TW202116482A - Chuck table of cutting apparatus capable of reducing processing costs and shortening delivery time - Google Patents

Chuck table of cutting apparatus capable of reducing processing costs and shortening delivery time Download PDF

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Publication number
TW202116482A
TW202116482A TW109136572A TW109136572A TW202116482A TW 202116482 A TW202116482 A TW 202116482A TW 109136572 A TW109136572 A TW 109136572A TW 109136572 A TW109136572 A TW 109136572A TW 202116482 A TW202116482 A TW 202116482A
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Taiwan
Prior art keywords
chuck table
cutting
workpiece
main body
plate
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TW109136572A
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Chinese (zh)
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金子智洋
有福法久
斎藤博
伏田正康
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日商迪思科股份有限公司
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Publication of TW202116482A publication Critical patent/TW202116482A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

This invention provides a chuck table of a cutting apparatus capable of reducing processing costs and shortening delivery time. A chuck table of a cutting apparatus includes: a main body having an air-permeable hard plate and a rubber plate fixed to a front side of the hard plate; and a frame fitted over an outer circumference of the main body such that a holding surface of the rubber plate of the main body and a back side of the hard plate are exposed, and the main body is detachably secured to a table base. The rubber plate of the main body includes: a holding surface for holding the workpiece to be processed; a blade clearance groove which corresponds to predetermined dicing lines on the workpiece to be processed supported on the holding surface; and a suction hole formed in an area scribed by the cutting blade clearance groove.

Description

切割裝置之卡盤台Chuck table of cutting device

本發明是關於切割裝置之卡盤台。The present invention relates to a chuck table of a cutting device.

已知有一種切割裝置，是以切割刀片切割並分割CSP（Chip Scale Package，晶片級封裝）或QFN（Quad Flat no-leads package，四方平面無引腳封裝）等的樹脂封裝基板。在將樹脂封裝基板分割為各個晶片之切割加工中有時會使用治具切割機，其將作為被加工物之樹脂封裝基板固定在具有對齊分割預定線而形成之退刀槽及吸引保持各晶片之吸引口的卡盤台上以進行切割（例如參閱專利文獻1）。在使用如此的卡盤台的情況，相較於以往加工被黏著膠膜固定在環狀框架的被加工物之方法，因不需要消耗品之黏著膠膜而有可抑制製造成本之優點。 [習知技術文獻] [專利文獻]A known dicing device uses a dicing blade to cut and divide resin package substrates such as CSP (Chip Scale Package) or QFN (Quad Flat no-leads package). In the dicing process of dividing the resin package substrate into individual wafers, a jig cutting machine is sometimes used to fix the resin package substrate as the processed object to the undercut groove formed by aligning the division line and attract and hold each chip. The suction port is placed on the chuck table for cutting (for example, refer to Patent Document 1). In the case of using such a chuck table, compared to the conventional method of processing a workpiece fixed to a ring frame by an adhesive film, it does not require an adhesive film for consumables, which has the advantage of reducing manufacturing costs. [Literature Technical Literature] [Patent Literature]

[專利文獻1]日本特開2015-093335號公報[Patent Document 1] JP 2015-093335 A

[發明所欲解決的課題] 然而，在使用上述的卡盤台的情況，在發生晶片尺寸的變更等的設計變更時，因為需要製作出配合變更設計之卡盤台，會有製造卡盤台的成本及整體的製造期間增加之問題。另外，上述的卡盤台是由形成有退刀槽及吸引孔的SUS（Steel Use Stainless，不鏽鋼）等的金屬板、，以及用來保護在載置有被加工物的區域中用來保護黏貼於金屬板的被加工物之橡膠片所組成。然而，因為SUS等的金屬加工困難，需要委託專門業者。藉因此，進而有所謂難以削減成本及交貨期縮短之問題。[The problem to be solved by the invention] However, in the case of using the above-mentioned chuck table, when a design change such as a wafer size change occurs, a chuck table that matches the design change needs to be produced, which will increase the cost of manufacturing the chuck table and the overall manufacturing period. The problem. In addition, the above-mentioned chuck table is made of a metal plate such as SUS (Steel Use Stainless) formed with undercuts and suction holes, and is used to protect the area where the workpiece is placed. It is composed of the rubber sheet of the processed object of the metal plate. However, because metal processing such as SUS is difficult, it is necessary to commission a specialist. Because of this, there is a problem that it is difficult to cut costs and shorten the delivery time.

因此本發明的目的為提供一種切割裝置之卡盤台，可削減加工成本、縮短交貨期。Therefore, the object of the present invention is to provide a chuck table of a cutting device, which can reduce the processing cost and shorten the delivery time.

[解決課題的技術手段] 根據本發明，提供一種用於切割裝置之卡盤台，該切割裝置具備：卡盤台，其吸引保持形成有互相交叉的多條分割預定線之板狀的被加工物；切割單元，其以切割刀片切割被保持在該卡盤台的被加工物以分割為多個晶片；以及台座，其固定該卡盤台，該切割裝置之卡盤台具備：本體部，其具有具透氣性之硬質板及被固定在該硬質板的正面側之橡膠板；以及框體部，其以該本體部的該橡膠板的保持面及該硬質板的背面會露出之方式嵌合於該本體部的外周，並將該本體部裝卸自如地固定在該台座；該本體部的該橡膠板包含：該保持面，其保持被加工物；切割刀片用退刀槽，其對應以該保持面支撐的被加工物的該分割預定線；以及吸引孔，其形成在以該切割刀片用退刀槽劃分的區域；來自該台座的負壓透過該硬質板傳遞至該橡膠板的該吸引孔。[Technical means to solve the problem] According to the present invention, there is provided a chuck table for a cutting device. The cutting device includes: a chuck table that sucks and holds a plate-shaped workpiece formed with a plurality of intersecting predetermined dividing lines; and a cutting unit with A dicing blade cuts the workpiece held on the chuck table to divide into a plurality of wafers; and a base for fixing the chuck table, and the chuck table of the cutting device is provided with a main body that has a gas-permeable rigid A plate and a rubber plate fixed on the front side of the hard plate; and a frame body part that is fitted to the outer periphery of the body part in such a way that the holding surface of the rubber plate of the body part and the back surface of the hard plate will be exposed , And the body part is detachably fixed to the pedestal; the rubber plate of the body part includes: the holding surface, which holds the processed object; the undercut groove for the cutting blade, which corresponds to the processed workpiece supported by the holding surface The predetermined dividing line of the object; and a suction hole formed in the area divided by the undercut groove of the cutting blade; the negative pressure from the pedestal is transmitted to the suction hole of the rubber plate through the hard plate.

