TWI776476B - Probe card and inspection device using the same - Google Patents

Probe card and inspection device using the same Download PDF

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TWI776476B
TWI776476B TW110114164A TW110114164A TWI776476B TW I776476 B TWI776476 B TW I776476B TW 110114164 A TW110114164 A TW 110114164A TW 110114164 A TW110114164 A TW 110114164A TW I776476 B TWI776476 B TW I776476B
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circuit substrate
test signal
probe card
control chip
active control
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TW110114164A
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TW202242420A (en
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張家鴻
蘇文彬
林文珍
余信宏
何柏翰
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旺矽科技股份有限公司
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Abstract

The present invention provides a probe card, comprising a first electrical circuit board having a plurality of probing needles, a second electrical circuit board electrically coupled to the first electrical circuit board, an active control chip, and a heat dissipating module. The active control chip is arranged onto the second electrical circuit board for receiving a first probing signal from a tester, converting the first probing signal into a second probing signal, and transmitting the second probing signal to the first electrical circuit board. The heat dissipating module is coupled to the active control chip for absorbing the heat generated from the active control chip. Alternatively, the present invention further provides an inspection device having the probe card for inspecting samples having different requirement of probing signals thereby reducing the equipment cost and effectively improving the inspection efficiency.

Description

探針卡及其檢測裝置Probe card and its detection device

本發明係關於一種點測技術，特別是指一種因應不同頻率或速度之測試訊號需求的探針卡及其檢測裝置。 The present invention relates to a point testing technology, in particular to a probe card and a testing device thereof that meet the requirements of testing signals of different frequencies or speeds.

隨著科技的進步，電子裝置的尺寸也逐漸小型化。為了驗證小型化的電子裝置，例如：半導體晶片或者是微發光二極體(micro LED)基板，的效能，需要有探針裝置與電子裝置的電性連接端電性接觸，以提供電訊號驅動電子裝置內的小型化電子元件，進而可以量測電子裝置的電性特徵，例如：電壓、電流、波長、亮度等，而得以判斷電子裝置的品質，根據品質可以進行後續的挑揀及分裝作業。 With the advancement of technology, the size of electronic devices is gradually miniaturized. In order to verify the performance of miniaturized electronic devices, such as semiconductor chips or micro LED substrates, a probe device is required to be in electrical contact with the electrical connection terminals of the electronic device to provide electrical signal driving The miniaturized electronic components in the electronic device can then measure the electrical characteristics of the electronic device, such as: voltage, current, wavelength, brightness, etc., so as to judge the quality of the electronic device, and follow-up sorting and packaging operations can be carried out according to the quality. .

習用測試裝置進行晶圓等待測物測試時，會使用測試機供應中低頻測試訊號給待測物，再接收待測物回送的結果訊號進行分析。隨著科技的發展以及電子產品的演進，很多電子元件都需要藉由高速或高頻的訊號來運作。當需要檢測在高速或高頻訊號下運作的待測物時，測試裝置需要用到高頻高速的訊號，然而對於習用的測試裝置而言，其產生測試訊號的測試機沒有相對應的模組，無法供應高頻或高速的測試訊號。因此，目前習用技術的做法是另外購買一台可以供應高頻或高速測試訊號的測試機來對待測物進行檢測。 When a conventional test device is used to test a wafer waiting for an object to be tested, a test machine is used to supply low-frequency test signals to the object to be tested, and then the result signal returned by the object to be tested is received for analysis. With the development of technology and the evolution of electronic products, many electronic components need to operate with high-speed or high-frequency signals. When it is necessary to detect the DUT that operates under high-speed or high-frequency signals, the test device needs to use high-frequency and high-speed signals. However, for conventional test devices, the tester that generates the test signal does not have a corresponding module , cannot supply high-frequency or high-speed test signals. Therefore, the current conventional technique is to purchase another test machine capable of supplying high-frequency or high-speed test signals to test the object under test.

雖然前述的方式可以解決對需要高頻或高速測試訊號的待測物進行檢測需求，不過此種方式需要將高頻或高速測試機與中低頻訊號的測試機整合，不但會使測試機連接探針卡的架構複雜化，也會增加測試設備的成本。 Although the aforesaid method can solve the testing requirements of the DUT that requires high frequency or high speed test signals, this method requires the integration of the high frequency or high speed test machine with the test machine for medium and low frequency signals, which not only makes the test machine connect to the probe The complex structure of the pin card will also increase the cost of the test equipment.

