TWI770555B - Chamber cooling unit for heat treatment furnaces - Google Patents

Chamber cooling unit for heat treatment furnaces Download PDF

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TWI770555B
TWI770555B TW109123345A TW109123345A TWI770555B TW I770555 B TWI770555 B TW I770555B TW 109123345 A TW109123345 A TW 109123345A TW 109123345 A TW109123345 A TW 109123345A TW I770555 B TWI770555 B TW I770555B
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chamber
cooling
heat treatment
treatment furnace
substrate
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TW202146830A (en
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金珉哲
中西識
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南韓商光洋熱系統韓國股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00—Casings; Linings; Walls; Roofs
    • F27D1/12—Casings; Linings; Walls; Roofs incorporating cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06—Chambers, containers, or receptacles
    • F26B25/08—Parts thereof
    • F26B25/12—Walls or sides; Doors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mathematical Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Furnace Details (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Tunnel Furnaces (AREA)

Abstract

本發明揭示熱處理爐的腔室冷卻單元。本發明的熱處理爐的腔室冷卻單元包括：熱處理爐，其具有為了加熱或乾燥基板而容納基板的腔室，所述腔室內安裝有由加熱器組成的發熱體，藉以利用所述加熱器的熱對基板進行加熱或者乾燥；冷卻氣流通道，其沿著所述腔室的內外部盒體形成：以及至少一個冷卻外套，其以垂直方向位於所述腔室的外側面，藉以在所述腔室內側形成的所述冷卻氣流通道中形成冷卻氣流。The present invention discloses a chamber cooling unit of a heat treatment furnace. The chamber cooling unit of the heat treatment furnace of the present invention includes a heat treatment furnace having a chamber for accommodating a substrate in order to heat or dry the substrate, and a heat generating body composed of a heater is installed in the chamber to utilize the heating effect of the heater. heat to heat or dry the substrate; cooling airflow channels formed along the inner and outer boxes of the chamber; and at least one cooling jacket located on the outer side of the chamber in a vertical direction, whereby the chamber is A cooling airflow is formed in the cooling airflow channel formed on the indoor side.

Description

熱處理爐的腔室冷卻單元Chamber cooling unit for heat treatment furnaces

本發明是關於一種有效地冷卻熱處理爐腔室的熱處理爐的腔室冷卻單元。The present invention relates to a chamber cooling unit of a heat treatment furnace that effectively cools the heat treatment furnace chamber.

有機發光顯示裝置及LCD玻璃基板等正在圖像屏幕、TV、手機、顯示器等各種圖像裝置中使用。有機發光顯示裝置及LCD玻璃基板等作為下一代顯示器之一正用於各種領域，近來，為了提高性能和收率，該領域平板顯示器製造技術的開發正在不斷地進行。Organic light-emitting display devices, LCD glass substrates, and the like are used in various image devices such as image screens, TVs, mobile phones, and monitors. Organic light-emitting display devices, LCD glass substrates, and the like are being used in various fields as one of the next-generation displays, and recently, in order to improve performance and yield, development of flat panel display manufacturing technologies in this field has been progressing.

製造作為典型的平板顯示器的有機發光顯示裝置或LCD玻璃基板（以下稱基板或者玻璃基板）的過程中，溫度控制和溫度均勻性是確保優質的基板質量和收率必不可少的。In the process of manufacturing organic light emitting display devices or LCD glass substrates (hereinafter referred to as substrates or glass substrates), which are typical flat panel displays, temperature control and temperature uniformity are essential to ensure excellent substrate quality and yield.

例如，在有機發光顯示裝置的製造工藝中，由於在基板表面形成有機物層，可能會包含一定量的水分，因此需要進行用於蒸發水分的乾燥工藝。For example, in the manufacturing process of the organic light-emitting display device, since the organic layer is formed on the surface of the substrate, it may contain a certain amount of moisture, so a drying process for evaporating the moisture is required.

LCD玻璃基板製造工藝中，在基板表面上塗布感光膜之前進行清洗過程，而在清洗過程之後執行用於去除水分的加熱乾燥工藝。In the LCD glass substrate manufacturing process, a cleaning process is performed before the photosensitive film is coated on the surface of the substrate, and a heating and drying process for removing moisture is performed after the cleaning process.

此外，將感光膜塗布到LCD玻璃基板上之後執行曝光及顯影工藝。該曝光及顯影工藝之前和之後依序執行預烘乾（pre-baking）和後烘乾（post-baking）工藝。In addition, exposure and development processes are performed after the photosensitive film is coated on the LCD glass substrate. A pre-baking and a post-baking process are sequentially performed before and after the exposure and development process.

如此，基板製造工藝的大部分執行加熱及乾燥工藝，以此來製造基板。在基板製造工藝中產生的水分可通過紫外線或放入包括加熱器（sheath heater）等發熱體的熱處理爐的腔室內經加熱乾燥後去除。As such, most of the substrate manufacturing process performs a heating and drying process to manufacture the substrate. Moisture generated in the substrate manufacturing process can be removed by ultraviolet rays or heating and drying in a chamber of a heat treatment furnace including a heat-generating body such as a heater (sheath heater).

韓國授權專利公報第10-2094763號中已提出與此有關的基板的熱處理爐。A heat treatment furnace for a substrate related to this has been proposed in Korean Patent Publication No. 10-2094763.

但是，現有的熱處理爐雖然在腔室利用加熱器系統去除基板上殘留的水分，但是難以有效地控制腔室的高溫、因此提高批量生成的產品品質受到限制，不能充分滿足高性能的工藝能力。However, although the existing heat treatment furnace uses a heater system in the chamber to remove the moisture remaining on the substrate, it is difficult to effectively control the high temperature of the chamber. Therefore, the quality of products produced in batches is limited, and the high-performance process capability cannot be fully satisfied.

