TWI752134B - Scoring wheel - Google Patents
Scoring wheel Download PDFInfo
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- TWI752134B TWI752134B TW106142887A TW106142887A TWI752134B TW I752134 B TWI752134 B TW I752134B TW 106142887 A TW106142887 A TW 106142887A TW 106142887 A TW106142887 A TW 106142887A TW I752134 B TWI752134 B TW I752134B
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- groove portion
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
本發明提供一種可藉由簡單之構成而有效抑制玻璃屑產生之劃線輪。 The present invention provides a scribing wheel capable of effectively suppressing the generation of glass dust with a simple structure.
劃線輪100具備:複數個刀部101,其等沿外周緣形成;及複數個槽部102,其等設置於在周向上相鄰之刀部101之間,且朝中心軸側凹陷。槽部102包含沿周向觀察時呈朝自中心軸L0離開之方向凸之曲面。曲面之曲率半徑隨著自槽部102與刀部101之邊界往槽部102之周向中央之槽底而逐漸變大。至少槽底藉由劃線輪100之滾動而按壓基板之上表面,使其產生彈性變形,減少因塑性變形引起之玻璃屑。 The scribing wheel 100 includes a plurality of blade portions 101 formed along the outer peripheral edge, and a plurality of groove portions 102 provided between the adjacent blade portions 101 in the circumferential direction and recessed toward the center axis side. The groove portion 102 includes a curved surface that is convex in a direction away from the central axis L0 when viewed in the circumferential direction. The curvature radius of the curved surface gradually increases from the boundary between the groove portion 102 and the blade portion 101 to the groove bottom in the circumferential center of the groove portion 102 . At least the bottom of the groove presses the upper surface of the substrate by the rolling of the scribing wheel 100 to cause elastic deformation to reduce the glass chips caused by plastic deformation.
Description
本發明係關於用以於玻璃基板等脆性材料基板形成劃線之劃線輪。 The present invention relates to a scribing wheel for forming scribing lines on brittle material substrates such as glass substrates.
玻璃基板等脆性材料基板之分斷係藉由如下步驟進行:於基板表面形成劃線之劃線步驟;及沿形成之劃線將基板分斷之裂斷步驟。於劃線步驟中,使劃線輪一面按壓於基板表面一面沿特定之線移動。藉此,劃線輪於基板表面滾動,而形成劃線。 The breaking of brittle material substrates such as glass substrates is performed by the following steps: a scribing step of forming a scribe line on the surface of the substrate; and a breaking step of breaking the substrate along the formed scribe line. In the scribing step, the scribing wheel is moved along a specific line while being pressed against the surface of the substrate. Thereby, the scribing wheel rolls on the surface of the substrate to form a scribing line.
於以下之專利文獻1中記載有於脊線形成有槽之劃線輪。藉由使用該構成之劃線輪,可從對基板開始劃線後立即確實地形成垂直裂紋,且可形成較深之垂直裂紋。但是,於劃線動作時,易產生相當於槽之形狀之比較大的玻璃屑。
The following
相對於此,於以下之專利文獻2、3中,揭示有一種劃線輪,其亦於劃線輪之傾斜面形成槽,進而亦於槽內形成脊線,從而可抑制自劃線偏離之裂紋之產生。
On the other hand, the following
[專利文獻1]日本專利特開平09-188534號公報 [Patent Document 1] Japanese Patent Laid-Open No. 09-188534
[專利文獻2]國際公開WO2008/087612號 [Patent Document 2] International Publication No. WO2008/087612
[專利文獻3]日本專利特開2010-132542號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2010-132542
於上述專利文獻2、3記載之劃線輪中,不易產生由自劃線輪偏離之裂紋相連而形成之較大的玻璃屑。然而,於上述專利文獻2、3記載之劃線輪中,因槽內之尖脊線咬入基板,故仍難以抑制由基板表面之塑性變形引起的玻璃屑之產生。
In the scribing wheels described in the above-mentioned
鑑於上述問題,本發明之目的係提供一種可藉由簡單之構成而有效抑制玻璃屑產生之劃線輪。 In view of the above-mentioned problems, an object of the present invention is to provide a scribing wheel that can effectively suppress the generation of glass chips with a simple structure.
本發明之主要態樣係關於用以於基板形成劃線之劃線輪。該態樣之劃線輪具備:複數個刀部,其等沿外周緣形成;及複數個槽部,其等設置於在周向上相鄰之上述刀部之間,且朝中心軸側凹陷。上述槽部包含沿上述周向觀察時呈朝自上述中心軸離開之方向凸之曲面,上述曲面之曲率半徑隨著自上述槽部與上述刀部之邊界往上述槽部之槽底而逐漸變大。至少上述槽底藉由上述劃線輪之滾動而按壓上述基板之上表面,使其產生彈性變形。 A major aspect of the present invention relates to a scribing wheel for forming scribing lines on a substrate. The scribing wheel of this aspect includes a plurality of blade portions formed along the outer periphery, and a plurality of groove portions provided between the aforementioned blade portions adjacent in the circumferential direction and recessed toward the center axis side. The groove portion includes a curved surface that is convex in a direction away from the central axis when viewed along the circumferential direction, and the curvature radius of the curved surface gradually changes from the boundary between the groove portion and the blade portion to the groove bottom of the groove portion. big. At least the groove bottom is pressed against the upper surface of the substrate by the rolling of the scribing wheel, so as to cause elastic deformation.
