TWI785238B - Processing device - Google Patents

Processing device Download PDF

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Publication number
TWI785238B
TWI785238B TW108115072A TW108115072A TWI785238B TW I785238 B TWI785238 B TW I785238B TW 108115072 A TW108115072 A TW 108115072A TW 108115072 A TW108115072 A TW 108115072A TW I785238 B TWI785238 B TW I785238B
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Taiwan
Prior art keywords
wafer
unit
cassette
frame
inspection
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TW108115072A
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Chinese (zh)
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TW201946216A (en
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北浦毅
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

提供一種加工裝置，其可以簡單地進行晶圓的結晶方位的對位，並 且謀求檢測單元的維護性之提升。 Provide a processing device that can easily align the crystallographic orientation of a wafer, and Furthermore, the maintainability of the detection unit is improved.

具備：片匣載置機構，載置晶圓片匣；檢測單元，檢測晶圓的 缺口之方向；片匣搬送部及洗淨搬送部，將晶圓從晶圓片匣搬出並搬入工作夾台，檢測單元具備：檢測工作台，保持晶圓，並且比晶圓更小徑；發光部及光接收部，檢測已保持於檢測工作台的晶圓的缺口；及旋轉控制部，使檢測工作台旋轉，以讓所檢測出的缺口朝向預定的方向，檢測工作台是設置在片匣搬送部從晶圓片匣搬出晶圓的搬送路徑上。 Equipped with: Cassette loading mechanism for loading wafer cassettes; detection unit for detecting wafers The direction of the notch; the cassette transfer part and the cleaning transfer part, which move the wafer out of the wafer cassette and into the work clamping table. The detection unit is equipped with: a detection work table, which holds the wafer and is smaller in diameter than the wafer; The part and the light receiving part detect the notch of the wafer that has been held on the detection workbench; and the rotation control part rotates the detection workbench so that the detected notch faces a predetermined direction. The transport section is on the transport path for unloading wafers from the cassette.

Description

加工裝置 Processing device

發明領域 field of invention

本發明是有關於一種加工裝置。 The present invention relates to a processing device.

發明背景 Background of the invention

已知有用以對半導體晶圓或各種板狀的被加工物進行切割之切割裝置、或進行雷射加工之雷射加工裝置等之加工裝置。在DBG(切割後研磨，Dicing Before Grinding)加工或SDBG(隱形切割後研磨，Stealth Dicing Before Grinding)加工等，沿著半導體晶圓的切割道(分割預定線)來進行加工的加工裝置中，是將晶圓收容於片匣來投入加工裝置中，並且將晶圓的結晶方位的方向調整成預定方向來保持於工作夾台。藉此，藉由將晶圓的圖案定位於預定的方向，即可容易地進行找出切割道的位置之校準。以往，已提出有一種具備有檢測單元的加工裝置，前述檢測單元是檢測晶圓的結晶方位以進行對位(例如參照專利文獻1)。 Processing devices such as dicing devices for cutting semiconductor wafers and various plate-shaped workpieces, laser processing devices for performing laser processing, and the like are known. In the processing equipment that processes along the dicing line (separation line) of the semiconductor wafer, such as DBG (Dicing Before Grinding) processing or SDBG (Stealth Dicing Before Grinding) processing, is The wafer is accommodated in the cassette and put into the processing apparatus, and the direction of the crystallographic orientation of the wafer is adjusted to a predetermined direction and held on the work chuck. Thereby, by orienting the pattern of the wafer in a predetermined direction, calibration for finding the position of the scribe line can be easily performed. Conventionally, there has been proposed a processing apparatus provided with a detection unit that detects the crystal orientation of a wafer for alignment (for example, refer to Patent Document 1).

先前技術文獻 prior art literature 專利文獻 patent documents

專利文獻1：日本專利特開2005-11917號公報 Patent Document 1: Japanese Patent Laid-Open No. 2005-11917

發明概要 Summary of the invention

在這種加工裝置中，上述之檢測單元是設置於片匣載置台的下方所設之專用的箱體內，從片匣搬出的晶圓是暫且收容於片匣載置台的下方之箱體內並在該箱體內進行結晶方位的對位後，才從箱體內搬送往工作夾台。因此，會有晶圓的搬送路徑變得繁雜，且晶圓的結晶方位的對位變得繁雜之類的問題。又，因為以往的檢測單元是設置於片匣載置台的下方所設之箱體內，所以也會有無法容易地進行該檢測單元的維護之問題。 In this kind of processing device, the above-mentioned detection unit is installed in a dedicated box below the cassette loading table, and the wafers carried out from the cassette are temporarily stored in the box below the cassette loading table and stored in the box below the cassette loading table. After the alignment of the crystallization orientation is carried out in the box, it is transported from the box to the work clamp. Therefore, there are problems that the transfer route of the wafer becomes complicated, and the alignment of the crystal orientation of the wafer becomes complicated. Moreover, since the conventional detection unit is installed in a box provided below the cassette mounting table, there is also a problem that maintenance of the detection unit cannot be easily performed.

本發明是有鑒於上述而作成的發明，目的在於提供一種加工裝置，其可以簡單地進行晶圓的結晶方位的對位，並且謀求檢測單元的維護性之提升。 The present invention has been made in view of the above, and an object of the present invention is to provide a processing apparatus capable of easily aligning crystal orientations of wafers and improving maintainability of detection units.

為了解決上述之課題，並且達成目的，本發明是一種加工裝置，並具備：工作夾台，以保持面來保持晶圓；加工單元，對已保持於該工作夾台的晶圓進行加工；加工進給單元，將該工作夾台朝與該保持面平行的方向加工進給；片匣載置台，載置收容晶圓的片匣，且可升降；檢測單元，檢測表示晶圓的結晶方位之缺口的方向；及搬送單元，將晶圓從已載置於該片匣載置台的該片匣搬出並搬入該工作夾台，該檢測單元具備：檢測工作台，保持晶圓，並且比該晶圓更小徑；感測器部，設置於已保持於該檢測工作台的晶圓的外周以檢測該缺口；及旋轉控制部， 使該檢測工作台旋轉，以讓所檢測出的該缺口朝向預定的方向，該檢測工作台是設置於該搬送單元從該片匣搬出該晶圓的搬送路徑上。 In order to solve the above-mentioned problems and achieve the purpose, the present invention is a processing device comprising: a work chuck for holding a wafer with a holding surface; a processing unit for processing the wafer held on the work chuck; The feeding unit is used to process and feed the work clamping table in a direction parallel to the holding surface; the cassette loading table is used to place the cassette containing the wafer and can be lifted; the detection unit is used to detect the crystal orientation of the wafer. The direction of the notch; and the transfer unit, which moves the wafer out of the cassette that has been placed on the cassette loading table and into the work clamping table. The detection unit has: a detection table, holding the wafer, and compared with the wafer The circle is smaller in diameter; the sensor part is arranged on the outer periphery of the wafer which has been held on the detection table to detect the notch; and the rotation control part, The detection workbench is rotated so that the detected notch faces a predetermined direction, and the detection workbench is arranged on a conveyance path where the conveyance unit unloads the wafer from the cassette.

在此構成中，亦可設為下述構成：該檢測工作台的中心與該片匣的距離比該晶圓的半徑更小，且以已保持於該檢測工作台的該晶圓的一部分仍在該片匣內之狀態來檢測該缺口。 In this configuration, it is also possible to adopt a configuration in which the distance between the center of the inspection table and the cassette is smaller than the radius of the wafer, and a part of the wafer held on the inspection table is still The gap is detected in the state of the cassette.

又，亦可為：該檢測單元具備計算單元，前述計算單元是從該感測器部所檢測的該晶圓的外周緣的位置來計算晶圓的中心與該檢測工作台的中心之距離，該計算單元是計算已將該晶圓的該缺口朝向該預定的方向的狀態下的該晶圓的中心與該檢測工作台的中心之距離，該搬送單元是依據所計算出的該距離來調整移動距離，以將該晶圓的中心定位於該工作夾台的中心。 In addition, the detection unit may include a calculation unit that calculates the distance between the center of the wafer and the center of the detection table from the position of the outer periphery of the wafer detected by the sensor unit, The calculation unit calculates the distance between the center of the wafer and the center of the inspection table when the notch of the wafer is facing the predetermined direction, and the transfer unit is adjusted according to the calculated distance Move a distance to position the center of the wafer at the center of the work clamp.

又，亦可為：該片匣是從晶圓片匣與框架片匣進行選擇並載置於該片匣載置台，前述晶圓片匣是直接支撐晶圓的片匣，前述框架片匣是收容已將板狀物以黏著膠帶支撐在環狀框架的開口之框架單元的片匣，該搬送單元具有吸引保持該晶圓之晶圓保持部、及保持該框架單元的該環狀框架之框架保持部，且本發明更具備暫置區域，前述暫置區域是供從該框架片匣搬出的該框架單元在搬入該工作夾台之前暫置的區域。 Alternatively, the cassette may be selected from a wafer cassette and a frame cassette and placed on the cassette mounting table, the wafer cassette directly supports the wafer, and the frame cassette may be A cassette for a frame unit that holds a plate-shaped object supported by an adhesive tape on an opening of a ring frame, the transfer unit has a wafer holding portion that attracts and holds the wafer, and a frame of the ring frame that holds the frame unit The holding part, and the present invention further includes a temporary storage area. The temporary storage area is an area where the frame unit unloaded from the frame cassette is temporarily stored before being loaded into the work clamp.

又，亦可具備檢查用收容部，前述檢查用收容部是設置於該片匣載置台的下側，並和該片匣載置台一 起升降，且可暫置檢查用的晶圓或框架單元，該檢查用收容部具備：支撐托盤，支撐藉由該搬送單元水平地搬入的該晶圓或該框架單元；及滑件(slider)，將該支撐托盤支撐成可從該片匣載置台的下方拉出。 In addition, it is also possible to provide an inspection storage part, the above-mentioned inspection storage part is provided on the lower side of the cassette loading table, and is integrated with the cassette loading table. The wafer or the frame unit for inspection can be raised and lowered temporarily, and the inspection storage unit has: a support tray for supporting the wafer or the frame unit horizontally carried in by the transfer unit; and a slider (slider) , the supporting tray is supported so as to be pulled out from the bottom of the cassette loading table.

根據本發明，因為檢測單元具備：檢測工作台，保持晶圓，並且比晶圓更小徑；感測器部，設置於已保持於檢測工作台的晶圓的外周以檢測缺口；及旋轉控制部，使檢測工作台旋轉，以讓所檢測出的該缺口朝向預定的方向，且該檢測工作台是設置於該搬送單元從該片匣搬出該晶圓的搬送路徑上，所以可以抑制晶圓的搬送路徑的繁雜化，而簡單地進行晶圓的結晶方位的對位，並且可以實現檢測單元的維護性之提升。 According to the present invention, because the detection unit is provided with: the detection table holds the wafer, and is smaller in diameter than the wafer; the sensor part is provided on the outer periphery of the wafer held on the detection table to detect notches; and the rotation control part, rotate the detection table so that the detected notch faces a predetermined direction, and the detection table is set on the transport path where the transport unit carries out the wafer from the cassette, so the wafer can be prevented from The crystallographic orientation of the wafer can be easily aligned without complicating the transport path, and the maintainability of the inspection unit can be improved.

