TWI766917B - Sheet attachment device and attachment method - Google Patents
Sheet attachment device and attachment method Download PDFInfo
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- TWI766917B TWI766917B TW106144107A TW106144107A TWI766917B TW I766917 B TWI766917 B TW I766917B TW 106144107 A TW106144107 A TW 106144107A TW 106144107 A TW106144107 A TW 106144107A TW I766917 B TWI766917 B TW I766917B
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- peeling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C1/00—Labelling flat essentially-rigid surfaces
- B65C1/02—Affixing labels to one flat surface of articles, e.g. of packages, of flat bands
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/0006—Removing backing sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/02—Devices for moving articles, e.g. containers, past labelling station
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/06—Devices for presenting articles in predetermined attitude or position at labelling station
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/08—Label feeding
- B65C9/18—Label feeding from strips, e.g. from rolls
- B65C9/1865—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/26—Devices for applying labels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/40—Controls; Safety devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Labeling Devices (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Supplying Of Containers To The Packaging Station (AREA)
- Basic Packing Technique (AREA)
Abstract
[課題] 提供一種薄片貼附裝置及貼附方法,其能夠不致因剝離手段發生剝離不良,並將該接著薄片貼附被黏物。 [解決手段] 係具備送出手段(20),係將於帶狀的接著薄片基材(ASB)的接著面(AS1)暫時接著有帶狀的剝離薄片(RL)的原料(RS)送出;切斷手段(30),係於送出手段(20)所送出的原料(RS)的接著薄片基材(ASB)形成預定形狀的切口(CU),藉此於該切口(CU)的內側形成接著薄片(AS);剝離手段(50),係將送出手段(20)所送出的原料(RS)藉由剝離邊緣(50A)反折,並將接著薄片AS從剝離薄片(RL)剝離;以及按壓手段(60),將藉由剝離手段(50)剝離的接著薄片(AS)按壓並貼附於被黏物(WK);切斷手段(30),係構成為能夠以考慮到剝離手段(50)的剝離邊緣(50A)的形狀,使接著薄片(AS)的剝離開始邊緣(ASF)與該剝離邊緣(50A)不致平行的方式形成切口(CU)。[Problem] To provide a sheet sticking device and an sticking method which can stick the adhesive sheet on an adherend without causing a peeling defect by a peeling means. [Solution] The system is provided with feeding means (20) for feeding out the raw material (RS) to which the tape-shaped release sheet (RL) is temporarily adhered to the bonding surface (AS1) of the tape-shaped adhesive sheet base material (ASB); A cutting means (30) is used to form a cut (CU) of a predetermined shape in the adhesive sheet base (ASB) of the raw material (RS) fed out by the feeding means (20), thereby forming an adhesive sheet inside the cut (CU) (AS); peeling means (50), which folds the raw material (RS) sent out by the sending means (20) by the peeling edge (50A), and peels the subsequent sheet AS from the peeling sheet (RL); and pressing means (60), the adhesive sheet (AS) peeled off by the peeling means (50) is pressed and attached to the adherend (WK); the cutting means (30) is configured so that the peeling means (50) can be considered The shape of the peeling edge (50A) is such that a cut (CU) is formed so that the peeling start edge (ASF) of the next sheet (AS) and the peeling edge (50A) are not parallel.
Description
[0001] 本發明,係有關於薄片貼附裝置及貼附方法。[0001] The present invention relates to a sheet attaching device and an attaching method.
