TW201739895A - LED apparatus employing tunable color filtering using multiple neodymium and fluorine compounds - Google Patents

LED apparatus employing tunable color filtering using multiple neodymium and fluorine compounds Download PDF

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TW201739895A
TW201739895A TW105140480A TW105140480A TW201739895A TW 201739895 A TW201739895 A TW 201739895A TW 105140480 A TW105140480 A TW 105140480A TW 105140480 A TW105140480 A TW 105140480A TW 201739895 A TW201739895 A TW 201739895A
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compounds
led
component
coating
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TWI772277B (en
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凱文 班納
蓋瑞 亞倫
蔡登奇
湯瑪士 克林尼
何建民
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Ｇｅ照明解決方案公司
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    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/22—Luminous paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module configured to generate a visible light such as white light, and at least one component such as an optical component comprising multiple (two or more) compounds, each containing neodymium (Nd) and at least one compound including fluorine (F) for imparting a desired color filtering effect to provide a desired light spectrum, where a color of the desired light spectrum in a color space is determined by relative amounts of the two or more compounds in the at least one component.

Description

使用多種釹和氟化合物於可調彩色濾光上的LED裝置 LED device using a variety of germanium and fluorine compounds on adjustable color filters 相關申請案之相互引用Mutual reference to related applications

本申請案為2015年10月6日提出申請之共待審共有美國專利申請案序號14/876366的部分連續申請案，該案教示係以全文引用方式併入本文中。本申請案為2014年10月8日提出申請之共待審共有國際申請案PCT/CN2014/088116的部分連續申請案，該案教示係以全文引用方式併入本文中。 This application is a continuation-in-part of U.S. Patent Application Serial No. 14/876,366, the entire disclosure of which is incorporated herein by reference. This application is a continuation-in-part of the co-pending international application PCT/CN2014/088116 filed on Oct. 8, 2014, which is incorporated herein in its entirety by reference.

本發明大致關於照明應用及相關技術，更明確但非排他地說，本發明關於使用多種包含釹(Nd)及氟(F)之化合物以在LED燈裝置中賦予所希望的彩色濾光效果。 The present invention relates generally to lighting applications and related art, and more specifically, but not exclusively, the present invention relates to the use of a plurality of compounds comprising niobium (Nd) and fluorine (F) to impart a desired color filter effect in an LED lamp apparatus.

如本文所使用之發光二極體(LED)，亦包括有機LED(OLED)，係將電能轉換成包括可見光(波長為約 400至750nm)之電磁輻射的固態半導體裝置。LED通常包含摻雜有雜質以產生p-n接面之半導體材料的晶片(晶粒)。該LED晶片係電性連接至陽極及陰極，該等電極經常均安裝在LED封裝內。相較於諸如白熾燈或螢光燈之其他燈具，LED以更窄光束發射更定向的可見光。 A light-emitting diode (LED), as used herein, also includes an organic LED (OLED) that converts electrical energy to include visible light (wavelength is about A solid state semiconductor device of electromagnetic radiation of 400 to 750 nm). LEDs typically comprise a wafer (grain) that is doped with impurities to create a p-n junction semiconductor material. The LED chip is electrically connected to the anode and the cathode, and the electrodes are often mounted in the LED package. Compared to other luminaires such as incandescent or fluorescent lamps, LEDs emit more directional visible light with a narrower beam.

OLED通常包含至少一個位於電極(至少一個電極為透明)之間的電致發光發射層(有機半導體膜)。該電致發光層回應於在電極之間流動的電流而發光。 The OLED typically comprises at least one electroluminescent emissive layer (organic semiconductor film) between the electrodes (at least one of which is transparent). The electroluminescent layer emits light in response to a current flowing between the electrodes.

LED/OLED光源(燈)提供優於傳統白熾燈及螢光燈的各種優點，包括但不局限於較長之預期壽命、較高能源效率、及不需要暖機時間即可達到全亮度。 LED/OLED light sources (lights) offer advantages over traditional incandescent and fluorescent lamps, including but not limited to longer life expectancy, higher energy efficiency, and full brightness without the need for warm-up time.

雖然LED/OLED照明在效率、耐久性、靈活性及其他有利方面具有吸引力，但仍需要持續改善LED照明之色彩性質，尤其是白光LED/OLED裝置，以用於一般照明及用於顯示器應用二者。 While LED/OLED lighting is attractive in terms of efficiency, durability, flexibility, and other benefits, there is still a need to continually improve the color properties of LED lighting, especially white LED/OLED devices for general lighting and for display applications. both.

圖1為適於局部照明應用之傳統之以LED為主的照明裝置10之透視圖。該照明裝置(亦可稱為「照明單元」或「燈」)10包括透明或半透明蓋或密封物12、螺紋基底接頭14、以及介於該密封物12與該接頭14之間的殼架或底座16。 1 is a perspective view of a conventional LED-based lighting device 10 suitable for localized lighting applications. The lighting device (also referred to as "lighting unit" or "light") 10 includes a transparent or translucent cover or seal 12, a threaded base joint 14, and a frame between the seal 12 and the joint 14. Or the base 16.

可為包括多個LED器件之LED陣列的以LED為主的光源(未圖示)係位於密封物12下端並與底座16相鄰。由於LED器件發射在窄波長帶中的可見光，例如，綠光、藍光、紅光等，故LED燈中經常使用不同LED器 件之組合以產生各種不同光色彩，包括白光。或者，基本上顯現為白色之光可藉由來自藍光LED之光與將至少一部分該藍光LED的藍光轉換成不同色彩之磷光體(例如釔鋁石榴石：鈰，縮寫為YAG：Ce)的組合而產生；該經轉換之光與該藍光的組合可產生顯現白色或基本上為白色的光。該等LED器件可安裝在底座16內的托架上，及可用包含折射率匹配之材料的保護蓋封裝在該托架上，以加強從該等LED器件提取可見光的效率。 An LED-based light source (not shown) that can be an LED array comprising a plurality of LED devices is located at the lower end of the seal 12 and adjacent to the base 16. Since LED devices emit visible light in a narrow wavelength band, such as green light, blue light, red light, etc., different LEDs are often used in LED lights. The combination of pieces produces a variety of different light colors, including white light. Alternatively, a combination of substantially white light can be converted by a light from a blue LED and a phosphor that converts at least a portion of the blue light of the blue LED into a different color (eg, yttrium aluminum garnet: 铈, abbreviated as YAG:Ce) Produced; the combination of the converted light and the blue light produces light that appears white or substantially white. The LED devices can be mounted on a carrier within the base 16 and can be packaged on the carrier with a protective cover containing index matching material to enhance the efficiency of extracting visible light from the LED devices.

為了促進照明裝置10以幾近全向方向發射可見光的能力，圖1所示之密封物12的形狀可為基本上為球形或橢圓形。為了進一步促進幾近全向照明能力，密封物12可包括能使該密封物12發揮光漫射器作用的材料。用以製造該漫射器之材料可包括聚醯胺(例如，耐綸(nylon))、聚碳酸酯(PC)、或聚丙烯(PP)等等。該等聚合材料亦可包括SiO2以促進光之折射，及因而達成白色反射外觀。該密封物12的內表面可具備含有磷光體組成物的塗層(未圖示)。 To facilitate the ability of the illumination device 10 to emit visible light in near-omnidirectional directions, the shape of the seal 12 shown in FIG. 1 can be substantially spherical or elliptical. To further promote near-omnidirectional illumination capabilities, the seal 12 can include a material that enables the seal 12 to function as a light diffuser. Materials used to make the diffuser may include polyamidamine (e.g., nylon), polycarbonate (PC), or polypropylene (PP), and the like. The polymeric materials may also include SiO 2 to promote the refraction of light, and thus achieve a white reflective appearance. The inner surface of the seal 12 may be provided with a coating (not shown) containing a phosphor composition.

雖然可利用使用不同LED器件及/或磷光體的組合以促進LED燈產生白光效果的能力，但亦希望有其他方法作為替代方案或除此之外亦希望有其他方法，以改善由LED器件所產生之白光的色彩特性。 While a combination of different LED devices and/or phosphors can be utilized to facilitate the ability of the LED lamp to produce a white light effect, it is desirable to have other methods as an alternative or in addition to other methods to improve the LED device. The color characteristics of the white light produced.

根據本發明之態樣，裝置包含：至少一個發 光二極體(LED)模組，其經建構以產生可見光；及至少一個組件，其包含二或更多種化合物，該化合物分別包含釹(Nd)，且該二或更多種化合物中至少一種化合物還包含氟(F)，該至少一個組件經建構以藉由使用該二或更多種化合物過濾所產生的可見光而提供所希望的光譜，其中，在色空間中之所希望光譜的色彩係由該至少一個組件中之該二或更多種化合物的相對量決定。 According to an aspect of the invention, the apparatus comprises: at least one hair a photodiode (LED) module constructed to produce visible light; and at least one component comprising two or more compounds, each comprising cerium (Nd), and at least one of the two or more compounds The compound further comprises fluorine (F), the at least one component being configured to provide a desired spectrum by filtering the generated visible light using the two or more compounds, wherein the color spectrum of the desired spectrum in the color space Determined by the relative amounts of the two or more compounds in the at least one component.

