TWI712805B - Handler for testing electronic devices - Google Patents

Handler for testing electronic devices Download PDF

Info

Publication number
TWI712805B
TWI712805B TW107142462A TW107142462A TWI712805B TW I712805 B TWI712805 B TW I712805B TW 107142462 A TW107142462 A TW 107142462A TW 107142462 A TW107142462 A TW 107142462A TW I712805 B TWI712805 B TW I712805B
Authority
TW
Taiwan
Prior art keywords
test
chamber
tray
electronic components
soaking
Prior art date
Application number
TW107142462A
Other languages
Chinese (zh)
Other versions
TW201930903A (en
Inventor
金祚熙
金東一
金元熙
Original Assignee
韓商泰克元股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 韓商泰克元股份有限公司 filed Critical 韓商泰克元股份有限公司
Publication of TW201930903A publication Critical patent/TW201930903A/en
Application granted granted Critical
Publication of TWI712805B publication Critical patent/TWI712805B/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本發明涉及一種電子部件測試用分選機。根據本發明的電子部件測試用分選機中，在開閉測試腔室的第一出入口的開閉裝置開放所述第一出入口後封閉所述第一出入口之前，將載有完成測試的電子部件的測試托盤從測試腔室搬出，並將載有需要測試的電子部件的測試托盤搬入測試腔室。根據本發明，具有可以最小化測試腔室的溫度環境的損失並提高處理容量的效果。The invention relates to a sorting machine for testing electronic components. In the sorting machine for testing electronic components according to the present invention, before the opening and closing device that opens and closes the first port of the test chamber opens the first port and then closes the first port, the test of the electronic component that has been tested is carried The tray is moved out of the test chamber, and the test tray containing the electronic components to be tested is moved into the test chamber. According to the present invention, it is possible to minimize the loss of the temperature environment of the test chamber and increase the processing capacity.

Description

電子部件測試用分選機Sorting machine for electronic component testing

本發明涉及一種電子部件測試用分選機。The invention relates to a sorting machine for testing electronic components.

生產的電子部件在被測試器測試之後分為良品和次品，並且只有良品被出廠。After being tested by the tester, the produced electronic components are divided into good and defective products, and only good products are shipped.

測試器與電子部件的電連接通過電子部件測試用分選機（以下稱為「分選機」）進行，並且根據電子部件的種類而包括多種形態的分選機。其中本發明涉及一種應用能夠堆載多個電子部件的測試托盤的分選機。The electrical connection between the tester and the electronic components is performed by a sorting machine for testing electronic components (hereinafter referred to as "sorting machine"), and various types of sorting machines are included depending on the type of electronic component. Among them, the present invention relates to a sorting machine using a test tray capable of stacking a plurality of electronic components.

應用測試托盤的分選機有包括韓國公開專利10-2013-0105104號等的多樣的形態，通常如圖1的示意性平面圖所示，包括裝載裝置110、均熱腔室（Soak Chamber）120、測試腔室130、連接裝置140、散熱腔室（Desoak Chamber）150及卸載裝置160。The sorting machine using test trays has various forms including Korean Patent No. 10-2013-0105104, etc., usually as shown in the schematic plan view of FIG. 1, including a loading device 110, a soak chamber (Soak Chamber) 120, The test chamber 130, the connection device 140, the heat dissipation chamber (Desoak Chamber) 150, and the unloading device 160.

裝載裝置110將堆載於客托盤CT1 的需要測試的電子部件裝載（loading）至位於裝載位置（LOADING POSITION）LP 的測試托盤TT。The loading device 110 loads the electronic components that need to be tested stacked on the passenger tray CT 1 to the test tray TT located at the loading position (LOADING POSITION) LP.

均熱腔室120用於在對被堆載於收容的測試托盤TT的電子部件進行測試之前根據測試溫度而施加熱刺激而預先調節溫度（預熱或預冷）。The soaking chamber 120 is used to apply a thermal stimulus according to the test temperature to adjust the temperature in advance (preheating or pre-cooling) before testing the electronic components stacked on the stored test tray TT.

測試腔室130為了對在均熱腔室120預熱/預冷後被移送至測試位置（TEST POSITION）TP的測試托盤TT的電子部件進行測試而配備。即，測試腔室130提供用於將被堆載於收容的測試托盤TT的電子部件的溫度維持在測試溫度條件的溫度環境。The test chamber 130 is provided for testing the electronic components of the test tray TT transferred to the test position (TEST POSITION) TP after the soaking chamber 120 is preheated/pre-cooled. That is, the test chamber 130 provides a temperature environment for maintaining the temperature of the electronic components stacked on the stored test tray TT at the test temperature condition.

連接裝置140將堆載於測試位置TP的測試托盤TT的電子部件電連接到測試器。The connecting device 140 electrically connects the electronic components of the test tray TT stacked on the test position TP to the tester.

散熱腔室150被配置為，使在從測試腔室130被移送過來的測試托盤TT上裝載的電子部件恢復至室溫或卸載時沒有問題的程度的預定溫度。The heat dissipation chamber 150 is configured to restore the electronic components loaded on the test tray TT transferred from the test chamber 130 to room temperature or a predetermined temperature at which there is no problem during unloading.

卸載裝置160從位於卸載位置（UNLOADING POSITION）UP的測試托盤TT卸載（unloading）電子部件，並將電子部件按測試等級分類，進而使其移動至空的客托盤CT2 。The unloading device 160 unloads the electronic components from the test tray TT located at the unloading position (UNLOADING POSITION) UP, classifies the electronic components according to the test level, and moves them to the empty passenger tray CT 2 .

如前述，測試托盤TT沿著經由裝載位置LP、測試位置TP及卸載位置UP而再次連接到裝載位置LP的循環路徑CC而循環，為此，未示出的多個移送器在形成循環路徑CC的各個區間內移送測試托盤TT。As mentioned above, the test tray TT circulates along the circulation path CC that is connected to the loading position LP again via the loading position LP, the test position TP, and the unloading position UP. For this reason, a plurality of unshown conveyors are forming the circulation path CC. Transfer the test tray TT in each section.

另外，圖1所示的分選機100具有在均熱腔室110和散熱腔室150之間設置測試腔室130的結構以及沿著封閉的循環路徑CC而移送測試托盤TT的結構，因此考慮到設備的寬度或高度，難以配備四個以上的測試窗TW。在此，測試窗TW表示電子部件與測試器TESTER電連接的窗，一個測試窗TW對應於一個測試托盤TT。顯然，測試器TESTER通過測試窗TW與分選機100結合。因此，能夠在一次進行測試的電子部件限定於裝載於1至3個測試托盤TT的數量，這使無法無限擴張大小的分選機100具有處理容量限制。In addition, the sorting machine 100 shown in FIG. 1 has a structure in which a test chamber 130 is provided between the soaking chamber 110 and the heat dissipation chamber 150, and a structure in which the test tray TT is transferred along the closed circulation path CC, so it is considered It is difficult to equip more than four test windows TW depending on the width or height of the equipment. Here, the test window TW indicates a window through which the electronic component is electrically connected to the tester TESTER, and one test window TW corresponds to one test tray TT. Obviously, the tester TESTER is combined with the sorting machine 100 through the test window TW. Therefore, the number of electronic components that can be tested at one time is limited to the number loaded on 1 to 3 test trays TT, which limits the processing capacity of the sorting machine 100 that cannot be expanded infinitely.

因此，本發明的申請人在當前未公開的韓國專利申請10-2017-000080號中，提出了關於如下新概念的分選機的技術（以下稱為「現有技術」）：配備有能夠使測試托盤移動的移動腔室，從而能夠大幅度地擴張處理容量。Therefore, the applicant of the present invention, in the currently unpublished Korean Patent Application No. 10-2017-000080, proposed the following new concept of sorting machine technology (hereinafter referred to as "prior art"): equipped with The moving chamber in which the tray moves can greatly expand the processing capacity.

[發明所欲解決的問題] 本發明的目的在於提供如下的技術，在將根據現有技術的分選機繼承並發展而將移動腔室實現為均熱腔室的情況下，能夠減少使測試托盤從相應均熱腔室移動至測試腔室，並使測試托盤從測試腔室移動至相應均熱腔室的整體時間。[Problems to be Solved by the Invention] The purpose of the present invention is to provide a technology that can reduce the number of test trays when the mobile chamber is implemented as a soaking chamber by inheriting and developing a sorting machine according to the prior art. The overall time for moving from the corresponding soaking chamber to the test chamber and moving the test tray from the test chamber to the corresponding soaking chamber.

