TW201707914A - Method for forming inclined cracks in brittle material substrate and cutting method of the brittle material substrate capable of enabling the cutting surface to be relatively inclined to the main surface of the substrate while maintaining a crack-free state right below the groove line - Google Patents
Method for forming inclined cracks in brittle material substrate and cutting method of the brittle material substrate capable of enabling the cutting surface to be relatively inclined to the main surface of the substrate while maintaining a crack-free state right below the groove line Download PDFInfo
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- TW201707914A TW201707914A TW105121922A TW105121922A TW201707914A TW 201707914 A TW201707914 A TW 201707914A TW 105121922 A TW105121922 A TW 105121922A TW 105121922 A TW105121922 A TW 105121922A TW 201707914 A TW201707914 A TW 201707914A
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- 239000000758 substrate Substances 0.000 title claims abstract description 113
- 239000000463 material Substances 0.000 title claims abstract description 93
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000005520 cutting process Methods 0.000 title claims description 44
- 238000005096 rolling process Methods 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 abstract description 55
- 239000010432 diamond Substances 0.000 abstract description 55
- 230000015572 biosynthetic process Effects 0.000 abstract description 19
- 230000002250 progressing effect Effects 0.000 abstract 1
- 238000011144 upstream manufacturing Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 5
- 238000007373 indentation Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
Description
本發明係關於一種用以切斷脆性材料基板之方法，尤其是關於一種於脆性材料基板之切斷時形成傾斜裂痕之方法。 The present invention relates to a method for cutting a substrate of a brittle material, and more particularly to a method for forming a slanted crack when the substrate of a brittle material is cut.
平面顯示器面板或太陽電池面板等之製造工藝通常包含將玻璃基板、陶瓷基板、半導體基板等包含脆性材料之基板(母基板)切斷之步驟。於該切斷中，廣泛使用如下方法：於基板表面使用金剛石尖或刀輪等刻劃工具形成劃線，並使裂痕(垂直裂痕)自該劃線沿基板厚度方向擴展。於已形成劃線之情形時，存在垂直裂痕沿厚度方向完全地擴展而基板被切斷之情形，亦存在垂直裂痕沿厚度方向僅局部地擴展之情形。於後者之情形時，於形成劃線後，進行被稱為分割步驟之應力賦予。藉由分割步驟使垂直裂痕沿厚度方向完全地行進，藉此基板沿劃線被切斷。 A manufacturing process of a flat display panel or a solar cell panel or the like generally includes a step of cutting a substrate (mother substrate) containing a brittle material such as a glass substrate, a ceramic substrate, or a semiconductor substrate. In the cutting, a method in which a scribe line is formed on a surface of a substrate using a dicing tool such as a diamond tip or a cutter wheel, and a crack (vertical crack) is spread from the scribe line in the thickness direction of the substrate. In the case where the scribe line has been formed, there is a case where the vertical crack propagates completely in the thickness direction and the substrate is cut, and there is also a case where the vertical crack spreads only partially in the thickness direction. In the latter case, after the scribing is formed, stress imparting is referred to as a dividing step. The vertical crack is completely traveled in the thickness direction by the dividing step, whereby the substrate is cut along the scribe line.
作為此種藉由形成劃線而使垂直裂痕擴展之方法，已公知之方法為：形成亦被稱為輔助線之於垂直裂痕之擴展時成為起點(觸發)之線狀加工痕跡(例如，參照專利文獻1)。 As a method of forming a vertical crack by forming a scribe line, a known method is to form a linear processing mark which is also referred to as a starting point (trigger) when the auxiliary line is extended by the vertical crack (for example, reference) Patent Document 1).
[專利文獻1]日本專利特開2015-74145號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2015-74145
關於上述對各種脆性材料基板之沿厚度方向之切斷，於多數情形時設為垂直於基板主面，但亦存在有意識地欲以切斷面相對於基板主面傾斜之方式進行切斷之情形。該切斷係藉由使裂痕相對於基板主面沿斜向擴展而實現，但於專利文獻1中，關於藉由形成輔助線之方法形成此種裂痕(傾斜裂痕)之態樣，未作任何揭示或提示。 The cutting in the thickness direction of the various brittle material substrates is generally perpendicular to the main surface of the substrate in many cases, but there is also a case where the cutting surface is intentionally cut so as to be inclined with respect to the main surface of the substrate. . This cutting is achieved by causing the crack to spread obliquely with respect to the main surface of the substrate. However, in Patent Document 1, the aspect of forming such a crack (inclined crack) by the method of forming the auxiliary line is not performed. Reveal or suggest.
本發明係鑒於上述問題而完成者，目的在於提供一種於脆性材料基板形成傾斜裂痕之新穎之方法。 The present invention has been made in view of the above problems, and an object thereof is to provide a novel method of forming a slanted crack on a brittle material substrate.
為了解決上述問題，技術方案1之發明之特徵在於：其係於脆性材料基板形成傾斜裂痕之方法，且具備：溝槽線形成步驟，其藉由沿上述脆性材料基板之一主面之預先規定之切斷位置使具有含稜線之刀尖之刻劃工具滑動或滾動，而形成線狀溝槽部即溝槽線；及裂痕形成步驟，其使裂痕產生於上述溝槽線之正下方；且於上述溝槽線形成步驟中，以如下方式形成上述溝槽線，即，於將上述刻劃工具之稜線於水平面內自上述溝槽線之形成行進方向傾斜特定之傾斜角之狀態下，於上述溝槽線之正下方維持無裂痕狀態，使相對於上述脆性材料基板之主面傾斜之裂痕即傾斜裂痕擴展。 In order to solve the above problems, the invention of claim 1 is characterized in that it is a method of forming a slanted crack on a brittle material substrate, and includes a groove line forming step by pre-specifying along one main surface of the brittle material substrate a cutting position for sliding or rolling a scribing tool having a ridged blade edge to form a linear groove portion, that is, a groove line; and a crack forming step for causing a crack to be generated directly under the groove line; In the groove line forming step, the groove line is formed in such a manner that the ridge line of the scribing tool is inclined in a horizontal plane from a direction in which the groove line is formed to a specific inclination angle. The crack line is maintained immediately below the groove line, and the crack which is inclined with respect to the main surface of the brittle material substrate, that is, the oblique crack is expanded.
技術方案2之發明係如技術方案1之脆性材料基板中之傾斜裂痕之形成方法，其特徵在於：上述傾斜角之絕對值為1.0°~3.0。 The invention of claim 2 is the method for forming a slanted crack in the brittle material substrate according to claim 1, characterized in that the absolute value of the inclination angle is 1.0 to 3.0.
技術方案3之發明係如技術方案1或技術方案2之脆性材料基板中之傾斜裂痕之形成方法，其特徵在於：上述切斷位置被規定為曲線狀，於上述溝槽線形成步驟中，以如下方式形成上述溝槽線，即，於將上述刻劃工具於水平面內自上述切斷位置之切線方向傾斜特定之傾斜角之狀態下，於上述溝槽線之正下方維持無裂痕狀態。 The invention of claim 3 is the method for forming a slanted crack in the brittle material substrate according to the first aspect or the second aspect, wherein the cutting position is defined as a curved shape, and in the groove line forming step, The groove line is formed in such a manner that the slitting state is maintained immediately below the groove line in a state where the scribing tool is inclined at a specific inclination angle from the tangential direction of the cutting position in the horizontal plane.
技術方案4之發明之特徵在於：其係將脆性材料基板切斷之方 法，且具備：傾斜裂痕形成步驟，藉由如技術方案1至技術方案3中任一項之傾斜裂痕之形成方法於上述脆性材料基板形成傾斜裂痕；及分割步驟，其沿上述傾斜裂痕分割上述脆性材料基板。 The invention of claim 4 is characterized in that it is a method of cutting a substrate of a brittle material And a step of forming a slanting crack, forming a slanted crack on the brittle material substrate by the method for forming a slanted crack according to any one of the first to third aspects; and a dividing step of dividing the slanting crack along the slanting crack A brittle material substrate.
根據技術方案1至技術方案4之發明，可實現利用了於溝槽線之正下方可維持無裂痕狀態之方法之、將切斷面相對於基板主面傾斜之態樣下之脆性材料基板之切斷。 According to the inventions of the first aspect to the fourth aspect, it is possible to realize the cutting of the brittle material substrate in a state in which the cut surface is inclined with respect to the main surface of the substrate by the method of maintaining the crack-free state directly under the groove line. Broken.
