TW202339594A - Air guide structure - Google Patents
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 238000009434 installation Methods 0.000 claims abstract description 9
- 230000009977 dual effect Effects 0.000 claims description 23
- 238000005192 partition Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000002452 interceptive effect Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 239000000284 extract Substances 0.000 description 1
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Abstract
Description
本發明係關於一種結構，特別是涉及一種導風結構。The present invention relates to a structure, in particular to an air guide structure.
隨著服務器的計算功能不斷強大，晶片集成度不斷增加，其表面熱流密度也不斷增大，產生的熱量增多，使得服務器的散熱問題愈加嚴峻。在服務器內部，通常採用散熱器與風扇的組合來增強晶片散熱，風扇吹出的風經過散熱器帶走散熱器底部通過與晶片接觸而吸收的熱量，從而實現散熱。As the computing functions of servers continue to become stronger and the integration level of chips continues to increase, the heat flow density on their surfaces also continues to increase, and the heat generated increases, making the heat dissipation problem of servers more severe. Inside the server, a combination of radiator and fan is usually used to enhance chip heat dissipation. The wind blown by the fan passes through the radiator and takes away the heat absorbed by the bottom of the radiator through contact with the chip, thereby achieving heat dissipation.
但是現有技術存在以下缺陷：However, the existing technology has the following shortcomings:
第一，風量利用率低。風扇吹出的風只有一小部分能夠吹到需要散熱的元件上，大部分風流都在各處理器及散熱器的上方或兩側形成旁流，無法滿足各元件散熱所需風量；First, the air volume utilization rate is low. Only a small part of the air blown by the fan can blow to the components that need heat dissipation. Most of the air flow forms side flow above or on both sides of each processor and radiator, which cannot meet the air volume required for each component to dissipate heat;
第二，風流分配不合理。不同元件散熱所需風量不同，且不同元件所在流道的流阻不同，風扇所提供的的風量無法按需分配給各元件，無法達到最佳散熱效果；Second, the distribution of wind flow is unreasonable. Different components require different air volumes for heat dissipation, and the flow resistance of the flow channels where different components are located is different. The air volume provided by the fan cannot be distributed to each component as needed, and the optimal heat dissipation effect cannot be achieved;
第三，系統內部易形成亂流。主板上各元件由於安裝位置的原因，其間風流相互干擾，容易形成亂流，干擾散熱；Third, turbulence is easy to form within the system. Due to the installation position of each component on the motherboard, the air flow between them interferes with each other, easily forming turbulence and interfering with heat dissipation;
第四，存在對服務器工作效率及系統壽命的威脅。由於散熱效果不佳，各工作元件表面熱量無法及時散出，熱量堆積，元件溫度不斷升高會降低工作效率，並對各元件的使用壽命及整體系統壽命造成威脅；Fourth, there are threats to server efficiency and system life. Due to the poor heat dissipation effect, the heat on the surface of each working component cannot be dissipated in time, and the heat accumulates. The rising component temperature will reduce the working efficiency and pose a threat to the service life of each component and the life of the overall system;
第五，現有通用型導風罩結構簡單、設計單一，只能起到簡單的分區導流作用，無法針對高發熱量元件進行高效散熱，效果不佳。Fifth, the existing general-purpose air guide hood has a simple structure and a single design. It can only play a simple role in zoning air diversion. It cannot efficiently dissipate heat for high-heat components, and the effect is not good.
因此，如何提供一種導風結構，以解決現有技術中存在的風量利用率低、風流分配不合理、系統內部易形成亂流、結構簡單無法針對高發熱量元件進行高效散熱等缺陷，實已成為本領域技術人員亟待解決的技術問題。Therefore, how to provide an air guide structure to solve the shortcomings in the existing technology such as low air volume utilization, unreasonable air flow distribution, easy formation of turbulent flow inside the system, and simple structure that cannot efficiently dissipate heat for high-heat components has become a practical problem. Technical problems that need to be solved urgently by technicians in the field.
