TWI797333B - cutting device - Google Patents

cutting device Download PDF

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Publication number
TWI797333B
TWI797333B TW108116728A TW108116728A TWI797333B TW I797333 B TWI797333 B TW I797333B TW 108116728 A TW108116728 A TW 108116728A TW 108116728 A TW108116728 A TW 108116728A TW I797333 B TWI797333 B TW I797333B
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Taiwan
Prior art keywords
holding
cutting
workpiece
jig
cutting blade
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TW108116728A
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Chinese (zh)
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TW202003149A (en
Inventor
楠欣浩
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/02—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage
    • B23D45/021—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage with the saw blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B23Q11/0046—Devices for removing chips by sucking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0092—Grinding attachments for lathes or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/01—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor for combined grinding of surfaces of revolution and of adjacent plane surfaces on work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Dicing (AREA)
  • Confectionery (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

[課題]提供一種切割裝置，其不用進行治具卡盤台的置換，而能夠容易地執行端面修正。[解決手段]具備：保持台30，其保持工件；切割刀片，其切割被保持在保持台30上的工件；以及，安裝凸緣24，其以端面24C將切割刀片夾持並固定在使切割刀片旋轉的主軸22的前端；其中，保持台30具備：保持治具34，其具有保持工件的保持面34a；多條閃避槽34c，其形成在對應於保持治具34中的工件之分割預定線的位置；以及，多個細孔34d，其形成在由閃避槽34c所劃分的各區域；並且保持台30設有端面修正治具100，其包含：研削磨石101，其在保持治具34上研削安裝凸緣24的端面24C；以及，磨石支撐構件102，其保持研削磨石101。[Problem] To provide a cutting device capable of easily performing end face correction without replacing a chuck table of a jig. [Solution means] equipped with: a holding table 30, which holds the workpiece; a cutting blade, which cuts the workpiece held on the holding table 30; The front end of the main shaft 22 where the blade rotates; wherein, the holding table 30 is equipped with: a holding fixture 34, which has a holding surface 34a for holding the workpiece; and a plurality of fine holes 34d, which are formed in each area divided by the dodging groove 34c; 34 on the end face 24C of the grinding mounting flange 24;

Description

切割裝置cutting device

本發明是關於一種切割裝置。The present invention relates to a cutting device.

通常，切割晶圓等工件之切割裝置，是藉由安裝凸緣將切割刀片固定在主軸的前端。安裝凸緣在使環狀的端面接觸切割刀片的一側面之狀態下，藉由固定螺帽夾持切割刀片。在此種安裝凸緣中，若在端面產生附著物或傷痕，則對切割刀片的夾持會變成局部的。因此，切割時切割刀片相對於旋轉軸變得容易晃動或傾斜旋轉，成為工件崩缺或切割刀片破損的原因。於是，定期地或在替換安裝凸緣時，實施所謂端面修正的作業，其使用具有研削磨石的端面修正治具研削安裝凸緣的端面，並使端面成為平整且與旋轉軸垂直的面。Generally, a cutting device for cutting workpieces such as wafers uses a mounting flange to fix the cutting blade on the front end of the main shaft. The mounting flange clamps the cutting blade by the fixing nut in a state where the ring-shaped end surface is in contact with one side surface of the cutting blade. In such a mounting flange, if a deposit or a flaw occurs on the end surface, the clamping of the cutting blade becomes partial. Therefore, the cutting blade tends to vibrate or rotate obliquely with respect to the rotating shaft during cutting, which causes chipping of the workpiece or breakage of the cutting blade. Therefore, periodically or when the mounting flange is replaced, a so-called end surface correction operation is carried out, which uses an end surface correction jig with a grinding stone to grind the end surface of the mounting flange so that the end surface becomes flat and perpendicular to the rotation axis.

在實施此種端面修正作業時，還設想為使端面修正治具吸引保持在切割加工時保持工件的卡盤台上。然而，端面修正治具比卡盤台小，而且卡盤台通常為多孔狀以整面吸附工件的構造。因此，將端面修正治具載置於卡盤台時會發生真空洩漏，而無法充分地吸附保持住端面修正治具。此外，若卡盤台的多孔表面損傷，會影響到工件加工時的平整度。從而，在實施端面修正作業時，已提出一種技術，其置換為在中央形成有真空槽的通用卡盤台，使端面修正治具吸附在此真空槽上（例如，參閱專利文獻1）。When carrying out such end surface correction work, it is also conceivable that the end surface correction jig is sucked and held on the chuck table that holds the workpiece during cutting. However, the end face correction jig is smaller than the chuck table, and the chuck table is usually porous in order to absorb the entire surface of the workpiece. Therefore, when the end surface correction jig is placed on the chuck table, a vacuum leak occurs, and the end surface correction jig cannot be sufficiently sucked and held. In addition, if the porous surface of the chuck table is damaged, it will affect the flatness of the workpiece during processing. Therefore, when carrying out the end surface correction work, a technique has been proposed which replaces it with a general-purpose chuck table with a vacuum groove formed in the center, and adsorbs the end surface correction jig to this vacuum groove (for example, refer to Patent Document 1).

此外，在切割加工用的卡盤台之外，也有提出一種切割裝置，其構成為設有尺寸比該卡盤台小的子卡盤台，並將端面修正治具載置於此子卡盤台之上（例如，參閱專利文獻2）。 [習知技術文獻] [專利文獻]In addition, in addition to the chuck table for cutting processing, there is also a cutting device that is provided with a sub-chuck table smaller in size than the chuck table, and the end surface correction jig is placed on the sub-chuck on the stage (for example, refer to Patent Document 2). [Prior art literature] [Patent Document]

[專利文獻1]日本特開2011-011299號公報 [專利文獻2]日本特開2011-255458號公報[Patent Document 1] Japanese Unexamined Patent Publication No. 2011-011299 [Patent Document 2] Japanese Unexamined Patent Publication No. 2011-255458

[發明所欲解決的課題] 然而，切割所謂的封裝基板作為工件的情況下，此封裝基板是保持在具有切割刀片的閃避槽之治具卡盤台（保持台）上。在此構成中，從通用卡盤台置換為治具卡盤台之後，需要對準閃避槽位置的操作，而有端面修正作業變得煩雜的問題。此外，在切割加工用的卡盤台之外設置子卡盤台的構成中，會有切割裝置的占據面積變大的問題。[Problems to be Solved by the Invention] However, in the case of dicing a so-called package substrate as a workpiece, the package substrate is held on a jig chuck table (holding table) having an escape groove for a dicing blade. In this configuration, after replacing the general-purpose chuck table with the jig chuck table, it is necessary to align the position of the dodging groove, and there is a problem that the end surface correction operation becomes complicated. In addition, in the configuration in which the sub-chuck table is provided in addition to the chuck table for cutting, there is a problem that the occupied area of the cutting device becomes large.

