TWI771258B - Circuit board testing method - Google Patents

Circuit board testing method Download PDF

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TWI771258B
TWI771258B TW111100850A TW111100850A TWI771258B TW I771258 B TWI771258 B TW I771258B TW 111100850 A TW111100850 A TW 111100850A TW 111100850 A TW111100850 A TW 111100850A TW I771258 B TWI771258 B TW I771258B
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board
circuit board
function
test
functional
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TW111100850A
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TW202319755A (en
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袁元
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大陸商環鴻電子(昆山)有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The present disclosure provides a circuit board testing method including a testing type defining step, a function board assembling step and a circuit board testing step. In the function board assembling step, the circuit board testing device includes a first function board and a second function board. The first function board includes first probe pins corresponding to first tested points of the circuit board, and the second function board includes second probe pins corresponding to second tested points of the circuit board. One of the first function board and the second function board is chosen and assembled to a base of the circuit board testing device according to the testing type, or the first function board and the second function board are stacked to be disposed at the base of the circuit board testing device. In the circuit board testing step, the circuit board is tested according to the testing type. Therefore, probe pins with different types can be used to lower the cost.

Description

電路板測試方法 Circuit board test method

本發明是有關一種測試裝置及測試方法，且尤其是有關一種電路板測試裝置及電路板測試方法。 The present invention relates to a test device and a test method, and more particularly, to a circuit board test device and a circuit board test method.

技術的進步使得電子產品的使用愈來愈廣泛，且功能愈來愈多，而電子產品所使用之電路板亦愈來愈複雜，且需進行例如在線測試等多種測試，而能確保電路板可正常運作。 The advancement of technology has made the use of electronic products more and more widely, with more and more functions, and the circuit boards used in electronic products are also more and more complex, and various tests such as online testing are required to ensure that the circuit board can be used. working normally.

據此，有業者發展出一種測試裝置，其包含底座及PCB板，底座具有空間可放置電路板，PCB板上的探針對應電路板上的不同測試點位，而可對電路板進行測試。一般而言，PCB板會統一使用最高規格之探針以對應電路板上之電源、地端、無線射頻等不同功能的測試，而使得探針功能溢出，如此容易浪費成本。再者，即便是最高規格之探針，仍會有較適合之測試，而當所有功能的測試均採用同規格的探針，也可能會產生測試不穩的狀況。此外，當單一功能之探針損壞時，需將整個PCB板或測試裝置進行拆卸、更換，而容易造成維修困難及成本提升。 Based on this, a manufacturer has developed a test device, which includes a base and a PCB board. The base has a space for placing the circuit board. The probes on the PCB board correspond to different test points on the circuit board, and the circuit board can be tested. Generally speaking, the PCB board will uniformly use the highest specification probe to correspond to the test of different functions such as power supply, ground terminal, and radio frequency on the circuit board, so that the probe function overflows, so it is easy to waste the cost. Furthermore, even with the highest specification probes, there will still be more suitable tests, and when all functions are tested with the same specifications of the probes, the test may be unstable. In addition, when the probe with a single function is damaged, the entire PCB board or the test device needs to be disassembled and replaced, which is likely to cause difficulty in maintenance and increase in cost.

有鑑於此，如何改善測試裝置的結構，遂成相關業者努力的目標。 In view of this, how to improve the structure of the test device has become the goal of the relevant industry.

依據本發明一實施方式提供一種電路板測試裝置，其包含一底座、一第一功能板以及一第二功能板。底座包含一容置空間及一下開口，容置空間供放置待測之一電路板，下開口連通容置空間。第一功能板組設於底座且對應下開口，第一功能板包含複數第一探針及至少一彈性轉接針，第一探針對應電路板的複數第一測試點位，彈性轉接針與第一探針間隔排列。第二功能板可拆地組設於第一功能板與底座之間且包含複數穿孔及至少一第二探針，穿孔對應第一探針，第二探針對應彈性轉接針且對應電路板的至少一第二測試點位，第二探針的一高度小於各第一探針的一高度。其中，電路板受測時，第二探針抵頂於電路板的第二測試點位，彈性轉接針與第二探針接觸且電性連接，且各第一探針穿過各穿孔以抵頂於電路板的各第一測試點位。 According to an embodiment of the present invention, a circuit board testing device is provided, which includes a base, a first function board, and a second function board. The base includes an accommodating space and a lower opening, the accommodating space is used for placing a circuit board to be tested, and the lower opening communicates with the accommodating space. The first functional board is assembled on the base and corresponds to the lower opening. The first functional board includes a plurality of first probes and at least one elastic transfer pin. The first probe corresponds to a plurality of first test points on the circuit board, and the elastic transfer pin spaced from the first probe. The second functional board is detachably assembled between the first functional board and the base and includes a plurality of perforations and at least one second probe, the perforations correspond to the first probes, the second probes correspond to the elastic transfer pins and correspond to the circuit board At least one second test point, a height of the second probes is smaller than a height of each of the first probes. Wherein, when the circuit board is tested, the second probe is pressed against the second test point of the circuit board, the elastic transfer pin is in contact with the second probe and is electrically connected, and each first probe passes through each through hole to Abut against each first test point of the circuit board.