根據本態樣之劃線輪,由於槽部包含呈朝自劃線輪之中心軸離開之方向凸之曲面,故劃線輪滾動因而槽部與基板成為對向時,不會如槽部內形成有尖脊線之先前之劃線輪般使得槽部內之尖脊線較深地咬入基板。因此,不易產生玻璃屑。又,至少槽底藉由上述劃線輪之滾動而按壓上述基板之上表面,對基板賦予荷重,但僅使基板彈性變形而不易塑性變形,故至少在槽底與基板對向期間,基於塑性變形產生玻璃屑之情形較少。因此,根據本態樣之劃線輪,可藉由將槽部設為曲面之簡單構成,而有效抑制玻璃屑之產生。 According to the scribing wheel of this aspect, since the groove portion includes a curved surface that is convex in the direction away from the central axis of the scribing wheel, when the scribing wheel rolls and the groove portion and the substrate face each other, the groove portion is not formed as the groove portion. The previous scribing wheel of the sharp ridge line generally causes the sharp ridge line within the groove to bite deeper into the substrate. Therefore, glass dust is not easily generated. In addition, at least the groove bottom is pressed against the upper surface of the substrate by the rolling of the scribing wheel, and a load is applied to the substrate, but the substrate is only elastically deformed and not easily plastically deformed. Deformation produces less glass debris. Therefore, according to the scribing wheel of this aspect, generation|occurrence|production of glass dust can be suppressed effectively by the simple structure of making a groove part into a curved surface.
於本態樣之劃線輪中,上述槽底可構成為沿上述周向於特定範圍連續。如此則可增長彈性變形之範圍。因此,可抑制槽部之玻璃屑之產生,且劃線輪之刀部間歇地咬入基板,而可有效地於基板形成垂直裂紋。 In the scribing wheel of this aspect, the groove bottom may be configured to be continuous in a specific range along the circumferential direction. In this way, the range of elastic deformation can be increased. Therefore, generation of glass dust in the groove portion can be suppressed, and the blade portion of the scribing wheel can intermittently bite into the substrate, thereby effectively forming vertical cracks in the substrate.
於本態樣之劃線輪中,上述槽底之曲率半徑較佳為4μm以上(通常為20μm以下)。或者,上述槽部之曲率半徑較佳為上述刀部之曲率半徑之2.5倍以上(通常為8倍以下)。如此則槽底可確實使基板產生彈性變形,而有效抑制因塑性變形之玻璃屑之產生。刀部之曲率半徑通常為1μm以上2.5μm以下。 In the scribing wheel of this aspect, the curvature radius of the groove bottom is preferably 4 μm or more (usually 20 μm or less). Alternatively, the radius of curvature of the groove portion is preferably 2.5 times or more (usually 8 times or less) of the radius of curvature of the blade portion. In this way, the bottom of the groove can indeed elastically deform the substrate, thereby effectively suppressing the generation of glass chips due to plastic deformation. The radius of curvature of the blade portion is usually 1 μm or more and 2.5 μm or less.
如上所述,根據本發明,可提供一種劃線輪,其可藉由簡單之構成形成較深之垂直裂紋,且可於劃線開始後立即確實形成垂直裂紋,且可有效抑制玻璃屑之產生。 As described above, according to the present invention, it is possible to provide a scribing wheel which can form deep vertical cracks with a simple structure, can reliably form vertical cracks immediately after the start of scribing, and can effectively suppress the generation of glass chips .
本發明之效果乃至意義由以下所示之實施形態之說明當更加明確。惟以下所示之實施形態僅為實施本發明時之例示之一,本發明一概不受限於以下之實施形態所記載者。 The effect and meaning of this invention will become clearer from the description of the embodiment shown below. However, the embodiment shown below is merely an example for implementing the present invention, and the present invention is not limited to what is described in the following embodiment.
100:劃線輪 100: Scribing wheel
101:刀部 101: Knife Department
102:槽部 102: Groove
100a:傾斜面 100a: Inclined surface
100b:圓形孔 100b: round hole
200:基板 200: Substrate
201:垂直裂紋 201: Vertical Crack
d:槽之深度 d: depth of groove
L0:中心軸 L0: Center axis
p:節距 p: pitch
X、Y、Z:方向 X, Y, Z: direction
圖1(a)、(b)分別為模式性顯示實施形態之劃線輪之前視圖及側視圖。圖1(c)係將實施形態之劃線輪之外周附近之一部分放大顯示之圖。 Figures 1(a) and (b) are a front view and a side view of the scribing wheel schematically showing the embodiment, respectively. Fig. 1(c) is an enlarged view showing a part of the vicinity of the outer periphery of the scribing wheel according to the embodiment.
圖2(a)係於刀部之位置在與中心軸平行之平面將實施形態之劃線輪於徑向切斷之剖視圖。圖2(b)、(c)分別為於槽部之位置在與中心軸平行之平面將實施形態之劃線輪於徑向切斷之剖視圖。 Fig. 2(a) is a cross-sectional view of cutting the scribing wheel of the embodiment in a radial direction on a plane parallel to the central axis at the position of the blade. Figures 2(b) and (c) are cross-sectional views of the scribing wheel of the embodiment cut radially at the position of the groove portion on a plane parallel to the central axis.
圖3(a)係模式性顯示實施形態之劃線輪之刀部與基板對向時之垂直裂紋之形成狀態之圖。圖3(b)、(c)分別為模式性顯示實施形態之劃線輪之槽 部與基板對向時之垂直裂紋之形成狀態之圖。圖3(d)係模式性顯示槽內部之具有尖脊線之先前之劃線輪之槽部與基板對向時之垂直裂紋之形成狀態之圖。 Fig.3 (a) is a figure which shows typically the formation state of the vertical crack when the blade part of the scribing wheel of embodiment opposes a board|substrate. Figures 3(b) and (c) schematically show the grooves of the scribing wheel according to the embodiment The figure shows the formation state of the vertical crack when the part faces the substrate. Fig. 3(d) is a diagram schematically showing the formation state of vertical cracks when the groove portion of the previous scribing wheel with sharp ridge lines in the groove faces the substrate.
