TWI772277B - Led apparatus employing tunable color filtering using multiple neodymium and fluorine compounds - Google Patents

Led apparatus employing tunable color filtering using multiple neodymium and fluorine compounds Download PDF

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TWI772277B
TWI772277B TW105140480A TW105140480A TWI772277B TW I772277 B TWI772277 B TW I772277B TW 105140480 A TW105140480 A TW 105140480A TW 105140480 A TW105140480 A TW 105140480A TW I772277 B TWI772277 B TW I772277B
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compounds
led
component
neodymium
color
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TW201739895A (en
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凱文 班納
蓋瑞 亞倫
蔡登奇
湯瑪士 克林尼
何建民
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美商薩萬特科技有限公司
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    • HELECTRICITY
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    • C09D7/40Additives
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
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    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
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    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
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    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
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    • F21Y2115/00Light-generating elements of semiconductor light sources
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    • F21Y2115/15Organic light-emitting diodes [OLED]
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    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

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Abstract

The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module configured to generate a visible light such as white light, and at least one component such as an optical component comprising multiple (two or more) compounds, each containing neodymium (Nd) and at least one compound including fluorine (F) for imparting a desired color filtering effect to provide a desired light spectrum, where a color of the desired light spectrum in a color space is determined by relative amounts of the two or more compounds in the at least one component.

Description

使用多種釹和氟化合物於可調彩色濾光上的LED裝置 LED devices using various neodymium and fluorine compounds on tunable color filters 相關申請案之相互引用Cross-Citation of Related Applications

本申請案為2015年10月6日提出申請之共待審共有美國專利申請案序號14/876366的部分連續申請案,該案教示係以全文引用方式併入本文中。本申請案為2014年10月8日提出申請之共待審共有國際申請案PCT/CN2014/088116的部分連續申請案,該案教示係以全文引用方式併入本文中。 This application is a continuation-in-part of co-pending co-owned US Patent Application Serial No. 14/876,366 filed on October 6, 2015, the teachings of which are incorporated herein by reference in their entirety. This application is a continuation-in-part of co-pending co-owned international application PCT/CN2014/088116 filed on October 8, 2014, the teachings of which are incorporated herein by reference in their entirety.

本發明大致關於照明應用及相關技術,更明確但非排他地說,本發明關於使用多種包含釹(Nd)及氟(F)之化合物以在LED燈裝置中賦予所希望的彩色濾光效果。 The present invention relates generally to lighting applications and related art, and more specifically, but not exclusively, to the use of various compounds comprising neodymium (Nd) and fluorine (F) to impart desired color filtering effects in LED lamp devices.

如本文所使用之發光二極體(LED),亦包括有機LED(OLED),係將電能轉換成包括可見光(波長為約 400至750nm)之電磁輻射的固態半導體裝置。LED通常包含摻雜有雜質以產生p-n接面之半導體材料的晶片(晶粒)。該LED晶片係電性連接至陽極及陰極,該等電極經常均安裝在LED封裝內。相較於諸如白熾燈或螢光燈之其他燈具,LED以更窄光束發射更定向的可見光。 Light emitting diodes (LEDs), as used herein, also include organic LEDs (OLEDs), which convert electrical energy to include visible light (wavelengths of about 400 to 750 nm) solid-state semiconductor devices for electromagnetic radiation. LEDs typically comprise a wafer (die) of semiconductor material doped with impurities to create a p-n junction. The LED chip is electrically connected to the anode and cathode, which are often mounted within the LED package. LEDs emit more directional visible light in narrower beams than other light fixtures such as incandescent or fluorescent lamps.

OLED通常包含至少一個位於電極(至少一個電極為透明)之間的電致發光發射層(有機半導體膜)。該電致發光層回應於在電極之間流動的電流而發光。 OLEDs generally comprise at least one electroluminescent emissive layer (organic semiconductor film) located between electrodes (at least one of which is transparent). The electroluminescent layer emits light in response to current flowing between the electrodes.

LED/OLED光源(燈)提供優於傳統白熾燈及螢光燈的各種優點,包括但不局限於較長之預期壽命、較高能源效率、及不需要暖機時間即可達到全亮度。 LED/OLED light sources (lamps) offer various advantages over traditional incandescent and fluorescent lamps, including but not limited to longer life expectancy, higher energy efficiency, and full brightness without warm-up time.

雖然LED/OLED照明在效率、耐久性、靈活性及其他有利方面具有吸引力,但仍需要持續改善LED照明之色彩性質,尤其是白光LED/OLED裝置,以用於一般照明及用於顯示器應用二者。 While LED/OLED lighting is attractive in terms of efficiency, durability, flexibility, and other benefits, there is a continuing need to improve the color properties of LED lighting, especially white LED/OLED devices, for general lighting and for display applications both.

圖1為適於局部照明應用之傳統之以LED為主的照明裝置10之透視圖。該照明裝置(亦可稱為「照明單元」或「燈」)10包括透明或半透明蓋或密封物12、螺紋基底接頭14、以及介於該密封物12與該接頭14之間的殼架或底座16。 FIG. 1 is a perspective view of a conventional LED-based lighting device 10 suitable for localized lighting applications. The lighting device (also referred to as a "lighting unit" or "lamp") 10 includes a transparent or translucent cover or seal 12 , a threaded base connector 14 , and a housing between the seal 12 and the connector 14 or base 16.

可為包括多個LED器件之LED陣列的以LED為主的光源(未圖示)係位於密封物12下端並與底座16相鄰。由於LED器件發射在窄波長帶中的可見光,例如,綠光、藍光、紅光等,故LED燈中經常使用不同LED器 件之組合以產生各種不同光色彩,包括白光。或者,基本上顯現為白色之光可藉由來自藍光LED之光與將至少一部分該藍光LED的藍光轉換成不同色彩之磷光體(例如釔鋁石榴石:鈰,縮寫為YAG:Ce)的組合而產生;該經轉換之光與該藍光的組合可產生顯現白色或基本上為白色的光。該等LED器件可安裝在底座16內的托架上,及可用包含折射率匹配之材料的保護蓋封裝在該托架上,以加強從該等LED器件提取可見光的效率。 An LED-based light source (not shown), which may be an LED array including a plurality of LED devices, is located at the lower end of the encapsulant 12 adjacent to the base 16 . Since LED devices emit visible light in a narrow wavelength band, eg, green, blue, red, etc., different LED devices are often used in LED lamps A combination of components to produce a variety of different light colors, including white light. Alternatively, light that appears substantially white can be obtained by a combination of light from a blue LED and a phosphor (eg, yttrium aluminum garnet:cerium, abbreviated as YAG:Ce) that converts at least a portion of the blue light of the blue LED to a different color to produce; the combination of the converted light and the blue light can produce light that appears white or substantially white. The LED devices can be mounted on a bracket within the base 16 and can be encapsulated on the bracket with a protective cover comprising an index matching material to enhance the efficiency of visible light extraction from the LED devices.

為了促進照明裝置10以幾近全向方向發射可見光的能力,圖1所示之密封物12的形狀可為基本上為球形或橢圓形。為了進一步促進幾近全向照明能力,密封物12可包括能使該密封物12發揮光漫射器作用的材料。用以製造該漫射器之材料可包括聚醯胺(例如,耐綸(nylon))、聚碳酸酯(PC)、或聚丙烯(PP)等等。該等聚合材料亦可包括SiO2以促進光之折射,及因而達成白色反射外觀。該密封物12的內表面可具備含有磷光體組成物的塗層(未圖示)。 To facilitate the ability of the lighting device 10 to emit visible light in nearly omnidirectional directions, the shape of the seal 12 shown in FIG. 1 may be substantially spherical or elliptical. To further facilitate near omnidirectional lighting capabilities, the encapsulant 12 may include a material that enables the encapsulant 12 to function as a light diffuser. Materials used to make the diffuser may include polyamide (eg, nylon), polycarbonate (PC), or polypropylene (PP), among others. These polymeric materials may also include SiO2 to facilitate the refraction of light, and thus achieve a white reflective appearance. The inner surface of the encapsulant 12 may be provided with a coating (not shown) containing a phosphor composition.

雖然可利用使用不同LED器件及/或磷光體的組合以促進LED燈產生白光效果的能力,但亦希望有其他方法作為替代方案或除此之外亦希望有其他方法,以改善由LED器件所產生之白光的色彩特性。 While the ability to use a combination of different LED devices and/or phosphors to promote the white light effect of an LED lamp can be utilized, alternatives or in addition to other methods are also desired to improve the performance of LED devices. The color properties of the white light produced.

根據本發明之態樣,裝置包含:至少一個發 光二極體(LED)模組,其經建構以產生可見光;及至少一個組件,其包含二或更多種化合物,該化合物分別包含釹(Nd),且該二或更多種化合物中至少一種化合物還包含氟(F),該至少一個組件經建構以藉由使用該二或更多種化合物過濾所產生的可見光而提供所希望的光譜,其中,在色空間中之所希望光譜的色彩係由該至少一個組件中之該二或更多種化合物的相對量決定。 According to an aspect of the invention, the apparatus includes: at least one hair a light diode (LED) module constructed to generate visible light; and at least one component comprising two or more compounds each comprising neodymium (Nd) and at least one of the two or more compounds The compound also includes fluorine (F), the at least one component is structured to provide a desired spectrum by filtering the generated visible light using the two or more compounds, wherein the color system of the desired spectrum in color space is determined by the relative amounts of the two or more compounds in the at least one component.