較佳為，該硬質板由具透氣性的硬質樹脂或多孔陶瓷所構成。Preferably, the hard board is made of hard resin or porous ceramic with air permeability.

[發明功效] 依據本發明可削減卡盤台加工成本，並縮短其交貨期。[Efficacy of invention] According to the present invention, the processing cost of the chuck table can be reduced, and the delivery time can be shortened.

以下參閱圖式詳細說明本發明的實施方式。本發明並不由以下的實施方式所記載的內容所限定。另外，以下記載的構成要素包含本發明所屬技術領域中具有通常知識者可輕易思及、實質上為相同之技術內容。進而，可將以下記載的構成進行適當的組合。另外，在不脫離本發明要旨的範圍內可進行構成之各種省略、置換或變更。The following describes the embodiments of the present invention in detail with reference to the drawings. The present invention is not limited by the content described in the following embodiments. In addition, the constituent elements described below include substantially the same technical content that can be easily thought of by those having ordinary knowledge in the technical field to which the present invention belongs. Furthermore, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

基於圖式說明本發明的實施方式的切割裝置1的卡盤台10。首先，說明實施方式的切割裝置1的整體構成及加工對象的被加工物100的構成。圖1是表示實施方式的切割裝置1的構成例之立體圖。圖2是表示圖1所示的切割裝置1的加工對象的被加工物100的外觀之立體圖。圖3是表示從別的方向觀看圖2所示的被加工物100的外觀之立體圖。在以下的說明中，X軸方向是在水平面中的一方向。Y軸方向是在水平面中正交於X軸方向之方向。Z軸方向是正交於X軸方向及Y軸方向之方向。實施方式的切割裝置1的加工進給方向是X軸方向，分度進給方向是Y軸方向，切入進給方向是Z軸方向。The chuck table 10 of the cutting device 1 of the embodiment of the present invention will be described based on the drawings. First, the overall configuration of the cutting device 1 of the embodiment and the configuration of the to-be-processed object 100 to be processed will be described. Fig. 1 is a perspective view showing a configuration example of a cutting device 1 according to an embodiment. FIG. 2 is a perspective view showing the appearance of a workpiece 100 to be processed by the cutting device 1 shown in FIG. 1. Fig. 3 is a perspective view showing the appearance of the workpiece 100 shown in Fig. 2 when viewed from another direction. In the following description, the X-axis direction is a direction in the horizontal plane. The Y-axis direction is the direction orthogonal to the X-axis direction in the horizontal plane. The Z-axis direction is a direction orthogonal to the X-axis direction and the Y-axis direction. The processing feed direction of the cutting device 1 of the embodiment is the X-axis direction, the indexing feed direction is the Y-axis direction, and the cutting feed direction is the Z-axis direction.

切割裝置1是切割保持在卡盤台10的被加工物100之裝置。被加工物100如圖2所示是具備配線基板101之封裝基板，配線基板101具有絕緣性的絕緣板以及由埋設於絕緣板內部之導電性的金屬構成之地線，並在正面102及背面103形成有電極或各種配線。被加工物100具有：多條分割預定線104，其形成在配線基板101的正面102；以及元件105，其形成在藉由格子狀交叉的多條分割預定線104劃分之各區域。The cutting device 1 is a device that cuts the workpiece 100 held on the chuck table 10. As shown in FIG. 2, the workpiece 100 is a package substrate provided with a wiring substrate 101. The wiring substrate 101 has an insulating insulating plate and a ground wire made of conductive metal buried in the insulating plate, and is placed on the front surface 102 and the back surface. 103 is formed with electrodes or various wirings. The workpiece 100 has a plurality of planned dividing lines 104 formed on the front surface 102 of the wiring substrate 101, and an element 105 formed in each area divided by the plurality of planned dividing lines 104 intersecting in a grid pattern.

被加工物100如圖3所示，在配線基板101的背面103形成有密封劑106，其密封各元件105及由對各元件105引線接合所形成的未圖示的配線。密封劑106是由環氧樹脂、矽氧樹脂、聚氨酯樹脂、不飽和聚酯樹脂、丙烯酸聚氨酯樹脂或聚醯亞胺樹脂等所構成，即所謂的封膜樹脂。被加工物100因在配線基板101的背面103形成有密封劑106而具有凹凸。被加工物100會沿著各分割預定線104被分割，並分割為一個個包含元件105的多片晶片107。As shown in FIG. 3, in the workpiece 100, a sealant 106 is formed on the back surface 103 of the wiring board 101, and the sealant 106 seals each element 105 and the wiring (not shown) formed by wire bonding to each element 105. The sealant 106 is composed of epoxy resin, silicone resin, urethane resin, unsaturated polyester resin, acrylic urethane resin, polyimide resin, etc., which is a so-called sealing film resin. The workpiece 100 has unevenness due to the sealant 106 formed on the back surface 103 of the wiring board 101. The workpiece 100 is divided along each planned dividing line 104 and divided into a plurality of wafers 107 each including the element 105.

被加工物100的分割預定線104的數量、分割預定線104彼此的間隔及元件105的數量等並未如實施方式所限定。亦即，產品編號不同的被加工物100，分割預定線104的數量、分割預定線104彼此的間隔及元件105的數量等互不相同。The number of planned dividing lines 104 of the workpiece 100, the interval between the planned dividing lines 104, and the number of elements 105 are not limited as in the embodiment. That is, the workpieces 100 with different product numbers are different from each other in the number of planned dividing lines 104, the interval between the planned dividing lines 104, and the number of components 105.

