TWI787874B - Radio frequency signal transceiver module and electronc device with same - Google Patents
Radio frequency signal transceiver module and electronc device with same Download PDFInfo
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Description
本申請涉及通訊技術領域,尤其涉及射頻訊號收發模組及電子設備。 This application relates to the field of communication technology, especially to radio frequency signal transceiver modules and electronic equipment.
隨著無線通訊技術之進步,行動電話、個人數位助理等電子裝置不斷朝向功能多樣化、輕薄化、以及資料傳輸更快、更有效率等趨勢發展。然而其相對可容納天線之空間亦就越來越小,且隨著無線通訊技術之不斷發展,天線之頻寬需求不斷增加。因此,如何於有限之空間內設計出具有較寬頻寬及較佳效率之天線,係天線設計面臨之一項重要課題。 With the advancement of wireless communication technology, electronic devices such as mobile phones and personal digital assistants are constantly developing towards the trend of diversified functions, thinner and thinner, faster and more efficient data transmission. However, the space for accommodating the antenna is getting smaller and smaller, and with the continuous development of wireless communication technology, the bandwidth requirement of the antenna is constantly increasing. Therefore, how to design an antenna with wider bandwidth and better efficiency in a limited space is an important issue for antenna design.
本申請提供一種射頻訊號收發模組及電子設備,所述射頻訊號收發模組可設置於電子設備內,且與金屬輻射體配合,進而涵蓋多個頻段,以提升頻寬並兼具最佳天線效率。 This application provides a radio frequency signal transceiver module and electronic equipment. The radio frequency signal transceiver module can be set in the electronic equipment and cooperate with a metal radiator to cover multiple frequency bands to increase the bandwidth and have an optimal antenna efficiency.
一種射頻訊號收發模組,包括基板,輻射部及主動電路,所述輻射部及所述主動電路均設置於所述基板上,所述輻射部與一輻射體間隔設置,所述輻射部與所述輻射體均由導電材料製成,所述輻射部透過與所述輻射體之耦合產生多個輻射模態,並將訊號由所述輻射體進行發射與/或接收,所述主動電路電連接至所述輻射部,用以切換所述輻射部之輻射模態。 A radio frequency signal transceiver module, including a substrate, a radiation part and an active circuit, the radiation part and the active circuit are both arranged on the substrate, the radiation part is spaced from a radiator, and the radiation part and the The radiators are all made of conductive materials, the radiator generates multiple radiation modes through coupling with the radiator, and transmits and/or receives signals from the radiator, and the active circuit is electrically connected to To the radiation part, used for switching the radiation mode of the radiation part.
一種電子設備,包括上述所述之射頻訊號收發模組。 An electronic device includes the radio frequency signal transceiver module mentioned above.
上述射頻訊號收發模組及電子設備可激發出多個輻射模態,進而涵蓋多個頻段,以提升頻寬並兼具最佳天線效率。 The above-mentioned radio frequency signal transceiver module and electronic equipment can excite multiple radiation modes, and then cover multiple frequency bands, so as to increase the bandwidth and have the best antenna efficiency.
