TWI749843B - 資訊安全紙 - Google Patents
資訊安全紙 Download PDFInfo
- Publication number
- TWI749843B TWI749843B TW109138150A TW109138150A TWI749843B TW I749843 B TWI749843 B TW I749843B TW 109138150 A TW109138150 A TW 109138150A TW 109138150 A TW109138150 A TW 109138150A TW I749843 B TWI749843 B TW I749843B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- information security
- paper
- security paper
- sensing unit
- Prior art date
Links
- 229920003023 plastic Polymers 0.000 claims abstract description 42
- 239000004033 plastic Substances 0.000 claims abstract description 42
- 230000002787 reinforcement Effects 0.000 claims abstract description 42
- 239000010410 layer Substances 0.000 claims description 116
- 239000011241 protective layer Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 10
- 239000002923 metal particle Substances 0.000 claims description 10
- -1 polyethylene Polymers 0.000 claims description 10
- 239000007769 metal material Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000005025 cast polypropylene Substances 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 3
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 238000005728 strengthening Methods 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims 1
- 229920006026 co-polymeric resin Polymers 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 239000000428 dust Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 238000011895 specific detection Methods 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 229920001038 ethylene copolymer Polymers 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 2
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229920002522 Wood fibre Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010893 paper waste Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002025 wood fiber Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
- D21H27/30—Multi-ply
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/12—Coating on the layer surface on paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/103—Metal fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
- B32B2264/1052—Aluminum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
