TWI707940B - Manufacturing method for printed circuit board - Google Patents
Manufacturing method for printed circuit board Download PDFInfo
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- TWI707940B TWI707940B TW107110570A TW107110570A TWI707940B TW I707940 B TWI707940 B TW I707940B TW 107110570 A TW107110570 A TW 107110570A TW 107110570 A TW107110570 A TW 107110570A TW I707940 B TWI707940 B TW I707940B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
本發明涉及一種印刷電路板的製造方法。本發明的印刷電路板的電磁波遮斷膜的特徵在於，包括：承載膜；形成在承載膜的一面上的導電性金屬層；形成在金屬層上的導電性黏合層；及形成在導電性黏合層上的保護膜。 The invention relates to a manufacturing method of a printed circuit board. The electromagnetic wave shielding film of the printed circuit board of the present invention is characterized by comprising: a carrier film; a conductive metal layer formed on one side of the carrier film; a conductive adhesive layer formed on the metal layer; and a conductive adhesive layer formed on the conductive adhesive Protective film on the layer.
Description
一種電磁波遮斷膜、印刷電路板的製造方法及電磁波遮斷膜的製造方法，更為具體地，涉及一種由於能夠擴寬附著在印刷電路板的電磁波遮斷膜的接地面積，從而能夠省略接地膜，並能提供優異的環境可靠性、耐熱性、階梯特性的高速傳送用電磁波遮斷膜、印刷電路板的製造方法及電磁波遮斷膜的製造方法。 An electromagnetic wave shielding film, a method for manufacturing a printed circuit board, and a method for manufacturing an electromagnetic wave shielding film, more specifically, relates to a grounding area that can be omitted because the electromagnetic wave shielding film attached to the printed circuit board can be widened Film, and can provide an electromagnetic wave shielding film for high-speed transmission with excellent environmental reliability, heat resistance, and step characteristics, a method for manufacturing a printed circuit board, and a method for manufacturing an electromagnetic wave shielding film.
據報導，手機、數位相機、手提電腦PC、辦公設備、醫療設備等電子設備的內部元件產生的電磁波可能會引起頭痛、視力下降、腦腫瘤、循環系統的異常等各種疾病，這種報導加深了電磁波對人體有害性的爭論。而且，隨著電子產品的輕量化趨勢，元件的集成度增加，各種構成元件產生的電磁雜訊(electromagnetic noise)會引起周邊元件的錯誤操作，從而引發設備障礙。因此，最近對由電腦、手機、醫療設備、多媒體播放機等家用、辦公用、工業用電子產品產生的電磁波強化了遮斷標準的同時對EMI(electromagnetic interference，電磁干擾)及RFI(Radio Frequency interference，射頻干擾)的釋放強化了管制，因此各種電子設備及零部件的電磁波遮斷措施成為重要的課題。 According to reports, electromagnetic waves generated by internal components of electronic devices such as mobile phones, digital cameras, laptop PCs, office equipment, medical equipment, etc. may cause headaches, decreased vision, brain tumors, abnormalities in the circulatory system, and other diseases. This report has deepened Controversy over the harmfulness of electromagnetic waves to humans. Moreover, with the trend toward lighter weight of electronic products and increased integration of components, electromagnetic noise (electromagnetic noise) generated by various constituent components may cause erroneous operation of peripheral components, thereby causing equipment obstacles. Therefore, recently, the electromagnetic wave generated by computers, mobile phones, medical equipment, multimedia players and other home, office, and industrial electronic products has strengthened the shielding standards, while simultaneously preventing EMI (electromagnetic interference) and RFI (Radio Frequency Interference). , Radio frequency interference) has strengthened the control, so the electromagnetic shielding measures of various electronic equipment and parts have become an important issue.
最近，為了回應人們對辦公設備、通訊設備和手機等的高性能化及小型化的要求，多使用窄而複雜的結構的撓性印刷電路板(下稱FPCB)。FPCB在附著有用於遮斷電磁波雜訊的遮罩膜(Shield film)的狀態下使用。 Recently, in response to people's requirements for high performance and miniaturization of office equipment, communication equipment, and mobile phones, flexible printed circuit boards (hereinafter referred to as FPCBs) with narrow and complex structures are often used. The FPCB is used with a shield film to block electromagnetic noise.
在以往的遮罩膜中，常見的是將基底膜(base film)和層疊在該基地膜上的導電層作為基本結構的遮罩膜。通常，該基本結構中的基底膜側上設置考慮到操作性的加強膜，在導電層上設置保護膜來製成產品而使用。 Among the conventional mask films, it is common to use a base film and a conductive layer laminated on the base film as a basic structure. Usually, the base film side in the basic structure is provided with a reinforcing film in consideration of operability, and a protective film is provided on the conductive layer to make a product for use.
在日本特開平5-3395號中記載了為了獲得優異的遮罩效果而使用金屬薄膜的方法；在日本特開平7-122882號中記載了將使用金屬填料的導電性黏合層和金屬薄膜組合的方法。 Japanese Patent Laid-Open No. 5-3395 describes a method of using a metal film to obtain an excellent masking effect; Japanese Patent Laid-Open No. 7-122882 describes a combination of a conductive adhesive layer using a metal filler and a metal film method.
然而，在接合承載膜和金屬層的狀態下，在金屬層上塗布導電性黏合層並進行乾燥，在導電性黏合層上層壓保護膜而製造電磁波遮斷膜的情況下，所述承載膜和金屬層之間的結合力相較於金屬層和導電性黏合層之間的結合力相對牢固，因此在剝離承載膜的過程中，會出現承載膜在其上附著有金屬層的狀態下從導電性黏合層剝離，或者出現在金屬層和導電性黏合層之間隔開的翹起現象。 However, in the state where the carrier film and the metal layer are joined, a conductive adhesive layer is coated on the metal layer and dried, and a protective film is laminated on the conductive adhesive layer to produce an electromagnetic wave shielding film. The carrier film and The bonding force between the metal layers is relatively strong compared to the bonding force between the metal layer and the conductive adhesive layer. Therefore, in the process of peeling off the carrier film, the carrier film will become conductive with the metal layer attached to it. The adhesive layer is peeled off, or the phenomenon of lifting between the metal layer and the conductive adhesive layer occurs.
不僅如此，最近生產的電子設備被製成精密而輕薄短小型，隨著這種傾向，電路圖案的線寬和間隔變窄，不能確保較寬的接地(Ground)，因此在製造印刷電路板時需要使用額外的接地膜。 Not only that, the recently produced electronic devices are made into precision, light, thin, short and small. With this trend, the line width and interval of the circuit pattern become narrower, and a wider ground cannot be ensured. Therefore, when manufacturing printed circuit boards Need to use additional ground film.
專利文獻1：日本特開平5-3395號(1993年1月8日公開) Patent Document 1: Japanese Patent Application Publication No. 5-3395 (published on January 8, 1993)
專利文獻2：日本特開平7-122882號(1995年5月12日公開) Patent Document 2: Japanese Patent Application Publication No. 7-122882 (published on May 12, 1995)
因此，本發明是為了解決上述以往問題的提出的，其目的在於提供一種電磁波遮斷膜、印刷電路板的製造方法及電磁波遮斷膜的製造方法，其通過擴寬附著在印刷電路板的電磁波遮斷膜的接地面積，從而能夠省略接地膜。 Therefore, the present invention is proposed to solve the above-mentioned problems in the past, and its purpose is to provide an electromagnetic wave shielding film, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film by widening the electromagnetic waves attached to the printed circuit board. The ground area of the film is blocked, so that the ground film can be omitted.
此外，本發明的目的是提供一種高速傳送用電磁波遮斷膜、印刷電路板的製造方法及電磁波遮斷膜的製造方法，其具有抗氧化特性和高耐熱特性。 In addition, an object of the present invention is to provide an electromagnetic wave shielding film for high-speed transmission, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film, which have anti-oxidation properties and high heat resistance properties.
另外，提供一種電磁波遮斷膜、印刷電路板的製造方法及電磁波遮斷膜的製造方法，其在使導電性黏合層半固化的狀態下剝離承載膜，從而能夠防止在承載膜的剝離過程中金屬層任意從導電性黏合層剝離。 In addition, there is provided an electromagnetic wave shielding film, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film, which peels off the carrier film in a state where the conductive adhesive layer is semi-cured, thereby preventing the carrier film from being peeled off. The metal layer is arbitrarily peeled off from the conductive adhesive layer.
所述目的通過本發明的以下技術方案來實現。一種電磁波遮斷膜，包括承載膜、在承載膜的一面上形成的導電性金屬層、在金屬層上形成的導電性黏合層、及在導電性黏合層上形成的保護膜。 The objective is achieved by the following technical solutions of the present invention. An electromagnetic wave shielding film includes a carrier film, a conductive metal layer formed on one side of the carrier film, a conductive adhesive layer formed on the metal layer, and a protective film formed on the conductive adhesive layer.
其中，優選的，導電性黏合層包括黏合劑樹脂及導電性填料。 Among them, preferably, the conductive adhesive layer includes a binder resin and a conductive filler.
此外，優選的，導電性填料包括銀、銅、鋁、鎳、金、鋅或鐵的顆粒，顆粒具有片狀(flake)、球狀(spherical)、枝狀(dendrite)或硬顆粒(Granule)形狀。 In addition, preferably, the conductive filler includes particles of silver, copper, aluminum, nickel, gold, zinc, or iron, and the particles have a flake, spherical, dendrite, or granule shape. shape.
此外，優選的，顆粒具有3μm~20μm的大小。 In addition, preferably, the particles have a size of 3 μm to 20 μm .
此外，優選的，黏合劑樹脂為聚乙烯醇丁醛、纖維素、聚氨酯、聚酯、環氧基、苯氧基、酚醛、醇酸、醯胺、醯亞胺樹脂或其改性物中的至少一種。 In addition, preferably, the binder resin is polyvinyl butyral, cellulose, polyurethane, polyester, epoxy, phenoxy, phenolic, alkyd, amide, imine resin or its modification. At least one.
此外，優選的，金屬層和導電性黏合層之間設置有導電層。 In addition, preferably, a conductive layer is provided between the metal layer and the conductive adhesive layer.
此外，優選的，導電層由導電率比金屬層的導電率相對優異的物質構成。 In addition, it is preferable that the conductive layer is composed of a substance having relatively superior conductivity than that of the metal layer.
此外，優選的，導電層通過在金屬層上塗布銀(Silver)墨而形成。 In addition, preferably, the conductive layer is formed by coating silver ink on the metal layer.
此外，優選的，金屬層為選自鎳、銅、鋁、鋅或其合金中的一種以上。 In addition, preferably, the metal layer is one or more selected from nickel, copper, aluminum, zinc, or alloys thereof.
此外，優選的，金屬層由厚度為2μm~10μm的箔(foil)來構成。 In addition, preferably, the metal layer is composed of a foil having a thickness of 2 μm to 10 μm .
本發明的目的可通過以下的技術方案來實現。一種印刷電路板的製造方法，包括：遮斷膜準備步驟，用於準備依次層疊有承載膜、金屬層、導電性黏合層及保護膜的遮斷膜；保護膜去除步驟，用於去除遮斷膜的保護膜；黏合步驟，用於將遮斷膜的導電性黏合層黏合到印刷電路板；承載膜去除步驟，用於去除遮斷膜的承載膜；及絕緣層形成步驟，用於在遮斷膜的金屬層上形成絕緣層，絕緣層在待形成印刷電路板的接地擴展端子的區域上形成有開口部。 The purpose of the present invention can be achieved by the following technical solutions. A manufacturing method of a printed circuit board includes: a shielding film preparation step for preparing a shielding film laminated with a carrier film, a metal layer, a conductive adhesive layer, and a protective film in sequence; a protective film removal step for removing the shielding film The protective film of the film; the bonding step for bonding the conductive adhesive layer of the blocking film to the printed circuit board; the carrier film removing step for removing the carrier film of the blocking film; and the insulating layer forming step for An insulating layer is formed on the metal layer of the broken film, and the insulating layer is formed with an opening in the area where the ground extension terminal of the printed circuit board is to be formed.