根據本發明之態樣，該二或更多種化合物中之至少一種化合物可為氟化釹(NdF3)。再者，該二或更多種化合物中之至少一種其他化合物可包含三氧化二釹(Nd2O3)。更進一步，該二或更多種化合物可包含Nd3+離子及F-離子。 According to aspects of the invention, at least one of the two or more compounds may be cesium fluoride (NdF 3 ). Furthermore, at least one other compound of the two or more compounds may comprise antimony trioxide (Nd 2 O 3 ). Still further, the two or more compounds may comprise Nd 3+ ions and F − ions.

更進一步根據本發明之態樣，在色空間中之所希望光譜的色彩可在至少由該二或更多種化合物之吸收向量所界定的色空間中之預定區域內變化。再者，該在該色空間中的預定區域可局限於約12個麥克亞當橢圓(MacAdam ellipse)(或類似者)。 Still further in accordance with aspects of the invention, the color of the desired spectrum in the color space can be varied within a predetermined region of the color space defined by at least the absorption vector of the two or more compounds. Furthermore, the predetermined area in the color space can be limited to about 12 MacAdam ellipse (or the like).

又更進一步根據本發明之態樣，至少一個LED模組可包含有機LED。再者，該裝置可包含含有複數個LED模組與對應複數個組件之積體電路。 Still further in accordance with aspects of the invention, the at least one LED module can comprise an organic LED. Furthermore, the device can include an integrated circuit including a plurality of LED modules and corresponding plurality of components.

又更進一步根據本發明之態樣，至少一個組件可為沈積在該至少一個LED模組頂部上的封裝層。再者，該至少一個組件包含選自由TiO2、SiO2及Al2O3所組成之群組的添加劑以提高該至少一個組件中之該二或更多 種化合物的漫射係數。更進一步，該封裝層可為低溫玻璃、聚合物、聚合物前驅物、聚碳酸酯、熱塑性或熱固性聚合物或樹脂、聚矽氧、或聚矽氧環氧樹脂。又更進一步，該至少一個組件可另外包含磷光體。 Still further in accordance with aspects of the invention, at least one component can be an encapsulation layer deposited on top of the at least one LED module. Furthermore, the at least one component comprises an additive selected from the group consisting of TiO 2 , SiO 2 and Al 2 O 3 to increase the diffusion coefficient of the two or more compounds in the at least one component. Still further, the encapsulating layer can be a low temperature glass, a polymer, a polymer precursor, a polycarbonate, a thermoplastic or thermoset polymer or resin, a polyoxyn oxide, or a polyoxyxene epoxy. Still further, the at least one component may additionally comprise a phosphor.

又更進一步根據本發明之態樣，該至少一個組件可為沉積在包含磷光體之另一封裝層上的封裝層，該另一封裝層係沉積在該至少一個LED模組的頂部上。 Still further in accordance with aspects of the invention, the at least one component can be an encapsulation layer deposited on another encapsulation layer comprising a phosphor deposited on top of the at least one LED module.

又更進一步根據本發明之態樣，該二或更多種化合物中之至少一種化合物可包一或更多種Nd-F及Nd-X-F化合物，其中，X為元素O、N、S、Cl、OH、Na、K、Al、Mg、Li、Ca、Sr、Ba及Y中之一或更多者。 Still further in accordance with aspects of the invention, at least one of the two or more compounds may comprise one or more Nd-F and Nd-XF compounds, wherein X is the element O, N, S, Cl One or more of OH, Na, K, Al, Mg, Li, Ca, Sr, Ba, and Y.

又更進一步根據本發明之態樣，該至少一個組件可為包含透明、半透明或反射性基材且該基材表面上具有塗層的光學組件，該塗層包含該二或更多種化合物以藉由過濾所產生的可見光來提供所希望光譜。再者，該塗層之厚度可在約50nm至約1000微米的範圍。更進一步，該塗層還可包含折射率高於該二或更多種化合物之添加劑，且其中該添加劑係選自至少包括TiO2、SiO2及Al2O3之金屬氧化物及非金屬氧化物。又更進一步，該塗層可配置於該基材的內表面上。又更進一步，該基材可為漫射器，其選自由下列所組成之群組：密封該至少一個LED模組的燈泡、透鏡、及圓頂。 Still further in accordance with aspects of the present invention, the at least one component can be an optical component comprising a transparent, translucent or reflective substrate having a coating on the surface of the substrate, the coating comprising the two or more compounds The desired spectrum is provided by filtering the generated visible light. Further, the thickness of the coating can range from about 50 nm to about 1000 microns. Further, the coating may further comprise an additive having a refractive index higher than the two or more compounds, and wherein the additive is selected from the group consisting of metal oxides including at least TiO 2 , SiO 2 and Al 2 O 3 and non-metal oxides Things. Still further, the coating can be disposed on the inner surface of the substrate. Still further, the substrate can be a diffuser selected from the group consisting of a bulb, a lens, and a dome that seal the at least one LED module.

更進一步根據本發明之態樣，該至少一個組 件可使用射出成形或相似技術沉積。 Still further in accordance with aspects of the present invention, the at least one group Pieces can be deposited using injection molding or similar techniques.

10‧‧‧照明裝置 10‧‧‧Lighting device

12‧‧‧密封物 12‧‧‧ Seals

14、74‧‧‧接頭 14, 74‧‧‧ joints

16、76‧‧‧殼架、底座 16, 76‧‧‧Shell frame, base

20、22‧‧‧曲線 20, 22‧‧‧ Curve

30、32、36、42a、44a、46a、48a、42b、44b、46b、48b‧‧‧向量 30, 32, 36, 42a, 44a, 46a, 48a, 42b, 44b, 46b, 48b‧‧‧ vectors

34‧‧‧區域 34‧‧‧Area

38‧‧‧單點 38‧‧‧ single point

52、54、56、58‧‧‧色點 52, 54, 56, 58‧ ‧ color points

60a、60b、60c、60d、80、100‧‧‧以LED為主之照明裝置 60a, 60b, 60c, 60d, 80, 100‧‧‧ LED-based lighting fixtures

62‧‧‧圓頂 62‧‧‧Dome

64a‧‧‧封裝劑材料層 64a‧‧‧layer of encapsulant material

65、105‧‧‧LED晶片 65, 105‧‧‧ LED chip

66‧‧‧印刷電路板 66‧‧‧Printed circuit board

64b‧‧‧磷光體層 64b‧‧‧phosphor layer

68b‧‧‧封裝劑層 68b‧‧‧Packaging agent layer

68c、68d‧‧‧複合物層 68c, 68d‧‧‧ composite layer

64d‧‧‧磷光體塗層 64d‧‧‧phosphor coating

70‧‧‧LED燈 70‧‧‧LED lights

72、102‧‧‧燈泡 72, 102‧‧‧ bulbs

78、88‧‧‧塗層 78, 88‧‧‧ coating

82‧‧‧半球形基材 82‧‧‧hemispherical substrate

90‧‧‧透鏡 90‧‧‧ lens

92‧‧‧平坦基材 92‧‧‧flat substrate

106‧‧‧反射性基材 106‧‧‧Reflective substrate

當參考附圖閱讀以下詳細說明時，將更加理解本發明之此等及其他特徵及態樣優點，所有圖式中之相似特徵表示相似部件，其中：圖1為傳統以LED為主的照明裝置之透視圖；圖2為Nd2O3及NdF3之可見光譜中的透射圖；圖3圖示摻入光學組件(諸如聚矽氧或聚碳酸酯)中並沉積在標準LED封裝(諸如具有3000K CCT之80CRI)上之Nd2O3及NdF3化合物如何使光源的色點沿著Nd2O3及NdF3化合物之光譜吸收所界定的向量偏移之色空間圖；圖4a為根據本發明實施態樣之包含不同量的Nd2O3及NdF3之Nd化合物混合物的可見光譜之透射圖；圖4b為利用圖4a所示之根據本發明實施態樣的具有各種不同Nd化合物混合物之濾光器的燈(諸如LED燈)在可見光譜中的模擬發射圖；圖5為比較標準3000K LED燈之色點與包含分別於圖4a及4b所示之根據本發明實施態樣的具有各種不同Nd化合物混合物之濾光器的LED燈之模擬色點的色空間圖； 圖6a至6d為根據本發明各種不同實施態樣之併入ND-F化合物(更常見為如本文所述之Nd-X-F)連同磷光體以賦予有利的可見光吸收/產生特徵之以LED為主的照明裝置；圖7為根據本發明一實施態樣之以LED為主的照明裝置之橫斷面圖；圖8為根據本發明另一實施態樣之以LED為主的照明裝置之橫斷面圖；圖9為根據本發明其他實施態樣之以LED為主的照明裝置之透視圖；圖10為根據本發明一其他實施態樣之以LED為主的照明裝置之透視圖。 These and other features and aspects of the present invention will become more apparent from the detailed description of the appended claims. Figure 2 is a transmission diagram in the visible spectrum of Nd 2 O 3 and NdF 3 ; Figure 3 illustrates incorporation into an optical component such as polyfluorene or polycarbonate and deposited in a standard LED package (such as having How to make the Nd 2 O 3 and NdF 3 compounds on the 80CRI of 3000K CCT make the color point of the light source along the spectral shift of the Nd 2 O 3 and NdF 3 compounds defined by the vector shift; Figure 4a is based on this A transmission spectrum of a visible spectrum of a mixture of Nd compounds comprising different amounts of Nd 2 O 3 and NdF 3 according to an embodiment of the invention; and FIG. 4b is a mixture of various Nd compounds according to an embodiment of the invention shown in FIG. 4a. Simulated emission map of a lamp (such as an LED lamp) in the visible spectrum; Figure 5 is a comparison of the color points of a standard 3000K LED lamp and the various embodiments according to the present invention shown in Figures 4a and 4b, respectively. LE of filters for different Nd compound mixtures Color space map of the simulated color point of the D lamp; Figures 6a to 6d are incorporation of ND-F compounds (more commonly Nd-XF as described herein) along with phosphors to impart advantages in accordance with various embodiments of the present invention. FIG. 7 is a cross-sectional view of an LED-based illuminating device according to an embodiment of the present invention; FIG. 8 is a cross-sectional view of an LED-based illuminating device according to an embodiment of the present invention; A cross-sectional view of an LED-based lighting device; FIG. 9 is a perspective view of an LED-based lighting device in accordance with another embodiment of the present invention; and FIG. 10 is an LED according to another embodiment of the present invention. A perspective view of the main lighting device.

