JP2005049021A - Paste material drying method and device - Google Patents

Paste material drying method and device Download PDF

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JP2005049021A
JP2005049021A JP2003281623A JP2003281623A JP2005049021A JP 2005049021 A JP2005049021 A JP 2005049021A JP 2003281623 A JP2003281623 A JP 2003281623A JP 2003281623 A JP2003281623 A JP 2003281623A JP 2005049021 A JP2005049021 A JP 2005049021A
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substrate
paste material
temperature
air
drying
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JP4120522B2 (en
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Masanori Suzuki
雅教 鈴木
Masataka Morita
真登 森田
Hiroyasu Tsuji
弘恭 辻
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To dry a paste material including a solvent, and applied onto a base, in a state of uniformly keeping distributions of temperature and vapor concentration on a surface of the base. <P>SOLUTION: This paste material drying device comprises a heating means 20 mounted in opposition to the base 2 and having a plurality of heaters 22 separated from each other, an air supplying means 40 mounted at a back side of the heating means 20, and an exhausting means 50 having an exhaust port 50a formed at least at an upper part with respect to the surface of the base 2. The air supplied from the air supplying means 40, is passed through among the heaters 22 separated from each other, of the heating means 20, and sprayed toward the base 2. The exhausting is performed by the exhausting means 50 through the exhaust port 50a, whereby the air is supplied in a state of being sprayed toward the surface of the base 2, while simultaneously uniformly heating the whole surface of the base 2, and the air is discharged from at least the upper part with respect to the surface of the base 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、基板上にペースト材料を所定パターンで塗布した後、乾燥する際の、乾燥方法および乾燥装置に関するものである。   The present invention relates to a drying method and a drying apparatus when a paste material is applied on a substrate in a predetermined pattern and then dried.

例えば、プラズマディスプレイパネル（ＰＤＰ）など、電子デバイスにおいては、ガラスやセラミックスなどの基板上に、金属材料や無機材料などが結着成分によって結着してなる構成要素が、所定パターンで形成されている。例えば、ＰＤＰにおいては、電極や誘電体層や隔壁や蛍光体層などが、この構成要素に該当する。   For example, in an electronic device such as a plasma display panel (PDP), a component formed by binding a metal material or an inorganic material with a binding component on a substrate such as glass or ceramics is formed in a predetermined pattern. Yes. For example, in a PDP, an electrode, a dielectric layer, a partition wall, a phosphor layer, and the like correspond to this component.

上記のような構成要素は、その前駆体となるペースト材料を、スクリーン印刷やダイコート法によって基板上に所定パターンで塗布し、その後、焼成することで形成する。   The components as described above are formed by applying a paste material as a precursor thereof in a predetermined pattern on a substrate by screen printing or a die coating method, and then baking.

ここで、前駆体となるペースト材料としては、上述した、金属材料や無機材料などに結着成分を添加したものに対して、さらに、所定のパターンに塗布した後、そのパターン形状を保持するための、例えばエチルセルロースやアクリル等の熱分解性のよい高分子化合物（樹脂成分）や、印刷に適した所定の粘性を与えるための、例えばテルピネオールやカルビトールアセテート等の溶剤を加えたものである。   Here, as a paste material used as a precursor, in order to maintain the pattern shape after applying a predetermined pattern to the above-described metal material or inorganic material added with a binder component. A high-decomposable polymer compound (resin component) such as ethyl cellulose or acrylic, or a solvent such as terpineol or carbitol acetate for giving a predetermined viscosity suitable for printing is added.

そしてこのペースト材料を基板上に所定パターンで塗布した後、例えば数百（℃）程度の所定温度で加熱処理することで、結着成分の溶融や材料自体の軟化、溶融、あるいは焼結により、所定の機能を有する構成要素として基板上に固着、形成する。   And after applying this paste material on the substrate in a predetermined pattern, for example, by heat treatment at a predetermined temperature of about several hundred (° C.), by melting the binder component, softening the material itself, melting, or sintering, It is fixed and formed on the substrate as a component having a predetermined function.

ここで、上述のペースト材料に含まれる、所定の粘性を与えるための溶剤は、上述の加熱処理に先立って、乾燥処理によってその溶剤の除去が行われる（例えば、非特許文献１参照）。   Here, the solvent for giving the predetermined viscosity contained in the paste material is removed by a drying process prior to the heat treatment (see, for example, Non-Patent Document 1).

