TWI812161B - Integrated optical inspection apparatus - Google Patents
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Abstract
Description
本發明係有關於一種光學檢測設備,尤指一種整合型光學檢測設備。The present invention relates to an optical detection device, in particular to an integrated optical detection device.
隨著全自動化工業的進展,自動光學檢測(Automatic Optical Inspection, AOI)已經被普遍應用在電子業的電路板組裝生產線的外觀檢查並取代以往的人工目檢作業(Visual Inspection)。With the development of fully automated industry, Automatic Optical Inspection (AOI) has been widely used in the appearance inspection of circuit board assembly production lines in the electronics industry and replaced the previous manual visual inspection (Visual Inspection).
自動光學辨識系統是工業製程中常見的代表性手法,主要的做法是利用攝影裝置拍攝待測物的表面狀態,再以電腦影像處理技術來檢出異物或圖案異常等瑕疵,由於採用了非接觸式檢查,因此在產線過程中可以用以檢查半成品。The automatic optical identification system is a common representative method in industrial processes. The main method is to use a photography device to capture the surface state of the object to be tested, and then use computer image processing technology to detect defects such as foreign matter or pattern abnormalities. Due to the use of non-contact Type inspection, so it can be used to inspect semi-finished products during the production line.
因應IC產品對於低功耗、高效能、薄型尺寸的需求,先進封裝技術充分應用了半導體IC線路尺寸微縮、同質及異質整合、立體晶片堆疊的特性。順應著摩爾定律,先進封裝內的邏輯閘元件持續進行微型化是必然趨勢,對於自動光學檢測而言亦是一大挑戰。因應待測物對於高精確度檢測的需求,一般自動光學檢測系統會依據實際需求設置複數個站台以對於各項缺失及特性分別進行檢測,造成設備整體體積太大及成本上升的問題。In response to the needs of IC products for low power consumption, high performance, and thin size, advanced packaging technology fully utilizes the characteristics of semiconductor IC circuit size reduction, homogeneous and heterogeneous integration, and three-dimensional chip stacking. In compliance with Moore's Law, the continued miniaturization of logic gate components in advanced packages is an inevitable trend, which is also a big challenge for automatic optical inspection. In response to the demand for high-precision detection of objects to be tested, automatic optical inspection systems generally set up multiple stations according to actual needs to detect various defects and characteristics separately, causing the overall size of the equipment to be too large and the cost to increase.
本發明的主要目的,在於提供一種整合型光學檢測設備,包含光源裝置、攝影機裝置、光源濾鏡模組、攝影機濾鏡模組、以及影像檢測裝置。該光源裝置經由一照明光路,提供一照明光至一待測物上。該攝影機裝置可選擇性地於複數個攝影機切換任一個該攝影機於一成像光路上,以拍攝該待測物,產生一待測物影像。該光源濾鏡模組可選擇性地於複數個光源濾鏡切換任一個該光源濾鏡於該照明光路上,以過濾該照明光。該攝影機濾鏡模組可選擇性地於複數個攝影機濾鏡切換任一個該攝影機濾鏡於該成像光路上,以過濾該照明光。該影像檢測裝置耦合至該攝影機,以接收並分析該待測物影像,以獲得一影像檢測結果。其中該影像檢測結果包括一螢光影像檢測結果或/及一單色光影像檢測結果。The main purpose of the present invention is to provide an integrated optical detection equipment, including a light source device, a camera device, a light source filter module, a camera filter module, and an image detection device. The light source device provides an illuminating light to an object to be measured through an illuminating light path. The camera device can selectively switch any one of the plurality of cameras on an imaging optical path to capture the object to be measured and generate an image of the object to be measured. The light source filter module can selectively switch any one of the plurality of light source filters on the illumination light path to filter the illumination light. The camera filter module can selectively switch any one of the plurality of camera filters on the imaging light path to filter the illumination light. The image detection device is coupled to the camera to receive and analyze the image of the object to be tested to obtain an image detection result. The image detection result includes a fluorescence image detection result or/and a monochromatic light image detection result.
本發明係整合了外觀檢測、螢光檢測、以及複檢檢測三種檢測的平台,可以有效的縮減設備的體積。此外,本發明支援不同波長影像檢出、不同波長螢光檢出,並支援自動對焦功能,且本發明物鏡倍率選擇性高且突破次微米限制,相較於習知的技術具有優勢的功效。The invention integrates three detection platforms: appearance detection, fluorescence detection, and re-inspection detection, which can effectively reduce the size of the equipment. In addition, the present invention supports image detection at different wavelengths, fluorescence detection at different wavelengths, and supports an autofocus function. The objective lens of the present invention has high magnification selectivity and breaks through the sub-micron limit. It has superior effects compared to conventional technologies.