其中，在絕緣層形成步驟中，優選的，通過在金屬層上印刷絕緣膏來形成絕緣層。 Among them, in the insulating layer forming step, preferably, the insulating layer is formed by printing an insulating paste on the metal layer.
此外，在絕緣層形成步驟中，優選的，通過將形成有開口部的絕緣膜貼合到金屬層上而形成絕緣層。 In addition, in the insulating layer forming step, preferably, the insulating layer is formed by bonding an insulating film formed with an opening to the metal layer.
此外，絕緣層形成步驟包括：覆蓋面準備步驟，用於準備依次層疊有另一承載膜、另一絕緣層、另一黏合層及另一保護膜的覆蓋面；衝壓步驟，用於通過衝壓覆蓋面，在待形成印刷電路板的接地擴展端子的區域上形成開口部；保護膜去除步驟，用於去除覆蓋面的保護膜；及接合步驟，用於接合遮斷膜的金屬層和覆蓋面的黏合層。 In addition, the insulating layer forming step includes: a covering surface preparation step for preparing a covering surface on which another carrier film, another insulating layer, another adhesive layer, and another protective film are sequentially laminated; and a punching step for covering the surface by punching An opening is formed in the area where the ground extension terminal of the printed circuit board is to be formed; the protective film removing step is used to remove the protective film of the covering surface; and the bonding step is used to join the metal layer of the shielding film and the adhesive layer of the covering surface.
此外，優選的，還包括：鍍層形成步驟，用於在通過絕緣層的開口部露出的金屬層上形成鍍層。 In addition, preferably, it further includes a plating layer forming step for forming a plating layer on the metal layer exposed through the opening of the insulating layer.
此外，在鍍層形成步驟之前，優選的，還包括：金屬層局部去除步驟，用於在金屬層的厚度方向上去除通過絕緣層的開口部露出的金屬層的一部分。 In addition, before the plating layer forming step, it is preferable to further include: a partial metal layer removal step for removing a part of the metal layer exposed through the opening of the insulating layer in the thickness direction of the metal layer.
此外，優選的，在承載膜去除步驟之前執行：導電性黏合層半固化步驟，用於使導電性黏合層半固化。 In addition, preferably, before the step of removing the carrier film, a step of semi-curing the conductive adhesive layer is performed for semi-curing the conductive adhesive layer.
此外，優選的，在承載膜去除步驟之後執行：導電性黏合層全固化步驟，用於使導電性黏合層完全固化。 In addition, preferably, after the step of removing the carrier film, the step of fully curing the conductive adhesive layer is performed to completely cure the conductive adhesive layer.
此外，優選的，在接合步驟之後執行：覆蓋面的承載膜去除步驟，用於去除覆蓋面的承載膜。 In addition, preferably, it is performed after the joining step: a step of removing the carrier film of the covering surface for removing the carrier film of the covering surface.
此外，優選的，在覆蓋面的承載膜去除步驟之前執行：黏合層半固化步驟，用於使覆蓋面的黏合層半固化。 In addition, it is preferable to perform before the step of removing the carrier film of the covering surface: the semi-curing step of the adhesive layer is used for semi-curing the adhesive layer of the covering surface.
此外，優選的，在覆蓋面的承載膜去除步驟之後執行：黏合層全固化步驟，用於使覆蓋面的黏合層完全固化。 In addition, preferably, it is performed after the step of removing the carrier film of the covering surface: the step of fully curing the adhesive layer is used to completely cure the adhesive layer of the covering surface.
此外，優選的，在遮斷膜準備步驟中，在金屬層和導電性黏合層之間形成導電層，導電層為導電率比金屬層的導電率相對優異的材質。 In addition, preferably, in the step of preparing the shielding film, a conductive layer is formed between the metal layer and the conductive adhesive layer, and the conductive layer is made of a material with relatively superior conductivity than the metal layer.
本發明的目的可通過以下技術方案來實現。一種電磁波遮斷膜的製造方法，包括：金屬層準備步驟，用於準備薄膜形狀的金屬層；導電性黏合層形成步驟，用於在金屬層的一面上形成導電性黏合層；第一保護膜形成步驟，用於在導電性黏合層上接合第一保護膜；絕緣層形成步驟，用於在金屬層的另一面上形成絕緣層；及第二保護膜形成步驟，用於在絕緣層上形成第二保護膜。 The purpose of the present invention can be achieved by the following technical solutions. An electromagnetic wave shielding film manufacturing method, comprising: a metal layer preparation step for preparing a metal layer in the shape of a thin film; a conductive adhesive layer forming step for forming a conductive adhesive layer on one side of the metal layer; and a first protective film A forming step for bonding a first protective film on the conductive adhesive layer; an insulating layer forming step for forming an insulating layer on the other side of the metal layer; and a second protective film forming step for forming on the insulating layer The second protective film.
此外，優選的，在導電性黏合層形成步驟之前執行：導電層形成步驟，用於在金屬層的一面上形成導電層。 In addition, preferably, it is performed before the conductive adhesive layer forming step: the conductive layer forming step is used to form a conductive layer on one side of the metal layer.
此外，優選的，導電層由導電率比金屬層的導電率相對優異的物質構成。 In addition, it is preferable that the conductive layer is composed of a substance having relatively superior conductivity than that of the metal layer.
此外，優選的，導電層通過在金屬層上塗布銀(Silver)墨而形成。 In addition, it is preferable that the conductive layer is formed by coating silver ink on the metal layer.
根據本發明，提供一種電磁波遮斷膜、印刷電路板的製造方法及電磁波遮斷膜的製造方法，其通過擴寬附著在印刷電路板的電磁波遮斷膜的接地面積，從而能夠省略接地膜。由此，能夠消除在製造微細電路板時不能形成較寬的接地面積，從而能夠提供微細電路板製造的容易性、由此帶來的製造製程的節省、生產效率的提高及製造費用的節省效果。 According to the present invention, there is provided an electromagnetic wave shielding film, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film. The grounding film can be omitted by expanding the ground area of the electromagnetic shielding film attached to the printed circuit board. As a result, it is possible to eliminate the inability to form a wide ground area when manufacturing microcircuit boards, thereby providing the ease of manufacturing microcircuit boards, resulting in savings in manufacturing processes, improvement in production efficiency, and savings in manufacturing costs. .
此外，能夠製造採用了具有抗氧化特性及高耐熱特性的高速傳送用電磁波遮斷膜的印刷電路板。 In addition, it is possible to manufacture a printed circuit board using an electromagnetic wave shielding film for high-speed transmission with oxidation resistance and high heat resistance.
另外，通過在使導電性黏合層半固化的狀態下剝離承載膜，能夠防止在承載膜的剝離過程中金屬層從導電性黏合層任意剝離。 In addition, by peeling the carrier film in a state where the conductive adhesive layer is semi-cured, it is possible to prevent the metal layer from arbitrarily peeling off the conductive adhesive layer during the peeling process of the carrier film.
10:遮斷膜 10: Blocking film
10':遮斷膜 10': Blocking film
11:承載膜 11: Carrier film
12:金屬層 12: Metal layer
13:導電性黏合層 13: Conductive adhesive layer
14:第一保護膜 14: The first protective film
14':第二保護膜 14': second protective film
15:導電層 15: conductive layer
20:覆蓋面 20: coverage
21:承載膜 21: Carrier film
22:絕緣層 22: Insulation layer
22a:開口部 22a: opening
23:黏合層 23: Adhesive layer
24:保護膜 24: Protective film
30:鍍層 30: Plating
PCB:印刷電路板 PCB: Printed Circuit Board
S110:遮斷膜準備步驟 S110: Preparing steps for blocking film
S110':遮斷膜準備步驟 S110': Steps to prepare the shielding film
S120:遮斷膜衝壓步驟 S120: Punching step of interrupting film
S130:保護膜去除步驟 S130: protective film removal step
S140:黏合步驟 S140: Bonding step
S150:導電性黏合層半固化步驟 S150: Semi-curing step of conductive adhesive layer
S160:承載膜去除步驟 S160: Carrier film removal step
S170:導電性黏合層全固化步驟 S170: Full curing step of conductive adhesive layer
S180:絕緣層形成步驟 S180: insulating layer formation step
S180':絕緣層形成步驟 S180': insulating layer formation step
S181:覆蓋面準備步驟 S181: Coverage preparation steps
S182:覆蓋面衝壓步驟 S182: Covering stamping step
S183:保護膜去除步驟 S183: protective film removal step
S184:接合步驟 S184: Joining step
S185:黏合層半固化步驟 S185: Semi-curing step of adhesive layer
S186:承載膜去除步驟 S186: Carrier film removal step
S187:黏合層全固化步驟 S187: Full curing step of the adhesive layer
S190:金屬層局部去除步驟 S190: Partial removal of metal layer
S200:鍍層形成步驟 S200: Plating layer formation step
S210:金屬層準備步驟 S210: Metal layer preparation steps
S211:導電層形成步驟 S211: conductive layer formation step
S220:導電性黏合層形成步驟 S220: forming step of conductive adhesive layer
S230:第一保護膜形成步驟 S230: first protective film forming step
S240:絕緣層形成步驟 S240: insulating layer formation step
S250:第二保護膜形成步驟 S250: second protective film forming step
[圖1]為本發明的第一實施例的電磁波遮斷膜的剖視圖。 [Fig. 1] is a cross-sectional view of the electromagnetic wave shielding film of the first embodiment of the present invention.
[圖2]為本發明的第二實施例的印刷電路板的製造方法的各製程的剖視圖。 [Fig. 2] is a cross-sectional view of each process of the manufacturing method of the printed circuit board of the second embodiment of the present invention.
[圖3]為本發明的第三實施例的印刷電路板的製造方法的各製程的剖視圖。 [Fig. 3] is a cross-sectional view of each process of the manufacturing method of the printed circuit board of the third embodiment of the present invention.
[圖4]為本發明的第四實施例的電磁波遮斷膜的剖視圖。 [Fig. 4] is a cross-sectional view of the electromagnetic wave shielding film of the fourth embodiment of the present invention.
[圖5]為本發明的第五實施例的印刷電路板的製造方法的各製程的剖視圖。 [FIG. 5] is a cross-sectional view of each process of the manufacturing method of the printed circuit board of the fifth embodiment of the present invention.
[圖6]為本發明的第六實施例的印刷電路板的製造方法的各製程的剖視圖。 [FIG. 6] is a cross-sectional view of each process of a manufacturing method of a printed circuit board according to a sixth embodiment of the present invention.
[圖7]為本發明的第七實施例的電磁波遮斷膜的製造方法的各製程的剖視圖。 [Fig. 7] Fig. 7 is a cross-sectional view of each process of the manufacturing method of the electromagnetic wave shielding film of the seventh embodiment of the present invention.
[圖8]為本發明的第八實施例的電磁波遮斷膜的製造方法的各製程的剖視圖。 [Fig. 8] Fig. 8 is a cross-sectional view of each process of the manufacturing method of the electromagnetic wave shielding film of the eighth embodiment of the present invention.
[圖9]為焊接耐熱性評價的階梯層疊圖及表面照片。 [Fig. 9] A step-by-step lamination diagram and surface photograph of solder heat resistance evaluation.
[圖10]為階梯開裂評價的階梯層疊圖及表面照片。 [Fig. 10] A step-by-step diagram and surface photograph of step crack evaluation.
[圖11]為電阻測試試件的圖像。 [Figure 11] is the image of the resistance test specimen.
在對本發明進行說明之前需要說明的是，在多個實施例中，對具有相同結構的結構要素採用相同的圖式標記，並在第一實施例中進行代表性的說明，在其他實施例中對與第一實施例不同的結構進行說明。 Before describing the present invention, it should be noted that in a plurality of embodiments, structural elements with the same structure are marked with the same drawings, and representative descriptions are given in the first embodiment, and in other embodiments The structure different from the first embodiment will be described.
下面，參照圖式詳細說明本發明的第一實施例的電磁波遮斷膜。 Hereinafter, the electromagnetic wave shielding film of the first embodiment of the present invention will be described in detail with reference to the drawings.