本文呈現一種新穎裝置，諸如照明裝置，該裝置包含至少一個經建構以產生可見光(諸如白光)之LED(或OLED)模組，及至少一個組件，諸如包含多種(二或更多種)化合物之光學組件分別包含釹(Nd)且至少一種化合物包含氟(F)，以供賦予所希望彩色濾光效果以提供所希望光譜，其中在色空間中之所希望光譜的色彩係由該二或更多種化合物在該至少一個組件中的相對數量決定。 Presented herein is a novel device, such as a lighting device, comprising at least one LED (or OLED) module constructed to produce visible light, such as white light, and at least one component, such as comprising a plurality (two or more) of compounds The optical components each comprise yttrium (Nd) and the at least one compound comprises fluorine (F) for imparting a desired color filter effect to provide a desired spectrum, wherein the color of the desired spectrum in the color space is comprised of the two or more The relative amounts of the plurality of compounds in the at least one component are determined.

例如，根據本發明一實施態樣，如本文中所詳細描述，該至少一個組件(光學組件)可為包含兩種化合物之聚合物基底材料(諸如聚矽氧、聚碳酸酯等)：第一種 化合物可為三氧化二釹(Nd2O3)及第二種化合物可為氟化釹(NdF3)。該釹化合物吸收在560至600nm範圍中之黃光，此改變該LED系統的色點。添加單一化合物可使該色點沿著CIE 1931色空間(色度座座為CCX及CCY)之線移動。藉由使用二或更多種化合物，色點可在CIE色空間(下文稱為「色空間」)區域內任何處移動。此容許更大程度地客製化用於如本文圖3所示之特定應用的LED系統之色彩。 For example, in accordance with an embodiment of the present invention, as described in detail herein, the at least one component (optical component) can be a polymeric substrate material (such as polyfluorene, polycarbonate, etc.) comprising two compounds: first The compound may be antimony trioxide (Nd 2 O 3 ) and the second compound may be neodymium fluoride (NdF 3 ). The ruthenium compound absorbs yellow light in the range of 560 to 600 nm, which changes the color point of the LED system. The addition of a single compound allows the color point to move along the line of the CIE 1931 color space (the chromaticity seats are CCX and CCY). By using two or more compounds, the color point can be moved anywhere within the CIE color space (hereinafter referred to as "color space"). This allows for greater customization of the color of the LED system for a particular application as shown in Figure 3 herein.

換言之，可添加各種不同量的釹化合物(諸如上述實例中之Nd2O3及NdF3)以改變光學組件的組成以控制所得之光的色點。當添加個別組件時，兩種(或更多種)組件之不同吸收光譜造成LED系統的色點沿不同方向(即，沿CCX及CCY方向二者)移動。然後，如本文所述之多種包含Nd及F的化合物之色點移動向量可界定CIE色空間內的區域，如本文所述，該區域內的任何色點可用相同LED藉由改變該二或更多種化合物的相對量而達成。 In other words, various amounts of cerium compounds (such as Nd 2 O 3 and NdF 3 in the above examples) may be added to change the composition of the optical components to control the color point of the resulting light. When individual components are added, the different absorption spectra of the two (or more) components cause the color points of the LED system to move in different directions (ie, in both CCX and CCY directions). The color point motion vectors of various Nd and F containing compounds as described herein can define regions within the CIE color space, as described herein, any color point within the region can be changed by the same LED by changing the two or more Achieved by the relative amounts of various compounds.

根據其他實施態樣，可將散射元件，諸如氧化鈦(TiO2)、氧化鋁(Al2O3)、矽石(SiO2)或類似者，添加至聚合物基底以提高光學組件中之該多種Nd及F化合物的漫射係數。三個變數(例如就上述實例而言為TiO2、NdF3、及Nd2O3的負載重量)的變動可容許產生種類眾多之用以達成所希望光譜及分布的專用光學組件。 According to other embodiments, a scattering element, such as titanium oxide (TiO 2 ), aluminum oxide (Al 2 O 3 ), vermiculite (SiO 2 ), or the like, may be added to the polymer substrate to enhance the optical component. The diffusion coefficient of various Nd and F compounds. Three variables (for example, TiO 2, NdF 3, and Nd 2 O 3 is the load weight in terms of the above example) dedicated to produce many types of optical components for achieving desired spectral distribution and variation allowable.

然而，根據本發明一實施態樣，至少一種化 合物(或超過一種化合物)可包含釹(Nd)及氟(F)元素，及隨意地包含一或更多種其他元素。通常，此種化合物包含Nd3+離子及F-離子。基於本發明目的，「Nd-F化合物」應廣義解釋為包括包含釹及氟化物及隨意的其他元素之化合物。 However, in accordance with an embodiment of the present invention, at least one compound (or more than one compound) may comprise neodymium (Nd) and fluorine (F) elements, and optionally one or more other elements. Typically, such compounds comprising Nd 3+ ions and F - ions. For the purposes of the present invention, "Nd-F compound" should be interpreted broadly to include compounds comprising hydrazine and fluoride and optionally other elements.

根據其他實施態樣，該組件可包括在LED(OLED)晶片表面上的複合/封裝層，以使本文所揭示之包含Nd及F的化合物可摻合(分散)於該封裝層，例如連同磷光體摻合(分散)，以獲致有利的可見光吸收剖線。該複合/封裝層可使用低溫玻璃、聚合物(諸如聚碳酸酯)、聚合物前驅物、聚矽氧(聚合物)或聚矽氧環氧樹脂或前驅物等。 According to other embodiments, the assembly can include a composite/encapsulation layer on the surface of the LED (OLED) wafer such that the Nd and F-containing compounds disclosed herein can be blended (dispersed) in the encapsulation layer, for example, together with phosphorescence. The body is blended (dispersed) to obtain a favorable visible light absorption profile. The composite/encapsulated layer may use low temperature glass, a polymer such as polycarbonate, a polymer precursor, a polyoxyn (polymer) or a polyoxy epoxy or a precursor.

根據另一實施態樣，該光學組件可為透明、半透明、反射性或半透射性(transflective)(部分反射及透射)基材，及在該基材表面上之包含本文所述的多種Nd及F組件之塗層可施加對於LED模組所產生的可見光之彩色濾光效果，當該可見光通過該光學組件時，例如過濾該可見光之黃光波長範圍，例如波長為約560nm至約600nm，以提供所希望的光譜。 According to another embodiment, the optical component can be a transparent, translucent, reflective or transflective (partially reflective and transmissive) substrate, and comprises a plurality of Nd as described herein on the surface of the substrate. And the coating of the F component can apply a color filtering effect on visible light generated by the LED module, and when the visible light passes through the optical component, for example, filtering a yellow light wavelength range of the visible light, for example, a wavelength of about 560 nm to about 600 nm, To provide the desired spectrum.

此外，該光學組件之透明或半透明基材可為漫射器，諸如密封該至少一個LED晶片的燈泡、透鏡、及包封件。此外，該基材可為反射性基材，及該LED晶片可配置在該基材外部。該多化合物塗層(包含本文所述之Nd及F多種化合物)可配置在該基材表面上，且該塗層 之厚度應足以獲致彩色濾光效果。該厚度通常可在50nm至1000微米之範圍內，較佳厚度係介於100nm至500微米。 Additionally, the transparent or translucent substrate of the optical component can be a diffuser, such as a bulb, lens, and encapsulant that seals the at least one LED wafer. Additionally, the substrate can be a reflective substrate, and the LED wafer can be disposed outside of the substrate. The multi-compound coating (comprising various compounds of Nd and F described herein) can be disposed on the surface of the substrate, and the coating The thickness should be sufficient to achieve a color filter effect. The thickness is typically in the range of 50 nm to 1000 microns, with a preferred thickness ranging from 100 nm to 500 microns.

所得之器件藉由使用在介於約530nm與600nm之可見光區中具有內在吸收的Nd及Nd-F化合物/材料濾光可展現光參數的改善，以增強CSI(色彩飽和指數)、CRI(色彩顯色指數)、R9(色彩顯色值(rendering value))、顯色性(revealness)(照明偏好指數(lighting preference index)，LPI)等。R9係界定為不用於計算CRI之6個飽和測試色彩中的一種色彩。「顯色性(revealness)」為根據LPI之版本所發射之光的參數，其描述於2014年9月9日提出申請之共待審共有國際申請案PCT/US2014/054868(於2015年3月12日公告為WO2015/035425)，特此以引用方式將相關部分併入。 The resulting device exhibits an improvement in optical parameters by using Nd and Nd-F compound/material filtering with intrinsic absorption in the visible region of about 530 nm and 600 nm to enhance CSI (Color Saturation Index), CRI (Color) Color rendering index), R9 (rendering value), revealness (lighting preference index, LPI), and the like. R9 is defined as one of the six saturated test colors that are not used to calculate CRI. "Remoteness" is a parameter of light emitted according to the version of LPI, which is described in the copending international application PCT/US2014/054868 filed on September 9, 2014 (in March 2015) The announcement on the 12th is WO2015/035425), and the relevant parts are hereby incorporated by reference.