[用以解決問題的技術手段] 根據本發明的電子部件測試用分選機包括：裝載裝置，將載於客托盤的電子部件裝載於位於裝載位置的測試托盤；第一均熱腔室，在收容通過所述裝載裝置而載有電子部件的測試托盤後向電子部件施加熱刺激；測試腔室，收容經由所述第一均熱腔室而來的測試托盤，提供能夠測試收容的測試托盤的電子部件的溫度環境，並具有能夠使測試托盤出入的第一出入口；連接裝置，將被收容於所述測試腔室的測試托盤的電子部件電連接到測試器；開閉裝置，開閉所述測試腔室的所述第一出入口；卸載裝置，從在從所述測試腔室搬出後移動到卸載位置的測試托盤卸載完成測試的電子部件；及傳遞裝置，為了在從所述第一均熱腔室移動至所述測試腔室的過程中，或者從所述測試腔室移動至所述卸載位置的過程中傳遞測試托盤而配備，其中所述傳遞裝置包括：第二均熱腔室，在收容從所述第一均熱腔室接收的測試托盤之後，維持所述第一均熱腔室向電子部件施加的熱刺激，並具有能夠使所述測試托盤出入的第二出入口；開閉器，開閉所述第二均熱腔室的所述第二出入口；堆載塊，能夠堆載從所述測試腔室搬出的測試托盤，並以與所述第二均熱腔室結合為一體的方式配備；移動器，使所述第二均熱腔室移動，以使所述第二均熱腔室位於所述第一均熱腔室或所述測試腔室的一側，其中所述電子部件測試用分選機還包括：供應器，將測試托盤從所述第二均熱腔室供應至所述測試腔室；回收器，從所述測試腔室向所述堆載塊回收測試托盤，當所述第二均熱腔室位於所述測試腔室的一側時，所述第一出入口和所述第二出入口以彼此隔開而相向的方式形成，在所述開閉裝置開放所述第一出入口後關閉所述第一出入口之前，所述供應器和所述回收器運行而將裝有完成測試的電子部件的測試托盤經由所述第一出入口而回收至所述堆載塊，並將裝有需要測試的電子部件的測試托盤依次經由所述第二出入口和第一出入口而供應至所述測試腔室，從而在一次運行所述開閉裝置時能夠實現所述測試腔室和所述傳遞裝置之間的測試托盤的交換。[Technical Means to Solve the Problem] The sorting machine for testing electronic components according to the present invention includes: a loading device for loading the electronic components loaded on the passenger tray on the test tray at the loading position; and the first soaking chamber in After accommodating the test tray loaded with electronic components through the loading device, thermal stimulus is applied to the electronic components; a test chamber, accommodating the test tray from the first soaking chamber, and providing a test tray capable of testing the accommodated test tray The temperature environment of the electronic component, and has a first inlet and outlet that can allow the test tray to enter and exit; a connecting device, which electrically connects the electronic component of the test tray contained in the test chamber to the tester; an opening and closing device, which opens and closes the test chamber The first entrance and exit of the chamber; an unloading device for unloading the electronic components that have completed the test from the test tray moved to the unloading position after being unloaded from the test chamber; and a transfer device for removing the electronic components from the first soaking chamber During the process of moving to the test chamber, or during the process of moving from the test chamber to the unloading position, the test tray is transferred and equipped, wherein the transfer device includes: a second soaking chamber, After the first soaking chamber receives the test tray, it maintains the thermal stimulus applied to the electronic components by the first soaking chamber, and has a second entrance and exit that can allow the test tray to enter and exit; a shutter, an opening and closing station The second entrance and exit of the second soaking chamber; a stacking block capable of stacking test trays carried out from the test chamber, and is equipped in an integrated manner with the second soaking chamber; A mover to move the second soaking chamber so that the second soaking chamber is located on one side of the first soaking chamber or the test chamber, wherein the electronic component is used for testing The sorting machine also includes: a supply device that supplies test trays from the second soaking chamber to the test chamber; a recovery device that recovers test trays from the test chamber to the stacking block, when all When the second soaking chamber is located on one side of the test chamber, the first port and the second port are formed spaced apart and opposed to each other, and the opening and closing device opens the first port After closing the first port, the supply and the recovery device are operated to retrieve the test tray containing the electronic components that have been tested to the stacking block through the first port and the The test trays of the electronic components to be tested are sequentially supplied to the test chamber via the second port and the first port, so that the test chamber and the transfer device can be exchanged when the opening and closing device is operated once. The exchange of test trays between.

所述測試腔室和所述連接裝置配備為多個，所述測試腔室中的至少一個與所述第一均熱腔室相隔，所述移動器能夠使所述第二均熱腔室位於各個所述測試腔室的一側。The test chamber and the connecting device are provided in multiples, at least one of the test chambers is separated from the first soaking chamber, and the mover can position the second soaking chamber One side of each of the test chambers.

為了最小化所述測試腔室內的溫度環境的損失，在所述測試腔室和所述傳遞裝置之間進行測試托盤的交換時，所述供應器所運行的時間區間和所述回收器所運行的時間區間的至少一部分重疊，並且，借助所述供應器的測試托盤的移動線和借助所述回收器的測試托盤的移動線彼此隔開。In order to minimize the loss of the temperature environment in the test chamber, when the test tray is exchanged between the test chamber and the transfer device, the operating time interval of the supplier and the operating time of the recovery device At least a part of the time interval overlaps, and the movement line of the test tray by the supplier and the movement line of the test tray by the recycler are separated from each other.

所述堆載塊配備於所述第二均熱腔室的上側。The stacking block is arranged on the upper side of the second soaking chamber.

[發明的功效] 根據本發明，具有如下效果。[Effects of Invention] According to the present invention, there are the following effects.

第一，由於測試托盤從測試腔室移動至第二均熱腔室的時間和使測試托盤從第二均熱腔室移動至測試腔室的時間重疊，從而能夠最小化測試腔室的溫度環境的損失。First, since the time for the test tray to move from the test chamber to the second soaking chamber and the time for the test tray to move from the second soaking chamber to the test chamber overlap, the temperature environment of the test chamber can be minimized Loss.

第二，由於向測試腔室供應測試托盤並回收測試托盤的動作以交換方式實現，從而能夠相應地節省時間，因此可以提高處理容量。Second, since the supply of test trays to the test chamber and the recovery of the test trays are realized in an exchange manner, time can be saved accordingly, and the processing capacity can be increased.

參照附圖對根據本發明的較佳實施例進行說明，為了說明的簡潔，盡可能省略或壓縮對於在在先專利申請10-2017-000080號中公開的內容、公知的技術或說明中重複或相同的構成的說明。The preferred embodiments of the present invention are described with reference to the accompanying drawings. For the sake of brevity of the description, the content disclosed in the prior patent application No. 10-2017-000080, the known technology or the description is repeated or repeated as much as possible. Explanation of the same composition.

＜對於構成的說明＞＜Description of composition＞

圖2是對於根據本發明的電子部件測試用分選機（以下簡稱為「分選機」）200的示意性平面圖。2 is a schematic plan view of a sorting machine for testing electronic components (hereinafter referred to as "sorting machine") 200 according to the present invention.

根據本實施例的分選機200包括供應部分SP、裝載裝置210、識別器DA、驅動測試器DT、第一緩衝器B1、第一開放裝置220、第一均熱腔室230、8個測試腔室TC、8個連接裝置CA、8個開閉裝置OC、散熱腔室240、卸載裝置250、第二緩衝器B2、第二開放裝置260、回收部分RP、傳遞裝置270、供應器280及回收器290。 The sorting machine 200 according to this embodiment includes a supply part SP, a loading device 210, an identifier DA, a drive tester DT, a first buffer B1, a first opening device 220, a first soaking chamber 230, and 8 tests. Chamber TC, 8 connecting devices CA, 8 opening and closing devices OC, heat dissipation chamber 240, unloading device 250, second buffer B2, second opening device 260, recovery part RP, transfer device 270, supplier 280 and recovery器290.

