TWI817416B - Installation tools and installation devices - Google Patents
Installation tools and installation devices Download PDFInfo
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- TWI817416B TWI817416B TW111111553A TW111111553A TWI817416B TW I817416 B TWI817416 B TW I817416B TW 111111553 A TW111111553 A TW 111111553A TW 111111553 A TW111111553 A TW 111111553A TW I817416 B TWI817416 B TW I817416B
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- holding surface
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- 238000009434 installation Methods 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000009423 ventilation Methods 0.000 claims abstract description 16
- 238000004891 communication Methods 0.000 claims abstract description 3
- 230000007246 mechanism Effects 0.000 claims description 54
- 238000001514 detection method Methods 0.000 claims description 13
- 238000012546 transfer Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000015654 memory Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 241000699670 Mus sp. Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Earth Drilling (AREA)
Abstract
本發明提供一種可減少將電子零件安裝在基板上時的氣泡的殘留及基板的破損的安裝工具及安裝裝置。實施形態是將電子零件(2)安裝在基板(W)上的安裝工具(31),具有:保持面(311),以將電子零件(2)彎曲並相接的方式***;多個開口(312),設置在保持面(311);以及多個通氣孔(313),分別與多個開口(312)連通地設置,多個通氣孔(313)藉由將內部的壓力設為負壓而將電子零件(2)保持在保持面(311),藉由自靠近保持面(311)的最***的峰部分的通氣孔(313)起,依次將鄰接的通氣孔(313)設為正壓,而使電子零件(2)從保持面(311)脫離。The present invention provides a mounting tool and a mounting device that can reduce the residual air bubbles and damage to the substrate when mounting electronic components on a substrate. The embodiment is a mounting tool (31) for mounting electronic components (2) on a substrate (W). It has a holding surface (311) that is raised to bend and connect the electronic components (2); and a plurality of openings ( 312), provided on the holding surface (311); and a plurality of ventilation holes (313), respectively provided in communication with the plurality of openings (312), the plurality of ventilation holes (313) by setting the internal pressure to negative pressure. Hold the electronic component (2) on the holding surface (311), and sequentially set the adjacent vent holes (313) to positive pressure starting from the vent hole (313) close to the most raised peak part of the holding surface (311). , so that the electronic component (2) is separated from the holding surface (311).
Description
本發明是有關於一種安裝工具及安裝裝置。The invention relates to an installation tool and an installation device.
在將作為邏輯、記憶體、圖像感測器等半導體元件的電子零件安裝在基板上時,藉由切斷形成有半導體元件的晶片而製成單片化的晶片。然後,將所述晶片一個個拾取並移送至基板來進行安裝。When electronic components such as semiconductor elements such as logic, memory, and image sensors are mounted on a substrate, the wafer on which the semiconductor elements are formed is cut to form individual wafers. Then, the wafers are picked up one by one and transferred to the substrate for mounting.
在此種電子零件的安裝中,有時在電子零件與基板之間殘留氣泡。若在電子零件與基板之間存在氣泡,則會連接不良、強度不足,從而導致安裝不良。為了應對這一點,在安裝電子零件時,在相對於基板壓接的安裝工具中,使電子零件彎曲並加以保持,使電子零件的一部分與基板接觸後利用彈性體進行按壓,由此以擠出電子零件與基板之間的氣體的方式進行安裝。 [現有技術文獻] [專利文獻] In such mounting of electronic components, air bubbles may remain between the electronic components and the substrate. If there are air bubbles between the electronic components and the substrate, the connection will be poor and the strength will be insufficient, resulting in poor installation. In order to cope with this problem, when mounting electronic components, the electronic components are bent and held in a mounting tool that is pressed against the substrate, and a part of the electronic component is brought into contact with the substrate and pressed with an elastic body, thereby extruding The electronic components are mounted in such a way that there is air between them and the substrate. [Prior art documents] [Patent Document]
[專利文獻1] 日本專利第3757193號公報 [專利文獻2]日本專利特開2003-203964號公報 [專利文獻3]日本專利特開2005-150311號公報 [Patent Document 1] Japanese Patent No. 3757193 [Patent Document 2] Japanese Patent Application Laid-Open No. 2003-203964 [Patent Document 3] Japanese Patent Application Laid-Open No. 2005-150311
[發明所欲解決之課題][Problem to be solved by the invention]
但是,在彈性體進行按壓的同時變形而壓潰的工具中,根據電子零件的尺寸,有時被按壓的區域不會均勻地擴展,或者無法對外緣部分施加充分的力,從而無法擠出氣泡。另外,有時會對中央部分施加過剩的按壓力而使電子零件破損。However, in a tool in which the elastic body is deformed and crushed while being pressed, depending on the size of the electronic component, the pressed area may not expand evenly, or sufficient force may not be applied to the outer edge part, making it impossible to squeeze out the air bubbles. . In addition, excessive pressing force may be applied to the central part and electronic components may be damaged.
本發明是為了解決如所述那樣的問題而完成的,其目的在於提供一種可減少在將電子零件安裝在基板上時的氣泡的殘留及基板的破損的安裝工具及安裝裝置。 [解決課題之手段] The present invention was made in order to solve the above-described problems, and an object thereof is to provide a mounting tool and a mounting device that can reduce the remaining air bubbles and damage to the substrate when mounting electronic components on a substrate. [Means to solve the problem]
本發明是將電子零件安裝在基板上的安裝工具,具有:保持面,以將所述電子零件彎曲並相接的方式***;多個開口,設置在所述保持面;以及通氣孔,與所述開口連通,藉由將內部的壓力設為負壓而將所述電子零件保持在所述保持面,藉由自靠近所述保持面的最***的峰部分的所述通氣孔起,依次將鄰接的所述通氣孔設為正壓,而使所述電子零件從所述保持面脫離。The present invention is a mounting tool for mounting electronic components on a substrate. It has: a holding surface raised to bend and connect the electronic components; a plurality of openings provided on the holding surface; and a ventilation hole connected to the holding surface. The opening is connected, and the internal pressure is set to a negative pressure to hold the electronic component on the holding surface. The adjacent vent holes are set to a positive pressure to separate the electronic components from the holding surface.
本發明的安裝裝置具有所述安裝工具,且具有:工具移動機構,使所述安裝工具在交接位置與安裝位置之間往復移動並在交接位置及安裝位置升降;檢測部,檢測對所述安裝工具的接觸;以及切換部,在由所述檢測部檢測到接觸的情況下,切換對所述安裝工具的通氣孔的負壓及正壓。 [發明的效果] The installation device of the present invention has the installation tool, and has: a tool moving mechanism to make the installation tool reciprocate between the transfer position and the installation position and to rise and fall between the transfer position and the installation position; and a detection part to detect whether the installation contact of the tool; and a switching unit that switches the negative pressure and the positive pressure on the ventilation hole of the mounting tool when the contact is detected by the detection unit. [Effects of the invention]
根據本發明的安裝工具及安裝裝置,可減少將電子零件安裝在基板上時的氣泡的殘留及基板的破損。According to the mounting tool and mounting device of the present invention, bubbles remaining and damage to the substrate can be reduced when mounting electronic components on a substrate.