100:射頻訊號收發模組 100: RF signal transceiver module
11:基板 11: Substrate
111:第一表面 111: first surface
112:第二表面 112: second surface
12:輻射部 12: Radiation Department
121,port1,port2,port3:饋入點 121, port1, port2, port3: feed point
13:主動電路 13:Active circuit
131:切換開關 131: toggle switch
132,133,134:可調元件 132, 133, 134: adjustable elements
14:連接器 14: Connector
200:輻射體 200: radiator
300:電子設備 300: Electronic equipment
303:電池 303: battery
304:邊框 304: border
305:背板 305: Backplane
306:接地面 306: ground plane
307:中框 307: middle frame
308:容置空間 308:Accommodating space
309:狹縫 309: Slit
310:縫隙 310: Gap
311:第一部分
311:
312:第二部分 312: Part Two
313:接地點 313: grounding point
151,152,153:匹配單元 151, 152, 153: matching unit
161,162,163:饋入源 161, 162, 163: Feed source
圖1為本申請實施例提供之射頻訊號收發模組之示意圖;圖2為圖1所示射頻訊號收發模組於另一角度下之示意圖;圖3為本申請實施例提供之射頻訊號收發模組中輻射部之示意圖;圖4為本申請實施例提供之射頻訊號收發模組設置於一輻射體一側之示意圖;圖5為圖4所示射頻訊號收發模組與輻射體於另一角度下之示意圖;圖6為本申請實施例提供之射頻訊號收發模組應用至電子設備之示意圖;圖7為圖6所示射頻訊號收發模組於另一角度下之示意圖;圖8為圖6所示射頻訊號收發模組中主動電路之電路連接示意圖;圖9為圖6所示射頻訊號收發模組之電流路徑示意圖;圖10至圖13為圖6所示射頻訊號收發模組之S參數(散射參數)曲線圖;圖14至圖17為圖6所示射頻訊號收發模組之效率曲線圖。 Figure 1 is a schematic diagram of the RF signal transceiver module provided by the embodiment of this application; Figure 2 is a schematic diagram of the RF signal transceiver module shown in Figure 1 from another angle; Figure 3 is a schematic diagram of the RF signal transceiver module provided by the embodiment of this application The schematic diagram of the radiation part in the group; Figure 4 is a schematic diagram of the radio frequency signal transceiver module provided by the embodiment of the present application arranged on one side of a radiator; Figure 5 is another angle between the radio frequency signal transceiver module and the radiator shown in Figure 4 The schematic diagram below; Figure 6 is a schematic diagram of the application of the radio frequency signal transceiver module provided by the embodiment of this application to electronic equipment; Figure 7 is a schematic diagram of the radio frequency signal transceiver module shown in Figure 6 at another angle; Figure 8 is a schematic diagram of Figure 6 The schematic diagram of the circuit connection of the active circuit in the RF signal transceiver module shown; Figure 9 is a schematic diagram of the current path of the RF signal transceiver module shown in Figure 6; Figure 10 to Figure 13 are the S parameters of the RF signal transceiver module shown in Figure 6 (Scattering parameter) curves; FIGS. 14 to 17 are efficiency curves of the radio frequency signal transceiver module shown in FIG. 6 .
為使本申請實施例之目的、技術方案與優點更加清楚,下面將結合本申請實施例中之附圖,對本申請實施例中之技術方案進行清楚、完整地描述,顯然,所描述之實施例是本申請一部分實施例,而不是全部之實施例。基於本申請中之實施例,所屬領域具有通常知識者於沒有做出創造性勞動前提下 所獲得之所有其他實施例,均屬於本申請保護之範圍。 In order to make the purpose, technical solutions and advantages of the embodiments of the application clearer, the technical solutions in the embodiments of the application will be clearly and completely described below in conjunction with the drawings in the embodiments of the application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, those with ordinary knowledge in the field do not make creative work All other obtained embodiments belong to the protection scope of this application.
需要說明的是,本申請實施例中“至少一個”係指一個或者多個,多個係指兩個或兩個以上。除非另有定義,本文所使用之所有之技術與科學術語與所屬領域具有通常知識者通常理解之含義相同。本申請之說明書中所使用之術語僅是為描述具體之實施例之目不是旨在於限制本申請。 It should be noted that "at least one" in the embodiments of the present application refers to one or more, and multiple refers to two or more. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terms used in the description of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.
應理解,本申請中除非另有說明,“/”表示或的意思。例如,A/B可表示A或B。本申請中之“A與/或B”僅僅係一種描述關聯物件之關聯關係,表示可存於僅存於A、僅存於B以及存於A與B這三種關係。 It should be understood that unless otherwise stated in this application, "/" means or. For example, A/B can mean either A or B. "A and/or B" in this application is only a description of the relationship between related objects, which means that there are three relationships that exist only in A, only in B, and only in A and B.