依據本發明另一實施方式提供一種電路板測試方法，其用以測試放置於一電路板測試裝置中的一電路板，電路板測試方法包含一測試類型決定步驟、一功能板組設步驟以及一電路板受測步驟。於測試類型決定步驟中，決定電路板測試裝置進行之一測試類型。於功能板組設步驟中，電路板測試裝置包含一第一功能板及一第二功能板， 第一功能板包含至少一第一探針用以對應電路板之至少一第一測試點位，第二功能板包含至少一第二探針用以對應電路板之至少一第二測試點位，依測試類型選擇將第一功能板及第二功能板中其中一者組設於電路板測試裝置之一底座，或選擇將第一功能板及第二功能板疊合後組設於電路板測試裝置之底座。於電路板受測步驟中，依測試類型使電路板受測。 According to another embodiment of the present invention, a circuit board testing method is provided, which is used to test a circuit board placed in a circuit board testing device. The circuit board testing method includes a test type determination step, a function board assembly step and a Circuit board tested steps. In the test type determination step, a test type to be performed by the circuit board testing apparatus is determined. In the function board assembly step, the circuit board testing device includes a first function board and a second function board, The first functional board includes at least one first probe for corresponding to at least one first test point of the circuit board, the second functional board includes at least one second probe for corresponding to at least one second test point of the circuit board, According to the test type, one of the first functional board and the second functional board can be assembled on a base of the circuit board testing device, or the first functional board and the second functional board can be stacked and assembled on the circuit board for testing. The base of the device. In the circuit board testing step, the circuit board is tested according to the test type.

100:電路板測試裝置 100: Circuit board test device

110:第一功能板 110: The first function board

111:第一探針 111: First probe

112:彈性轉接針 112: Elastic transfer pin

113:第一本體 113: The first body

114:頂部持位件 114: Top Holder

115:底部持位件 115: Bottom holder

120:第二功能板 120: Second function board

121:穿孔 121: perforation

122:第二探針 122: Second probe

123:第二本體 123: The second body

130:第三功能板 130: The third function board

131:第三探針 131: The third probe

140:第四功能板 140: Fourth function board

141:金屬本體 141: Metal body

142:讓位孔 142: Make way for holes

143:吸波膠 143: Absorber

150:上蓋 150: upper cover

160:壓板 160: Platen

170:螺件 170: Screws

180:底座 180: base

190:PCB板 190:PCB board

200:電路板測試方法 200: Circuit Board Test Methods

210:測試類型決定步驟 210: Test Type Determination Steps

220:功能板組設步驟 220: Function board assembly steps

230:電路板受測步驟 230: Test steps of the circuit board

C1:電路板 C1: circuit board

C11:第一測試點位 C11: The first test point

C12:第二測試點位 C12: The second test point

M1:電壓電流系統 M1: Voltage Current System

S1:容置空間 S1: accommodating space

第1圖繪示依據本發明一實施例之一種電路板測試裝置的立體示意圖；第2圖繪示第1圖實施例之電路板測試裝置與一電路板的部分剖視示意圖；第3圖繪示第1圖實施例之一第三功能板與一電壓電流系統的俯視示意圖；第4圖繪示第1圖實施例之一第四功能板的俯視示意圖；以及第5圖繪示依據本發明另一實施例之一種電路板測試方法的步驟方塊圖。 FIG. 1 is a schematic perspective view of a circuit board testing device according to an embodiment of the present invention; FIG. 2 is a schematic partial cross-sectional view of the circuit board testing device and a circuit board according to the embodiment of FIG. 1 ; FIG. 3 Figure 1 shows a schematic top view of a third functional board and a voltage-current system according to the embodiment of Figure 1; Figure 4 shows a schematic top view of a fourth functional board according to the embodiment of Figure 1; and Figure 5 shows a schematic diagram according to the present invention A block diagram of steps of a circuit board testing method according to another embodiment.

