TWI743076B - Washing device - Google Patents

Washing device Download PDF

Info

Publication number
TWI743076B
TWI743076B TW106101030A TW106101030A TWI743076B TW I743076 B TWI743076 B TW I743076B TW 106101030 A TW106101030 A TW 106101030A TW 106101030 A TW106101030 A TW 106101030A TW I743076 B TWI743076 B TW I743076B
Authority
TW
Taiwan
Prior art keywords
cleaning
wafer
roller
cleaning roller
washing
Prior art date
Application number
TW106101030A
Other languages
Chinese (zh)
Other versions
TW201735148A (en
Inventor
保羅 亞天迪多
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201735148A publication Critical patent/TW201735148A/en
Application granted granted Critical
Publication of TWI743076B publication Critical patent/TWI743076B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)

Abstract

在晶圓洗淨裝置中，汙垢附著於洗淨輥之情況下，亦可以防止晶圓被洗淨輥染污。 In the wafer cleaning device, when dirt adheres to the cleaning roller, it can also prevent the wafer from being stained by the cleaning roller.

洗淨裝置(1)構成為具備：保持手段(3)，其具有保持晶圓之外周緣的3個以上之保持部(30)，所保持的晶圓(W)之中心位置被置於連結3個以上之保持部(30)的多角形之中；旋轉手段(2)，以所保持的晶圓之中心為軸使晶圓旋轉；洗淨手段(4)，其具有以外側面(40a)接觸所保持的晶圓下面而對晶圓下面進行洗淨的圓筒狀之洗淨輥(40)，及使洗淨輥(40)繞洗淨輥(40)之旋轉軸旋轉的洗淨輥旋轉機構(41)；及供給手段(5)，對洗淨輥(40)與晶圓下面之間的接觸部供給洗淨液；洗淨手段(4)具有貯存部(430)，該貯存部(430)夾持洗淨輥(40)之旋轉軸而貯存在與與晶圓相反側對洗淨輥(40)進行洗淨的洗淨輥洗淨液。 The cleaning device (1) is configured to include: a holding means (3), which has three or more holding parts (30) for holding the outer periphery of the wafer, and the center of the held wafer (W) is placed in the connection Among the polygons of three or more holding parts (30); rotating means (2), which rotates the wafer with the center of the held wafer as the axis; cleaning means (4), which has an outer side surface (40a) A cylindrical cleaning roller (40) that cleans the underside of the wafer by contacting the held wafer bottom surface, and a cleaning roller that rotates the cleaning roller (40) around the rotation axis of the cleaning roller (40) The rotating mechanism (41); and the supply means (5), which supply the cleaning liquid to the contact part between the cleaning roller (40) and the lower surface of the wafer; the cleaning means (4) has a storage part (430), the storage part (430) The washing roller cleaning solution for washing the washing roller (40) is stored on the side opposite to the wafer by sandwiching the rotating shaft of the washing roller (40).

Description

洗淨裝置 Washing device

本發明關於對晶圓進行洗淨的洗淨裝置。 The present invention relates to a cleaning device for cleaning wafers.

半導體製造中使用的對晶圓進行洗淨的洗淨裝置中，例如使晶圓之至少一面接觸旋轉的圓筒狀之洗淨輥之外側面而進行洗淨(例如參照專利文獻1)。 In a cleaning device for cleaning wafers used in semiconductor manufacturing, for example, at least one surface of the wafer is brought into contact with the outer side surface of a rotating cylindrical cleaning roller to perform cleaning (for example, refer to Patent Document 1).

[先行技術文獻] [Advanced Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]特開2009-117765號公報 [Patent Document 1] JP 2009-117765 A

但是，晶圓之洗淨中，洗淨輥之外側面與晶圓接觸，因此存在有附著於晶圓的汙垢會附著於洗淨輥之問題。以附著有汙垢的洗淨輥繼續進行晶圓之洗淨時，反而有可能對待洗淨的晶圓帶來污染。 However, during the cleaning of the wafer, the outer surface of the cleaning roller is in contact with the wafer, so there is a problem that the dirt adhering to the wafer will adhere to the cleaning roller. When the cleaning roller with the dirt attached to the cleaning roller continues to clean the wafer, it may contaminate the wafer to be cleaned instead.

因此，在對晶圓進行洗淨的洗淨裝置中，即使汙垢附著於洗淨輥之情況下，亦可以防止污染且藉由洗 淨輥進行晶圓之洗淨，提高晶圓之洗淨效果成為課題。 Therefore, in a cleaning device that cleans wafers, even if dirt adheres to the cleaning roller, contamination can be prevented and by cleaning The cleaning roller cleans the wafers, and improving the cleaning effect of the wafers becomes a problem.

解決上述課題之本發明的洗淨裝置，係具備：保持手段，具有保持晶圓之外周緣的3個以上之保持部，將所保持的晶圓之中心位置置於連結該3個以上之保持部的多角形之中；晶圓旋轉手段，以該保持手段所保持的晶圓之中心為軸而使晶圓旋轉；洗淨手段，其具有以外側面接觸該保持手段所保持的晶圓之下面而對晶圓之下面進行洗淨的圓筒狀之洗淨輥，及使該洗淨輥繞沿該洗淨輥之長度方向延伸的旋轉軸旋轉的洗淨輥旋轉機構；及洗淨液供給手段，至少對該洗淨輥與晶圓之下面之間的接觸部供給洗淨液；該洗淨手段具有：貯存部，夾持該洗淨輥之該旋轉軸而貯存在與晶圓相反側對該洗淨輥進行洗淨的洗淨輥洗淨液。 The cleaning device of the present invention that solves the above-mentioned problems is provided with: holding means having three or more holding parts for holding the outer periphery of the wafer, and positioning the center of the held wafer to connect the three or more holding parts In the polygonal shape of the part; wafer rotation means, which rotates the wafer with the center of the wafer held by the holding means as the axis; cleaning means, which has an outer side contact with the bottom of the wafer held by the holding means A cylindrical cleaning roller that cleans the underside of the wafer, and a cleaning roller rotating mechanism that rotates the cleaning roller around a rotating shaft extending along the length of the cleaning roller; and cleaning liquid supply Means for supplying at least the cleaning liquid to the contact part between the cleaning roller and the lower surface of the wafer; the cleaning means has: a storage part for holding the rotating shaft of the cleaning roller and storing it on the side opposite to the wafer A cleaning roll cleaning solution for cleaning the cleaning roll.

上述貯存部，在上述洗淨輥之上述旋轉軸方向中由一端朝另一端變低而傾斜，於該貯存部在該一端側形成供給上述洗淨輥洗淨液的洗淨輥洗淨液供給口為較佳。 The storage portion is inclined from one end to the other end in the direction of the rotation axis of the cleaning roller, and a cleaning solution supply of the cleaning roll for supplying the cleaning solution of the cleaning roll is formed on the one end side of the storage portion Mouth is better.

本發明的洗淨裝置中，洗淨手段具有貯存部，該貯存部用於貯存在夾持洗淨輥之旋轉軸且在與晶圓之相反側對洗淨輥進行洗淨的洗淨輥洗淨液，因此即使汙 垢附著於洗淨輥之情況下，亦可以藉由貯存部之洗淨輥洗淨液進行洗淨輥之洗淨，可以減少附著有汙垢的洗淨輥所導致晶圓被污染之可能性，提升晶圓之洗淨效果。 In the cleaning device of the present invention, the cleaning means has a storage portion for storing the cleaning roll washing that is held on the rotating shaft of the cleaning roll and cleans the cleaning roll on the side opposite to the wafer Clean liquid, so even if it is dirty When dirt adheres to the cleaning roller, the cleaning roller can also be cleaned by the cleaning roller cleaning solution in the storage section, which can reduce the possibility of wafer contamination caused by the cleaning roller with dirt. Improve the cleaning effect of wafers.