この乾燥処理によって、塗布したペースト材料は固化するので、その後に行う加熱処理までの間に、塗布したペースト材料にダストなどが付着したり、また塗布の際の形状が「だれ」などで変化してしまうことを抑制することが可能となる。
２００１ ＦＰＤテクノロジー大全、株式会社電子ジャーナル 刊、２０００年１０月２５日、ｐ６６９ The applied paste material is solidified by this drying process, so that dust or the like adheres to the applied paste material and the shape during application changes due to “sag” etc. until the subsequent heat treatment. It becomes possible to suppress that.
2001 FPD Technology Taizen, published by E-journal Co., Ltd., October 25, 2000, p669

ペースト材料を塗布して形成したパターンの形状は、その乾燥過程における溶剤の蒸発速度に大きく影響を受ける。そして、蒸発速度は蒸気圧分布による影響を強く受け、蒸気圧は温度、蒸気濃度に大きく影響される。すなわち、乾燥過程において基板の面内で大きな温度分布、および大きな蒸気濃度分布が生じると、溶剤の蒸発速度にばらつきが生じ、それに起因して、形成したパターンの、高さや幅などの形状が、不均一となってしまい、その結果、構成要素を所望の機能を有するものとすることが困難となってしまう場合があった。このような問題は、基板の大型に伴いさらに顕著となる。すなわち、乾燥処理は、基板の面内の温度分布と蒸気濃度分布を可及的に均一に保ちつつ実施することが要求される。   The shape of the pattern formed by applying the paste material is greatly affected by the evaporation rate of the solvent during the drying process. The evaporation rate is strongly influenced by the vapor pressure distribution, and the vapor pressure is greatly influenced by the temperature and the vapor concentration. That is, when a large temperature distribution and a large vapor concentration distribution occur in the plane of the substrate in the drying process, the evaporation rate of the solvent varies, and as a result, the shape of the formed pattern, such as the height and width, As a result, it may be difficult to make a component have a desired function. Such a problem becomes more conspicuous as the substrate becomes larger. That is, the drying process is required to be performed while keeping the temperature distribution and the vapor concentration distribution in the plane of the substrate as uniform as possible.

本発明は上記課題に鑑みてなされたものであり、溶剤を含むペースト材料を塗布した後、乾燥する際、基板の面内の温度分布と蒸気濃度分布を均一に保つことで、ペースト材料の均一な乾燥を可能とする、ペースト材料の乾燥方法および乾燥装置を提供することを目的とするものである。   The present invention has been made in view of the above problems, and when applying a paste material containing a solvent and then drying, the temperature distribution and the vapor concentration distribution in the surface of the substrate are kept uniform, thereby making the paste material uniform. It is an object of the present invention to provide a drying method and a drying apparatus for a paste material that can be easily dried.

上記目的を実現するために本発明の基板上のペースト材料の乾燥方法は、基板上に塗布したペースト材料を乾燥する際、前記基板を全面均一となるように加熱すると同時に、前記基板面に向けて吹き付けるように空気を供給し、そして、基板面より少なくとも上方から排気することを特徴とするものである。   In order to achieve the above object, the method for drying a paste material on a substrate according to the present invention is such that when the paste material applied on the substrate is dried, the substrate is heated so that the entire surface is uniform, and at the same time directed toward the substrate surface. Then, air is supplied so as to be blown and exhausted from at least above the substrate surface.

また、上記目的を達成するために本発明の基板上のペースト材料の乾燥装置は、基板上に塗布したペースト材料を乾燥する乾燥装置であって、基板と対向するように設けた、複数に分離したヒーターを有する加熱手段と、加熱手段の背面側に設けた給気手段と、基板面より少なくとも上方に設けた排気口を有する排気手段とを備え、給気は、給気手段から、加熱手段が有する分離したヒーターの間を通過した後、基板に向けて吹き付けるように行い、また、排気は、排気口を通じて排気手段により行うように構成したことを特徴とするものである。   In order to achieve the above object, the apparatus for drying a paste material on a substrate according to the present invention is a drying apparatus for drying a paste material applied on a substrate, and is provided so as to face the substrate and separated into a plurality of parts. A heating means having a heater, an air supply means provided on the back side of the heating means, and an exhaust means having an exhaust port provided at least above the substrate surface, the supply air from the air supply means to the heating means After passing between the separated heaters, the substrate is blown toward the substrate, and the exhaust is performed by the exhaust means through the exhaust port.