切割裝置1如圖1所示，具備卡盤台10、台座50、切割單元70、給水單元75、攝像單元80、X軸移動單元91、Y軸移動單位92、Z軸移動單元93及旋轉移動單元94。切割裝置1具備2個切割單元70，亦即為雙主軸的切割機，是所謂對向式雙主軸型的切割裝置。切割裝置1進而可具備清洗切割後的被加工物100之清洗單元、容納切割前後的被加工物100之卡匣，以及在卡匣與卡盤台10與清洗單元之間搬送被加工物100之搬送單元等。切割裝置1的各構成要素是藉由未圖示的電腦之控制單元所控制。As shown in FIG. 1, the cutting device 1 includes a chuck table 10, a base 50, a cutting unit 70, a water supply unit 75, a camera unit 80, an X-axis moving unit 91, a Y-axis moving unit 92, a Z-axis moving unit 93, and rotational movement Unit 94. The cutting device 1 includes two cutting units 70, that is, a dual-spindle cutting machine, which is a so-called opposing dual-spindle type cutting device. The cutting device 1 may further include a cleaning unit for cleaning the processed object 100 after cutting, a cassette for accommodating the processed object 100 before and after cutting, and a mechanism for transporting the processed object 100 between the cassette and the chuck table 10 and the cleaning unit. Transport unit, etc. Each component of the cutting device 1 is controlled by a control unit of a computer not shown.

卡盤台10是以保持面31吸引保持被加工物100。卡盤台10並非隔著黏著膠膜等吸引保持被加工物100，而是直接在保持面31吸引保持被加工物100，且亦吸引保持由被加工物100所分割的一個個晶片107。卡盤台10在實施方式中，具有大於被加工物100的外形之矩形狀的保持面31。卡盤台10對台座50裝卸自如。卡盤台10透過台座50的吸引源連通孔53來與吸引源60（參閱圖5）連接。卡盤台10被吸引源60吸引，藉此吸引保持載置在保持面31上的被加工物100。關於卡盤台10的詳細構成，如後所述進行說明。The chuck table 10 sucks and holds the workpiece 100 on the holding surface 31. The chuck table 10 does not suck and hold the workpiece 100 through an adhesive film or the like, but directly sucks and holds the workpiece 100 on the holding surface 31, and also sucks and holds the individual wafers 107 divided by the workpiece 100. In the embodiment, the chuck table 10 has a rectangular holding surface 31 larger than the outer shape of the workpiece 100. The chuck table 10 is freely attachable to and detachable from the base 50. The chuck table 10 is connected to the suction source 60 (see FIG. 5) through the suction source communication hole 53 of the pedestal 50. The chuck table 10 is sucked by the suction source 60 to suck and hold the workpiece 100 placed on the holding surface 31. The detailed structure of the chuck table 10 will be described later.

台座50固定有卡盤台10。台座50是卡盤台10所嵌合之矩形狀的盤體。在實施方式中，台座50設置在X軸移動基台4，該X軸移動基台4是遍及切割單元70的下方的加工區域以及從切割單元70的下方分離而被加工物100被搬出搬入的區域，藉由X軸移動單元91在X軸方向移動自如。在實施方式中，台座50是繞與Z軸方向平行的軸心而旋轉自如地被支撐在旋轉移動單元94，該旋轉移動單元94藉由X軸移動單元91設置為在X軸方向移動自如。再者，X軸移動基台4的上表面是沿著水平方向平坦地形成。關於台座50的詳細構成，如後所述進行說明。The chuck table 10 is fixed to the pedestal 50. The pedestal 50 is a rectangular disk body into which the chuck table 10 is fitted. In the embodiment, the pedestal 50 is provided on the X-axis moving base 4, and the X-axis moving base 4 covers the processing area below the cutting unit 70 and is separated from below the cutting unit 70 so that the workpiece 100 is carried in and out. The area can be moved freely in the X-axis direction by the X-axis moving unit 91. In the embodiment, the pedestal 50 is rotatably supported by the rotation movement unit 94 around an axis parallel to the Z-axis direction, and the rotation movement unit 94 is provided to be freely movable in the X-axis direction by the X-axis movement unit 91. Furthermore, the upper surface of the X-axis moving base 4 is formed flat in the horizontal direction. The detailed structure of the pedestal 50 will be described later.

切割單元70是切割保持在卡盤台10的被加工物100並裝卸自如地裝設了分割多片晶片107的切割刀片71之切割手段。其中一個的切割單元70透過Y軸移動單元92及Z軸移動單元93，設於從裝置本體2立設之門型的支撐框架3之其中一個柱部。另一個的切割單元70透過Y軸移動單元92及Z軸移動單元93，設於支撐框架3之另一個柱部。再者，支撐框架3是藉由水平樑將一對柱部的上端彼此連結而成。各個切割單元70相對於保持在卡盤台10的被加工物100，藉由Y軸移動單元92在Y軸方向移動自如，且藉由Z軸移動單元93在Z軸方向移動自如。切割單元70藉由Y軸移動單元92及Z軸移動單元93，可將切割刀片71定位於卡盤台10的保持面31的任意位置。切割單元70具備切割刀片71、主軸外殼72及主軸73。The dicing unit 70 is a dicing means that cuts the workpiece 100 held on the chuck table 10, and is detachably installed with a dicing blade 71 that divides a plurality of wafers 107. One of the cutting units 70 is provided on one of the pillars of the door-shaped support frame 3 erected from the device body 2 through the Y-axis moving unit 92 and the Z-axis moving unit 93. The other cutting unit 70 is provided on the other column of the support frame 3 through the Y-axis moving unit 92 and the Z-axis moving unit 93. Furthermore, the support frame 3 is formed by connecting the upper ends of a pair of column parts to each other by horizontal beams. Each cutting unit 70 is freely movable in the Y-axis direction by the Y-axis moving unit 92 and is freely movable in the Z-axis direction by the Z-axis moving unit 93 with respect to the workpiece 100 held on the chuck table 10. The cutting unit 70 can position the cutting blade 71 at any position on the holding surface 31 of the chuck table 10 through the Y-axis moving unit 92 and the Z-axis moving unit 93. The cutting unit 70 includes a cutting blade 71, a spindle housing 72 and a spindle 73.