- B32B2264/1055—Copper or nickel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
- B32B2264/1056—Iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/582—Tearability
- B32B2307/5825—Tear resistant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2554/00—Paper of special types, e.g. banknotes
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
Abstract
本發明公開一種資訊安全紙。資訊安全紙包括:第一紙層、第二紙層、感測單元以及塑膠強化層。感測單元與塑膠強化層都設置在第一紙層與第二紙層之間,且塑膠強化層是位於感測單元的其中一側。
Description
本發明涉及一種具有感測效果的資訊安全紙,特別是涉及一種應用金屬或電子標籤的資訊安全紙,且兼具保密安全紙(security paper)以及無塵紙(dust-proof paper)的功能。
在科技快速進步的時代,快速掌握發展趨勢並研發產品是各公司企業獲利的途徑之一。然而,為了避免辛苦研究的成果非預期的被洩漏,科技公司通常會嚴密管控內部機密資訊的流通區域和流通途徑,以保護商業機密。
根據統計,在眾多機密洩漏的事件中,造成機密資訊外傳的途徑大致可區分為網路傳輸(11.3%)、硬體拷貝(13.1%)、文件影印(72.6%)以及其他(2.7%)。大部分的公司對於電腦資料、網路封包等數位資料,可以透過資安軟體來管制資料流量,以防止容易傳遞的電子資料被外洩。但以紙張建立的紙本文件資料,只能經由提高文書控管,或在紙張表面貼附電子標籤或條碼的方式,來達到管制文件流向及保全資料的目的。
然而,若研究人員一時疏忽,將記載有機密資料的攜帶出規範的安全區域外,所有人都有可能成為洩密者,而導致機密資料非出於本意而被公開。據此,大部分公司的技術研發部門會使用保密安全紙,保密安全紙可能被標示特殊的印記或條碼,而可被對應的檢測設備偵測。
如此一來,便可有效控管保密安全紙所流通的區域和範圍。一般來說,科技公司會於特定區域的出入口處架設檢測設備,一旦檢測設備檢測到保密安全紙上的印記或條碼,檢測設備便會發出聲響警示,以提醒相關人員,而可達到防止保密安全紙被帶出安全範圍的功效。
另外,公司內部通常還會搭配使用特定的保密專用列印機,保密專用列印機內建有具辨識功能的軟體或硬體,只有符合規格的保密安全紙可通過辨識並進行列印,以全面控管使用的紙張並達到保護商業機密的效果。
根據上述,現有技術中的保密安全紙都仍是以紙張作為材料。然而,紙製的保密安全紙通常機械強度較差,容易被撕裂破碎,且落塵量高而不適於應用在無塵室中。因此,現有技術中的保密安全紙雖已發展成熟,但開發一種具有良好的抗撕裂性以及耐衝擊性,以及較低的紙張落塵量的保密安全紙,仍為本領域技術人員的研發目標。
本發明所要解決的技術問題在於,針對現有技術的不足提供一種資訊安全紙,其不僅具有防竊功能,亦具有良好的抗撕裂性以及耐衝擊性。
為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種資訊安全紙,其包括:第一紙層、第二紙層、感測單元以及塑膠強化層。感測單元與塑膠強化層都設置在第一紙層與第二紙層之間,且塑膠強化層是位於感測單元的其中一側。
於本發明的其中一實施例中,資訊安全紙還進一步包括第一保護層以及第二保護層,且感測單元、塑膠強化層、第一紙層以及第二紙層都設置在第一保護層與第二保護層之間。
進一步而言,第一保護層的厚度與第二保護層的厚度都是介
於0.5微米至20微米。第一保護層的材料與第二保護層的材料選自由聚甲基丙烯酸甲酯(PMMA)、聚乙烯醇(PVA)、乙烯醋酸乙烯酯共聚合樹脂(EVA)、聚胺酯(PU)及其組合物所組成的群組中的其中一種。
於本發明的其中一實施例中,感測單元包括至少一種金屬材料,金屬材料是選自於由鋁、銅、鎳、鐵和其混合物或合金所構成的群組中的至少其中一種。
於本發明的其中一實施例中,感測單元具有層狀結構,且包括分散於層狀結構內的至少一種金屬顆粒、至少一種金屬纖維或其組合。
於本發明的其中一實施例中,感測單元為電子標籤,其包括一天線結構以及耦接於天線結構的無線射頻辨識晶片。
於本發明的其中一實施例中,強化層的材料是選自由聚烯烴、聚酯、聚醯胺和其組合物所構成的群組中的其中一種。詳細而言,塑膠強化層的材料選自由聚乙烯、雙軸延伸聚丙烯、流延聚丙烯、流延聚對苯二甲酸乙二酯、雙軸延伸對苯二甲酸乙二酯和聚醯亞胺所構成的群組中的任一種。另外,強化層的厚度是介於9微米至50微米。
於本發明的其中一實施例中,以SEMI G67-0996的測試方法測試資訊安全紙所產生的微粒子數,其中,粒徑大於0.3微米的微粒子數是介於50至1200 count/ft3。
