JP2930580B1 - Cleaning equipment for semiconductor wafers - Google Patents
Cleaning equipment for semiconductor wafersInfo
- Publication number
- JP2930580B1 JP2930580B1 JP9819798A JP9819798A JP2930580B1 JP 2930580 B1 JP2930580 B1 JP 2930580B1 JP 9819798 A JP9819798 A JP 9819798A JP 9819798 A JP9819798 A JP 9819798A JP 2930580 B1 JP2930580 B1 JP 2930580B1
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- cleaning liquid
- brush
- precision substrate
- rotating brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
【要約】
【課題】半導体ウエーハ等の洗浄に際し、回転ブラシを
常に洗浄液で濡らしておきながら精密基板を刷掃使用で
き、ブラシの変形を防止し、しかも回転ブラシ表面が平
坦面で矯正できてブラシの平坦性を保ち、回転ブラシに
よる洗浄むらがなく安定した洗浄効果を高める。
【解決手段】半導体ウエーハ、液晶ガラス等の精密基板
１を水平状態で回転自在に回動ローラ２によって保持し
て、該精密基板１の両面に洗浄液３で濡らしたロール状
の回転ブラシ４，５を接触配備して、該回転ブラシ４，
５によって精密基板１の表面を刷掃洗浄する装置であっ
て、前記精密基板１の上方に配備される上部回転ブラシ
４の上方に近接して洗浄液３を貯溜し液滴導出しうる第
１洗浄液タンク６を設けると共に、前記精密基板１の下
方に配備される下部回転ブラシ５の下方に近接して洗浄
液３を貯溜した第２洗浄液タンク７を設けて、該第２洗
浄液タンク７内の洗浄液３に前記下部回転ブラシ５を浸
漬したとで、精密基板１の洗浄用の回転ブラシ４，５の
変形がなく平坦性を保って洗浄むらのない安定した洗浄
作業を行なうようにした。Kind Code: A1 When cleaning a semiconductor wafer or the like, a brush can be used for cleaning a precision substrate while the rotary brush is constantly wetted with a cleaning liquid, thereby preventing deformation of the brush and, furthermore, allowing the rotary brush surface to be corrected with a flat surface. Maintains flatness and enhances the stable cleaning effect without rotating unevenness by the rotating brush. A roll-shaped rotating brush (4, 5) wettable on both sides of a precision substrate (1) with a cleaning liquid (3) by holding a precision substrate (1) such as a semiconductor wafer or a liquid crystal glass in a horizontal state so as to be freely rotatable. And the rotating brush 4,
5 for cleaning the surface of the precision substrate 1 by means of cleaning, wherein the first cleaning solution is capable of storing the cleaning solution 3 in close proximity to an upper rotating brush 4 disposed above the precision substrate 1 and leading out droplets. A tank 6 is provided, and a second cleaning liquid tank 7 for storing the cleaning liquid 3 is provided adjacent to below the lower rotary brush 5 provided below the precision substrate 1, and the cleaning liquid 3 in the second cleaning liquid tank 7 is provided. Since the lower rotating brush 5 was immersed in the cleaning substrate, the rotating brushes 4 and 5 for cleaning the precision substrate 1 were not deformed, and the cleaning was performed so that the flatness was maintained and a stable cleaning operation without uneven cleaning was performed.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体ウエーハや
液晶ガラス（ＬＣＤ）などの精密基板を洗浄液の使用に
よってブラシ洗浄処理するための半導体ウエーハ等用洗
浄装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus for a semiconductor wafer or the like for cleaning a precision substrate such as a semiconductor wafer or a liquid crystal glass (LCD) with a brush by using a cleaning liquid.