本発明によれば、溶剤を含むペースト材料を塗布した後、乾燥する際、基板の面内の温度分布と蒸気濃度分布を均一に保ちつつ行うことが可能となるため、ペースト材料の均一な乾燥を実現することができる。   According to the present invention, when the paste material containing the solvent is applied and then dried, the temperature distribution and the vapor concentration distribution in the surface of the substrate can be kept uniform. Can be realized.

すなわち、本発明の請求項１に記載の発明は、基板上に塗布したペースト材料を乾燥する際、前記基板を全面均一となるように加熱すると同時に、前記基板面に向けて吹き付けるように空気を供給し、そして、基板面より少なくとも上方から排気することを特徴とするペースト材料の乾燥方法である。   That is, according to the first aspect of the present invention, when the paste material applied on the substrate is dried, the substrate is heated so that the entire surface is uniform, and at the same time, air is blown toward the substrate surface. It is a method for drying a paste material, characterized in that it is supplied and exhausted from at least above the substrate surface.

また、請求項２に記載の発明は、基板上に塗布したペースト材料を乾燥する乾燥装置であって、基板と対向するように設けた、複数に分離したヒーターを有する加熱手段と、加熱手段の背面側に設けた給気手段と、基板面より少なくとも上方に設けた排気口を有する排気手段とを備え、給気は、給気手段から、加熱手段が有する分離したヒーターの間を通過した後、基板に向けて吹き付けるように行い、また、排気は、排気口を通じて排気手段により行うように構成したことを特徴とするペースト材料の乾燥装置である。   The invention according to claim 2 is a drying device for drying the paste material applied on the substrate, the heating device having a plurality of heaters provided so as to face the substrate, and the heating device. An air supply means provided on the back side and an exhaust means having an exhaust port provided at least above the substrate surface, after the supply air passes between the separated heaters of the heating means from the air supply means The paste material drying apparatus is characterized in that the paste material is sprayed toward the substrate and the exhaust is performed by the exhaust means through the exhaust port.

以下、本発明の一実施の形態による、基板上のペースト材料の乾燥方法、およびその際に用いる乾燥装置について、図を用いて説明する。   Hereinafter, a method for drying a paste material on a substrate and a drying apparatus used at that time according to an embodiment of the present invention will be described with reference to the drawings.

図１は、本発明の一実施の形態による乾燥装置の概略構成を示す断面図であり、側面から見たものである。また、図２は、図１におけるＡ−Ａ矢視断面図であり、図１に示す側面構造のものが２列並列して配設されたものであることを示している。   FIG. 1 is a cross-sectional view showing a schematic configuration of a drying apparatus according to an embodiment of the present invention, viewed from the side. FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and shows that the side structure shown in FIG. 1 is arranged in two rows in parallel.

乾燥装置１は、炉室１０と加熱手段２０と搬送手段３０と給気手段４０と排気手段５０とを備えており、例えば、ガラスやセラミックスなどの、１５００×１０００（ｍｍ）程度の大きさの基板２上に、金属材料や無機材料などが結着成分によって結着してなる構成要素、例えば、ＰＤＰにおいては、隔壁、電極、誘電体層、蛍光体層などを形成するに際し、その前駆体となるペースト材料を塗布した後、乾燥する目的で用いられるものである。   The drying apparatus 1 includes a furnace chamber 10, a heating unit 20, a conveying unit 30, an air supply unit 40, and an exhaust unit 50, and has a size of about 1500 × 1000 (mm) such as glass or ceramics. On the substrate 2, a component formed by binding a metal material, an inorganic material, or the like with a binding component, for example, in a PDP, a precursor for forming a partition, an electrode, a dielectric layer, a phosphor layer, etc. After the paste material is applied, it is used for the purpose of drying.

