TWI829345B - Heat dissipation device and server - Google Patents
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 140
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Abstract
Description
本發明屬於散熱技術領域，特別是涉及一種散熱裝置及伺服器。The invention belongs to the field of heat dissipation technology, and in particular relates to a heat dissipation device and a server.
隨著GPU計算平臺的蓬勃發展，實際業務對底層硬件基礎設施的算力要求越來越高，性能的提高直接導致伺服器功耗不斷增加，同時，制程升級帶來的不僅是計算力躍升，還有整體功耗和發熱量的明顯上升；在單機櫃內伺服器數量不變的情況下，整櫃功耗大幅提升，給數據中心的能耗和換熱帶來極大的挑戰。With the vigorous development of GPU computing platforms, actual business requirements for underlying hardware infrastructure are getting higher and higher. The improvement in performance directly leads to an increase in server power consumption. At the same time, process upgrades bring not only a jump in computing power, but also There is also a significant increase in overall power consumption and heat generation; when the number of servers in a single cabinet remains unchanged, the power consumption of the entire cabinet increases significantly, which brings great challenges to the energy consumption and heat exchange of the data center.
為了應對這樣的挑戰，冷卻技術也需要革新；傳統的風冷模式正在逐漸逼近極限，在面臨高功率計算晶片時，會出現瓶頸，不能解決高能耗、低性能的問題。In order to meet such challenges, cooling technology also needs to be innovated; the traditional air cooling mode is gradually approaching its limit. When facing high-power computing chips, bottlenecks will appear and cannot solve the problems of high energy consumption and low performance.
鑒於以上所述現有技術的缺點，本發明的目的在於提供一種散熱裝置及伺服器，用於解決現有技術中採用風冷模式存在的無法有效散熱的問題。In view of the above shortcomings of the prior art, the purpose of the present invention is to provide a heat dissipation device and a server to solve the problem of ineffective heat dissipation in the air cooling mode in the prior art.
為實現上述目的及其他相關目的，本發明提供一種散熱裝置，包括：殼體、風冷散熱組件和液冷散熱組件；所述殼體內部為空心結構；所述風冷散熱組件和所述液冷散熱組件均設於所述殼體內；其中，所述液冷散熱組件包括：進液管、出液管及至少一組液冷板組；每一所述液冷板組均分別與所述進液管和所述出液管連接。In order to achieve the above objects and other related objects, the present invention provides a heat dissipation device, which includes: a shell, an air-cooling heat dissipation component and a liquid-cooling heat dissipation component; the inside of the shell is a hollow structure; the air-cooling heat dissipation component and the liquid cooling heat dissipation component The cooling and heat dissipation components are all arranged in the housing; wherein, the liquid cooling heat dissipation component includes: a liquid inlet pipe, a liquid outlet pipe and at least one group of liquid cooling plate groups; each of the liquid cooling plate groups is connected to the The liquid inlet pipe is connected to the liquid outlet pipe.
於本發明的一實施例中，每一所述液冷板組包括至少一液冷板；所述液冷板內為空心結構；當所述液冷板組包括至少兩個所述液冷板時，至少兩個所述液冷板依次排列，且相鄰的兩個所述液冷板之間透過柔性軟管連接；其中，位於首端的液冷板與所述進液管連接，位於尾端的液冷板與所述出液管連接。In one embodiment of the present invention, each liquid-cooled plate group includes at least one liquid-cooled plate; the liquid-cooled plate has a hollow structure; when the liquid-cooled plate group includes at least two liquid-cooled plates, When at least two of the liquid cooling plates are arranged in sequence, and the two adjacent liquid cooling plates are connected through a flexible hose; wherein, the liquid cooling plate located at the head end is connected to the liquid inlet pipe, and the liquid cooling plate located at the tail end is connected to the liquid inlet pipe. The liquid cooling plate at the end is connected to the liquid outlet pipe.
於本發明的一實施例中，當所述液冷板組的數量為至少兩組時，至少兩組所述液冷板組中的部分液冷板組形成第一冷板模組；至少兩組所述液冷板組中，除用於形成所述第一冷板模組外的液冷板組形成第二冷板模組；其中，所述第一冷板模組用於為GPU模組散熱；所述第二冷板模組用於為以太網交換機晶片散熱。In an embodiment of the present invention, when the number of the liquid cooling plate groups is at least two groups, some of the liquid cooling plate groups in the at least two groups of liquid cooling plate groups form the first cold plate module; at least two In the liquid cooling plate group, the liquid cooling plate group except for forming the first cold plate module forms a second cold plate module; wherein the first cold plate module is used for GPU module The second cold plate module is used to dissipate heat for the Ethernet switch chip.
於本發明的一實施例中，所述液冷散熱組件還包括：分水器和至少一分液管組；每一所述分液管組對應一所述液冷板組，每一所述分液管組包括：一進液分液管和一出液分液管；所述分水器分別與所述進液管、所述出液管、所述進液分液管及所述出液分液管連接；每一所述液冷板組分別與對應的分液管組中的進液分液管和出液分液管連接。In an embodiment of the present invention, the liquid cooling heat dissipation component further includes: a water distributor and at least one liquid distribution tube group; each of the liquid distribution tube groups corresponds to one of the liquid cooling plate groups, and each of the liquid cooling plate groups The liquid distributor tube group includes: an inlet liquid distributor tube and an outlet liquid distributor tube; the water distributor is connected to the liquid inlet pipe, the liquid outlet pipe, the liquid inlet distributor pipe and the outlet pipe respectively. The liquid dispensing pipes are connected; each liquid cooling plate group is respectively connected to the liquid inlet dispensing pipe and the liquid dispensing pipe in the corresponding liquid dispensing pipe group.
於本發明的一實施例中，所述風冷散熱組件包括：導風罩和風冷機構；所述導風罩和所述風冷機構均設於所述殼體，其中，所述導風罩用於將風流分別導向三個不同的導風流道。In one embodiment of the present invention, the air-cooling heat dissipation component includes: an air guide hood and an air-cooling mechanism; the air guide hood and the air-cooling mechanism are both provided in the housing, wherein the air guide hood Used to guide the air flow to three different air guide channels.