鑒於以上所述現有技術的缺點，本發明的目的在於提供一種導風結構，用於解決現有技術中存在的風量利用率低、風流分配不合理、系統內部易形成亂流、結構簡單無法針對高發熱量元件進行高效散熱的問題。In view of the above shortcomings of the prior art, the purpose of the present invention is to provide an air guide structure to solve the problems existing in the prior art such as low air volume utilization, unreasonable air flow distribution, easy formation of turbulence inside the system, and a simple structure that cannot target high-incidence The problem of efficient heat dissipation from thermal components.
為實現上述目的及其他相關目的，本發明提供一種導風結構，應用於機台，機台包括若干位於機箱內部的散熱部件；導風結構包括：主體導風罩，固定至機箱的外殼，以罩蓋散熱部件；其中，主體導風罩的內側按照散熱部件的安裝位置依次形成有用於將風流引導至不同散熱部件處的第一流道，第二流道、第三流道及第四流道；第一流道與第二流道之間，第二流道與第三流道之間，第三流道與第四流道之間均設置有隔板。In order to achieve the above objects and other related objects, the present invention provides an air guide structure, which is applied to a machine. The machine includes a number of heat dissipation components located inside the chassis; the air guide structure includes: a main air guide hood, which is fixed to the outer shell of the chassis. Cover heat dissipation component; wherein, the inside of the main air guide cover is formed with a first flow channel, a second flow channel, a third flow channel and a fourth flow channel for guiding the air flow to different heat dissipation components in sequence according to the installation position of the heat dissipation component. ; There are partitions between the first flow channel and the second flow channel, between the second flow channel and the third flow channel, and between the third flow channel and the fourth flow channel.
於本發明的一實施例中，機箱的外殼的邊緣側設置卡槽；主體導風罩的罩邊，且與卡槽對應處設置有卡扣。In one embodiment of the present invention, a card slot is provided on the edge side of the outer casing of the chassis; and a buckle is provided on the edge of the main air guide cover corresponding to the card slot.
於本發明的一實施例中，散熱部件包括主板晶片、及設置於主板新版上的硬碟驅動器、主機接口、雙列直插式存儲模組、中央處理器、南橋晶片、圖形處理晶片和/或PCIe卡。In one embodiment of the present invention, the heat dissipation component includes a motherboard chip, a hard disk drive, a host interface, a dual in-line storage module, a central processing unit, a south bridge chip, a graphics processing chip and/or provided on the new version of the motherboard. or PCIe card.
於本發明的一實施例中，導風結構還包括分別設置於主體導風罩的出風口處和入風口處的第一散熱器和第二散熱器。In one embodiment of the present invention, the air guide structure further includes a first radiator and a second radiator respectively provided at the air outlet and the air inlet of the main air guide cover.
於本發明的一實施例中，第一散熱器安裝在第一流道的出風口處；第二散熱器安裝在第二流道和第三流道的入風口處。In one embodiment of the present invention, the first radiator is installed at the air outlet of the first flow channel; the second radiator is installed at the air inlet of the second flow channel and the third flow channel.
於本發明的一實施例中，第一流道從入口至出口依次為硬碟驅動器、主機接口、第一部分雙列直插式存儲模組及南橋晶片引導風流；第一流道中包圍硬碟驅動器的內壁呈傾斜狀；第一流道中遠離第一部分雙列直插式存儲模組的內壁亦呈傾斜狀；第一散熱器用於驅散第一流道內的熱量。In one embodiment of the present invention, the first flow channel guides the air flow from the entrance to the exit in order for the hard drive, the host interface, the first part of the dual in-line storage module and the south bridge chip; the inner part surrounding the hard drive in the first flow channel The wall is inclined; the inner wall of the first flow channel away from the first part of the dual in-line storage module is also inclined; the first radiator is used to dissipate the heat in the first flow channel.