綜合上述，因此需要一種探針卡及其檢測裝置來解決習用技術所產生的問題。 In view of the above, there is a need for a probe card and a detection device thereof to solve the problems caused by the conventional technology.

本發明提供一種探針卡，利用主動控制晶片將中低速或中低頻的測試訊號調變成符合測試需求的高頻或高速測試訊號，並且導入散熱處理的技術，解決因為高頻或高速測試訊號使得主動控制晶片功率消耗發熱的問題以維持適當的運作溫度，進而可以提升主動控制晶片的電路性能與可靠性。 The present invention provides a probe card, which uses an active control chip to convert a low-to-medium-speed or low-frequency test signal into a high-frequency or high-speed test signal that meets the test requirements, and introduces heat dissipation technology to solve the problem of high-frequency or high-speed test signals. The problem of power consumption and heat generation of the chip is actively controlled to maintain a proper operating temperature, thereby improving the circuit performance and reliability of the active control chip.

本發明提供一種檢測裝置，在既有中低速或中低頻的測試機架構下，透過可以將中低速或中低頻測試訊號調變成高頻或高速訊號的探針卡，使得既有的檢測裝置架構就可以對高頻或高速的待測物進行檢測，達到簡化測試設備提升檢測效能以及降低設備成本的效果。 The present invention provides a detection device. Under the existing structure of a low-to-medium-speed or low-frequency test machine, through a probe card that can convert the test signal of low-to-medium speed or low-frequency into a signal of high frequency or high-speed, the existing structure of the detection device can be achieved. It is possible to detect high-frequency or high-speed objects to be tested, so as to simplify the test equipment, improve the detection efficiency and reduce the cost of the equipment.

在一實施例中，本發明提供一種探針卡，包括有具有複數個探針的第一電路基板、第二電路基板、主動控制晶片以及散熱模組。第二電路基板與該第一電路基板電性連接。主動控制晶片設置於第二電路基板上，主動控制晶片用以接收來自測試機的第一測試訊號，將該第一測試訊號轉換成第二測試訊號後再傳輸給第一電路基板。散熱模組與該主動控制晶片耦接以吸收主動控制晶片所發出之熱。 In one embodiment, the present invention provides a probe card, which includes a first circuit substrate having a plurality of probes, a second circuit substrate, an active control chip, and a heat dissipation module. The second circuit substrate is electrically connected to the first circuit substrate. The active control chip is arranged on the second circuit substrate, and the active control chip is used for receiving the first test signal from the tester, converting the first test signal into the second test signal and then transmitting it to the first circuit substrate. The heat dissipation module is coupled with the active control chip to absorb the heat emitted by the active control chip.

在一實施例中，主動控制晶片為現場可編程輯閘陣列(Field Programmable Gate Array,FPGA)，用以將屬於中頻或低頻的第一測試訊號調變成高頻或高速的第二測試訊號。 In one embodiment, the active control chip is a Field Programmable Gate Array (FPGA) for modulating a first test signal belonging to an intermediate frequency or a low frequency into a second test signal of a high frequency or a high speed.

在一實施例中，散熱模組係為散熱鰭片、散熱風扇或前述之組合。 In one embodiment, the heat dissipation module is a heat dissipation fin, a heat dissipation fan, or a combination thereof.

在一實施例中，複數個探針設置於該第一電路基板上的探針區，第二電路基板對應該探針區之位置具有貫孔。其中，探針卡上更具有複數個支撐柱設置於該第一與第二電路基板之間，使該第一與第二電路基板之間保持一距離。第一電路基板上具有第一電性插座，而第二電路基板上具有第二電性插座，第一與第二電性插座相互電性連接。 In one embodiment, a plurality of probes are disposed on the probe regions on the first circuit substrate, and the second circuit substrate has through holes at positions corresponding to the probe regions. Wherein, the probe card further has a plurality of supporting columns disposed between the first and second circuit substrates to maintain a distance between the first and second circuit substrates. The first circuit substrate has a first electrical socket, and the second circuit substrate has a second electrical socket, and the first and second electrical sockets are electrically connected to each other.