請參閱第1圖及第2圖，其中第1圖繪示依據本發明一實施例之一種電路板測試裝置100的立體示意圖， 第2圖繪示第1圖實施例之電路板測試裝置100與一電路板C1的部分剖視示意圖。電路板測試裝置100包含一底座180、一第一功能板110以及一第二功能板120。底座180包含一容置空間S1及一下開口(未繪示)，容置空間S1供放置待測之一電路板C1，下開口連通容置空間S1。第一功能板110組設於底座180且對應下開口，第一功能板110包含複數第一探針111及至少一彈性轉接針112，第一探針111分別對應電路板C1的複數第一測試點位C11，彈性轉接針112與第一探針111間隔排列。第二功能板120可拆地組設於第一功能板110與底座180之間且包含複數穿孔121及至少一第二探針122，各穿孔121對應各第一探針111，第二探針122對應彈性轉接針112且對應電路板C1的至少一第二測試點位C12，第二探針122的一高度小於各第一探針111的一高度。其中，電路板C1受測時，第二探針122抵頂於電路板C1的第二測試點位C12，彈性轉接針112與第二探針122接觸且電性連接，且各第一探針111穿過各穿孔121以抵頂於電路板C1的第一測試點位C11。 Please refer to FIG. 1 and FIG. 2, wherein FIG. 1 is a three-dimensional schematic diagram of a circuit board testing apparatus 100 according to an embodiment of the present invention, FIG. 2 is a schematic partial cross-sectional view of the circuit board testing apparatus 100 and a circuit board C1 according to the embodiment of FIG. 1 . The circuit board testing apparatus 100 includes a base 180 , a first functional board 110 and a second functional board 120 . The base 180 includes an accommodating space S1 and a lower opening (not shown). The accommodating space S1 is used for placing a circuit board C1 to be tested, and the lower opening communicates with the accommodating space S1. The first functional board 110 is assembled on the base 180 and corresponds to the lower opening. The first functional board 110 includes a plurality of first probes 111 and at least one elastic transfer pin 112 , and the first probes 111 correspond to a plurality of first probes 111 on the circuit board C1 respectively. At the test point C11, the elastic transfer pins 112 and the first probe pins 111 are arranged at intervals. The second functional board 120 is detachably assembled between the first functional board 110 and the base 180 and includes a plurality of through holes 121 and at least one second probe 122 . Each through hole 121 corresponds to each first probe 111 and the second probe 122 corresponds to the elastic transfer pins 112 and corresponds to at least one second test point C12 of the circuit board C1 , and a height of the second probes 122 is smaller than a height of each of the first probes 111 . Wherein, when the circuit board C1 is tested, the second probes 122 abut against the second test point C12 of the circuit board C1, the elastic transfer pins 112 are in contact with the second probes 122 and are electrically connected, and each of the first probes The needles 111 pass through the through holes 121 to abut against the first test point C11 of the circuit board C1.

藉此，透過第二功能板120之穿孔121可讓第一探針111穿過而與第一測試點位C11接觸，且透過第一功能板110之彈性轉接針112的轉接可使第二探針122與下方的PCB板190電性導通，如此第一探針111可使用適合於第一測試點位C11之規格或是其專用的探針，第二探針122可使用適合於第二測試點位C12之規格或是其 專用的探針，且可達到成本降低及維修容易之優點。後面將詳述電路板測試裝置100的細節。 In this way, the first probe 111 can pass through the through hole 121 of the second functional board 120 to make contact with the first test point C11, and the first probe 111 can be connected through the elastic transfer pin 112 of the first functional board 110 to make the first probe 111 pass through. The two probes 122 are electrically connected to the lower PCB board 190, so that the first probe 111 can use the specification suitable for the first test point C11 or its dedicated probe, and the second probe 122 can use the probe suitable for the first test point C11. 2. The specification of test point C12 or its Dedicated probe, and can achieve the advantages of cost reduction and easy maintenance. Details of the circuit board testing apparatus 100 will be described in detail later.