需要說明的是,本申請實施例中,“第一”、“第二”等詞彙,僅用於區分描述之目的,而不能理解為指示或暗示相對重要性,亦不能理解為指示或暗示順序。限定有“第一”、“第二”之特徵可明示或者隱含地包括一個或者更多個所述特徵。於本申請實施例之描述中,“示例性的”或者“例如”等詞用於表示作例子、例證或說明。本申請實施例中被描述為“示例性的”或者“例如”之任何實施例或設計方案不應被解釋為比其它實施例或設計方案更優選或更具優勢。確切而言,使用“示例性的”或者“例如”等詞旨於以具體方式呈現相關概念。 It should be noted that in the embodiments of the present application, terms such as "first" and "second" are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order . Features defined as "first" and "second" may explicitly or implicitly include one or more of said features. In the description of the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner.
需要說明的是,本申請實施例中,術語“高度”係指於垂直於參考地層之方向上之投影長度。術語“中心”、“上”、“下”、“前”、“後”、“左”、“右”、“豎直”、“水平”、“頂”、“底”、“內”、“外”等指示之方位或位置關係為基於附圖所示之方位或位置關係,僅係為便於描述本申請與簡化描述,而不是指示或暗示所指之裝置或元件必須具有特定之方位、以特定之方位構造與操作,因此不能理解為對本申請之限制。 It should be noted that, in the embodiment of the present application, the term "height" refers to the projected length in the direction perpendicular to the reference formation. The terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, Constructed and operated in a particular orientation and therefore should not be construed as limiting the application.
請一併參閱圖1及圖2,可理解,本申請實施例提供一種射頻訊號
收發模組100。所述射頻訊號收發模組100包括基板11,輻射部12,主動電路13及連接器14。
Please refer to Figure 1 and Figure 2 together, it can be understood that the embodiment of this application provides a radio frequency
所述基板11可為介質基板,例如,印刷電路板(printed circuit board,PCB),陶瓷(ceramics)基板或其他介質基板,於此不做具體限定。所述基板11包括第一表面111及第二表面112,所述第二表面112與所述第一表面111相對設置。
The
於本申請實施例中,所述射頻訊號收發模組100包括多個輻射部。例如,於圖1示出之實施例中,所述射頻訊號收發模組100包括四個輻射部12。所述輻射部12均設置於所述基板11之第一表面111,且彼此間隔設置。所述輻射部12可均藉由穿孔(過孔)連接至所述基板11之第二表面112。於其中一個實施例中,所述輻射部12為金屬薄片狀,且均呈矩形,並共面設置。當然,於本申請實施例中,並不對所述輻射部12之形狀及結構進行具體限制。例如,所述輻射部12之形狀還可為圓形,方形或其他形狀。
In the embodiment of the present application, the RF
可理解,請一併參閱圖3,於本申請實施例中,每一輻射部12均包括饋入點121。所述饋入點121用以藉由匹配電路(圖未示,參後詳述)電連接至相應之饋入源(圖未示,參後詳述),進而將電訊號饋入至對應之輻射部12。
Understandably, please also refer to FIG. 3 , in the embodiment of the present application, each
可理解,請再次參閱圖2,於本申請實施例中,所述主動電路13設置於所述基板11之第二表面112上。所述基板11之第二表面112上佈設有連接線路(圖未示)。所述連接線路連接至所述主動電路13。所述主動電路13可包括切換開關,與/或其他可變換阻抗之可調元件(圖未示,參後詳述)。所述主動電路13可藉由所述連接線路電連接至所述輻射部12及所述連接器14。
例如,於其中一個實施例中,所述基板11上還設置有過孔(圖未示),所述輻射部12可透過所述過孔連接至所述基板11之第二表面112,並藉由所述第二表面112上之連接線路連接至所述主動電路13。
Understandably, please refer to FIG. 2 again, in the embodiment of the present application, the
所述連接器14設置於所述基板11之第二表面112上,即設置於所述主動電路13所在表面。於其中一些實施例中,所述連接器14可與所述主動電路13間隔設置,且彼此電連接。當然,於本申請實施例中,並不對所述連接器14與所述主動電路13之具體位置關係及連接關係等進行限制。例如,於其中一個實施例中,所述主動電路13可設置於所述連接器14內,即所述連接器14可用以***述主動電路13。所述連接器14電連接至所述主動電路13,且連接至相應之傳輸線,進而藉由所述傳輸線實現所述射頻訊號收發模組100之訊號傳輸,例如實現訊號之送出或送入。
The
可理解,所述傳輸線可為,但不局限於,同軸電纜(coaxial cable),柔性印刷電路板(Flexible Printed Circuit Board,FPCB)或其他傳輸線等。 It can be understood that the transmission line may be, but not limited to, a coaxial cable (coaxial cable), a flexible printed circuit board (Flexible Printed Circuit Board, FPCB) or other transmission lines.