在一實施態樣中，本文所述之多種化合物中的至少一種化合物可包括Nd3+離子及F-離子及可為Nd-F化合物或Nd-X-F化合物。如本文所使用，「Nd-F化合物」應廣義解釋為包括包含釹及氟化物及隨意的其他元素之化合物。此等包含釹及氟化物之化合物可包含氟化釹、或氧氟化釹(例如，NdOxFy，其中2x+y=3，諸如Nd4O3F6)、或含有不定水(adventitious water)及/或氧之氟化釹、或氫氧氟化釹(neodymium hydroxide fluoride)(例如，Nd(OH)aFb，其中a+b=3)、或從下列描述將容易明白之眾多包含釹及氟化物的其他化合物。 In one embodiment, at least one of the plurality of compounds described herein can include Nd 3+ ions and F − ions and can be Nd—F compounds or Nd-XF compounds. As used herein, "Nd-F compound" shall be interpreted broadly to include compounds comprising hydrazine and fluoride and optionally other elements. Such compounds comprising rhodium and fluoride may comprise cesium fluoride, or cesium oxyfluoride (eg, NdO x F y , where 2x+y=3, such as Nd 4 O 3 F 6 ), or contain amorphous water (adventitious) Water) and/or oxygen barium fluoride, or neodymium hydroxide fluoride (eg, Nd(OH) a F b , where a+b=3), or many of which will be readily apparent from the description below Other compounds containing hydrazine and fluoride.

在一些實施態樣中，該多種化合物中之一種化合物可為NdF3或NdFO。就Nd-X-F化合物而言，X為至少一種選自由下列所組成之群組的元素：與釹形成化合物之元素，諸如氧、氮、硫及氯；或至少一種與氟形成化合物之金屬元素，諸如Na、K、Al、Mg、Li、Ca、Sr、Ba、及Y、或此等元素之組合，該等金屬元素係與釹不同。Nd-X-F化合物之特定實例可包括：氧氟化釹(Nd-O-F)化合物；Nd-X-F化合物，其中X可為Mg及Ca或可為Mg、Ca及O；以及含有Nd-F之其他化合物，包括摻雜釹之鈣鈦礦結構。特定Nd-X-F化合物可有利地更廣泛吸收在約580nm之波長。 In some embodiments, one of the plurality of compounds can be NdF 3 or NdFO. In the case of the Nd-XF compound, X is at least one element selected from the group consisting of: an element forming a compound with ruthenium, such as oxygen, nitrogen, sulfur, and chlorine; or at least one metal element forming a compound with fluorine, Such as Na, K, Al, Mg, Li, Ca, Sr, Ba, and Y, or combinations of such elements, which are different from ruthenium. Specific examples of the Nd-XF compound may include: an antimony oxyfluoride (Nd-OF) compound; a Nd-XF compound, wherein X may be Mg and Ca or may be Mg, Ca, and O; and other compounds containing Nd-F , including the perovskite-doped perovskite structure. The particular Nd-XF compound can advantageously be more widely absorbed at a wavelength of about 580 nm.

如上述，一個組件/光學組件可為包含例如兩種化合物Nd2O3及NdF3之聚合物基底材料(諸如聚矽氧、聚碳酸酯等)。圖2為分別以曲線22表示之Nd2O3(在折射率為1.54之1.3mm厚的聚矽氧中，1.0%)於可見光譜中之透射率，以及以曲線20表示之NdF3(在折射率為1.54之1.3mm厚的聚矽氧中，2.9%)於可見光譜中之透射率圖。可看出，個別材料共有許多相似吸收特徵，尤其是在黃光(例如，約570nm至約600nm)範圍。圖2中所顯示之不同吸收峰驅動個別組件(Nd2O3及NdF3)在色空間中之不同色彩偏移向量，如圖3中進一步圖示說明。藉由組合這兩種化合物，可獲致無法用單一Nd化合物或用Nd：玻璃(SiO2中之Nd2O3)獲致的色點。 As noted above, one component/optical component can be a polymeric substrate material (such as polyfluorene, polycarbonate, etc.) comprising, for example, two compounds, Nd 2 O 3 and NdF 3 . 2 is a transmittance of Nd 2 O 3 (1.0% in a 1.3 mm thick polyfluorene having a refractive index of 1.54) in the visible spectrum, and NdF 3 represented by a curve 20, respectively. Transmittance plot in the visible spectrum of a 1.5 mm thick polyfluorene with a refractive index of 1.54. It can be seen that individual materials share many similar absorption characteristics, especially in the range of yellow light (e.g., from about 570 nm to about 600 nm). The different absorption peaks shown in Figure 2 drive the different color shift vectors of the individual components (Nd 2 O 3 and NdF 3 ) in the color space, as further illustrated in Figure 3. By combining the two compounds, it is possible to obtain a color point which cannot be obtained with a single Nd compound or with Nd: glass (Nd 2 O 3 in SiO 2 ).

使用時，吾人可用封裝劑(例如，聚矽氧、環 氧樹脂、丙烯酸系樹脂或類似者)封裝LED晶片/晶粒；該封裝劑可包含Nd2O3及NdF3材料或通常包含如本文所述之Nd及F為主的化合物，以使例如聚矽氧中之Nd2O3及NdF3可直接沉積在LED晶片上或在LED晶片的陣列上(例如，晶片直接封裝陣列(chip-on-board array)，COB陣列)，如本文進一步詳細說明。 In use, we may encapsulate the LED wafer/die with an encapsulant (eg, polyoxyxide, epoxy, acrylic, or the like); the encapsulant may comprise Nd 2 O 3 and NdF 3 materials or is typically included as herein and F of the Nd-based compound, so that for example a poly silicon oxide Nd 2 O 3 and in the NdF 3 may be deposited directly on an LED wafer or an array of LED chip (e.g., direct wafer package array (chIP- On-board array), as described in further detail herein.

圖3圖示摻入光學組件(諸如聚矽氧或聚碳酸酯)中並沉積在標準LED封裝(諸如具有3000K CCT之80CRI)上之Nd2O3及NdF3化合物如何使光源的色點分別沿著Nd2O3及NdF3化合物之光譜吸收所界定的向量30及32偏移之色空間圖。 Figure 3 illustrates how the Nd 2 O 3 and NdF 3 compounds incorporated into an optical component (such as polyfluorene or polycarbonate) and deposited on a standard LED package (such as 80 CRI with 3000K CCT) A color space map of vectors 30 and 32 offset defined by spectral absorption along the Nd 2 O 3 and NdF 3 compounds.

從圖3中之圖表清楚看出，該系統理論上可容許藉由改變Nd2O3及NdF3化合物之相對量而從標準3000K LED產生在三角形ABC中的任何色點，即，使發射體之色點分別沿著Nd2O3及NdF3化合物之光譜吸收所界定的向量30及32偏移。然而，由於因高度濾光所造成的大幅能量損失是不想要的情況，該系統實際上會局限於較小區域34，例如12個麥克亞當橢圓，或根據應用及最終使用者願意犧牲LPW(流明/瓦)以獲致離起始色彩非常遠之色點的意願而任意選擇之一些其他區域大小。區域34係由線BD、BE及曲線36界定範圍。在區域34中之實際色點中的任一色點可在廣範圍之Nd2O3及NdF3化合物的相對量及漫射程度內獲致，容許在需要不同之光學元件的光束成形特性之不同LED系統中應用給定色點。相 較之下，添加Nd玻璃(傳統方法)容許色點僅移動至單點38(或者若該玻璃的厚度變動的話則沿向量移動)。圖4a、4b及5圖示說明實施本文所揭示實施態樣的其他實例。 As is clear from the graph in Figure 3, the system can theoretically allow any color point in the triangle ABC to be generated from a standard 3000K LED by varying the relative amounts of Nd 2 O 3 and NdF 3 compounds, i.e., the emitter The color points are offset along the vectors 30 and 32 defined by the spectral absorption of the Nd 2 O 3 and NdF 3 compounds, respectively. However, since large energy losses due to high filtering are undesirable, the system will actually be limited to smaller areas 34, such as 12 MacAdam ellipse, or willing to sacrifice LPW depending on the application and end user (lumen / watt) Some other area sizes arbitrarily chosen to obtain a color point that is very far from the starting color. Region 34 is defined by lines BD, BE, and curve 36. Any of the actual color points in region 34 can be achieved over a wide range of relative amounts and diffusion levels of Nd 2 O 3 and NdF 3 compounds, allowing for different LED shaping characteristics that require different optical components. A given color point is applied to the system. In contrast, the addition of Nd glass (conventional method) allows the color point to move only to a single point 38 (or move along the vector if the thickness of the glass changes). Figures 4a, 4b and 5 illustrate other examples of implementing the embodiments disclosed herein.