於本發明的一實施例中，所述導風罩包括：第一導風塊、第二導風塊及第三導風塊；其中，所述第二導風塊設於所述第一導風塊與所述第三導風塊之間，且所述第二導風塊的高度低於所述第一導風塊和所述第三導風塊。In one embodiment of the present invention, the air guide block includes: a first air guide block, a second air guide block and a third air guide block; wherein the second air guide block is provided on the first air guide block. between the air block and the third air guide block, and the height of the second air guide block is lower than the first air guide block and the third air guide block.
於本發明的一實施例中，所述第二導風塊包括：三個依次連接且高度逐級遞減的階梯板；相鄰的兩個所述階梯板之間透過斜面板連接。In one embodiment of the present invention, the second air guide block includes: three step plates connected in sequence and with gradually decreasing heights; two adjacent step plates are connected through an inclined plate.
於本發明的一實施例中，所述導風罩為整體式結構；和/或所述導風罩採用麥拉材料製成。In one embodiment of the present invention, the air guide cover has an integral structure; and/or the air guide cover is made of Mylar material.
本發明提供一種伺服器，包括：待散熱組件及上所述的散熱裝置；所述散熱裝置的殼體為所述伺服器機櫃的櫃體；所述待散熱組件設於所述櫃體內；所述散熱裝置的液冷板組設於所述待散熱組件。The invention provides a server, which includes: a component to be heat dissipated and the above-mentioned heat dissipation device; the housing of the heat dissipation device is the cabinet body of the server cabinet; the component to be heat dissipated is provided in the cabinet; The liquid cooling plate of the heat dissipation device is assembled on the component to be heat dissipated.
於本發明的一實施例中，所述待散熱組件包括：GPU模組和以太網交換機晶片；當所述液冷板組的數量為至少兩組時，至少兩組所述液冷板組中的部分液冷板組形成第一冷板模組；至少兩組所述液冷板組中，除用於形成所述第一冷板模組外的液冷板組形成第二冷板模組；其中，所述第一冷板模組設於所述GPU模組，用於為所述GPU模組散熱；所述第二冷板模組設於所述以太網交換機晶片，用於為所述以太網交換機晶片散熱。In one embodiment of the present invention, the components to be heat dissipated include: GPU modules and Ethernet switch chips; when the number of the liquid cooling plate groups is at least two groups, at least two groups of the liquid cooling plate groups include Part of the liquid cooling plate groups forms the first cold plate module; among at least two groups of the liquid cooling plate groups, the liquid cooling plate groups other than those used to form the first cold plate module form the second cold plate module ; Wherein, the first cold plate module is provided on the GPU module and is used to dissipate heat for the GPU module; the second cold plate module is provided on the Ethernet switch chip and is used for dissipating heat for the GPU module. Described Ethernet switch chip heat dissipation.
如上所述，本發明所述的散熱裝置及伺服器，具有以下有益效果：As mentioned above, the heat dissipation device and server of the present invention have the following beneficial effects:
（1）與現有技術相比，本發明突破了傳統風冷散熱模式，採用風冷和液冷相結合的混合散熱模式，透過這種混合製冷方式，大幅提升了散熱效率，實現了有效散熱，解決了現有技術中僅採用風冷模式存在的無法有效散熱的問題。(1) Compared with the existing technology, the present invention breaks through the traditional air-cooling heat dissipation mode and adopts a hybrid heat dissipation mode that combines air cooling and liquid cooling. Through this hybrid refrigeration method, the heat dissipation efficiency is greatly improved and effective heat dissipation is achieved. This solves the problem of ineffective heat dissipation in existing technologies that only use air-cooling mode.
（2）本發明設計導風罩用於起分流作用，透過將風流導至各導風流道中，根據不同導風流道中不同的散熱需求設計不同的形狀結構進行導風，實現了合理分配風流；該導風罩將風流最大程度地彙聚至需要散熱的結構處，提升了散熱效果，提高了各導風流道中風量有效利用率；各導風流道相互獨立，互不干擾，避免了旁流及亂流的產生，減少了資源浪費。(2) The present invention designs the air guide hood to serve as a diverter. By guiding the air flow to each air guide runner, and designing different shapes and structures to guide the air according to the different heat dissipation requirements in different air guide runner, a reasonable distribution of the air flow is achieved; The air guide hood concentrates the air flow to the structure that needs heat dissipation to the maximum extent, improving the heat dissipation effect and improving the effective utilization of air volume in each air guide duct; each air guide runner is independent of each other and does not interfere with each other, avoiding side flow and turbulent flow. The production reduces the waste of resources.
（3）本發明透過將該散熱裝置應用於伺服器，降低了熱源GPU散熱所消耗電能，並增強了該伺服器的可靠性，能夠很好地解決GPU散熱問題；使用導風罩可顯著增強該伺服器內各元件散熱效果，避免了熱量堆積對元件帶來的損害，提高工作效率的同時，避免了損壞的風險，進而延長了該伺服器的工作壽命。(3) By applying the heat dissipation device to the server, the present invention reduces the power consumption of the heat source GPU for heat dissipation, and enhances the reliability of the server. It can well solve the GPU heat dissipation problem; using an air guide cover can significantly enhance The heat dissipation effect of each component in the server avoids damage to the components caused by heat accumulation, improves work efficiency, and avoids the risk of damage, thereby extending the working life of the server.
