TWI819300B - Circuit board material layer pre-lamination equipment and process - Google Patents
Circuit board material layer pre-lamination equipment and process Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 150
- 238000003475 lamination Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims description 52
- 230000008569 process Effects 0.000 title claims description 37
- 235000012431 wafers Nutrition 0.000 claims abstract description 281
- 230000007246 mechanism Effects 0.000 claims abstract description 187
- 238000012546 transfer Methods 0.000 claims abstract description 143
- 210000000078 claw Anatomy 0.000 claims description 64
- 238000013519 translation Methods 0.000 claims description 21
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 238000005303 weighing Methods 0.000 claims description 5
- 239000002648 laminated material Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 23
- 230000003068 static effect Effects 0.000 description 14
- 230000008030 elimination Effects 0.000 description 11
- 238000003379 elimination reaction Methods 0.000 description 11
- 238000000926 separation method Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 230000006698 induction Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 238000007664 blowing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 239000002994 raw material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
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- 238000012850 discrimination method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G59/00—De-stacking of articles
- B65G59/005—De-stacking of articles by using insertions or spacers between the stacked layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G59/00—De-stacking of articles
- B65G59/02—De-stacking from the top of the stack
- B65G59/04—De-stacking from the top of the stack by suction or magnetic devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G61/00—Use of pick-up or transfer devices or of manipulators for stacking or de-stacking articles not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/08—Feeding articles separated from piles; Feeding articles to machines by grippers, e.g. suction grippers
- B65H5/10—Reciprocating or oscillating grippers, e.g. suction or gripper tables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
本發明公開了一種線路板材料層預疊合設備，其包括有機架，機架上由左至右依次設有半固化片(PP片)上料機構、預疊台、轉送台、晶片上料機構和隔紙下料機構，機架上還設有左右設置的滑移承載架，滑移承載架上由左至右依次設有PP取料機械手、晶片轉送機械手、晶片上料機械手和隔紙下料機械手，PP取料機械手用於從PP片上料機構拾取PP片並放置於預疊台上，晶片上料機械手用於從晶片上料機構拾取晶片並放置於轉送台上，隔紙下料機械手用於從晶片上料機構拾取兩個晶片之間的隔紙並放置於隔紙下料機構，晶片轉送機械手用於從轉送台上拾取晶片並放置於預疊台上。本發明能節省人工、可提高生產效率、降低出錯率以及提高產品品質。 The invention discloses a circuit board material layer pre-lamination equipment, which includes a frame. The frame is provided with a prepreg sheet (PP sheet) feeding mechanism, a pre-stacking table, a transfer table, a wafer feeding mechanism and a There is a separator unloading mechanism, and the frame is also equipped with sliding bearing frames on the left and right. The sliding bearing frame is equipped with a PP feeding manipulator, a wafer transfer manipulator, a wafer loading manipulator and a separator from left to right. The paper unloading robot and the PP picking robot are used to pick up the PP sheets from the PP sheet loading mechanism and place them on the pre-stack table. The wafer loading robot is used to pick up the wafers from the wafer loading mechanism and place them on the transfer table. The paper unloading robot is used to pick up the paper between two wafers from the wafer loading mechanism and place it on the paper unloading mechanism. The wafer transfer robot is used to pick up the wafer from the transfer table and place it on the pre-stack table. . The invention can save labor, improve production efficiency, reduce error rates and improve product quality.
Description
本發明涉及線路板生產設備的技術領域，尤其涉及一種線路板材料層預疊合設備及製程。 The present invention relates to the technical field of circuit board production equipment, and in particular to a circuit board material layer pre-lamination equipment and a process.
線路板又稱PCB板，是目前電子、電氣設備中必不可少的器材，同時也是將電路原理實體化的重要材料。習知技術中，線路板一般包括層疊設置的半固化片(PP片)與晶片等多層結構，線路板在生產過程中，需要將PP片與晶片等多層結構進行預疊合，然後再進行壓合加工，其中預疊合的過程一般由人工完成，該過程中需要人工按照層級順序放置各層材料，這不僅造成生產效率低、費人工、人員勞動強度高，而且一旦層級順序出現放置錯誤，則會出現廢板的情況，錯誤率較高，存在品質管控困難，而且成品率低下。 Circuit boards, also known as PCB boards, are indispensable equipment in current electronic and electrical equipment. They are also an important material that materializes circuit principles. In the conventional technology, circuit boards generally include multi-layer structures such as prepreg sheets (PP sheets) and wafers that are laminated. During the production process of circuit boards, multi-layer structures such as PP sheets and wafers need to be pre-laminated and then pressed. , the pre-lamination process is generally completed manually. In this process, each layer of materials needs to be manually placed in hierarchical order. This not only results in low production efficiency, labor cost, and high labor intensity, but also once there is a placement error in the hierarchical order, there will be In the case of scrap boards, the error rate is high, quality control is difficult, and the yield is low.
本發明要解決的技術問題問題在於，針對習知技術的不足，提供一種節省人工、可提高生產效率、降低出錯率、提高產品品質的線路板材料層預疊合設備及製程。 The technical problem to be solved by the present invention is to provide a circuit board material layer pre-lamination equipment and process that saves labor, improves production efficiency, reduces error rates, and improves product quality in view of the deficiencies of the conventional technology.
為解決上述技術問題，本發明採用如下技術方案。 In order to solve the above technical problems, the present invention adopts the following technical solutions.
一種線路板材料層預疊合設備，其包括有機架，所述機架上由左至右依次設有PP片上料機構、預疊台、轉送台、晶片上料機構和隔紙下料機構，所述機架上還設有左右設置的滑移承載架，所述滑移承載架上由左至右依次設有PP取料機械手、晶片轉送機械手、晶片上料機械手和隔紙下料機械手，所述PP取料機械手用於從所述PP片上料機構拾取PP片並放置於所述預疊台上，所述晶片上料機械手用於從所述晶片上料機 構拾取晶片並放置於所述轉送台上，所述隔紙下料機械手用於從所述晶片上料機構拾取兩個晶片之間的隔紙並放置於所述隔紙下料機構，所述晶片轉送機械手用於從所述轉送台上拾取晶片並放置於所述預疊台上，通過所述PP取料機械手、晶片轉送機械手、晶片上料機械手和隔紙下料機械手的配合，將所述PP片和所述晶片按照預設疊放順序疊合於所述預疊台。 A kind of circuit board material layer pre-lamination equipment, which includes a frame. The frame is provided with a PP sheet loading mechanism, a pre-stacking table, a transfer table, a wafer loading mechanism and a paper separation mechanism from left to right. The frame is also provided with sliding bearing frames arranged on the left and right. The sliding bearing frame is provided with a PP picking manipulator, a wafer transferring manipulator, a wafer loading manipulator and a paper separator from left to right. Material manipulator, the PP material picking manipulator is used to pick up PP sheets from the PP sheet loading mechanism and place them on the pre-stack table, the wafer loading manipulator is used to pick up the PP sheets from the wafer loading machine The structure picks up the wafer and places it on the transfer table. The paper separator unloading robot is used to pick up the separator paper between two wafers from the wafer loading mechanism and place it on the separator paper unloading mechanism. The wafer transfer robot is used to pick up wafers from the transfer table and place them on the pre-stack table. Through the PP picking robot, wafer transfer robot, wafer loading robot and paper unloading machinery With the cooperation of hands, the PP sheet and the wafer are stacked on the pre-stacking stage in a preset stacking sequence.