[0002] 以往,係已知一種安裝裝置(薄片貼附裝置),其係於被送出的接著薄片基材形成切口並於該切口的內側形成接著薄片,將該接著薄片藉由剝離手段剝離而貼附於被黏物(例如,參照專利文獻1)。 [先前技術文獻] [專利文獻] [0003] [專利文獻1] 日本特開2005-116928號公報Conventionally, a mounting device (a sheet sticking device) is known that forms a slit in a fed adhesive sheet base material, forms an adhesive sheet inside the slit, and peels the adhesive sheet by a peeling means to remove the adhesive sheet. It is attached to a to-be-adhered body (for example, refer to Patent Document 1). [Prior Art Document] [Patent Document] [0003] [Patent Document 1] Japanese Patent Laid-Open No. 2005-116928
[發明所欲解決的技術課題] [0004] 然而,於專利文獻1所記載之以往的薄片貼附裝置中,係並未考慮剝離板26(剝離手段)的前端(剝離邊緣)的形狀,預切裝置13(切斷手段)便形成切口並形成切割膠帶T(接著薄片),故視接著薄片的形狀,有其剝離開始邊緣與剝離手段的剝離邊緣平行的情形。於如此情形,因接著薄片係藉由剝離手段的剝離邊緣一舉將包含大量的剝離開始邊緣的前端部區域進行剝離,故若接著於該前端部區域的基底薄片S(剝離薄片)的力超越該前端部區域的剛性,則於以往的薄片貼附裝置中,會發生無法從剝離薄片將接著薄片剝離之剝離不良。 [0005] 本發明之目的,係在於提供一種薄片貼附裝置及貼附方法,其能夠不致因剝離手段發生剝離不良,並將該接著薄片貼附被黏物。 [用以解決課題的技術方案] [0006] 本發明,係採用記載於請求項之構成。 [發明之效果] [0007] 依據本發明,因考慮到剝離手段的剝離邊緣的形狀,以使接著薄片的剝離開始邊緣不致與該剝離邊緣平行的方式形成切口,故接著薄片不會被剝離手段的剝離邊緣一舉將大量的前端部區域剝離,能夠不致因剝離手段發生剝離不良,並將該接著薄片貼附被黏物。 另外,若移動手段具備位移手段,則能夠進行接著薄片與被黏物的對位而將該接著薄片貼附被黏物。 並且,若係依據薄片方向檢測手段的檢測結果,使位移手段改變被黏物的方向之構成,則能夠輕易地進行接著薄片與被黏物的對位而將該接著薄片貼附於被黏物。[Technical Problem to be Solved by the Invention] [0004] However, in the conventional sheet sticking device described in Patent Document 1, the shape of the front end (peeling edge) of the peeling plate 26 (peeling means) is not considered, and the The cutting device 13 (cutting means) forms the incision and forms the dicing tape T (adhesive sheet), so depending on the shape of the adhesive sheet, the peeling start edge may be parallel to the peeling edge of the peeling means. In this case, since the adhesive sheet is peeled off by the peeling edge of the peeling means, the front end region including a large number of peeling start edges is peeled off at one stroke, so if the force of the base sheet S (peeling sheet) attached to the front end region exceeds this. Due to the rigidity of the front-end region, in the conventional sheet sticking apparatus, a peeling failure in which the adhesive sheet cannot be peeled off from the peeling sheet occurs. [0005] The purpose of the present invention is to provide a sheet attaching device and an attaching method, which can prevent poor peeling due to the peeling means, and attach the adhesive sheet to the adherend. [Technical Solution for Solving the Problem] [0006] The present invention adopts the configuration described in the claims. [Effect of the Invention] [0007] According to the present invention, in consideration of the shape of the peeling edge of the peeling means, the slit is formed so that the peeling start edge of the adhesive sheet is not parallel to the peeling edge, so that the adhesive sheet is not affected by the peeling means. The peeling edge peels off a large number of front-end regions at one stroke, so that the adhesive sheet can be attached to the adherend without causing peeling defects due to the peeling means. In addition, if the moving means is provided with displacement means, the adhesive sheet and the adherend can be aligned and the adhesive sheet can be attached to the adherend. Furthermore, if the displacement means changes the direction of the adherend according to the detection result of the sheet orientation detection means, the adhesive sheet and the adherend can be easily aligned and the adhesive sheet can be attached to the adherend. .