在圖式中，圖1為本發明的第一實施例的電磁波遮斷膜的剖視圖。 In the drawings, FIG. 1 is a cross-sectional view of the electromagnetic wave shielding film of the first embodiment of the present invention.
本發明的第一實施例的電磁波遮斷膜10包括承載膜11、在承載膜11的一面上形成的導電性金屬層12、在金屬層12上形成的導電性黏合層13及在導電性黏合層13上形成的保護膜14。
The electromagnetic
承載膜11可以在PET膜上層壓有鋁膜的AL-PET(Aluminum-Laminated Polyethylene Terephthalate)形式提供，或者可以在PET
膜上層壓有銅膜的Copper-PET(Copper-Laminated Polyethylene Terephthalate)形式提供。
The
金屬層12可由鎳(Nikel)、銅(Copper)、鋁(Aluminium)、鋅(Zinc)等導電率優異的金屬材料或其合金形式的金屬材料構成，可由厚度為2μm~10μm的箔(foil)形式構成。金屬層12可通過鍍覆、印刷、塗布、沉積等多種方法在承載膜11的一面上設置導電性物質來形成。也可採用在承載膜11的一面上形成有薄膜金屬層12的成品。
The
導電性黏合層13可包括導電性填料及黏合劑樹脂、固化劑、阻燃劑和添加劑等，可通過在金屬層12上塗布導電性黏合組合物的方法來形成導電性黏合層13。
The conductive
其中，黏合劑樹脂需有優異的耐熱性、耐酸性及耐鹼性，尤其優選的為黏合力優異，黏合劑的特性對導電性填料的導電性的影響較小的材料。 Among them, the adhesive resin needs to have excellent heat resistance, acid resistance, and alkali resistance, and particularly preferable is a material that has excellent adhesive force and the characteristics of the adhesive have little influence on the conductivity of the conductive filler.
當樹脂的耐熱性低時，在作為印刷電路板製造的必要製程的焊接製程中會出現表面龜裂的不良，或者因熱而導致電阻上升。此外，在製造印刷電路板時，為了降低電路電阻或防止腐蝕，可進行鍍銅或鍍金(Ag)，此時鍍覆液呈強酸性或強鹼性，因此需要優異的耐藥品性和耐鹼性。此外，在焊接前後為了進行表面清洗並去除焊劑(Flux)，可由鹼溶液進行清洗作業。根據情況，可執行通過進行軟蝕刻(Soft Etching)來提高鍍覆的均勻性和附著力的製程。 When the heat resistance of the resin is low, defects such as surface cracks may occur in the soldering process, which is a necessary process for the manufacture of printed circuit boards, or resistance may increase due to heat. In addition, in order to reduce circuit resistance or prevent corrosion when manufacturing printed circuit boards, copper or gold (Ag) plating can be carried out. In this case, the plating solution is strongly acidic or alkaline, so excellent chemical resistance and alkali resistance are required Sex. In addition, in order to clean the surface and remove the flux (Flux) before and after soldering, the cleaning operation can be performed with an alkaline solution. According to the situation, a process of improving the uniformity and adhesion of plating by performing soft etching (Soft Etching) can be performed.
導電性黏合層13需在半固化(B-Stage)狀態下臨時固定(Pre-Fix)在印刷電路板之後，採用正式固定製程來提供。因此，黏合劑樹脂須在室溫下保持半固化狀態，並且在正式固定製程中須進行完全固化(C-Stage)。
The conductive
作為導電性黏合層13的黏合劑樹脂，可使用聚乙烯醇丁醛(PVB；Polyvinyl Butyral)、纖維素(Cellulose)、聚氨酯(Polyurethane)、聚酯(Polyester)、環氧基(Epoxy)、苯氧基(Phenoxy)、酚醛(Novolac)、醇酸(Alkyd)、醯胺(Amide)、醯亞胺(Imide)樹脂或其改性物。在本實施例中，為了提高耐熱性，混合使用了聚酯樹脂的改性物及甲酚酚醛樹脂。
As the binder resin of the conductive
此外，導電性填料(Conductive Filler)可使用銀(Silver)、銅(Copper)、鋁(Aluminium)、鎳(Nikel)、金(Gold)、鋅(Zinc)、鐵(Iron)等的導電性金屬和其塗布形態。而且，其形狀可由片狀(Flake)、球狀(Spherical)、枝狀(Dendrite)、硬顆粒(Granule)等形狀構成。 In addition, conductive fillers can use conductive metals such as silver, copper, aluminum, nickel, gold, zinc, and iron. And its coating form. Moreover, its shape can be composed of flake, spherical, dendritic, Granule, or the like.
導電性填料可使用顆粒尺寸為30μm以下的填料。更加適合的是3μm以上~20μm以下為佳。當使用小於3μm的導電性填料時，會存在因樹脂引起電阻上升，因此需要更多的金屬顆粒，也會導致電阻提高的問題。此外，若採用大小大於20μm的顆粒，在塗布製程中塗布方向上會出現未塗布(缺行)的部分，且發生經乾燥的塗膜不均勻且形成針孔(Pin-hole)的問題。 As the conductive filler, a filler having a particle size of 30 μm or less can be used. More suitable is 3 μm or more to 20 μm or less. When a conductive filler of less than 3 μm is used, there is a problem of an increase in resistance due to the resin, so more metal particles are required, which also leads to an increase in resistance. In addition, if particles larger than 20 μm are used, uncoated (missing lines) will appear in the coating direction during the coating process, and the dried coating film will be uneven and pin-holes will be formed. .
保護膜14可由離型塗布有矽酮的PET薄膜來構成，可通過在導電性黏合層13上層壓通過矽酮離型處理後的保護膜14的方法來將保護膜14附著在導電性黏合層13上。
The
本實施例的電磁波遮斷膜10可由83μm厚度的承載膜11、3μm厚度的金屬層12、6μm厚度的導電性黏合層13及75μm厚度的保護膜14構成。
A conductive adhesive layer of the present embodiment is an electromagnetic wave blocking film carrier film thickness may be 83 μ m 10 11,3 μ m thickness of 12,6 μ m thickness of the
如此，具有上述結構的電磁波遮斷膜10可通過在形成有金屬層12的承載膜11上塗布導電性黏合劑來形成導電性黏合層13後附著保護膜14來製
備，或者也可在保護膜14上塗布導電性黏合劑來形成導電性黏合層13後接合形成有金屬層12的承載膜11的方法來製備。
In this way, the electromagnetic
下面，參照圖式詳細說明本發明的第二實施例的印刷電路板的製造方法。 Hereinafter, the manufacturing method of the printed circuit board of the second embodiment of the present invention will be described in detail with reference to the drawings.
在圖式中，圖2為本發明的第二實施例的印刷電路板的製造方法的每製程的剖視圖。 In the drawings, FIG. 2 is a cross-sectional view of each process of the manufacturing method of the printed circuit board according to the second embodiment of the present invention.
本發明的第二實施例的印刷電路板的製造方法包括：遮斷膜準備步驟S110、遮斷膜衝壓步驟S120、保護膜去除步驟S130、黏合步驟S140、導電性黏合層半固化步驟S150、承載膜去除步驟S160、導電性黏合層全固化步驟S170、絕緣層形成步驟S180、金屬層局部去除步驟S190及鍍層形成步驟S200。 The manufacturing method of the printed circuit board of the second embodiment of the present invention includes: a shielding film preparation step S110, a shielding film punching step S120, a protective film removal step S130, a bonding step S140, a conductive adhesive layer semi-curing step S150, a bearing Film removal step S160, conductive adhesive layer full curing step S170, insulating layer formation step S180, metal layer partial removal step S190, and plating layer formation step S200.
在遮斷膜準備步驟S110中，如圖2的(a)所示，準備依次層疊有承載膜11、金屬層12、導電性黏合層13及保護膜14的遮斷膜10。這種遮斷膜10可由上述本發明的第一實施例的電磁波遮斷膜構成。
In the shielding film preparation step S110, as shown in FIG. 2(a), a shielding
在遮斷膜衝壓步驟S120中，如圖2的(b)所示，按照作為附著對象的印刷電路板(PCB)衝壓片狀遮斷膜10。遮斷膜10的衝壓可由加壓製程或鐳射切割製程等來實現。
In the shielding film punching step S120, as shown in FIG. 2(b), the sheet-shaped
在保護膜去除步驟S130中，如圖2的(c)所示，去除配置在遮斷膜10的導電性黏合層13的一面上的保護膜14。由於保護膜14對導電性黏合層13具有適當的離型力，因此能夠容易剝離保護膜14。
In the protective film removal step S130, as shown in FIG. 2(c), the
在黏合步驟S140中，如圖2的(d)所示，將遮斷膜10的導電性黏合層13緊貼在印刷電路板(PCB)的形成有電路圖案的表面上並進行黏合。
In the bonding step S140, as shown in (d) of FIG. 2, the conductive
在導電性黏合層半固化步驟S150中，加熱遮斷膜10規定時間，以使導電性黏合層13成為半固化(B-Stage)狀態。半固化條件可根據導電性黏合層13的組合物來改變，在本實施例中採用臨時固定機在150℃的溫度、3bar的壓力下加溫加壓20秒。通過這種導電性黏合層13的半固化，增大導電性黏合層13和金屬層12的結合力。
In the conductive adhesive layer semi-curing step S150, the shielding
在承載膜去除步驟S160中，如圖2的(e)所示，去除貼合在遮斷膜10的金屬層12上的承載膜11。此時，隨著導電性黏合層13的半固化，貼合有承載膜11的金屬層12處於與導電性黏合層13的結合力增大的狀態，因此在去除承載膜11的過程中，能夠防止金屬層12從導電性黏合層13剝離。
In the carrier film removal step S160, as shown in FIG. 2(e), the
在導電性黏合層全固化步驟S170中進行加熱及加壓，以使導電性黏合層13成為完全固化(C-Stage)狀態。其中，導電性黏合層13的完全固化條件可根據導電性黏合層13的組合物來改變，在本實施例中採用熱加壓機來在150℃±10℃的溫度、40kgf/cm2(表面壓力)的壓力下加熱及加壓60分鐘。
In step S170 of fully curing the conductive adhesive layer, heating and pressing are performed to make the conductive
在絕緣層形成步驟S180中，如圖2的(f)所示，可通過按圖案製版的絲網來印刷絕緣膏之後進行乾燥而形成絕緣層22。如此可通過絲網印刷法來在所需的區域中形成絕緣層22，由此可在遮斷膜10的金屬層12上形成絕緣層22，該絕緣層22上形成有開口部22a，該開口部22a在待形成印刷電路板(PCB)的接地擴展端子的區域中形成。
In the insulating layer forming step S180, as shown in (f) of FIG. 2, the insulating paste may be formed by printing the insulating paste on a patterned screen and then drying the insulating
另外，在本實施例中除了在金屬層12上印刷絕緣膏之外，也可衝壓絕緣膜(Coverlay)，從而在待形成印刷電路板(PCB)的接地擴展端子的區域中形成開口部22a之後，貼合金屬層12來形成絕緣層22。
In addition, in this embodiment, in addition to printing insulating paste on the
當遮斷膜10的金屬層12通過導電性黏合層13與印刷電路板(PCB)的接地電路電連接後，通過絕緣層22的開口部22a露出的金屬層12可作為印刷電路板(PCB)的接地擴展端子來使用。
After the
絕緣膏可包括黏合劑樹脂、阻燃劑、著色劑和固化劑等。 The insulating paste may include binder resin, flame retardant, colorant, curing agent, and the like.