電路板測試裝置100可更包含一上蓋150、一壓板160以及一PCB板190，上蓋150可掀地蓋設於底座180，壓板160設置於上蓋150的下表面，PCB板190組設於第一功能板110遠離第二功能板120的一側。當電路板C1置於容置空間S1後，上蓋150蓋合，壓板160將電路板C1下壓，即可使第一探針111抵頂接觸第一測試點位C11，及使第二探針122抵頂接觸第二測試點位C12，並進行測試。其中，上蓋150、壓板160以及PCB板190為習知且並非本案之改良重點，細節不再贅述。 The circuit board testing device 100 may further include an upper cover 150 , a pressing plate 160 and a PCB board 190 . The upper cover 150 can be flipped to cover the base 180 , the pressing plate 160 is arranged on the lower surface of the upper cover 150 , and the PCB board 190 is assembled on the first A side of the function board 110 away from the second function board 120 . After the circuit board C1 is placed in the accommodating space S1, the upper cover 150 is closed, and the pressing plate 160 presses the circuit board C1 down, so that the first probes 111 can be pressed against the first test point C11, and the second probes 122 abuts against the second test point C12 and performs the test. Among them, the upper cover 150 , the pressing plate 160 and the PCB board 190 are conventional and not the focus of improvement in this case, and details will not be repeated here.

第一功能板110可包含一第一本體113，第二功能板120亦可包含一第二本體123，第一本體113的面寬及第二本體123的面寬與底座180的面寬相同，也就是說，第一本體113、第二本體123及底座180的長寬均相同，而第一本體113可使用絕緣性能好、結構穩定且變形量小之塑鋼材質製成，然不以此為限。 The first function board 110 may include a first body 113 , and the second function board 120 may also include a second body 123 . The surface width of the first body 113 and the surface width of the second body 123 are the same as the surface width of the base 180 . That is to say, the lengths and widths of the first body 113 , the second body 123 and the base 180 are the same, and the first body 113 can be made of plastic steel material with good insulation performance, stable structure and small deformation. limit.

第一探針111及彈性轉接針112均是穿設於第一本體113，而使第一探針111的上下端及彈性轉接針112的上下端均外露，第一探針111是使用適用於測試開短路之探針類型且亦可具有彈簧針結構，故其受壓後可略為壓縮以避免PCB板190及電路板C1受損。第二探針122是穿設於第二本體123而使其上下端均外露，且第二探針122是使用適用於測試無線射頻之探針類型並亦具有彈簧 針結構，穿孔121則是縱向貫穿第二本體123。在結構配置上，彈性轉接針112的上端高度可低於第一探針111的上端高度，故當第二探針122下壓與彈性轉接針112抵接時，第一探針111的上端可穿過穿孔121並與第一測試點位C11接觸，而能進行測試。 The first probe 111 and the elastic transfer pin 112 are both passed through the first body 113, so that the upper and lower ends of the first probe 111 and the upper and lower ends of the elastic transfer pin 112 are exposed. The first probe 111 is used for The probe type is suitable for testing open and short circuits and can also have a pogo pin structure, so it can be slightly compressed after being pressed to avoid damage to the PCB board 190 and the circuit board C1. The second probe 122 is passed through the second body 123 so that the upper and lower ends are exposed, and the second probe 122 is a probe type suitable for testing radio frequency and also has a spring In the needle structure, the perforation 121 penetrates the second body 123 longitudinally. In terms of structural configuration, the height of the upper end of the elastic transfer needle 112 can be lower than the height of the upper end of the first probe needle 111 , so when the second probe needle 122 is pressed down against the elastic transfer needle 112 , the height of the first probe needle 111 The upper end can pass through the through hole 121 and be in contact with the first test point C11 so that the test can be performed.

在其他實施例中，第一功能板可包含一第一上本體及一第一下本體，第一上本體設置於第一下本體的上方且包含複數上貫孔。第一探針中之一部分可具有上錫探針結構且穿設於第一下本體，並可再穿過第一上本體的上貫孔而使其上端外露；彈性轉接針亦可穿設於第一下本體，並可再穿過第一上本體的上貫孔而使上端外露；此外，第一探針中之另一部分可具有鍍金探針結構且設置於第一上本體，並穿過第一下本體的下貫孔而使其下端外露抵接PCB板，如此可組設成具有不同探針結構的第一功能板，而可更適用於不同之測試類型，同時具有維修容易之優點，然本發明不以此為限。 In other embodiments, the first function board may include a first upper body and a first lower body, and the first upper body is disposed above the first lower body and includes a plurality of upper through holes. A part of the first probe can have an upper tin probe structure and penetrate through the first lower body, and can pass through the upper through hole of the first upper body to expose the upper end; the elastic transfer pin can also be penetrated on the first lower body, and can pass through the upper through hole of the first upper body to expose the upper end; in addition, another part of the first probe can have a gold-plated probe structure and is disposed on the first upper body, and penetrates through the first upper body. Through the lower through hole of the first lower body, the lower end is exposed to contact the PCB board, so that the first functional board with different probe structures can be assembled, which is more suitable for different test types, and has the advantages of easy maintenance. However, the present invention is not limited to this.