參照附圖對實施形態的安裝裝置進行說明。再者,附圖是示意圖,各部的尺寸、比率等為了容易理解而包含誇張的部分。如圖1及圖2所示,安裝裝置1包括供給裝置10、拾取裝置20、搭載裝置30、控制裝置50,是藉由拾取裝置20將電子零件2向搭載裝置30交接,藉由搭載裝置30安裝在基板載台60的基板W上的裝置。電子零件2例如是晶片狀的零件。本實施形態中,電子零件2是將晶片分割成單片的半導體晶片。The mounting device of the embodiment will be described with reference to the drawings. In addition, the drawings are schematic diagrams, and the dimensions, ratios, etc. of each part include exaggerated parts for easy understanding. As shown in FIGS. 1 and 2 , the mounting device 1 includes a supply device 10 , a pickup device 20 , a mounting device 30 , and a control device 50 . The pickup device 20 transfers the electronic components 2 to the mounting device 30 , and the mounting device 30 A device mounted on the substrate W on the substrate stage 60 . The electronic component 2 is, for example, a wafer-shaped component. In this embodiment, the electronic component 2 is a semiconductor wafer obtained by dividing the wafer into individual pieces.
供給裝置10是向拾取裝置20供給電子零件2的裝置。供給裝置10使作為拾取物件的電子零件2移動至供給位置P1。所謂供給位置P1,是拾取裝置20拾取作為拾取物件的電子零件2的位置。供給裝置10包括支援貼附有電子零件2的片材11的供給載台12、使供給載台12移動的載台移動機構13。作為載台移動機構13,例如可使用藉由以伺服電動機驅動的滾珠螺桿機構而使滑動器在導軌上移動的線性引導件。The supply device 10 is a device that supplies the electronic components 2 to the pickup device 20 . The supply device 10 moves the electronic component 2 as a picked-up object to the supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 as a pickup object. The supply device 10 includes a supply stage 12 that supports the sheet 11 on which the electronic component 2 is attached, and a stage moving mechanism 13 that moves the supply stage 12 . As the stage moving mechanism 13, for example, a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor can be used.
此處,貼附有電子零件2的片材11是貼附在未圖示的晶片環上的具有粘著性的晶片片材。在片材11上,電子零件2配置成矩陣(matrix)狀。本實施形態中,電子零件2以功能面露出至上方的朝上狀態配置。Here, the sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). On the sheet 11, the electronic components 2 are arranged in a matrix. In this embodiment, the electronic component 2 is arranged in an upward state with the functional surface exposed upward.
供給載台12是水準支持貼附有片材11的晶片環的台。即,經由晶片環支援貼附有電子零件2的片材11。供給載台12被設置成通超載台移動機構13能夠在水準方向上移動。片材11與供給載台12一起被水準地支持,因此片材11及載置於所述片材11上的電子零件2也被設置成能夠在水準方向上移動。The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the sheet 11 to which the electronic component 2 is attached is supported via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by an overload stage moving mechanism 13 . Since the sheet 11 is supported horizontally together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.
再者,如圖1及圖2所示,將水準方向中供給裝置10與搭載裝置30排列的方向稱為X軸方向,將與X軸正交的方向稱為Y軸方向。另外,將與片材11的平面正交的方向稱為Z軸方向或上下方向。所謂上方向,是以片材11的平面為邊界且載置有電子零件2的一側的方向,所謂下方向,是以片材11的平面為邊界且未載置電子零件2的一側的方向。In addition, as shown in FIGS. 1 and 2 , the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. In addition, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction refers to the side with the plane of the sheet 11 as a boundary and on which the electronic components 2 are placed. The downward direction refers to the side with the plane of the sheet 11 as a boundary and with which the electronic components 2 are not placed. direction.
[拾取裝置] 拾取裝置20是從供給裝置10拾取電子零件2並將拾取的電子零件2交接至搭載裝置30的中繼裝置。所述拾取裝置20包括拾取噴嘴21、噴嘴移動機構22、方向轉換部23、以及上推銷24。 [pickup device] The pickup device 20 is a relay device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30 . The pick-up device 20 includes a pick-up nozzle 21 , a nozzle moving mechanism 22 , a direction conversion part 23 , and a push-up push button 24 .
拾取噴嘴21是保持電子零件2並解除保持狀態而釋放電子零件2的筒狀的吸附噴嘴。拾取噴嘴21具有在其前端的吸附面開口的噴嘴孔。噴嘴孔與真空泵等負壓產生回路(未圖示)連通,藉由所述回路產生負壓,利用噴嘴孔吸附保持電子零件2。另外,藉由解除負壓而從拾取噴嘴21釋放電子零件2。The pickup nozzle 21 is a cylindrical adsorption nozzle that holds the electronic component 2 and releases the holding state to release the electronic component 2 . The pickup nozzle 21 has a nozzle hole opened on the suction surface at the front end. The nozzle hole is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and the circuit generates negative pressure, and the electronic component 2 is adsorbed and held by the nozzle hole. In addition, the electronic component 2 is released from the pickup nozzle 21 by releasing the negative pressure.
噴嘴移動機構22是使拾取噴嘴21在供給位置P1與交接位置P2之間往復移動且在供給位置P1及交接位置P2升降的機構。具體而言,噴嘴移動機構22包括滑動機構221、升降機構222。再者,所謂交接位置P2,是拾取裝置20將在供給位置P1拾取的電子零件2交接至作為後述的接收部發揮功能的安裝工具31的位置。The nozzle moving mechanism 22 is a mechanism that reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2, and moves the pick-up nozzle 21 up and down in the supply position P1 and the delivery position P2. Specifically, the nozzle moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222 . In addition, the delivery position P2 is a position where the pick-up device 20 delivers the electronic component 2 picked up at the supply position P1 to the mounting tool 31 that functions as a receiving portion to be described later.
供給位置P1及交接位置P2主要是指XY方向的位置,不一定是指Z軸方向的位置。另外,即使在是指Z軸方向的位置(高度)的情況下,其高度也具有規定的寬度。規定的寬度包括電子零件2的交接時的電子零件2的厚度、將電子零件2上推的距離、能夠吸附電子零件2的距離等。The supply position P1 and the delivery position P2 mainly refer to the positions in the XY direction, and do not necessarily refer to the positions in the Z-axis direction. In addition, even when referring to the position (height) in the Z-axis direction, the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2 when the electronic component 2 is handed over, the distance to push the electronic component 2 up, the distance to which the electronic component 2 can be attracted, and the like.