【０００２】[0002]
【従来の技術】従来の半導体ウエーハ等の精密基板は、
洗浄処理工程において純水（ＤＩＷ）や薬液によって、
洗浄槽内でウエット洗浄処理することが知られている
が、基板表面に強固に付着したパーティクルを取り除く
のには、このウエット洗浄処理では難しい。この基板表
面に強固に付着したパーティクルを取り除くことは重要
なことであるが、基板表面にに付着したパーティクルを
取り除く際に、精密基板そのものに傷を与えるような洗
浄手段は避けねばならないことも配慮しなければなら
ず、さらに重要なことは基板表面に強固に付着したパー
ティクルを短時間で、かつ高清浄に能率良く洗浄するこ
とであるために、精密基板に接触刷掃するブラシ洗浄が
有効であることが知られて実用化されている。即ち、こ
の従来のブラシ洗浄としては、図２に示すように半導体
ウエーハ等の精密基板ａを水平状態で回動自在に保持し
て、該精密基板ａの両面に洗浄液で濡らした回転ブラシ
ｂを接触配備して、該回転ブラシｂによって精密基板ａ
の表面を刷掃洗浄するもので、該回転ブラシａには洗浄
液を噴射するノズルｃをそれざれ装備して、ノズルｃか
ら洗浄液ｄを回転ブラシｂに吹きつけブラシを濡らして
洗浄処理するものであった。2. Description of the Related Art Conventional precision substrates such as semiconductor wafers are
In the cleaning process, pure water (DIW) or chemicals
It is known that wet cleaning is performed in a cleaning tank, but it is difficult to remove particles firmly adhered to the substrate surface by this wet cleaning. It is important to remove the particles that adhere to the substrate surface, but when removing the particles that adhere to the substrate surface, care must also be taken to avoid cleaning methods that may damage the precision substrate itself. More importantly, it is necessary to clean the particles firmly adhered to the substrate surface in a short period of time, with high efficiency and high efficiency. It is known that it has been put to practical use. That is, as this conventional brush cleaning, as shown in FIG. 2, a precision substrate a such as a semiconductor wafer is held rotatably in a horizontal state, and a rotating brush b wet on both sides of the precision substrate a with a cleaning liquid is used. The contact board is arranged, and the precision substrate a is
The rotary brush a is equipped with a nozzle c for spraying a cleaning liquid, and the cleaning liquid d is sprayed from the nozzle c onto the rotary brush b to wet the brush and perform a cleaning process. there were.
【０００３】[0003]
【発明が解決しようとする課題】この従来のブラシ洗浄
装置では、洗浄すべき精密基板の邪魔にならない位置に
洗浄ノズルを取り付ける必要があり、常に洗浄液で濡ら
してきながら刷掃することが肝心なのに、吹きつけ液の
ため十分に回転ブラシを濡らすことができず、しかも高
価な洗浄液を余分に大量に使うこととなり、処理コスト
も割高となって不経済であり、さらに十分にブラシを濡
らすことがでないと回転ブラシの表面が乾いて変形を引
き起こし易く、また基板を刷掃するブラシは変形しやす
いので、このブラシの変形によって精密基板へ均一にブ
ラシを当てることができなくなり、精密基板に洗浄斑点
が生じて洗浄不均一となるなどの問題があった。本発明
は、これら従来の欠点を排除しようとするもので、基板
洗浄用のロール状の回転ブラシを常に洗浄液で濡らして
おきながら精密基板を刷掃使用でき、ブラシの変形を防
止し、しかも回転ブラシ表面が平坦面で矯正できてブラ
シの平坦性を保ち、ロール状の回転ブラシによる洗浄む
らがなく安定した洗浄効果が得られると共に、使用洗浄
液量も可及的に減少させ洗浄処理作業性をも著しく向上
し、ランニングコストの低減をもはかることのできる安
価な半導体ウエーハ等用洗浄装置を提供することを目的
としている。In this conventional brush cleaning apparatus, it is necessary to install a cleaning nozzle at a position where it does not interfere with the precision substrate to be cleaned. It is important to perform cleaning while always wetting with a cleaning liquid. Due to the spray liquid, the rotating brush cannot be sufficiently wetted, and an extra large amount of expensive cleaning liquid is used, which increases the processing cost and is uneconomical, and does not allow the brush to be sufficiently wetted. And the surface of the rotating brush dries easily and causes deformation, and the brush for cleaning the substrate is easily deformed, so that the deformation of this brush makes it impossible to apply a brush evenly to the precision substrate, and cleaning spots on the precision substrate This causes problems such as uneven cleaning. The present invention is intended to eliminate these conventional drawbacks, and can use a precision substrate for cleaning while keeping a roll-shaped rotary brush for cleaning a substrate wet with a cleaning liquid, thereby preventing deformation of the brush and rotating the brush. The brush surface can be corrected with a flat surface to maintain the flatness of the brush, and a stable cleaning effect can be obtained without uneven cleaning by the roll-shaped rotating brush, and the amount of cleaning liquid used is reduced as much as possible to improve the cleaning workability. Another object of the present invention is to provide an inexpensive cleaning apparatus for semiconductor wafers and the like which can significantly reduce the running cost.