圖4(a)係拍攝實施例之劃線輪之刀部與槽部之照片。圖4(b)係拍攝比較例1之劃線輪之刀部與槽部之照片。 Fig. 4(a) is a photograph of the knife portion and the groove portion of the scribing wheel of the embodiment. FIG. 4( b ) is a photograph of the knife portion and the groove portion of the scribing wheel of Comparative Example 1. FIG.
圖5(a)係拍攝實施例之劃線輪之刀部與槽部之照片。圖5(b)係於周向測定實施例之劃線輪之刀部與槽部之徑向之高度之圖表。圖5(c)係於厚度方向測定實施例之劃線輪之槽部之徑向之高度之圖表。 Fig. 5(a) is a photograph of the knife portion and the groove portion of the scribing wheel of the embodiment. Fig. 5(b) is a graph of measuring the heights of the blade portion and the radial direction of the groove portion of the scribing wheel of the embodiment in the circumferential direction. Fig. 5(c) is a graph of measuring the height in the radial direction of the groove portion of the scribing wheel of the embodiment in the thickness direction.
圖6(a)係拍攝比較例1之劃線輪之刀部與槽部之照片。圖6(b)係於周向測定比較例1之劃線輪之刀部與槽部之徑向之高度之圖表。圖6(c)係於厚度方向測定比較例1之劃線輪之槽部之槽部的徑向之高度之圖表。 FIG. 6( a ) is a photograph of the knife portion and the groove portion of the scribing wheel of Comparative Example 1. FIG. Fig. 6(b) is a graph of measuring the height of the blade portion and the radial direction of the groove portion of the scribing wheel of Comparative Example 1 in the circumferential direction. FIG.6(c) is a graph which measured the height of the radial direction of the groove part of the groove part of the scribing wheel of Comparative Example 1 in the thickness direction.
圖7(a)係顯示實施例之刀部及槽部之曲率半徑之測定位置與其值之圖。圖7(b)~(d)係於厚度方向測定圖7(a)之各測定位置之劃線輪之外周部的徑向之高度之圖表。 Fig.7 (a) is a figure which shows the measurement position and the value of the curvature radius of the blade part and the groove part of an Example. FIGS. 7( b ) to ( d ) are graphs of measuring the height in the radial direction of the outer peripheral portion of the scribing wheel at each measurement position of FIG. 7( a ) in the thickness direction.
圖8(a)係顯示實施例之槽部之曲率半徑之測定位置與其值之圖。圖8(b)~(d)係於厚度方向測定圖8(a)之各測定位置之劃線輪之外周部的徑向之高度之圖表。 FIG. 8( a ) is a diagram showing the measured positions and values of the radius of curvature of the grooves in the example. FIGS. 8( b ) to ( d ) are graphs of measuring the height in the radial direction of the outer peripheral portion of the scribing wheel at each measurement position of FIG. 8( a ) in the thickness direction.
圖9(a)係顯示比較例2之刀部及槽部之曲率半徑之測定位置與其值之圖。圖9(b)~(d)係於厚度方向測定圖9(a)之各測定位置之劃線輪之外周部的徑向之高度之圖表。 FIG. 9( a ) is a diagram showing the measured positions and values of the radius of curvature of the blade portion and the groove portion of Comparative Example 2. FIG. FIGS. 9( b ) to ( d ) are graphs of measuring the height in the radial direction of the outer peripheral portion of the scribing wheel at each measurement position of FIG. 9( a ) in the thickness direction.
圖10(a)係顯示比較例2之槽部之曲率半徑之測定位置與其值之圖。圖10(b)~(d)係於厚度方向測定圖10(a)之各測定位置之劃線輪之外周部的徑向之高度之圖表。 FIG. 10( a ) is a diagram showing the measured positions and values of the radius of curvature of the grooves in Comparative Example 2. FIG. FIGS. 10( b ) to ( d ) are graphs of measuring the height in the radial direction of the outer peripheral portion of the scribing wheel at each measurement position of FIG. 10( a ) in the thickness direction.
圖11(a)~(d)分別為拍攝以實施例(No.1)、實施例(No.2)、比較例2及比較例1之劃線輪對評估用玻璃板劃線時之凹痕之照片。 Figures 11(a) to (d) show the concave when scribing the glass plate for evaluation with the scribing wheel of Example (No. 1), Example (No. 2), Comparative Example 2 and Comparative Example 1, respectively. Photo of scars.
圖12(a)係顯示由實施例(No.1、No.2)之劃線輪100對玻璃板劃線時之玻璃屑之產生狀況(實驗結果)之圖。圖12(b)係顯示由比較例1、2之劃線輪100對玻璃板劃線時之玻璃屑之產生狀況(實驗結果)之圖。
FIG. 12( a ) is a diagram showing the generation of glass chips (experimental results) when the glass plate is scribed by the
以下參照圖式,對本發明之實施形態進行說明。另,為方便起見,對各圖標註互相正交之X軸、Y軸及Z軸。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, for the sake of convenience, the X-axis, the Y-axis, and the Z-axis which are orthogonal to each other are denoted in each drawing.