根據本發明之態樣,該二或更多種化合物中之至少一種化合物可為氟化釹(NdF3)。再者,該二或更多種化合物中之至少一種其他化合物可包含三氧化二釹(Nd2O3)。更進一步,該二或更多種化合物可包含Nd3+離子及F-離子。 According to aspects of the invention, at least one of the two or more compounds may be neodymium fluoride ( NdF3 ). Furthermore, at least one other compound of the two or more compounds may comprise neodymium trioxide (Nd 2 O 3 ). Still further, the two or more compounds may comprise Nd 3+ ions and F ions.

更進一步根據本發明之態樣,在色空間中之所希望光譜的色彩可在至少由該二或更多種化合物之吸收向量所界定的色空間中之預定區域內變化。再者,該在該色空間中的預定區域可局限於約12個麥克亞當橢圓(MacAdam ellipse)(或類似者)。 Still further in accordance with aspects of the present invention, the desired spectrum of color in color space may vary within a predetermined region in color space bounded by at least the absorption vectors of the two or more compounds. Again, the predetermined area in the color space may be limited to about 12 MacAdam ellipses (or the like).

又更進一步根據本發明之態樣,至少一個LED模組可包含有機LED。再者,該裝置可包含含有複數個LED模組與對應複數個組件之積體電路。 Still further in accordance with aspects of the present invention, at least one LED module can include organic LEDs. Furthermore, the device may include an integrated circuit including a plurality of LED modules and a corresponding plurality of components.

又更進一步根據本發明之態樣,至少一個組件可為沈積在該至少一個LED模組頂部上的封裝層。再者,該至少一個組件包含選自由TiO2、SiO2及Al2O3所組成之群組的添加劑以提高該至少一個組件中之該二或更多 種化合物的漫射係數。更進一步,該封裝層可為低溫玻璃、聚合物、聚合物前驅物、聚碳酸酯、熱塑性或熱固性聚合物或樹脂、聚矽氧、或聚矽氧環氧樹脂。又更進一步,該至少一個組件可另外包含磷光體。 Still further in accordance with aspects of the present invention, the at least one component may be an encapsulation layer deposited on top of the at least one LED module. Furthermore, the at least one component includes an additive selected from the group consisting of TiO 2 , SiO 2 and Al 2 O 3 to increase the diffusion coefficient of the two or more compounds in the at least one component. Still further, the encapsulation layer may be low temperature glass, polymer, polymer precursor, polycarbonate, thermoplastic or thermosetting polymer or resin, polysiloxane, or polysiloxane epoxy. Still further, the at least one component may additionally comprise a phosphor.

又更進一步根據本發明之態樣,該至少一個組件可為沉積在包含磷光體之另一封裝層上的封裝層,該另一封裝層係沉積在該至少一個LED模組的頂部上。 Still further in accordance with aspects of the present invention, the at least one component may be an encapsulation layer deposited on another encapsulation layer comprising phosphor, the other encapsulation layer deposited on top of the at least one LED module.

又更進一步根據本發明之態樣,該二或更多種化合物中之至少一種化合物可包一或更多種Nd-F及Nd-X-F化合物,其中,X為元素O、N、S、Cl、OH、Na、K、Al、Mg、Li、Ca、Sr、Ba及Y中之一或更多者。 Still further according to aspects of the present invention, at least one of the two or more compounds may include one or more Nd-F and Nd-X-F compounds, wherein X is the element O, N, S, Cl , one or more of OH, Na, K, Al, Mg, Li, Ca, Sr, Ba and Y.

又更進一步根據本發明之態樣,該至少一個組件可為包含透明、半透明或反射性基材且該基材表面上具有塗層的光學組件,該塗層包含該二或更多種化合物以藉由過濾所產生的可見光來提供所希望光譜。再者,該塗層之厚度可在約50nm至約1000微米的範圍。更進一步,該塗層還可包含折射率高於該二或更多種化合物之添加劑,且其中該添加劑係選自至少包括TiO2、SiO2及Al2O3之金屬氧化物及非金屬氧化物。又更進一步,該塗層可配置於該基材的內表面上。又更進一步,該基材可為漫射器,其選自由下列所組成之群組:密封該至少一個LED模組的燈泡、透鏡、及圓頂。 Still further according to aspects of the invention, the at least one component can be an optical component comprising a transparent, translucent or reflective substrate with a coating on the surface of the substrate, the coating comprising the two or more compounds The desired spectrum is provided by filtering the visible light produced. Furthermore, the thickness of the coating may range from about 50 nm to about 1000 microns. Further, the coating may further comprise an additive having a refractive index higher than the two or more compounds, and wherein the additive is selected from metal oxides and non-metal oxides including at least TiO 2 , SiO 2 and Al 2 O 3 thing. Still further, the coating can be disposed on the inner surface of the substrate. Still further, the substrate may be a diffuser selected from the group consisting of a bulb encapsulating the at least one LED module, a lens, and a dome.

更進一步根據本發明之態樣,該至少一個組 件可使用射出成形或相似技術沉積。 Still further according to aspects of the invention, the at least one group Pieces can be deposited using injection molding or similar techniques.

10‧‧‧照明裝置 10‧‧‧Lighting

12‧‧‧密封物 12‧‧‧Sealings

14、74‧‧‧接頭 14, 74‧‧‧ connector

16、76‧‧‧殼架、底座 16, 76‧‧‧ Shell frame, base

20、22‧‧‧曲線 20, 22‧‧‧curve

30、32、36、42a、44a、46a、48a、42b、44b、46b、48b‧‧‧向量 30, 32, 36, 42a, 44a, 46a, 48a, 42b, 44b, 46b, 48b‧‧‧vector

34‧‧‧區域 34‧‧‧Area

38‧‧‧單點 38‧‧‧Single Point

52、54、56、58‧‧‧色點 52, 54, 56, 58‧‧‧ color point

60a、60b、60c、60d、80、100‧‧‧以LED為主之照明裝置 60a, 60b, 60c, 60d, 80, 100‧‧‧LED-based lighting devices

62‧‧‧圓頂 62‧‧‧Dome

64a‧‧‧封裝劑材料層 64a‧‧‧Encapsulant Material Layer

65、105‧‧‧LED晶片 65, 105‧‧‧LED chip

66‧‧‧印刷電路板 66‧‧‧Printed circuit boards

64b‧‧‧磷光體層 64b‧‧‧phosphor layer

68b‧‧‧封裝劑層 68b‧‧‧Encapsulant layer

68c、68d‧‧‧複合物層 68c, 68d‧‧‧composite layer

64d‧‧‧磷光體塗層 64d‧‧‧phosphor coating

70‧‧‧LED燈 70‧‧‧LED lights

72、102‧‧‧燈泡 72, 102‧‧‧light bulb

78、88‧‧‧塗層 78、88‧‧‧Coating

82‧‧‧半球形基材 82‧‧‧Spherical substrate

90‧‧‧透鏡 90‧‧‧Lens

92‧‧‧平坦基材 92‧‧‧Flat substrate

106‧‧‧反射性基材 106‧‧‧Reflective substrates

當參考附圖閱讀以下詳細說明時,將更加理解本發明之此等及其他特徵及態樣優點,所有圖式中之相似特徵表示相似部件,其中:圖1為傳統以LED為主的照明裝置之透視圖;圖2為Nd2O3及NdF3之可見光譜中的透射圖;圖3圖示摻入光學組件(諸如聚矽氧或聚碳酸酯)中並沉積在標準LED封裝(諸如具有3000K CCT之80CRI)上之Nd2O3及NdF3化合物如何使光源的色點沿著Nd2O3及NdF3化合物之光譜吸收所界定的向量偏移之色空間圖;圖4a為根據本發明實施態樣之包含不同量的Nd2O3及NdF3之Nd化合物混合物的可見光譜之透射圖;圖4b為利用圖4a所示之根據本發明實施態樣的具有各種不同Nd化合物混合物之濾光器的燈(諸如LED燈)在可見光譜中的模擬發射圖;圖5為比較標準3000K LED燈之色點與包含分別於圖4a及4b所示之根據本發明實施態樣的具有各種不同Nd化合物混合物之濾光器的LED燈之模擬色點的色空間圖; 圖6a至6d為根據本發明各種不同實施態樣之併入ND-F化合物(更常見為如本文所述之Nd-X-F)連同磷光體以賦予有利的可見光吸收/產生特徵之以LED為主的照明裝置;圖7為根據本發明一實施態樣之以LED為主的照明裝置之橫斷面圖;圖8為根據本發明另一實施態樣之以LED為主的照明裝置之橫斷面圖;圖9為根據本發明其他實施態樣之以LED為主的照明裝置之透視圖;圖10為根據本發明一其他實施態樣之以LED為主的照明裝置之透視圖。 These and other features and advantages of aspects of the present invention will be better understood when reading the following detailed description with reference to the accompanying drawings, in which like features represent like parts throughout the drawings, wherein: FIG. 1 is a conventional LED-based lighting device FIG. 2 is a transmission diagram in the visible spectrum of Nd2O3 and NdF3 ; Color space diagram of how Nd2O3 and NdF3 compounds at 3000K CCT at 80CRI ) shift the color point of the light source along the vector defined by the spectral absorption of Nd2O3 and NdF3 compounds ; Figure 4a is according to this Transmission diagrams of visible spectra of Nd compound mixtures comprising different amounts of Nd 2 O 3 and NdF 3 according to embodiments of the invention; FIG. 4b is a diagram of the transmission of the visible spectrum with various Nd compound mixtures according to embodiments of the invention shown in FIG. 4a. Simulated emission plots in the visible spectrum for a lamp (such as an LED lamp) of the filter; Figure 5 compares the color point of a standard 3000K LED lamp with various Color space diagrams of simulated color points of LED lamps for filters of different mixtures of Nd compounds; Figures 6a-6d are according to various embodiments of the invention incorporating ND-F compounds (more commonly Nd as described herein) -XF) LED-based lighting device in conjunction with phosphor to impart favorable visible light absorption/generation characteristics; Figure 7 is a cross-sectional view of an LED-based lighting device according to an embodiment of the present invention; Figure 8 is a cross-sectional view of an LED-based lighting device according to another embodiment of the present invention; FIG. 9 is a perspective view of an LED-based lighting device according to another embodiment of the present invention; A perspective view of an LED-based lighting device according to another embodiment of the invention.