有關本發明之詳細說明及技術內容,現就配合圖式說明如下。再者,本發明中之圖式,為說明方便,其比例未必按實際比例繪製,而有誇大之情況,該等圖式及其比例非用以限制本發明之範圍。The detailed description and technical content of the present invention are described below with reference to the drawings. Furthermore, for the convenience of explanation, the proportions of the drawings in the present invention may not be drawn according to actual proportions, but may be exaggerated. These drawings and their proportions are not intended to limit the scope of the present invention.
此外,圖中各特徵與元件並未依實際比例繪製,其繪製方式僅是為了以最佳方式呈現與本發明相關的具體特徵與元件。此外,在不同圖式間係以相同或相似的元件符號指稱相同或相似的元件及部件。In addition, the features and components in the figures are not drawn to actual scale, but are drawn in a manner intended to best represent specific features and components relevant to the present invention. In addition, the same or similar reference symbols are used in different drawings to refer to the same or similar elements and components.
於本文中,除非上下文另有載明,則「包含」、「包括」、「具有」或「含有」係包含性或開放性,並不排除其他未闡述之元素或方法步驟。In this article, unless the context indicates otherwise, the words "includes", "includes", "has" or "contains" are inclusive or open-ended and do not exclude other unstated elements or method steps.
於本文中,「中」、「上」、「下」、「前」、「後」、「左」、「右」、「垂直」、「水平」、「頂」、「底」、「內」、「外」等用於指示方位或位置關係描述的用語為基於附圖所示的方位或位置關係,其僅係為了便於描述本發明和簡化描述,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。In this article, "middle", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner" ”, “outside” and other terms used to indicate the orientation or positional relationship description are based on the orientation or positional relationship shown in the drawings. They are only used to facilitate the description of the present invention and simplify the description, rather than indicating or implying the device or device referred to. Elements must have a specific orientation, be constructed and operate in a specific orientation and therefore are not to be construed as limitations of the invention.
於本文中,「設置」、「安裝」、「相連」、「連接」、「固定」等應做廣義理解,例如可以是固定連接、可拆卸連接、機械連接、直接相連、通過中間媒介間接相連等。對於本領域中具通常知識者而言,可以根據具體情況理解上述術語在本發明中的具體含義。In this article, "setting", "installation", "connection", "connection", "fixing", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a mechanical connection, a direct connection, or an indirect connection through an intermediate medium. wait. For those with ordinary knowledge in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
以下針對本發明的其中一實施例進行說明,請先參閱「圖1」,係為本發明中整合型光學檢測設備的方塊示意圖,如圖所示。The following is a description of one embodiment of the present invention. Please refer to "Figure 1" first, which is a block diagram of an integrated optical detection device in the present invention, as shown in the figure.
本實施例揭示一種整合型光學檢測設備100,所述的光學檢測系統100用以拍攝平台上的待測物W,經由拍攝待測物W獲得待測物W的影像,經由分析該待測物影像獲得影像檢測結果。所述的影像檢測裝置60於獲得待測物W的影像後,係依據待測物W的影像生成一影像檢測結果。於一實施例中,待測物W包括半導體裝置、半導體晶圓、半導體晶片、電路板、顯示面板或其他含有有機物的物體等,於本發明中不予以限制。This embodiment discloses an integrated
該光學檢測系統100包括光源裝置10、攝影機裝置20、光源濾鏡模組30、攝影機濾鏡模組40、物鏡裝置50、影像檢測裝置60、以及顯示裝置70。The