又，第一功能板110可更包含一頂部持位件114以及一底部持位件115，頂部持位件114可抵頂於第一功能板110與第二功能板120之間，底部持位件115可抵頂於第一功能板110與PCB板190之間，而頂部持位件114及底部持位件115可具有柱狀彈簧結構。 In addition, the first functional board 110 may further include a top holding member 114 and a bottom holding member 115 , the top holding member 114 can abut between the first functional board 110 and the second functional board 120 , and the bottom holding member 114 The member 115 can abut between the first functional board 110 and the PCB board 190 , and the top holding member 114 and the bottom holding member 115 can have a columnar spring structure.

具體而言，如第1圖及第2圖所示，PCB板190、第一功能板110及第二功能板120透過螺件170由下而上依序與底座180組裝置，螺件170之一部分具有螺紋能 鎖入底座180，其餘未有螺紋的部分可供PCB板190、第二功能板120及第一功能板110做小部分的上下位移，此螺件170亦非本案之改良重點，不再贅述。 Specifically, as shown in FIG. 1 and FIG. 2 , the PCB board 190 , the first functional board 110 and the second functional board 120 are sequentially assembled with the base 180 through the screws 170 from bottom to top. part with thread energy Locked into the base 180 , the rest of the unthreaded portion can be used for small up and down displacement of the PCB board 190 , the second functional board 120 and the first functional board 110 .

在上蓋150未蓋上前，透過頂部持位件114與底部持位件115的支撐，第一功能板110可被定位於PCB板190與第二功能板120之間，此時第一探針111未穿過第二功能板120的穿孔121，而彈性轉接針112可以是與第二探針122抵接或未抵接。當上蓋150蓋上後，壓板160下壓電路板C1，電路板C1朝下位移，此時頂部持位件114與底部持位件115被壓縮，如此可容許第一功能板110的第一探針111穿過第二功能板120的穿孔121，並容許第二探針122接觸壓縮彈性轉接針112，第一測試點位C11及第二測試點位C12即可分別透過第一探針111及第二探針122與PCB板190電性導通並開始受測，然不以此為限。 Before the upper cover 150 is closed, the first functional board 110 can be positioned between the PCB board 190 and the second functional board 120 through the support of the top holding member 114 and the bottom holding member 115 . At this time, the first probe The 111 does not pass through the through hole 121 of the second functional board 120 , and the elastic transfer needle 112 may or may not be in contact with the second probe 122 . After the upper cover 150 is closed, the pressing plate 160 presses the circuit board C1, and the circuit board C1 is displaced downward. At this time, the top holding member 114 and the bottom holding member 115 are compressed, which allows the first function board 110 The probes 111 pass through the through holes 121 of the second functional board 120 and allow the second probes 122 to contact the compressive elastic transfer pins 112. The first test point C11 and the second test point C12 can respectively pass through the first probe 111 and the second probe 122 are electrically connected to the PCB board 190 and begin to be tested, but not limited to this.

請參閱第3圖，並一併參閱第1圖，其中第3圖繪示第1圖實施例之一第三功能板130與一電壓電流系統M1的俯視示意圖。電路板測試裝置100可更包含一第三功能板130，第三功能板130包含至少一第三探針131用以對應電路板C1之至少一第三測試點位(未繪示)，第三探針131的數量可依實際需求做變更，不以此限制本發明。為了符合不同需求，可針對電路板C1本身需要的特殊電流電壓設定，使用不同規格的探針類型，故於本實施例中，是針對特殊電壓電流配置成第三功能板130，採用特 定規格的第三探針131以供電壓電流輸入，並可進一步電性連接至一電壓電流系統M1，對電流電壓進行異常的監控，同時也可以實現穩壓的效果。在操作時，可將第三功能板130單獨組設於底座180與PCB板190之間，並讓電路板C1開始受測。 Please refer to FIG. 3 together with FIG. 1 , wherein FIG. 3 is a schematic top view of a third functional board 130 and a voltage-current system M1 according to the embodiment of FIG. 1 . The circuit board testing device 100 may further include a third function board 130, the third function board 130 includes at least one third probe 131 corresponding to at least a third test point (not shown) of the circuit board C1, the third The number of the probes 131 can be changed according to actual needs, which does not limit the present invention. In order to meet different requirements, probe types of different specifications can be used for the special current and voltage settings required by the circuit board C1. Therefore, in this embodiment, the third function board 130 is configured for the special voltage and current, using special The third probe 131 of a certain specification is used for voltage and current input, and can be further electrically connected to a voltage and current system M1 to monitor abnormal current and voltage, and at the same time, it can also achieve the effect of voltage regulation. During operation, the third functional board 130 can be separately assembled between the base 180 and the PCB board 190, and the circuit board C1 can be tested.