【０００４】[0004]
【課題を解決するための手段】本発明は、半導体ウエー
ハ等の精密基板を水平状態で回転または水平移動自在に
保持して、該精密基板の両面に洗浄液で濡らしたロール
状の回転ブラシを接触配備して、該回転ブラシによって
精密基板の表面を刷掃洗浄する装置であって、前記精密
基板の上方に配備される回転ブラシの上方に近接して洗
浄液を貯溜し液滴導出しうる第１洗浄液タンクを設ける
と共に、前記精密基板の下方に配備される回転ブラシの
下方に近接して洗浄液を貯溜し回転ブラシを浸漬する第
２洗浄液タンクを設けたもので、ブラシの平坦性を保
ち、回転ブラシの変形防止を確実にして均等に精密基板
に接触して洗浄むらがなく安定した洗浄効果が得られる
ようにしたものである。また、本発明では、前記第１洗
浄液タンクが、洗浄液を逐次供給されるものであって、
底面に多数の液滴孔を有し、液底面外表面をロール状の
上部回転ブラシ上に接触配備したことをも特徴とする
し、さらに前記第２洗浄液タンクが、洗浄液を逐次供給
されオーバーフローするものであって、ロール状の下部
回転ブラシの下方の一部を洗浄液面下に浸漬すると共
に、下部回転ブラシ先端を第２洗浄液タンク内底面に接
触するように配備したことをも特徴とするものである。According to the present invention, a precision substrate such as a semiconductor wafer is held in a horizontal state so as to be rotatable or horizontally movable, and both surfaces of the precision substrate are brought into contact with a roll-shaped rotary brush wetted with a cleaning liquid. An apparatus for cleaning the surface of a precision substrate by using the rotating brush, wherein the cleaning liquid is stored in close proximity to a rotating brush provided above the precision substrate and a first liquid can be discharged. A cleaning liquid tank is provided, and a second cleaning liquid tank for storing the cleaning liquid and immersing the rotating brush is provided in the vicinity of a rotating brush provided below the precision substrate, and the flatness of the brush is maintained. The brush is surely prevented from being deformed so as to uniformly contact the precision substrate to obtain a stable cleaning effect without cleaning unevenness. In the present invention, the first cleaning liquid tank is supplied with the cleaning liquid sequentially,
It is also characterized in that it has a number of droplet holes on the bottom surface, and the outer surface of the liquid bottom surface is provided in contact with a roll-shaped upper rotating brush, and the second cleaning liquid tank is supplied with a cleaning liquid sequentially and overflows. A lower part of the roll-shaped lower rotating brush is immersed below the surface of the cleaning liquid, and a tip of the lower rotating brush is arranged to be in contact with the inner bottom surface of the second cleaning liquid tank. It is.
【０００５】この請求項１記載の発明によれば、基板洗
浄用の回転ブラシを常に洗浄液で濡らしておきながら使
用でき、回転ブラシ表面が乾くことがなくブラシの平坦
性を保ち、回転ブラシの変形防止を確実にし洗浄むらが
なく安定した洗浄効果が得られると共に、使用洗浄液量
を可及的に減少させ洗浄処理作業性をも著しく向上し、
ランニングコストの低減をもはかる。また、第１洗浄液
タンクの液底面外表面をロール状の上部回転ブラシ上に
接触配備したことで、回転ブラシ表面が平坦面で矯正で
きてブラシの平坦性を保ち、ロール状の回転ブラシの変
形防止を確実にし洗浄むらがなく安定した洗浄効果が得
られる。さらに、第２洗浄液タンクに浸漬される下部回
転ブラシ先端を第２洗浄液タンク内底面に接触するよう
に配備したことで、回転ブラシ表面が平坦面で矯正でき
てブラシの平坦性を保ち、ロール状の回転ブラシの変形
防止を確実にし洗浄むらがなく安定した洗浄効果が得ら
れる。According to the first aspect of the present invention, the rotating brush for cleaning the substrate can be used while being kept wet with the cleaning liquid, the surface of the rotating brush is not dried, the flatness of the brush is maintained, and the rotating brush is deformed. In addition to ensuring the prevention, a stable cleaning effect is obtained without cleaning unevenness, the amount of cleaning liquid used is reduced as much as possible, and the workability of the cleaning process is significantly improved.
It also aims to reduce running costs. In addition, the outer surface of the liquid bottom surface of the first cleaning liquid tank is arranged in contact with the upper rotating brush in a roll form, so that the surface of the rotating brush can be corrected with a flat surface, and the flatness of the brush is maintained. Prevention is ensured, and a stable cleaning effect is obtained without cleaning unevenness. Further, by disposing the tip of the lower rotating brush immersed in the second cleaning liquid tank so as to contact the inner bottom surface of the second cleaning liquid tank, the surface of the rotating brush can be corrected with a flat surface, and the flatness of the brush can be maintained. As a result, a stable cleaning effect can be obtained without unevenness of cleaning.