絕緣層22的黏合劑樹脂需要能夠進行塗布，且在固化後需具有較高的柔軟性，並且由於位於印刷電路板的外部，需要具有耐刮性(2H以上)。
The adhesive resin of the insulating
絕緣層22為在印刷電路板的製造製程中露出的部位，因此絕緣層22需要具有優異的耐熱性、耐藥品性、耐鹼性和耐酸性。
The insulating
尤其是，絕緣層22為直接暴露在熱的部位，因此需要具有優異的耐熱性(300℃)，在製造製程中如有表面污染，還需通過醇(異丙醇)來去除，因此還需具有優異的耐藥品性。
In particular, the insulating
此外，由於需要在絕緣層22上附著其他加強片並且進行標記，因此絕緣層22需要設計成具有優異的附著力。當表面為聚醯亞胺時，層疊附著力上會有問題，因此有時還要增加電漿(Plasma)製程。
In addition, since other reinforcing sheets need to be attached and marked on the insulating
在金屬層局部去除步驟S190中，如圖2的(g)所示，對通過絕緣層22的開口部22a露出的金屬層12進行軟蝕刻(Soft Etching)，從而在厚度方向上去除部分物質來去除(0.3~1.0μm)金屬層12的氧化表面。
In the metal layer partial removal step S190, as shown in FIG. 2(g), the
接著，在鍍層形成步驟S200中，如圖2的(h)所示，通過電鍍或無電鍍製程，在去除表面後的金屬層12上鍍覆如金(Au)的導電性抗表面氧化物質來形成鍍層30。這種鍍層30可在保護金屬層12的同時，與印刷電路板(PCB)的接地電路電連接而作為接地擴展端子來使用。
Next, in the plating layer formation step S200, as shown in FIG. 2(h), the
下面，參照圖式詳細說明本發明的第三實施例的印刷電路板的製造方法。 Hereinafter, the manufacturing method of the printed circuit board of the third embodiment of the present invention will be described in detail with reference to the drawings.
在圖式中，圖3為本發明的第三實施例的印刷電路板的製造方法的每製程的剖視圖。 In the drawings, FIG. 3 is a cross-sectional view of each process of the manufacturing method of the printed circuit board of the third embodiment of the present invention.
本發明的第三實施例的印刷電路板的製造方法包括：遮斷膜準備步驟S110、遮斷膜衝壓步驟S120、保護膜去除步驟S130、黏合步驟S140、導電性黏合層半固化步驟S150、承載膜去除步驟S160、絕緣層形成步驟S180'、金屬層局部去除步驟S190及鍍層形成步驟S200。 The manufacturing method of the printed circuit board of the third embodiment of the present invention includes: a shielding film preparation step S110, a shielding film punching step S120, a protective film removing step S130, a bonding step S140, a conductive adhesive layer semi-curing step S150, a bearing The film removing step S160, the insulating layer forming step S180', the metal layer partial removing step S190, and the plating layer forming step S200.
在本發明的第三實施例中，除絕緣層形成步驟S180'之外的其餘步驟與第二實施例相同，因此省略對相同步驟的具體說明。 In the third embodiment of the present invention, the rest of the steps except for the insulating layer forming step S180' are the same as the second embodiment, so a detailed description of the same steps is omitted.
絕緣層形成步驟S180'包括覆蓋面準備步驟S181、覆蓋面衝壓步驟S182、保護膜去除步驟S183、接合步驟S184、黏合層半固化步驟S185、承載膜去除步驟S186及黏合層全固化步驟S187。 The insulating layer forming step S180' includes a covering surface preparation step S181, a covering surface punching step S182, a protective film removing step S183, a joining step S184, an adhesive layer semi-curing step S185, a carrier film removing step S186, and an adhesive layer full curing step S187.
在覆蓋面準備步驟S181中，如圖3的(f)所示，準備依次層疊有承載膜21、絕緣層22、黏合層23及保護膜24的覆蓋面20。
In the covering surface preparation step S181, as shown in FIG. 3(f), the covering
在本實施例中，覆蓋面20可由55μm厚度的承載膜21、7μm厚度的絕緣層22、8μm厚度的黏合層23及75μm厚度的保護膜24構成。覆蓋面20的承載膜21可以半無光PET(semi-matt PET)的形式提供，絕緣層22及黏合層23可包括吸光物質。
In the present embodiment, the insulating layer, the coverage of the
在覆蓋面衝壓步驟S182中，如圖3的(g)所示，衝壓覆蓋面20來在待形成接地擴展端子的區域中形成圖3的(j)所示的開口部22a。衝壓覆蓋面20可由加壓製程或鐳射切割製程來完成。
In the covering surface punching step S182, as shown in FIG. 3(g), the covering
在保護膜去除步驟S183中，如圖3的(h)所示，去除配置在覆蓋面20的黏合層23的一面上的保護膜24。由於保護膜24對導電性黏合層23具有適當的離型力，因此能夠容易剝離保護膜14。
In the protective film removal step S183, as shown in FIG. 3(h), the
在接合步驟S184中，如圖3的(i)所示，將覆蓋面20的黏合層23緊貼在遮斷膜10的金屬層12上進行黏合。
In the joining step S184, as shown in (i) of FIG. 3, the
在黏合層半固化步驟S185中，加熱覆蓋面20規定的時間，以使覆蓋面20的黏合層23成為半固化(B-Stage)狀態。半固化條件可根據導電性黏合層23的組合物來改變，在本實施例中採用臨時固定機在150℃的溫度、3bar的壓力下加溫加壓20秒。通過這種導電性黏合層23的半固化，增大導電性黏合層23和金屬層12的結合力。
In the adhesive layer semi-curing step S185, the covering
在承載膜去除步驟S186中，如圖3的(j)所示，去除貼合在覆蓋面20的絕緣層22上的承載膜21。此時，隨著黏合層23的半固化，貼合有承載膜21的絕緣層22處於與黏合層23的結合力增大的狀態，因此在去除承載膜21的過程中，能夠防止絕緣層22從黏合層23剝離。另外，遮斷膜10的導電性黏合層13也是經半固化而處於與金屬層12及印刷電路板(PCB)之間的結合力增大的狀態，因此在去除覆蓋面20的承載膜21的過程中，能夠防止金屬層12和導電性黏合層13之間的接合面分離或導電性黏合層13和印刷電路板(PCB)之間的接合面分離。
In the carrier film removal step S186, as shown in FIG. 3(j), the
在黏合層全固化步驟S187中進行加熱及加壓，以使黏合層23成為完全固化(C-Stage)狀態。其中，黏合層23的完全固化條件可根據黏合層23的組合物來改變，在本實施例中使用熱加壓機來在150℃±10℃的溫度、40kgf/cm2(表面壓力)的壓力下加熱及加壓60分鐘。
Heating and pressing are performed in step S187 of fully curing the adhesive layer so that the
另外，本實施例在執行黏合層全固化步驟S187的過程中能夠完全固化遮斷膜10的導電性黏合層13，因此可以省略第二實施例中的導電性黏合層全固化步驟S170。為此，優選的將覆蓋面20的黏合層23構成為能夠在與遮斷膜10的導電性黏合層13相同的條件下完全固化。
In addition, in the present embodiment, the conductive
如上，對於接合在遮斷膜10的金屬層12上側的覆蓋面20的絕緣層22而言，在待形成印刷電路板(PCB)的接地擴展端子的區域中形成有開口部22a。即，遮斷膜10的金屬層12通過導電性黏合層13與印刷電路板(PCB)的接地電路電連接，與接地電路連接的金屬層12通過絕緣層22的開口部22a露出，因此露出的金屬層12可作為印刷電路板(PCB)的接地擴展端子使用。
As above, for the insulating
另外，覆蓋面20的絕緣層22優選的由與第二實施例的絕緣層22相同的材質構成。
In addition, the insulating
如上在遮斷膜10的上側層疊絕緣層22之後，如圖3的(k)及(l)所示，執行金屬層局部去除步驟S190及鍍層形成步驟S200，以在通過絕緣層22的開口部22a露出的金屬層12上形成鍍層30。
After the insulating
如此，在使用覆蓋面20的情況下，可以如本實施例那樣依次執行遮斷膜準備步驟S110至絕緣層形成步驟S180'，也可以與上述順序無關地分別層疊加壓遮斷膜10及覆蓋面20而製造。
In this way, in the case of using the
下面，參照圖式詳細說明本發明的第四實施例的電磁波遮斷膜。 Hereinafter, the electromagnetic wave shielding film of the fourth embodiment of the present invention will be described in detail with reference to the drawings.
在圖式中，圖4為本發明的第四實施例的電磁波遮斷膜的剖視圖。 In the drawings, FIG. 4 is a cross-sectional view of the electromagnetic wave shielding film of the fourth embodiment of the present invention.
本發明的第四實施例的電磁波遮斷膜10'包括承載膜11、在承載膜11的一面上形成的導電性金屬層12、在金屬層12上形成的導電層15、在導電層15上形成的導電性黏合層13及在導電性黏合層13上形成的保護膜14。
The electromagnetic wave shielding film 10' of the fourth embodiment of the present invention includes a
導電層15優選的由導電率比金屬層12的導電率相對優異的材質構成，可通過在金屬層12上塗布導電率優異的銀(Silver)墨而形成導電層15。
導電層15的塗布方法可採用凹版塗布、絲網印刷、狹縫式模具塗布或旋轉塗布等。如此在金屬層12上形成導電層15的情況下，能夠進一步提高電磁波遮斷效果。
The
另外，除導電層15之外的其他結構與圖1所示的第一實施例的電磁波遮斷膜相同，因此省略對相同結構的具體說明。
In addition, the structure other than the
下面，參照圖式詳細說明本發明的第五實施例的印刷電路板的製造方法。 Hereinafter, the manufacturing method of the printed circuit board of the fifth embodiment of the present invention will be described in detail with reference to the drawings.
在圖式中，圖5為本發明的第五實施例的印刷電路板的製造方法的每製程的剖視圖。 In the drawings, FIG. 5 is a cross-sectional view of each process of the manufacturing method of the printed circuit board of the fifth embodiment of the present invention.
圖5所示的本發明的第五實施例的印刷電路板的製造方法在使用本發明的第四實施例的電磁波遮斷膜10'這一點上與第二實施例的印刷電路板的製造方法不同。 The manufacturing method of the printed circuit board of the fifth embodiment of the present invention shown in FIG. 5 differs from the manufacturing method of the printed circuit board of the second embodiment in that the electromagnetic wave shielding film 10' of the fourth embodiment of the present invention is used. different.
具體而言，圖5所示的本發明的第五實施例的印刷電路板的製造方法包括遮斷膜準備步驟S110'、遮斷膜衝壓步驟S120、保護膜去除步驟S130、黏合步驟S140、導電性黏合層半固化步驟S150、承載膜去除步驟S160、絕緣層形成步驟S180、金屬層局部去除步驟S190及鍍層形成步驟S200。 Specifically, the manufacturing method of the printed circuit board of the fifth embodiment of the present invention shown in FIG. 5 includes a shielding film preparation step S110', a shielding film punching step S120, a protective film removal step S130, a bonding step S140, and a conductive film. The adhesive layer semi-curing step S150, the carrier film removal step S160, the insulating layer formation step S180, the metal layer partial removal step S190, and the plating layer formation step S200.
在遮斷膜準備步驟S110'中，如圖5的(a)所示，準備層疊有承載膜11、金屬層12、導電層15、導電性黏合層13及保護膜14的遮斷膜10'。這種遮斷膜10'可由本發明的第四實施例的電磁波遮斷膜10'構成。
In the shielding film preparation step S110', as shown in FIG. 5(a), a shielding film 10' in which a
導電層15為通過在金屬層12上塗布導電率比金屬層12的導電率相對優異的銀(Silver)墨而形成的。銀墨可通過凹版塗布、絲網印刷、狹縫式模具塗布或旋轉塗布等來塗布於金屬層12上。
The
在本實施例中，除遮斷膜準備步驟S110'之外的其他步驟與圖2所示的第二實施例的印刷電路製造方法相同，因此省略對相同步驟的具體說明。 In this embodiment, the steps other than the shielding film preparation step S110' are the same as the printed circuit manufacturing method of the second embodiment shown in FIG. 2, and therefore, detailed description of the same steps is omitted.
此外，圖6為本發明的第六實施例的印刷電路板的製造方法的每製程的剖視圖。 In addition, FIG. 6 is a cross-sectional view of each process of the manufacturing method of the printed circuit board of the sixth embodiment of the present invention.
