TWI749501B - Display device - Google Patents

Display device Download PDF

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TWI749501B
TWI749501B TW109111017A TW109111017A TWI749501B TW I749501 B TWI749501 B TW I749501B TW 109111017 A TW109111017 A TW 109111017A TW 109111017 A TW109111017 A TW 109111017A TW I749501 B TWI749501 B TW I749501B
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Taiwan
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display panel
display device
substrate
electrically connected
driving
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TW109111017A
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Chinese (zh)
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TW202038453A (en
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楊文霖
張勁淳
林金鋒
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力領科技股份有限公司
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

A display device comprises a substrate, a display panel, multiple driving chips, and a connecting module. The display panel is set on the substrate for displaying the picture. The display panel comprises multiple areas. Each driving chip is electrically connected to the display panel and is used to drive the display panel. The connecting module is set on the substrate and is electrically connected to the multiple driving chips and the substrate. Each driving chip is electrically connected to one of the areas of the display panel to drive the areas of the display panel.

Description

顯示裝置 Display device

本發明係指一種顯示裝置，尤指一種透過玻璃覆晶結合製程來達到窄邊框之需求的顯示裝置，不僅能降低成本，還能大幅提升產能。 The present invention refers to a display device, in particular to a display device that meets the requirement of a narrow frame through a glass-on-glass bonding process, which can not only reduce the cost, but also greatly increase the production capacity.

隨著時代的演進，行動裝置的顯示面板之尺寸愈來愈大且高屏占比的需求也逐漸提高，窄邊框的行動裝置開始問世。顯示面板的驅動晶片封裝由過去的玻璃覆晶結合(Chip on Glass，COG)製程慢慢地被薄膜覆晶結合(Chip on Film，COF)製程所取代，以滿足窄邊框的需求。 With the evolution of the times, the size of the display panels of mobile devices has become larger and the demand for high screen-to-body ratios has gradually increased, and mobile devices with narrow bezels have begun to come out. The driver chip package of the display panel is gradually replaced by the chip on glass (COG) process in the past by the chip on film (COF) process to meet the needs of narrow bezels.

具體來說，請參考第1圖及第2圖，第1圖為玻璃覆晶結合製程封裝的顯示裝置1與薄膜覆晶結合製程封裝的顯示裝置2之示意圖，第2圖為玻璃覆晶結合製程封裝的顯示裝置1的外觀圖。顯示裝置1包含一基板10、一顯示面板11、一驅動晶片12及一連接模組13。顯示面板11設置於基板10上，若以智慧型手機或平板電腦為例，且基板10上未被顯示面板11覆蓋的區域即為慣稱的邊框14。於玻璃覆晶結合製程中，驅動晶片12設置於基板10的邊框14區域並電連接於顯示面板11。連接模組13一般為一軟性印刷電路板(Flexible Printed Circuit，FPC)，其設置於基板10上以經由基板10電連接顯示面板11，並且連接模組13還電連接於驅動晶片12，且在顯示裝置1組裝時，部分的連接模組13將被彎折至基板10的 背面(第2圖為攤開連接模組13之示意圖，即連接模組13尚未彎折)，使得驅動晶片12與顯示面板11係位於基板10的同一側(即基板10的正面)，因此邊框14至少需容納驅動晶片12與部分之連接模組13。相較之下，於薄膜覆晶結合製程中，顯示裝置2同樣包含一基板20、一顯示面板21、一驅動晶片22及一連接模組23。惟，薄膜覆晶結合製程與玻璃覆晶結合製程的差異在於：驅動晶片22可以封裝於連接模組23上，故將部分的連接模組23彎折至基板20的背面時，驅動晶片22與顯示面板21係位於基板20的不同側，因此邊框不需容納驅動晶片22，如此可大幅減少邊框的面積，以滿足窄邊框的需求。一般而言，薄膜覆晶結合製程封裝透過讓驅動晶片22不佔用邊框的空間，可使邊框節省約1.5公釐(mm)左右的寬度。 Specifically, please refer to Figures 1 and 2. Figure 1 is a schematic diagram of a display device 1 packaged by a chip-on-glass process and a display device 2 packaged by a film-on-glass process. Figure 2 is a chip-on-glass process. The external view of the display device 1 packaged in the process. The display device 1 includes a substrate 10, a display panel 11, a driving chip 12 and a connection module 13. The display panel 11 is disposed on the substrate 10, if a smartphone or a tablet computer is taken as an example, and the area on the substrate 10 not covered by the display panel 11 is the so-called frame 14. In the chip-on-glass bonding process, the driver chip 12 is disposed on the frame 14 area of the substrate 10 and is electrically connected to the display panel 11. The connection module 13 is generally a flexible printed circuit board (FPC), which is disposed on the substrate 10 to be electrically connected to the display panel 11 through the substrate 10, and the connection module 13 is also electrically connected to the driving chip 12, and When the display device 1 is assembled, part of the connection module 13 will be bent to the substrate 10 The back side (Figure 2 is a schematic diagram of the connection module 13 spread out, that is, the connection module 13 has not been bent), so that the driver chip 12 and the display panel 11 are located on the same side of the substrate 10 (that is, the front side of the substrate 10), so the frame 14 at least needs to accommodate the driver chip 12 and part of the connection module 13. In contrast, in the thin film flip chip bonding process, the display device 2 also includes a substrate 20, a display panel 21, a driving chip 22, and a connection module 23. However, the difference between the film-on-chip bonding process and the chip-on-glass bonding process is that the driver chip 22 can be packaged on the connection module 23, so when a part of the connection module 23 is bent to the back of the substrate 20, the driver chip 22 and The display panel 21 is located on different sides of the substrate 20, so the frame does not need to accommodate the driving chip 22, so that the area of the frame can be greatly reduced to meet the requirement of a narrow frame. Generally speaking, a thin film-on-chip integrated process package can save the width of the frame by about 1.5 millimeters (mm) by allowing the driver chip 22 to not occupy the space of the frame.

