CN117452690A

CN117452690A - Display apparatus

Info

Publication number: CN117452690A
Application number: CN202311240346.4A
Authority: CN
Inventors: 杨文霖; 张劲淳; 林金锋
Original assignee: Forcelead Technology Corp
Current assignee: Forcelead Technology Corp
Priority date: 2019-04-02
Filing date: 2020-04-01
Publication date: 2024-01-26
Also published as: TW202038453A; CN111796446B; CN111796446A; TWI749501B

Abstract

The invention discloses a display device, which comprises a substrate; a display panel arranged on the substrate for displaying images, the display panel comprising a plurality of regions; a plurality of driving chips, each of which is electrically connected to the display panel to drive the display panel; the connecting module is arranged on the substrate and is electrically connected with the plurality of driving chips and the substrate; each driving chip is electrically connected with one area of the display panel to drive a plurality of areas of the display panel respectively, the plurality of driving chips are provided with a long side direction and a short side direction, the connecting module comprises a circuit board, the circuit board is arranged on one of two sides of the plurality of driving chips in the long side direction, the circuit board is provided with a plurality of electric connecting parts electrically connected with the driving chips, and one driving chip is electrically connected with a plurality of transmission lines which face the circuit board along the long side direction and are electrically connected with the plurality of electric connecting parts.

Description

Display apparatus

The present application is a divisional application of the invention patent application with the application number 202010250551.9 and the name of "display device" of the year 2020, month 4 and 1.

Technical Field

The present application relates to a display device, and more particularly, to a display device capable of achieving a narrow frame through a flip-chip bonding process, which can reduce cost and greatly improve productivity.

Background

With the evolution of the era, the display panel of the mobile device is increasingly large in size, the requirement of high screen ratio is gradually increased, and the mobile device with narrow frame is coming out. The driving Chip package of the display panel is replaced by the past Chip On Glass (COG) process slowly by the Chip On Film (COF) process to meet the requirement of narrow frame.

Specifically, referring to fig. 1 and 2, fig. 1 is a schematic diagram of a display device 1 packaged by a flip-chip-on-glass process and a display device 2 packaged by a flip-chip-on-film process, and fig. 2 is an external view of the display device 1 packaged by a flip-chip-on-glass process. The display device 1 comprises a substrate 10, a display panel 11, a driving chip 12 and a connection module 13. The display panel 11 is disposed on the substrate 10, for example, a smart phone or a tablet computer, and a region of the substrate 10 not covered by the display panel 11 is a frame 14. In the flip-chip bonding process, the driving chip 12 is disposed in the frame 14 region of the substrate 10 and electrically connected to the display panel 11. The connection module 13 is generally a flexible printed circuit board (Flexible Printed Circuit, FPC) disposed on the substrate 10 to electrically connect the display panel 11 via the substrate 10, and the connection module 13 is further electrically connected to the driving chip 12, and when the display device 1 is assembled, a portion of the connection module 13 is bent to the back surface of the substrate 10 (fig. 2 is a schematic view of the connection module 13 being unfolded, i.e. the connection module 13 is not yet bent), so that the driving chip 12 and the display panel 11 are located on the same side of the substrate 10 (i.e. the front surface of the substrate 10), and therefore the frame 14 at least needs to accommodate the driving chip 12 and a portion of the connection module 13. In contrast, in the flip-chip bonding process, the display device 2 also includes a substrate 20, a display panel 21, a driving chip 22 and a connection module 23. However, the difference between the film flip chip bonding process and the glass flip chip bonding process is: the driving chip 22 can be packaged on the connection module 23, so when part of the connection module 23 is bent to the back of the substrate 20, the driving chip 22 and the display panel 21 are positioned at different sides of the substrate 20, and therefore the frame does not need to accommodate the driving chip 22, so that the area of the frame can be greatly reduced to meet the requirement of a narrow frame. In general, the COF package can save the frame by about 1.5 mm by making the driving chip 22 occupy no space of the frame.

Although the area of the frame of the display device 2 manufactured by the film flip chip bonding process can be reduced, the technology threshold is high, so that the overall manufacturing cost is relatively high, and the productivity is limited; however, although the manufacturing cost of the display device 1 manufactured by the flip-chip bonding process is low, the frame can be reduced to a limited extent, and the effect of narrow frame is not easy to achieve.

