TWI748975B - 電磁波屏蔽膜及其製造方法 - Google Patents
電磁波屏蔽膜及其製造方法 Download PDFInfo
- Publication number
- TWI748975B TWI748975B TW105143248A TW105143248A TWI748975B TW I748975 B TWI748975 B TW I748975B TW 105143248 A TW105143248 A TW 105143248A TW 105143248 A TW105143248 A TW 105143248A TW I748975 B TWI748975 B TW I748975B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- metal layer
- electromagnetic wave
- wave shielding
- shielding film
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP??2015-253514 | 2015-12-25 | ||
JP2015253514 | 2015-12-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201801602A TW201801602A (zh) | 2018-01-01 |
TWI748975B true TWI748975B (zh) | 2021-12-11 |
Family
ID=59090573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105143248A TWI748975B (zh) | 2015-12-25 | 2016-12-26 | 電磁波屏蔽膜及其製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6949724B2 (ko) |
KR (1) | KR102608700B1 (ko) |
CN (1) | CN108476607B (ko) |
TW (1) | TWI748975B (ko) |
WO (1) | WO2017111158A1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110268812A (zh) * | 2017-07-10 | 2019-09-20 | 拓自达电线株式会社 | 电磁波屏蔽膜及具备该电磁波屏蔽膜的屏蔽印刷布线板 |
JP7153489B2 (ja) * | 2018-07-09 | 2022-10-14 | 信越ポリマー株式会社 | 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板 |
TWI699279B (zh) * | 2018-10-22 | 2020-07-21 | 長興材料工業股份有限公司 | 電磁波屏蔽膜及其製備方法與用途 |
CN113631370B (zh) * | 2019-03-29 | 2023-06-09 | 东丽Kp薄膜股份有限公司 | 金属化膜及其制造方法 |
CN111231338A (zh) * | 2019-12-16 | 2020-06-05 | 安徽墙煌彩铝科技有限公司 | 一种制冷金属板的复合工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070138441A1 (en) * | 2005-12-16 | 2007-06-21 | Narito Goto | Electromagnetic wave shielding material, method of manufacturing the same and electromagnetic wave shielding material for plasma display panel |
CN102047777A (zh) * | 2008-05-30 | 2011-05-04 | 大自达电线股份有限公司 | 电磁波屏蔽材料及印刷电路板 |
CN102711428A (zh) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | 一种高屏蔽效能的极薄屏蔽膜及其制作方法 |
JP2013185163A (ja) * | 2012-03-06 | 2013-09-19 | Toray Kp Films Inc | 金属化フィルムおよび金属箔 |
TW201438560A (zh) * | 2007-08-03 | 2014-10-01 | Tatsuta Densen Kk | 印刷配線板用屏蔽薄膜及印刷配線板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4201548B2 (ja) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法 |
JP2004128158A (ja) * | 2002-10-01 | 2004-04-22 | Fcm Kk | 電磁波シールド材 |
TWI360386B (en) | 2005-02-18 | 2012-03-11 | Toyo Ink Mfg Co | Electro-magnetic wave shielding adhesive sheet, pr |
JP2006245452A (ja) * | 2005-03-07 | 2006-09-14 | Toyo Kohan Co Ltd | 電磁波シールド材 |
US8138429B2 (en) * | 2008-12-17 | 2012-03-20 | 3M Innovative Properties Company | Electromagnetic shielding article |
JP2013110335A (ja) * | 2011-11-24 | 2013-06-06 | Toray Ind Inc | 遊技台用電磁波遮蔽フイルム、及び該遊技台用電磁波遮蔽フイルムを用いた遊技台 |
JP5983141B2 (ja) * | 2012-07-24 | 2016-08-31 | 東レ株式会社 | 積層フィルム |
-
2016
- 2016-12-26 TW TW105143248A patent/TWI748975B/zh active
- 2016-12-26 JP JP2017558325A patent/JP6949724B2/ja active Active
- 2016-12-26 KR KR1020187014245A patent/KR102608700B1/ko active IP Right Grant
- 2016-12-26 CN CN201680076117.5A patent/CN108476607B/zh active Active
- 2016-12-26 WO PCT/JP2016/088678 patent/WO2017111158A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070138441A1 (en) * | 2005-12-16 | 2007-06-21 | Narito Goto | Electromagnetic wave shielding material, method of manufacturing the same and electromagnetic wave shielding material for plasma display panel |
TW201438560A (zh) * | 2007-08-03 | 2014-10-01 | Tatsuta Densen Kk | 印刷配線板用屏蔽薄膜及印刷配線板 |
CN102047777A (zh) * | 2008-05-30 | 2011-05-04 | 大自达电线股份有限公司 | 电磁波屏蔽材料及印刷电路板 |
JP2013185163A (ja) * | 2012-03-06 | 2013-09-19 | Toray Kp Films Inc | 金属化フィルムおよび金属箔 |
CN102711428A (zh) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | 一种高屏蔽效能的极薄屏蔽膜及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
KR102608700B1 (ko) | 2023-11-30 |
CN108476607B (zh) | 2020-09-25 |
JP6949724B2 (ja) | 2021-10-13 |
CN108476607A (zh) | 2018-08-31 |
TW201801602A (zh) | 2018-01-01 |
JPWO2017111158A1 (ja) | 2018-10-18 |
WO2017111158A1 (ja) | 2017-06-29 |
KR20180097520A (ko) | 2018-08-31 |
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