【０００６】[0006]
【発明の実施の形態】本発明の実施形態では、半導体ウ
エーハ等の精密基板を水平状態で回転または水平移動さ
せながら、この移動精密基板の両面に洗浄液で濡らした
ロール状の回転ブラシを接触して回転すると、精密基板
の表面を刷掃洗浄することができ、基板表面に強固に付
着したパーティクルを取り除くことが容易にできる。し
かも前記精密基板の上方に配備されるロール状の上部回
転ブラシの上方に近接して洗浄液を貯溜し液滴導出しう
る第１洗浄液タンクを設けてあるので、回転ブラシを常
に洗浄液で濡らしてきながら精密基板を刷掃すると共
に、液底面外表面をロール状の上部回転ブラシ上に接触
配備してあるので、回転ブラシ表面がタンクの平坦面で
矯正できてブラシの平坦性を保ち、回転ブラシの変形を
確実に防ぎ洗浄むらなく安定した洗浄作業ができる。さ
らに、ロール状の下部回転ブラシは、その下方の一部を
洗浄液面下に浸漬すると共に、下部回転ブラシ先端を第
２洗浄液タンク内底面に接触して回転するので、回転ブ
ラシを常に洗浄液で濡らしてきながら精密基板を刷掃す
ることとなり、かつ下部回転ブラシの表面がタンク内底
面の平坦面で矯正できて、回転ブラシの変形がなく平坦
性を保って洗浄むらのない安定した洗浄作業を行なうこ
とができる。In the embodiment of the present invention, while rotating or horizontally moving a precision substrate such as a semiconductor wafer in a horizontal state, a roll-shaped rotary brush wetted with a cleaning liquid is brought into contact with both surfaces of the movable precision substrate. When rotated, the surface of the precision substrate can be brushed and cleaned, and particles firmly attached to the substrate surface can be easily removed. In addition, since the first cleaning liquid tank capable of storing the cleaning liquid and discharging the liquid droplets is provided in proximity to the upper part of the roll-shaped rotary brush provided above the precision substrate, the rotary brush is constantly wetted with the cleaning liquid. Since the precision substrate is cleaned and the outer surface of the liquid bottom is placed in contact with the roll-shaped upper rotating brush, the rotating brush surface can be corrected on the flat surface of the tank, maintaining the flatness of the brush. Deformation is reliably prevented, and stable cleaning work can be performed without uneven cleaning. Furthermore, the lower part of the lower rotating brush is immersed below the surface of the cleaning liquid, and the tip of the lower rotating brush contacts the inner surface of the second cleaning liquid tank and rotates, so that the rotating brush is always wet with the cleaning liquid. To clean the precision substrate while cleaning, and the surface of the lower rotating brush can be corrected by the flat surface of the inner bottom surface of the tank, and there is no deformation of the rotating brush to maintain flatness and perform stable cleaning work without cleaning unevenness be able to.
【０００７】[0007]
【実施例】本発明の実施例を図１の洗浄処理装置の例で
説明すると、半導体ウエーハ、液晶ガラス等の精密基板
１を水平状態で回転自在に回動ローラ２によって保持し
て、この回動する精密基板１の上下両面に洗浄液３で濡
らしたロール状の回転ブラシ４，５を接触配備して、該
回転ブラシ４，５によって精密基板１の表面を刷掃洗浄
する装置であって、前記精密基板１の上方に配備される
上部回転ブラシ４の上方に近接して洗浄液３を貯溜し液
滴導出しうる第１洗浄液タンク６を設けると共に、前記
精密基板１の下方に配備される下部回転ブラシ５の下方
に近接して洗浄液３を貯溜した第２洗浄液タンク７を設
けて、該第２洗浄液タンク７内の洗浄液３に前記下部回
転ブラシ５を浸漬して半導体ウエーハ等用洗浄装置とし
てある。この場合、前記第１洗浄液タンク６しては、洗
浄液３を逐次供給されるものであって、底面に多数の液
滴孔６1 、例えばφ０．３〜０．８好ましくはφ０．５
位の小さな孔を有して洗浄液３が下方に滴下するように
してあり、液底面外表面をロール状の上部回転ブラシ４
上に接触配備し、該回転ブラシ４を常に洗浄液３で濡ら
してきながら精密基板１を刷掃できるようにすると共
に、液底面外表面をロール状の上部回転ブラシ４上に接
触配備してあるので、回転ブラシ表面が洗浄液タンク６
の平坦面で矯正できて上部回転ブラシ４の平坦性を保
ち、回転ブラシ４の変形を確実に防ぐようにしてある。
また、前記第２洗浄液タンク７としても洗浄液３を逐次
供給されオーバーフローするものとしてあって、ロール
状の下部回転ブラシ５の下方の一部を洗浄液面下に浸漬
すると共に、下部回転ブラシ先端を第２洗浄液タンク７
の内底面に接触するようにして、下部回転ブラシ５を常
に洗浄液３で濡らしてきながら精密基板１を刷掃し、か
つ下部回転ブラシ５の表面が洗浄液タンク７の内底面の
平坦面で矯正できて、下部回転ブラシ５の変形がなく平
坦性を保って洗浄むらのない安定した洗浄作業を行なう
ようにしてある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the example of the cleaning apparatus shown in FIG. 1. A precision substrate 1 such as a semiconductor wafer or a liquid crystal glass is horizontally held by a rotating roller 2 so as to be rotatable. An apparatus for cleaning the surface of the precision substrate 1 by rotating the brushes 4 and 5 in contact with the rotating brushes 4 and 5 wetted with the cleaning liquid 3 on the upper and lower surfaces of the moving precision substrate 1. A first cleaning liquid tank 6 for storing the cleaning liquid 3 and discharging the cleaning liquid 3 is provided near the upper rotating brush 4 provided above the precision substrate 1 and a lower part provided below the precision substrate 1. A second cleaning liquid tank 7 storing the cleaning liquid 3 is provided adjacent to below the rotating brush 5 and the lower rotating brush 5 is immersed in the cleaning liquid 3 in the second cleaning liquid tank 7 to provide a cleaning device for a semiconductor wafer or the like. is there. In this case, the first cleaning liquid tank 6 is supplied with the cleaning liquid 3 sequentially and has a large number of droplet holes 61 on the bottom surface, for example, φ0.3 to 0.8, preferably φ0.5.