1‧‧‧平台 1‧‧‧ platform
2‧‧‧刻劃頭 2‧‧‧Scratch
50‧‧‧刻劃工具 50‧‧‧ scribing tools
51‧‧‧劃線輪 51‧‧‧marking wheel
52‧‧‧銷 52‧‧ ‧ sales
53‧‧‧保持器 53‧‧‧ Keeper
100‧‧‧刻劃裝置 100‧‧‧ scoring device
150‧‧‧刻劃工具 150‧‧‧ scribing tools
151‧‧‧金剛石尖 151‧‧‧ diamond tip
152‧‧‧柄 152‧‧‧ handle
A1‧‧‧起點 Starting point for A1‧‧
A2‧‧‧終點 A2‧‧‧ End
AL‧‧‧輔助線 AL‧‧‧Auxiliary line
AR1‧‧‧箭頭 AR1‧‧‧ arrow
AR2‧‧‧箭頭 AR2‧‧‧ arrow
AR3‧‧‧箭頭 AR3‧‧‧ arrow
AR4‧‧‧箭頭 AR4‧‧‧ arrow
AR5‧‧‧箭頭 AR5‧‧‧ arrow
AX‧‧‧(劃線輪之)軸中心 AX‧‧‧ (dash wheel) axis center
AX2‧‧‧(柄之軸向)軸向 AX2‧‧‧ (axial axis of the handle)
C‧‧‧(溝槽線之)交點 C‧‧‧ (groove line) intersection
D1‧‧‧延伸方向 D1‧‧‧ extending direction
DA‧‧‧(金剛石尖之)移動方向 DA‧‧‧ (diamond tip) moving direction
DP‧‧‧刻劃方向 DP‧‧‧ scoring direction
DT‧‧‧(脆性材料基板之)厚度方向 DT‧‧‧ (brittle material substrate) thickness direction
IC‧‧‧傾斜裂痕 IC‧‧‧Tilt crack
PF‧‧‧(劃線輪之)刀尖 PF‧‧‧ (marking wheel)
PF2‧‧‧(金剛石尖之)刀尖 PF2‧‧‧ (diamond tip) tip
PP‧‧‧(金剛石尖之)頂點 PP‧‧‧ (diamond tip) apex
PS‧‧‧(金剛石尖之)稜線 PS‧‧‧ (diamond tip) ridgeline
RT‧‧‧箭頭 RT‧‧‧ arrow
SD1‧‧‧頂面(第1面) SD1‧‧‧ top surface (1st side)
SD2‧‧‧側面(第2面) SD2‧‧‧ side (2nd side)
SD3‧‧‧側面(第3面) SD3‧‧‧ side (3rd side)
SF1‧‧‧(脆性材料基板之一)主面(上表面) SF1‧‧‧ (one of the brittle material substrates) main surface (upper surface)
SF2‧‧‧(脆性材料基板之另一)主面(下表面) SF2‧‧‧ (other of the brittle material substrate) main surface (lower surface)
T1‧‧‧起點 Starting point for T1‧‧
T2‧‧‧終點 T2‧‧‧ end point
TL‧‧‧溝槽線 TL‧‧‧ trench line
VC‧‧‧垂直裂痕 VC‧‧‧ vertical crack
W‧‧‧脆性材料基板 W‧‧‧Battery material substrate
W1‧‧‧單片 W1‧‧‧ single film
x‧‧‧x軸 X‧‧‧x axis
y‧‧‧y軸 Y‧‧‧y axis
z‧‧‧z軸 Z‧‧‧z axis
δ‧‧‧傾斜角 δ‧‧‧Tilt angle
θ‧‧‧傾斜角 θ‧‧‧Tilt angle
圖1係例示溝槽線TL形成後之情況之脆性材料基板W之俯視圖。 FIG. 1 is a plan view showing a brittle material substrate W in a case where the groove line TL is formed.
圖2(a)、(b)係概略性地表示用於溝槽線TL之形成之刻劃工具150之構成之圖。 2(a) and 2(b) are diagrams schematically showing the configuration of the scribing tool 150 for forming the groove line TL.
圖3係包含溝槽線TL之垂直剖面之zx局部剖視圖。 3 is a partial cross-sectional view taken along line zx of a vertical section including a groove line TL.
圖4係例示輔助線AL形成時之情況之脆性材料基板W之俯視圖。 FIG. 4 is a plan view showing the brittle material substrate W in the case where the auxiliary line AL is formed.
圖5係概略性地表示用於輔助線AL之形成之刻劃裝置100之構成之圖。 Fig. 5 is a view schematically showing the configuration of the scribing device 100 for forming the auxiliary line AL.
圖6係例示伴隨輔助線AL之形成之傾斜裂痕IC之擴展之情況之脆性材料基板W之俯視圖。 Fig. 6 is a plan view showing the brittle material substrate W in the case where the oblique crack IC of the formation of the auxiliary line AL is expanded.
圖7係例示伴隨輔助線AL之形成之傾斜裂痕IC之擴展之情況之脆性材料基板W之俯視圖。 Fig. 7 is a plan view showing the brittle material substrate W in the case where the oblique crack IC of the formation of the auxiliary line AL is expanded.
圖8係包含溝槽線TL及傾斜裂痕IC之垂直剖面之zx局部剖視圖。 Figure 8 is a partial cross-sectional view taken along line zx of a vertical section including a groove line TL and a slant crack IC.
圖9係每當於傾斜角θ之值相同之情形時便對在形成溝槽線TL時施加於金剛石尖151之荷重、與形成之裂痕之傾斜角δ之關係進行繪圖所得之曲線圖。 Fig. 9 is a graph obtained by plotting the relationship between the load applied to the diamond tip 151 and the inclination angle δ of the formed crack when the groove line TL is formed, whenever the values of the inclination angle θ are the same.
圖10係針對賦予金剛石尖151之3位準之傾斜角θ之各者，對關於施加於金剛石尖151之荷重不同之6種裂痕之傾斜角δ之平均值、最大值、及最小值進行繪圖所得之曲線圖。 10 is a graph for plotting the average value, the maximum value, and the minimum value of the inclination angles δ of the six types of cracks applied to the diamond tip 151 for each of the inclination angles θ of the three positions of the diamond tips 151. The resulting graph.
圖11係針對對將傾斜角θ設為-2.1°之金剛石尖151施加1.6N之荷重而形成有溝槽線TL之玻璃基板，藉由在形成傾斜裂痕IC後進行分割步驟而獲得之單片之光學顯微鏡像。 Fig. 11 is a view showing a glass substrate having a groove line TL formed by applying a load of 1.6 N to a diamond tip 151 having a tilt angle θ of -2.1°, and a single piece obtained by performing a dividing step after forming the oblique crack IC. Optical microscope image.
圖12係表示於切斷位置被規定為圓形狀之情形時之溝槽線TL及輔助線AL之形成位置之圖。 Fig. 12 is a view showing a position where the groove line TL and the auxiliary line AL are formed when the cutting position is defined as a circular shape.
圖13(a)、(b)係模式性地表示於圖12所示之態樣中形成溝槽線TL及輔助線AL後之脆性材料基板W之情況之圖。 FIGS. 13(a) and 13(b) are diagrams schematically showing the state of the brittle material substrate W after the groove line TL and the auxiliary line AL are formed in the aspect shown in FIG.
圖14係表示於脆性材料基板W被挖空成圓錐台狀之情形時之、於與圖12所示之態樣不同之態樣中之溝槽線TL及輔助線AL之形成位置之圖。 Fig. 14 is a view showing a position where the groove line TL and the auxiliary line AL are formed in a state different from the state shown in Fig. 12 when the brittle material substrate W is hollowed out into a truncated cone shape.
圖15係表示於脆性材料基板W被挖空成圓錐台狀之情形時之、於與圖12所示之態樣不同之態樣中之溝槽線TL及輔助線AL之形成位置之圖。 Fig. 15 is a view showing a position where the groove line TL and the auxiliary line AL are formed in a state different from the state shown in Fig. 12 when the brittle material substrate W is hollowed out into a truncated cone shape.
以下所示之本發明之實施形態之方法係於脆性材料基板W之特定位置(切斷位置)，形成用以切斷該脆性材料基板W之裂痕、即相對於基板主面傾斜之裂痕(以下稱為傾斜裂痕)。概略而言，該方法係藉由與切斷位置對應之被稱為溝槽線之加工槽之形成、及繼其之後之與該溝槽線交叉之態樣下之輔助線之形成，而使傾斜裂痕自溝槽線向基板厚度方向擴展。再者，於本實施形態中，所謂溝槽線係指成為傾斜裂痕之基板厚度方向上之形成起點位置之微細之線狀溝槽部(凹部)。又，所謂輔助線係指於與溝槽線交叉之態樣中形成於脆性材料基板W之主面上、且於使傾斜裂痕於溝槽線之正下方擴展時成為起點(觸發)之加工痕跡。 The method of the embodiment of the present invention shown below is formed at a specific position (cutting position) of the brittle material substrate W to form a crack for cutting the brittle material substrate W, that is, a crack which is inclined with respect to the main surface of the substrate (hereinafter Called a sloping crack). Roughly speaking, the method is formed by the formation of a processing groove called a groove line corresponding to the cutting position, and the formation of an auxiliary line following the intersection with the groove line. The oblique crack spreads from the groove line toward the thickness of the substrate. In the present embodiment, the groove line means a fine linear groove portion (concave portion) which is a starting point position in the thickness direction of the substrate which is a slanted crack. Further, the auxiliary line refers to a processing mark which is formed on the main surface of the brittle material substrate W in a state intersecting the groove line and becomes a starting point (trigger) when the oblique crack is expanded directly under the groove line. .