可理解,請一併參閱圖4及圖5,當使用所述射頻訊號收發模組100時,可將所述射頻訊號收發模組100設置於一輻射體200之一側。其中,所述射頻訊號收發模組100設置有輻射部12之一側朝向所述輻射體200設置。如此,可透過所述輻射部12與所述輻射體200之耦合將訊號由所述輻射體200進行發射與/或接收。另外,所述射頻訊號收發模組100還可利用所述主動電路13之切換開關,並配合匹配電路,以切換多模態,進而實現多個寬頻操作。
Understandably, please refer to FIG. 4 and FIG. 5 together. When using the radio frequency
例如,於其中一個實施例中,當所述射頻訊號收發模組100包括三個輻射部12,且設置有所述主動電路13時,三個所述輻射部12間隔設置,且藉由與所述輻射體200間隔設置,進而可用以接收4G/5G中頻訊號(頻率範
圍為1.7GHz-2.2GHz)、高頻訊號(頻率範圍為2.3GHz-2.7GHz)、超高頻(ultra high band,UHB)訊號(頻率範圍為3.3GHz-4.8GHz)、GPS訊號(頻率範圍為1.5GHz-1.6GHz)、Wi-Fi訊號(頻率範圍為2.4GHz,5GHz)等。
For example, in one of the embodiments, when the radio frequency
當然,於本申請實施例中,並不對所述射頻訊號收發模組100之頻率進行限制。例如,可藉由調整所述射頻訊號收發模組100之外形,長度,寬度等參數,以調整所需之頻率。另外,所述輻射部12之外形,長度,寬度等參數,亦可根據所需之頻率進行調整。
Certainly, in the embodiment of the present application, the frequency of the radio frequency
可理解,於本申請實施例中,所述輻射體200可為任何導體,例如鐵件,PCB軟板上之銅箔,鐳射直接成型(Laser Direct Structuring,LDS)制程中之導體等,於此不做具體限定。例如,於其中一個實施例中,所述輻射體200為一電子設備之金屬邊框,所述輻射體200設置於一背板305上,且與一電子元件,例如電池303間隔設置,所述射頻訊號收發模組100設置於所述輻射體200與所述電池303之間。所述電池303設置於一中框307上。所述中框307設置於所述背板305上(參後詳述)。
It can be understood that, in the embodiment of the present application, the
可理解,於本申請實施例中,所述輻射部12與所述輻射體200間隔設置。例如,所述輻射部12與所述輻射體200平行設置。又如,所述輻射部12與所述輻射體200間隔設置,但彼此不平行設置。當然,於其他實施例中,所述輻射部12亦可直接連接或不連接所述輻射體200。例如,於其中一個實施例中,所述輻射部12與所述輻射體200間隔設置,且藉由連接線連接至所述輻射體200。又如,於另外之實施例中,所述輻射部12與所述輻射體200間隔設置,且兩者之間無電性連接。
It can be understood that, in the embodiment of the present application, the
可理解,於本申請實施例中,並不對所述輻射體200之具體結構,
與/或其與其他元件之連接關係等進行限制。例如,所述輻射體200之側端可連接至地(即所述輻射體200接地處理),或者不連接至地。又如,所述輻射體200上可設置中斷點或未設置任何中斷點,斷槽,縫隙等。
It can be understood that in the embodiment of the present application, the specific structure of the
可理解,請一併參閱圖6,於本申請實施例中,所述射頻訊號收發模組100可應用於一電子設備300,用以發射、接收無線電波以傳遞、交換無線訊號。所述電子設備300可為掌上型通訊裝置(例如行動電話),折疊機,智慧穿戴裝置(例如手錶,耳機等),平板電腦,個人數位助理(personal digital assistant,PDA)等,於此不做具體限制。
Understandably, please also refer to FIG. 6 , in the embodiment of the present application, the radio frequency