供應部分SP供應需要測試的電子部件。這種供應部分SP可以體現為多種形態，但是在本實施例中，採用將用於搬運裝載有要測試的電子部件的客托盤CT1的貨車TM安裝的方式，裝載於貨車TM的客托盤CT1被每次一張地依次供應。 Part of the supply SP supplies electronic components that need to be tested. Such a supply part SP can be embodied in various forms. However, in this embodiment, a truck TM for transporting a passenger pallet CT 1 loaded with electronic components to be tested is installed, and the passenger pallet CT of the truck TM is installed. 1 is sequentially supplied one sheet at a time.

裝載裝置210抓持從供應部分SP提供的在客托盤CT1上載著的電子部件之後最終裝載到位於裝載位置LP的測試托盤TT。 The loading device 210 grasps the electronic components provided from the supply part SP and loaded on the passenger tray CT 1 and finally loads them on the test tray TT located at the loading position LP.

識別器DA在需要單獨管理電子部件的情況下配備，並且只要配備成可以根據識別符而讀取相應識別符的讀取器即可。例如，在識別符為條碼的情況下，讀取器配備成能夠讀取條碼的條碼讀取器(或用於拍攝條碼的攝像頭)。本實施例的識別器DA在電子部件被裝載裝置210抓持的狀態下讀取識別符。因此，在將電子部件裝載到測試托盤TT的過程中，裝載裝置210以經由識別器DA的方式運行。 The recognizer DA is equipped when it is necessary to separately manage electronic components, and it only needs to be equipped with a reader that can read the corresponding identifier based on the identifier. For example, in the case where the identifier is a barcode, the reader is equipped with a barcode reader capable of reading the barcode (or a camera for photographing the barcode). The identifier DA of this embodiment reads the identifier in a state where the electronic component is grasped by the loading device 210. Therefore, in the process of loading the electronic components on the test tray TT, the loading device 210 operates in a manner via the identifier DA.

驅動測試器DT為了簡單地測試電子部件是否借助電源的施加而運行而配備。為了借助這種驅動測試器DT而進行電子部件的驅動測試，較佳是配備單獨的測試框架TF和開放器OD。在本實施例中，為了提高處理容量，將測試框架TF和開放器OD在驅動測試器DT的兩側分別配備作為一對。並且，測試托盤TF沿著左右方向移動，從而能夠選擇性地位於供需區域RA和測試區域TA，並且開放器OD以固定於供需區域RA的方式配備。 The drive tester DT is provided for simply testing whether the electronic components are operated by the application of power. In order to carry out the drive test of the electronic component by means of this drive tester DT, it is preferable to equip a separate test frame TF and an opener OD. In this embodiment, in order to increase the processing capacity, the test frame TF and the opener OD are provided as a pair on both sides of the drive tester DT. In addition, the test tray TF moves in the left-right direction so as to be selectively located in the supply and demand area RA and the test area TA, and the opener OD is equipped to be fixed to the supply and demand area RA.

為了驅動測試，裝載裝置210在將電子部件裝載到測試托盤TT之前首先將電子部件堆載到借助開放器OD開放的測試框架TF。 In order to drive the test, the loading device 210 first stacks the electronic components on the test frame TF opened by the opener OD before loading the electronic components on the test tray TT.

如果電子部件都被堆載到測試框架TF，則測試框架TF向測試區域TA移動而實現借助驅動測試器DT的驅動測試。此時，裝載裝置210將電子部件堆載到另一側的測試框架TF。 If the electronic components are all stacked on the test frame TF, the test frame TF moves to the test area TA to realize the drive test by the drive tester DT. At this time, the loading device 210 stacks the electronic components on the test frame TF on the other side.

如果驅動測試結束，則測試框架TF回到供需區域RA，且開放器OD開放測試框架TF。並且，裝載裝置210從測試框架TF抓持電子部件而裝載到測試托盤TT。此時，使在驅動測試中判斷為次品的電子部件移動至第一緩衝器B1。 If the driving test ends, the test framework TF returns to the supply and demand area RA, and the opener OD opens the test framework TF. In addition, the loading device 210 grips the electronic component from the test frame TF and loads it on the test tray TT. At this time, the electronic components judged to be defective in the drive test are moved to the first buffer B1.

第一緩衝器B1為了堆載在驅動測試中判斷為次品的電子部件而配備。 The first buffer B1 is provided for stacking electronic components judged to be defective in the drive test.

第一開放裝置220將位於裝載位置LP的測試托盤TT開放，以使裝載裝置210將電子部件裝載於位於裝載位置LP的測試托盤TT。 The first opening device 220 opens the test tray TT located at the loading position LP, so that the loading device 210 loads the electronic components on the test tray TT located at the loading position LP.

第一均熱腔室230被配置為在收容通過裝載裝置210而裝有電子部件的測試托盤後向電子部件施加熱刺激。在此，熱刺激不僅加熱電子部件的情形，還包括冷卻電子部件的情形。 The first soaking chamber 230 is configured to apply thermal stimulation to the electronic components after accommodating the test tray loaded with the electronic components by the loading device 210. Here, thermal stimulation not only heats electronic components, but also includes cooling electronic components.

8個測試腔室TC以每組4個的方式分配，並隔著傳遞裝置270而在第一均熱腔室230和散熱腔室240的後方沿著前後方向並排佈置。各個測試腔室TC收容經由第一均熱腔室230及傳遞裝置270而來的測試托盤TT，並提供能夠測試收容的測試托盤TT的電子部件的溫度環境。如圖3的局部圖所示，上述的測試腔室TC分別具有朝向傳遞裝置270側而形成的第一出入口I/O1。顯然，測試托盤TT通過第一出入口I/O1被搬入測試腔室TC或從測試腔室TC搬出。在此，可知測試腔室TC與第一均熱腔室230相隔，根據實施方式，位於第一均熱腔室230的直接的後方的測試腔室TC可以以與第一均熱腔室230沿著前後方向結合的方式配備，但至少剩餘測試腔室TC無法以與第一均熱腔室230結合的方式配備。即，這是由於本發明採用如下方式：第一均熱腔室230和測試腔室TC相隔地配備而在測試托盤TT無法在第一均熱腔室230和測試腔室TC之間直接移動的情況下，最大程度地 保存向電子部件施加的熱刺激而將電子部件從第一均熱腔室230向測試腔室TC傳遞。 The eight test chambers TC are allocated in a group of four, and are arranged side by side in the front-rear direction behind the first soaking chamber 230 and the heat dissipation chamber 240 via the transfer device 270. Each test chamber TC accommodates the test tray TT passing through the first soaking chamber 230 and the transfer device 270, and provides a temperature environment capable of testing the electronic components of the accommodated test tray TT. As shown in the partial view of FIG. 3, the above-mentioned test chambers TC respectively have first inlets and outlets I/O1 formed toward the transmission device 270 side. Obviously, the test tray TT is moved into or out of the test chamber TC through the first port I/O1. Here, it can be seen that the test chamber TC is separated from the first soaking chamber 230. According to the embodiment, the test chamber TC located directly behind the first soaking chamber 230 may be adjacent to the first soaking chamber 230. It is equipped in a front-to-back combination, but at least the remaining test chambers TC cannot be equipped in a combination with the first soaking chamber 230. That is, this is because the present invention adopts the following method: the first soaking chamber 230 and the test chamber TC are provided separately, and the test tray TT cannot directly move between the first soaking chamber 230 and the test chamber TC Situation, maximally The thermal stimulus applied to the electronic component is stored and the electronic component is transferred from the first soaking chamber 230 to the test chamber TC.

對應於每個測試腔室TC而配備有一個連接裝置CA，且連接裝置CA將被收容於測試腔室TC的測試托盤TT的電子部件電連接到測試器，當測試結束時，為了搬出測試托盤TT而使測試托盤TT上升。關於上述連接裝置CA的技術在本案申請人的韓國專利申請10-2017-0160905號中被命名為加壓裝置而詳細地描述，因此省略詳細的說明。 A connection device CA is provided corresponding to each test chamber TC, and the connection device CA electrically connects the electronic components of the test tray TT contained in the test chamber TC to the tester, and when the test is over, in order to remove the test tray TT raises the test tray TT. The technology of the above-mentioned connecting device CA is named as a pressurizing device in Korean Patent Application No. 10-2017-0160905 of the applicant of this case and described in detail, so detailed description is omitted.