本發明係鑑於上述情況而完成，目的在於提供一種切割裝置，其不用進行治具卡盤台的置換，而能夠容易地執行端面修正。The present invention was made in view of the above circumstances, and an object of the present invention is to provide a cutting device capable of easily performing end surface correction without replacing a jig chuck table.

[解決課題的技術手段] 為解決上述課題並達成目的，本發明之切割裝置具備：保持台，其保持設定有交叉的多條分割預定線的工件；切割刀片，其切割被保持在該保持台上的工件；主軸，其使該切割刀片旋轉；以及，凸緣，其以端面將該切割刀片夾持並固定在該主軸的前端；其中，該保持台構成為包含：保持面，其保持工件；多條切割刀片用閃避槽，其形成在對應於保持在該保持面上的工件之該分割預定線的位置；多個吸引孔，其形成在由該切割刀片用閃避槽劃分的各區域中；負壓傳動部，其將負壓傳動至該吸引孔；研削磨石，其研削該凸緣的該端面；以及，磨石支撐構件，其保持該研削磨石。[Technical means to solve the problem] In order to solve the above problems and achieve the object, the cutting device of the present invention is provided with: a holding table, which holds a workpiece with a plurality of intersecting dividing lines set; a cutting blade, which cuts the workpiece held on the holding table; The cutting blade is rotated; and a flange clamps and fixes the cutting blade on the front end of the main shaft with an end surface; wherein the holding table is configured to include: a holding surface, which holds a workpiece; a plurality of cutting blades avoid a groove formed at a position corresponding to the planned division line of the workpiece held on the holding surface; a plurality of suction holes formed in each area divided by the cutting blade with an avoidance groove; a negative pressure transmission part of which negative pressure is transmitted to the suction hole; a grinding stone grinds the end face of the flange; and a grinding stone support member holds the grinding stone.

根據此構成，由於保持台構成為包含研削凸緣之端面的研削磨石以及保持研削磨石的磨石支撐構件，所以不用進行治具卡盤台的置換，即能夠容易地執行端面修正。此外，由於不需要另外準備子卡盤台，所以能夠防止切割裝置的占據面積擴大。According to this configuration, since the holding table includes the grinding stone for grinding the end surface of the flange and the grinding stone support member holding the grinding stone, end surface correction can be easily performed without replacing the jig chuck table. In addition, since it is not necessary to separately prepare a sub-chuck table, it is possible to prevent an increase in the occupied area of the cutting device.

在此構成中，該磨石支撐構件也可以配設在該保持面的高度之下，並以相向於該凸緣之端面的方式固定在該保持台的側面。In this configuration, the grinding stone supporting member may also be arranged below the height of the holding surface, and fixed to the side surface of the holding table so as to face the end surface of the flange.

[發明功效] 根據本發明，由於保持台構成為包含研削凸緣之端面的研削磨石以及保持研削磨石的磨石支撐構件，所以不用進行治具卡盤台的置換，即能夠容易地執行端面修正。此外，由於不需要另外準備子卡盤台，所以能夠防止切割裝置的占據面積擴大。[Efficacy of the invention] According to the present invention, since the holding table includes the grinding stone for grinding the end surface of the flange and the grinding stone supporting member holding the grinding stone, end surface correction can be easily performed without replacing the jig chuck table. In addition, since it is not necessary to separately prepare a sub-chuck table, it is possible to prevent an increase in the occupied area of the cutting device.

說明關於本發明之實施方式的切割裝置。本發明不為以下實施方式所記載之內容所限定。此外，對於以下所記載的構成要素，包含本領域的技術人員能輕易思及或實質相同者。進一步，以下所記載的構成可以作適當的組合。此外，在不脫離本發明主旨的範圍內，可以對構成進行各種的省略、置換或變更。A cutting device according to an embodiment of the present invention will be described. The present invention is not limited by the contents described in the following embodiments. In addition, components described below include those that can be easily conceived by those skilled in the art or that are substantially the same. Furthermore, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes can be made in the configuration without departing from the scope of the present invention.

圖1是顯示本實施方式之切割裝置之構成的外觀立體圖。圖2是示意性顯示工件的俯視圖。圖3是示意性顯示工件的仰視圖。切割裝置1是對工件11進行切割加工、將工件11分割為一個個晶片的裝置。在本實施方式中，工件11是所謂的元件封裝（封裝基板），如圖2及圖3所示，包含在俯視中形成為大致矩形的框體13。框體13是由例如銅等金屬、樹脂或者陶瓷等所構成，包含多個（本實施方式中為3個）元件區域15以及圍繞各元件區域15的外周剩餘區域17。FIG. 1 is an external perspective view showing the configuration of a cutting device according to this embodiment. Fig. 2 is a plan view schematically showing a workpiece. Fig. 3 is a bottom view schematically showing a workpiece. The dicing device 1 is a device for dicing the workpiece 11 and dividing the workpiece 11 into individual wafers. In the present embodiment, the workpiece 11 is a so-called element package (package substrate), and includes a frame 13 formed in a substantially rectangular shape in plan view, as shown in FIGS. 2 and 3 . The frame body 13 is made of, for example, metal such as copper, resin, or ceramics, and includes a plurality (three in this embodiment) of element regions 15 and a peripheral remaining region 17 surrounding each element region 15 .

元件區域15被以交叉的多條切割道（分割預定線）19進一步劃分為多個區域（本實施方式中為48個區域），各區域中配置有IC、LSI或者LED等元件（未圖示）。此外，在框體13的背面13b側設置有樹脂12，其覆蓋住各元件區域15的整個背面13b側，且將多個元件密封。此樹脂12形成為預定厚度，並從框體13的背面13b突出。此外，在框體13的正面13a側，設置有對應各元件的多個平台14。在各平台14的周圍，形成有多個電極焊墊(未圖示)。 The element area 15 is further divided into a plurality of areas (48 areas in this embodiment) by a plurality of intersecting dicing lines (planned dividing lines) 19, and components such as ICs, LSIs, or LEDs (not shown in the figure) are arranged in each area. ). In addition, resin 12 is provided on the rear surface 13b side of the frame body 13, covers the entire rear surface 13b side of each element region 15, and seals a plurality of elements. This resin 12 is formed to a predetermined thickness, and protrudes from the back surface 13 b of the frame body 13 . In addition, on the front surface 13a side of the housing 13, a plurality of platforms 14 corresponding to the respective components are provided. A plurality of electrode pads (not shown) are formed around each platform 14 .