The cleaning liquid 3 is dripped downward with a small hole at the bottom, and the outer surface of the liquid bottom is roll-shaped.
Since the precision substrate 1 can be cleaned while the rotary brush 4 is constantly wetted with the cleaning liquid 3 and the outer surface of the liquid bottom surface is disposed in contact with the roll-shaped upper rotary brush 4. , Rotating brush surface is cleaning liquid tank 6
The flat surface can be corrected to maintain the flatness of the upper rotating brush 4 and to surely prevent the rotating brush 4 from being deformed.
The second cleaning liquid tank 7 is also configured so that the cleaning liquid 3 is sequentially supplied and overflows. A part of the lower part of the roll-shaped lower rotating brush 5 is immersed below the cleaning liquid surface, and the tip of the lower rotating brush is moved to the second position. 2 cleaning liquid tank 7
The lower rotary brush 5 can be wiped with the cleaning liquid 3 to clean the precision substrate 1 while being in contact with the inner bottom surface, and the surface of the lower rotary brush 5 can be corrected by the flat surface of the inner bottom surface of the cleaning liquid tank 7. Thus, the lower rotating brush 5 is not deformed and the flatness is maintained to perform a stable cleaning operation without cleaning unevenness.
【０００８】前記回動ローラ２としては、円盤状の精密
基板１を水平状態で保持しつつ、ローラ２が回転するこ
とで、該精密基板１に動力が伝わり回転駆動するもので
あるが、石英ガラス等の角形状の精密基板１の場合は、
回動ローラ２の上に基板を搭載して回動ローラ２の回転
で基板を水平方向に移動する形態とし、この移動搬送中
にロール状の回転ブラシ５，６で基板表面を刷掃するよ
うにするのがよい。The rotating roller 2 is a roller that rotates while the roller 2 rotates while holding the disk-shaped precision substrate 1 in a horizontal state, and the power is transmitted to the precision substrate 1 and is driven to rotate. In the case of a square precision substrate 1 such as glass,
The substrate is mounted on the rotating roller 2 and the substrate is moved in the horizontal direction by the rotation of the rotating roller 2, and the surface of the substrate is cleaned by the roll-shaped rotating brushes 5 and 6 during the moving and conveying. It is better to
【０００９】また、前記洗浄液タンク６，７の洗浄液
は、アンモニア水、希フッ酸水、純水、その他、水＋ア
ルカリまたは界面活性剤や半導体製造や液晶ガラス製造
等で用いられている公知の水系洗浄液（例えば、市水、
温純水、超純水、純水、薬液、又はリンス液など）を用
いることができ、この洗浄液の供給も各洗浄液タンク
６，７に適宜調整して行なわれる。更に必要に応じて親
水性のガスを発生する有機性液体、例えばイソプロピル
アルコール（１ＰＡ）やエチルグリコール、エチレング
リコール、１−プロパノール、２−プロパノール、テト
ラヒドラフラン、１−ブタノール、２−ブタノール、等
を各洗浄液タンク６，７に適宜調整して入れて洗浄効果
を高めることもできる。The cleaning liquid in the cleaning liquid tanks 6 and 7 may be ammonia water, dilute hydrofluoric acid water, pure water, water + alkali or a surfactant, or a known liquid used in the production of semiconductors or liquid crystal glass. Aqueous cleaning liquid (for example, city water,
Warm pure water, ultrapure water, pure water, a chemical solution, a rinsing solution, or the like) can be used, and the supply of this cleaning solution is also performed by appropriately adjusting each of the cleaning solution tanks 6 and 7. Further, an organic liquid which generates a hydrophilic gas as required, such as isopropyl alcohol (1PA), ethyl glycol, ethylene glycol, 1-propanol, 2-propanol, tetrahydrafuran, 1-butanol, 2-butanol, etc. Can be appropriately adjusted and put into each of the cleaning liquid tanks 6 and 7 to enhance the cleaning effect.