以下，以對矩形狀脆性材料基板W預先設定有平行於一組對邊之複數個直線狀切斷位置(切斷線)之情形為例進行說明。又，於用於說 明之圖中，適當地標註有將輔助線AL之形成行進方向設為x軸正方向、將溝槽線TL之形成行進方向設為y軸正方向、將鉛垂上方設為z軸正方向之右手系統之xyz座標。 Hereinafter, a case where a plurality of linear cut positions (cut lines) parallel to a pair of opposite sides are set in advance for the rectangular brittle material substrate W will be described as an example. Also, used to say In the figure, the direction in which the auxiliary line AL is formed is appropriately set to the positive x-axis direction, the direction in which the groove line TL is formed is the positive direction of the y-axis, and the upper side of the vertical direction is set to the positive direction of the z-axis. The xyz coordinates of the right hand system.
<溝槽線之形成> <Formation of groove lines>
圖1係例示溝槽線TL形成後之情況之脆性材料基板W之俯視圖(xy俯視圖)。圖2係概略性地表示用於溝槽線TL之形成之刻劃工具150之構成之圖。圖3係包含溝槽線TL之垂直剖面之zx局部剖視圖。圖1所示之溝槽線TL之形成位置對應於在對脆性材料基板W自其一主面(上表面)SF1側俯視之情形時之切斷位置。 FIG. 1 is a plan view (xy top view) of the brittle material substrate W in the case where the groove line TL is formed. FIG. 2 is a view schematically showing the configuration of the scribing tool 150 for forming the groove line TL. 3 is a partial cross-sectional view taken along line zx of a vertical section including a groove line TL. The position at which the groove line TL is formed in FIG. 1 corresponds to a cutting position when the brittle material substrate W is viewed from the one main surface (upper surface) SF1 side.
於本實施形態中，於溝槽線TL之形成中，使用具備金剛石尖151之刻劃工具150。金剛石尖151係例如如圖2所示般形成為角錐台形狀，且設有頂面SD1(第1面)、及包圍頂面SD1之複數個面。更詳細而言，如圖2(b)所示般該等複數個面包含側面SD2(第2面)及側面SD3(第3面)。頂面SD1、側面SD2及SD3朝向互不相同之方向，且互相鄰接。於金剛石尖151中，藉由由側面SD2及SD3所成之稜線PS、及頂面SD1、側面SD2及SD3之3個面所成之頂點PP而形成刀尖PF2。金剛石尖151係如圖2(a)所示般以頂面SD1成為最下端部之態樣保持於呈棒狀(柱狀)之柄152之一端部側。 In the present embodiment, the scribing tool 150 having the diamond tip 151 is used for forming the groove line TL. The diamond tip 151 is formed in a truncated pyramid shape as shown in FIG. 2, for example, and has a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. More specifically, as shown in FIG. 2(b), the plurality of faces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and the SD3 face in mutually different directions and are adjacent to each other. In the diamond tip 151, the blade edge PF2 is formed by the ridge line PS formed by the side faces SD2 and SD3 and the apex PP formed by the three faces of the top surface SD1, the side faces SD2, and SD3. As shown in Fig. 2(a), the diamond tip 151 is held on one end side of the rod-shaped (columnar) shank 152 in such a manner that the top surface SD1 is the lowermost end portion.
又，於本實施形態中，將進行如下設置時之角度θ定義為金剛石尖151之傾斜角，即，將金剛石尖151之移動方向DA設為基準方向，如圖2(b)所示般將頂面SD1配置於xy平面內，於自頂面SD1之側觀察金剛石尖151之狀態下，使金剛石尖151相對於移動方向DA於水平面內沿順時針方向傾斜角度θ。傾斜角θ亦為金剛石尖151之稜線PS所成之鉛垂面與水平面之正交軸之延伸方向D1和金剛石尖151之移動方向DA所成之角。又，傾斜角θ亦可取正負任一值。再者，於自柄152之側觀察之情形時，逆時針方向成為角度θ之正向。 Further, in the present embodiment, the angle θ at the time of setting is defined as the inclination angle of the diamond tip 151, that is, the movement direction DA of the diamond tip 151 is set as the reference direction, as shown in Fig. 2(b). The top surface SD1 is disposed in the xy plane, and the diamond tip 151 is inclined by an angle θ in the clockwise direction in the horizontal plane with respect to the moving direction DA in a state where the diamond tip 151 is viewed from the side of the top surface SD1. The inclination angle θ is also an angle formed by the extending direction D1 of the orthogonal axis of the vertical plane and the horizontal plane formed by the ridge line PS of the diamond tip 151 and the moving direction DA of the diamond tip 151. Further, the inclination angle θ may take any value of positive or negative. Furthermore, in the case of viewing from the side of the handle 152, the counterclockwise direction becomes the positive direction of the angle θ.
於使用刻劃工具150之情形時，如圖2(a)所示般，於使柄152之軸向AX2自鉛垂方向朝向移動方向DA前方(y軸正方向)僅傾斜特定之角度，且賦予並非0°之特定之傾斜角θ之狀態下，使金剛石尖151抵接於脆性材料基板W之上表面SF1。然後，藉由一面保持該抵接狀態一面使刻劃工具150向移動方向DA前方移動，而使金剛石尖151之刀尖PF2滑動。藉此，產生沿金剛石尖151之移動方向DA之塑性變形。於本實施形態中，亦將使該產生塑性變形之金剛石尖151之滑動動作稱為金剛石尖151之刻劃動作。 When the scribing tool 150 is used, as shown in FIG. 2( a ), the axial direction AX2 of the shank 152 is inclined only a certain angle from the vertical direction toward the front of the moving direction DA (the positive direction of the y-axis), and The diamond tip 151 is brought into contact with the upper surface SF1 of the brittle material substrate W in a state where the specific inclination angle θ is not 0°. Then, the blade tip PF2 of the diamond tip 151 is slid by moving the scribing tool 150 forward in the moving direction DA while maintaining the abutting state. Thereby, plastic deformation along the moving direction DA of the diamond tip 151 is generated. In the present embodiment, the sliding operation of the diamond tip 151 which is plastically deformed is also referred to as a scribing operation of the diamond tip 151.
作為金剛石尖151，可應用公知者。惟，於形成溝槽線TL時，傾斜角θ之絕對值被設定於1.0°~3.0°之範圍。於將傾斜角θ之絕對值設定為大於3.0°之情形時，無法較佳地形成溝槽線TL。又，於傾斜角θ之絕對值小於1.0°之情形時，自溝槽線TL之裂痕之擴展方向大致為垂直於上表面SF1，而裂痕無法較佳地形成傾斜裂痕。 As the diamond tip 151, a known person can be applied. However, when the groove line TL is formed, the absolute value of the inclination angle θ is set in the range of 1.0° to 3.0°. When the absolute value of the inclination angle θ is set to be larger than 3.0°, the groove line TL cannot be preferably formed. Further, in the case where the absolute value of the inclination angle θ is less than 1.0°, the direction in which the crack from the groove line TL is expanded is substantially perpendicular to the upper surface SF1, and the crack does not preferably form the oblique crack.
如圖1及圖3所示，溝槽線TL係於脆性材料基板W之上表面SF1形成為沿y軸方向延伸之微細之線狀溝槽部。溝槽線TL係作為藉由在將刻劃工具150之姿勢設為相對於移動方向DA對稱之狀態下，使金剛石尖151滑動而於脆性材料基板W之上表面SF1產生之塑性變形之結果而形成。 As shown in FIGS. 1 and 3, the groove line TL is formed on the upper surface SF1 of the brittle material substrate W as a fine linear groove portion extending in the y-axis direction. The groove line TL is a result of plastic deformation of the surface SF1 of the brittle material substrate W by sliding the diamond tip 151 in a state where the posture of the scribing tool 150 is symmetrical with respect to the movement direction DA. form.
溝槽線TL係如圖1所示般，於在脆性材料基板W之上表面SF1規定之切斷位置沿箭頭AR1所示之y軸正方向，自起點T1形成至終點T2。以下，關於溝槽線TL，亦將相對地靠近起點T1之範圍稱為上游側，亦將相對地靠近終點T2之範圍稱為下游側。 As shown in FIG. 1, the groove line TL is formed from the starting point T1 to the end point T2 in the positive direction of the y-axis indicated by the arrow AR1 on the cutting position defined by the upper surface SF1 of the brittle material substrate W. Hereinafter, the range in which the groove line TL is relatively close to the starting point T1 is also referred to as the upstream side, and the range relatively close to the end point T2 is also referred to as the downstream side.
再者，於圖1中，溝槽線TL之起點T1及終點T2被設為稍微離開脆性材料基板W之端部之位置，但其並非必須之態樣，亦可根據被設為切斷對象之脆性材料基板W之種類或切斷後之單片之用途等，適當地將任一者或兩者設為脆性材料基板W之端部位置。但是，將起點T1設 為脆性材料基板W之端部之態樣係與如圖1所例示般將稍微離開端部之位置設為起點T1之情形時相比，由於對刻劃工具150之刀尖PF2施加之衝擊變大，故而就刀尖PF2之壽命之方面及會引起無法預期之垂直裂痕之產生之方面而言，必須留意。 Further, in FIG. 1, the start point T1 and the end point T2 of the groove line TL are set to be slightly apart from the end portion of the brittle material substrate W, but this is not essential, and may be set as the object to be cut. Either or both of the brittle material substrate W are used as the end position of the brittle material substrate W as appropriate. However, set the starting point T1 The impact applied to the blade tip PF2 of the scribing tool 150 is changed as compared with the case where the position of the end portion of the brittle material substrate W is set to the starting point T1 as the position slightly separated from the end portion as illustrated in FIG. Large, so care must be taken in terms of the life of the tip PF2 and the occurrence of unpredictable vertical cracks.