工件11例如是從框體13的背面13b側將元件配置於各平台14上，並以金屬導線(未圖示)等將各元件的電極與配置在平台14周圍的電極焊墊連接之後，再以樹脂12將背面13b密封所得。藉由沿著切割道19將此工件11分割，能夠形成以樹脂密封的多個晶片。另外，工件11並不限於元件封裝(封裝基板)，也包含陶瓷基板、玻璃基板、半導體晶圓、光學元件晶圓等。 For the workpiece 11, for example, components are arranged on each platform 14 from the back surface 13b side of the frame body 13, and the electrodes of each component are connected to the electrode pads arranged around the platform 14 with metal wires (not shown) or the like, and then The rear surface 13b is sealed with resin 12. By dividing this workpiece 11 along dicing lines 19, a plurality of wafers sealed with resin can be formed. In addition, the workpiece 11 is not limited to an element package (package substrate), and includes ceramic substrates, glass substrates, semiconductor wafers, optical element wafers, and the like.

如圖1所示，切割裝置1具備：保持台(也稱作治具卡盤台)30，其吸引保持工件11；切割單元20，其將切割水供給至保持在保持台30上的工件11，同時以切割刀片21切割(加工)該工件11；加工進給單元(未圖示)，其使保持台30在X軸方向(加工進給方向)上移動；分度進給單元40，其使切割單元20在與X軸方向正交的Y軸方向(分度進給方向)上移動；以及，切入進給單元50，其使切割單元20在分別與X軸方向和Y軸方向正交的Z軸方向(垂直方向)上移動。 As shown in FIG. 1 , the cutting device 1 includes: a holding table (also referred to as a jig chuck table) 30 that attracts and holds the workpiece 11 ; and a cutting unit 20 that supplies cutting water to the workpiece 11 held on the holding table 30 , while cutting (processing) the workpiece 11 with the cutting blade 21; the processing feed unit (not shown), which moves the holding table 30 in the X-axis direction (processing feed direction); the index feed unit 40, which making the cutting unit 20 move in the Y-axis direction (index feed direction) orthogonal to the X-axis direction; Move in the Z-axis direction (vertical direction).

切割裝置1具備長方體狀的裝置本體2，在其上表面形成有在X軸方向延長的矩形開口2a。在此開口2a內，設置有保持台30、加工進給單元、覆蓋此加工進給單元的防水蓋3、以及連結此防水蓋3的一對蛇腹部4。保持台30具備：治具基座32，其具備2種吸引口；以及，保持治具34，其被裝設在此治具基座32的上表面32a並吸引保持工件11。此外，保持台30藉由未圖示的加工進給單元，在裝置本體2的上表面於X軸方向上移動自如，並且藉由未圖示的旋轉驅動源繞與Z軸方向平行的軸心旋轉自如。如圖5及圖6所示，保持治具34形成為大致矩形的平板狀，其上表面成為吸引保持工件11的保持面34a。 The cutting device 1 includes a rectangular parallelepiped device body 2, and a rectangular opening 2a extending in the X-axis direction is formed on the upper surface thereof. In this opening 2a, a holding table 30, a processing feeding unit, a waterproof cover 3 covering the processing feeding unit, and a pair of bellows 4 connecting the waterproof cover 3 are provided. The holding table 30 includes a jig base 32 provided with two types of suction ports, and a holding jig 34 mounted on the upper surface 32 a of the jig base 32 to suck and hold the workpiece 11 . In addition, the holding table 30 is freely movable in the X-axis direction on the upper surface of the device body 2 by an unillustrated machining feed unit, and rotates around an axis parallel to the Z-axis direction by an unillustrated rotational drive source. Rotate freely. As shown in FIGS. 5 and 6 , the holding jig 34 is formed in a substantially rectangular flat plate shape, and its upper surface serves as a holding surface 34 a for sucking and holding the workpiece 11 .

在保持面34a上，在對應工件11之切割道19的位置形成有閃避槽(切割刀片用閃避槽)34c。藉由此閃避槽34c，保持治具34的保持面34a被劃分為對應從工件11中分割出來的各晶片之多個區域。閃避槽34c的寬度比切割刀片21的寬度寬，且閃避槽34c的深度比切割刀片21的切入深度深。因此，在沿著切割道19切割工件11時，即使讓切割刀片21深深地切入，切割刀片21也不會與保持治具34干涉。另外，保持治具34形成為比閃避槽34c的深度厚。 On the holding surface 34a, an avoidance groove (evasion groove for cutting blade) 34c is formed at a position corresponding to the scribe line 19 of the workpiece 11 . With the dodging groove 34c, the holding surface 34a of the holding jig 34 is divided into a plurality of regions corresponding to each wafer separated from the workpiece 11 . The width of the dodging groove 34 c is wider than the width of the cutting blade 21 , and the depth of the dodging groove 34 c is deeper than the cutting depth of the cutting blade 21 . Therefore, when the workpiece 11 is cut along the scribe line 19 , even if the cutting blade 21 is deeply cut, the cutting blade 21 does not interfere with the holding jig 34 . In addition, the holding jig 34 is formed thicker than the depth of the escape groove 34c.

在藉由閃避槽34c劃分的各區域中，形成有上下貫穿保持治具34且開口於保持面34a上的細孔(吸引孔)34d。如圖5所示，當將保持治具34 放置於治具基座32的上表面32a時，各細孔34d與形成在治具基座32上表面32a側的中央部分之第1吸引口32b連通。 In each area partitioned by the avoidance groove 34c, a fine hole (suction hole) 34d penetrating the holding jig 34 up and down and opening on the holding surface 34a is formed. As shown in Figure 5, when holding the jig 34 When placed on the upper surface 32 a of the jig base 32 , each fine hole 34 d communicates with the first suction port 32 b formed in the central portion of the jig base 32 on the upper surface 32 a side.