一種線路板材料層預疊合製程，所述製程基於一設備實現，所述設備包括有機架，所述機架上由左至右依次設有PP片上料機構、預疊台、轉送台、晶片上料機構和隔紙下料機構，所述機架上還設有左右設置的滑移承載架，所述滑移承載架上由左至右依次設有PP取料機械手、晶片轉送機械手、晶片上料機械手和隔紙下料機械手，所述製程包括：PP片取料步驟：利用所述PP取料機械手從所述PP片上料機構拾取PP片並放置於所述預疊台上；晶片取料步驟：利用所述晶片上料機械手從所述晶片上料機構拾取晶片並放置於所述轉送台上；隔紙下料步驟：利用所述隔紙下料機械手從所述晶片上料機構拾取兩個晶片之間的隔紙並放置於所述隔紙下料機構；晶片轉送步驟：利用所述晶片轉送機械手從所述轉送台上拾取晶片並放置於所述預疊台上；通過控制所述PP片取料步驟、所述晶片取料步驟、所述隔紙下料步驟和所述晶片轉送步驟的執行順序，藉由所述PP取料機械手、晶片轉送機械手、晶片上料機械手和隔紙下料機械手的配合，將所述PP片和所述晶片按照預設疊放順序疊合於所述預疊台。 A circuit board material layer pre-lamination process. The process is implemented based on an equipment. The equipment includes a rack. The rack is provided with a PP sheet loading mechanism, a pre-stack stage, a transfer stage, and a wafer from left to right. The loading mechanism and the paper unloading mechanism are also equipped with sliding bearing frames on the left and right sides of the frame. The sliding bearing frame is equipped with a PP feeding manipulator and a wafer transfer manipulator from left to right. , wafer loading robot and separator unloading robot, the process includes: PP sheet picking step: using the PP picking robot to pick up PP sheets from the PP sheet loading mechanism and place them on the pre-stack on the table; the wafer picking step: using the wafer loading manipulator to pick up the wafers from the wafer loading mechanism and placing them on the transfer table; the paper unloading step: using the paper unloading manipulator to pick up the wafers from the wafer loading mechanism The wafer loading mechanism picks up the separation paper between the two wafers and places it on the separation paper unloading mechanism; the wafer transfer step: uses the wafer transfer robot to pick up the wafer from the transfer table and places it on the Pre-stacking table; by controlling the execution sequence of the PP sheet picking step, the wafer picking step, the separator unloading step and the wafer transfer step, the PP picking robot, wafer The transfer robot, the wafer loading robot, and the separator unloading robot cooperate to stack the PP sheets and the wafers on the pre-stacking table in a preset stacking sequence.
本發明公開的線路板材料層預疊合設備，在實際應用過程中，可根據線路板的層級結構，按照預設的執行順序啟動所述PP片取料步驟、所述晶片取料步驟、所述隔紙下料步驟和所述晶片轉送步驟，在執行上述過程中，藉由所述PP取料機械手、晶片轉送機械手、晶片上料機械手和隔紙下料機械手的配合，將所述PP片和所述晶片按照預設疊放順序疊 合於所述預疊台。相比習知技術而言，本發明無需人工作業，大大降低了人員的勞動強度，有效節省了人工成本以及提高了生產效率，此外，本發明設備的自動化性能更強，可有效降低生產過程中的出錯率，進而提高線路板的產品品質。 In the actual application process of the circuit board material layer pre-lamination equipment disclosed in the present invention, the PP sheet picking step, the wafer picking step, and the PP sheet picking step can be started according to the preset execution sequence according to the hierarchical structure of the circuit board. During the execution of the separator paper unloading step and the wafer transfer step, through the cooperation of the PP picking manipulator, the wafer transfer manipulator, the wafer loading manipulator and the separator unloading manipulator, The PP sheets and the wafers are stacked in a preset stacking sequence. Suitable for the pre-stacked table. Compared with the prior art, the present invention does not require manual work, greatly reduces the labor intensity of personnel, effectively saves labor costs and improves production efficiency. In addition, the equipment of the present invention has stronger automation performance and can effectively reduce the labor cost during the production process. The error rate is improved, thereby improving the product quality of circuit boards.
1:機架 1:Rack
10:晶片上料機械手 10: Wafer loading robot
100:PP片 100:PP film
11:隔紙下料機械手 11: Paper blanking manipulator
12:物料車 12:Material truck
13:上料滑台 13: Loading slide
130:上料平移驅動機構 130: Loading translation drive mechanism
131:升降驅動模組 131:Lift drive module
132:上料支臂 132: Loading arm
133:上料吸爪 133: Feeding suction claw
134:上料吸嘴 134: Feeding nozzle
136:垂直滑塊 136:Vertical slider
137:垂直滑軌 137:Vertical slide rail
138:上料橫樑 138:Loading beam
139:顏色感測器 139: Color sensor
15:晶片物料車 15:wafer material truck
150:萬向輪 150: Universal wheel
151:扶手 151: handrail
2:PP片上料機構 2: PP sheet loading mechanism
20:PP片上料台 20: PP sheet loading table
200:鏤空孔 200: Hollow hole
21:擋塊 21:Block
22:垂直支架 22:Vertical bracket
23:靜電消除機構 23: Static elimination mechanism
230:出風盒 230: Air outlet box
231:吹氣嘴 231: Air blower
232:U形支架 232:U-shaped bracket
233:鉸接片 233:Hinged piece
24:L形承載架 24:L-shaped bearing frame
25:上料台升降驅動機構 25: Loading table lifting drive mechanism
3:預疊台 3: Pre-stack table
30:預疊物料升降機構 30: Pre-stacked material lifting mechanism
4:轉送台 4:Transfer station
40:定位槽孔 40: Positioning slot
41:支撑座 41: Support base
42:活動塊 42:Activity block
420:定位手指 420: Position finger
43:定位夾持驅動機構 43: Positioning and clamping drive mechanism
5:晶片上料機構 5: Wafer loading mechanism
50:晶片上料盒 50:wafer loading box
51:檢測氣缸 51: Detect cylinder
52:上料感應機構 52: Feeding induction mechanism
520:感應支架 520: Induction bracket
521:物料感應器 521:Material sensor
53:第一物料車位 53: First material parking space
54:第一鎖固機構 54:First locking mechanism
540:第一定位塊 540: First positioning block
55:第一料盒升降機構 55: The first material box lifting mechanism
56:靜電消除機構 56: Static elimination mechanism
6:隔紙下料機構 6: Paper cutting mechanism
60:隔紙下料盒 60: Paper separation box
63:第二物料車位 63: Second material parking space
7:滑移承載架 7: Sliding bearing frame
8:PP取料機械手 8:PP reclaiming manipulator
81:取料平移驅動機構 81: Material retrieval translation drive mechanism
82:取料升降氣缸 82: Material lifting cylinder
83:取料支臂 83:Retrieving arm
84:取料吸爪 84:Retrieving suction claw
85:取料吸嘴 85:Taking nozzle
86:抖動氣缸 86: Shake the cylinder
9:晶片轉送機械手 9: Wafer transfer robot
90:轉送滑台 90: Transfer slide
91:升降氣缸 91:Lifting cylinder
92:轉送支臂 92:Transfer arm
93:轉送吸爪 93:Transfer suction claw
94:轉送吸嘴 94: Transfer nozzle
95:轉送平移驅動機構 95: Transfer translation drive mechanism
圖1為線路板材料層預疊合設備的整體結構圖；圖2為PP片上料機構的結構圖；圖3為PP取料機械手的結構圖；圖4為PP取料機械手的側視圖；圖5為晶片轉送機械手的仰視圖；圖6為晶片轉送機械手的側視圖；圖7為轉送台的結構圖；圖8為預疊台的側視圖；圖9為晶片上料機構和隔紙下料機構的結構圖一；圖10為晶片上料機構和隔紙下料機構的結構圖二；圖11為晶片轉送機械手、晶片上料機械手和隔紙下料機械手的結構圖；圖12為晶片上料機械手的俯視圖；圖13為晶片上料機械手的正視圖；圖14為晶片上料機械手的側視圖；以及圖15為晶片物料車的側視圖。 Figure 1 is the overall structural diagram of the circuit board material layer pre-lamination equipment; Figure 2 is the structural diagram of the PP sheet loading mechanism; Figure 3 is the structural diagram of the PP material picking robot; Figure 4 is the side view of the PP material picking robot ; Figure 5 is a bottom view of the wafer transfer robot; Figure 6 is a side view of the wafer transfer robot; Figure 7 is a structural diagram of the transfer table; Figure 8 is a side view of the pre-stack table; Figure 9 is a wafer loading mechanism and Structural diagram 1 of the separator unloading mechanism; Figure 10 shows the structural diagram 2 of the wafer loading mechanism and separator unloading mechanism; Figure 11 shows the structure of the wafer transfer robot, wafer loading robot and separator unloading robot. Figure; Figure 12 is a top view of the wafer loading robot; Figure 13 is a front view of the wafer loading robot; Figure 14 is a side view of the wafer loading robot; and Figure 15 is a side view of the wafer material truck.