於本發明的一實施例中，第二流道從入口至出口依次為中央處理器和PCIe卡引導風流；其中，中央處理器的散熱器與主體導風罩的頂部貼近。In one embodiment of the present invention, the second flow channel guides the air flow for the CPU and the PCIe card sequentially from the entrance to the exit; wherein, the heat sink of the CPU is close to the top of the main air guide cover.
於本發明的一實施例中，當機台內未***圖形處理晶片時，第三流道僅為第二部分雙列直插式存儲模組引導風流；第二散熱器用於驅散第二流道和第三流道內的熱量。In one embodiment of the present invention, when the graphics processing chip is not inserted into the machine, the third flow channel only guides the air flow of the second part of the dual in-line memory module; the second radiator is used to disperse the second flow channel and the heat in the third flow channel.
於本發明的一實施例中，導風結構還包括呈弧形狀的輔助導風罩；輔助導風罩可拆分式***於主體導風罩的第三流道內；輔助導風罩適用於當機台內通過晶片支架***圖像處理晶片時，輔助導風罩的弧形壁為位於晶片支架下方的第二部分雙列直插式存儲模組導風。In one embodiment of the present invention, the air guide structure further includes an arc-shaped auxiliary air guide hood; the auxiliary air guide hood is detachably inserted into the third flow channel of the main air guide hood; the auxiliary air guide hood is suitable for When the image processing chip is inserted into the machine through the chip holder, the curved wall of the auxiliary air guide guides air for the second part of the dual in-line storage module located below the chip holder.
於本發明的一實施例中，第四流道從入口至出口依次為圖形處理晶片、第二部分雙列直插式存儲模組及PCIe卡引導風流；其中，形成第四流道的兩側端的罩面呈對稱傾斜狀，兩端之間的部分罩蓋的貼近於圖形處理晶片。In one embodiment of the present invention, the fourth flow channel guides the air flow for the graphics processing chip, the second part of the dual in-line storage module and the PCIe card in sequence from the entrance to the exit; wherein, both sides of the fourth flow channel are formed The cover surface of the two ends is symmetrically inclined, and the part of the cover between the two ends is close to the graphics processing chip.
如上所述，本發明的導風結構，具有以下有益效果：As mentioned above, the wind guide structure of the present invention has the following beneficial effects:
第一，本發明使用導風罩可將風流導至各需散熱元件處，避免在各元件上方或兩側形成旁流，顯著增強各元件散熱效果，提高風量利用率；First, the present invention uses an air guide hood to guide the air flow to each component that requires heat dissipation, avoiding the formation of side flow above or on both sides of each component, significantly enhancing the heat dissipation effect of each component, and improving the air volume utilization rate;
第二，本發明採用各風道間導風罩呈隔板設計，各元件間風道相互獨立，避免形成亂流阻礙散熱，各元件獨立散熱，互不干擾，實現合理分配風流；Secondly, the present invention adopts the partition design of the air guide cover between each air duct, and the air ducts between each component are independent of each other to avoid the formation of turbulent flow and hinder heat dissipation. Each component independently dissipates heat without interfering with each other, achieving reasonable distribution of air flow;
第三，本發明避免因熱量無法及時散出堆積在元件表面從而對系統工作壽命產生威脅，延長服務器工作壽命；Third, the present invention avoids the threat to the working life of the system due to heat being unable to dissipate in time and accumulating on the surface of components, and extends the working life of the server;
第四， 本發明針對發熱量高、散熱需求大的工作元件，導風罩呈斜面設計，最大程度對風流進行引流，實現高效散熱；Fourth, this invention is aimed at working components with high calorific value and large heat dissipation requirements. The air guide cover is designed with a slope to guide the wind flow to the greatest extent and achieve efficient heat dissipation;
第五，本發明整體穩固性好，結構簡單，易於製作及安裝，成本低廉。Fifth, the present invention has good overall stability, simple structure, easy production and installation, and low cost.