【００１０】なお、本実施形態におけるロール状の回転
ブラシ４，５は、ナイロン、ポリビニールアルコール
（ＰＶＡ）などの合成樹脂製の円筒状スポンジに回転軸
を備えたのを用いて洗浄液タンク６，７の平坦板の表面
に軽く押し当てながら、表面を平らに矯正していくのが
よいが、回転軸に合成樹脂製のフィラメントを放射状に
密生させたロール状のブラシとしたものを用いることも
できる。The roll-shaped rotary brushes 4 and 5 in the present embodiment use a cylindrical sponge made of synthetic resin such as nylon or polyvinyl alcohol (PVA) provided with a rotary shaft, and use a cleaning liquid tank 6 or 6. It is better to straighten the surface flatly while pressing lightly on the surface of the flat plate of 7, but it is also possible to use a roll-shaped brush in which synthetic resin filaments are radially densely packed on the rotating shaft. it can.
【００１１】この構成において、前記精密基板を洗浄液
で洗浄する場合には、各構成部材を区画室内にセットし
た形態で洗浄液を供給すると、ロール状の回転ブラシ
４，５及び各洗浄液タンク６，７を経て本体内部に一定
の速度で連続的に導出し、連続的に搬送される被洗浄物
の精密基板１の表面を精密洗浄することにより、精密基
板１の一部にパーティクルが残存するのを有効に防止し
たり、或いはパーティクルの再付着防止が期待でき、洗
浄の効果や効率を向上させることができ、しかも洗浄効
果の向上により、洗浄液の使用量の削減、省エネ及び省
資源化を図ることが可能となる。この場合、前記精密基
板１を精密洗浄した洗浄液は、第２洗浄液タンク７から
オーバーフローしてオーバーフロー槽に流入して回収さ
れ再利用されるようになっている。In this configuration, when cleaning the precision substrate with a cleaning liquid, the cleaning liquid is supplied in a state where each component is set in a compartment, and the rotating brushes 4 and 5 and the cleaning liquid tanks 6 and 7 are rolled. By continuously cleaning the surface of the precision substrate 1 of the object to be cleaned, which is continuously conveyed through the main body at a constant speed through the above, it is possible to prevent particles from remaining on a part of the precision substrate 1. It can be expected to effectively prevent or prevent particles from re-adhering, and can improve the cleaning effect and efficiency. In addition, by improving the cleaning effect, reduce the amount of cleaning liquid used, and save energy and resources. Becomes possible. In this case, the cleaning liquid obtained by precision-cleaning the precision substrate 1 overflows from the second cleaning liquid tank 7, flows into the overflow tank, and is collected and reused.