本發明的第六實施例的印刷電路板的製造方法包括遮斷膜準備步驟S110'、遮斷膜衝壓步驟S120、保護膜去除步驟S130、黏合步驟S140、導電性黏合層半固化步驟S150、承載膜去除步驟S160、絕緣層形成步驟S180'、金屬層局部去除步驟S190及鍍層形成步驟S200。 The manufacturing method of the printed circuit board of the sixth embodiment of the present invention includes a shielding film preparation step S110', a shielding film punching step S120, a protective film removal step S130, a bonding step S140, a conductive adhesive layer semi-curing step S150, a carrier The film removing step S160, the insulating layer forming step S180', the metal layer partial removing step S190, and the plating layer forming step S200.
在本實施例中，遮斷膜準備步驟S110'與圖5所示的第五實施例的遮斷膜準備步驟S110'相同，除遮斷膜準備步驟S110'之外的其他步驟與圖3所示的第三實施例的遮斷膜衝壓步驟S120至鍍層形成步驟S200相同，因此省略對相同步驟的具體說明。 In this embodiment, the shielding film preparation step S110' is the same as the shielding film preparation step S110' of the fifth embodiment shown in FIG. 5, and the other steps except the shielding film preparation step S110' are the same as those shown in FIG. 3. The shielding film punching step S120 to the plating layer forming step S200 of the third embodiment shown are the same, so a detailed description of the same steps is omitted.
下面，參照圖式詳細說明本發明的第七實施例的電磁波遮斷膜的製造方法。 Hereinafter, the manufacturing method of the electromagnetic wave shielding film of the seventh embodiment of the present invention will be described in detail with reference to the drawings.
在圖式中，圖7為表示本發明的第七實施例的電磁波遮斷膜的製造方法的每製程的剖視圖。 In the drawings, FIG. 7 is a cross-sectional view of each process of the manufacturing method of the electromagnetic wave shielding film of the seventh embodiment of the present invention.
本發明的第七實施例的電磁波遮斷膜的製造方法包括：金屬層準備步驟S210、在金屬層12的一面上形成導電性黏合層13的導電性黏合層形成步驟S220、在導電性黏合層13上接合第一保護膜14的第一保護膜形成步驟S230、
在金屬層12的另一面上形成絕緣層22的絕緣層形成步驟S240、以及在絕緣層22上形成第二保護膜14'的第二保護膜形成步驟S250。
The manufacturing method of the electromagnetic wave shielding film of the seventh embodiment of the present invention includes: a metal layer preparation step S210, a conductive adhesive layer forming step S220 of forming a conductive
在金屬層準備步驟S210中，如圖7的(a)所示，準備以導電率優異的銅箔(copper foil)形式提供的金屬層12。
In the metal layer preparation step S210, as shown in (a) of FIG. 7, the
在導電性黏合層形成步驟S220中，如圖7的(b)所示，在金屬層12的一面上塗布導電性黏合劑之後進行乾燥，以形成導電性黏合層13。其中，導電性黏合層13可包括導電性填料、黏合劑樹脂、固化劑、阻燃劑和添加劑等，可通過在金屬層12上塗布導電性黏合組合物的方法來形成導電性黏合層13。
In the conductive adhesive layer forming step S220, as shown in FIG. 7(b), a conductive adhesive is coated on one surface of the
在第一保護膜形成步驟S230中，如圖7的(c)所示，可採用在導電性黏合層13上層壓經矽酮離型處理的第一保護膜14的方法。其中，第一保護膜14可由離型塗布有矽酮的PET薄膜來構成。
In the first protective film forming step S230, as shown in FIG. 7(c), a method of laminating the first
在絕緣層形成步驟S240中，如圖7的(d)所示，可在金屬層12的另一面上塗布絕緣膏之後進行乾燥，以形成絕緣層22。其中，絕緣膏可包括黏合劑樹脂、阻燃劑、著色劑和固化劑等。
In the insulating layer forming step S240, as shown in FIG. 7(d), the insulating paste may be coated on the other surface of the
在第二保護膜形成步驟S250中，如圖7的(e)所示，可採用在絕緣層22上層壓經矽酮離型處理的第二保護膜14'的方法。其中，第二保護膜14'可由離型塗布有矽酮的PET薄膜來構成。
In the second protective film forming step S250, as shown in FIG. 7(e), a method of laminating the second protective film 14' with silicone release treatment on the insulating
如上製備的電磁波遮斷膜如圖2的(c)至(e)中示出的保護膜去除步驟S130至導電性黏合層全固化步驟S170所示，可通過如下步驟在印刷電路板上接合電磁波遮斷膜：即，剝離用於保護導電性黏合層13的第一保護膜14來露出導電性黏合層13，將露出的導電性黏合層13黏合在印刷電路板上的狀態
下進行半固化，去除用於保護絕緣層22的第二保護膜14'之後，使導電性黏合層13完全固化。
The electromagnetic wave shielding film prepared as above is shown in the protective film removal step S130 to the conductive adhesive layer full curing step S170 shown in (c) to (e) of FIG. 2, and the electromagnetic wave can be bonded on the printed circuit board through the following steps Blocking film: That is, the state where the first
即，在導電性黏合層13的半固化狀態下，導電性黏合層13與金屬層12的結合力增大，因此在去除第二保護膜14'的過程中，能夠防止金屬層12和導電性黏合層13之間的接合面或者導電性黏合層13和印刷電路板之間的接合面分離。
That is, in the semi-cured state of the conductive
在圖式中，圖8為表示本發明的第八實施例的電磁波遮斷膜的製造方法的每製程的剖視圖。 In the drawings, FIG. 8 is a cross-sectional view of each process of the manufacturing method of the electromagnetic wave shielding film of the eighth embodiment of the present invention.
本發明的第八實施例的電磁波遮斷膜的製造方法包括金屬層準備步驟S210、在金屬層12的一面上形成導電層15的導電層形成步驟S211、在導電層15上形成導電性黏合層13的導電性黏合層形成步驟S220、在導電性黏合層13上接合第一保護膜14的第一保護膜形成步驟S230、在金屬層12的另一面上形成絕緣層22的絕緣層形成步驟S240、以及在絕緣層22上形成第二保護膜14'的第二保護膜形成步驟S250。
The manufacturing method of the electromagnetic wave shielding film of the eighth embodiment of the present invention includes a metal layer preparation step S210, a conductive layer forming step S211 of forming a
在導電層形成步驟S211中，如圖8的(b)所示，可通過在金屬層12上塗布導電率優異的銀(Silver)墨來形成導電層15。導電層15的塗布方法可採用凹版塗布、絲網印刷、狹縫式模具塗布或旋轉塗布等。如此在金屬層12上形成導電層15的情況下，能夠進一步提高電磁波遮斷效果。
In the conductive layer forming step S211, as shown in (b) of FIG. 8, the
接下來，在導電性黏合層形成步驟S230中，如圖8的(c)所示，在導電層15上塗布導電性黏合劑之後進行乾燥，以形成導電性黏合層13。
Next, in the conductive adhesive layer forming step S230, as shown in (c) of FIG. 8, a conductive adhesive is coated on the
另外，在本發明的第八實施例中，除導電層形成步驟S211之外的其他步驟與上述第七實施例相同，因此省略對相同步驟的具體說明。 In addition, in the eighth embodiment of the present invention, the steps other than the conductive layer forming step S211 are the same as the seventh embodiment described above, and therefore, a detailed description of the same steps is omitted.
下面，通過為了證明本發明的電磁波遮斷膜、印刷電路板的製造方法及電磁波遮斷膜的製造方法的優異性而實施的實施例及實驗結果，詳細說明本發明。但是，以下的實施例是為了舉例而示出的，本發明並不局限於以下的實施例。 Hereinafter, the present invention will be described in detail through examples and experimental results carried out to prove the superiority of the electromagnetic wave shielding film, the method of manufacturing a printed circuit board, and the method of manufacturing the electromagnetic wave shielding film of the present invention. However, the following embodiments are shown for example, and the present invention is not limited to the following embodiments.
<實施例1> <Example 1>
在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-5000，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為4μm的球形AgCu(S-403，JB caltech公司)作為導電性填料來投放14重量份，並且進一步攪拌一個小時。 Put 67 parts by weight of polyurethane-modified polyester resin (IT-5000, Nanolucos) into the blender, cresol dissolved in MIBK (Methyl isobutyl ketone, methyl isobutyl ketone) with a solid content of 70% 10 parts by weight of a phenolic resin solution and 9 parts by weight of cyclohexanone as a solvent were stirred for two hours, and then a spherical AgCu (S-403, JB caltech company) coated with silver and an average particle size of 4 μm ) As a conductive filler, 14 parts by weight were added, and the mixture was further stirred for one hour.
採用SUS1000目篩檢程式對製備出的導電性黏合劑進行過濾，獲得各向異性導電性(Anisotropy conductive)黏合劑組合物。 The prepared conductive adhesive was filtered using a SUS1000 mesh screening program to obtain an anisotropy conductive adhesive composition.
通過狹縫式模具，在附著有承載膜的銅箔(Copper foil，銅厚為3μm)的表面上塗布所製備的各向異性導電性黏合劑組合物，並在150℃的溫度下加熱兩分鐘而形成乾燥後厚度為3μm的各向異性導電性黏合劑層。之後，在各向異性導電性黏合劑層上層壓經矽酮離型處理的50μm厚度的PET保護膜，以完成製備。 Coat the prepared anisotropic conductive adhesive composition on the surface of a copper foil (copper foil with a thickness of 3 μm ) attached with a carrier film through a slit mold, and heat it at a temperature of 150°C After two minutes, an anisotropic conductive adhesive layer with a thickness of 3 μm after drying was formed. After that, a 50 μm thick PET protective film with a silicone release treatment was laminated on the anisotropic conductive adhesive layer to complete the preparation.
<實施例2> <Example 2>
在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-5000，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)
9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為4μm的球形AgCu(S-403，JB caltek)作為導電性填料來投放14重量份，進一步攪拌一個小時。
Put 67 parts by weight of polyurethane-modified polyester resin (IT-5000, Nanolucos) into the blender, cresol dissolved in MIBK (Methyl isobutyl ketone, methyl isobutyl ketone) with a solid content of 70% 10 parts by weight of phenolic resin solution and 9 parts by weight of cyclohexanone as a solvent. After stirring for two hours, a spherical AgCu (S-403, JB caltek) coated with silver and an average particle size of 4
採用SUS1000目篩檢程式對製備出的導電性黏合劑進行過濾，獲得各向異性導電性(Anisotropy conductive)黏合劑組合物。 The prepared conductive adhesive was filtered using a SUS1000 mesh screening program to obtain an anisotropy conductive adhesive composition.
通過狹縫式模具，在附著有承載膜的銅箔(Copper foil，銅厚為6μm)的表面上塗布所製備的各向異性導電性黏合劑組合物，並在150℃的溫度下加熱兩分鐘而形成乾燥後厚度為3μm的各向異性導電性黏合劑層。之後，在各向異性導電性黏合劑層上層壓經矽酮離型處理的50μm厚度的PET保護膜，以完成製備。 Coat the prepared anisotropic conductive adhesive composition on the surface of the copper foil (Copper foil with a copper thickness of 6 μm ) to which the carrier film is attached through a slit mold, and heat it at a temperature of 150°C After two minutes, an anisotropic conductive adhesive layer with a thickness of 3 μm after drying was formed. After that, a 50 μm thick PET protective film with a silicone release treatment was laminated on the anisotropic conductive adhesive layer to complete the preparation.
<實施例3> <Example 3>
在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-5000，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為4μm的球形AgCu(S-403，JB caltech)作為導電性填料來投放14重量份，進一步攪拌一個小時。
Put 67 parts by weight of polyurethane-modified polyester resin (IT-5000, Nanolucos) into the blender, cresol dissolved in MIBK (Methyl isobutyl ketone, methyl isobutyl ketone) with a solid content of 70% 10 parts by weight of phenolic resin solution and 9 parts by weight of cyclohexanone as a solvent. After stirring for two hours, spherical AgCu (S-403, JB caltech) coated with silver and having an average particle size of 4
採用SUS1000目篩檢程式對製備出的導電性黏合劑進行過濾，獲得各向異性導電性(Anisotropy conductive)黏合劑組合物。 The prepared conductive adhesive was filtered using a SUS1000 mesh screening program to obtain an anisotropy conductive adhesive composition.