切割刀片71是具有大致環形狀的極薄切割磨石。切割刀片71在實施方式中，是所謂輪轂型刀片，具備裝設在主軸73的圓環狀的圓形基台、及配設於圓形基台的外周緣之預定厚度圓環狀的切割刀刃。圓形基台是以導電性的金屬所構成。切割刀刃是由金剛石或CBN（Cubic Boron Nitride，立方氮化硼）等的磨粒、及金屬或樹脂等的黏合材（結合材）所組成。The cutting blade 71 is an extremely thin cutting grindstone having a substantially ring shape. In the embodiment, the cutting blade 71 is a so-called hub-shaped blade, and includes an annular circular base mounted on the main shaft 73, and a circular cutting blade of a predetermined thickness arranged on the outer periphery of the circular base. . The circular base is made of conductive metal. The cutting blade is composed of abrasive grains such as diamond or CBN (Cubic Boron Nitride), and a bonding material (bonding material) such as metal or resin.

主軸外殼72是設置於藉由後述的Z軸移動單元93在Z軸方向移動自如的Z軸移動基台6上。其中一個的切割單元70的主軸外殼72透過Y軸移動單元92及Z軸移動單元93，被支撐在從裝置本體2立設的門型的支撐框架3之其中一個柱部側。另一個的切割單元70的主軸外殼72透過Y軸移動單元92及Z軸移動單元93，被支撐在支撐框架3之另一個柱部側。各個主軸外殼72相對於保持在卡盤台10的被加工物100，藉由Y軸移動單元92在Y軸方向移動自如，且藉由Z軸移動單元93在Z軸方向移動自如。The spindle housing 72 is provided on a Z-axis moving base 6 that can be moved in the Z-axis direction by a Z-axis moving unit 93 described later. The spindle housing 72 of one of the cutting units 70 is supported by the Y-axis moving unit 92 and the Z-axis moving unit 93 on the side of one of the pillars of the door-shaped support frame 3 erected from the device body 2. The spindle housing 72 of the other cutting unit 70 is supported on the other column side of the support frame 3 through the Y-axis moving unit 92 and the Z-axis moving unit 93. Each spindle housing 72 is freely movable in the Y-axis direction by the Y-axis moving unit 92 and is freely movable in the Z-axis direction by the Z-axis moving unit 93 with respect to the workpiece 100 held on the chuck table 10.

主軸73是繞軸心旋轉自如地設在主軸外殼72內。主軸73是藉由未圖示的主軸馬達等進行驅動而旋轉。主軸73在前端部裝設有切割刀片71。切割單元70的主軸73及切割刀片71的軸心，在實施方式中設定為平行於Y軸方向之方向。The main shaft 73 is rotatably provided in the main shaft housing 72 around the shaft center. The main shaft 73 is driven to rotate by a main shaft motor or the like not shown. The main shaft 73 is provided with a cutting blade 71 at the front end. The main shaft 73 of the cutting unit 70 and the axis of the cutting blade 71 are set to be a direction parallel to the Y-axis direction in the embodiment.

給水單元75在由切割單元70進行的切割加工中，對被加工物100及切割刀片71供給加工水。給水單元75包含未圖示的給水源及給水噴嘴76。給水源是例如包含貯留加工水的水槽，以及將水槽的加工水供給於給水噴嘴76的泵。給水噴嘴76是以與切割單元70成為一體而移動之方式，固定於切割單元70。給水噴嘴76將從給水源供給的加工水，供給於被加工物100及切割刀片71。The water supply unit 75 supplies processing water to the workpiece 100 and the cutting blade 71 during the cutting process performed by the cutting unit 70. The water supply unit 75 includes a water supply source and a water supply nozzle 76 not shown. The water supply source is, for example, a water tank that stores processing water, and a pump that supplies the processing water in the water tank to the water supply nozzle 76. The water supply nozzle 76 is fixed to the cutting unit 70 so as to be integrated with the cutting unit 70 to move. The water supply nozzle 76 supplies the processing water supplied from the water supply source to the workpiece 100 and the cutting blade 71.

攝像單元80是以與其中一個切割單元70成為一體而移動之方式，固定於其中一個切割單元70。攝像單元80是包含拍攝保持在卡盤台10的被加工物100的正面102的預定區域之攝像元件。攝像元件是例如CCD（Charge-Coupled Device，電荷耦合元件）攝像元件或CMOS（complementary MOS，互補式金屬氧化物半導體）攝像元件等。攝像單元80是例如拍攝用來執行對位等之拍攝影像，並將取得的拍攝影像輸出至控制單元等，所述對位是將保持在卡盤台10的被加工物100與切割刀片71進行對準。The camera unit 80 is fixed to one of the cutting units 70 in a manner of being integrated with one of the cutting units 70 to move. The imaging unit 80 includes an imaging element that captures a predetermined area of the front surface 102 of the workpiece 100 held on the chuck table 10. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (complementary MOS, complementary metal oxide semiconductor) imaging element. The imaging unit 80 captures, for example, a captured image for performing alignment, and outputs the captured image to a control unit, etc. The alignment is performed between the workpiece 100 held on the chuck table 10 and the cutting blade 71 alignment.

X軸移動單元91是使卡盤台10及切割單元70在加工進給方向之X軸方向相對移動之單元。X軸移動單元91在實施方式中，透過X軸移動基台4使固定有卡盤台10之台座50及旋轉移動單元94在X軸方向移動。X軸移動單元91是例如具備：習知的滾珠螺桿，其設為繞平行於X軸方向的軸心而旋轉自如；習知的馬達，其使滾珠螺桿繞軸心旋轉；及習知的導軌，其將設置有台座50的X軸移動基台4支撐為在X軸方向移動自如。X軸移動單元91的導軌在實施方式中，被設置於切割裝置1的裝置本體2。The X-axis moving unit 91 is a unit that relatively moves the chuck table 10 and the cutting unit 70 in the X-axis direction of the processing feed direction. In the embodiment, the X-axis moving unit 91 moves the base 50 to which the chuck table 10 is fixed and the rotation moving unit 94 through the X-axis moving base 4 in the X-axis direction. The X-axis moving unit 91 is, for example, provided with: a conventional ball screw, which is set to freely rotate around an axis parallel to the X-axis direction; a conventional motor, which rotates the ball screw around the axis; and a conventional guide rail , Which supports the X-axis movable base 4 provided with the pedestal 50 so as to be freely movable in the X-axis direction. The guide rail of the X-axis moving unit 91 is provided in the apparatus main body 2 of the cutting apparatus 1 in the embodiment.