【００１２】本実施形態においては、半導体グレードに
十分耐えられる、例えば材質から発塵の少ない石英ガラ
スや電界研磨したＳＵＳ板で構成した第１、第２洗浄液
タンク６，７に、アンモニア水、希フッ酸水、純水、な
どの洗浄液３を供給し、第１洗浄液タンク６から洗浄液
をロール状の上部回転ブラシ４上に滴下する。この第１
洗浄液タンク６のタンク底面は上部回転ブラシ４の表面
に軽く接触しており、上部回転ブラシ４は回転でブラシ
表面を矯正して平坦にしながら精密基板１の上面を刷掃
する。また、精密基板１の下表面を刷掃するロール状の
下部回転ブラシ５も洗浄液面下に浸漬させて回転するの
で、第２洗浄液タンク７の洗浄液３を巻き込みながら回
転ブラシ５を濡らし精密基板１の下面をこすり刷掃す
る。このロール状の下部回転ブラシ５の先端面は、第２
洗浄液タンク７の内底面に接触するようにして回転する
ので、下部回転ブラシ５の表面が平坦面に矯正できて、
下部回転ブラシ５の変形がなく平坦性を保って洗浄むら
のない安定した洗浄作業を行なうことができる。In the present embodiment, the first and second cleaning liquid tanks 6 and 7 made of, for example, quartz glass or a SUS plate which has been subjected to electropolishing, which are sufficiently resistant to semiconductor grades, are made of, for example, ammonia water and diluted water. A cleaning liquid 3 such as hydrofluoric acid water or pure water is supplied, and the cleaning liquid is dropped from a first cleaning liquid tank 6 onto a roll-shaped upper rotating brush 4. This first
The tank bottom surface of the cleaning liquid tank 6 is lightly in contact with the surface of the upper rotating brush 4, and the upper rotating brush 4 cleans the upper surface of the precision substrate 1 while correcting and flattening the brush surface by rotation. Further, since the roll-shaped lower rotary brush 5 for cleaning the lower surface of the precision substrate 1 is also immersed below the cleaning liquid surface and rotates, the rotary brush 5 is wet while the cleaning liquid 3 of the second cleaning liquid tank 7 is involved and the precision substrate 1 is wetted. Rub the bottom surface of the. The tip surface of the roll-shaped lower rotating brush 5 is
Since it rotates so as to contact the inner bottom surface of the cleaning liquid tank 7, the surface of the lower rotating brush 5 can be corrected to a flat surface,
The lower rotating brush 5 is not deformed, maintains flatness, and can perform a stable cleaning operation without cleaning unevenness.
【００１３】[0013]
【発明の効果】本発明は、半導体ウエーハ等の精密基板
を水平状態で回転または水平移動自在に保持して、該精
密基板の両面に洗浄液で濡らしたロール状の回転ブラシ
を接触配備して、該回転ブラシによって精密基板の表面
を刷掃洗浄する装置であって、前記精密基板の上方に配
備されるロール状の上部回転ブラシの上方に近接して接
触させ、かつ洗浄液を底面の液滴孔より液滴導出しうる
第１洗浄液タンクを設けると共に、前記精密基板の下方
に配備されるロール状の下部回転ブラシの下方に近接し
て洗浄液中にロール状の下部回転ブラシを浸漬させ、内
底面に接触させた第２洗浄液タンクを設けたことによ
り、基板洗浄用の回転ブラシを常に洗浄液で濡らしてお
きながら精密基板を刷掃でき、ブラシの変形を防止し、
しかもロール状の回転ブラシ表面が各洗浄液タンクの平
坦面で矯正できてブラシの平坦性を保ち、均等に精密基
板に接触できてロール状の回転ブラシによる洗浄むらが
なく安定した洗浄効果が得られると共に、使用洗浄液量
をも可及的に減少させ洗浄処理作業性をも著しく向上
し、ランニングコストの低減をもはかることのできる安
価な半導体ウエーハ等用洗浄装置とすることができる。According to the present invention, a precision substrate such as a semiconductor wafer is held rotatably or horizontally movable in a horizontal state, and a roll-shaped rotary brush wetted with a cleaning liquid is provided on both surfaces of the precision substrate in contact therewith. An apparatus for cleaning and cleaning the surface of a precision substrate by the rotating brush, wherein the cleaning brush is brought into close contact with a roll-shaped upper rotating brush provided above the precision substrate, and a cleaning liquid is provided on a bottom surface of a droplet hole. Providing a first cleaning liquid tank from which liquid droplets can be drawn out, and immersing the roll-shaped lower rotating brush in the cleaning liquid in proximity to a lower part of the roll-shaped lower rotating brush provided below the precision substrate; By providing the second cleaning liquid tank in contact with the substrate, the precision substrate can be cleaned while the rotating brush for cleaning the substrate is always wet with the cleaning liquid, and the deformation of the brush is prevented.
In addition, the surface of the roll-shaped rotating brush can be corrected on the flat surface of each cleaning liquid tank to maintain the flatness of the brush, and evenly contact the precision substrate, so that a stable cleaning effect can be obtained without uneven cleaning by the roll-shaped rotating brush. At the same time, it is possible to provide an inexpensive cleaning device for semiconductor wafers and the like which can reduce the amount of cleaning liquid to be used as much as possible, significantly improve the cleaning workability, and reduce the running cost.
【図１】本発明に係る半導体等の洗浄処理装置の実施の
形態を示し、（ａ）は側面図、（ｂ）はその平面図であ
る。FIGS. 1A and 1B show an embodiment of a cleaning apparatus for cleaning a semiconductor or the like according to the present invention, wherein FIG. 1A is a side view and FIG.