透過薄膜覆晶結合製程所製成的顯示裝置2雖可減少邊框的面積，然其技術門檻較高，造成整體製作成本也相對較高，更會使產能受到限制；而玻璃覆晶結合製程所製成的顯示裝置1雖製作成本較低，但邊框可被減少幅度卻是受限的，不易達到窄邊框的效果。 Although the display device 2 manufactured by the thin film-on-chip bonding process can reduce the area of the frame, its technical threshold is relatively high, resulting in a relatively high overall production cost, and also restricts the production capacity; and the glass-on-glass bonding process Although the manufacturing cost of the manufactured display device 1 is relatively low, the extent that the frame can be reduced is limited, and it is not easy to achieve the effect of a narrow frame.

因此，本發明的主要目的即在於提供一種顯示裝置，有別於先前技術必須採用技術門檻較高的薄膜覆晶結合製程封裝，且亦能滿足窄邊框的需求。 Therefore, the main purpose of the present invention is to provide a display device, which is different from the prior art, which must be packaged with a thin-film-on-chip bonding process with a higher technical threshold, and can also meet the needs of narrow bezels.

本發明揭露一種顯示裝置，包含一基板、一顯示面板、複數個驅動晶片以及一連接模組。顯示面板設置於該基板以供顯示畫面，該顯示面板包含數個區域。各該驅動晶片電連接於該顯示面板以驅動該顯示面板。連接模組設置於該基板並電連接於該複數個驅動晶片及該基板。其中，每一驅動晶片與該 顯示面板的其中一區域電連接，以分別驅動該顯示面板的數個區域。 The present invention discloses a display device, which includes a substrate, a display panel, a plurality of driving chips, and a connection module. The display panel is arranged on the substrate for displaying images, and the display panel includes several areas. Each of the driving chips is electrically connected to the display panel to drive the display panel. The connection module is arranged on the substrate and electrically connected to the plurality of driving chips and the substrate. Among them, each driver chip and the One area of the display panel is electrically connected to drive several areas of the display panel respectively.

3,4,5,6,7,8,9:顯示裝置 3, 4, 5, 6, 7, 8, 9: display device

30,40,50,60,70,80,90:基板 30, 40, 50, 60, 70, 80, 90: substrate

31,41,51,61,71,81,91:顯示面板 31, 41, 51, 61, 71, 81, 91: display panel

32,42,52,62,72,82,92:驅動晶片 32, 42, 52, 62, 72, 82, 92: driver chip

321,422:傳輸線 321,422: Transmission line

33,43,53,63,73,83,93:連接模組 33,43,53,63,73,83,93: connection module

331,431,531a,531b,631a,631b,731,931:電路板 331,431,531a,531b,631a,631b,731,931: circuit board

332,432,532a,532b,632a,632b,732,832:電連接部 332,432,532a,532b,632a,632b,732,832: electrical connection part

6311,7311,8311,9311:本體部 6311,7311,8311,9311: body part

6312,7312,8312:凸伸部 6312, 7312, 8312: protrusion

9312:彎折部 9312: Bending part

9311a:第一面 9311a: First side

9311b:第二面 9311b: second side

L:長邊方向 L: Long side direction

W:短邊方向 W: Short-side direction

第1圖是現有技術之顯示裝置的示意圖。 Figure 1 is a schematic diagram of a prior art display device.

第2圖是現有技術之顯示裝置的示意圖。 Figure 2 is a schematic diagram of a prior art display device.

第3圖是本發明實施例之一顯示裝置的示意圖。 Figure 3 is a schematic diagram of a display device according to an embodiment of the present invention.

第4圖是本發明實施例之一顯示裝置的示意圖。 Fig. 4 is a schematic diagram of a display device according to an embodiment of the present invention.

第5圖是本發明實施例之一顯示裝置的示意圖。 Figure 5 is a schematic diagram of a display device according to an embodiment of the present invention.

第6圖是本發明實施例之一顯示裝置的示意圖。 Fig. 6 is a schematic diagram of a display device according to an embodiment of the present invention.

第7圖是本發明實施例之一顯示裝置的示意圖。 Fig. 7 is a schematic diagram of a display device according to an embodiment of the present invention.

第8圖是本發明實施例之一顯示裝置的示意圖。 Fig. 8 is a schematic diagram of a display device according to an embodiment of the present invention.

第9圖是本發明實施例之一顯示裝置的示意圖。 Fig. 9 is a schematic diagram of a display device according to an embodiment of the present invention.