所述的光源裝置10經由照明光路,提供照明光至待測物上。於一實施例中,光源裝置10包括雷射光源,經由照明光路P,提供照明光至待測物上,雷射光源可以設計成位在待測物W的激發頻帶之中,以激發待測物W產生螢光。於另一實施例中,光源裝置10包括單色光源,經由照明光路P,提供照明光至待測物上,單色光源例如可以是白光、紅光、藍光、綠光等,於本發明中不予以限制。於一實施例中,光學檢測系統100進一步包括暗視野環形燈80,環設於待測物W的外周側。The light source device 10 provides illumination light to the object to be measured through an illumination light path. In one embodiment, the light source device 10 includes a laser light source, which provides illumination light to the object under test through the illumination light path P. The laser light source can be designed to be located in the excitation frequency band of the object under test W to excite the object under test. Object W produces fluorescence. In another embodiment, the light source device 10 includes a monochromatic light source, which provides illumination light to the object to be measured through the illumination light path P. The monochromatic light source can be, for example, white light, red light, blue light, green light, etc. In the present invention, Not restricted. In one embodiment, the
所述的攝影機裝置20可選擇性地於複數個攝影機切換任一個該攝影機於成像光路R上,以拍攝待測物W,產生待測物影像。於一實施例中,該些攝影機例如可以包括但不限定於線掃描攝影機(Line Scan Camera)及/或面掃描攝影機(Area Scan Camera),於本發明中不予以限制。The
所述的光源濾鏡模組30可選擇性地於複數個光源濾鏡切換任一個該光源濾鏡於該照明光路P上,以過濾該照明光。於一實施例中,光源濾鏡模組30包括複數個光源濾鏡、以及光源濾鏡切換裝置,光源濾鏡切換裝置可選擇性於複數個光源濾鏡切換任一個光源濾鏡於該照明光路P上;於一實施例中,複數個該光源濾鏡可以包括但不限定於第一激發光濾鏡、第二紅光濾鏡、第二綠光濾鏡、第二藍光濾鏡及第二白光濾鏡,於本發明中不予以限制。
The light
所述的攝影機濾鏡模組40可選擇性地於複數個攝影機濾鏡切換任一個該攝影機濾鏡於該成像光路R上,以過濾該照明光。於一實施例中,攝影機濾鏡模組40包括複數個攝影機濾鏡、以及攝影機濾鏡切換裝置,攝影機濾鏡切換裝置可選擇性於複數個該攝影機濾鏡切換任一個該攝影機濾鏡於該成像光路R上;於一實施例中,複數個攝影機濾鏡包括一第一激發光濾鏡、一第一紅光濾鏡、一第一綠光濾鏡、一第一藍光濾鏡及一第一白光濾鏡。
The
所述的物鏡裝置50可選擇性於複數個該物鏡切換任一個該物鏡於該成像光路R上。於一實施例中,該些物鏡個別的倍率係介於1倍至100倍之間,例如1倍、4倍、10倍、40倍、100倍等,於本發明中不予以限制。
The
所述的影像檢測裝置60耦合至攝影機裝置20的攝影機,以接收並分析該待測物影像,以獲得一影像檢測結果。影像檢測裝置60例如可以是包括處理器的任意裝置,處理器例如可以是中央處理單元(Central Processing Unit,CPU)、微處理器(Microprocessor)、數位訊號處理器(Digital Signal Processor,DSP)、可程式化控制器、可程式化邏輯裝置(Programmable Logic Device,PLD)或其他類似裝置或這些裝置的組合,本發明並不予以限制。所述的影像檢測結果例如可以是待測物W瑕疵的檢出、待測物W的瑕疵種類、待測物W的結構尺寸量測、待測物W的特性分析、或待測物W的結構特徵還原,於本發明中不予以限制。影像檢測的方式例如可以是傳統影像演算法、或是經由類神經網路(包括機器學
習(Machine Learning)、深度學習(Deep Learning)等)執行檢測,由於所述檢測技術非屬本發明所欲限制的範圍,在此即不再針對執行影像檢測的演算法進行多餘的說明。該影像檢測結果包括螢光影像檢測結果或/及單色光影像檢測結果。
The
所述的顯示裝置70連接至攝影機裝置20的面掃描攝影機,以顯示面掃描攝影機所拍攝的待測物影像。具體而言,顯示裝置70係可以做為複檢設備使用,供複檢人員通過顯示裝置70對待測物W進行目檢或複檢;於一實施例中,本發明的整合型光學檢測設備100可以先線掃描攝影機拍攝待測物W的影像進行檢測後,再經由面掃描攝影機拍攝待測物以進行複檢。
The
於一實施例中,光學檢測系統100通過光源濾鏡模組30切換至激發光濾鏡,於照明光路P上過濾照明光,使照明光的激發光波長成分通過至待測物W上,使待測物W產生螢光;另一方面,光學檢測系統100通過攝影機濾鏡模組40切換至螢光濾鏡,螢光濾鏡於成像光路R上過濾螢光,使螢光的波長成分通過,藉以通過攝影機裝置20產生螢光影像。
In one embodiment, the
於一實施例中,光學檢測系統100通過光源濾鏡模組30切換至第一紅光濾鏡、第一綠光濾鏡、第一藍光濾鏡或第一白光濾鏡,經由照明光路P過濾照明光,使照明光的紅光、綠光、藍光或白光波長成分通過至待測物W上;另一方面,光學檢測系統100通過攝影機濾鏡模組40切換至第二紅光濾鏡、第二綠光濾鏡、第二藍光濾鏡或第二白光濾鏡,以經由成像光路R過濾該照明光,使照明光的紅光、綠光、藍光或白光波長成分通過,藉以產生非螢光影像。
In one embodiment, the
以下針對本發明的整合型光學檢測設備10舉一具體實施例進行較為詳細的說明,請一併參閱「圖2」、「圖3」、「圖4」及「圖5」,係為本發明中整合型光學拍攝設備的外觀示意圖、側面示意圖、正面示意圖、以及剖面示意圖,如圖所示。The following is a detailed description of a specific embodiment of the integrated optical detection device 10 of the present invention. Please refer to "Fig. 2", "Fig. 3", "Fig. 4" and "Fig. 5". The appearance schematic, side schematic, front schematic, and cross-sectional schematic of the integrated optical photography equipment are as shown in the figure.