[0009] 以下,根據圖式對本發明之一實施形態進行說明。 又,本實施形態之X軸、Y軸、Z軸,係各自正交的關係,X軸及Y軸係預定平面內的軸,Z軸係正交於前述預定平面的軸。進而,於本實施形態中,在以從與Y軸平行的第1圖中的手邊方向觀察的情形為基準而表示方向時,「上」係Z軸的箭號方向而「下」係其反方向,「左」係X軸的箭號方向而「右」係其反方向,「前」係與Y軸平行的第1圖中手邊方向而「後」係其反方向。 [0010] 於第1圖中,本發明之薄片貼附裝置10,係具備:送出手段20,係將於帶狀的接著薄片基材ASB的接著面AS1暫時接著有帶狀的剝離薄片RL的原料RS送出;切斷手段30,係於送出手段20所送出的原料RS的接著薄片基材ASB形成預定形狀的切口CU,藉此於該切口CU的內側形成接著薄片AS;薄片方向檢測手段40,係檢測形成於接著薄片基材ASB的接著薄片AS的方向的照相機或投影機等攝像手段、光學感測器或音波感測器等之各種感測器等;剝離板50,係作為將送出手段20所送出的原料RS藉由剝離邊緣50A反折,並將接著薄片AS從剝離薄片RL剝離的剝離手段;按壓滾輪60,係作為將藉由剝離板50所剝離的接著薄片AS按壓於被黏物WK而貼附的按壓手段;以及移動手段70,係使剝離板50及按壓滾輪60與被黏物WK朝向預定的貼附方向SD(X軸方向)相對移動。 [0011] 送出手段20,係具備:支承滾輪21,係支承原料RS;導引滾輪22,係引導原料RS;驅動滾輪23,係藉由作為驅動機器的轉動馬達23A驅動,於與夾壓滾輪24之間夾住剝離薄片RL;以及回收滾輪25,係藉由未圖示之驅動機器驅動,對於剝離薄片RL賦予預定的張力而回收。 [0012] 切斷手段30,係具備被支承於作為驅動機器的轉動馬達31的輸出軸31A,並於周面設置有作為切斷構件的切斷刃33的切割滾輪32,以及與切割滾輪32同步旋轉的承接滾輪34,並構成為考慮到剝離板50的剝離邊緣50A的形狀,能夠以使接著薄片AS的剝離開始邊緣ASF不致與該剝離邊緣50A平行的方式形成切口CU。 [0013] 移動手段70,係具備:底板72,係被作為驅動機器的線性馬達71的滑件71A所支承;轉動馬達73,係被底板72所支承,作為對應於形成在接著薄片基材ASB的接著薄片AS的方向,改變被黏物WK的方向的位移手段;支承台74,係被該輸出軸73A所支承,並具有能夠藉由減壓泵浦或真空抽氣機等未圖示的減壓手段支承被黏物WK的支承面74A;以及被黏物方向檢測手段75,係能夠檢測載置於支承面74A上的被黏物WK的方向的照相機或投影機等攝像手段、光學感測器或音波感測器等之各種感測器等。 又,於本實施形態的情形,轉動馬達73,係根據薄片方向檢測手段40的檢測結果改變被黏物WK的方向的構成。 [0014] 說明以上之薄片貼附裝置10的動作。 首先,對於各構件配置在第1圖中以實線所示的初始位置的薄片貼附裝置10,薄片貼附裝置10的使用者(以下僅稱為「使用者」)將原料RS如該圖中所示般進行裝設後,透過操作面板或個人電腦等未圖示的操作手段將自動運轉開始的訊號輸入至未圖示的控制手段。如此,送出手段20及切斷手段30驅動轉動馬達23A、31,而將原料RS送出,並且,同步於該原料RS的送出而使切割滾輪32旋轉,於接著薄片基材ASB形成切口CU而於其內側形成接著薄片AS。 又,於本實施形態的情形,接著薄片AS的平面形狀係如第1圖(B)所示為長方形,切斷手段30,考慮到在從正交於剝離板50的原料引導面50B的方向觀察的正交視角(以下僅稱為「正交視角」)中,剝離邊緣50A的形狀為直線,以使接著薄片AS的剝離開始邊緣ASF與該剝離邊緣50A不致平行的方式,形成切口CU。另外,接著薄片AS,在與原料RS一起被送出之際,藉由薄片方向檢測手段40,如第1圖(B)所示,檢測通過接著薄片AS的2個短邊的中心的中心線CLA與原料RS的送出方向LD之斜率的接著薄片AS的斜率θ1,並檢測其方向。 [0015] 之後,如第1圖(A)、第2圖所示,當開頭的接著薄片AS藉由剝離板50的剝離邊緣50A從剝離薄片RL被以預定長度剝離之情形藉由照相機等攝像手段或光學感測器等未圖示的前端檢測手段受到檢測,則送出手段20及切斷手段30停止轉動馬達23A、31的驅動,成為待命狀態。