第10圖是沿著第9圖的剖面線A-A的剖示圖。 Fig. 10 is a cross-sectional view taken along the section line A-A of Fig. 9;

請參閱第3圖，第3圖為本發明實施例的一顯示裝置3的示意圖。顯示裝置3係可透過玻璃覆晶結合製程封裝，其包含一基板30、一顯示面板31、兩個驅動晶片32及一連接模組33。顯示面板31用來顯示畫面，且顯示面板31可為一薄膜電晶體液晶顯示器(TFT-LCD)，但不以此為限。顯示面板31、兩個驅動晶片32與連接模組33係設置於基板30上，驅動晶片32電連接於顯示面板31，且用來驅動顯示面板31，每一驅動晶片32為一積體電路顯示驅動晶片，故其具有相互垂的一長邊方向L及一短邊方向W。連接模組33電連接於驅動晶片32及基板30，並控制驅動晶片32驅動顯示面板31。其中，顯示面板31具有數條(例如n條) 源極線，且顯示面板包含數個(例如2個)區域，且每個區域包含該數條源極線中的一部分(例如n/2條)。每一驅動晶片32與顯示面板31的其中一區域電連接，以分別驅動顯示面板31的數個區域，具體來說，兩個驅動晶片32分別驅動顯示面板31的左半部區域與右半部區域。值得注意的是，本實施例是以兩個驅動晶片32為例，故將顯示面板31劃分為兩個區域，但在其他實施例中，也可為三個或以上的驅動晶片，不以本實施例所揭露的態樣為限。更進一步來說，兩個驅動晶片32於長邊方向L上彼此相間隔，每一個驅動晶片32電連接朝顯示面板31延伸並電連接至顯示面板31的複數條傳輸線321，每一條傳輸線321是由驅動晶片32相鄰顯示面板31的邊緣朝顯示面板31延伸，使顯示面板31與驅動晶片32之距離縮短。連接模組33包括一電路板331及設置於電路板331上且電連接於兩個驅動晶片32的複數個電連接部332。其中，電路板331為一軟性印刷電路板，可被彎折至顯示面板31的背面，而第3圖僅為電路板331尚未彎折之示意圖，然而實際上在顯示裝置3組裝時，電路板331可被彎折至基板30的背面。 Please refer to FIG. 3, which is a schematic diagram of a display device 3 according to an embodiment of the present invention. The display device 3 can be packaged through a chip-on-glass bonding process, and includes a substrate 30, a display panel 31, two driving chips 32, and a connection module 33. The display panel 31 is used to display images, and the display panel 31 can be a thin film transistor liquid crystal display (TFT-LCD), but is not limited to this. The display panel 31, the two driving chips 32 and the connection module 33 are arranged on the substrate 30. The driving chip 32 is electrically connected to the display panel 31 and used to drive the display panel 31. Each driving chip 32 is an integrated circuit display The driving chip has a long side direction L and a short side direction W which are perpendicular to each other. The connection module 33 is electrically connected to the driving chip 32 and the substrate 30 and controls the driving chip 32 to drive the display panel 31. Among them, the display panel 31 has several (for example, n) The source line, and the display panel includes several (for example, 2) areas, and each area includes a part (for example, n/2) of the several source lines. Each drive chip 32 is electrically connected to one area of the display panel 31 to drive several areas of the display panel 31. Specifically, the two drive chips 32 drive the left half area and the right half of the display panel 31 respectively. area. It is worth noting that this embodiment takes two driver chips 32 as an example, so the display panel 31 is divided into two areas. However, in other embodiments, there may also be three or more driver chips. The aspects disclosed in the embodiments are limited. Furthermore, the two driving chips 32 are spaced apart from each other in the longitudinal direction L, and each driving chip 32 is electrically connected to a plurality of transmission lines 321 extending toward the display panel 31 and electrically connected to the display panel 31, and each transmission line 321 is The edge of the display panel 31 adjacent to the driving chip 32 extends toward the display panel 31, so that the distance between the display panel 31 and the driving chip 32 is shortened. The connection module 33 includes a circuit board 331 and a plurality of electrical connection portions 332 disposed on the circuit board 331 and electrically connected to the two driving chips 32. The circuit board 331 is a flexible printed circuit board that can be bent to the back of the display panel 31, and Figure 3 is only a schematic diagram of the circuit board 331 that has not been bent. However, in fact, when the display device 3 is assembled, the circuit board 331 can be bent to the back of the substrate 30.

比較先前技術的第2圖與本實施例的第3圖可知，相較於僅以單一個驅動晶片12驅動顯示面板11全部源極線的現有技術，本實施例的顯示裝置3透過兩個驅動晶片32的結構與排列設計，可使複數條傳輸線321的延伸長度減少，進而大幅縮短顯示面板31與驅動晶片32之間的距離。舉例來說，若先前技術的顯示裝置1與本實施例的顯示裝置3應用的顯示面板11、31具有相同解析度：720x1520，該等顯示面板的尺寸一般為4~6吋，且所需的驅動晶片尺寸常見為28000um x 900um或相近的大小，在先前技術中，顯示面板11與驅動晶片12之間在短邊方向W上的距離大約為2.2公釐；在本實施例中，藉由減少複數條傳輸線321的延伸長度，顯示面板31與驅動晶片32之間在短邊方向W上的距離d1可縮減至大約為0.9公釐；換言之，針對上述範例，應用本發明實施例將可使邊框於該 短邊方向W上節省約1.3公釐左右的寬度，與薄膜覆晶結合製程的邊框節省效果(約1.5公釐)已相去無幾，同樣可達到窄邊框的效果。 Comparing FIG. 2 of the prior art with FIG. 3 of this embodiment, it can be seen that, compared to the prior art in which only a single driver chip 12 drives all the source lines of the display panel 11, the display device 3 of this embodiment uses two drivers The structure and arrangement design of the chip 32 can reduce the extension length of the plurality of transmission lines 321, thereby greatly shortening the distance between the display panel 31 and the driving chip 32. For example, if the display panels 11, 31 applied to the display device 1 of the prior art and the display device 3 of this embodiment have the same resolution: 720x1520, the size of the display panels is generally 4-6 inches, and the required The size of the driver chip is usually 28000um x 900um or a similar size. In the prior art, the distance between the display panel 11 and the driver chip 12 in the short-side direction W is about 2.2 mm; in this embodiment, by reducing The extension length of the plurality of transmission lines 321 and the distance d1 in the short-side direction W between the display panel 31 and the driving chip 32 can be reduced to approximately 0.9 mm; For that The width of about 1.3 mm is saved in the short-side direction W, and the frame saving effect (about 1.5 mm) of the film-on-chip integration process is almost the same, and the effect of a narrow frame can also be achieved.