可理解,所述電子設備300可採用以下一種或多種通訊技術:藍牙(bluetooth,BT)通訊技術、全球定位系統(global positioning system,GPS)通訊技術、無線保真(wireless fidelity,Wi-Fi)通訊技術、全球移動通訊系統(global system for mobile communications,GSM)通訊技術、寬頻碼分多址(wideband code division multiple access,WCDMA)通訊技術、長期演進(long term evolution,LTE)通訊技術、5G通訊技術、SUB-6G通訊技術以及未來其他通訊技術等。
It can be understood that the
於本申請實施例中,以所述電子設備300為手機為例加以說明。
In the embodiment of the present application, the
請再次參閱圖6,於其中一實施例中,所述電子設備300至少包括電池303、邊框304、背板305、接地面306及中框307(參圖5)。
Please refer to FIG. 6 again. In one embodiment, the
所述邊框304由金屬或其他導電材料製成。所述背板305可由金屬或其他導電材料製成。所述邊框304設置於所述背板305之邊緣,並與所述背板305共同形成一容置空間308。所述邊框304相對所述背板305之一側設置有一開口(圖未標),用於容置一顯示單元(圖未示)。所述顯示單元具有一顯示平面,該顯示平面裸露於該開口。可理解,所述顯示單元可結合觸摸感測
器組合成觸控屏。觸摸感測器又可稱為觸控面板或觸敏面板。
The
可理解,於本申請實施例中,所述顯示單元具有高屏占比。即所述顯示單元之顯示平面之面積大於70%之電子設備之正面面積,甚至可做到正面全螢幕。具體於本申請實施例中,所述全螢幕是指除了所述電子設備300上開設之必要之槽孔以外,所述顯示單元之左側、右側、下側均可無縫隙地連接至所述邊框304。
It can be understood that in the embodiment of the present application, the display unit has a high screen ratio. That is, the area of the display plane of the display unit is greater than 70% of the front area of the electronic device, and even a full front screen can be achieved. Specifically, in the embodiment of the present application, the full screen means that, except for the necessary slots on the
所述接地面306可由金屬或其他導電材料製成。所述接地面306可設置於所述邊框304與所述背板305共同圍成之所述容置空間308內,且連接至所述背板305。
The
所述中框307由金屬或其他導電材料製成。所述中框307之形狀及尺寸可小於所述接地面306。所述中框307疊設於所述接地面306上。於本實施例中,所述中框307為設置於所述顯示單元與所述接地面306之間之金屬片。所述中框307用於支撐所述顯示單元、提供電磁屏蔽、及提高所述電子設備300之機構強度。
The
可理解,於本實施例中,所述邊框304、所述背板305、所述接地面306及所述中框307可構成一體成型之金屬框體。所述背板305、所述接地面306及所述中框307為大面積金屬,因此可共同構成所述電子設備300之系統接地面(圖未標)。
It can be understood that, in this embodiment, the
所述電池303設置於所述中框307上,用以為所述電子設備300之電子元件,模組,電路等提供電能。所述電池303與所述邊框304間隔設置,進而於兩者之間形成狹縫309。
The
可理解,於其他實施例中,所述電子設備300還可包括以下一個
或多個元件,例如處理器、電路板、記憶體、輸入輸出電路、音訊元件(例如麥克風及揚聲器等)、多媒體元件(例如前置攝像頭與/後置攝像頭)、感測器元件(例如接近感測器、距離感測器、環境光感測器、加速度感測器、陀螺儀、磁感測器、壓力感測器及/或溫度感測器等)等,於此不再贅述。
It can be understood that, in other embodiments, the