本文呈現一種新穎裝置,諸如照明裝置,該裝置包含至少一個經建構以產生可見光(諸如白光)之LED(或OLED)模組,及至少一個組件,諸如包含多種(二或更多種)化合物之光學組件分別包含釹(Nd)且至少一種化合物包含氟(F),以供賦予所希望彩色濾光效果以提供所希望光譜,其中在色空間中之所希望光譜的色彩係由該二或更多種化合物在該至少一個組件中的相對數量決定。 Presented herein is a novel device, such as a lighting device, comprising at least one LED (or OLED) module configured to generate visible light, such as white light, and at least one component, such as a compound comprising multiple (two or more) compounds The optical components each contain neodymium (Nd) and at least one compound contains fluorine (F) for imparting the desired color filtering effect to provide the desired spectrum, wherein the color of the desired spectrum in the color space is determined by the two or more The relative amounts of the various compounds in the at least one component are determined.

例如,根據本發明一實施態樣,如本文中所詳細描述,該至少一個組件(光學組件)可為包含兩種化合物之聚合物基底材料(諸如聚矽氧、聚碳酸酯等):第一種 化合物可為三氧化二釹(Nd2O3)及第二種化合物可為氟化釹(NdF3)。該釹化合物吸收在560至600nm範圍中之黃光,此改變該LED系統的色點。添加單一化合物可使該色點沿著CIE 1931色空間(色度座座為CCX及CCY)之線移動。藉由使用二或更多種化合物,色點可在CIE色空間(下文稱為「色空間」)區域內任何處移動。此容許更大程度地客製化用於如本文圖3所示之特定應用的LED系統之色彩。 For example, according to one aspect of the invention, as described in detail herein, the at least one component (optical component) may be a polymeric base material (such as polysiloxane, polycarbonate, etc.) comprising two compounds: a first The first compound may be neodymium trioxide (Nd2O3) and the second compound may be neodymium fluoride ( NdF3 ) . The neodymium compound absorbs yellow light in the range of 560 to 600 nm, which changes the color point of the LED system. Adding a single compound moves the color point along the lines of the CIE 1931 color space (the chromaticity pedestals are CCX and CCY). By using two or more compounds, the color point can be moved anywhere within the region of the CIE color space (hereinafter "color space"). This allows for greater customization of the color of the LED system for the specific application shown in Figure 3 herein.

換言之,可添加各種不同量的釹化合物(諸如上述實例中之Nd2O3及NdF3)以改變光學組件的組成以控制所得之光的色點。當添加個別組件時,兩種(或更多種)組件之不同吸收光譜造成LED系統的色點沿不同方向(即,沿CCX及CCY方向二者)移動。然後,如本文所述之多種包含Nd及F的化合物之色點移動向量可界定CIE色空間內的區域,如本文所述,該區域內的任何色點可用相同LED藉由改變該二或更多種化合物的相對量而達成。 In other words, various amounts of neodymium compounds (such as Nd2O3 and NdF3 in the above examples ) can be added to alter the composition of the optical components to control the color point of the resulting light. When individual components are added, the different absorption spectra of the two (or more) components cause the color point of the LED system to shift in different directions (ie, in both the CCX and CCY directions). Then, the color point shift vectors of various Nd and F-containing compounds as described herein can define a region within the CIE color space, as described herein, any color point within the region can be used with the same LED by changing the two or more relative amounts of various compounds.

根據其他實施態樣,可將散射元件,諸如氧化鈦(TiO2)、氧化鋁(Al2O3)、矽石(SiO2)或類似者,添加至聚合物基底以提高光學組件中之該多種Nd及F化合物的漫射係數。三個變數(例如就上述實例而言為TiO2、NdF3、及Nd2O3的負載重量)的變動可容許產生種類眾多之用以達成所希望光譜及分布的專用光學組件。 According to other embodiments, scattering elements, such as titanium oxide ( TiO2 ), aluminum oxide ( Al2O3 ), silica ( SiO2 ) , or the like, can be added to the polymer substrate to enhance the performance of the optical component. Diffuse coefficients of various Nd and F compounds. Variation of three variables (eg, loading weights of TiO2 , NdF3 , and Nd2O3 for the above example ) can allow the creation of a wide variety of specialized optical components to achieve the desired spectrum and distribution.

然而,根據本發明一實施態樣,至少一種化 合物(或超過一種化合物)可包含釹(Nd)及氟(F)元素,及隨意地包含一或更多種其他元素。通常,此種化合物包含Nd3+離子及F-離子。基於本發明目的,「Nd-F化合物」應廣義解釋為包括包含釹及氟化物及隨意的其他元素之化合物。 However, according to one aspect of the present invention, at least one compound (or more than one compound) may comprise neodymium (Nd) and fluorine (F) elements, and optionally one or more other elements. Typically, such compounds contain Nd 3+ ions and F ions. For the purposes of the present invention, "Nd-F compounds" should be interpreted broadly to include compounds comprising neodymium and fluoride and optionally other elements.

根據其他實施態樣,該組件可包括在LED(OLED)晶片表面上的複合/封裝層,以使本文所揭示之包含Nd及F的化合物可摻合(分散)於該封裝層,例如連同磷光體摻合(分散),以獲致有利的可見光吸收剖線。該複合/封裝層可使用低溫玻璃、聚合物(諸如聚碳酸酯)、聚合物前驅物、聚矽氧(聚合物)或聚矽氧環氧樹脂或前驅物等。 According to other aspects, the assembly can include a composite/encapsulation layer on the surface of an LED (OLED) wafer, such that the Nd and F-containing compounds disclosed herein can be incorporated (dispersed) in the encapsulation layer, eg, in conjunction with phosphorescence Bulk blending (dispersion) to obtain favorable visible light absorption profiles. The composite/encapsulation layer may use low temperature glass, polymers (such as polycarbonate), polymer precursors, polysiloxane (polymer) or polysiloxane epoxy or precursors, and the like.

根據另一實施態樣,該光學組件可為透明、半透明、反射性或半透射性(transflective)(部分反射及透射)基材,及在該基材表面上之包含本文所述的多種Nd及F組件之塗層可施加對於LED模組所產生的可見光之彩色濾光效果,當該可見光通過該光學組件時,例如過濾該可見光之黃光波長範圍,例如波長為約560nm至約600nm,以提供所希望的光譜。 According to another aspect, the optical component can be a transparent, translucent, reflective or transflective (partially reflective and transmissive) substrate, and on the surface of the substrate comprises various Nd as described herein And the coating of the F component can apply a color filter effect to the visible light generated by the LED module. When the visible light passes through the optical component, for example, the yellow light wavelength range of the visible light is filtered, for example, the wavelength is about 560nm to about 600nm, to provide the desired spectrum.

此外,該光學組件之透明或半透明基材可為漫射器,諸如密封該至少一個LED晶片的燈泡、透鏡、及包封件。此外,該基材可為反射性基材,及該LED晶片可配置在該基材外部。該多化合物塗層(包含本文所述之Nd及F多種化合物)可配置在該基材表面上,且該塗層 之厚度應足以獲致彩色濾光效果。該厚度通常可在50nm至1000微米之範圍內,較佳厚度係介於100nm至500微米。 Additionally, the transparent or translucent substrate of the optical component can be a diffuser, such as a bulb, a lens, and an encapsulant that encapsulates the at least one LED chip. Furthermore, the substrate can be a reflective substrate, and the LED chip can be disposed outside the substrate. The multi-compound coating (including the Nd and F compounds described herein) can be disposed on the surface of the substrate, and the coating should be thick enough to obtain a color filter effect. The thickness can generally be in the range of 50 nm to 1000 microns, with a preferred thickness being between 100 nm and 500 microns.