炉室１０は、基板２の搬送方向に、例えば３つのゾーン１０ａ、１０ｂ、１０ｃに分けられており、例えば、基板２に対して、昇温、維持、降温などのように、独立した温度変化を与えることが可能となっている。   The furnace chamber 10 is divided into, for example, three zones 10a, 10b, and 10c in the transport direction of the substrate 2. For example, independent temperature changes such as temperature rise, maintenance, and temperature drop with respect to the substrate 2 are performed. It is possible to give.

加熱手段２０は、基板２に対して例えば２００（ｍｍ）程度の距離を隔てて対向して炉室１０内に備えられており、炉室１０内を、基板２の搬送方向に従って、ゾーン毎に独立して温度設定できるよう、それぞれのゾーン毎に、遠赤外線マトリックスヒーターユニット２１ａ、２１ｂ、２１ｃ（以下、特に区別しないときは単にヒーターユニット２１という）を備える。ここで、ヒーターユニット２１は、図３に基板２との上下位置関係を図１、図２とは反対の状態で、且つ、間隔ｄを拡大した状態で示すように、複数に分離した、面状のヒーター２２ａ、２２ｂ、２２ｃ（以下、特に区別しないときは単にヒーター２２という）をマトリックス状に配列したものである。ヒーターユニット２１は、例えば格子状、メッシュ状の骨組みであり、そこにヒーター２２が配設されており、この構造においては、その厚み方向に対して、配列されたヒーター２２の間をぬけて通気可能な状態となっている。これにより、給気手段４０からの空気は加熱手段２０を通過して基板２に吹き付けられる。   The heating means 20 is provided in the furnace chamber 10 so as to face the substrate 2 with a distance of, for example, about 200 (mm), and the furnace chamber 10 is provided for each zone according to the transport direction of the substrate 2. Far-infrared matrix heater units 21a, 21b, and 21c (hereinafter simply referred to as heater unit 21 unless otherwise specified) are provided for each zone so that the temperature can be set independently. Here, the heater unit 21 is divided into a plurality of surfaces as shown in FIG. 3 in the vertical positional relationship with the substrate 2 in a state opposite to that in FIGS. Heaters 22a, 22b and 22c (hereinafter simply referred to as heaters 22 unless otherwise specified) are arranged in a matrix. The heater unit 21 is, for example, a lattice-like or mesh-like framework, and a heater 22 is disposed therein. In this structure, the heater unit 21 is ventilated between the arranged heaters 22 in the thickness direction. It is possible. Thereby, the air from the air supply means 40 passes through the heating means 20 and is blown onto the substrate 2.

また、基板２に入射する遠赤外線強度は、図３中の基板２上に破線で示すように、ヒーター２２それぞれに対応する領域毎に、独立、或いは組合せて制御することが可能である。なお、ヒーター２２によって構成されるヒーターユニット２１の面積は、炉室１０内で乾燥される基板２の大きさよりも、例えばヒーター２２の１枚分程度の幅、大きな面積となるように設定している。   Further, the far-infrared intensity incident on the substrate 2 can be controlled independently or in combination for each region corresponding to each heater 22, as indicated by a broken line on the substrate 2 in FIG. The area of the heater unit 21 constituted by the heaters 22 is set so as to be, for example, a width and a large area of about one heater 22 than the size of the substrate 2 to be dried in the furnace chamber 10. Yes.

搬送手段３０は、例えば、ローラーやベルトやチェーン等により基板２を図の左方から右方に連続的、或いは間欠的に搬送するもので、その搬送過程で、加熱手段２０による加熱により、基板２上に塗布したペースト材料は乾燥させられる。   The transport means 30 is for transporting the substrate 2 continuously or intermittently from the left to the right in the drawing by means of rollers, belts, chains, etc., and the substrate is heated by the heating means 20 during the transport process. The paste material applied on 2 is dried.

給気手段４０は、炉室１０内に空気を供給するために、図示しないエア供給源に接続されているダクト４１と、そのダクト４１を介して供給されるエアを必要に応じて加熱するための加熱ヒーター４２と、そのエアから塵埃を除去するためのフィルタ４３と、体積流量を調整する、例えば、ダンパーなどの流量調整弁４４とを備える。なお、給気手段４０の開口面積は、基板２よりも各辺で２５０（ｍｍ）程度以上大きくなるよう設定している。   In order to supply air into the furnace chamber 10, the air supply means 40 heats the duct 41 connected to an air supply source (not shown) and the air supplied via the duct 41 as necessary. Heater 42, a filter 43 for removing dust from the air, and a flow rate adjusting valve 44 such as a damper for adjusting the volume flow rate. Note that the opening area of the air supply means 40 is set to be larger than the substrate 2 by about 250 (mm) or more on each side.