又，貯存部，係在洗淨輥之旋轉軸方向由一端朝另一端變低而傾斜，於貯存部在一端側形成供給洗淨輥洗淨液的洗淨輥洗淨液供給口，據此，所供給的洗淨輥洗淨液由貯存部之一端朝另一端流動，因此染汙的洗淨輥洗淨液不會滯留於貯存部內，可以持續藉由清潔的洗淨輥洗淨液對洗淨輥進行洗淨。 In addition, the storage part is inclined from one end to the other end in the direction of the rotation axis of the washing roller, and a washing roller cleaning liquid supply port for supplying the cleaning liquid of the cleaning roller is formed on one end side of the storage part. , The supplied cleaning liquid of the cleaning roller flows from one end of the storage part to the other end, so the contaminated cleaning liquid of the cleaning roller will not stay in the storage part, and the cleaning liquid of the cleaning roller can be continuously used to The washing roller performs washing.

1:洗淨裝置 1: Washing device

2:晶圓旋轉手段 2: Wafer rotating means

3:保持手段 3: keep the means

3a、3b:保持單元 3a, 3b: holding unit

30:保持部 30: holding part

300:旋轉軸 300: Rotation axis

301:旋轉輥 301: Rotating roller

301a:一對凸緣部 301a: a pair of flanges

31:基台 31: Abutment

32a、32b:可動板 32a, 32b: movable plate

33a、33b:連結具 33a, 33b: connecting device

34:可動板旋轉機構 34: Movable plate rotating mechanism

340:氣缸管 340: Cylinder tube

341:活塞桿 341: Piston Rod

342a、342b:連結具 342a, 342b: connecting device

4:洗淨手段 4: Means of washing

40:洗淨輥 40: Washing roller

40a:洗淨輥之外側面 40a: Outside the cleaning roller

400o:洗淨輥之旋轉軸 400o: Rotating shaft of washing roller

41:洗淨輥旋轉機構 41: Washing roller rotating mechanism

410:轉動軸 410: Rotating shaft

410a:洗淨液供給路 410a: Detergent supply path

410b:分歧路 410b: divergent road

411:馬達 411: Motor

43:殼體 43: shell

43a:殼體之底板 43a: bottom plate of the shell

43b、43c、43d:殼體之側板 43b, 43c, 43d: side panels of the shell

430:貯存部 430: Storage Department

431:洗淨輥洗淨液供給口 431: Washing roller cleaning liquid supply port

44:支撐台 44: support table

44a:支撐台之底板 44a: The bottom plate of the support platform

44b:支撐台之側板 44b: Side plate of support platform

44d:支撐軸 44d: Support shaft

440‧‧‧彈性構件 440‧‧‧Elastic member

45‧‧‧升降手段 45‧‧‧Lifting means

450‧‧‧氣缸管 450‧‧‧Cylinder tube

451‧‧‧活塞桿 451‧‧‧Piston rod

46‧‧‧移動機構 46‧‧‧Mobile mechanism

5‧‧‧洗淨液供給手段 5‧‧‧Washing liquid supply means

50‧‧‧洗淨液供給源 50‧‧‧Cleaning liquid supply source

50a‧‧‧洗淨液供給路 50a‧‧‧Washing fluid supply path

W‧‧‧晶圓 W‧‧‧wafer

Wa‧‧‧晶圓之上面 Wa‧‧‧On top of the wafer

Wb‧‧‧晶圓之下面 Wb‧‧‧Below the wafer

Wd‧‧‧晶圓之外周緣 Wd‧‧‧Outer edge of wafer

Wo‧‧‧晶圓之中心 Wo‧‧‧The Center of Wafer

L‧‧‧洗淨液 L‧‧‧Cleaning liquid

L1‧‧‧洗淨輥洗淨液 L1‧‧‧Cleaning roll detergent

[圖1]洗淨裝置之一例的平面圖。 [Fig. 1] A plan view of an example of a washing device.

[圖2]構成保持手段的保持單元的側面圖。 [Fig. 2] A side view of a holding unit constituting the holding means.

[圖3]洗淨前之晶圓與洗淨手段的配置的斷面圖。 [Figure 3] A cross-sectional view of the arrangement of wafers and cleaning means before cleaning.

[圖4]藉由洗淨手段洗淨晶圓之狀態的斷面圖。 [Figure 4] A cross-sectional view of the state of the wafer being cleaned by the cleaning means.

[圖5]由洗淨輥之軸向觀察以洗淨手段洗淨晶圓之狀態的斷面圖。 [Figure 5] A cross-sectional view of the state of the wafer being cleaned by the cleaning means viewed from the axial direction of the cleaning roller.

[圖6]藉由在貯存部之一端側形成有洗淨輥洗淨液供給口的洗淨手段對晶圓進行洗淨的狀態的斷面圖。 [FIG. 6] A cross-sectional view of a state in which a wafer is cleaned by a cleaning means in which a cleaning liquid supply port of a cleaning roll is formed on one end side of a storage portion.

[圖7]由洗淨輥之軸向觀察藉由同洗淨手段對晶圓進行洗淨的狀態的斷面圖。 [Fig. 7] A cross-sectional view of the state in which the wafer is cleaned by the same cleaning method as observed from the axial direction of the cleaning roller.

圖1所示晶圓W之洗淨裝置1具備：保持手段3，其具有保持晶圓W之外周緣Wd的3個以上(本實施形態中為4個)之保持部30，所保持的晶圓W之中心Wo之位置被置於連結3個以上之保持部30的多角形(本實施形態中為四角形)之中；晶圓旋轉手段2，以保持手段3所保持的晶圓W之中心Wo為軸使晶圓W旋轉；洗淨手段4，其具有以外側面40a接觸保持手段3所保持的圖3所示晶圓W之下面Wb而對晶圓W之下面Wb進行洗淨的圓筒狀之洗淨輥40，及使洗淨輥40繞沿著洗淨輥40之長度方向延伸的旋轉軸400o而旋轉的洗淨輥旋轉機構41；及洗淨液供給手段5，至少對洗淨輥40與晶圓W之下面Wb之間的接觸部供給洗淨液。洗淨裝置1可以單獨使用，也可以組合於切削裝置或研削裝置等使用。 The cleaning device 1 for the wafer W shown in FIG. 1 includes a holding means 3 having three or more (four in this embodiment) holding portions 30 for holding the outer periphery Wd of the wafer W, and the held crystal The position of the center Wo of the circle W is placed in the polygon (quadrature in this embodiment) connecting three or more holding parts 30; the wafer rotating means 2 holds the center of the wafer W held by the means 3 Wo is a shaft that rotates the wafer W; the cleaning means 4 has a cylinder whose outer side surface 40a contacts the lower surface Wb of the wafer W shown in FIG. 3 held by the holding means 3 and cleans the lower surface Wb of the wafer W The washing roller 40 in the shape of a shape, and the washing roller rotating mechanism 41 that rotates the washing roller 40 around a rotating shaft 400° extending along the length of the washing roller 40; and the washing liquid supply means 5, at least for washing The contact portion between the roller 40 and the lower surface Wb of the wafer W supplies cleaning liquid. The cleaning device 1 may be used alone, or may be used in combination with a cutting device, a grinding device, or the like.

圖1所示保持手段3，例如具備在相互之長邊方向(Y軸向)的垂直方向(X軸向)分離特定之距離面對而配置的保持單元3a及保持單元3b。在保持單元3a與保持單元3b之間配置有洗淨手段4。 The holding means 3 shown in FIG. 1 includes, for example, a holding unit 3a and a holding unit 3b that are arranged to face each other in the vertical direction (X-axis) of the longitudinal direction (Y-axis) separated by a predetermined distance. A washing means 4 is arranged between the holding unit 3a and the holding unit 3b.

圖1及圖2所示保持單元3b之構成係和保持單元3a之構成同樣，因此以下僅說明保持單元3a之構成。如圖1所示，保持單元3a具備大致長方體狀之基台31。在基台31之上面，可動板32a及可動板32b沿保持單元3a之長邊方向(Y軸向)呈分離配置。 The structure of the holding unit 3b shown in FIGS. 1 and 2 is the same as that of the holding unit 3a, so only the structure of the holding unit 3a will be described below. As shown in FIG. 1, the holding unit 3a is equipped with the base 31 of a substantially rectangular parallelepiped shape. On the upper surface of the base 31, the movable plate 32a and the movable plate 32b are separately arranged along the longitudinal direction (Y-axis) of the holding unit 3a.