又，複數個切斷位置之各者上之溝槽線TL之形成可為於具備一個刻劃工具150之未圖示之加工裝置中使用該刻劃工具150依序形成之態樣，亦可為使用複數個溝槽線TL形成用之加工裝置同時並行地形成之態樣。 Further, the formation of the groove line TL on each of the plurality of cutting positions may be sequentially formed by using the scribing tool 150 in a processing device (not shown) including one scribing tool 150. A state in which a processing device for forming a plurality of trench lines TL is simultaneously formed in parallel.
於形成溝槽線TL時，以如下方式設定刻劃工具150施加之荷重(相當於將刻劃工具150自鉛垂上方對脆性材料基板W之上表面SF1壓入之力)，即，雖能夠確實地實現溝槽線TL之形成，但於脆性材料基板W之厚度方向DT上不會產生自該溝槽線TL之垂直裂痕之擴展(圖3)。 When the groove line TL is formed, the load applied by the scribing tool 150 is set as follows (corresponding to the force which presses the scribing tool 150 from the upper side to the upper surface SF1 of the brittle material substrate W), that is, The formation of the trench line TL is surely achieved, but no extension of the vertical crack from the trench line TL occurs in the thickness direction DT of the brittle material substrate W (Fig. 3).
換言之，溝槽線TL之形成係以如下方式進行，即，於溝槽線TL之正下方，脆性材料基板W於與溝槽線TL交叉之方向上維持連續地連接之狀態(無裂痕狀態)。再者，於藉由該應對而形成溝槽線TL之情形時，於脆性材料基板W之溝槽線TL附近(距溝槽線TL大致約5μm~10μm以內之範圍)，作為塑性變形之結果，內部應力殘留。 In other words, the formation of the trench line TL is performed in such a manner that the brittle material substrate W maintains a continuous connection state (no crack state) in the direction crossing the groove line TL directly under the groove line TL. . In the case where the groove line TL is formed by the countermeasure, the vicinity of the groove line TL of the brittle material substrate W (within a range of approximately 5 μm to 10 μm from the groove line TL) is a result of plastic deformation. Internal stress remains.
該殘留內部應力係於傾斜角θ為正之情形時，有偏集存在於溝槽線TL之形成行進方向(於圖1中為箭頭AR1所示之方向)右側之傾向，於傾斜角θ為負之情形時，有偏集存在於溝槽線TL之形成行進方向(於圖1中為箭頭AR1所示之方向)左側之傾向。若基於圖3而言，於前者之情形時有偏集存在於形成為溝槽線TL之溝槽部之圖式觀察左半部分(x軸方向正側)之下方之傾向，於後者之情形時有偏集存在於該溝槽部之圖式觀察右半部分(x軸方向負側)之下方之傾向。 When the residual internal stress is positive when the inclination angle θ is positive, the biasing tends to exist on the right side in the direction in which the groove line TL is formed (in the direction indicated by the arrow AR1 in Fig. 1), and the inclination angle θ is negative. In the case of the case, there is a tendency that the partial set exists on the left side of the groove line TL in the traveling direction (the direction indicated by the arrow AR1 in Fig. 1). According to FIG. 3, in the case of the former, there is a tendency that the partial set exists below the left half of the pattern (the positive side in the x-axis direction) of the groove portion formed as the groove line TL, in the latter case. At the time, there is a tendency that the partial set exists in the right half of the groove portion (the negative side in the x-axis direction).
此種溝槽線TL之形成係藉由如下而實現，即，例如，將刻劃工 具150施加之荷重設定為與使用相同之刻劃工具150形成伴隨垂直裂痕之擴展之劃線之情形相比較小之值。 The formation of such a groove line TL is achieved by, for example, a scribe The load applied by 150 is set to a value that is smaller than the case where the same scoring tool 150 is used to form an extended scribe line accompanying the vertical crack.
於無裂痕狀態下，由於即便形成有溝槽線TL，亦無自該溝槽線TL之垂直裂痕或傾斜裂痕之擴展，故而即便假設對脆性材料基板W作用彎曲力矩，與此種形成有裂痕之情形相比，亦難以產生沿溝槽線TL之切斷。 In the crack-free state, since the groove line TL is formed, there is no extension of the vertical crack or the oblique crack from the groove line TL, so even if a bending moment is applied to the brittle material substrate W, a crack is formed. In contrast, it is also difficult to produce a cut along the groove line TL.
<輔助線之形成及傾斜裂痕之擴展> <Formation of auxiliary lines and expansion of inclined cracks>
若藉由上述態樣形成溝槽線TL，則繼其之後，形成輔助線AL。 If the groove line TL is formed by the above-described aspect, the auxiliary line AL is formed thereafter.
圖4係例示輔助線AL形成時之情況之脆性材料基板W之俯視圖。圖5係概略性地表示用於輔助線AL之形成之刻劃裝置100之構成之圖。圖6及圖7係例示伴隨輔助線AL之形成之傾斜裂痕IC之擴展之情況之脆性材料基板W之俯視圖。圖8係包含溝槽線TL及傾斜裂痕IC之垂直剖面之zx局部剖視圖。 FIG. 4 is a plan view showing the brittle material substrate W in the case where the auxiliary line AL is formed. Fig. 5 is a view schematically showing the configuration of the scribing device 100 for forming the auxiliary line AL. FIGS. 6 and 7 are plan views showing the brittle material substrate W in the case where the oblique crack IC is formed along with the formation of the auxiliary line AL. Figure 8 is a partial cross-sectional view taken along line zx of a vertical section including a groove line TL and a slant crack IC.
於本實施形態中，輔助線AL係如圖4所示般於溝槽線TL之下游側附近，藉由沿箭頭AR2所示之x軸正方向(以與溝槽線TL正交之方式)，於起點A1至終點A2之範圍內使脆性材料基板W之上表面SF1產生塑性變形而形成之加工痕跡。 In the present embodiment, the auxiliary line AL is in the vicinity of the downstream side of the groove line TL as shown in FIG. 4, and is in the positive x-axis direction shown by the arrow AR2 (in a manner orthogonal to the groove line TL). A processing mark formed by plastically deforming the upper surface SF1 of the brittle material substrate W from the starting point A1 to the end point A2.
輔助線AL係使用圖5所示之刻劃裝置100所具備之刻劃工具50進行。刻劃裝置100主要具備：平台1，其供載置脆性材料基板W；及刻劃頭2，其保持刻劃工具50；刻劃工具50具有劃線輪(刀輪)51、銷52、及保持器53。 The auxiliary line AL is performed using the scribing tool 50 provided in the scribing device 100 shown in Fig. 5 . The scribing device 100 mainly includes a platform 1 for mounting a brittle material substrate W, and a scribing head 2 holding the scoring tool 50; the scribing tool 50 has a scribing wheel (cutter wheel) 51, a pin 52, and Holder 53.
劃線輪51形成為圓盤狀(算盤珠狀)，且沿其外周同樣地具備剖面觀察為大致三角形狀之(由稜線與夾著其之一對傾斜面構成之)刀尖PF。劃線輪51典型性地具有數mm左右之直徑。銷52係垂直地插通於劃線輪51之軸中心AX之位置。保持器53係由刻劃頭2保持，並且以劃線輪51能夠繞軸中心AX旋轉之態樣，支持插通於劃線輪51之銷52。 即，保持器53係利用銷52對劃線輪51能夠繞軸中心AX旋轉地進行軸支。更詳細而言，保持器53係以劃線輪51之刀尖PF(外周部)所成之面沿鉛垂方向延伸之方式，水平地支持銷52。 The scribing wheel 51 is formed in a disk shape (abacus bead shape), and has a blade edge PF which is substantially triangular in cross section as viewed in the outer periphery thereof (the ridge line and the one of the inclined faces are sandwiched). The scribing wheel 51 typically has a diameter of about several mm. The pin 52 is vertically inserted into the axial center AX of the scribing wheel 51. The holder 53 is held by the scribing head 2, and supports the pin 52 inserted through the scribing wheel 51 in such a manner that the scribing wheel 51 is rotatable about the axis center AX. That is, the retainer 53 is pivotally supported by the pin 52 so as to be rotatable about the axis center AX by the scribing wheel 51. More specifically, the retainer 53 horizontally supports the pin 52 such that the surface formed by the blade edge PF (outer peripheral portion) of the scribing wheel 51 extends in the vertical direction.