開閉裝置OC對應於每個測試腔室TC而配備，因此總共為8個，並且如圖3所示，分別配備氣缸C和門D。因此，門D根據氣缸C的運行狀態而開放或關閉第一出入口I/O1。 The opening and closing device OC is equipped corresponding to each test chamber TC, so there are 8 in total, and as shown in FIG. 3, the cylinder C and the door D are respectively equipped. Therefore, the door D opens or closes the first port I/O1 according to the operating state of the cylinder C.

均熱腔室240收容載有完成測試的電子部件的測試托盤TT，並使測試托盤TT的電子部件恢復到常溫或接近常溫，從而能夠使日後的借助卸載裝置250的卸載作業能夠適當地進行，並且可以防止電子部件的損傷。顯然，在僅通過暴露於常溫也能夠從電子部件充分去除熱刺激的情況下，無須構成散熱腔室240。 The soaking chamber 240 accommodates the test tray TT carrying the electronic components that have been tested, and restores the electronic components of the test tray TT to normal temperature or close to normal temperature, so that future unloading operations by the unloading device 250 can be performed appropriately. And can prevent damage to electronic components. Obviously, in the case where the thermal stimulus can be sufficiently removed from the electronic component only by exposure to normal temperature, the heat dissipation chamber 240 does not need to be formed.

卸載裝置250將從測試腔室TC被搬出之後經由傳遞裝置270及散熱腔室240而移動到卸載位置UP的測試托盤TT卸載完成測試的電子部件。此時，卸載裝置250可以按照根據測試結果的等級來卸載電子部件，並且 對於需要重新測試(Retest)的電子部件而言，將其移動至第二緩衝器B2。 The unloading device 250 unloads the electronic components that have completed the test from the test tray TT moved to the unloading position UP via the transfer device 270 and the heat dissipation chamber 240 after being carried out of the test chamber TC. At this time, the unloading device 250 may unload the electronic components according to the level according to the test result, and For electronic components that need to be retested, move them to the second buffer B2.

第二緩衝器B2為了堆載需要重新測試的電子部件而配備。 The second buffer B2 is equipped for stacking electronic components that need to be retested.

第二開放裝置260開放位於卸載位置UP的測試托盤TT，從而能夠借助卸載裝置250而從相應測試托盤TT卸載完成測試的電子部件。 The second opening device 260 opens the test tray TT located at the unloading position UP, so that the electronic components that have been tested can be unloaded from the corresponding test tray TT by means of the unloading device 250.

回收部分RP提供能夠裝入完成測試的電子部件的空的客托盤CT2，從而回收完成測試的電子部件。即，卸載裝置250在從位於卸載位置UP的測試托盤TT卸載電子部件之後使其移動至回收部分RP所提供的空的客托盤CT2。為此，如本實施例，在回收部分RP可以配備有能夠收容客托盤CT2的多個堆疊器SK。 The recycling part RP provides an empty passenger tray CT 2 that can be loaded with electronic components that have been tested, so that the electronic components that have been tested can be recovered. That is, after unloading the electronic components from the test tray TT located in the unloading position UP, the unloading device 250 moves it to the empty passenger tray CT 2 provided by the recovery part RP. For this reason, as in the present embodiment, a plurality of stackers SK capable of accommodating the passenger tray CT 2 may be equipped in the recovery part RP.

傳遞裝置270被配置為，在從第一均熱腔室230移動至測試腔室TC的過程或者為了從測試腔室TC移動至作為最終目的地的卸載位置UP而向散熱腔室250移動的過程中，傳遞測試托盤TT。這種傳遞裝置270包括第二均熱腔室271、一對開閉器272、堆疊塊273以及移動器274。 The transfer device 270 is configured to move from the first soaking chamber 230 to the test chamber TC or to move to the heat dissipation chamber 250 in order to move from the test chamber TC to the unloading position UP as the final destination. In, transfer the test tray TT. This transfer device 270 includes a second soaking chamber 271, a pair of shutters 272, a stacking block 273, and a mover 274.

第二均熱腔室271收容從第一均熱腔室230接收的測試托盤TT，並維持第一均熱腔室230向電子部件271施加的熱刺激。為此，第二均熱腔室271的內部組成為用於維持電子部件的熱刺激或將未得到充分熱刺激的電子部件同化為根據測試條件的溫度的溫度環境。如圖 4的局部圖所示，上述的第二均熱腔室271在左右兩側具有朝向測試腔室TC側而形成的第二出入口I/O2，測試托盤TT通過所述第二出入口I/O2被搬入第二均熱腔室271，或者從第二均熱腔室271搬出。 The second soaking chamber 271 accommodates the test tray TT received from the first soaking chamber 230 and maintains the thermal stimulation applied by the first soaking chamber 230 to the electronic component 271. For this reason, the internal composition of the second soaking chamber 271 is used to maintain the thermal stimulation of the electronic components or to assimilate electronic components that have not received sufficient thermal stimulation into a temperature environment according to the temperature of the test condition. As shown As shown in the partial view of 4, the second soaking chamber 271 has second inlets I/O2 formed toward the test chamber TC on the left and right sides, and the test tray TT is covered by the second inlet I/O2. Carry into the second soaking chamber 271, or carry out from the second soaking chamber 271.

如前述的第二均熱腔室271向前後移動，從而可以選擇性地位於各個測試腔室TC的一側。因此，如果第二均熱腔室271位於測試腔室TC的一側，則第一出入口I/O1和第二出入口I/O2彼此隔開而相向，從而測試托盤TT通過第一出入口I/O1和第二出入口I/O2而從第二均熱腔室271向測試腔室TC移動。 As mentioned above, the second soaking chamber 271 moves forward and backward so as to be selectively located on one side of each test chamber TC. Therefore, if the second soaking chamber 271 is located at one side of the test chamber TC, the first port I/O1 and the second port I/O2 are spaced apart and face each other, so that the test tray TT passes through the first port I/O1. And the second inlet and outlet I/O2 move from the second soaking chamber 271 to the test chamber TC.

一對開閉器272與開閉裝置OC具有實質上相同的構成，並分別開閉位於左右側的第二出入口I/O2。 The pair of shutters 272 have substantially the same structure as the opening and closing device OC, and respectively open and close the second inlet and outlet I/O2 located on the left and right sides.

堆載塊273配備於第二均熱腔室271的上側，並且可以堆載從測試腔室TC搬出的測試托盤TT。這種堆載塊273以與第二均熱腔室結合為一體的方式配備，從而與第二均熱腔室271一起沿前後方向移動。本實施例中，堆載塊273構成為包括前後左右四個方向開放四邊形框架SF和將測試托盤TT支撐並引導的支撐軌道SR，但是根據實施方式，可以用具有開閉門的殼體代替四邊形框架而以腔室形態配備。在配備為腔室形態的情況下，還可以具有用於去除施加到電子部件的熱刺激的功能。 The stacking block 273 is provided on the upper side of the second soaking chamber 271, and can stack the test tray TT carried out from the test chamber TC. Such a stacking block 273 is equipped in an integrated manner with the second soaking chamber, so that it moves in the front-to-rear direction together with the second soaking chamber 271. In this embodiment, the stacking block 273 is configured to include a quadrilateral frame SF that is open in four directions, front, back, left, and right, and a support rail SR that supports and guides the test tray TT, but according to the embodiment, a housing with an opening and closing door may be used instead of the quadrilateral frame It is equipped with a chamber form. In the case of being equipped with a chamber form, it may also have a function for removing thermal stimulation applied to electronic components.

移動器274以使第二均熱腔室271位於第一均熱腔室230或測試腔室TC的一側的方式使第二均熱腔室271沿前後方向移動。 The mover 274 moves the second soaking chamber 271 in the front-rear direction in such a way that the second soaking chamber 271 is located at one side of the first soaking chamber 230 or the test chamber TC.

供應器280從第二均熱腔室271向測試腔室TC供應測試托盤TT。 The supplier 280 supplies the test tray TT from the second soaking chamber 271 to the test chamber TC.

回收器290從測試腔室TC向堆載塊273回收測試托盤TT。 The recoverer 290 recovers the test tray TT from the test chamber TC to the stacking block 273.