此外，現有的熱處理爐為了藉由縮短工藝時間來提高產品的生產效率，在腔室冷卻時，在迅速降低溫度的同時結構上滿足腔室的耐久性的方面存在局限性。In addition, in order to improve the production efficiency of products by shortening the process time, the conventional heat treatment furnaces have limitations in that the temperature of the chamber can be rapidly lowered while the durability of the chamber can be satisfied structurally.

因此，當前需要一種性能得到改善的熱處理爐，其滿足包括平板顯示器基板的熱處理工藝趨勢的變化在內的要求性能升級的用戶要求。Therefore, there is currently a need for a heat treatment furnace with improved performance that meets user requirements for performance upgrades including changes in heat treatment process trends for flat panel display substrates.

本發明要解決的一技術問題是，提供一種滿足基板的熱處理工藝性能的熱處理爐。A technical problem to be solved by the present invention is to provide a heat treatment furnace that satisfies the heat treatment process performance of the substrate.

本發明要解決的一技術問題是，提供一種縮短熱處理基板的熱處理工藝時間且結構上能夠加強腔室耐久性的熱處理爐。A technical problem to be solved by the present invention is to provide a heat treatment furnace capable of shortening the heat treatment process time of the heat treatment substrate and structurally enhancing the durability of the chamber.

根據本發明，所述目的可藉由熱處理爐的腔室冷卻單元來實現，所述冷卻單元包括：熱處理爐，其具有為了加熱或乾燥基板而容納基板的腔室，所述腔室內安裝有由加熱器組成的發熱體，藉以利用所述加熱器的熱對基板進行加熱或者乾燥；冷卻氣流通道，其沿著所述腔室的內外部盒體形成：以及至少一個冷卻外套，其以垂直方向位於所述腔室的外側面，藉以在所述腔室內側形成的所述冷卻氣流通道中形成冷卻氣流。According to the present invention, the object can be achieved by a chamber cooling unit of a heat treatment furnace, the cooling unit comprising: a heat treatment furnace having a chamber for accommodating the substrates for heating or drying the substrates, in which chambers are installed a heating body composed of a heater, so as to use the heat of the heater to heat or dry the substrate; a cooling airflow channel, which is formed along the inner and outer boxes of the chamber; and at least one cooling jacket, which is arranged in a vertical direction It is located on the outer side of the chamber, thereby forming a cooling airflow in the cooling airflow channel formed on the inner side of the chamber.

根據本發明的實施例，沿著所述腔室的內外部盒體形成的冷卻氣流通道可包括冷卻水管道。According to an embodiment of the present invention, the cooling air flow channels formed along the inner and outer boxes of the chamber may include cooling water pipes.

根據本發明的實施例，所述冷卻氣流通道包括：第一通道部，其形成在所述腔室的外部盒體和與其相隔的內部盒體之間；以及第二通道部，其將由所述冷卻外套形成的冷卻氣流導入所述第一通道部，並排出從所述第一通道部排出的流體。According to an embodiment of the present invention, the cooling airflow channel includes: a first channel portion formed between an outer case of the chamber and an inner case spaced therefrom; and a second channel portion to be formed by the chamber The cooling airflow formed by the cooling jacket is introduced into the first channel portion, and the fluid discharged from the first channel portion is discharged.

根據本發明的實施例，所述第一通道部和第二通道部可形成為一體型或者獨立型。According to an embodiment of the present invention, the first channel part and the second channel part may be formed as an integral type or an independent type.

根據本發明的實施例，所述第一通道部可分別以水平方向形成於所述腔室的外部盒體和與其相隔的內部盒體的上下部。According to an embodiment of the present invention, the first channel part may be formed in the upper and lower parts of the outer box body of the chamber and the inner box body spaced therefrom in a horizontal direction, respectively.

根據本發明的實施例，所述第一通道部中，冷卻管以內置形式布置在所述腔室的外部盒體和與其相隔的內部盒體之間。According to an embodiment of the present invention, in the first channel portion, the cooling pipe is arranged in a built-in form between the outer box body of the chamber and the inner box body spaced therefrom.

根據本發明的實施例，所述第二通道部可沿著所述腔室的外部盒體和與其相隔的內部盒體的垂直壁面以垂直方向形成。According to an embodiment of the present invention, the second channel portion may be formed in a vertical direction along the vertical wall surfaces of the outer box body of the chamber and the inner box body spaced therefrom.

根據本發明的實施例，所述冷卻外套可沿著所述腔室的垂直方向布置以形成所述腔室的外壁。According to an embodiment of the present invention, the cooling jacket may be arranged along a vertical direction of the chamber to form an outer wall of the chamber.

根據本發明的實施例，所述冷卻外套可沿著所述腔室的垂直方向布置以多個小區單位組裝並形成所述腔室的外壁。According to an embodiment of the present invention, the cooling jacket may be arranged in a vertical direction of the chamber to be assembled in a plurality of cell units and form the outer wall of the chamber.

根據本發明的實施例，所述冷卻外套包括主機殼體，所述主機殼體容納供冷卻水從外部導入並通過的冷卻管，且內部具有形成冷卻氣流藉以沿著所述腔室的冷卻氣流通道供氣的空間，所述主機殼體的上部和下部可分別具有用於導入外部氣體的外部氣體導入口和用於排出冷卻氣流的排氣口。According to an embodiment of the present invention, the cooling jacket includes a main body casing that accommodates a cooling pipe through which cooling water is introduced from the outside and passes, and has a cooling pipe inside to form a cooling airflow along the chamber. The space for supplying air to the cooling airflow channel, the upper and lower parts of the main body housing may respectively have an external air introduction port for introducing external air and an exhaust port for discharging the cooling airflow.

根據本發明的實施例，在與所述腔室面對的主機殼體的內壁垂直壁面上具有多個空氣翼片。According to an embodiment of the present invention, a plurality of air fins are provided on the vertical wall surface of the inner wall of the host housing facing the chamber.