在一實施例中，該第二電路基板具有一貫孔，該第二電路基板配合該貫孔的設計，使該第二電路基板呈一U字型、一L字型或者一口字型。其中，該複數個探針設置於該第一電路基板上的一探針區，該第二電路基板的貫孔對應該探針區之位置。 In one embodiment, the second circuit substrate has a through hole, and the second circuit substrate matches the design of the through hole, so that the second circuit substrate has a U-shape, an L-shape or a mouth-shape. Wherein, the plurality of probes are disposed in a probe area on the first circuit substrate, and the through hole of the second circuit substrate corresponds to the position of the probe area.

在一實施例中，本發明提供一種檢測裝置，包括有提供中低頻或中低速測試訊號的測試機，以及接收該中低頻或中低速測試訊號並將其轉換成高頻或高速測試訊號的探針卡，其中，探針卡包括有具有複數個探針的第一電路基板、第二電路基板、主動控制晶片以及散熱模組。第二電路基板與該第一電路基板電性連接。主動控制晶片設置於第二電路基板上，主動控制晶片用以接收來自測試機的第一測試訊號，將該第一測試訊號轉換成第二測試訊號後再傳輸給第一電路基板。散熱模組與該主動控制晶片耦接以吸收主動控制晶片所發出之熱。 In one embodiment, the present invention provides a testing device, comprising a testing machine for providing a low-medium or low-speed test signal, and a detector for receiving the low-medium or low-speed test signal and converting it into a high-frequency or high-speed test signal. A needle card, wherein the probe card includes a first circuit substrate with a plurality of probes, a second circuit substrate, an active control chip and a heat dissipation module. The second circuit substrate is electrically connected to the first circuit substrate. The active control chip is arranged on the second circuit substrate, and the active control chip is used to receive the first test signal from the testing machine, convert the first test signal into the second test signal and then transmit it to the first circuit substrate. The heat dissipation module is coupled with the active control chip to absorb the heat emitted by the active control chip.

2:檢測裝置 2: Detection device

20:測試機 20: Test machine

21、21a、21b:探針卡 21, 21a, 21b: Probe card

210:第一電路基板 210: The first circuit substrate

210a:表面 210a: Surface

210b:第一電性插座 210b: first electrical socket

210c:第一電性連接端 210c: the first electrical connection terminal

211:第二電路基板 211: Second circuit substrate

211a:貫孔 211a: Through hole

211b:表面 211b: Surface

211c:第二電性插座 211c: Second electrical socket

211d:轉接板 211d: Adapter Board

211e:第二電性連接端 211e: second electrical connection terminal

212:主動控制晶片 212: Active control chip

213:散熱模組 213: cooling module

2130:散熱鰭片 2130: cooling fins

2131:散熱風扇 2131: Cooling Fan

214:支撐柱 214: Support column

22:探針區 22: Probe area

220:探針 220: Probe

23:探針固定模組 23: Probe fixing module

90:第一測試訊號 90: The first test signal

91:第二測試訊號 91: The second test signal

92:導線 92: Wire

W:待測物 W: object to be tested

H:距離 H: distance

圖1A為檢測裝置實施例俯視示意圖。 FIG. 1A is a schematic top view of an embodiment of a detection device.

圖1B為本發明探針卡之一實施例AA剖面示意圖。 FIG. 1B is a schematic cross-sectional view of an embodiment AA of the probe card of the present invention.

圖2為本發明之探針卡另一實施例剖面示意圖。 FIG. 2 is a schematic cross-sectional view of another embodiment of the probe card of the present invention.

圖3為本發明之探針卡另一實施例剖面示意圖。 3 is a schematic cross-sectional view of another embodiment of the probe card of the present invention.