以下透過特定的具體實施例說明本發明的實施方式，熟悉此技術的人士可由本說明書所揭露的內容輕易地瞭解本發明的其他優點及功效。The following describes the implementation of the present invention through specific embodiments. Those familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
須知，本說明書所附圖示所繪示的結構、比例、大小等，均僅用以配合說明書所揭示的內容，以供熟悉此技術的人士瞭解與閱讀，並非用以限定本發明可實施的限定條件，故不具技術上的實質意義，任何結構的修飾、比例關係的改變或大小的調整，在不影響本發明所能產生的功效及所能達成的目的下，均應仍落在本發明所揭示的技術內容得能涵蓋的範圍內。同時，本說明書中所引用的如“上”、“下”、“左”、“右”、“中間”及“一”等的用語，亦僅為便於敘述的明瞭，而非用以限定本發明可實施的範圍，其相對關係的改變或調整，在無實質變更技術內容下，當亦視為本發明可實施的範疇。It should be noted that the structures, proportions, sizes, etc. shown in the figures attached to this specification are only used to coordinate with the content disclosed in the specification for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention. Restrictive conditions, so they have no technical substantive significance. Any structural modifications, changes in proportions, or adjustments in size should still fall within the scope of the present invention as long as they do not affect the effects that the present invention can produce and the purposes that can be achieved. The technical content disclosed must be within the scope that can be covered. At the same time, terms such as "upper", "lower", "left", "right", "middle" and "one" cited in this specification are only for convenience of description and are not used to limit the scope of this specification. The scope of the invention that can be implemented, and changes or adjustments in their relative relationships, as long as there is no substantial change in the technical content, shall also be regarded as the scope of the invention that can be implemented.
本發明的散熱裝置及伺服器用於解決現有技術中採用風冷模式存在的無法有效散熱的問題。以下將詳細闡述本發明的一種散熱裝置及伺服器的原理及實施方式，使本領域技術人員不需要創造性勞動即可理解本發明的一種散熱裝置及伺服器。The heat dissipation device and server of the present invention are used to solve the problem of inability to effectively dissipate heat in the air-cooling mode in the prior art. The principles and implementations of the heat dissipation device and the server of the present invention will be described in detail below, so that those skilled in the art can understand the heat dissipation device and the server of the present invention without creative work.
參閱圖1至圖7。本發明的散熱裝置及伺服器，與現有技術相比，本發明突破了傳統風冷散熱模式，採用風冷和液冷相結合的混合散熱模式，透過這種混合製冷方式，大幅提升了散熱效率，實現了有效散熱，解決了現有技術中僅採用風冷模式存在的無法有效散熱的問題；本發明設計導風罩用於起分流作用，透過將風流導至各導風流道中，根據不同導風流道中不同的散熱需求設計不同的形狀結構進行導風，實現了合理分配風流；該導風罩將風流最大程度地彙聚至需要散熱的結構處，提升了散熱效果，提高了各導風流道中風量有效利用率；各導風流道相互獨立，互不干擾，避免了旁流及亂流的產生，減少了資源浪費；本發明透過將該散熱裝置應用於伺服器，降低了熱源GPU散熱所消耗電能，並增強了該伺服器的可靠性，能夠很好地解決GPU散熱問題；使用導風罩可顯著增強該伺服器內各元件散熱效果，避免了熱量堆積對元件帶來的損害，提高工作效率的同時，避免了損壞的風險，進而延長了該伺服器的工作壽命。See Figures 1 to 7. Compared with the existing technology, the heat dissipation device and server of the present invention break through the traditional air-cooling heat dissipation mode and adopt a hybrid heat dissipation mode that combines air cooling and liquid cooling. Through this hybrid cooling method, the heat dissipation efficiency is greatly improved. , realizes effective heat dissipation, and solves the problem of ineffective heat dissipation in the existing technology that only uses air-cooling mode; the invention designs an air guide hood to play a diverting role, by guiding the air flow to each air guide flow channel, according to different air guide flows For different heat dissipation needs in the duct, different shaped structures are designed to guide the air, achieving a reasonable distribution of air flow; the air guide hood maximizes the concentration of air flow to the structures that need heat dissipation, improving the heat dissipation effect and increasing the effective air volume of each air guide duct. Utilization rate; Each air guide channel is independent of each other and does not interfere with each other, avoiding the generation of side flow and turbulent flow, and reducing resource waste; by applying the heat dissipation device to the server, the present invention reduces the power consumption of the heat source GPU heat dissipation. It also enhances the reliability of the server and can well solve the GPU heat dissipation problem; using the air guide can significantly enhance the heat dissipation effect of each component in the server, avoid damage to components caused by heat accumulation, and improve work efficiency. At the same time, the risk of damage is avoided, thereby extending the working life of the server.
如圖1所示，於一實施例中，本發明的散熱裝置包括殼體101、風冷散熱組件（未在圖中示出）和液冷散熱組件（未在圖中示出）。As shown in Figure 1, in one embodiment, the heat dissipation device of the present invention includes a housing 101, an air-cooling heat dissipation component (not shown in the figure) and a liquid-cooling heat dissipation component (not shown in the figure).
具體地，所述殼體101內部為空心結構；所述風冷散熱組件和所述液冷散熱組件均設於所述殼體內。Specifically, the interior of the housing 101 is a hollow structure; the air-cooling heat dissipation component and the liquid cooling heat dissipation component are both provided in the housing.
需要說明的是，於該殼體101內設有待散熱組件（未在圖中示出），以透過該風冷散熱組件和該液冷散熱組件對該待散熱組件進行散熱；具體地，對於待散熱組件中的主要熱源利用該液冷散熱組件進行冷卻，其餘熱源採用該風冷散熱組件進行冷卻，透過這種混合製冷方式，可大幅提升散熱效率。It should be noted that a heat dissipation component (not shown in the figure) is provided in the housing 101 to dissipate heat through the air-cooling heat dissipation component and the liquid-cooling heat dissipation component; specifically, for the heat dissipation component to be The main heat source in the heat dissipation component is cooled by the liquid cooling component, and the remaining heat sources are cooled by the air-cooling heat dissipation component. Through this hybrid cooling method, the heat dissipation efficiency can be greatly improved.
如圖1和圖2所示，於一實施例中，所述液冷散熱組件包括進液管102、出液管103及至少一組液冷板組（未在圖中示出）；每一所述液冷板組均分別與所述進液管102和所述出液管103連接。As shown in Figures 1 and 2, in one embodiment, the liquid cooling heat dissipation component includes a liquid inlet pipe 102, a liquid outlet pipe 103 and at least one liquid cooling plate group (not shown in the figure); each The liquid cooling plate groups are connected to the liquid inlet pipe 102 and the liquid outlet pipe 103 respectively.