可動板32a、32b，係透過配置於基台31之上面且作為旋轉軸之機能的連結具33a及連結具33b分別連 接於基台31之上面。可動板32a、32b繞著該連結具33a，33b旋轉而可於基台31之上面上滑動。 The movable plates 32a and 32b are respectively connected through a connecting device 33a and a connecting device 33b which are arranged on the top of the base 31 and function as a rotating shaft. Connected to the top of the base 31. The movable plates 32a, 32b rotate around the connecting devices 33a, 33b to be slidable on the upper surface of the base 31.

在基台31之上面之外側之區域(相對於洗淨手段4更遠離之側之區域)設置使可動板32a、32b旋轉的可動板旋轉機構34。可動板旋轉機構34，例如為氣缸，具備：在內部具備未圖示的活塞之基端側(-Y方向側)具有底部的有底圓筒狀之氣缸管340，及***氣缸管340，且一端安裝於活塞的活塞桿341。活塞桿341之另一端透過連結具342b連接於可動板32b。又，在氣缸管340之基端側透過連結具342a連接著可動板32a。對氣缸管340供給(或排出)空氣使氣缸管340之內部之壓力變化，據此使活塞桿341朝Y軸向移動，伴隨此而使可動板32a、32b繞各個連結具33a、33b旋轉而於基台31之上面上滑動。 A movable plate rotating mechanism 34 that rotates the movable plates 32a and 32b is provided in the area on the outer side of the upper surface of the base 31 (the area on the side farther from the cleaning means 4). The movable plate rotating mechanism 34 is, for example, an air cylinder, and includes a bottomed cylindrical cylinder tube 340 with a bottom on the base end side (-Y direction side) of a piston (not shown) inside, and an inserted cylinder tube 340, and One end is mounted on the piston rod 341 of the piston. The other end of the piston rod 341 is connected to the movable plate 32b through a connecting device 342b. In addition, the movable plate 32a is connected to the base end side of the cylinder tube 340 through a coupling 342a. Supplying (or exhausting) air to the cylinder tube 340 changes the pressure inside the cylinder tube 340, thereby moving the piston rod 341 in the Y-axis direction, and thereby causing the movable plates 32a and 32b to rotate around the respective couplings 33a and 33b. Slide on the upper surface of the base 31.

在可動板32a、32b之上面分別配置各1個保持部30，該保持部30抵接於晶圓W之外周緣Wd而將晶圓W之外周緣Wd予以保持。保持部30例如由軸向為鉛直方向(Z軸向)的旋轉軸300，及安裝於旋轉軸300而繞旋轉軸旋轉的旋轉輥301構成。圖示之例中，旋轉輥301具備沿徑向(與旋轉軸300之軸向及水平方向正交的方向)向外延伸的一對凸緣部301a，晶圓W之外周緣Wd被卡合於一對凸緣部301a之間。 On the upper surfaces of the movable plates 32a and 32b, one holding portion 30 is respectively arranged, and the holding portion 30 abuts against the outer periphery Wd of the wafer W and holds the outer periphery Wd of the wafer W. The holding portion 30 is composed of, for example, a rotating shaft 300 whose axial direction is a vertical direction (Z-axis), and a rotating roller 301 that is attached to the rotating shaft 300 and rotates around the rotating shaft. In the example shown in the figure, the rotating roller 301 has a pair of flange portions 301a extending outward in the radial direction (direction orthogonal to the axial and horizontal directions of the rotating shaft 300), and the outer peripheral edge Wd of the wafer W is engaged Between a pair of flange portions 301a.

使可動板32a、32b旋轉，使複數個旋轉輥301配合晶圓W之直徑2R1(圖1所示晶圓W之半徑R1 之2倍者)沿水平方向移動，據此即可藉由複數個旋轉輥301夾持晶圓W並予以保持。 Rotate the movable plates 32a and 32b so that the plurality of rotating rollers 301 match the diameter 2R1 of the wafer W (the radius R1 of the wafer W shown in FIG. 1 (2 times the value) moves in the horizontal direction, and accordingly, the wafer W can be clamped and held by a plurality of rotating rollers 301.

以保持手段3所保持的晶圓W之中心Wo為軸使晶圓W旋轉的晶圓旋轉手段2，例如為馬達等之旋轉驅動源，圖示之例中，係連接於1個旋轉輥301。藉由複數個旋轉輥301夾持保持晶圓W之後，晶圓旋轉手段2使旋轉輥301旋轉，即可以保持手段3所保持的晶圓W之中心Wo為軸使晶圓W旋轉。又，晶圓旋轉手段2至少連接於1個旋轉輥301即可，亦可以連接於複數個旋轉輥301。 The wafer rotating means 2 that rotates the wafer W with the center Wo of the wafer W held by the holding means 3 as an axis is, for example, a rotation driving source such as a motor. In the example shown in the figure, it is connected to a rotating roller 301 . After the wafer W is clamped and held by the plurality of rotating rollers 301, the wafer rotating means 2 rotates the rotating roller 301, that is, the wafer W can be rotated by the center Wo of the wafer W held by the holding means 3 as an axis. In addition, the wafer rotating means 2 may be connected to at least one rotating roller 301, and may be connected to a plurality of rotating rollers 301.

保持手段3與晶圓旋轉手段2不限定於上述構成，亦可以是以下之構成。例如亦可以構成為保持手段3具備的複數個保持部30之中，1個保持部30之旋轉輥301繞旋轉軸300而旋轉，其他保持部30之旋轉輥301相對於旋轉軸300被固定不旋轉。又，晶圓旋轉手段2，可以是如圖1所示抵接於晶圓W之外周緣Wd而配設的晶圓旋轉用輥。該情況下，藉由晶圓旋轉手段2自身之旋轉，可使保持手段3所保持的晶圓W以晶圓W之中心Wo為軸進行旋轉。又，本實施形態中，保持手段3具備4個保持部30，但保持手段3具備的保持部30至少3個以上即可。 The holding means 3 and the wafer rotating means 2 are not limited to the above-mentioned configuration, and may have the following configurations. For example, it may be configured such that among the plurality of holding parts 30 provided in the holding means 3, the rotating roller 301 of one holding part 30 rotates around the rotating shaft 300, and the rotating rollers 301 of the other holding parts 30 are not fixed with respect to the rotating shaft 300. Spin. In addition, the wafer rotating means 2 may be a wafer rotating roller arranged in contact with the outer periphery Wd of the wafer W as shown in FIG. 1. In this case, by the rotation of the wafer rotating means 2 itself, the wafer W held by the holding means 3 can be rotated about the center Wo of the wafer W as an axis. In addition, in the present embodiment, the holding means 3 includes four holding parts 30, but the holding means 3 may include at least three holding parts 30.

圖1所示洗淨輥40係將具備特定厚度之海綿形成為圓筒形狀者，圖示之例中，其旋轉軸400o之軸向為Y軸方向。使用之海綿例如係將聚氨酯發泡成形而製作 的海綿或PVA海綿等。洗淨輥40之外側面40a成為與晶圓W之下面Wb接觸而進行洗淨的洗淨面。洗淨輥40之長度M1，係晶圓W之半徑R1以上且小於晶圓W之直徑2R1。 The cleaning roller 40 shown in FIG. 1 is formed of a sponge having a specific thickness into a cylindrical shape. In the example shown in the figure, the axial direction of the rotating shaft 400° is the Y-axis direction. The sponge used is made by foaming polyurethane, for example Sponge or PVA sponge, etc. The outer side surface 40a of the cleaning roller 40 becomes a cleaning surface that comes into contact with the lower surface Wb of the wafer W and is cleaned. The length M1 of the cleaning roller 40 is greater than the radius R1 of the wafer W and smaller than the diameter 2R1 of the wafer W.

洗淨輥旋轉機構41具備***洗淨輥40的轉動軸410。如圖3所示，轉動軸410，係在其軸芯線上形成朝軸向(Y軸方向)延伸的洗淨液供給路410a。由洗淨液供給路410a朝轉動軸410之徑向外側延伸出複數個分歧路410b，該分歧路410b在轉動軸410之外側面具有開口。 The washing roller rotating mechanism 41 includes a rotating shaft 410 into which the washing roller 40 is inserted. As shown in FIG. 3, the rotating shaft 410 has a cleaning solution supply path 410a extending in the axial direction (Y-axis direction) formed on the axis of the rotating shaft 410. A plurality of branch passages 410 b extend from the washing liquid supply passage 410 a toward the radially outer side of the rotating shaft 410, and the branch passages 410 b have openings on the outer surface of the rotating shaft 410.

