TW201830559A - Transport mechanism of processing apparatus comprising the loading and unloading beds and a chuck bed to reduce the loading burden - Google Patents
Transport mechanism of processing apparatus comprising the loading and unloading beds and a chuck bed to reduce the loading burden Download PDFInfo
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- TW201830559A TW201830559A TW106138567A TW106138567A TW201830559A TW 201830559 A TW201830559 A TW 201830559A TW 106138567 A TW106138567 A TW 106138567A TW 106138567 A TW106138567 A TW 106138567A TW 201830559 A TW201830559 A TW 201830559A
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- 238000012545 processing Methods 0.000 title claims abstract description 122
- 230000007723 transport mechanism Effects 0.000 title abstract description 12
- 125000006850 spacer group Chemical group 0.000 claims abstract description 84
- 230000007246 mechanism Effects 0.000 claims description 44
- 239000002390 adhesive tape Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 4
- 230000032258 transport Effects 0.000 abstract 2
- 238000005520 cutting process Methods 0.000 description 28
- 238000012546 transfer Methods 0.000 description 10
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
本發明有關加工裝置的搬運機構。The present invention relates to a conveying mechanism of a processing device.
以往，在用在半導體裝置或封裝裝置、陶瓷基板、玻璃基板這類的電子機器之各種裝置的分割加工中，使用有設置在無塵室內的切削裝置或雷射加工裝置。例如，在專利文獻1，揭示出具有載置已載置了被加工物的卡匣之卡匣載置部，藉由搬出搬入手段從卡匣搬出搬入切削加工前後的被加工物之切削裝置。理想上，這樣的加工裝置在削減無塵室的建設成本或維持成本的目的下，是圖求省空間化。在專利文獻2，揭示出把鄰接的切割裝置彼此相互地對向配置，或是把配管區域共用化，藉此，圖求切割裝置的省空間化。 [先前技術文獻] [專利文獻]Conventionally, a cutting device or a laser processing device provided in a clean room has been used for the division processing of various devices used in electronic devices such as semiconductor devices, packaging devices, ceramic substrates, and glass substrates. For example, Patent Document 1 discloses a cutting device having a cassette mounting portion on which a cassette on which a workpiece is mounted is loaded and unloaded from the cassette by a loading and unloading means. Ideally, such a processing device is intended to save space in order to reduce the construction cost or maintenance cost of a clean room. Patent Document 2 discloses that adjacent cutting devices are arranged to face each other, or a piping area is shared, thereby achieving space saving of the cutting devices. [Prior Art Literature] [Patent Literature]
[專利文獻1] 日本特開2010-272842號專利公報 [專利文獻2] 日本特開2013-254834號專利公報[Patent Document 1] Japanese Patent Laid-Open No. 2010-272842 [Patent Document 2] Japanese Patent Laid-Open No. 2013-254834
[發明欲解決之課題][Questions to be Solved by the Invention]
上述專利文獻2記載的切割裝置，並不具備搬運被加工物之搬運機構。如此，以省略搬運機構的方式，可以圖求加工裝置的省空間化。但是，省略搬運機構的話，操作人員一定要每進行一次加工前後中的被加工物之朝夾盤床臺上的搬運。為此，增加有關搬運的工時，增加操作人員的負擔或必要的人員，是有招致加工成本的增加之虞。The cutting device described in the aforementioned Patent Document 2 does not include a conveying mechanism for conveying a workpiece. In this way, by omitting the conveyance mechanism, it is possible to achieve space saving of the processing apparatus. However, if the conveying mechanism is omitted, the operator must move the workpiece toward the chuck bed before and after each processing. For this reason, increasing the man-hours related to transportation, increasing the burden on operators, or necessary personnel may cause an increase in processing costs.
本發明為有鑑於上述而為之創作，其目的在於一邊維持加工裝置的省空間化，一邊減低有關被加工物的搬運之操作人員的負擔。 [解決課題之手段]The present invention has been made in view of the above, and an object of the present invention is to reduce the burden on the operator of the processing of an object while maintaining the space saving of a processing device. [Means for solving problems]
為了解決上述課題並達成目的，本發明係一種加工裝置的搬運機構，係被設置到加工裝置，把該被加工物搬出搬入到該搬出搬入區域的該夾盤床臺；該加工裝置具備：夾盤床臺，其係保持被加工物；加工單元，其係加工被保持在該夾盤床臺的該被加工物；以及加工進給單元，其係在加工該被加工物的加工區域與搬出搬入該被加工物的搬出搬入區域之間朝加工進給方向移動該夾盤床臺；其特徵為，該加工裝置的搬運機構具備：裝載床臺，其係與該搬出搬入區域鄰接，在該加工進給單元的側方的區域，透過間隔件層疊並支撐被加工物；卸載床臺，其係與該搬出搬入區域鄰接，在包挾該加工進給單元而與該裝載床臺為相反側的區域，透過該間隔件層疊並支撐加工後的該被加工物；以及搬運單元，其係具備被加工物支撐部與間隔件支撐部，從該裝載床臺搬出該被加工物與該間隔件，然後僅把該被加工物搬入到該夾盤床臺，把從該裝載床臺搬出後持續支撐的該間隔件堆疊到加工後的該被加工物，然後從該夾盤床臺搬入到該卸載床臺。In order to solve the above-mentioned problems and achieve the object, the present invention relates to a conveying mechanism of a processing device. The chuck bed is installed in a processing device and carries the processed object into and out of the carrying-in area. The processing device includes: A disk bed that holds the workpiece; a processing unit that processes the workpiece that is held on the chuck bed; and a processing feed unit that is in the processing area and removes the workpiece The chuck bed is moved between the carry-in and carry-in areas of the work object toward the processing feed direction; the carrying mechanism of the processing apparatus is provided with a loading bed that is adjacent to the carry-in and carry-out area, and The side area of the processing feed unit is stacked and supported by the spacer through the spacer; the unloading bed is adjacent to the loading and unloading area, and the processing feed unit is contained on the opposite side to the loading bed. The workpiece is stacked and supported by the spacer through the spacer; and the transport unit includes a workpiece support and a spacer support, and is carried from the loading bed. The object to be processed and the spacer, and then only the object to be processed is transferred to the chuck bed, and the spacer that is continuously supported after being removed from the loading table is stacked to the object to be processed, and then The chuck bed is moved into the unloading bed.
理想上，該搬運單元具備：裝載床臺移動單元，其係使該裝載床臺移動到位置在該搬出搬入區域之該夾盤床臺的正上的正上區域；卸載床臺移動單元，其係使該卸載床臺移動到該正上區域；以及載換單元，其係移動在垂直方向，在位置在該搬出搬入區域之該夾盤床臺、與位置在該正上區域之該裝載床臺或是該卸載床臺之間，搬運該被加工物與該間隔件。Ideally, the handling unit is provided with: a loading bed moving unit that moves the loading bed to an area directly above the chuck bed in the loading and unloading area; and an unloading bed moving unit, which The unloading bed is moved to the directly above area; and the loading and unloading unit is moved in the vertical direction, the chuck bed in the loading and unloading area, and the loading bed in the directly above area. The workpiece or the spacer is carried between the table or the unloading bed.
而且，理想上，該被加工物乃是用黏著膠帶支撐被加工物到環狀框的開口之框架單元；該裝載床臺或是該卸載床臺具備：抵接部，其係規範制約該框架單元移動在面方向。 [發明效果]Moreover, ideally, the workpiece is a frame unit that supports the workpiece to the opening of the ring frame with an adhesive tape; the loading bed or the unloading bed is provided with: an abutment portion, which is a specification that restricts the frame The element moves in the face direction. [Inventive effect]
有關本發明的加工裝置的搬運機構，係在與加工裝置的搬出搬入區域鄰接的空間配置裝載床臺與卸載床臺，在裝載床臺及卸載床臺與夾盤床臺之間藉由搬運單元搬出搬入被加工物。經此，可以一方面利用搬出搬入區域的兩側的空間一方面設置搬運機構到加工裝置的緣故，不會使加工裝置大型化，可以實現搬運機構所致之被加工物的自動搬出搬入。因此，本發明的加工裝置的搬運機構，可以一邊維持加工裝置的省空間化，一邊減低有關被加工物的搬運之操作人員的負擔，發揮了這樣的效果。The conveyance mechanism of the processing apparatus of this invention arranges a loading bed and an unloading bed in the space adjacent to the carrying-in / out area of a processing device, and a conveying unit is provided between a loading bed and an unloading bed, and a chuck bed Move in and out the workpiece. As a result, it is possible to use the space on both sides of the loading / unloading area to set up the conveying mechanism to the processing device on the one hand, without increasing the size of the processing device, and to realize the automatic loading and unloading of the workpiece caused by the conveying mechanism. Therefore, the conveying mechanism of the processing device of the present invention can reduce the burden on the operator of the conveyance of the processed object while maintaining the space saving of the processing device, and exerts such an effect.