在本實施例中採用了如下的方式：構成為供應器280配備於第二均熱腔室271且回收器290安裝於堆載塊273的結構，因此供應器280和回收器290與第一均熱腔室271及堆載塊273一起沿前後方向移動。但是，根據實施方式，可以採用對應於每個測試腔室TC而配備供應器280和回收器290的示例。 In this embodiment, the following method is adopted: the structure in which the supplier 280 is equipped in the second soaking chamber 271 and the collector 290 is installed in the stacking block 273, so the supplier 280 and the collector 290 are the same as the first. The thermal chamber 271 and the stacking block 273 move together in the forward and backward directions. However, according to the embodiment, an example in which the supplier 280 and the recoverer 290 are provided corresponding to each test chamber TC may be adopted.

<對於運行的說明> <Explanation for operation>

以下，對上述的分選機200的運行進行說明。 Hereinafter, the operation of the aforementioned sorting machine 200 will be described.

如果成堆的客托盤CT1與貨車TM一同安裝於供應部分SP，則為了電子部件的裝載作業而以每次供應一張客托盤CT1的方式按序地供應客托盤CT1。 If the passenger piles 1 and CT tray truck mounted together supply portion TM SP, then the loading operation for the electronic component at a time and one off the supply tray CT Embodiment 1 sequentially supplied off a tray CT.

裝載裝置210在從客托盤CT1抓持需要測試的電子部件之後經由識別器DA而堆載於位於供需區域RA的測試框架TF。在此過程中，電子部件借助識別器DA而被分別識別。 The loading device 210 grasps the electronic component to be tested from the passenger tray CT 1 and then stacks it on the test frame TF located in the supply and demand area RA via the identifier DA. In this process, the electronic components are individually identified by the identifier DA.

如果電子部件都被載於測試托盤TF，則在測試框架TF向測試區域TA移動的狀態下，電子部件和驅動測試器DT電連接。並實施驅動測試。 If the electronic components are all loaded on the test tray TF, the electronic components and the drive tester DT are electrically connected in a state where the test frame TF moves to the test area TA. And implement drive test.

如果完成測試，則測試框架TF回到供需區域RA，裝載裝置210從測試框架TF抓持電子部件而裝載到位於裝載位置LP的測試托盤TT。此時，將在驅動測試中判斷為次品的電子部件分離到第一緩衝器B1。 If the test is completed, the test frame TF returns to the supply and demand area RA, and the loading device 210 grabs the electronic component from the test frame TF and loads it onto the test tray TT at the loading position LP. At this time, the electronic components judged to be defective in the drive test are separated to the first buffer B1.

如果電子部件都被載於位於裝載位置LP的測試托盤TT，則測試托盤TT被收容到後方的第一均熱腔室230。因此，向載於測試托盤TT的電子部件施加熱刺激。並且，如果測試托盤TT向在第一均熱腔室230的右側等待的第二均熱腔室271移動，則第二均熱腔室271向後方移動而置於要求載有要測試的電子部件的測試托盤TT的測試腔室TC的一側。在此狀態下，開閉裝置OC和開閉器272運行而使第一出入口I/O1和第二出入口I/O2開放。接著，供應器280運行而使測試托盤TT從均熱腔室271移動至測試腔室TC。此時，如果不是分選機200的運行初期步驟，則在測試腔室TC內已收容有載有已經完成測試的電子部件的測試托盤TT。對此，參照圖5進行更詳細的說明。 If the electronic components are all loaded on the test tray TT at the loading position LP, the test tray TT is stored in the first soaking chamber 230 at the rear. Therefore, thermal stimulation is applied to the electronic components mounted on the test tray TT. Also, if the test tray TT moves to the second soaking chamber 271 waiting on the right side of the first soaking chamber 230, the second soaking chamber 271 moves backward and is placed where the electronic components to be tested are required to be loaded. The test tray TT is on the side of the test chamber TC. In this state, the opening and closing device OC and the shutter 272 operate to open the first port I/O1 and the second port I/O2. Next, the supply 280 operates to move the test tray TT from the soaking chamber 271 to the test chamber TC. At this time, if it is not the initial step of the operation of the sorting machine 200, the test tray TT loaded with the electronic components that have been tested is already stored in the test chamber TC. This will be explained in more detail with reference to FIG. 5.

參照圖5的示意圖，載有完成測試的電子部件的測試托盤TT由於連接裝置CA而預先上升，因此成為來自第二均熱腔室271的測試托盤TT能夠被搬入測試腔室TC的狀態。在圖5的狀態下，如果開閉裝置OC和開閉器 272運行而開放第一出入口I/O1和第二出入口I/O2，則供應器280運行而使載有需要測試的電子部件的測試托盤TT依次經由第二出入口I/O2和第一出入口I/O1而被供應至測試腔室TC。並且，與此並行地，回收器290運行而使載有完成測試的電子部件的測試托盤TT經由第一出入口I/O1而被回收至堆載塊273。並且，當完成測試托盤TT的交換時，開閉裝置OC和開閉器272分別封閉第一出入口I/O1和第二出入口I/O2。即，當開閉裝置OC運行1次時，在測試腔室TC和傳遞裝置270之間形成測試托盤TT的交換。因此，運行供應器280的時間區間和運行回收器290的時間區間的至少一部分重疊。從而，向測試腔室TC供應測試托盤TT的時間和從測試腔室TC回收測試托盤TT的整體時間會對應地最小化，進而使測試腔室TC內的溫度環境損失最小化。顯然，相應的時間最小化還會帶來處理容量的提高。能夠如前述地同時在測試腔室TC和傳遞裝置270之間進行測試托盤TT的交換的原因在於，連接裝置CA使將要從測試腔室TC搬出的測試托盤TT上升，從而使借助供應器280的測試托盤TT的移動線ML1和借助回收器290的測試托盤TT的移動線ML2沿著上下方向彼此隔開。 Referring to the schematic diagram of FIG. 5, the test tray TT loaded with the electronic components that have been tested is raised in advance by the connecting device CA, and therefore the test tray TT from the second soaking chamber 271 can be carried into the test chamber TC. In the state of Figure 5, if the opening and closing device OC and the shutter 272 runs to open the first port I/O1 and the second port I/O2, and the supplier 280 runs to make the test tray TT carrying the electronic components to be tested sequentially pass through the second port I/O2 and the first port I/ O1 is supplied to the test chamber TC. In addition, in parallel with this, the collector 290 operates to collect the test tray TT on which the electronic components that have completed the test are loaded to the stacking block 273 via the first port I/O1. And, when the exchange of the test tray TT is completed, the opening and closing device OC and the shutter 272 respectively close the first port I/O1 and the second port I/O2. That is, when the opening and closing device OC is operated once, the test tray TT is exchanged between the test chamber TC and the transfer device 270. Therefore, the time interval for operating the provider 280 and at least a part of the time interval for operating the collector 290 overlap. Therefore, the time for supplying the test tray TT to the test chamber TC and the overall time for recovering the test tray TT from the test chamber TC will be correspondingly minimized, thereby minimizing the temperature environment loss in the test chamber TC. Obviously, the corresponding time minimization will also bring about an increase in processing capacity. The reason why the test tray TT can be exchanged between the test chamber TC and the transfer device 270 at the same time as described above is that the connecting device CA raises the test tray TT to be carried out from the test chamber TC, so that the The moving line ML1 of the test tray TT and the moving line ML2 of the test tray TT by the recycler 290 are separated from each other in the up and down direction.

如果完成測試腔室TC和傳遞裝置270之間的測試托盤TT的交換，則第二均熱腔室271向前方移動而位於散熱腔室240的左側，並且測試托盤TT向散熱腔室240移動。 If the exchange of the test tray TT between the test chamber TC and the transfer device 270 is completed, the second soaking chamber 271 moves forward and is located on the left side of the heat dissipation chamber 240, and the test tray TT moves to the heat dissipation chamber 240.

接著，測試托盤TT從散熱腔室240向卸載位置UP移動，卸載裝置250從位於卸載位置UP的測試托盤TT卸載電子部件而使其移動至回收部分RP的客托盤CT2。在此過程中，需要重新測試的電子部件移動至第二緩衝器B2。 Next, the test tray TT moves from the heat dissipation chamber 240 to the unloading position UP, and the unloading device 250 unloads the electronic components from the test tray TT located at the unloading position UP and moves it to the passenger tray CT 2 of the recovery part RP. In this process, the electronic components that need to be retested move to the second buffer B2.