以下由特定的具體實施例說明本發明的實施方式，熟悉此技術的人士可由本說明書所揭露的內容輕易地瞭解本發明的其他優點及功效。The implementation of the present invention is described below with specific embodiments. Those familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
須知，本說明書所附圖式所繪示的結構、比例、大小等，均僅用以配合說明書所揭示的內容，以供熟悉此技術的人士瞭解與閱讀，並非用以限定本發明可實施的限定條件，故不具技術上的實質意義，任何結構的修飾、比例關係的改變或大小的調整，在不影響本發明所能產生的功效及所能達成的目的下，均應仍落在本發明所揭示的技術內容得能涵蓋的範圍內。同時，本說明書中所引用的如“上”、“下”、“左”、“右”、“中間”及“一”等的用語，亦僅為便於敘述的明瞭，而非用以限定本發明可實施的範圍，其相對關係的改變或調整，在無實質變更技術內容下，當亦視為本發明可實施的範疇。It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to coordinate with the content disclosed in the specification for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention. Restrictive conditions, so they have no technical substantive significance. Any structural modifications, changes in proportions, or adjustments in size should still fall within the scope of the present invention as long as they do not affect the effects that the present invention can produce and the purposes that can be achieved. The technical content disclosed must be within the scope that can be covered. At the same time, terms such as "upper", "lower", "left", "right", "middle" and "one" cited in this specification are only for convenience of description and are not used to limit the scope of this specification. The scope of the invention that can be implemented, and changes or adjustments in their relative relationships, as long as there is no substantial change in the technical content, shall also be regarded as the scope of the invention that can be implemented.
實施例一
本實施例提供一種導風結構，機台包括若干位於機箱內部的散熱部件；導風結構包括：This embodiment provides an air guide structure. The machine includes a number of heat dissipation components located inside the chassis; the air guide structure includes:
主體導風罩，固定至機箱的外殼，以罩蓋散熱部件；The main air guide is fixed to the shell of the chassis to cover the heat dissipation components;
其中，主體導風罩的內側按照散熱部件的安裝位置依次形成有用於將風流引導至不同散熱部件處的第一流道，第二流道、第三流道及第四流道；第一流道與第二流道之間，第二流道與第三流道之間，第三流道與第四流道之間均設置有隔板。Among them, the inside of the main air guide cover is formed with a first flow channel, a second flow channel, a third flow channel and a fourth flow channel for guiding the air flow to different heat dissipation components in order according to the installation position of the heat dissipation component; the first flow channel and Partition plates are provided between the second flow channels, between the second flow channels and the third flow channels, and between the third flow channels and the fourth flow channels.
以下將結合圖示對本實施例所提供的導風結構進行詳細描述。本實施例導風結構應用於一機台，例如，ML110機台。機台內包括若干位於機箱內部的散熱部件，導風機構針對機台，例如，針對ML110機台中各散熱部件的散熱需求設計了主體導風罩（baffle I）和輔助導風罩（GPU module blank），同時考慮系統中***與未***GPU晶片時DIMM卡的散熱需求。導風機構共四個流道，分別為包括主板晶片、及設置於主板新版上的硬碟驅動器、主機接口、雙列直插式存儲模組、中央處理器、南橋晶片、圖形處理晶片和/或PCIe卡等散熱部件進行導風，優化散熱效果。The wind guide structure provided in this embodiment will be described in detail below with reference to the figures. The air guide structure of this embodiment is applied to a machine, for example, the ML110 machine. The machine includes a number of heat dissipation components located inside the chassis. The air guide mechanism is specific to the machine. For example, the main air guide hood (baffle I) and the auxiliary air guide hood (GPU module blank) are designed to meet the heat dissipation needs of each heat dissipation component in the ML110 machine. ), and consider the heat dissipation requirements of the DIMM card when the GPU chip is inserted or not inserted in the system. The air guide mechanism has a total of four flow channels, including the motherboard chip, the hard drive installed on the new motherboard, the host interface, the dual in-line storage module, the central processing unit, the south bridge chip, the graphics processing chip and/or Or PCIe cards and other heat dissipation components to guide air and optimize the heat dissipation effect.