在下文將參考隨附圖式，可更充分地描述各種例示性實施例，在隨附圖式中展示一些例示性實施例。然而，本發明概念可能以許多不同形式來體現，且不應解釋為限於本文中所闡述之例示性實施例。確切而言，提供此等例示性實施例使得本發明將為詳盡且完整，且將向熟習此項技術者充分傳達本發明概念的範疇。類似數字始終指示類似元件。以下將以多種實施例配合圖式來說明導探針卡及其檢測裝置，然而，下述實施例並非用以限制本發明。 Various illustrative embodiments may be described more fully hereinafter with reference to the accompanying drawings, in which some illustrative embodiments are shown. The inventive concepts may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these illustrative embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Similar numbers always indicate similar elements. The guide probe card and its detection device will be described below with various embodiments in conjunction with the drawings, however, the following embodiments are not intended to limit the present invention.

請參閱圖1A與圖1B所示，其中圖1A為檢測裝置實施例俯視示意圖，圖1B為本發明探針卡之一實施例AA剖面示意圖。本實施例中，檢測裝置2包括有測試機20以及探針卡21。測試機20用以產生第一測試訊號，在本實施例中，第一測試訊號90為中低頻或中低速的測試訊號，例如100MHz的測試訊號。要說明的是，100Mhz僅為實施的其中之一例示，並不以該頻率為限制。探針卡21與測試機20電性連接，探針卡接收第一測試訊號90。 Please refer to FIG. 1A and FIG. 1B , wherein FIG. 1A is a schematic top view of an embodiment of a detection device, and FIG. 1B is a schematic cross-sectional view of an embodiment AA of a probe card of the present invention. In this embodiment, the detection device 2 includes a testing machine 20 and a probe card 21 . The tester 20 is used for generating a first test signal. In this embodiment, the first test signal 90 is a test signal of a low frequency or a low speed, such as a test signal of 100 MHz. It should be noted that 100Mhz is only an example of implementation, and is not limited by this frequency. The probe card 21 is electrically connected to the tester 20 , and the probe card receives the first test signal 90 .

在本實施例中，探針卡21包括有具有第一電路基板210、第二電路基板211、主動控制晶片212以及散熱模組213。其中，第一電路基板210具有探 針區22，其係具有複數個探針220，與第一電路基板210電性連接，以接收第一電路基板210所輸出的測試訊號，並利用測試訊號對待測物W進行檢測。要說明的是，本實施例中的探針220為懸臂式探針，其係透過探針固定模組23定位在第一電路基板210上。探針固定模組23為絕緣材料所構成，例如：環氧樹脂或具有絕緣效果的高分子材料所構成。 In this embodiment, the probe card 21 includes a first circuit substrate 210 , a second circuit substrate 211 , an active control chip 212 and a heat dissipation module 213 . The first circuit substrate 210 has a probe The needle area 22, which has a plurality of probes 220, is electrically connected to the first circuit substrate 210 to receive the test signal output by the first circuit substrate 210, and use the test signal to detect the object under test W. It should be noted that the probe 220 in this embodiment is a cantilever probe, which is positioned on the first circuit substrate 210 through the probe fixing module 23 . The probe fixing module 23 is made of insulating material, such as epoxy resin or polymer material with insulating effect.

第二電路基板211與該測試機20電性連接，用以接收測試機20所發出的第一測試訊號90。本實施例中，第二電路基板211在結構上具有貫孔211a，構成開口區域，其係與探針區22相對應。透過貫孔211a與探針區22相對應的設置，提供使用者維修該複數個探針220所需的空間。本實施例中，第一電路基板210設置於第二電路基板211的下方，第一與第二電路基板210與211之間具有複數個支撐柱214，每一個支撐柱214的兩端分別抵靠於第一與第二電路基板210與211上用以支撐第一與第二電路基板210與211，使得第一與第二電路基板210與211之間維持特定的距離H。 The second circuit substrate 211 is electrically connected to the testing machine 20 for receiving the first testing signal 90 sent by the testing machine 20 . In this embodiment, the second circuit substrate 211 has a through hole 211 a in structure to form an opening area, which corresponds to the probe area 22 . Through the arrangement of the through holes 211 a corresponding to the probe regions 22 , the space required for the user to maintain the plurality of probes 220 is provided. In this embodiment, the first circuit substrate 210 is disposed below the second circuit substrate 211 , and a plurality of support columns 214 are disposed between the first and second circuit substrates 210 and 211 , and two ends of each support column 214 are respectively abutted against The first and second circuit substrates 210 and 211 are used to support the first and second circuit substrates 210 and 211 so that a specific distance H is maintained between the first and second circuit substrates 210 and 211 .