有關用於實施本發明的型態(實施方式)，一邊參閱圖面，詳細說明之。並沒有藉由記載在以下的實施方式的內容來限定本發明。而且，在以下記載的構成要件，是包含所屬技術領域中具有通常知識者容易假想、或實質上相同者。更進一步，以下記載的構成可以適宜組合。而且，可以在不逸脫本發明的要旨的範圍下，進行構成之種種省略、置換或是變更。The form (embodiment) for implementing the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include those that are easily assumed by those with ordinary knowledge in the technical field to which they belong, or are substantially the same. Furthermore, the structures described below can be appropriately combined. In addition, various omissions, substitutions, or changes can be made in the scope without departing from the gist of the present invention.
圖1為表示具備有關實施方式之加工裝置的搬運機構之加工裝置的概略之立體圖。圖1表示的加工裝置1，乃是對被加工物施以切削加工的加工裝置。加工裝置1係如圖1表示，具備：夾盤床臺10、加工單元20、加工進給單元31、分度進給單元32、切削進給單元33、以及與實施方式有關的加工裝置的搬運機構40。FIG. 1 is a perspective view schematically showing a processing apparatus including a transport mechanism of a processing apparatus according to the embodiment. The processing device 1 shown in FIG. 1 is a processing device that performs cutting processing on a workpiece. As shown in FIG. 1, the processing device 1 includes a chuck table 10, a processing unit 20, a processing feed unit 31, an indexing feed unit 32, a cutting feed unit 33, and a conveyance of a processing device according to the embodiment. Agency 40.
經由加工裝置1而被切削加工的被加工物W並沒有特別限定，可以是例如以矽、藍寶石、鎵等為母材之板狀的半導體晶圓或光元件晶圓、陶瓷、玻璃、藍寶石系的板狀的無機材料基板、金屬或樹脂等的板狀的延性材料等、各種的板狀的加工材料。被加工物W係如圖1表示，透過黏著膠帶T被固定到環狀框F的開口F1(參閱圖2)，與環狀框F一起形成框架單元FU。亦即，本實施方式中，被加工物成為被加工物W被黏著膠帶T支撐在環狀框F的開口F1的框架單元FU的型態。The workpiece W to be cut through the processing device 1 is not particularly limited, and may be, for example, a plate-shaped semiconductor wafer or optical element wafer made of silicon, sapphire, gallium, or the like as a base material, ceramic, glass, or sapphire. Various plate-shaped processing materials such as plate-shaped inorganic material substrates, plate-shaped ductile materials such as metals and resins, and the like. As shown in FIG. 1, the workpiece W is fixed to the opening F1 (see FIG. 2) of the ring frame F through the adhesive tape T, and forms a frame unit FU together with the ring frame F. That is, in the present embodiment, the processed object is in the form of the frame unit FU of the processed object W supported by the opening F1 of the ring frame F by the adhesive tape T.
夾盤床臺10例如用具備吸引通路的金屬或多孔陶瓷來構成，具有吸附保持被加工物W之盤狀的保持面10a。夾盤床臺10係透過真空吸引路徑(未圖示)來與真空吸引源(未圖示)連接，以吸引被載置在保持面10a的被加工物W的方式來進行保持。夾盤床臺10係藉由加工進給單元31自由移動在加工進給方向(圖1表示的X軸方向)。而且，夾盤床臺10設置成利用旋轉驅動源(未圖示)來繞與Z軸平行的中心軸線自由旋轉。The chuck bed 10 is made of, for example, a metal or a porous ceramic having a suction channel, and has a disk-shaped holding surface 10 a that holds and holds a workpiece W. The chuck bed 10 is connected to a vacuum suction source (not shown) through a vacuum suction path (not shown), and is held so as to attract the workpiece W placed on the holding surface 10a. The chuck table 10 is freely moved in the processing feed direction (the X-axis direction shown in FIG. 1) by the processing feed unit 31. The chuck bed 10 is provided to rotate freely around a central axis parallel to the Z axis by a rotation drive source (not shown).
加工單元20係對被保持在夾盤床臺10的被加工物W做切削加工。加工單元20係被安裝在設在裝置本體2之門型的柱部3上，透過分度進給單元32及切削進給單元33，可移動在分度進給方向(圖1表示的Y軸方向)及切削進給方向(圖1表示的Z軸方向)。加工單元20係如圖1表示，具備：對被保持在夾盤床臺10的被加工物W進行加工之2個切削刀片21、各安裝有切削刀片21之2個心軸22、以及支撐各心軸22之2個罩殼23。切削刀片21為極薄的圓板狀，且形成為環狀之切削磨石。心軸22係安裝切削刀片21成可以裝卸。罩殼23具有馬達等的驅動源，支撐心軸22成繞Y軸自由旋轉。The processing unit 20 performs a cutting process on the workpiece W held on the chuck table 10. The processing unit 20 is mounted on the gate portion 3 provided on the gate body of the apparatus body 2. The indexing feed unit 32 and the cutting feed unit 33 can be moved in the indexing feed direction (the Y axis shown in FIG. 1) Direction) and cutting feed direction (Z-axis direction shown in Fig. 1). As shown in FIG. 1, the processing unit 20 includes two cutting inserts 21 for processing the workpiece W held on the chuck table 10, two mandrels 22 to which the cutting inserts 21 are each mounted, and support for each 2 壳 23 of the mandrel 22. The cutting insert 21 has an extremely thin circular plate shape and is formed as a ring-shaped cutting grindstone. The mandrel 22 is detachably mounted with a cutting insert 21. The cover 23 has a drive source such as a motor, and supports the mandrel 22 to rotate freely about the Y axis.
加工進給單元31具備可移動在加工進給方向的移動床臺311。在移動床臺311上，設有夾盤床臺10。在移動床臺311的加工進給方向的兩側，安裝有蛇腹狀蓋子35。蛇腹狀蓋子35是用布等之可以自由摺疊之適宜的材料所構成，覆蓋移動床臺311的移動區域，隨移動床臺311的移動沿加工進給方向做伸縮。而且，加工進給單元31具有設在裝置本體2的內部之未圖示的移動機構。移動機構例如是構成包含有脈衝馬達或滾珠螺桿、導軌等，在對被加工物W進行加工的加工區域4與搬出搬入被加工物W的搬出搬入區域5之間，使移動床臺311相對於裝置本體2相對移動在加工進給方向。經此，加工進給單元31係在加工區域4與搬出搬入區域5之間，透過移動床臺311使夾盤床臺10移動在加工進給方向。The processing feed unit 31 includes a moving table 311 that is movable in the processing feed direction. A chuck bed 10 is provided on the moving bed 311. A bellows-shaped cover 35 is attached to both sides of the moving bed 311 in the processing feed direction. The bellows-shaped cover 35 is made of a suitable material that can be folded freely, such as cloth, and covers the moving area of the moving bed 311, and expands and contracts in the processing feed direction as the moving bed 311 moves. The processing feed unit 31 includes a not-shown moving mechanism provided inside the apparatus body 2. The moving mechanism includes, for example, a pulse motor, a ball screw, a guide rail, and the like, and moves the moving table 311 relative to the processing area 4 for processing the workpiece W and the carrying-in / carry-out area 5 for carrying in and out the workpiece W. The relative movement of the apparatus body 2 is in the processing feed direction. After this, the processing feed unit 31 is located between the processing area 4 and the carry-in / out area 5, and the chuck bed 10 is moved in the processing feed direction through the moving bed 311.