1:晶圓 1: Wafer

2:基板 2: Substrate

2A:缺口 2A: Gap

2O:晶圓的中心 2O: the center of the wafer

3:分割預定線 3: Split the scheduled line

3A:半切溝 3A: half cut groove

4:元件 4: Components

5:正面 5: Front

6:背面 6: Back

7:框架(環狀框架) 7: Frame (ring frame)

7a、30A1:開口 7a, 30A1: opening

8:黏著膠帶 8: Adhesive tape

9:框架單元 9: Frame unit

9A、113A:緣部 9A, 113A: edge

10:工作夾台 10: Work clamp table

11:吸附夾頭 11: Adsorption chuck

11A、82A:保持面 11A, 82A: holding surface

12、14:支撐構造 12, 14: Support structure

13:暫置軌道(暫置區域) 13: Temporary track (temporary area)

15:加工進給單元 15: Processing feed unit

17、62、72:移動單元 17, 62, 72: mobile unit

20:切割單元(加工單元) 20: Cutting unit (processing unit)

21:切割刀片 21: Cutting blade

30:片匣 30: Cassette

30A:晶圓片匣 30A:Wafer Cassette

30B:框架片匣 30B: Frame Cassette

40:片匣載置機構 40: Cassette loading mechanism

41:檢查用收容部 41: Containment Unit for Inspection

41A:第1開口 41A: 1st opening

41B:片匣載置台 41B: Cassette loading table

41C:下板部 41C: Lower board part

41D:第2開口 41D: 2nd opening

42:升降部 42: Lifting Department

42A:公螺桿 42A: male screw

42B:脈衝馬達 42B: Pulse motor

42C:引導軌道 42C: Guide track

43:支撐台 43: support table

43A:母螺孔 43A: female screw hole

43B:被引導軌道 43B: Guided track

50:洗淨部 50: cleaning department

60:片匣搬送部(搬送單元) 60: Cassette conveying part (conveying unit)

61、66、71、114:導軌 61, 66, 71, 114: guide rail

61A、71A:滾珠螺桿 61A, 71A: ball screw

63、74:汽缸部 63, 74: Cylinder department

64:搬送臂 64: Transfer arm

64A:外側臂 64A: Outer arm

64A1、67A:真空墊 64A1, 67A: vacuum pad

64B:內側臂 64B: Medial arm

64B1:吸引墊 64B1: Attraction pad

65:把持部 65: control department

67:晶圓搬送臂 67:Wafer transfer arm

68:驅動部 68: Drive Department

70:洗淨搬送部(搬送單元) 70: Cleaning and conveying part (conveying unit)

73:臂部 73: Arm

75:保持部 75: Keeping Department

75A:吸引墊(晶圓保持部) 75A: Suction pad (wafer holding part)

75B:真空墊(框架保持部) 75B: Vacuum pad (frame holding part)

80:檢測單元 80: detection unit

81:支撐框架 81: Support frame

81A、101A:上表面 81A, 101A: upper surface

82:檢測工作台 82: Detection workbench

82O:檢測工作台的中心 82O: Check the center of the bench

83:感測器框架 83:Sensor frame

84:發光部(感測器部) 84: Light emitting part (sensor part)

85:光接收部(感測器部) 85: Light receiving part (sensor part)

86:間隙 86: Clearance

90:控制單元 90: Control unit

91:旋轉控制部 91:Rotary control unit

92:計算部(計算單元) 92: Calculation department (computing unit)

93:判定部 93: Judgment Department

100:加工裝置 100: Processing device

101:基台 101: Abutment

110:收容箱本體 110: Containment box body

111:底板 111: Bottom plate

112:側板 112: side panel

113:支撐托盤 113: support tray

115:滑行軌道(滑件) 115: sliding track (sliding piece)

120:晶圓載置區域 120: Wafer loading area

121:外周區域 121:Peripheral area

122:吸附孔 122: adsorption hole

123:晶圓吸附孔 123: Wafer adsorption hole

124:連通路 124: connected road

130:吸引路 130: attract road

131:電磁閥 131: Solenoid valve

132:負壓源 132: Negative pressure source

133:壓力測定部 133: Pressure measurement department

X、Y、Z:方向 X, Y, Z: direction

圖1是顯示本實施形態之加工裝置的加工對象之晶圓的一例的立體圖。 FIG. 1 is a perspective view showing an example of a wafer to be processed by the processing apparatus of the present embodiment.

圖2是顯示將圖1所示之晶圓以環狀框架支撐之框架單元的一例的立體圖。 FIG. 2 is a perspective view showing an example of a frame unit supporting the wafer shown in FIG. 1 with a ring frame.

圖3是本實施形態之加工裝置的立體圖。 Fig. 3 is a perspective view of the processing device of the present embodiment.

圖4是顯示加工裝置所具備的片匣載置機構與片匣搬送部之部分截面圖。 4 is a partial cross-sectional view showing a cassette loading mechanism and a cassette conveying unit included in the processing device.

圖5是片匣搬送部的移動單元之立體圖。 Fig. 5 is a perspective view of a moving unit of the cassette transport unit.

圖6是顯示從圖5的移動單元去掉了晶圓搬送臂之主要部位的平面圖。 FIG. 6 is a plan view showing main parts of the moving unit of FIG. 5 with the wafer transfer arm removed.

圖7是顯示已保持於檢測工作台的晶圓之平面圖。 FIG. 7 is a plan view showing a wafer held at an inspection station.

圖8是顯示片匣搬送部將晶圓從檢測工作台朝使其脫離的方向搬送的狀態之圖。 FIG. 8 is a view showing a state where the cassette transport unit transports the wafer from the inspection table in a direction to separate it.

圖9是顯示洗淨搬送部已將晶圓搬送至工作夾台的狀態之圖。 FIG. 9 is a diagram showing a state where a wafer has been transferred to a work chuck by a cleaning transfer unit.

圖10是顯示將框架單元搬入檢查用收容部的收容箱本體的狀態之圖。 Fig. 10 is a diagram showing a state in which the frame unit is carried into the storage box main body of the inspection storage section.

圖11是顯示將收容箱本體從檢查用收容部取出的狀態之圖。 Fig. 11 is a diagram showing a state in which the storage box main body is taken out from the inspection storage section.

圖12是支撐晶圓的支撐托盤的立體圖。 12 is a perspective view of a support tray supporting a wafer.

圖13是圖12的部分截面圖。 FIG. 13 is a partial sectional view of FIG. 12 .

圖14是顯示對是否已將晶圓適當地支撐於支撐托盤進行判定的概略構成之圖。 FIG. 14 is a diagram showing a schematic configuration for determining whether a wafer is properly supported on a support tray.

圖15是顯示片匣搬送部使晶圓從工作夾台脫離的狀態之圖。 FIG. 15 is a diagram showing a state in which a wafer is detached from a work chuck by a cassette transport unit.

圖16是顯示將支撐托盤從檢查用收容部的收容箱本體搬出的狀態之圖。 Fig. 16 is a diagram showing a state in which the support tray is carried out from the storage box main body of the inspection storage section.

圖17是顯示在支撐托盤上載置晶圓的狀態之圖。 FIG. 17 is a diagram showing a state in which a wafer is placed on a support tray.

圖18是顯示將已載置有晶圓的支撐托盤搬入檢查用收容部的收容箱本體的狀態之圖。 18 is a view showing a state in which the support tray on which the wafer is placed is carried into the storage box main body of the inspection storage section.

用以實施發明之形態 The form used to practice the invention

針對用於實施本發明之形態(實施形態)，參照圖式並且詳細地進行說明。本發明並非因以下的實施形態所記載 之內容而受到限定之發明。又，在以下所記載之構成要件中，包含所屬技術領域中具有通常知識者可以輕易設想得到的或實質上是相同的構成要件。此外，以下所記載之構成是可適當組合的。又，在不脫離本發明之要旨的範圍內，可進行各種構成之省略、置換或變更。 The mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not described by the following embodiments Inventions limited by their content. In addition, the structural requirements described below include those that can be easily imagined by those skilled in the art or that are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, omissions, substitutions, or changes of various configurations can be made without departing from the gist of the present invention.

圖1是顯示本實施形態之加工裝置的加工對象之晶圓的一例的立體圖。圖2是顯示將圖1所示之晶圓以環狀框架支撐之框架單元的一例的立體圖。本實施形態之加工裝置，是將圖1所示之單體狀態的晶圓(也稱為晶圓單體)1、及構成圖2所示之框架單元9的晶圓1設為加工對象。晶圓1是將矽、藍寶石、砷化鎵或SiC(碳化矽)等作為基板2之圓板狀的半導體晶圓或光元件晶圓。如圖1所示，晶圓1在基板2的外周部上設置有表示晶圓1的結晶方位之方向的缺口2A。晶圓1具有正面(上表面)5，前述正面5設定有互相交叉之複數條直線狀的分割預定線3，並且在以複數條分割預定線3所區劃出的各區域中分別形成有元件4。又，如圖2所示，框架單元9是具備框架(環狀框架)7、上述之晶圓1及黏著膠帶8而構成，前述框架7是形成為圓環狀，前述晶圓1是配置於此框架7的開口7a，前述黏著膠帶8是貼附於此晶圓1及框架7的背面。再者，單體狀態的晶圓1是表示未受框架7所保持的狀態之晶圓1，且包含於晶圓1的正面5或背面6貼附有保護膠帶的狀態。 FIG. 1 is a perspective view showing an example of a wafer to be processed by the processing apparatus of the present embodiment. FIG. 2 is a perspective view showing an example of a frame unit supporting the wafer shown in FIG. 1 with a ring frame. In the processing apparatus of this embodiment, a wafer (also referred to as a single wafer) 1 in a single state shown in FIG. 1 and a wafer 1 constituting a frame unit 9 shown in FIG. 2 are used as processing objects. The wafer 1 is a disc-shaped semiconductor wafer or an optical device wafer having silicon, sapphire, gallium arsenide, or SiC (silicon carbide) as a substrate 2 . As shown in FIG. 1 , wafer 1 is provided with notches 2A indicating the direction of the crystal orientation of wafer 1 on the outer peripheral portion of substrate 2 . The wafer 1 has a front surface (upper surface) 5. The front surface 5 is provided with a plurality of linear dividing lines 3 intersecting each other, and elements 4 are respectively formed in the regions demarcated by the plurality of dividing lines 3. . Moreover, as shown in FIG. 2, the frame unit 9 is constituted by comprising a frame (annular frame) 7, the aforementioned wafer 1, and an adhesive tape 8. The aforementioned frame 7 is formed in an annular shape, and the aforementioned wafer 1 is disposed on The opening 7 a of the frame 7 , the aforementioned adhesive tape 8 is pasted on the back of the wafer 1 and the frame 7 . In addition, the wafer 1 in a single state refers to the wafer 1 in a state not held by the frame 7 , and includes a state in which a protective tape is attached to the front side 5 or the back side 6 of the wafer 1 .

接著，說明加工裝置100。圖3為本實施形態之加工裝置的立體圖。圖4是顯示加工裝置所具備的片匣 載置機構與片匣搬送部之部分截面圖。圖5是片匣搬送部的移動單元之立體圖。圖6是顯示從圖5的移動單元去掉了晶圓搬送臂之主要部位的平面圖。加工裝置100是對上述之晶圓1或構成框架單元9的晶圓1進行切割加工的裝置。如圖3所示，加工裝置100是配置於長方體形的基台101，且具備：工作夾台10，保持晶圓1或框架單元9；及切割單元(加工單元)20，對已保持於工作夾台10的晶圓1或框架單元9的晶圓1進行切割加工。 Next, the processing device 100 will be described. Fig. 3 is a perspective view of the processing device of the present embodiment. Figure 4 shows the cassettes of the processing device A partial cross-sectional view of the loading mechanism and cassette transport unit. Fig. 5 is a perspective view of a moving unit of the cassette transport unit. FIG. 6 is a plan view showing main parts of the moving unit of FIG. 5 with the wafer transfer arm removed. The processing device 100 is a device for dicing the wafer 1 described above or the wafer 1 constituting the frame unit 9 . As shown in Figure 3, the processing device 100 is configured on a rectangular parallelepiped base 101, and is provided with: a work clamp table 10, holding a wafer 1 or a frame unit 9; The wafer 1 on the chuck 10 or the wafer 1 on the frame unit 9 is subjected to dicing.