滑動機構221使拾取噴嘴21在供給位置P1與交接位置P2之間往復移動。此處,滑動機構221具有:與X軸方向平行地延伸且固定於支持框架221a的導軌221b、以及在導軌221b上行進的滑動器221c。雖未圖示,但滑動器221c藉由以旋轉電動機驅動的滾珠螺桿、線性電動機等而受到驅動。升降機構222使拾取噴嘴21在上下方向上移動。具體而言,升降機構222可使用藉由以伺服電動機驅動的滾珠螺桿機構而使滑動器在導軌上移動的線性引導件。即,藉由伺服電動機的驅動,拾取噴嘴21沿著Z軸方向升降。The sliding mechanism 221 reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2. Here, the sliding mechanism 221 has a guide rail 221b extending parallel to the X-axis direction and fixed to the support frame 221a, and a slider 221c traveling on the guide rail 221b. Although not shown in the figure, the slider 221c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The lifting mechanism 222 moves the pickup nozzle 21 in the up and down direction. Specifically, the lifting mechanism 222 may use a linear guide that moves a slider on a guide rail through a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 moves up and down along the Z-axis direction by driving the servo motor.
方向轉換部23設置在拾取噴嘴21與噴嘴移動機構22之間。此處,方向轉換部23是包括變更拾取噴嘴21的朝向的電動機等驅動源、滾珠軸承等旋轉引導件而成的致動器。所謂變更朝向,是在上下方向上旋轉0°~180°。例如,使吸附面朝向供給載台12的拾取噴嘴21在供給位置P1吸附保持電子零件2。之後,方向轉換部23以吸附面朝上的方式變更拾取噴嘴21的朝向。此時,旋轉角度為180°。The direction conversion part 23 is provided between the pickup nozzle 21 and the nozzle moving mechanism 22 . Here, the direction changing unit 23 is an actuator including a driving source such as a motor for changing the direction of the pickup nozzle 21 and a rotation guide such as a ball bearing. The so-called change of orientation means rotating 0° to 180° in the up and down direction. For example, the electronic component 2 is sucked and held at the supply position P1 by the pick-up nozzle 21 with the suction surface facing the supply stage 12 . Thereafter, the direction changing unit 23 changes the direction of the pickup nozzle 21 so that the suction surface faces upward. At this time, the rotation angle is 180°.
上推銷24設置在供給裝置10的片材11的下方。上推銷24是前端尖銳的針狀構件。上推銷24以長度方向平行於Z軸方向的方式設置在支撐體241的內部。The upper push button 24 is provided below the sheet 11 of the supply device 10 . The upper push pin 24 is a needle-shaped member with a sharp front end. The upper push pin 24 is provided inside the support body 241 so that its length direction is parallel to the Z-axis direction.
支撐體241具有使上推銷24從其內部進出或退避至其內部的驅動機構。所述進出或退避在上下方向上進行。所述驅動機構例如包括由上下方向的導軌引導而移動的滑動器、以及驅動滑動器的氣缸或凸輪機構。The support body 241 has a driving mechanism for moving the upper push pin 24 in and out of the support body 241 or retracting the support body 241 to the inside thereof. The entry and exit or retraction is performed in the up and down direction. The drive mechanism includes, for example, a slider that is guided to move by an up-and-down guide rail, and a cylinder or a cam mechanism that drives the slider.
[搭載裝置] 搭載裝置30是將從拾取裝置20接收到的電子零件2搬運至安裝位置P3並安裝在基板W上的裝置。所謂安裝位置P3,是將電子零件2安裝在基板上的位置。搭載裝置30具有安裝工具31、工具移動機構32。 [Mounted device] The mounting device 30 is a device that carries the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate W. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a mounting tool 31 and a tool moving mechanism 32 .
安裝工具31是具有作為在交接位置P2從拾取噴嘴21接收電子零件2的接收部的功能且將所述電子零件2在安裝位置P3安裝在基板W上的構件。安裝工具31保持電子零件2並在安裝後解除保持狀態而釋放電子零件2。The mounting tool 31 has a function as a receiving portion for receiving the electronic component 2 from the pickup nozzle 21 at the delivery position P2, and is a member that mounts the electronic component 2 on the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2 .
具體而言,如圖3的(A)、圖3的(B)所示,安裝工具31是剖面為大致長方體形狀的區塊,且具有保持面311、開口312、通氣孔313。保持面311是安裝工具31的底面,且是以電子零件2彎曲並相接的方式***的面。所謂彎曲,是指以不產生角的方式彎折,還包含如圖3的(B)所示在平坦面之間產生曲面而彎折那樣的、所謂的稱為屈曲那樣的實施方式。本實施形態的保持面311為山形。此處所說的山形是指角度不同的兩個平坦面在包含中央的最高頂點的峰部分平緩地連續的形狀。即,保持面311的平面形狀為矩形,長邊方向的兩側面的中央成為峰部分,將兩側面的峰部分連結的棱線成為短邊方向。再者,保持面311優選為安裝工具31由硬質的材料形成,以防止在電子零件2的安裝時的壓力下彈性變形。保持面311根據要安裝的電子零件2,平面形狀為長方形,也可為正方形。再者,如上所述,圖3的(A)~圖3的(C)及其他附圖是示意圖,為了容易理解,誇大了保持面311的***的程度或與其他部分的比率等。Specifically, as shown in FIGS. 3(A) and 3(B) , the mounting tool 31 is a block with a substantially rectangular parallelepiped shape in cross section, and has a holding surface 311 , an opening 312 , and a ventilation hole 313 . The holding surface 311 is the bottom surface of the mounting tool 31 and is a raised surface such that the electronic components 2 are bent and connected. Bending refers to bending without creating an angle, and also includes an embodiment called buckling in which a curved surface is generated between flat surfaces and bent as shown in FIG. 3(B) . The holding surface 311 of this embodiment has a mountain shape. The mountain shape referred to here refers to a shape in which two flat surfaces with different angles are gently continued at a peak portion including the central highest apex. That is, the planar shape of the holding surface 311 is a rectangle, the center of both side surfaces in the longitudinal direction is a peak portion, and the ridge line connecting the peak portions of both side surfaces is a short-side direction. Furthermore, the holding surface 311 is preferably made of a hard material for the mounting tool 31 to prevent elastic deformation under pressure during mounting of the electronic component 2 . The holding surface 311 may have a rectangular planar shape or a square shape depending on the electronic component 2 to be mounted. In addition, as mentioned above, FIGS. 3(A) to 3(C) and other drawings are schematic diagrams, and the degree of bulge of the holding surface 311 or the ratio to other parts, etc. are exaggerated for easy understanding.
如圖3的(C)所示,開口312在保持面311設置有多個。多個開口312是排列成多個列而設置。此處,在保持面311為長方形的情況下,各列的方向是與其短邊平行的方向。但是,並不限定於所述方向。本實施形態中的開口312隔著設置在峰部分的一列即列[1],在保持面311的兩短邊側各設置有列[2]、列[3]此兩列。As shown in FIG. 3(C) , a plurality of openings 312 are provided on the holding surface 311 . The plurality of openings 312 are arranged in a plurality of columns. Here, when the holding surface 311 is rectangular, the direction of each column is a direction parallel to its short side. However, it is not limited to the above-mentioned direction. The openings 312 in this embodiment are arranged in one row at the peak portion, that is, row [1], and two rows, row [2] and row [3], are provided on both short sides of the holding surface 311.