通過狹縫式模具，在附著有承載膜的銅箔(Copper foil，銅厚為10μm)的表面上塗布所製備的各向異性導電性黏合劑組合物，並在150℃的溫度下加熱兩分鐘而形成乾燥後厚度為3μm的各向異性導電性黏合劑層。之後，在各向異性導電性黏合劑層上層壓經矽酮離型處理的50μm厚度的PET保護膜，以完成製備。 Coat the prepared anisotropic conductive adhesive composition on the surface of a copper foil (copper foil with a thickness of 10 μm ) attached with a carrier film through a slit mold, and heat it at a temperature of 150°C After two minutes, an anisotropic conductive adhesive layer with a thickness of 3 μm after drying was formed. After that, a 50 μm thick PET protective film with a silicone release treatment was laminated on the anisotropic conductive adhesive layer to complete the preparation.
<實施例4> <Example 4>
在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-180，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為7μm的枝狀AgCu(ACBY-2F，三井金屬)作為導電性填料來投放14重量份，進一步攪拌一個小時。
Add 67 parts by weight of polyurethane-modified polyester resin (IT-180, Narrow Paint) into the blender, cresol dissolved in MIBK (Methyl isobutyl ketone) at 70%
採用SUS1000目篩檢程式對製造出的導電性黏合劑進行過濾，獲得各向同性導電性(Anisotropy conductive)黏合劑組合物。 The manufactured conductive adhesive was filtered with a SUS1000 mesh screening program to obtain an isotropy conductive adhesive composition.
通過狹縫式模具，在附著有承載膜的銅箔(Copper foil，銅厚為3μm)的表面上塗布所製備的各向同性導電性黏合劑組合物，並在150℃的溫度下加熱兩分鐘而形成乾燥後厚度為7μm的各向同性導電性黏合劑層。之後，在各向同性導電性黏合劑層上層壓經丙烯酸黏合處理的50μm厚度的PET保護膜，以完成製備。 Coat the prepared isotropic conductive adhesive composition on the surface of the copper foil (copper foil with a copper thickness of 3 μm ) to which the carrier film is attached through a slit mold, and heat it at a temperature of 150°C After two minutes, an isotropic conductive adhesive layer with a thickness of 7 μm after drying was formed. After that, a 50 μm- thick PET protective film treated with acrylic bonding was laminated on the isotropic conductive adhesive layer to complete the preparation.
<實施例5> <Example 5>
通過微凹版塗布機在附著有承載膜的銅箔(Copper foil，銅厚為3μm)的表面上塗布銀墨(TEC-CO-021，印可得股份有限公司)後，在150℃下加溫燒結四分鐘，以製備厚度為0.5μm的銀金屬層。 After applying silver ink (TEC-CO-021, Inkable Co., Ltd.) on the surface of copper foil (copper foil with a thickness of 3 μm ) attached with a carrier film by a micro gravure coater, add it at 150°C Warm sintering was performed for four minutes to prepare a silver metal layer with a thickness of 0.5 μm .
此外，在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-5000，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為4μm的
球形AgCu(S-403，JB caltech)作為導電性填料來投放14重量份，進一步攪拌一個小時。
In addition, add 67 parts by weight of polyurethane-modified polyester resin (IT-5000, Nalu Paint) into the blender, dissolved in MIBK (Methyl isobutyl ketone, methyl isobutyl ketone) with a solid content of 70% 10 parts by weight of cresol phenolic resin solution and 9 parts by weight of cyclohexanone as a solvent were stirred for two hours, then spherical AgCu (S-403, JB) coated with silver and an average particle size of 4 μm Caltech) was added as a
採用SUS1000目篩檢程式對製備出的導電性黏合劑進行過濾，獲得各向異性導電性(Anisotropy conductive)黏合劑組合物。 The prepared conductive adhesive was filtered using a SUS1000 mesh screening program to obtain an anisotropy conductive adhesive composition.
通過狹縫式模具，在附著有承載膜的銅箔(Copper foil，銅厚為3μm)的表面上塗布所製備的各向異性導電性黏合劑組合物，並在150℃的溫度下加熱兩分鐘而形成乾燥後厚度為3μm的各向異性導電性黏合劑層。之後，在各向異性導電性黏合劑層上層壓經矽酮離型處理的50μm厚度的PET保護膜，以完成製備。 Coat the prepared anisotropic conductive adhesive composition on the surface of a copper foil (copper foil with a thickness of 3 μm ) attached with a carrier film through a slit mold, and heat it at a temperature of 150°C After two minutes, an anisotropic conductive adhesive layer with a thickness of 3 μm after drying was formed. After that, a 50 μm thick PET protective film with a silicone release treatment was laminated on the anisotropic conductive adhesive layer to complete the preparation.
<實施例6> <Example 6>
在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-5000，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為4μm的球形AgCu(S-403，JB caltech)作為導電性填料來投放14重量份，進一步攪拌一個小時。
Put 67 parts by weight of polyurethane-modified polyester resin (IT-5000, Nanolucos) into the blender, cresol dissolved in MIBK (Methyl isobutyl ketone, methyl isobutyl ketone) with a solid content of 70% 10 parts by weight of phenolic resin solution and 9 parts by weight of cyclohexanone as a solvent. After stirring for two hours, spherical AgCu (S-403, JB caltech) coated with silver and having an average particle size of 4
採用SUS1000目篩檢程式對製備出的導電性黏合劑進行過濾，獲得各向異性導電性(Anisotropy conductive)黏合劑組合物。 The prepared conductive adhesive was filtered using a SUS1000 mesh screening program to obtain an anisotropy conductive adhesive composition.
通過狹縫式模具，在附著有承載膜的銅箔(Copper foil，銅厚為3μm)的表面上塗布所製備的各向異性導電性黏合劑組合物，並在150℃的溫度下加熱兩分鐘而形成乾燥後厚度為3μm的各向異性導電性黏合劑層。之後，在各向異性導電性黏合劑層上層壓經矽酮離型處理的50μm厚度的PET保護膜，以完成製備。 Coat the prepared anisotropic conductive adhesive composition on the surface of a copper foil (copper foil with a thickness of 3 μm ) attached with a carrier film through a slit mold, and heat it at a temperature of 150°C After two minutes, an anisotropic conductive adhesive layer with a thickness of 3 μm after drying was formed. After that, a 50 μm thick PET protective film with a silicone release treatment was laminated on the anisotropic conductive adhesive layer to complete the preparation.
此外，在聚醯亞胺改性樹脂(HPC-9000-21，日立化學)50重量份中投入作為阻燃性填料的氫氧化鋁(OSDH-3，午星企業)3重量份和分散劑(BYK-167，拜耳公司)2重量份，並將環己酮(Cyclohexanone)45重量份作為溶劑投入後攪拌20分鐘。將攪拌後的混合溶液放入裝有5μm大小的氧化鋯微球的籃式砂磨機(DWS-25，大元estec)，並以1500rpm分散10分鐘後冷卻至常溫。 In addition, in 50 parts by weight of polyimide modified resin (HPC-9000-21, Hitachi Chemical), 3 parts by weight of aluminum hydroxide (OSDH-3, Wuxing Enterprise) and dispersant ( BYK-167, Bayer) 2 parts by weight, and 45 parts by weight of cyclohexanone (Cyclohexanone) were added as a solvent and stirred for 20 minutes. The stirred mixed solution was put into a basket sand mill (DWS-25, Dayuan estec) equipped with 5 μm zirconia microspheres, and dispersed at 1500 rpm for 10 minutes and then cooled to room temperature.
在該分散液100重量份中投入改性環氧樹脂(Arakid-9201N，荒川化學)5重量份並進行低速攪拌一小時後，用SUS1000目過濾而獲得絕緣層組合物。 After adding 5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical) to 100 parts by weight of the dispersion liquid and stirring at low speed for one hour, it was filtered with SUS1000 mesh to obtain an insulating layer composition.
去除上述過程中製備的各向異性導電性電磁波遮斷膜的承載膜後，通過狹縫式模具塗布絕緣層組合物，並在150℃的溫度下加熱五分鐘而形成乾燥後厚度為5μm的絕緣層，以製備實施例6的電磁波遮斷膜。 After removing the carrier film of the anisotropic conductive electromagnetic wave shielding film prepared in the above process, the insulating layer composition is coated by a slit die, and heated at a temperature of 150°C for five minutes to form a dried thickness of 5 μm To prepare the electromagnetic wave shielding film of Example 6.
<實施例7> <Example 7>
在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-180，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為7μm的枝狀的AgCu(ACBY-2F，三井金屬)作為導電性填料來投放14重量份，進一步攪拌一個小時。
Add 67 parts by weight of polyurethane-modified polyester resin (IT-180, Narrow Paint) into the blender, cresol dissolved in MIBK (Methyl isobutyl ketone) at 70%
採用SUS1000目篩檢程式對製備出的導電性黏合劑進行過濾，獲得各向同性導電性(Anisotropy conductive)黏合劑組合物。 The prepared conductive adhesive was filtered using a SUS1000 mesh screening program to obtain an isotropic conductive (Anisotropy conductive) adhesive composition.
通過狹縫式模具，在附著有承載膜的銅箔(Copper foil，銅厚為3μm)的表面上塗布所製備的各向同性導電性黏合劑組合物，並在150℃的溫度下 加熱兩分鐘而形成乾燥後厚度為7μm的各向同性導電性黏合劑層。之後，在各向同性導電性黏合劑層上層壓經丙烯酸黏合處理的50μm厚度的PET保護膜，以完成製備。 Coat the prepared isotropic conductive adhesive composition on the surface of the copper foil (copper foil with a copper thickness of 3 μm ) to which the carrier film is attached through a slit mold, and heat it at a temperature of 150°C After two minutes, an isotropic conductive adhesive layer with a thickness of 7 μm after drying was formed. After that, a 50 μm- thick PET protective film treated with acrylic bonding was laminated on the isotropic conductive adhesive layer to complete the preparation.
此外，在聚醯亞胺改性樹脂(HPC-9000-21，日立化學)50重量份中投入作為阻燃性填料的氫氧化鋁(OSDH-3，午星企業)3重量份和分散劑(BYK-167，拜耳公司)2重量份，並將環己酮(Cyclohexanone)45重量份作為溶劑投入後攪拌20分鐘。將攪拌後的混合溶液放入裝有5μm大小的氧化鋯微球的籃式砂磨機(DWS-25，大元estec)，並以1500rpm分散10分鐘後冷卻至常溫。 In addition, in 50 parts by weight of polyimide modified resin (HPC-9000-21, Hitachi Chemical), 3 parts by weight of aluminum hydroxide (OSDH-3, Wuxing Enterprise) and dispersant ( BYK-167, Bayer) 2 parts by weight, and 45 parts by weight of cyclohexanone (Cyclohexanone) were added as a solvent and stirred for 20 minutes. The stirred mixed solution was put into a basket sand mill (DWS-25, Dayuan estec) equipped with 5 μm zirconia microspheres, and dispersed at 1500 rpm for 10 minutes and then cooled to room temperature.
在該分散液100重量份中投入改性環氧樹脂(Arakid-9201N，荒川化學)5重量份並進行低速攪拌一小時後，用SUS1000目過濾而獲得絕緣層組合物。 After adding 5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical) to 100 parts by weight of the dispersion liquid and stirring at low speed for one hour, it was filtered with SUS1000 mesh to obtain an insulating layer composition.
去除上述過程中製備的各向異性導電性電磁波遮斷膜的承載膜後，通過狹縫式模具塗布絕緣層組合物，並在150℃的溫度下加熱五分鐘而形成乾燥後厚度為5μm的絕緣層，以製備實施例7的電磁波遮斷膜。 After removing the carrier film of the anisotropic conductive electromagnetic wave shielding film prepared in the above process, the insulating layer composition is coated by a slit die, and heated at a temperature of 150°C for five minutes to form a dried thickness of 5 μm To prepare the electromagnetic wave shielding film of Example 7.