接著,當藉由使用者或是多關節機械手臂或輸送帶等未圖示的搬運手段,使被黏物WK被載置於支承面74A上,則移動手段70驅動未圖示的減壓手段,開始被黏物WK的吸附保持。 又,於本實施形態之情形,被黏物WK,係採用在第1圖(A)的狀態從上方俯視的俯視觀察下,與接著薄片AS為相同形狀的長方形。 [0016] 之後,移動手段70驅動轉動馬達73及被黏物方向檢測手段75,以使通過被黏物WK的2個短邊的中心的中心線CLW與貼附方向SD的斜率之被黏物WK的斜率θ2,與接著薄片AS的斜率θ1成為相同角度的方式使支承台74旋轉。接著,移動手段70驅動線性馬達71,使支承台74朝向左方移動,當被黏物WK到達預定的位置之情形藉由照相機或投影機等攝像手段、光學感測器或音波感測器等之各種感測器等之未圖示的被黏物檢測手段受到檢測,則送出手段20及切斷手段30驅動轉動馬達23A、31,一邊於接著薄片基材ASB形成接著薄片AS,一邊配合被黏物WK的搬運速度將原料RS送出。藉此,接著薄片AS係如第1圖(A)、第2圖中兩點虛線所示,一邊藉由剝離板50的剝離邊緣50A從剝離薄片RL被剝離,一邊藉由按壓滾輪60被按壓並貼附於被黏物WK的上面。 [0017] 在接著薄片AS整體被貼附於被黏物WK之後,當下個接著薄片AS藉由剝離板50的剝離邊緣50A從剝離薄片RL被以預定長度剝離之情形藉由未圖示的前端檢測手段受到檢測,則送出手段20及切斷手段30停止轉動馬達23A、31的驅動,而再次成為待命狀態。當貼附有接著薄片AS整體之被黏物WK到達按壓滾輪60的左方的預定位置之情形藉由照相機或投影機等攝像手段、光學感測器或音波感測器等之各種感測器等之未圖示的產品檢測手段受到檢測,則移動手段70停止線性馬達71及未圖示之減壓手段的驅動。之後,使用者或是未圖示之搬運手段,將貼附有接著薄片AS的被黏物WK搬運至下個步驟之後,移動手段70驅動各驅動機,使支承台74復位至初始位置,接著重複與前述相同的動作。 [0018] 依據以上般之實施形態,因考慮到剝離板50的剝離邊緣50A的形狀,以使接著薄片AS的剝離開始邊緣ASF不致與該剝離邊緣50A平行的方式形成切口CU,故接著薄片AS不會被剝離板50的剝離邊緣50A一舉將大量的前端部區域剝離,能夠不致因剝離板50發生剝離不良,並將該接著薄片AS貼附被黏物WK。 [0019] 本發明中之手段及步驟,係只要能夠達成針對該等手段及步驟所說明的動作、功能或是步驟則並無限定,更有甚者,並不受藉由前述實施形態所表示的一實施形態的構成物或步驟所限定。例如,送出手段,係只要是能夠將於帶狀的接著薄片基材的接著面暫時接著有帶狀的剝離薄片的原料送出,按照申請當時之技術常識,在其技術範圍內者並無任何限定(針對其他手段及步驟)。 [0020] 送出手段20,係在將接著薄片AS從剝離薄片RL剝離之際,以對於原料RS賦予預定的張力的方式進行轉動馬達23A的轉矩控制亦可,取代支承滾輪21或導引滾輪22等之各滾輪而藉由板狀構件或軸構件等支承或引導原料RS亦可,將並非回捲的原料RS而是藉由例如扇折(fanfold)摺疊的原料RS以能夠送出的方式支承亦可,不將剝離薄片RL回捲而是例如進行扇折摺疊,或是藉由切碎機等切碎而回收亦可,不回收剝離薄片RL亦可。 [0021] 切斷手段30,係只要考慮到剝離板50的剝離邊緣50A的形狀,為接著薄片AS的剝離開始邊緣ASF不致與該剝離邊緣50A平行的切口CU,則形成何種形狀的切口CU,形成何種形狀的接著薄片AS皆可,採用於周面直接設置切斷刃33的切割滾輪32亦可,採用能夠將切斷刃33對於周面裝卸的切割滾輪32,並能夠在周面上變更切斷刃33的方向的構成亦可。又,採用於周面直接設置切斷刃33的切割滾輪32的情形,係只要考慮到剝離板50的剝離邊緣50A的形狀,將接著薄片AS的剝離開始邊緣ASF不致與該剝離邊緣50A平行的切斷刃33,預先形成於切割滾輪32的周面即可,在採用能夠對於切割滾輪32的周面裝卸的切斷刃33的情形,係只要考慮到剝離板50的剝離邊緣50A的形狀,以使接著薄片AS的剝離開始邊緣ASF不致與該剝離邊緣50A平行的方式,將能夠裝卸的切斷刃33安裝於切割滾輪32的周面即可。 [0022] 薄片方向檢測手段40,係藉由檢測通過形成於接著薄片基材ASB的接著薄片AS的2個長邊的中心的中心線與原料RS的送出方向LD的斜率而檢測其方向亦可,藉由檢測接著薄片AS的一邊的斜率而檢測其方向亦可,觀察接著薄片AS的整體圖像而檢測該接著薄片AS的方向亦可,觀察記於接著薄片AS的外緣的一部分,或是接著薄片AS的花紋、文字、印記,或是層疊於接著薄片AS上之物等的預定的部分而檢測該接著薄片AS的方向亦可,只要能夠檢測形成於接著薄片基材ASB的接著薄片AS的方向,採用任何檢測方法皆可,於本發明之薄片貼附裝置10不具備亦可。 [0023] 剝離手段,係具備正交視角下為圓弧形或其他形狀的剝離邊緣亦可,在如此情形,切斷手段30,係考慮到剝離手段的剝離邊緣的形狀於正交視角下為圓弧形或其他形狀,而藉由於接著薄片AS的剝離開始邊緣ASF形成與剝離邊緣的形狀相同的圓弧部或其他形狀部,以使該剝離開始邊緣ASF與剝離邊緣不致平行的方式,形成切口CU即可。 [0024] 按壓手段,係具備作為使按壓滾輪60遠離、接近被黏物WK的按壓手段接離手段之驅動機器,防止對於被黏物WK施加有應力或損傷亦可,作為如此之按壓手段接離手段,除了驅動機器以外藉由手動使按壓滾輪60移動者亦可。 [0025] 移動手段70,在使被黏物WK的方向配合形成於接著薄片基材ASB的接著薄片AS的方向之際,預先得知載置於支承面74A上的被黏物WK的方向的情形,不採用被黏物方向檢測手段75,而根據薄片方向檢測手段40的檢測結果,使支承台74旋轉即可,根據薄片方向檢測手段40的檢測結果,配合接著薄片AS的方向使被黏物WK載置於支承台74上的情形,使轉動馬達73不旋轉或去除轉動馬達73亦可,在形成於接著薄片基材ASB的接著薄片AS的方向為一定的方向的情形,若構成為配合接著薄片AS的一定的方向將被黏物WK載置於支承台74上,沒有轉動馬達73、薄片方向檢測手段40及被黏物方向檢測手段75當中至少1者亦可。 移動手段70,係使被黏物WK不移動,或是一邊移動一邊使剝離板50及按壓滾輪60等移動亦可,不採用薄片方向檢測手段40或被黏物方向檢測手段75,藉由人手操作控制器等而使轉動馬達73旋轉亦可,作為位移手段,採用具備被支承於底板72上以使支承台74能夠旋轉的方式進行支承的旋轉構件,以及能夠抑制支承台74的旋轉的固定手段者,並在藉由人手使支承台74旋轉之後,藉由人手以固定手段抑制支承台74的旋轉亦可,在藉由其他裝置使剝離板50及按壓滾輪60等與被黏物WK相對移動的情形,於本發明之薄片貼附裝置10不具備亦可。 [0026] 薄片貼附裝置10,係上下顛倒配置或橫向配置,將接著薄片AS貼附於被黏物WK亦可。 被黏物WK及接著薄片AS的形狀,為正方形亦可,為三角形或五角形以上的多角形、圓形、橢圓形等相同形狀亦可,非相同形狀亦可,其大小為相同亦可,為不同大小亦可。 [0027] 另外,本發明中之接著薄片基材ASB、接著薄片AS以及被黏物WK的材質、種類、形狀等,並未特別限定。例如,接著薄片AS,係圓形、橢圓形、三角形或四角形等多角形,或其他形狀亦可,亦可為感壓接著性、感熱接著性等接著形態者,在採用感熱接著性的接著薄片基材ASB或接著薄片AS的情形,藉由設置加熱該等的適當的線圈加熱器或熱管的加熱側等之加熱手段的適當方法進行接著亦可。另外,如此之接著薄片基材ASB或接著薄片AS,係例如僅接著劑層之單層者、在基材與接著劑層之間具有中間層者、在基材的上面具有覆蓋層等之3層以上者,更有甚者,亦可為能夠從接著劑層將基材剝離的所謂兩面接著薄片般者,兩面接著薄片,係具有單層或是複層之中間層者,或是不具有中間層的單層或是複層者亦可。另外,作為被黏物WK,能夠以例如食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等半導體晶圓、電路基板、光碟等資訊紀錄基板、玻璃板、鋼板、陶器、木板或是樹脂等單體亦可,為以該等2個以上所形成的複合物亦可,任意形態的構件或物品等亦能夠作為對象。又,接著薄片AS,若以功能性、用途性之角度來看,係例如資訊記載用標籤、裝飾用標籤、保護薄片、切割膠帶、晶片貼附薄膜、黏晶膠帶、紀錄層形成樹脂薄片等之任意的薄片、薄膜、膠帶等亦可。 [0028] 前述實施形態中之驅動機器,係能夠採用轉動馬達、直動馬達、線性馬達、單軸機械手臂、多關節機械手臂等電動機器、氣壓缸、油壓缸、無桿汽缸及旋轉汽缸等致動器等,並能夠採用將該等直接或間接組合者。 