本實施例中的整合型光學檢測設備100主要包括設備支架SP、以及設置於設備支架SP上的光源裝置10、攝影機裝置20、光源濾鏡模組30、攝影機濾鏡模組40、物鏡裝置50、以及影像檢測裝置60。The integrated
所述的設備支架SP例如可以是任意檢測平台或加工機床上的支架,例如側面支架、龍門架、懸臂架、豎直架等,於本發明中不予以限制。值得注意的是,於本實施例的圖式中,雖然揭示光源裝置10、攝影機裝置20、光源濾鏡模組30、攝影機濾鏡模組40、以及物鏡裝置50設置於同一支架上,實務上,所述裝置亦可以分別設置於不同的設備支架上,並最終將複數個設備支架依序排列以組成所述的整合型光學檢測設備100,所述實施例之變化均屬本發明所欲保護的範圍。於本實施例中,所述的裝置由上而下的配置分別是攝影機裝置20、攝影機濾鏡模組40、光源裝置10、光源濾鏡模組30、以及物鏡裝置50 (光源裝置10及光源濾鏡模組30可以配置在同一層)。The equipment support SP can be, for example, a support on any inspection platform or processing machine tool, such as a side support, a gantry support, a cantilever support, a vertical support, etc., which are not limited in the present invention. It is worth noting that in the drawings of this embodiment, although it is revealed that the light source device 10, the
所述的攝影機裝置20設置於設備支架SP上,攝影機裝置20包括複數個攝影機21、以及一供複數個攝影機21設置的攝影機切換裝置22。攝影機切換裝置22於成像光路R所對應的拍攝位置及至少一第一預備位置上,切換攝影機21。於一應用實施例中,例如可以通過線掃描攝影機進行高精確度的檢測,再通過面掃描攝影機進行複檢程序,藉此於同一設備上實現影像檢測及影像複檢的功能。於一實施例中,攝影機切換裝置22係為承載複數個攝影機21的線性移動載台,或是其他任意的載具,例如XY載台、機械手臂、汽缸等,於本發明中不予以限制。於一實施例中,攝影機裝置20包括對應設置於線性移動載台(攝影機切換裝置22)與該些攝影機21之間的高度調節機構23,通過高度調節機構23可以手動的調整攝影機21的高度,例如手動滑台,以調整適當的焦距;於另一實施例中,高度調節機構23亦可以通過伺服馬達、或其他類似的驅動裝置調整攝影機21的升降,例如自動滑台,於本發明中不予以限制。The
於本發明中所述的「成像光路」,係指攝影機21移動於拍攝位置時,攝影機21朝向待測物W的光軸方向。此外,於本實施例中,待測物W與攝影機21之間的成像光路R雖然為直線,但於其他實施例中,成像光路R亦可以通過反射鏡、半反射鏡進行轉折,所述實施例的變化均屬本發明所欲保護的範圍,在此先行敘明。The "imaging light path" mentioned in the present invention refers to the optical axis direction of the camera 21 facing the object W when the camera 21 moves to the shooting position. In addition, in this embodiment, although the imaging light path R between the object W and the camera 21 is a straight line, in other embodiments, the imaging light path R can also be turned through a mirror or a half-reflecting mirror. Changes in the examples all fall within the protection scope of the present invention and are described in advance.