下面結合附圖和實施例對本發明作更加詳細的描述。 The present invention will be described in more detail below with reference to the accompanying drawings and examples.
實施例一
本實施例提出了一種線路板材料層預疊合設備，結合圖1至圖11所示，其包括有機架1，所述機架1上由左至右依次設有PP片上料機構2、預疊台3、轉送台4、晶片上料機構5和隔紙下料機構6，所述機架1上還
設有左右設置的滑移承載架7，所述滑移承載架7上由左至右依次設有PP取料機械手8、晶片轉送機械手9、晶片上料機械手10和隔紙下料機械手11，所述PP取料機械手8用於從所述PP片上料機構2拾取PP片100並放置於所述預疊台3上，所述晶片上料機械手10用於從所述晶片上料機構5拾取晶片並放置於所述轉送台4上，所述隔紙下料機械手11用於從所述晶片上料機構5拾取兩個晶片之間的隔紙並放置於所述隔紙下料機構6，所述晶片轉送機械手9用於從所述轉送台4上拾取晶片並放置於所述預疊台3上，通過所述PP取料機械手8、晶片轉送機械手9、晶片上料機械手10和隔紙下料機械手11的配合，將所述PP片100和所述晶片按照預設疊放順序疊合於所述預疊台3。
This embodiment proposes a circuit board material layer pre-lamination equipment. As shown in Figures 1 to 11, it includes a
上述設備在實際應用過程中，可根據線路板的層級結構，按照預設的執行順序啟動所述PP片取料步驟、所述晶片取料步驟、所述隔紙下料步驟和所述晶片轉送步驟，在執行上述過程中，藉由所述PP取料機械手8、晶片轉送機械手9、晶片上料機械手10和隔紙下料機械手11的配合，將所述PP片100和所述晶片按照預設疊放順序疊合於所述預疊台3。相比習知技術而言，本發明無需人工作業，大大降低了人員的勞動強度，有效節省了人工成本以及提高了生產效率，此外，本發明設備的自動化性能更強，可有效降低生產過程中的出錯率，進而提高線路板的產品品質。
During the actual application process of the above equipment, the PP sheet picking step, the wafer picking step, the separator unloading step and the wafer transfer can be started according to the preset execution sequence according to the hierarchical structure of the circuit board. Step, during the execution of the above process, through the cooperation of the PP picking robot 8, the
為了更好地拾取PP片，本實施例中，所述PP取料機械手8通過負壓吸附方式拾取PP片100，所述晶片轉送機械手9和所述晶片上料機械手10均通過負壓吸附方式拾取晶片，所述隔紙下料機械手11通過負壓吸附方式拾取隔紙。
In order to better pick up the PP sheets, in this embodiment, the PP picking robot 8 picks up the
進一步地，包括有物料車12，所述物料車12將預設的晶片上料盒50移送至晶片上料機構5以及將預設的隔紙下料盒60移送至所述隔紙下料機構6。
Further, a
關於所述晶片轉送機械手9的具體結構，本實施例中，所述晶片轉送機械手9包括有轉送滑台90以及用於驅使所述轉送滑台90左右滑動的轉送平移驅動機構95，所述轉送滑台90上固定有轉送升降氣缸91，所述轉送升降氣缸91用於驅使兩個轉送支臂92上升或者下降，所述轉送支臂92上固定有長條狀的轉送吸爪93，兩個轉送吸爪93相互平行，且兩個轉送吸爪93分別與所述晶片的兩側邊緣處對齊，所述轉送吸爪93上固定有多個用於吸附所述晶片的轉送吸嘴94，多個轉送吸嘴94沿所述轉送吸爪93的長度方向依次設置，藉由所述轉送平移驅動機構95、所述轉送升降氣缸91、所述轉送吸爪93和所述轉送吸嘴94的配合，通過負壓吸附方式拾取所述轉送台4上的晶片，並將所述晶片移送至所述預疊台3上。
Regarding the specific structure of the
為了對晶片起到定位作用，並使得所述晶片轉送機械手9與所述轉送台4上的晶片對正，本實施例中，所述轉送台4上開設有多個定位槽孔40，多個定位槽孔40沿所述轉送台4的周向均勻分佈，所述轉送台4的下方設有支撐座41，且所述轉送台4固定於所述支撐座41上，所述支撐座41上設有四個活動塊42以及用於驅使四個活動塊42相互遠離或者相對靠近的定位夾持驅動機構43，四個活動塊42對稱設於所述轉送台4的四周，所述活動塊42的頂部形成有多個定位手指420，所述定位手指420與所述定位槽孔40一一對齊，所述定位手指420穿過所述定位槽孔40並向上伸出，且所述定位手指420能夠在所述定位槽孔40內活動，當所述晶片放置於所述轉送台4時，所述定位夾持驅動機構43驅使四個活動塊42相對靠近，藉由所述晶片周圍的所述定位手指420，將所述晶片定位於所述轉送台4上。
In order to position the wafer and align the
進一步地，所述定位槽孔40為長條狀槽孔。
Furthermore, the
為了提高PP片上料效率，本實施例中，所述PP片上料機構2包括有兩個PP片上料台20，兩個PP片上料台20上下設置且二者之間設有預設間距，所述滑移承載架7上設有兩個PP取料機械手8，兩個PP取料機械手
8上下設置，所述PP取料機械手8與所述PP片上料台20一一對應，藉由兩個PP取料機械手8分別從兩個PP片上料台20拾取PP片100並按照預設疊放順序放置於所述預疊台3上。
In order to improve the efficiency of PP sheet loading, in this embodiment, the PP
作為一種較佳方式，所述PP片上料台20上設有第一稱重感測器，所述第一稱重感測器用於採集多層PP片100的重量並以電訊號的形式回饋至預設的控制器。實際應用中，PP片在取料時可能會出現兩片或者多片粘粘的情況，當多層PP片100每次取走一層時，所述第一稱重感測器回饋的重量值都會減少，控制器根據PP片取走前後的重量差值，可以判斷出所述PP取料機械手8是否同時取走多片PP片，如果同時取走多片PP片，則由控制器及時發出報警提醒。
As a preferred method, the PP
本實施例中，所述機架1上設有預疊物料升降機構30，所述預疊台3設於所述預疊物料升降機構30的升降端，所述控制器用於根據所述預疊台3疊放的物料厚度即時控制所述預疊物料升降機構30升降，進而控制所述預疊台3的垂直高度。實際應用中，當各層疊放後，其整體厚度會隨之增加，為了保證頂層的高度位置恒定，本實施例利用所述預疊物料升降機構30驅使所述預疊台3上下微運動，使得疊放後的頂層高度保持恒定，從而更好地與各機械手進行配合。
In this embodiment, the
為了更好地描述本發明的技術方案，本發明還公開了一種線路板材料層預疊合製程，結合圖1至圖11所示，所述製程基於一設備實現，所述設備包括有機架1，所述機架1上由左至右依次設有PP片上料機構2、預疊台3、轉送台4、晶片上料機構5和隔紙下料機構6，所述機架1上還設有左右設置的滑移承載架7，所述滑移承載架7上由左至右依次設有PP取料機械手8、晶片轉送機械手9、晶片上料機械手10和隔紙下料機械手11，所述製程包括下列步驟：PP片取料步驟：利用所述PP取料機械手8從所述PP片上料機構2拾取PP片100並放置於所述預疊台3上；