所得之器件藉由使用在介於約530nm與600nm之可見光區中具有內在吸收的Nd及Nd-F化合物/材料濾光可展現光參數的改善,以增強CSI(色彩飽和指數)、CRI(色彩顯色指數)、R9(色彩顯色值(rendering value))、顯色性(revealness)(照明偏好指數(lighting preference index),LPI)等。R9係界定為不用於計算CRI之6個飽和測試色彩中的一種色彩。「顯色性(revealness)」為根據LPI之版本所發射之光的參數,其描述於2014年9月9日提出申請之共待審共有國際申請案PCT/US2014/054868(於2015年3月12日公告為WO2015/035425),特此以引用方式將相關部分併入。 The resulting device can exhibit improvements in optical parameters to enhance CSI (Color Saturation Index), CRI (Color Color rendering index), R9 (color rendering value), color rendering (revealness) (lighting preference index (lighting preference index, LPI), etc. R9 is defined as one of the 6 saturated test colors not used to calculate CRI. "Revealness" is a parameter of light emitted according to the version of LPI described in co-pending international application PCT/US2014/054868 filed on September 9, 2014 (filed on March 2015) The announcement on the 12th is WO2015/035425), and the relevant parts are hereby incorporated by reference.

在一實施態樣中,本文所述之多種化合物中的至少一種化合物可包括Nd3+離子及F-離子及可為Nd-F化合物或Nd-X-F化合物。如本文所使用,「Nd-F化合物」應廣義解釋為包括包含釹及氟化物及隨意的其他元素之化合物。此等包含釹及氟化物之化合物可包含氟化釹、或氧氟化釹(例如,NdOxFy,其中2x+y=3,諸如Nd4O3F6)、或含有不定水(adventitious water)及/或氧之氟化釹、或氫氧氟化釹(neodymium hydroxide fluoride)(例如,Nd(OH)aFb,其中a+b=3)、或從下列描述將容易明白之眾多包含釹及氟化物的其他化合物。 In one embodiment, at least one of the various compounds described herein can include Nd 3+ ions and F ions and can be Nd-F compounds or Nd-XF compounds. As used herein, "Nd-F compounds" should be interpreted broadly to include compounds comprising neodymium and fluoride and optionally other elements. These neodymium and fluoride containing compounds may contain neodymium fluoride, or neodymium oxyfluoride (eg, NdOxFy , where 2x + y = 3 , such as Nd4O3F6 ), or contain adventitious water water) and/or oxygen, or neodymium hydroxide fluoride (eg, Nd(OH) a F b , where a+b=3), or as many as will be readily apparent from the following description Other compounds including neodymium and fluoride.

在一些實施態樣中,該多種化合物中之一種化合物可為NdF3或NdFO。就Nd-X-F化合物而言,X為至少一種選自由下列所組成之群組的元素:與釹形成化合物之元素,諸如氧、氮、硫及氯;或至少一種與氟形成化合物之金屬元素,諸如Na、K、Al、Mg、Li、Ca、Sr、Ba、及Y、或此等元素之組合,該等金屬元素係與釹不同。Nd-X-F化合物之特定實例可包括:氧氟化釹(Nd-O-F)化合物;Nd-X-F化合物,其中X可為Mg及Ca或可為Mg、Ca及O;以及含有Nd-F之其他化合物,包括摻雜釹之鈣鈦礦結構。特定Nd-X-F化合物可有利地更廣泛吸收在約580nm之波長。 In some embodiments, one of the plurality of compounds can be NdF3 or NdFO. For Nd-XF compounds, X is at least one element selected from the group consisting of: elements that form compounds with neodymium, such as oxygen, nitrogen, sulfur, and chlorine; or at least one metal element that forms compounds with fluorine, Metal elements such as Na, K, Al, Mg, Li, Ca, Sr, Ba, and Y, or combinations of these, are different from neodymium. Specific examples of Nd-XF compounds may include: neodymium oxyfluoride (Nd-OF) compounds; Nd-XF compounds, where X may be Mg and Ca or may be Mg, Ca, and O; and other compounds containing Nd-F , including neodymium-doped perovskite structures. Certain Nd-XF compounds can advantageously absorb more broadly at wavelengths around 580 nm.

如上述,一個組件/光學組件可為包含例如兩種化合物Nd2O3及NdF3之聚合物基底材料(諸如聚矽氧、聚碳酸酯等)。圖2為分別以曲線22表示之Nd2O3(在折射率為1.54之1.3mm厚的聚矽氧中,1.0%)於可見光譜中之透射率,以及以曲線20表示之NdF3(在折射率為1.54之1.3mm厚的聚矽氧中,2.9%)於可見光譜中之透射率圖。可看出,個別材料共有許多相似吸收特徵,尤其是在黃光(例如,約570nm至約600nm)範圍。圖2中所顯示之不同吸收峰驅動個別組件(Nd2O3及NdF3)在色空間中之不同色彩偏移向量,如圖3中進一步圖示說明。藉由組合這兩種化合物,可獲致無法用單一Nd化合物或用Nd:玻璃(SiO2中之Nd2O3)獲致的色點。 As mentioned above, an element/optical element may be a polymer base material (such as polysiloxane, polycarbonate, etc. ) comprising, for example, two compounds Nd2O3 and NdF3 . Figure 2 shows the transmittance in the visible spectrum of Nd 2 O 3 (1.0% in 1.3 mm thick polysiloxane with a refractive index of 1.54) represented by curve 22, and NdF 3 (at Transmittance map of visible spectrum in 1.3mm thick polysiloxane with a refractive index of 1.54, 2.9%). It can be seen that the individual materials share many similar absorption characteristics, especially in the yellow light (eg, about 570 nm to about 600 nm) range. The different absorption peaks shown in FIG. 2 drive different color shift vectors in the color space of the individual components (Nd 2 O 3 and NdF 3 ), as further illustrated in FIG. 3 . By combining these two compounds, it is possible to obtain color points that cannot be achieved with a single Nd compound or with Nd:glass (Nd2O3 in SiO2 ) .

使用時,吾人可用封裝劑(例如,聚矽氧、環 氧樹脂、丙烯酸系樹脂或類似者)封裝LED晶片/晶粒;該封裝劑可包含Nd2O3及NdF3材料或通常包含如本文所述之Nd及F為主的化合物,以使例如聚矽氧中之Nd2O3及NdF3可直接沉積在LED晶片上或在LED晶片的陣列上(例如,晶片直接封裝陣列(chip-on-board array),COB陣列),如本文進一步詳細說明。 In use, we can encapsulate the LED chip/die with an encapsulant (eg, polysiloxane, epoxy, acrylic, or the like) ; the encapsulant can include Nd2O3 and NdF3 materials or generally as described herein The Nd- and F-based compounds are described so that, for example, Nd 2 O 3 and NdF 3 in polysilicon can be deposited directly on LED chips or on arrays of LED chips (eg, chip-packaged arrays). on-board array), COB array), as described in further detail herein.

圖3圖示摻入光學組件(諸如聚矽氧或聚碳酸酯)中並沉積在標準LED封裝(諸如具有3000K CCT之80CRI)上之Nd2O3及NdF3化合物如何使光源的色點分別沿著Nd2O3及NdF3化合物之光譜吸收所界定的向量30及32偏移之色空間圖。 Figure 3 illustrates how Nd2O3 and NdF3 compounds incorporated into optical components (such as polysilicon or polycarbonate) and deposited on standard LED packages (such as 80CRI with 3000K CCT ) make the color point of the light source respectively Color space diagram of the shift along vectors 30 and 32 defined by the spectral absorption of Nd2O3 and NdF3 compounds.

從圖3中之圖表清楚看出,該系統理論上可容許藉由改變Nd2O3及NdF3化合物之相對量而從標準3000K LED產生在三角形ABC中的任何色點,即,使發射體之色點分別沿著Nd2O3及NdF3化合物之光譜吸收所界定的向量30及32偏移。然而,由於因高度濾光所造成的大幅能量損失是不想要的情況,該系統實際上會局限於較小區域34,例如12個麥克亞當橢圓,或根據應用及最終使用者願意犧牲LPW(流明/瓦)以獲致離起始色彩非常遠之色點的意願而任意選擇之一些其他區域大小。區域34係由線BD、BE及曲線36界定範圍。在區域34中之實際色點中的任一色點可在廣範圍之Nd2O3及NdF3化合物的相對量及漫射程度內獲致,容許在需要不同之光學元件的光束成形特性之不同LED系統中應用給定色點。相 較之下,添加Nd玻璃(傳統方法)容許色點僅移動至單點38(或者若該玻璃的厚度變動的話則沿向量移動)。圖4a、4b及5圖示說明實施本文所揭示實施態樣的其他實例。 It is clear from the graph in Figure 3 that this system can theoretically allow any color point in triangle ABC to be generated from a standard 3000K LED by varying the relative amounts of Nd2O3 and NdF3 compounds, i.e. making the emitter The color points are shifted along vectors 30 and 32 defined by the spectral absorption of Nd2O3 and NdF3 compounds, respectively. However, since large energy losses due to high filtering are undesirable, the system would actually be limited to a smaller area 34, such as 12 MacAdam ellipses, or depending on the application and the end user's willingness to sacrifice LPW (lumens) /Watt) some other area size arbitrarily chosen in order to obtain a color point very far from the starting color. Region 34 is bounded by lines BD, BE, and curve 36 . Any of the actual color points in region 34 can be achieved over a wide range of relative amounts and degrees of diffusion of Nd2O3 and NdF3 compounds, allowing for different LEDs that require the beam shaping properties of different optics Apply the given color point in the system. In contrast, the addition of Nd glass (the traditional method) allows the color point to move only to a single point 38 (or a vector if the thickness of the glass varies). 4a, 4b, and 5 illustrate other examples of implementing aspects disclosed herein.