刀尖PF係使用例如超硬合金、燒結金剛石、多晶金剛石或單晶金剛石等硬質材料而形成。就減小上述稜線及傾斜面之表面粗糙度之觀點而言，亦可劃線輪51整體由單晶金剛石製造。 The tip PF is formed using a hard material such as cemented carbide, sintered diamond, polycrystalline diamond, or single crystal diamond. From the viewpoint of reducing the surface roughness of the ridge line and the inclined surface, the entire scribing wheel 51 may be made of single crystal diamond.
於形成輔助線AL時，對以另一主面SF2作為載置面而水平地載置固定於刻劃裝置100之平台1上之脆性材料基板W之上表面SF1，以使劃線輪51壓接之狀態，藉由未圖示之移動機構，使保持刻劃工具50之刻劃頭2沿亦為箭頭AR2所示之輔助線AL之形成行進方向之刻劃方向DP移動。由此，被壓接於脆性材料基板W之狀態之劃線輪51於使刀尖PF稍微侵入至脆性材料基板W之狀態下沿箭頭RT所示之方向繞軸中心AX而滾動。藉此，於脆性材料基板W之上表面SF1，伴隨該劃線輪51之壓接滾動產生沿劃線輪51之移動方向之塑性變形。 When the auxiliary line AL is formed, the upper surface SF1 of the brittle material substrate W fixed on the stage 1 of the scoring apparatus 100 is horizontally placed with the other main surface SF2 as a mounting surface to press the scribing wheel 51. In the connected state, the scribe head 2 holding the scribe tool 50 is moved in the scribe direction DP in which the direction of travel of the auxiliary line AL indicated by the arrow AR2 is formed by a moving mechanism (not shown). As a result, the scribing wheel 51 that is pressed against the brittle material substrate W rolls around the axis center AX in the direction indicated by the arrow RT while the blade edge PF slightly enters the brittle material substrate W. Thereby, plastic deformation along the moving direction of the scribing wheel 51 is generated on the upper surface SF1 of the brittle material substrate W by the pressure rolling of the scribing wheel 51.
於本實施形態中，將使該塑性變形產生之劃線輪51之壓接滾動動作稱為利用劃線輪51所進行之刻劃動作。再者，於使劃線輪51對上表面SF1進行壓接時，劃線輪51施加於脆性材料基板之荷重設為可藉由刻劃頭2所具備之未圖示之荷重調整機構而調整。 In the present embodiment, the pressure rolling operation of the scribing wheel 51 caused by the plastic deformation is referred to as a scribing operation by the scribing wheel 51. Further, when the scribing wheel 51 is pressed against the upper surface SF1, the load applied to the brittle material substrate by the scribing wheel 51 is adjusted by a load adjusting mechanism (not shown) provided in the scribing head 2. .
若將於如上所述之態樣中之輔助線AL之形成，於劃線輪51施加之荷重成為特定之臨限值以上之條件下進行，則每當輔助線AL與溝槽線TL交叉，便如於圖6中箭頭AR3所示般，以與各條溝槽線TL之交點C之位置作為起點，朝向傾斜裂痕IC之預定擴展方向(若為圖6之情形，則為溝槽線TL之上游側)依序產生自溝槽線TL朝向脆性材料基板W之厚度方向DT之傾斜裂痕IC之擴展。 If the formation of the auxiliary line AL in the above-described aspect is performed under the condition that the load applied by the scribing wheel 51 is equal to or higher than the specific threshold value, each time the auxiliary line AL intersects the groove line TL, As shown by an arrow AR3 in FIG. 6, the position of the intersection C with each groove line TL is taken as a starting point toward the predetermined expansion direction of the oblique crack IC (if the case of FIG. 6, the groove line TL) The upstream side) sequentially generates an extension of the oblique crack IC from the groove line TL toward the thickness direction DT of the brittle material substrate W.
此時之傾斜裂痕IC之脆性材料基板W之厚度方向上之擴展方向、即傾斜裂痕IC之斜率成為與形成溝槽線TL時之金剛石尖151之傾斜角 θ對應者。具體而言，如圖8所示，將於設為θ=0°而形成溝槽線TL之情形時擴展之垂直裂痕VC之擴展方向即鉛垂下方(z軸正方向)設為基準方向，將自與刻劃時之頂面相對之稜線PS之延伸方向(於本實施態樣中為溝槽線TL之下游側)觀察之順時針方向設為正而定義傾斜裂痕IC之傾斜角δ，於上述情況下，於傾斜角θ為正之情形時δ亦成為正。即，傾斜裂痕IC自溝槽線TL朝向x軸方向正側傾斜而擴展。另一方面，於傾斜角θ為負之情形時δ亦成為負。即，傾斜裂痕IC自溝槽線TL朝向x軸方向負側傾斜而擴展。再者，該傾斜裂痕IC之傾斜方向係與上述於溝槽線TL形成時有殘留內部應力偏集存在之傾向之側一致。其原因在於，與輔助線AL之形成一併產生於脆性材料基板W之表面之微細之龜裂即微裂痕被向溝槽線正下方引導，殘留內部應力得以釋放而產生傾斜裂痕IC之擴展。 At this time, the direction in which the brittle material substrate W of the oblique crack IC extends in the thickness direction, that is, the slope of the oblique crack IC becomes the inclination angle of the diamond tip 151 when the groove line TL is formed. θ corresponds to. Specifically, as shown in FIG. 8 , when the groove line TL is formed as θ=0°, the expansion direction of the vertical crack VC, that is, the vertical direction (the z-axis positive direction) is set as the reference direction. The inclination angle δ of the oblique crack IC is defined by setting the clockwise direction of the ridge line PS opposite to the top surface of the scribe line (the downstream side of the groove line TL in the present embodiment) as positive. In the above case, δ also becomes positive when the inclination angle θ is positive. In other words, the oblique crack IC is inclined from the groove line TL toward the positive side in the x-axis direction. On the other hand, δ also becomes negative when the inclination angle θ is negative. In other words, the oblique crack IC is inclined from the groove line TL toward the negative side in the x-axis direction. Further, the oblique direction of the oblique crack IC coincides with the side where the residual internal stress is concentrated when the groove line TL is formed. This is because the micro cracks which are generated on the surface of the brittle material substrate W together with the formation of the auxiliary line AL are guided directly below the groove line, and the residual internal stress is released to cause the expansion of the oblique crack IC.
如上所述，金剛石尖151之傾斜角θ之絕對值被設定於1.0°~3.0°之範圍，傾斜裂痕IC之傾斜角δ之絕對值亦成為1.0°~3.0°。再者，金剛石尖151之傾斜角θ、與傾斜裂痕IC之傾斜角δ之間大概存在線性關係。 As described above, the absolute value of the inclination angle θ of the diamond tip 151 is set in the range of 1.0° to 3.0°, and the absolute value of the inclination angle δ of the oblique crack IC is also 1.0° to 3.0°. Further, there is a linear relationship between the inclination angle θ of the diamond tip 151 and the inclination angle δ of the oblique crack IC.
於形成輔助線AL後，最終如圖7所示般，於所有切斷位置上產生自溝槽線TL之傾斜裂痕IC之擴展。即，輔助線AL之形成成為契機(輔助線AL成為觸發)，至此，於雖然形成有溝槽線TL但是為無裂痕狀態之脆性材料基板W之各切斷位置，形成自溝槽線TL延伸之傾斜裂痕IC。 After the auxiliary line AL is formed, finally, as shown in FIG. 7, an extension of the oblique crack IC from the groove line TL is generated at all the cutting positions. In other words, the formation of the auxiliary line AL is triggered (the auxiliary line AL is triggered), and thus the cutting position is formed from the groove line TL at each cutting position of the brittle material substrate W in which the groove line TL is formed without cracking. Tilt crack IC.
再者，傾斜裂痕IC之預定擴展方向如上所述般成為朝向溝槽線TL之上游側之方向之原因在於具有如下性質，即，於使用具備金剛石尖151之刻劃工具150形成溝槽線TL之情形時，產生於溝槽線TL之正下方之傾斜裂痕IC於頂面SD1所存在之側擴展。即，傾斜裂痕IC具有朝向特定之一方向擴展之性質。於藉由將金剛石尖之頂面SD1配置 於溝槽線TL上之上游側之態樣形成溝槽線TL之本實施形態中，於形成輔助線AL時，於溝槽線TL之上游側傾斜裂痕IC擴展，但於反方向上不易擴展。 Further, the reason why the predetermined expansion direction of the oblique crack IC becomes the direction toward the upstream side of the groove line TL is to have a property of forming the groove line TL using the scribing tool 150 having the diamond tip 151. In the case of the case, the oblique crack IC generated directly under the groove line TL spreads on the side where the top surface SD1 exists. That is, the oblique crack IC has a property of expanding toward a specific one direction. By configuring the top surface of the diamond tip SD1 In the present embodiment in which the groove line TL is formed on the upstream side of the groove line TL, when the auxiliary line AL is formed, the crack IC spreads on the upstream side of the groove line TL, but is not easily expanded in the reverse direction.