晶片取料步驟：利用所述晶片上料機械手10從所述晶片上料機構5拾取晶片並放置於所述轉送台4上；隔紙下料步驟：利用所述隔紙下料機械手11從所述晶片上料機構5拾取兩個晶片之間的隔紙並放置於所述隔紙下料機構6；晶片轉送步驟：利用所述晶片轉送機械手9從所述轉送台4上拾取晶片並放置於所述預疊台3上；其中，通過控制所述PP片取料步驟、所述晶片取料步驟、所述隔紙下料步驟和所述晶片轉送步驟的執行順序，藉由所述PP取料機械手8、晶片轉送機械手9、晶片上料機械手10和隔紙下料機械手11的配合，將所述PP片100和所述晶片按照預設疊放順序疊合於所述預疊台3。
In order to better describe the technical solution of the present invention, the present invention also discloses a circuit board material layer pre-lamination process. As shown in FIGS. 1 to 11 , the process is implemented based on an equipment, and the equipment includes a
實施例二
目前，對於多層放置的PP片原料，常用的取料辦法是人工借助工具取料，這種取料手段的工作效率低下，人工成本較高，無法在線路板材料層預疊合自動化設備中推廣應用。 At present, for multi-layer PP sheet raw materials, the commonly used method of removing materials is to manually use tools to remove materials. This method of removing materials has low work efficiency and high labor costs, and cannot be promoted in automated equipment for pre-lamination of circuit board material layers. Application.
對此，本實施例提出了一種可提高工作效率、降低人工成本、更具自動化性能的PP片取料裝置，結合圖1至圖4所示，其包括有機架1，所述機架1上設有PP片上料機構2、預疊台3和滑移承載架7，所述PP片上料機構2上放置有PP片100，所述滑移承載架7上設有PP取料機械手8，所述PP取料機械手8包括有取料滑台80以及用於驅使所述取料滑台80左右滑動的取料平移驅動機構81，所述取料滑台80上固定有兩個取料升降氣缸82，所述取料升降氣缸82用於驅使一取料支臂83上升或者下降，所述取料支臂83上固定有長條狀的取料吸爪84，兩個取料吸爪84相互平行，且兩個取料吸爪84分別與所述PP片100的兩側邊緣處對齊，所述取料吸爪84上固定有多個用於吸附PP片100的取料吸嘴85，多個取料吸嘴85沿所述取料吸爪84的長度方向依次設置，藉由所述取料平移驅動機構81、所述取料升降氣缸82和所述取料吸嘴85的配合，通過負壓吸附方式拾取
所述PP片上料機構2上的PP片100，並將所述PP片100移送至所述預疊台3上。
In this regard, this embodiment proposes a PP sheet picking device that can improve work efficiency, reduce labor costs, and have more automated performance. As shown in Figures 1 to 4, it includes a
上述裝置在執行過程中，先由所述取料平移驅動機構81驅使所述取料滑台80平移，直至所述取料吸爪84平移至所述PP片上料機構2上方，然後所述取料升降氣缸82驅使所述取料支臂83和所述取料吸爪84下降，以令所述取料吸嘴85靠近所述PP片上料機構2上的PP片100，此時所述取料吸嘴85吸氣並產生負壓，利用負壓將位於頂層的PP片100吸附於兩個取料吸爪84上，接下來，所述取料升降氣缸82驅使所述取料支臂83和所述取料吸爪84上升，並將位於頂層的PP片100從所述PP片上料機構2取出，再由所述取料平移驅動機構81驅使所述取料滑台80平移，直至所述取料吸爪84平移至所述預疊台3上方，之後所述取料升降氣缸82驅使所述取料支臂83和所述取料吸爪84下降，直至所述PP片100放置於所述預疊台3，然後所述取料吸嘴85停止吸氣，最後，所述取料吸嘴85與所述PP片100分離，進而將所述PP片100留置於所述預疊台3上。基於上述過程，本發明更好地完成了PP片取料過程，相比習知技術而言，本發明的自動化性能更強，取料過程無需人員參與，從而節省了人工成本，有助於在線路板材料層預疊合自動化設備中進行靈活運用。
During the execution of the above device, the material-picking
進一步地，所述取料平移驅動機構81為電機絲桿驅動機構。
Further, the material taking
本實施例中，所述取料升降氣缸82的伸縮軸與所述取料滑台80固定連接，藉由所述取料升降氣缸82的殼體帶動所述取料支臂83上升或者下降。 In this embodiment, the telescopic shaft of the picking lifting cylinder 82 is fixedly connected to the picking slide 80 , and the housing of the picking lifting cylinder 82 drives the picking arm 83 to rise or fall.
為了避免同時取走相互粘連的多層PP片，本實施例較佳設置抖動步驟，具體是指，所述取料升降氣缸82的殼體上固定有抖動氣缸86，所述取料支臂83設於所述抖動氣缸86上，藉由所述抖動氣缸86驅使所述取料支臂83上升或者下降。 In order to avoid removing multiple layers of PP sheets that are adhered to each other at the same time, this embodiment preferably provides a shaking step. Specifically, it means that a shaking cylinder 86 is fixed on the housing of the picking lifting cylinder 82, and the picking arm 83 is provided with a shaking step. On the shaking cylinder 86, the shaking cylinder 86 drives the picking arm 83 to rise or fall.
進一步地，所述取料支臂83呈“L”形。 Further, the material picking arm 83 is in an "L" shape.
作為一種較佳方式，所述抖動氣缸86的伸縮軸與所述取料升降氣缸82的殼體固定連接，所述抖動氣缸86的殼體與所述取料支臂83的垂直部固定連接，所述取料吸爪84與所述取料支臂83的水平部固定連接。 As a preferred way, the telescopic shaft of the shaking cylinder 86 is fixedly connected to the housing of the picking lifting cylinder 82, and the housing of the shaking cylinder 86 is fixedly connected to the vertical part of the picking arm 83. The material-picking suction claw 84 is fixedly connected to the horizontal part of the material-picking arm 83 .
