TWI797272B - 加工品之製造方法及黏著性層合體 - Google Patents

加工品之製造方法及黏著性層合體 Download PDF

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Publication number
TWI797272B
TWI797272B TW108108020A TW108108020A TWI797272B TW I797272 B TWI797272 B TW I797272B TW 108108020 A TW108108020 A TW 108108020A TW 108108020 A TW108108020 A TW 108108020A TW I797272 B TWI797272 B TW I797272B
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TW
Taiwan
Prior art keywords
adhesive
aforementioned
layer
adhesive layer
adhesive sheet
Prior art date
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TW108108020A
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English (en)
Chinese (zh)
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TW201940347A (zh
Inventor
中山武人
也
阿久津高志
Original Assignee
日商琳得科股份有限公司
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Publication of TW201940347A publication Critical patent/TW201940347A/zh
Application granted granted Critical
Publication of TWI797272B publication Critical patent/TWI797272B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW108108020A 2018-03-20 2019-03-11 加工品之製造方法及黏著性層合體 TWI797272B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-052922 2018-03-20
JP2018052922 2018-03-20

Publications (2)

Publication Number Publication Date
TW201940347A TW201940347A (zh) 2019-10-16
TWI797272B true TWI797272B (zh) 2023-04-01

Family

ID=67986176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108108020A TWI797272B (zh) 2018-03-20 2019-03-11 加工品之製造方法及黏著性層合體

Country Status (5)

Country Link
JP (1) JP7273792B2 (ja)
KR (1) KR20200133209A (ja)
CN (1) CN111837219A (ja)
TW (1) TWI797272B (ja)
WO (1) WO2019181447A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021117695A1 (ja) * 2019-12-11 2021-06-17
WO2021193942A1 (ja) * 2020-03-27 2021-09-30 リンテック株式会社 半導体装置製造用シート
TW202301426A (zh) * 2021-03-17 2023-01-01 日商琳得科股份有限公司 半導體裝置之製造方法及半導體裝置之製造裝置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI299019B (ja) * 1999-11-22 2008-07-21 Sumitomo Chemical Co
CN103031076A (zh) * 2011-10-04 2013-04-10 日东电工株式会社 加热发泡型可剥离粘合带或粘合片及其制造方法
JP2015034265A (ja) * 2013-08-09 2015-02-19 日東電工株式会社 易解体型両面粘着シート、及びその貼付方法
TW201623509A (zh) * 2014-11-13 2016-07-01 Dainippon Ink & Chemicals 雙面黏貼膠帶、物品及分離方法
TW201728439A (zh) * 2015-11-13 2017-08-16 Nitto Denko Corp 積層體及併合體、組合之回收方法、半導體裝置之製造方法
TW201741419A (zh) * 2016-03-03 2017-12-01 Lintec Corp 半導體加工用黏著膠帶、及半導體裝置之製造方法
JP2018032777A (ja) * 2016-08-25 2018-03-01 株式会社ディスコ パッケージデバイスチップの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594853A (ja) 1982-07-01 1984-01-11 Mitsubishi Electric Corp 太陽熱暖房給湯システム
JP4219605B2 (ja) * 2002-03-12 2009-02-04 リンテック株式会社 半導体ウエハ加工用粘着シートおよびその使用方法
JP4592270B2 (ja) 2003-10-06 2010-12-01 日東電工株式会社 半導体ウエハの支持材からの剥離方法およびこれを用いた装置
JP2010209158A (ja) * 2009-03-06 2010-09-24 Nitto Denko Corp 粘着シート及びそれを用いた半導体ウェハの加工方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI299019B (ja) * 1999-11-22 2008-07-21 Sumitomo Chemical Co
CN103031076A (zh) * 2011-10-04 2013-04-10 日东电工株式会社 加热发泡型可剥离粘合带或粘合片及其制造方法
JP2015034265A (ja) * 2013-08-09 2015-02-19 日東電工株式会社 易解体型両面粘着シート、及びその貼付方法
TW201623509A (zh) * 2014-11-13 2016-07-01 Dainippon Ink & Chemicals 雙面黏貼膠帶、物品及分離方法
TW201728439A (zh) * 2015-11-13 2017-08-16 Nitto Denko Corp 積層體及併合體、組合之回收方法、半導體裝置之製造方法
TW201741419A (zh) * 2016-03-03 2017-12-01 Lintec Corp 半導體加工用黏著膠帶、及半導體裝置之製造方法
JP2018032777A (ja) * 2016-08-25 2018-03-01 株式会社ディスコ パッケージデバイスチップの製造方法

Also Published As

Publication number Publication date
KR20200133209A (ko) 2020-11-26
JP7273792B2 (ja) 2023-05-15
WO2019181447A1 (ja) 2019-09-26
CN111837219A (zh) 2020-10-27
JPWO2019181447A1 (ja) 2021-04-08
TW201940347A (zh) 2019-10-16

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