本發明藉由在熱處理爐的腔室內部形成冷卻氣流通道和冷卻管，能夠迅速均勻地管理腔室內部的溫度，藉以具有能夠改善腔室的冷卻性能的效果。The present invention can quickly and uniformly manage the temperature inside the chamber by forming cooling airflow passages and cooling pipes inside the chamber of the heat treatment furnace, thereby having the effect of improving the cooling performance of the chamber.

此外，藉由提高腔室的耐久性，即使在熱處理工藝中反覆出現腔室內溫度急降的條件下也能夠長時間使用腔室，而且可預防腔室的燒損或者正常功能障礙，藉以具有改善熱處理爐的使用安全性及熱處理爐的性能的效果。In addition, by improving the durability of the chamber, the chamber can be used for a long time even under the condition that the temperature in the chamber repeatedly drops rapidly during the heat treatment process, and the burnout of the chamber or normal malfunction of the chamber can be prevented, thereby improving the The use safety of heat treatment furnace and the effect of heat treatment furnace performance.

此外，藉由提高熱處理爐的腔室性能，使得基板的熱處理工藝時間縮減、基板的熱處理生產量增加、基板的熱處理品質得到改善以及能耗效率提高，藉以具有能夠提供符合環保條件的熱處理爐的效果。In addition, by improving the chamber performance of the heat treatment furnace, the heat treatment process time of the substrate is shortened, the heat treatment production volume of the substrate is increased, the heat treatment quality of the substrate is improved, and the energy consumption efficiency is improved, so as to provide a heat treatment furnace that meets environmental protection conditions. Effect.

下面，參照附圖對根據本發明的較佳實施例的熱處理爐腔室的冷卻單元的內容進行具體說明。Hereinafter, the content of the cooling unit of the heat treatment furnace chamber according to the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

通常，熱處理基板的熱處理爐的前側可具有遮擋器，且後側可具有爐門，藉以將待熱處理基板放入腔室內預置的各台或者從腔室搬出熱處理工藝結束的基板。Generally, a heat treatment furnace for heat-treating substrates may have a shutter on the front side, and a furnace door on the rear side, so as to put the substrates to be heat-treated into preset stages in the chamber or remove the substrates after the heat treatment process from the chamber.

此外，熱處理爐具有用於容納待加熱或者乾燥的基板的腔室，腔室內安裝有由加熱器組成的發熱體，藉以可利用從加熱器產生的熱對基板進行加熱或者通過蒸發水分進行乾燥。此外，根據配置會有所不同，但是一般情況下加熱器的上下部設置有與其緊貼的上/下部熱傳遞板，藉以可有效地進行基板加熱工藝。Further, the heat treatment furnace has a chamber for accommodating the substrate to be heated or dried, and a heat generating body composed of a heater is installed in the chamber, whereby the substrate can be heated by heat generated from the heater or dried by evaporating moisture. In addition, it differs depending on the configuration, but generally, the upper and lower parts of the heater are provided with upper/lower heat transfer plates in close contact therewith, whereby the substrate heating process can be efficiently performed.

此外，熱處理爐的腔室的一側具有用於供含有工藝氣體的流體流入的供氣口，以及用於將腔室內流體排出的排氣口，並包括具有用於支撐並托起腔室的支托的框架及與多個匯流條連接的導電部。所述匯流條與加熱器的發熱線連接以導通電流。In addition, one side of the chamber of the heat treatment furnace has a gas supply port for inflow of the fluid containing the process gas, and an exhaust port for discharging the fluid in the chamber, and includes a gas supply port for supporting and holding up the chamber. The frame of the support and the conductive part connected with the plurality of bus bars. The bus bar is connected with the heating wire of the heater to conduct current.

另外，熱處理爐為了去除基板的熱處理工藝中基板上殘留的水分，腔室內部包括加熱器，而且為了提高產品的質量，需要具有更加有效且高性能的工藝能力。In addition, the heat treatment furnace includes a heater inside the chamber in order to remove the moisture remaining on the substrate during the heat treatment process of the substrate, and in order to improve the quality of the product, a more efficient and high-performance process capability is required.

此外，為了藉由縮短熱處理工藝時間來對更多產品進行量產，需要一種能夠迅速提高腔室內部的溫度且能夠迅速冷卻的同時結構上具有優異的耐久性的熱處理爐。In addition, in order to mass-produce more products by shortening the heat treatment process time, a heat treatment furnace that can rapidly increase the temperature inside the chamber and can be rapidly cooled while having excellent durability in structure is required.

現有熱處理爐的腔室起到在進行熱處理工藝的溫度條件下保持並管理腔室的溫度的作用，並設置為在熱處理工藝條件下滿足效率性和量產性等性能。The chamber of the existing heat treatment furnace plays a role of maintaining and managing the temperature of the chamber under the temperature conditions for the heat treatment process, and is set to satisfy performances such as efficiency and mass productivity under the heat treatment process conditions.

另外，近來隨著基板的超薄化和大型化，熱處理工藝趨勢頻繁發生變化，而且對性能改善需求不斷增加。In addition, recently, with the ultrathinization and enlargement of substrates, the trend of heat treatment processes has frequently changed, and the demand for performance improvement has been increasing.

因此，當前需要開發一種在熱處理工藝中能夠有效地維持並管理熱處理爐的腔室溫度的方案。Therefore, there is currently a need to develop a solution that can effectively maintain and manage the chamber temperature of the heat treatment furnace during the heat treatment process.

改善熱處理爐的腔室結構的方法需要滿足幾方面性能。A method for improving the chamber structure of a heat treatment furnace needs to satisfy several properties.

例如，熱處理爐的腔室為了能夠迅速地保持熱處理工藝溫度，需要有效地管理腔室的溫度。For example, in order to rapidly maintain the temperature of the heat treatment process in a chamber of a heat treatment furnace, it is necessary to effectively manage the temperature of the chamber.