如圖1和圖2所示，於一實施例中，每一所述液冷板組包括至少一液冷板104；所述液冷板104內為空心結構，用於存放冷液。As shown in FIGS. 1 and 2 , in one embodiment, each liquid cooling plate group includes at least one liquid cooling plate 104 ; the liquid cooling plate 104 has a hollow structure for storing cold liquid.
需要說明的是，當所述液冷板組包括至少兩個所述液冷板104時，至少兩個所述液冷板104依次排列，且相鄰的兩個所述液冷板104之間透過柔性軟管105連接，以實現液冷板組的液冷板104之間的相互連通；其中，位於首端的液冷板104與所述進液管102連接，位於尾端的液冷板104與所述出液管103連接。It should be noted that when the liquid cooling plate group includes at least two liquid cooling plates 104, at least two liquid cooling plates 104 are arranged in sequence, and there is a gap between two adjacent liquid cooling plates 104. The liquid-cooling plates 104 of the liquid-cooling plate group are connected through flexible hoses 105. The liquid-cooling plate 104 at the head end is connected to the liquid inlet pipe 102, and the liquid-cooling plate 104 at the tail end is connected to the liquid inlet pipe 102. The liquid outlet pipe 103 is connected.
需要說明的是，相鄰液冷板104之間透過柔性軟管105連接（如圖1和圖2所示），製作難度低，解決了採用硬管連接易變形、易損壞的問題。It should be noted that adjacent liquid cooling plates 104 are connected through flexible hoses 105 (as shown in Figures 1 and 2), which is easy to manufacture and solves the problem of easy deformation and damage when using hard pipe connections.
於一實施例中，當所述液冷板組的數量為至少兩組時，至少兩組所述液冷板組中的部分液冷板組形成第一冷板模組（未在圖中示出）；至少兩組所述液冷板組中，除用於形成所述第一冷板模組外的液冷板組形成第二冷板模組（未在圖中示出）。In one embodiment, when the number of the liquid cooling plate groups is at least two groups, some of the liquid cooling plate groups in the at least two groups of liquid cooling plate groups form a first cold plate module (not shown in the figure). out); among at least two sets of liquid cooling plate groups, the liquid cooling plate group other than those used to form the first cold plate module forms a second cold plate module (not shown in the figure).
如圖1所示，所述第一冷板模組用於為GPU模組201散熱；所述第二冷板模組用於為以太網交換機晶片202（NV SWITCH晶片）散熱。As shown in Figure 1, the first cold plate module is used to dissipate heat for the GPU module 201; the second cold plate module is used to dissipate heat for the Ethernet switch chip 202 (NV SWITCH chip).
需要說明的是，透過將本發明的散熱裝置應用於伺服器，對於該伺服器內的主要熱源（包括GPU模組201和以太網交換機晶片202）利用液冷板進行冷卻，其餘熱源仍採用風冷方式進行冷卻；透過這種混合製冷方式，可大幅提升該伺服器的散熱效率；同時，降低主要熱源GPU散熱所消耗電能，並增強伺服器的可靠性；另外，能很好的解決GPU散熱問題，最後可達到年平均PUE1.2以下。It should be noted that by applying the heat dissipation device of the present invention to a server, the main heat sources in the server (including the GPU module 201 and the Ethernet switch chip 202) are cooled by a liquid cooling plate, and the remaining heat sources are still cooled by air. Cooling method; through this hybrid cooling method, the heat dissipation efficiency of the server can be greatly improved; at the same time, the power consumption of the GPU heat dissipation, the main heat source, is reduced, and the reliability of the server is enhanced; in addition, it can effectively solve the problem of GPU heat dissipation Problem, the annual average PUE can eventually reach below 1.2.
如圖1和圖2所示，於一實施例中，所述液冷散熱組件還包括分水器106和至少一分液管組（未在圖中示出）。As shown in FIGS. 1 and 2 , in one embodiment, the liquid-cooling heat dissipation assembly further includes a water distributor 106 and at least one liquid distribution tube group (not shown in the figure).
具體地，每一所述分液管組對應一所述液冷板組，每一所述分液管組包括一進液分液管107和一出液分液管108；所述分水器106分別與所述進液管102、所述出液管103、所述進液分液管107及所述出液分液管108連接；每一所述液冷板組分別與對應的分液管組中的進液分液管107和出液分液管108連接。Specifically, each liquid distribution pipe group corresponds to a liquid cooling plate group, and each liquid distribution pipe group includes an inlet liquid distribution pipe 107 and an outlet liquid distribution pipe 108; the water distributor 106 are respectively connected to the liquid inlet pipe 102, the liquid outlet pipe 103, the liquid inlet pipe 107 and the outlet pipe 108; each of the liquid cooling plate groups is respectively connected to the corresponding liquid pipe. The inlet and outlet pipes 107 and 108 in the tube set are connected.
如圖1所示，用於為GPU模組201散熱的第一冷板模組，與用於為以太網交換機晶片202散熱的第二冷板模組合二為一，分水器也只用了一個，滿足散熱性能的同時，減少了快接頭的使用，冷水優先透過功耗較大的GPU模組201，提高了整個液冷散熱組件的散熱性能。As shown in Figure 1, the first cold plate module used to dissipate heat for the GPU module 201 is combined with the second cold plate module used to dissipate heat for the Ethernet switch chip 202. The water distributor is also used. One, while satisfying the heat dissipation performance, the use of quick connectors is reduced. The cold water is preferentially passed through the GPU module 201 with higher power consumption, which improves the heat dissipation performance of the entire liquid cooling component.
進一步地，在上述液冷散熱組件的安裝過程中，設計了專門的工裝結構，透過該工裝結構將該液冷散熱組件中的各個液冷板104（該工裝結構包括與液冷板104數量相等的工裝組件30）之間連接為一個硬性連接整體，用於各液冷板104的預固定，大大了降低了組裝難度及治具的製作費用。Furthermore, during the installation process of the above-mentioned liquid cooling heat dissipation component, a special tooling structure is designed, through which each liquid cooling plate 104 in the liquid cooling heat dissipation component (the tooling structure includes an equal number of liquid cooling plates 104 The tooling components 30) are connected into a rigidly connected whole, which is used to pre-fix each liquid cooling plate 104, which greatly reduces the difficulty of assembly and the manufacturing cost of the jig.