Y軸移動單元92是使卡盤台10及切割單元70在分度進給方向之Y軸方向相對移動之單元。Y軸移動單元92在實施方式中，使切割單元70及Z軸移動單元93在Y軸方向移動。Y軸移動單元92是例如具備：習知的滾珠螺桿，其設為繞平行於Y軸方向的軸心而旋轉自如；習知的馬達，其使滾珠螺桿繞軸心旋轉；及習知的導軌，其將Y軸移動基台5支撐為在Y軸方向移動自如。Y軸移動單元92的導軌在實施方式中，被設置於連結切割裝置1的支撐框架3的一對柱部的前端彼此之水平樑上。The Y-axis moving unit 92 is a unit that relatively moves the chuck table 10 and the cutting unit 70 in the Y-axis direction of the indexing feed direction. In the embodiment, the Y-axis moving unit 92 moves the cutting unit 70 and the Z-axis moving unit 93 in the Y-axis direction. The Y-axis moving unit 92 is, for example, provided with: a conventional ball screw, which is set to freely rotate around an axis parallel to the Y-axis direction; a conventional motor, which rotates the ball screw around the axis; and a conventional guide rail , Which supports the Y-axis moving base 5 so as to move freely in the Y-axis direction. In the embodiment, the guide rail of the Y-axis moving unit 92 is provided on a horizontal beam that connects the front ends of a pair of column parts of the support frame 3 of the cutting device 1.

Z軸移動單元93是使卡盤台10及切割單元70在切入進給方向之Z軸方向相對移動之單元。Z軸移動單元93在實施方式中，對應各個切割單元70而設有2個。各個Z軸移動單元93在實施方式中，使支撐各個切割單元70的各個Z軸移動基台6在Z軸方向移動。Z軸移動單元93是例如具備：習知的滾珠螺桿，其設為繞軸心而旋轉自如；習知的馬達，其使滾珠螺桿繞軸心旋轉；及習知的導軌，其將切割單元70支撐為在Z軸方向移動自如。Z軸移動單元93的導軌在實施方式中，被設置於Y軸移動基台5上。The Z-axis moving unit 93 is a unit that relatively moves the chuck table 10 and the cutting unit 70 in the Z-axis direction of the cutting feed direction. In the embodiment, two Z-axis moving units 93 are provided corresponding to each cutting unit 70. In the embodiment, each Z-axis moving unit 93 moves each Z-axis moving base 6 supporting each cutting unit 70 in the Z-axis direction. The Z-axis moving unit 93 is, for example, provided with: a conventional ball screw, which is set to freely rotate around the axis; a conventional motor, which rotates the ball screw around the axis; and a conventional guide, which moves the cutting unit 70 The support is free to move in the Z-axis direction. The guide rail of the Z-axis moving unit 93 is provided on the Y-axis moving base 5 in the embodiment.

旋轉移動單元94是使卡盤台10及切割單元70繞平行於Z軸方向的軸心旋轉之單元。旋轉移動單元94在實施方式中，透過台座50使卡盤台10繞平行於Z軸方向的軸心旋轉。旋轉移動單元94與設置有台座50之X軸移動基台4一同在X軸方向加工進給。The rotation moving unit 94 is a unit that rotates the chuck table 10 and the cutting unit 70 around an axis parallel to the Z-axis direction. In the embodiment, the rotation moving unit 94 rotates the chuck table 10 about an axis parallel to the Z-axis direction through the base 50. The rotary moving unit 94 is processed and fed in the X-axis direction together with the X-axis moving base 4 provided with the pedestal 50.

接著，說明關於實施方式的卡盤台10及台座50的詳細構成。圖4是表示圖1所示的切割裝置1的卡盤台10及台座50的構成例之分解立體圖。圖5是表示由圖1所示的切割裝置1進行的切割加工一狀態之示意圖。圖6是表示更換圖1所示的切割裝置1的卡盤台10的本體部11的一狀態之圖。Next, the detailed configuration of the chuck table 10 and the pedestal 50 of the embodiment will be described. 4 is an exploded perspective view showing a configuration example of the chuck table 10 and the base 50 of the cutting device 1 shown in FIG. 1. FIG. 5 is a schematic diagram showing a state of cutting processing performed by the cutting device 1 shown in FIG. 1. FIG. 6 is a diagram showing a state in which the main body portion 11 of the chuck table 10 of the cutting device 1 shown in FIG. 1 is replaced.

如圖4所示，卡盤台10可分解為本體部11及框體部40。另外，卡盤台10對台座50裝卸自如。本體部11具有保持被加工物100之卡盤台10的保持面31。本體部11具有硬質板20及橡膠板30。As shown in FIG. 4, the chuck table 10 can be decomposed into a main body part 11 and a frame body part 40. In addition, the chuck table 10 is detachably attachable to and detachable from the base 50. The main body 11 has a holding surface 31 for holding the chuck table 10 of the workpiece 100. The main body 11 has a hard plate 20 and a rubber plate 30.

硬質板20為較被加工物100的外形大的矩形狀板。硬質板20具有透氣性。硬質板20例如為具有透氣性的硬質樹脂或多孔陶瓷。具有透氣性的硬質樹脂為例如胺基甲酸酯泡沫體、發泡聚乙烯（PE：Polyethylene，聚乙烯）、發泡聚丙烯（PP：Polypropylene，聚丙烯）等的具有具連續氣泡之連泡性且低發塵特性材質的樹脂。硬質板20亦可為添加填充料等抑制熱收縮的硬質樹脂。The hard board 20 is a rectangular board larger than the outer shape of the workpiece 100. The hard board 20 has air permeability. The hard board 20 is, for example, a hard resin or porous ceramic having air permeability. The air-permeable rigid resin is, for example, urethane foam, foamed polyethylene (PE: Polyethylene, polyethylene), foamed polypropylene (PP: Polypropylene, polypropylene), etc., which have continuous cells with continuous cells. A resin made of a material with high performance and low dust-generating properties. The hard board 20 may be a hard resin that suppresses heat shrinkage by adding fillers or the like.