通氣孔313設置有多個,各通氣孔313的一端與各個開口312連通。多個通氣孔313藉由將孔內的壓力設為負壓而將電子零件2保持在保持面311,藉由自靠近保持面311的最***的峰部分的通氣孔313起,依次將鄰接的通氣孔313設為正壓,而使電子零件2從保持面311脫離。本實施形態中,從電子零件2的中央側的通氣孔313向鄰接的通氣孔313依次設為正壓。各通氣孔313的另一端與切換負壓及正壓而產生的氣壓回路(未圖示)連通。本實施形態中,各列的通氣孔313分別連接於配管及閥,以便可對每列切換負壓及正壓。此種閥用作為切換對通氣孔313的負壓及正壓的切換部發揮功能。A plurality of ventilation holes 313 are provided, and one end of each ventilation hole 313 is connected to each opening 312 . The plurality of vent holes 313 hold the electronic component 2 on the holding surface 311 by setting the pressure in the hole to a negative pressure. The ventilation hole 313 is set to a positive pressure, and the electronic component 2 is separated from the holding surface 311 . In this embodiment, the positive pressure is set sequentially from the vent hole 313 on the central side of the electronic component 2 to the adjacent vent hole 313 . The other end of each vent hole 313 is connected to an air pressure circuit (not shown) generated by switching negative pressure and positive pressure. In this embodiment, the ventilation holes 313 of each row are respectively connected to pipes and valves so that negative pressure and positive pressure can be switched for each row. This type of valve functions as a switching unit for switching between negative pressure and positive pressure with respect to the vent hole 313 .
工具移動機構32使安裝工具31在交接位置P2與安裝位置P3之間往復移動並在交接位置P2與安裝位置P3升降。工具移動機構32具有滑動機構321、升降機構322。The tool moving mechanism 32 reciprocates the installation tool 31 between the transfer position P2 and the installation position P3, and moves the installation tool 31 up and down between the transfer position P2 and the installation position P3. The tool moving mechanism 32 includes a sliding mechanism 321 and a lifting mechanism 322 .
滑動機構321使安裝工具31在交接位置P2與安裝位置P3之間往復移動。此處,滑動機構321具有:與X軸方向平行地延伸且固定於支援框架321a上的兩根導軌321b、以及在導軌321b上行進的滑動器321c。雖未圖示,但滑動器321c藉由以旋轉電動機驅動的滾珠螺桿、線性電動機等而受到驅動。再者,雖未圖示,但滑動機構321具有使安裝工具31在Y軸方向上滑動移動的滑動機構。所述滑動機構也可包括Y軸方向的導軌與在導軌上行進的滑動器。滑動器藉由以旋轉電動機驅動的滾珠螺桿、線性電動機等而受到驅動。The sliding mechanism 321 reciprocates the installation tool 31 between the transfer position P2 and the installation position P3. Here, the sliding mechanism 321 includes two guide rails 321b that extend parallel to the X-axis direction and are fixed to the support frame 321a, and a slider 321c that runs on the guide rails 321b. Although not shown in the figure, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. Furthermore, although not shown in the figure, the sliding mechanism 321 has a sliding mechanism for sliding the mounting tool 31 in the Y-axis direction. The sliding mechanism may also include a guide rail in the Y-axis direction and a slider traveling on the guide rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like.
升降機構322藉由驅動能夠裝卸地設置有安裝工具31的臂,使安裝工具31在上下方向上移動。具體而言,升降機構322可使用藉由以伺服電動機驅動的滾珠螺桿機構而使滑動器在導軌上移動的線性引導件。即,藉由伺服電動機的驅動,安裝工具31沿著Z軸方向升降。進而,在升降機構322上設置有檢測對安裝工具31的接觸的檢測部322a。作為檢測部322a,可使用應變計或壓電元件等載荷感測器。The lifting mechanism 322 drives the arm on which the installation tool 31 is detachably provided to move the installation tool 31 in the up and down direction. Specifically, the lifting mechanism 322 may use a linear guide that moves a slider on a guide rail through a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the mounting tool 31 moves up and down along the Z-axis direction. Furthermore, the lifting mechanism 322 is provided with a detection portion 322 a that detects contact with the mounting tool 31 . As the detection part 322a, a load sensor such as a strain gauge or a piezoelectric element can be used.
基板載台60是支援用於安裝電子零件2的基板W的台。基板載台60設置在載台移動機構61。載台移動機構61是使基板載台60在XY平面上滑動移動且將電子零件2在基板W上的安裝位置定位在安裝位置P3的移動機構。載台移動機構61例如可使用藉由以伺服電動機驅動的滾珠螺桿機構而使滑動器在導軌上移動的線性引導件。The substrate stage 60 is a stage that supports the substrate W for mounting the electronic component 2 . The substrate stage 60 is provided in the stage moving mechanism 61 . The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 on the XY plane and positions the mounting position of the electronic component 2 on the substrate W at the mounting position P3. The stage moving mechanism 61 may use, for example, a linear guide that moves a slider on a guide rail using a ball screw mechanism driven by a servo motor.
控制裝置50控制供給裝置10、拾取裝置20、搭載裝置30、基板載台60的啟動、停止、速度、動作時機等。即,控制裝置50是安裝裝置1的控制裝置。控制裝置50例如可藉由專用的電子回路或以規定的程式運作的電腦等實現。操作者輸入控制所需的指示或資訊的輸入裝置、用於確認裝置的狀態的輸出裝置與控制裝置50連接。輸入裝置可使用開關、觸控式螢幕、鍵盤、滑鼠等。輸出裝置可使用液晶、有機電致發光(electroluminescence,EL)等的顯示部。The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10 , the pickup device 20 , the loading device 30 , and the substrate stage 60 . That is, the control device 50 is a control device of the mounting device 1 . The control device 50 can be implemented by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. The control device 50 is connected to an input device for the operator to input instructions or information required for control and an output device for confirming the status of the device. Input devices may use switches, touch screens, keyboards, mice, etc. The output device may use a display unit such as liquid crystal or organic electroluminescence (EL).
圖4是控制裝置50的功能框圖。控制裝置50具有:控制供給裝置10的供給裝置控制部51、控制拾取裝置20的上推銷控制部52及拾取噴嘴控制部53、控制搭載裝置30的安裝工具控制部54、控制基板載台60的基板載台控制部56、以及記憶部57。FIG. 4 is a functional block diagram of the control device 50. The control device 50 includes a supply device control unit 51 that controls the supply device 10 , a push-up control unit 52 and a pick-up nozzle control unit 53 that control the pickup device 20 , a mounting tool control unit 54 that controls the mounting device 30 , and a substrate stage 60 that controls the substrate stage 60 . The substrate stage control unit 56 and the memory unit 57 are provided.
供給裝置控制部51控制供給載台12的移動。即,控制載置於片材11上的作為拾取物件的電子零件2的移動。上推銷控制部52控制上推銷24的移動。The supply device control unit 51 controls the movement of the supply stage 12 . That is, the movement of the electronic component 2 as a pickup object placed on the sheet 11 is controlled. The upper pusher control unit 52 controls the movement of the upper pusher 24 .
