TWI735686B - 電連接器組件 - Google Patents

電連接器組件 Download PDF

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TWI735686B
TWI735686B TW106136013A TW106136013A TWI735686B TW I735686 B TWI735686 B TW I735686B TW 106136013 A TW106136013 A TW 106136013A TW 106136013 A TW106136013 A TW 106136013A TW I735686 B TWI735686 B TW I735686B
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electrical connector
connector assembly
cover
fan
fan bracket
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TW106136013A
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TW201917962A (zh
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陳銘佑
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鴻騰精密科技股份有限公司
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Priority to US16/167,495 priority patent/US10895594B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB

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Abstract

本發明公開了一種電連接器組件，用於電性連接晶片模組至印刷電路板，包括絕緣基座、第一蓋體、第二蓋體及風扇支架。絕緣基座具有收容腔及凸伸於該收容腔內的導電端子，第一蓋體係樞接於絕緣基座，第二蓋體係樞接於第一蓋體，風扇支架係設於第二蓋體上，風扇支架可供風扇固設。

Description

電連接器組件
本發明係關於一種電連接器組件，尤其是一種晶片模組性能檢測的電連接器組件。
晶片模組在使用前通常需要在電連接器組件中進行燒機(Burn-in)測試，以檢測晶片模組的性能是否達標，並保證在實際工作環境下能夠安全、可靠的運行。
測試晶片模組的電連接器組件一般包括收容有若干導電端子的絕緣基座、樞接在絕緣基座上以鎖固晶片模組的第一蓋體、與第一蓋體相樞接的第二蓋體及一鎖扣裝置。絕緣基座設有收容晶片模組的收容空間。
使用時，首先，將組設在印刷電路板上的電連接器組件處於開啟位置，並將晶片模組放入絕緣基座的收容空間。然後，旋轉第一蓋體及第二蓋體使電連接器組件處於閉合狀態，鎖扣裝置扣持在絕緣基座上，從而實現晶片模組與印刷電路板間的電性連接。
高功率/大瓦數的晶片模組的燒機測試通常於燒機爐內進行，測試溫度較實際運行時的環境溫度要嚴格，並且要預先設定一個適當的測試溫度區間。檢測時，晶片模組上裝有溫度感測元件，位於晶片模組上方的散熱器中裝有熱管。裝設在散熱器上的散熱風扇、溫度感測元件和熱管分別通過柔性線路連接在溫度控制儀上。當電連接器組件的實際測試溫度高於預設溫度區間上限時，溫度控制儀接收自溫度感測元件傳輸的溫度信號後向安裝在散熱器上的散熱風扇發出工作指令，使得實際測試溫度降低到預設溫度區間。當實際測試溫 度低於預設溫度區間下限時，溫度控制儀接收自溫度感測元件傳輸的溫度信號後向安裝在散熱器中的熱管發出加熱工作指令，使得實際測試溫度又回復到預設的溫度區間。
但是，上述電連接器組件至少存在以下不足：風扇散熱時無法均勻散熱，散熱效能較佳，若進行高功率/大瓦數的燒機測試時必須於爐內進行，增加了測試成本。
因此，確有必要提供一種改進的電連接器組件，以克服上述缺陷。
本發明所要解決之技術問題在於：提供一種電連接器組件，尤其是一種晶片模組性能檢測的電連接器組件。
為解決上述技術問題，本發明之技術方案係： 一種電連接器組件，用於電性連接晶片模組至印刷電路板，包括絕緣基座係具有收容腔及凸伸於該收容腔內的導電端子、第一蓋體係樞接於絕緣基座、第二蓋體係樞接於第一蓋體、風扇支架係設於第二蓋體上，所述風扇支架可供風扇固設。
與先前技術相比，本發明之風扇設置於風扇支架相對於散熱器的兩側，可將外界的空氣導入散熱器內進行熱交換後排出，藉由此一氣體流場的空冷作用來達到快速降低散熱器溫度的目的。風扇支架的導流面具有較佳的流體力學設計，不會形成氣體亂流，可高效導引氣流進入散熱器進行熱交換，此一設計使燒機測試可於開放空間下進行，不需於爐內進行燒機，節省下許多測試空間及設備成本。
10:電連接器組件
20:絕緣基座
21:收容腔
22:樞接塊
220:樞接孔
23:凸台
24:扣持部
25:樞接塊
250:樞接孔
26:導電端子
30:第一蓋體
330:組裝孔
34:安裝邊
340:貫穿孔
36:承載部
40:第二蓋體
42:樞接端
44:鎖固端
46:按壓邊
47:彎折部
470:開孔
48:凸翼
48:通槽
49:穿孔
50:鎖扣裝置
52:按壓部
54:連接部
540:連接孔
56:鎖扣部
60:風扇支架
62框架部
620:導流切面
622:螺孔
64:支撐部
640:導流切面
642:螺孔
70:散熱器
80:風扇
101:橫桿
102:樞接桿
103:導桿
104:連桿