又，加工裝置100具備片匣載置機構40(片匣機構)，前述片匣載置機構40可供支撐切割加工前後的晶圓1之晶圓片匣30A載置。在片匣載置機構40中，也可以載置收容上述之框架單元9的框架片匣30B，而可將從晶圓片匣30A與框架片匣30B中選擇出的其中一種片匣載置於片匣載置機構40。再者，在毋須區別晶圓片匣30A與框架片匣30B的情況下是簡稱為片匣30。又，加工裝置100具備：洗淨部50，洗淨切割加工後的晶圓1或框架單元9；片匣搬送部(搬送單元；第1搬送單元)60，在片匣30與工作夾台10之間搬送晶圓1或框架單元9；及洗淨搬送部(搬送單元；第2搬送單元)70，在工作夾台10與洗淨部50之間搬送晶圓1或框架單元9。又，加工裝置100具備：檢測單元80，檢測已收容於晶圓片匣30A之晶圓1的缺口2A的位置；及控制單元90，控制加工裝置100的動作。控制單元90具備旋轉控制部91、計算部(計算單元)92、判定部93、及未圖示的輸入輸出介面裝置。控制單元90具有如 CPU(中央處理單元，central processing unit)的微處理器(microprocessor)，且執行儲存於ROM之電腦程式，以生成用於控制加工裝置100的控制訊號，且可將所生成之控制訊號透過輸出入介面裝置來輸出到加工裝置100的各構成要件。 Furthermore, the processing apparatus 100 includes a cassette loading mechanism 40 (cassette mechanism) on which the wafer cassette 30A supporting the wafers 1 before and after dicing processing can be loaded. In the cassette loading mechanism 40, the frame cassette 30B accommodating the above-mentioned frame unit 9 can also be loaded, and one of the cassettes selected from the wafer cassette 30A and the frame cassette 30B can be loaded on the cassette. Cassette loading mechanism 40. Furthermore, it is simply referred to as the cassette 30 when there is no need to distinguish the wafer cassette 30A from the frame cassette 30B. Furthermore, the processing device 100 includes: a cleaning unit 50 for cleaning the wafer 1 or frame unit 9 after dicing; between the wafer 1 or the frame unit 9 ; Furthermore, the processing device 100 includes: a detection unit 80 for detecting the position of the notch 2A of the wafer 1 accommodated in the wafer cassette 30A; and a control unit 90 for controlling the operation of the processing device 100 . The control unit 90 includes a rotation control unit 91 , a calculation unit (calculation unit) 92 , a determination unit 93 , and an input/output interface device not shown. The control unit 90 has features such as The microprocessor (microprocessor) of the CPU (central processing unit) executes the computer program stored in the ROM to generate control signals for controlling the processing device 100, and the generated control signals can be input and output through Each component of the processing device 100 is output to the interface device.

工作夾台10是以可藉由設置於上述之基台101內的未圖示的加工進給單元，而在X軸方向(加工進給方向；與保持面平行的方向)上移動的方式設置。工作夾台10是形成為具備吸附夾頭11，並且在該吸附夾頭11的保持面11A上，藉由未圖示的吸引組件來保持晶圓1或框架單元9。加工進給單元是將工作夾台10以和保持面11A水平的方式在上述X軸方向上加工進給。又，工作夾台10是構成為可藉由未圖示的旋轉機構而旋動。 The work clamp table 10 is provided in such a manner that it can move in the X-axis direction (processing feed direction; direction parallel to the holding surface) by a processing feed unit not shown in the above-mentioned base 101 . The work chuck 10 is formed to include a suction chuck 11 , and holds the wafer 1 or the frame unit 9 on the holding surface 11A of the suction chuck 11 by a suction unit (not shown). The machining feeding means is for machining feeding the work chuck 10 in the above-mentioned X-axis direction so as to be horizontal to the holding surface 11A. In addition, the work chuck 10 is configured to be rotatable by a not-shown rotatable mechanism.

又，在基台101的上表面101A設置有門型的支撐構造12、14，前述支撐構造12、14是分別沿著Y軸方向(分度方向)延伸，並且橫跨工作夾台10而配置。在其中一者的支撐構造14設置有移動單元17，前述移動單元17是使切割單元20分別在Y軸方向(分度方向)及Z軸方向(鉛直方向)上移動。切割單元20具備切割刀片21，前述切割刀片21是裝設於可被旋轉驅動之未圖示的旋轉主軸上，可藉由讓此切割刀片21一面旋轉一面朝Z軸方向下降，而對晶圓1的正面進行切割加工。例如，可對在背面6側貼附有保護膠帶(未圖示)，且已保持於工作夾台10上之單體狀態的晶圓1執行半切(half cut)，前述半切是切割至晶圓1的厚 度方向之中途為止，可對已保持於工作夾台10上的框架單元9的晶圓1執行全切(full cut)，前述全切是將此晶圓1沿著分割預定線3來切割並分割。再者，在本實施形態中，雖然例示了具備切割刀片21的切割單元20來作為加工單元，但是也可以設為具備雷射照射部來作為加工單元的構成，前述雷射照射部是藉由對晶圓1照射雷射光線，來對該晶圓1進行雷射加工。 In addition, door-shaped support structures 12 and 14 are provided on the upper surface 101A of the base 101. The support structures 12 and 14 respectively extend along the Y-axis direction (indexing direction) and are arranged across the work chuck 10. . One of the support structures 14 is provided with a moving unit 17 which moves the cutting unit 20 in the Y-axis direction (indexing direction) and the Z-axis direction (vertical direction). The cutting unit 20 is equipped with a cutting blade 21. The cutting blade 21 is installed on an unillustrated rotating main shaft that can be rotated and driven. The front side of circle 1 is cut. For example, a half cut (half cut) can be performed on the wafer 1 in a single state with a protective tape (not shown) attached to the back side 6 and held on the work chuck 10. The aforementioned half cut is cut to the wafer 1 1 thick In the middle of the horizontal direction, a full cut (full cut) can be performed on the wafer 1 held on the frame unit 9 on the chuck table 10. The aforementioned full cut is to cut the wafer 1 along the planned dividing line 3 and cut it. segmentation. Furthermore, in the present embodiment, although the cutting unit 20 provided with the cutting blade 21 is illustrated as the processing unit, it may also be configured as a processing unit provided with a laser irradiation unit. The wafer 1 is irradiated with laser light to perform laser processing on the wafer 1 .

如圖4所示，晶圓片匣30A具備用於進行晶圓1的搬入及搬出的開口30A1，此開口30A1是相向於片匣搬送部60而設置。又，在晶圓片匣30A的兩側壁的內表面，是在Z軸方向(鉛直方向)上隔著間隔而平行地設置有複數層導軌狀的料架(未圖示)，前述料架是用於支撐已搬入的晶圓1的外周緣的一部分。又，雖然省略圖示，但框架片匣30B是和晶圓片匣30A同樣地具備用於進行框架單元9的搬入及搬出的開口，且此開口是相向於片匣搬送部60而設置。又，在框架片匣30B的兩側壁的內表面，是在Z軸方向(鉛直方向)上相向地設置有複數層料架(未圖示)，前述料架是用於載置已搬入的框架單元9。 As shown in FIG. 4 , the cassette 30A has an opening 30A1 for carrying in and carrying out the wafer 1 , and the opening 30A1 is provided to face the cassette conveyance unit 60 . In addition, on the inner surfaces of the two side walls of the wafer cassette 30A, a plurality of rail-shaped racks (not shown) are arranged in parallel at intervals in the Z-axis direction (vertical direction). The racks are It is used to support a part of the outer periphery of the loaded wafer 1 . Also, although not shown, the frame cassette 30B has an opening for loading and unloading the frame unit 9 similarly to the wafer cassette 30A, and this opening is provided facing the cassette transfer unit 60 . Also, on the inner surfaces of the two side walls of the frame cassette 30B, a plurality of layers of material racks (not shown) are arranged facing each other in the Z-axis direction (vertical direction), and the aforementioned material racks are used to place the loaded frames. Unit 9.

片匣載置機構40具備：檢查用收容部41，選擇並載置上述之晶圓片匣30A或框架片匣30B；及升降部42，用於使此檢查用收容部41朝Z軸方向(鉛直方向)上下移動。檢查用收容部41是形成為在片匣搬送部60側設置有第1開口41A，並在此第1開口41A的相反側設置有第2開口41D的角筒狀，且可在其內部以可滑行移動的方式配置收 容箱本體110。在本實施形態中，因為是在檢查用收容部41之上載置片匣30，所以檢查用收容部41的上板部是作為片匣載置台41B而發揮功能。又，檢查用收容部41的下板部41C是固定於可藉由升降部42來升降的支撐台43。 The cassette loading mechanism 40 is provided with: an inspection receiving part 41 for selecting and loading the above-mentioned wafer cassette 30A or frame cassette 30B; vertical direction) to move up and down. The receiving part 41 for inspection is formed into an angular cylindrical shape in which a first opening 41A is provided on the side of the cassette conveying part 60 and a second opening 41D is provided on the opposite side of the first opening 41A. Taxi movement mode configuration collection The container body 110 . In the present embodiment, since the cassette 30 is placed on the inspection container 41 , the upper plate portion of the inspection container 41 functions as the cassette mounting table 41B. In addition, the lower plate portion 41C of the storage portion 41 for inspection is fixed to the support table 43 that can be raised and lowered by the elevating portion 42 .

升降部42具備：公螺桿42A，沿著基台101的側壁而朝上下方向配設並且可旋轉地被支撐；脈衝馬達42B，讓此公螺桿42A正旋轉及逆旋轉；及引導軌道42C，平行地配設於公螺桿42A的兩側並且朝上下方向延伸。在公螺桿42A上，是供已設置於支撐台43的一端部的母螺孔43A可進退自如地安裝，並且使被引導軌道43B與引導軌道42C相卡合。藉此，當將脈衝馬達42B朝其中一個方向旋轉驅動時，支撐台43即沿著公螺桿42A及引導軌道42C而上升，當將脈衝馬達42B朝另一個方向旋轉驅動時，支撐台43即沿著公螺桿42A及引導軌道42C而下降。像這樣藉由使支撐台43升降，固定於支撐台43的檢查用收容部41就可以從收容於基台101的內部之位置來露出於該基台101的上部，並且將Z軸方向的高度位置調整到與片匣搬送部60的把持部65相向的位置。又，在將檢查用收容部41收容於基台101的內部之情況下，是使於檢查用收容部41上所載置的片匣30的開口與片匣搬送部60相向。 The lifting unit 42 includes: a male screw 42A arranged vertically along the side wall of the base 101 and supported rotatably; a pulse motor 42B that rotates the male screw 42A forward and reverse; and a guide rail 42C parallel It is disposed on both sides of the male screw 42A and extends in the vertical direction. On the male screw 42A, a female screw hole 43A provided at one end of the support base 43 is mounted so as to be able to move forward and backward, and the guided rail 43B is engaged with the guide rail 42C. Thus, when the pulse motor 42B is rotated in one direction, the support table 43 rises along the male screw 42A and the guide rail 42C, and when the pulse motor 42B is rotated in the other direction, the support table 43 moves up along the guide rail 42C. It descends along the male screw 42A and the guide rail 42C. By raising and lowering the support table 43 in this way, the inspection accommodating part 41 fixed to the support table 43 can be exposed to the upper part of the base 101 from the position stored inside the base 101, and the height in the Z-axis direction The position is adjusted to a position facing the gripping portion 65 of the cassette transport portion 60 . In addition, when storing the inspection storage unit 41 inside the base 101 , the opening of the cassette 30 placed on the inspection storage unit 41 is made to face the cassette transport unit 60 .