針對不同需求，本發明的實施例也可藉由不同的結構設計來達到類似的功效。請參閱第4圖，第4圖為本發明實施例的一顯示裝置4的示意圖。顯示裝置4包含一基板40、一顯示面板41、一驅動晶片42及一連接模組43。其中，連接模組43包括一電路板431，電路板431可設置於驅動晶片42於長邊方向L上的兩側之其中一側。在第4圖中，電路板431係設置於驅動晶片42於長邊方向L上的右側，且電路板431具有複數個供電連接於驅動晶片42的電連接部432，且驅動晶片42電連接朝電路板431延伸並電連接至電連接部432的複數條傳輸線422。每一條傳輸線422可沿長邊方向L朝電路板431延伸以和電連接部432進行電連接。如此，電路板431仍然可以在顯示裝置4組裝時，被彎折至基板40的背面，然而，用來電連接驅動晶片42與電路板431的複數條傳輸線422以及電連接部432並不會在短邊方向W上佔用邊框的空間。 For different needs, the embodiments of the present invention can also achieve similar effects through different structural designs. Please refer to FIG. 4, which is a schematic diagram of a display device 4 according to an embodiment of the present invention. The display device 4 includes a substrate 40, a display panel 41, a driving chip 42 and a connection module 43. The connection module 43 includes a circuit board 431, and the circuit board 431 can be disposed on one of the two sides of the driving chip 42 in the longitudinal direction L. In Figure 4, the circuit board 431 is disposed on the right side of the driver chip 42 in the longitudinal direction L, and the circuit board 431 has a plurality of electrical connection portions 432 connected to the driver chip 42 for power supply, and the driver chip 42 is electrically connected toward The circuit board 431 extends and is electrically connected to the plurality of transmission lines 422 of the electrical connection part 432. Each transmission line 422 may extend toward the circuit board 431 along the longitudinal direction L to be electrically connected to the electrical connection part 432. In this way, the circuit board 431 can still be bent to the back of the substrate 40 when the display device 4 is assembled. However, the plurality of transmission lines 422 and the electrical connection portions 432 used to electrically connect the driver chip 42 and the circuit board 431 are not short. Occupies the space of the frame in the side direction W.

更詳言之，比較先前技術的第1、2圖與本實施例的第4圖可知，在先前技術中，由於驅動晶片12是沿短邊方向W延伸的傳輸線來電連接至連接模組13的電連接部，這些電連接部無法如連接模組13的其他部分被彎折至基板10的背面，因此將會在短邊方向W上佔用邊框14的空間。舉例而言在常見情況下，此連接模組13的電連接部下緣與驅動晶片12之間在短邊方向W上的距離d2大約為1.4公釐，此即相當於在短邊方向W上佔用邊框14約1.4公釐左右的寬度。而在本實施例中，由於用來電連接驅動晶片42與電路板431的複數條傳輸線422以及電連接部432並不會在短邊方向W上佔用邊框的空間；換言之，應用本發明實施例將可使邊框於該短邊方向W上節省約1.4公釐左右的寬度，與薄膜覆晶結合製 程的邊框節省效果(約1.5公釐)已相去無幾，同樣可達到窄邊框的效果。 In more detail, comparing Figures 1 and 2 of the prior art with Figure 4 of this embodiment, it can be seen that in the prior art, since the driver chip 12 is electrically connected to the connection module 13 by a transmission line extending in the short-side direction W The electrical connection parts, which cannot be bent to the back of the substrate 10 like other parts of the connection module 13, will occupy the space of the frame 14 in the short-side direction W. For example, in a common situation, the distance d2 between the lower edge of the electrical connection portion of the connection module 13 and the drive chip 12 in the short-side direction W is approximately 1.4 mm, which is equivalent to occupying the short-side direction W The frame 14 has a width of about 1.4 mm. In this embodiment, since the plurality of transmission lines 422 and the electrical connection portion 432 used to electrically connect the driving chip 42 and the circuit board 431 do not occupy the space of the frame in the short-side direction W; in other words, the application of the present invention will The width of the frame in the short-side direction W can be saved by about 1.4 mm, which is combined with thin film flip chip The frame saving effect (approximately 1.5 mm) of Cheng is almost the same, and the effect of narrow frame can also be achieved.