請參閱圖1和圖2，分別顯示為導風結構的立體結構示意圖和平面結構示意圖。如圖1和圖2所示，導風結構1包括主體導風罩11，輔助導風罩12，及設置於主體導風罩的出風口處和入風口處的第一散熱器和第二散熱器（未予圖示）。Please refer to Figures 1 and 2, which are respectively a schematic three-dimensional structural diagram and a schematic planar structure of the wind guide structure. As shown in Figures 1 and 2, the
主體導風罩11固定至機箱的外殼，以罩蓋散熱部件。The main
具體地，機箱的外殼的邊緣側設置卡槽。請參閱圖1和圖2，主體導風罩11的罩邊、Specifically, a card slot is provided on the edge side of the shell of the chassis. Please refer to Figure 1 and Figure 2, the cover edges of the main body
且與卡槽對應處設置有卡扣13。在安裝主體導風罩11時，將卡扣13卡合至卡槽中。And a buckle 13 is provided at a position corresponding to the card slot. When installing the main body
在本實施例中，為了對各散熱部件進行獨立散熱，互不干擾，主體導風罩11的內側按照散熱部件的安裝位置依次形成有用於將風流引導至不同散熱部件處的第一流道111，第二流道112、第三流道113及第四流道114。第一流道111與第二流道112之間，第二流道112與第三流道113之間，第三流道113與第四流道114之間均設置有隔板，以便合理分配風流。各散熱部件間風道相互獨立，避免形成亂流阻礙散熱。In this embodiment, in order to dissipate heat independently for each heat dissipation component without interfering with each other,
請參閱圖3A，顯示為第一流道的平面結構示意圖。如圖3A所示，第一流道111從入口至出口依次為硬碟驅動器30（HDD）、主機接口、第一部分雙列直插式存儲模組31（具體為DIMM1-8）及南橋晶片引導風流。Please refer to FIG. 3A , which is a schematic plan view of the first flow channel. As shown in Figure 3A, the
其中，第一流道111中包圍硬碟驅動器HDD的內壁111A呈傾斜狀，第一流道111中遠離第一部分雙列直插式存儲模組31的內壁111B亦呈傾斜狀。當硬碟驅動器HDD和第一部分雙列直插式存儲模組、PCH晶片產生的熱量朝第一流道111出風口處擠壓，使設置於第一流道111出風口處的第一散熱器21（例如，風扇）將流經HDD、DIMM及PCH晶片的風抽出，帶走熱量，驅散第一流道內的熱量，以實現散熱。Among them, the inner wall 111A of the
在本實施例中，第二散熱器22（例如，風扇）設置於第二通道112，第三通道113的入風口處。In this embodiment, the second heat sink 22 (for example, a fan) is disposed at the air inlet of the
請參閱圖3B，顯示為第二流道的平面結構示意圖。如圖3B所示，第二流道112從入口至出口依次為中央處理器CPU40和中央處理器CPU41後方的PCIe卡41引導風流。其中，中央處理器40的散熱器與主體導風罩的頂部貼近。設置於第二流道112入風口處的第二散熱器22為第二流道提供風量。Please refer to Figure 3B, which is a schematic plan view of the second flow channel. As shown in FIG. 3B , the
請參閱圖3C，顯示為第三流道的平面結構示意圖。如圖3C所示，當機台內未***圖形處理晶片時，第三流道113僅為第二部分雙列直插式存儲模組（具體為DIMM9-16）42引導風流。第二散熱器22用於驅散第三流道113內的熱量。Please refer to Figure 3C, which shows a schematic plan view of the third flow channel. As shown in FIG. 3C , when the graphics processing chip is not inserted into the machine, the
在本實施例中，當機台內通過晶片支架***圖像處理晶片時，將呈弧形狀的輔助導風罩12***第三流道113內。請參閱圖4A和圖4B，顯示為輔助導風罩的立體結構示意圖及側視結構示意圖。如圖4A和圖4B所示，輔助導風罩12的側壁設置有卡扣121，卡扣121與對應設置於第三流道113上的卡槽相卡合，以實現輔助導風罩的可拆分式安裝。In this embodiment, when the image processing chip is inserted into the machine through the wafer holder, the arc-shaped auxiliary air guide 12 is inserted into the
具體地，當機台內通過晶片支架***圖像處理晶片時，第二部分雙列直插式存儲模組位於晶片支架下方，由於將晶片支架的底部設計成弧形結構，形成一斜面，當第二散熱器22吹風時，經過這個斜面的風為位於晶片支架底部的DIMM卡散熱。Specifically, when the image processing chip is inserted into the machine through the chip holder, the second part of the dual in-line storage module is located below the chip holder. Since the bottom of the chip holder is designed into an arc structure, an inclined plane is formed. When the