所述的攝影機濾鏡模組40設置於設備支架SP上相對於攝影機裝置20的下側。攝影機濾鏡模組40可選擇性地於複數個攝影機濾鏡41切換任一個攝影機濾鏡41於成像光路R上,以過濾該照明光。攝影機濾鏡模組40包括複數個攝影機濾鏡41以及攝影機濾鏡切換裝置42,攝影機濾鏡切換裝置42可選擇性於複數個該攝影機濾鏡41切換任一個攝影機濾鏡41於成像光路R上。攝影機濾鏡切換裝置42於成像光路R上及至少一第二預備位置上,切換攝影機濾鏡41。於一實施例中,複數個攝影機濾鏡41包括第一UV光濾鏡、第一紅光濾鏡、第一綠光濾鏡、第一藍光濾鏡及第一白光濾鏡,通過攝影機濾鏡切換裝置42,可以於上述的各種濾鏡中進行切換。於一實施例中,攝影機濾鏡切換裝置42包括步進馬達421、以及設置於步進馬達421驅動端的承載轉盤422,承載轉盤422上具有複數個設置孔423,分別供該些攝影機濾鏡41設置。具體而言,步進馬達驅動端係為步進馬達421輸出位置上的轉動軸心,通過步進馬達421旋轉承載轉盤422,以便將對應的濾鏡移動至成像光路R上;於本實施例中,攝影機濾鏡41於切換至工作位置時係直接對應至攝影機21的進光孔,所述實施例非屬本發明所欲限制的範圍。於另一實施例中,步進馬達421亦可以經由其他類型的馬達(例如伺服馬達)所取代,於本發明中不予以限制。The
所述的光源裝置10經由照明光路P,提供照明光至待測物W上。於本發明中所述的「照明光路」,係指光源裝置10的輸出光至待測物W位置上所經過的路徑。此外,於本實施例中,待測物W與光源裝置10之間的照明光路P雖然經由半反射鏡而呈L型轉折,但於其他實施例中,照明光路P在不遮蔽攝影機拍攝的情況下亦可以適當的調整照明光路P的方向,所述實施例的變化均屬本發明所欲保護的範圍,在此先行敘明。於本實施例中,照明光係以同軸光的形式提供至待測物W。具體而言,光源裝置的種類10包括光源11、以及至少一設置於成像方向及光源11出光方向之間的半反射鏡13(如圖5所示);於一實施例中,光源11例如可以但不限定於包括雷射光光源、單色光光源或其他類此的光源。半反射鏡13將光源11所提供的光轉換為與拍攝方向平行的同軸光。於一實施例中,雷射光光源例如可以包括但不限定於連續雷射器、脈衝雷射器、鎖相雷射器、或脈衝泵浦等,於本發明中不予以限制;該單色光光源例如可以包括但不限定於白光LED強光燈、鹵素燈、螢光燈、RGB燈等,任一可供檢測用並符合檢測需求的燈具皆可被設置為光源裝置10,於本發明中不予以限制。於一實施例中,為形成準直光。光源11與半反射鏡13之間進一步設置有一準直透鏡,經由準直透鏡將擴散光轉換為準直光。The light source device 10 provides illumination light to the object W through the illumination light path P. The "illumination light path" mentioned in the present invention refers to the path along which the output light of the light source device 10 reaches the position of the object W to be measured. In addition, in this embodiment, although the illumination light path P between the object W and the light source device 10 turns in an L shape through the half-reflecting mirror, in other embodiments, the illumination light path P does not block the camera when shooting. The direction of the illumination light path P can also be appropriately adjusted. The changes in the above embodiments all fall within the scope of protection of the present invention and will be described in advance. In this embodiment, the illumination light is provided to the object W in the form of coaxial light. Specifically, the type of light source device 10 includes a
所述的光源濾鏡模組30設置於設備支架SP上對應於光源裝置10的出光側。光源濾鏡模組30可選擇性地於複數個光源濾鏡31切換任一個光源濾鏡31於照明光路P上,以過濾照明光。光源濾鏡模組30複數個光源濾鏡31以及光源濾鏡切換裝置32,可選擇性於複數個光源濾鏡31切換任一個該光源濾鏡31於照明光路P上。光源濾鏡切換裝置32於光源裝置10的照明方向上及至少一第三預備位置上,切換光源濾鏡31。於一實施例中,複數個光源濾鏡31包括第二UV光濾鏡、第二紅光濾鏡、第二綠光濾鏡、第二藍光濾鏡及第二白光濾鏡,通過光源濾鏡切換裝置32,可以於上述的各種光源濾鏡31中進行切換。於一實施例中,光源濾鏡切換裝置32包括設置於任一設備支架SP上的步進馬達321、以及設置於步進馬達321驅動端的承載轉盤322。承載轉盤322上係具有複數個設置孔323分別供光源濾鏡31設置。具體而言,步進馬達321驅動端係為步進馬達321輸出位置上的轉動軸心,通過步進馬達321旋轉承載轉盤322,以便將對應的光源濾鏡31移動至攝影機21的拍攝方向上。於另一實施例中,步進馬達321亦可以經由其他類型的馬達(例如伺服馬達)所取代,於本發明中不予以限制。The light