請參閱第5圖，第5圖為本發明實施例的一顯示裝置5的示意圖。顯示裝置5包含一基板50、一顯示面板51、一驅動晶片52及一連接模組53。連接模組53包括兩電路板531a與531b，兩電路板531a與531b分別設置於驅動晶片52於長邊方向L上的兩側，且兩電路板531a與531b分別具有複數個電連接於驅動晶片52的電連接部532a與532b。由於電連接部532a與532b是分別從驅動晶片52於長邊方向L上的左右兩側來進行電連接，因此亦可節省邊框於該短邊方向W上的寬度，以達到窄邊框的效果。此外，相較於前述實施例，本案實施例藉由讓連接模組53包括兩電路板531a與531b，連接模組53可提供更寬裕的空間來設置電連接部532a與532b。 Please refer to FIG. 5, which is a schematic diagram of a display device 5 according to an embodiment of the present invention. The display device 5 includes a substrate 50, a display panel 51, a driving chip 52 and a connection module 53. The connection module 53 includes two circuit boards 531a and 531b. The two circuit boards 531a and 531b are respectively disposed on both sides of the driving chip 52 in the longitudinal direction L, and the two circuit boards 531a and 531b respectively have a plurality of electrical connections to the driving chip. 52's electrical connections 532a and 532b. Since the electrical connection portions 532a and 532b are electrically connected from the left and right sides of the driving chip 52 in the long side direction L, the width of the frame in the short side direction W can also be saved to achieve a narrow frame effect. In addition, compared with the foregoing embodiments, the embodiment of the present application allows the connection module 53 to include two circuit boards 531a and 531b, and the connection module 53 can provide a wider space for disposing the electrical connection portions 532a and 532b.

請參閱第6圖，第6圖為本發明實施例的一顯示裝置6的示意圖。顯示裝置6包含一基板60、一顯示面板61、兩個驅動晶片62及一連接模組63，且顯示裝置6結合了上述第3圖及第5圖實施例的結構設計，在此不重複贅述。顯示裝置6透過兩個驅動晶片62的結構設計，可大幅縮短顯示面板61與驅動晶片62之間的距離；另外，連接模組63包括兩電路板631a與631b，可提供更寬裕的空間來設置電連接部632a與632b，且連接模組63的電連接部632a、632b是分別從各驅動晶片62的左、右兩側來進行電連接，因此本實施例可大幅節省邊框於短邊方向W上的寬度，以達到窄邊框的效果。值得注意的是，如前述範例所示，應用本實施例的連接模組63將可使邊框於該短邊方向W上節省約1.4公釐左右的寬度，再配合兩驅動晶片62的設計可使邊框於該短邊方向W上再節省約1.3公釐左右的寬度，將可輕易達到窄邊框的效果，且在不採用薄膜覆晶結合製程封裝的情況下，本發明實施例所達到的邊框節省效果(約2.7公釐)實際上已經超出了膜覆晶結 合製程的邊框節省效果(約1.5公釐)。 Please refer to FIG. 6, which is a schematic diagram of a display device 6 according to an embodiment of the present invention. The display device 6 includes a substrate 60, a display panel 61, two driving chips 62, and a connection module 63, and the display device 6 combines the structural design of the above-mentioned third and fifth embodiments, which will not be repeated here. . The display device 6 can greatly shorten the distance between the display panel 61 and the driver chip 62 through the structural design of the two driver chips 62; in addition, the connection module 63 includes two circuit boards 631a and 631b, which can provide more space for installation The electrical connection portions 632a and 632b, and the electrical connection portions 632a, 632b of the connection module 63 are electrically connected from the left and right sides of each drive chip 62, so this embodiment can greatly save the frame in the short-side direction W The width of the upper part to achieve the effect of a narrow border. It is worth noting that, as shown in the foregoing example, the use of the connection module 63 of this embodiment will save the frame width of about 1.4 mm in the short-side direction W, and the design of the two driving chips 62 can make The width of the frame in the short-side direction W is about 1.3 mm, which can easily achieve the effect of a narrow frame, and the frame saving achieved by the embodiment of the present invention is achieved without the use of a film-on-chip bonding process package. The effect (approximately 2.7 mm) has actually exceeded the film-on-chip junction The frame saving effect of the integrated process (about 1.5 mm).