請參閱圖3D，顯示為第四流道的正視圖。如圖3D所示，第四流道114從入口至出口依次為圖形處理晶片、第二部分雙列直插式存儲模組及PCIe卡引導風流；其中，為了增強導風的作用，使形成第四流道114的兩側端的罩面呈對稱傾斜狀，兩端之間的部分罩蓋的貼近於圖形處理晶片。第二散熱器22為第四流道114提供風量。Please refer to Figure 3D, which shows a front view of the fourth flow channel. As shown in Figure 3D, the fourth flow channel 114 guides the air flow from the entrance to the exit in order for the graphics processing chip, the second part of the dual in-line storage module and the PCIe card; in order to enhance the air guiding effect, the fourth flow channel 114 is formed. The cover surfaces at both ends of the four-flow channel 114 are symmetrically inclined, and the portion of the cover between the two ends is close to the graphics processing chip. The
綜上所述，本發明導風機構具有以下有益效果：To sum up, the air guide mechanism of the present invention has the following beneficial effects:
第一，本發明使用導風罩可將風流導至各需散熱元件處，避免在各元件上方或兩側形成旁流，顯著增強各元件散熱效果，提高風量利用率；First, the present invention uses an air guide hood to guide the air flow to each component that requires heat dissipation, avoiding the formation of side flow above or on both sides of each component, significantly enhancing the heat dissipation effect of each component, and improving the air volume utilization rate;
第二，本發明採用各風道間導風罩呈隔板設計，各元件間風道相互獨立，避免形成亂流阻礙散熱，各元件獨立散熱，互不干擾，實現合理分配風流；Secondly, the present invention adopts the partition design of the air guide cover between each air duct, and the air ducts between each component are independent of each other to avoid the formation of turbulent flow and hinder heat dissipation. Each component independently dissipates heat without interfering with each other, achieving reasonable distribution of air flow;
第三，本發明避免因熱量無法及時散出堆積在元件表面從而對系統工作壽命產生威脅，延長服務器工作壽命；Third, the present invention avoids the threat to the working life of the system due to heat being unable to dissipate in time and accumulating on the surface of components, and extends the working life of the server;
第四， 本發明針對發熱量高、散熱需求大的工作元件，導風罩呈斜面設計，最大程度對風流進行引流，實現高效散熱；Fourth, this invention is aimed at working components with high calorific value and large heat dissipation requirements. The air guide cover is designed with a slope to guide the wind flow to the greatest extent and achieve efficient heat dissipation;
第五，本發明整體穩固性好，結構簡單，易於製作及安裝，成本低廉。因此，本發明有效克服了現有技術中的種種缺點而具高度產業利用價值。Fifth, the present invention has good overall stability, simple structure, easy production and installation, and low cost. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.
上述實施例僅例示性說明本發明的原理及其功效，而非用於限制本發明。任何熟悉此技術的人士皆可在不違背本發明的精神及範疇下，對上述實施例進行修飾或改變。因此，舉凡所屬技術領域中具有通常知識者在未脫離本發明所揭示的精神與技術思想下所完成的一切等效修飾或改變，仍應由本發明的權利要求所涵蓋。The above embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present invention shall still be covered by the claims of the present invention.
