TWI799525B - 黏著劑組成物及使用該黏著劑組成物的附黏著劑層層積體 - Google Patents

黏著劑組成物及使用該黏著劑組成物的附黏著劑層層積體 Download PDF

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TWI799525B
TWI799525B TW108107109A TW108107109A TWI799525B TW I799525 B TWI799525 B TW I799525B TW 108107109 A TW108107109 A TW 108107109A TW 108107109 A TW108107109 A TW 108107109A TW I799525 B TWI799525 B TW I799525B
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Taiwan
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adhesive composition
adhesive
layer laminate
composition
adhesive layer
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TW108107109A
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TW201940634A (zh
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沖村祐彌
平川真
山田成志
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日商東亞合成股份有限公司
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    • C—CHEMISTRY; METALLURGY
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    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/16—Presence of ethen-propene or ethene-propene-diene copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00—Presence of graft polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
TW108107109A 2018-03-07 2019-03-04 黏著劑組成物及使用該黏著劑組成物的附黏著劑層層積體 TWI799525B (zh)

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Families Citing this family (11)

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Publication number Priority date Publication date Assignee Title
US11603466B2 (en) 2017-01-10 2023-03-14 Sumitomo Seika Chemicals Co.. Ltd. Epoxy resin composition
CN110531583B (zh) * 2019-09-14 2023-09-29 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层
JPWO2021112134A1 (zh) * 2019-12-04 2021-06-10
KR20220128469A (ko) * 2020-01-16 2022-09-20 스미토모 세이카 가부시키가이샤 수지 조성물
WO2021145240A1 (ja) * 2020-01-16 2021-07-22 住友精化株式会社 銅箔とエポキシ樹脂組成物層とを備えた積層体
KR102324559B1 (ko) * 2020-02-28 2021-11-10 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
KR102259097B1 (ko) * 2020-02-28 2021-06-02 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
TWI781394B (zh) * 2020-04-22 2022-10-21 三芳化學工業股份有限公司 聚丙烯積層材料及其製法
JP7348673B2 (ja) * 2021-12-03 2023-09-21 ニッカン工業株式会社 樹脂組成物、及び、これを用いたカバーレイフィルム、接着剤シート、樹脂付き金属箔、金属張積層板またはプリント配線板
JP7444319B1 (ja) 2023-05-30 2024-03-06 東洋紡エムシー株式会社 接着剤組成物、並びにこれを含有する接着シート、積層体およびプリント配線板
JP7444318B1 (ja) 2023-05-30 2024-03-06 東洋紡エムシー株式会社 接着剤組成物、並びにこれを含有する接着シート、積層体およびプリント配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201614027A (en) * 2014-08-27 2016-04-16 Toyo Boseki Low dielectric adhesive composition

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814459B2 (ja) * 1977-12-28 1983-03-19 住友化学工業株式会社 接着性樹脂組成物
US5091469A (en) * 1990-06-28 1992-02-25 Eastman Kodak Company Compatibilized epoxy/polyamide compositions containing polyolefins
JPH07235767A (ja) 1994-02-24 1995-09-05 Tokai Rubber Ind Ltd フレキシブル印刷回路基板、フレキシブル印刷配線板およびこれらに用いられる接着剤組成物
DE69514902T2 (de) * 1995-01-12 2000-10-05 Showa Denko Kk Klebstoffzusammensetzung und darauf basierendes Laminat und Herstellungsverfahren des Laminates
JP3184725B2 (ja) * 1995-01-19 2001-07-09 昭和電工株式会社 接着性樹脂組成物ならびにその積層体およびその製造方法
JPH10178060A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
JP2001354936A (ja) 2000-06-14 2001-12-25 Sumitomo Bakelite Co Ltd フレキシブル配線板用接着剤組成物
JP3621351B2 (ja) * 2001-02-08 2005-02-16 日東電工株式会社 熱反応性接着剤組成物および熱反応性接着フィルム
ES2456958T3 (es) 2003-04-01 2014-04-24 Besins Healthcare Luxembourg Sarl Formulaciones para prevención y tratamiento de cáncer de seno con 4-hidroxi tamoxifen
JP3849789B2 (ja) * 2003-10-20 2006-11-22 東洋紡績株式会社 積層体
JP2007002121A (ja) 2005-06-24 2007-01-11 Fujikura Ltd エポキシ系接着剤、カバーレイ、プリプレグ、金属張積層板、プリント配線基板
US7576443B2 (en) 2006-12-15 2009-08-18 General Electric Company Method and apparatus for generating electric power
JP5086666B2 (ja) * 2007-03-07 2012-11-28 積水フーラー株式会社 ホットメルト接着剤組成物
JP5532712B2 (ja) * 2009-07-10 2014-06-25 三菱化学株式会社 樹脂分散体組成物、及びそれを含有してなるプライマー、塗料、及びその積層体
JPWO2014147903A1 (ja) * 2013-03-22 2017-02-16 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP2014205790A (ja) * 2013-04-15 2014-10-30 住友化学株式会社 振動エネルギー吸収部材並びにこれからなる遮音部材及び振動吸収部材
JP6718148B2 (ja) * 2014-09-24 2020-07-08 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体
JP6383258B2 (ja) * 2014-11-07 2018-08-29 三井化学株式会社 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材
EP3342838A4 (en) * 2015-08-28 2019-03-13 DIC Corporation STRATIFICATION ADHESIVE, MULTILAYER FILM, AND SECONDARY BATTERY USING THE SAME
JP6288539B1 (ja) * 2016-06-24 2018-03-07 Dic株式会社 ラミネート用接着剤組成物、積層体、及び二次電池
JP2018135468A (ja) * 2017-02-22 2018-08-30 藤森工業株式会社 ホットメルト接着性樹脂フィルム、ホットメルト接着性樹脂積層体及び積層体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201614027A (en) * 2014-08-27 2016-04-16 Toyo Boseki Low dielectric adhesive composition

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WO2019172109A1 (ja) 2019-09-12
CN111801395B (zh) 2023-06-23
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US20210009865A1 (en) 2021-01-14
TW201940634A (zh) 2019-10-16
KR102647985B1 (ko) 2024-03-15
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