在轉動軸410之-Y方向側之一端透過連結器等連結馬達411。將洗淨輥40裝配於轉動軸410使洗淨輥40之旋轉軸400o與轉動軸410之旋轉軸成為一致之狀態。馬達411使轉動軸410旋轉，據此，裝配於轉動軸410的洗淨輥40亦繞旋轉軸400o旋轉。 The motor 411 is connected to one end of the rotation shaft 410 on the -Y direction side through a connector or the like. The washing roller 40 is assembled on the rotating shaft 410 so that the rotating shaft 400o of the washing roller 40 and the rotating shaft of the rotating shaft 410 are in the same state. The motor 411 rotates the rotating shaft 410, and accordingly, the cleaning roller 40 mounted on the rotating shaft 410 also rotates around the rotating shaft 400°.

在轉動軸410之+Y方向側之另一端連接著洗淨液供給手段5。與構成洗淨液供給手段5的洗淨液供給源50連通的洗淨液供給路50a，係透過旋轉接頭等可裝拆地連結於轉動軸410之另一端。 The cleaning liquid supply means 5 is connected to the other end of the rotation shaft 410 on the +Y direction side. The washing liquid supply path 50a communicating with the washing liquid supply source 50 constituting the washing liquid supply means 5 is detachably connected to the other end of the rotating shaft 410 through a rotary joint or the like.

如圖3所示，裝配有洗淨輥40的轉動軸410，係以洗淨輥40之外側面40a由殼體43之上部露出的方式，可旋轉地配設於洗淨手段4之殼體43內。殼體43，例如由大致長方形狀之底板43a，及在殼體43之長邊方向(Y軸方向)對置的側板43b、43c構成。在側板 43b、43c分別形成貫穿厚度方向(Y軸方向)的具備軸承之未圖示的貫穿孔，轉動軸410通過該貫穿孔插通於殼體43，轉動軸410之兩端分別藉由側板43b、43c被支撐。 As shown in FIG. 3, the rotating shaft 410 equipped with the washing roller 40 is rotatably arranged in the housing of the washing means 4 in such a way that the outer side 40a of the washing roller 40 is exposed from the upper part of the housing 43. Within 43. The housing 43 is composed of, for example, a substantially rectangular bottom plate 43a and side plates 43b and 43c opposed to each other in the longitudinal direction (Y-axis direction) of the housing 43. On the side panel 43b and 43c respectively form through holes (not shown) with bearings in the thickness direction (Y-axis direction). The rotating shaft 410 is inserted into the housing 43 through the through holes. Both ends of the rotating shaft 410 are respectively passed through the side plates 43b, 43c is supported.

殼體43配設於僅將殼體43之+Y方向側之一端支撐為可上下移動的支撐台44上。支撐台44，例如由大致長方形狀之底板44a，及由底板44a之2個長邊之-Y方向側之一部分分別立設且對置的2片側板44b(圖3中僅圖示一片)形成。 The housing 43 is disposed on a support platform 44 that supports only one end of the housing 43 on the +Y direction side so as to be movable up and down. The support base 44 is formed by, for example, a substantially rectangular bottom plate 44a, and two side plates 44b (only one is shown in FIG. 3) that are respectively erected and opposed to a part of the -Y direction side of the two long sides of the bottom plate 44a .

在殼體43之一端側配置於支撐台44之2片側板44b之間之狀態下，支撐軸44d在X軸方向被挿通於2片側板44b與殼體43之側板43b，據此，殼體43成為在支撐台44上被支撐軸44d支撐之狀態。 In a state where one end side of the housing 43 is arranged between the two side plates 44b of the support base 44, the support shaft 44d is inserted through the two side plates 44b and the side plate 43b of the housing 43 in the X-axis direction. Accordingly, the housing 43 is in a state of being supported by the support shaft 44d on the support base 44.

在洗淨輥40之一端40c側，在殼體43之底板43a與支撐台44之底板44a之間配設有彈性構件440。彈性構件440，例如為彈簧，將洗淨輥40之一端40c側偏置於上方向。殼體43伴隨彈性構件440之伸縮而以支撐軸44d為支點可以旋動。如圖3所示，在洗淨輥40不與晶圓W接觸之狀態中，彈性構件440之長度成為自然長度。又，彈性構件440不限定於彈簧，可以是橡膠柱等。 On the side of one end 40c of the cleaning roller 40, an elastic member 440 is arranged between the bottom plate 43a of the housing 43 and the bottom plate 44a of the support table 44. The elastic member 440 is, for example, a spring, and biases one end 40c side of the cleaning roller 40 in the upward direction. The housing 43 can rotate with the support shaft 44d as a fulcrum along with the expansion and contraction of the elastic member 440. As shown in FIG. 3, in the state where the cleaning roller 40 is not in contact with the wafer W, the length of the elastic member 440 becomes a natural length. In addition, the elastic member 440 is not limited to a spring, and may be a rubber column or the like.

支撐台44配設於圖3所示升降手段45上。升降手段45，例如為氣缸，係具備：在內部具備未圖示的活塞之基端側(-Z方向側)具有底部的有底圓筒狀之氣缸管450，及***氣缸管450，下端安裝於活塞的活塞桿451。活塞桿451之上端被固定於支撐台44之底板44a之下面。又，氣缸管450之基端側係與使洗淨手段4在X軸Y軸平面上移動的移動機構46連接。 The support stand 44 is arranged on the lifting means 45 shown in FIG. 3. The lifting means 45 is, for example, an air cylinder, which is provided with a bottomed cylindrical cylinder tube 450 with a bottom on the base end side (-Z direction side) of a piston (not shown) inside, and a cylinder tube 450 inserted therein, and mounted at the lower end The piston rod 451 of the piston. The upper end of the piston rod 451 is fixed under the bottom plate 44a of the support platform 44. In addition, the base end side of the cylinder tube 450 is connected to a moving mechanism 46 that moves the cleaning means 4 on the X-axis and Y-axis plane.

對氣缸管450供給(或排出)空氣使氣缸管450內部之內壓變化，據此，活塞桿451沿Z軸方向上下移動，洗淨手段4對晶圓W升降。又，升降手段45不限定於氣缸，例如可以是藉由馬達使滾珠螺桿旋動而使洗淨手段4升降的滾珠螺桿機構。 Supplying (or exhausting) air to the cylinder tube 450 changes the internal pressure inside the cylinder tube 450, and accordingly, the piston rod 451 moves up and down in the Z-axis direction, and the cleaning means 4 lifts and lowers the wafer W. In addition, the elevating means 45 is not limited to an air cylinder, and may be, for example, a ball screw mechanism that raises and lowers the washing means 4 by rotating a ball screw by a motor.

洗淨手段4，係在夾持洗淨輥40之旋轉軸400o而與晶圓W相反之側具有用來貯存對洗淨輥40進行洗淨的洗淨輥洗淨液之貯存部430。本實施形態中，貯存部430成為殼體43之底板43a之上面與洗淨輥40之外側面40a之下側部分之間的空間。 The cleaning means 4 is provided with a storage part 430 for storing the cleaning liquid for cleaning the cleaning roller 40 on the side opposite to the wafer W while sandwiching the rotating shaft 400 o of the cleaning roller 40. In the present embodiment, the storage portion 430 becomes a space between the upper surface of the bottom plate 43a of the housing 43 and the lower portion of the outer side surface 40a of the washing roller 40.