第二電路基板211與第一電路基板210電性連接，其中，在第一與第二電路基板210與211電性連接的一實施例中，如圖1B所示，第一電路基板210與第二電路基板211相互對應的表面210a與211b分別具有第一電性插座210b與第二電性插座211c相互插接。第一電性插座210b為公插座，第二電電性插座211c為母插座，或者是第一電性插座210b為母插座，第二電電性插座211c為公插座，皆可以實施。在圖1A與1B的實施例中，複數個探針220藉由第一電性插座210b以及第二電電性插座211c與第二電路基板211電性連接。 The second circuit substrate 211 is electrically connected to the first circuit substrate 210 , wherein, in an embodiment in which the first and second circuit substrates 210 and 211 are electrically connected, as shown in FIG. 1B , the first circuit substrate 210 is electrically connected to the first circuit substrate 210 The surfaces 210a and 211b of the two circuit substrates 211 corresponding to each other respectively have a first electrical socket 210b and a second electrical socket 211c to be plugged with each other. Either the first electrical socket 210b is a male socket and the second electrical socket 211c is a female socket, or the first electrical socket 210b is a female socket and the second electrical socket 211c is a male socket, both can be implemented. In the embodiment of FIGS. 1A and 1B , the plurality of probes 220 are electrically connected to the second circuit substrate 211 through the first electrical socket 210b and the second electrical socket 211c.

除了圖1A的電性連接方式之外，如圖2所示，其為本發明之探針卡另一實施例剖面示意圖。在本實施例中，探針卡21a的第一電路基板210與第 二電路基板211具有相互對應的表面210a與211b，其中，表面210a上具有與第一電性連接端210c，表面211b上具有第二電性連接插座211c，與轉接板211d電性連接。轉接板211d上具有複數個第二電性連接端211e，每一個第二電性連接端211e與第一電性連接端211c相互對應。相互對應的第一與第二電性連接端210c與211e透過導線92電性連接，使得第一電路基板210與第二電路基板211之間可以進行電訊傳輸。要說明的是，在圖2的實施例中，複數個探針220藉由第一電性連接端210c、導線92、轉接板211d以及第二電性連接插座211c與第二電路基板211電性連接。 In addition to the electrical connection method shown in FIG. 1A , as shown in FIG. 2 , it is a schematic cross-sectional view of another embodiment of the probe card of the present invention. In this embodiment, the first circuit substrate 210 of the probe card 21a is connected to the first circuit board 210 of the probe card 21a. The two circuit substrates 211 have surfaces 210a and 211b corresponding to each other, wherein the surface 210a has a first electrical connection end 210c, and the surface 211b has a second electrical connection socket 211c, which is electrically connected to the adapter board 211d. The adapter board 211d has a plurality of second electrical connection ends 211e, and each of the second electrical connection ends 211e corresponds to the first electrical connection end 211c. The first and second electrical connection terminals 210c and 211e corresponding to each other are electrically connected through the wires 92, so that the first circuit substrate 210 and the second circuit substrate 211 can perform telecommunication transmission. It should be noted that, in the embodiment of FIG. 2 , the plurality of probes 220 are electrically connected to the second circuit substrate 211 through the first electrical connection ends 210c, the wires 92, the adapter plate 211d and the second electrical connection sockets 211c. sexual connection.

主動控制晶片212設置於第二電路基板211上，主動控制晶片212用以接收來自測試機20的第一測試訊號90，並將該第一測試訊號90轉換成第二測試訊號91並傳輸給第一電路基板211。在本實施例中，該主動控制晶片212為FPGA，但不以此為限，例如：單晶片或者是用以將第一測試訊號90轉換成第二測試訊號91的專用晶片亦可。其中，第二測試訊號91為高頻或高速的測試訊號，在一實施例中為2.5GH或3GHz的測試訊號。要說明的是，2.5GH或3GHz僅為實施的其中之一例示，並不以該頻率為限制。本實施例中，主動控制晶片212藉由複數個可程式邏輯閘將中低速或中低頻的第一測試訊號90調變成高速或高頻的第二測試訊號91。 The active control chip 212 is disposed on the second circuit substrate 211, and the active control chip 212 is used for receiving the first test signal 90 from the tester 20, converting the first test signal 90 into a second test signal 91 and transmitting it to the first test signal 90. A circuit substrate 211 . In this embodiment, the active control chip 212 is an FPGA, but not limited thereto, for example, a single chip or a dedicated chip for converting the first test signal 90 into the second test signal 91 may also be used. The second test signal 91 is a high-frequency or high-speed test signal, in one embodiment, a 2.5GH or 3GHz test signal. It should be noted that 2.5GHz or 3GHz is only an example of implementation, and the frequency is not limited. In this embodiment, the active control chip 212 modulates the first test signal 90 of low-speed or low-frequency into the second test signal 91 of high-speed or high frequency through a plurality of programmable logic gates.