此外，在熱處理爐的腔室內進行熱處理的工藝中，需要迅速保持並管理腔室內的溫度。Furthermore, in the process of performing the heat treatment in the chamber of the heat treatment furnace, it is necessary to maintain and manage the temperature in the chamber quickly.

此外，在熱處理爐的腔室內進行熱處理的工藝中，需要藉由增強保持並管理溫度的能力來改善生產效率。In addition, there is a need to improve production efficiency by enhancing the ability to maintain and manage temperature in the process of heat treatment within the chamber of a heat treatment furnace.

此外，在熱處理爐的腔室內進行熱處理的工藝中，應該能夠對工藝的所有區間的溫度進行管理。In addition, in the process of heat treatment in the chamber of the heat treatment furnace, it should be possible to manage the temperature in all sections of the process.

因此，本發明藉由在熱處理爐100的腔室200內部形成冷卻氣流通道和冷卻管，藉以能夠迅速均勻地管理腔室200內部的溫度，並改善腔室200的冷卻性能。Therefore, the present invention can quickly and uniformly manage the temperature inside the chamber 200 and improve the cooling performance of the chamber 200 by forming the cooling airflow channel and the cooling pipe inside the chamber 200 of the heat treatment furnace 100 .

此外，本發明通過提高腔室200的耐久性，即使在熱處理工藝中反覆出現腔室200內溫度急降的條件下也能夠長時間使用腔室200，而且可預防腔室200的燒損或者正常功能障礙，藉以改善熱處理爐100的使用安全性及熱處理爐100的性能。In addition, by improving the durability of the chamber 200, the present invention enables the chamber 200 to be used for a long time even under the condition that the temperature in the chamber 200 repeatedly drops rapidly during the heat treatment process, and can prevent the chamber 200 from being burnt out or normal. functional impairment, so as to improve the use safety of the heat treatment furnace 100 and the performance of the heat treatment furnace 100 .

此外，本發明通過提高熱處理爐100的腔室200性能，使得基板的熱處理工藝時間縮減、基板的熱處理生產量增加、基板的熱處理品質改善以及能耗效率提高，藉以能夠提供符合環保條件的熱處理爐100。In addition, by improving the performance of the chamber 200 of the heat treatment furnace 100, the present invention reduces the heat treatment process time of the substrate, increases the heat treatment throughput of the substrate, improves the heat treatment quality of the substrate, and improves the energy consumption efficiency, so as to provide a heat treatment furnace that meets environmental protection conditions. 100.

下面，參照附圖對根據本發明的較佳實施例的內容進行更加具體的說明。Hereinafter, the content of the preferred embodiments according to the present invention will be described in more detail with reference to the accompanying drawings.

圖1是顯示根據本發明一實施例的熱處理爐100的示例。圖2是顯示根據本發明一實施例的熱處理爐100的正面的示例。圖3是俯視根據本發明一實施例的熱處理爐100的示例。圖4是顯示根據本發明一實施例的熱處理爐100的側面的示例。FIG. 1 is an example showing a heat treatment furnace 100 according to an embodiment of the present invention. FIG. 2 is an example showing the front surface of the heat treatment furnace 100 according to an embodiment of the present invention. FIG. 3 is an example of a top view of the heat treatment furnace 100 according to an embodiment of the present invention. FIG. 4 is an example showing a side surface of the heat treatment furnace 100 according to an embodiment of the present invention.

圖1至圖4中圖示的附圖顯示熱處理爐100的整體結構，是包括腔室200的熱處理爐100的示例。The drawings illustrated in FIGS. 1 to 4 show the overall structure of the heat treatment furnace 100 , which is an example of the heat treatment furnace 100 including the chamber 200 .

根據本發明的熱處理爐100如圖1至圖4所示，熱處理基板的熱處理爐100的前側可具有遮擋器部120，且後側可具有爐門部110，藉以將待熱處理的基板放到腔室200內預置的各台或者從腔室200搬出熱處理工藝結束的基板。According to the heat treatment furnace 100 of the present invention, as shown in FIGS. 1 to 4 , the heat treatment furnace 100 for heat-treating substrates may have a shutter portion 120 on the front side and a furnace door portion 110 on the rear side, so as to place the substrates to be heat-treated into the cavity Each stage preset in the chamber 200 or the substrate after the heat treatment process is carried out from the chamber 200 .

此外，熱處理爐100具有用於容納待加熱或者乾燥基板的腔室200，腔室200內安裝有由加熱器組成的發熱體，藉以可利用從加熱器產生的熱對基板進行加熱或者通過蒸發水分進行乾燥。此外，根據配置會有所不同，但是一般情況下加熱器的上下部設置有與其緊貼的上/下部熱傳遞板，藉以可有效地進行基板加熱工藝。In addition, the heat treatment furnace 100 has a chamber 200 for accommodating the substrate to be heated or dried, and a heating body composed of a heater is installed in the chamber 200, whereby the substrate can be heated by the heat generated from the heater or by evaporating moisture Dry. In addition, it differs depending on the configuration, but generally, the upper and lower parts of the heater are provided with upper/lower heat transfer plates in close contact therewith, whereby the substrate heating process can be efficiently performed.

此外，熱處理爐100在腔室200的一側具有用於供含有工藝氣體的流體流入的供氣口，以及用於將腔室200內流體排出的排氣口303，並包括具有用於支撐並托起腔室200的支托框架和與多個匯流條510連接的導電部500，所述匯流條510與加熱器的發熱線連接以導通電流。In addition, the heat treatment furnace 100 has a gas supply port on one side of the chamber 200 for the inflow of the fluid containing the process gas, and an exhaust port 303 for discharging the fluid in the chamber 200, and includes a gas supply port 303 for supporting and The supporting frame of the chamber 200 and the conductive portion 500 connected to a plurality of bus bars 510 are held up, and the bus bars 510 are connected to the heating wires of the heater to conduct current.