圖4為根據本發明實施態樣之在聚矽氧帶中包含不同量的Nd2O3及NdF3之Nd化合物混合物之可見光譜的透射範例圖。曲線42a對應於包含4%之NdF3及1%之Nd2O3的1.3mm厚聚矽氧帶，曲線44a對應於包含5%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶，曲線46a對應於包含3.%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶，以及曲線48a對應於包含3.5%之NdF3及1.8%之Nd2O3的1.3mm厚聚矽氧帶。 FIG 4 is a exemplary embodiment of the present invention, the transmission aspects of Nd contain varying amounts of silicon oxide with polyethylene in the Nd 2 O 3 and NdF 3 of the compound mixtures according to the visible spectrum. Curve 42a corresponds to a 1.3 mm thick polyxanium band containing 4% NdF 3 and 1% Nd 2 O 3 , and curve 44a corresponds to a 1.3 mm thick polyg containing 5% NdF 3 and 0.5% Nd 2 O 3 The oxygen band, curve 46a corresponds to a 1.3 mm thick polyxene oxide band containing 3.% NdF 3 and 0.5% Nd 2 O 3 , and curve 48a corresponds to 3.5% NdF 3 and 1.8% Nd 2 O 3 1.3mm thick polyxene belt.

圖4b為利用圖4a所示之根據本發明實施態樣的具有各種不同Nd化合物混合物之濾光器的燈(諸如LED燈)在可見光譜中的模擬發光圖。在圖4b中，曲線42b為具有該包含4%之NdF3及1%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈、曲線44b為具有該包含5%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈、曲線46b為具有該包含3%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈，以及曲線48b為具有該包含3.5%之NdF3及1.8%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈。 Figure 4b is a simulated luminescence of a lamp (such as an LED lamp) having a filter of various Nd compound mixtures in accordance with an embodiment of the present invention shown in Figure 4a. In Fig. 4b, curve 42b is an analog LED lamp having a 1.3 mm thick polyxenium band containing 4% NdF 3 and 1% Nd 2 O 3 , curve 44b having the NdF 3 and 0.5 containing 5%. A simulated LED lamp with a 1.3 mm thick polyxylene band of % Nd 2 O 3 , curve 46b is a simulated LED lamp with a 1.3 mm thick polyxylene band containing 3% NdF 3 and 0.5% Nd 2 O 3 And curve 48b is an analog LED lamp having a 1.3 mm thick polyxenium band containing 3.5% NdF 3 and 1.8% Nd 2 O 3 .

圖5為比較標準3000K LED燈之色點與包含分別於圖4a及4b所示之根據本發明實施態樣的具有各種不同Nd化合物混合物之濾光器的LED燈之色點的色空間 圖。在圖5中，色點52為具有該包含4%之NdF3及1%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈、色點54為具有該包含5%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈、色點56為具有該包含3%之NdF3及0.5%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈，以及色點58為具有該包含3.5%之NdF3及1.8%之Nd2O3的1.3mm厚聚矽氧帶之模擬LED燈。 Figure 5 is a color space diagram comparing the color point of a standard 3000K LED lamp with the color point of an LED lamp comprising filters of various Nd compound mixtures in accordance with an embodiment of the present invention shown in Figures 4a and 4b, respectively. In FIG. 5, the color point 52 is an analog LED lamp having a 1.3 mm thick polyoxynitride band containing 4% NdF 3 and 1% Nd 2 O 3 , and the color point 54 is having the NdF 3 containing 5%. And a 0.3% thick polyxenium band analog LED lamp with 0.5% Nd 2 O 3 , color point 56 is a 1.3 mm thick polyoxynitride band having 3% NdF 3 and 0.5% Nd 2 O 3 The analog LED lamp, and color point 58 is an analog LED lamp having a 1.3 mm thick polyoxynitride band containing 3.5% NdF 3 and 1.8% Nd 2 O 3 .

圖4a、4b及5圖示說明改變(LED)燈之濾光組件中的NdF3及Nd2O3之相對量如何修改該燈的色溫及修改其發射光譜(例如，在570至600nm波長範圍附近的吸收峰)以提供具有所希望色溫之所希望的燈光譜(例如，使光源「白化」)，及適當程度的透射流明功率，以能進一步改善其他光參數，諸如CSI、CRI、R9及顯色性(revealness)。「顯色性(revealness)」為根據LPI之版本所發射之光的參數，其描述於2014年9月9日提出申請之共待審共有國際申請案PCT/US2014/054868(於2015年3月12日公告為WO2015/035425)，特此以引用方式將相關部分併入。 Figures 4a, 4b and 5 illustrate how the relative amounts of NdF 3 and Nd 2 O 3 in the filter assembly of a (LED) lamp modify how the color temperature of the lamp is modified and modify its emission spectrum (e.g., in the 570 to 600 nm wavelength range) Nearby absorption peaks) to provide a desired lamp spectrum with a desired color temperature (eg, "whitening" the source), and an appropriate degree of transmitted lumens power to further improve other optical parameters such as CSI, CRI, R9 and Revealness. "Remoteness" is a parameter of light emitted according to the version of LPI, which is described in the copending international application PCT/US2014/054868 filed on September 9, 2014 (in March 2015) The announcement on the 12th is WO2015/035425), and the relevant parts are hereby incorporated by reference.

在其他實施態樣中，具有對應的相對量之多種Nd及F化合物可連同一或多種發光材料(諸如磷光體)摻入封裝材料。例如，具有對應相對量之Nd及F多種化合物可與黃-綠色磷光體及/或紅色磷光體摻合。例如，該多種Nd及F化合物可與摻雜Ce之YAG磷光體及/或傳統紅色氮化物磷光體(諸如摻雜Eu2+之CaAlSiN紅色磷光體) 摻合。在其他實例中，該Nd及F多種化合物可在封裝發射藍光/紫外線之LED的聚矽氧中與YAG：Ce磷光體及紅色氮化物磷光體摻合。 In other embodiments, a plurality of Nd and F compounds having corresponding relative amounts can be incorporated into the encapsulating material with one or more luminescent materials, such as phosphors. For example, a plurality of Nd and F compounds having corresponding relative amounts can be blended with a yellow-green phosphor and/or a red phosphor. For example, the plurality of Nd and F compounds can be blended with a Ce-doped YAG phosphor and/or a conventional red nitride phosphor such as a CaAlSiN red phosphor doped with Eu 2+ . In other examples, the Nd and F compounds can be blended with YAG:Ce phosphors and red nitride phosphors in a polyfluorene encapsulating a blue/ultraviolet emitting LED.

圖6a至6d分別圖示說明根據本發明各種不同實施態樣之併入如本文所述的Nd及F多種化合物連同磷光體以獲致有利可見光吸收/產生特性的以LED為主之照明裝置60a、60b、60c及60d之不同的非限制性實例。在圖6a至6d中，該以LED為主之照明裝置60a、60b、60c或60d包括可為密封安裝在印刷電路板(PCB)66上之LED晶片65的隨意地呈透明或半透明基材之圓頂62。引線提供電流至LED晶片65，因而使其發射輻射。該LED晶片可為任何半導體光源，尤其是當所發射之輻射被導引至磷光體上時能產生白光的藍光或紫外線光源。特別是，該半導體光源可為發射波長大於約200nm以及小於約550nm之以氮化物化合物半導體為主的發射藍光/紫外線(UV)LED，其中該氮化物化合物半導體統稱為IniGajAlkN，其中i、j及k分別為具有1或0之值的整數(包括例如InGaN、AlN、AlGaN、AlGaInN裝置結構)。更具體地說，該晶片可為峰值發射波長為約400至約500nm之發射近UV或藍光的LED。又更具體地說，該晶片可為峰值發射波長在約440至460nm之範圍的發射藍光之LED。此等LED半導體在本技術中係已知。 Figures 6a through 6d respectively illustrate an LED-based illumination device 60a incorporating a plurality of Nd and F compounds as described herein along with a phosphor to achieve advantageous visible light absorption/generation characteristics, in accordance with various embodiments of the present invention, Different non-limiting examples of 60b, 60c, and 60d. In Figures 6a to 6d, the LED-based illumination device 60a, 60b, 60c or 60d comprises a randomly transparent or translucent substrate that can be sealed to the LED chip 65 mounted on a printed circuit board (PCB) 66. Dome 62. The leads provide current to the LED wafer 65, thereby causing it to emit radiation. The LED wafer can be any semiconductor light source, especially a blue or ultraviolet light source that produces white light when the emitted radiation is directed onto the phosphor. In particular, the semiconductor light source may be a nitride compound semiconductor-based emitting blue/ultraviolet (UV) LED having an emission wavelength greater than about 200 nm and less than about 550 nm, wherein the nitride compound semiconductor is collectively referred to as IniGa j Al k N, wherein i, j, and k are integers having values of 1 or 0, respectively (including, for example, InGaN, AlN, AlGaN, AlGaInN device structures). More specifically, the wafer can be an LED emitting near-UV or blue light having a peak emission wavelength of from about 400 to about 500 nm. Still more specifically, the wafer may be a blue-emitting LED having a peak emission wavelength in the range of about 440 to 460 nm. Such LED semiconductors are known in the art.