Disclosure of Invention

Therefore, the main objective of the present application is to provide a display device, which is different from the prior art that the technology of the flip-chip bonding process package with a higher threshold is required, and can also meet the requirement of a narrow frame.

The application discloses a display device, comprising a substrate; a display panel arranged on the substrate for displaying images, the display panel comprising a plurality of regions; a plurality of driving chips, each of which is electrically connected to the display panel to drive the display panel; the connecting module is arranged on the substrate and is electrically connected with the plurality of driving chips and the substrate; each driving chip is electrically connected with one area of the display panel to drive a plurality of areas of the display panel respectively, the plurality of driving chips are provided with a long side direction and a short side direction, the connecting module comprises a circuit board, the circuit board is arranged on one of two sides of the plurality of driving chips in the long side direction, the circuit board is provided with a plurality of electric connecting parts electrically connected with the driving chips, and one driving chip is electrically connected with a plurality of transmission lines which face the circuit board along the long side direction and are electrically connected with the plurality of electric connecting parts.

The application discloses a display device, comprising a substrate; a display panel arranged on the substrate for displaying images, the display panel comprising a plurality of regions; the driving chip is electrically connected with the display panel to drive the display panel; the connecting module is arranged on the substrate and is electrically connected with the driving chip and the substrate; the driving chip is electrically connected to the display panel to drive the display panel, the driving chip has a long side direction and a short side direction, the connection module comprises a circuit board, the circuit board is arranged on one of two sides of the driving chip in the long side direction, the circuit board is provided with a plurality of electric connection parts electrically connected to the driving chip, and the driving chip is electrically connected with a plurality of transmission lines which face the circuit board along the long side direction and are electrically connected to the electric connection parts.

The application discloses a display device, comprising a substrate; a display panel arranged on the substrate for displaying images, the display panel comprising a plurality of regions; a plurality of driving chips, each of which is electrically connected to the display panel to drive the display panel; the connecting module is arranged on the substrate and is electrically connected with the plurality of driving chips and the substrate; the connecting module comprises a circuit board, wherein the circuit board is provided with a first surface and a second surface opposite to the first surface, and the first surface is overlapped with the substrate; the plurality of driving chips are arranged on the second surface and electrically connected with the circuit board.

Drawings

Fig. 1 is a schematic diagram of a prior art display device.

Fig. 2 is a schematic diagram of a prior art display device.

Fig. 3 is a schematic diagram of a display device according to an embodiment of the present application.

Fig. 4 is a schematic diagram of a display device according to an embodiment of the present application.

Fig. 5 is a schematic diagram of a display device according to an embodiment of the present application.

Fig. 6 is a schematic diagram of a display device according to an embodiment of the present application.

Fig. 7 is a schematic diagram of a display device according to an embodiment of the present application.

Fig. 8 is a schematic diagram of a display device according to an embodiment of the present application.

Fig. 9 is a schematic diagram of a display device according to an embodiment of the present application.

Fig. 10 is a sectional view taken along section line A-A of fig. 9.

Wherein reference numerals are as follows:

3,4,5,6,7,8,9 display device

30,40,50,60,70,80,90 substrate

31,41,51,61,71,81,91 display panel

32,42,52,62,72,82,92 driving chip

321,422 transmission line

33,43,53,63,73,83,93 connection module

331,431,531a,531b, 351 a, 351 b,731,931 circuit board

332,432,532a,532b,632a,632b,732,832 electrical connection

6311,7311,8311,9311 body part

6312,7312,8312 projection

9311a first face

9311b second face

9312. Bending part

L long side direction

W short side direction

Detailed Description

Referring to fig. 3, fig. 3 is a schematic diagram of a display device 3 according to an embodiment of the disclosure. The display device 3 is packaged by a flip-chip-on-glass process, and comprises a substrate 30, a display panel 31, two driving chips 32 and a connection module 33. The display panel 31 is used for displaying a picture, and the display panel 31 may be a thin film transistor liquid crystal display (TFT-LCD), but is not limited thereto. The display panel 31, two driving chips 32 and a connection module 33 are disposed on the substrate 30, the driving chips 32 are electrically connected to the display panel 31 and are used for driving the display panel 31, and each driving chip 32 is an integrated circuit display driving chip, so that it has a long side direction L and a short side direction W perpendicular to each other. The connection module 33 is electrically connected to the driving chip 32 and the substrate 30, and controls the driving chip 32 to drive the display panel 31. The display panel 31 has a plurality of (e.g., n) source lines, and the display panel includes a plurality of (e.g., 2) regions, and each region includes a portion (e.g., n/2) of the plurality of source lines. Each driving chip 32 is electrically connected to one of the regions of the display panel 31 to drive several regions of the display panel 31, specifically, two driving chips 32 drive the left half region and the right half region of the display panel 31 respectively. It should be noted that, in the present embodiment, two driving chips 32 are taken as an example, so the display panel 31 is divided into two areas, but in other embodiments, three or more driving chips may be used, which is not limited to the disclosed aspects of the present embodiment. Furthermore, the two driving chips 32 are spaced apart from each other in the longitudinal direction L, each driving chip 32 is electrically connected to a plurality of transmission lines 321 extending toward the display panel 31 and electrically connected to the display panel 31, and each transmission line 321 extends from an edge of the driving chip 32 adjacent to the display panel 31 toward the display panel 31, so that the distance between the display panel 31 and the driving chip 32 is shortened. The connection module 33 includes a circuit board 331 and a plurality of electrical connection portions 332 disposed on the circuit board 331 and electrically connected to the two driving chips 32. The circuit board 331 is a flexible printed circuit board, and can be bent to the back of the display panel 31, and fig. 3 is only a schematic view of the circuit board 331 that has not yet been bent, however, in practice, the circuit board 331 can be bent to the back of the substrate 30 when the display device 3 is assembled.

As can be seen from comparing fig. 2 of the prior art with fig. 3 of the present embodiment, compared with the prior art that only a single driving chip 12 is used to drive all source lines of the display panel 11, the display device 3 of the present embodiment can reduce the extension length of the plurality of transmission lines 321 through the structure and arrangement design of the two driving chips 32, thereby greatly shortening the distance between the display panel 31 and the driving chips 32. For example, if the display device 1 of the prior art has the same resolution as the display panels 11, 31 applied to the display device 3 of the present embodiment: 720x1520, the size of the display panels is typically 4-6 inches, and the size of the required driving chip is usually 28000um x 900um or similar, in the prior art, the distance between the display panel 11 and the driving chip 12 in the short side direction W is about 2.2 mm; in the present embodiment, by reducing the extension length of the plurality of transmission lines 321, the distance d1 between the display panel 31 and the driving chip 32 in the short-side direction W can be reduced to about 0.9 mm; in other words, for the above example, the width of the frame in the short side direction W can be reduced by about 1.3 mm, which is similar to the frame saving effect (about 1.5 mm) of the film flip chip bonding process, and the effect of the narrow frame can be achieved.

Embodiments of the present application may achieve similar effects with different structural designs for different needs. Referring to fig. 4, fig. 4 is a schematic diagram of a display device 4 according to an embodiment of the present application. The display device 4 includes a substrate 40, a display panel 41, a driving chip 42 and a connection module 43. The connection module 43 includes a circuit board 431, and the circuit board 431 may be disposed on one of two sides of the driving chip 42 in the longitudinal direction L. In fig. 4, the circuit board 431 is disposed on the right side of the driving chip 42 in the longitudinal direction L, and the circuit board 431 has a plurality of electrical connection portions 432 electrically connected to the driving chip 42, and the driving chip 42 is electrically connected to a plurality of transmission lines 422 extending toward the circuit board 431 and electrically connected to the electrical connection portions 432. Each of the transmission lines 422 may extend toward the circuit board 431 in the long side direction L to make electrical connection with the electrical connection portion 432. Thus, the circuit board 431 can still be folded to the back surface of the substrate 40 when the display device 4 is assembled, however, the plurality of transmission lines 422 and the electrical connection parts 432 for electrically connecting the driving chip 42 and the circuit board 431 do not occupy the space of the frame in the short side direction W.