要說明的是，利用主動控制晶片212轉換訊號速度或頻率的方式，可以讓檢測裝置2在既有架構配置因應高速高頻待測物測試的需求，達到降低成本與提高檢測效益的效果。由於主動控制晶片212在調變訊號時，內部的邏輯電路會因為功率消耗而發熱，熱能增加了主動控制晶片212的溫度，進而影響主動控制晶片212電路的性能，例如：處理速度變慢，與可靠性，例如：因高溫而停 止運作等。因此，本實施例在主動控制晶片上設置散熱模組213，讓散熱模組213吸收主動控制晶片212所發出之熱。在圖1A與圖1B所示的實施例中，散熱模組213包括有散熱鰭片2130。在另一實施例中，如圖3所示，探針卡21b的散熱模組213a包含有散熱鰭片2130以及散熱風扇2131。散熱風扇2131可以快速的把散熱鰭片2130的發熱逸散到外部環境，提升散熱的效果。此外，散熱模組也可以為具有管路的液冷式冷卻設計，使用者可以根據散熱需求選擇適當的散熱手段，因此不以本發明所列示的實施例為限制。 It should be noted that, by actively controlling the chip 212 to convert the signal speed or frequency, the detection device 2 can be configured in the existing structure to meet the requirements of high-speed and high-frequency DUT testing, thereby reducing costs and improving detection efficiency. When the active control chip 212 modulates the signal, the internal logic circuit will heat up due to power consumption, and the thermal energy increases the temperature of the active control chip 212, which in turn affects the performance of the active control chip 212 circuit, such as slowing down the processing speed, and Reliability, e.g. stop due to high temperature stop operation, etc. Therefore, in this embodiment, the heat dissipation module 213 is disposed on the active control chip, so that the heat dissipation module 213 absorbs the heat emitted by the active control chip 212 . In the embodiment shown in FIGS. 1A and 1B , the heat dissipation module 213 includes heat dissipation fins 2130 . In another embodiment, as shown in FIG. 3 , the heat dissipation module 213 a of the probe card 21 b includes a heat dissipation fin 2130 and a heat dissipation fan 2131 . The heat dissipation fan 2131 can quickly dissipate the heat generated by the heat dissipation fins 2130 to the external environment, thereby improving the effect of heat dissipation. In addition, the heat dissipation module can also be a liquid-cooled cooling design with pipelines, and the user can select an appropriate heat dissipation means according to the heat dissipation requirements, so the embodiments listed in the present invention are not limited.

此外，第二電路基板211配合貫孔211a的設計可以使第二電路基板211呈U字型、L字型或者口字型，可以增加散熱對流的流道，以提升對於主動控制晶片212的散熱效果。第二電路基板的貫孔211a對應探針區22之位置。 In addition, the design of the second circuit substrate 211 in conjunction with the through hole 211 a can make the second circuit substrate 211 be U-shaped, L-shaped or mouth-shaped, which can increase the heat dissipation and convection flow channels to improve the heat dissipation of the active control chip 212 Effect. The through holes 211 a of the second circuit substrate correspond to the positions of the probe regions 22 .