圖1(a)、(b)分別為模式性顯示劃線輪100之構成之前視圖及側視圖。圖1(c)係將劃線輪100之外周附近之一部分放大顯示之圖。
FIGS. 1( a ) and ( b ) are a front view and a side view schematically showing the structure of the
劃線輪100具有將外周部兩側之邊緣傾斜切去之圓板形狀。於劃線輪100之外周部,形成有於側視時彼此於不同方向傾斜之2個傾斜面100a。藉由2個傾斜面100a交叉,而形成複數個刀部101,進而於周向上相鄰之各刀部101之間,形成有朝中心軸L0側凹陷之槽部102。周向上之各刀部101之長度互為相等。又,周向上之各槽部102之長度亦互為相等。因此,周向上之刀部101之節距為固定,且周向之槽部102之節距亦為固定。
The
劃線輪100係藉由超硬合金、燒結金剛石、單結晶金剛石或多結晶金剛石等形成。於劃線輪100之中央,形成有供***成為旋轉軸之軸的圓形之孔100b。劃線輪100之直徑為1mm~5mm左右,厚度為0.4~1mm左右。又,刀部101之角度,即2個傾斜面100a所成之角度為100~160°左右,孔100b之直徑為0.4~1.5mm左右。
The
槽之節距p(1個槽之劃線輪之周向之長度(L1)與1個刀部之劃線輪之 周向之長度(L2)之和)例如為10~100μm左右。槽之深度d(刀部之脊線與槽之底部之劃線輪之徑向之高度差)例如為1~10μm左右。較劃線輪外周之刀部之脊線更為凹陷之區域之長度即槽之周向之長度(L1)例如為3~40μm左右。刀部(夾在相鄰的槽之間之區域)之脊線之長度(L2)相對於槽之周向之長度(L1)之比(L1/L2)例如為0.5~5.0。 The pitch p of the grooves (the circumferential length (L1) of the scribing wheel of one groove and the scribing wheel of one knife part The sum of the lengths (L2) in the circumferential direction) is, for example, about 10 to 100 μm. The depth d of the groove (the height difference between the ridge line of the blade portion and the radial direction of the scribing wheel at the bottom of the groove) is, for example, about 1 to 10 μm. The length of the region which is more concave than the ridge line of the blade portion of the outer periphery of the scribing wheel, that is, the length (L1) in the circumferential direction of the groove is, for example, about 3 to 40 μm. The ratio (L1/L2) of the length (L2) of the ridge line of the blade portion (region sandwiched between adjacent grooves) to the length (L1) in the circumferential direction of the groove is, for example, 0.5 to 5.0.
槽部102包含沿周向觀察時呈朝自中心軸L0離開之方向凸之曲面。又,曲面之劃線輪之徑向之剖面的曲率半徑自槽部102與刀部101之邊界往槽部102之周向中央之槽底逐漸變大。
The
圖2(a)係於刀部101之位置在與中心軸L0平行之平面(Y-Z平面)將劃線輪100於徑向切斷之剖視圖。圖2(b)、(c)分別為於槽部102之位置在與中心軸L0平行之平面(Y-Z平面)將劃線輪100於徑向切斷之剖視圖。圖2(a)~(c)分別為圖1(c)之A-A'位置、B-B'位置及C-C'位置之剖視圖。
FIG. 2( a ) is a cross-sectional view of the
如圖2(a)所示,於周向觀察時之刀部101之剖面形狀為特定角度之V字形狀。即使假設刀部101之剖面形狀為V字形狀之圓角之圓弧狀的曲面形狀,其曲率半徑R亦為2μm以下。若周向之位置自刀部101向槽部102移行,則於周向觀察時之槽部102之剖面形狀如圖2(b)所示,成為V字形狀之圓角之圓弧狀的曲面形狀。圖2(b)係周向之位置位在槽部102之肩上脊線位置時之劃線輪之徑向之剖視圖。此時之肩上脊線位置之高度較刀部101之脊線之高度僅低D1。
As shown in FIG. 2( a ), the cross-sectional shape of the
再者,若周向之位置自刀部101之肩上脊線位置向刀部101中央之槽底脊線位置移行,則於周向觀察時之槽部102之剖面形狀如圖2(c)所示,成為於槽部102之所有範圍內曲率半徑最大之圓弧形狀。此時之槽底脊線位置之高度較刀部101之脊線之高度僅低D2。
Furthermore, if the position in the circumferential direction moves from the position of the upper ridge line on the shoulder of the
如此,槽部102之曲面形狀為其曲率半徑隨著自與刀部101之邊界朝向槽底而逐漸變大。又,槽部102之周向之脊線隨著自與刀部101之邊界朝向槽底而相對於刀部101之脊線逐漸變低,於靠近劃線輪100之中心軸L0之方向(Y軸負方向)後退。
In this way, the curved surface shape of the
另,槽部102之槽底於周向於一定範圍連續。即,圖2(c)所示之槽部102之曲面形狀與刀部101之落差(深度)維持在D2,而於周向連續一定距離。其後,槽部102之曲率半徑隨著周向之位置自槽底脊線位置朝向與下一刀部101之邊界而逐漸變小,且槽部102相對於刀部101之落差減少。即,槽部102之剖面形狀經過圖2(b)之剖面形狀,而向圖2(a)之刀部101之剖面形狀接近。如此,槽部102與下一刀部101相連。槽部102之脊線之形狀於周向大致對稱。槽部102例如藉由雷射加工而形成。
In addition, the groove bottom of the
接著,針對於劃線動作時,劃線輪100於基板200之表面滾動時之刀部101及槽部102之作用進行說明。
Next, the functions of the
圖3(a)係模式性顯示劃線輪100之刀部101與基板200對向時之垂直裂紋201之形成狀態之圖。圖3(b)、(c)分別為模式性顯示劃線輪100之槽部102與基板200對向時之垂直裂紋201之形成狀態之圖。圖3(d)係模式性顯示槽內部之具有尖脊線之先前之劃線輪之槽部與基板對向時之垂直裂紋201之形成狀態之圖。