第1吸引口32b通過第1電磁閥36a連接於吸引源(負壓傳動部)38。此吸引源38通過第1吸引口32b將負壓傳動到各細孔34d。因此，將工件11重疊在放置於治具基座32上表面32a之狀態下的保持治具34之保持面34a上，並將對應工件11之各晶片的區域對齊於各細孔34d之後，開啟第1電磁閥36a時，能夠以保持台30吸引保持工件11。此外，在治具基座32之上表面32a的外周部分，形成有用以將保持治具34裝設在治具基座32上的第2吸引口32c。此第2吸引口32c通過第2電磁閥36b連接於吸引源38。因此，使保持治具34的下表面34b接觸治具基座32的上表面32a，並開啟第2電磁閥36b時，能夠將保持治具34裝設在治具基座32的上表面32a上。 The first suction port 32b is connected to a suction source (negative pressure transmission unit) 38 through a first electromagnetic valve 36a. This suction source 38 transmits negative pressure to each fine hole 34d through the first suction port 32b. Therefore, after the workpiece 11 is superimposed on the holding surface 34a of the holding jig 34 placed on the upper surface 32a of the jig base 32, and after the regions of each wafer corresponding to the workpiece 11 are aligned with each of the fine holes 34d, the opening is performed. When the first electromagnetic valve 36 a is used, the workpiece 11 can be sucked and held by the holding table 30 . In addition, a second suction opening 32 c for mounting the holding jig 34 on the jig base 32 is formed on the outer peripheral portion of the upper surface 32 a of the jig base 32 . This 2nd suction port 32c is connected to the suction source 38 via the 2nd electromagnetic valve 36b. Therefore, when the lower surface 34b of the holding jig 34 contacts the upper surface 32a of the jig base 32 and the second solenoid valve 36b is opened, the holding jig 34 can be mounted on the upper surface 32a of the jig base 32. .

在裝置本體2的上表面，如圖1所示，設有沿著Y軸方向延伸並且跨過保持台30而配置的門型支撐構造5。分度進給單元40以及切入進給單元50設置於上述支撐構造5。分度進給單元40是藉由使切割單元20在與保持台30的保持面34a平行且與X軸方向正交的分度進給方向，即Y軸方向上移動，以將保持台30與切割單元20相對地沿著Y軸方向分度進給。如圖1所示，分度進給單元40具備：一對導軌41，其配置於支撐構造5上且在Y軸方向上延伸；滾珠螺桿42，其與該對導軌41平行地配設；以及，刀片移動基台43，其內部具有螺合於該滾珠螺桿42的螺帽(未圖示)，並沿著導軌41移動。在滾珠螺桿42的一端，連結有使該滾珠螺桿42旋轉的脈衝馬達(未圖示)，藉由滾珠螺桿42的旋轉，刀片移動基台43沿著導軌41在Y軸方向上移動。 On the upper surface of the device main body 2 , as shown in FIG. 1 , there is provided a gate-shaped support structure 5 extending in the Y-axis direction and straddling the holding table 30 . The index feed unit 40 and the plunging feed unit 50 are provided on the above-mentioned support structure 5 . The index feeding unit 40 moves the cutting unit 20 in the index feeding direction parallel to the holding surface 34a of the holding table 30 and perpendicular to the X-axis direction, that is, the Y-axis direction, so that the holding table 30 and The cutting unit 20 is relatively indexed and fed along the Y-axis direction. As shown in FIG. 1 , the index feed unit 40 includes: a pair of guide rails 41 arranged on the support structure 5 and extending in the Y-axis direction; a ball screw 42 arranged parallel to the pair of guide rails 41; , the blade moving base 43 has a nut (not shown) screwed on the ball screw 42 inside, and moves along the guide rail 41 . A pulse motor (not shown) for rotating the ball screw 42 is connected to one end of the ball screw 42 , and the blade moving base 43 moves along the guide rail 41 in the Y-axis direction by the rotation of the ball screw 42 .

切入進給單元50藉由使切割單元20在與保持台30的保持面34a正交的切入進給方向，即Z軸方向上移動，以將保持台30與切割單元20相對地沿著Z軸方向切入進給。切入進給單元50具備：一對導軌51，其配置於刀片移動基台43上且在Z軸方向上延伸；滾珠螺桿52，其與該對導軌51平行地配設；以及，切入移動基台53，其內部具有螺合於該滾珠螺桿52的螺帽(未圖示)，並沿著導軌51移動。在此切入移動基台53上支撐著上述切割單元20。此外，在滾珠螺桿52的一端，連結有使該滾珠螺桿52旋轉的脈衝馬達54，藉由滾珠螺桿52的旋轉，切入移動基台53沿著導軌51在Z軸方向上移動。The cutting feed unit 50 moves the cutting unit 20 in the cutting feeding direction perpendicular to the holding surface 34a of the holding table 30, that is, the Z-axis direction, so that the holding table 30 and the cutting unit 20 are opposed to each other along the Z-axis. Direction plunge feed. The cutting feed unit 50 includes: a pair of guide rails 51 arranged on the blade moving base 43 and extending in the Z-axis direction; a ball screw 52 arranged parallel to the pair of guide rails 51; and a cutting moving base 53 , which has a nut (not shown) screwed on the ball screw 52 inside, and moves along the guide rail 51 . The above-mentioned cutting unit 20 is supported on the cutting mobile base 53 . Also, a pulse motor 54 for rotating the ball screw 52 is connected to one end of the ball screw 52 , and the cutting movement base 53 moves in the Z-axis direction along the guide rail 51 by the rotation of the ball screw 52 .

切割單元20藉由分度進給單元40以及切入進給單元50，可以將切割刀片21定位在保持台30之保持面34a的任意位置。如圖6所示，切割單元20具備外殼23、主軸22、安裝凸緣（凸緣）24、切割刀片21以及固定螺帽25。此外，雖省略了圖式，但切割單元20具備有在切割加工時分別朝向切割刀片21的刀鋒和加工點供給切割水的噴嘴。The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 34 a of the holding table 30 through the index feeding unit 40 and the cutting feeding unit 50 . As shown in FIG. 6 , the cutting unit 20 includes a housing 23 , a main shaft 22 , a mounting flange (flange) 24 , a cutting blade 21 , and a fixing nut 25 . In addition, although illustration is omitted, the cutting unit 20 includes nozzles for supplying cutting water toward the edge of the cutting blade 21 and the processing point during the cutting process.