In more detail, as shown in fig. 1 and 2 of the prior art and fig. 4 of the present embodiment, in the prior art, since the driving chip 12 is a transmission line extending along the short side direction W electrically connected to the electrical connection portions of the connection module 13, the electrical connection portions cannot be bent to the back surface of the substrate 10 like other portions of the connection module 13, and therefore occupy the space of the frame 14 in the short side direction W. For example, in a conventional case, a distance d2 between the lower edge of the electrical connection portion of the connection module 13 and the driving chip 12 in the short-side direction W is about 1.4 mm, which is equivalent to a width of about 1.4 mm of the frame 14 occupied in the short-side direction W. In the present embodiment, the plurality of transmission lines 422 and the electrical connection portion 432 for electrically connecting the driving chip 42 and the circuit board 431 do not occupy the space of the frame in the short side direction W; in other words, the width of the frame in the short side direction W can be reduced by about 1.4 mm by applying the embodiment of the present application, which is similar to the frame saving effect (about 1.5 mm) of the film flip chip bonding process, and the effect of a narrow frame can be achieved.

Referring to fig. 5, fig. 5 is a schematic diagram of a display device 5 according to an embodiment of the disclosure. The display device 5 includes a substrate 50, a display panel 51, a driving chip 52 and a connection module 53. The connection module 53 includes two circuit boards 531a and 531b, the two circuit boards 531a and 531b are respectively disposed on two sides of the driving chip 52 in the longitudinal direction L, and the two circuit boards 531a and 531b respectively have a plurality of electrical connection portions 532a and 532b electrically connected to the driving chip 52. Since the electrical connection portions 532a and 532b are electrically connected from the left and right sides of the driving chip 52 in the long side direction L, the width of the frame in the short side direction W can be saved, so as to achieve the effect of a narrow frame. In addition, compared with the previous embodiment, the present embodiment provides more space for disposing the electrical connection portions 532a and 532b by making the connection module 53 include two circuit boards 531a and 531b, and the connection module 53 can be disposed with a larger space.

Referring to fig. 6, fig. 6 is a schematic diagram of a display device 6 according to an embodiment of the disclosure. The display device 6 includes a substrate 60, a display panel 61, two driving chips 62 and a connection module 63, and the display device 6 combines the structural design of the embodiments of fig. 3 and 5, which is not repeated here. The display device 6 can greatly shorten the distance between the display panel 61 and the driving chip 62 through the structural design of the two driving chips 62; in addition, the connection module 63 includes two circuit boards 631a and 631b, which can provide more space for disposing the electrical connection portions 632a and 632b, and the electrical connection portions 632a and 632b of the connection module 63 are respectively electrically connected from the left and right sides of each driving chip 62, so that the width of the frame in the short side direction W can be greatly reduced in the present embodiment, so as to achieve the effect of a narrow frame. It should be noted that, as shown in the foregoing example, the connection module 63 of the present embodiment can save the width of the frame about 1.4 mm in the short side direction W, and the design of the two driving chips 62 can save the width of the frame about 1.3 mm in the short side direction W, so that the effect of the narrow frame can be easily achieved, and the frame saving effect (about 2.7 mm) achieved by the embodiment of the present invention is actually better than the frame saving effect (about 1.5 mm) of the film flip chip bonding process without the use of the film flip chip bonding process.

Referring to fig. 7, fig. 7 is a schematic diagram of a display device 7 according to an embodiment of the disclosure. The display device 7 includes a substrate 70, a display panel 71, a driving chip 72 and a connection module 73. The connection module 73 includes a circuit board 731, wherein the circuit board 731 has a body portion 7311, a protruding portion 7312 and a plurality of electrical connection portions 732. The main body 7311 and the display panel 71 are located on both sides of the driving chip 72 in the short direction W, so that the main body 7311 and the driving chip 72 do not overlap in the long direction L; in contrast, the protruding portion 7312 protrudes from the body portion 7311 in the short side direction W toward either side of the driving chip 72 in the long side direction L, for example, the protruding portion 7312 indicated in fig. 7 protrudes in the short side direction W toward the left side of the driving chip 72 in the long side direction L. This causes the protrusion 7312 and the driving chip 72 to overlap in the longitudinal direction L. The plurality of electrical connection portions 732 are disposed on the protruding portions 7312 and electrically connected to the driving chip 72. As can be seen from the above, since the protruding portion 7312 protruding to both sides of the driving chip 72 in the long side direction L is provided in the present embodiment, the protruding portion 7312 overlaps the driving chip 72 in the long side direction L, and the electrical connection portion 732 provided in the protruding portion 7312 is also electrically connected from both sides of the driving chip 72 in the long side direction L, similar to the embodiments shown in fig. 4 to 6, the width of the frame in the short side direction W can be effectively saved, so as to achieve the effect of a narrow frame.

