TWI817416B - 安裝工具及安裝裝置 - Google Patents

安裝工具及安裝裝置 Download PDF

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Publication number
TWI817416B
TWI817416B TW111111553A TW111111553A TWI817416B TW I817416 B TWI817416 B TW I817416B TW 111111553 A TW111111553 A TW 111111553A TW 111111553 A TW111111553 A TW 111111553A TW I817416 B TWI817416 B TW I817416B
Authority
TW
Taiwan
Prior art keywords
holding surface
electronic component
installation
mounting
substrate
Prior art date
Application number
TW111111553A
Other languages
English (en)
Chinese (zh)
Other versions
TW202238750A (zh
Inventor
窪田俊也
羽根洋祐
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW202238750A publication Critical patent/TW202238750A/zh
Application granted granted Critical
Publication of TWI817416B publication Critical patent/TWI817416B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Earth Drilling (AREA)
TW111111553A 2021-03-29 2022-03-28 安裝工具及安裝裝置 TWI817416B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-055398 2021-03-29
JP2021055398A JP2022152575A (ja) 2021-03-29 2021-03-29 実装ツールおよび実装装置

Publications (2)

Publication Number Publication Date
TW202238750A TW202238750A (zh) 2022-10-01
TWI817416B true TWI817416B (zh) 2023-10-01

Family

ID=83376262

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111111553A TWI817416B (zh) 2021-03-29 2022-03-28 安裝工具及安裝裝置

Country Status (4)

Country Link
JP (1) JP2022152575A (ja)
KR (2) KR20220135189A (ja)
CN (1) CN115132614A (ja)
TW (1) TWI817416B (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10223692A (ja) * 1997-02-06 1998-08-21 Pfu Ltd フリップチップ実装装置並びに該装置に装着するチップ吸着ツール及びベアチップの実装方法
JP2004022995A (ja) * 2002-06-19 2004-01-22 Mitsui Chemicals Inc 半導体チップのボンディング方法および装置
US20100083494A1 (en) * 2003-12-31 2010-04-08 Chippac, Inc. Bonding Tool for Mounting Semiconductor Chips
TW201631804A (zh) * 2014-11-26 2016-09-01 Toray Industries 筒夾以及發光裝置的製造裝置和製造方法
TW201826406A (zh) * 2016-11-30 2018-07-16 日商新川股份有限公司 接合裝置和接合方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1321966B8 (de) 2001-12-21 2007-05-23 Oerlikon Assembly Equipment AG, Steinhausen Greifwerkzeug zum Montieren von Halbleiterchips
JP2005150311A (ja) 2003-11-13 2005-06-09 Nec Machinery Corp チップマウント方法及び装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10223692A (ja) * 1997-02-06 1998-08-21 Pfu Ltd フリップチップ実装装置並びに該装置に装着するチップ吸着ツール及びベアチップの実装方法
JP2004022995A (ja) * 2002-06-19 2004-01-22 Mitsui Chemicals Inc 半導体チップのボンディング方法および装置
US20100083494A1 (en) * 2003-12-31 2010-04-08 Chippac, Inc. Bonding Tool for Mounting Semiconductor Chips
TW201631804A (zh) * 2014-11-26 2016-09-01 Toray Industries 筒夾以及發光裝置的製造裝置和製造方法
TW201826406A (zh) * 2016-11-30 2018-07-16 日商新川股份有限公司 接合裝置和接合方法

Also Published As

Publication number Publication date
KR20220135189A (ko) 2022-10-06
CN115132614A (zh) 2022-09-30
JP2022152575A (ja) 2022-10-12
KR20240082285A (ko) 2024-06-10
TW202238750A (zh) 2022-10-01

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