具體地，在安裝該液冷散熱組件時，透過該工裝結構將該液冷散熱組件的各液冷板104安裝於GPU模組201和以太網交換機晶片202；在安裝完成後，再將該工裝結構移除即可，以備後續其它液冷板組裝時再次使用，可以重複利用。Specifically, when installing the liquid cooling heat dissipation component, each liquid cooling plate 104 of the liquid cooling heat dissipation component is installed on the GPU module 201 and the Ethernet switch chip 202 through the tooling structure; after the installation is completed, the tooling is The structure can be removed for subsequent use when assembling other liquid cooling plates and can be reused.
如圖4和圖5所示，每一工裝組件30內置彈簧301，只需按壓後旋轉半圈與液冷板104上的固定件1041緊固即可，製作簡單，操作方便，成本更低。As shown in Figures 4 and 5, each tooling assembly 30 has a built-in spring 301, which only needs to be pressed and then rotated half a turn to tighten with the fixing piece 1041 on the liquid cooling plate 104. It is simple to make, easy to operate, and lower in cost.
如圖1所示，於一實施例中，所述液冷散熱組件還包括支架109，該支架109用於安裝分水器106。As shown in FIG. 1 , in one embodiment, the liquid cooling component further includes a bracket 109 , which is used to install a water distributor 106 .
需要說明的是，隨著市場對伺服器性能要求的不斷提高，伺服器內部元件越來越多、分佈越來越密集，各元件的運行強度也不斷增加，這就造成系統內部產生的熱量越來越多，所以如何靈活運用伺服器內部的空間來提高各元件的散熱效率成為產品研發過程中面臨的重要問題；現有技術中，在伺服器中通常採用風扇進行散熱，利用風流將熱量帶走，但是，使用風扇進行散熱時通常面臨以下問題：It should be noted that as the market continues to improve the performance requirements of servers, the internal components of the server are becoming more and more densely distributed, and the operating intensity of each component is also increasing, which causes the heat generated inside the system to become more and more intense. There are more and more, so how to flexibly use the space inside the server to improve the heat dissipation efficiency of each component has become an important issue faced in the product development process; in the existing technology, fans are usually used in servers for heat dissipation, and wind flow is used to take away the heat. , however, you usually face the following problems when using fans for cooling:
（1）風流分配不合理，缺乏針對性。主板上各發熱元件的散熱需求不同，所需風量也不同，風流無法按需分配風量給各流道上的元件，致使散熱效果不佳；(1) The distribution of wind flow is unreasonable and lacks pertinence. The heat dissipation requirements of each heating component on the motherboard are different, and the required air volume is also different. The air flow cannot distribute the air volume to the components on each flow channel as needed, resulting in poor heat dissipation effect;
（2）風量有效利用率低。風扇吹出的風流大多於各元件之間的空隙中流出，能夠在各元件表面起到散熱作用的風量有限；(2) The effective utilization rate of air volume is low. Most of the air flow blown by the fan flows out from the gaps between the components, and the amount of air that can dissipate heat on the surface of each component is limited;
（3）風流受空間佈局影響大。主板上各元件對風流也起到一定阻擋作用，所以在各元件間的空隙之間易形成旁流，風流相互干擾，影響散熱效果；(3) Wind flow is greatly affected by spatial layout. Each component on the motherboard also blocks the air flow to a certain extent, so side flow is easily formed in the gaps between the components, and the air flow interferes with each other, affecting the heat dissipation effect;
（4）系統工作效率降低且存在對系統安全性的威脅。風量分佈不合理、散熱效果不佳等因素使得散熱元件表面的熱量無法及時散出，熱量堆積過多使得元件工作效率降低且有損壞的風險；(4) System efficiency is reduced and there is a threat to system security. Factors such as unreasonable air volume distribution and poor heat dissipation effect prevent the heat on the surface of the cooling component from being dissipated in time. Excessive heat accumulation reduces the working efficiency of the component and risks damage;
（5）通用型導風罩無法精準導風。現有設計中的通用型導風罩結構單一，無法實現對散熱量需求大的元件進行精準導風，散熱效率無法達到要求。(5) Universal air guide hood cannot accurately guide air. The universal air guide hood in the existing design has a single structure, which cannot accurately guide the air for components with large heat dissipation requirements, and the heat dissipation efficiency cannot meet the requirements.
為解決上述問題，如圖1、圖3及圖6所示，本發明提供了一種風冷散熱組件；具體地，所述風冷散熱組件包括導風罩110和風冷機構111。In order to solve the above problems, as shown in Figures 1, 3 and 6, the present invention provides an air-cooling heat dissipation assembly; specifically, the air-cooling heat dissipation assembly includes an air guide cover 110 and an air cooling mechanism 111.
於一實施例中，所述導風罩110和所述風冷機構111均設於所述殼體101，其中，所述導風罩110用於將風流分別導向三個不同的導風流道，這三個導風流道分別對應殼體101的兩側及該殼體101後部（如圖3所示，殼體101的右側設有進風口，左側設有出風口，箭頭指明了風向）。In one embodiment, the air guide 110 and the air cooling mechanism 111 are both provided in the housing 101, wherein the air guide 110 is used to guide the air flow to three different air guide channels, respectively. These three air guide flow channels respectively correspond to both sides of the housing 101 and the rear of the housing 101 (as shown in Figure 3, there is an air inlet on the right side of the housing 101 and an air outlet on the left side, and the arrow indicates the wind direction).
具體地，在將本發明的散熱裝置應用於伺服器時，該導風罩110用於將風流分流導向伺服器機櫃兩側的VR及該機櫃後部的網卡（PCIe卡）處。Specifically, when the heat dissipation device of the present invention is applied to a server, the air guide cover 110 is used to divert the air flow to the VR on both sides of the server cabinet and the network card (PCIe card) at the rear of the cabinet.