根據圖6a所示之一實施態樣，聚合物複合物層(封裝劑化合物)64a可包含與磷光體摻合的如本文所述 之Nd及F多種化合物，以對根據本文所述之各種不同實施態樣賦予有利的可見光吸收/產生特徵。該化合物層64a可直接配置在LED晶片65表面上且輻射耦合至該晶片。「輻射耦合」意指來自該LED晶片之輻射透射至磷光體，且該磷光體發射具有不同波長的輻射。在特定實施態樣中，該LED晶片65可為藍光LED，而該聚合物複合物層可包括具有對應相對量之多種Nd及F化合物與黃-綠色磷光體(諸如摻雜鈰之釔鋁石榴石，Ce：YAG)的摻合物。由該LED晶片所發射的藍光與由聚合物複合物層之磷光體所發射的黃-綠光混合，該淨發射呈現為被該Nd及F多種化合物過濾的白光。因此，LED晶片65可由封裝劑材料層64a密封。該封裝劑材料可為低溫玻璃、熱塑性或熱固性聚合物或樹脂、或聚矽氧或環氧樹脂。該LED晶片65及該封裝劑材料層64a可封裝在殼體(由圓頂62限制)內。或者，該LED裝置60a可僅包括封裝劑層64a而無外殼體/圓頂62。此外，散射粒子可埋在該封裝劑材料中以提高如本文所述之Nd及F多種化合物的漫射係數。散射粒子可為例如氧化鋁(Al2O3)、矽石(SiO2)或氧化鈦(TiO2)。又，散射粒子可有效散射自LED晶片發射的定向光，較佳具有可忽視之吸收量。 According to one embodiment shown in Figure 6a, the polymer composite layer (encapsulant compound) 64a may comprise a plurality of Nd and F compounds as described herein blended with the phosphor to vary according to the variousities described herein. Embodiments impart advantageous visible light absorption/production characteristics. The compound layer 64a can be disposed directly on the surface of the LED wafer 65 and radiatively coupled to the wafer. "Radiation coupling" means that radiation from the LED wafer is transmitted to the phosphor, and the phosphor emits radiation having different wavelengths. In a particular embodiment, the LED chip 65 can be a blue LED, and the polymer composite layer can include a plurality of Nd and F compounds and a yellow-green phosphor having a corresponding relative amount (such as a doped yttrium aluminum pomegranate) A blend of stone, Ce:YAG). The blue light emitted by the LED wafer is mixed with yellow-green light emitted by the phosphor of the polymer composite layer, which appears as white light filtered by the Nd and F compounds. Therefore, the LED wafer 65 can be sealed by the encapsulant material layer 64a. The encapsulant material can be a low temperature glass, a thermoplastic or thermoset polymer or resin, or a polyoxyl or epoxy. The LED wafer 65 and the encapsulant material layer 64a can be packaged within a housing (restricted by the dome 62). Alternatively, the LED device 60a may include only the encapsulant layer 64a without the outer casing/dome 62. Additionally, scattering particles can be embedded in the encapsulant material to increase the diffusion coefficient of the various Nd and F compounds as described herein. The scattering particles may be, for example, alumina (Al 2 O 3 ), vermiculite (SiO 2 ) or titanium oxide (TiO 2 ). Further, the scattering particles can effectively scatter the directional light emitted from the LED wafer, and preferably have a negligible absorption amount.

為了在LED晶片表面上形成包括如本文所述之對應相對量的多種Nd及F化合物之聚合物複合物層，該等粒子可分散在聚合物或聚合物前驅物，特別是聚矽氧、聚碳酸酯、聚矽氧環氧樹脂或其前驅物中。對於LED 封裝而言已熟知此等材料。該分散混合物可藉由任何適用方法塗布在該晶片上，例如使用射出成形(或澆鑄或擠出光學組件或相似技術)，且具有較大密度或粒度或較大密度與較大粒度之粒子優先沉降在緊鄰該LED晶片的區域，形成具有梯級組成的層。沉降可發生在聚合物或前驅物之塗布或固化期間，及可藉由如本技術中已知的離心方法而促進。另外應注意的是，該磷光體及該Nd及F多種化合物之分散參數(例如包括粒子密度)及製程參數可經選擇以使該磷光體材料比該Nd及F多種化合物更接近該LED晶片65，以使該Nd及F多種化合物適當地過濾由磷光體組件所產生的光。 To form a polymer composite layer comprising a plurality of Nd and F compounds of corresponding relative amounts as described herein on the surface of the LED wafer, the particles may be dispersed in a polymer or polymer precursor, particularly polyoxyl, poly Carbonate, polyoxy epoxy resin or its precursor. For LED These materials are well known for packaging. The dispersion mixture can be applied to the wafer by any suitable method, such as by injection molding (or casting or extrusion of optical components or the like), and having a larger density or particle size or larger density and larger particle size is preferred. It settles in the area immediately adjacent to the LED wafer, forming a layer having a step composition. Settling can occur during coating or curing of the polymer or precursor, and can be facilitated by centrifugation methods as are known in the art. In addition, it should be noted that the dispersion parameters (including, for example, particle density) and process parameters of the phosphor and the Nd and F compounds may be selected such that the phosphor material is closer to the LED wafer 65 than the Nd and F compounds. In order for the Nd and F compounds to properly filter the light generated by the phosphor assembly.

在圖6B所示之替代範例實施態樣中，磷光體層64b可為以傳統方式製造的封裝劑層，及可在該磷光體層64b上沉積具有Nd及F多種化合物之獨立的封裝劑層68b，例如使用適當傳統之沉積/粒子分散在聚合物或聚合物前驅物中的技術。 In an alternative embodiment shown in FIG. 6B, the phosphor layer 64b can be a conventionally fabricated encapsulant layer, and a separate encapsulant layer 68b having a plurality of Nd and F compounds can be deposited on the phosphor layer 64b. For example, techniques using suitable conventional deposition/particle dispersion in a polymer or polymer precursor.

在圖6c所示之其他範例實施態樣中，包含該Nd及F多種化合物之複合物層68c可塗布在圓頂(殼體)62的外表面上。塗布的層68c之性能與圖6b中之具有Nd及F多種化合物的封裝劑層68b之性能相似。或者，圖6c中之塗層68c係沉積在圓頂62之內表面。關於圓頂/基材之塗層的更多實施細節將參考圖7至10進行討論。應注意的是，圓頂62本身可為透明或半透明。 In other exemplary embodiments shown in FIG. 6c, a composite layer 68c comprising the Nd and F compounds may be coated on the outer surface of the dome (housing) 62. The properties of the coated layer 68c are similar to those of the encapsulant layer 68b having various Nd and F compounds in Figure 6b. Alternatively, the coating 68c of Figure 6c is deposited on the inner surface of the dome 62. Further implementation details regarding the dome/substrate coating will be discussed with reference to Figures 7-10. It should be noted that the dome 62 itself may be transparent or translucent.

在又其他範例實施態樣中，如圖6d所示，圓 頂(殼體)62可用以將多種Nd及F化合物複合物層/塗層68d沉積在圓頂62之外表面上及將磷光體塗層64d沉積在圓頂62之內表面上。另外應注意的是，該方法可能有不同變型。例如，塗層64d及68d二者可均沉積在圓頂62的一個表面(外或內表面)上，其中磷光體塗層64d比塗層68d更接近LED晶片65。又，塗層64d及68d(當沉積在圓頂62之一個表面上時)可與圖6a中之封裝劑化合物層64a相似地組合成一個層。應注意的是，圓頂62本身可為透明、半透明或半透射性，以實施圖6d所示之實例的不同變型。 In still other example implementations, as shown in Figure 6d, the circle A top (housing) 62 can be used to deposit a plurality of Nd and F compound composite layers/coatings 68d on the outer surface of the dome 62 and deposit a phosphor coating 64d on the inner surface of the dome 62. It should also be noted that this method may have different variations. For example, both coatings 64d and 68d may be deposited on one surface (outer or inner surface) of the dome 62, with the phosphor coating 64d being closer to the LED wafer 65 than the coating 68d. Further, the coatings 64d and 68d (when deposited on one surface of the dome 62) may be combined into a single layer similarly to the encapsulant compound layer 64a of Fig. 6a. It should be noted that the dome 62 itself may be transparent, translucent or semi-transmissive to implement different variations of the example shown in Figure 6d.

下文為數個使用本文所述造成所希望彩色濾光效果之含有Nd及F多種化合物的塗層之以LED為主的照明裝置的非限制性實例。 The following are non-limiting examples of LED-based lighting devices that employ coatings containing Nd and F compounds that result in the desired color filtering effects described herein.

圖7為根據本發明一實施態樣之適於局部照明裝置的以LED為主的照明裝置。該以LED為主的照明裝置(其亦可稱為「照明單元」或「燈」)為經建構以提供幾近全向照明能力的LED燈70。如圖7所示，LED燈70包括燈泡72、接頭74、及介於燈泡72與接頭74之間的底座76，以及在燈泡72外表面上的塗層78。塗層78包括本文所述之Nd及F多種化合物。在一些實施態樣中，燈泡72可被其他透明或半透明基材替代。或者，塗層78可塗布在可為透明或半透明之燈泡72的內表面上。 7 is an LED-based lighting device suitable for a local illumination device in accordance with an embodiment of the present invention. The LED-based lighting device (which may also be referred to as a "lighting unit" or "light") is an LED lamp 70 that is constructed to provide near-omnidirectional illumination capabilities. As shown in FIG. 7, the LED lamp 70 includes a bulb 72, a joint 74, and a base 76 interposed between the bulb 72 and the joint 74, and a coating 78 on the outer surface of the bulb 72. Coating 78 includes a plurality of Nd and F compounds as described herein. In some implementations, the bulb 72 can be replaced with other transparent or translucent substrates. Alternatively, the coating 78 can be applied to the inner surface of the bulb 72 which can be transparent or translucent.