排気手段５０は、排気口５０ａ、および図示しない排気通路、排気装置とを備えるものである。ここで、排気口５０ａは、少なくとも基板面より上方に設けられている。   The exhaust means 50 includes an exhaust port 50a, an exhaust passage (not shown), and an exhaust device. Here, the exhaust port 50a is provided at least above the substrate surface.

以上の構成により、給気手段４０からの空気は、加熱手段２０の上方、すなわち背面側から、加熱手段２０が有する分離したヒーター２２の間を通過して、基板２に向かって吹き付けられ、その後、排気手段５０により、すなわち、排気口５０ａおよび排気通路を通じて排気装置により排気される。   With the above configuration, the air from the air supply means 40 passes from above the heating means 20, that is, from the back side, between the separated heaters 22 of the heating means 20, and is blown toward the substrate 2, and thereafter The exhaust device 50 exhausts the exhaust gas through the exhaust port 50a and the exhaust passage.

ここで、上述したようなヒーター２２の温度設定の手順は以下のとおりである。まず、基板２の温度分布の発生傾向や乾燥装置１の構造等を考慮し、さらに、経験的知識に基づいて、ヒーター２２の温度を個々に仮設定する。次に、乾燥処理しようとする基板２と同様な材質および大きさのダミー基板（例えば、ペースト材料が塗布されていない基板）を用意し、そのダミー基板の表面に、数箇所から数十箇所程度に区分した領域毎に熱電対等の温度センサを取り付け、このダミー基板を基板２の通常の乾燥処理手順に従って、炉室１０内を搬送しつつ加熱する。そして、加熱中のダミー基板の各領域の温度を上記の温度センサによって連続的に測定することにより、そのダミー基板の温度分布を経時的に測定する。そして、測定した温度分布、すなわち各時間におけるダミー基板内の最高温度と最低温度との差ΔＴｎが、予め定められた所定値ΔＴｄ（例えば１０（℃））以下であり、且つ、各時間におけるダミー基板内の平均温度と目標基板温度との差ΔＴｍが、予め定められた所定値ΔＴａ（例えば３（℃））以下であるか否かを判断する。そして、ΔＴｎ＞ΔＴｄ、或いはΔＴｍ＞ΔＴａの場合には、上記ヒーター２２の温度設定を変更した上で、同様のダミー基板による温度測定を再び実施する。この時、個々のヒーター２２の目標温度は、前回測定されたダミー基板の温度分布に基づいて、温度が低い領域に対応するヒータ２２の遠赤外線の放射強度が高く、反対に温度が高い領域に対応するヒーター２２の遠赤外線の放射強度が低くなるように設定変更する。このようにして、ΔＴｎ≦ΔＴｄ、およびΔＴｍ≦ΔＴａの条件を満足するまで繰り返し実施することにより、基板２の温度分布が略均一になるように個々のヒーター２２の温度設定を行う。   Here, the procedure for setting the temperature of the heater 22 as described above is as follows. First, the temperature distribution of the substrate 2 is considered, the structure of the drying apparatus 1 and the like are taken into consideration, and the temperature of the heater 22 is temporarily set individually based on empirical knowledge. Next, a dummy substrate (for example, a substrate to which no paste material is applied) having the same material and size as the substrate 2 to be dried is prepared, and several to several tens of locations are provided on the surface of the dummy substrate. A temperature sensor such as a thermocouple is attached to each of the divided areas, and the dummy substrate is heated while being conveyed in the furnace chamber 10 in accordance with a normal drying processing procedure for the substrate 2. Then, the temperature distribution of the dummy substrate is measured over time by continuously measuring the temperature of each region of the dummy substrate being heated by the temperature sensor. The measured temperature distribution, that is, the difference ΔTn between the highest temperature and the lowest temperature in the dummy substrate at each time is not more than a predetermined value ΔTd (for example, 10 (° C.)) and the dummy at each time. It is determined whether or not the difference ΔTm between the average temperature in the substrate and the target substrate temperature is equal to or less than a predetermined value ΔTa (for example, 3 (° C.)). If ΔTn> ΔTd or ΔTm> ΔTa, the temperature setting of the heater 22 is changed, and the temperature measurement using the same dummy substrate is performed again. At this time, the target temperature of each heater 22 is based on the temperature distribution of the dummy substrate measured last time, and the far-infrared radiation intensity of the heater 22 corresponding to the low temperature region is high, and conversely the high temperature region. The setting is changed so that the far-infrared radiation intensity of the corresponding heater 22 is lowered. In this way, by repeatedly performing the conditions of ΔTn ≦ ΔTd and ΔTm ≦ ΔTa, the temperature of each heater 22 is set so that the temperature distribution of the substrate 2 becomes substantially uniform.