分度進給單元32係被支撐在柱部3，支撐著切削進給單元33。分度進給單元32例如是構成包含有脈衝馬達或滾珠螺桿、導軌等，透過切削進給單元33使加工單元20相對於裝置本體2相對移動在分度進給方向。而且，切削進給單元33係利用分度進給單元32而被支撐，支撐著加工單元20。切削進給單元33例如是構成包含有伺服馬達或滾珠螺桿、導軌等，使加工單元20相對於裝置本體2相對移動在切削進給方向。經此，加工裝置1係藉由加工進給單元31、分度進給單元32及切削進給單元33，使夾盤床臺10與加工單元20相對移動，對被保持在夾盤床臺10的保持面10a上之被加工物W，利用加工單元20的切削刀片21，來做切削加工。The indexing feed unit 32 is supported by the column portion 3 and supports the cutting feed unit 33. The indexing feed unit 32 includes, for example, a pulse motor, a ball screw, a guide rail, and the like, and the cutting unit 33 moves the processing unit 20 relative to the apparatus body 2 in the indexing feed direction through the cutting feed unit 33. The cutting feed unit 33 is supported by the index feed unit 32 and supports the machining unit 20. The cutting feed unit 33 includes, for example, a servo motor, a ball screw, a guide rail, and the like, and moves the processing unit 20 relative to the apparatus body 2 in the cutting feed direction. After this, the processing device 1 moves the chuck table 10 and the processing unit 20 relatively by the processing feed unit 31, the indexing feed unit 32, and the cutting feed unit 33, and holds the chuck bed 10 The workpiece W on the holding surface 10a is cut using the cutting insert 21 of the machining unit 20.
接著，根據圖面說明有關實施方式之加工裝置的搬運機構。圖2為表示安裝間隔件在本實施方式的搬運機構中被搬運的被加工物所形成的框架單元的樣子之立體圖；圖3為表示安裝了間隔件的框架單元之立體圖；圖4為表示把框架單元層疊到搬運機構的裝載床臺或是卸載床臺的樣子之剖視圖；圖5為表示利用搬運機構的載換單元吸附保持框架單元的樣子之剖視圖。Next, the conveyance mechanism of the processing apparatus which concerns on embodiment is demonstrated based on drawing. FIG. 2 is a perspective view showing a state of a frame unit formed by a workpiece to be processed in the transport mechanism of the present embodiment by mounting a spacer; FIG. 3 is a perspective view showing a frame unit with a spacer installed; A cross-sectional view of a state where the frame unit is stacked on a loading bed or an unloading bed of the conveyance mechanism; FIG. 5 is a cross-sectional view showing a state in which the frame unit is held by the load exchange unit of the conveyance mechanism.
搬運機構40被設置在加工裝置1。搬運機構40係如圖1表示，具備：裝載床臺41、卸載床臺42、以及搬運單元50。搬運機構40係在裝載床臺41及卸載床臺42、與位置在搬出搬入區域5的夾盤床臺10之間，搬出搬入被加工物W(框架單元FU)。The conveyance mechanism 40 is provided in the processing apparatus 1. As shown in FIG. 1, the conveyance mechanism 40 includes a loading bed 41, an unloading bed 42, and a conveying unit 50. The conveying mechanism 40 is arranged between the loading bed 41 and the unloading bed 42 and the chuck bed 10 located in the loading / unloading area 5 to load / unload the workpiece W (frame unit FU).
在此，如圖2及圖3表示，在本實施方式中，在形成框架單元FU的環狀框F上載置了環狀的間隔件S的狀態下，利用搬運機構40搬運被加工物W。間隔件S係如圖4表示，具有段差部S1，該段差部可以抵接到環狀框F的開口F1的內周圍面。間隔件S係在段差部S1抵接到環狀框F的開口F1的內周圍面之狀態(被載置到環狀框F上的狀態)下，比起已被貼附到黏著膠帶T上的被加工物W，其上表面具有垂直方向上側的厚度。尚且，間隔件S也可以是段差部S1嵌合到環狀框F的開口F1者。經此，如圖4表示，透過間隔件S，可以層疊在裝載床臺41或是卸載床臺42上而複數個框架單元FU不會相互接觸。尚且，在圖4表示的例子中，是層疊3個框架單元FU在裝載床臺41或是卸載床臺42上，但是，框架單元FU的層疊數目不限於此，可以是2個以下，也可以是4個以上。Here, as shown in FIGS. 2 and 3, in the present embodiment, the workpiece W is transported by the transport mechanism 40 in a state where the ring-shaped spacer S is placed on the ring frame F forming the frame unit FU. As shown in FIG. 4, the spacer S has a stepped portion S1 that can abut the inner peripheral surface of the opening F1 of the ring-shaped frame F. The spacer S is in a state where the step S1 is in contact with the inner peripheral surface of the opening F1 of the ring frame F (a state where the spacer S is placed on the ring frame F), as compared with the state where the spacer S has been attached to the adhesive tape T. The workpiece W has a thickness on the upper side in the vertical direction. In addition, the spacer S may be one in which the stepped portion S1 is fitted into the opening F1 of the ring frame F. After this, as shown in FIG. 4, the spacer S can be stacked on the loading bed 41 or the unloading bed 42 without the plurality of frame units FU contacting each other. In the example shown in FIG. 4, three frame units FU are stacked on the loading bed 41 or unloading bed 42. However, the number of stacking of the frame units FU is not limited to this, and may be two or less. It is 4 or more.
裝載床臺41係透過間隔件S層疊並支撐複數個加工前的被加工物W。裝載床臺41鄰接到搬出搬入區域5，配置在加工進給單元31的側方的區域。加工裝置1係如圖1表示，在搬出搬入區域5的兩側，亦即加工進給單元31的側方的區域，具有空間。裝載床臺41係作為初始位置，配置在該搬出搬入區域5的兩側中其中一方的空間。以下的說明中，把圖1表示的裝載床臺41被配置作為初始位置的區域，稱為「裝載區域7」。本實施方式中，裝載床臺41乃是形成為四角形狀的板狀構件。尚且，裝載床臺41也可以是圓盤狀。裝載床臺41具有：可以載置框架單元FU之平坦的載置面41a。The loading table 41 is configured to stack and support a plurality of workpieces W before being processed through the spacer S. The loading table 41 is adjacent to the loading / unloading area 5 and is arranged in a region to the side of the processing feed unit 31. As shown in FIG. 1, the processing device 1 has space on both sides of the carry-in / out area 5, that is, a side area of the processing feed unit 31. The loading table 41 is an initial position and is arranged in a space on one of both sides of the loading / unloading area 5. In the following description, a region where the loading bed 41 shown in FIG. 1 is arranged as an initial position is referred to as a "loading region 7". In this embodiment, the loading bed 41 is a plate-shaped member formed in a quadrangular shape. The loading bed 41 may have a disc shape. The loading table 41 includes a flat mounting surface 41 a on which the frame unit FU can be mounted.
而且，裝載床臺41具有：設在載置面41a的周圍之複數個(在本實施方式為4個)抵接部41b。抵接部41b乃是從裝載床臺41的上表面朝向垂直方向上側延伸之棒狀構件。抵接部41b係如圖4表示，在把複數個框架單元FU層疊到裝載床臺41上的狀態下，比起位置在最高位置的框架單元FU的環狀框F，更延伸到垂直方向上側。經此，抵接部41b係規範制約層疊在載置面41a上之複數個框架單元FU，移動在載置面41a的面方向。In addition, the loading bed 41 includes a plurality of (four in the present embodiment) abutment portions 41b provided around the mounting surface 41a. The abutting portion 41b is a rod-shaped member extending from the upper surface of the loading table 41 toward the upper side in the vertical direction. As shown in FIG. 4, the abutting portion 41 b is in a state where a plurality of frame units FU are stacked on the loading table 41, and extends to the upper side in the vertical direction than the ring frame F of the frame unit FU at the highest position. . As a result, the abutment portion 41b restricts the movement of the plurality of frame units FU stacked on the mounting surface 41a in the plane direction of the mounting surface 41a.
