TWI748975B - 電磁波屏蔽膜及其製造方法 - Google Patents

電磁波屏蔽膜及其製造方法 Download PDF

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Publication number
TWI748975B
TWI748975B TW105143248A TW105143248A TWI748975B TW I748975 B TWI748975 B TW I748975B TW 105143248 A TW105143248 A TW 105143248A TW 105143248 A TW105143248 A TW 105143248A TW I748975 B TWI748975 B TW I748975B
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TW
Taiwan
Prior art keywords
layer
metal layer
electromagnetic wave
wave shielding
shielding film
Prior art date
Application number
TW105143248A
Other languages
English (en)
Chinese (zh)
Other versions
TW201801602A (zh
Inventor
岩井靖
柳善治
都地輝明
西山剛司
藤信男
Original Assignee
日商拓自達電線股份有限公司
日商東麗Ｋｐ薄膜股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商拓自達電線股份有限公司, 日商東麗Ｋｐ薄膜股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW201801602A publication Critical patent/TW201801602A/zh
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Publication of TWI748975B publication Critical patent/TWI748975B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW105143248A 2015-12-25 2016-12-26 電磁波屏蔽膜及其製造方法 TWI748975B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP??2015-253514 2015-12-25
JP2015253514 2015-12-25

Publications (2)

Publication Number Publication Date
TW201801602A TW201801602A (zh) 2018-01-01
TWI748975B true TWI748975B (zh) 2021-12-11

Family

ID=59090573

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105143248A TWI748975B (zh) 2015-12-25 2016-12-26 電磁波屏蔽膜及其製造方法

Country Status (5)

Country Link
JP (1) JP6949724B2 (ko)
KR (1) KR102608700B1 (ko)
CN (1) CN108476607B (ko)
TW (1) TWI748975B (ko)
WO (1) WO2017111158A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110268812A (zh) * 2017-07-10 2019-09-20 拓自达电线株式会社 电磁波屏蔽膜及具备该电磁波屏蔽膜的屏蔽印刷布线板
JP7153489B2 (ja) * 2018-07-09 2022-10-14 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板
TWI699279B (zh) * 2018-10-22 2020-07-21 長興材料工業股份有限公司 電磁波屏蔽膜及其製備方法與用途
CN113631370B (zh) * 2019-03-29 2023-06-09 东丽Kp薄膜股份有限公司 金属化膜及其制造方法
CN111231338A (zh) * 2019-12-16 2020-06-05 安徽墙煌彩铝科技有限公司 一种制冷金属板的复合工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070138441A1 (en) * 2005-12-16 2007-06-21 Narito Goto Electromagnetic wave shielding material, method of manufacturing the same and electromagnetic wave shielding material for plasma display panel
CN102047777A (zh) * 2008-05-30 2011-05-04 大自达电线股份有限公司 电磁波屏蔽材料及印刷电路板
CN102711428A (zh) * 2012-06-21 2012-10-03 广州方邦电子有限公司 一种高屏蔽效能的极薄屏蔽膜及其制作方法
JP2013185163A (ja) * 2012-03-06 2013-09-19 Toray Kp Films Inc 金属化フィルムおよび金属箔
TW201438560A (zh) * 2007-08-03 2014-10-01 Tatsuta Densen Kk 印刷配線板用屏蔽薄膜及印刷配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2004128158A (ja) * 2002-10-01 2004-04-22 Fcm Kk 電磁波シールド材
TWI360386B (en) 2005-02-18 2012-03-11 Toyo Ink Mfg Co Electro-magnetic wave shielding adhesive sheet, pr
JP2006245452A (ja) * 2005-03-07 2006-09-14 Toyo Kohan Co Ltd 電磁波シールド材
US8138429B2 (en) * 2008-12-17 2012-03-20 3M Innovative Properties Company Electromagnetic shielding article
JP2013110335A (ja) * 2011-11-24 2013-06-06 Toray Ind Inc 遊技台用電磁波遮蔽フイルム、及び該遊技台用電磁波遮蔽フイルムを用いた遊技台
JP5983141B2 (ja) * 2012-07-24 2016-08-31 東レ株式会社 積層フィルム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070138441A1 (en) * 2005-12-16 2007-06-21 Narito Goto Electromagnetic wave shielding material, method of manufacturing the same and electromagnetic wave shielding material for plasma display panel
TW201438560A (zh) * 2007-08-03 2014-10-01 Tatsuta Densen Kk 印刷配線板用屏蔽薄膜及印刷配線板
CN102047777A (zh) * 2008-05-30 2011-05-04 大自达电线股份有限公司 电磁波屏蔽材料及印刷电路板
JP2013185163A (ja) * 2012-03-06 2013-09-19 Toray Kp Films Inc 金属化フィルムおよび金属箔
CN102711428A (zh) * 2012-06-21 2012-10-03 广州方邦电子有限公司 一种高屏蔽效能的极薄屏蔽膜及其制作方法

Also Published As

Publication number Publication date
KR102608700B1 (ko) 2023-11-30
CN108476607B (zh) 2020-09-25
JP6949724B2 (ja) 2021-10-13
CN108476607A (zh) 2018-08-31
TW201801602A (zh) 2018-01-01
JPWO2017111158A1 (ja) 2018-10-18
WO2017111158A1 (ja) 2017-06-29
KR20180097520A (ko) 2018-08-31

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