如圖6和圖7所示，於一實施例中，所述導風罩110包括第一導風塊1101、第二導風塊1102及第三導風塊1103。As shown in FIGS. 6 and 7 , in one embodiment, the air guide cover 110 includes a first air guide block 1101 , a second air guide block 1102 and a third air guide block 1103 .
具體地，所述第二導風塊1102設於所述第一導風塊1101與所述第三導風塊1103之間，且所述第二導風塊1102的高度低於所述第一導風塊1101和所述第三導風塊1103。Specifically, the second air guide block 1102 is provided between the first air guide block 1101 and the third air guide block 1103, and the height of the second air guide block 1102 is lower than the first air guide block 1102. The air guide block 1101 and the third air guide block 1103.
如圖6和圖7所示，於一實施例中，所述第二導風塊1102包括三個依次連接且高度逐級遞減的階梯板11021；相鄰的兩個所述階梯板11021之間透過斜面板11022連接。As shown in Figures 6 and 7, in one embodiment, the second air guide block 1102 includes three step plates 11021 connected in sequence and with decreasing heights; Connected through inclined plate 11022.
具體地，如圖6和圖7所示，沿著殼體101寬度方向，導風罩110在空間上的高低分佈，將導風罩110分為三個區域，分別為第一導風塊1101、第二導風塊1102及第三導風塊1103；其中，第一導風塊1101和第三導風塊1103的塊狀結構相比中間區域的第二導風塊1102更加高，以便於將風導向VR Heatsink處，從而改善其換熱效果；而第二導風塊1102沿殼體101長度方向則做了兩次的階梯狀下壓設計，主要是為了將氣流壓低至與後方PCIe卡相近的高度區間內，從而提高後方卡區的氣流流量。Specifically, as shown in FIGS. 6 and 7 , along the width direction of the housing 101 , the spatial distribution of the air guide cover 110 divides the air guide cover 110 into three areas, namely the first air guide block 1101 , the second air guide block 1102 and the third air guide block 1103; wherein, the block structure of the first air guide block 1101 and the third air guide block 1103 is higher than the second air guide block 1102 in the middle area, so as to facilitate The air is directed to the VR Heatsink to improve its heat exchange effect; the second air guide block 1102 is designed with two stepped downward pressures along the length of the housing 101, mainly to lower the airflow to the rear PCIe card. Within a similar height range, thereby increasing the airflow in the rear stuck area.
於一實施例中，所述導風罩110為整體式結構，其透過螺絲鎖附在整個殼體101上。In one embodiment, the air guide cover 110 is an integral structure, and is locked to the entire housing 101 through screws.
如圖1、圖6及圖7所示，於一實施例中，所述導風罩110的頂板1104與殼體101的上蓋1011接觸。As shown in FIGS. 1 , 6 and 7 , in one embodiment, the top plate 1104 of the air guide 110 is in contact with the upper cover 1011 of the housing 101 .
需要說明的，該導風罩110順應伺服器機櫃內部各元件的空間佈局，VR處導風罩設計高度較低，將風流最大可能壓至VR處；另外，順應分液管組（包括進液分液管107和出液分液管108）的分佈，設計了斜面對網卡進行導風，從而最大程度地利用了風量，使VR及網卡實現高效散熱，達到了以下技術效果：It should be noted that the air guide 110 conforms to the spatial layout of the components inside the server cabinet. The design height of the air guide 110 at VR is lower to maximize the air flow to VR; in addition, it conforms to the liquid distribution pipe group (including liquid inlet). The distribution of the liquid dispensing pipe 107 and the liquid dispensing pipe 108) is designed with a slope to guide the air to the network card, thereby maximizing the use of air volume, enabling efficient heat dissipation of the VR and the network card, and achieving the following technical effects:
（1）合理分配風流。導風罩起分流作用，將風流導至各流道中，根據不同流道中不同的散熱需求設計不同的形狀結構進行導風。(1) Reasonably distribute the wind flow. The air guide hood acts as a diverter to guide the air flow to each flow channel. Different shapes and structures are designed to guide the air according to the different heat dissipation requirements in different flow channels.
（2）提高各流道中風量有效利用率。導風罩將風流最大程度地彙聚至需要散熱的元件處，提升了各元件的散熱效果。(2) Improve the effective utilization rate of the air volume in each flow channel. The air guide maximizes the flow of air to the components that need heat dissipation, improving the heat dissipation effect of each component.
（3）避免形成亂流。各風道相互獨立，互不干擾，避免了旁流及亂流的產生，減少資源浪費。(3) Avoid turbulence. Each air duct is independent of each other and does not interfere with each other, avoiding the generation of side flow and turbulence and reducing waste of resources.
（4）延長伺服器工作壽命。使用導風罩可顯著增強各元件散熱效果，避免了熱量堆積對元件帶來的損害，提高工作效率的同時避免了損壞的風險。(4) Extend the working life of the server. The use of air guides can significantly enhance the heat dissipation effect of each component, avoid damage to components caused by heat accumulation, improve work efficiency and avoid the risk of damage.
（5）結構簡單，易於製作，成本低。(5) Simple structure, easy to produce and low cost.
於一實施例中，所述導風罩110採用成本低廉的麥拉（Mylar）材料製成，相比聚碳酸酯材質（PC）的導風罩，麥拉材質的導風罩無需開模，製作簡單，經濟效益明顯。In one embodiment, the air guide cover 110 is made of low-cost Mylar material. Compared with the air guide cover made of polycarbonate (PC), the air guide cover made of Mylar material does not require mold opening. It is simple to make and has obvious economic benefits.
需要說明的是，本發明提供了在某機型機台中使用的一種整體式導風罩，針對晶片及卡的散熱需求分別提供了三個導風流道 ，分別優化各流道中的風流分配、最大程度利用了風量，提升散熱效果、避免了熱量堆積對系統造成損害、延長了伺服器的工作壽命。It should be noted that the present invention provides an integrated air guide used in a certain machine model. It provides three air guide flow channels according to the heat dissipation requirements of chips and cards, respectively optimizing the air flow distribution and maximum flow in each flow channel. The air volume is fully utilized to improve the heat dissipation effect, avoid damage to the system caused by heat accumulation, and extend the working life of the server.