綜合上述，本發明利用在既有第一電路板210與測試機20的架構下，設置了具有主動控制晶片212的第二電路板211，讓檢測裝置在既有中低速或中低頻的測試機架構下，將中低速或中低頻測試訊號調變成高頻或高速訊號，使得既有的檢測裝置架構就可以對高頻或高速的待測物進行檢測，達到簡化測試設備提升檢測效能以及降低設備成本的效果。此外，本發明更於主動控制晶片212上設置散熱模組213，解決因為高頻或高速測試訊號使得主動控制晶片212功率消耗發熱的問題以維持適當的運作溫度，進而可以提升主動控制晶片212的電路性能與可靠性。 To sum up the above, the present invention utilizes the structure of the existing first circuit board 210 and the testing machine 20 to set the second circuit board 211 with the active control chip 212, so that the testing device can be used in the existing low-speed or low-frequency testing machine. Under the framework, the medium-low-speed or medium-low frequency test signal is converted into a high-frequency or high-speed signal, so that the existing detection device structure can detect the high-frequency or high-speed DUT, thus simplifying the test equipment, improving the detection efficiency and reducing the equipment. cost effect. In addition, the present invention further disposes the heat dissipation module 213 on the active control chip 212 to solve the problem of power consumption and heat generation of the active control chip 212 due to high frequency or high-speed test signals, so as to maintain a proper operating temperature, thereby improving the performance of the active control chip 212 circuit performance and reliability.

以上所述，乃僅記載本發明為呈現解決問題所採用的技術手段之較佳實施方式或實施例而已，並非用來限定本發明專利實施之範圍。即凡與本發明專利申請範圍文義相符，或依本發明專利範圍所做的均等變化與修飾，皆為本發明專利範圍所涵蓋。 The above descriptions are merely for describing the preferred embodiments or examples of the technical means adopted by the present invention to solve the problems, and are not intended to limit the scope of the patent implementation of the present invention. That is, all the equivalent changes and modifications that are consistent with the context of the scope of the patent application of the present invention, or made in accordance with the scope of the patent of the present invention, are all covered by the scope of the patent of the present invention.

21:探針卡 21: Probe card

210:第一電路基板 210: The first circuit substrate

210a:表面 210a: Surface

210b:第一電性插座 210b: first electrical socket

211:第二電路基板 211: Second circuit substrate

211a:貫孔 211a: Through hole

211b:表面 211b: Surface

211c:第二電性插座 211c: Second electrical socket

212:主動控制晶片 212: Active control chip

213:散熱模組 213: cooling module

2130:散熱鰭片 2130: cooling fins

214:支撐柱 214: Support column

220:探針 220: Probe

23:探針固定模組 23: Probe fixing module

91:第二測試訊號 91: The second test signal

W:待測物 W: object to be tested

H:距離 H: distance

Claims (11)