卸載床臺42係透過間隔件S層疊並支撐複數個加工後的被加工物W。卸載床臺42鄰接到搬出搬入區域5，包挾加工進給單元31而配置在與裝載床臺41為相反側的區域。亦即，卸載床臺42係作為初始位置，配置在加工裝置1所具有的搬出搬入區域5的兩側中另一方的空間。以下的說明中，把圖1表示的卸載床臺42被配置作為初始位置的區域，稱為「卸載區域8」。本實施方式中，卸載床臺42係與裝載床臺41同樣，乃是形成為四角形狀的板狀構件。尚且，卸載床臺42也可以是圓盤狀。卸載床臺42具有：可以載置框架單元FU之平坦的載置面42a。The unloading table 42 is configured to stack and support a plurality of processed objects W through a spacer S. The unloading table 42 is adjacent to the loading / unloading area 5 and the packing / feeding unit 31 is disposed in a region opposite to the loading table 41. That is, the unloading bed 42 is an initial position, and it is arrange | positioned in the space of the other of both sides of the carry-in / out area 5 which the processing apparatus 1 has. In the following description, a region in which the unloading table 42 shown in FIG. 1 is arranged as an initial position is referred to as "unloading region 8". In the present embodiment, the unloading bed 42 is a plate-shaped member formed in a rectangular shape similar to the loading bed 41. The unloading bed 42 may be disc-shaped. The unloading bed 42 has a flat mounting surface 42a on which the frame unit FU can be placed.
而且，卸載床臺42具有：設在載置面42a的周圍之複數個(在實施方式為4個)抵接部42b。抵接部42b乃是從卸載床臺42的上表面朝向垂直方向上側延伸之棒狀構件。抵接部42b係在把複數個框架單元FU層疊到卸載床臺42上的狀態下，比起位置在最高位置的框架單元FU的環狀框F，更延伸到垂直方向上側。經此，抵接部42b係規範制約層疊在載置面42a上之複數個框架單元FU，移動在載置面42a的面方向。The unloading bed 42 has a plurality of (four in the embodiment) abutment portions 42b provided around the mounting surface 42a. The abutting portion 42 b is a rod-shaped member extending from the upper surface of the unloading bed 42 toward the upper side in the vertical direction. The abutting portion 42b is in a state where a plurality of frame units FU are stacked on the unloading bed 42 and extends to the upper side in the vertical direction than the ring frame F of the frame unit FU positioned at the highest position. As a result, the abutment portion 42b restricts the movement of the plurality of frame units FU stacked on the mounting surface 42a in the plane direction of the mounting surface 42a.
搬運單元50為如下之機構：從裝載床臺41搬出被加工物W與間隔件S，然後僅搬入被加工物W到夾盤床臺10，把從裝載床臺41搬出後持續支撐的間隔件S堆疊到加工後的被加工物W，然後從夾盤床臺10搬入到卸載床臺42。搬運單元50具備：裝載床臺移動單元51、卸載床臺移動單元52、以及載換單元60。The conveying unit 50 is a mechanism that removes the workpiece W and the spacer S from the loading bed 41, and then only the workpiece W is transferred to the chuck bed 10, and the spacer that is continuously supported after being removed from the loading bed 41 S is stacked on the processed object W, and then carried from the chuck bed 10 to the unloading bed 42. The conveyance unit 50 includes a loading bed moving unit 51, an unloading bed moving unit 52, and a loading and unloading unit 60.
裝載床臺移動單元51為如下之機構：使裝載床臺41移動到位置在搬出搬入區域5之夾盤床臺10的正上的正上區域6。而且，卸載床臺移動單元52為如下之機構：使卸載床臺42移動到正上區域6。裝載床臺移動單元51與卸載床臺移動單元52具備共通之一對導軌53。一對導軌53係如圖1表示，在裝置本體2上，跨過搬出搬入區域5，從裝載區域7朝Y軸方向(分度進給方向)一直延伸到卸載區域8。尚且，一對導軌53係設在比起夾盤床臺10的保持面10a更靠垂直方向上側的位置，不會與位置在搬出搬入區域5的夾盤床臺10產生干涉。The loading bed moving unit 51 is a mechanism that moves the loading bed 41 to a position 6 directly above the chuck bed 10 in the loading / unloading area 5. In addition, the unloading bed moving unit 52 is a mechanism for moving the unloading bed 42 to the area 6 directly above. The loading bed moving unit 51 and the unloading bed moving unit 52 include a common pair of guide rails 53. As shown in FIG. 1, a pair of guide rails 53 extend from the loading area 7 in the Y-axis direction (index feeding direction) to the unloading area 8 across the loading and unloading area 5 on the device body 2. In addition, the pair of guide rails 53 are provided at a position vertically higher than the holding surface 10a of the chuck bed 10, and do not interfere with the chuck bed 10 located in the carry-in / out area 5.
裝載床臺移動單元51係藉由氣缸51a產生力，使裝載床臺41沿一對導軌53移動在裝載區域7與正上區域6之間。而且，卸載床臺移動單元52係藉由氣缸(未圖示)產生力，使卸載床臺42沿一對導軌53移動在卸載區域8與正上區域6之間。尚且，裝載床臺移動單元51若是不要有與夾盤床臺10產生干涉之虞的話，取代氣缸51a，例如也可以利用使用脈衝馬達或滾珠螺桿的機構，使裝載床臺41沿一對導軌53移動。卸載床臺移動單元52也是同樣。The loading bed moving unit 51 generates a force by the air cylinder 51 a to move the loading bed 41 between the loading area 7 and the directly upper area 6 along a pair of guide rails 53. In addition, the unloading bed moving unit 52 generates a force by the air cylinder (not shown) to move the unloading bed 42 along the pair of guide rails 53 between the unloading area 8 and the directly upper area 6. In addition, if the loading bed moving unit 51 is not likely to interfere with the chuck bed 10, instead of the air cylinder 51a, for example, a mechanism using a pulse motor or a ball screw may be used to move the loading bed 41 along a pair of guide rails 53. mobile. The same is true of the unloading bed moving unit 52.
尚且，實施方式的加工裝置1中，在卸載床臺42的移動路徑的垂直方向上側，配置有空氣噴嘴70。空氣噴嘴70係在卸載床臺42從正上區域6一直移動卸載區域8之間，以噴出空氣到被支撐在卸載床臺42的被加工物W的方式，去除在切削加工中附著到被加工物W之切削屑或切削液等。Furthermore, in the processing apparatus 1 according to the embodiment, an air nozzle 70 is disposed on the upper side in the vertical direction of the moving path of the unloading table 42. The air nozzle 70 is located between the unloading bed 42 and the unloading area 8 from the directly upper area 6 and ejects air to the workpiece W supported by the unloading bed 42 to remove the adherence to the work during cutting. Object W's cutting chips or cutting fluid.
載換單元60係移動在垂直方向，在位置在搬出搬入區域5的夾盤床臺10、與位置在正上區域6的裝載床臺41或是卸載床臺42之間，搬運被加工物W與間隔件S。載換單元60係如圖1表示，被配置在正上區域6的垂直方向上側，透過未圖示驅動機構，被安裝在加工裝置1，相對於裝置本體2可以相對移動在垂直方向。載換單元60具有：形成在末端部之H型的支架61。支架61係如圖5表示，各末端部具有：與真空吸引源連接之真空吸附式的吸附墊也就是被加工物支撐部62及間隔件支撐部63。各被加工物支撐部62係如圖5表示，吸附保持框架單元FU的環狀框F的上表面。而且，各間隔件支撐部63係如圖5表示，吸附保持間隔件S的上表面。亦即，載換單元60吸附保持框架單元FU與間隔件S成一體。The loading and unloading unit 60 moves in a vertical direction between the chuck bed 10 in the loading / unloading area 5 and the loading bed 41 or unloading bed 42 located in the upper area 6 to carry the workpiece W. With spacer S. As shown in FIG. 1, the load exchange unit 60 is arranged on the upper side of the vertical area 6 in the vertical direction, and is mounted on the processing device 1 through a drive mechanism (not shown), and can be relatively moved in the vertical direction relative to the device body 2. The transfer unit 60 includes an H-shaped bracket 61 formed at a distal end portion. The bracket 61 is shown in FIG. 5, and each end portion includes a vacuum suction type suction pad connected to a vacuum suction source, that is, a workpiece support portion 62 and a spacer support portion 63. Each workpiece support portion 62 is as shown in FIG. 5, and the upper surface of the annular frame F of the frame unit FU is sucked and held. Moreover, as shown in FIG. 5, each spacer supporting portion 63 is configured to suck and hold the upper surface of the spacer S. That is, the load-exchange unit 60 holds and holds the frame unit FU integrally with the spacer S.