<比較例1> <Comparative Example 1>
在聚醯亞胺改性樹脂(HPC-9000-21，日立化學)50重量份中投入作為阻燃性填料的氫氧化鋁(OSDH-3，午星企業)3重量份和分散劑(BYK-167，拜耳公司)2重量份，並將環己酮(Cyclohexanone)45重量份作為溶劑投入後攪拌20分鐘。將攪拌後的混合溶液放入裝有5μm大小的氧化鋯微球的籃式砂磨機(DWS-25，大元estec)，並以1500rpm分散10分鐘後冷卻至常溫。 Add 3 parts by weight of aluminum hydroxide (OSDH-3, Wuxing Enterprise) as a flame-retardant filler to 50 parts by weight of polyimide modified resin (HPC-9000-21, Hitachi Chemical) and dispersant (BYK- 167, Bayer) 2 parts by weight, and 45 parts by weight of cyclohexanone (Cyclohexanone) were added as a solvent and stirred for 20 minutes. The stirred mixed solution was put into a basket sand mill (DWS-25, Dayuan estec) equipped with 5 μm zirconia microspheres, and dispersed at 1500 rpm for 10 minutes and then cooled to room temperature.
在該分散液100重量份中投入改性環氧樹脂(Arakid-9201N，荒川化學)5重量份並進行低速攪拌一小時後，用SUS1000目過濾而獲得絕緣層組合物。 After adding 5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical) to 100 parts by weight of the dispersion liquid and stirring at low speed for one hour, it was filtered with SUS1000 mesh to obtain an insulating layer composition.
在經矽酮離型處理的50μm厚度的PET膜上塗布絕緣層組合物，並在150℃下乾燥兩分鐘，獲得乾燥後厚度為7μm的塗膜。 The insulating layer composition was coated on a 50 μm thick PET film subjected to silicone release treatment, and dried at 150° C. for two minutes to obtain a coating film with a thickness of 7 μm after drying.
在該絕緣層上以濺射方式沉積銀(Silver)，形成0.2μm厚度的銀金屬層。 On the insulating layer, silver was deposited by sputtering to form a silver metal layer with a thickness of 0.2 μm .
此外，在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-5000，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為4μm的球形AgCu(S-403，JB caltech)作為導電性填料來投放14重量份，進一步攪拌一個小時。
In addition, add 67 parts by weight of polyurethane-modified polyester resin (IT-5000, Nalu Paint) into the blender, dissolved in MIBK (Methyl isobutyl ketone, methyl isobutyl ketone) with a solid content of 70% 10 parts by weight of cresol phenolic resin solution and 9 parts by weight of cyclohexanone as a solvent were stirred for two hours, then spherical AgCu (S-403, JB) coated with silver and an average particle size of 4 μm Caltech) was added as a
採用SUS1000目篩檢程式對製備出的導電性黏合劑進行過濾，獲得各向異性導電性(Anisotropy conductive)黏合劑組合物。 The prepared conductive adhesive was filtered using a SUS1000 mesh screening program to obtain an anisotropy conductive adhesive composition.
通過狹縫式模具，在銀金屬層表面上塗布所製備的各向異性導電性黏合劑組合物，並在150℃下加熱兩分鐘而形成乾燥後厚度為3μm的各向異性導電性黏合劑層。之後，在各向異性導電性黏合劑層上層壓經矽酮離型處理的50μm厚度的PET保護膜，以製備比較例1。 Coat the prepared anisotropic conductive adhesive composition on the surface of the silver metal layer through a slit mold, and heat it at 150°C for two minutes to form an anisotropic conductive adhesive with a thickness of 3 μm after drying Agent layer. After that, a 50 μm- thick PET protective film with a silicone release treatment was laminated on the anisotropic conductive adhesive layer to prepare Comparative Example 1.
<比較例2> <Comparative Example 2>
在聚醯亞胺改性樹脂(HPC-9000-21，日立化學)50重量份中投入作為阻燃性填料的氫氧化鋁(OSDH-3，午星企業)3重量份和分散劑 (BYK-167，拜耳公司)2重量份，並將環己酮(Cyclohexanone)45重量份作為 溶劑投入後攪拌20分鐘。將攪拌後的混合溶液放入裝有5μm大小的氧化鋯微球的籃式砂磨機(DWS-25，大元estec)，並以1500rpm分散10分鐘後冷卻至常溫。 Add 3 parts by weight of aluminum hydroxide (OSDH-3, Wuxing Enterprise) as a flame-retardant filler to 50 parts by weight of polyimide modified resin (HPC-9000-21, Hitachi Chemical) and dispersant (BYK- 167, Bayer) 2 parts by weight, and 45 parts by weight of cyclohexanone (Cyclohexanone) were added as a solvent and stirred for 20 minutes. The stirred mixed solution was put into a basket sand mill (DWS-25, Dayuan estec) equipped with 5 μm zirconia microspheres, and dispersed at 1500 rpm for 10 minutes and then cooled to room temperature.
在該分散液100重量份中投入改性環氧樹脂(Arakid-9201N，荒川化學)5重量份並進行低速攪拌一小時後，用SUS1000目過濾而獲得絕緣層組合物。 After adding 5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical) to 100 parts by weight of the dispersion liquid and stirring at low speed for one hour, it was filtered with SUS1000 mesh to obtain an insulating layer composition.
在經矽酮離型處理的50μm厚度的PET膜上塗布絕緣層組合物，並在150℃下乾燥兩分鐘，獲得乾燥後厚度為7μm的塗膜。 The insulating layer composition was coated on a 50 μm thick PET film subjected to silicone release treatment and dried at 150° C. for two minutes to obtain a coating film with a thickness of 7 μm after drying.
此外，在攪拌機中投入經聚氨酯改性的聚酯樹脂(IT-5000，納路塗料)67重量份、在MIBK(Methyl isobutyl ketone，甲基異丁酮)中以70%的固體含量來溶解的甲酚酚醛樹脂溶液10重量份、以及作為溶劑的環己酮(Cyclohexanone)9重量份，攪拌兩個小時後，將塗布有銀且平均粒徑為7μm的枝狀AgCu(ACBY-2F，三井金屬)作為導電性填料來投放14重量份，進一步攪拌一個小時。
In addition, add 67 parts by weight of polyurethane-modified polyester resin (IT-5000, Nalu Paint) into the blender, dissolved in MIBK (Methyl isobutyl ketone, methyl isobutyl ketone) with a solid content of 70% cresol
採用SUS1000目篩檢程式對製備出的導電性黏合劑進行過濾，獲得各向同性導電性(Anisotropy conductive)黏合劑組合物。 The prepared conductive adhesive was filtered using a SUS1000 mesh screening program to obtain an isotropic conductive (Anisotropy conductive) adhesive composition.
通過狹縫式模具，在經矽酮離型處理的PET離型膜表面上塗布所製備的各向同性導電性黏合劑組合物，並在150℃下加熱三分鐘而形成乾燥後厚度為12μm的各向同性導電性黏合劑層。之後，將該在PET離型膜上形成有各向同性導電性黏合劑層的薄膜與在經矽酮離型處理的PET膜上形成有絕緣層的薄膜在100℃溫度和7bar壓力下進行輥軋層壓而製備比較例2。 Coat the prepared isotropic conductive adhesive composition on the surface of the silicone release-treated PET release film through a slit mold, and heat it at 150°C for three minutes to form a dried thickness of 12 μ m is an isotropic conductive adhesive layer. After that, the film with the isotropic conductive adhesive layer formed on the PET release film and the film with the insulating layer formed on the silicone release treatment PET film were rolled at a temperature of 100°C and a pressure of 7 bar. Comparative Example 2 was prepared by roll lamination.
下面說明本發明實施例1~7及比較例1~2的層疊結構及厚度。實施例1：層疊結構由上而下依序為承載膜、銅箔、ACA及離型膜。銅箔厚度為3μm，ACA為3μm，離型膜為50μm。實施例2：層疊結構由上而下依序為承載膜、銅箔、ACA及離型膜。銅箔厚度為6μm，ACA為3μm，離型膜為50μm。實施例3：層疊結構由上而下依序為承載膜、銅箔、ACA及離型膜。銅箔厚度為10μm，ACA為3μm，離型膜為50μm。實施例4：層疊結構由上而下依序為承載膜、銅箔、ICA及黏合層(PET)。銅箔厚度為3μm，ICA為7μm。實施例5：層疊結構由上而下依序為承載膜、銅箔、Ag層、ACA及離型膜。銅箔厚度為3μm，Ag層為0.5μm，ACA為3μm。實施例6：層疊結構由上而下依序為絕緣層、銅箔、ACA及離型膜。 絕緣層厚度為5μm，銅箔厚度為3μm，ACA為3μm，離型膜為50μm。實施例7：層疊結構由上而下依序為絕緣層、銅箔、ICA及黏合層(PET)。絕緣層厚度為5μm，銅箔厚度為3μm，ICA為7μm，黏合層(PET)為50μm。比較例1：層疊結構由上而下依序為離型承載膜、絕緣層、Ag層、ACA及離型膜。離型承載膜厚度為50μm，絕緣層厚度為7μm，Ag層厚度為0.3μm，ACA厚度為3μm，離型膜厚度為50μm。比較例2：層疊結構由上而下依序為離型承載膜、絕緣層、ICA及離型膜。離型承載膜厚度為50μm，絕緣層厚度為7μm，ICA厚度為12μm，離型膜厚度為50μm。 The laminated structure and thickness of Examples 1 to 7 and Comparative Examples 1 to 2 of the present invention are described below. Example 1: From top to bottom, the laminated structure consists of carrier film, copper foil, ACA and release film in sequence. The thickness of the copper foil is 3μm, the ACA is 3μm, and the release film is 50μm. Embodiment 2: From top to bottom, the laminated structure consists of carrier film, copper foil, ACA and release film in sequence. The thickness of the copper foil is 6μm, the ACA is 3μm, and the release film is 50μm. Embodiment 3: From top to bottom, the laminated structure consists of carrier film, copper foil, ACA and release film in sequence. The thickness of the copper foil is 10μm, the ACA is 3μm, and the release film is 50μm. Example 4: From top to bottom, the laminated structure consists of carrier film, copper foil, ICA and adhesive layer (PET) in sequence. The thickness of the copper foil is 3 μm, and the ICA is 7 μm. Embodiment 5: The laminated structure is composed of carrier film, copper foil, Ag layer, ACA and release film in order from top to bottom. The thickness of the copper foil is 3 μm, the Ag layer is 0.5 μm, and the ACA is 3 μm. Embodiment 6: The laminated structure is composed of insulating layer, copper foil, ACA and release film in order from top to bottom. The thickness of the insulating layer is 5μm, the thickness of the copper foil is 3μm, the ACA is 3μm, and the release film is 50μm. Embodiment 7: The laminated structure consists of insulating layer, copper foil, ICA, and adhesive layer (PET) in order from top to bottom. The thickness of the insulating layer is 5μm, the thickness of the copper foil is 3μm, the ICA is 7μm, and the adhesion layer (PET) is 50μm. Comparative Example 1: The laminated structure consists of a release carrier film, an insulating layer, an Ag layer, ACA, and a release film in order from top to bottom. The thickness of the release carrier film is 50 μm, the thickness of the insulating layer is 7 μm, the thickness of the Ag layer is 0.3 μm, the thickness of the ACA is 3 μm, and the thickness of the release film is 50 μm. Comparative Example 2: The laminated structure consists of release carrier film, insulating layer, ICA and release film in order from top to bottom. The thickness of the release carrier film is 50μm, the thickness of the insulating layer is 7μm, the thickness of the ICA is 12μm, and the thickness of the release film is 50μm.
此外，對所製備的電磁波遮斷膜，以如下的方法製備評價用試片，並將評價結果示在表1中。 In addition, for the prepared electromagnetic wave shielding film, test pieces for evaluation were prepared by the following method, and the evaluation results are shown in Table 1.