<參考事項> <References>

1.上述實施例中採用了測試腔室TC和連接裝置CA為多個的情形，但是在僅配備一個測試腔室TC的情況下，如果測試托盤TT無法從第一均熱腔室230直接移動至測試腔室TC，則也可以適當地應用本發明。 1. In the above embodiment, there are multiple test chambers TC and connection devices CA. However, if only one test chamber TC is provided, if the test tray TT cannot be moved directly from the first soaking chamber 230 To the test chamber TC, the present invention can also be suitably applied.

2.根據本發明的分選機200中配備有第一均熱腔室230和第二均熱腔室271，並且根據處理速度而可以使測試托盤TT更多地停留在第一均熱腔室230，或者更多地停留在第二均熱腔室271。顯然，載於測試托盤TT的電子部件在第一均熱腔室230或第二均熱腔室271中的哪一側受更多的熱刺激並不重要。重要的是，電子部件被收容於測試腔室TC後以能夠盡可能被快速測試的狀態被供應至測試腔室TC，因此較佳是考慮處理速度或測試速度等而適當地控制第一均熱腔室230或第二均熱腔室271內的溫度環境。 2. The sorting machine 200 according to the present invention is equipped with a first soaking chamber 230 and a second soaking chamber 271, and depending on the processing speed, the test tray TT can stay in the first soaking chamber more 230, or more stay in the second soaking chamber 271. Obviously, it does not matter which side of the first soaking chamber 230 or the second soaking chamber 271 receives more thermal stimulation on the electronic components loaded on the test tray TT. It is important that the electronic components are stored in the test chamber TC and are supplied to the test chamber TC in a state that can be tested as quickly as possible. Therefore, it is preferable to appropriately control the first soaking in consideration of the processing speed or the test speed. The temperature environment in the chamber 230 or the second soaking chamber 271.

3.在圖2的分選機200中，裝載裝置210和卸載裝置250分別獨立地配備，從而將裝載作業和卸載作業分開進行，但是考慮到處理速度等，可以考慮將裝載裝置210和卸載裝置250由構成為單個抓持裝置。顯然，與此 相反地，為了快速的裝載作業而可以將裝載裝置210分為將電子部件從客托盤CT1移動至測試托盤TF的第一裝載器以及從測試框架TF向測試托盤TT移動的第二裝載器而配備。 3. In the sorting machine 200 of FIG. 2, the loading device 210 and the unloading device 250 are separately equipped to separate the loading and unloading operations. However, considering the processing speed, the loading device 210 and the unloading device can be considered 250 is constructed as a single gripping device. Obviously, in contrast to this, the loading device 210 can be divided into a first loader that moves electronic components from the passenger tray CT 1 to the test tray TF and a second loader that moves the electronic components from the test frame TF to the test tray TT for fast loading operations. Equipped with two loaders.

4.參照圖2的平面圖，對於被搬入第一均熱腔室230的測試托盤TT向右側移動而向第二均熱腔室271移動的情形進行了說明，但是為了確保向電子部件施加充分的熱刺激的時間，需要使測試托盤TT停留在第一均熱腔室230的時間較長。為此，可以採用如下方式：將測試托盤TT搬入第一均熱腔室230的上部區域，並將測試托盤TT向下方平移後，向右側搬出。如果採用上述方式，可以在第一均熱腔室230收容多個測試托盤TT，並且測試托盤TT停留於第一均熱腔室230的滯留時間變長，從而能夠使電子部件在第一均熱腔室230內受到充分的熱刺激。 4. With reference to the plan view of FIG. 2, the case where the test tray TT carried into the first soaking chamber 230 moves to the right and moves to the second soaking chamber 271 is described, but in order to ensure sufficient application of the electronic components The thermal stimulation time requires that the test tray TT stays in the first soaking chamber 230 for a long time. To this end, the following method may be adopted: the test tray TT is moved into the upper area of the first soaking chamber 230, and the test tray TT is translated downward and then moved out to the right. If the above method is adopted, a plurality of test trays TT can be accommodated in the first soaking chamber 230, and the residence time of the test trays TT in the first soaking chamber 230 becomes longer, so that the electronic components can be heated in the first soaking chamber 230. The chamber 230 receives sufficient thermal stimulation.

5.上文中，對於在測試腔室TC和傳遞裝置270之間形成測試托盤TT的交換時，同時形成測試托盤TT的供應和回收的情形進行了說明，但是，如果供應器280所運行的時間區間和回收器290所運行的時間區間中的至少一部分重疊，則可以對應於上述的重疊而具有根據本發明的效果。 5. In the above, when the exchange of the test tray TT is formed between the test chamber TC and the transfer device 270, the situation in which the supply and recovery of the test tray TT is formed at the same time has been described. However, if the supply and recovery time of the supply 280 is The interval overlaps with at least a part of the time interval during which the recovery unit 290 operates, and the effect according to the present invention can be achieved corresponding to the above overlap.

如前述，對於本發明的具體說明通過參照附圖的實施例而進行，但是上述的實施例僅僅為本發明的較佳 實施例，因此不應理解為本發明侷限於上述實施例，並且本發明的權利範圍應理解為申請專利範圍及其等同範圍。 As mentioned above, the specific description of the present invention is carried out by referring to the embodiments of the drawings, but the above-mentioned embodiments are only the preferred embodiments of the present invention. Therefore, it should not be understood that the present invention is limited to the above-mentioned embodiments, and the scope of rights of the present invention should be understood as the scope of patent application and its equivalent scope.

200:分選機 200: Sorting machine

210:裝載裝置 210: loading device

230:第一均熱腔室 230: The first soaking chamber

TC:測試腔室 TC: test chamber

CA:連接裝置 CA: Connect the device

OC:開閉裝置 OC: Opening and closing device

250:卸載裝置 250: Unloading device

270:傳遞裝置 270: transfer device

271:第二均熱腔室 271: The second soaking chamber

272:開閉器 272: Shutter

273:堆載塊 273: Overload Block

274:移動器 274: Mover

280:供應器 280: Supply

290:回收器 290: Collector

圖1是對於現有的電子部件測試用分選機的示意性平面圖。 圖2是對於根據本發明的一實施例的電子部件測試用分選機的示意性平面圖。 圖3是對於應用於圖2的分選機的測試腔室部位的示意性局部立體圖。 圖4是對於應用於圖2的分選機的第二移動腔室部位的示意性局部立體圖。 圖5是用於說明在圖2的分選機中在傳遞裝置和測試腔室之間進行的測試托盤的交換的參照圖。Fig. 1 is a schematic plan view of a conventional sorting machine for testing electronic components. 2 is a schematic plan view of a sorting machine for testing electronic components according to an embodiment of the present invention. Fig. 3 is a schematic partial perspective view of a test chamber applied to the sorting machine of Fig. 2. Fig. 4 is a schematic partial perspective view of a second moving chamber applied to the sorting machine of Fig. 2. 5 is a reference diagram for explaining the exchange of test trays between the transfer device and the test chamber in the sorting machine of FIG. 2.