また、上述したようなヒーター２２の温度設定は以下の理由によるものである。一般に、図１に示すような構成の乾燥装置１で基板２を乾燥する場合には、炉室１０の壁面からの熱損失により、図３の基板２上に破線で区分して示す複数の領域６０において、搬送方向Ａと垂直な基板２の幅方向の両端部の領域６０ｓでは相対的に温度が低く、中央部の領域６０ｃでは相対的に温度が高くなる。さらに、連続搬送方式では、基板２の搬送方向Ａと垂直な基板２の幅方向の温度差にのみ配慮すれば良いが、間欠搬送方式では、炉室１０内での温度勾配によって基板２の搬送方向Ａに沿った方向において、前方の領域６０ｆと後方の領域６０ｒと中央部の領域６０ｃとでは温度差が発生する。例えば、乾燥装置１の炉室１０の３つのゾーンのうち、中央に位置するゾーン１０ｂでは、所定の温度で基板２を保持するキープゾーンに対応するため、ゾーン１０ｂ内は中央側程高温となり、入口および出口においては外気等による冷却もあって低温となる。そのため、基板２の搬送方向Ａに沿った方向において、前方の領域６０ｆと後方の領域６０ｒとが相対的に温度が低く、中央部の領域６０ｃが相対的に温度が高くなる。そこで、基板２の表面温度を均一にして基板２上に塗布したペースト材料を均一に乾燥するためには、これらの昇温特性を考慮して、入射させる遠赤外線の放射強度を温度が低い領域程高くする必要がある。そこで、個々のヒーター２２の設定温度は、それぞれの放射強度に対応するように、例えば中央部で低く、搬送方向に対する幅方向両端部で高く、また、ゾーン１０ｂの中央部側で低く入口および出口側で高くなるように設定を行う。   The temperature setting of the heater 22 as described above is due to the following reason. In general, when the substrate 2 is dried by the drying apparatus 1 configured as shown in FIG. 1, a plurality of regions indicated by broken lines on the substrate 2 of FIG. 3 due to heat loss from the wall surface of the furnace chamber 10. At 60, the temperature is relatively low in the regions 60s at both ends in the width direction of the substrate 2 perpendicular to the transport direction A, and the temperature is relatively high in the central region 60c. Furthermore, in the continuous transfer method, it is only necessary to consider the temperature difference in the width direction of the substrate 2 perpendicular to the transfer direction A of the substrate 2, but in the intermittent transfer method, the substrate 2 is transferred due to the temperature gradient in the furnace chamber 10. In the direction along the direction A, a temperature difference occurs between the front region 60f, the rear region 60r, and the central region 60c. For example, among the three zones of the furnace chamber 10 of the drying apparatus 1, the zone 10 b located in the center corresponds to the keep zone that holds the substrate 2 at a predetermined temperature. At the inlet and outlet, the temperature is lowered due to cooling by outside air or the like. Therefore, in the direction along the conveyance direction A of the substrate 2, the temperature of the front region 60f and the rear region 60r is relatively low, and the temperature of the central region 60c is relatively high. Therefore, in order to uniformly dry the paste material applied on the substrate 2 with the surface temperature of the substrate 2 being uniform, the radiation intensity of the far infrared rays to be incident is in a region where the temperature is low in consideration of these temperature rise characteristics. It needs to be as high as possible. Therefore, the set temperatures of the individual heaters 22 are, for example, low at the center, high at both ends in the width direction with respect to the transport direction, and low at the center of the zone 10b so as to correspond to each radiation intensity. Set to be higher on the side.