105:固定裝置
106:固定裝置
第一圖係符合本發明電連接器組件之立體圖；第二圖係第一圖所示電連接器組件之分解圖；第三圖係第一圖所示電連接器組件之開啟狀態之立體圖；第四圖係第一圖對應之左視圖，其中風扇支架上裝設有風扇。
請參考第一圖至第三圖所示，本發明電連接器組件10，用於連接晶片(未圖示)至電路板(未圖示)，其包括一收容有若干導電端子26的絕緣基座20、一樞接在絕緣基座20上以鎖固晶片模組的第一蓋體30、一與第一蓋體30相樞接的第二蓋體40、一樞接在第二蓋體40的鎖扣裝置50及一設於第二蓋體40上的支架60。
絕緣基座20大體為矩形框體結構，其設有用以容置晶片模組的收容腔21。絕緣基座20一端設有一對彼此隔開一定距離且橫向設有樞接孔220的樞接塊22，絕緣基座20在該兩樞接塊22間設有凸台23，該凸台23的底部中間設有扣持部24。在本實施例中，所述扣持部24為一凹槽。絕緣基座20另一端設有設有一對彼此隔開一定距離且橫向設有樞接孔250的樞接塊25，樞接孔250可供橫桿101穿過。
第一蓋體30是由絕緣材料製成的中空框架結構，其包括可樞軸連接在絕緣基座20上的樞接邊32及與樞接邊32相對的安裝邊34。樞接邊32和安裝邊34共同圍成一容置空間，其四周相對凹設有承載部36。請同時參閱第四圖所示，承載部36用以承載散熱器70，散熱器70包括有金屬鰭片及熱管。樞接邊32兩側設有一對凸耳33，每個凸耳33中央貫通設有組裝孔330。組裝時，透過一樞接桿102依次穿過絕緣基座20的樞接孔220及第一蓋體30的組裝孔330，將第一蓋體30樞接在絕緣基座20上。第一蓋體30的安裝邊34還設有貫穿孔340。
第二蓋體40是由金屬片材製成，其包覆在第一蓋體30的外側，包括樞接端42、與樞接端42相對的鎖固端44以及連接樞接端42與鎖固端44的一對按壓邊46。樞接端42兩側分別向下彎折設有彎折部47，彎折部47上開設有開孔470。通過一導桿103依次穿過第一蓋體30的貫穿孔340與第二蓋體40的開孔470，將第二蓋體40連接在第一蓋體30的安裝邊34上，且第二蓋體40可在一定的範圍內圍繞導桿103相對于第一蓋體30旋轉。第二蓋體40在鎖固端44兩側分別設有一對彎曲凸翼48，凸翼48上分別設有通槽480。第二蓋體40周緣的四個端角設有穿孔49。
鎖扣裝置50包括一傾斜的按壓部52、與按壓部52相連的連接部54及自連接部54縱長底邊向下延伸出的鎖扣部56。連接部54貫穿設有連接孔540。 透過一連桿104穿過鎖扣裝置50的連接孔540及第二蓋體40的通槽480，將鎖扣裝置50樞接在第二蓋體40上。鎖扣部56為兩彼此間隔設置的一對卡鈎，其與絕緣基座20上的扣持部24相扣持，從而將鎖扣裝置50鎖扣在絕緣基座20上，使電連接器組件10鎖定於閉合狀態。
風扇支架60大體為矩形框架結構，其設置於第二蓋體40上，包括框架部62及設於框架部62周緣四個端角的支撐部64。框架部62的兩端外緣設有導流切面620及螺孔622。支撐部64的外緣設有設有導流切面640，支撐部64的導流切面640與框架部62的導流切面620可滑順連接，以形成最佳的氣流引導效果。支撐部64的底部設有螺孔642。組裝時，透過若干固定裝置105，如螺絲依次穿過第二蓋體40的穿孔49而螺鎖入風扇支架60的支撐部64的螺孔642內，而將風扇支架60固設於第二蓋體40上。請同時參閱第四圖所示，透過若干固定裝置106，如螺絲依次穿過風扇80的固定孔(未標示)及框架部62的螺孔622把風扇80固設於風扇支架60相對應的兩端上，兩端的風扇80係一吸氣一排氣以形成一氣體流場。
組裝時，首先，將第一蓋體30透過樞接桿102樞軸連接在絕緣基座20上。其次，將安裝有鎖扣裝置50的第二蓋體40通過導桿103連接在第一蓋體30的安裝邊34上。
使用時，旋轉第一蓋體30及第二蓋體40使電連接器組件10處於開啟狀態，將晶片模組置於絕緣基座20的收容腔21內。然後，將第一蓋體30及第二蓋體40旋轉至水平位置，第二蓋體30壓接在第一蓋體40上，第二蓋體40的彎折部47勾住橫桿101的兩端，而鎖扣裝置50的鎖扣部56扣持在絕緣基座20上，從而第二蓋體40穩定的鎖扣在絕緣基座20上。此時電連接器組件10處於閉合狀態，晶片模組與電連接器組件10的導電端子26抵壓導接，以對該晶片模組進行持續高溫運作以促使有缺陷的晶片模組儘早失效。高溫測試完後，擠壓鎖扣裝置50的按壓部52，鎖扣部56向外旋轉以脫離絕緣基座20。然後向上旋轉第二蓋體40，其彎折部47向外旋轉並脫離絕緣基座20上的橫桿101。繼續旋轉使第二蓋體40及第一蓋體30處於開啟狀態，即電連接器組件10處於完全開啟狀態，便可輕易取出經過測試的晶片模組，從而可對另一個晶片模組進行測試。
本發明的有益效果在於：1)風扇80設置於風扇支架60相對於散熱器70的兩側，可將外界的空氣導入散熱器70內進行熱交換後排出，藉由此一氣體流場的空冷作用來達到快速降低散熱器70溫度的目的。2)風扇支架60的導流面620、640具有較佳的流體力學設計，不會形成氣體亂流，可高效導引氣流進入散熱器70進行熱交換，此一設計使燒機測試可於開放空間下進行，不需於爐內進行燒機，節省下許多測試空間及設備成本。3)此一主控式的散熱設計可達到更均勻更高效的散熱，可應用於700瓦以上大功率的晶片模組的高熱測試環境。
綜上所述，本創作符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本創作之較佳實施例，本創作之範圍並不以上述實施例為限， 舉凡熟習本案技藝之人士援依本創作之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
10:電連接器組件
20:絕緣基座
30:第一蓋體
40:第二蓋體
50:鎖扣裝置
60:風扇支架