其中，用於供電的供電部400。作為參考，形成熱處理爐的基本構件，例如，加熱器、上/下部的熱傳遞板、工藝氣體的供氣及排氣系統、包括向加熱器供電的導電部的供電系統的構件與本發明沒有直接的關聯。此外，熱處理爐的基本構件與本發明的主旨無關，是已知的構件，因此本發明將省略其說明。Among them, the power supply unit 400 is used for power supply. For reference, the basic components forming the heat treatment furnace, for example, the heater, the upper/lower heat transfer plates, the supply and exhaust system of the process gas, the components of the power supply system including the conductive part for supplying power to the heater are not related to the present invention. direct association. In addition, the basic components of the heat treatment furnace are not related to the gist of the present invention, and are known components, and thus the description thereof will be omitted in the present invention.

下面，將說明根據本發明的熱處理爐100的腔室200冷卻單元的主要構件。Next, the main components of the cooling unit of the chamber 200 of the heat treatment furnace 100 according to the present invention will be described.

圖5是顯示根據本發明一實施例的熱處理爐100的腔室200的示例。圖6是俯視根據本發明一實施例的熱處理爐100的腔室200的示例。圖7是顯示根據本發明一實施例的熱處理爐100的腔室200的內部結構的示例。圖8是顯示根據本發明一實施例的熱處理爐100的腔室200的主要構件的示例。圖9的（a）、（b）、（c）分別為圖8的詳圖，（a）為圖8的A部，（b）為圖8的B部，圖8的（c）為圖8的C部的放大示例。圖10是為說明根據本發明一實施例的熱處理爐的腔室主要構件而節選一側面並顯示的示例。FIG. 5 is an example showing the chamber 200 of the heat treatment furnace 100 according to an embodiment of the present invention. FIG. 6 is an example of a top view of the chamber 200 of the heat treatment furnace 100 according to an embodiment of the present invention. FIG. 7 is an example showing the internal structure of the chamber 200 of the heat treatment furnace 100 according to an embodiment of the present invention. FIG. 8 is an example showing the main components of the chamber 200 of the heat treatment furnace 100 according to an embodiment of the present invention. (a), (b) and (c) of FIG. 9 are detailed views of FIG. 8 , (a) is part A of FIG. 8 , (b) is part B of FIG. 8 , and (c) of FIG. 8 is a diagram of Enlarged example of section C of 8. FIG. 10 is an example of an excerpted side and shown for explaining the main components of the chamber of the heat treatment furnace according to an embodiment of the present invention.

圖5至圖10中圖示的附圖是節選形成熱處理爐100的腔室200並顯示的示例。The drawings illustrated in FIGS. 5 to 10 are excerpted and shown examples of forming the chamber 200 of the heat treatment furnace 100 .

根據本發明實施例的熱處理爐100的腔室200冷卻單元可由熱處理爐100組成，所述熱處理爐100具有為了加熱或者乾燥基板而容納基板的腔室200，腔室200內安裝有由加熱器組成的發熱體，藉以利用加熱器的熱對基板進行加熱或者乾燥。The cooling unit of the chamber 200 of the heat treatment furnace 100 according to the embodiment of the present invention may be composed of the heat treatment furnace 100 having a chamber 200 for accommodating a substrate for heating or drying the substrate, and a heater composed of a heater installed in the chamber 200 The heating element is used to heat or dry the substrate with the heat of the heater.

此外，可沿著腔室200的內部盒體210、外部盒體220設置冷卻氣流通道和冷卻水管道。In addition, cooling air flow channels and cooling water pipes may be provided along the inner box body 210 and the outer box body 220 of the chamber 200 .

此外，可包括至少一個冷卻外套300，其以垂直方向位於腔室200的外側面，藉以在腔室200內部形成的冷卻氣流通道中形成冷卻氣流a1。In addition, at least one cooling jacket 300 may be included, which is located on the outer side of the chamber 200 in a vertical direction, thereby forming the cooling airflow a1 in the cooling airflow channel formed inside the chamber 200 .

根據本發明的熱處理爐100的腔室200冷卻單元的更加具體的配置如下。A more specific configuration of the cooling unit of the chamber 200 of the heat treatment furnace 100 according to the present invention is as follows.

如圖5至圖10所示，腔室200可設有冷卻氣流通道和冷卻水管道。As shown in FIGS. 5 to 10 , the chamber 200 may be provided with cooling airflow channels and cooling water pipes.

冷卻氣流通道可包括：第一通道部230，其形成在腔室200的外部盒體220和與其相隔的內部盒體210之間；以及第二通道部240，其將由各冷卻外套300形成的冷卻氣流a1導入第一通道部230，並排出由第一通道部230排出的供排氣流a2。The cooling airflow channel may include: a first channel portion 230 formed between the outer case 220 of the chamber 200 and the inner case 210 spaced therefrom; The air flow a1 is introduced into the first passage portion 230 , and the air supply and exhaust flow a2 discharged from the first passage portion 230 is discharged.

此外，可具有分別獨立地控制從第一通道部230中排出的冷卻氣流a1及供排氣流a2的功能。Furthermore, the cooling airflow a1 and the supply/exhaust airflow a2 discharged from the first passage portion 230 can be independently controlled.

此外，第一通道部230分別以水平方向形成於腔室200的外部盒體220和與其相隔的內部盒體210的上下部。In addition, the first channel parts 230 are respectively formed in the upper and lower parts of the outer case 220 of the chamber 200 and the inner case 210 spaced therefrom in a horizontal direction.

如此，分別以水平方向形成於外部盒體220和與其相隔的內部盒體210的上下部的第一通道部230分別在腔室200的上部和下部形成均勻的冷卻氣流a1，藉以能夠使冷卻腔室200均勻冷卻。In this way, the first channel parts 230 formed in the upper and lower parts of the outer box body 220 and the inner box body 210 spaced therefrom in the horizontal direction respectively form a uniform cooling air flow a1 at the upper and lower parts of the chamber 200, so that the cooling chamber can be cooled Chamber 200 cools evenly.