また、上述したような排気手段５０の設置は、以下の理由によるものである。例えば図４に示すような、排気手段５０の排気口５０ａが基板２の面より低い位置に設けられている乾燥装置１で基板２を乾燥する場合には、給気手段４０から加熱手段２０を通過して基板２上に吹き付けられた空気は、基板２の下方に設けられた排気手段５０により排気されることとなり、排気口５０ａから排気される過程において、図４中の矢印で示すような、基板２の中央から基板２の周縁部に向かう空気の流れが発生し、その回り込みの影響を受け、基板２の中央部に比べ周縁部では空気の流れの速度が増してしまう。そこで、回り込みによる流速の増加を抑制する目的で、図２に示す本発明の一実施の形態の焼成装置のように、排気口５０ａを、基板２の、ペースト材料を塗布して形成した面よりも上方に設ける。このことにより、給気手段４０から加熱手段２０を通過して基板２上に向けて吹き付けられた空気は、基板２の上方に設けられた排気手段５０により排気されることとなるため、図２中に矢印で示すような気流の流れとなり、基板２上には、排気手段５０による排気に伴う気流の発生が抑制されることとなる。その結果、ペースト材料の乾燥を基板２の面内の蒸気濃度分布を均一に保ちつつ行うことが可能となり、したがって均一な乾燥状態が得られる。また、排気口５０ａと基板２の周縁部とが近接しすぎると、基板２上における排気口５０ａ近傍において、排気手段５０による排気に伴う気流が発生してしまう場合があるため、これを避けるために、基板２の周縁部と排気口５０ａとは例えば２５０（ｍｍ）以上隔てて設けると良い。   Moreover, the installation of the exhaust means 50 as described above is for the following reason. For example, when the substrate 2 is dried by the drying apparatus 1 in which the exhaust port 50a of the exhaust unit 50 is provided at a position lower than the surface of the substrate 2, as shown in FIG. The air that passes through and is blown onto the substrate 2 is exhausted by the exhaust means 50 provided below the substrate 2, and in the process of exhausting from the exhaust port 50a, as shown by the arrows in FIG. An air flow from the center of the substrate 2 toward the peripheral edge of the substrate 2 is generated, and the air flow speed increases at the peripheral edge compared to the central portion of the substrate 2 due to the influence of the wraparound. Therefore, for the purpose of suppressing an increase in the flow rate due to the wraparound, the exhaust port 50a is formed from the surface of the substrate 2 formed by applying the paste material as in the baking apparatus according to the embodiment of the present invention shown in FIG. Is also provided above. As a result, the air blown from the air supply means 40 through the heating means 20 and blown onto the substrate 2 is exhausted by the exhaust means 50 provided above the substrate 2. As a result, an air current flows as indicated by an arrow, and generation of an air current due to exhaust by the exhaust means 50 is suppressed on the substrate 2. As a result, the paste material can be dried while keeping the vapor concentration distribution in the plane of the substrate 2 uniform, and thus a uniform dry state can be obtained. Further, if the exhaust port 50a and the peripheral edge of the substrate 2 are too close to each other, an air flow accompanying the exhaust by the exhaust means 50 may be generated in the vicinity of the exhaust port 50a on the substrate 2, so that this can be avoided. In addition, the peripheral edge of the substrate 2 and the exhaust port 50a may be provided, for example, at a distance of 250 (mm) or more.

以上の説明から明らかなように本発明によれば、溶剤を含むペースト材料を塗布した後、乾燥する際、基板の面内の温度分布と蒸気濃度分布を均一に保ちつつ行うことを可能とすることで、ペースト材料の均一な乾燥を実現することができる乾燥方法および乾燥装置を提供できる。   As is apparent from the above description, according to the present invention, when applying a paste material containing a solvent and then drying, it is possible to carry out while keeping the temperature distribution and vapor concentration distribution in the plane of the substrate uniform. Thereby, the drying method and drying apparatus which can implement | achieve uniform drying of paste material can be provided.