圖8為根據本發明其他實施態樣之以LED為主的照明裝置80。如圖8所示，以LED為主的照明裝置 為天花板燈80(LED晶片未顯示)。天花板燈80包括半球形基材82及含有本文所述之Nd及F多種化合物的塗層88；塗層88係在半球形基材82的內表面上。或者，塗層88可塗布在可為透明或半透明之半球形基材82的外表面上。 Figure 8 is an LED-based illumination device 80 in accordance with other embodiments of the present invention. As shown in Figure 8, LED-based lighting For the ceiling light 80 (LED chip not shown). The ceiling light 80 includes a hemispherical substrate 82 and a coating 88 comprising various Nd and F compounds as described herein; the coating 88 is attached to the inner surface of the hemispherical substrate 82. Alternatively, coating 88 can be applied to the outer surface of hemispherical substrate 82 which can be transparent or translucent.

圖9為根據本發明其他實施態樣之以LED為主的照明裝置。如圖9所示，該以LED為主的照明裝置為透鏡90，且透鏡90包括平坦基材92。在該實施態樣中，平坦基材92包括在其外表面上之Nd及F化合物塗層(未圖示)。 9 is an LED-based lighting device in accordance with other embodiments of the present invention. As shown in FIG. 9, the LED-based illumination device is a lens 90, and the lens 90 includes a flat substrate 92. In this embodiment, the flat substrate 92 includes a coating of Nd and F compounds (not shown) on its outer surface.

圖10為根據本發明一其他實施態樣之以LED為主的照明裝置100。以LED為主的照明裝置100包括燈泡102、至少一個LED晶片105及反射性基材106。反射性基材106係建構成反射LED晶片105所產生的可見光。在特定實施態樣中，反射性基材106包括在其外表面上之Nd及F多種化合物塗層(未圖示)以提供所希望的濾光作用。圖10中，圓頂(102)可由漫射材料建造，以使特定量之來自LED的光通過，及特定量會反射回至凹穴(此等量係視該圓頂材料的漫射程度而定)。所反射的光會鏡面式或漫射式反射，視圓頂102的漫射係數而定。來自圓頂102之漫射式及/或鏡面式反射將入射在根據本文所述之實施態樣中的一個實施態樣之經塗布反射性基材106上。或者，圓頂102可從寬譜帶半反射性材料建造，以提供相同功能性。 Figure 10 is an LED-based illumination device 100 in accordance with another embodiment of the present invention. The LED-based lighting device 100 includes a bulb 102, at least one LED wafer 105, and a reflective substrate 106. The reflective substrate 106 is constructed to reflect visible light generated by the LED wafer 105. In a particular embodiment, the reflective substrate 106 includes Nd and F compound coatings (not shown) on its outer surface to provide the desired filtering. In Figure 10, the dome (102) may be constructed of a diffusing material such that a particular amount of light from the LED passes, and a particular amount is reflected back to the pocket (this amount is dependent on the degree of diffusion of the dome material) set). The reflected light will be specular or diffuse, depending on the diffusion coefficient of the dome 102. The diffuse and/or specular reflection from the dome 102 will be incident on the coated reflective substrate 106 in accordance with one of the embodiments described herein. Alternatively, the dome 102 can be constructed from a wide band of semi-reflective material to provide the same functionality.

本文所述之塗布材料(包括含有Nd3+離子及F-離子)可具有少許光學散射(漫射)效果；或者，可在光通過時造成相當可觀的光散射。為了增大散射角，該塗層可包括有機或無機材料之離散粒子。或者，該有機或無機材料可僅由本文所述之Nd及F多種化合物的離散粒子構成，及/或可由該Nd及F多種化合物之離散粒子及由至少一種其他不同材料所形成之粒子的混合物構成。 The coating materials described herein (including containing Nd 3+ ions and F − ions) may have a slight optical scattering (diffusion) effect; or, may cause considerable light scattering as the light passes. To increase the scattering angle, the coating may comprise discrete particles of organic or inorganic materials. Alternatively, the organic or inorganic material may consist solely of discrete particles of the Nd and F compounds described herein, and/or a mixture of discrete particles of the Nd and F compounds and particles formed from at least one other different material. Composition.

在一實施態樣中，該有機或無機材料之適合粒度可為約1nm至約10微米。就圖7所示之LED燈70而言，為了使散射角最大化以使LED燈70能獲致全向照明，該粒度可選擇為遠小於300nm以使瑞立散射(Rayleigh scattering)效率最大化。 In one embodiment, the suitable particle size of the organic or inorganic material can range from about 1 nm to about 10 microns. With respect to the LED lamp 70 shown in Figure 7, in order to maximize the scattering angle to enable the omnidirectional illumination of the LED lamp 70, the particle size can be chosen to be much less than 300 nm to maximize Rayleigh scattering efficiency.

雖然不希望成為限制，但該Nd及F多種化合物塗層可藉由例如噴塗、輥塗、彎液面(meniscus)塗布或浸塗、打印、網版、分配、輥軋、塗刷、黏合、靜電塗布或可提供均勻厚度之塗層的任何其他方法施加。下文將描述三個將Nd及F多種化合物塗層提供在基材上之方式的非限制性實例。 Although not intended to be limiting, the Nd and F compound coatings can be applied, for example, by spray coating, roll coating, meniscus coating or dip coating, printing, screen printing, dispensing, rolling, brushing, bonding, Electrostatic coating or any other method that provides a coating of uniform thickness. Three non-limiting examples of the manner in which Nd and F compound coatings are provided on a substrate will be described below.

在一實施態樣中，如圖7所示，塗層78可藉由黏合法塗布在燈泡72上。LED燈70可包括介於該燈泡72與該塗層78之間的黏合層(未圖示)，且該黏合層可包括有機黏著劑或無機黏著劑。有機黏著劑可包括環氧樹脂、有機聚矽氧黏著劑、丙烯酸系樹脂等。無機黏著劑可包括矽酸鹽無機黏著劑、硫酸鹽黏著劑、磷酸鹽黏著劑、 氧化物黏著劑、硼酸鹽黏著劑等。 In one embodiment, as shown in FIG. 7, coating 78 can be applied to bulb 72 by adhesion. The LED lamp 70 can include an adhesive layer (not shown) interposed between the bulb 72 and the coating 78, and the adhesive layer can include an organic or inorganic adhesive. The organic adhesive may include an epoxy resin, an organic polyoxygen adhesive, an acrylic resin, or the like. Inorganic adhesives may include bismuth silicate inorganic adhesives, sulfate adhesives, phosphate adhesives, Oxide adhesives, borate adhesives, etc.

在其他實施態樣中，如圖7所示，塗層78可藉由噴塗法塗布在燈泡72的外表面上。首先，形成含有例如具有對應相對量之Nd2O3及NdF3化合物、二氧化矽(silicone dioxide)、分散劑(諸如DISPEX A40)、水及隨意的TiO2或Al2O3之液態混合物。然後，將形成之液體混合物噴淋至燈泡72上。最後，將燈泡72固化以獲得經塗布之LED燈70。 In other embodiments, as shown in FIG. 7, coating 78 can be applied to the outer surface of bulb 72 by spray coating. First, a liquid mixture containing, for example, a corresponding relative amount of Nd 2 O 3 and NdF 3 compound, silicon dioxide, a dispersant such as DISPEX A40, water, and optionally TiO 2 or Al 2 O 3 is formed. The resulting liquid mixture is then sprayed onto the bulb 72. Finally, the bulb 72 is cured to obtain a coated LED lamp 70.

在一實施態樣中，如圖7所示，塗層78可藉由靜電塗布法塗布至燈泡72的外表面上。首先，製造由對應相對量之Nd2O3及NdF3化合物、SiO2及Al2O3所組成的帶電荷粉末。然後，將該粉末塗布至帶相反電荷的燈泡72上。 In one embodiment, as shown in FIG. 7, coating 78 can be applied to the outer surface of bulb 72 by electrostatic coating. First, a charged powder composed of a corresponding relative amount of Nd 2 O 3 and NdF 3 compound, SiO 2 and Al 2 O 3 was produced. This powder is then applied to an oppositely charged bulb 72.

在本發明其他實施態樣中，噴塗法及靜電塗布法二者均可使用無有機溶劑或有機化合物的材料，此可延長LED照明裝置的使用壽命及避免通常因磺化而造成的變色。 In other embodiments of the present invention, both the spray coating method and the electrostatic coating method may use materials free of organic solvents or organic compounds, which may extend the service life of the LED lighting device and avoid discoloration usually caused by sulfonation.

在其他實施態樣中，為了促進光折射以獲致白色反射外觀，該塗層還可包括具有比該多種Nd及F化合物更高折射率的添加劑。該添加劑可選自金屬氧化物或非金屬氧化物中之至少一種氧化物，諸如TiO2、SiO2及Al2O3。 In other embodiments, to promote light refraction to achieve a white reflective appearance, the coating may further comprise an additive having a higher refractive index than the plurality of Nd and F compounds. The additive may be selected from at least one of a metal oxide or a non-metal oxide such as TiO 2 , SiO 2 and Al 2 O 3 .