如圖3所示，片匣搬送部60是設置於另一側的支撐構造12。此片匣搬送部60是將晶圓1及框架單元9分別沿著與上述之分度方向成為平行的Y軸方向(搬出入方向)來搬送至片匣30。片匣搬送部60具備：導軌61，配 置於支撐構造12的側面，並且平行於Y軸方向；及移動單元62，可在此導軌61上滑行移動。移動單元62是在與導軌61的相向面側具備螺帽部(未圖示)，並將此螺帽部進退自如地安裝於設置在導軌61的滾珠螺桿61A。於滾珠螺桿61A的一端部連結有脈衝馬達(未圖示)，當以脈衝馬達使滾珠螺桿61A旋轉時，移動單元62即沿著導軌61而在Y軸方向上移動。 As shown in FIG. 3 , the cassette transport unit 60 is provided on the other side of the support structure 12 . The cassette transport unit 60 transports the wafer 1 and the frame unit 9 to the cassette 30 along the Y-axis direction (in/out direction) parallel to the indexing direction described above. Cassette conveying part 60 has: guide rail 61, with It is placed on the side of the supporting structure 12 and parallel to the Y-axis direction; and the moving unit 62 can slide and move on the guide rail 61 . The moving unit 62 is provided with a nut portion (not shown) on the side facing the guide rail 61 , and the nut portion is movably attached to the ball screw 61A provided on the guide rail 61 . A pulse motor (not shown) is connected to one end of the ball screw 61A. When the ball screw 61A is rotated by the pulse motor, the moving unit 62 moves along the guide rail 61 in the Y-axis direction.

如圖5所示，移動單元62具備：朝Z軸方向(鉛直方向)下方延伸的汽缸部63、連結於此汽缸部63的下端部之搬送臂64、及設置於此搬送臂64的把持部65。又，移動單元62具備：導軌66，配置於搬送臂64的上部並且平行於Y軸方向；晶圓搬送臂67，在此導軌66上沿著Y軸方向滑行移動；及驅動部68，驅動晶圓搬送臂67。 As shown in FIG. 5 , the moving unit 62 includes: a cylinder portion 63 extending downward in the Z-axis direction (vertical direction), a transfer arm 64 connected to the lower end portion of the cylinder portion 63 , and a gripping portion provided on the transfer arm 64 65. Also, the moving unit 62 is provided with: a guide rail 66 disposed on the upper portion of the transfer arm 64 and parallel to the Y-axis direction; a wafer transfer arm 67 slides and moves along the Y-axis direction on the guide rail 66; Round conveying arm 67.

汽缸部63是在Z軸方向(鉛直方向)上伸縮，而調整搬送臂64及安裝於搬送臂64的晶圓搬送臂67之Z軸方向的高度位置。搬送臂64是搬送晶圓1及框架單元9的構件。如圖6所示，搬送臂64具備在Y軸方向延伸的一對外側臂(接觸式搬送部)64A、64A及一對內側臂(非接觸式搬送部)64B、64B。一對內側臂64B、64B是配置於一對外側臂64A、64A之間，並且將Y軸方向的長度形成得比一對外側臂64A、64A更短。在外側臂64A的各末端之下部，分別設置有真空墊(圖4；框架保持部)64A1。如圖6所示，此真空墊64A1是形成在對應於框架單元9的框架7的外緣之位置，並藉由吸引此框架7的正面來保持框架單元9。又， 於內側臂64B的各末端之下部，分別形成有吸引墊(晶圓保持部)64B1，前述吸引墊64B1是對晶圓1噴出空氣(流體)而產生負壓，並以非接觸狀態來吸引該晶圓1。此吸引墊64B1是形成在對應於晶圓1的外緣之位置，並且為所謂的白努利墊，並以利用了藉由噴出空氣所生成之白努利效果的負壓的非接觸狀態來吸引保持晶圓1。 The cylinder part 63 expands and contracts in the Z-axis direction (vertical direction), and adjusts the height positions of the transfer arm 64 and the wafer transfer arm 67 attached to the transfer arm 64 in the Z-axis direction. The transfer arm 64 is a member for transferring the wafer 1 and the frame unit 9 . As shown in FIG. 6 , the transport arm 64 includes a pair of outer arms (contact transport units) 64A, 64A and a pair of inner arms (non-contact transport units) 64B, 64B extending in the Y-axis direction. The pair of inner arms 64B, 64B is arranged between the pair of outer arms 64A, 64A, and the length in the Y-axis direction is formed shorter than the pair of outer arms 64A, 64A. Under each end of the outer arm 64A, vacuum pads ( FIG. 4 ; frame holding portion) 64A1 are respectively provided. As shown in FIG. 6, the vacuum pad 64A1 is formed at a position corresponding to the outer edge of the frame 7 of the frame unit 9, and holds the frame unit 9 by attracting the front surface of the frame 7. again, Suction pads (wafer holders) 64B1 are respectively formed on the lower parts of the ends of the inner arms 64B. The suction pads 64B1 blow air (fluid) to the wafer 1 to generate negative pressure and suck the wafer 1 in a non-contact state. Wafer 1. This suction pad 64B1 is formed at a position corresponding to the outer edge of the wafer 1, and is a so-called Bernoulli pad, and is in a non-contact state utilizing the negative pressure of the Bernoulli effect generated by ejecting air. Suction holds wafer 1.

如圖3及圖4所示，把持部65是與片匣30相向而設置於Y軸方向的前端部，並且把持框架單元9的框架7之緣部。框架單元9可受把持部65所把持而從框架片匣30B搬出至後述之暫置軌道(暫置區域)13。又，框架單元9可受把持部65所把持，而從暫置軌道13搬入至框架片匣30B或檢查用收容部41。 As shown in FIGS. 3 and 4 , the holding portion 65 is provided at the front end portion facing the cassette 30 in the Y-axis direction, and holds the edge portion of the frame 7 of the frame unit 9 . The frame unit 9 can be carried out from the frame cassette 30B to the temporary storage rail (temporary storage area) 13 described later by being grasped by the grasping portion 65 . In addition, the frame unit 9 can be grasped by the grasping portion 65 and carried into the frame cassette 30B or the storage portion 41 for inspection from the temporary storage rail 13 .

另一方面，如圖5所示，晶圓搬送臂67在平面視角下是形成為大致C字形狀，在晶圓搬送臂67的上表面形成有複數個真空墊67A(晶圓保持部)，前述真空墊67A是以和晶圓1的背面(下表面)6接觸的狀態來吸引保持該晶圓1的背面6。驅動部68是使晶圓搬送臂67沿著導軌66移動，並且從晶圓片匣30A將晶圓1搬出或將晶圓1搬入晶圓片匣30A。 On the other hand, as shown in FIG. 5 , the wafer transfer arm 67 is formed in a substantially C-shape in a plan view, and a plurality of vacuum pads 67A (wafer holders) are formed on the upper surface of the wafer transfer arm 67, The vacuum pad 67A attracts and holds the back surface 6 of the wafer 1 in a state of being in contact with the back surface (lower surface) 6 of the wafer 1 . The drive unit 68 moves the wafer transfer arm 67 along the guide rail 66 , and carries out the wafer 1 from the cassette 30A or loads the wafer 1 into the cassette 30A.

洗淨搬送部70是和片匣搬送部60同樣地設置於支撐構造12，並且將晶圓1及框架單元9分別沿著與上述之分度方向成為平行的Y軸方向(搬出入方向)來搬送至洗淨部50。洗淨搬送部70具備：導軌71，配置於支撐構造12的側面，並且平行於Y軸方向；及移動單元72，可在此 導軌71上滑行移動。移動單元72是在與導軌71的相向面側具備螺帽部(未圖示)，並將此螺帽部進退自如地安裝於設置在導軌71的滾珠螺桿71A。於滾珠螺桿71A的一端部連結有脈衝馬達(未圖示)，當以脈衝馬達使滾珠螺桿71A旋轉時，移動單元72即沿著導軌71而在Y軸方向上移動。又，移動單元72具備：從導軌71朝X軸方向延伸的臂部73、從此臂部73的前端朝Z軸方向(鉛直方向)下方延伸的汽缸部74、及設置於此汽缸部74的下端的保持部75。汽缸部74是在Z軸方向(鉛直方向)上伸縮，而調整保持部75的Z軸方向的高度位置。保持部75具備：複數個吸引墊(白努利墊；晶圓保持部)75A(參照圖8)，形成為圓板形狀，且在保持部75的下表面是對晶圓1以非接觸狀態來吸引保持；及複數個真空墊(框架保持部)75B(參照圖8)，吸引保持框架單元9。真空墊75B是吸引框架單元9的框架7，並且設置得比吸引墊75A更朝外緣側。 The cleaning transfer unit 70 is provided on the support structure 12 in the same manner as the cassette transfer unit 60, and moves the wafer 1 and the frame unit 9 along the Y-axis direction (carry-in/out direction) parallel to the indexing direction described above. Transfer to the cleaning unit 50 . The cleaning and conveying unit 70 is equipped with: a guide rail 71 disposed on the side of the supporting structure 12 and parallel to the Y-axis direction; and a moving unit 72 which can be used here Sliding movement on guide rail 71. The moving unit 72 is provided with a nut portion (not shown) on the side facing the guide rail 71 , and the nut portion is attached to the ball screw 71A provided on the guide rail 71 so as to be able to move forward and backward. A pulse motor (not shown) is connected to one end of the ball screw 71A. When the ball screw 71A is rotated by the pulse motor, the moving unit 72 moves along the guide rail 71 in the Y-axis direction. Moreover, the moving unit 72 includes: an arm portion 73 extending from the guide rail 71 in the X-axis direction, a cylinder portion 74 extending downward in the Z-axis direction (vertical direction) from the front end of the arm portion 73 , and a lower end of the cylinder portion 74 . The holding part 75. The cylinder part 74 expands and contracts in the Z-axis direction (vertical direction), and the height position of the holding part 75 in the Z-axis direction is adjusted. The holding part 75 is equipped with: a plurality of suction pads (Bernoulli pads; wafer holding part) 75A (refer to FIG. and a plurality of vacuum pads (frame holding parts) 75B (see FIG. 8 ) to attract and hold the frame unit 9 . The vacuum pad 75B is to attract the frame 7 of the frame unit 9 , and is provided further toward the outer edge side than the suction pad 75A.

在本實施形態中，如圖3及圖4所示，片匣30及洗淨部50是位於片匣搬送部60及洗淨搬送部70的搬送路徑上，並且包夾可讓工作夾台10在X軸方向上移動的區域，而配置於基台101的兩側。又，片匣30是朝片匣搬送部60側開口而形成，洗淨部50是將上表面開口而形成。在片匣30與洗淨部50之間，設置有可供框架單元9暫時地暫置的一對暫置軌道13、13。在此暫置軌道13、13上可供下述框架單元9暫置：藉由片匣搬送部60的把持部65從框架片匣30B搬出之未加工的框架單元9、或要搬入框架片匣 30B或檢查用收容部41之加工後的框架單元9。 In this embodiment, as shown in FIGS. 3 and 4 , the cassette 30 and the cleaning unit 50 are located on the transport path of the cassette transport unit 60 and the cleaning transport unit 70 , and the clamping can allow the work holder 10 The regions that move in the X-axis direction are arranged on both sides of the base 101 . In addition, the cassette 30 is formed by opening toward the cassette conveyance part 60 side, and the cleaning part 50 is formed by opening the upper surface. Between the cassette 30 and the cleaning unit 50, a pair of provisional rails 13, 13 for provisional provision of the frame unit 9 are provided. The following frame unit 9 can be temporarily placed on this temporary track 13, 13: the unprocessed frame unit 9 that is carried out from the frame cassette 30B by the gripping portion 65 of the cassette transport portion 60, or the frame unit 9 to be loaded into the frame cassette 30B or the processed frame unit 9 of the receiving portion 41 for inspection.