藉由以上之態樣於切斷位置形成有傾斜裂痕IC之脆性材料基板W被給予至未圖示之特定之分割裝置。於分割裝置中進行如下分割步驟，即，藉由所謂之3點彎曲或4點彎曲之方法，使彎曲力矩作用於脆性材料基板W，藉此，使傾斜裂痕IC擴展至脆性材料基板W之下表面SF2。藉由經過該分割步驟，脆性材料基板W於切斷位置被切斷。 The brittle material substrate W on which the oblique crack IC is formed at the cutting position by the above-described manner is given to a specific dividing device not shown. In the dividing device, a dividing step is performed in which a bending moment is applied to the brittle material substrate W by a so-called 3-point bending or 4-point bending method, whereby the oblique crack IC is extended to the brittle material substrate W. Surface SF2. By the division step, the brittle material substrate W is cut at the cutting position.
以上，如所說明般，根據本實施形態，於將脆性材料基板於預先規定之切斷位置切斷時，可藉由如下方法於該切斷位置使傾斜裂痕擴展，即，於與該切斷位置對應之形成位置，一面使金剛石尖傾斜一面進行於在正下方不產生垂直裂痕及傾斜裂痕之條件下之溝槽線之形成，然後於該溝槽線之上游側形成輔助線。 As described above, according to the present embodiment, when the brittle material substrate is cut at a predetermined cutting position, the oblique crack can be expanded at the cutting position by the following method, that is, the cutting The position corresponding to the position is formed, and the diamond line is inclined while forming a groove line under the condition that vertical cracks and oblique cracks are not formed directly, and then an auxiliary line is formed on the upstream side of the groove line.
<實施例> <Example>
藉由傾斜角θ不同之金剛石尖151形成溝槽線TL，其後形成輔助線AL，對擴展之裂痕之傾斜角δ進行評價。具體而言，準備刀尖PF2之稜線PS之曲率半徑為9.5μm者作為金剛石尖151，藉由使傾斜角θ為不同之-2.1°、0.0°、1.9°之3種，並且將於溝槽線TL形成時施加於金剛石尖151之荷重設為不同之1.0N、1.1N、1.3N、1.4N、1.5N、及1.6N之6個位準，而針對全部18種情形，求出傾斜角δ。 The groove line TL is formed by the diamond tip 151 having different inclination angles θ, and thereafter the auxiliary line AL is formed, and the inclination angle δ of the expanded crack is evaluated. Specifically, the radius of curvature of the ridge line PS of the blade tip PF2 is 9.5 μm as the diamond tip 151, and the inclination angle θ is made different by -2.1°, 0.0°, and 1.9°, and will be grooved. When the line TL is formed, the load applied to the diamond tip 151 is set to 6 levels of 1.0 N, 1.1 N, 1.3 N, 1.4 N, 1.5 N, and 1.6 N, and the tilt angle is obtained for all 18 cases. δ.
作為脆性材料基板W，準備厚度為0.2mm之玻璃基板。將形成輔助線AL時之刻劃頭2之移動速度設為100mm/sec，作為劃線輪51，使用輪直徑為2.0mm、厚度為0.65mm、銷52之插通孔之直徑為0.8mm、刀尖角度為100°者。 As the brittle material substrate W, a glass substrate having a thickness of 0.2 mm was prepared. When the auxiliary line AL is formed, the moving speed of the scribe head 2 is set to 100 mm/sec, and as the scribing wheel 51, the wheel diameter is 2.0 mm, the thickness is 0.65 mm, and the diameter of the insertion hole of the pin 52 is 0.8 mm. The angle of the knife tip is 100°.
圖9係每當於傾斜角θ之值相同之情形時便對在形成溝槽線TL時施加於金剛石尖151之荷重、與形成之裂痕之傾斜角δ之關係進行繪圖 所得之曲線圖。又，圖10係基於圖9所示之結果，分別針對賦予金剛石尖151之3位準之傾斜角θ，對關於施加於金剛石尖151之荷重不同之6種裂痕之傾斜角δ之平均值(Ave.)、最大值(Max)、及最小值(Min)進行繪圖所得之曲線圖。 Fig. 9 is a graph showing the relationship between the load applied to the diamond tip 151 and the inclination angle δ of the formed crack when the groove line TL is formed, whenever the value of the inclination angle θ is the same. The resulting graph. Further, Fig. 10 is based on the results shown in Fig. 9, for the inclination angle θ of the three positions imparted to the diamond tip 151, and the average of the inclination angles δ of the six types of cracks which are different from the load applied to the diamond tip 151 ( The graph obtained by drawing the Ave.), the maximum value (Max), and the minimum value (Min).
根據圖9及圖10，可確認於形成溝槽線TL時賦予金剛石尖151之傾斜角θ、與於形成該溝槽線TL後藉由形成輔助線AL而自溝槽線TL擴展之裂痕之傾斜角δ之間，存在大致正相關。 9 and 10, it can be confirmed that the inclination angle θ given to the diamond tip 151 when the groove line TL is formed and the crack which spreads from the groove line TL by forming the auxiliary line AL after forming the groove line TL There is a roughly positive correlation between the inclination angles δ.
又，圖11係藉由針對對將傾斜角θ設為-2.1°之金剛石尖151施加1.6N之荷重而形成有溝槽線TL之玻璃基板，於形成傾斜裂痕IC後進行分割步驟而獲得之單片之光學顯微鏡像。更詳細而言，圖11表示藉由將以將傾斜角θ設為-2.1°且圖式觀察近前側為下游側之方式形成有溝槽線TL之玻璃基板分割而獲得之單片。根據圖11，可確認切斷面朝向於圖8中設為θ<0之情形時所示之方向傾斜。其意指沿該方向形成有傾斜裂痕IC。 Moreover, FIG. 11 is obtained by applying a 1.6 N load to the diamond tip 151 having the inclination angle θ of -2.1° to form a glass substrate having the groove line TL, and performing the dividing step after forming the oblique crack IC. A single optical microscope image. More specifically, FIG. 11 shows a single piece obtained by dividing a glass substrate in which the groove line TL is formed such that the inclination angle θ is −2.1° and the near side is viewed as the downstream side in the drawing. According to Fig. 11, it can be confirmed that the cut surface is inclined in the direction shown when θ < 0 in Fig. 8 . It means that a tilted crack IC is formed in this direction.
<變化例> <variation>
於上述實施形態中，設為於形成溝槽線TL之後，形成輔助線AL，但亦可將溝槽線TL與輔助線AL之形成順序顛倒。 In the above embodiment, the auxiliary line AL is formed after the groove line TL is formed, but the order in which the groove line TL and the auxiliary line AL are formed may be reversed.
又，於上述實施形態中，使溝槽線TL與輔助線AL於脆性材料基板W之上表面SF1正交，但其並非必須之態樣，只要能夠較佳地實現伴隨輔助線AL之形成之自溝槽線TL之傾斜裂痕之擴展，亦可為溝槽線TL與輔助線AL傾斜地交叉之態樣。 Further, in the above-described embodiment, the groove line TL and the auxiliary line AL are orthogonal to the upper surface SF1 of the brittle material substrate W, but this is not essential, as long as the formation of the auxiliary line AL can be preferably achieved. The extension of the oblique crack from the groove line TL may also be such that the groove line TL and the auxiliary line AL are obliquely intersected.
進而，於上述實施形態中將溝槽線TL與輔助線AL交叉之點設為傾斜裂痕擴展之起點，但亦可為藉由在溝槽線TL之附近形成微裂痕而使傾斜裂痕擴展之態樣。微裂痕之形成係藉由如下方法進行，即，例如於脆性材料基板W之上表面SF1，藉由特定之按壓體局部地按壓溝槽線TL之附近，藉此形成壓痕。伴隨該壓痕之形成，自壓痕延伸 之微裂痕到達至溝槽線TL之下方，藉此傾斜裂痕於上述溝槽線之正下方擴展。 Further, in the above-described embodiment, the point at which the groove line TL and the auxiliary line AL intersect is the starting point of the oblique crack propagation, but the state in which the oblique crack is expanded by forming microcracks in the vicinity of the groove line TL may be employed. kind. The formation of the micro-cracks is performed by, for example, pressing the vicinity of the groove line TL by the specific pressing body on the upper surface SF1 of the brittle material substrate W, thereby forming an indentation. With the formation of the indentation, self-indentation extension The microcracks reach below the groove line TL, whereby the slanted crack spreads directly below the groove line.
又，於上述實施形態中，設為藉由如下方法進行利用刻劃工具150所進行之溝槽線TL之形成，即，於使柄152之軸向AX2朝向移動方向DA前方傾斜之狀態下、即以將頂面SD1朝向移動方向DA後方之姿勢，使金剛石尖151滑動；但亦可代替其設為藉由如下方法形成溝槽線TL，即，於使柄152之軸向AX2朝向移動方向DA後方傾斜之狀態下、即以將頂面SD1朝向移動方向DA前方之姿勢，使金剛石尖151滑動。 Further, in the above-described embodiment, the groove line TL by the scribing tool 150 is formed by the following method, that is, in a state where the axial direction AX2 of the shank 152 is inclined forward in the moving direction DA, That is, the diamond tip 151 is slid in a posture in which the top surface SD1 is directed rearward in the moving direction DA; however, instead of forming the groove line TL, the axial direction AX2 of the shank 152 is oriented in the moving direction. The diamond tip 151 is slid in a state in which the DA is tilted rearward, that is, in a posture in which the top surface SD1 is directed forward in the moving direction DA.