切割刀片21為所謂的輪轂型（hub）刀片，固定在以金屬（例如鋁）所形成的圓盤狀基台21A之外周，並具備切割工件11之圓環狀的切割刃21B。切割刃21B由金剛石或CBN（Cubic Boron Nitide；立方氮化硼）等的磨粒與金屬或樹脂等的黏合材（結合材）所組成並形成預定的厚度。另外，作為切割刀片，亦可使用僅以切割刃構成的墊圈型（washer）刀片。The cutting blade 21 is a so-called hub blade, fixed to the outer periphery of a disc-shaped base 21A formed of metal (for example, aluminum), and has an annular cutting edge 21B for cutting the workpiece 11 . The cutting edge 21B is composed of abrasive grains such as diamond or CBN (Cubic Boron Nitide; cubic boron nitride) and a bonding material (bonding material) such as metal or resin, and has a predetermined thickness. In addition, as a cutting blade, a washer type (washer) blade constituted only of a cutting edge may be used.

主軸22是藉由使切割刀片21旋轉以切割工件11。主軸22容納於主軸外殼23內，此外殼23被切入進給單元50的切入移動基台53所支撐。切割單元20的主軸22以及切割刀片21的軸心設定成與Y軸方向平行。此外，主軸22的一端側自外殼23的一端部向外部突出，並且在主軸22的另一端側，連結有用以使該主軸22旋轉的馬達（未圖示）。又，在主軸22的一端部（前端）的外周上裝設有安裝凸緣24。The spindle 22 cuts the workpiece 11 by rotating the cutting blade 21 . The main shaft 22 is accommodated in a main shaft housing 23 supported by a cutting movement base 53 of the cutting feeding unit 50 . The axis center of the main shaft 22 of the cutting unit 20 and the cutting blade 21 is set to be parallel to the Y-axis direction. In addition, one end of the main shaft 22 protrudes outward from one end of the casing 23 , and a motor (not shown) for rotating the main shaft 22 is connected to the other end of the main shaft 22 . Furthermore, a mounting flange 24 is attached to the outer periphery of one end portion (tip end) of the main shaft 22 .

安裝凸緣24支撐切割刀片21。安裝凸緣24為金屬製，具備有裝設在主軸22一端部的外周上的圓筒狀的凸起部24A，以及從凸起部24A的外周面向徑方向外側延伸的凸緣部24B。安裝凸緣24是利用主軸22的一端部嵌入凸起部24A內，且螺栓26擰入主軸22的一端部，而固定在主軸22上。此外，切割刀片21嵌入於凸起部24A的外周部，且固定螺帽25螺合於此凸起部24A的外周。藉此，以固定螺帽25和安裝凸緣24將切割刀片21的基台21A夾持並固定。在安裝凸緣24的凸緣部24B上，形成有與切割刀片21的基台21A抵接以支撐切割刀片21的端面24C。此外，如圖1所示，切割單元20上固定有拍攝工件11上表面的攝像部29，以一體地移動。攝像部29具備CCD攝影機，其拍攝被保持在保持台30上的加工前的工件11的應分割區域。CCD攝影機拍攝被保持在保持台30的工件11，以得到用以執行對準的影像，該對準是進行工件11與切割刀片21的對位。The mounting flange 24 supports the cutting blade 21 . The attachment flange 24 is made of metal and includes a cylindrical boss 24A attached to the outer periphery of one end of the main shaft 22 , and a flange 24B extending radially outward from the outer peripheral surface of the boss 24A. The mounting flange 24 is fixed to the main shaft 22 by inserting one end of the main shaft 22 into the protrusion 24A, and screwing a bolt 26 into one end of the main shaft 22 . In addition, the cutting blade 21 is embedded in the outer periphery of the protrusion 24A, and the fixing nut 25 is screwed on the outer periphery of the protrusion 24A. Thereby, the base 21A of the cutting blade 21 is sandwiched and fixed by the fixing nut 25 and the mounting flange 24 . An end surface 24C that abuts against the base 21A of the cutting blade 21 to support the cutting blade 21 is formed on the flange portion 24B of the attachment flange 24 . In addition, as shown in FIG. 1 , an imaging unit 29 for imaging the upper surface of the workpiece 11 is fixed to the cutting unit 20 so as to move integrally. The imaging unit 29 includes a CCD camera, and images the regions to be divided of the unprocessed workpiece 11 held on the holding table 30 . The CCD camera photographs the workpiece 11 held on the holding table 30 to obtain an image for performing alignment between the workpiece 11 and the cutting blade 21 .

此外，如上所述，切割刀片21是以固定螺帽25和安裝凸緣24的端面24C將切割刀片21的基台21A夾持以固定。在此，例如，在由於形成基台21A的鋁金屬之部分附著在安裝凸緣24的端面24C上，而使安裝凸緣24的端面24C不平整的情況下，或是當端面24C與主軸22的軸心間的角度非直角的情況下，在主軸22旋轉時有可能會產生切割刀片21晃動、無法精密地切割的問題。因此，切割裝置1具備修正安裝凸緣24之端面24C的端面修正治具100。此端面修正治具100定期地，或在替換安裝凸緣24時，研削此安裝凸緣24的端面24C，以將此端面24C與主軸22的軸心間的角度修正為直角的平面。In addition, as described above, the cutting blade 21 is fixed by holding the base 21A of the cutting blade 21 between the fixing nut 25 and the end surface 24C of the mounting flange 24 . Here, for example, in the case where the end surface 24C of the mounting flange 24 is uneven due to the part of the aluminum metal forming the base 21A adhering to the end surface 24C of the mounting flange 24, or when the end surface 24C is in contact with the main shaft 22 In the case where the angle between the shaft centers is not a right angle, the cutting blade 21 may vibrate when the main shaft 22 rotates, making it impossible to cut precisely. Therefore, the cutting device 1 includes the end surface correction jig 100 for correcting the end surface 24C of the attachment flange 24 . The end face correction jig 100 grinds the end face 24C of the mounting flange 24 periodically or when the mounting flange 24 is replaced, so as to correct the angle between the end face 24C and the axis of the main shaft 22 into a right-angled plane.