於暫置軌道13、13上所暫置之未加工的框架單元9是被片匣搬送部60的搬送臂64的真空墊64A1所吸引保持，而從暫置軌道13上搬送至工作夾台10。已在工作夾台10上進行切割加工的框架單元9是被洗淨搬送部70的保持部75的真空墊75B所吸引保持，而搬送至洗淨部50。已在洗淨部50洗淨的框架單元9是被片匣搬送部60的搬送臂64的真空墊64A1所吸引保持，而從洗淨部50暫置至暫置軌道13上。又，暫置軌道13、13是以可在X軸方向上移動成互相接近或遠離的方式所構成。暫置軌道13、13可以藉由在已載置框架單元9的狀態下互相接近，而將框架單元9的中心位置定位於預定的位置，並在往工作夾台10的搬送時將工作夾台10的中心與框架單元9的中心對齊。同樣地，暫置軌道13、13也可以藉由在已載置框架單元9的狀態下互相接近，而將框架片匣30B的中心與框架單元9的中心對齊。 The unprocessed frame unit 9 temporarily placed on the temporary track 13, 13 is attracted and held by the vacuum pad 64A1 of the transport arm 64 of the cassette transport unit 60, and is transported from the temporary track 13 to the work clamp table 10 . The frame unit 9 that has been cut on the work chuck 10 is sucked and held by the vacuum pad 75B of the holding unit 75 of the cleaning and transporting unit 70 , and is transported to the cleaning unit 50 . The frame unit 9 cleaned in the cleaning unit 50 is sucked and held by the vacuum pad 64A1 of the transport arm 64 of the cassette transport unit 60 , and temporarily placed on the temporary storage rail 13 from the cleaning unit 50 . Moreover, the provisional rails 13 and 13 are configured so as to be movable in the X-axis direction so as to approach or separate from each other. The provisional rails 13, 13 can position the center of the frame unit 9 at a predetermined position by approaching each other in the state where the frame unit 9 is placed, and can set the work clamp 10 when it is transferred to the work clamp 10. The center of 10 is aligned with the center of frame unit 9 . Similarly, the provisional rails 13 , 13 can also align the center of the frame cassette 30B with the center of the frame unit 9 by approaching each other in a state where the frame unit 9 is placed.

然而，以往在對框架單元9的晶圓1進行全切的切割裝置中，是將用於觀察切割等之加工後的狀態的檢查用收容部配置於片匣的下方區域(例如，日本專利特開2009-105109號公報)。另一方面，在對單體狀態的晶圓1進行半切之半切專用機中，是在片匣的下方區域設置有檢測單元，前述檢測單元是對晶圓1的缺口位置進行檢測。因此，在對框架單元9與晶圓1之任何一方都可以加工之兼用機的情況下，會強烈地要求使兩種功能共存，而必須確 保配置檢查用收容部與檢查單元的空間。 However, conventionally, in a dicing device that fully cuts the wafer 1 of the frame unit 9, an inspection accommodating portion for observing the state after dicing and the like is disposed in the lower area of the cassette (for example, Japanese Patent No. Publication No. 2009-105109). On the other hand, in the special half-cutting machine for half-cutting the wafer 1 in a single state, a detection unit is provided in the lower area of the cassette, and the detection unit detects the notch position of the wafer 1 . Therefore, in the case of a dual-purpose machine that can process both the frame unit 9 and the wafer 1, it is strongly required to have both functions coexist, and it is necessary to ensure that the two functions coexist. Ensure the space for arranging the storage unit for inspection and the inspection unit.

因此，在本實施形態中，是如圖3所示，將檢測單元80配置於晶圓片匣30A與工作夾台10之間的基台101的上表面101A。亦即，檢測單元80是設置在片匣搬送部60從晶圓片匣30A搬出晶圓1的搬送路徑上。檢測單元80具備：支撐框架81，配置於基台101的上表面101A；檢測工作台82，設置於此支撐框架81上並保持晶圓1；匚字形的感測器框架83，在此支撐框架81上和檢測工作台82並排而配置；及2個發光部84、84及光接收部85、85(感測器部)，分別配置於此感測器框架83之相向的面上。 Therefore, in this embodiment, as shown in FIG. 3 , the detection unit 80 is disposed on the upper surface 101A of the base 101 between the cassette 30A and the work chuck 10 . That is, the detection unit 80 is provided on the transport path where the cassette transport unit 60 unloads the wafer 1 from the wafer cassette 30A. The detection unit 80 has: a support frame 81, which is arranged on the upper surface 101A of the base 101; a detection table 82, which is arranged on the support frame 81 and holds the wafer 1; a U-shaped sensor frame 83, which supports the frame 81 is arranged side by side with the detection table 82;

支撐框架81是在基台101的上表面101A從該上表面101A隔著間隙而配置。在支撐框架81與基台101的上表面101A之間，形成有可以充分地讓晶圓1或框架單元9通過之程度的間隙86。在支撐框架81的上表面81A設置有保持晶圓1的檢測工作台82。此檢測工作台82是構成為可藉由脈衝馬達等之旋轉驅動組件(未圖示)而適當地旋轉。又，在檢測工作台82的保持面82A是構成為藉由負壓控制組件(未圖示)來使適當的負壓作用。如圖4所示，檢測工作台82是形成得比晶圓1更小徑，檢測工作台82的中心與晶圓片匣30A的開口30A1的距離是比晶圓1的半徑更小。因此，可以利用片匣搬送部60的晶圓搬送臂67，讓已從晶圓片匣30A搬出的晶圓1快速地保持在檢測工作台82上。 The support frame 81 is arranged on the upper surface 101A of the base 101 with a gap therebetween. A gap 86 is formed between the support frame 81 and the upper surface 101A of the base 101 to the extent that the wafer 1 or the frame unit 9 can sufficiently pass through. On the upper surface 81A of the support frame 81 , an inspection table 82 holding the wafer 1 is provided. This detection table 82 is configured to be properly rotatable by a rotary drive unit (not shown) such as a pulse motor. In addition, on the holding surface 82A of the detection table 82, an appropriate negative pressure is applied by a negative pressure control unit (not shown). As shown in FIG. 4 , the inspection table 82 is formed with a smaller diameter than the wafer 1 , and the distance between the center of the inspection table 82 and the opening 30A1 of the cassette 30A is smaller than the radius of the wafer 1 . Therefore, the wafer 1 carried out from the cassette 30A can be quickly held on the inspection table 82 by the wafer transfer arm 67 of the cassette transfer unit 60 .

發光部84及光接收部85是互相相向而配 置，並檢測已保持在檢測工作台82上之晶圓1的缺口2A的位置。在本實施形態中，發光部84及光接收部85是對應於例如8吋晶圓及12吋晶圓等晶圓1的大小而設置。在此構成中，因為檢測單元80是在基台101的上表面101A上露出而配置，所以變得也可容易地進行檢測單元80的各構成構件的維護。 The light emitting part 84 and the light receiving part 85 are arranged facing each other. position, and detect the position of the notch 2A of the wafer 1 held on the inspection table 82. In this embodiment, the light emitting unit 84 and the light receiving unit 85 are provided corresponding to the size of the wafer 1 such as an 8-inch wafer and a 12-inch wafer. In this configuration, since the detection unit 80 is exposed and arranged on the upper surface 101A of the base 101 , maintenance of each constituent member of the detection unit 80 can also be easily performed.

接著，說明檢測單元80調整缺口2A的位置之動作。圖7是顯示已保持於檢測工作台的晶圓之平面圖。首先，如圖4所示，片匣搬送部60的晶圓搬送臂67是藉由吸引晶圓1，而將晶圓1從晶圓片匣30A搬出，並且將此搬出的晶圓1保持在檢測工作台82上。接著，控制單元90的旋轉控制部91是使檢測工作台82旋轉，並且使發光部84及光接收部85動作以檢測晶圓1的缺口2A的位置。 Next, the operation of the detection unit 80 to adjust the position of the notch 2A will be described. FIG. 7 is a plan view showing a wafer held at an inspection station. First, as shown in FIG. 4 , the wafer transfer arm 67 of the cassette transfer unit 60 carries out the wafer 1 from the wafer cassette 30A by sucking the wafer 1 , and holds the transferred wafer 1 in the cassette 30A. On the detection workbench 82. Next, the rotation control unit 91 of the control unit 90 rotates the detection stage 82 and operates the light emitting unit 84 and the light receiving unit 85 to detect the position of the notch 2A of the wafer 1 .

當檢測晶圓1的缺口2A的位置時，旋轉控制部91是依據缺口2A的位置與脈衝馬達的旋轉位置之關係，來進行將晶圓1的缺口2A朝向預定方向的控制。例如，旋轉控制部91是控制缺口2A的位置，以如圖7所示，使旋轉後之從缺口2A朝向晶圓1(基板2)的中心2O的方向與Y軸方向(分度方向)一致。在此構成中，因為檢測單元80是設置於片匣搬送部60從晶圓片匣30A搬出晶圓1的搬送路徑上，所以可以使將晶圓1搬送至檢測單元的順序簡單化，且容易地在檢測單元80的檢測工作台82上將晶圓1的缺口2A的位置調整成預定的方向。 When detecting the position of the notch 2A of the wafer 1 , the rotation control unit 91 controls the notch 2A of the wafer 1 to face a predetermined direction according to the relationship between the position of the notch 2A and the rotation position of the pulse motor. For example, the rotation control unit 91 controls the position of the notch 2A so that, as shown in FIG. 7 , the direction from the notch 2A toward the center 20 of the wafer 1 (substrate 2 ) after rotation coincides with the Y-axis direction (indexing direction). . In this configuration, since the detection unit 80 is provided on the transport path where the cassette transport unit 60 unloads the wafer 1 from the wafer cassette 30A, the procedure for transporting the wafer 1 to the detection unit can be simplified and easily performed. The position of the notch 2A of the wafer 1 is adjusted to a predetermined direction on the inspection table 82 of the inspection unit 80 .

在此，控制單元90的計算部(計算單元)92是 在已將晶圓1的缺口2A定位於預定的方向之狀態下，從發光部84及光接收部85所檢測的晶圓1的外周緣的位置來分別計算在X軸方向(加工進給方向)及Y軸方向(分度方向、搬出入方向)上晶圓1(基板2)的中心2O與檢測工作台82的中心82O之距離。並且，將所計算出的距離分別設為X軸方向及Y軸方向的偏移量，並於將晶圓1搬送至工作夾台10時補正該偏移量。 Here, the calculation section (calculation unit) 92 of the control unit 90 is In the state where the notch 2A of the wafer 1 has been positioned in a predetermined direction, the positions in the X-axis direction (processing feed direction) are calculated from the positions of the outer periphery of the wafer 1 detected by the light emitting unit 84 and the light receiving unit 85, respectively. ) and the distance between the center 2O of the wafer 1 (substrate 2 ) and the center 82O of the inspection table 82 in the Y-axis direction (indexing direction, loading/unloading direction). Then, the calculated distances are used as offset amounts in the X-axis direction and the Y-axis direction, respectively, and the offset amounts are corrected when the wafer 1 is transferred to the chuck 10 .