此外，在第一通道部230中，在腔室200的外部盒體220和與其相隔的內部盒體210的之間能夠以內置形式布置冷卻管250。In addition, in the first passage part 230, a cooling pipe 250 can be arranged in a built-in form between the outer case 220 of the chamber 200 and the inner case 210 spaced therefrom.

如此，若在第一通道部230上設置冷卻管250，則根據需要可以將較高的腔室200內部溫度冷卻至均勻的溫度分布。所述第一通道部230通過在腔室200的外部盒體220和與其相隔的內部盒體210之間以內置形式布置冷卻管250而形成。In this way, if the cooling pipe 250 is provided on the first passage portion 230, the high internal temperature of the chamber 200 can be cooled to a uniform temperature distribution as required. The first channel portion 230 is formed by arranging a cooling pipe 250 in a built-in form between the outer case 220 of the chamber 200 and the inner case 210 spaced therefrom.

此外，形成冷卻氣流通道的第二通道部240可沿著腔室200的外部盒體220和與其相隔的內部盒體210的垂直壁面以垂直方向形成。In addition, the second channel part 240 forming the cooling airflow channel may be formed in a vertical direction along the vertical wall surfaces of the outer case 220 of the chamber 200 and the inner case 210 spaced therefrom.

圖11的（a）、（b）是顯示根據本發明一實施例的設置於熱處理爐的腔室的冷卻外套的示例，（a）為冷卻外套的外側的示例，（b）為冷卻外套的內側的示例。(a) and (b) of FIG. 11 show examples of a cooling jacket provided in a chamber of a heat treatment furnace according to an embodiment of the present invention, (a) is an example of the outer side of the cooling jacket, (b) is an example of the cooling jacket Example inside.

如圖5至圖11所示，冷卻外套300可沿著腔室200的垂直方向布置以形成腔室200的外壁。As shown in FIGS. 5 to 11 , the cooling jacket 300 may be arranged along the vertical direction of the chamber 200 to form an outer wall of the chamber 200 .

此外，冷卻外套300可沿著腔室200的垂直方向布置以多個小區單位組裝並形成腔室200的外壁。In addition, the cooling jacket 300 may be arranged in a vertical direction of the chamber 200 to be assembled in a plurality of cell units and form the outer wall of the chamber 200 .

此外，冷卻外套300可包括主機殼體301，所述主機殼體301容納供冷卻水從外部導入並通過的冷卻管310，且內部具有形成冷卻氣流a1藉以沿著腔室200的冷卻氣流通道供氣的空間320。In addition, the cooling jacket 300 may include a main body casing 301 that accommodates a cooling pipe 310 through which cooling water is introduced and passed from the outside, and has a cooling air flow inside for forming the cooling air flow a1 along the chamber 200 The space 320 for channel supply air.

此外，主機殼體301的上部和下部可分別具有用於導入外部氣體的外部氣體導入口302和用於排出冷卻氣流的排氣口303。In addition, the upper and lower parts of the main body casing 301 may have an external air introduction port 302 for introducing the external air and an exhaust port 303 for discharging the cooling airflow, respectively.

此外，冷卻外套300具有多個空氣翼片304，所述多個空氣翼片304形成於與腔室200面對的主機殼體301的內壁垂直壁面，藉以能夠提高冷卻性能。In addition, the cooling jacket 300 has a plurality of air fins 304 formed on the vertical wall surface of the inner wall of the host casing 301 facing the chamber 200 , thereby improving cooling performance.

圖12是顯示根據本發明一實施例的熱處理爐100的腔室200內的氣流流動的示例。FIG. 12 is an example showing the flow of air flow in the chamber 200 of the heat treatment furnace 100 according to an embodiment of the present invention.

圖13的（a）、（b）分別是顯示根據本發明一實施例的熱處理爐100的腔室200內的氣流流動及冷卻水流動的示例，（a）為氣流水平方向流動的示例，（b）為冷卻水水平方向流動的示例。(a) and (b) of FIG. 13 are examples showing the flow of air flow and the flow of cooling water in the chamber 200 of the heat treatment furnace 100 according to an embodiment of the present invention, respectively, (a) is an example of the flow of the air flow in the horizontal direction, ( b) is an example of cooling water flowing horizontally.

根據本發明的熱處理爐的腔室冷卻單元如圖12和圖13所示，藉由冷卻外套300的外部氣體導入口302導入的外部氣體在通過冷卻外套300的冷卻管310的過程中形成冷卻氣流a1，藉以沿著形成於腔室200的內部的冷卻氣流通道即第一通道部230和第二通道部240流入，因此可將腔室200冷卻至均勻的溫度分布。The chamber cooling unit of the heat treatment furnace according to the present invention is shown in FIG. 12 and FIG. 13 , the external air introduced through the external air inlet 302 of the cooling jacket 300 forms a cooling airflow during the process of passing through the cooling pipe 310 of the cooling jacket 300 a1 , so as to flow along the cooling airflow channels formed inside the chamber 200 , namely the first channel portion 230 and the second channel portion 240 , so that the chamber 200 can be cooled to a uniform temperature distribution.

用於冷卻腔室200內部的流體同樣可通過形成冷卻氣流通道的第一通道部230和第二通道部240向外部排出。The fluid used for cooling the inside of the chamber 200 can also be discharged to the outside through the first channel part 230 and the second channel part 240 forming the cooling airflow channel.