國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic hosting information (please note in the order of hosting organization, date and number)

國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Foreign hosting information (please note in the order of hosting country, institution, date and number) None

200‧‧‧分選機 200‧‧‧Splitting machine

210‧‧‧裝載裝置 210‧‧‧Loading device

220‧‧‧第一開放裝置 220‧‧‧The first opening device

230‧‧‧第一均熱腔室 230‧‧‧The first soaking chamber

240‧‧‧散熱腔室 240‧‧‧Radiating chamber

250‧‧‧卸載裝置 250‧‧‧Unloading device

260‧‧‧第二開放裝置 260‧‧‧Second Opening Device

270‧‧‧傳遞裝置 270‧‧‧Transfer device

271‧‧‧第二均熱腔室 271‧‧‧Second soaking chamber

272‧‧‧開閉器 272‧‧‧Shutter

273‧‧‧堆疊塊/堆載塊 273‧‧‧Stacking block/stacking block

274‧‧‧移動器 274‧‧‧Movers

280‧‧‧供應器 280‧‧‧Supply

290‧‧‧回收器 290‧‧‧Recycler

B1‧‧‧第一緩衝器 B1‧‧‧First buffer

B2‧‧‧第二緩衝器 B2‧‧‧Second buffer

CA‧‧‧連接裝置 CA‧‧‧Connecting device

CT1、CT2‧‧‧客托盤 CT 1 、CT 2 ‧‧‧Passenger tray

DA‧‧‧識別器 DA‧‧‧Recognizer

DT‧‧‧驅動測試器 DT‧‧‧Drive Tester

LP‧‧‧裝載位置 LP‧‧‧Loading position

OC‧‧‧開閉裝置 OC‧‧‧Opening and closing device

OD‧‧‧開放器 OD‧‧‧Opener

RA‧‧‧供需區域 RA‧‧‧Supply and demand area

RP‧‧‧回收部分 RP‧‧‧Recycling part

SK‧‧‧堆疊器 SK‧‧‧Stacker

SP‧‧‧供應部分 SP‧‧‧Supply part

TA‧‧‧測試區域 TA‧‧‧Test area

TC‧‧‧測試腔室 TC‧‧‧Test Chamber

TF‧‧‧測試框架/測試托盤 TF‧‧‧Test Frame/Test Tray

TM‧‧‧貨車 TM‧‧‧Truck

TT‧‧‧測試托盤 TT‧‧‧Test tray

UP‧‧‧卸載位置 UP‧‧‧Uninstall location

Claims (4)

一種電子部件測試用分選機，其中包括：裝載裝置，將載於客托盤的電子部件裝載到位於裝載位置的測試托盤；第一均熱腔室，在收容通過所述裝載裝置而載有電子部件的測試托盤後向電子部件施加熱刺激；測試腔室，收容經由所述第一均熱腔室而來的測試托盤，提供能夠測試收容的測試托盤的電子部件的溫度環境，並具有能夠使測試托盤出入的第一出入口；連接裝置，將被收容於所述測試腔室的測試托盤的電子部件電連接到測試器；開閉裝置，開閉所述測試腔室的所述第一出入口；卸載裝置，從在從所述測試腔室搬出後移動到卸載位置的測試托盤卸載完成測試的電子部件；及傳遞裝置，被配置為在從所述第一均熱腔室移動至所述測試腔室的過程中，或者從所述測試腔室移動至所述卸載位置的過程中傳遞測試托盤，其中所述傳遞裝置包括：第二均熱腔室，在收容從所述第一均熱腔室接收的測試托盤之後，維持所述第一均熱腔室向 電子部件施加的熱刺激，並具有能夠使所述測試托盤出入的第二出入口；開閉器，開閉所述第二均熱腔室的所述第二出入口；堆載塊，能夠堆載從所述測試腔室搬出的測試托盤，並以與所述第二均熱腔室結合為一體的方式配備；移動器，使所述第二均熱腔室移動，以使所述第二均熱腔室位於所述第一均熱腔室或所述測試腔室的一側，其中所述電子部件測試用分選機還包括：供應器，從所述第二均熱腔室向所述測試腔室供應測試托盤；回收器，從所述測試腔室向所述堆載塊回收測試托盤，當所述第二均熱腔室位於所述測試腔室的一側時，所述第一出入口和所述第二出入口以彼此隔開而相向的方式形成，在所述開閉裝置開放所述第一出入口後關閉所述第一出入口之前，所述供應器和所述回收器運行而將裝有完成測試的電子部件的測試托盤經由所述第一出入口而回收至所述堆載塊，並將裝有需要測試的電子 部件的測試托盤依次經由所述第二出入口和第一出入口而供應至所述測試腔室，從而在一次運行所述開閉裝置時能夠實現所述測試腔室和所述傳遞裝置之間的測試托盤的交換，為了最小化所述測試腔室內的溫度環境的損失，在所述測試腔室和所述傳遞裝置之間進行測試托盤的交換時，所述供應器所運行的時間區間和所述回收器所運行的時間區間的至少一部分重疊。 A sorting machine for testing electronic components, which includes: a loading device for loading electronic components loaded on a passenger tray to a test tray located at a loading position; a first soaking chamber, which contains the electronic components loaded by the loading device. After the test tray of the component, thermal stimulation is applied to the electronic component; the test chamber contains the test tray from the first soaking chamber, provides a temperature environment that can test the electronic components of the stored test tray, and has The first entrance and exit of the test tray; a connecting device that electrically connects the electronic components of the test tray contained in the test chamber to the tester; an opening and closing device that opens and closes the first entrance and exit of the test chamber; an unloading device , Unloading the electronic components that have completed the test from the test tray moved to the unloading position after being removed from the test chamber; and a transfer device configured to move from the first soaking chamber to the test chamber During the process, or during the process of moving from the test chamber to the unloading position, the test tray is transferred, wherein the transfer device includes: a second soaking chamber for receiving the test tray received from the first soaking chamber After testing the tray, maintain the first soaking chamber to The thermal stimulus applied by the electronic component has a second inlet and outlet that can make the test tray in and out; a shutter that opens and closes the second inlet and outlet of the second soaking chamber; and a stacking block can be stacked from the The test tray moved out of the test chamber is equipped with the second soaking chamber as a whole; the mover moves the second soaking chamber to make the second soaking chamber Located on one side of the first soaking chamber or the test chamber, wherein the sorting machine for testing electronic components further includes: a supplier, from the second soaking chamber to the test chamber Supply a test tray; a recovery device to recover the test tray from the test chamber to the stacking block. When the second soaking chamber is located on one side of the test chamber, the first entrance and exit The second inlets and outlets are formed in a manner of being spaced apart from each other and facing each other, and before the first inlet and outlet are closed after the opening and closing device opens the first inlet and outlet, the supply and the recovery device operate to complete the test The test trays of the electronic components are recovered to the stacking block through the first entrance and exit, and will contain the electronic components that need to be tested The test tray of the component is supplied to the test chamber through the second port and the first port in sequence, so that the test tray between the test chamber and the transfer device can be realized when the opening and closing device is operated once. In order to minimize the loss of the temperature environment in the test chamber, when the test tray is exchanged between the test chamber and the transfer device, the operating time interval of the supplier and the recovery At least a part of the time interval during which the detector is running overlaps. 如請求項1所述之電子部件測試用分選機，其中，所述測試腔室和所述連接裝置配備為多個，所述測試腔室中的至少一個與所述第一均熱腔室相隔，所述移動器能夠使所述第二均熱腔室位於各個所述測試腔室的一側。 The sorting machine for testing electronic components according to claim 1, wherein the test chamber and the connecting device are provided in a plurality, and at least one of the test chambers and the first soaking chamber Separately, the mover can enable the second soaking chamber to be located on one side of each of the test chambers. 如請求項1所述之電子部件測試用分選機，其中，所述堆載塊配備於所述第二均熱腔室的上側。 The sorting machine for testing electronic components according to claim 1, wherein the stacking block is provided on the upper side of the second soaking chamber. 一種電子部件測試用分選機，其中包括：裝載裝置，將載於客托盤的電子部件裝載到位於裝載位置的測試托盤；第一均熱腔室，在收容通過所述裝載裝置而載有 電子部件的測試托盤後向電子部件施加熱刺激；測試腔室，收容經由所述第一均熱腔室而來的測試托盤，提供能夠測試收容的測試托盤的電子部件的溫度環境，並具有能夠使測試托盤出入的第一出入口；連接裝置，將被收容於所述測試腔室的測試托盤的電子部件電連接到測試器；開閉裝置，開閉所述測試腔室的所述第一出入口；卸載裝置，從在從所述測試腔室搬出後移動到卸載位置的測試托盤卸載完成測試的電子部件；及傳遞裝置，被配置為在從所述第一均熱腔室移動至所述測試腔室的過程中，或者從所述測試腔室移動至所述卸載位置的過程中傳遞測試托盤，其中所述傳遞裝置包括：第二均熱腔室，在收容從所述第一均熱腔室接收的測試托盤之後，維持所述第一均熱腔室向電子部件施加的熱刺激，並具有能夠使所述測試托盤出入的第二出入口；開閉器，開閉所述第二均熱腔室的所述第二出入口；堆載塊，能夠堆載從所述測試腔室搬出的測試 托盤，並以與所述第二均熱腔室結合為一體的方式配備；移動器，使所述第二均熱腔室移動，以使所述第二均熱腔室位於所述第一均熱腔室或所述測試腔室的一側，其中所述電子部件測試用分選機還包括：供應器，從所述第二均熱腔室向所述測試腔室供應測試托盤；回收器，從所述測試腔室向所述堆載塊回收測試托盤，當所述第二均熱腔室位於所述測試腔室的一側時，所述第一出入口和所述第二出入口以彼此隔開而相向的方式形成，在所述開閉裝置開放所述第一出入口後關閉所述第一出入口之前，所述供應器和所述回收器運行而將裝有完成測試的電子部件的測試托盤經由所述第一出入口而回收至所述堆載塊，並將裝有需要測試的電子部件的測試托盤依次經由所述第二出入口和第一出入口而供應至所述測試腔室，從而在一次運行所述開閉裝置時能夠實現所述測試腔室和所述傳遞裝置之間的測試托盤的交換，並且，借助所述供應器的測試托盤的移動線和借 助所述回收器的測試托盤的移動線彼此隔開。 A sorting machine for testing electronic components, which includes: a loading device for loading electronic components loaded on a passenger tray to a test tray located at a loading position; a first soaking chamber, which is loaded by the loading device The test tray of the electronic component applies thermal stimulation to the electronic component; the test chamber contains the test tray from the first soaking chamber, provides a temperature environment that can test the electronic components of the stored test tray, and has A first port for accessing the test tray; a connecting device for electrically connecting the electronic components of the test tray contained in the test chamber to the tester; an opening and closing device for opening and closing the first port of the test chamber; unloading A device for unloading the electronic components that have been tested from the test tray moved to the unloading position after being unloaded from the test chamber; and a transfer device configured to move from the first soaking chamber to the test chamber During the process, or during the process of moving from the test chamber to the unloading position, the test tray is transferred, wherein the transfer device includes: a second soaking chamber, receiving from the first soaking chamber After the test tray, the thermal stimulus applied by the first soaking chamber to the electronic components is maintained, and there is a second entrance and exit that can allow the test tray to enter and exit; a shutter that opens and closes all of the second soaking chamber The second entrance and exit; the stacking block, which can stack the test moved out from the test chamber The tray is equipped with the second soaking chamber as a whole; the mover moves the second soaking chamber so that the second soaking chamber is located in the first soaking chamber The thermal chamber or one side of the test chamber, wherein the sorting machine for testing electronic components further includes: a supplier, which supplies a test tray from the second soaking chamber to the test chamber; and a recycler , The test tray is recovered from the test chamber to the stacking block, and when the second soaking chamber is located on one side of the test chamber, the first port and the second port are mutually It is formed in a spaced apart and opposite manner. Before the opening and closing device opens the first port and then closes the first port, the supply and the recovery device operate to load a test tray containing electronic components that have been tested. It is recovered to the stacking block via the first port, and the test tray containing the electronic components to be tested is supplied to the test chamber via the second port and the first port in sequence, so that the When the opening and closing device is operated, the test tray can be exchanged between the test chamber and the transfer device, and with the aid of the moving line and borrowing of the test tray of the supplier The moving lines of the test trays of the recovery device are separated from each other.
TW107142462A 2017-12-19 2018-11-28 Handler for testing electronic devices TWI712805B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0174996 2017-12-19
??10-2017-0174996 2017-12-19
KR1020170174996A KR102422649B1 (en) 2017-12-19 2017-12-19 Handler for testing electronic devices