接著，根據圖面說明有關搬運機構40所致之被加工物W的搬運動作。圖6至圖8係表示被加工物W的加工前後中的一連串的搬運動作。圖6為表示從裝載床臺搬出加工前的被加工物的樣子之說明圖；圖7為表示在加工前後中從夾盤床臺搬出搬入被加工物的樣子之說明圖；圖8為表示把加工後的被加工物搬出到卸載床臺的樣子之說明圖。Next, the conveyance operation of the to-be-processed object W by the conveyance mechanism 40 is demonstrated based on drawing. 6 to 8 show a series of conveying operations before and after processing of the workpiece W. FIG. 6 is an explanatory view showing the state of the processed object before being processed from the loading bed; FIG. 7 is an explanatory view showing the state of being carried out from the chuck table before and after processing; The figure which shows the state which the to-be-processed object was carried out to an unloading table.
首先、如圖6的步驟ST1表示，在被配置在初始位置也就是裝載區域7之裝載床臺41上，透過間隔件S層疊並支撐複數個框架單元FU。接著，如步驟ST2表示，使裝載床臺41移動到正上區域6。接著，如步驟ST3表示，使載換單元60朝垂直方向下側移動，使各被加工物支撐部62抵接到框架單元FU的環狀框F的上表面，並且，使間隔件支撐部63抵接到間隔件S的上表面。更進一步，使被連接到載換單元60的真空吸引源作動，利用被加工物支撐部62吸附保持框架單元FU的環狀框F，並且，利用間隔件支撐部63吸附保持間隔件S。接著，如步驟ST4表示，使載換單元60朝垂直方向上側移動，從裝載床臺41上抬起框架單元FU及間隔件S。之後，如步驟ST5表示，使裝載床臺41從正上區域6移動到裝載區域7。First, as shown in step ST1 of FIG. 6, a plurality of frame units FU are stacked and supported by a spacer S on a loading bed 41 arranged at an initial position, that is, a loading area 7. Next, as shown in step ST2, the loading bed 41 is moved to the upper area 6. Next, as shown in step ST3, the load exchange unit 60 is moved downward in the vertical direction so that each workpiece support portion 62 abuts the upper surface of the ring frame F of the frame unit FU, and the spacer support portion 63 is caused. It abuts on the upper surface of the spacer S. Furthermore, the vacuum suction source connected to the load-exchange unit 60 is operated, the annular frame F of the frame unit FU is sucked and held by the workpiece support portion 62, and the spacer S is sucked and held by the spacer support portion 63. Next, as shown in step ST4, the load exchange unit 60 is moved upward in the vertical direction, and the frame unit FU and the spacer S are lifted from the loading bed 41. After that, as shown in step ST5, the loading bed 41 is moved from the upper area 6 to the loading area 7.
接下來，如圖7的步驟ST6表示，使載換單元60朝垂直方向下側移動，把框架單元FU載置到夾盤床臺10上。尚且，夾盤床臺10在進行步驟ST6的時點可以不用位置到搬出搬入區域5，在從圖6的步驟ST1進行到步驟ST5之間，可以位置到加工區域4與搬出搬入區域5之其中任一處。在該時點下，使被連接到夾盤床臺10的真空吸引源作動，利用夾盤床臺10吸附保持框架單元FU。在此，對框架單元FU之夾盤床臺10的吸附保持力，係被設定成比對框架單元FU之載換單元60的吸附保持力還要強。為此，如步驟ST7表示，使載換單元60朝垂直方向上側移動的話，僅被載置在框架單元FU的間隔件S利用載換單元60而被吸附保持，框架單元FU維持被吸附保持在夾盤床臺10上的狀態。經此，在從框架單元FU脫離了間隔件S的狀態下，使夾盤床臺10從搬出搬入區域5移動到加工區域4，可以利用加工單元20對被加工物W施以切削加工。被加工物W的加工中，載換單元60係持續保持間隔件S待機。Next, as shown in step ST6 in FIG. 7, the loading unit 60 is moved downward in the vertical direction, and the frame unit FU is placed on the chuck table 10. Moreover, the chuck table 10 can be moved to the unloading and loading area 5 without performing a position at the time of performing step ST6, and can be moved to either the processing area 4 or the unloading or loading area 5 from step ST1 to step ST5 in FIG. 6. one place. At this point, the vacuum suction source connected to the chuck bed 10 is activated, and the chuck bed 10 sucks and holds the frame unit FU. Here, the adsorption holding force on the chuck bed 10 of the frame unit FU is set to be stronger than the adsorption holding force on the load exchange unit 60 of the frame unit FU. For this reason, as shown in step ST7, when the loading and unloading unit 60 is moved upward in the vertical direction, only the spacer S placed on the frame unit FU is sucked and held by the loading and unloading unit 60, and the frame unit FU remains sucked and held at The state on the chuck bed 10. As a result, the chuck table 10 is moved from the loading / unloading area 5 to the processing area 4 in a state where the spacer S is separated from the frame unit FU, and the workpiece W can be subjected to cutting processing by the processing unit 20. During the processing of the workpiece W, the transfer unit 60 continuously holds the spacer S on standby.
加工單元20所致之被加工物W的加工完畢，夾盤床臺10朝搬出搬入區域5移動的話，如步驟ST8表示，把待機中的載換單元60移動到垂直方向下側，把間隔件S載置到夾盤床臺10上的框架單元FU之上。經此，藉由載換單元60吸附保持框架單元FU及間隔件S雙方。而且，解除夾盤床臺10所致之框架單元FU的吸附保持。之後，如步驟ST9表示，使載換單元60朝垂直方向上側移動，從夾盤床臺10抬起利用載換單元60而被吸附保持的框架單元FU及間隔件S。When the processing of the workpiece W caused by the processing unit 20 is completed, and the chuck table 10 is moved toward the loading / unloading area 5, as shown in step ST8, the load exchange unit 60 in standby is moved to the lower side in the vertical direction, and the spacer is moved. S is placed on the frame unit FU on the chuck bed 10. As a result, both the frame unit FU and the spacer S are held by the load exchange unit 60. Then, the holding of the frame unit FU by the chuck bed 10 is released. After that, as shown in step ST9, the load exchange unit 60 is moved upward in the vertical direction, and the frame unit FU and the spacer S that are held and held by the load exchange unit 60 are lifted from the chuck bed 10.
接下來，如圖8的步驟ST10表示，使卸載床臺42從卸載區域8移動到正上區域6。接著，如步驟ST11表示，使載換單元60朝垂直方向下側移動，把框架單元FU及間隔件S載置到卸載床臺42上，解除載換單元60所致之框架單元FU及間隔件S的吸附保持。接著，如步驟ST12表示，使載換單元60移動到垂直方向上側後，如步驟ST13表示，使卸載床臺42從正上區域6移動到卸載區域8。尚且，夾盤床臺10係在從圖8的步驟ST10進行到步驟ST13之間，可以位置在加工區域4與搬出搬入區域5之其中任一處。以後，反覆執行從圖6至圖8表示之同樣的程序，進行下一個的被加工物W的加工，如圖4表示，把加工後的被加工物W(框架單元FU)層疊到卸載床臺42上。Next, as shown in step ST10 of FIG. 8, the unloading table 42 is moved from the unloading area 8 to the directly above area 6. Next, as shown in step ST11, the load exchange unit 60 is moved downward in the vertical direction, the frame unit FU and the spacer S are placed on the unloading table 42, and the frame unit FU and the spacer caused by the load exchange unit 60 are released. Adsorption of S is maintained. Next, as shown in step ST12, after the load exchange unit 60 is moved to the upper side in the vertical direction, as shown in step ST13, the unloading table 42 is moved from the upper area 6 to the unloading area 8. In addition, the chuck table 10 is located between step ST10 and step ST13 in FIG. 8, and may be positioned in any one of the processing area 4 and the loading / unloading area 5. Thereafter, the same procedure shown in FIGS. 6 to 8 is repeatedly executed to process the next workpiece W. As shown in FIG. 4, the processed workpiece W (frame unit FU) is stacked on the unloading table. 42 on.