Claims (8)

  1. 一種電連接器組件，用於電性連接晶片模組至印刷電路板，其包括：絕緣基座，係具有收容腔及凸伸於該收容腔內的導電端子；第一蓋體，係樞接於絕緣基座；第二蓋體，係樞接於第一蓋體；及風扇支架，係設於第二蓋體上，所述風扇支架可供風扇固設；其中，所述風扇支架的兩端係設有風扇，且所述風扇支架一端的風扇為吸氣作用，所述風扇支架另一端的風扇為排氣作用以形成一氣體流場。
  2. 如請求項1所述之電連接器組件，其中所述第二蓋體上相對位於風扇支架內還設有一散熱器。
  3. 如申請求項1所述之電連接器組件，其中所述風扇支架包括框架部及設於框架部周緣四個端角的支撐部，所述支撐部設於第二蓋體上。
  4. 如請求項3所述之電連接器組件，其中所述風扇支架的支撐部底端設有螺孔，所述螺孔可供風扇支架螺設於第二蓋體。
  5. 如請求項3所述之電連接器組件，其中所述框架部的兩端外緣設有導流切面。
  6. 如請求項5所述之電連接器組件，其中所述支撐部的外緣設有導流切面。
  7. 如請求項6所述之電連接器組件，其中所述框架部的導流切面與支撐部的導流切面係滑順連接。
  8. 如請求項3所述之電連接器組件，其中所述框架部的外緣設有螺 孔，所述螺孔可供風扇螺設於風扇支架上。
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