於一實施例中,光學檢測系統100包括暗視野環形燈80設置於設備支架SP上,暗視野環形燈80係環設於待測物W的外周側,通過暗視野環形燈80提升微結構邊緣的亮度,增加對比度。於一實施例中,暗視野環形燈80係以水平徑向的方式設置於待測物W的外圍,且照明方向與待測物W的表面大致平行,以構成邊緣銳利化的顯示效果。In one embodiment, the
所述的物鏡裝置50可選擇性於複數個物鏡51切換任一個物鏡51於成像光路R上,物鏡裝置50設置於設備支架SP上相較於光源裝置10的下側並對應至待測物W設置平台的上側。物鏡裝置50包括複數個物鏡51、以及供複數個物鏡51設置的旋轉盤52,旋轉盤52上設置有複數個設置孔521,分別供該些物鏡51設置。物鏡裝置50於攝影機21的成像光路R上及至少一第四預備位置上,切換物鏡51。於一實施例中,複數個物鏡51個別的倍率係介於1倍至100倍之間。具體而言,物鏡51例如可以為1x物鏡、4x物鏡、10x物鏡、40x物鏡、100x物鏡等,所述物鏡51的數量以及物鏡51的倍率非屬本發明所欲限制的範圍,可以依照實際的需求做變更。於一實施例中,物鏡裝置50可以是承載複數個物鏡51的旋轉盤52,旋轉盤52例如可以經由手動旋轉或自動旋轉切換物鏡51以調整倍率,於本發明中不予以限制。於自動旋轉的實施例中,可以通過步進馬達、伺服馬達、或其他類似的裝置配合連動機構(例如齒輪)控制旋轉盤52旋轉。The
為了實現自動對焦的功能,於一實施例中,光學檢測系統100包括設置於設備支架SP上的對焦模組53、以及一設置於設備支架SP控制物鏡裝置50升降的移動載台54。移動載台54係依據對焦模組53的訊號調整於成像光路R上物鏡51與待測物W之間的距離。於一實施例中,移動載台54為一線性載台,於其他實施例中,移動載台54可藉由齒輪與齒條的配合實現調整物鏡裝置50升降的功能,移動載台54的實施方式可依實際需求而變更,於本發明中不予以限制。In order to realize the auto-focus function, in one embodiment, the
於本實施例中,各裝置(例如攝影機、濾鏡)之間的切換可以經由電腦、伺服器、或是可編程邏輯控制器(PLC)提供控制指令至線性馬達、步進馬達、伺服馬達、機械手臂、或汽缸等而執行,經由處理器進行運算後依據使用者的控制指令(例如經由人機介面)或是依據預先編程的程序執行相應的切換。In this embodiment, switching between various devices (such as cameras and filters) can be accomplished by providing control instructions to linear motors, stepper motors, servo motors, etc. through computers, servers, or programmable logic controllers (PLC). It is executed by a robot arm, cylinder, etc., and the processor performs calculations and then performs corresponding switching according to the user's control instructions (for example, through a human-machine interface) or according to a pre-programmed program.
關於攝影機裝置20的攝影機切換方式,請參閱「圖6」及「圖7」,係為攝影機的切換動作示意圖(一)及切換動作示意圖(二),如圖所示。Regarding the camera switching method of the
於本實施例中所述的攝影機裝置20主要包括兩種攝影機。依據攝影機數量的不同,攝影機切換裝置22停留的站點數量會隨之調整,此部分可以經由回授的馬達轉動行程或是編碼器確認,於本發明中不予以限制。當攝影機切換裝置22共同承載第一攝影機21A(例如線掃描攝影機)、第二攝影機21B(例如面掃描攝影機)的線性移動載台(如圖2所示)在位置A上時,此時第一攝影機21A係對準至拍攝位置A1上(成像光路R的第一端),而第二攝影機21B則對準至第一預備位置A2上;當攝影機切換裝置22收到切換指令時,攝影機切換裝置22將線性移動載台移動至位置B時,此時第二攝影機21B對準至拍攝位置A1,第一攝影機21A則對準至第一預備位置A3上。The
關於攝影機濾鏡模組40的濾鏡切換方式,請參閱「圖8」,係為攝影機濾鏡模組的切換動作示意圖,如圖所示。Regarding the filter switching method of the
於本實施例中,攝影機濾鏡模組40包括有五種攝影機端濾鏡,分別為第一UV光濾鏡41A、第一紅光濾鏡41B、第一綠光濾鏡41C、第一藍光濾鏡41D及第一白光濾鏡41E。於圖式中,第一UV光濾鏡41A係對準至拍攝位置B1(成像光路R)上,第一紅光濾鏡41B、第一綠光濾鏡41C、第一藍光濾鏡41D、以及第一白光濾鏡41E則分別對準至第二預備位置B2-B5上。當承載轉盤422轉動時(例如箭頭Ar1所指的方向),則各濾鏡的位置將會切換,例如如果移動切換指令為一個行程,第一UV光濾鏡41A將由拍攝位置B1移動至第二預備位置B2上,第一紅光濾鏡41B將由第二預備位置B2移動至第二預備位置B3,第一綠光濾鏡41C 將由第二預備位置B3移動至第二預備位置B4,第一藍光濾鏡41D將由第二預備位置B4移動至第二預備位置B5,第一白光濾鏡41E則由第二預備位置B5移動至拍攝位置B1;於兩個行程的情況時則移動兩個幅距,依此類推。除了上述的實施例外,承載轉盤422的轉動方向亦可以是與箭頭Ar1相反的方向,於本發明中不予以限制。In this embodiment, the