如以上說明，有關實施方式的加工裝置1的搬運機構40，係把裝載床臺41與卸載床臺42配置在與加工裝置1的搬出搬入區域5鄰接之空間(裝載區域7、卸載區域8)，在裝載床臺41及卸載床臺42與夾盤床臺10之間藉由搬運單元50搬出搬入被加工物W(框架單元FU)。經此，可以一方面利用搬出搬入區域5的兩側的空間一方面設置搬運機構40到加工裝置1的緣故，不會使加工裝置1大型化，可以實現搬運機構40所致之被加工物W的自動搬出搬入。因此，有關實施方式的加工裝置1的搬運機構40，係可以一邊維持加工裝置1的省空間化，一邊減低有關被加工物W的搬運之操作人員的負擔。As described above, the conveyance mechanism 40 of the processing device 1 according to the embodiment is configured to place the loading bed 41 and the unloading bed 42 in a space adjacent to the loading / unloading area 5 of the processing device 1 (loading area 7, unloading area 8) Between the loading bed 41 and the unloading bed 42 and the chuck bed 10, the workpiece W is carried in and out by the transfer unit 50 (frame unit FU). As a result, the space on both sides of the loading / unloading area 5 can be used to install the conveying mechanism 40 to the processing device 1 on the one hand, the processing device 1 cannot be enlarged, and the workpiece W caused by the conveying mechanism 40 can be realized. Automatic moving out. Therefore, the conveyance mechanism 40 of the processing device 1 according to the embodiment can reduce the burden on the operator of the conveyance of the workpiece W while maintaining the space saving of the processing device 1.
而且，有關實施方式的加工裝置1的搬運機構40，係可以透過間隔件S層疊複數個被加工物W(框架單元FU)，並用裝載床臺41及卸載床臺42做支撐。經此，可以把複數個加工前的被加工物W一次設置到裝載床臺41，使複數個加工後的被加工物W一次從卸載床臺42脫離。其結果，與用一個裝載床臺41或卸載床臺42支撐一個被加工物W的情況相比，可以使操作人員的作業效率更提升。In addition, the conveyance mechanism 40 of the processing device 1 according to the embodiment is capable of stacking a plurality of workpieces W (frame unit FU) through the spacer S and supporting the loading bed 41 and the unloading bed 42. As a result, the plurality of workpieces W before processing can be set on the loading table 41 at a time, and the plurality of processed objects W can be separated from the unloading table 42 at one time. As a result, compared with the case where one workpiece W is supported by one loading bed 41 or unloading bed 42, the work efficiency of the operator can be improved.
而且，有關實施方式的加工裝置1的搬運機構40，係在利用加工單元20加工一個被加工物W的期間，可以把裝載床臺41配置到裝載區域7，並且，把卸載床臺42配置到卸載區域8。經此，在加工被加工物W的期間，操作人員可以在任意的時序下把其他的被加工物W設置到裝載床臺41上，或是從卸載床臺42脫離其他的被加工物W。其結果，可以盡可能削減被加工物W的裝卸作業所致之加工裝置1的停止時間，可以使操作人員的負擔更進一步減低，以最低限的操作人員使加工裝置1運作，進行有效率的加工作業。In addition, the conveying mechanism 40 of the processing device 1 according to the embodiment can arrange the loading bed 41 to the loading area 7 and the unloading bed 42 to the loading area 7 while one workpiece W is processed by the processing unit 20. Unload area 8. As a result, during the processing of the workpiece W, the operator can set other workpieces W on the loading table 41 or detach from the other workpieces W from the unloading table 42 at an arbitrary timing. As a result, it is possible to reduce the stopping time of the processing device 1 caused by the loading and unloading operation of the workpiece W as much as possible, further reducing the burden on the operator, and operating the processing device 1 with a minimum number of operators to perform an efficient operation. Processing operations.
而且，以透過間隔件S層疊並支撐被加工物W的方式，所以沒有必用使用用於保持複數個被加工物W的卡匣設備。亦即，有關實施方式的加工裝置1的搬運機構40係沒有必要更進一步追加設置卡匣本身的配置空間、或用於使被加工物W從卡匣滑動並取得的空間、用於使被加工物W滑動的導軌、握持被加工物W的握持臂之機構。亦即，在把搬運機構40做成比較簡易的構成之下，可以實現複數個被加工物W的自動搬出搬入。經此，即便把搬運機構40設置到加工裝置1，也可以良好地維持加工裝置1的省空間化。而且，可以抑制設置卡匣設備所致之成本的增加。更進一步，如此把搬運機構40做成比較簡易的構成，並且，以利用搬出搬入區域5的兩側的空間的方式，對於尚未有卡匣設備或被加工物的搬運機構之現有的加工裝置，可以比較容易追加設置搬運機構40。Furthermore, since the workpieces W are stacked and supported through the spacer S, it is not necessary to use a cassette device for holding the plurality of workpieces W. That is, the conveyance mechanism 40 of the processing device 1 according to the embodiment does not need to further add an arrangement space of the cassette itself, or a space for sliding the workpiece W to be obtained from the cassette, or a space for processing. The guide rail on which the object W slides, and a mechanism for holding the grip arm of the workpiece W. That is, with a relatively simple structure of the conveyance mechanism 40, it is possible to automatically carry out and carry in a plurality of workpieces W. As a result, even if the conveyance mechanism 40 is installed in the processing device 1, the space saving of the processing device 1 can be favorably maintained. Moreover, it is possible to suppress an increase in cost due to the installation of the cassette device. Furthermore, the conveying mechanism 40 has a relatively simple structure in this way, and uses the space on both sides of the carrying-in area 5 to carry out the existing processing device of the conveying mechanism for which there is no cassette equipment or workpiece, It is relatively easy to add the transport mechanism 40.
而且，搬運單元50具備：裝載床臺移動單元51，其係使裝載床臺41移動到位置在搬出搬入區域5之夾盤床臺10的正上的正上區域6；卸載床臺移動單元52，其係使卸載床臺42移動到正上區域6；以及載換單元60，其係移動在垂直方向，在位置在搬出搬入區域5的夾盤床臺10、與在位置在正上區域6的裝載床臺41或是卸載床臺42之間，搬運被加工物W與間隔件S。Further, the transport unit 50 includes a loading bed moving unit 51 that moves the loading bed 41 to a position 6 directly above the chuck bed 10 in the loading / unloading area 5; and an unloading bed moving unit 52 , Which moves the unloading table 42 to the upper area 6; and the loading and unloading unit 60, which moves in the vertical direction, the chuck bed 10 in the loading and unloading area 5 and the upper plate 6 The workpiece W and the spacer S are conveyed between the loading bed 41 or the unloading bed 42.
經此，如例如使用卡匣設備的情況般，不用使被加工物W滑動移動，可以從移動到正上區域6的裝載床臺41，從垂直方向上側搬出被加工物W，朝移動到正上區域6的卸載床臺42，從垂直方向上側搬入被加工物W。其結果，可以容易進行被加工物W的搬出搬入。尚且，從搬運單元50省略裝載床臺移動單元51或是卸載床臺移動單元52，也可以構成把載換單元60移動在裝載區域7與正上區域6之間、卸載區域8與正上區域6之間。After that, as in the case of using a cassette device, for example, the workpiece W can be moved from the loading bed 41 moved to the upper direct area 6 from the loading bed 41 in the vertical direction without moving the workpiece W to the positive direction. The unloading bed 42 of the upper region 6 is carried into the workpiece W from the upper side in the vertical direction. As a result, the workpiece W can be carried in and out easily. In addition, the loading bed moving unit 51 or the unloading bed moving unit 52 is omitted from the conveying unit 50, and the loading and unloading unit 60 may be moved between the loading area 7 and the upper area 6, and the unloading area 8 and the upper area may be configured. Between 6.
而且，被加工物乃是用黏著膠帶T支撐被加工物W到環狀框F的開口F1之框架單元FU；裝載床臺41具備：抵接部41b，其係規範制約框架單元FU移動在面方向；卸載床臺42具備：抵接部42b，其係規範制約框架單元FU移動在面方向。The workpiece is a frame unit FU that supports the workpiece W to the opening F1 of the ring frame F with an adhesive tape T. The loading table 41 includes a contact portion 41b that regulates the movement of the frame unit FU on the surface. Direction: The unloading table 42 includes: an abutment portion 42b, which regulates the movement of the frame unit FU in the surface direction by specifications.
經此，利用抵接部41b、42b，可以防止框架單元FU從移動中的裝載床臺41或是卸載床臺42上掉落。尚且，抵接部41b、42b可以從裝載床臺41及卸載床臺42省略掉，也可以僅形成在裝載床臺41及卸載床臺42之其中任一方。As a result, the abutting portions 41b and 42b can prevent the frame unit FU from falling off the moving loading platform 41 or the unloading platform 42. In addition, the contact portions 41b and 42b may be omitted from the loading bed 41 and the unloading bed 42 or may be formed only on one of the loading bed 41 and the unloading bed 42.