拾取噴嘴控制部53控制拾取噴嘴21的移動、即噴嘴移動機構22及方向轉換部23的動作。另外,拾取噴嘴控制部53控制與噴嘴孔21b連通的負壓產生回路,控制電子零件2的保持及釋放。The pickup nozzle control unit 53 controls the movement of the pickup nozzle 21 , that is, the operations of the nozzle moving mechanism 22 and the direction conversion unit 23 . In addition, the pick-up nozzle control unit 53 controls the negative pressure generating circuit connected to the nozzle hole 21 b and controls the holding and releasing of the electronic component 2 .
安裝工具控制部54控制安裝工具31的移動、即工具移動機構32的動作。另外,安裝工具控制部54控制與安裝工具31的通氣孔313連通的氣壓回路,切換各列的開口312的負壓及正壓,來控制電子零件2的保持及釋放。另外,安裝工具控制部54根據利用檢測部322a進行的接觸檢測,來控制通氣孔313的負壓與正壓的切換。基板載台控制部56控制基板載台60的移動、即載台移動機構61的動作。The mounting tool control unit 54 controls the movement of the mounting tool 31 , that is, the operation of the tool moving mechanism 32 . In addition, the mounting tool control unit 54 controls the air pressure circuit connected to the ventilation hole 313 of the mounting tool 31 to switch the negative pressure and the positive pressure of the opening 312 of each row to control the holding and releasing of the electronic component 2 . In addition, the mounting tool control unit 54 controls switching between negative pressure and positive pressure in the vent hole 313 based on the contact detection by the detection unit 322a. The substrate stage control unit 56 controls the movement of the substrate stage 60 , that is, the operation of the stage moving mechanism 61 .
記憶部57是包括作為記錄媒體的各種記憶體(硬碟驅動器(Hard Disk Drive,HDD)或固態驅動器(Solid State Drive,SSD)等)、記錄媒體與外部的介面的記憶裝置。記憶部57中預先記憶有安裝裝置1的動作所需的資料、程式,且記憶安裝裝置1的動作所需的資料。所謂所述所需資料,例如是供給位置P1、交接位置P2、安裝位置P3的位置座標、各移動機構的位置座標。所述各移動機構基於這些座標進行各結構的移動控制。另外,在記憶部57中記憶有將安裝工具31的通氣孔313的列中的哪一列從負壓切換為正壓的時機。The storage unit 57 is a storage device including various memories as recording media (hard disk drive (HDD), solid state drive (SSD), etc.) and an interface between the recording medium and the outside. The memory unit 57 stores data and programs necessary for the operation of the mounting device 1 in advance, and stores data necessary for the operation of the mounting device 1 . The required data include, for example, the position coordinates of the supply position P1, the transfer position P2, the installation position P3, and the position coordinates of each moving mechanism. Each of the moving mechanisms controls the movement of each structure based on these coordinates. In addition, the memory unit 57 stores the timing of switching which column of the vent holes 313 of the mounting tool 31 from negative pressure to positive pressure.
[動作] 對如以上所述那樣的安裝裝置1的動作進行說明。首先,拾取裝置20從供給裝置10拾取電子零件2,並將所述電子零件2交接至搭載裝置30。即,利用拾取裝置20使拾取噴嘴21移動至上推銷24所在的供給位置P1,使拾取噴嘴21的噴嘴孔21b與上推銷24相向。 [action] The operation of the mounting device 1 as described above will be described. First, the pickup device 20 picks up the electronic components 2 from the supply device 10 and delivers the electronic components 2 to the mounting device 30 . That is, the pickup nozzle 21 is moved to the supply position P1 where the upper push pin 24 is located by the pickup device 20 , so that the nozzle hole 21 b of the pickup nozzle 21 faces the upper push pin 24 .
另一方面,供給裝置10使供給載台12移動,使作為拾取物件的電子零件2位於供給位置P1。之後,使拾取噴嘴21下降而使吸附面與供給位置P1的電子零件2抵接來吸附電子零件2。繼而,在保持電子零件2的狀態下使拾取噴嘴21上升,同時利用上推銷24上推電子零件2,由此在從片材11上剝落電子零件2的同時拾取電子零件2。On the other hand, the supply device 10 moves the supply stage 12 so that the electronic component 2 as a picked-up object is located at the supply position P1. Thereafter, the pickup nozzle 21 is lowered to bring the suction surface into contact with the electronic component 2 at the supply position P1, and the electronic component 2 is suctioned. Next, while holding the electronic components 2 , the pick-up nozzle 21 is raised and the electronic components 2 are pushed up by the push pin 24 , thereby peeling off the electronic components 2 from the sheet 11 and simultaneously picking up the electronic components 2 .
拾取裝置20藉由方向轉換部23使拾取噴嘴21反轉。即,使拾取噴嘴21的朝向在上下方向上旋轉180°,使拾取噴嘴21的吸附面朝向上方。再者,反轉動作也可在從供給位置P1至交接位置P2之間的任意地點進行。The pickup device 20 reverses the pickup nozzle 21 through the direction converting unit 23 . That is, the direction of the pickup nozzle 21 is rotated 180° in the up-down direction so that the suction surface of the pickup nozzle 21 faces upward. Furthermore, the reversal operation may be performed at any point between the supply position P1 and the delivery position P2.
拾取裝置20藉由噴嘴移動機構22使拾取的電子零件2移動至交接位置P2。搭載裝置30的安裝工具31藉由工具移動機構32而移動至交接位置P2並待機,安裝工具31的保持面311經由電子零件2而與拾取噴嘴21的噴嘴孔21b相向。The pick-up device 20 moves the picked-up electronic component 2 to the transfer position P2 through the nozzle moving mechanism 22 . The mounting tool 31 of the mounting device 30 is moved to the transfer position P2 by the tool moving mechanism 32 and waits. The holding surface 311 of the mounting tool 31 faces the nozzle hole 21 b of the pickup nozzle 21 via the electronic component 2 .
然後,在使安裝工具31向位於交接位置P2的拾取噴嘴21下降,使負壓作用於安裝工具31的通氣孔313而保持電子零件2後,拾取噴嘴21解除負壓,由此從拾取噴嘴21向安裝工具31交接電子零件2。由此,電子零件2以仿照保持面311的***的方式彎曲並被吸附保持。Then, the mounting tool 31 is lowered toward the pickup nozzle 21 located at the transfer position P2, and negative pressure is applied to the ventilation hole 313 of the mounting tool 31 to hold the electronic component 2. Then, the pickup nozzle 21 releases the negative pressure, thereby removing the negative pressure from the pickup nozzle 21. The electronic component 2 is delivered to the mounting tool 31 . Thereby, the electronic component 2 is bent in a manner imitating the bulge of the holding surface 311 and is adsorbed and held.