關於光源濾鏡模組30的濾鏡切換方式,請參閱「圖9」,係為光源濾鏡模組的切換動作示意圖,如圖所示。Regarding the filter switching method of the light
於本實施例中,光源濾鏡模組30包括有五種入光端濾鏡,分別為第二UV濾鏡31A、第二紅光濾鏡31B、第二綠光濾鏡31C、第二藍光濾鏡31D、以及第二白光濾鏡31E。於圖式中,第二UV濾鏡31A係對準至拍攝位置C1上,第二紅光濾鏡31B、第二綠光濾鏡31C、第二藍光濾鏡31D、以及第二白光濾鏡31E則分別對準至第三預備位置C2-C5上,當承載轉盤322轉動時(例如箭頭Ar2所指的方向),則各濾鏡的位置將會切換,例如如果移動切換指令為一個行程,第二UV濾鏡31A將由拍攝位置C1移動至第三預備位置C2上,第二紅光濾鏡31B將由第三預備位置C2移動至第三預備位置C3,第二綠光濾鏡31C將由第三預備位置C3移動至第三預備位置C4,第二藍光濾鏡31D將由第三預備位置C4移動至第三預備位置C5,第二白光濾鏡31E則由第三預備位置C5移動至拍攝方向C1;於兩個行程的情況時則移動兩個幅距,依此類推。除了上述的實施例外,承載轉盤322的轉動方向亦可以是與箭頭Ar2相反的方向,於本發明中不予以限制。In this embodiment, the light
關於物鏡裝置50的物鏡切換方式,請參閱「圖10」,係為物鏡的切換動作示意圖,如圖所示。Regarding the objective lens switching method of the
於本實施例中,物鏡裝置50包括有五種物鏡,分別為1x物鏡51A、4x物鏡51B、10x物鏡51C、40x物鏡51D、以及100x物鏡51E。於圖式中,4x物鏡51B係對準至拍攝位置D1上,1x物鏡51A、10x物鏡51C、40x物鏡51D、以及100x物鏡51E則分別對準至第四預備位置D5、D2-D4上,當旋轉盤52轉動時(例如箭頭Ar3所指的方向),則各物鏡的位置將會切換,例如當旋轉盤52逆時針旋轉一個行程時,4x物鏡51B將由拍攝位置D1移動至第四預備位置D2上,10x物鏡51C將由第四預備位置D2移動至第四預備位置D3,40x物鏡51D將由第四預備位置D3移動至第四預備位置D4,100x物鏡51E將由第四預備位置D4移動至第四預備位置D5,1x物鏡51A則由第四預備位置D5移動至拍攝方向D1;於兩個行程的情況時則移動兩個幅距,依此類推。除了上述的實施例外,承載轉盤52的轉動方向亦可以是與箭頭Ar3相反的方向,於本發明中不予以限制。In this embodiment, the
綜上所述,本發明係整合了外觀檢測、螢光檢測、以及複檢檢測三種檢測的平台,可以有效的縮減設備的體積。此外,本發明支援不同波長影像檢出、不同波長螢光檢出,並支援自動對焦功能,且本發明物鏡倍率選擇性高且突破次微米限制,相較於習知的技術具有優勢的功效。To sum up, the present invention integrates three detection platforms: appearance detection, fluorescence detection, and re-inspection detection, which can effectively reduce the size of the equipment. In addition, the present invention supports image detection at different wavelengths, fluorescence detection at different wavelengths, and supports an autofocus function. The objective lens of the present invention has high magnification selectivity and breaks through the sub-micron limit. It has superior effects compared to conventional technologies.
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能以此限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾,皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above. However, what is described above is only one of the preferred embodiments of the present invention. It should not be used to limit the scope of the present invention, that is, any application based on the patent scope of the present invention shall be equal. Changes and modifications should still fall within the scope of the patent of the present invention.