但是，於該態樣之情形時，與上述實施形態不同，傾斜裂痕之預定擴展方向成為溝槽線TL之下游側。因此，於該態樣中，設為於溝槽線TL之上游側附近形成輔助線AL。又，於該態樣中，將於設為θ=0°而形成溝槽線TL之情形時擴展之垂直裂痕VC之擴展方向即鉛垂下方(z軸正方向)設為基準方向，自與刻劃時之頂面相對之稜線PS之延伸方向(於本實施態樣中為溝槽線TL之上游側)觀察將順時針方向設為正，而定義傾斜裂痕IC之傾斜角δ，於上述情形時，於傾斜角θ為正之情形時δ亦成為正。即，傾斜裂痕IC自溝槽線TL朝向x軸方向正側傾斜而擴展。另一方面，於傾斜角θ為負之情形時δ亦成為負。即，傾斜裂痕IC自溝槽線TL朝向x軸方向負側傾斜而擴展。再者，該傾斜裂痕IC之傾斜方向係與上述之於溝槽線TL形成時有殘留內部應力偏集存在之傾向之側一致。 However, in the case of this aspect, unlike the above embodiment, the predetermined expansion direction of the inclined crack is the downstream side of the groove line TL. Therefore, in this aspect, the auxiliary line AL is formed in the vicinity of the upstream side of the groove line TL. Further, in this aspect, when the groove line TL is formed to be θ = 0°, the expansion direction of the vertical crack VC, that is, the vertical direction (the z-axis positive direction) is set as the reference direction. When the top surface of the scribe line is aligned with respect to the extending direction of the ridge line PS (in the present embodiment, the upstream side of the groove line TL), the clockwise direction is set to be positive, and the inclination angle δ of the oblique crack IC is defined. In the case, δ also becomes positive when the inclination angle θ is positive. In other words, the oblique crack IC is inclined from the groove line TL toward the positive side in the x-axis direction. On the other hand, δ also becomes negative when the inclination angle θ is negative. In other words, the oblique crack IC is inclined from the groove line TL toward the negative side in the x-axis direction. Further, the oblique direction of the oblique crack IC coincides with the side where the residual internal stress is present when the groove line TL is formed.
於該情形時，亦與上述實施形態同樣地，於傾斜裂痕IC之預定擴展方向上較佳地產生自溝槽線TL之傾斜裂痕之擴展。 Also in this case, as in the above-described embodiment, the expansion of the oblique crack from the groove line TL is preferably generated in the predetermined expansion direction of the oblique crack IC.
或者，又，於上述實施形態中，於形成溝槽線TL時使用金剛石尖151，但亦可代替其為如下態樣，即，藉由使刻劃裝置100之劃線輪51壓接滾動而形成溝槽線TL。於該情形時，包含劃線輪之稜線PF之 鉛垂面與水平面之正交軸之延伸方向、與刻劃工具之移動方向所成之角成為傾斜角，自保持器側觀察，逆時針方向成為角度θ之正向。 Alternatively, in the above embodiment, the diamond tip 151 is used in forming the groove line TL, but it may be replaced by the fact that the scribing wheel 51 of the scoring device 100 is crimped and rolled. A groove line TL is formed. In this case, the ridge line PF containing the scribing wheel The angle between the extending direction of the orthogonal axis of the vertical plane and the horizontal plane and the moving direction of the scribing tool becomes an inclination angle, and the counterclockwise direction becomes the positive direction of the angle θ as viewed from the retainer side.
但是，於該態樣中，亦與上述實施形態不同，傾斜裂痕IC之預定擴展方向成為溝槽線TL之下游側。因此，於該等態樣中，與上述實施例2同樣地設為於以傾斜角θ成為負之方式使劃線輪51傾斜之狀態下，於溝槽線TL之上游側附近形成輔助線AL。與上述實施形態同樣地，於傾斜裂痕IC之預定擴展方向上較佳地產生自溝槽線TL之傾斜裂痕之擴展。 However, in this aspect, unlike the above embodiment, the predetermined expansion direction of the oblique crack IC becomes the downstream side of the groove line TL. Therefore, in the same manner as in the above-described second embodiment, in the state where the scribing wheel 51 is inclined such that the inclination angle θ becomes negative, the auxiliary line AL is formed in the vicinity of the upstream side of the groove line TL. . As in the above embodiment, the expansion of the oblique crack from the groove line TL is preferably generated in the predetermined expansion direction of the oblique crack IC.
又，於該態樣中，將於設為θ=0°而形成溝槽線TL之情形時擴展之垂直裂痕VC之擴展方向即鉛垂下方(z軸正方向)設為基準方向，自溝槽線TL之下游側觀察，將順時針方向設為正，而定義傾斜裂痕IC之傾斜角δ，於上述情形時，於傾斜角θ為正之情形時δ亦成為正。即，傾斜裂痕IC係自溝槽線TL朝向x軸方向正側傾斜而擴展。另一方面，於傾斜角θ為負之情形時δ亦成為負。即，傾斜裂痕IC係自溝槽線TL朝向x軸方向負側傾斜而擴展。再者，該傾斜裂痕IC之傾斜方向係與上述之於溝槽線TL形成時有殘留內部應力偏集存在之傾向之側一致。 Further, in this aspect, when the groove line TL is formed as θ=0°, the expansion direction of the vertical crack VC, that is, the vertical direction (the z-axis positive direction) is set as the reference direction. When viewed on the downstream side of the groove line TL, the clockwise direction is set to be positive, and the inclination angle δ of the oblique crack IC is defined. In the above case, δ also becomes positive when the inclination angle θ is positive. In other words, the oblique crack IC is extended from the groove line TL toward the positive side in the x-axis direction. On the other hand, δ also becomes negative when the inclination angle θ is negative. In other words, the oblique crack IC is extended from the groove line TL toward the negative side in the x-axis direction. Further, the oblique direction of the oblique crack IC coincides with the side where the residual internal stress is present when the groove line TL is formed.
<對曲線狀之切斷之應用> <Application to the cutting of the curve shape>
於上述實施形態中，用以切斷脆性材料基板W之切斷位置被設為直線狀，但於上述實施形態中傾斜裂痕之形成可應用於切斷位置被規定為曲線狀之情形。以下，以切斷位置被規定為圓形狀，脆性材料基板W沿該切斷位置被挖空成圓錐台狀之情形為例進行說明。 In the above embodiment, the cutting position for cutting the brittle material substrate W is linear. However, in the above embodiment, the formation of the oblique crack can be applied to the case where the cutting position is defined as a curved shape. Hereinafter, a case where the cutting position is defined as a circular shape and the brittle material substrate W is hollowed out into a truncated cone shape along the cutting position will be described as an example.
圖12係表示切斷位置被規定為圓形狀之情形時之溝槽線TL與輔助線AL之形成位置之圖。於該情形時，溝槽線TL係沿於脆性材料基板W之上表面SF1預先規定之圓形狀之切斷位置自起點T1形成，但此時，切斷位置之切線方向被設為金剛石尖151之移動方向DA，且以該 切線方向作為基準而被賦予傾斜角θ(方向D1被規定)。 Fig. 12 is a view showing a position at which the groove line TL and the auxiliary line AL are formed when the cutting position is defined as a circular shape. In this case, the groove line TL is formed from the starting point T1 along a cutting position of a predetermined circular shape on the upper surface SF1 of the brittle material substrate W. However, at this time, the tangential direction of the cutting position is set to the diamond tip 151. Moving direction DA, and The tangential direction is given as a reference to the inclination angle θ (direction D1 is defined).
然後，於維持傾斜角θ之狀態下，溝槽線TL形成為圓形狀。但是，終點T2係較起點T1稍微向外側偏移而被設定。若於終點T2之附近以與溝槽線TL交叉之態樣形成輔助線AL，則自該交叉點朝向起點T1，產生沿溝槽線TL之傾斜裂痕IC之擴展。 Then, in a state where the inclination angle θ is maintained, the groove line TL is formed in a circular shape. However, the end point T2 is set to be slightly shifted outward from the starting point T1. If the auxiliary line AL is formed in the vicinity of the end point T2 in a state intersecting the groove line TL, an extension of the oblique crack IC along the groove line TL is generated from the intersection point toward the starting point T1.
圖13係模式性地表示以圖12所示之態樣形成溝槽線TL及輔助線AL後之脆性材料基板W之情況之圖。以圖12所示之態樣形成之傾斜裂痕IC係如圖13(a)所示般成為相對於脆性材料基板W之厚度方向向基板外側傾斜者。此時，由傾斜裂痕IC包圍之區域成為圓錐台狀(剖面觀察梯形狀)。 Fig. 13 is a view schematically showing a state in which the brittle material substrate W is formed by forming the groove line TL and the auxiliary line AL in the state shown in Fig. 12. As shown in FIG. 13(a), the oblique crack IC formed in the state shown in FIG. 12 is inclined toward the outside of the substrate with respect to the thickness direction of the brittle material substrate W. At this time, the region surrounded by the oblique crack IC has a truncated cone shape (a cross-sectional observation ladder shape).