除非另外定義，否則本文所使用之技術及科學用語具有熟悉本揭示所屬之技術的人士一般暸解的相同 意義。本文所使用之用語「第一」、「第二」等不表示任何順序、數量或重要性，而是用以區分一個元件與另一元件。又，用語「一」不表示數量限制，而是表示存在至少一個所指示之項目。本文中使用「包括」、「包含」或「具有」及其變形係意指包括之後所列的項目及其等效物以及額外項目。用語「連接」及「耦合」不限制於物理或機械式連接或耦合，及可包括直接或間接的電性及光學連接或耦合。 Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. significance. The articles "first", "second", and the like, as used herein, are not intended to indicate any order, quantity, or Also, the term "a" does not denote a quantity limitation, but rather means that there is at least one indicated item. The use of "including", "comprising" or "having" and its variants in this document is intended to include the items listed thereafter and their equivalents and additional items. The terms "connected" and "coupled" are not restricted to physical or mechanical connections or couplings and may include both direct and indirect electrical and optical connections or couplings.

此外，熟悉之技術人士將認可來自不同實施態樣之各種不同特徵的互換性。具有本領域普通技術之人士可根據本發明的原理混合並匹配所述之各種不同特徵以及每一種特徵之其他已知等效物，以建構其他系統及技術。 In addition, those skilled in the art will recognize the interchangeability of various features from different embodiments. Those skilled in the art can mix and match the various features described and other known equivalents of each feature in accordance with the principles of the present invention to construct other systems and techniques.

在描述所主張的裝置之替代實施態樣時，為求清楚起見，使用特定術語。然而，不希望本發明受到所選用之特定術語限制。如此，應暸解，特定元件分別包括以相似方式操作達到相似功能的技術等效物。 In describing alternative embodiments of the claimed device, specific terminology is used for the sake of clarity. However, it is not intended that the invention be limited by the specific terms used. As such, it will be understood that the particular elements, respectively, include the technical equivalents that perform similar functions in a similar manner.

應暸解前述描述目的係說明而非限制本發明範疇，本發明範疇係由附錄之申請專利範圍的範疇界定。其他實施態樣係在下文申請專利範圍之範圍內。 It is to be understood that the foregoing description is intended to be illustrative and not restricting the scope of the invention Other embodiments are within the scope of the following patent application.

應注意的是，本文所描述及主張之各種不同非限制性實施態樣可針對特殊應用而獨立使用、組合或選擇性組合。 It should be noted that the various non-limiting embodiments described and claimed herein can be used independently, in combination, or selectively in combination for a particular application.

另外，可使用上述非限制性實施態樣的各種 不同特徵其中之一些特徵而不對應使用其他所述特徵以突顯優點。因此，前述描述應僅視為本發明之原理、教示及範例實施態樣的說明而非限制本發明。 In addition, various types of non-limiting embodiments described above may be used. Some of the features of the different features do not correspond to the use of other described features to highlight the advantages. Therefore, the foregoing description should be considered as illustrative of the invention

30、32、36‧‧‧向量 30, 32, 36‧‧‧ vectors

34‧‧‧區域 34‧‧‧Area

38‧‧‧單點 38‧‧‧ single point

Claims (20)

一種裝置，其包含至少一個發光二極體(LED)模組，其經建構以產生可見光；及至少一個組件，其包含二或更多種化合物，該化合物分別包含釹(Nd)，且該二或更多種化合物中至少一種化合物還包含氟(F)，該至少一個組件經建構以藉由使用該二或更多種化合物過濾所產生的可見光而提供所希望的光譜。 A device comprising at least one light emitting diode (LED) module constructed to produce visible light; and at least one component comprising two or more compounds, the compound comprising yttrium (Nd), respectively At least one of the compounds of the more or more compounds further comprises fluorine (F), the at least one component being configured to provide the desired spectrum by filtering the generated visible light using the two or more compounds. 如申請專利範圍第1項之裝置，其中，該二或更多種化合物中之至少一種化合物為氟化釹(NdF3)。 The device of claim 1, wherein at least one of the two or more compounds is cesium fluoride (NdF 3 ). 如申請專利範圍第1項之裝置，其中，該二或更多種化合物中之至少一種其他化合物包含三氧化二釹(Nd2O3)。 The device of claim 1, wherein at least one other compound of the two or more compounds comprises antimony trioxide (Nd 2 O 3 ). 如申請專利範圍第1項之裝置，其中，在色空間中之所希望光譜的色彩係在至少由該二或更多種化合物之吸收向量所界定的色空間中之預定區域內變化。 The device of claim 1, wherein the color of the desired spectrum in the color space varies within a predetermined region of the color space defined by at least the absorption vector of the two or more compounds. 如申請專利範圍第4項之裝置，其中，該在該色空間中的預定區域係局限於約12個麥克亞當橢圓(MacAdam ellipse)。 The apparatus of claim 4, wherein the predetermined area in the color space is limited to about 12 MacAdam ellipse. 如申請專利範圍第1項之裝置，其中，該二或更多種化合物包含Nd3+離子和F-離子。 The device of claim 1, wherein the two or more compounds comprise Nd 3+ ions and F − ions. 如申請專利範圍第1項之裝置，其中，在色空間中之所希望光譜的色彩係由該至少一個組件中之該二或更 多種化合物的相對量決定。 The apparatus of claim 1, wherein the color of the desired spectrum in the color space is the two or more of the at least one component The relative amount of multiple compounds is determined. 如申請專利範圍第1項之裝置，其中，該至少一個組件為沉積在該至少一個LED模組頂部上的封裝層。 The device of claim 1, wherein the at least one component is an encapsulation layer deposited on top of the at least one LED module. 如申請專利範圍第8項之裝置，其中，該封裝層為低溫玻璃、聚合物、聚合物前驅物、聚碳酸酯、熱塑性或熱固性聚合物或樹脂、聚矽氧、或聚矽氧環氧樹脂。 The device of claim 8 wherein the encapsulating layer is a low temperature glass, a polymer, a polymer precursor, a polycarbonate, a thermoplastic or thermosetting polymer or resin, a polyoxyn oxide, or a polyoxyxene epoxy resin. . 如申請專利範圍第8項之裝置，其中，該至少一個組件還包含磷光體。 The device of claim 8, wherein the at least one component further comprises a phosphor. 如申請專利範圍第1項之裝置，其中，該至少一個組件為沉積在包含磷光體之另一封裝層上的封裝層，該另一封裝層係沉積在該至少一個LED模組的頂部上。 The device of claim 1, wherein the at least one component is an encapsulation layer deposited on another encapsulation layer comprising a phosphor, the another encapsulation layer being deposited on top of the at least one LED module. 如申請專利範圍第1項之裝置，其中，該二或更多種化合物之該至少一種化合物包含一或更多種Nd-F及Nd-X-F化合物，其中，X為元素O、N、S、Cl、OH、Na、K、Al、Mg、Li、Ca、Sr、Ba及Y中之一或更多者。 The device of claim 1, wherein the at least one compound of the two or more compounds comprises one or more Nd-F and Nd-XF compounds, wherein X is an element O, N, S, One or more of Cl, OH, Na, K, Al, Mg, Li, Ca, Sr, Ba, and Y. 如申請專利範圍第1項之裝置，其中，該至少一個組件為包含透明、半透明或反射性基材且該基材表面上具有塗層的光學組件，該塗層包含該二或更多種化合物以藉由過濾所產生的可見光來提供所希望光譜。 The device of claim 1, wherein the at least one component is an optical component comprising a transparent, translucent or reflective substrate and having a coating on the surface of the substrate, the coating comprising the two or more The compound provides the desired spectrum by the visible light produced by filtration. 如申請專利範圍第13項之裝置，其中，該塗層之厚度在約50nm至約1000微米的範圍。 The device of claim 13, wherein the coating has a thickness in the range of from about 50 nm to about 1000 microns. 如申請專利範圍第14項之裝置，其中，該塗層還包含折射率高於該二或更多種化合物之添加劑，且其中 該添加劑係選自至少包括TiO2、SiO2及Al2O3之金屬氧化物及非金屬氧化物。 The device of claim 14, wherein the coating further comprises an additive having a higher refractive index than the two or more compounds, and wherein the additive is selected from the group consisting of at least TiO 2 , SiO 2 and Al 2 O 3 Metal oxides and non-metal oxides. 如申請專利範圍第14項之裝置，其中，該塗層係配置於該基材的內表面上。 The device of claim 14, wherein the coating is disposed on an inner surface of the substrate. 如申請專利範圍第14項之裝置，其中，該基材為漫射器，其選自由下列所組成之群組：密封該至少一個LED模組的燈泡、透鏡、及圓頂。 The device of claim 14, wherein the substrate is a diffuser selected from the group consisting of a bulb, a lens, and a dome that seal the at least one LED module. 如申請專利範圍第1項之裝置，其中，該裝置包含含有複數個LED模組與對應複數個組件之積體電路。 The device of claim 1, wherein the device comprises an integrated circuit comprising a plurality of LED modules and corresponding plurality of components. 如申請專利範圍第1項之裝置，其中，該至少一個組件包含選自由TiO2、SiO2及Al2O3所組成之群組的添加劑以提高該至少一個組件中之該二或更多種化合物的漫射係數。 The device of claim 1, wherein the at least one component comprises an additive selected from the group consisting of TiO 2 , SiO 2 and Al 2 O 3 to increase the two or more of the at least one component The diffusion coefficient of the compound. 如申請專利範圍第1項之裝置，其中，該至少一個組件係使用射出成形沉積。 The device of claim 1, wherein the at least one component is deposited using injection molding.
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