FIG. 3( a ) is a diagram schematically showing the formation state of the
如圖3(a)所示,若劃線輪100之刀部101與基板200對向,則刀部101咬入基板200,基板200產生塑性變形且於其下方形成垂直裂紋201。基板200例如為厚度1mm以下之玻璃基板。刀部101與基板200對向期間,若因刀部101引起塑性變形,則基板200之垂直裂紋201持續伸展。
As shown in FIG. 3( a ), if the
其後,若藉由劃線輪100之滾動,如圖3(b)所示,劃線輪100之槽部
102與基板200成為對向,則隨著槽部102之曲率半徑之變化,槽部102成為緩慢地自垂直裂紋201退避之狀態。且,若槽部102之曲率半徑達到特定大小,則槽部102在自垂直裂紋201完全退避之狀態下與基板200之上表面相接,而僅按壓基板200之上表面。如圖3(c)所示,在槽部102之槽底與基板200對向之狀態下,槽部102按壓基板200之上表面。
After that, by rolling the
槽部102按壓基板200之上表面期間(區域),基板200藉由槽部102之按壓,而如圖3(c)所示彈性變形。藉由該按壓,使得剛由刀部形成之垂直裂紋201伸展。如此,亦於槽部102之抵接位置形成垂直裂紋201。
When the
另一方面,槽內部之具有尖脊線之先前之劃線輪之槽部與基板對向時,如圖3(d)所示,槽內部之尖脊線亦容易咬入基板200。因此,槽部與基板200對向期間亦容易產生塑性變形,而於劃線中自刀部向槽部連續產生塑性變形。
On the other hand, when the groove portion of the previous scribing wheel with sharp ridge lines in the groove faces the substrate, as shown in FIG. Therefore, while the groove portion is facing the
如此,根據本實施形態之劃線輪100,槽部102之槽底按壓基板200之上表面,使其產生彈性變形,且僅會使剛由刀部101形成之垂直裂紋201伸展。因此,至少槽底與基板200對向期間,基於塑性變形而產生之玻璃屑變少。又,槽部102包含呈朝自劃線輪100之中心軸L0離開之方向凸之曲面,於槽部102內未形成尖脊線,故當劃線輪100滾動因而槽部102與基板成為對向時,不會有於槽部102內尖脊線咬入基板200而產生塑性變形之情形。藉此,可有效抑制玻璃屑之產生。
Thus, according to the
又,由於槽部102包含呈朝自中心軸L0離開之方向凸之曲面,故與基板200之接觸位置自刀部101向槽部102移行時,自刀部101咬入之狀態變成槽部102自垂直裂紋201緩慢抽離而退避之狀態,不會對垂直裂紋201施加較大衝擊。藉此,即使於該期間亦可抑制玻璃屑之產生。
In addition, since the
<實驗> <Experiment>
本案發明者等藉由實驗而確認使用上述構成之劃線輪100之情形之效果。於實驗中,將上述構成之劃線輪100(實施例)與2個比較例(比較例1、2)進行對比,驗證玻璃屑之產生狀況。以下,針對該實驗及實驗結果,參照圖式進行說明。
The inventors of the present invention and others have confirmed the effect of the case of using the
圖4(a)係拍攝實施例之劃線輪100之刀部101與槽部102之照片。圖4(b)係拍攝比較例1之劃線輪100之刀部101與槽部102之照片。圖4(a)、(b)之照片係在與劃線輪100之外周之脊線平行的方向拍攝刀部101與槽部102者。更黑之部分為槽部102。
FIG. 4( a ) is a photograph of the
實施例之劃線輪100如參照圖1(a)~圖2(c)說明,藉由曲率半徑往槽底逐漸變大之凸狀曲面而形成槽部102。相對於此,於比較例1中,槽部102成為沿著與劃線輪100之中心軸L0平行之圓柱之外側面之形狀。
The
圖5(a)係拍攝實施例之劃線輪100之刀部101與槽部102之照片。圖5(a)之照片係在劃線輪100之徑向拍攝刀部101與槽部102者。與A-A'線平行之方向為劃線輪100之周向,與B-B'線平行之方向為劃線輪100之厚度方向。A-A'線設定在槽部102之厚度方向之中央位置,B-B'線設定在槽部102之周向之中央位置。
FIG. 5( a ) is a photograph of the
圖5(b)係於周向測定實施例之劃線輪100之刀部101與槽部102之徑向之高度之圖表。圖5(b)係顯示測定圖5(a)之A-A'線之位置之圖表。如圖5(b)所示,實施例之槽部102係其劃線輪100之徑向之高度隨著朝向槽底而逐漸變低。於圖5(b)中,圖表中央之平坦部分為槽部102之槽底。如圖5(b)所示,於實施例中,槽底於周向延伸一定距離。
FIG. 5( b ) is a graph of measuring the radial heights of the
圖5(c)係於厚度方向測定實施例之劃線輪100之槽部102之徑向之高
度之圖表。圖5(c)係顯示測定圖5(a)之B-B'線之位置,即槽部102之槽底脊線之位置之圖表。如圖5(c)所示,實施例之槽底呈朝徑向凸之曲面形狀。
FIG. 5( c ) is the measurement of the radial height of the
圖6(a)係拍攝比較例1之劃線輪100之刀部101與槽部102之照片。圖6(a)之照片係在劃線輪100徑向拍攝刀部101與槽部102者。與A-A'線平行之方向為劃線輪100之周向,與B-B'線平行之方向為劃線輪100之厚度方向。A-A'線設定在槽部102之厚度方向之中央位置,B-B'線設定在槽部102之周向之中央位置。
FIG. 6( a ) is a photograph of the
圖6(b)係於周向測定比較例1之劃線輪100之刀部與槽部之徑向之高度之圖表。圖6(b)係顯示測定圖6(a)之A-A'線之位置之圖表。如圖6(b)所示,比較例1之槽部102為其劃線輪100之徑向之高度隨著朝向槽底而逐漸變低。如圖6(b)所示,於比較例1中,槽底未於周向延伸,槽底僅為1點。
FIG. 6( b ) is a graph of measuring the height of the blade portion and the radial direction of the groove portion of the
圖6(c)係於厚度方向測定比較例1之劃線輪100之槽部之徑向的高度之圖表。圖6(c)係顯示測定圖6(a)之B-B'線位置、即槽部102之槽底位置之圖表。於圖6(c)中,中央之直線部分為槽底之部分,其兩側之傾斜部分為與圖1(c)之傾斜面100a對應之部分。如圖6(c)所示,比較例1之槽底成為與中心軸L0平行之直線。
FIG.6(c) is a graph which measured the height of the radial direction of the groove part of the
圖7(a)係顯示實施例之刀部101及槽部102之曲率半徑之測定位置與其值之圖。