100:整合型光學檢測設備 W:待測物 10:光源裝置 11:光源 13:半反射鏡 20:攝影機裝置 21:攝影機 21A:第一攝影機 21B:第二攝影機 22:攝影機切換裝置 23:高度調節機構 A:位置 B:位置 A1:拍攝位置 A2-A3:第一預備位置 30:光源濾鏡模組 31:光源濾鏡 31A:第二UV濾鏡 31B:第二紅光濾鏡 31C:第二綠光濾鏡 31D:第二藍光濾鏡 31E:第二白光濾鏡 32:光源濾鏡切換裝置 321:步進馬達 322:承載轉盤 323:設置孔 C1:拍攝位置 C2-C5:第三預備位置 Ar2:箭頭 40:攝影機濾鏡模組 41:攝影機濾鏡 41A:第一激發光濾鏡 41B:第一紅光濾鏡 41C:第一綠光濾鏡 41D:第一藍光濾鏡 41E:第一白光濾鏡 42:攝影機濾鏡切換裝置 421:步進馬達 422:承載轉盤 423:設置孔 B1:拍攝位置 B2-B5:第二預備位置 50:物鏡裝置 51:物鏡 51A:1x物鏡 51B:4x物鏡 51C:10x物鏡 51D:40x物鏡 51E:100x物鏡 52:旋轉盤 521:設置孔 53:對焦模組 54:移動載台 D1:拍攝位置 D2-D5:第四預備位置 60:影像檢測裝置 70:顯示裝置 80:暗視野環形燈 SP:設備支架 R:成像光路 P:照明光路 100: Integrated optical inspection equipment W: object to be tested 10:Light source device 11:Light source 13: Half mirror 20:Camera rig 21:Camera 21A:First camera 21B: Second camera 22:Camera switching device 23:Height adjustment mechanism A: Location B: Location A1: Shooting location A2-A3: first ready position 30:Light source filter module 31:Light source filter 31A: Second UV filter 31B: Second red light filter 31C: Second green light filter 31D: Second blue light filter 31E: Second white light filter 32:Light source filter switching device 321: Stepper motor 322: Carrying turntable 323: Setting hole C1: Shooting location C2-C5: The third ready position Ar2: arrow 40:Camera filter module 41:Camera filter 41A: First excitation filter 41B: The first red light filter 41C: The first green light filter 41D: The first blue light filter 41E: The first white light filter 42:Camera filter switching device 421: Stepper motor 422: Carrying turntable 423: Setting hole B1: Shooting location B2-B5: Second preparation position 50:Objective lens device 51:Objective lens 51A:1x objective lens 51B:4x objective lens 51C:10x objective lens 51D:40x objective lens 51E:100x objective lens 52: Rotating disk 521: Setting hole 53:Focus module 54:Mobile carrier D1: Shooting location D2-D5: The fourth reserve position 60:Image detection device 70:Display device 80: Dark field ring light SP: Equipment stand R: Imaging light path P: Illumination light path
圖1,為本發明整合型光學檢測設備的方塊示意圖。Figure 1 is a block diagram of the integrated optical detection equipment of the present invention.
圖2,為本發明整合型光學檢測設備的外觀示意圖。Figure 2 is a schematic diagram of the appearance of the integrated optical detection equipment of the present invention.
圖3,為本發明整合型光學檢測設備的側面示意圖。Figure 3 is a schematic side view of the integrated optical detection equipment of the present invention.
圖4,為本發明整合型光學檢測設備的正面示意圖。Figure 4 is a schematic front view of the integrated optical detection equipment of the present invention.
圖5,為本發明整合型光學檢測設備的剖面示意圖。Figure 5 is a schematic cross-sectional view of the integrated optical detection equipment of the present invention.
圖6,為攝影機的切換動作示意圖(一)。Figure 6 is a schematic diagram of the camera switching action (1).
圖7,為攝影機的切換動作示意圖(二)。Figure 7 is a schematic diagram of the camera switching action (2).
圖8,為攝影機濾鏡模組的切換動作示意圖。Figure 8 is a schematic diagram of the switching action of the camera filter module.
圖9,為光源濾鏡模組的切換動作示意圖。Figure 9 is a schematic diagram of the switching action of the light source filter module.
圖10,為物鏡的切換動作示意圖。Figure 10 is a schematic diagram of the switching action of the objective lens.
100:整合型光學檢測設備 100: Integrated optical inspection equipment
W:待測物 W: object to be tested
11:光源 11:Light source
20:攝影機裝置 20:Camera rig
30:光源濾鏡模組 30:Light source filter module
40:攝影機濾鏡模組 40:Camera filter module
50:物鏡裝置 50:Objective lens device
60:影像檢測裝置 60:Image detection device
70:顯示裝置 70:Display device
R:成像光路 R: Imaging light path
P:照明光路 P: Illumination light path
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM467056U (en) * | 2013-06-25 | 2013-12-01 | Apex Biotechnology Corp | Apparatuses for optical inspecting biochemical test strips |
CN109791275A (en) * | 2016-09-30 | 2019-05-21 | 奥林巴斯株式会社 | Observe device |
TW201923337A (en) * | 2017-10-11 | 2019-06-16 | 日商住友化學股份有限公司 | Defect inspection apparatus, defect inspection method, and manufacturing method for film |
US20200217831A1 (en) * | 2014-07-21 | 2020-07-09 | 7386819 Manitoba Ltd. | Method for Bone Scan in Meat |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM467056U (en) * | 2013-06-25 | 2013-12-01 | Apex Biotechnology Corp | Apparatuses for optical inspecting biochemical test strips |
US20200217831A1 (en) * | 2014-07-21 | 2020-07-09 | 7386819 Manitoba Ltd. | Method for Bone Scan in Meat |
CN109791275A (en) * | 2016-09-30 | 2019-05-21 | 奥林巴斯株式会社 | Observe device |
TW201923337A (en) * | 2017-10-11 | 2019-06-16 | 日商住友化學股份有限公司 | Defect inspection apparatus, defect inspection method, and manufacturing method for film |
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