為了實現批量取料，本實施例中，所述PP片上料機構2包括有兩個PP片上料台20，兩個PP片上料台20上下設置且二者之間設有預設間距，所述滑移承載架7上設有兩個PP取料機械手8，兩個PP取料機械手8上下設置，所述PP取料機械手8與所述PP片上料台20一一對應，藉由兩個PP取料機械手8分別從兩個PP片上料台20拾取PP片100並按照預設疊放順序放置於所述預疊台3上。上述結構設計不僅能夠節省空間，而且可以利用兩個PP取料機械手8交替取料，有助於提高生產效率。
In order to realize batch retrieval, in this embodiment, the PP
實際應用中，兩個PP片上料台20上可以均放置PP片，也可以放置其他類型的材料片，因此，即使將本實施例中的PP片置換成其他材料片，也應當屬於本發明的保護範圍。 In practical applications, PP sheets can be placed on both PP sheet loading tables 20, or other types of material sheets can be placed. Therefore, even if the PP sheets in this embodiment are replaced with other material sheets, they should still belong to the present invention. scope of protection.
為了更好地描述本實施例的技術方案，本實施例還提出了一種PP片取料方法，結合圖1至圖4所示，所述取料方法基於一取料裝置實現，所述取料裝置包括有機架1，所述機架1上設有PP片上料機構2、預疊台3和滑移承載架7，所述PP片上料機構2上放置有PP片100，所述滑移承載架7上設有PP取料機械手8，所述PP取料機械手8包括有取料滑台80以及用於驅使所述取料滑台80左右滑動的取料平移驅動機構81，所述取料滑台80上固定有兩個取料升降氣缸82，所述取料升降氣缸82用於驅使一取料支臂83上升或者下降，所述取料支臂83上固定有長條狀的取料吸爪84，兩個取料吸爪84相互平行，且兩個取料吸爪84分別與所述PP片100的兩側邊緣處對齊，所述取料吸爪84上固定有多個用於吸附PP片100的取料吸嘴85，多個取料吸嘴85沿所述取料吸爪84的長度方向依次設置，所述取料方法包括下列步驟：
步驟S10，所述取料平移驅動機構81驅使所述取料滑台80平移，直至所述取料吸爪84平移至所述PP片上料機構2上方；步驟S11，所述取料升降氣缸82驅使所述取料支臂83和所述取料吸爪84下降，以令所述取料吸嘴85靠近所述PP片上料機構2上的PP片100；步驟S12，所述取料吸嘴85吸氣並產生負壓，利用負壓將位於頂層的PP片100吸附於兩個取料吸爪84上；步驟S13，所述取料升降氣缸82驅使所述取料支臂83和所述取料吸爪84上升，並將位於頂層的PP片100從所述PP片上料機構2取出；步驟S14，所述取料平移驅動機構81驅使所述取料滑台80平移，直至所述取料吸爪84平移至所述預疊台3上方；步驟S15，所述取料升降氣缸82驅使所述取料支臂83和所述取料吸爪84下降，直至所述PP片100放置於所述預疊台3，然後所述取料吸嘴85停止吸氣；以及步驟S16，所述取料升降氣缸82驅使所述取料支臂83和所述取料吸爪84上升，所述取料吸嘴85與所述PP片100分離，進而將所述PP片100留置於所述預疊台3上。
In order to better describe the technical solution of this embodiment, this embodiment also proposes a method for reclaiming PP sheets. As shown in Figures 1 to 4, the reclaiming method is based on a reclaiming device. The device includes a
作為一種較佳方式，所述步驟S13還包括抖動步驟：當所述取料升降氣缸82驅使所述取料支臂83和所述取料吸爪84上升後，所述取料平移驅動機構81驅使所述取料滑台80左右抖動。
As a preferred way, the step S13 also includes a shaking step: when the picking lifting cylinder 82 drives the picking arm 83 and the picking suction claw 84 to rise, the picking
進一步地，所述取料升降氣缸82上設有抖動氣缸86，所述取料支臂83設於所述抖動氣缸86上，藉由所述抖動氣缸86驅使所述取料支臂83上升或者下降，所述抖動步驟中：利用所述抖動氣缸86驅使所述取料支臂83和所述取料吸爪84上下抖動，藉由左右抖動和上下抖動配合，令所述取料吸嘴85吸附的多餘PP片100抖落於所述PP片上料機構2。
Further, the material picking up and down cylinder 82 is provided with a shaking cylinder 86, and the picking arm 83 is provided on the shaking cylinder 86. The shaking cylinder 86 drives the picking arm 83 to rise or Descending, in the shaking step: the shaking cylinder 86 is used to drive the picking arm 83 and the picking suction claw 84 to shake up and down, and through the cooperation of left and right shaking and up and down shaking, the picking nozzle 85 The adsorbed
實施例三
目前，多片PP片在疊放過程中，受靜電等因素的影響，在取料時通常會出現同時取走兩片或者多片PP片的情況，一旦PP片的取出片數錯誤，則直接導致線路板報廢，失誤率和錯誤率較高，難以滿足生產要求。 At present, when multiple PP sheets are stacked, due to factors such as static electricity, two or more PP sheets are usually taken away at the same time. Once the wrong number of PP sheets is taken out, the machine will As a result, the circuit board is scrapped, the error rate and error rate are high, and it is difficult to meet production requirements.