本発明の一実施の形態による乾燥装置の概略構成を示す断面図Sectional drawing which shows schematic structure of the drying apparatus by one embodiment of this invention 図１におけるＡ−Ａ矢視断面図AA arrow sectional view in FIG. 本発明の一実施の形態による乾燥装置における加熱手段と給気手段の一部の概略構成を示す斜視図The perspective view which shows schematic structure of a part of heating means and air supply means in the drying apparatus by one embodiment of this invention 排気口の位置による効果の違いを説明するための乾燥装置の概略構成を示す断面図Sectional drawing which shows schematic structure of the drying apparatus for demonstrating the difference of the effect by the position of an exhaust port

符号の説明Explanation of symbols

１ 乾燥装置
２ 基板
１０ 炉室
１０ａ、１０ｂ、１０ｃ 炉室
２０ 加熱手段
２２（２２ａ、２２ｂ、２２ｃ） ヒーター
３０ 搬送手段
４０ 給気手段
５０ 排気手段
５０ａ 排気口 DESCRIPTION OF SYMBOLS 1 Drying apparatus 2 Board | substrate 10 Furnace chamber 10a, 10b, 10c Furnace chamber 20 Heating means 22 (22a, 22b, 22c) Heater 30 Conveyance means 40 Air supply means 50 Exhaust means 50a Exhaust port

Claims (2)

基板上に塗布したペースト材料を乾燥する際、前記基板を全面均一となるように加熱すると同時に、前記基板面に向けて吹き付けるように空気を供給し、そして、基板面より少なくとも上方から排気することを特徴とするペースト材料の乾燥方法。 When drying the paste material applied on the substrate, the substrate is heated so that the entire surface is uniform, and at the same time, air is supplied so as to blow toward the substrate surface, and air is exhausted from at least above the substrate surface. A method for drying a paste material characterized by the above. 基板上に塗布したペースト材料を乾燥する乾燥装置であって、基板と対向するように設けた、複数に分離したヒーターを有する加熱手段と、加熱手段の背面側に設けた給気手段と、基板面より少なくとも上方に設けた排気口を有する排気手段とを備え、給気は、給気手段から、加熱手段が有する分離したヒーターの間を通過した後、基板に向けて吹き付けるように行い、また、排気は、排気口を通じて排気手段により行うように構成したことを特徴とするペースト材料の乾燥装置。 A drying apparatus for drying a paste material applied on a substrate, the heating unit having a plurality of heaters provided so as to face the substrate, the air supply unit provided on the back side of the heating unit, and the substrate An exhaust means having an exhaust port provided at least above the surface, and the air supply is performed so as to blow from the air supply means toward the substrate after passing between the separated heaters of the heating means. An apparatus for drying a paste material, wherein the exhaust is performed by an exhaust means through an exhaust port.
JP2003281623A 2003-07-29 2003-07-29 Paste material drying equipment Expired - Fee Related JP4120522B2 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011068013A1 (en) * 2009-12-02 2011-06-09 シャープ株式会社 Ink drying apparatus
JP2014181889A (en) * 2013-03-21 2014-09-29 Dainippon Printing Co Ltd Airflow processing equipment
CN105880128A (en) * 2016-06-15 2016-08-24 深圳市华星光电技术有限公司 Baking equipment for display panel process
JP2018124027A (en) * 2017-02-03 2018-08-09 幸代 野阪 Dryer for highly-concentrated coating apparatus, and drying method
JP2019163931A (en) * 2015-03-26 2019-09-26 日本碍子株式会社 Drying method, manufacturing method of ceramic component, and drying system
CN115265148B (en) * 2022-07-28 2023-07-07 江苏龙恒新能源有限公司 Heterojunction solar cell drying device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011068013A1 (en) * 2009-12-02 2011-06-09 シャープ株式会社 Ink drying apparatus
JP2014181889A (en) * 2013-03-21 2014-09-29 Dainippon Printing Co Ltd Airflow processing equipment
JP2019163931A (en) * 2015-03-26 2019-09-26 日本碍子株式会社 Drying method, manufacturing method of ceramic component, and drying system
CN105880128A (en) * 2016-06-15 2016-08-24 深圳市华星光电技术有限公司 Baking equipment for display panel process
JP2018124027A (en) * 2017-02-03 2018-08-09 幸代 野阪 Dryer for highly-concentrated coating apparatus, and drying method
CN115265148B (en) * 2022-07-28 2023-07-07 江苏龙恒新能源有限公司 Heterojunction solar cell drying device

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