圖4為根據本發明實施態樣之在聚矽氧帶中包含不同量的Nd2O3及NdF3之Nd化合物混合物之可見光譜的透射範例圖。曲線42a對應於包含4%之NdF3及1%之Nd2O3的1.3mm厚聚矽氧帶,曲線44a對應於包含5%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶,曲線46a對應於包含3.%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶,以及曲線48a對應於包含3.5%之NdF3及1.8%之Nd2O3的1.3mm厚聚矽氧帶。 4 is an exemplary diagram of the transmission of the visible spectrum of Nd compound mixtures containing various amounts of Nd 2 O 3 and NdF 3 in polysiloxane tapes according to embodiments of the present invention. Curve 42a corresponds to a 1.3mm thick polysilicon tape containing 4 % NdF3 and 1 % Nd2O3, and curve 44a corresponds to a 1.3mm thick polysilicon tape containing 5 % NdF3 and 0.5 % Nd2O3 Silicon tape, curve 46a corresponds to a 1.3 mm thick polysilicon tape containing 3.5 % NdF3 and 0.5% Nd2O3, and curve 48a corresponds to 3.5 % NdF3 and 1.8% Nd2O 3 of 1.3mm thick polysilicon tape.

圖4b為利用圖4a所示之根據本發明實施態樣的具有各種不同Nd化合物混合物之濾光器的燈(諸如LED燈)在可見光譜中的模擬發光圖。在圖4b中,曲線42b為具有該包含4%之NdF3及1%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈、曲線44b為具有該包含5%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈、曲線46b為具有該包含3%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈,以及曲線48b為具有該包含3.5%之NdF3及1.8%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈。 Figure 4b is a graph of simulated luminescence in the visible spectrum of a lamp, such as an LED lamp, using the filters shown in Figure 4a with various mixtures of Nd compounds in accordance with an embodiment of the present invention. In Figure 4b, curve 42b is a simulated LED lamp with the 1.3mm thick polysilicon tape containing 4 % NdF3 and 1 % Nd2O3, curve 44b is having the 5% NdF3 and 0.5% NdF3 A simulated LED lamp with a 1.3mm thick polysilicon tape of % Nd2O3, curve 46b is a simulated LED lamp with the 1.3mm thick polysilicon tape containing 3 % NdF3 and 0.5 % Nd2O3 , and curve 48b is a simulated LED lamp with the 1.3 mm thick polysilicon tape containing 3.5% NdF 3 and 1.8% Nd 2 O 3 .

圖5為比較標準3000K LED燈之色點與包含分別於圖4a及4b所示之根據本發明實施態樣的具有各種不同Nd化合物混合物之濾光器的LED燈之色點的色空間 圖。在圖5中,色點52為具有該包含4%之NdF3及1%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈、色點54為具有該包含5%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈、色點56為具有該包含3%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈,以及色點58為具有該包含3.5%之NdF3及1.8%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈。 Figure 5 is a color space diagram comparing the color point of a standard 3000K LED lamp with the color point of an LED lamp comprising filters with various mixtures of Nd compounds according to embodiments of the invention shown in Figures 4a and 4b, respectively. In FIG. 5, color point 52 is a simulated LED lamp having the 1.3 mm thick polysilicon tape containing 4 % NdF and 1% Nd2O3, and color point 54 is having the 5 % NdF3 and 0.5% Nd2O3 1.3mm thick polysilicon tape simulated LED lamp, color point 56 is with the 1.3mm thick polysilicon tape containing 3 % NdF3 and 0.5 % Nd2O3 A simulated LED lamp, and color point 58 is a simulated LED lamp with the 1.3 mm thick polysilicon tape containing 3.5 % NdF3 and 1.8 % Nd2O3.

圖4a、4b及5圖示說明改變(LED)燈之濾光組件中的NdF3及Nd2O3之相對量如何修改該燈的色溫及修改其發射光譜(例如,在570至600nm波長範圍附近的吸收峰)以提供具有所希望色溫之所希望的燈光譜(例如,使光源「白化」),及適當程度的透射流明功率,以能進一步改善其他光參數,諸如CSI、CRI、R9及顯色性(revealness)。「顯色性(revealness)」為根據LPI之版本所發射之光的參數,其描述於2014年9月9日提出申請之共待審共有國際申請案PCT/US2014/054868(於2015年3月12日公告為WO2015/035425),特此以引用方式將相關部分併入。 Figures 4a, 4b and 5 illustrate how changing the relative amounts of NdF3 and Nd2O3 in the filter element of an (LED) lamp modifies the color temperature of the lamp and modifies its emission spectrum (eg, in the 570 to 600 nm wavelength range) nearby absorption peaks) to provide a desired lamp spectrum with a desired color temperature (e.g., to "whiten" the light source), and an appropriate level of transmitted lumen power to further improve other optical parameters such as CSI, CRI, R9, and Color rendering (revealness). "Revealness" is a parameter of light emitted according to the version of LPI described in co-pending international application PCT/US2014/054868 filed on September 9, 2014 (filed on March 2015) The announcement on the 12th is WO2015/035425), and the relevant parts are hereby incorporated by reference.

在其他實施態樣中,具有對應的相對量之多種Nd及F化合物可連同一或多種發光材料(諸如磷光體)摻入封裝材料。例如,具有對應相對量之Nd及F多種化合物可與黃-綠色磷光體及/或紅色磷光體摻合。例如,該多種Nd及F化合物可與摻雜Ce之YAG磷光體及/或傳統紅色氮化物磷光體(諸如摻雜Eu2+之CaAlSiN紅色磷光體) 摻合。在其他實例中,該Nd及F多種化合物可在封裝發射藍光/紫外線之LED的聚矽氧中與YAG:Ce磷光體及紅色氮化物磷光體摻合。 In other embodiments, multiple Nd and F compounds with corresponding relative amounts may be incorporated into the encapsulating material along with one or more emissive materials, such as phosphors. For example, various compounds with corresponding relative amounts of Nd and F can be blended with yellow-green phosphors and/or red phosphors. For example, the various Nd and F compounds can be blended with Ce doped YAG phosphors and/or traditional red nitride phosphors such as Eu 2+ doped CaAlSiN red phosphors. In other examples, the Nd and F compounds can be blended with YAG:Ce phosphors and red nitride phosphors in polysilicon encapsulating blue/UV emitting LEDs.

圖6a至6d分別圖示說明根據本發明各種不同實施態樣之併入如本文所述的Nd及F多種化合物連同磷光體以獲致有利可見光吸收/產生特性的以LED為主之照明裝置60a、60b、60c及60d之不同的非限制性實例。在圖6a至6d中,該以LED為主之照明裝置60a、60b、60c或60d包括可為密封安裝在印刷電路板(PCB)66上之LED晶片65的隨意地呈透明或半透明基材之圓頂62。引線提供電流至LED晶片65,因而使其發射輻射。該LED晶片可為任何半導體光源,尤其是當所發射之輻射被導引至磷光體上時能產生白光的藍光或紫外線光源。特別是,該半導體光源可為發射波長大於約200nm以及小於約550nm之以氮化物化合物半導體為主的發射藍光/紫外線(UV)LED,其中該氮化物化合物半導體統稱為IniGajAlkN,其中i、j及k分別為具有1或0之值的整數(包括例如InGaN、AlN、AlGaN、AlGaInN裝置結構)。更具體地說,該晶片可為峰值發射波長為約400至約500nm之發射近UV或藍光的LED。又更具體地說,該晶片可為峰值發射波長在約440至460nm之範圍的發射藍光之LED。此等LED半導體在本技術中係已知。 Figures 6a-6d illustrate LED-based lighting devices 60a, 60a, respectively, incorporating Nd and F compounds as described herein along with phosphors for favorable visible light absorption/generation properties, according to various embodiments of the present invention. Different non-limiting examples of 60b, 60c, and 60d. In Figures 6a to 6d, the LED-based lighting device 60a, 60b, 60c or 60d includes an optionally transparent or translucent substrate that may be an LED chip 65 hermetically mounted on a printed circuit board (PCB) 66 The dome 62. The leads provide current to the LED die 65, thereby causing it to emit radiation. The LED chip can be any semiconductor light source, especially a blue or ultraviolet light source that produces white light when the emitted radiation is directed onto a phosphor. In particular, the semiconductor light source may be a nitride compound semiconductor-based blue/ultraviolet (UV) emitting LED with an emission wavelength greater than about 200 nm and less than about 550 nm, wherein the nitride compound semiconductors are collectively referred to as IniGa j Al k N, wherein i, j, and k are integers having a value of 1 or 0, respectively (including, for example, InGaN, AlN, AlGaN, AlGaInN device structures). More specifically, the wafer may be a near UV or blue light emitting LED with a peak emission wavelength of about 400 to about 500 nm. Still more specifically, the chip may be a blue-emitting LED with a peak emission wavelength in the range of about 440 to 460 nm. Such LED semiconductors are known in the art.