洗淨液供給源50所供給的洗淨液，係流入轉動軸410之洗淨液供給路410a，進一步分流至複數個分歧路410b，由轉動軸410之側面到達洗淨輥40。到達洗淨輥40的洗淨液，係由洗淨輥40之內部遍及廣範圍滲透至外側面40a上。由外側面40a滲出的洗淨液，在殼體43之底板43a之上面與洗淨輥40之下面側之間，基於表面張力而存留於貯存部430內。為使洗淨液藉由表面張力而貯存於貯存部430，例如殼體43之底板43a之上面與洗淨輥40之下面側之間的距離，例如較好是設為約3mm~5mm。又，洗淨液供給源50供給的洗淨液之流量，例如較好是設為1.5L/分。 The washing liquid supplied by the washing liquid supply source 50 flows into the washing liquid supply path 410 a of the rotating shaft 410, and is further divided to a plurality of branch paths 410 b, and reaches the washing roller 40 from the side of the rotating shaft 410. The cleaning liquid reaching the cleaning roller 40 penetrates from the inside of the cleaning roller 40 to the outer surface 40a over a wide area. The washing liquid seeping out from the outer surface 40a is stored in the reservoir 430 based on the surface tension between the upper surface of the bottom plate 43a of the housing 43 and the lower surface of the washing roller 40. In order for the cleaning liquid to be stored in the reservoir 430 by surface tension, for example, the distance between the upper surface of the bottom plate 43a of the housing 43 and the lower surface of the cleaning roller 40 is preferably about 3 mm to 5 mm, for example. In addition, the flow rate of the cleaning liquid supplied from the cleaning liquid supply source 50 is preferably set to 1.5 L/min, for example.

以下，參照圖1及圖3~5說明藉由洗淨裝置1對晶圓W進行洗淨時之洗淨裝置1的動作。 Hereinafter, the operation of the cleaning device 1 when the wafer W is cleaned by the cleaning device 1 will be described with reference to FIGS. 1 and 3 to 5.

藉由圖1、3所示洗淨裝置1洗淨的晶圓W，例如係圓板狀之半導體晶圓，在晶圓W之上面Wa形成未圖示的多數之元件。例如圖3所示晶圓W，中央部朝+Z方向彎曲而使晶圓W之下面Wb朝中央區域彎曲成為中凹，但不限定於此，晶圓W之上面Wa及下面Wb之兩方無凹陷而均為平坦面之晶圓亦可。 The wafer W cleaned by the cleaning device 1 shown in Figs. For example, in the wafer W shown in FIG. 3, the center portion of the wafer W is bent in the +Z direction, and the lower surface Wb of the wafer W is bent toward the center area to become a concave. Wafers that have no dents but are flat surfaces are also acceptable.

首先，如圖1所示，晶圓W被搬送至洗淨裝置1，進行晶圓W與保持手段3的定位，成為晶圓W之下面Wb側面對洗淨手段4之狀態。使晶圓W之中心Wo之位置置於連結4個保持部30的四角形之中之後，移動各保持部30而使各旋轉輥301成為抵接晶圓W之外周緣Wd之狀態，於此狀態下藉由4個保持部30保持晶圓W之外周緣Wd。又，所保持的晶圓W之中心Wo之位置被置於連結4個保持部30的四角形之中。 First, as shown in FIG. 1, the wafer W is transported to the cleaning device 1, and the wafer W and the holding means 3 are positioned so that the side of the lower surface Wb of the wafer W faces the cleaning means 4. After placing the center Wo of the wafer W in the quadrangular shape connecting the four holding parts 30, move the holding parts 30 so that the rotating rollers 301 abut the outer periphery Wd of the wafer W. In this state The outer periphery Wd of the wafer W is held by the four holding parts 30 below. In addition, the position of the center Wo of the held wafer W is placed in a quadrangular shape connecting the four holding parts 30.

又，進行保持手段3所保持的晶圓W之下面Wb與洗淨手段4的定位。例如圖4所示，該定位如下進行：亦即使洗淨輥40之一端40c側(被彈性構件440偏置於上方向之側)位於比起晶圓W之中心Wo稍微靠+Y方向側之位置，並且，使洗淨輥40之另一端40b側接觸晶圓W之外周緣Wd。又，亦可以如下進行：使被彈性構件440偏置於上方向的一端40c側接觸晶圓W之外周緣Wd，使被殼體43之側板43b支撐的另一端40b側位於比 起晶圓W之中心Wo稍微靠+Y方向側之位置，據此來進行洗淨輥40與晶圓W之間之定位。 In addition, the positioning of the lower surface Wb of the wafer W held by the holding means 3 and the cleaning means 4 is performed. For example, as shown in FIG. 4, the positioning is performed as follows: even if the side of one end 40c of the cleaning roller 40 (the side biased in the upward direction by the elastic member 440) is located slightly closer to the +Y direction side than the center Wo of the wafer W Position and make the other end 40b side of the cleaning roller 40 contact the outer peripheral edge Wd of the wafer W. Alternatively, it may be performed as follows: the one end 40c side biased upward by the elastic member 440 is brought into contact with the outer periphery Wd of the wafer W, and the other end 40b supported by the side plate 43b of the case 43 is positioned more than The center Wo of the wafer W is slightly closer to the +Y direction side, and the positioning between the cleaning roller 40 and the wafer W is performed accordingly.

接著，空氣被供給至升降手段45之氣缸管450使活塞桿451上升，伴隨此而使洗淨輥40上升，其外側面40a接觸晶圓W之下面Wb。 Then, air is supplied to the cylinder tube 450 of the elevating means 45 to raise the piston rod 451. As a result, the cleaning roller 40 is raised, and its outer surface 40a contacts the lower surface Wb of the wafer W.

如圖4所示，洗淨輥40首先由一端40c側接觸晶圓W之下面Wb。接著，活塞桿451進一步上升，彈性構件440收縮，據此，洗淨輥40傾斜成為與晶圓W之下面Wb之形狀一致。進一步，洗淨輥40被押接於晶圓W，洗淨輥40變形成為與晶圓W之下面Wb之形狀一致，使洗淨輥40與晶圓W之下面Wb的接觸面積成為最大化。 As shown in FIG. 4, the cleaning roller 40 first contacts the lower surface Wb of the wafer W from the side of one end 40c. Then, the piston rod 451 further rises, and the elastic member 440 contracts. According to this, the cleaning roller 40 is inclined to conform to the shape of the lower surface Wb of the wafer W. Further, the cleaning roller 40 is pressed against the wafer W, and the cleaning roller 40 is deformed to conform to the shape of the lower surface Wb of the wafer W, so that the contact area between the cleaning roller 40 and the lower surface Wb of the wafer W is maximized.

於該狀態下，藉由馬達411使轉動軸410繞旋轉軸400o進行旋轉，使固定於轉動軸410的洗淨輥40對晶圓W之下面Wb進行洗淨。此時，由洗淨液供給手段5將洗淨液L供給至洗淨輥40與晶圓W之下面Wb之間的接觸部。亦即，洗淨液L由洗淨液供給源50流入轉動軸410之洗淨液供給路410a，該洗淨液L進一步分流成為分歧路410b，經由洗淨輥40之內部而到達洗淨輥40與晶圓W之下面Wb之間的接觸部。 In this state, the motor 411 rotates the rotating shaft 410 around the rotating shaft 400 o, and the cleaning roller 40 fixed to the rotating shaft 410 cleans the lower surface Wb of the wafer W. At this time, the cleaning liquid L is supplied to the contact portion between the cleaning roller 40 and the lower surface Wb of the wafer W by the cleaning liquid supply means 5. That is, the washing liquid L flows from the washing liquid supply source 50 into the washing liquid supply path 410a of the rotating shaft 410, and the washing liquid L is further divided into the branch path 410b, and reaches the washing roller through the inside of the washing roller 40. The contact portion between 40 and the lower surface Wb of the wafer W.

又，圖1所示晶圓旋轉手段2使晶圓W以晶圓W之中心Wo為軸進行旋轉，據此，洗淨輥40進行晶圓W之下面Wb之全面之洗淨。 In addition, the wafer rotating means 2 shown in FIG. 1 rotates the wafer W about the center Wo of the wafer W as an axis, and accordingly, the cleaning roller 40 performs the full cleaning of the lower surface Wb of the wafer W.

流入分歧路410b的洗淨液L亦到達貯存部 430，基於表面張力而被貯存在殼體43之底板43a之上面與洗淨輥40之外側面40a之下側部分之間的貯存部430內。到達且被貯存在貯存部430的洗淨輥洗淨液L1，係作為在夾持洗淨輥40之旋轉軸400o且與晶圓W相反之側(-Z方向側)對洗淨輥40進行洗淨的洗淨輥洗淨液L1而發揮作用。 The cleaning liquid L flowing into the branch path 410b also reaches the reservoir 430 is stored in the storage portion 430 between the upper surface of the bottom plate 43a of the casing 43 and the lower part of the outer side surface 40a of the cleaning roller 40 based on the surface tension. The cleaning liquid L1 of the cleaning roller, which has reached and is stored in the storage part 430, is used to perform the cleaning on the cleaning roller 40 on the side opposite to the wafer W (-Z direction side) while sandwiching the rotating shaft of the cleaning roller 40. The washing roller washing liquid L1 for washing functions.