而且，被加工物W也可以不用是與環狀框F一塊形成框架單元FU者。圖9為表示把間隔件固定到有關變形例的被加工物的樣子之立體圖；圖10為表示固定了間隔件之有關變形例的被加工物之立體圖；圖11為表示利用載換單元吸附保持有關變形例的被加工物並從搬運機構的裝載床臺上抬起的樣子之剖視圖。In addition, the workpiece W need not be the one forming the frame unit FU together with the ring frame F. FIG. 9 is a perspective view showing a state in which a spacer is fixed to a processed object related to a modified example; FIG. 10 is a perspective view showing a state in which a spacer is fixed to a processed object according to a modified example; A cross-sectional view of a modified example in which a workpiece is lifted from a loading table of a transport mechanism.
如圖9及圖10表示，有關變形例的被加工物W，係不使用環狀框F，以被貼附在黏著膠帶T的狀態利用搬運機構40來搬運，並且，用加工裝置1來加工。在黏著膠帶T上，貼附間隔件SA圍繞在被加工物W的周圍。該情況下，間隔件SA只要是具有比被加工物W的外徑還要大的內徑，而且，具有比被加工物W的厚度還要大的厚度之構件即可。而且，間隔件SA沒有必要具有段差部S1。在圖9及圖10表示的例子，間隔件SA雖形成四角形狀，但也可以形成圓環狀。As shown in FIG. 9 and FIG. 10, the processed object W according to the modified example does not use the ring frame F, is transferred by the transfer mechanism 40 in a state of being attached to the adhesive tape T, and is processed by the processing device 1. . On the adhesive tape T, a spacer SA is attached around the workpiece W. In this case, the spacer SA may be a member having an inner diameter larger than the outer diameter of the workpiece W and a thickness larger than the thickness of the workpiece W. Moreover, it is not necessary for the spacer SA to have the step S1. In the examples shown in FIGS. 9 and 10, although the spacer SA is formed in a rectangular shape, it may be formed in a ring shape.
經此，如圖11表示，透過間隔件SA，可以把複數個被加工物W層疊並支撐在裝載床臺41上。同樣，可以透過間隔件SA，層疊並支撐複數個被加工物W在卸載床臺42。在本實施方式，不使用卡匣設備的緣故，即便不利用環狀框F形成框架單元FU，也可以把被加工物W安定地保持在裝載床臺41的平坦的載置面41a上、卸載床臺42的平坦的載置面42a上。After that, as shown in FIG. 11, a plurality of workpieces W can be stacked and supported on the loading table 41 through the spacer SA. Similarly, a plurality of workpieces W can be stacked and supported on the unloading table 42 through the spacer SA. In the present embodiment, because the cassette device is not used, even if the frame unit FU is not formed by using the ring frame F, the workpiece W can be stably held on the flat mounting surface 41a of the loading table 41 and unloaded. On the flat mounting surface 42a of the bed 42.
如此在藉由載換單元60吸附保持不形成框架單元FU的被加工物W之際，如圖11表示，藉由載換單元60的被加工物支撐部62吸附保持黏著膠帶T，並且，藉由間隔件支撐部63吸附保持間隔件SA。之後，把被加工物W與間隔件SA載置到夾盤床臺10上，利用夾盤床臺10透過黏著膠帶T吸附保持被加工物W。在此，透過了黏著膠帶之對被加工物W的夾盤床臺10的吸附保持力，係被設定成比對黏著膠帶T之被加工物支撐部62的吸附保持力還要強，而且，比對間隔件SA之黏著膠帶T的黏著力還要強。為此，利用夾盤床臺10透過黏著膠帶T吸附保持了被加工物W後，使載換單元60朝垂直方向上側移動的話，僅間隔件SA從黏著膠帶T剝離，維持被加工物W被吸附在夾盤床臺10上的狀態。經此，遂可以對脫離了間隔件SA之被加工物W施以加工。被加工物W的加工完畢後，使載換單元20朝垂直方向下側移動的話，把間隔件SA貼著到黏著膠帶T，可以再次使被加工物W與間隔件SA一體化。In this way, when the workpiece W that does not form the frame unit FU is sucked and held by the loading and unloading unit 60, as shown in FIG. 11, the workpiece support portion 62 of the loading and unloading unit 60 sucks and holds the adhesive tape T. The spacer SA is sucked and held by the spacer support portion 63. Thereafter, the workpiece W and the spacer SA are placed on the chuck table 10, and the workpiece W is sucked and held by the chuck table 10 through the adhesive tape T. Here, the adsorption and holding force of the chuck table 10 through the adhesive tape to the workpiece W is set to be stronger than the adsorption and holding force to the workpiece support portion 62 of the adhesive tape T, and, The adhesive force is stronger than the adhesive tape T of the spacer SA. For this reason, after the workpiece W is adsorbed and held by the chuck table 10 through the adhesive tape T, and then the load transfer unit 60 is moved upward in the vertical direction, only the spacer SA is peeled off from the adhesive tape T, and the workpiece W is maintained. The state of being adsorbed on the chuck bed 10. As a result, the workpiece W from which the spacer SA is separated can be processed. After the processing of the workpiece W is completed, if the transfer unit 20 is moved downward in the vertical direction, the spacer SA is attached to the adhesive tape T, and the workpiece W and the spacer SA can be integrated again.
而且，在本實施方式，作為使裝載床臺41、卸載床臺42沿一對導軌53移動在Y軸方向(分度進給方向)，但是，裝載床臺41、卸載床臺42的移動路徑不限於此。圖12為示意性表示有關變形例的搬運機構40A之說明圖。如圖表示，也可以使裝載床臺41、卸載床臺42，以與Y軸方向(分度進給方向)相對傾斜的角度做移動。經此，在裝載床臺41、卸載床臺42的側方的區域有任何的障礙物的情況下，可以迴避與障礙物的干涉。而且，可以縮短裝載床臺41、卸載床臺42的移動距離。Furthermore, in this embodiment, the loading bed 41 and the unloading bed 42 are moved along the pair of guide rails 53 in the Y-axis direction (index feeding direction). However, the moving path of the loading bed 41 and the unloading bed 42 is as follows. Not limited to this. FIG. 12 is an explanatory diagram schematically showing a transport mechanism 40A according to a modification. As shown in the figure, the loading bed 41 and the unloading bed 42 may be moved at an angle that is relatively inclined with respect to the Y-axis direction (the index feeding direction). As a result, when there are any obstacles in the area beside the loading bed 41 and the unloading bed 42, interference with the obstacles can be avoided. In addition, the moving distance of the loading bed 41 and the unloading bed 42 can be shortened.
而且，在本實施方式，為載置被加工物W或是框架單元FU到裝載床臺41或是卸載床臺42者，但是，裝載床臺41或是卸載床臺42也可以是連接到未圖示的真空吸引源，吸附保持被加工物W或是框架單元FU者。Furthermore, in the present embodiment, the workpiece W or the frame unit FU is placed on the loading table 41 or the unloading table 42. However, the loading table 41 or the unloading table 42 may be connected to an unloaded table 42. The vacuum suction source shown in the figure adsorbs and holds the workpiece W or the frame unit FU.
而且，在本實施方式，把載換單元60的被加工物支撐部62及間隔件支撐部63做成真空吸附式的吸附墊，同時進行對被加工物支撐部62所致之被加工物W(框架單元FU或是黏著膠帶T)的吸附動作、以及對間隔件支撐部63所致之間隔件S、SA的吸附動作，但是，也可以個別控制這些吸附動作。經此，在圖7的步驟ST7表示的時序下，僅解除對被加工物支撐部62所致之被加工物W(框架單元FU或是黏著膠帶T)的吸附的話，可以利用載換單元60從被加工物W容易地僅抬起間隔件S、SA。Furthermore, in the present embodiment, the workpiece support portion 62 and the spacer support portion 63 of the load exchange unit 60 are made into a vacuum suction type suction pad, and the workpiece W caused by the workpiece support portion 62 is simultaneously performed. The suction operation of the frame unit FU or the adhesive tape T and the suction operation of the spacers S and SA caused by the spacer support portion 63 may be controlled individually. After this, at the timing shown in step ST7 in FIG. 7, if only the workpiece W (the frame unit FU or the adhesive tape T) caused by the workpiece support portion 62 is desorbed, the load transfer unit 60 can be used. Only the spacers S, SA are easily lifted from the workpiece W.