之後,安裝工具31向安裝位置P3移動,將電子零件2安裝在基板W上。參照圖5的流程圖、圖6的動作說明圖來對所述安裝動作進行說明。首先,安裝工具31移動至安裝位置P3,如圖6的(A)所示,由安裝工具31保持的電子零件2與基板W相向(步驟S01)。然後,安裝工具31下降,而使電子零件2接近基板W(步驟S02)。Thereafter, the mounting tool 31 moves to the mounting position P3 to mount the electronic component 2 on the substrate W. The installation operation will be described with reference to the flowchart of FIG. 5 and the operation explanation diagram of FIG. 6 . First, the mounting tool 31 moves to the mounting position P3, and as shown in FIG. 6(A) , the electronic component 2 held by the mounting tool 31 faces the substrate W (step S01). Then, the mounting tool 31 is lowered to bring the electronic component 2 close to the substrate W (step S02 ).
當安裝工具31的檢測部322a檢測到電子零件2與基板W的接觸時(步驟S03的是(YES)),安裝工具31停止下降(步驟S04)。然後,自通氣孔313的一部分起,依次停止負壓,並且設為正壓,由此使電子零件2脫離而安裝在基板W上。即,按照圖3的(A)~圖3的(C)所示的列[1]、列[2]、列[3]的順序切換為正壓,從開口312進行吹風(步驟S05~步驟S07)。When the detection part 322a of the mounting tool 31 detects the contact between the electronic component 2 and the board W (YES in step S03), the mounting tool 31 stops descending (step S04). Then, the negative pressure is stopped sequentially from a part of the vent hole 313 and is set to a positive pressure, whereby the electronic component 2 is detached and mounted on the substrate W. That is, the positive pressure is switched to the positive pressure in the order of row [1], row [2], and row [3] shown in FIGS. S07).
此時,如圖6的(B)、圖6的(C)、圖6的(D)所示,通氣孔313的多個列中與保持面311的最***的峰部分對應的電子零件2的部分最初與基板W相接,從所述峰部分的列向鄰接的列依次從負壓(圖中塗白的箭頭)切換為正壓(圖中塗黑的箭頭)。由此,彎曲的電子零件2從峰部分向外側,逐漸以仿照基板W的平坦面的方式脫離,因此氣泡在被排除至外側的同時被安裝在基板W上。安裝後,如圖6的(E)所示,安裝工具31上升,殘留電子零件2而從基板W退避(步驟S08)。At this time, as shown in FIGS. 6(B) , 6(C) , and 6(D) , the electronic component 2 corresponding to the most raised peak portion of the holding surface 311 among the plurality of rows of the vent holes 313 The portion is initially in contact with the substrate W, and the negative pressure (white arrow in the figure) is switched to the positive pressure (black arrow in the figure) from the column of the peak portion to the adjacent column. Thereby, the curved electronic component 2 gradually detaches from the peak portion toward the outside to imitate the flat surface of the substrate W. Therefore, the air bubbles are removed to the outside and are mounted on the substrate W. After mounting, as shown in (E) of FIG. 6 , the mounting tool 31 rises, leaving the electronic component 2 and retracting from the substrate W (step S08 ).
[效果] (1)本實施形態是將電子零件2安裝在基板W上的安裝工具31,具有:保持面311,以電子零件2彎曲並相接的方式***;多個開口312,設置在保持面311;以及多個通氣孔313,分別與多個開口312連通地設置,多個通氣孔313藉由將內部的壓力設為負壓而將電子零件2保持在保持面311,藉由自靠近保持面311的最***的峰部分的通氣孔313起,依次將鄰接的通氣孔313設為正壓,而使電子零件2從保持面311脫離。 [Effect] (1) This embodiment is a mounting tool 31 for mounting electronic components 2 on a substrate W. It has: a holding surface 311 that is raised in a manner that the electronic components 2 are bent and connected; a plurality of openings 312 are provided in the holding surface 311; And a plurality of ventilation holes 313 are provided in communication with the plurality of openings 312 respectively. The plurality of ventilation holes 313 maintain the electronic component 2 on the holding surface 311 by setting the internal pressure as a negative pressure, and by approaching the holding surface 311 from Starting from the vent hole 313 at the most raised peak portion, the adjacent vent holes 313 are sequentially set to positive pressure, and the electronic component 2 is detached from the holding surface 311 .
另外,本實施形態的安裝裝置1具有安裝工具31,且具有:工具移動機構32,使安裝工具31在交接位置與安裝位置之間往復移動並在交接位置及安裝位置升降;檢測部322a,檢測對安裝工具31的接觸壓;以及切換部,在由檢測部322a檢測到接觸的情況下,切換對安裝工具31的通氣孔313的負壓及正壓。In addition, the mounting device 1 of this embodiment has the mounting tool 31, and has: the tool moving mechanism 32, which reciprocates the mounting tool 31 between the delivery position and the mounting position, and raises and lowers the delivery position and the mounting position; and the detection part 322a, which detects the contact pressure to the mounting tool 31; and a switching unit that switches the negative pressure and the positive pressure to the vent hole 313 of the mounting tool 31 when the detection unit 322a detects contact.
因此,自電子零件2藉由負壓而彎曲並保持在保持面311的狀態,依次將通氣孔設為正壓,由此在電子零件2以仿照基板W的方式成為平坦的過程中,在排出氣泡的同時進行安裝。由此,可抑制氣泡殘留在電子零件2與基板W之間,從而安裝不良減少。由於是利用電子零件2自身的彎曲復原來安裝,因此按壓力不偏向而是均勻地發揮作用,可均勻地擠出氣泡,並且也可減少電子零件2的破損。Therefore, since the electronic component 2 is bent by the negative pressure and held on the holding surface 311, the ventilation holes are sequentially set to positive pressure, and the electronic component 2 becomes flat in the manner of imitating the substrate W. Install the air bubbles at the same time. This can suppress bubbles from remaining between the electronic component 2 and the substrate W, thereby reducing mounting defects. Since the electronic component 2 is installed by utilizing its own bending recovery, the pressing force acts evenly without being biased, and can evenly squeeze out air bubbles and reduce damage to the electronic component 2 .
(2)多個開口312是排列成多個列而形成。因此,藉由對每列依次將負壓切換為正壓,可在防止對電子零件2的一部分施加過大的力的同時,使彎曲部恢復為平坦地進行安裝。(2) The plurality of openings 312 are arranged in a plurality of columns. Therefore, by sequentially switching the negative pressure to the positive pressure for each row, it is possible to prevent excessive force from being applied to a part of the electronic component 2 and to restore the curved portion to a flat surface for mounting.
(3)自多個通氣孔313中靠近保持面311的最***的峰部分的通氣孔313起,依次將鄰接的通氣孔313設為正壓。因此,可自電子零件2首先與基板W接觸的部分起,逐漸向外緣與基板W接觸而排出氣泡。再者,藉由將各列設為與短邊方向平行,可在長方形形狀的電子零件2容易變形的長邊方向上產生彎曲。(3) Starting from the vent hole 313 close to the most raised peak portion of the holding surface 311 among the plurality of vent holes 313, the adjacent vent holes 313 are sequentially set to positive pressure. Therefore, from the part where the electronic component 2 first comes into contact with the substrate W, the air bubbles can be discharged gradually toward the outer edge and come into contact with the substrate W. Furthermore, by arranging each row parallel to the short side direction, the rectangular electronic component 2 can be bent in the long side direction where it is easily deformed.