接著，說明將已調整缺口2A的位置之晶圓1搬送至工作夾台10的動作。圖8是顯示片匣搬送部將晶圓從檢測工作台朝使其脫離的方向搬送的狀態之圖，圖9是顯示洗淨搬送部已將晶圓搬送至工作夾台的狀態之圖。如圖8所示，已在檢測工作台82調整缺口2A的位置之晶圓1的背面(下表面)6，會再次被片匣搬送部60的晶圓搬送臂67之形成於上表面的真空墊67A所吸引，並且沿著Y軸方向從檢測工作台82脫離。此時，片匣搬送部60是將晶圓1沿著Y軸方向搬送相當於已加減上述之Y軸方向的偏移量的移動距離。藉此，可補正晶圓1的Y軸方向之偏移量。接著，將洗淨搬送部70定位於晶圓1的上方，並且使洗淨搬送部70的保持部75下降，並藉由設置於該保持部75的下表面之吸引墊75A以非接觸狀態來吸引晶圓1的上表面。此時，可以藉由讓晶圓搬送臂67的真空墊67A之吸引停止，而順暢地進行從晶圓搬送臂67往保持部75的移動。將工作夾台10定位到以保持部75所吸引的晶圓1的下方。此時，可將工作夾台10在X軸方向上移動相當於已加減上述之X 軸方向的偏移量的移動距離。藉此，因為也將晶圓1的X軸方向的偏移量補正，所以如圖9所示，可以藉由使被保持部75以非接觸狀態所吸引的晶圓1降下以搬送至工作夾台10上，而將晶圓1的中心2O定位於工作夾台10的中心。 Next, the operation of transferring the wafer 1 with the adjusted position of the notch 2A to the work chuck 10 will be described. FIG. 8 is a diagram showing a state where the cassette transfer unit transfers the wafer from the inspection table in a direction to release it, and FIG. 9 is a diagram showing a state where the wafer is transferred to the work chuck by the cleaning transfer unit. As shown in FIG. 8 , the back side (lower surface) 6 of the wafer 1 that has adjusted the position of the notch 2A on the detection table 82 will be again vacuumed by the wafer transfer arm 67 of the cassette transfer unit 60 formed on the upper surface. The pad 67A is attracted and detached from the detection stage 82 along the Y-axis direction. At this time, the cassette transport unit 60 transports the wafer 1 along the Y-axis direction by a movement distance corresponding to the above-mentioned offset in the Y-axis direction. Thereby, the displacement amount of the wafer 1 in the Y-axis direction can be corrected. Next, the cleaning transfer unit 70 is positioned above the wafer 1, and the holder 75 of the cleaning transfer unit 70 is lowered, and the suction pad 75A provided on the lower surface of the holder 75 is in a non-contact state. Attract the upper surface of wafer 1. At this time, the movement from the wafer transfer arm 67 to the holding portion 75 can be smoothly performed by stopping the suction of the vacuum pad 67A of the wafer transfer arm 67 . The chuck 10 is positioned below the wafer 1 attracted by the holding portion 75 . At this time, the work clamp table 10 can be moved in the X-axis direction, which is equivalent to the addition and subtraction of the above-mentioned X The movement distance of the offset in the axis direction. Thereby, since the offset amount of the wafer 1 in the X-axis direction is also corrected, as shown in FIG. On the stage 10, the center 2O of the wafer 1 is positioned at the center of the work clamp stage 10.

接著，說明將框架單元9收容於檢查用收容部41的動作。圖10是顯示將框架單元搬入至檢查用收容部的收容箱本體的狀態之圖，圖11是顯示將收容箱本體從檢查用收容部取出的狀態之圖。檢查用收容部41是用於觀察加工後的框架單元9或晶圓1的狀態之收容部，並具備收容箱本體110，前述收容箱本體110是讓所選擇的1片框架單元9或晶圓1暫置。如圖3所示，收容箱本體110是具備底板111與兩邊的側板112、112而形成為上表面開放的托盤形狀，在側板112的內表面，是將複數層導軌114於Z軸方向(鉛直方向)上相向而設置，前述導軌114是用於載置所搬入之支撐托盤113，且前述支撐托盤113載置有框架單元9或晶圓1。又，收容箱本體110是形成為可沿著形成於檢查用收容部41的內側面之滑行軌道(滑件)115(圖11)，而在檢查用收容部41內滑行移動。 Next, the operation of housing the frame unit 9 in the inspection housing portion 41 will be described. Fig. 10 is a diagram showing a state in which the frame unit is carried into the storage box body of the inspection storage section, and Fig. 11 is a diagram showing a state in which the storage box body is taken out of the inspection storage section. The receiving part 41 for inspection is a receiving part for observing the state of the frame unit 9 or wafer 1 after processing, and is provided with a storage box body 110. 1 temporarily. As shown in FIG. 3 , the storage box body 110 is provided with a bottom plate 111 and side plates 112 and 112 on both sides and is formed into a tray shape with an open upper surface. direction), the aforementioned guide rails 114 are used to place the loaded support tray 113 , and the aforementioned support tray 113 is loaded with the frame unit 9 or the wafer 1 . Moreover, the storage box main body 110 is formed so that it can slide and move inside the inspection storage part 41 along the sliding rail (slider) 115 (FIG. 11) formed in the inner surface of the inspection storage part 41.

在將框架單元9搬入至檢查用收容部41的收容箱本體110的情況下，如圖10所示，是使檢查用收容部41的第1開口41A露出，並調整片匣載置機構40的高度位置，以使收容箱本體110的底板111與暫置軌道13的高度位置對齊。並且，利用形成於片匣搬送部60的外側臂64A之真空墊64A1，將檢查對象之框架單元9載置於暫置軌道13 上。 When the frame unit 9 is carried into the storage box main body 110 of the inspection storage part 41, as shown in FIG. height position, so that the bottom plate 111 of the storage box body 110 is aligned with the height position of the temporary track 13 . In addition, the frame unit 9 to be inspected is placed on the temporary storage rail 13 by using the vacuum pad 64A1 formed on the outer arm 64A of the cassette conveying part 60 superior.

已載置於暫置軌道13上的框架單元9，是以片匣搬送部60的把持部65來把持框架的緣部9A，並且如圖10所示，通過形成於支撐框架81與基台101的上表面101A之間的間隙86，來搬入至收容箱本體110內。在此情況下，較佳的是在檢查用收容部41的第2開口41D側事先設置鎖定組件(未圖示)，以免收容箱本體110在檢查用收容部41內移動。 The frame unit 9 that has been placed on the provisional rail 13 grips the edge portion 9A of the frame with the grip portion 65 of the cassette conveying portion 60, and as shown in FIG. The gap 86 between the upper surfaces 101A of the upper surface 101A is used to carry it into the storage box body 110 . In this case, it is preferable to provide a lock unit (not shown) on the side of the second opening 41D of the inspection housing portion 41 so as to prevent the storage box main body 110 from moving in the inspection housing portion 41 .

當將框架單元9搬入至收容箱本體110內時，即會自動或藉由作業員來解除鎖定組件，如圖11所示，收容箱本體110是在檢查用收容部41內沿著滑行軌道115滑行移動並且通過第2開口41D而被拉出。據此，就可以簡單地將框架單元9搬入至設置於片匣30的下方的檢查用收容部41內的收容箱本體110，並且簡單地將此收容箱本體110從檢查用收容部41拉出。 When the frame unit 9 is moved into the storage box body 110, the locking assembly will be unlocked automatically or by an operator. As shown in FIG. The slide moves and is pulled out through the second opening 41D. Accordingly, the frame unit 9 can be easily carried into the storage box body 110 in the inspection storage portion 41 provided below the cassette 30, and the storage box body 110 can be easily pulled out from the inspection storage portion 41. .

接著，說明可支撐於收容箱本體110的支撐托盤113。圖12是支撐晶圓的支撐托盤之立體圖。圖13是圖12的部分截面圖。圖14是顯示對是否已將晶圓適當地支撐於支撐托盤進行判定的概略構成之圖。如圖12所示，支撐托盤113是用於將沿著分割預定線3形成有半切溝3A的晶圓1支撐於收容箱本體110內的板狀體，並且形成為和上述之框架單元9的框架7同等的外形尺寸。支撐托盤113具備可在中央載置晶圓1的晶圓載置區域120、及位於此晶圓載置區域120的外側的外周區域121。如圖13所示，支撐托 盤113具備有形成於外周區域121的吸附孔(吸附區域)122、形成於晶圓載置區域120的晶圓吸附孔123、及連通此晶圓吸附孔123與吸附孔122的連通路124。 Next, the supporting tray 113 that can be supported on the storage box body 110 will be described. 12 is a perspective view of a support tray supporting a wafer. FIG. 13 is a partial sectional view of FIG. 12 . FIG. 14 is a diagram showing a schematic configuration for determining whether a wafer is properly supported on a support tray. As shown in FIG. 12 , the support tray 113 is a plate-shaped body for supporting the wafer 1 formed with the half-cut groove 3A along the planned dividing line 3 in the storage box body 110, and is formed to be the same as that of the above-mentioned frame unit 9. Frame 7 has the same overall dimensions. The support tray 113 has a wafer loading area 120 on which the wafer 1 can be placed in the center, and an outer peripheral area 121 located outside the wafer loading area 120 . As shown in Figure 13, the support bracket The tray 113 includes suction holes (suction regions) 122 formed in the outer peripheral region 121 , wafer suction holes 123 formed in the wafer placement region 120 , and communication paths 124 connecting the wafer suction holes 123 and the suction holes 122 .

如圖14所示，吸附孔(吸附區域)122是形成在對應於片匣搬送部60的搬送臂64中的外側臂64A之真空墊64A1的位置。又，晶圓吸附孔123是形成於與晶圓1相向的位置，且已將晶圓1載置於晶圓載置區域120的情況下，晶圓吸附孔123是與晶圓1密合。又，搬送臂64的外側臂64A具備使負壓作用於真空墊64A1的吸引路130，於此吸引路130是透過電磁閥131而連接有負壓源132。又，在吸引路130中，在真空墊64A1與電磁閥131之間具備測定該吸引路130內的壓力之壓力測定部133，此壓力測定部133是連接於控制單元90(圖1)的判定部93。 As shown in FIG. 14 , the suction hole (suction area) 122 is formed at a position corresponding to the vacuum pad 64A1 of the outer arm 64A of the transport arm 64 of the cassette transport unit 60 . Furthermore, the wafer suction hole 123 is formed at a position facing the wafer 1 , and when the wafer 1 is placed on the wafer loading area 120 , the wafer suction hole 123 is in close contact with the wafer 1 . In addition, the outer arm 64A of the transfer arm 64 has a suction path 130 for applying negative pressure to the vacuum pad 64A1 , and a negative pressure source 132 is connected to the suction path 130 via a solenoid valve 131 . Also, in the suction path 130, a pressure measurement unit 133 for measuring the pressure in the suction path 130 is provided between the vacuum pad 64A1 and the electromagnetic valve 131, and the pressure measurement unit 133 is connected to the control unit 90 (FIG. 1) to determine Part 93.

在本實施形態中，當將晶圓1正常地載置於支撐托盤113的晶圓載置區域120時，會使形成於晶圓載置區域120的晶圓吸附孔123與晶圓1密合。在此狀態下，當將外側臂64A的真空墊64A1定位在形成於外周區域121的吸附孔122，並且使負壓作用於此吸附孔122時，會使吸引路130內的壓力降低。因此，判定部93在藉由壓力測定部133所測定到的吸引路130內的壓力降低至預定的閾值以下之情況下，會判定為已將晶圓1正常地載置於晶圓載置區域120。又，藉由壓力測定部133所測定到的吸引路130內的壓力未降低至預定的閾值以下之情況下，判定部93會判定為晶圓1未載置於晶圓載置區域120、或者是以偏移的 狀態(不是正常的狀態)載置。藉此，可以藉由以壓力測定部133所測定到的吸引路130內的壓力值，來正確地判定晶圓1是否正常地載置於晶圓載置區域120。 In the present embodiment, when the wafer 1 is normally placed on the wafer loading area 120 of the support tray 113 , the wafer suction holes 123 formed in the wafer loading area 120 are brought into close contact with the wafer 1 . In this state, when the vacuum pad 64A1 of the outer arm 64A is positioned on the suction hole 122 formed in the outer peripheral region 121 and a negative pressure is applied to the suction hole 122 , the pressure in the suction path 130 decreases. Therefore, the determination unit 93 determines that the wafer 1 has been normally placed on the wafer placement region 120 when the pressure in the suction passage 130 measured by the pressure measurement unit 133 falls below a predetermined threshold value. . In addition, when the pressure in the suction path 130 measured by the pressure measurement unit 133 does not drop below a predetermined threshold value, the determination unit 93 determines that the wafer 1 is not placed on the wafer placement area 120, or that the offset by Status (not normal status) is loaded. Thereby, it is possible to accurately determine whether the wafer 1 is normally placed on the wafer placement area 120 by the pressure value in the suction path 130 measured by the pressure measurement unit 133 .