根據圖6a所示之一實施態樣,聚合物複合物層(封裝劑化合物)64a可包含與磷光體摻合的如本文所述 之Nd及F多種化合物,以對根據本文所述之各種不同實施態樣賦予有利的可見光吸收/產生特徵。該化合物層64a可直接配置在LED晶片65表面上且輻射耦合至該晶片。「輻射耦合」意指來自該LED晶片之輻射透射至磷光體,且該磷光體發射具有不同波長的輻射。在特定實施態樣中,該LED晶片65可為藍光LED,而該聚合物複合物層可包括具有對應相對量之多種Nd及F化合物與黃-綠色磷光體(諸如摻雜鈰之釔鋁石榴石,Ce:YAG)的摻合物。由該LED晶片所發射的藍光與由聚合物複合物層之磷光體所發射的黃-綠光混合,該淨發射呈現為被該Nd及F多種化合物過濾的白光。因此,LED晶片65可由封裝劑材料層64a密封。該封裝劑材料可為低溫玻璃、熱塑性或熱固性聚合物或樹脂、或聚矽氧或環氧樹脂。該LED晶片65及該封裝劑材料層64a可封裝在殼體(由圓頂62限制)內。或者,該LED裝置60a可僅包括封裝劑層64a而無外殼體/圓頂62。此外,散射粒子可埋在該封裝劑材料中以提高如本文所述之Nd及F多種化合物的漫射係數。散射粒子可為例如氧化鋁(Al2O3)、矽石(SiO2)或氧化鈦(TiO2)。又,散射粒子可有效散射自LED晶片發射的定向光,較佳具有可忽視之吸收量。 According to one implementation aspect shown in FIG. 6a, the polymer composite layer (encapsulant compound) 64a may comprise various compounds of Nd and F as described herein blended with phosphors for various Embodiments impart favorable visible light absorption/generation characteristics. The compound layer 64a may be disposed directly on the surface of the LED die 65 and radiation coupled to the die. "Radiation coupled" means that radiation from the LED chip is transmitted to the phosphor, and the phosphor emits radiation having different wavelengths. In certain embodiments, the LED chip 65 can be a blue LED, and the polymer composite layer can include various Nd and F compounds with corresponding relative amounts and a yellow-green phosphor such as cerium-doped yttrium aluminum garnet Stone, Ce: YAG) blend. The blue light emitted by the LED chip is mixed with the yellow-green light emitted by the phosphors of the polymer composite layer, and the net emission appears as white light filtered by the Nd and F compounds. Thus, the LED die 65 may be encapsulated by the encapsulant material layer 64a. The encapsulant material may be low temperature glass, thermoplastic or thermoset polymers or resins, or polysiloxane or epoxy resins. The LED die 65 and the encapsulant material layer 64a can be encapsulated within a housing (bounded by the dome 62). Alternatively, the LED device 60a may include only the encapsulant layer 64a without the outer casing/dome 62. Additionally, scattering particles can be embedded in the encapsulant material to increase the diffusion coefficient of Nd and F compounds as described herein. The scattering particles can be, for example, aluminum oxide (Al 2 O 3 ), silica (SiO 2 ), or titanium oxide (TiO 2 ). Also, the scattering particles can effectively scatter the directional light emitted from the LED chip, and preferably have a negligible amount of absorption.

為了在LED晶片表面上形成包括如本文所述之對應相對量的多種Nd及F化合物之聚合物複合物層,該等粒子可分散在聚合物或聚合物前驅物,特別是聚矽氧、聚碳酸酯、聚矽氧環氧樹脂或其前驅物中。對於LED 封裝而言已熟知此等材料。該分散混合物可藉由任何適用方法塗布在該晶片上,例如使用射出成形(或澆鑄或擠出光學組件或相似技術),且具有較大密度或粒度或較大密度與較大粒度之粒子優先沉降在緊鄰該LED晶片的區域,形成具有梯級組成的層。沉降可發生在聚合物或前驅物之塗布或固化期間,及可藉由如本技術中已知的離心方法而促進。另外應注意的是,該磷光體及該Nd及F多種化合物之分散參數(例如包括粒子密度)及製程參數可經選擇以使該磷光體材料比該Nd及F多種化合物更接近該LED晶片65,以使該Nd及F多種化合物適當地過濾由磷光體組件所產生的光。 In order to form a polymer composite layer comprising corresponding relative amounts of various Nd and F compounds as described herein on the surface of the LED chip, the particles can be dispersed in a polymer or polymer precursor, especially polysiloxane, poly Carbonate, polysiloxane epoxy or its precursors. For LEDs Such materials are well known for packaging. The dispersed mixture may be coated on the wafer by any suitable method, such as using injection molding (or casting or extruding optical components or similar techniques), with particles having greater density or particle size or greater density and larger particle size being preferred Settling in the area immediately adjacent to the LED wafer forms a layer with a stepped composition. Sedimentation can occur during coating or curing of the polymer or precursor, and can be facilitated by centrifugation methods as known in the art. It should also be noted that the dispersion parameters (eg, including particle density) and process parameters of the phosphor and the Nd and F compounds can be selected so that the phosphor material is closer to the LED chip 65 than the Nd and F compounds , so that the Nd and F compounds properly filter the light generated by the phosphor assembly.

在圖6B所示之替代範例實施態樣中,磷光體層64b可為以傳統方式製造的封裝劑層,及可在該磷光體層64b上沉積具有Nd及F多種化合物之獨立的封裝劑層68b,例如使用適當傳統之沉積/粒子分散在聚合物或聚合物前驅物中的技術。 In an alternative example implementation shown in FIG. 6B, the phosphor layer 64b can be a conventionally fabricated encapsulant layer, and a separate encapsulant layer 68b with Nd and F compounds can be deposited on the phosphor layer 64b, For example, appropriate conventional deposition/particle dispersion techniques in polymer or polymer precursor are used.

在圖6c所示之其他範例實施態樣中,包含該Nd及F多種化合物之複合物層68c可塗布在圓頂(殼體)62的外表面上。塗布的層68c之性能與圖6b中之具有Nd及F多種化合物的封裝劑層68b之性能相似。或者,圖6c中之塗層68c係沉積在圓頂62之內表面。關於圓頂/基材之塗層的更多實施細節將參考圖7至10進行討論。應注意的是,圓頂62本身可為透明或半透明。 In other example embodiments shown in FIG. 6c , a composite layer 68c comprising the Nd and F compounds may be coated on the outer surface of the dome (shell) 62 . The properties of the coated layer 68c are similar to the properties of the encapsulant layer 68b with various compounds of Nd and F in Figure 6b. Alternatively, the coating 68c in FIG. 6c is deposited on the inner surface of the dome 62. Further implementation details regarding the coating of the dome/substrate will be discussed with reference to FIGS. 7 to 10 . It should be noted that the dome 62 itself may be transparent or translucent.

在又其他範例實施態樣中,如圖6d所示,圓 頂(殼體)62可用以將多種Nd及F化合物複合物層/塗層68d沉積在圓頂62之外表面上及將磷光體塗層64d沉積在圓頂62之內表面上。另外應注意的是,該方法可能有不同變型。例如,塗層64d及68d二者可均沉積在圓頂62的一個表面(外或內表面)上,其中磷光體塗層64d比塗層68d更接近LED晶片65。又,塗層64d及68d(當沉積在圓頂62之一個表面上時)可與圖6a中之封裝劑化合物層64a相似地組合成一個層。應注意的是,圓頂62本身可為透明、半透明或半透射性,以實施圖6d所示之實例的不同變型。 In yet other exemplary implementations, as shown in FIG. 6d, the circle The top (casing) 62 may be used to deposit various Nd and F compound composite layers/coatings 68d on the outer surface of the dome 62 and phosphor coating 64d on the inner surface of the dome 62. It should also be noted that different variations of this method are possible. For example, both coatings 64d and 68d may be deposited on one surface (outer or inner surface) of dome 62, with phosphor coating 64d being closer to LED die 65 than coating 68d. Again, coatings 64d and 68d (when deposited on one surface of dome 62) may be combined into one layer similar to encapsulant compound layer 64a in Figure 6a. It should be noted that the dome 62 itself may be transparent, translucent or translucent to implement different variations of the example shown in Figure 6d.

下文為數個使用本文所述造成所希望彩色濾光效果之含有Nd及F多種化合物的塗層之以LED為主的照明裝置的非限制性實例。 The following are several non-limiting examples of LED-based lighting devices using coatings containing various Nd and F compounds described herein that result in the desired color filtering effects.

圖7為根據本發明一實施態樣之適於局部照明裝置的以LED為主的照明裝置。該以LED為主的照明裝置(其亦可稱為「照明單元」或「燈」)為經建構以提供幾近全向照明能力的LED燈70。如圖7所示,LED燈70包括燈泡72、接頭74、及介於燈泡72與接頭74之間的底座76,以及在燈泡72外表面上的塗層78。塗層78包括本文所述之Nd及F多種化合物。在一些實施態樣中,燈泡72可被其他透明或半透明基材替代。或者,塗層78可塗布在可為透明或半透明之燈泡72的內表面上。 7 is an LED-based lighting device suitable for a local lighting device according to an embodiment of the present invention. The LED-based lighting device (which may also be referred to as a "lighting unit" or "lamp") is an LED lamp 70 constructed to provide nearly omnidirectional lighting capabilities. As shown in FIG. 7 , the LED lamp 70 includes a bulb 72 , a connector 74 , a base 76 between the bulb 72 and the connector 74 , and a coating 78 on the outer surface of the bulb 72 . Coating 78 includes various compounds of Nd and F as described herein. In some embodiments, the bulb 72 can be replaced by other transparent or translucent substrates. Alternatively, coating 78 may be applied to the inner surface of bulb 72, which may be transparent or translucent.