【図２】従来の半導体等の洗浄処理装置の側面図であ
る。FIG. 2 is a side view of a conventional apparatus for cleaning semiconductors and the like.
１ 精密基板 ２ ローラ ３ 洗浄液 ４ 上部回転ブラシ ５ 下部回転ブラシ ６ 第１洗浄液タンク ６１ 液滴孔 ７ 第２洗浄液タンクDESCRIPTION OF SYMBOLS 1 Precision board 2 Roller 3 Cleaning liquid 4 Upper rotating brush 5 Lower rotating brush 6 First cleaning liquid tank 6 1 Droplet hole 7 Second cleaning liquid tank
Claims (1)
で回転または水平移動自在に保持して、該精密基板の両
面に洗浄液で濡らしたロール状の回転ブラシを接触配備
して、該回転ブラシによって精密基板の表面を刷掃洗浄
する装置において、前記精密基板の上方に配備されるロ
ール状の上部回転ブラシの上方に近接して接触させ、か
つ洗浄液を底面の液滴孔より液滴導出しうる第１洗浄液
タンクを設けると共に、前記精密基板の下方に配備され
るロール状の下部回転ブラシの下方に近接して洗浄液中
にロール状の下部回転ブラシを浸漬させ、内底面に接触
させた第２洗浄液タンクを設けたことを特徴とする半導
体ウエーハ等用洗浄装置。1. A precision substrate such as a semiconductor wafer or the like is held rotatably or horizontally movable in a horizontal state, and a roll-shaped rotary brush wetted with a cleaning liquid is provided on both sides of the precision substrate in contact therewith. In an apparatus for cleaning and cleaning the surface of a precision substrate, a device provided above the precision substrate .
Close contact with the upper part of the upper rotating brush ,
A first cleaning liquid tank capable of discharging a cleaning liquid from a liquid drop hole on a bottom surface, and a cleaning liquid in the cleaning liquid proximate to a lower part of a roll-shaped lower rotating brush provided below the precision substrate.
Roll-shaped lower rotating brush is immersed in, and contacts the inner bottom surface
A cleaning device for a semiconductor wafer or the like, characterized in that the cleaning device is provided with a second cleaning liquid tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9819798A JP2930580B1 (en) | 1998-03-27 | 1998-03-27 | Cleaning equipment for semiconductor wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9819798A JP2930580B1 (en) | 1998-03-27 | 1998-03-27 | Cleaning equipment for semiconductor wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2930580B1 true JP2930580B1 (en) | 1999-08-03 |
| JPH11283951A JPH11283951A (en) | 1999-10-15 |
Family
ID=14213287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9819798A Expired - Fee Related JP2930580B1 (en) | 1998-03-27 | 1998-03-27 | Cleaning equipment for semiconductor wafers |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2930580B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107670898A (en) * | 2017-10-31 | 2018-02-09 | 安徽新辰光学新材料有限公司 | A kind of adjustable accurate control coating machine of coating method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005057109A1 (en) * | 2005-11-26 | 2007-05-31 | Kunze-Concewitz, Horst, Dipl.-Phys. | Continuous wet chemical processing, e.g. cleaning, etching, stripping, coating or drying of flat, thin, fragile substrates comprises transporting and processing substrates using absorbent rollers |
| JP5894490B2 (en) * | 2012-04-13 | 2016-03-30 | 株式会社ディスコ | Grinding equipment |
| JP6609197B2 (en) * | 2016-02-25 | 2019-11-20 | 株式会社ディスコ | Cleaning device |
| JP7100475B2 (en) * | 2018-03-30 | 2022-07-13 | 株式会社ディスコ | Processing equipment |
| CN108296210A (en) * | 2018-04-08 | 2018-07-20 | 湖州嘉和电脑技术服务有限公司 | A kind of display screen processing glass washing device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0193197A (en) * | 1987-10-05 | 1989-04-12 | Fujitsu Ltd | Substrate cleaning mechanism |
| JPH05267259A (en) * | 1992-03-17 | 1993-10-15 | Fujitsu Ltd | Cleaning method for substrate |
| JP3272039B2 (en) * | 1992-07-07 | 2002-04-08 | 松下電器産業株式会社 | Brush cleaning device and brush cleaning method |
-
1998
- 1998-03-27 JP JP9819798A patent/JP2930580B1/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107670898A (en) * | 2017-10-31 | 2018-02-09 | 安徽新辰光学新材料有限公司 | A kind of adjustable accurate control coating machine of coating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11283951A (en) | 1999-10-15 |
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