對此，本實施例提出了一種能夠避免因靜電吸附而誤取多個PP片，進而提高取料動作的準確性，有助於提高線路板成品率的PP片上料機構，請參見圖1和圖2，所述PP片上料機構2包括有方形的PP片上料台20，所述PP片上料台20上固定有四個擋塊21，四個擋塊21分別靠近所述PP片上料台20的四個邊緣處，四個擋塊21之間用於放置多層疊放的PP片100，所述PP片上料台20的斜上方設有用於向所述PP片100吹送負離子風的靜電消除機構23。
In this regard, this embodiment proposes a PP sheet loading mechanism that can avoid mistakenly picking up multiple PP sheets due to electrostatic adsorption, thereby improving the accuracy of the picking action and helping to improve the circuit board yield. Please refer to Figure 1 and Figure 2. The PP
上述結構中，在所述PP片上料台20上設置了四個擋塊21，四個擋塊21起到從四周抵擋PP片的作用，進而在取料之前對PP片起到定位作用，同時在所述PP片上料台20的斜上方設置了靜電消除機構23，該靜電消除機構23用於向所述PP片100吹送負離子風，藉由負離子風對PP片起到消除靜電的作用，當機械手在取料過程中，可避免因靜電吸附而出現同時取走多片PP片的情況，大大提高了取料步驟的準確性和可靠性，較好地提高了線路板成品率，進而滿足生產要求。
In the above structure, four
作為一種較佳方式，所述擋塊21為長條狀擋塊，且所述擋塊21沿所述PP片上料台20的邊緣延伸。
As a preferred method, the
當放入多層PP片原料時，為了方便排出底部氣流，使得多層PP片準確落入四個擋塊21之間，本實施例中，所述PP片上料台20上開設有鏤空孔200，所述鏤空孔200貫穿於所述PP片上料台20的上下兩側。
When the multi-layer PP sheet raw materials are put in, in order to facilitate the discharge of the bottom airflow so that the multi-layer PP sheet accurately falls between the four stops 21, in this embodiment, the PP sheet loading table 20 is provided with a
為了對所述PP片上料台20起到支撐固定作用，本實施例中，所述PP片上料機構2包括有垂直支架22，所述PP片上料台20固定於所述垂直支架22上。
In order to support and fix the PP
為了實現批量上料，本實施例中，所述垂直支架22上固定有兩個上下設置的PP片上料台20，兩個PP片上料台20之間設有預設間距。
In order to realize batch loading, in this embodiment, two PP
關於所述靜電消除機構23的具體結構，本實施例中，所述靜電消除機構23包括有出風盒230，所述出風盒230連通有負離子氣源，所述出風盒230上設有多個吹氣嘴231，所述吹氣嘴231朝向所述PP片上料台20。
Regarding the specific structure of the
為了擴大負離子風的吹送範圍，本實施例中，所述出風盒230呈長條狀，多個吹氣嘴231沿所述出風盒230的長度方向依次分佈。
In order to expand the blowing range of the negative ion wind, in this embodiment, the
作為一種較佳方式，所述靜電消除機構23包括有U形支架232，所述出風盒230安裝於所述U形支架232上。
As a preferred method, the
為了便於調整吹風方向，本實施例中，所述U形支架232的兩端分別設有能夠在預設角度內轉動的鉸接片233，所述出風盒230的兩端分別與兩個鉸接片233固定連接。
In order to facilitate the adjustment of the blowing direction, in this embodiment, the two ends of the
本實施例中，所述垂直支架22上固定有兩個上下設置的L形承載架24，兩個PP片上料台20分別固定於兩個L形承載架24上。
In this embodiment, two L-shaped carrier frames 24 arranged up and down are fixed on the
為了更好地與線路板材料層預疊合設備相配合，本實施例中，所述機架1上還設有用於驅使所述垂直支架22上升或者下降的上料台升降驅動機構25，並通過所述L形承載架24與所述上料台升降驅動機構25的驅動端固定連接。
In order to better cooperate with the circuit board material layer pre-lamination equipment, in this embodiment, the
實施例四
線路板在預疊合過程必然涉及晶片上料步驟，多層晶片原料通常層疊放置在料盒內，為了避免相鄰晶片之間發生摩擦，需在兩層晶片之間放置隔紙，從而起到保護作用，執行預疊合步驟時，需要在頂層晶片取下後，將隔紙取出收集，以便再次利用。上述過程屬於晶片與隔紙的分料取料工序，目前，上述工序均由人工完成，因此不僅工作效率低下，而且人工成本較高，缺乏自動化性能，無法滿足自動化生產要求。 The circuit board pre-lamination process inevitably involves a wafer loading step. Multi-layer wafer raw materials are usually stacked in a material box. In order to avoid friction between adjacent wafers, spacers need to be placed between the two layers of wafers for protection. When performing the pre-lamination step, after the top wafer is removed, the separator paper needs to be taken out and collected for reuse. The above-mentioned process belongs to the process of sorting and picking up the wafers and separators. Currently, the above-mentioned processes are all completed manually. Therefore, not only the work efficiency is low, but also the labor cost is high. It lacks automation performance and cannot meet the requirements of automated production.
對此，本實施例提出了一種可自動完成晶片和隔紙的取料工作，無需人工參與，節省人力成本，而且更具自動化性能的晶片分料取料裝置，結合圖1、圖9至圖14所示，其包括有機架1，所述機架1上設有轉送台4、晶片上料機構5、隔紙下料機構6和滑移承載架7，所述轉送台4、晶片上料機構5和隔紙下料機構6由左至右依次設置，所述滑移承載架7上設有晶片上料機械手10和隔紙下料機械手11，所述晶片上料機構5包括有晶片上料盒50，所述晶片上料盒50內盛裝有層疊放置的多個晶片，相鄰兩個晶片之間夾設有隔紙，所述隔紙下料機構6包括有隔紙下料盒60，所述晶片上料機械手10包括有上料滑台13以及用於驅使所述上料滑台13左右滑動的上料平移驅動機構130，所述上料滑台13上固定有一升降驅動模組131，所述升降驅動模組131用於驅使一上料支臂132上升或者下降，所述上料支臂132上固定有長條狀的上料吸爪133，兩個上料吸爪133相互平行，且兩個上料吸爪133分別與所述晶片的兩側邊緣處對齊，所述上料吸爪133上固定有多個用於吸附所述晶片的上料吸嘴134，多個上料吸嘴134沿所述上料吸爪133的長度方向依次設置，藉由所述上料平移驅動機構130、所述升降驅動模組131、所述上料吸爪133和所述上料吸嘴134的配合，通過負壓吸附方式拾取所述晶片上料盒50內的晶片，並將所述晶片移送至所述轉送台4上，所述隔紙下料機械手11的結構與所述晶片上料機械手10的結構相同，所述隔紙下料機械手11用於通過負壓吸附的方式拾取所述晶片上料盒50內的隔紙，並將所述隔紙移送至所述隔紙下料盒60。
In this regard, this embodiment proposes a wafer sorting and picking device that can automatically complete the picking work of wafers and separators without manual participation, save labor costs, and have more automated performance. Combined with Figures 1 and 9 to Figure As shown in 14, it includes a
上述晶片分料取料裝置在執行過程中，所述晶片上料機械手10先平移至所述晶片上料盒50上方，此時，所述隔紙下料機械手11位於所述隔紙下料盒60上方，所述晶片上料機械手10取晶片時，所述升降驅動模組131驅使所述上料支臂132和所述上料吸爪133下降，所述上料吸嘴134吸氣並產生負壓，利用負壓吸附所述晶片，然後所述升降驅動模組
131驅使所述上料支臂132和所述上料吸爪133上升，再由所述上料平移驅動機構130驅使所述上料滑台13平移，直至將所述晶片移送至所述轉送台4上方，最後所述升降驅動模組131驅使所述上料支臂132和所述上料吸爪133下降，所述上料吸嘴134停止吸氣，將所述晶片放置於所述轉送台4上；基於上述過程使得所述所述晶片上料機械手10完成了晶片取料，因所述隔紙下料機械手11的結構與所述晶片上料機械手10的結構相同，所以，所述隔紙下料機械手11只需按照上述動作過程，同樣以負壓吸附的方式來拾取所述晶片上料盒50內的隔紙，並將所述隔紙移送至所述隔紙下料盒60即可完成隔紙下料步驟。相比現有技術而言，本發明較好地完成了晶片隔紙的自動化分料取料過程，不僅提高了生產效率，而且有效節省了生產成本，進而滿足生產需求。