在本實施方式中，如圖4所示，端面修正治具100設置於保持台30的保持治具34上。具體而言，端面修正治具100設置於保持治具34中未形成閃避槽34c的一角部34f，以成為不會與閃避槽34c干涉。端面修正治具100構成為具備：研削磨石101，其研削安裝凸緣24的端面24C；磨石支撐構件102，其支撐（保持）此研削磨石101；以及，固定螺絲103，其將該些研削磨石101和磨石支撐構件102固定於保持治具34。In this embodiment, as shown in FIG. 4 , the end surface correction jig 100 is installed on the holding jig 34 of the holding table 30 . Specifically, the end face correcting jig 100 is provided at a corner portion 34f of the holding jig 34 where the dodging groove 34c is not formed so as not to interfere with the dodging groove 34c. The end surface correcting jig 100 is configured to include: a grinding stone 101 that grinds the end surface 24C of the mounting flange 24; a grinding stone support member 102 that supports (holds) the grinding stone 101; and a fixing screw 103 that places the The grinding stones 101 and the stone supporting member 102 are fixed to the holding jig 34 .

在保持治具34的一角部34f，如圖7所示，形成有比保持面34a低的段部34g，藉由此段部34g與磨石支撐構件102夾持研削磨石101。此磨石支撐構件102以相向於安裝凸緣24的端面24C的方式，固定在保持治具34（保持台30）的側面。此外，在本實施方式中，將磨石支撐構件102固定在段部34g時，磨石支撐構件102的上表面102a與保持面34a齊平或比保持面低。因此，能夠防止磨石支撐構件102阻礙到將工件11保持在保持治具34的保持面34a，並對工件11施行切割加工的一系列操作。此外，固定螺絲103通過形成在磨石支撐構件102的貫穿孔（未圖示）而固定在段部34g。由於固定螺絲103的頭部容納在該貫穿孔內，因此能夠防止此頭部阻礙對工件11施行切割加工的一系列操作。此外，磨石支撐構件也可以具備夾持研削磨石101的上部塊與下部塊，以將研削磨石101夾持在與該上部塊之間的狀態將下部塊固定在段部34g。根據此構成，變得容易在保持治具34的保持面34a上形成上述段部34g。At one corner 34f of the holding jig 34, as shown in FIG. This grindstone supporting member 102 is fixed to the side surface of the holding jig 34 (holding table 30 ) so as to face the end surface 24C of the attachment flange 24 . In addition, in the present embodiment, when the grindstone support member 102 is fixed to the step portion 34g, the upper surface 102a of the grindstone support member 102 is flush with the holding surface 34a or lower than the holding surface. Therefore, it is possible to prevent the grindstone support member 102 from interfering with a series of operations of holding the workpiece 11 on the holding surface 34 a of the holding jig 34 and cutting the workpiece 11 . In addition, the fixing screw 103 is fixed to the segment part 34g through the through-hole (not shown) formed in the grindstone support member 102. As shown in FIG. Since the head of the fixing screw 103 is accommodated in the through hole, it is possible to prevent the head from hindering a series of operations of cutting the workpiece 11 . In addition, the grindstone support member may include an upper block and a lower block for sandwiching the grinding stone 101, and the lower block may be fixed to the step portion 34g with the grinding stone 101 sandwiched between the upper block. According to this structure, it becomes easy to form the said step part 34g on the holding surface 34a of the holding jig 34. As shown in FIG.

接著，說明本實施方式的端面修正之作業流程。端面修正是定期地，或在替換切割單元20的安裝凸緣24時進行。操作員停止切割裝置1的運轉，並卸除切割單元20的固定螺帽25和切割刀片21（圖6）。此外，也可以是從主軸22卸除安裝凸緣24，並將新的安裝凸緣24裝設在主軸22上的狀態。在這些狀態中，如圖7所示，安裝凸緣24成為端面24C露出的狀態。Next, the operation flow of the end face correction in this embodiment will be described. Face correction is performed periodically, or when the mounting flange 24 of the cutting unit 20 is replaced. The operator stops the operation of the cutting device 1 and removes the fixing nut 25 and the cutting blade 21 of the cutting unit 20 ( FIG. 6 ). In addition, the mounting flange 24 may be removed from the main shaft 22 and a new mounting flange 24 may be attached to the main shaft 22 . In these states, as shown in FIG. 7 , the mounting flange 24 is in a state where the end surface 24C is exposed.

接著，使分度進給單元40與切入進給單元50動作，並將切割單元20定位在面對端面修正治具100的研削磨石101的位置。然後，使分度進給單元40動作，如圖7所示，使切割單元20在Y軸方向上分度進給，直到安裝凸緣24的端面24C與研削磨石101接觸的預定位置為止。 Next, the index feed unit 40 and the plunging feed unit 50 are operated, and the cutting unit 20 is positioned at a position facing the grinding stone 101 of the end face correction jig 100 . Then, the index feeding unit 40 is operated, and the cutting unit 20 is indexed in the Y-axis direction as shown in FIG.

接著，使主軸22旋轉，並且以分度進給單元40將安裝凸緣24在Y軸方向上僅進給預先設定的研削距離。再來，藉由加工進給單元，使保持台30即研削磨石101在X軸方向上能接觸到端面24C的預定範圍內來回移動，同時以研削磨石101研削安裝凸緣24的端面24C。如此一來，能夠使安裝凸緣24的端面24C平整並且將與主軸22的軸心間的角度修正為直角。 Next, while the spindle 22 is rotated, the index feed unit 40 feeds the attachment flange 24 by a predetermined grinding distance in the Y-axis direction. Next, the holding table 30, that is, the grinding stone 101, moves back and forth within a predetermined range in the X-axis direction within a predetermined range in which the grinding stone 101 is used to grind the end surface 24C of the mounting flange 24 by the machining feed unit. . In this way, the end surface 24C of the attachment flange 24 can be flattened and the angle with the axis center of the main shaft 22 can be corrected to a right angle.

如以上所述，本實施方式的切割裝置1具備：保持台30，其保持設定有交叉的多條切割道19之工件11；切割刀片21，其切割被保持在保持台30上的工件11；主軸22，其使切割刀片21旋轉；以及，安裝凸緣24，其以端面24C將切割刀片21夾持並固定在主軸22的前端；其中，保持台30具備：保持治具34，其具有保持工件11的保持面34a；多條閃避槽34c，其形成在對應於保持在保持面34a上的工件11之切割道19的位置；多個細孔34d，其形成在由閃避槽34c所劃分的各區域；以及，吸引源38，其將負壓傳動至細孔34d；並且保持台30構成為設有端面修正治具100，該端面修正治具100包含：研削磨石101，其在保持治具34上研削安裝凸緣24的端面24C；以及，磨石支撐構件102，其保持研削磨石101。 As described above, the cutting device 1 of the present embodiment includes: a holding table 30 that holds the workpiece 11 provided with a plurality of intersecting cutting lines 19; a cutting blade 21 that cuts the workpiece 11 held on the holding table 30; The main shaft 22 rotates the cutting blade 21; and the mounting flange 24 clamps and fixes the cutting blade 21 on the front end of the main shaft 22 with an end surface 24C; wherein the holding table 30 has: a holding fixture 34, which has a holding The holding surface 34a of the workpiece 11; a plurality of dodging grooves 34c formed at positions corresponding to the cutting paths 19 of the workpiece 11 held on the holding surface 34a; Each area; and, the suction source 38, which transmits negative pressure to the fine hole 34d; and the holding table 30 is configured to be provided with an end surface correction jig 100, which includes: a grinding grindstone 101, which is held the end surface 24C of the grinding mounting flange 24 on the tool 34;