橡膠板30是與硬質板20幾乎同形狀的矩形狀板。橡膠板30是透過接著材等層積固定在硬質板20的正面側。橡膠板30例如是非透氣性的   胺甲酸乙酯橡膠等的樹脂。橡膠板30具備保持面31、切割刀片用退刀槽32及吸引孔33。保持面31是保持被加工物100之橡膠板30的正面側之面。切割刀片用退刀槽32是在橡膠板30的保持面31格子狀交叉而形成的多個槽。切割刀片用退刀槽32對應以保持面31支撐的被加工物100的分割預定線104。吸引孔33是形成在以切割刀片用退刀槽32劃分的區域之貫通孔。The rubber plate 30 is a rectangular plate having almost the same shape as the hard plate 20. The rubber plate 30 is laminated and fixed to the front side of the hard plate 20 through an adhesive material or the like. The rubber sheet 30 is, for example, a resin such as non-air-permeable urethane rubber. The rubber plate 30 includes a holding surface 31, a cutting blade relief groove 32, and a suction hole 33. The holding surface 31 is a surface on the front side of the rubber plate 30 holding the workpiece 100. The relief grooves 32 for the dicing blade are a plurality of grooves formed by intersecting the holding surface 31 of the rubber plate 30 in a grid pattern. The cutting blade relief groove 32 corresponds to the planned dividing line 104 of the workpiece 100 supported by the holding surface 31. The suction hole 33 is a through hole formed in a region partitioned by the undercut groove 32 for the dicing blade.

框體部40是嵌合於本體部11的外周之矩形狀框狀的蓋體。框體部40將本體部11裝卸自如地固定在台座50。如圖5所示，被夾持固定在框體部40及台座50之間的本體部11，橡膠板30的保持面31與硬質板20的背面21會從框體部40的開口部41露出。如圖4所示，框體部40在實施方式中，具有在4個角部之螺桿用貫通孔42及螺合於螺桿用貫通孔42之螺桿43。螺桿用貫通孔42對應台座50的螺桿孔54。The frame portion 40 is a rectangular frame-shaped cover fitted to the outer periphery of the main body portion 11. The frame body portion 40 detachably fixes the main body portion 11 to the base 50. As shown in FIG. 5, the main body portion 11 clamped and fixed between the frame portion 40 and the pedestal 50, the holding surface 31 of the rubber plate 30 and the back surface 21 of the rigid plate 20 are exposed from the opening portion 41 of the frame portion 40 . As shown in FIG. 4, in the embodiment, the frame body portion 40 has screw through holes 42 at four corners and a screw 43 screwed into the screw through holes 42. The screw through hole 42 corresponds to the screw hole 54 of the base 50.

台座50固定有卡盤台10。台座50是具有由上表面往下方形成為凹形狀的凹部51之矩形狀的盤體。硬質板20的背面21側被支撐在台座50的凹部51的底面上。卡盤台10的本體部11是以被載置於凹部51的底面上的狀態，被容納於凹部51內。台座50具有從凹部51的底面往下方形成為凹形狀之負壓傳遞室52，以及形成於負壓傳遞室52的底面之吸引源連通孔53。負壓傳遞室52較佳為，包含對應形成有橡膠板30的吸引孔33的區域之區域而形成之長方形室。負壓傳遞室52連通凹部51。在實施方式中，雖吸引源連通孔53是在負壓傳遞室52的底面中央形成為圓形狀，但本發明並不限定於此。如圖5所示，吸引源連通孔53與吸引源60連接。在連接吸引源60及吸引源連通孔53之通路，亦可設有切換閥61。切換閥61僅在通電狀態使吸引源60及吸引源連通孔53連通。如圖4所示，台座50在實施方式中，具有在4個角部之螺桿孔54。螺桿孔54對應框體部40的螺桿用貫通孔42。The chuck table 10 is fixed to the pedestal 50. The pedestal 50 is a rectangular disk body having a concave portion 51 formed in a concave shape from the upper surface downward. The back 21 side of the hard board 20 is supported on the bottom surface of the recess 51 of the pedestal 50. The main body 11 of the chuck table 10 is placed on the bottom surface of the recess 51 and is accommodated in the recess 51. The pedestal 50 has a negative pressure transmission chamber 52 formed in a concave shape from the bottom surface of the recess 51 downward, and a suction source communication hole 53 formed on the bottom surface of the negative pressure transmission chamber 52. The negative pressure transmission chamber 52 preferably includes a rectangular chamber formed corresponding to the area where the suction hole 33 of the rubber plate 30 is formed. The negative pressure transmission chamber 52 communicates with the recess 51. In the embodiment, the suction source communication hole 53 is formed in a circular shape at the center of the bottom surface of the negative pressure transmission chamber 52, but the present invention is not limited to this. As shown in FIG. 5, the suction source communication hole 53 is connected to the suction source 60. A switching valve 61 may be provided in the passage connecting the suction source 60 and the suction source communication hole 53. The switching valve 61 connects the suction source 60 and the suction source communication hole 53 only in the energized state. As shown in FIG. 4, in the embodiment, the pedestal 50 has screw holes 54 at four corners. The screw hole 54 corresponds to the screw through hole 42 of the frame body portion 40.

如圖5所示，台座50收納本體部11，藉由螺桿43使框體部40固定，藉此使負壓傳遞室52密封。卡盤台10是透過具有透氣性的硬質板20將藉由吸引源60進行吸引所產生之台座50的負壓傳遞室52的負壓，傳遞至橡膠板30的吸引孔33，藉此吸引保持被加工物100。卡盤台10在實施方式中，吸引保持包含被加工物100的密封劑106之背面103側。此時，藉由對準被加工物100的分割預定線104及橡膠板30的切割刀片用退刀槽32，在切割單元70切割加工被加工物100時，可抑制切割刀片71切割橡膠板30。As shown in FIG. 5, the base 50 accommodates the main body portion 11, and the frame body portion 40 is fixed by the screw 43, thereby sealing the negative pressure transmission chamber 52. The chuck table 10 transmits the negative pressure of the negative pressure transmission chamber 52 of the pedestal 50 generated by the suction source 60 to the suction hole 33 of the rubber plate 30 through the air-permeable rigid plate 20, thereby attracting and holding The object to be processed 100. In the embodiment, the chuck table 10 sucks and holds the back surface 103 side of the sealant 106 containing the workpiece 100. At this time, by aligning the planned dividing line 104 of the workpiece 100 and the cutting blade undercut 32 of the rubber plate 30, when the cutting unit 70 cuts the workpiece 100, the cutting blade 71 can be prevented from cutting the rubber plate 30. .