請參閱第7圖，第7圖為本發明實施例的一顯示裝置7的示意圖。顯示裝置7包含一基板70、一顯示面板71、一驅動晶片72及一連接模組73。連接模組73包括一電路板731，其中電路板731具有一本體部7311一凸伸部7312及複數個電連接部732。其中，本體部7311及顯示面板71於短邊方向W上分別位於驅動晶片72之兩側，故本體部7311與驅動晶片72於長邊方向L上不會重疊；相對地，凸伸部7312由本體部7311沿短邊方向W朝驅動晶片72於長邊方向L上的兩側之任一側凸伸，例如在第7圖中所標示的凸伸部7312係沿短邊方向W朝驅動晶片72於長邊方向L上的左側凸伸。如此將使得凸伸部7312與驅動晶片72於長邊方向L上重疊。複數個電連接部732分別設置於凸伸部7312且電連接於驅動晶片72。由上述可知，由於在本實施例中設置了凸伸至驅動晶片72於長邊方向L上的兩側之凸伸部7312，凸伸部7312與驅動晶片72於長邊方向L上重疊，故設置於凸伸部7312的電連接部732也是從驅動晶片72於長邊方向L上的左右兩側來進行電連接，因此與前述第4~6圖所示實施例類似，可有效節省邊框於該短邊方向W上的寬度，以達到窄邊框的效果。 Please refer to FIG. 7, which is a schematic diagram of a display device 7 according to an embodiment of the present invention. The display device 7 includes a substrate 70, a display panel 71, a driving chip 72 and a connection module 73. The connection module 73 includes a circuit board 731, wherein the circuit board 731 has a body portion 7311, a protruding portion 7312 and a plurality of electrical connection portions 732. Among them, the main body 7311 and the display panel 71 are respectively located on both sides of the driving chip 72 in the short-side direction W, so the main body 7311 and the driving chip 72 will not overlap in the long-side direction L; The body portion 7311 protrudes along the short side direction W toward either side of the drive chip 72 in the long side direction L. For example, the protruding portion 7312 indicated in Figure 7 is directed toward the drive chip along the short side direction W 72 protrudes on the left side in the longitudinal direction L. In this way, the protruding portion 7312 and the driving chip 72 overlap in the longitudinal direction L. The plurality of electrical connection portions 732 are respectively disposed on the protruding portion 7312 and electrically connected to the driving chip 72. It can be seen from the above that in this embodiment, the protruding portions 7312 protruding to both sides of the driving chip 72 in the longitudinal direction L are provided, and the protruding portions 7312 and the driving chip 72 overlap in the longitudinal direction L, so The electrical connection portion 732 provided on the protruding portion 7312 is also electrically connected from the left and right sides of the drive chip 72 in the longitudinal direction L. Therefore, similar to the embodiment shown in Figures 4 to 6 above, the frame can be effectively saved. The width in the short-side direction W to achieve the effect of a narrow frame.

請參閱第8圖，第8圖為本發明實施例的一顯示裝置8的示意圖。顯示裝置8包含一顯示面板81、兩驅動晶片82及一連接模組83，且顯示裝置8綜合了上述第3圖與第7圖實施例的結構設計，在此不重複贅述。顯示裝置8透過兩個驅動晶片82的結構設計，可大幅縮短顯示面板81與驅動晶片82之間的距離；另外，連接模組83的電連接部832是分別從各驅動晶片82的左、右兩側來進行電連接，因此本實施例可大幅節省邊框於短邊方向W上的寬度，以達到窄邊框的效果。再者，與前述第6圖實施例差異之處在於：在本實施例中，訊號可以直接經由位 在兩驅動晶片82之間的電連接部832輸入/輸出各驅動晶片82，故若驅動晶片的數量設計為三個或以上時，位於內側的驅動晶片仍可透過位在兩驅動晶片之間的電連接部輸入/輸出訊號，同時還可避免走線較長而影響訊號傳輸品質的問題。 Please refer to FIG. 8, which is a schematic diagram of a display device 8 according to an embodiment of the present invention. The display device 8 includes a display panel 81, two driving chips 82, and a connection module 83, and the display device 8 integrates the structural design of the above-mentioned third and seventh embodiments, and will not be repeated here. The display device 8 can greatly shorten the distance between the display panel 81 and the drive chip 82 through the structural design of the two drive chips 82; in addition, the electrical connection part 832 of the connection module 83 is from the left and right of each drive chip 82 respectively. The two sides are electrically connected, so this embodiment can greatly save the width of the frame in the short-side direction W, so as to achieve the effect of a narrow frame. Furthermore, the difference from the embodiment in Figure 6 above is that in this embodiment, the signal can directly pass through the bit The electrical connection part 832 between the two drive chips 82 inputs/outputs each drive chip 82. Therefore, if the number of drive chips is designed to be three or more, the drive chip located on the inner side can still pass through the drive chip located between the two drive chips. The electrical connection part inputs/outputs signals, and at the same time avoids the problem of long wiring that affects the signal transmission quality.