(4)保持面311為山形。因此,藉由夾著中央的峰部分向兩側的外緣基板W逐漸變得平坦,在彎曲從電子零件2的中央恢復為平坦的同時與基板W相接的距離變短即可,因此捲入氣泡的擔憂也少。進而,藉由在保持面311的長邊形成山形,將連結峰部分的棱線設為短邊方向,在電子零件2的長邊方向上產生彎曲,因此電子零件2容易仿照保持面311。再者,也可將連結峰部分的棱線設置在保持面311的任一邊上。例如,在一端的短邊上設置棱線的情況下,藉由從一端向另一端依次設為正壓,電子零件2從一端向另一端與基板W相接。即使在此情況下,也可獲得可在排除氣泡的同時減少電子零件2的破損的效果。電子零件2不產生彎曲,相應地進一步減少破損之虞。例如,在如圖3的(C)那樣設置有開口312的列的情況下,自一端側的列[3]起,按照列[2]、列[1]、另一端側的列[2]、列[3]的順序從負壓切換為正壓。(4) The holding surface 311 is in the shape of a mountain. Therefore, the outer edges of the substrate W on both sides sandwiching the peak portion in the center gradually become flat, and the bending returns to flat from the center of the electronic component 2 and the distance between the electronic component 2 and the substrate W is shortened. Therefore, the winding There is also less worry about getting into air bubbles. Furthermore, by forming a mountain shape on the long side of the holding surface 311 and setting the ridge line connecting the peak portions in the short side direction, the electronic component 2 is curved in the long side direction, so the electronic component 2 can easily imitate the holding surface 311 . Furthermore, a ridge line connecting the peak portions may be provided on either side of the holding surface 311 . For example, when a ridge is provided on the short side of one end, the electronic component 2 is in contact with the substrate W from one end to the other end by setting the positive pressure sequentially from one end to the other end. Even in this case, it is possible to obtain an effect of eliminating air bubbles and reducing damage to the electronic component 2 . The electronic component 2 does not bend, thereby further reducing the risk of damage. For example, in the case where rows are provided with openings 312 as shown in FIG. 3(C) , starting from row [3] on one end side, row [2], row [1], and row [2] on the other end side are followed. , the sequence of column [3] switches from negative pressure to positive pressure.
[變形例] 本實施形態也能夠應用如下的變形例。 (1)保持面311也可為曲面。例如,如圖7所示,保持面311也可為如圓筒的側面的一部分那樣***的形狀。再者,所謂此處所說的圓筒的側面的一部分,也包含剖面為圓形、橢圓形、圓角長方形、跑道形的筒狀體的一部分的情況。由此,電子零件2的彎曲變得平緩,從而可抑制對電子零件2的影響。再者,所述實施方式中,在連結峰部分的棱線部分設置有開口312。但是,開口312未必需要設置在棱線上,也可設置在其附近。藉由自各開口312的通氣孔313中靠近棱線的地方起,依次從負壓設為正壓,可獲得與所述同樣的效果。另外,即使在此種曲面的情況下,也可將棱線部分設置在保持面311的任一邊上。 [Modification] The following modifications can also be applied to this embodiment. (1) The holding surface 311 may also be a curved surface. For example, as shown in FIG. 7 , the holding surface 311 may have a convex shape like a part of the side surface of the cylinder. In addition, the part of the side surface of the cylinder here also includes a part of a cylindrical body whose cross section is circular, elliptical, rounded rectangular, or track-shaped. Thereby, the bending of the electronic component 2 becomes gentle, and the influence on the electronic component 2 can be suppressed. Furthermore, in the embodiment, the opening 312 is provided in the ridge portion connecting the peak portions. However, the opening 312 does not necessarily need to be provided on the ridge line, and may be provided near it. The same effect as described above can be obtained by sequentially changing the negative pressure to the positive pressure from the position close to the ridge line in the ventilation hole 313 of each opening 312 . In addition, even in the case of such a curved surface, the ridge portion may be provided on either side of the holding surface 311 .
(2)在安裝工具31從拾取噴嘴21接收電子零件2時,也可自保持面311的一部分通氣孔313起,依次將鄰接的通氣孔313設為負壓。即,在安裝工具31接收電子零件2時,即使要使電子零件2仿照保持面311彎曲,若一部分浮起或偏靠,則產生無法進行電子零件2的位置識別等問題。另外,若要在產生電子零件2的浮起或偏靠的狀態下進行安裝,則在沿著外緣離開棱線時,有產生時機的偏移而捲入氣泡的可能性。(2) When the mounting tool 31 receives the electronic component 2 from the pickup nozzle 21 , starting from a portion of the vent holes 313 of the holding surface 311 , the adjacent vent holes 313 may be set to negative pressure in sequence. That is, when the electronic component 2 is received by the mounting tool 31 , even if the electronic component 2 is bent to follow the holding surface 311 , if a part of the electronic component 2 floats or is deflected, the position of the electronic component 2 cannot be recognized, etc. Problems arise. In addition, if the electronic component 2 is to be mounted in a state where it floats or is deflected, there is a possibility that air bubbles may be trapped due to timing deviation when the electronic component 2 leaves the ridge along the outer edge.
例如,可自多個通氣孔313中靠近保持面311的最***的峰部分的通氣孔313起,依次將鄰接的通氣孔313設為負壓。更具體而言,如圖8的(A)所示,當安裝工具31的保持面311接近電子零件2,檢測部322a檢測到接觸時,如圖8的(B)~圖8的(D)所示,自開口312的列[1]起,依次將列[2]、列[3](參照圖3的(B))設為負壓。由此,可以仿照保持面311的方式使電子零件2逐漸彎曲,同時安裝工具31從拾取噴嘴21接收電子零件2,因此抑制浮起或偏靠,從而可防止無法進行位置識別。另外,由於浮起或偏靠減少,因此在安裝電子零件2時,難以產生脫離的時機的偏移,可減少捲入氣泡的可能性。For example, the adjacent vent holes 313 may be set to negative pressure in sequence starting from the vent hole 313 close to the most raised peak portion of the holding surface 311 among the plurality of vent holes 313 . More specifically, as shown in FIG. 8(A) , when the holding surface 311 of the mounting tool 31 approaches the electronic component 2 and the detection part 322 a detects contact, as shown in FIG. 8(B) to FIG. 8(D) As shown in the figure, starting from the row [1] of the openings 312, the rows [2] and [3] (see (B) of FIG. 3 ) are set to negative pressure in sequence. Accordingly, the electronic component 2 can be gradually bent in the manner of the holding surface 311 while the mounting tool 31 receives the electronic component 2 from the pick-up nozzle 21, thereby suppressing floating or deflection and preventing position recognition from being impossible. In addition, since floating or deflection is reduced, when the electronic component 2 is mounted, the timing of detachment is less likely to shift, and the possibility of air bubbles being trapped can be reduced.
