TWI785238B - 加工裝置 - Google Patents

加工裝置 Download PDF

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Publication number
TWI785238B
TWI785238B TW108115072A TW108115072A TWI785238B TW I785238 B TWI785238 B TW I785238B TW 108115072 A TW108115072 A TW 108115072A TW 108115072 A TW108115072 A TW 108115072A TW I785238 B TWI785238 B TW I785238B
Authority
TW
Taiwan
Prior art keywords
wafer
unit
cassette
frame
inspection
Prior art date
Application number
TW108115072A
Other languages
English (en)
Chinese (zh)
Other versions
TW201946216A (zh
Inventor
北浦毅
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201946216A publication Critical patent/TW201946216A/zh
Application granted granted Critical
Publication of TWI785238B publication Critical patent/TWI785238B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW108115072A 2018-05-01 2019-04-30 加工裝置 TWI785238B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-088291 2018-05-01
JP2018088291A JP7061012B2 (ja) 2018-05-01 2018-05-01 加工装置

Publications (2)

Publication Number Publication Date
TW201946216A TW201946216A (zh) 2019-12-01
TWI785238B true TWI785238B (zh) 2022-12-01

Family

ID=68408413

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108115072A TWI785238B (zh) 2018-05-01 2019-04-30 加工裝置

Country Status (4)

Country Link
JP (1) JP7061012B2 (ja)
KR (1) KR102633607B1 (ja)
CN (1) CN110429043B (ja)
TW (1) TWI785238B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110224052B (zh) * 2019-05-28 2024-02-06 深圳新益昌科技股份有限公司 一种led固晶的双摆臂固晶装置及其固晶方法
JP2021132119A (ja) * 2020-02-19 2021-09-09 株式会社ディスコ 加工装置
JP7479244B2 (ja) 2020-08-18 2024-05-08 株式会社ディスコ 加工装置
CN112509960B (zh) * 2020-11-09 2024-04-09 太极半导体（苏州）有限公司 一种3d晶圆环切后的定位方法
CN112658476B (zh) * 2021-01-11 2023-03-24 宿迁学院 一种板式激光切割机工作台自动化清理装置
CN115148651B (zh) * 2022-08-01 2023-05-02 弥费科技(上海)股份有限公司 晶圆盒交换传输设备及其驱动装置、存储库

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200620407A (en) * 2004-08-31 2006-06-16 Nikon Corp Aligning method, processing system, substrate loading repeatability measuring method, position measuring method, exposure method, substrate processing apparatus, measuring method and measuring apparatus
TW201030824A (en) * 2008-12-11 2010-08-16 Nitto Denko Corp Method and apparatus for separating protective tape from semiconductor wafer
TW201731011A (zh) * 2015-11-13 2017-09-01 Eo科技股份有限公司 晶圓對準方法以及使用該方法的對準設備
CN107305863A (zh) * 2016-04-18 2017-10-31 株式会社迪思科 晶片的加工方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263518A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置
JP3927018B2 (ja) 2001-11-28 2007-06-06 株式会社ディスコ 切削装置
JP4303041B2 (ja) * 2003-06-18 2009-07-29 株式会社ディスコ 半導体ウエーハの加工装置
JP2005045134A (ja) 2003-07-25 2005-02-17 Disco Abrasive Syst Ltd 半導体ウエーハの加工装置
JP4921316B2 (ja) 2007-10-22 2012-04-25 株式会社ディスコ ワーク収納搬送装置及び該ワーク収納搬送装置を備えた切削装置
JP5582152B2 (ja) * 2012-02-03 2014-09-03 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
JP5959216B2 (ja) * 2012-02-06 2016-08-02 日東電工株式会社 基板搬送方法および基板搬送装置
JP6204008B2 (ja) 2012-09-14 2017-09-27 株式会社ディスコ 加工装置
JP6202962B2 (ja) * 2013-09-20 2017-09-27 株式会社ディスコ 切削装置
JP6192526B2 (ja) 2013-12-17 2017-09-06 株式会社ディスコ 加工装置
JP2015170719A (ja) 2014-03-06 2015-09-28 株式会社ディスコ 板状物の搬送装置および切削装置
JP6300645B2 (ja) 2014-05-30 2018-03-28 株式会社ディスコ 加工装置
JP6474275B2 (ja) 2015-02-19 2019-02-27 株式会社ディスコ 加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200620407A (en) * 2004-08-31 2006-06-16 Nikon Corp Aligning method, processing system, substrate loading repeatability measuring method, position measuring method, exposure method, substrate processing apparatus, measuring method and measuring apparatus
TW201030824A (en) * 2008-12-11 2010-08-16 Nitto Denko Corp Method and apparatus for separating protective tape from semiconductor wafer
TW201731011A (zh) * 2015-11-13 2017-09-01 Eo科技股份有限公司 晶圓對準方法以及使用該方法的對準設備
CN107305863A (zh) * 2016-04-18 2017-10-31 株式会社迪思科 晶片的加工方法

Also Published As

Publication number Publication date
TW201946216A (zh) 2019-12-01
CN110429043B (zh) 2024-02-20
JP2019195015A (ja) 2019-11-07
KR102633607B1 (ko) 2024-02-05
KR20190126248A (ko) 2019-11-11
JP7061012B2 (ja) 2022-04-27
CN110429043A (zh) 2019-11-08

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