可理解,當所述射頻訊號收發模組100應用至所述電子設備300時,所述射頻訊號收發模組100可設置於所述狹縫309內,且大致垂直所述接地面306所在平面設置。所述邊框304之一部分構成所述輻射體200。具體地,所述邊框304上設置有縫隙310。所述縫隙310隔斷所述邊框304,以將所述邊框304劃分為間隔設置之第一部分311及第二部分312。其中所述第一部分311構成所述輻射體200。所述第二部分312可電連接至所述系統接地面,例如所述接地面306,即接地。
It can be understood that when the radio frequency
可理解,於其中一個實施例中,所述縫隙310可與所述狹縫309連通,並填充有絕緣材料,例如塑膠、橡膠、玻璃、木材、陶瓷等,但不以此為限。
It can be understood that, in one embodiment, the
可理解,於其中一個實施例中,所述第一部分311(即所述輻射體200)遠離所述縫隙310之一側設置有接地點313。所述接地點313之一端電連接至所述第一部分311,另一端電連接至所述中框307,即接地。而所述射頻訊號收發模組100設置於所述縫隙310與所述接地點313之間之所述狹縫309內,且大致垂直所述接地面306所在平面設置。
It can be understood that, in one of the embodiments, a
可理解,當所述射頻訊號收發模組100設置於所述狹縫309內時,所述射頻訊號收發模組100上之輻射部12朝向所述第一部分311,且與所述第一部分311間隔設置。所述連接器14設置於所述基板11之另一表面,即背向
所述第一部分311設置。所述連接器14之一端電連接至所述中框307,另一端與所述基板11電連接。
It can be understood that when the radio frequency
請一併參閱圖7及圖8,於本申請實施例中,所述射頻訊號收發模組100包括三個輻射部12。每一輻射部12均包括相應之饋入點(例如饋入點port1,port2,port3)。每一饋入點分別藉由相應之匹配單元電連接至相應之饋入源。例如饋入點port1藉由匹配單元151電連接至饋入源161。饋入點port2藉由匹配單元152電連接至饋入源162。饋入點port3藉由匹配單元153電連接至饋入源163。即,所述匹配電路至少包括匹配單元151,匹配單元152及匹配單元153。
Please refer to FIG. 7 and FIG. 8 together. In the embodiment of the present application, the radio frequency
另外,請再次參閱圖7,所述射頻訊號收發模組100中之主動電路13設置於所述連接器14內。如圖8所示,所述主動電路13包括切換開關131及可調元件132,133,134。其中,所述切換開關131之一端電連接至所述連接器14,另一端藉由相應之可調元件132,133,134電連接至對應之饋入源。例如,所述切換開關131藉由可調元件132電連接至所述饋入源161,藉由可調元件133電連接至所述饋入源162,藉由可調元件134電連接至所述饋入源163。
In addition, please refer to FIG. 7 again, the
如此,藉由設置所述輻射部12,並使得所述輻射部12與所述第一部分311耦合共振出具有可調性之模態。另外,還可控制相鄰兩個輻射部12之間之耦合狀態,透過耦合分別產生可調性且天線效率佳之獨立模態。再者,藉由所述主動電路13中之切換開關131之切換,可切換多模態,並使用多個可調元件(例如可調元件132,133,134)實現多個頻段包覆。例如,請一併參閱圖9,為所述電子設備300之電流路徑示意圖。其中,遠離所述縫隙310之輻射部12(即設置有饋入點port3之輻射部12,以下為描述方便,簡稱為第一輻射部)
可激發Wi-Fi 2.4G(參路徑P1)、Wi-Fi 5G(參路徑P2)與授權頻譜輔助接入(License Assisted Access,LAA)模態,利用狹縫309可耦合共振出Wi-Fi 2.4G、Wi-Fi 5G與LAA頻段,兼具最佳天線效率,使得所述第一輻射部之工作頻率範圍可涵蓋Wi-Fi 2.4G頻段(2400MHz-2484MHz)、Wi-Fi 5G頻段(5150MHz-5850MHz)與LAA頻段(5150MHz-5925MHz)。
In this way, by setting the