請參閱第4圖，並一併參閱第1圖，其中第4圖繪示第1圖實施例之一第四功能板140的俯視示意圖。電路板測試裝置100可更包含一第四功能板140，第四功能板140可包含一金屬本體141、複數讓位孔142及複數吸波膠143，讓位孔142彼此間隔且貫穿金屬本體141，而各吸波膠143填充於各讓位孔142。第四功能板140是用以進行訊號遮罩，且可依據實際之佈局、遮罩能力需求等進行配置，不以上述揭露為限。在組合第四功能板140時，可以讓第四功能板140位於PCB板190的上方，第四功能板140可與PCB板190的外殼鎖緊以接地短路，而PCB板190上的探針可例如加裝絕緣套，故PCB板190上的探針穿過讓位孔142時不會與吸波膠143接觸，而不會影響訊號的傳輸，且透過吸波膠143可增加訊號的屏蔽功能。 Please refer to FIG. 4 together with FIG. 1 , wherein FIG. 4 is a schematic top view of a fourth function board 140 according to the embodiment of FIG. 1 . The circuit board testing device 100 may further include a fourth function board 140 , and the fourth function board 140 may include a metal body 141 , a plurality of escape holes 142 and a plurality of absorbing glues 143 , and the escape holes 142 are spaced apart from each other and penetrate through the metal body 141 . , and each absorbing glue 143 is filled in each vacant hole 142 . The fourth function board 140 is used for signal masking, and can be configured according to the actual layout, masking capability requirements, etc., and is not limited to the above disclosure. When assembling the fourth functional board 140, the fourth functional board 140 can be located above the PCB board 190, the fourth functional board 140 can be locked with the shell of the PCB board 190 to short-circuit the ground, and the probes on the PCB board 190 can be For example, by adding an insulating cover, the probes on the PCB board 190 will not contact the absorbing glue 143 when they pass through the vacant holes 142, and will not affect the transmission of the signal, and the shielding function of the signal can be increased through the absorbing glue 143 .

由於電路板測試裝置100包含第一功能板110、第二功能板120、第三功能板130及第四功能板140等，而能選擇不同測試類型，測試類型可為一軟體以及文件燒錄測試(OS)、一在線開短路測試(ICT)、一功能測試(FCT)或一無線射頻測試。例如，可用第一功能板110及第二功 能板120疊合以進行軟體以及文件燒錄測試；可以僅用第一功能板110進行在線開短路測試；可以僅用第三功能板130進行在線開路短路測試或功能測試；或者，可使用第三功能板130、第二功能板120及第四功能板140疊合以進行無線射頻測試，且第二功能板120的穿孔121可進一步供第三功能板130上的第三探針131穿過以接觸PCB板190，第三功能板130上可更包含孔洞讓第二功能板120上的第二探針122穿過以接觸電路板C1，然不以上述揭露為限。 Since the circuit board testing apparatus 100 includes the first functional board 110, the second functional board 120, the third functional board 130, and the fourth functional board 140, etc., different test types can be selected, and the test type can be a software or file programming test (OS), an in-circuit open-short test (ICT), a functional test (FCT) or a radio frequency test. For example, the first functional board 110 and the second functional board can be used The power boards 120 are superimposed to perform software and file programming tests; only the first functional board 110 can be used for online open-short circuit testing; only the third functional board 130 can be used for online open-circuit short-circuit testing or functional testing; The three-function board 130 , the second-function board 120 and the fourth-function board 140 are superimposed for radio frequency testing, and the through holes 121 of the second-function board 120 can further allow the third probes 131 on the third-function board 130 to pass through In order to contact the PCB board 190 , the third functional board 130 may further include holes for allowing the second probes 122 on the second functional board 120 to pass through to contact the circuit board C1 , but the disclosure is not limited to the above.

請參閱第5圖，並一併參閱第1圖至第4圖，其中第5圖繪示依據本發明另一實施例之一種電路板測試方法200的步驟方塊圖，以下將搭配電路板測試裝置100說明電路板測試方法200的細節。電路板測試方法200用以測試放置於一電路板測試裝置100中的一電路板C1，電路板測試方法200包含一測試類型決定步驟210、一功能板組設步驟220以及一電路板受測步驟230。 Please refer to FIG. 5, and also refer to FIGS. 1 to 4, wherein FIG. 5 shows a block diagram of steps of a circuit board testing method 200 according to another embodiment of the present invention, and the circuit board testing apparatus will be used below. 100 illustrates the details of circuit board testing method 200 . The circuit board testing method 200 is used to test a circuit board C1 placed in a circuit board testing apparatus 100 . The circuit board testing method 200 includes a test type determination step 210 , a function board assembly step 220 and a circuit board testing step 230.