[其他實施形態] 本發明並不限定於所述實施形態,也包含下述所示的其他實施形態。另外,本發明也包含將所述實施形態及下述其他實施形態全部或任意組合後的形態。進而,可在不脫離發明的範圍內對這些實施形態進行各種省略或置換、變更,其變形也包含在本發明中。 [Other embodiments] The present invention is not limited to the above-described embodiment, but also includes other embodiments shown below. In addition, the present invention also includes an embodiment in which all or any combination of the above-described embodiments and other embodiments described below are included. Furthermore, various omissions, substitutions, and changes can be made to these embodiments without departing from the scope of the invention, and the modifications are also included in the present invention.
1:安裝裝置 2:電子零件 10:供給裝置 11:片材 12:供給載台 13:載台移動機構 20:拾取裝置 21:拾取噴嘴 21b:噴嘴孔 22:噴嘴移動機構 23:方向轉換部 24:上推銷 30:搭載裝置 31:安裝工具 32:工具移動機構 50:控制裝置 51:供給裝置控制部 52:上推銷控制部 53:拾取噴嘴控制部 54:安裝工具控制部 56:基板載台控制部 57:記憶部 60:基板載台 61:載台移動機構 221、321:滑動機構 221a、321a:支持框架 221b、321b:導軌 221c、321c:滑動器 222、322:升降機構 241:支撐體 311:保持面 312:開口 313:通氣孔 322a:檢測部 P1:供給位置 P2:交接位置 P3:安裝位置 S01、S02、S03、S04、S05、S06、S07、S08:步驟 W:基板 [1]、[2]、[3]:列 1: Install the device 2: Electronic parts 10: Supply device 11:Sheet 12: Supply carrier 13: Carrier moving mechanism 20: Pickup device 21: Pick up the nozzle 21b:Nozzle hole 22:Nozzle moving mechanism 23: Direction conversion part 24: Promotion on the Internet 30: Mounted device 31:Installation tools 32: Tool moving mechanism 50:Control device 51: Supply device control department 52: Go to the sales control department 53: Pick up nozzle control part 54: Installation tool control department 56:Substrate stage control section 57:Memory Department 60: Substrate carrier 61: Carrier moving mechanism 221, 321: Sliding mechanism 221a, 321a: Support framework 221b, 321b: guide rail 221c, 321c: slider 222, 322: Lifting mechanism 241:Support 311:Keep the surface 312:Open your mouth 313:Vent hole 322a: Inspection Department P1: supply position P2: handover position P3: Installation location S01, S02, S03, S04, S05, S06, S07, S08: steps W: substrate [1], [2], [3]: columns
圖1是表示實施形態的安裝裝置的正視圖。 圖2是表示實施形態的安裝裝置的平面圖。 圖3的(A)~圖3的(C)是表示實施形態的安裝工具的側視圖(A)、剖面圖(B)、底視圖(C)。 圖4是實施形態的控制裝置的功能框圖。 圖5是表示安裝實施形態的電子零件的順序的流程圖。 圖6的(A)~圖6的(E)是表示實施形態的電子零件的安裝實施方式的說明圖。 圖7是表示安裝工具的變形例的剖面圖。 圖8的(A)~圖8的(D)是表示利用安裝工具進行的電子零件的接收實施方式的說明圖。 Fig. 1 is a front view showing the mounting device according to the embodiment. Fig. 2 is a plan view showing the mounting device according to the embodiment. 3(A) to 3(C) are a side view (A), a cross-sectional view (B), and a bottom view (C) showing the mounting tool according to the embodiment. Fig. 4 is a functional block diagram of the control device according to the embodiment. FIG. 5 is a flowchart showing a procedure for mounting electronic components according to the embodiment. 6(A) to 6(E) are explanatory diagrams illustrating a mounting embodiment of electronic components according to the embodiment. FIG. 7 is a cross-sectional view showing a modified example of the mounting tool. 8(A) to 8(D) are explanatory diagrams showing an embodiment of receiving electronic components using a mounting tool.
2:電子零件 2: Electronic parts
31:安裝工具 31:Installation tools
311:保持面 311:Keep the surface
312:開口 312:Open your mouth
313:通氣孔 313:Vent hole
[1]、[2]、[3]:列 [1], [2], [3]: columns
Claims (6)
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JP2021055398A JP2022152575A (en) | 2021-03-29 | 2021-03-29 | Mounting tool and mounting device |
JP2021-055398 | 2021-03-29 |
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JPH10223692A (en) * | 1997-02-06 | 1998-08-21 | Pfu Ltd | Flip-chip mounting apparatus, chip vacuum-sucking tool attached to the apparatus and method of mounting bare chip |
JP2004022995A (en) * | 2002-06-19 | 2004-01-22 | Mitsui Chemicals Inc | Method and system for bonding semiconductor chip |
US20100083494A1 (en) * | 2003-12-31 | 2010-04-08 | Chippac, Inc. | Bonding Tool for Mounting Semiconductor Chips |
TW201631804A (en) * | 2014-11-26 | 2016-09-01 | Toray Industries | Collet, and apparatus and method for manufacturing light emitting device |
TW201826406A (en) * | 2016-11-30 | 2018-07-16 | 日商新川股份有限公司 | Bonding device and bonding method |
Family Cites Families (2)
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EP1321966B8 (en) | 2001-12-21 | 2007-05-23 | Oerlikon Assembly Equipment AG, Steinhausen | Gripping tool for mounting semiconductor chips |
JP2005150311A (en) | 2003-11-13 | 2005-06-09 | Nec Machinery Corp | Chip mounting method and apparatus thereof |
-
2021
- 2021-03-29 JP JP2021055398A patent/JP2022152575A/en active Pending
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2022
- 2022-03-23 CN CN202210290569.0A patent/CN115132614A/en active Pending
- 2022-03-24 KR KR1020220036594A patent/KR20220135189A/en not_active Application Discontinuation
- 2022-03-28 TW TW111111553A patent/TWI817416B/en active
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- 2024-05-23 KR KR1020240067051A patent/KR20240082285A/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10223692A (en) * | 1997-02-06 | 1998-08-21 | Pfu Ltd | Flip-chip mounting apparatus, chip vacuum-sucking tool attached to the apparatus and method of mounting bare chip |
JP2004022995A (en) * | 2002-06-19 | 2004-01-22 | Mitsui Chemicals Inc | Method and system for bonding semiconductor chip |
US20100083494A1 (en) * | 2003-12-31 | 2010-04-08 | Chippac, Inc. | Bonding Tool for Mounting Semiconductor Chips |
TW201631804A (en) * | 2014-11-26 | 2016-09-01 | Toray Industries | Collet, and apparatus and method for manufacturing light emitting device |
TW201826406A (en) * | 2016-11-30 | 2018-07-16 | 日商新川股份有限公司 | Bonding device and bonding method |
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TW202238750A (en) | 2022-10-01 |
CN115132614A (en) | 2022-09-30 |
KR20240082285A (en) | 2024-06-10 |
KR20220135189A (en) | 2022-10-06 |
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