JP6949724B2 - 電磁波シールドフィルム及びその製造方法 - Google Patents

電磁波シールドフィルム及びその製造方法 Download PDF

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Publication number
JP6949724B2
JP6949724B2 JP2017558325A JP2017558325A JP6949724B2 JP 6949724 B2 JP6949724 B2 JP 6949724B2 JP 2017558325 A JP2017558325 A JP 2017558325A JP 2017558325 A JP2017558325 A JP 2017558325A JP 6949724 B2 JP6949724 B2 JP 6949724B2
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Japan
Prior art keywords
resin composition
layer
metal layer
electromagnetic wave
metal
Prior art date
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JP2017558325A
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English (en)
Japanese (ja)
Other versions
JPWO2017111158A1 (ja
Inventor
岩井　靖
靖 岩井
善治 柳
善治 柳
輝明 都地
輝明 都地
剛司 西山
剛司 西山
藤　信男
信男 藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Toray KP Films Inc
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Toray KP Films Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd, Toray KP Films Inc filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of JPWO2017111158A1 publication Critical patent/JPWO2017111158A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2017558325A 2015-12-25 2016-12-26 電磁波シールドフィルム及びその製造方法 Active JP6949724B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015253514 2015-12-25
JP2015253514 2015-12-25
PCT/JP2016/088678 WO2017111158A1 (ja) 2015-12-25 2016-12-26 電磁波シールドフィルム及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2017111158A1 JPWO2017111158A1 (ja) 2018-10-18
JP6949724B2 true JP6949724B2 (ja) 2021-10-13

Family

ID=59090573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017558325A Active JP6949724B2 (ja) 2015-12-25 2016-12-26 電磁波シールドフィルム及びその製造方法

Country Status (5)

Country Link
JP (1) JP6949724B2 (ko)
KR (1) KR102608700B1 (ko)
CN (1) CN108476607B (ko)
TW (1) TWI748975B (ko)
WO (1) WO2017111158A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110268812A (zh) * 2017-07-10 2019-09-20 拓自达电线株式会社 电磁波屏蔽膜及具备该电磁波屏蔽膜的屏蔽印刷布线板
JP7153489B2 (ja) * 2018-07-09 2022-10-14 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板
TWI699279B (zh) * 2018-10-22 2020-07-21 長興材料工業股份有限公司 電磁波屏蔽膜及其製備方法與用途
CN113631370B (zh) * 2019-03-29 2023-06-09 东丽Kp薄膜股份有限公司 金属化膜及其制造方法
CN111231338A (zh) * 2019-12-16 2020-06-05 安徽墙煌彩铝科技有限公司 一种制冷金属板的复合工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2004128158A (ja) * 2002-10-01 2004-04-22 Fcm Kk 電磁波シールド材
TWI360386B (en) 2005-02-18 2012-03-11 Toyo Ink Mfg Co Electro-magnetic wave shielding adhesive sheet, pr
JP2006245452A (ja) * 2005-03-07 2006-09-14 Toyo Kohan Co Ltd 電磁波シールド材
JPWO2007069495A1 (ja) * 2005-12-16 2009-05-21 コニカミノルタエムジー株式会社 電磁波遮蔽材料、電磁波遮蔽材料の製造方法及びプラズマディスプレイパネル用電磁波遮蔽材料
JP4974803B2 (ja) * 2007-08-03 2012-07-11 タツタ電線株式会社 プリント配線板用シールドフィルム及びプリント配線板
JP5139156B2 (ja) * 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
US8138429B2 (en) * 2008-12-17 2012-03-20 3M Innovative Properties Company Electromagnetic shielding article
JP2013110335A (ja) * 2011-11-24 2013-06-06 Toray Ind Inc 遊技台用電磁波遮蔽フイルム、及び該遊技台用電磁波遮蔽フイルムを用いた遊技台
JP5938824B2 (ja) * 2012-03-06 2016-06-22 東レＫｐフィルム株式会社 金属化フィルムの製造方法および金属箔の製造方法
CN102711428B (zh) * 2012-06-21 2015-11-18 广州方邦电子有限公司 一种高屏蔽效能的极薄屏蔽膜及其制作方法
JP5983141B2 (ja) * 2012-07-24 2016-08-31 東レ株式会社 積層フィルム

Also Published As

Publication number Publication date
KR102608700B1 (ko) 2023-11-30
CN108476607B (zh) 2020-09-25
TWI748975B (zh) 2021-12-11
CN108476607A (zh) 2018-08-31
TW201801602A (zh) 2018-01-01
JPWO2017111158A1 (ja) 2018-10-18
WO2017111158A1 (ja) 2017-06-29
KR20180097520A (ko) 2018-08-31

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