接著，說明利用上述之支撐托盤113，將晶圓1收容至檢查用收容部41的動作。圖15是顯示片匣搬送部使晶圓從工作夾台脫離的狀態之圖。圖16是顯示將支撐托盤從檢查用收容部的收容箱本體搬出的狀態之圖。圖17是顯示在支撐托盤上載置晶圓的狀態之圖。圖18是顯示將已載置晶圓的支撐托盤搬入檢查用收容部的收容箱本體的狀態之圖。 Next, the operation of storing the wafer 1 in the inspection storage section 41 using the support tray 113 described above will be described. FIG. 15 is a diagram showing a state in which a wafer is detached from a work chuck by a cassette transport unit. Fig. 16 is a diagram showing a state in which the support tray is carried out from the storage box main body of the inspection storage section. FIG. 17 is a diagram showing a state in which a wafer is placed on a support tray. 18 is a view showing a state in which the support tray on which the wafer is placed is carried into the storage box main body of the inspection storage section.

在將加工後的晶圓1搬入檢查用收容部41的收容箱本體110的情況下，如圖15所示，是將配置於工作夾台10上的晶圓1，利用形成於片匣搬送部60的內側臂64B的吸引墊64B1，以非接觸狀態來吸引檢查對象的晶圓1並使其從工作夾台10脫離。 In the case of carrying the processed wafer 1 into the storage box body 110 of the inspection storage unit 41, as shown in FIG. The suction pad 64B1 of the inner arm 64B of the wafer 60 suctions and detaches the wafer 1 to be inspected from the chuck 10 in a non-contact state.

接著，如圖16所示，使檢查用收容部41的第1開口41A露出，並調整片匣載置機構40的高度位置，以使收容箱本體110的底板111與暫置軌道13的高度位置對齊。並且，通過形成於支撐框架81與基台101的上表面101A之間的間隙86，來將片匣搬送部60的把持部65***至收容箱本體110內。把持部65是把持配置於收容箱本體110內的支撐托盤113的緣部113A，並且將支撐托盤113搬出至收容箱本體110的外側而載置於暫置軌道13上。 Next, as shown in FIG. 16 , the first opening 41A of the inspection accommodating portion 41 is exposed, and the height position of the cassette loading mechanism 40 is adjusted so that the height position between the bottom plate 111 of the storage box body 110 and the temporary rail 13 align. Then, the gripping portion 65 of the cassette transport portion 60 is inserted into the storage box main body 110 through the gap 86 formed between the support frame 81 and the upper surface 101A of the base 101 . The gripping portion 65 grips the edge portion 113A of the support tray 113 arranged in the storage box body 110 , and carries the support tray 113 out to the outside of the storage box body 110 to be placed on the temporary storage rail 13 .

接著，如圖17所示，將被片匣搬送部60中的 內側臂64B的吸引墊64B1以非接觸狀態所保持的檢查對象之晶圓1，載置到已載置在暫置軌道13上的支撐托盤113。此時，將片匣搬送部60中的外側臂64A的真空墊64A1定位在支撐托盤113之形成於外周區域121的吸附孔122，並且使負壓作用於此吸附孔122。並且，藉由以壓力測定部133所測定到的吸引路130內的壓力是否已降低至預定的閾值以下，來判定是否已將晶圓1正常地載置於晶圓載置區域120。在晶圓1並未正常地載置於晶圓載置區域120的情況下，可利用內側臂64B的吸引墊64B1來再次將晶圓1載置於晶圓載置區域120，亦可直接將載置不良設為錯誤並發出警報。 Next, as shown in FIG. 17, the The wafer 1 to be inspected, which is held by the suction pad 64B1 of the inner arm 64B in a non-contact state, is placed on the support tray 113 placed on the provisional rail 13 . At this time, the vacuum pad 64A1 of the outer arm 64A in the cassette transport unit 60 is positioned on the suction hole 122 formed in the outer peripheral region 121 of the support tray 113, and negative pressure is applied to the suction hole 122. Then, whether the wafer 1 is normally placed on the wafer placement area 120 is determined by whether the pressure in the suction path 130 measured by the pressure measurement unit 133 has fallen below a predetermined threshold. When the wafer 1 is not normally placed on the wafer loading area 120, the suction pad 64B1 of the inner arm 64B can be used to place the wafer 1 on the wafer loading area 120 again, or the wafer 1 can be placed directly on the wafer loading area 120. Defects are set to error and an alert is issued.

另一方面，在已將晶圓正常地載置於晶圓載置區域120的情況下，如圖18所示，片匣搬送部60的把持部65是把持支撐托盤113的緣部113A，並且通過形成於支撐框架81與基台101的上表面101A之間的間隙86，來將載置有晶圓1的支撐托盤113搬入至收容箱本體110內。在此情況下，也是宜在檢查用收容部41的第2開口41D側事先設置鎖定組件(未圖示)，以免收容箱本體110在檢查用收容部41內移動。 On the other hand, when the wafer is normally placed on the wafer loading area 120, as shown in FIG. The gap 86 formed between the support frame 81 and the upper surface 101A of the base 101 is used to carry the support tray 113 on which the wafer 1 is placed into the storage box body 110 . Also in this case, it is preferable to provide a locking unit (not shown) on the side of the second opening 41D of the inspection receiving portion 41 in advance so as to prevent the storage box body 110 from moving in the inspection receiving portion 41 .

當將支撐托盤113搬入至收容箱本體110內時，會自動或藉由作業員來解除鎖定組件，和框架單元9的情況同樣地，收容箱本體110是在檢查用收容部41內沿著滑行軌道115滑行移動並且通過第2開口41D而被拉出。據此，就可以簡單地將晶圓1搬入至設置於片匣30的 下方的檢查用收容部41內的收容箱本體110，並且簡單地將此收容箱本體110從檢查用收容部41拉出。 When the support tray 113 is moved into the storage box body 110, the lock assembly will be released automatically or by an operator. Like the case of the frame unit 9, the storage box body 110 slides along the inside of the inspection storage part 41. The rail 115 slides and is pulled out through the second opening 41D. Accordingly, the wafer 1 can be simply loaded into the cassette 30. The storage box body 110 in the lower inspection storage part 41 is simply pulled out from the inspection storage part 41 .

如以上所說明，本實施形態的加工裝置100具備：工作夾台10，以保持面11A來保持晶圓1；切割單元20，對工作夾台10所保持的晶圓1進行切割加工；加工進給單元，將工作夾台10朝與保持面11A平行的方向加工進給；片匣載置機構40，載置收容晶圓1的晶圓片匣30A，且可升降；檢測單元80，檢測表示晶圓1的結晶方位之缺口2A的方向；片匣搬送部60及洗淨搬送部70，將晶圓1從已載置於片匣載置機構40的晶圓片匣30A搬出並搬入工作夾台10，檢測單元80具備：檢測工作台82，保持晶圓1，並且比晶圓1更小徑；發光部84及光接收部85，設置於已保持於檢測工作台82的晶圓1的外周以檢測缺口2A；及旋轉控制部91，使檢測工作台82旋轉，以讓所檢測出的缺口2A朝向預定的方向，檢測工作台82是設置在片匣搬送部60從晶圓片匣30A搬出晶圓1的搬送路徑上。因此，可以抑制搬送晶圓1的路徑之繁雜化，而簡單地進行晶圓1的缺口2A之對位。再者，可以實現檢測單元80的維護性之提升。 As described above, the processing apparatus 100 of the present embodiment includes: the work chuck 10 holding the wafer 1 with the holding surface 11A; the dicing unit 20 for dicing the wafer 1 held by the work chuck 10; The feeding unit is used to process and feed the work clamp table 10 in a direction parallel to the holding surface 11A; the cassette loading mechanism 40 is used to load the wafer cassette 30A containing the wafer 1 and can be lifted; the detection unit 80 is used to detect and indicate The direction of the notch 2A of the crystal orientation of the wafer 1; the cassette transfer unit 60 and the cleaning transfer unit 70 carry the wafer 1 out of the wafer cassette 30A placed on the cassette loading mechanism 40 and into the work holder The table 10 and the detection unit 80 are equipped with: a detection workbench 82, which holds the wafer 1, and is smaller in diameter than the wafer 1; The outer circumference is used to detect the gap 2A; and the rotation control part 91 rotates the detection table 82 so that the detected gap 2A faces a predetermined direction. On the transport path for unloading wafer 1. Therefore, the alignment of the notch 2A of the wafer 1 can be easily performed while suppressing the complication of the route for transferring the wafer 1 . Furthermore, the maintainability of the detection unit 80 can be improved.

又，根據本實施形態，因為是設為下述構成：檢測工作台82的中心82O與晶圓片匣30A的開口30A1之距離比晶圓1的半徑更小，且以已保持於檢測工作台82晶圓1的一部分仍在晶圓片匣30A內之狀態來檢測缺口2A，所以，可以利用片匣搬送部60的晶圓搬送臂67，將已從晶圓片匣30A搬出的晶圓1快速地保持在檢測工作台 82上，並且可以有效地利用加工裝置100的空間來檢測缺口2A的位置。 Also, according to the present embodiment, since the distance between the center 82O of the inspection table 82 and the opening 30A1 of the wafer cassette 30A is smaller than the radius of the wafer 1, and the distance between the center 820 of the inspection table 82 and the opening 30A1 of the wafer cassette 30A is smaller than that of the wafer 1, the wafer 1 is held on the inspection table. 82 A part of the wafer 1 is still in the state of the wafer cassette 30A to detect the notch 2A, so the wafer 1 that has been carried out from the wafer cassette 30A can be transported by the wafer transfer arm 67 of the cassette transfer unit 60. Quickly hold on to the detection bench 82, and can effectively use the space of the processing device 100 to detect the position of the notch 2A.

又，根據本實施形態，檢測單元80具備計算部92，前述計算部92是從發光部84及光接收部85所檢測的晶圓1的外周緣的位置來計算晶圓1的中心2O與檢測工作台82的中心82O之距離，此計算部92是在已將晶圓1的缺口2A朝向預定的方向的狀態下，來分別計算晶圓1的中心2O與檢測工作台82的中心82O之X軸方向(加工進給方向)以及Y軸方向(分度方向、搬出入方向)的距離，因為片匣搬送部60及洗淨搬送部70是依據所計算出的距離來調整移動距離，以將晶圓1的中心2O定位於工作夾台10的中心，所以可以容易地進行將已配置於工作夾台10上的晶圓1的切割道的位置找出之校準。 Also, according to the present embodiment, the detection unit 80 includes a calculation unit 92, and the calculation unit 92 calculates the center 20 of the wafer 1 from the position of the outer periphery of the wafer 1 detected by the light emitting unit 84 and the light receiving unit 85 and detects the position. The distance between the center 82O of the workbench 82, the calculation unit 92 calculates the distance between the center 2O of the wafer 1 and the center 82O of the detection workbench 82 in the state where the notch 2A of the wafer 1 is oriented in a predetermined direction. Axial direction (processing feed direction) and Y-axis direction (indexing direction, carrying in and out direction), because the cassette conveying part 60 and cleaning conveying part 70 adjust the moving distance according to the calculated distance, so as to Since the center 2O of the wafer 1 is positioned at the center of the work chuck 10, calibration for finding the position of the dicing line of the wafer 1 already placed on the work chuck 10 can be easily performed.

根據本實施形態，因為片匣30是從晶圓片匣30A與框架片匣30B進行選擇並載置於片匣載置機構40，其中前述晶圓片匣30A是直接支撐晶圓1的片匣，前述框架片匣30B是收容已將晶圓1以黏著膠帶8支撐在框架7的開口7a之框架單元9的片匣，片匣搬送部60具有以非接觸狀態來吸引保持晶圓1的吸引墊64B1、保持晶圓1的真空墊67A、及保持框架單元9的框架7之真空墊64A1，洗淨搬送部70具有以非接觸狀態來吸引保持晶圓1的吸引墊75A、及保持框架單元9的框架7之真空墊75B，且本發明更具備一對暫置軌道13，前述暫置軌道13是供從框架片匣30B搬出的框架單元9在搬入該工作夾台10之前暫置的軌道，所 以可以有效率地搬送晶圓1與框架單元9之類的不同的被加工物。 According to this embodiment, because the cassette 30 is selected from the wafer cassette 30A and the frame cassette 30B and loaded on the cassette loading mechanism 40, wherein the wafer cassette 30A is a cassette that directly supports the wafer 1 The aforementioned frame magazine 30B is a magazine for accommodating the frame unit 9 that has supported the wafer 1 on the opening 7a of the frame 7 with the adhesive tape 8. The pad 64B1, the vacuum pad 67A for holding the wafer 1, and the vacuum pad 64A1 for holding the frame 7 of the frame unit 9, the cleaning transfer unit 70 has a suction pad 75A for sucking and holding the wafer 1 in a non-contact state, and a holding frame unit The vacuum pad 75B of the frame 7 of 9, and the present invention is further equipped with a pair of temporary rails 13, the aforementioned temporary rails 13 are rails for the frame unit 9 that is carried out from the frame cassette 30B before being moved into the work clamping table 10 ,Place Different workpieces such as the wafer 1 and the frame unit 9 can be efficiently transferred.