伴隨著洗淨輥40對晶圓W之下面Wb進行洗淨，附著在晶圓W的汙垢會附著於洗淨輥40之外側面40a。伴隨著洗淨輥40之旋轉，附著於該洗淨輥40的汙垢在貯存部430內被貯存於貯存部430的洗淨輥洗淨液L1清洗，而由外側面40a抖落。又，如圖5所示，在貯存部430內，洗淨輥40之汙垢被清洗抖落之後由洗淨輥40之外側面40a之正下方朝+X方向或-X方向流動的洗淨輥洗淨液L1，不會滯留於貯存部430，而由殼體43之底板43a之短邊方向(X軸方向)兩側向下流出殼體43之外部。因此，藉由從洗淨液供給源50繼續供給洗淨液L，即可在貯存部430內保持貯存有一定量之清潔的洗淨輥洗淨液L1之狀態。 As the cleaning roller 40 cleans the lower surface Wb of the wafer W, the dirt adhering to the wafer W adheres to the outer surface 40a of the cleaning roller 40. Along with the rotation of the washing roller 40, the dirt adhering to the washing roller 40 is washed in the storage portion 430 by the washing roller cleaning liquid L1 stored in the storage portion 430, and shaken off from the outer surface 40a. In addition, as shown in FIG. 5, in the storage portion 430, after the dirt of the cleaning roller 40 is washed and shaken off, the cleaning roller flows directly under the outer surface 40a of the cleaning roller 40 in the +X direction or -X direction. The washing liquid L1 does not stay in the reservoir 430, but flows downwardly from both sides of the bottom plate 43a of the casing 43 in the short-side direction (X-axis direction) to the outside of the casing 43. Therefore, by continuing to supply the cleaning liquid L from the cleaning liquid supply source 50, a certain amount of clean cleaning roller cleaning liquid L1 can be kept in the storage portion 430.

又，洗淨中，係如圖4所示，藉由彈性構件440之收縮使殼體43傾斜成為與晶圓W之下面Wb之形狀一致，因此在洗淨輥40之旋轉軸400o方向中，貯存部430亦由洗淨輥40之一端40c朝另一端40b變低而傾斜。因此，貯存於貯存部430內的洗淨輥洗淨液L1，清洗抖落洗淨輥40之汙垢之同時由洗淨輥40之一端40c朝另一端40b流動，在洗淨輥40之另一端40b側，由殼體43之底板43a之短邊方向(X軸方向)兩側向下流出殼體43之外部。因此，藉由從洗淨液供給源50繼續供給洗淨液L，即可在貯存部430內以更高水準保持貯存有一定量之清潔的洗淨輥洗淨液L1之狀態。 In addition, during cleaning, as shown in FIG. 4, the housing 43 is inclined to conform to the shape of the lower surface Wb of the wafer W due to the contraction of the elastic member 440. Therefore, in the 400o direction of the rotation axis of the cleaning roller 40, The storage part 430 is also inclined from one end 40c of the cleaning roller 40 to the other end 40b becoming lower. Therefore, the cleaning liquid L1 of the cleaning roller stored in the reservoir 430 washes off the dirt of the cleaning roller 40 and flows from one end 40c of the cleaning roller 40 to the other end 40b at the other end of the cleaning roller 40. On the 40b side, the bottom plate 43a of the housing 43 flows out of the housing 43 from both sides of the short side direction (X-axis direction) downwards. Therefore, by continuing to supply the cleaning liquid L from the cleaning liquid supply source 50, the state of storing a certain amount of clean cleaning roller cleaning liquid L1 in the storage portion 430 can be maintained at a higher level.

如上述說明，本發明的洗淨裝置1中，洗淨手段4具有貯存部430，該貯存部430用於貯存在夾持洗淨輥40之旋轉軸400o且在晶圓W之相反側對洗淨輥40進行洗淨的洗淨輥洗淨液，因此即使因為晶圓W之洗淨造成汙垢附著於洗淨輥40時，亦可以藉由貯存於貯存部430的洗淨輥洗淨液L1對洗淨輥40進行洗淨，可以減低因為附著有汙垢的洗淨輥40所導致晶圓被污染之可能性，可以提升晶圓洗淨效果。 As described above, in the cleaning device 1 of the present invention, the cleaning means 4 has a storage part 430 for storing on the rotating shaft 400o of the cleaning roller 40 and washing on the opposite side of the wafer W The cleaning roller cleaning liquid for cleaning the cleaning roller 40, so even if dirt is attached to the cleaning roller 40 due to the cleaning of the wafer W, the cleaning roller cleaning liquid L1 stored in the storage part 430 can be used. Cleaning the cleaning roller 40 can reduce the possibility of wafer contamination caused by the cleaning roller 40 attached to the dirt, and can improve the wafer cleaning effect.

又，貯存部430，在洗淨輥40之旋轉軸400o方向(X軸方向)中係由洗淨輥40之一端40c朝另一端40b變低而傾斜，因此所供給的洗淨輥洗淨液L1在貯存部430內由洗淨輥40之一端40c朝另一端40b流動，因此染汙的洗淨輥洗淨液L1不會滯留貯存部430內，可以持續藉由清潔的洗淨輥洗淨液L1對洗淨輥40進行洗淨。 In addition, the reservoir 430 is inclined from one end 40c of the cleaning roller 40 toward the other end 40b in the 400o direction (X-axis direction) of the rotation axis of the cleaning roller 40, so the cleaning roller cleaning liquid is supplied L1 flows from one end 40c of the cleaning roller 40 to the other end 40b in the reservoir 430. Therefore, the contaminated cleaning roller cleaning liquid L1 does not stay in the reservoir 430 and can be continuously cleaned by a clean cleaning roller. The liquid L1 cleans the cleaning roller 40.

本發明的洗淨裝置1不限定於上述實施形態，又，關於添付圖面所圖示的洗淨裝置1之各構成之大小或形狀等，亦不限定於此，在可以發揮本發明之效果之範圍內可以進行適宜變更。 The cleaning device 1 of the present invention is not limited to the above-mentioned embodiment, and the size or shape of each configuration of the cleaning device 1 shown in the attached drawing is not limited to this, and the effects of the present invention can be exerted. Appropriate changes can be made within the range.

例如圖6所示，在洗淨手段4之殼體43之側 板43c之下部形成貫穿厚度方向(Y軸方向)的洗淨輥洗淨液供給口431，透過該洗淨輥洗淨液供給口431對貯存部430供給洗淨輥洗淨液L1之構成亦可。該情況下，洗淨輥洗淨液供給口431係形成於洗淨輥40之一端40c側。 For example, as shown in Figure 6, on the side of the housing 43 of the cleaning means 4 The lower portion of the plate 43c is formed with a cleaning roll cleaning liquid supply port 431 that penetrates through the thickness direction (Y-axis direction), and the cleaning roll cleaning liquid L1 is supplied to the reservoir 430 through the cleaning roll cleaning liquid supply port 431. Can. In this case, the cleaning liquid supply port 431 of the cleaning roller is formed on the side of one end 40 c of the cleaning roller 40.

在殼體43之側板43c設置洗淨輥洗淨液供給口431之情況下，與洗淨液供給源50連通的洗淨液供給路50a，例如分歧為二股，連通於轉動軸410而且亦連通於洗淨輥洗淨液供給口431。 In the case where the side plate 43c of the housing 43 is provided with the cleaning liquid supply port 431 of the cleaning roller, the cleaning liquid supply path 50a communicating with the cleaning liquid supply source 50 is, for example, branched into two, communicating with the rotating shaft 410 and also communicating In the washing roller washing liquid supply port 431.