於一實施例中，本發明的伺服器包括待散熱組件及上述的散熱裝置。In one embodiment, the server of the present invention includes a component to be cooled and the above-mentioned heat dissipation device.
具體地，所述散熱裝置的殼體101為所述伺服器機櫃的櫃體；所述待散熱組件設於所述櫃體內；所述散熱裝置的液冷板組設於所述待散熱組件。Specifically, the housing 101 of the heat dissipation device is the cabinet of the server cabinet; the component to be heat dissipated is provided in the cabinet; and the liquid cooling plate of the heat dissipation device is assembled to the component to be heat dissipated.
如圖1所示，於一實施例中，所述待散熱組件包括GPU模組201和以太網交換機晶片202。As shown in FIG. 1 , in one embodiment, the components to be heat dissipated include a GPU module 201 and an Ethernet switch chip 202 .
具體地，當所述液冷板組的數量為至少兩組時，至少兩組所述液冷板組中的部分液冷板組形成第一冷板模組；至少兩組所述液冷板組中，除用於形成所述第一冷板模組外的液冷板組形成第二冷板模組。Specifically, when the number of the liquid cooling plate groups is at least two groups, part of the liquid cooling plate groups in the at least two groups of liquid cooling plate groups form the first cold plate module; at least two groups of the liquid cooling plate groups In the group, the liquid cooling plate group except for forming the first cold plate module forms a second cold plate module.
需要說明的是，所述第一冷板模組設於所述GPU模組201，用於為所述GPU模組散熱；所述第二冷板模組設於所述以太網交換機晶片202，用於為所述以太網交換機晶片202散熱。It should be noted that the first cold plate module is provided on the GPU module 201 and is used to dissipate heat for the GPU module; the second cold plate module is provided on the Ethernet switch chip 202. Used to dissipate heat for the Ethernet switch chip 202 .
下面透過具體實施例來進一步解釋說明本發明的散熱裝置應用於伺服器的工作原理。The working principle of the heat dissipation device of the present invention applied to the server will be further explained through specific embodiments.
如圖1至圖3所示，於一實施例中，該散熱裝置的液冷散熱組件包括五組液冷板組；其中，四組液冷板組中均包括兩個液冷板104，分別為第一液冷板和第二液冷板，第一液冷板與第二液冷板之間透過第一柔性軟管連接，且該四組液冷板組形成第一冷板模組；剩餘一組液冷板組包括四個液冷板104，這四個液冷板依次設置，且相鄰兩個液冷板104之間透過第二柔性軟管連接，形成第二冷板模組。As shown in FIGS. 1 to 3 , in one embodiment, the liquid cooling component of the heat dissipation device includes five groups of liquid cooling plates; each of the four groups of liquid cooling plates includes two liquid cooling plates 104 , respectively. It is a first liquid cooling plate and a second liquid cooling plate, the first liquid cooling plate and the second liquid cooling plate are connected through a first flexible hose, and the four groups of liquid cooling plates form a first cold plate module; The remaining liquid-cooled plate group includes four liquid-cooled plates 104. These four liquid-cooled plates are arranged in sequence, and two adjacent liquid-cooled plates 104 are connected through a second flexible hose to form a second cold plate module. .
對應地，透過分水器106分出五個進液分液管107和五個出液分液管108；其中，五個進液分液管107中的四個進液分液管107分別與上述四組液冷板組中的四個第一液冷板104連接，剩餘的一進液分液管107與上述第二冷板模組中位於首端的液冷板104連接；五個出液分液管108中的四個出液分液管108分別與上述四組液冷板組中的四個第二液冷板104連接，剩餘的一出液分液管108與上述第二冷板模組中位於尾端的液冷板104連接。Correspondingly, five inlet and outlet pipes 107 and five outlet pipes 108 are separated through the water separator 106; among them, four of the five inlet and outlet pipes 107 are respectively connected with The four first liquid cooling plates 104 in the above four groups of liquid cooling plates are connected, and the remaining liquid inlet and liquid distribution pipe 107 is connected to the liquid cooling plate 104 located at the head end of the above second cold plate module; the five liquid outlets The four liquid outlet pipes 108 of the liquid distributor pipes 108 are respectively connected to the four second liquid cooling plates 104 in the above four groups of liquid cooling plates, and the remaining one liquid outlet pipe 108 is connected to the above second cold plate. The liquid cooling plate 104 located at the rear end of the module is connected.
具體地，由外界輸入冷液至該進液管102，經由分水器106分水後，產生五路分液支路（分別對應上述的五個進液分液管107），分別流向上述的五組液冷板組，經冷卻後，再經上述的五個出液分液管108流進該分水器106，最終沿著出液管103流出，實現散熱。Specifically, cold liquid is input from the outside to the liquid inlet pipe 102, and after the water is divided by the water distributor 106, five liquid branch branches are generated (corresponding to the above-mentioned five liquid inlet pipes 107), respectively flowing to the above-mentioned liquid inlet pipes 107. After cooling, the five sets of liquid cooling plate groups flow into the water distributor 106 through the above-mentioned five liquid outlet pipes 108, and finally flow out along the liquid outlet pipe 103 to achieve heat dissipation.