Referring to fig. 8, fig. 8 is a schematic diagram of a display device 8 according to an embodiment of the disclosure. The display device 8 includes a display panel 81, two driving chips 82 and a connection module 83, and the display device 8 integrates the structural design of the embodiment of fig. 3 and 7, and the detailed description is omitted herein. The display device 8 can greatly shorten the distance between the display panel 81 and the driving chip 82 through the structural design of the two driving chips 82; in addition, the electrical connection portions 832 of the connection module 83 are electrically connected from the left and right sides of each driving chip 82, so that the width of the frame in the short side direction W can be greatly reduced in the present embodiment, so as to achieve the effect of a narrow frame. Furthermore, the difference from the previous embodiment of fig. 6 is that: in the present embodiment, the signals can be directly input/output to/from each driving chip 82 through the electrical connection 832 between the two driving chips 82, so that if the number of driving chips is three or more, the driving chips located inside can still input/output signals through the electrical connection between the two driving chips, and meanwhile, the problem of affecting the signal transmission quality due to longer routing can be avoided.

Referring to fig. 9 and 10, fig. 9 is a schematic diagram of a display device 9 according to an embodiment of the disclosure. Fig. 10 is a sectional view taken along section line A-A of fig. 9. The display device 9 includes a substrate 90, a display panel 91, two driving chips 92 and a connection module 93. The display panel 91 is disposed on the substrate 90 as in the connection module 93, and differs from the foregoing embodiment in that: the two driving chips 92 are disposed on the connection module 93. In more detail, the connection module 93 includes a circuit board 931, and the circuit board 931 has a main body 9311 and a bending portion 9312. The main body 9311 is fixed to the substrate 90, and the bending portion 9312 is bent to the back surface of the substrate 90 when the display device 9 is assembled. The main body 9311 has a first surface 9311a and a second surface 9311b opposite to the first surface 9311a, the first surface 9311a of the main body 9311 is overlapped with the substrate 90 to electrically connect the display panel 91 via the substrate 90; the two driving chips 92 are disposed on the second surface 9311b of the main body 931 and electrically connected to the circuit board 931. Specifically, the circuit board 931 and the two driving chips 92 may be electrically connected through a bump (bump) bonding process or other chip bonding process. Thus, compared with the prior art in which the electrical connection portion of the connection module 13 cannot be bent to the back surface of the substrate 10 and the space of the frame 14 is occupied in the short side direction W (as shown in fig. 2, the distance d2 between the lower edge of the electrical connection portion of the connection module 13 and the driving chip 12 in the short side direction W is about 1.4 mm), in the present embodiment, the structure for electrically connecting the circuit board 931 and the driving chip 92 does not occupy the space of the frame in the short side direction W because the driving chip 92 is directly disposed on the second surface 931 b of the connection module 93. Therefore, the width of the frame about 1.4 mm in the short side direction W can be saved by applying the embodiment of the present application, and the width of the frame about 1.3 mm in the short side direction W can be saved by matching with the design of the two driving chips 92, so that the effect of a narrow frame is easily achieved, and the frame saving effect (about 2.7 mm) achieved by the embodiment of the present application is actually beyond the frame saving effect (about 1.5 mm) of the film flip chip bonding process under the condition that the driving chips 92 cannot be folded to the back of the substrate 90 without adopting the film flip chip bonding process for packaging. In addition, in the present embodiment, signals can be directly input/output to/from each driving chip 92 through the second surface 9311b, so that if the number of driving chips is three or more, signals can be input/output through the circuit board from the driving chips on the inner side or the outer side, and meanwhile, the problem that the signal transmission quality is affected due to longer routing can be avoided.