圖8為根據本發明其他實施態樣之以LED為主的照明裝置80。如圖8所示,以LED為主的照明裝置 為天花板燈80(LED晶片未顯示)。天花板燈80包括半球形基材82及含有本文所述之Nd及F多種化合物的塗層88;塗層88係在半球形基材82的內表面上。或者,塗層88可塗布在可為透明或半透明之半球形基材82的外表面上。 FIG. 8 is an LED-based lighting device 80 according to other embodiments of the present invention. As shown in Figure 8, the LED-based lighting device It is a ceiling light 80 (LED chip not shown). Ceiling light 80 includes a hemispherical substrate 82 and a coating 88 containing various compounds of Nd and F as described herein; Alternatively, coating 88 may be applied to the outer surface of hemispherical substrate 82, which may be transparent or translucent.

圖9為根據本發明其他實施態樣之以LED為主的照明裝置。如圖9所示,該以LED為主的照明裝置為透鏡90,且透鏡90包括平坦基材92。在該實施態樣中,平坦基材92包括在其外表面上之Nd及F化合物塗層(未圖示)。 FIG. 9 is an LED-based lighting device according to other embodiments of the present invention. As shown in FIG. 9 , the LED-based lighting device is a lens 90 , and the lens 90 includes a flat substrate 92 . In this embodiment, the flat substrate 92 includes a coating of Nd and F compounds (not shown) on its outer surface.

圖10為根據本發明一其他實施態樣之以LED為主的照明裝置100。以LED為主的照明裝置100包括燈泡102、至少一個LED晶片105及反射性基材106。反射性基材106係建構成反射LED晶片105所產生的可見光。在特定實施態樣中,反射性基材106包括在其外表面上之Nd及F多種化合物塗層(未圖示)以提供所希望的濾光作用。圖10中,圓頂(102)可由漫射材料建造,以使特定量之來自LED的光通過,及特定量會反射回至凹穴(此等量係視該圓頂材料的漫射程度而定)。所反射的光會鏡面式或漫射式反射,視圓頂102的漫射係數而定。來自圓頂102之漫射式及/或鏡面式反射將入射在根據本文所述之實施態樣中的一個實施態樣之經塗布反射性基材106上。或者,圓頂102可從寬譜帶半反射性材料建造,以提供相同功能性。 FIG. 10 is an LED-based lighting device 100 according to another embodiment of the present invention. The LED-based lighting device 100 includes a bulb 102 , at least one LED chip 105 and a reflective substrate 106 . The reflective substrate 106 is configured to reflect the visible light generated by the LED chip 105 . In certain embodiments, the reflective substrate 106 includes a coating of various Nd and F compounds (not shown) on its outer surface to provide the desired filtering effect. In Figure 10, the dome (102) may be constructed of a diffusing material to allow a certain amount of light from the LED to pass through and a certain amount to reflect back into the cavity (these amounts depend on how diffuse the dome material is Certainly). The reflected light can be specularly or diffusely reflected, depending on the diffusion coefficient of the dome 102 . Diffuse and/or specular reflection from dome 102 will be incident on coated reflective substrate 106 according to one of the embodiments described herein. Alternatively, the dome 102 can be constructed from a broadband semi-reflective material to provide the same functionality.

本文所述之塗布材料(包括含有Nd3+離子及F-離子)可具有少許光學散射(漫射)效果;或者,可在光通過時造成相當可觀的光散射。為了增大散射角,該塗層可包括有機或無機材料之離散粒子。或者,該有機或無機材料可僅由本文所述之Nd及F多種化合物的離散粒子構成,及/或可由該Nd及F多種化合物之離散粒子及由至少一種其他不同材料所形成之粒子的混合物構成。 The coating materials described herein, including those containing Nd 3+ ions and F ions, can have a little optical scattering (diffusing) effect; alternatively, can cause considerable light scattering as light passes through. To increase the scattering angle, the coating may include discrete particles of organic or inorganic material. Alternatively, the organic or inorganic material may consist solely of discrete particles of the Nd and F compounds described herein, and/or may be a mixture of discrete particles of the Nd and F compounds and particles formed from at least one other different material constitute.

在一實施態樣中,該有機或無機材料之適合粒度可為約1nm至約10微米。就圖7所示之LED燈70而言,為了使散射角最大化以使LED燈70能獲致全向照明,該粒度可選擇為遠小於300nm以使瑞立散射(Rayleigh scattering)效率最大化。 In one embodiment, a suitable particle size of the organic or inorganic material may be from about 1 nm to about 10 microns. For the LED lamp 70 shown in Figure 7, in order to maximize the scattering angle for omnidirectional illumination of the LED lamp 70, the particle size can be chosen to be much smaller than 300 nm to maximize Rayleigh scattering efficiency.

雖然不希望成為限制,但該Nd及F多種化合物塗層可藉由例如噴塗、輥塗、彎液面(meniscus)塗布或浸塗、打印、網版、分配、輥軋、塗刷、黏合、靜電塗布或可提供均勻厚度之塗層的任何其他方法施加。下文將描述三個將Nd及F多種化合物塗層提供在基材上之方式的非限制性實例。 While not wishing to be limiting, the Nd and F compound coatings can be applied by, for example, spraying, rolling, meniscus coating or dipping, printing, screen, dispensing, rolling, brushing, gluing, Electrostatic coating or any other method that provides a coating of uniform thickness. Three non-limiting examples of ways to provide coatings of Nd and F compounds on substrates are described below.

在一實施態樣中,如圖7所示,塗層78可藉由黏合法塗布在燈泡72上。LED燈70可包括介於該燈泡72與該塗層78之間的黏合層(未圖示),且該黏合層可包括有機黏著劑或無機黏著劑。有機黏著劑可包括環氧樹脂、有機聚矽氧黏著劑、丙烯酸系樹脂等。無機黏著劑可包括矽酸鹽無機黏著劑、硫酸鹽黏著劑、磷酸鹽黏著劑、 氧化物黏著劑、硼酸鹽黏著劑等。 In one embodiment, as shown in FIG. 7 , the coating 78 may be applied to the bulb 72 by an adhesive method. The LED lamp 70 may include an adhesive layer (not shown) between the bulb 72 and the coating layer 78 , and the adhesive layer may include an organic adhesive or an inorganic adhesive. Organic adhesives may include epoxy resins, organopolysiloxane adhesives, acrylic resins, and the like. Inorganic adhesives may include silicate inorganic adhesives, sulfate adhesives, phosphate adhesives, Oxide adhesives, borate adhesives, etc.

在其他實施態樣中,如圖7所示,塗層78可藉由噴塗法塗布在燈泡72的外表面上。首先,形成含有例如具有對應相對量之Nd2O3及NdF3化合物、二氧化矽(silicone dioxide)、分散劑(諸如DISPEX A40)、水及隨意的TiO2或Al2O3之液態混合物。然後,將形成之液體混合物噴淋至燈泡72上。最後,將燈泡72固化以獲得經塗布之LED燈70。 In other embodiments, as shown in FIG. 7 , the coating 78 may be applied on the outer surface of the bulb 72 by spraying. First, a liquid mixture is formed containing, for example, Nd2O3 and NdF3 compounds with corresponding relative amounts, silicon dioxide , a dispersant such as DISPEX A40 , water, and optionally TiO2 or Al2O3 . Then, the resulting liquid mixture is sprayed onto the bulb 72 . Finally, the bulb 72 is cured to obtain the coated LED lamp 70 .

在一實施態樣中,如圖7所示,塗層78可藉由靜電塗布法塗布至燈泡72的外表面上。首先,製造由對應相對量之Nd2O3及NdF3化合物、SiO2及Al2O3所組成的帶電荷粉末。然後,將該粉末塗布至帶相反電荷的燈泡72上。 In one embodiment, as shown in FIG. 7 , the coating 78 may be applied to the outer surface of the bulb 72 by electrostatic coating. First, charged powders composed of Nd 2 O 3 and NdF 3 compounds, SiO 2 and Al 2 O 3 in corresponding relative amounts are produced. The powder is then applied to the oppositely charged bulb 72 .

在本發明其他實施態樣中,噴塗法及靜電塗布法二者均可使用無有機溶劑或有機化合物的材料,此可延長LED照明裝置的使用壽命及避免通常因磺化而造成的變色。 In other embodiments of the present invention, both the spray coating method and the electrostatic coating method can use materials without organic solvents or organic compounds, which can prolong the service life of the LED lighting device and avoid the discoloration usually caused by sulfonation.

在其他實施態樣中,為了促進光折射以獲致白色反射外觀,該塗層還可包括具有比該多種Nd及F化合物更高折射率的添加劑。該添加劑可選自金屬氧化物或非金屬氧化物中之至少一種氧化物,諸如TiO2、SiO2及Al2O3In other embodiments, to promote light refraction for a white reflective appearance, the coating may also include additives having a higher refractive index than the various Nd and F compounds. The additive may be selected from at least one oxide of metal oxides or non-metal oxides, such as TiO 2 , SiO 2 and Al 2 O 3 .