根據此構成，由於設置有端面修正治具100，其包含在保持治具34上研削安裝凸緣24的端面24C之研削磨石101以及保持研削磨石101之磨石支撐構件102，所以不用進行具有保持治具34的保持台30的置換，即能夠容易地執行安裝凸緣24的端面24C的修正。此外，由於不需要如同以往的構成，例如另外準備保持端面修正治具的子卡盤台，所以能夠防止切割裝置1的占據面積擴大。 According to this configuration, since the end surface correction jig 100 is provided, which includes the grinding stone 101 for grinding the end surface 24C of the mounting flange 24 on the holding jig 34 and the grinding stone support member 102 for holding the grinding stone 101, it is not necessary to perform Replacement of the holding table 30 having the holding jig 34 , that is, correction of the end surface 24C of the mounting flange 24 can be easily performed. In addition, since it is not necessary to separately prepare a sub-chuck table for holding the end face correction jig in a conventional configuration, it is possible to prevent an increase in the occupied area of the cutting device 1 .

此外，根據本實施方式，磨石支撐構件102配設在保持治具34的保持面34a的高度之下，由於是以相向於安裝凸緣24的端面24C的方式固定在保持治具34的側面，所以能夠防止磨石支撐構件102(端面修正治具100)阻礙對於被保持在保持面34a上的工件施行切割加工的一系列操作。因此，能夠在將磨石支撐構件102（端面修正治具100）裝設在保持治具34上的狀態下，進行工件11的切割加工。In addition, according to the present embodiment, the grindstone supporting member 102 is arranged below the height of the holding surface 34 a of the holding jig 34 , and is fixed to the side surface of the holding jig 34 so as to face the end surface 24C of the mounting flange 24 . , so it is possible to prevent the grindstone support member 102 (end face correction jig 100) from hindering a series of operations of cutting the workpiece held on the holding surface 34a. Therefore, cutting of the workpiece 11 can be performed with the grindstone support member 102 (end surface correction jig 100 ) mounted on the holding jig 34 .

接著，說明另一實施方式。圖8是顯示利用另一實施方式之端面修正治具進行安裝凸緣的端面修正之狀態的側視圖。在上述實施方式中，端面修正治具100是構成為設在保持台30的保持治具34上，但在另一實施方式中，端面修正治具100A是設在保持台30的治具基座32上。由於端面修正治具100A的構成構件與上述構成相同，所以附上相同符號並省略說明。Next, another embodiment will be described. Fig. 8 is a side view showing a state in which an end surface correction of a mounting flange is performed using an end surface correction jig according to another embodiment. In the above-mentioned embodiment, the end surface correction jig 100 is configured to be provided on the holding jig 34 of the holding table 30 , but in another embodiment, the end surface correction jig 100A is provided on the jig base of the holding table 30 32 on. Since the constituent members of the end surface correction jig 100A are the same as those described above, the same reference numerals are assigned and descriptions thereof are omitted.

在另一實施方式中，端面修正治具100A設在治具基座32的一角部32f。此一角部32f對應於保持治具34之一角部34f的位置。在治具基座32的一角部32f，如圖8所示，形成有比治具基座32的上表面32a低的段部32g，藉由此段部32g與磨石支撐構件102夾持研削磨石101。此磨石支撐構件102以相向於安裝凸緣24的端面24C的方式，固定在治具基座32（保持台30）的側面。此外，在本實施方式中，將磨石支撐構件102固定在段部32g時，磨石支撐構件102的上表面102a與治具基座32的上表面32a齊平。因此，能夠防止磨石支撐構件102（端面修正治具100A）阻礙對治具基座32的上表面32a裝設保持治具34。此外，固定螺絲103通過形成在磨石支撐構件102的貫穿孔（未圖示）而固定在段部32g。由於固定螺絲103的頭部容納在該貫穿孔內，因此能夠防止此頭部阻礙對治具基座32的上表面32a裝設保持治具34。In another embodiment, the end face correction jig 100A is disposed on a corner 32 f of the jig base 32 . This corner 32f corresponds to the position of a corner 34f of the holding jig 34 . A corner portion 32f of the jig base 32, as shown in FIG. Millstone 101. The grindstone supporting member 102 is fixed to the side surface of the jig base 32 (holding table 30 ) so as to face the end surface 24C of the mounting flange 24 . In addition, in this embodiment, when the grindstone support member 102 is fixed to the segment portion 32g, the upper surface 102a of the grindstone support member 102 is flush with the upper surface 32a of the jig base 32 . Therefore, it is possible to prevent the grinding stone supporting member 102 (the end surface correction jig 100A) from obstructing the attachment of the holding jig 34 to the upper surface 32 a of the jig base 32 . In addition, the fixing screw 103 is fixed to the step portion 32 g through a through hole (not shown) formed in the grindstone supporting member 102 . Since the head of the fixing screw 103 is accommodated in the through hole, it is possible to prevent the head from obstructing the attachment of the holding jig 34 to the upper surface 32 a of the jig base 32 .

另外，本發明非限定於上述實施方式。亦即，在未超出本發明精神的範圍內可以實施各種變形。In addition, this invention is not limited to the said embodiment. That is, various modifications can be made within the scope not departing from the spirit of the present invention.