Fig.7 (a) is a figure which shows the measurement position and the value of the curvature radius of the
於圖7(a)之左側,由等高分佈圖表示刀部101與槽部102之徑向之高度,於其下顯示劃線輪100之厚度方向之中心位置之刀部101與槽部102之脊線。又,於圖7(a)之右側,顯示圖7(a)左側之圖(1)~(3)之位置的刀部101與槽部102之厚度方向的形狀之曲率半徑。此處,為方便起見,將(1)
~(3)之位置分別稱為外周脊線、肩上部脊線及肩下部脊線。測定位置(1)為刀部101之位置,測定位置(2)、(3)為槽部102之刀部101側之位置。
On the left side of FIG. 7( a ), the heights of the
圖7(b)~(d)係於厚度方向測定圖7(a)之各測定位置(1)~(3)之劃線輪100的外周部之徑向的高度之圖表。圖7(b)~(d)中,為方便起見,以虛線表示取得曲率半徑之圓。
FIGS. 7( b ) to ( d ) are graphs of measuring the heights in the radial direction of the outer peripheral portion of the
圖8(a)~(d)係顯示對實施例之槽部102測定與圖7(a)不同位置時之各測定位置之曲率半徑與槽部102之形狀之圖。圖8(a)~(d)與圖7(a)~(d)相比,僅測定位置不同,測定方法與圖7(a)~(d)相同。
FIGS. 8( a ) to ( d ) are diagrams showing the radius of curvature of each measurement position and the shape of the
於圖8(a)之右側,顯示圖8(a)左側圖之測定位置(4)~(6)之槽部102之厚度方向之形狀之曲率半徑。此處,為方便起見,將測定位置(4)、(5)稱為裙擺脊線,將測定位置(6)稱為槽底脊線。測定位置(4)、(5)為向槽底移行之槽部102之位置,測定位置(5)為槽底之位置。
On the right side of Fig. 8(a), the curvature radius of the shape of the thickness direction of the
如圖7(a)~圖8(d)所示,於實施例之劃線輪100中,槽部102頂部之曲率半徑隨著朝向槽底而逐漸變大。再者,於刀部101中亦然,由於成形精度之關係而略有圓度,測定到小的曲率半徑。
As shown in FIGS. 7( a ) to 8 ( d ), in the
圖9(a)~(d)及圖10(a)~(d)係顯示比較例2之劃線輪100之刀部101及槽部102之曲率半徑之變化之圖。
FIGS. 9( a ) to ( d ) and FIGS. 10 ( a ) to ( d ) are graphs showing changes in the radius of curvature of the
於比較例2中,藉由圖9(a)之左側所示之等高等分佈及脊線波形,而於劃線輪100之外周部形成刀部101與槽部102。圖9(a)左側之2個圖分別與圖7(a)左側之2個圖對應。又,圖9(b)~(d)及圖10(b)~(d)分別與圖7(b)~(d)及圖8(b)~(d)對應
In the comparative example 2, the
如圖圖9(a)~圖10(d)所示,於比較例2中,與實施例相比,槽部102之曲率半徑變得相當小。又,於比較例2中,與實施例相比,於徑向觀察
時之刀部101之輪廓不同。
As shown in FIGS. 9( a ) to 10 ( d ), in Comparative Example 2, the radius of curvature of the
藉由具有以上構成之實施例、比較例1、2之劃線輪100,對玻璃板進行劃線動作。玻璃板之厚度為0.7mm。又,劃線動作時之荷重在實施例(No.1、No.2)與比較例2中設定為0.07MPa、0.011MPa、0.16MPa,在比較例1中設定為0.08MPa、0.16MPa、0.25MPa。
With the
實施例、比較例1、2之劃線輪100之各尺寸如下設定。另,以下所示之「槽深度」是指自劃線輪100之中心軸L0至刀部101及槽底之距離之差量,槽寬是指周向之槽部102之長度。又,針對實施例,準備槽部102之尺寸不同之2種劃線輪100(No.1、No.2)。於實施例、比較例1、2中,周向上之刀部101之節距為固定。因此,於實施例、比較例1、2中,周向上之槽部102之節距亦為固定。
The respective dimensions of the
(1)實施例 (1) Example
外徑:2mm Outer diameter: 2mm
刀部角度:105° Knife angle: 105°
槽深度:5.51μm(No.1)、4.80μm(No.2) Groove depth: 5.51μm (No.1), 4.80μm (No.2)
槽寬:29.26μm(No.1)、32.12μm(No.2) Groove width: 29.26μm (No.1), 32.12μm (No.2)
(2)比較例1 (2) Comparative Example 1
外徑:2mm Outer diameter: 2mm
刀部角度:105° Knife angle: 105°
槽深度:5.15μm Groove depth: 5.15μm
槽寬:29.39μm Slot width: 29.39μm
(3)比較例2 (3) Comparative Example 2
外徑:2mm Outer diameter: 2mm
刀部角度:105° Knife angle: 105°
槽深度:4.90μm Groove depth: 4.90μm
槽寬:29.10μm Slot width: 29.10μm
測定係按以下順序進行。 The measurement is carried out in the following order.
(S1)以馬克筆於玻璃板畫2條間隔2mm之線。
(S1)
(S2)自玻璃板之表面拭去。 (S2) Wipe off from the surface of the glass plate.
(S3)以顯微鏡觀察玻璃表面,確認是否有異物殘留。 (S3) Observe the glass surface with a microscope to confirm whether or not foreign matter remains.
(S4)與2條線垂直地以各劃線輪進行劃線。 (S4) Scribing is performed with each scribing wheel perpendicular to the two lines.
(S5)放置3分鐘(玻璃屑自劃線輪飛散之期間)。 (S5) It is left to stand for 3 minutes (during the period during which the glass chips are scattered from the scribing wheel).