另外，附圖中雖未具體示出，流經包括腔室200的冷卻氣流通道在內的第一通道部230和第二通道部240的冷卻氣流a1的供排氣流a2可通過以冷卻外套300為中心設置排風扇或者供排氣裝置，藉以在腔室200內部對冷卻氣流進行調整使其均勻分布，並在排氣階段可使腔室200內氣流簡單地排出到腔室200外部。In addition, although not specifically shown in the drawings, the supply and exhaust flow a2 of the cooling airflow a1 flowing through the first channel part 230 and the second channel part 240 including the cooling airflow channel of the chamber 200 may pass through to cool the jacket An exhaust fan or an air supply and exhaust device is arranged at the center of 300 , so as to adjust the cooling airflow inside the chamber 200 to make it evenly distributed, and in the exhaust stage, the airflow in the chamber 200 can be simply discharged to the outside of the chamber 200 .

如上所述，根據本發明的熱處理爐100的腔室冷卻單元藉由在熱處理爐100的腔室200內部形成冷卻氣流通道和冷卻管，藉以可迅速且均勻地管理腔室200內部的溫度，並具有提高腔室200的冷卻性能的優點。As described above, the chamber cooling unit of the heat treatment furnace 100 according to the present invention can quickly and uniformly manage the temperature inside the chamber 200 by forming the cooling airflow passage and the cooling pipe inside the chamber 200 of the heat treatment furnace 100, and This has the advantage of improving the cooling performance of the chamber 200 .

此外，藉由提高腔室200的耐久性，即使在熱處理工藝中反覆出現腔室200內溫度急降的條件下，也能夠長時間使用腔室200，而且可預防腔室200的燒損或者正常功能障礙，因此具有改善熱處理爐100的使用安全性及熱處理爐100的性能的優點。In addition, by improving the durability of the chamber 200, the chamber 200 can be used for a long time even under the condition that the temperature in the chamber 200 repeatedly drops rapidly during the heat treatment process, and the burnout or normal operation of the chamber 200 can be prevented. Therefore, there is an advantage of improving the safety of use of the heat treatment furnace 100 and the performance of the heat treatment furnace 100 .

此外，藉由提高熱處理爐100的腔室200性能，使得基板的熱處理工藝時間縮減、基板的熱處理生產量增加、基板的熱處理品質得到改善及能耗效率提高，藉以具有能夠提供符合環保條件的熱處理爐100的優點。In addition, by improving the performance of the chamber 200 of the heat treatment furnace 100, the heat treatment process time of the substrate is shortened, the heat treatment throughput of the substrate is increased, the heat treatment quality of the substrate is improved, and the energy consumption efficiency is improved, so as to provide a heat treatment that meets environmental protection conditions. Advantages of furnace 100.

本發明雖然參考附圖中圖示的一實施例進行說明，但本發明並不限於這些實施例，在不脫離本發明主旨的範圍內可進行修改和變形，這些修改和變形屬於本發明的技術思想。Although the present invention is described with reference to an embodiment shown in the accompanying drawings, the present invention is not limited to these embodiments, and modifications and variations can be made within the scope of not departing from the gist of the present invention, and these modifications and variations belong to the technology of the present invention Thought.

100:熱處理爐 110:爐門 120:遮擋器 200:腔室 210:內部盒體 220:外部盒體 230:第一通道部 240:第二通道部 250:冷卻管 300:冷卻外套 301:主機殼體 302:外部氣體導入口 303:排氣口 304:空氣翼片 310:冷卻管 320:空間 400:供電部 500:導電部 510:匯流條 a1:冷卻氣流 a2:供排氣流100: Heat treatment furnace 110: Furnace door 120: Occluder 200: Chamber 210: Internal Box 220: External box 230: First Channel Department 240: Second channel department 250: Cooling pipe 300: Cooling Jacket 301: host shell 302: External gas inlet 303: exhaust port 304: Air vanes 310: Cooling pipe 320: Space 400: Power Supply Department 500: Conductive part 510: Bus bar a1: cooling airflow a2: Supply and exhaust flow

圖1是顯示根據本發明一實施例的熱處理爐的示例。 圖2是顯示根據本發明一實施例的熱處理爐的正面的示例。 圖3是俯視根據本發明一實施例的熱處理爐的示例。 圖4是顯示根據本發明一實施例的熱處理爐的側面的示例。 圖5是顯示根據本發明一實施例的熱處理爐的腔室的示例。 圖6是俯視根據本發明一實施例的熱處理爐的腔室的示例。 圖7是顯示根據本發明一實施例的熱處理爐的腔室的內部結構的示例。 圖8是顯示根據本發明一實施例的熱處理爐的腔室的主要構件的示例。 圖9的（a）、（b）、（c）分別為圖8的詳圖，（a）為圖8的A部，（b）為圖8的B部，圖8的（c）為圖8的C部的放大示例。 圖10是為說明根據本發明一實施例的熱處理爐的腔室主要構件而節選一側面並顯示的示例。 圖11的（a）、（b）是顯示根據本發明一實施例的設置於熱處理爐的腔室的冷卻外套的示例，（a）為冷卻外套的外側的示例，（b）為冷卻外套的內側的示例。 圖12是顯示根據本發明一實施例的熱處理爐的腔室內的氣流流動的示例。 圖13的（a）、（b）分別是顯示根據本發明一實施例的熱處理爐的腔室內的氣流流動及冷卻水流動的示例，（a）為氣流水平方向流動的示例，（b）為冷卻水水平方向流動的示例。FIG. 1 is an example showing a heat treatment furnace according to an embodiment of the present invention. FIG. 2 is an example showing a front surface of a heat treatment furnace according to an embodiment of the present invention. FIG. 3 is a top view of an example of a heat treatment furnace according to an embodiment of the present invention. FIG. 4 is an example showing a side surface of a heat treatment furnace according to an embodiment of the present invention. FIG. 5 is an example showing a chamber of a heat treatment furnace according to an embodiment of the present invention. 6 is an example of a top view of a chamber of a heat treatment furnace according to an embodiment of the present invention. FIG. 7 is an example showing an internal structure of a chamber of a heat treatment furnace according to an embodiment of the present invention. 8 is an example showing the main components of a chamber of a heat treatment furnace according to an embodiment of the present invention. (a), (b) and (c) of FIG. 9 are detailed views of FIG. 8 , (a) is part A of FIG. 8 , (b) is part B of FIG. 8 , and (c) of FIG. 8 is a diagram of Enlarged example of section C of 8. FIG. 10 is an example of an excerpted side and shown for explaining the main components of the chamber of the heat treatment furnace according to an embodiment of the present invention. (a) and (b) of FIG. 11 show examples of a cooling jacket provided in a chamber of a heat treatment furnace according to an embodiment of the present invention, (a) is an example of the outer side of the cooling jacket, (b) is an example of the cooling jacket Example inside. FIG. 12 is an example showing the flow of airflow in a chamber of a heat treatment furnace according to an embodiment of the present invention. (a) and (b) of FIG. 13 are examples showing the flow of air flow and the flow of cooling water in the chamber of the heat treatment furnace according to an embodiment of the present invention, respectively, (a) is an example of the flow of air in the horizontal direction, (b) is an example of the flow of air in the horizontal direction. Example of horizontal flow of cooling water.