於測試類型決定步驟210中，決定電路板測試裝置100進行之一測試類型。 In the test type determination step 210, a test type to be performed by the circuit board testing apparatus 100 is determined.

於功能板組設步驟220中，電路板測試裝置100包含面寬相同之一第一功能板110及一第二功能板120，第一功能板110包含至少一第一探針111用以對應電路板C1之至少一第一測試點位C11，第二功能板120包含至少一第二探針122用以對應電路板C1之至少一第二測試點位C12，依測試類型選擇將第一功能板110及第二功能 板120中其中一者組設於電路板測試裝置100之一底座180，或選擇將第一功能板110及第二功能板120疊合後組設於電路板測試裝置100之底座180。 In the function board assembling step 220, the circuit board testing apparatus 100 includes a first function board 110 and a second function board 120 with the same surface width, and the first function board 110 includes at least one first probe 111 for corresponding circuits At least one first test point C11 of the board C1, the second function board 120 includes at least one second probe 122 corresponding to at least one second test point C12 of the circuit board C1, and the first function board is selected according to the test type. 110 and the second function One of the boards 120 is assembled on a base 180 of the circuit board testing apparatus 100 , or alternatively, the first functional board 110 and the second functional board 120 are stacked and assembled on the base 180 of the circuit board testing apparatus 100 .

於電路板受測步驟230中，依測試類型使電路板C1受測，測試類型可為軟體以及文件燒錄測試、在線開短路測試、功能測試或無線射頻測試。 In the circuit board testing step 230, the circuit board C1 is tested according to the test type, and the test type may be software and file programming test, online open-short circuit test, functional test or radio frequency test.

仔細而言，若於測試類型決定步驟210中選擇進行軟體以及文件燒錄測試，則於功能板組設步驟220中，可選擇疊設第一功能板110及第二功能板120，而將第一功能板110及第二功能板120疊合後組設於電路板測試裝置100之底座180時，第一功能板110的第一探針111對應第二功能板120的穿孔121，第一功能板110的彈性轉接針112對應第二功能板120的第二探針122。如此，在電路板受測步驟230中，第一功能板110的第一探針111可穿過第二功能板120的穿孔121使第一測試點位C11與PCB板190電性導通，即使第二測試點位C12透過第二功能板120的第二探針122、第一功能板110的彈性轉接針112與PCB板190電性導通。 Specifically, if software and file programming tests are selected in the test type determination step 210, in the function board assembly step 220, the first function board 110 and the second function board 120 can be selected to be stacked, and the first function board 110 and the second function board 120 can be stacked. When a functional board 110 and a second functional board 120 are stacked and assembled on the base 180 of the circuit board testing device 100 , the first probes 111 of the first functional board 110 correspond to the through holes 121 of the second functional board 120 . The elastic transfer pins 112 of the board 110 correspond to the second probe pins 122 of the second functional board 120 . In this way, in the circuit board testing step 230, the first probe 111 of the first functional board 110 can pass through the through hole 121 of the second functional board 120 to make the first test point C11 and the PCB board 190 electrically connected, even if the first test point C11 is electrically connected to the PCB board 190. The two test points C12 are electrically connected to the PCB board 190 through the second probes 122 of the second functional board 120 and the elastic transfer pins 112 of the first functional board 110 .

又，電路板測試裝置100包含第三功能板130及第四功能板140，第三功能板130包含第三探針131用以對應電路板C1之第三測試點位，第四功能板140包含讓位孔142，是以，若於測試類型決定步驟210中選擇進行無線射頻測試，則於功能板組設步驟220中，可將第三功能板130、第二功能板120及第四功能板140依序疊合組 設於電路板測試裝置100之底座180。 In addition, the circuit board testing apparatus 100 includes a third function board 130 and a fourth function board 140 , the third function board 130 includes a third probe 131 corresponding to the third test point of the circuit board C1 , and the fourth function board 140 includes The hole 142 makes way for the third function board 130 , the second function board 120 and the fourth function board in the function board assembly step 220 if the radio frequency test is selected in the test type determination step 210 . 140 sequential stacks Set on the base 180 of the circuit board testing apparatus 100 .