本體部11例如為，在以接著材等將橡膠板30貼附於硬質板20之後，藉由在橡膠板30形成切割刀片用退刀槽32及吸引孔33來製造。本體部11亦可為，在橡膠板30形成切割刀片用退刀槽32及吸引孔33之後，以接著材等將形成有切割刀片用退刀槽32及吸引孔33之橡膠板30貼附於硬質板20來製造。The main body 11 is manufactured by, for example, attaching the rubber plate 30 to the hard plate 20 with an adhesive or the like, and then forming the dicing blade relief groove 32 and the suction hole 33 in the rubber plate 30. The main body 11 may also be formed by forming the dicing blade relief groove 32 and the suction hole 33 on the rubber plate 30, and then attach the rubber plate 30 with the dicing blade relief groove 32 and the suction hole 33 formed thereon with an adhesive material or the like. Hard board 20 is manufactured.

橡膠板30的切割刀片用退刀槽32的數量、切割刀片用退刀槽32彼此的間隔及吸引孔33的數量等，須因應對應的被加工物100的分割預定線104的數量、分割預定線104彼此的間隔及元件105的數量等而形成。實施方式的卡盤台10是因應對應的被加工物100的分割預定線104的數量、分割預定線104彼此的間隔及元件105的數量等，在切割刀片用退刀槽32的數量、切割刀片用退刀槽32彼此的間隔及吸引孔33的數量等不同的多個本體部11中，選擇一個本體部11來安裝。The number of undercuts 32 for cutting blades of the rubber plate 30, the distance between undercuts 32 for cutting blades, and the number of suction holes 33, etc., must be determined in accordance with the number of planned dividing lines 104 of the corresponding workpiece 100. The distance between the lines 104 and the number of the elements 105 are formed. The chuck table 10 of the embodiment corresponds to the number of planned dividing lines 104 of the workpiece 100, the interval between the planned dividing lines 104 and the number of components 105, etc., and the number of undercuts 32 for cutting blades and the number of cutting blades Among a plurality of body parts 11 different in the distance between the relief grooves 32 and the number of suction holes 33, one body part 11 is selected and attached.

卡盤台10對台座50裝卸自如，且可分解為本體部11和框體部40。藉此，如圖6所示，在從台座50卸下框體部40的狀態，可將容納於框體部40及台座50之間的本體部11-1更換為別的本體部11-2。在本體部11的更換中，首先卸下將框體部40固定於台座50之螺桿43。接著，藉由從台座50提起框體部40並卸下，使用完的本體部11-1的外周露出來。接著，從台座50提起並卸下容納於台座50的本體部11-1之後，使其他的本體部11-2載置於台座50的凹部51的底面。進而，將框體部40安裝於台座50，藉由螺桿43固定並藉此完成更換。The chuck table 10 is freely attachable to and detachable from the base 50 and can be decomposed into a main body 11 and a frame body 40. As a result, as shown in FIG. 6, in the state where the frame portion 40 is removed from the base 50, the main body portion 11-1 accommodated between the frame portion 40 and the base 50 can be replaced with another main body portion 11-2. . In the replacement of the main body portion 11, first, the screw 43 that fixes the frame portion 40 to the base 50 is removed. Next, by lifting the frame body 40 from the base 50 and detaching it, the outer periphery of the used body 11-1 is exposed. Next, after lifting and removing the main body portion 11-1 housed in the pedestal 50 from the pedestal 50, the other main body portions 11-2 are placed on the bottom surface of the recessed portion 51 of the pedestal 50. Furthermore, the frame body 40 is mounted on the base 50 and fixed by the screw 43 to complete the replacement.

如以上說明，實施方式的切割裝置1的卡盤台10具備本體部11及用來將本體部11固定於台座50的框體部40。因為切割刀片用退刀槽32及吸引孔33是形成於樹脂之橡膠板30，本體部11會易於加工。藉此，可削減加工成本、縮短交貨期。另外，因為框體部40將本體部11裝卸自如地固定在台座50，故可輕易地僅更換本體部11。藉此，即使在發生晶片尺寸的變更等的設計變更的情況，仍可抑制製造卡盤台10的成本及整體的製造期間增加。舉例而言，即使是因吸引切割屑並在硬質板20發生阻塞而吸引力下降，卡盤台10仍可低成本地形成，且可輕易地更換本體部11。As described above, the chuck table 10 of the cutting device 1 of the embodiment includes the body portion 11 and the frame body portion 40 for fixing the body portion 11 to the base 50. Since the dicing blade relief groove 32 and the suction hole 33 are formed in the resin rubber plate 30, the main body 11 can be easily processed. As a result, processing costs can be reduced, and delivery time can be shortened. In addition, since the frame body portion 40 detachably fixes the body portion 11 to the base 50, only the body portion 11 can be easily replaced. Thereby, even when a design change such as a wafer size change occurs, it is possible to suppress an increase in the cost of manufacturing the chuck table 10 and the overall manufacturing period. For example, even if the attractive force is reduced due to the suction of cutting chips and clogging of the hard plate 20, the chuck table 10 can be formed at a low cost, and the body portion 11 can be easily replaced.