(S6)以顯微鏡自劃線觀察1方向側,測量在2條線之間飛散的玻璃屑之尺寸與數量。 (S6) Observe the 1-direction side from the scribe line with a microscope, and measure the size and number of glass chips scattered between the two lines.
(S7)以手沿劃線分斷玻璃基板。 (S7) The glass substrate is cut along the scribe line by hand.
(S8)再次與S6同樣地測量玻璃屑之尺寸與數量。 (S8) The size and number of glass chips are measured again in the same manner as in S6.
以上述3種荷重分別進行上述S1~S8之順序。又,S6、S8之測量係於離劃線之距離為0mm、2mm、10mm之範圍內分別進行。且,針對每個劃線輪統計該等測量結果,比較玻璃屑之產生狀況。 The above-mentioned sequence of S1 to S8 is carried out respectively with the above-mentioned three kinds of loads. In addition, the measurement of S6, S8 is carried out in the range of 0mm, 2mm, and 10mm from the scribed line, respectively. And, these measurement results are counted for each scribing wheel, and the generation conditions of glass chips are compared.
圖11(a)~(d)分別為拍攝以實施例(No.1)、實施例(No.2)、比較例2及比較例1之劃線輪100對評估用玻璃板劃線時之凹痕之照片。
11( a ) to ( d ) are respectively photographed when scribing the glass plate for evaluation with the
如參照圖11(a)、(b)可知,於實施例中,垂直裂紋在與橢圓形凹痕之間延伸。因此,藉由使用實施例之劃線輪100,即使槽部102與玻璃板相接,亦可使垂直裂紋進展。
As can be seen with reference to FIGS. 11( a ) and ( b ), in the embodiment, the vertical crack extends between the oval dent. Therefore, by using the
圖12(a)係顯示由實施例(No.1、No.2)之劃線輪100對玻璃板劃線時之玻璃屑之產生狀況(實驗結果)之圖。圖12(b)係顯示由比較例1、2之劃
線輪100對玻璃板劃線時之玻璃屑之產生狀況(實驗結果)之圖。
FIG. 12( a ) is a diagram showing the generation of glass chips (experimental results) when the glass plate is scribed by the
圖12(a)、(b)所示之玻璃屑面積是指以上述S1~S8之順序針對每個劃線輪所統計之各玻璃屑之面積之合計,玻璃屑數是指針對每個劃線輪所統計之玻璃屑之數量的合計。 The glass chip area shown in Figure 12 (a) and (b) refers to the total area of each glass chip counted for each scribing wheel in the order of S1 to S8 above, and the number of glass chips refers to each scribing wheel. The total number of glass chips counted by the reel.
如圖12(b)所示,於比較例1中,玻璃屑面積及玻璃屑數量兩者與實施例及比較例2相比顯著變大。又,於比較例1中,每1個玻璃屑之平均面積為100μm2左右,產生之玻璃屑之大小亦變大。 As shown in FIG.12(b), in the comparative example 1, compared with the Example and the comparative example 2, both the glass flake area and the glass flake number became large remarkably. Moreover, in the comparative example 1, the average area per one glass flake was about 100 micrometer 2 , and the magnitude|size of the glass fume produced also became large.
另一方面,於比較例2中,將產生之玻璃屑數量抑制為4個。但,於比較例2中,每1個玻璃屑之平均面積為80μm2左右,產生之玻璃屑之大小變大。 On the other hand, in Comparative Example 2, the number of generated glass flakes was suppressed to four. However, in Comparative Example 2, the average area per one glass chip was about 80 μm 2 , and the size of the generated glass chip became large.
相對於此,於實施例中,將產生之玻璃屑數量抑制為10個,與比較例1相比顯著變少。又,於實施例中,每1個玻璃屑之平均面積為40μm2或20μm2左右,產生之玻璃屑之大小為最小。 On the other hand, in the Example, the number of glass flakes produced was suppressed to 10, and compared with the comparative example 1, it was remarkably small. Moreover, in the Example, the average area of each glass flake was about 40 μm 2 or 20 μm 2 , and the size of the glass flakes produced was the smallest.
如此,於實施例中,可顯著抑制劃線動作及裂斷動作時產生之玻璃屑,且可顯著縮小產生之玻璃屑之尺寸。若如比較例1、2般玻璃屑之尺寸較大,則當玻璃屑夾於基板與平台之間之情形時,易刮傷基板表面,且會導致基板表面之高度高於特定高度。因此,可以說各動作中產生之玻璃屑盡可能小且少則較佳。如上述,於實施例中,可顯著縮小產生之玻璃屑之尺寸,且亦可顯著抑制玻璃屑之數量。因此,藉由使用實施例之劃線輪100,可有效抑制刮傷基板,且可將基板表平面之高度穩定化為特定高度。
In this way, in the embodiment, the glass debris generated during the scribing action and the breaking action can be significantly suppressed, and the size of the generated glass debris can be significantly reduced. If the size of the glass chips is larger as in Comparative Examples 1 and 2, when the glass chips are sandwiched between the substrate and the platform, the surface of the substrate will be easily scratched, and the height of the substrate surface will be higher than a certain height. Therefore, it can be said that the glass dust generated in each action is as small and small as possible. As described above, in the embodiment, the size of the generated glass debris can be significantly reduced, and the amount of the glass debris can also be significantly suppressed. Therefore, by using the
<實施形態之效果> <Effect of the embodiment>
根據本實施形態,發揮以下之效果。 According to this embodiment, the following effects are exhibited.