【表1】
<電磁波遮斷膜的評價方法> <Evaluation method of electromagnetic wave shielding film>
1)電磁波遮斷膜的層間附著力 1) Interlayer adhesion of electromagnetic wave blocking film
將待檢測試片切割成寬度25.4mm和長度25cm的大小後，去除導電性黏合劑層的保護膜，並在其一面上放置25μm厚度的聚醯亞胺PI薄膜(Kapton，杜邦公司)後採用臨時固定機(溫度150℃，壓力3bar，20秒)貼合。
之後，去除承載膜的銅表面或者絕緣層面上層疊25μm厚度的黏合片(Bonding sheet)後，使用熱壓機(加壓條件：溫度150℃，壓力40kgf/cm2，時間60分鐘)進行加溫加壓，以使黏合劑層完全固化(C-stage)。在25℃和50%RH氣氛下，測量拉伸速度58.8M/min和180度下的拉伸強度。對相同的試片進行三次實驗，並記錄其平均值。
After cutting the test piece to be tested into a size of 25.4 mm in width and 25 cm in length, the protective film of the conductive adhesive layer is removed, and a 25 μm thick polyimide PI film (Kapton, DuPont) is placed on one side. Then use a temporary fixing machine (
2)焊接耐熱性 2) Soldering heat resistance
如圖9的階梯層疊圖所示，去除電磁波遮斷膜的保護膜，採用臨時固定機貼合25μm厚度的PI薄膜(Kapton，杜邦公司)(溫度150℃，壓力3bar，20秒)之後，對實施例1~4去除承載膜後層疊絕緣膜(BT-012，印可得股份有限公司)，之後採用熱加壓機(加壓條件：溫度150℃，壓力40kgf/cm2，時間60分
鐘)進行加壓加壓，以使黏合劑層完全固化(C-stage)。將固化的試片分別浮置在295℃焊料(Solder)中兩次，每次浮置時間為一分鐘，用肉眼觀察並評價有無氣泡、翹起和外觀上的顏色變化。每一種試片分別試驗五個，並記錄產生外觀不良的數量。
As shown in the stepwise stacking diagram of Figure 9, after removing the protective film of the electromagnetic wave shielding film, a temporary fixing machine is used to bond a 25 μm- thick PI film (Kapton, DuPont) (
3)階梯開裂 3) Ladder cracking
如圖10的階梯層疊圖所示，將作為階梯使用且厚度為100μm、200μm、300μm、400μm的纖維增強塑膠FRP棒(寬度5mm，長度25cm)放置在25μm厚度的PI薄膜(Kapton，杜邦公司)上，並用耐熱膠帶固定兩端，在FRP棒的上面放置去除離型膜的遮斷膜，之後採用臨時固定機(溫度150℃，壓力3bar，20秒)貼合後，對實施例1~4去除承載膜並層疊絕緣膜(BT-012，印可得股份有限公司)，之後採用熱加壓機(加壓條件：溫度150℃，壓力40kgf/cm2，時間60分鐘)進行加溫加壓，以使黏合劑層完全固化(C-stage)。
As shown in the ladder stacking diagram in Figure 10, fiber-reinforced plastic FRP rods (width 5mm, length 25cm) used as ladders with thicknesses of 100 μm , 200 μm , 300 μm , and 400 μm are placed at 25 μm Thickness of PI film (Kapton, DuPont), and fix both ends with heat-resistant tape, place a blocking film to remove the release film on the FRP rod, and then use a temporary fixing machine (
用手動顯微鏡(Hand Microscope)觀察試片的絕緣層表面上的階梯部位的開裂(參照圖10的表面照片)。每一種評價試片分別製備五個，並且按階梯厚度記錄發生開裂的數量。 A hand microscope (Hand Microscope) was used to observe the cracking of the stepped portion on the surface of the insulating layer of the test piece (refer to the surface photograph of FIG. 10). Five test pieces for each evaluation were prepared, and the number of cracks was recorded according to the thickness of the steps.
4)可靠性 4) Reliability
去除電磁波遮斷膜上的保護膜，採用臨時固定機(溫度150℃，壓力3bar，20秒)將去除保護膜的電磁波遮斷膜貼合在電阻測試用試件(圖11，印可得股份有限公司)上後，對實施例1~4去除承載膜並層疊絕緣膜(BT-012，印可得股份有限公司)，之後採用熱加壓機(加壓條件：溫度150℃，壓力40kgf/cm2，時間60分鐘)進行加溫加壓，以使黏合劑層完全固化(C-stage)。
Remove the protective film on the electromagnetic wave shielding film, and use a temporary fixing machine (
將製備出的試片擱置在溫度為85℃、濕度為85%RH(相對溼度)的腔室內後，檢測外觀及電阻變化。 The prepared test piece was placed in a chamber with a temperature of 85° C. and a humidity of 85% RH (relative humidity), and then the appearance and resistance changes were examined.
5)測量電磁波遮斷率 5) Measure the interruption rate of electromagnetic waves
去除電磁波遮斷膜的保護膜，採用熱板在120℃下將25μm厚度的PI薄膜(Kapton，杜邦公司)按壓到去除保護膜後的電磁波遮斷膜並保持兩秒而貼合後，對實施例1~4去除承載膜並層疊絕緣膜(BT-012，印可得股份有限公司)，之後採用熱加壓機(加壓條件：溫度150℃，壓力40kgf/cm2，時間60分鐘)進行加溫加壓，以使黏合劑層完全固化(C-stage)。
After removing the protective film of the electromagnetic wave shielding film, use a hot plate to press a 25 μm- thick PI film (Kapton, DuPont) onto the electromagnetic wave shielding film after removing the protective film at 120°C and hold it for two seconds. For Examples 1 to 4, the carrier film was removed and the insulating film (BT-012, Printed Co., Ltd.) was laminated, and then a hot press was used (pressurization conditions:
參照ASTM D4935(平面材料的遮斷效果標準測量試驗方法)標準，對試片進行測試。 The test piece was tested with reference to ASTM D4935 (Standard Test Method for Measuring the Blocking Effect of Plane Materials).
本發明的申請專利範圍並不局限於上述實施例，在所附的申請專 利範圍的範圍內可用多種形式的實施例來實現。本領域中任何技術人員在不脫離申請專利範圍中要求保護的本發明要點的情況下均可變形的各種範圍也屬於本發明的申請專利範圍中所記載的範圍。 The scope of patent application of the present invention is not limited to the above-mentioned embodiments. Various forms of embodiments can be used to implement within the scope of interest. The various ranges that can be deformed by any person skilled in the art without departing from the main points of the invention claimed in the scope of the patent application also belong to the scope described in the scope of the patent application of the present invention.
10:遮斷膜 10: Blocking film
11:承載膜 11: Carrier film
12:金屬層 12: Metal layer
13:導電性黏合層 13: Conductive adhesive layer
14:保護膜 14: Protective film
Claims (4)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170174287A KR102197471B1 (en) | 2017-12-18 | 2017-12-18 | Electromagnetic wave shield film, manufacturing method for printed circuit board and manufacturing method for electromagnetic wave shield film |
| ??10-2017-0174287 | 2017-12-18 | ||
| KR10-2017-0174287 | 2017-12-18 |
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| Publication Number | Publication Date |
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| TW201927968A TW201927968A (en) | 2019-07-16 |
| TWI707940B true TWI707940B (en) | 2020-10-21 |
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| TW107110570A TWI707940B (en) | 2017-12-18 | 2018-03-27 | Manufacturing method for printed circuit board |
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| Country | Link |
|---|---|
| JP (1) | JP6724054B2 (en) |
| KR (1) | KR102197471B1 (en) |
| CN (1) | CN108495543B (en) |
| TW (1) | TWI707940B (en) |
| WO (1) | WO2019124624A1 (en) |
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| JP6497477B1 (en) * | 2018-10-03 | 2019-04-10 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet and electronic component mounting board |
| CN112406217B (en) * | 2020-10-27 | 2022-04-26 | 瑞声精密制造科技(常州)有限公司 | Metal plastic composite film and preparation method and application thereof |
| JP7232995B2 (en) * | 2021-03-19 | 2023-03-06 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet, manufacturing method thereof, shielding wiring board, and electronic device |
| JP7001187B1 (en) | 2021-03-19 | 2022-01-19 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet and its manufacturing method, shielded wiring board, and electronic equipment |
| TW202237716A (en) * | 2021-03-26 | 2022-10-01 | 日商拓自達電線股份有限公司 | Electroconductive adhesive layer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201322836A (en) * | 2011-11-24 | 2013-06-01 | Tatsuta Densen Kk | Shield film, shielded printed wiring board, and method for manufacturing shield film |
| JP2017059801A (en) * | 2015-09-17 | 2017-03-23 | 東洋インキＳｃホールディングス株式会社 | Laminate for shielding electromagnetic waves, electromagnetic wave shield laminate, electronic device and method for manufacturing the same |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3434021B2 (en) | 1993-06-03 | 2003-08-04 | 住友電気工業株式会社 | Shield flexible printed wiring board |
| US7321496B2 (en) * | 2004-03-19 | 2008-01-22 | Matsushita Electric Industrial Co., Ltd. | Flexible substrate, multilayer flexible substrate and process for producing the same |
| JP4319167B2 (en) * | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | Shield film, shield printed wiring board, shield flexible printed wiring board, shield film manufacturing method, and shield printed wiring board manufacturing method |
| JP2009289840A (en) * | 2008-05-28 | 2009-12-10 | Toyo Ink Mfg Co Ltd | Electromagnetic wave shieldable adhesive film |
| JP2010067806A (en) * | 2008-09-11 | 2010-03-25 | Toray Advanced Film Co Ltd | Filter for display |
| JP2010204332A (en) * | 2009-03-03 | 2010-09-16 | Toray Advanced Film Co Ltd | Filter for display and manufacturing method thereof |
| CN103120042B (en) * | 2010-06-23 | 2016-03-23 | 印可得株式会社 | The preparation method of electromagnetic shielding film and electromagnetic shielding film prepared therefrom |
| KR101361533B1 (en) * | 2012-04-12 | 2014-02-13 | 한화엘앤씨 주식회사 | Method for manufacturing electromagnetic wave shield film |
| CN103763893B (en) * | 2014-01-14 | 2016-04-13 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and comprise the manufacture method of wiring board of screened film |
| KR20160014456A (en) * | 2014-07-29 | 2016-02-11 | 삼성전기주식회사 | Flexible printed circuit board and manufacturing method thereof |
| KR101487227B1 (en) * | 2014-12-15 | 2015-01-29 | 두성산업 주식회사 | An Electromagnetic wave shield tape and manufacturing method thereof |
| KR102282613B1 (en) * | 2014-12-24 | 2021-07-28 | 주식회사 두산 | Preparation method of electromagnetic wave shielding film for flexible printed circuit board |
| KR20170119421A (en) * | 2016-04-19 | 2017-10-27 | 전자부품연구원 | EMI shielding film and manufacturing method thereof |
| JP6709669B2 (en) * | 2016-04-20 | 2020-06-17 | 信越ポリマー株式会社 | Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film |
-
2017
- 2017-12-18 KR KR1020170174287A patent/KR102197471B1/en active IP Right Grant
-
2018
- 2018-01-15 WO PCT/KR2018/000662 patent/WO2019124624A1/en active Application Filing
- 2018-03-16 JP JP2018049472A patent/JP6724054B2/en not_active Expired - Fee Related
- 2018-03-27 TW TW107110570A patent/TWI707940B/en not_active IP Right Cessation
- 2018-03-30 CN CN201810277038.1A patent/CN108495543B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201322836A (en) * | 2011-11-24 | 2013-06-01 | Tatsuta Densen Kk | Shield film, shielded printed wiring board, and method for manufacturing shield film |
| JP2017059801A (en) * | 2015-09-17 | 2017-03-23 | 東洋インキＳｃホールディングス株式会社 | Laminate for shielding electromagnetic waves, electromagnetic wave shield laminate, electronic device and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190073037A (en) | 2019-06-26 |
| JP6724054B2 (en) | 2020-07-15 |
| CN108495543B (en) | 2020-03-31 |
| CN108495543A (en) | 2018-09-04 |
| TW201927968A (en) | 2019-07-16 |
| JP2019110282A (en) | 2019-07-04 |
| WO2019124624A1 (en) | 2019-06-27 |
| KR102197471B1 (en) | 2021-01-04 |
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