又，如圖7所示，亦可以構成為：殼體43具備2個由底板43a之長邊分別立設的側板43d，僅在天井部分具有開口。 Furthermore, as shown in Fig. 7, the housing 43 may include two side plates 43d standing upright from the long sides of the bottom plate 43a, and have an opening only in the ceiling portion.

以下說明藉由具備對貯存部430供給洗淨輥洗淨液L1的洗淨輥洗淨液供給口431之洗淨裝置4來洗淨晶圓W之情況。如圖6所示，將洗淨輥40押接於晶圓W，使洗淨輥40與晶圓W之下面Wb的接觸面積最大化之後，使晶圓W以晶圓W之中心Wo為軸進行旋轉，藉由洗淨輥40對晶圓W之下面Wb之全面進行洗淨。 Hereinafter, a case where the wafer W is cleaned by the cleaning device 4 provided with the cleaning roll cleaning liquid supply port 431 for supplying the cleaning roll cleaning liquid L1 to the storage section 430 will be described. As shown in FIG. 6, after the cleaning roller 40 is pressed against the wafer W to maximize the contact area between the cleaning roller 40 and the lower surface Wb of the wafer W, the wafer W is made to take the center Wo of the wafer W as the axis By rotating, the entire surface of the lower surface Wb of the wafer W is cleaned by the cleaning roller 40.

使洗淨液L由洗淨液供給源50流入轉動軸410之洗淨液供給路410a後，該洗淨液L進一步分流至分歧路410b，由洗淨輥40之內部到達洗淨輥40與晶圓W之下面Wb之間的接觸部。又，由分歧路410b流入貯存部430的洗淨液L，係作為對洗淨輥40進行洗淨的洗淨輥洗淨液L1而發揮作用。又，由洗淨液供給源50經由洗淨輥洗淨液供給口431直接流入貯存部430的洗淨液L，亦作為洗淨輥洗淨液L1而發揮作用。 After the washing liquid L flows from the washing liquid supply source 50 into the washing liquid supply path 410a of the rotating shaft 410, the washing liquid L is further divided to the branch path 410b, and reaches the washing roller 40 and the washing roller 40 from the inside of the washing roller 40. The contact portion between the lower surface Wb of the wafer W. In addition, the washing liquid L flowing into the reservoir 430 from the branch path 410 b functions as a washing roller washing liquid L1 for washing the washing roller 40. In addition, the washing liquid L directly flowing into the reservoir 430 from the washing liquid supply source 50 through the washing roller washing liquid supply port 431 also functions as the washing roller washing liquid L1.

伴隨著洗淨輥40之旋轉，附著於洗淨輥40的汙垢在貯存部430內藉由貯存於貯存部430的洗淨輥洗淨液L1被清洗而由外側面40a抖落。又，如圖7所示，在貯存部430內清洗抖落洗淨輥40之汙垢後的洗淨輥洗淨液L1，超越殼體43之側板43而由貯存部430內被排出，因此針對洗淨液供給源50所供給的洗淨液L之供給量，進行比起圖5所示實施形態更增加等之調整。如此般藉由調整洗淨液L之供給量，可以確實確保貯存部430內的洗淨液L之貯存機能，而且可以將使用完畢之洗淨液排出外部。 Along with the rotation of the washing roller 40, the dirt adhering to the washing roller 40 is washed in the storage portion 430 by the washing roller cleaning liquid L1 stored in the storage portion 430 and shaken off from the outer surface 40a. In addition, as shown in FIG. 7, the washing roller cleaning liquid L1 after washing off the dirt of the washing roller 40 in the reservoir 430 exceeds the side plate 43 of the housing 43 and is discharged from the reservoir 430. The supply amount of the washing liquid L supplied from the washing liquid supply source 50 is adjusted to be increased compared to the embodiment shown in FIG. 5. In this way, by adjusting the supply amount of the cleaning liquid L, the storage function of the cleaning liquid L in the storage portion 430 can be surely ensured, and the used cleaning liquid can be discharged to the outside.

1‧‧‧洗淨裝置 1‧‧‧Cleaning device

2‧‧‧晶圓旋轉手段 2‧‧‧Wafer rotating means

3‧‧‧保持手段 3‧‧‧Keep the means

3a、3b‧‧‧保持單元 3a, 3b‧‧‧holding unit

30‧‧‧保持部 30‧‧‧Retention Department

300‧‧‧旋轉軸 300‧‧‧Rotating axis

301‧‧‧旋轉輥 301‧‧‧Rotating roller

301a‧‧‧一對凸緣部 301a‧‧‧A pair of flanges

31‧‧‧基台 31‧‧‧Abutment

32a、32b‧‧‧可動板 32a, 32b‧‧‧ movable plate

33a、33b‧‧‧連結具 33a, 33b‧‧‧Connecting tool

34‧‧‧可動板旋轉機構 34‧‧‧Movable plate rotating mechanism

340‧‧‧氣缸管 340‧‧‧Cylinder tube

341‧‧‧活塞桿 341‧‧‧Piston rod

342a、342b‧‧‧連結具 342a, 342b‧‧‧Connecting tool

4‧‧‧洗淨手段 4‧‧‧Washing method

40‧‧‧洗淨輥 40‧‧‧Cleaning roller

40a‧‧‧洗淨輥之外側面 40a‧‧‧The outer side of the washing roller

400o‧‧‧洗淨輥之旋轉軸 400o‧‧‧Rotating shaft of washing roller

41‧‧‧洗淨輥旋轉機構 41‧‧‧Washing roller rotating mechanism

410‧‧‧轉動軸 410‧‧‧Rotating shaft

411‧‧‧馬達 411‧‧‧Motor

43‧‧‧殼體 43‧‧‧Shell

43a‧‧‧殼體之底板 43a‧‧‧The bottom plate of the shell

43b、43c‧‧‧殼體之側板 43b、43c‧‧‧The side plate of the shell

44‧‧‧支撐台 44‧‧‧Support Table

44a‧‧‧支撐台之底板 44a‧‧‧Bottom plate of support platform

44b‧‧‧支撐台之側板 44b‧‧‧Side plate of support platform

44d‧‧‧支撐軸 44d‧‧‧Support shaft

5‧‧‧洗淨液供給手段 5‧‧‧Washing liquid supply means

50‧‧‧洗淨液供給源 50‧‧‧Cleaning liquid supply source

50a‧‧‧洗淨液供給路 50a‧‧‧Washing fluid supply path

W‧‧‧晶圓 W‧‧‧wafer

Wd‧‧‧晶圓之外周緣 Wd‧‧‧Outer edge of wafer

Wo‧‧‧晶圓之中心 Wo‧‧‧The Center of Wafer

R1‧‧‧晶圓之半徑 R1‧‧‧The radius of the wafer

M1‧‧‧洗淨輥之長度 M1‧‧‧The length of the cleaning roller

Claims (4)

