JP6949724B2 - 電磁波シールドフィルム及びその製造方法 - Google Patents
電磁波シールドフィルム及びその製造方法 Download PDFInfo
- Publication number
- JP6949724B2 JP6949724B2 JP2017558325A JP2017558325A JP6949724B2 JP 6949724 B2 JP6949724 B2 JP 6949724B2 JP 2017558325 A JP2017558325 A JP 2017558325A JP 2017558325 A JP2017558325 A JP 2017558325A JP 6949724 B2 JP6949724 B2 JP 6949724B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- layer
- metal layer
- electromagnetic wave
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015253514 | 2015-12-25 | ||
JP2015253514 | 2015-12-25 | ||
PCT/JP2016/088678 WO2017111158A1 (ja) | 2015-12-25 | 2016-12-26 | 電磁波シールドフィルム及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017111158A1 JPWO2017111158A1 (ja) | 2018-10-18 |
JP6949724B2 true JP6949724B2 (ja) | 2021-10-13 |
Family
ID=59090573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017558325A Active JP6949724B2 (ja) | 2015-12-25 | 2016-12-26 | 電磁波シールドフィルム及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6949724B2 (ko) |
KR (1) | KR102608700B1 (ko) |
CN (1) | CN108476607B (ko) |
TW (1) | TWI748975B (ko) |
WO (1) | WO2017111158A1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110268812A (zh) * | 2017-07-10 | 2019-09-20 | 拓自达电线株式会社 | 电磁波屏蔽膜及具备该电磁波屏蔽膜的屏蔽印刷布线板 |
JP7153489B2 (ja) * | 2018-07-09 | 2022-10-14 | 信越ポリマー株式会社 | 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板 |
TWI699279B (zh) * | 2018-10-22 | 2020-07-21 | 長興材料工業股份有限公司 | 電磁波屏蔽膜及其製備方法與用途 |
CN113631370B (zh) * | 2019-03-29 | 2023-06-09 | 东丽Kp薄膜股份有限公司 | 金属化膜及其制造方法 |
CN111231338A (zh) * | 2019-12-16 | 2020-06-05 | 安徽墙煌彩铝科技有限公司 | 一种制冷金属板的复合工艺 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4201548B2 (ja) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法 |
JP2004128158A (ja) * | 2002-10-01 | 2004-04-22 | Fcm Kk | 電磁波シールド材 |
TWI360386B (en) | 2005-02-18 | 2012-03-11 | Toyo Ink Mfg Co | Electro-magnetic wave shielding adhesive sheet, pr |
JP2006245452A (ja) * | 2005-03-07 | 2006-09-14 | Toyo Kohan Co Ltd | 電磁波シールド材 |
JPWO2007069495A1 (ja) * | 2005-12-16 | 2009-05-21 | コニカミノルタエムジー株式会社 | 電磁波遮蔽材料、電磁波遮蔽材料の製造方法及びプラズマディスプレイパネル用電磁波遮蔽材料 |
JP4974803B2 (ja) * | 2007-08-03 | 2012-07-11 | タツタ電線株式会社 | プリント配線板用シールドフィルム及びプリント配線板 |
JP5139156B2 (ja) * | 2008-05-30 | 2013-02-06 | タツタ電線株式会社 | 電磁波シールド材及びプリント配線板 |
US8138429B2 (en) * | 2008-12-17 | 2012-03-20 | 3M Innovative Properties Company | Electromagnetic shielding article |
JP2013110335A (ja) * | 2011-11-24 | 2013-06-06 | Toray Ind Inc | 遊技台用電磁波遮蔽フイルム、及び該遊技台用電磁波遮蔽フイルムを用いた遊技台 |
JP5938824B2 (ja) * | 2012-03-06 | 2016-06-22 | 東レKpフィルム株式会社 | 金属化フィルムの製造方法および金属箔の製造方法 |
CN102711428B (zh) * | 2012-06-21 | 2015-11-18 | 广州方邦电子有限公司 | 一种高屏蔽效能的极薄屏蔽膜及其制作方法 |
JP5983141B2 (ja) * | 2012-07-24 | 2016-08-31 | 東レ株式会社 | 積層フィルム |
-
2016
- 2016-12-26 TW TW105143248A patent/TWI748975B/zh active
- 2016-12-26 JP JP2017558325A patent/JP6949724B2/ja active Active
- 2016-12-26 KR KR1020187014245A patent/KR102608700B1/ko active IP Right Grant
- 2016-12-26 CN CN201680076117.5A patent/CN108476607B/zh active Active
- 2016-12-26 WO PCT/JP2016/088678 patent/WO2017111158A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR102608700B1 (ko) | 2023-11-30 |
CN108476607B (zh) | 2020-09-25 |
TWI748975B (zh) | 2021-12-11 |
CN108476607A (zh) | 2018-08-31 |
TW201801602A (zh) | 2018-01-01 |
JPWO2017111158A1 (ja) | 2018-10-18 |
WO2017111158A1 (ja) | 2017-06-29 |
KR20180097520A (ko) | 2018-08-31 |
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