一種探針卡，包括有：一第一電路基板，具有複數個探針；一第二電路基板，與該第一電路基板電性連接；一主動控制晶片，設置於該第二電路基板上，該主動控制晶片用以接收來自一測試機的一第一測試訊號，將該第一測試訊號轉換成一第二測試訊號再傳輸給該第一電路基板，其中，該主動控制晶片將該第一測試訊號調變成該第二測試訊號，該調變方式係利用該主動控制晶片轉換該第一測試訊號速度或頻率的方式成該第二測試訊號，該第二測試訊號的頻率或者速度高於該第一測試訊號；以及一散熱模組，與該主動控制晶片耦接，以吸收該主動控制晶片所發出之熱。 A probe card includes: a first circuit substrate with a plurality of probes; a second circuit substrate electrically connected with the first circuit substrate; an active control chip arranged on the second circuit substrate, The active control chip is used for receiving a first test signal from a testing machine, converts the first test signal into a second test signal and transmits it to the first circuit substrate, wherein the active control chip performs the first test signal The signal is modulated into the second test signal, and the modulation method uses the active control chip to convert the speed or frequency of the first test signal into the second test signal, and the frequency or speed of the second test signal is higher than the first test signal. a test signal; and a heat dissipation module coupled with the active control chip to absorb the heat emitted by the active control chip. 如請求項1所述之探針卡，其中該主動控制晶片為一現場可編程輯閘陣列。 The probe card of claim 1, wherein the active control chip is a field programmable gate array. 如請求項1所述之探針卡，其中該散熱模組係為一散熱鰭片、一散熱風扇或前述之組合。 The probe card of claim 1, wherein the heat dissipation module is a heat dissipation fin, a heat dissipation fan, or a combination of the foregoing. 如請求項1所述之探針卡，其中該探針為懸臂式探針。 The probe card of claim 1, wherein the probe is a cantilever probe. 如請求項1所述之探針卡，其中該複數個探針設置於該第一電路基板上的一探針區，該第二電路基板對應該探針區之位置具有一貫孔。 The probe card of claim 1, wherein the plurality of probes are disposed in a probe area on the first circuit substrate, and the second circuit substrate has a through hole corresponding to the position of the probe area. 如請求項1所述之探針卡，其中該第二電路基板具有一貫孔，該第二電路基板配合該貫孔的設計，使該第二電路基板呈一U字型、一L字型或者一口字型。 The probe card of claim 1, wherein the second circuit substrate has a through hole, and the second circuit substrate matches the design of the through hole, so that the second circuit substrate has a U-shape, an L-shape or A mouthful of fonts. 如請求項6所述之探針卡，其中該複數個探針設置於該第一電路基板上的一探針區，該第二電路基板的貫孔對應該探針區之位置。 The probe card of claim 6, wherein the plurality of probes are disposed in a probe area on the first circuit substrate, and the through holes of the second circuit substrate correspond to the positions of the probe area. 如請求項1所述之探針卡，其係更具有複數個支撐柱設置於該第一與第二電路基板之間，使該第一與第二電路基板之間保持一距離。 The probe card as claimed in claim 1, further comprising a plurality of support columns disposed between the first and second circuit substrates to maintain a distance between the first and second circuit substrates. 如請求項1所述之探針卡，其中該第一電路基板上具有一第一電性插座，而第二電路基板上具有一第二電性插座，該第一與第二電性插座相互電性連接。 The probe card of claim 1, wherein the first circuit substrate has a first electrical socket, and the second circuit substrate has a second electrical socket, and the first and second electrical sockets are mutually Electrical connection. 如請求項1所述之探針卡，其中該第一電路基板上具有複數個第一電性連接端，而第二電路基板具有一轉接板，其上具有複數個第二電性連接端，其係分別藉由一導線與對應的第一電性接點電性連接。 The probe card as claimed in claim 1, wherein the first circuit substrate has a plurality of first electrical connection terminals, and the second circuit substrate has an adapter board with a plurality of second electrical connection terminals thereon , which are respectively electrically connected with the corresponding first electrical contacts through a wire. 一種檢測裝置，包括：一測試機，用以輸出一第一測試訊號；以及如申請專利範圍第1項至第10項中任何一項的探針卡，與該測試機電性連接，其中該第二測試訊號經由該第一電路基板傳給該複數個探針，以對一待測物進行電性檢測。 A testing device, comprising: a testing machine for outputting a first test signal; and a probe card according to any one of items 1 to 10 in the scope of the patent application, electrically connected to the testing machine, wherein the first Two test signals are transmitted to the plurality of probes through the first circuit substrate, so as to perform electrical detection on an object to be tested.
TW110114164A 2021-04-20 2021-04-20 Probe card and inspection device using the same TWI776476B (en)

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TW201027078A (en) * 2008-12-03 2010-07-16 Formfactor Inc Mechanical decoupling of a probe card assembly to improve thermal response
TW201111797A (en) * 2009-09-17 2011-04-01 Mpi Corp Area array probe card
US20120212248A9 (en) * 2004-06-16 2012-08-23 Fu Chiung Chong Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
TWI689731B (en) * 2019-03-18 2020-04-01 中華精測科技股份有限公司 Probe card testing device and signal switching module thereof

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Publication number Priority date Publication date Assignee Title
US20120212248A9 (en) * 2004-06-16 2012-08-23 Fu Chiung Chong Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
US20080042668A1 (en) * 2005-04-19 2008-02-21 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
TW200807427A (en) * 2006-06-13 2008-02-01 Formfactor Inc Method of designing an application specific probe card test system
TW201027078A (en) * 2008-12-03 2010-07-16 Formfactor Inc Mechanical decoupling of a probe card assembly to improve thermal response
TW201111797A (en) * 2009-09-17 2011-04-01 Mpi Corp Area array probe card
TWI689731B (en) * 2019-03-18 2020-04-01 中華精測科技股份有限公司 Probe card testing device and signal switching module thereof

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