位於中間之輻射部12(即設置有饋入點port2之輻射部12,以下為描述方便,簡稱為第二輻射部)可激發超高頻(UHB)模態及5G Sub6 NR模態(參路徑P3),利用狹縫309可耦合共振出UHB頻段及5G Sub6 NR頻段,兼具最佳天線效率,使所述第二輻射部之工作頻率範圍可涵蓋超高頻頻段(3400MHz-3800MHz)及5G Sub6 NR頻段(例如,5G Sub6 N77頻段(3300MHz-4200MHz)、5G Sub6 N78頻段(3300MHz-3800MHz)與5G Sub6 N79頻段(4400MHz-5000MHz)頻段)。
The
另外,靠近所述縫隙310一側之所述輻射部12(即設置有饋入點port1之輻射部12,以下為描述方便,簡稱為第三輻射部)可激發中高頻模態(參路徑P4),利用狹縫309可耦合共振出中高頻頻段,兼具最佳天線效率。使所述第三輻射部之工作頻率範圍可涵蓋中頻GSM1800/1900/WCDMA2100頻段(1710MHz-2170MHz),高頻LTE B7、B40、B41頻段(2300MHz-2690MHz)。
In addition, the radiating
顯然,所述切換開關131為中高頻/UHB及NR/Wi-Fi 2.4G、Wi-Fi 5G與LAA切換開關,用以切換中高頻/UHB及NR/Wi-Fi 2.4G、Wi-Fi 5G與LAA頻段。
Obviously, the
亦就是說,本申請中之射頻訊號收發模組100可應用至電子設備300中,以提升天線效率頻寬並具有最佳天線效率,且利用所述切換開關131之
切換,可有效提升天線頻率覆蓋範圍。具體地,於其中一個實施例中,所述射頻訊號收發模組100適用之工作頻率範圍涵蓋中頻1710MHz至2170MHz、高頻2300MHz-2690MHz、超高頻3400MHz至3800MHz、Wi-Fi 2.4G、Wi-Fi 5G與LAA,並可支援5G Sub6 N77/N78/N79頻段。
That is to say, the radio frequency
即,所述射頻訊號收發模組100藉由於所述輻射部12之適當位置設置相應之饋入點,並藉由所述輻射體200(亦可為電子設備300之金屬邊框,例如第一部分311)作為金屬輻射體,於狹縫309中由所述輻射體200與所述射頻訊號收發模組100耦合能量共振出模態,涵蓋中、高頻、超高頻、5G Sub6 N77、5G Sub6 N78、5G Sub6 N79、Wi-Fi 2.4G、Wi-Fi 5G頻段,藉以大幅提升其頻寬與天線效率,亦可涵蓋全球常用5G之通訊頻段之應用,以及支援LTE-A(LTE-Advanced之簡稱,是LTE技術之後續演進)之載波聚合應用(Carrier Aggregation,CA)要求。
That is, the radio frequency
請一併參閱圖10至圖13,為所述射頻訊號收發模組100設置三個輻射部時之S參數(散射參數)曲線圖。其中,圖10為所述射頻訊號收發模組100中第二輻射部之S參數(散射參數)曲線圖。圖11為所述射頻訊號收發模組100中第二輻射部及第三輻射部之S參數(散射參數)曲線圖。具體地,曲線S111為所述射頻訊號收發模組100中第二輻射部之S11值。曲線S112為所述射頻訊號收發模組100中第三輻射部之S11值。圖12為所述射頻訊號收發模組100中第一至第三輻射部之S參數(散射參數)曲線圖。其中,曲線S121為所述射頻訊號收發模組100中第一輻射部之S11值。曲線S122為所述射頻訊號收發模組100中第二輻射部之S11值。曲線S123為所述射頻訊號收發模組100中第三輻射部之S11值。圖13為所述射頻訊號收發模組100設置三個輻射部,
且採用另一匹配電路時之S參數(散射參數)曲線圖。其中,曲線S131為所述射頻訊號收發模組100中第一輻射部之S11值。曲線S132為所述射頻訊號收發模組100中第二輻射部之S11值。曲線S133為所述射頻訊號收發模組100中第三輻射部之S11值。
Please refer to FIG. 10 to FIG. 13 together, which are the S-parameter (scattering parameter) curve diagrams when the radio frequency
請一併參閱圖14至圖17,為所述射頻訊號收發模組100設置三個輻射部時之效率曲線圖。其中,圖14為所述射頻訊號收發模組100中第二輻射部之效率曲線圖。其中,曲線S141為所述射頻訊號收發模組100中第二輻射部之總效率值。曲線S142為所述射頻訊號收發模組100中第二輻射部之輻射效率值。
Please also refer to FIG. 14 to FIG. 17 , which are the efficiency curves when the radio frequency