於前述實施形態中,在採用滾輪的情形,具備將滾輪旋轉驅動的驅動機器亦可,將滾輪的表面或滾輪本身以橡膠或樹脂等能夠變形的構件構成亦可,將滾輪的表面或滾輪本身以不變形的構件構成亦可,在採用按壓滾輪或按壓頭等按壓手段或按壓構件的情形,取代或併用前述所例示者,採用滾輪、圓棒、刮刀材、橡膠、樹脂、海綿等之構件,或是藉由噴吹大氣或氣體等之氣體而進行按壓的構成亦可,將按壓手段或按壓構件以橡膠或樹脂等能夠變形的構件構成亦可,以不變形的構件構成亦可,在採用剝離板或剝離滾輪等剝離手段或剝離構件的情形,取代或併用前述所例示者,採用板狀構件、圓棒、滾輪等之構件亦可,將剝離手段或剝離構件以橡膠或樹脂等能夠變形的構件構成亦可,以不變形的構件構成亦可,在採用將支承(保持)手段或支承(保持)構件等之將被支承構件進行支承或保持者的情形,採用機械式夾具或夾持筒等把持手段、藉由庫倫力、接著劑、黏著劑、磁力、白努力吸附、驅動機器等將被支承構件作支承(保持)的構成亦可,在採用切斷手段或切斷構件的情形,亦可取代或併用前述所例示者,採用藉由裁切刀、雷射切割器、離子束、火力、熱、水壓、電熱線、噴吹氣體或液體等進行切斷者,或是藉由組合了適當的驅動機器者使進行切斷者移動而進行切斷亦可。在採用推彈手段的情形,以彈簧、橡膠、樹脂等構成亦可。[0009] Hereinafter, one embodiment of the present invention will be described according to the drawings. Furthermore, the X-axis, Y-axis, and Z-axis in this embodiment are in an orthogonal relationship, the X-axis and the Y-axis are axes in a predetermined plane, and the Z-axis is an axis that is orthogonal to the predetermined plane. Furthermore, in the present embodiment, when the directions are shown based on the situation viewed from the hand direction in the first figure parallel to the Y axis, "up" refers to the arrow direction of the Z axis and "down" refers to the opposite. "Left" is the direction of the arrow on the X-axis and "right" is the opposite direction, "front" is the direction of the hand in the first figure parallel to the Y-axis, and "rear" is the opposite direction. In FIG. 1, the
[0029]10‧‧‧薄片貼附裝置20‧‧‧送出手段30‧‧‧切斷手段40‧‧‧薄片方向檢測手段50‧‧‧剝離板(剝離手段)50A‧‧‧剝離邊緣60‧‧‧按壓滾輪(按壓手段)70‧‧‧移動手段73‧‧‧轉動馬達(位移手段)AS‧‧‧接著薄片ASB‧‧‧接著薄片基材ASF‧‧‧剝離開始邊緣AS1‧‧‧接著面CU‧‧‧切口RL‧‧‧剝離薄片RS‧‧‧原料WK‧‧‧被黏物[0029] 10‧‧‧
[0008] [第1圖] (A)係表示本發明之一實施形態之薄片貼附裝置的側視圖。(B)係第1圖(A)的補充圖。 [第2圖] 第1圖(A)的立體圖。[0008] [FIG. 1] (A) is a side view showing a sheet sticking device according to an embodiment of the present invention. (B) is a supplement to Figure 1 (A). [Figure 2] The perspective view of Figure 1 (A).