In summary, in some embodiments of the present application, the structure and arrangement design of the plurality of driving chips can reduce the extension length of the transmission line, so as to greatly shorten the distance between the display panel and the driving chip. In addition, in some embodiments of the present application, the electrical connection portion of the connection module is electrically connected by two sides of the driving chip, so as to avoid the space occupied by the transmission line and the electrical connection portion for electrically connecting the driving chip and the circuit board; in addition, in some embodiments of the present application, the driving chip is disposed on the connection module, so that the transmission line for electrically connecting the driving chip and the circuit board and the electrical connection portion occupy the space of the frame. The embodiments can effectively save the space of the substrate frame independently or mutually, so that the embodiments can achieve the effect of narrow frame without using the film flip chip bonding process for packaging, for example, the embodiments can be completed by using the glass flip chip bonding process for packaging, thereby effectively reducing the cost and simultaneously avoiding the limitation of the productivity by the film flip chip bonding process.

The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display device, comprising:

a substrate;

a display panel arranged on the substrate for displaying images, the display panel comprising a plurality of regions;

a plurality of driving chips, each of which is electrically connected to the display panel to drive the display panel; and

the connecting module is arranged on the substrate and is electrically connected with the plurality of driving chips and the substrate;

each driving chip is electrically connected with one area of the display panel to drive a plurality of areas of the display panel respectively, the plurality of driving chips are provided with a long side direction and a short side direction, the connecting module comprises a circuit board, the circuit board is arranged on one of two sides of the plurality of driving chips in the long side direction, the circuit board is provided with a plurality of electric connecting parts electrically connected with the driving chips, and one driving chip is electrically connected with a plurality of transmission lines which face the circuit board along the long side direction and are electrically connected with the plurality of electric connecting parts.

2. The display device of claim 1, wherein the plurality of driving chips are spaced apart from each other in the long side direction, each driving chip being electrically connected to a plurality of transmission lines extending toward the display panel in the short side direction and electrically connected to the display panel.

3. The display device of claim 2, wherein the plurality of transmission lines each of which is electrically connected to the display panel extend from an edge of the driving chip adjacent to the display panel toward the display panel.

4. The display device of claim 1, wherein the circuit board and the plurality of driver chips overlap in the longitudinal direction.

5. The display device of claim 1, wherein the connection module comprises another circuit board, and the two circuit boards are respectively disposed on two sides of the plurality of driving chips in the longitudinal direction.

6. A display device, comprising:

a substrate;

the driving chip is electrically connected with the display panel to drive the display panel; and

the connecting module is arranged on the substrate and is electrically connected with the driving chip and the substrate; the driving chip is electrically connected to the display panel to drive the display panel, the driving chip has a long side direction and a short side direction, the connection module comprises a circuit board, the circuit board is arranged on one of two sides of the driving chip in the long side direction, the circuit board is provided with a plurality of electric connection parts electrically connected to the driving chip, and the driving chip is electrically connected with a plurality of transmission lines which face the circuit board along the long side direction and are electrically connected to the electric connection parts.

7. The display device of claim 6, wherein the driving chip is electrically connected to a plurality of transmission lines extending toward the display panel along the short side direction and electrically connected to the display panel.

8. The display device of claim 6, wherein the plurality of transmission lines electrically connected to the display panel by the driving chip extend from an edge of the driving chip adjacent to the display panel toward the display panel.

9. The display device of claim 6, wherein the circuit board and the driving chip overlap in the longitudinal direction.

10. The display device of claim 6, wherein the connection module includes another circuit board, and the two circuit boards are respectively disposed on two sides of the driving chip in the longitudinal direction.

11. A display device, comprising:

a substrate;

the connecting module comprises a circuit board, wherein the circuit board is provided with a first surface and a second surface opposite to the first surface, and the first surface is overlapped with the substrate; the plurality of driving chips are arranged on the second surface and electrically connected with the circuit board.

12. The display device of claim 11, wherein the circuit board and the plurality of driver chips are electrically connected by a bump bonding process.

13. The display device of claim 11, wherein the circuit board has a main body and a bending portion, the first surface and the second surface are two surfaces of the main body, and the bending portion is bent to the back surface of the substrate when the display device is assembled.