又，因為具備檢查用收容部41，前述檢查用收容部41是設置於片匣載置機構40的下側，並和片匣載置機構40一起升降，且可暫置檢查用的晶圓1或框架單元9，且檢查用收容部41具備：收容箱本體110，具有支撐托盤113，前述支撐托盤113是支撐藉由片匣搬送部60或洗淨搬送部70而水平地搬入檢查用收容部41的晶圓1或框架單元9；及滑行軌道115，將收容箱本體110支撐成可從片匣載置機構40之下方的檢查用收容部41拉出，所以可以簡單地將晶圓1或框架單元9搬入至設置於片匣30的下方的檢查用收容部41內的收容箱本體110，並且簡單地將此收容箱本體110從檢查用收容部41拉出。又，根據本實施形態，可以實現檢測單元80與檢查用收容部41之雙方的功能，並且可以很緊密(compact)地且很集中地配置雙方。 Also, because of the inspection container 41, the inspection container 41 is arranged on the lower side of the cassette loading mechanism 40, and moves up and down together with the cassette loading mechanism 40, and can temporarily store the wafer 1 for inspection. Or the frame unit 9, and the storage unit 41 for inspection is equipped with: the storage box body 110 has a support tray 113, and the aforementioned support tray 113 is supported by the cassette transport unit 60 or the cleaning transport unit 70 and is horizontally carried into the storage unit for inspection. Wafer 1 or frame unit 9 of 41; and slide track 115, support box body 110 to be able to be pulled out from inspection receiving part 41 below cassette loading mechanism 40, so wafer 1 or The frame unit 9 is loaded into the storage box body 110 provided in the inspection storage portion 41 below the cassette 30 , and the storage box body 110 is simply pulled out from the inspection storage portion 41 . Also, according to the present embodiment, both the functions of the detection unit 80 and the inspection storage unit 41 can be realized, and both can be arranged compactly and intensively.

再者，本發明並不限定於上述實施形態。亦即，在不脫離本發明之要點的範圍內，可以進行各種變形來實施。 In addition, this invention is not limited to the said embodiment. That is, various modifications and implementations are possible without departing from the gist of the present invention.

1:晶圓 1: Wafer

2A:缺口 2A: Gap

7:框架(環狀框架) 7: Frame (ring frame)

8:黏著膠帶 8: Adhesive tape

9:框架單元 9: Frame unit

10:工作夾台 10: Work clamp table

11:吸附夾頭 11: Adsorption chuck

11A、82A:保持面 11A, 82A: holding surface

12、14:支撐構造 12, 14: Support structure

13:暫置軌道(暫置區域) 13: Temporary track (temporary area)

17、62、72:移動單元 17, 62, 72: mobile units

20:切割單元(加工單元) 20: Cutting unit (processing unit)

21:切割刀片 21: Cutting blade

30:片匣 30: Cassette

30A:晶圓片匣 30A:Wafer Cassette

30B:框架片匣 30B: Frame Cassette

40:片匣載置機構 40: Cassette loading mechanism

50:洗淨部 50: cleaning department

60:片匣搬送部(搬送單元) 60: Cassette conveying part (conveying unit)

61、66、71、114:導軌 61, 66, 71, 114: guide rail

61A、71A:滾珠螺桿 61A, 71A: ball screw

63、74:汽缸部 63, 74: Cylinder department

64:搬送臂 64: Transfer arm

65:把持部 65: control department

67:晶圓搬送臂 67:Wafer transfer arm

68:驅動部 68: Drive Department

70:洗淨搬送部(搬送單元) 70: Cleaning and conveying part (conveying unit)

73:臂部 73: Arm

75:保持部 75: Keeping Department

80:檢測單元 80: detection unit

81:支撐框架 81: Support frame

81A、101A:上表面 81A, 101A: upper surface

82:檢測工作台 82: Detection workbench

83:感測器框架 83:Sensor frame

84:發光部(感測器部) 84: Light emitting part (sensor part)

90:控制單元 90: Control unit

91:旋轉控制部 91:Rotary control unit

92:計算部(計算單元) 92: Calculation department (computing unit)

93:判定部 93: Judgment Department

100:加工裝置 100: Processing device

101:基台 101: Abutment

110:收容箱本體 110: Containment box body

111:底板 111: Bottom plate

112:側板 112: side panel

113:支撐托盤 113: support tray

X、Y、Z:方向 X, Y, Z: direction

Claims (7)

一種加工裝置，是對晶圓進行加工的加工裝置，並具備：工作夾台，以保持面來保持晶圓；加工單元，對已保持於該工作夾台的晶圓進行加工；加工進給單元，將該工作夾台朝與該保持面平行的方向加工進給；片匣載置台，載置收容晶圓的片匣，並且可升降；檢測單元，檢測表示晶圓的結晶方位之缺口的方向；及搬送單元，將晶圓從已載置於該片匣載置台的該片匣搬出並搬入該工作夾台，該檢測單元具備：檢測工作台，保持晶圓，並且比該晶圓更小徑；感測器部，設置於已保持於該檢測工作台的晶圓的外周以檢測該缺口；及旋轉控制部，使該檢測工作台旋轉，以讓所檢測出的該缺口朝向預定的方向，該檢測工作台是設置於該搬送單元從該片匣搬出該晶圓的搬送路徑上。 A processing device is a processing device for processing wafers, and includes: a work chuck for holding the wafer with a holding surface; a processing unit for processing the wafer held by the work chuck; a processing feed unit , the work clamping table is processed and fed in a direction parallel to the holding surface; the cassette loading table is loaded with the cassette containing the wafer, and can be lifted; the detection unit detects the direction of the notch indicating the crystal orientation of the wafer ; and a transfer unit that unloads the wafer from the cassette that has been placed on the cassette loading table and into the work clamping table, the detection unit is equipped with: a detection table that holds the wafer and is smaller than the wafer diameter; the sensor part is installed on the outer periphery of the wafer held on the detection table to detect the notch; and the rotation control part rotates the detection table so that the detected notch faces a predetermined direction , the detection workbench is set on the transport path where the transport unit unloads the wafer from the magazine. 如請求項1之加工裝置，其中該檢測工作台的中心與該片匣的距離是比該晶圓的半徑更小，且是以已保持於該檢測工作台的該晶圓的一部分仍在該片匣內之狀態來檢測該缺口。 The processing device as claimed in claim 1, wherein the distance between the center of the inspection table and the cassette is smaller than the radius of the wafer, and a part of the wafer that has been held on the inspection table is still in the inspection table. The state of the cassette is used to detect the gap. 如請求項1之加工裝置，其中該檢測單元具備計算單元，前述計算單元是從該感測器部所檢測的該晶圓的外周緣的位置來計算晶圓的中心與該檢測工作台的中心之距離，該計算單元是計算已將該晶圓的該缺口朝向該預定的方向的狀態下的該晶圓的中心與該檢測工作台的中心之距離，該搬送單元是依據所計算出的該距離來調整移動距離，以將該晶 圓的中心定位於該工作夾台的中心。 The processing device according to claim 1, wherein the detection unit has a calculation unit, and the calculation unit calculates the center of the wafer and the center of the detection table from the position of the outer periphery of the wafer detected by the sensor unit The calculation unit is to calculate the distance between the center of the wafer and the center of the inspection table under the condition that the notch of the wafer is oriented in the predetermined direction, and the transfer unit is based on the calculated distance distance to adjust the moving distance so that the crystal The center of the circle is positioned at the center of the work clamp. 如請求項2之加工裝置，其中該檢測單元具備計算單元，前述計算單元是從該感測器部所檢測的該晶圓的外周緣的位置來計算晶圓的中心與該檢測工作台的中心之距離，該計算單元是計算已將該晶圓的該缺口朝向該預定的方向的狀態下的該晶圓的中心與該檢測工作台的中心之距離，該搬送單元是依據所計算出的該距離來調整移動距離，以將該晶圓的中心定位於該工作夾台的中心。 The processing device according to claim 2, wherein the detection unit has a calculation unit, and the calculation unit calculates the center of the wafer and the center of the detection table from the position of the outer periphery of the wafer detected by the sensor unit The calculation unit is to calculate the distance between the center of the wafer and the center of the inspection table under the condition that the notch of the wafer is oriented in the predetermined direction, and the transfer unit is based on the calculated distance The moving distance is adjusted to position the center of the wafer at the center of the work clamp. 如請求項1至4中任一項之加工裝置，其中該片匣是從晶圓片匣與框架片匣進行選擇並載置於該片匣載置台，前述晶圓片匣是直接支撐晶圓的片匣，前述框架片匣是收容已將晶圓以黏著膠帶支撐在環狀框架的開口之框架單元的片匣，該搬送單元具有吸引保持該晶圓之晶圓保持部、及保持該框架單元的該環狀框架之框架保持部，該加工裝置更具備暫置區域，前述暫置區域是供從該框架片匣搬出的該框架單元在搬入該工作夾台之前暫置的區域。 The processing device according to any one of claims 1 to 4, wherein the cassette is selected from a wafer cassette and a frame cassette and placed on the cassette loading table, and the wafer cassette directly supports the wafer The aforementioned frame cassette is a cassette for accommodating a frame unit that has supported a wafer on an opening of a ring frame with an adhesive tape, and the transfer unit has a wafer holding portion that attracts and holds the wafer, and holds the frame The frame holding part of the ring frame of the unit, the processing device further has a temporary storage area, and the temporary storage area is an area for the frame unit carried out from the frame cassette to be temporarily stored before being loaded into the work clamp. 如請求項1至4中任一項之加工裝置，其具備檢查用收容部，前述檢查用收容部是設置於該片匣載置台的下側，而和該片匣載置台一起升降，且可暫置檢查用的晶圓或框架單元，該檢查用收容部具備：支撐托盤，支撐藉由該搬送單元水平地搬入的該晶圓或該框架單元；及滑件，將該支撐托盤支撐成可從該片匣載置台的下方拉出。 The processing device according to any one of Claims 1 to 4, which is equipped with an inspection storage part, the aforementioned inspection storage part is arranged on the lower side of the cassette loading table, and can be lifted and lowered together with the cassette loading table, and can The wafer or the frame unit for inspection is temporarily placed, and the storage unit for inspection includes: a support tray supporting the wafer or the frame unit carried in horizontally by the transfer unit; and a slider supporting the support tray so as to be able to Pull it out from under the cassette holder. 如請求項5之加工裝置，其具備檢查用收容部，前述檢查用收容部是設置於該片匣載置台的下側，而和該片匣載置台一起升降，且可暫置檢查用的晶圓或框架單元， 該檢查用收容部具備：支撐托盤，支撐藉由該搬送單元水平地搬入的該晶圓或該框架單元；及滑件，將該支撐托盤支撐成可從該片匣載置台的下方拉出。 The processing device as in claim 5, which is equipped with an inspection storage section, the aforesaid inspection storage section is arranged on the lower side of the cassette loading table, and rises and falls together with the cassette loading table, and can temporarily store the crystals for inspection. circle or frame elements, The storage unit for inspection includes: a support tray supporting the wafer or the frame unit carried in horizontally by the transfer unit; and a slider supporting the support tray so as to be drawn out from under the cassette mounting table.
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