10‧‧‧薄片貼附裝置 10‧‧‧Sheet Attachment Device
20‧‧‧送出手段 20‧‧‧Means of sending
21‧‧‧支承滾輪 21‧‧‧Support roller
22‧‧‧導引滾輪 22‧‧‧Guide roller
23‧‧‧驅動滾輪 23‧‧‧Drive roller
23A‧‧‧轉動馬達 23A‧‧‧Rotating motor
24‧‧‧夾壓滾輪 24‧‧‧Clamping roller
25‧‧‧回收滾輪 25‧‧‧Recycling rollers
30‧‧‧切斷手段 30‧‧‧Means of cutting
31‧‧‧轉動馬達 31‧‧‧Rotating the motor
31A‧‧‧輸出軸 31A‧‧‧Output shaft
32‧‧‧切割滾輪 32‧‧‧Cutting rollers
33‧‧‧切斷刃 33‧‧‧Cutting blade
34‧‧‧承接滾輪 34‧‧‧Receiving rollers
40‧‧‧薄片方向檢測手段 40‧‧‧Slice orientation detection method
50‧‧‧剝離板(剝離手段) 50‧‧‧Peeling sheet (peeling means)
50A‧‧‧剝離邊緣 50A‧‧‧Peeling edge
50B‧‧‧原料引導面 50B‧‧‧Material guide surface
60‧‧‧按壓滾輪(按壓手段) 60‧‧‧Press the roller (pressing means)
70‧‧‧移動手段 70‧‧‧Means of movement
71‧‧‧線性馬達 71‧‧‧Linear motors
71A‧‧‧滑件 71A‧‧‧Slide
72‧‧‧底板 72‧‧‧Bottom
73‧‧‧轉動馬達(位移手段) 73‧‧‧Rotating motor (displacement means)
73A‧‧‧輸出軸 73A‧‧‧Output shaft
74‧‧‧支承台 74‧‧‧Support table
74A‧‧‧支承面 74A‧‧‧Support surface
75‧‧‧被黏物方向檢測手段 75‧‧‧Measurement of the direction of the adherend
AS‧‧‧接著薄片 AS‧‧‧adhesive sheet
AS1‧‧‧接著面 AS1‧‧‧Following
ASB‧‧‧接著薄片基材 ASB‧‧‧adhesive sheet substrate
ASF‧‧‧剝離開始邊緣 ASF‧‧‧Peeling start edge
CU‧‧‧切口 CU‧‧‧Cutting
RL‧‧‧剝離薄片 RL‧‧‧Peeling sheet
RS‧‧‧原料 RS‧‧‧Materials
SD‧‧‧貼附方向 SD‧‧‧Attaching direction
WK‧‧‧被黏物 WK‧‧‧Adhesion
LD‧‧‧送出方向 LD‧‧‧Send Direction
CLA‧‧‧中心線 CLA‧‧‧Centerline
θ1‧‧‧斜率 θ1‧‧‧Slope
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CN110466854A (en) * | 2019-09-17 | 2019-11-19 | 成都芯瑞科技股份有限公司 | A kind of automatic labeling label device for optical module |
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JPH02191137A (en) * | 1988-09-22 | 1990-07-27 | R Ancker Jorgensen As | Method and apparatus for imparting label |
JPH04311443A (en) * | 1991-03-29 | 1992-11-04 | Kawasaki Steel Corp | Tape with adhesive sheet piece and peeling-off of adhesive sheet piece |
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