請參閱第9圖與第10圖，第9圖為本發明實施例的一顯示裝置9的示意圖。第10圖是沿著第9圖的剖面線A-A的剖示圖。顯示裝置9包含一基板90、一顯示面板91、兩驅動晶片92及一連接模組93。顯示面板91與連接模組93同樣設置於基板90上，與前述實施例不同的是：兩驅動晶片92係設置於連接模組93上。更詳言之，連接模組93包括一電路板931，電路板931具有一本體部9311及一彎折部9312。本體部9311係固定於基板90，彎折部9312則在顯示裝置9組裝時被彎折至基板90的背面。其中本體部9311具有一第一面9311a及相反於第一面9311a的一第二面9311b，本體部9311的第一面9311a重疊於基板90，以經由基板90電連接顯示面板91；兩驅動晶片92設置於本體部9311的第二面9311b並電連接電路板931。具體地，電路板931及兩驅動晶片92可透過一凸塊(bump)壓合製程或其他晶片接合製程形成電連接。如此，相較於習知技術中連接模組13的電連接部無法被彎折至基板10的背面而會在短邊方向W上佔用邊框14的空間(如第2圖所示連接模組13的電連接部下緣與驅動晶片12之間在短邊方向W上的距離d2大約為1.4公釐)，在本實施例中，由於驅動晶片92是直接設置於連接模組93的第二面9311b上，故用來電連接電路板931和驅動晶片92的構造並不會在短邊方向W上佔用邊框的空間。因此，應用本發明實施例將可使邊框於該短邊方向W上節省約1.4公釐左右的寬度，再配合兩驅動晶片92的設計可使邊框於該短邊方向W上再節省約1.3公釐左右的寬度，進而輕易達到窄邊框的效果，且在不採用薄膜覆晶結合製程封裝，而驅動晶片92無法被彎折至基板90背面的情況下，本發明實施例所達到的邊框節省效果(約2.7公釐)實際上已經超出了膜覆晶結合製程的邊 框節省效果(約1.5公釐)。再者，由於在本實施例中，訊號可以直接經第二面9311b輸入/輸出各驅動晶片92，故若驅動晶片的數量設計為三個或以上時，無論內側或外側的驅動晶片均可透過電路板輸入/輸出訊號，同時還故可避免走線較長而影響訊號傳輸品質的問題。 Please refer to FIG. 9 and FIG. 10. FIG. 9 is a schematic diagram of a display device 9 according to an embodiment of the present invention. Fig. 10 is a cross-sectional view taken along the section line A-A of Fig. 9; The display device 9 includes a substrate 90, a display panel 91, two driving chips 92 and a connection module 93. The display panel 91 and the connection module 93 are also disposed on the substrate 90. The difference from the foregoing embodiment is that the two driving chips 92 are disposed on the connection module 93. In more detail, the connection module 93 includes a circuit board 931, and the circuit board 931 has a body portion 9311 and a bending portion 9312. The body portion 9311 is fixed to the substrate 90, and the bending portion 9312 is bent to the back of the substrate 90 when the display device 9 is assembled. The body portion 9311 has a first surface 9311a and a second surface 9311b opposite to the first surface 9311a. The first surface 9311a of the body portion 9311 overlaps the substrate 90 to be electrically connected to the display panel 91 via the substrate 90; two drive chips 92 is disposed on the second surface 9311 b of the main body portion 9311 and is electrically connected to the circuit board 931. Specifically, the circuit board 931 and the two driving chips 92 can be electrically connected through a bump pressing process or other chip bonding processes. In this way, compared with the prior art, the electrical connection portion of the connection module 13 cannot be bent to the back of the substrate 10 and will occupy the space of the frame 14 in the short-side direction W (as shown in the connection module 13 in FIG. 2 The distance d2 between the lower edge of the electrical connection portion and the driver chip 12 in the short-side direction W is approximately 1.4 mm). In this embodiment, since the driver chip 92 is directly disposed on the second surface 9311b of the connection module 93 Therefore, the structure used to electrically connect the circuit board 931 and the driving chip 92 does not occupy the space of the frame in the short-side direction W. Therefore, the application of the embodiment of the present invention can save the width of the frame in the short-side direction W by about 1.4 mm, and the design of the two drive chips 92 can save the frame in the short-side direction W by about 1.3 mm. The width of about 10 centimetres can easily achieve the effect of narrow frame, and the frame saving effect achieved by the embodiment of the present invention is achieved when the driver chip 92 cannot be bent to the back of the substrate 90 without using the film-on-chip bonding process package. (Approximately 2.7 mm) is actually beyond the edge of the film-on-chip bonding process Frame saving effect (approximately 1.5 mm). Furthermore, since in this embodiment, signals can be directly input/output to each driver chip 92 through the second surface 9311b, if the number of driver chips is designed to be three or more, no matter the inner or outer driver chips can pass through The circuit board inputs/outputs signals, and at the same time, it can avoid the problem of long wiring that affects the signal transmission quality.

綜上所述，本發明部分實施例中透過複數個驅動晶片的結構與排列設計，可使傳輸線的延伸長度減少，進而大幅縮短顯示面板與驅動晶片之間的距離。又，本發明部分實施例中連接模組的電連接部是由驅動晶片的兩側來進行電連接，以避免用來電連接驅動晶片與電路板的傳輸線以及電連接部佔用邊框的空間；此外，本發明又一部份實施例透過將驅動晶片設置於連接模組上的方式，也可避免用來電連接驅動晶片與電路板的傳輸線以及電連接部佔用邊框的空間。上述各實施例單獨或相互組合均可有效節省基板邊框的空間，使得本發明各實施例並不需要使用薄膜覆晶結合製程封裝，即可達到窄邊框的效果，例如本發明各實施例均可利用玻璃覆晶結合製程封裝來完成，故可有效降低成本，同時避免產能受到薄膜覆晶結合製程限制。 To sum up, in some embodiments of the present invention, through the structure and arrangement design of a plurality of driving chips, the extension length of the transmission line can be reduced, thereby greatly shortening the distance between the display panel and the driving chip. In addition, in some embodiments of the present invention, the electrical connection part of the connection module is electrically connected by the two sides of the driver chip, so as to avoid the transmission line and the electrical connection part for electrically connecting the driver chip and the circuit board from occupying the space of the frame; in addition, In yet another part of the embodiments of the present invention, by arranging the driving chip on the connection module, the transmission line and the electrical connection portion for electrically connecting the driving chip and the circuit board can also avoid occupying the space of the frame. The above embodiments alone or in combination with each other can effectively save the space of the substrate frame, so that the embodiments of the present invention do not need to use the film-on-chip bonding process package to achieve the effect of narrow frame, for example, all embodiments of the present invention can The packaging is completed by the chip-on-glass bonding process, which can effectively reduce the cost and avoid the limitation of the production capacity by the chip-on-film bonding process.

以上所述的實施例用於說明本發明的概念，本領域技術人員可據此進行修改及變更，並不侷限於此。以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 The above-mentioned embodiments are used to illustrate the concept of the present invention, and those skilled in the art can make modifications and changes accordingly, and are not limited thereto. The foregoing descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.