進而，因位以往的卡盤台是使具有保持面的SUS等的金屬板的背面對向於負壓傳遞室，從負壓傳遞室使直接負壓作用於金屬板的吸引孔，且因保持面的下方為空洞，會有在加工中保持面振動的疑慮。對此，實施方式的卡盤台10因橡膠板30被固定於具透氣性的硬質板20，且硬質板20被容納於台座50的凹部51並被載置於凹部51的底面，故保持面31被穩定地固定。藉此，發揮抑制因切割加工中的被加工物100偏移而導致晶片107的外形偏移或崩缺之效果。另外，因為被支撐於凹部51的底面之硬質板20，支撐有形成保持面31的橡膠板30，即使藉由鎖緊螺桿43使本體部11固定，仍能發揮保持面31不易變形的效果。Furthermore, in the conventional chuck table, the back surface of a metal plate such as SUS with a holding surface faces the negative pressure transmission chamber, and direct negative pressure is applied to the suction hole of the metal plate from the negative pressure transmission chamber, and the There is a void under the surface, and there is a concern that the surface will vibrate during processing. In contrast, in the chuck table 10 of the embodiment, the rubber plate 30 is fixed to the air-permeable hard plate 20, and the hard plate 20 is accommodated in the recess 51 of the base 50 and placed on the bottom surface of the recess 51, so the holding surface 31 is stably fixed. Thereby, the effect of suppressing the deviation or chipping of the outer shape of the wafer 107 due to the deviation of the workpiece 100 during the dicing process is exerted. In addition, because the hard plate 20 supported on the bottom surface of the recess 51 supports the rubber plate 30 forming the holding surface 31, even if the main body 11 is fixed by the locking screw 43, the holding surface 31 is not easily deformed.

再者，本發明不限定為上述實施方式。亦即，可實施不脫離本發明的骨幹的範圍之各種變形。In addition, the present invention is not limited to the above-mentioned embodiment. That is, various modifications can be implemented without departing from the scope of the backbone of the present invention.

1:切割裝置 10:卡盤台 11,11-1,11-2:本體部 20:硬質板 21:背面 30:橡膠板 31:保持面 32:切割刀片用退刀槽 33:吸引孔 40:框體部 50:台座 52:負壓傳遞室 70:切割單元 71:切割刀片 100:被加工物 104:分割預定線 107:晶片1: Cutting device 10: Chuck table 11,11-1,11-2: body part 20: hard board 21: back 30: rubber sheet 31: Keep the noodles 32: Undercut for cutting blade 33: Attraction hole 40: Frame body 50: Pedestal 52: Negative pressure transfer chamber 70: Cutting unit 71: cutting blade 100: processed objects 104: Dividing planned line 107: Chip

圖1是表示實施方式的切割裝置的構成例之立體圖。 圖2是表示圖1所示的切割裝置的加工對象的被加工物的外觀之立體圖。 圖3是表示從背面觀看圖2所示的被加工物的外觀之立體圖。 圖4是表示圖1所示的切割裝置之卡盤台及台座的構成例之分解立體圖。 圖5是表示由圖1所示的切割裝置進行的切割加工一狀態之示意圖。 圖6是表示更換圖1所示的切割裝置之卡盤台的本體部的一狀態之圖。Fig. 1 is a perspective view showing a configuration example of a cutting device according to an embodiment. Fig. 2 is a perspective view showing the appearance of a to-be-processed object to be processed by the cutting device shown in Fig. 1. Fig. 3 is a perspective view showing the appearance of the to-be-processed object shown in Fig. 2 viewed from the back. Fig. 4 is an exploded perspective view showing a configuration example of a chuck table and a base of the cutting device shown in Fig. 1. Fig. 5 is a schematic diagram showing a state of cutting processing performed by the cutting device shown in Fig. 1. Fig. 6 is a diagram showing a state in which the main body of the chuck table of the cutting device shown in Fig. 1 is replaced.

10:卡盤台10: Chuck table

11:本體部11: Body part

20:硬質板20: hard board

21:背面21: back

30:橡膠板30: rubber sheet

31:保持面31: Keep the noodles

32:切割刀片用退刀槽32: Undercut for cutting blade

33:吸引孔33: Attraction hole

40:框體部40: Frame body

41:開口部41: Opening

42:螺桿用貫通孔42: Through hole for screw

43:螺桿43: screw

50:台座50: Pedestal

51:凹部51: recess

52:負壓傳遞室52: Negative pressure transfer chamber

53:吸引源連通孔53: Suction source connecting hole

54:螺桿孔54: Screw hole

Claims (2)

一種用於切割裝置之卡盤台，該切割裝置具備：卡盤台，其吸引保持形成有互相交叉的多條分割預定線之板狀的被加工物；切割單元，其以切割刀片切割被保持在該卡盤台的被加工物以分割為多個晶片；以及台座，其固定該卡盤台，該切割裝置之卡盤台具備： 本體部，其具有具透氣性之硬質板及被固定在該硬質板的正面側之橡膠板；以及 框體部，其以該本體部的該橡膠板的保持面及該硬質板的背面會露出之方式嵌合於該本體部的外周，並將該本體部裝卸自如地固定在該台座； 該本體部的該橡膠板包含： 該保持面，其保持被加工物； 切割刀片用退刀槽，其對應以該保持面支撐的被加工物的該分割預定線；以及 吸引孔，其形成在以該切割刀片用退刀槽劃分的區域； 來自該台座的負壓透過該硬質板傳遞至該橡膠板的該吸引孔。A chuck table for a cutting device, the cutting device comprising: a chuck table that sucks and holds a plate-shaped workpiece formed with a plurality of intersecting predetermined dividing lines; a cutting unit that cuts and holds a cutting blade The workpiece on the chuck table is divided into a plurality of wafers; and a pedestal for fixing the chuck table, and the chuck table of the cutting device includes: The main body part has a hard plate with air permeability and a rubber plate fixed on the front side of the hard plate; and The frame body part is fitted to the outer periphery of the body part in such a way that the holding surface of the rubber plate of the body part and the back surface of the hard plate will be exposed, and the body part is detachably fixed to the pedestal; The rubber plate of the main body part includes: The holding surface, which holds the processed object; An undercut for the cutting blade, which corresponds to the planned dividing line of the workpiece supported by the holding surface; and The suction hole is formed in the area divided by the undercut groove of the cutting blade; The negative pressure from the pedestal is transmitted to the suction hole of the rubber plate through the hard plate. 如請求項1所述之切割裝置之卡盤台， 該硬質板為具透氣性的硬質樹脂或多孔陶瓷。The chuck table of the cutting device as described in claim 1, The hard board is made of air-permeable hard resin or porous ceramics.
TW109136572A 2019-10-24 2020-10-21 Chuck table of cutting apparatus capable of reducing processing costs and shortening delivery time TW202116482A (en)

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