除非另外定義,否則本文所使用之技術及科學用語具有熟悉本揭示所屬之技術的人士一般暸解的相同 意義。本文所使用之用語「第一」、「第二」等不表示任何順序、數量或重要性,而是用以區分一個元件與另一元件。又,用語「一」不表示數量限制,而是表示存在至少一個所指示之項目。本文中使用「包括」、「包含」或「具有」及其變形係意指包括之後所列的項目及其等效物以及額外項目。用語「連接」及「耦合」不限制於物理或機械式連接或耦合,及可包括直接或間接的電性及光學連接或耦合。 Unless otherwise defined, technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains significance. The terms "first," "second," etc. as used herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the term "a" does not denote a quantitative limit, but rather denotes that there is at least one of the indicated item. The use of "including", "including" or "having" and variations thereof herein is meant to include the items listed thereafter and their equivalents as well as additional items. The terms "connected" and "coupled" are not limited to physical or mechanical connections or couplings, and may include direct or indirect electrical and optical connections or couplings.

此外,熟悉之技術人士將認可來自不同實施態樣之各種不同特徵的互換性。具有本領域普通技術之人士可根據本發明的原理混合並匹配所述之各種不同特徵以及每一種特徵之其他已知等效物,以建構其他系統及技術。 Furthermore, those skilled in the art will recognize the interchangeability of various features from different implementations. Those of ordinary skill in the art can mix and match the various features described, as well as other known equivalents for each feature, to construct other systems and techniques in accordance with the principles of this disclosure.

在描述所主張的裝置之替代實施態樣時,為求清楚起見,使用特定術語。然而,不希望本發明受到所選用之特定術語限制。如此,應暸解,特定元件分別包括以相似方式操作達到相似功能的技術等效物。 In describing alternative implementations of the claimed device, specific terminology is used for the sake of clarity. However, it is not intended that the invention be limited by the specific terminology so chosen. As such, it should be understood that the specific elements each include technical equivalents that operate in a similar manner to achieve similar functions.

應暸解前述描述目的係說明而非限制本發明範疇,本發明範疇係由附錄之申請專利範圍的範疇界定。其他實施態樣係在下文申請專利範圍之範圍內。 It should be understood that the foregoing description is intended to illustrate rather than limit the scope of the present invention, which is defined by the scope of the appended claims. Other embodiments are within the scope of the following patent application.

應注意的是,本文所描述及主張之各種不同非限制性實施態樣可針對特殊應用而獨立使用、組合或選擇性組合。 It should be noted that the various non-limiting implementation aspects described and claimed herein may be used independently, combined or selectively combined for particular applications.

另外,可使用上述非限制性實施態樣的各種 不同特徵其中之一些特徵而不對應使用其他所述特徵以突顯優點。因此,前述描述應僅視為本發明之原理、教示及範例實施態樣的說明而非限制本發明。 Additionally, various of the above-described non-limiting embodiments may be used Some of the different features are used without corresponding other described features to highlight the advantages. Accordingly, the foregoing description should be considered only as illustrative of the principles, teachings, and exemplary embodiments of the present invention and not as a limitation of the present invention.

30、32、36‧‧‧向量 30, 32, 36‧‧‧vectors

34‧‧‧區域 34‧‧‧Area

38‧‧‧單點 38‧‧‧Single Point

Claims (12)

一種LED裝置,其包含至少一個發光二極體(LED)模組,其經建構以產生可見光;磷光體;及至少一個組件,其包含二或更多種化合物,其中該二或更多種化合物中之至少一種化合物包含三氧化二釹(Nd2O3),其中該二或更多種化合物中之至少一種其他化合物包括氟化釹(NdF3)、或式NdOxFy的氧氟化釹(neodymium oxyfluoride)(其中2x+y=3)、或式Nd(OH)aFb的氫氧氟化釹(neodymium hydroxide fluoride)(其中a+b=3),其中該至少一個組件經建構以藉由使用該二或更多種化合物過濾所產生的可見光而提供所希望的光譜,其中在色空間中之所希望光譜的色彩係由該至少一個組件中之該二或更多種化合物的相對量決定,其中該至少一個組件包括氟化釹(NdF3)或式NdOxFy的氧氟化釹(其中2x+y=3)或式Nd(OH)aFb的氫氧氟化釹(其中a+b=3)之量大於三氧化二釹(Nd2O3)之量,及其中在色空間中之所希望光譜的色彩係在至少由該二或更多種化合物之吸收向量所界定的色空間中之預定區域內變化,及該在該色空間中的預定區域係局限於約12個麥克亞當橢圓(MacAdam ellipse)。 An LED device comprising at least one light emitting diode (LED) module structured to generate visible light; a phosphor; and at least one component comprising two or more compounds, wherein the two or more compounds At least one of the compounds comprises neodymium trioxide (Nd2O3), wherein at least one of the other compounds of the two or more compounds comprises neodymium fluoride ( NdF3 ) , or an oxyfluoride of the formula NdOxFy Neodymium (neodymium oxyfluoride) (where 2x+y=3), or neodymium hydroxide fluoride (where a+b=3) of the formula Nd(OH) a F b , wherein the at least one component is constructed to provide a desired spectrum by filtering the generated visible light using the two or more compounds, wherein the color of the desired spectrum in color space is determined by the color of the two or more compounds in the at least one component Determined in relative amounts, wherein the at least one component comprises neodymium fluoride (NdF 3 ) or neodymium oxyfluoride of formula NdO x F y (where 2x+y=3) or oxyfluoride of formula Nd(OH) a F b The amount of neodymium (where a+b=3) is greater than the amount of neodymium trioxide (Nd 2 O 3 ), and wherein the color of the desired spectrum in color space is at least absorbed by the two or more compounds The vectors vary within a predetermined area in the color space defined by the vector, and the predetermined area in the color space is limited to about 12 MacAdam ellipses. 如請求項1之裝置,其中,該至少一個 組件為沉積在該至少一個LED模組頂部上的封裝層。 The apparatus of claim 1, wherein the at least one The component is an encapsulation layer deposited on top of the at least one LED module. 如請求項2之裝置,其中,該封裝層為低溫玻璃、聚碳酸酯、聚矽氧、或聚矽氧環氧樹脂。 The device of claim 2, wherein the encapsulation layer is low temperature glass, polycarbonate, polysiloxane, or polysiloxane epoxy. 如請求項1之裝置,其中,該至少一個組件為沉積在包含磷光體之另一封裝層上的封裝層,該另一封裝層係沉積在該至少一個LED模組的頂部上。 The apparatus of claim 1, wherein the at least one component is an encapsulation layer deposited on another encapsulation layer comprising phosphor, the other encapsulation layer deposited on top of the at least one LED module. 如請求項1之裝置,其中,該至少一個組件為包含透明、半透明或反射性基材且該基材表面上具有塗層的光學組件,該塗層包含該二或更多種化合物以藉由過濾所產生的可見光來提供所希望光譜。 The device of claim 1, wherein the at least one component is an optical component comprising a transparent, translucent or reflective substrate and having a coating on the surface of the substrate, the coating comprising the two or more compounds to The desired spectrum is provided by filtering the resulting visible light. 如請求項5之裝置,其中,該塗層之厚度在約50nm至約1000微米的範圍。 The device of claim 5, wherein the coating has a thickness in the range of about 50 nm to about 1000 microns. 如請求項6之裝置,其中,該塗層還包含折射率高於該二或更多種化合物之添加劑,且其中該添加劑係選自至少包括TiO2、SiO2及Al2O3之金屬氧化物及非金屬氧化物。 The device of claim 6, wherein the coating further comprises an additive having a higher refractive index than the two or more compounds, and wherein the additive is selected from metal oxides including at least TiO 2 , SiO 2 and Al 2 O 3 and non-metal oxides. 如請求項6之裝置,其中,該塗層係配置於該基材的內表面上。 The device of claim 6, wherein the coating is disposed on the inner surface of the substrate. 如請求項6之裝置,其中,該基材為漫射器,其選自由下列所組成之群組:密封該至少一個LED模組的燈泡、透鏡、及圓頂。 6. The device of claim 6, wherein the substrate is a diffuser selected from the group consisting of a bulb encapsulating the at least one LED module, a lens, and a dome. 如請求項1之裝置,其中,該裝置包含含有複數個LED模組與對應的複數個組件之積體電路。 The device of claim 1, wherein the device comprises an integrated circuit including a plurality of LED modules and a plurality of corresponding components. 如請求項1之裝置,其中,該至少一個組件包含選自由TiO2、SiO2及Al2O3所組成之群組的添加劑以提高該至少一個組件中之該二或更多種化合物的漫射係數。 The device of claim 1, wherein the at least one component comprises an additive selected from the group consisting of TiO2 , SiO2 , and Al2O3 to increase the diffusion of the two or more compounds in the at least one component shot coefficient. 如請求項1之裝置,其中,該至少一個組件係使用射出成形沉積。 The apparatus of claim 1, wherein the at least one component is deposited using injection molding.
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