Publications (2)

Publication Number Publication Date
TW201930903A TW201930903A (en) 2019-08-01
TWI712805B true TWI712805B (en) 2020-12-11

Family

ID=66984537

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107142462A TWI712805B (en) 2017-12-19 2018-11-28 Handler for testing electronic devices

Country Status (3)

Country Link
KR (1) KR102422649B1 (en)
CN (1) CN109926334B (en)
TW (1) TWI712805B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114472191A (en) * 2020-11-12 2022-05-13 泰克元有限公司 Sorter for processing electronic parts and method for confirming whether insert has defect

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130105104A (en) * 2012-03-16 2013-09-25 (주)테크윙 Side docking type test handler and operating method of side docking type test handler
WO2015083241A1 (en) * 2013-12-03 2015-06-11 東北精機工業株式会社 Electronic device handler
TW201737383A (en) * 2016-04-12 2017-10-16 泰克元股份有限公司 Handler for electronic device test wherein the temperature required for the test of the electronic component can be maintained by means of the cooling fluid and the heater

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3254775B2 (en) * 1992-12-01 2002-02-12 日立電子エンジニアリング株式会社 IC device constant temperature test equipment
JP3183591B2 (en) * 1993-07-02 2001-07-09 三菱電機株式会社 Semiconductor device test system, semiconductor device test method, semiconductor device insertion / extraction station, and test chamber
JP2606680B2 (en) * 1994-12-28 1997-05-07 日本電気株式会社 UV irradiation device
KR101350999B1 (en) * 2007-08-23 2014-01-14 세메스 주식회사 Method of testing a semiconductor device and test handler for performing the same
KR101327455B1 (en) * 2007-09-19 2013-11-11 세메스 주식회사 Test handler and semiconductor device loading and unloading method thereof the same
KR101173391B1 (en) * 2011-01-13 2012-08-10 세크론 주식회사 Pushing apparatus for testing a semiconductor device and test handler including the same
US20130200915A1 (en) * 2012-02-06 2013-08-08 Peter G. Panagas Test System with Test Trays and Automated Test Tray Handling
JP6083140B2 (en) * 2012-07-20 2017-02-22 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
KR101811662B1 (en) * 2014-03-07 2017-12-26 (주)테크윙 Handler for testing semiconductor device and test supportion method of the same
KR20160025863A (en) * 2014-08-28 2016-03-09 삼성전자주식회사 Contact structure for a test handler, test handler having contact structure and method of testing integrated circuit devices using the test handler
KR102254494B1 (en) * 2015-04-30 2021-05-24 (주)테크윙 Handler for testing semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130105104A (en) * 2012-03-16 2013-09-25 (주)테크윙 Side docking type test handler and operating method of side docking type test handler
WO2015083241A1 (en) * 2013-12-03 2015-06-11 東北精機工業株式会社 Electronic device handler
TW201737383A (en) * 2016-04-12 2017-10-16 泰克元股份有限公司 Handler for electronic device test wherein the temperature required for the test of the electronic component can be maintained by means of the cooling fluid and the heater

Also Published As

Publication number Publication date
CN109926334B (en) 2021-05-25
TW201930903A (en) 2019-08-01
KR20190073818A (en) 2019-06-27
KR102422649B1 (en) 2022-07-19
CN109926334A (en) 2019-06-25

Similar Documents

Publication Publication Date Title
KR102664951B1 (en) Handler for testing electronic devices
KR100560729B1 (en) Handler for testing semiconductor
US20020041181A1 (en) Device test handler and method for operating the same
JP4884717B2 (en) Handler for semiconductor device test
US7948255B2 (en) Test handler
KR100564780B1 (en) Substrate treating apparatus
TWI470246B (en) Test handler
US20080297140A1 (en) System and method for transferring trays within a test handler
JP5539568B2 (en) Semiconductor element handling system
KR100567237B1 (en) Substrate treating apparatus
US20080071409A1 (en) Handler
KR100865910B1 (en) Handler and method of manufacturing semiconductor using the same
TWI712805B (en) Handler for testing electronic devices
US8570058B2 (en) Carrier board transfer system for handler that supports testing of electronic devices and method for transferring carrier board in chamber of handler
CN107807296B (en) Sorting machine for testing electronic components
KR100938170B1 (en) Handler, Method of Transferring Test-tray, and Method of Manufacturing Semiconductor
KR100765463B1 (en) Method for transferring test tray of handler
JP5628372B2 (en) Semiconductor element handling system
KR102236104B1 (en) Test tray feeder
KR20020053406A (en) Handler for testing semiconductor
KR102249574B1 (en) Electric device unloading equipment
KR102628828B1 (en) Handler for testing electronic devices
KR20200112761A (en) Electric device unloading equipment
JP3607233B2 (en) Automatic device loading device for handlers
KR20210094419A (en) Handler for testing electronic components