於本發明的其中一實施例中,第一保護層與第二保護層是利用凹版塗佈而分別形成於第一紙層與第二紙層上。
本發明的其中一有益效果在於,本發明所提供的資訊安全紙,其能通過“感測單元設置於第一紙層與第二紙層之間”以及“塑膠強化層設置於第一紙層與第二紙層之間,並位於感測單元的其中一側”的技術方案,以使資訊安全紙不僅具有防竊功能,亦具有良好的抗撕裂性以及耐衝擊
性。
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。
P1~P5:資訊安全紙
10:第一紙層
20:第二紙層
30,30A,30B,30C:感測單元
300p:金屬顆粒
300f:金屬纖維
301:天線結構
302:晶片
40:塑膠強化層
50:第一保護層
60:第二保護層
圖1為本發明第一實施例的資訊安全紙的局部剖面示意圖。
圖2為本發明第二實施例的資訊安全紙的局部剖面示意圖。
圖3為本發明第三實施例的資訊安全紙的局部剖面示意圖。
圖4為本發明第四實施例的資訊安全紙的局部俯視示意圖。
圖5為圖4的V-V剖面的剖面示意圖。
圖6為本發明第五實施例的資訊安全紙的局部剖面示意圖。
以下是通過特定的具體實施例來說明本發明所公開有關“資訊安全紙”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。
[第一實施例]
參閱圖1,本發明第一實施例提供一種資訊安全紙P1。本發明提供一種資訊安全紙P1,其可應用於避免機密資料洩漏。本發明所提供的資訊安全紙P1的外觀可與一般紙相同,且規格可以符合A3(297mm×420mm)或者A4(210mm×297mm)大小,並可供特殊影印設備複印。另外,但相較於現有的保密安全紙,本發明實施例的資訊安全紙P1的良好的抗撕裂性以及耐衝擊性。在本發明實施例中,資訊安全紙P1仍具有可彎折性(flexibility),且可根據不同需求調整厚度,其厚度範圍可為20微米至350微米。
如圖1所示,資訊安全紙P1一第一紙層10、第二紙層20、感測單元30以及塑膠強化層40。塑膠強化層40位於感測單元30的其中一側,且感測單元30與塑膠強化層40設置於第一紙層10與第二紙層20之間。
在一實施例中,用於製作第一紙層10與第二紙層20的材料可包括,但不限於,紙漿、廢紙、木質纖維等。感測單元30被埋設在資訊安全紙P1內,而使資訊安全紙P1可被特定的檢測設備辨識。在一實施例中,感測單元30包括至少一種金屬材料,所述金屬材料是選自於由鋁、銅、鎳、鐵和其混合物或合金所構成的群組中的其中一種。因此,與感測單元30對應的檢測設備可以是一金屬探測器或一X射線(x-ray)感測器。在一實施例中,金屬材料為金屬磁性材料,其可以是軟磁性材料或是硬磁性材料,本發明並不限制。
如圖1所示,本實施例的感測單元30具有層狀結構。也就是說,本實施例的感測單元30為金屬片,且被夾設在第一紙層10與第二紙層20之間。在一較佳實施例中,感測單元30為一鋁箔片。由於金屬具有良好的延展性,金屬片的厚度可以薄於10微米,因此,即使將金屬片應用在本發明的資訊安全紙P1中,其總厚度與一般紙相差無幾,並不會因厚度過厚而
導致使用上和運輸上的不便。在一實施例中,金屬片的厚度是4微米至8微米;優選的,金屬片的厚度為6微米。然而,本發明不以上述所舉的例子為限。
在一實施例中,作為感測單元30的金屬片可形成有多個通孔,且多個通孔均勻地分佈於金屬箔片上。如此一來,本發明資訊安全紙P1可使用較少的金屬原料,但還是可被檢測設備所辨識。在另一實施例中,金屬片可具有特定的圖案,其可包括符號、文字、數字或其任意組合,並可利用特定檢測設備辨識。
通過使用形成有通孔或是圖案化的金屬片作為感測單元30,不僅可降低原料成本,也可減輕資訊安全紙P1的總重量。此外,形成通孔或者是圖案化之後,金屬片與紙層(第一紙層10或者第二紙層20)之間的接觸面積以及與塑膠強化層40之間的接觸面積也會隨之增加,有利於提升感測單元30和塑膠強化層40與紙層(第一紙層10或者第二紙層20)之間的結合力。在一實施例中,感測單元30和塑膠強化層40之間可利用黏著劑來結合,以提升感測單元30和塑膠強化層40間的結合效果。
在另一實施例中,感測單元30可以包括至少一種金屬纖維、至少一種金屬顆粒或其組合,且至少一種金屬纖維或是至少一種金屬顆粒可被混入用於製作第一紙層10、第二紙層20的材料內,而使資訊安全紙P1可被特定的檢測設備辨識。
由於感測單元30不會裸露在資訊安全紙P1的外表面,就外觀而言,本發明實施例所提供的資訊安全紙P1的外觀與一般紙張無異。即使有心人士欲竊盜或洩漏機密資料,也無法資訊安全紙P1的外部輕易地移除感測單元30。因此,本發明實施例的資訊安全紙P1可用於避免技術研發的機密資訊外洩。
請再參照圖1,塑膠強化層40位於感測單元30的其中一側。在本實施例中,塑膠強化層40是位於感測單元30與第二紙層20之間。然而,在另一實施例中,塑膠強化層40也可位於感測單元30與第一紙層10之間。也就是說,只要塑膠強化層40與感測單元30共同被夾設在第一紙層10與第二紙層20之間,本發明並不限制塑膠強化層40的位置。