槽部102包含呈朝自劃線輪100之中心軸L0離開之方向凸之曲面,故於劃線輪100滾動因而槽部102與基板200成為對向時,因於槽部102內無尖脊線,故無如尖脊線咬入基板200般之情形。藉此,可有效抑制玻璃屑之產生。又,至少槽底藉由劃線輪100之滾動而按壓基板200之上表面,使其產生彈性變形。因此,至少槽底與基板200對向期間,較少產生基於塑性變形之玻璃屑。藉此,根據本態樣之劃線輪100,藉由將槽部102設為曲面之簡單構成,可有效抑制玻璃屑之產生。
The
又,槽部102係以槽底沿周向於特定範圍連續之方式構成。因此,可確保彈性變形之範圍,藉此,可抑制玻璃屑之產生,且有效地於基板200形成垂直裂紋。
Moreover, the
又,若將比較例2與實施例進行比較,則於比較例2中,槽底之曲率半徑為3.36μm,相對於此,於實施例中,槽底之曲率半徑為9.4μm。即,於比較例2中,槽底之曲率半徑為刀部101之曲率半徑之2.2倍左右,相對於此,於實施例中,槽底之曲率半徑為刀部101之曲率半徑之5.2倍左右。
In addition, when Comparative Example 2 is compared with the Example, in Comparative Example 2, the radius of curvature of the groove bottom is 3.36 μm, whereas in the Example, the radius of curvature of the groove bottom is 9.4 μm. That is, in Comparative Example 2, the radius of curvature of the groove bottom is about 2.2 times the radius of curvature of the
如圖12(b)之實驗結果所示,於比較例2中,雖可抑制玻璃屑之產生,但每1個玻璃屑之平均面積並未較比較例1有所大幅改善。由該實驗結果認為,若要縮小玻璃屑之尺寸,槽底之曲率半徑較佳為至少以超出比較例2之3.6μm之範圍設定,具體而言,以4μm以上之範圍或刀部101之曲率半徑之2.5倍以上之範圍設定。藉由如此設定槽底之曲率半徑,可進而確實抑制槽底咬入垂直裂紋,據信可有效抑制因塑性變形而產生玻璃屑。藉此,認為可發揮與上述實施例同樣之效果。
As shown in the experimental result of FIG. 12( b ), in Comparative Example 2, although the generation of glass dust can be suppressed, the average area per one glass dust is not significantly improved compared with Comparative Example 1. From the experimental results, it is considered that in order to reduce the size of the glass chips, the curvature radius of the groove bottom is preferably set at least in the range of 3.6 μm beyond that of Comparative Example 2, specifically, in the range of 4 μm or more or the curvature of the
<變化例> <Variation example>
以上,雖已對本發明之實施形態進行說明,但本發明一概不受限於上述實施形態,又,本發明之實施形態亦可於上述以外進行各種變更。 Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment at all, and the embodiment of the present invention may be variously modified in addition to the above-described embodiment.
例如,劃線輪100之各部之尺寸未必限於上述實驗所示之尺寸,可於獲得同樣效果之範圍內可進行各種變更。例如,槽之最深部分即槽底未必要形成於槽之周向中央。又,基板200之厚度亦不限於上述實驗所示之玻璃板之厚度。劃線輪100之孔100b之直徑,或形成於劃線輪100外周之刀部101及槽部102之數量及節距亦可適當調整。
For example, the size of each part of the
本發明之實施形態可於申請專利範圍所示之技術性思想範圍內適當進行各種變更。 Various modifications can be appropriately made to the embodiment of the present invention within the scope of the technical idea shown in the scope of claims.
100:劃線輪 100: Scribing wheel
101:刀部 101: Knife Department
102:槽部 102: Groove
100a:傾斜面 100a: Inclined surface
100b:圓形孔 100b: round hole
d:槽之深度 d: depth of groove
L0:中心軸 L0: Center axis
p:節距 p: pitch
X、Y、Z:方向 X, Y, Z: direction
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JP2009234874A (en) * | 2008-03-28 | 2009-10-15 | Shiba Giken:Kk | Cutter wheel and method for manufacturing the same |
TW201617293A (en) * | 2014-10-30 | 2016-05-16 | 三星鑽石工業股份有限公司 | Method of scribing thick plate glass, and scribing wheel for scribing thick plate glass |
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JP3074143B2 (en) | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | Glass cutter wheel |
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ES2462746T3 (en) | 2007-01-19 | 2014-05-26 | Awin Diamond Technology Corporation | Cutting disc to form a drawn line and method of manufacturing it |
KR101081898B1 (en) | 2008-12-05 | 2011-11-10 | 세메스 주식회사 | A scrib wheel and an scribing unit with the wheel, and a scribe line forming method with the unit |
JP2012115991A (en) * | 2010-11-29 | 2012-06-21 | Mitsuboshi Diamond Industrial Co Ltd | Scribing wheel |
CN102531373B (en) * | 2010-12-07 | 2016-01-06 | 孙春雨 | A kind of break bar of glass-cutting material |
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CN103214179A (en) * | 2013-04-26 | 2013-07-24 | 北京沃尔德超硬工具有限公司 | High-permeability glass cutting wheel with full-cutting edge |
JP2015048260A (en) * | 2013-08-30 | 2015-03-16 | 三星ダイヤモンド工業株式会社 | Scribing wheel, holder unit, and scribing device |
CN105365058A (en) * | 2014-05-26 | 2016-03-02 | 孙春雨 | A cutting knife wheel for fragile materials |
JP6589380B2 (en) * | 2015-05-29 | 2019-10-16 | 三星ダイヤモンド工業株式会社 | Method for forming vertical crack in brittle material substrate and method for dividing brittle material substrate |
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JP2009234874A (en) * | 2008-03-28 | 2009-10-15 | Shiba Giken:Kk | Cutter wheel and method for manufacturing the same |
TW201617293A (en) * | 2014-10-30 | 2016-05-16 | 三星鑽石工業股份有限公司 | Method of scribing thick plate glass, and scribing wheel for scribing thick plate glass |
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CN108249750B (en) | 2022-07-29 |
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KR20180077055A (en) | 2018-07-06 |
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