而且，在用磁性材料形成了環狀框F的情況下，被加工物支撐部62也可以是藉由磁力保持框架單元FU者。也在該情況下，對框架單元FU之夾盤床臺10的吸附保持力，係被設定成比對框架單元FU之被加工物支撐部62的磁力所致之保持力還要強。而且，在用磁性材料形成間隔件S、SA的情況下，間隔件支撐部63也可以是藉由磁力保持間隔件S、SA者。When the ring frame F is formed of a magnetic material, the workpiece support portion 62 may be a member that holds the frame unit FU by magnetic force. Also in this case, the holding force of the chuck bed 10 of the frame unit FU is set to be stronger than the holding force by the magnetic force of the workpiece support portion 62 of the frame unit FU. When the spacers S and SA are formed of a magnetic material, the spacer supporting portion 63 may be a member that holds the spacers S and SA by a magnetic force.
1‧‧‧加工裝置1‧‧‧Processing Equipment
2‧‧‧裝置本體2‧‧‧device body
3‧‧‧柱部3‧‧‧ pillar
4‧‧‧加工區域4‧‧‧ processing area
5‧‧‧搬出搬入區域5‧‧‧ move out area
6‧‧‧正上區域6‧‧‧upper area
7‧‧‧裝載區域7‧‧‧ Loading area
8‧‧‧卸載區域8‧‧‧ unloading area
10‧‧‧夾盤床臺10‧‧‧ chuck bed
10a‧‧‧保持面10a‧‧‧ keep face
20‧‧‧加工單元20‧‧‧Processing unit
21‧‧‧切削刀片21‧‧‧ cutting insert
22‧‧‧心軸22‧‧‧ mandrel
23‧‧‧罩殼23‧‧‧Cover
31‧‧‧加工進給單元31‧‧‧Processing feed unit
311‧‧‧移動床臺311‧‧‧mobile bed
32‧‧‧分度進給單元32‧‧‧ index feed unit
33‧‧‧切削進給單元33‧‧‧ cutting feed unit
35‧‧‧蛇腹狀蓋子35‧‧‧Snake belly lid
40、40A‧‧‧搬運機構40, 40A‧‧‧ handling mechanism
41‧‧‧裝載床臺41‧‧‧Loading bed
41a、42a‧‧‧載置面41a, 42a‧‧‧mounting surface
41b、42b‧‧‧抵接部41b, 42b ‧‧‧ abutment department
42‧‧‧卸載床臺42‧‧‧Unloading bed
50‧‧‧搬運單元50‧‧‧handling unit
51a‧‧‧氣缸51a‧‧‧cylinder
51‧‧‧裝載床臺移動單元51‧‧‧ Loading bed mobile unit
52‧‧‧卸載床臺移動單元52‧‧‧Unloading bed mobile unit
53‧‧‧導軌53‧‧‧rail
60‧‧‧載換單元60‧‧‧Transfer unit
61‧‧‧支架61‧‧‧Scaffold
62‧‧‧被加工物支撐部62‧‧‧Workpiece support
63‧‧‧間隔件支撐部63‧‧‧spacer support
70‧‧‧空氣噴嘴70‧‧‧air nozzle
F‧‧‧環狀框F‧‧‧ ring frame
F1‧‧‧開口F1‧‧‧ opening
FU‧‧‧框架單元FU‧‧‧Frame Unit
S、SA‧‧‧間隔件S, SA‧‧‧ spacer
S1‧‧‧段差部S1‧‧‧step difference
T‧‧‧黏著膠帶T‧‧‧adhesive tape
W‧‧‧被加工物W‧‧‧Processed
[圖1] 圖1為表示具備有關實施方式之加工裝置的搬運機構之加工裝置的概略之立體圖。 [圖2] 圖2為表示安裝間隔件在本實施方式的搬運機構中被搬運的被加工物所形成的框架單元的樣子之立體圖。 [圖3] 圖3為表示安裝了間隔件之框架單元之立體圖。 [圖4] 圖4為表示把框架單元層疊到搬運機構的裝載床臺或是卸載床臺的樣子之剖視圖。 [圖5] 圖5為表示利用搬運機構的載換單元吸附保持框架單元的樣子之剖視圖。 [圖6] 圖6為表示從裝載床臺搬出加工前的被加工物的樣子之說明圖。 [圖7] 圖7為表示在加工前後中從夾盤床臺搬出搬入被加工物的樣子之說明圖。 [圖8] 圖8為表示把加工後的被加工物搬出到卸載床臺的樣子之說明圖。 [圖9] 圖9為表示把間隔件固定到有關變形例的被加工物的樣子之立體圖。 [圖10] 圖10為表示固定了間隔件之有關變形例的被加工物之立體圖。 [圖11] 圖11為表示利用載換單元吸附保持有關變形例的被加工物並從搬運機構的裝載床臺上抬起的樣子之剖視圖。 [圖12] 圖12為示意性表示有關變形例的搬運機構之說明圖。[FIG. 1] FIG. 1 is a perspective view schematically showing a processing device including a transport mechanism of a processing device according to an embodiment. [FIG. 2] FIG. 2 is a perspective view showing a state of a frame unit formed by an object to be processed by the mounting spacer in the transport mechanism of the present embodiment.图 [Fig. 3] Fig. 3 is a perspective view showing a frame unit to which a spacer is mounted.图 [Fig. 4] Fig. 4 is a cross-sectional view showing a state in which a frame unit is stacked on a loading bed or an unloading bed of a conveyance mechanism.图 [Fig. 5] Fig. 5 is a cross-sectional view showing a state in which the frame unit is sucked and held by the transfer unit of the transport mechanism. [Fig. 6] Fig. 6 is an explanatory view showing a state of a workpiece before processing is carried out from a loading table. [Fig. 7] Fig. 7 is an explanatory view showing a state in which an object to be processed is carried out from a chuck bed before and after processing. [Fig. 8] Fig. 8 is an explanatory view showing a state in which the processed object is carried out to an unloading table. [Fig. 9] Fig. 9 is a perspective view showing a state in which a spacer is fixed to a workpiece in a modification.图 [Fig. 10] Fig. 10 is a perspective view showing a to-be-processed object according to a modification example in which a spacer is fixed. [Fig. 11] Fig. 11 is a cross-sectional view showing a state in which a workpiece to be modified is sucked and held by a transfer unit and lifted from a loading table of a transport mechanism. [Fig. 12] Fig. 12 is an explanatory diagram schematically showing a conveying mechanism according to a modification.
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| JP2016-243760 | 2016-12-15 | ||
| JP2016243760A JP6762220B2 (en) | 2016-12-15 | 2016-12-15 | Transfer mechanism of processing equipment |
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| TW201830559A true TW201830559A (en) | 2018-08-16 |
| TWI737848B TWI737848B (en) | 2021-09-01 |
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| JP7294777B2 (en) * | 2018-07-09 | 2023-06-20 | 株式会社ディスコ | Workpiece drying method and cutting device |
| JP7184620B2 (en) * | 2018-12-11 | 2022-12-06 | 株式会社ディスコ | cutting equipment |
| CN116329975B (en) * | 2023-04-03 | 2023-09-05 | 东莞市腾信精密仪器有限公司 | Precision machining numerical control equipment for industrial components |
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| JP5248987B2 (en) * | 2008-11-11 | 2013-07-31 | 株式会社ディスコ | Transport mechanism |
| JP5773841B2 (en) * | 2011-10-27 | 2015-09-02 | 株式会社ディスコ | Unit loading / unloading device |
| JP2014135333A (en) * | 2013-01-09 | 2014-07-24 | Mitsuboshi Diamond Industrial Co Ltd | Sucking and lifting/lowering device |
| JP2015233065A (en) * | 2014-06-09 | 2015-12-24 | 株式会社ディスコ | Transport device |
| JP6456177B2 (en) * | 2015-02-12 | 2019-01-23 | 株式会社ディスコ | Wafer processing system |
| JP6491017B2 (en) * | 2015-04-08 | 2019-03-27 | 株式会社ディスコ | Workpiece transport tray |
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| JP6762220B2 (en) | 2020-09-30 |
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