During the execution of the above-mentioned wafer material sorting and retrieval device, the
為了實現上下移動，本實施例中，所述上料滑台13上固定有垂直滑塊136，所述上料支臂132上固定有垂直滑軌137，所述垂直滑軌137穿過所述垂直滑塊136且二者滑動配合，所述升降驅動模組131固定於所述上料支臂132上，所述升降驅動模組131的驅動端連接於所述上料滑台13。
In order to move up and down, in this embodiment, a
為了進一步提高結構穩定性，本實施例中，所述上料支臂132上固定有兩個相互平行的垂直滑軌137，所述上料滑台13上固定有四個垂直滑塊136，每個垂直滑軌137對應穿過兩個垂直滑塊136。
In order to further improve the structural stability, in this embodiment, two vertical slide rails 137 parallel to each other are fixed on the
進一步地，所述上料支臂132為“L”形支臂。
Further, the
作為一種較佳方式，所述升降驅動模組131固定於所述上料支臂132的垂直部上。
As a preferred method, the lifting
為了對兩個上料吸爪133起到固定作用，本實施例中，所述上料支臂132的水平部上固定有上料橫樑138，兩個上料吸爪133分別固定於所述上料橫樑138的兩端。
In order to fix the two
為了更好地消除靜電，本實施例中，所述機架1上設有靜電消除機構56，所述靜電消除機構56與所述晶片上料機構5相鄰設置，且所述靜電消除機構56用於向所述晶片上料機構5吹送負離子風。
In order to better eliminate static electricity, in this embodiment, a static
本實施例還涉及一種晶片分料取料方法，結合圖1、圖9至圖14所示，所述取料方法基於一取料裝置實現，包括有機架1，所述機架1上設有轉送台4、晶片上料機構5、隔紙下料機構6和滑移承載架7，所述轉送台4、晶片上料機構5和隔紙下料機構6由左至右依次設置，所述滑移承載架7上設有晶片上料機械手10和隔紙下料機械手11，所述晶片上料機構5包括有晶片上料盒50，所述晶片上料盒50內盛裝有層疊放置的多個晶片，相鄰兩個晶片之間夾設有隔紙，所述隔紙下料機構6包括有隔紙下料盒60，所述晶片上料機械手10包括有上料滑台13以及用於驅使所述上料滑台13左右滑動的上料平移驅動機構130，所述上料滑台13上固定有一升降驅動模組131，所述升降驅動模組131用於驅使一上料支臂132上升或者下降，所述上料支臂132上固定有長條狀的上料吸爪133，兩個上料吸爪133相互平行，且兩個上料吸爪133分別與所述晶片的兩側邊緣處對齊，所述上料吸爪133上固定有多個用於吸附所述晶片的上料吸嘴134，多個上料吸嘴134沿所述上料吸爪133的長度方向依次設置，所述取料方法包括有如下步驟：步驟S20，所述晶片上料機械手10平移至所述晶片上料盒50上方，此時，所述隔紙下料機械手11位於所述隔紙下料盒60上方；步驟S21，所述升降驅動模組131驅使所述上料支臂132和所述上料吸爪133下降，所述上料吸嘴134吸氣並產生負壓，利用負壓吸附所述晶片；步驟S22，所述升降驅動模組131驅使所述上料支臂132和所述上料吸爪133上升，再由所述上料平移驅動機構130驅使所述上料滑台13平移，直至將所述晶片移送至所述轉送台4上方；
步驟S23，所述升降驅動模組131驅使所述上料支臂132和所述上料吸爪133下降，所述上料吸嘴134停止吸氣，將所述晶片放置於所述轉送台4上；所述隔紙下料機械手11的結構與所述晶片上料機械手10的結構相同，所述隔紙下料機械手11按照步驟S20至步驟S23的動作過程，通過負壓吸附的方式拾取所述晶片上料盒50內的隔紙，並將所述隔紙移送至所述隔紙下料盒60。
This embodiment also relates to a wafer sorting and picking method. As shown in FIG. 1 and FIG. 9 to FIG. 14, the picking method is based on a picking device, including a
實施例五
實際應用過程中，當預設的機械手從料盒中取出晶片和隔紙時，為了避免誤取料的情況發生，需要對晶片和隔紙進行準確分辨，現有的分辨手段是通過人工觀察的方式，這種分辨措施不僅效率低下，而且容易因操作人員疲勞而出現取料失誤，嚴重影響線路板生產品質，無法滿足生產要求。 In the actual application process, when the preset manipulator takes out the wafers and separators from the material box, in order to avoid accidentally taking the materials, it is necessary to accurately distinguish the wafers and separators. The existing discrimination method is through manual observation. This method is not only inefficient, but also prone to material picking errors due to operator fatigue, seriously affecting the quality of circuit board production and failing to meet production requirements.
對此，本實施例提出了一種可提高晶片取料工序的準確性和可靠性，同時提高線路板生產品質，而且更具自動化性能的晶片隔紙分料檢測裝置，結合圖1、圖11至圖14所示，其包括有機架1，所述機架1上設有晶片上料機構5和滑移承載架7，所述滑移承載架7上設有晶片上料機械手10和隔紙下料機械手11，所述晶片上料機構5包括有晶片上料盒50，所述晶片上料盒50內盛裝有層疊放置的多個晶片，相鄰兩個晶片之間夾設有隔紙，所述晶片上料機械手10用於通過負壓吸附的方式拾取所述晶片上料盒50內的晶片，所述晶片上料機械手10包括有上料橫樑138和顏色感測器139，所述顏色感測器139安裝於所述上料橫樑138上，所述顏色感測器139的感應端朝下設置，所述隔紙下料機械手11的結構與所述晶片上料機械手10的結構相同，所述隔紙下料機械手11用於通過負壓吸附的方式拾取所述晶片上料盒50內的隔紙，所述顏色感測器139用於採集顏色並以電訊號的形式回饋至預設的控制器，所述控制器根據所述顏
色感測器139回饋的電訊號判斷所述晶片上料機械手10是否拾取晶片，以及判斷所述隔紙下料機械手11是否拾取隔紙。
In this regard, this embodiment proposes a wafer separator material sorting and detection device that can improve the accuracy and reliability of the wafer picking process, improve the quality of circuit board production, and have more automated performance. Combined with Figures 1 and 11 to As shown in Figure 14, it includes a
上述結構中，利用所述晶片上料機械手10和隔紙下料機械手11分別對晶片和隔紙進行取料，同時在所述晶片上料機械手10和隔紙下料機械手11中分別配置了顏色感測器139，以所述晶片上料機械手10為例，利用所述上料橫樑138上安裝的所述顏色感測器139，在所述晶片上料機械手10拾取晶片時，通過所述顏色感測器139回饋的顏色資料，預設的控制器根據顏色資料可以判斷出所述晶片上料機械手10拾取的是晶片還是隔紙，如果此時拾取的是隔紙，則屬於誤拾取動作，所述控制器可及時發出報警提示，相應地，所述隔紙下料機械手11也具備顏色採集與判斷功能。基於上述原理，本發明可大大提高晶片與隔紙分料過程的準確性，有效避免誤取料的情況發生，有助於提高線路板生產品質，而且更具自動化性能。
In the above structure, the
基於上述顏色感測器，本實施例不僅用於區分晶片和隔紙，還可用於拾取膠片等片材，同時，所述顏色感測器也不局限於檢測不同類型的片材，還可以對單片片材和多片片材進行判斷，例如，當機械手拾取多片膠片時，其色彩深度與單片膠片不同，據此回饋的顏色資料也不相同，控制器根據該顏色區別，可以判斷出機械手拾取的是單片還是多片，進而提高取料過程的準確性，同時還可向用戶及時發出報警提示，不僅準確性更佳，而且也進一步提升了自動化性能。 Based on the above color sensor, this embodiment is not only used to distinguish wafers and separators, but can also be used to pick up sheets such as films. At the same time, the color sensor is not limited to detecting different types of sheets, and can also be used to detect different types of sheets. Judgment is made between a single piece of film and multiple pieces of film. For example, when the robot picks up multiple pieces of film, its color depth is different from that of a single piece of film, and the color data fed back is also different. Based on the color difference, the controller can It can determine whether the robot picks up a single piece or multiple pieces, thereby improving the accuracy of the picking process. At the same time, it can also send an alarm prompt to the user in a timely manner, which not only improves accuracy, but also further improves automation performance.