塑膠強化層40可用來強化資訊安全紙P1的機械強度,以使資訊安全紙P1具有較佳的抗撕裂性與耐衝擊性。塑膠強化層40的厚度若過薄可能無法有效地提升資訊安全紙P1的抗撕裂性,若是太厚亦會使資訊安全紙P1重量過重。在一實施例中,塑膠強化層40的厚度範圍是介於9微米至50微米。
另外,塑膠強化層40的材料是選自由聚烯烴、聚酯、聚醯胺和其組合物所構成的群組中的其中一種,例如是選自由聚乙烯、雙軸延伸聚丙烯(biaxially oriented polypropylene)、流延聚丙烯(casting polypropylene,CPP)、流延聚對苯二甲酸乙二酯(casting PET)、雙軸延伸對苯二甲酸乙二酯(biaxially oriented polyethylene terephthalate film)和聚醯亞胺所構成的群組中的任一種。
聚乙烯可以是乙烯均聚物、乙烯共聚物或其混合物。乙烯均聚物是指僅使用乙烯作為單體所聚合而成的聚合物,乙烯均聚物的分散度為1.5至3.5;此處的分散度是指重量平均分子量和數量平均分子量的比值,簡稱為Mw/Mn。乙烯共聚物是指由乙烯和另一種或多種單體共同聚合而成的共聚物,乙烯共聚物的分散度為3.5以上。然而,本發明不以上述所舉的例子為限。
在一實施例中,塑膠強化層40和感測單元30之間設置有一黏著層(圖未示)。黏著層可由水性聚氨酯和壓克力樹脂混合而形成。黏著層中水性聚氨酯的含量為1重量百分比至70重量百分比,而壓克力樹脂的含量為1重量百分比至70重量百分比,但本發明並不以此例為限。
當感測單元30為金屬片時,因感測單元30與塑膠強化層40的材質不同,而使二者之間的結合力較差。因此,在貼合感測單元30(金屬片)與塑膠強化層40之前,可先在感測單元30的表面上塗佈約1微米至5微米厚度的黏著劑(primer),以在感測單元30和塑膠強化層40之間形成黏著層,以提升感測單元30與塑膠強化層40之間的結合力。在本實施例中,黏著層的厚度為2微米,然而,本發明不以上述所舉的例子為限。
基於上述,本發明實施例所提供的資訊安全紙P1具有較佳的抗撕裂性以及耐衝擊性,並可用於避免機密資料洩漏。
請參照圖2,顯示本發明第二實施例的資訊安全紙的局部剖面示意圖。本實施例的資訊安全紙P2與第一實施例相同的元件具有相同的標號,且相同的部分不再贅述。
具體而言,本實施例的資訊安全紙P2的感測單元30A是一複合材料層,其包括有機材料與至少一種金屬顆粒300p。金屬顆粒300p的材料是選自於由鋁、銅、鎳、鐵和其混合物或合金所構成的群組中的其中一種。換言之,感測單元30A具有層狀結構,且金屬顆粒300p分散於層狀結構內。在一實施例中,金屬顆粒300p可以只分佈在複合材料層的局部區域內。另外,在本實施例中,塑膠強化層40是位於感測單元30與第一紙層10之間。
請參照圖3,顯示本發明第三實施例的資訊安全紙的局部剖面示意圖。本實施例的資訊安全紙P3與第二實施例相同的元件具有相同的標號。在本實施例中,感測單元30B同樣具有層狀結構,且為複合材料層,其包括有機材料與至少一種金屬纖維300f。也就是說,只少一種金屬纖維300f會分散於層狀結構內。相似於第二實施例,金屬纖維300f的材料可選自於由鋁、銅、鎳、鐵和其混合物或合金所構成的群組中的其中一種,但本發明並不限制。
在其他實施例中,感測單元30B也可以同時包括分散於層狀
結構中的至少一種金屬顆粒300p與至少一種金屬纖維300f。只要可以被特定的檢測設備偵測,本發明並不限制感測單元30B的實施態樣。
請參照圖4以及圖5,圖4為本發明第四實施例的資訊安全紙的局部俯視示意圖,而圖5為圖4的V-V剖面的剖面示意圖。
如圖4所示,本實施例的資訊安全紙P4中,感測單元30C為電子標籤。進一步而言,在一實施例中,電子標籤為無線射頻辨識標籤,其可以是被動式、半被動式或者是主動式無線射頻辨識標籤。在本實施例中,電子標籤包括一天線結構301以及耦接於天線結構301的一晶片302,但本發明並不以此例為限。在另一實施例中,電子標籤中的晶片302可以被省略,而只具有天線結構301。
天線結構301與晶片302可以被形成於塑膠強化層40上,並且被夾設在第一紙層10與第二紙層20之間。利用特定的讀取設備,可讀取儲存於電子標籤內的數據。
須說明的是,由於一般紙張表面的纖維在摩擦之後容易產生粉屑。具體來說,通過空氣微粒計數器的測量,一般紙張在經摩擦後會測得粒徑大於0.3μm的微粒數量超過15000 count/ft3。相較之下,本發明所提供的資訊安全紙P1~P4具有較佳的抗撕裂性以及耐衝擊性,因此也可具有較低的落塵數,而可被應用一般環境甚至是對潔淨度要求較嚴格的環境中。
然而,若要在等級更高的無塵室內時,還需進一步降低資訊安全紙的落塵數。請參照圖6,顯示本發明第五實施例的資訊安全紙的局部剖面示意圖。
為了可適用於等級規範更嚴格的無塵室中,本發明實施例的資訊安全紙P5除了第一紙層10、第二紙層20、感測單元30以及塑膠強化層40之外,還進一步包括一第一保護層50與第二保護層60。
如圖6所示,第一保護層50與第二保護層60是位於資訊安全紙P5的最外側。也就是說,感測單元30、塑膠強化層40、第一紙層10以及第二紙層20都設置在第一保護層50與第二保護層60之間。