綜上所述，本發明的散熱裝置及伺服器，與現有技術相比，本發明突破了傳統風冷散熱模式，採用風冷和液冷相結合的混合散熱模式，透過這種混合製冷方式，大幅提升了散熱效率，實現了有效散熱，解決了現有技術中僅採用風冷模式存在的無法有效散熱的問題；本發明設計導風罩用於起分流作用，透過將風流導至各導風流道中，根據不同導風流道中不同的散熱需求設計不同的形狀結構進行導風，實現了合理分配風流；該導風罩將風流最大程度地彙聚至需要散熱的結構處，提升了散熱效果，提高了各導風流道中風量有效利用率；各導風流道相互獨立，互不干擾，避免了旁流及亂流的產生，減少了資源浪費；本發明透過將該散熱裝置應用於伺服器，降低了熱源GPU散熱所消耗電能，並增強了該伺服器的可靠性，能夠很好地解決GPU散熱問題；使用導風罩可顯著增強該伺服器內各元件散熱效果，避免了熱量堆積對元件帶來的損害，提高工作效率的同時，避免了損壞的風險，進而延長了該伺服器的工作壽命；所以，本發明有效克服了現有技術中的種種缺點而具高度產業利用價值。To sum up, compared with the existing technology, the heat dissipation device and server of the present invention break through the traditional air-cooling heat dissipation mode and adopt a hybrid heat dissipation mode that combines air cooling and liquid cooling. Through this hybrid cooling method, The heat dissipation efficiency is greatly improved, effective heat dissipation is achieved, and the problem of ineffective heat dissipation existing in the existing technology that only uses air-cooling mode is solved; the air guide hood is designed in the present invention to act as a diverter, by guiding the air flow to each air guide runner. According to the different heat dissipation needs in different air guide ducts, different shapes of structures are designed to guide the air, achieving a reasonable distribution of air flow; the air guide hood maximizes the concentration of air flow to the structures that need heat dissipation, improving the heat dissipation effect and improving various aspects. Effective utilization rate of air volume in the air guide ducts; each air guide runner is independent of each other and does not interfere with each other, avoiding the generation of side flow and turbulent flow, and reducing resource waste; by applying the heat dissipation device to the server, the present invention reduces the heat source GPU The heat dissipation consumes electricity and enhances the reliability of the server, which can well solve the GPU heat dissipation problem; using the air guide can significantly enhance the heat dissipation effect of each component in the server and avoid damage to the components caused by heat accumulation. , while improving work efficiency, avoiding the risk of damage, thereby extending the working life of the server; therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.
上述實施例僅例示性說明本發明的原理及其功效，而非用於限制本發明。任何熟悉此技術的人士皆可在不違背本發明的精神及範疇下，對上述實施例進行修飾或改變。因此，舉凡所屬技術領域中具有通常知識者在未脫離本發明所揭示的精神與技術思想下所完成的一切等效修飾或改變，仍應由本發明的權利要求所涵蓋。The above embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present invention shall still be covered by the claims of the present invention.
101:殼體 1011:上蓋 102:進液管 103:出液管 104:液冷板 1041:固定件 105:柔性軟管 106:分水器 107:進液分液管 108:出液分液管 109:支架 110:導風罩 1101:第一導風塊 1102:第二導風塊 11021:階梯板 11022:斜面板 1103:第三導風塊 1104:頂板 111:風冷機構 201:GPU模組 202:以太網交換機晶片 30:工裝組件 301:彈簧 101: Shell 1011: Upper cover 102: Liquid inlet pipe 103: Liquid outlet pipe 104:Liquid cooling plate 1041: Fasteners 105:Flexible hose 106:Water separator 107: Liquid inlet and dispensing tube 108: Discharge tube 109:Bracket 110: Wind guide cover 1101: First air guide block 1102: Second air guide block 11021:Step board 11022: Inclined panel 1103: The third air guide block 1104: Top plate 111: Air cooling mechanism 201:GPU module 202:Ethernet switch chip 30: Tooling components 301:Spring
圖1顯示為本發明的散熱裝置於一實施例中的***圖。 圖2顯示為本發明的液冷散熱組件於一實施例中的結構示意圖。 圖3顯示為本發明的散熱裝置於一實施例中的整體結構示意圖。 圖4顯示為本發明的工裝組件與液冷板於一實施例中的分離狀態圖。 圖5顯示為本發明的工裝組件與液冷板於一實施例中的連接狀態圖。 圖6顯示為本發明的導風罩於一實施例中的斜視圖。 圖7顯示為本發明的導風罩處於一實施例中的氣流流動示意圖。 FIG. 1 is an exploded view of the heat dissipation device of the present invention in one embodiment. FIG. 2 shows a schematic structural diagram of the liquid cooling heat dissipation component of the present invention in one embodiment. FIG. 3 is a schematic diagram of the overall structure of the heat dissipation device of the present invention in one embodiment. FIG. 4 shows a separation state diagram of the tooling assembly and the liquid cooling plate in one embodiment of the present invention. FIG. 5 shows a connection state diagram of the tooling assembly and the liquid cooling plate in one embodiment of the present invention. FIG. 6 is a perspective view of the air guide cover in one embodiment of the present invention. FIG. 7 is a schematic diagram of the air flow of the air guide cover in an embodiment of the present invention.
101:殼體 101: Shell
1011:上蓋 1011: Upper cover
102:進液管 102: Liquid inlet pipe
103:出液管 103: Liquid outlet pipe
104:液冷板 104:Liquid cooling plate
1041:固定件 1041: Fasteners
105:柔性軟管 105:Flexible hose
106:分水器 106:Water separator
107:進液分液管 107: Liquid inlet and dispensing tube
108:出液分液管 108: Discharge tube
109:支架 109:Bracket
111:風冷機構 111: Air cooling mechanism
201:GPU模組 201:GPU module
202:以太網交換機晶片 202:Ethernet switch chip
Claims (9)
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110060470A1 (en) * | 2009-09-09 | 2011-03-10 | International Business Machines Corporation | Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks |
| CN103176572A (en) * | 2011-12-26 | 2013-06-26 | 英业达股份有限公司 | Server and heat-dissipating module |
| TWM600068U (en) * | 2020-03-24 | 2020-08-11 | 廣達電腦股份有限公司 | Equipment assembly, cooling system, and equipment rack |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110060470A1 (en) * | 2009-09-09 | 2011-03-10 | International Business Machines Corporation | Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks |
| CN103176572A (en) * | 2011-12-26 | 2013-06-26 | 英业达股份有限公司 | Server and heat-dissipating module |
| TWM600068U (en) * | 2020-03-24 | 2020-08-11 | 廣達電腦股份有限公司 | Equipment assembly, cooling system, and equipment rack |
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