作為一種較佳方式，所述晶片上料機械手10包括有兩個相互平行的上料吸爪133，兩個上料吸爪133分別固定於所述上料橫樑138的兩端。
As a preferred method, the
為了更加準確地採集片材顏色，本實施例中，所述顏色感測器139位於兩個上料吸爪133之間。
In order to collect the sheet color more accurately, in this embodiment, the
在此基礎上，本實施例還具有取料檢測功能，具體是指，所述晶片上料機構5包括有檢測氣缸51，所述檢測氣缸51固定於所述機架1上，
所述檢測氣缸51的伸縮軸上固定有上料感應機構52，當所述晶片上料機械手10拾取晶片或者所述隔紙下料機械手11拾取隔紙後，所述檢測氣缸51驅使所述上料感應機構52向所述晶片上料盒50內伸出，當所述上料感應機構52感應到所述晶片或者所述隔紙時向所述控制器回饋一電訊號。基於上述結構，有助控制器判斷機械手是否準確取到片材物料，從而進一步提高取料動作的準確性和可靠性。
On this basis, this embodiment also has a material picking and detection function. Specifically, the
為了起到較好的支撐作用，本實施例中，所述上料感應機構52包括有感應支架520和物料感應器521，所述感應支架520與所述檢測氣缸51的伸縮軸固定連接，所述物料感應器521固定於所述感應支架520上。
In order to play a better supporting role, in this embodiment, the
作為一種較佳方式，所述物料感應器521為紅外對管感測器或者接近開關。
As a preferred method, the
實施例六
實際應用中，在晶片上料以及隔紙下料過程中，一般需要利用料盒裝載原料和隔紙，同時需要人工將料盒放置於晶片取料工位與隔紙下料工位，待取放料完成，再由人工進行取換料盒，整個過程不僅繁瑣，而且需要耗費較多人力，工作效率低下，人工成本較高，無法滿足生產需求。 In practical applications, during the process of wafer loading and separator unloading, it is generally necessary to use material boxes to load raw materials and separators. At the same time, the material boxes need to be manually placed at the wafer picking station and separator unloading station to be picked up. After the material feeding is completed, the material box is manually removed and replaced. The whole process is not only cumbersome, but also requires a lot of manpower. The work efficiency is low, the labor cost is high, and the production demand cannot be met.
對此，本實施例提出了一種有助於實現自動取放料盒，從而提高晶片與隔紙的上下料效率，同時節省人工成本的料盒移送機構，結合圖1、圖9至圖15所示，其包括有機架1和晶片物料車15和隔紙物料車，所述機架1上設有晶片上料機構5和隔紙下料機構6，其中：
所述晶片上料機構5的下方設有可推入晶片物料車15的第一物料車位53，所述晶片物料車15上設有第一料盒升降機構55，所述第一料盒升降機構55的升降端放置有晶片上料盒50，所述晶片上料機構5包括有第一鎖固機構54，當所述晶片物料車15推入所述第一物料車位53時，藉
由所述第一鎖固機構54將所述晶片物料車15固定於所述第一物料車位53，再由所述第一料盒升降機構55驅使所述晶片上料盒50上升至預設高度；
所述隔紙下料機構6的下方設有可推入所述隔紙物料車的第二物料車位63，所述隔紙物料車上設有第二料盒升降機構，所述第二料盒升降機構的升降端放置有隔紙下料盒60，所述隔紙下料機構6包括有第二鎖固機構，當所述隔紙物料車推入所述第二物料車位63時，藉由所述第二鎖固機構將所述隔紙物料車固定於所述第二物料車位63，再由所述第二料盒升降機構驅使所述隔紙下料盒60上升至預設高度。
In this regard, this embodiment proposes a box transfer mechanism that helps to realize automatic picking and placing of boxes, thereby improving the loading and unloading efficiency of wafers and separators, while saving labor costs. Combined with Figures 1, 9 to 15 As shown, it includes a
上述結構中，所述晶片上料機構5的下方和所述隔紙下料機構6的下方分別設置了第一物料車位53和第二物料車位63，在進行取換料盒的工序時，只需將所述晶片物料車15和所述隔紙物料車分別推入第一物料車位53和第二物料車位63，將所述晶片物料車15和所述隔紙物料車通過鎖固機構進行固定後，可利用兩個物料車上的料盒升降機構驅使料盒上升至預設的取放料高度，取放料盒的過程可自動化完成，動作過程簡單可靠，不僅省時省力，而且節省了人工成本，有助於提高線路板材料層預疊合設備的工作效率，較好地滿足了生產需求。
In the above structure, a first
為了在料盒升至預設高度後對料盒起到定位作用，本實施例中，所述機架1上固定有至少兩個第一定位氣缸(第一鎖固機構)54，所述第一定位氣缸54分設於所述晶片上料盒50的兩側，所述第一定位氣缸(第一鎖固機構)54的伸縮軸上固定有第一定位塊540，當所述第一料盒升降機構55驅使所述晶片上料盒50上升至預設高度時，所述第一定位氣缸54(第一鎖固機構)驅使所述第一定位塊540伸出，藉由所述晶片上料盒50兩側的第一定位塊540對所述晶片上料盒50進行夾持定位。
In order to position the material box after the material box rises to the preset height, in this embodiment, at least two first positioning cylinders (first locking mechanisms) 54 are fixed on the
實際應用中，所述晶片物料車15和所述隔紙物料車的結構相同，為了便於移動物料車，本實施例中，所述晶片物料車15的底部設有4個萬向輪150。
In practical applications, the
進一步地，所述晶片物料車15的側部設有垂直設置的扶手151。
Furthermore, a
為了實現批量運送，本實施例中，所述第一料盒升降機構55的升降端放置有至少兩個上下層疊放置的晶片上料盒50。
In order to realize batch transportation, in this embodiment, at least two
以上所述只是本發明較佳的實施例，並不用於限制本發明，凡在本發明的技術範圍內所做的修改、等同替換或者改進等，均應包含在本發明所保護的範圍內。 The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the technical scope of the present invention shall be included in the scope of protection of the present invention.
1:機架 1:Rack
10:晶片上料機械手 10: Wafer loading robot
11:隔紙下料機械手 11: Paper blanking manipulator
2:PP片上料機構 2: PP sheet loading mechanism
25:上料台升降驅動機構 25: Loading table lifting drive mechanism
3:預疊台 3: Pre-stack table
4:轉送台 4:Transfer station
5:晶片上料機構 5: Wafer loading mechanism
6:隔紙下料機構 6: Paper cutting mechanism
7:滑移承載架 7: Sliding bearing frame
8:PP取料機械手 8:PP reclaiming manipulator
9:晶片轉送機械手 9: Wafer transfer robot
Claims (9)
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| CN112099320B (en) * | 2020-09-29 | 2022-06-10 | 广东华恒智能科技有限公司 | Double-station exposure equipment |
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| CN113573483B (en) * | 2021-07-27 | 2022-08-02 | 龙宇电子(梅州)有限公司 | Automatic pre-stacking equipment for PCB (printed circuit board) brown plates |
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| CN113972157A (en) * | 2021-10-19 | 2022-01-25 | 科尔迅智能科技(深圳)有限公司 | Single crystal silicon chip flip-chip equipment |
| CN114104743B (en) * | 2021-11-30 | 2022-10-04 | 方泰(广东)科技有限公司 | Laminating device |
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| CN115087248B (en) * | 2022-07-04 | 2023-08-04 | 南京克锐斯自动化科技有限公司 | High-precision automatic sequencing and fixing system for production of laminated printed circuit board |
| CN117509168B (en) * | 2023-12-18 | 2024-04-23 | 江苏富乐华半导体科技股份有限公司 | DCB ceramic substrate automatic feeding equipment |
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