於該情形時，如箭頭AR4所示，若對由傾斜裂痕IC包圍之區域自脆性材料基板W之上方施加力，則傾斜裂痕IC進而擴展。若最終傾斜裂痕IC到達至相反面(下表面SF2)，則如於圖13(b)中箭頭AR5所示般，被挖空出圓錐台狀(剖面觀察梯形狀)之單片W1。 In this case, as shown by the arrow AR4, when a force is applied from above the brittle material substrate W to the region surrounded by the oblique crack IC, the oblique crack IC is further expanded. When the final inclined crack IC reaches the opposite surface (lower surface SF2), as shown by an arrow AR5 in FIG. 13(b), the single piece W1 of the truncated cone shape (the cross-sectional observation ladder shape) is hollowed out.
圖14及圖15係表示於脆性材料基板W被挖空成圓錐台狀之情形時之、於與圖12所示之態樣不同之態樣中之溝槽線TL及輔助線AL之形成位置之圖。於圖14所示之態樣中，終點T2被設定為較起點T1更向內側偏移。於該情形時亦為如下情況：若於終點T2之附近以與溝槽線TL交叉之態樣形成輔助線AL，則自該交叉點朝向起點T1，產生沿溝槽線TL之傾斜裂痕IC之擴展。 14 and FIG. 15 show the positions where the groove line TL and the auxiliary line AL are formed in a state different from the one shown in FIG. 12 when the brittle material substrate W is hollowed out into a truncated cone shape. Picture. In the aspect shown in FIG. 14, the end point T2 is set to be shifted more inward than the starting point T1. In this case as well, if the auxiliary line AL is formed in the vicinity of the end point T2 so as to intersect the groove line TL, the oblique crack IC along the groove line TL is generated from the intersection point toward the starting point T1. Expansion.
圖12所示之態樣通常被應用於欲獲取被挖空成圓錐台狀之部分之情形，相對於此，圖14所示之態樣通常被應用於欲獲取除被挖空成圓錐台狀之部分以外之部分之情形。任一種態樣之共通點在於未形成輔助線AL之部位被作為獲取對象。 The aspect shown in Fig. 12 is generally applied to the case where a portion that is hollowed out into a truncated cone shape is to be obtained. In contrast, the aspect shown in Fig. 14 is generally applied to be obtained in addition to being hollowed out into a truncated cone shape. The case of a part other than the part. The common point of any of the aspects is that the portion where the auxiliary line AL is not formed is taken as the acquisition target.
又，於圖15所示之態樣中，以於起點T1附近溝槽線TL自身重疊之方式設定終點T2。於該情形時，即便不形成輔助線AL，亦可藉由 溝槽線TL之重複部分發揮作為輔助線AL之作用，而實現與圖13(b)所示之情形相同之圓錐台狀之單片之挖空。 Moreover, in the aspect shown in FIG. 15, the end point T2 is set so that the groove line TL itself overlaps in the vicinity of the starting point T1. In this case, even if the auxiliary line AL is not formed, The overlapping portion of the groove line TL functions as the auxiliary line AL, and realizes the hollowing out of the truncated cone-shaped single piece which is the same as the case shown in Fig. 13(b).
再者，於上述例中切斷位置被規定為圓形狀，但於切斷位置被規定為其他曲線狀之情形時，亦可藉由以相對於其切線方向賦予傾斜角θ之態樣形成溝槽線TL，而使傾斜裂痕沿切斷位置擴展。 Further, in the above example, the cutting position is defined as a circular shape. However, when the cutting position is defined as another curved shape, the groove may be formed by imparting the inclination angle θ with respect to the tangential direction thereof. The groove line TL expands the slanted crack along the cut position.
150‧‧‧刻劃工具 150‧‧‧ scribing tools
151‧‧‧金剛石尖 151‧‧‧ diamond tip
152‧‧‧柄 152‧‧‧ handle
AX2‧‧‧(柄之軸向)軸向 AX2‧‧‧ (axial axis of the handle)
D1‧‧‧延伸方向 D1‧‧‧ extending direction
DA‧‧‧(金剛石尖之)移動方向 DA‧‧‧ (diamond tip) moving direction
DT‧‧‧(脆性材料基板之)厚度方向 DT‧‧‧ (brittle material substrate) thickness direction
PF2‧‧‧(金剛石尖之)刀尖 PF2‧‧‧ (diamond tip) tip
PP‧‧‧(金剛石尖之)頂點 PP‧‧‧ (diamond tip) apex
PS‧‧‧(金剛石尖之)稜線 PS‧‧‧ (diamond tip) ridgeline
SD1‧‧‧頂面(第1面) SD1‧‧‧ top surface (1st side)
SD2‧‧‧側面(第2面) SD2‧‧‧ side (2nd side)
SD3‧‧‧側面(第3面) SD3‧‧‧ side (3rd side)
SF1‧‧‧(脆性材料基板之一)主面(上表面) SF1‧‧‧ (one of the brittle material substrates) main surface (upper surface)
SF2‧‧‧(脆性材料基板之另一)主面(下表面) SF2‧‧‧ (other of the brittle material substrate) main surface (lower surface)
W‧‧‧脆性材料基板 W‧‧‧Battery material substrate
x‧‧‧x軸 X‧‧‧x axis
y‧‧‧y軸 Y‧‧‧y axis
z‧‧‧z軸 Z‧‧‧z axis
θ‧‧‧傾斜角 θ‧‧‧Tilt angle
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2015170437A JP6544149B2 (en) | 2015-08-31 | 2015-08-31 | Method of forming inclined cracks in brittle material substrate and method of dividing brittle material substrate |
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| Publication Number | Publication Date |
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| TW201707914A true TW201707914A (en) | 2017-03-01 |
| TWI625211B TWI625211B (en) | 2018-06-01 |
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| TW105121922A TWI625211B (en) | 2015-08-31 | 2016-07-12 | Method for forming inclined cracks in brittle material substrate and method for breaking brittle material substrate |
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| Country | Link |
|---|---|
| JP (1) | JP6544149B2 (en) |
| KR (1) | KR101851453B1 (en) |
| CN (1) | CN106477866B (en) |
| TW (1) | TWI625211B (en) |
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| JP6955754B2 (en) * | 2017-07-25 | 2021-10-27 | 三星ダイヤモンド工業株式会社 | Diamond cutting edge and substrate cutting method |
| WO2020040482A2 (en) | 2018-08-24 | 2020-02-27 | 김보언 | Method, device and program for controlling expert platform |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS4962075A (en) * | 1972-09-21 | 1974-06-15 | ||
| US4498451A (en) * | 1983-08-05 | 1985-02-12 | At&T Technologies, Inc. | Cutting articles along known planes |
| JP2785906B2 (en) * | 1994-02-14 | 1998-08-13 | 日本板硝子株式会社 | Glass plate cutting method |
| JP4342039B2 (en) * | 1999-06-15 | 2009-10-14 | 三星ダイヤモンド工業株式会社 | Glass scriber and scribing method |
| BRPI0513669A (en) * | 2004-07-30 | 2008-05-13 | Mitsuboshi Diamond Ind Co Ltd | substrate intermediate crack formation method and substrate intermediate crack formation equipment |
| CN101218078B (en) * | 2005-07-06 | 2012-04-04 | 三星钻石工业股份有限公司 | Brittle material scribing wheel, method for manufacturing such brittle material scribing wheel, and scribing method, scribing apparatus and scribing tool using such brittle material scribing wheel |
| CN102046346B (en) * | 2008-05-30 | 2014-04-09 | 三星钻石工业股份有限公司 | Method for chamfering brittle material substrate |
| JP5832064B2 (en) * | 2009-01-30 | 2015-12-16 | 三星ダイヤモンド工業株式会社 | Cutter and method for dividing brittle material substrate using the same |
| KR101247571B1 (en) * | 2010-06-14 | 2013-03-26 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method for scribing brittle material substrate |
| JP5244202B2 (en) * | 2011-01-27 | 2013-07-24 | 三星ダイヤモンド工業株式会社 | Method for scribing a brittle material substrate |
| TWI483911B (en) * | 2011-09-28 | 2015-05-11 | Mitsuboshi Diamond Ind Co Ltd | Scribing apparatus |
| KR101421353B1 (en) * | 2012-11-30 | 2014-07-18 | (주)제일로닉 | Brittle material plate cutting apparatus |
| JP6201608B2 (en) * | 2013-10-08 | 2017-09-27 | 三星ダイヤモンド工業株式会社 | Scribing method |
| WO2015063960A1 (en) * | 2013-10-30 | 2015-05-07 | 坂東機工株式会社 | Glass plate scribing device |
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| KR101851453B1 (en) | 2018-04-23 |
| KR20170026118A (en) | 2017-03-08 |
| JP6544149B2 (en) | 2019-07-17 |
| CN106477866A (en) | 2017-03-08 |
| TWI625211B (en) | 2018-06-01 |
| CN106477866B (en) | 2019-08-23 |
| JP2017047546A (en) | 2017-03-09 |
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