在一實施例中,第一保護層50與第二保護層60的材料可以選自由聚甲基丙烯酸甲酯(PMMA)、聚乙烯醇(PVA)、乙烯醋酸乙烯酯共聚合樹脂(EVA)、聚胺酯(PU)及其組合物所組成的群組中的其中一種。在一實施例中,第一保護層50與第二保護層60可利用凹版塗佈而分別形成於第一紙層10與第二紙層20上。另外,第一保護層50(或者第二保護層60)的厚度是介於0.5微米至20微米。
如此,本實施例的資訊安全紙P5經摩擦後所測得的落塵數會大幅減少,而可應用在等級規範更高的無塵室中。具體而言,本發明實施例的資訊安全紙P5以SEMI G67-0996的測試方法測試,測得粒徑大於或等於0.3μm的微粒數量不超過1500 count/ft3,較佳是50至1200 count/ft3。另外,測試結果顯示粒徑大於或等於0.5μm的微粒數量為142至716 count/ft3;粒徑大於或等於1μm的微粒數量為84至403 count/ft3。
此外,須說明的是,雖然本實施例的感測單元30與圖1的實施例中的感測單元相同,但在其他實施例中,也可以被任意替換為圖2至圖4的任一實施例的感測單元30A~30C。
[實施例的有益效果]
本發明的其中一有益效果在於,本發明所提供的資訊安全紙,其能通過“感測單元30,30A~30C設置於第一紙層10與第二紙層20之間”以及“塑膠強化層40設置於第一紙層10與第二紙層20之間,並位於感測單元30,30A~30C的其中一側”的技術方案,以使資訊安全紙P1~P5不僅具有防竊功能,亦具有良好的抗撕裂性以及耐衝擊性。
更進一步來說,相較於不具有塑膠強化層40的比較例而言,本發明實施例的資訊安全紙P1~P5的抗撕裂性是比較例的1.5倍至3倍。由於抗撕裂性與耐衝擊性提高,本發明實施例的資訊安全紙P1~P5較不容易被撕裂,而產生粉塵或細屑,而可應用於在對潔淨度要求較嚴格的環境中。整體而言,以SEMI G67-0996的測試方法測試本發明實施例的資訊安全紙P1~P5所產生的微粒子數,粒徑大於0.3微米的微粒子數是介於50至1200 count/ft3。
此外,本發明實施例的資訊安全紙P1~P5的表面在摩擦之後,也較不易產生細屑,可避免細屑飄落至儀器或產線,而對儀器的運作或產品的生產造成影響。當研究人員攜帶記載有研究機密的資訊安全紙P1~P5經過檢測設備時,檢測設備可辨識到感測單元,而發出警示聲響來提醒研究人員,以達到保護商業機密的目的。
更進一步而言,本發明實施例的資訊安全紙P5還包括分別形成於第一紙層10與第二紙層20上的第一保護層50與第二保護層60,可以進一步降低資訊安全紙P5的表面被摩擦而產生的落塵,使資訊安全紙P5可被應用在等級更高的無塵室中。
相較於以往的紙張層,本發明實施例的資訊安全紙P1~P5可被檢測設備辨識,而可避免機密資料被竊。除此之外,資訊安全紙P1~P5具有較低的發塵性以及較高的抗撕裂性與抗衝擊性,可在潔淨度要求較嚴苛的環境中書寫以及複印。
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。
P1:資訊安全紙
10:第一紙層
20:第二紙層
30:感測單元
40:塑膠強化層
Claims (12)
- 一種資訊安全紙,其包括:一第一紙層;一第二紙層;一感測單元,其設置於所述第一紙層與所述第二紙層之間;以及一塑膠強化層,其設置於所述第一紙層與所述第二紙層之間,並位於所述感測單元的其中一側;其中,所述資訊安全紙的厚度範圍介於20微米至350微米。
- 如請求項1所述的資訊安全紙,還進一步包括一第一保護層以及一第二保護層,所述感測單元、所述塑膠強化層、所述第一紙層以及所述第二紙層都設置在所述第一保護層與所述第二保護層之間。
- 如請求項2所述的資訊安全紙,其中,所述第一保護層的厚度與所述第二保護層的厚度都是介於0.5微米至20微米。
- 如請求項2所述的資訊安全紙,其中,所述第一保護層的材料與所述第二保護層的材料選自由聚甲基丙烯酸甲酯(PMMA)、聚乙烯醇(PVA)、乙烯醋酸乙烯酯共聚合樹脂(EVA)、聚胺酯(PU)及其組合物所組成的群組中的其中一種。
- 如請求項1所述的資訊安全紙,其中,所述感測單元包括至少一種金屬材料,所述金屬材料是選自於由鋁、銅、鎳、鐵和其混合物或合金所構成的群組中的至少其中一種。
- 如請求項1所述的資訊安全紙,其中,所述感測單元具有層狀結構,且包括分散於所述層狀結構內的至少一種金屬顆粒、至少一種金屬纖維或其組合。
- 如請求項1所述的資訊安全紙,其中,所述感測單元為電子 標籤,其包括一天線結構以及耦接於所述天線結構的一晶片。
- 如請求項1所述的資訊安全紙,其中,所述塑膠強化層的材料是選自由聚烯烴、聚酯、聚醯胺和其組合物所構成的群組中的其中一種。
- 如請求項1所述的資訊安全紙,其中,所述強化層的厚度是介於9微米至50微米。
- 如請求項1所述的資訊安全紙,其中,以SEMI G67-0996的測試方法測試所述資訊安全紙所產生的微粒子數,其中,粒徑大於0.3微米的微粒子數是介於50至1200 count/ft3。