210:內部盒體210: Internal Box

220:外部盒體220: External box

230:第一通道部230: First Channel Department

240:第二通道部240: Second channel department

250:冷卻管250: Cooling pipe

300:冷卻外套300: Cooling Jacket

Claims (6)

一種熱處理爐的腔室冷卻單元，其包括：熱處理爐，其具有為了加熱或乾燥基板而容納基板的腔室，所述腔室內安裝有由加熱器組成的發熱體，藉以利用所述加熱器的熱對基板進行加熱或者乾燥；冷卻氣流通道，其沿著所述腔室的內外部盒體形成；以及至少一個冷卻外套，其以垂直方向位於所述腔室的外側面，藉以在所述腔室內側形成的所述冷卻氣流通道中形成冷卻氣流；其中，所述冷卻氣流通道包括：第一通道部及第二通道部，所述第一通道部及所述第二通道部皆形成在所述腔室的外部盒體和與其相隔的內部盒體之間；其中，所述第一通道部分別以水平方向形成於所述腔室的外部盒體和與其相隔的內部盒體的上下部；其中，所述第二通道部沿著所述腔室的外部盒體和與其相隔的內部盒體的垂直壁面以垂直方向形成，用以將由所述冷卻外套形成的冷卻氣流導入所述第一通道部，並排出從所述第一通道部排出的流體。 A chamber cooling unit of a heat treatment furnace, comprising: a heat treatment furnace having a chamber for accommodating a substrate for heating or drying a substrate, wherein a heat generating body composed of a heater is installed in the chamber, thereby utilizing the heat to heat or dry the substrate; cooling airflow channels formed along the inner and outer boxes of the chamber; and at least one cooling jacket vertically positioned on the outer side of the chamber for The cooling airflow is formed in the cooling airflow channel formed on the indoor side; wherein, the cooling airflow channel includes: a first channel part and a second channel part, and the first channel part and the second channel part are both formed in the Between the outer box body of the chamber and the inner box body separated from it; wherein, the first passage portion is formed in the upper and lower parts of the outer box body of the chamber and the inner box body separated from it in a horizontal direction respectively; Wherein, the second channel portion is formed in a vertical direction along the vertical wall surface of the outer box body of the chamber and the inner box body spaced therefrom, and is used for introducing the cooling airflow formed by the cooling jacket into the first channel part, and discharge the fluid discharged from the first channel part. 如請求項1所述之熱處理爐的腔室冷卻單元，其中沿著所述腔室的內外部盒體形成的冷卻氣流通道包括冷卻水管道。 The chamber cooling unit of a heat treatment furnace according to claim 1, wherein the cooling air flow channels formed along the inner and outer boxes of the chamber include cooling water pipes. 如請求項1所述之熱處理爐的腔室冷卻單元，其中所述第一通道部中，冷卻管以內置形式布置在所述腔室的外部盒體和與其相隔的內部盒體之間。 The chamber cooling unit of the heat treatment furnace according to claim 1, wherein in the first passage portion, a cooling pipe is arranged in a built-in form between an outer case of the chamber and an inner case spaced therefrom. 如請求項1所述之熱處理爐的腔室冷卻單元，其中所述冷卻外 套沿著所述腔室的垂直方向布置以形成所述腔室的外壁。 The chamber cooling unit of the heat treatment furnace according to claim 1, wherein the cooling outer The sleeve is arranged along the vertical direction of the chamber to form the outer wall of the chamber. 如請求項1所述之熱處理爐的腔室冷卻單元，其中所述冷卻外套沿著所述腔室的垂直方向布置以多個小區單位組裝並形成所述腔室的外壁。 The chamber cooling unit of a heat treatment furnace according to claim 1, wherein the cooling jacket is arranged in a vertical direction of the chamber and assembled in a plurality of cell units to form the outer wall of the chamber. 如請求項1所述之熱處理爐的腔室冷卻單元，其中所述冷卻外套包括：機殼體，所述主機殼體容納供冷卻水從外部導入並通過的冷卻管，且內部具有形成冷卻氣流藉以沿著所述腔室的冷卻氣流通道供氣的空間，所述主機殼體的上部和下部分別具有用於導入外部氣體的外部氣體導入口和用於排出冷卻氣流的排氣口。The chamber cooling unit of a heat treatment furnace according to claim 1, wherein the cooling jacket comprises: a casing, the main casing accommodates a cooling pipe through which cooling water is introduced and passed from the outside, and has a cooling tube inside. The space through which the airflow is supplied along the cooling airflow channel of the chamber, the upper and lower parts of the main body casing respectively have an external air introduction port for introducing external air and an exhaust port for discharging the cooling airflow .
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