1:導風結構
11:主體導風罩
12:輔助導風罩
13:卡扣
111:第一流道
112:第二流道
113:第三流道
114:第四流道
111A/111B:內壁
21:第一散熱器
22:第二散熱器
30:硬碟驅動器
31:第一部分雙列直插式存儲模組
40:中央處理器
41:PCIe卡
42:第二部分雙列直插式存儲模組
121:卡扣
1: Wind guide structure
11: Main air guide cover
12: Auxiliary air guide cover
13: buckle
111:First flow channel
112:Second flow channel
113:Third flow channel
114:Fourth channel
111A/111B:Inner wall
21:First radiator
22:Second radiator
30:Hard drive
31:
圖1顯示為本發明的導風結構的立體結構示意圖和平面結構示意圖。 圖2顯示為本發明的導風結構的平面結構示意圖。 圖3A顯示為本發明的第一流道的平面結構示意圖。 圖3B顯示為本發明的第二流道的平面結構示意圖。 圖3C顯示為本發明的第三流道的平面結構示意圖。 圖3D顯示為本發明的第四流道的正視結構示意圖。 圖4A顯示為本發明的輔助導風罩的立體結構示意圖。 圖4B顯示為本發明的輔助導風罩的側視結構示意圖。 Figure 1 shows a schematic three-dimensional structural diagram and a schematic planar structural diagram of the air guide structure of the present invention. Figure 2 shows a schematic plan view of the wind guide structure of the present invention. FIG. 3A shows a schematic plan view of the first flow channel of the present invention. Figure 3B shows a schematic plan view of the second flow channel of the present invention. Figure 3C shows a schematic plan view of the third flow channel of the present invention. Figure 3D shows a schematic front structural view of the fourth flow channel of the present invention. Figure 4A shows a schematic three-dimensional structural view of the auxiliary air guide cover of the present invention. Figure 4B shows a schematic side structural view of the auxiliary air guide cover of the present invention.
1:導風結構 1: Wind guide structure
11:主體導風罩 11: Main air guide cover
12:輔助導風罩 12: Auxiliary air guide cover
13:卡扣 13: buckle
111:第一流道 111:First flow channel
112:第二流道 112:Second flow channel
113:第三流道 113:Third flow channel
114:第四流道 114:Fourth channel
111A/111B:內壁 111A/111B:Inner wall
21:第一散熱器 21:First radiator
22:第二散熱器 22:Second radiator
30:硬碟驅動器 30:Hard drive
31:第一部分雙列直插式存儲模組
31:
40:中央處理器 40:CPU
41:PCIe卡 41: PCIe card
42:第二部分雙列直插式存儲模組 42:Part 2 Dual In-Line Memory Modules
121:卡扣 121:Buckle
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111109664A TWI807696B (en) | 2022-03-16 | 2022-03-16 | Air guide structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111109664A TWI807696B (en) | 2022-03-16 | 2022-03-16 | Air guide structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI807696B TWI807696B (en) | 2023-07-01 |
| TW202339594A true TW202339594A (en) | 2023-10-01 |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100545784C (en) * | 2006-12-14 | 2009-09-30 | 英业达股份有限公司 | Radiation wind-guiding hood |
| CN109960380B (en) * | 2017-12-22 | 2022-10-04 | 富联精密电子(天津)有限公司 | Wind scooper, case adopting wind scooper and electronic device |
| JP2020052870A (en) * | 2018-09-28 | 2020-04-02 | Ｎｅｃプラットフォームズ株式会社 | Duct for expansion card, expansion card, electronic apparatus and cooling method of expansion card |
| CN114077292A (en) * | 2020-08-13 | 2022-02-22 | 鸿富锦精密工业(武汉)有限公司 | Wind scooper and heat dissipation device |
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| Publication number | Publication date |
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| TWI807696B (en) | 2023-07-01 |
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