1‧‧‧切割裝置 11‧‧‧工件 19‧‧‧切割道（分割預定線） 20‧‧‧切割單元 21‧‧‧切割刀片 22‧‧‧主軸 23‧‧‧外殼 24‧‧‧安裝凸緣（凸緣） 24C‧‧‧端面 30‧‧‧保持台 32‧‧‧治具基座 32a‧‧‧上表面 32f‧‧‧一角部 32g‧‧‧段部 34‧‧‧保持治具 34a‧‧‧保持面 34c‧‧‧閃避槽（切割刀片用閃避槽） 34d‧‧‧細孔（吸引孔） 34f‧‧‧一角部 34g‧‧‧段部 38‧‧‧吸引源（負壓傳動部） 40‧‧‧分度進給單元 50‧‧‧切入進給單元 100、100A‧‧‧端面修正治具 101‧‧‧研削磨石 102‧‧‧磨石支撐構件 102a‧‧‧上表面 103‧‧‧固定螺絲1‧‧‧Cutting device 11‧‧‧Workpiece 19‧‧‧Cutting Road (Splitting Predetermined Line) 20‧‧‧cutting unit 21‧‧‧Cutting blade 22‧‧‧Spindle 23‧‧‧Shell 24‧‧‧Mounting flange (flange) 24C‧‧‧end face 30‧‧‧Holding table 32‧‧‧Jig base 32a‧‧‧upper surface 32f‧‧‧one corner 32g‧‧‧section 34‧‧‧Retention fixture 34a‧‧‧Retaining surface 34c‧‧‧Dodge slot (dodge slot for cutting blade) 34d‧‧‧pore (suction hole) 34f‧‧‧one corner 34g‧‧‧section 38‧‧‧Attraction source (negative pressure transmission part) 40‧‧‧Index feed unit 50‧‧‧cutting into the feed unit 100, 100A‧‧‧End face correction jig 101‧‧‧Grinding grindstone 102‧‧‧Millstone support member 102a‧‧‧upper surface 103‧‧‧fixing screw

圖1是顯示本實施方式之切割裝置之構成的外觀立體圖。 圖2是示意性顯示工件的俯視圖。 圖3是示意性顯示工件的仰視圖。 圖4是示意性顯示保持治具的俯視圖。 圖5是示意性顯示載置於治具基座狀態下的保持治具的側剖面圖。 圖6是顯示切割裝置的切割單元之構成的分解立體圖。 圖7是顯示利用本實施方式之端面修正治具進行安裝凸緣的端面修正之狀態的側視圖。 圖8是顯示利用另一實施方式之端面修正治具進行安裝凸緣的端面修正之狀態的側視圖。FIG. 1 is an external perspective view showing the configuration of a cutting device according to this embodiment. Fig. 2 is a plan view schematically showing a workpiece. Fig. 3 is a bottom view schematically showing a workpiece. Fig. 4 is a plan view schematically showing the holding jig. Fig. 5 is a side sectional view schematically showing the holding jig placed on the jig base. Fig. 6 is an exploded perspective view showing the configuration of a cutting unit of the cutting device. Fig. 7 is a side view showing a state in which the end surface correction of the mounting flange is performed using the end surface correction jig of this embodiment. Fig. 8 is a side view showing a state in which an end surface correction of a mounting flange is performed using an end surface correction jig according to another embodiment.

20‧‧‧切割單元 20‧‧‧cutting unit

22‧‧‧主軸 22‧‧‧Spindle

23‧‧‧外殼 23‧‧‧Shell

24‧‧‧安裝凸緣(凸緣) 24‧‧‧Mounting flange (flange)

24C‧‧‧端面 24C‧‧‧end face

30‧‧‧保持台 30‧‧‧Holding table

32‧‧‧治具基座 32‧‧‧Jig base

32a‧‧‧上表面 32a‧‧‧upper surface

32b‧‧‧第1吸引口 32b‧‧‧The first suction port

32c‧‧‧第2吸引口 32c‧‧‧The second suction port

34‧‧‧保持治具 34‧‧‧Retention fixture

34a‧‧‧保持面 34a‧‧‧Retaining surface

34b‧‧‧下表面 34b‧‧‧lower surface

34c‧‧‧閃避槽(切割刀片用閃避槽) 34c‧‧‧Dodge slot (dodge slot for cutting blade)

34d‧‧‧細孔(吸引孔) 34d‧‧‧pore (suction hole)

34f‧‧‧一角部 34f‧‧‧one corner

34g‧‧‧段部 34g‧‧‧section

36a‧‧‧第1電磁閥 36a‧‧‧1st solenoid valve

36b‧‧‧第2電磁閥 36b‧‧‧Second solenoid valve

38‧‧‧吸引源(負壓傳動部) 38‧‧‧Attraction source (negative pressure transmission part)

100‧‧‧端面修正治具 100‧‧‧End face correction jig

101‧‧‧研削磨石 101‧‧‧Grinding grindstone

102‧‧‧磨石支撐構件 102‧‧‧Millstone support member

102a‧‧‧上表面 102a‧‧‧upper surface

103‧‧‧固定螺絲 103‧‧‧fixing screw

Claims (2)

一種切割裝置，其具備： 保持台，其保持設定有交叉的多條分割預定線之工件； 切割刀片，其切割保持於該保持台的工件； 主軸，其使該切割刀片旋轉；以及， 凸緣，其以端面將該切割刀片夾持並固定在該主軸的前端； 其中，該保持台，構成為包含： 保持面，其保持工件； 多條切割刀片用閃避槽，其形成在對應於保持在該保持面上的工件之該分割預定線的位置； 多個吸引孔，其形成在由該切割刀片用閃避槽所劃分的各區域中； 負壓傳動部，其將負壓傳動至該吸引孔； 研削磨石，其研削該凸緣的該端面；以及，磨石支撐構件，其保持該研削磨石。A cutting device comprising: a holding table, which holds a workpiece set with a plurality of crossing predetermined dividing lines; a cutting blade that cuts the workpiece held on the holding table; a spindle that rotates the cutting blade; and, a flange, which clamps and fixes the cutting blade on the front end of the main shaft with its end face; Wherein, the holding table is constituted to include: a retaining surface, which retains the workpiece; a plurality of avoidance grooves for cutting blades formed at positions corresponding to the planned dividing line of the workpiece held on the holding surface; a plurality of suction holes formed in each area divided by the cutting blade dodging groove; a negative pressure transmission part, which transmits negative pressure to the suction hole; a grinding stone that grinds the end surface of the flange; and a grinding stone support member that holds the grinding stone. 如申請專利範圍第1項所述之切割裝置，其中， 該磨石支撐構件，配設在該保持面的高度之下， 並以相向於該凸緣之端面的方式固定在該保持台的側面。The cutting device as described in item 1 of the scope of the patent application, wherein, The grinding stone support member is arranged below the height of the holding surface, And be fixed on the side of this holding table in the mode facing the end face of this flange.
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