一種洗淨裝置，係具備：保持手段，具有保持晶圓之外周緣的3個以上之保持部，且將所保持的該晶圓之中心位置置於連結該3個以上之保持部的多角形之中；晶圓旋轉手段，以該保持手段所保持的該晶圓之中心為軸使該晶圓旋轉；洗淨手段，具有：以外側面接觸該保持手段所保持的該晶圓之下面而對該晶圓之下面進行洗淨的圓筒狀之洗淨輥；及使該洗淨輥繞沿該洗淨輥之長度方向延伸的旋轉軸旋轉的洗淨輥旋轉機構；殼體，係至少具備側板和底板，並且使該洗淨輥之上部側露出殼體外部之同時將該洗淨輥可旋轉地進行收納；及洗淨液供給手段，至少對該洗淨輥與該晶圓之下面之間的接觸部供給洗淨液；該洗淨手段具有：貯存部，夾持該洗淨輥之該旋轉軸而貯存在與晶圓相反側對該洗淨輥進行洗淨的洗淨輥洗淨液；該貯存部，係形成在該殼體內的該底板之上面與該洗淨輥的下側部分之間，而且能夠利用貯存在該貯存部的洗淨液針對以該上部側洗淨該晶圓之狀態下的該洗淨輥進行洗淨。 A cleaning device is provided with a holding means having three or more holding parts for holding the outer periphery of a wafer, and the center of the held wafer is placed in a polygon connecting the three or more holding parts Among; wafer rotating means, rotating the wafer with the center of the wafer held by the holding means as the axis; cleaning means having: outer side contact with the bottom of the wafer held by the holding means against A cylindrical cleaning roller that cleans the underside of the wafer; and a cleaning roller rotating mechanism that rotates the cleaning roller around a rotating shaft extending along the length of the cleaning roller; the housing has at least The side plate and the bottom plate, and the upper side of the cleaning roller is exposed to the outside of the housing while the cleaning roller is rotatably housed; and the cleaning liquid supply means is at least between the cleaning roller and the bottom of the wafer A cleaning liquid is supplied to the contact part between the cleaning devices; the cleaning means has: a storage part that sandwiches the rotating shaft of the cleaning roller and stores the cleaning roller cleaning on the side opposite to the wafer for cleaning the cleaning roller The storage portion is formed between the upper surface of the bottom plate in the housing and the lower part of the cleaning roller, and the cleaning solution stored in the storage portion can be used to clean the crystal on the upper side The washing roller in the round state is washed. 如申請專利範圍第1項之洗淨裝置，其中 上述貯存部，在上述洗淨輥之上述旋轉軸方向中由一端朝另一端變低而傾斜，於該貯存部在該一端側形成供給上述洗淨輥洗淨液的洗淨輥洗淨液供給口。 Such as the cleaning device of item 1 of the scope of patent application, which The storage portion is inclined from one end to the other end in the direction of the rotation axis of the cleaning roller, and a cleaning solution supply of the cleaning roll for supplying the cleaning solution of the cleaning roll is formed on the one end side of the storage portion mouth. 如申請專利範圍第2項之洗淨裝置，其中該保持手段所保持的該晶圓的下面，係從外周側至中央區域朝上方向彎曲成為中凹，該洗淨裝置還具備：彈性構件，用於將收納在該殼體的該洗淨輥之與該晶圓的下面的該中央區域接觸的該一端側偏置於上方向，在該洗淨輥中被該彈性構件偏置於上方向的該一端側係高於該另一端側。 For example, the cleaning device of the second item of the scope of patent application, wherein the lower surface of the wafer held by the holding means is curved upward from the outer peripheral side to the central area to form a concave, and the cleaning device further includes: an elastic member, For biasing the one end side of the cleaning roller housed in the housing in contact with the central area of the lower surface of the wafer in the upward direction, the cleaning roller is biased in the upward direction by the elastic member The one end side is higher than the other end side. 如申請專利範圍第1至3項中任一項之洗淨裝置，其中該洗淨輥的長度為該晶圓的半徑以上且小於該晶圓的直徑，該洗淨輥，係以與該保持手段所保持的該晶圓W之下面的中心至外周側接觸的方式進行定位。 For example, the cleaning device of any one of items 1 to 3 in the scope of patent application, wherein the length of the cleaning roller is greater than the radius of the wafer and less than the diameter of the wafer, the cleaning roller is connected to the holding Positioning is performed in such a way that the center of the lower surface of the wafer W held by the means is in contact with the outer peripheral side.
TW106101030A 2016-02-25 2017-01-12 Washing device TWI743076B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016034321A JP6609197B2 (en) 2016-02-25 2016-02-25 Cleaning device
JP2016-034321 2016-02-25

Publications (2)

Publication Number Publication Date
TW201735148A TW201735148A (en) 2017-10-01
TWI743076B true TWI743076B (en) 2021-10-21

Family

ID=59717914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106101030A TWI743076B (en) 2016-02-25 2017-01-12 Washing device

Country Status (4)

Country Link
JP (1) JP6609197B2 (en)
KR (1) KR102518002B1 (en)
CN (1) CN107123609B (en)
TW (1) TWI743076B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6951199B2 (en) * 2017-11-09 2021-10-20 株式会社ディスコ Wafer cleaning equipment
CN107931179B (en) * 2017-11-15 2020-10-02 宜都同创光电科技有限公司 Semi-automatic oil wiping machine for cleaning front of optical glass lens
JP7100475B2 (en) * 2018-03-30 2022-07-13 株式会社ディスコ Processing equipment
JP7288370B2 (en) * 2019-08-20 2023-06-07 株式会社ディスコ Wafer cleaning mechanism
CN114425492B (en) * 2022-02-17 2023-01-20 江苏正永地面装饰材料有限公司 Production system of processing of PVC panel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347287A (en) * 1992-04-14 1993-12-27 Sony Corp Cleaning device
JP2002307023A (en) * 2001-04-13 2002-10-22 Display Technologies Inc Brush washing apparatus provided with self washing function and method of manufacturing flat display apparatus or semiconductor element using the same
JP2009279536A (en) * 2008-05-23 2009-12-03 Hitachi High-Technologies Corp Apparatus for and method of cleaning substrate
JP2013239498A (en) * 2012-05-11 2013-11-28 Disco Abrasive Syst Ltd Cleaning device
JP2015126033A (en) * 2013-12-25 2015-07-06 株式会社ディスコ Cleaning device and processing device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139062A (en) * 1994-11-11 1996-05-31 M Setetsuku Kk Device for scrubbing substrate
JP2930580B1 (en) * 1998-03-27 1999-08-03 株式会社カイジョー Cleaning equipment for semiconductor wafers
JP2009117765A (en) 2007-11-09 2009-05-28 Aion Kk Washing sponge roller
JP5886224B2 (en) * 2012-05-23 2016-03-16 株式会社荏原製作所 Substrate cleaning method
JP6054805B2 (en) * 2013-04-25 2016-12-27 株式会社荏原製作所 Substrate cleaning device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347287A (en) * 1992-04-14 1993-12-27 Sony Corp Cleaning device
JP2002307023A (en) * 2001-04-13 2002-10-22 Display Technologies Inc Brush washing apparatus provided with self washing function and method of manufacturing flat display apparatus or semiconductor element using the same
JP2009279536A (en) * 2008-05-23 2009-12-03 Hitachi High-Technologies Corp Apparatus for and method of cleaning substrate
JP2013239498A (en) * 2012-05-11 2013-11-28 Disco Abrasive Syst Ltd Cleaning device
JP2015126033A (en) * 2013-12-25 2015-07-06 株式会社ディスコ Cleaning device and processing device

Also Published As

Publication number Publication date
JP6609197B2 (en) 2019-11-20
JP2017152565A (en) 2017-08-31
KR102518002B1 (en) 2023-04-04
CN107123609B (en) 2022-02-11
TW201735148A (en) 2017-10-01
KR20170100428A (en) 2017-09-04
CN107123609A (en) 2017-09-01

Similar Documents

Publication Publication Date Title
TWI743076B (en) Washing device
KR102326734B1 (en) Substrate processing apparatus
US11532491B2 (en) Substrate cleaning apparatus, substrate processing apparatus, and method of cleaning substrate
CN101740450B (en) Substrate supporting unit, and apparatus and method for polishing substrate using the same
CN114274041B (en) Double-side polishing apparatus and double-side polishing method
TWI644738B (en) Substrate cleaning apparatus and substrate processing apparatus
KR101965118B1 (en) Substrate treatment method and substrate treatment device
KR100379650B1 (en) Substrate cleaning apparatus and substrate cleaning method
TWI681449B (en) Polishing method and polishing apparatus
JP2001326201A (en) Polishing device
JP2014082470A (en) Substrate processing apparatus
US10170343B1 (en) Post-CMP cleaning apparatus and method with brush self-cleaning function
KR20190070532A (en) Load cup and chemical mechanical polishing apparatus including the same
KR20190070874A (en) Substrate processing apparatus and substrate processing method
CN114227524A (en) Double-side polishing apparatus and double-side polishing method
US20170372893A1 (en) Cleaning apparatus and substrate processing apparatus
US10751761B2 (en) Self-cleaning device and substrate processing apparatus
JP2018056385A (en) Substrate cleaning apparatus, substrate cleaning method, and roll sponge for substrate cleaning apparatus
KR20160027638A (en) Non-contact type wafer cleaning system
JP6549936B2 (en) Cleaning device
JP2002184732A (en) Delivering device
KR20100048407A (en) Substrate support member and apparatus for treating substrate with the same
KR101213967B1 (en) Wafer cleaning apparatus
WO2023195340A1 (en) Substrate processing device and substrate processing method
JP2003080454A (en) Polishing device