- 如請求項1所述的資訊安全紙,還進一步包括一第一保護層以及一第二保護層,其中,所述第一保護層與所述第二保護層是利用凹版塗佈而分別形成於所述第一紙層與所述第二紙層上。
- 如請求項1所述的資訊安全紙,其中,所述塑膠強化層的材料選自由聚乙烯、雙軸延伸聚丙烯、流延聚丙烯、流延聚對苯二甲酸乙二酯、雙軸延伸對苯二甲酸乙二酯和聚醯亞胺所構成的群組中的任一種。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109138150A TWI749843B (zh) | 2020-11-03 | 2020-11-03 | 資訊安全紙 |
CN202110320619.0A CN114434934A (zh) | 2020-11-03 | 2021-03-25 | 资讯安全纸 |
US17/381,589 US20220134708A1 (en) | 2020-11-03 | 2021-07-21 | Information security paper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109138150A TWI749843B (zh) | 2020-11-03 | 2020-11-03 | 資訊安全紙 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI749843B true TWI749843B (zh) | 2021-12-11 |
TW202218883A TW202218883A (zh) | 2022-05-16 |
Family
ID=80681250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109138150A TWI749843B (zh) | 2020-11-03 | 2020-11-03 | 資訊安全紙 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20220134708A1 (zh) |
CN (1) | CN114434934A (zh) |
TW (1) | TWI749843B (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007034129A1 (en) * | 2005-09-26 | 2007-03-29 | The Secretary Of State For The Home Department | Document and method of manufacturing same |
TWM588824U (zh) * | 2019-10-04 | 2020-01-01 | 台灣寶點科技股份有限公司 | 防拷貝之安全紙結構 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI276671B (en) * | 2000-03-03 | 2007-03-21 | Lintec Corp | Adhesive sheet and adhered article |
DE10148122A1 (de) * | 2001-09-28 | 2003-04-24 | Giesecke & Devrient Gmbh | Sicherheitspapier |
JP2008303522A (ja) * | 2007-06-08 | 2008-12-18 | Koreit Co Ltd | 保安用印刷用紙及びその製造方法 |
KR101874620B1 (ko) * | 2012-02-28 | 2018-07-05 | 에이치피프린팅코리아 주식회사 | 금속탐지기 검출용 보안용지 |
KR20130115023A (ko) * | 2012-04-10 | 2013-10-21 | 삼성전자주식회사 | 금속탐지기 검출용 보안용지 |
RU2665521C2 (ru) * | 2013-08-14 | 2018-08-30 | КБА-НотаСис СА | Создание окна с областью линз в подложке защищенной от подделки бумаги |
CN203625721U (zh) * | 2013-10-25 | 2014-06-04 | 李贤珑 | 一种用于rfid屏蔽的复合纸 |
CN106192574A (zh) * | 2015-04-03 | 2016-12-07 | 北京恒维科技有限公司 | 一种防盗安全纸 |
WO2017068440A1 (en) * | 2015-10-24 | 2017-04-27 | Malpani Manoj | High tear resistant paper comprising means for determinining authenticity |
CN107100035A (zh) * | 2017-06-14 | 2017-08-29 | 盛世龙图(北京)物联技术有限公司 | 一种可识别和防盗的安全纸 |