據此，電路板測試裝置100可依據測試類型選擇所欲組裝之功能板(第一功能板110、第二功能板120、第三功能板130及第四功能板140)，並快速更換功能板，而可提升測試效率。再者，透過各獨立的功能板，可分別設置不同的探針類型，配合不同的測試功能，同時可降低成本並容易保養。此外，還可利用交叉驗證的方式，快速確定是何者出現的故障，而能便於更換及維護。 Accordingly, the circuit board testing apparatus 100 can select the functional boards to be assembled (the first functional board 110 , the second functional board 120 , the third functional board 130 and the fourth functional board 140 ) according to the test type, and quickly replace the functional boards , which can improve the test efficiency. Furthermore, through each independent function board, different probe types can be set up to match different test functions, and at the same time, the cost can be reduced and maintenance is easy. In addition, the cross-validation method can be used to quickly determine which fault has occurred, which can facilitate replacement and maintenance.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the appended patent application.

200:電路板測試方法 200: Circuit Board Test Methods

210:測試類型決定步驟 210: Test Type Determination Steps

220:功能板組設步驟 220: Function board assembly steps

230:電路板受測步驟 230: Test steps of the circuit board

Claims (5)

一種電路板測試方法，用以測試放置於一電路板測試裝置中的一電路板，該電路板測試方法包含：一測試類型決定步驟，決定該電路板測試裝置進行之一測試類型；一功能板組設步驟，該電路板測試裝置包含一第一功能板及一第二功能板，該第一功能板包含至少一第一探針用以對應該電路板之至少一第一測試點位，該第二功能板包含至少一第二探針用以對應該電路板之至少一第二測試點位，依該測試類型選擇將該第一功能板及該第二功能板中其中一者組設於該電路板測試裝置之一底座，或選擇將該第一功能板及該第二功能板疊合後組設於該電路板測試裝置之該底座；以及一電路板受測步驟，依該測試類型使該電路板受測。 A circuit board testing method for testing a circuit board placed in a circuit board testing device, the circuit board testing method comprising: a test type determination step for determining a test type performed by the circuit board testing device; a functional board In the assembly step, the circuit board testing device includes a first function board and a second function board, the first function board includes at least one first probe for corresponding to at least one first test point of the circuit board, the The second function board includes at least one second probe for corresponding to at least one second test point of the circuit board. According to the test type, one of the first function board and the second function board is selected to be assembled on the A base of the circuit board testing device, or the first functional board and the second functional board are selected to be stacked on the base of the circuit board testing device; and a circuit board testing step, according to the test type Put the board under test. 如請求項1所述之電路板測試方法，其中，該測試類型為一軟體以及文件燒錄測試、一在線開短路測試、一功能測試或一無線射頻測試。 The circuit board test method of claim 1, wherein the test type is a software and file programming test, an online open-short test, a functional test, or a radio frequency test. 如請求項1所述之電路板測試方法，其中，於該功能板組設步驟中，將該第一功能板及該第二功能板疊合後組設於該電路板測試裝置之該底座時，該第一功能板的該至少一第一探針對應該第二功能板的至少一穿孔，該第一功能板的至少一彈性轉接針對應該第二功能板的該 至少一第二探針。 The circuit board testing method according to claim 1, wherein in the function board assembling step, when the first function board and the second function board are stacked and assembled on the base of the circuit board testing device , the at least one first probe of the first functional board corresponds to at least one through hole of the second functional board, and the at least one elastic switch of the first functional board corresponds to the at least one second probe. 如請求項1所述之電路板測試方法，其中，該電路板測試裝置更包含一第三功能板及一第四功能板，該第三功能板包含至少一第三探針用以對應該電路板之至少一第三測試點位，該第四功能板包含複數讓位孔，於該功能板組設步驟中，依該測試類型選擇將該第三功能板、該第二功能板及該第四功能板依序疊合組設於該電路板測試裝置之該底座。 The circuit board testing method of claim 1, wherein the circuit board testing device further comprises a third functional board and a fourth functional board, the third functional board comprises at least one third probe for corresponding to the circuit At least one third test point of the board, the fourth function board includes a plurality of escape holes, and in the function board assembly step, the third function board, the second function board and the first function board are selected according to the test type. The four-function boards are sequentially stacked and assembled on the base of the circuit board testing device. 如請求項4所述之電路板測試方法，其中，該第四功能板更包含複數吸波膠，各該吸波膠填充於各該讓位孔。 The circuit board testing method according to claim 4, wherein the fourth functional board further comprises a plurality of absorbing glues, and each of the absorbing glues is filled in each of the vacant holes.
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