8:顯示裝置 8: Display device

80:基板 80: substrate

81:顯示面板 81: display panel

82:驅動晶片 82: driver chip

83:連接模組 83: connection module

832:電連接部 832: Electrical connection part

8311:本體部 8311: body part

8312:凸伸部 8312: Convex

L:長邊方向 L: Long side direction

W:短邊方向 W: Short-side direction

Claims (9)

一種顯示裝置，包含：一基板；一顯示面板設置於該基板以供顯示畫面，該顯示面板包含數個區域；複數個驅動晶片，各該驅動晶片電連接於該顯示面板以驅動該顯示面板；以及一連接模組設置於該基板，該連接模組電連接於該複數個驅動晶片及該基板；其中，每一驅動晶片與該顯示面板的其中一區域電連接，以分別驅動該顯示面板的數個區域；該複數個驅動晶片具有一長邊方向及一短邊方向，該連接模組包括一電路板，該電路板具有一本體部、由該本體部沿短邊方向朝其中一驅動晶片於長邊方向上的兩側之其中一側凸伸的一凸伸部，及設置於該凸伸部且電連接於該複數個驅動晶片的複數個電連接部。 A display device includes: a substrate; a display panel arranged on the substrate for displaying images, the display panel including a plurality of areas; a plurality of driving chips, each of the driving chips is electrically connected to the display panel to drive the display panel; And a connection module is disposed on the substrate, and the connection module is electrically connected to the plurality of driving chips and the substrate; wherein, each driving chip is electrically connected to one of the regions of the display panel to respectively drive the display panel Several areas; the plurality of drive chips have a long side direction and a short side direction, the connection module includes a circuit board, the circuit board has a body portion, from the body portion along the short side direction toward one of the drive chips A protruding portion protruding from one of the two sides in the longitudinal direction, and a plurality of electrical connection portions arranged on the protruding portion and electrically connected to the plurality of driving chips. 如請求項1所述的顯示裝置，其中，該複數個驅動晶片於該長邊方向上彼此相間隔，每一個驅動晶片電連接複數條沿該短邊方向朝該顯示面板延伸並電連接至該顯示面板的傳輸線。 The display device according to claim 1, wherein the plurality of driving chips are spaced apart from each other in the long-side direction, and each driving chip is electrically connected to a plurality of driving chips that extend toward the display panel along the short-side direction and are electrically connected to the The transmission line of the display panel. 如請求項2所述的顯示裝置，其中，每一個驅動晶片的該複數條傳輸線是由該驅動晶片相鄰該顯示面板的邊緣朝該顯示面板延伸。 The display device according to claim 2, wherein the plurality of transmission lines of each driving chip extend from the edge of the driving chip adjacent to the display panel toward the display panel. 如請求項1所述的顯示裝置，其中，該本體部與該複數個驅動晶片於該長邊方向上不重疊，該凸伸部與該複數個驅動晶片於該長邊方向上重 疊。 The display device according to claim 1, wherein the main body portion and the plurality of driving chips do not overlap in the longitudinal direction, and the protruding portion and the plurality of driving chips overlap in the longitudinal direction Stacked. 如請求項1所述的顯示裝置，其中，該凸伸部於該長邊方向上位於其中兩個驅動晶片之間。 The display device according to claim 1, wherein the protruding portion is located between two of the driving chips in the longitudinal direction. 如請求項1至5中任一項所述的顯示裝置，其中，該驅動晶片設置於該基板。 The display device according to any one of claims 1 to 5, wherein the driving chip is disposed on the substrate. 如請求項1所述的顯示裝置，其中，該電路板為軟性印刷電路板。 The display device according to claim 1, wherein the circuit board is a flexible printed circuit board. 一種顯示裝置，包含：一基板；一顯示面板設置於該基板以供顯示畫面，該顯示面板包含數個區域；一驅動晶片，該驅動晶片電連接於該顯示面板以驅動該顯示面板；以及一連接模組設置於該基板，該連接模組電連接於該驅動晶片及該基板；其中，該驅動晶片與該顯示面板電連接，以驅動該顯示面板；該驅動晶片具有一長邊方向及一短邊方向，該連接模組包括一電路板，該電路板具有一本體部、由該本體部沿短邊方向朝該驅動晶片於長邊方向上的兩側之其中一側凸伸的一凸伸部，及設置於該凸伸部且電連接於該驅動晶片的複數個電連接部。 A display device includes: a substrate; a display panel disposed on the substrate for displaying images, the display panel including a plurality of areas; a driving chip electrically connected to the display panel to drive the display panel; and a The connection module is disposed on the substrate, and the connection module is electrically connected to the driving chip and the substrate; wherein the driving chip is electrically connected to the display panel to drive the display panel; the driving chip has a longitudinal direction and a In the short-side direction, the connection module includes a circuit board. The circuit board has a main body and a protrusion protruding from the main body to one of the two sides of the driving chip in the long-side direction. A protruding part, and a plurality of electrical connection parts arranged on the protruding part and electrically connected to the driving chip. 如請求項8所述的顯示裝置，其中，該本體部與該複數個驅動晶片於該長邊方向上不重疊，該凸伸部與該驅動晶片於該長邊方向上重疊。 The display device according to claim 8, wherein the body portion and the plurality of driving chips do not overlap in the longitudinal direction, and the protruding portion and the driving chip overlap in the longitudinal direction.
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