TWM553860U (zh) * | 2017-09-26 | 2018-01-01 | Taiwan E A S Tech Co Ltd | 資料保密防竊紙結構 |
CN207608771U (zh) * | 2017-11-07 | 2018-07-13 | 林宏政 | 感应防盗纸结构 |
-
2020
- 2020-11-03 TW TW109138150A patent/TWI749843B/zh active
-
2021
- 2021-03-25 CN CN202110320619.0A patent/CN114434934A/zh active Pending
- 2021-07-21 US US17/381,589 patent/US20220134708A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007034129A1 (en) * | 2005-09-26 | 2007-03-29 | The Secretary Of State For The Home Department | Document and method of manufacturing same |
TWM588824U (zh) * | 2019-10-04 | 2020-01-01 | 台灣寶點科技股份有限公司 | 防拷貝之安全紙結構 |
Also Published As
Publication number | Publication date |
---|---|
CN114434934A (zh) | 2022-05-06 |
US20220134708A1 (en) | 2022-05-05 |
TW202218883A (zh) | 2022-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6521312B1 (en) | Multilayered film structures and methods of making and using the same | |
JP5727568B2 (ja) | 積層体および包装体 | |
US20100291354A1 (en) | Laminate for Laser Marking | |
JP2009234275A (ja) | 多層のカード | |
JP2014031016A5 (zh) | ||
US20160214422A1 (en) | Polyolefin based identification documents | |
TWI749843B (zh) | 資訊安全紙 | |
JP2754279B2 (ja) | 感熱接着シート及びそれを用いた情報記録体 | |
JP2005100371A (ja) | アンテナシート及びそれを用いたicカードまたはicタグ | |
JP2005209171A (ja) | Icカードまたはicタグの製造方法及びこれに用いる延伸プラスチックフィルム | |
TWI751446B (zh) | 具有感測效果的無塵紙 | |
US20100330304A1 (en) | Security laminates with a security feature detectable by touch | |
CA2369744A1 (en) | Epoxy coated multilayer structure for use in the producton of security documents | |
JP2004355519A (ja) | Icラベル | |
JPWO2003004270A1 (ja) | 巻回積層体 | |
JP6972285B2 (ja) | 印刷層付フィルム積層体、該印刷層付フィルム積層体を含む光学積層体、およびこれらを用いた画像表示装置 | |
EP2070022B1 (en) | Laminate device having voided structure for carrying electronic element, such as label for rfid tag | |
KR20010023216A (ko) | 인쇄용 시트 | |
JP5173628B2 (ja) | 積層シート | |
JPH04142986A (ja) | ラミネートシート | |
WO2002005037A1 (fr) | Papier d'enregistrement electrophotographique | |
US6607801B2 (en) | Heat-sensitive adhesive sheet and information-recorded sheet material using the same | |
JPH0834186A (ja) | カード | |
JPH0999677A (ja) | 耐熱性プラスチックカード及びその製造方法 | |
JP5348854B2 (ja) | 電子写真記録用紙および記録物 |