圖15為所述射頻訊號收發模組100中第二輻射部及第三輻射部之效率曲線圖。具體地,曲線S151為所述射頻訊號收發模組100中第二輻射部之總效率值。曲線S152為所述射頻訊號收發模組100中第二輻射部之輻射效率值。曲線S153為所述射頻訊號收發模組100中第三輻射部之總效率值。曲線S154為所述射頻訊號收發模組100中第三輻射部之輻射效率值。
FIG. 15 is an efficiency curve diagram of the second radiation part and the third radiation part in the radio frequency
圖16為所述射頻訊號收發模組100中第一至第三輻射部之效率曲線圖。其中,曲線S161為所述射頻訊號收發模組100中第一輻射部之總效率值。曲線S162為所述射頻訊號收發模組100中第一輻射部之輻射效率值。曲線S163為所述射頻訊號收發模組100中第二輻射部之總效率值。曲線S164為所述射頻訊號收發模組100中第二輻射部之輻射效率值。曲線S165為所述射頻訊號收發模組100中第三輻射部之總效率值。曲線S166為所述射頻訊號收發模組100中第三輻射部之輻射效率值。
FIG. 16 is a graph showing the efficiency of the first to third radiation parts in the radio frequency
圖17為所述射頻訊號收發模組100設置三個輻射部,且採用另一
匹配電路時之效率曲線圖。其中,曲線S171為所述射頻訊號收發模組100中第一輻射部之總效率值。曲線S172為所述射頻訊號收發模組100中第一輻射部之輻射效率值。曲線S173為所述射頻訊號收發模組100中第二輻射部之總效率值。曲線S174為所述射頻訊號收發模組100中第二輻射部之輻射效率值。曲線S175為所述射頻訊號收發模組100中第三輻射部之總效率值。曲線S176為所述射頻訊號收發模組100中第三輻射部之輻射效率值。
Figure 17 shows that the radio frequency
顯然,藉由設置所述切換開關,並使得所述切換開關切換至不同之饋入點,以控制頻率模態,進而涵蓋至中頻(1710MHz-2170MHz),高頻(2300MHz-2690MHz),超高頻(3400MHz-3800MHz),Wi-Fi 2.4G,Wi-Fi 5G及LAA,並可支援5G Sub6 N77/N78/N79頻段。 Obviously, by setting the switch and switching the switch to different feed points, the frequency mode can be controlled, and then cover the intermediate frequency (1710MHz-2170MHz), high frequency (2300MHz-2690MHz), super High frequency (3400MHz-3800MHz), Wi-Fi 2.4G, Wi-Fi 5G and LAA, and can support 5G Sub6 N77/N78/N79 frequency bands.
以上所述,僅為本發明的較佳實施例,並非是對本發明作任何形式上的限定。另外,本領域技術人員還可在本發明精神內做其它變化,當然,這些依據本發明精神所做的變化,都應包含在本發明所要求保護的範圍之內。 The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. In addition, those skilled in the art can also make other changes within the spirit of the present invention. Of course, these changes made according to the spirit of the present invention should be included within the scope of protection claimed by the present invention.
100:射頻訊號收發模組 100: RF signal transceiver module
11:基板 11: Substrate
111:第一表面 111: first surface
112:第二表面 112: second surface
12:輻射部 12: Radiation Department
Claims (8)
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