CN116082976A - Porous metal type conductive adhesive film and preparation method thereof - Google Patents

Porous metal type conductive adhesive film and preparation method thereof Download PDF

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Publication number
CN116082976A
CN116082976A CN202211382557.7A CN202211382557A CN116082976A CN 116082976 A CN116082976 A CN 116082976A CN 202211382557 A CN202211382557 A CN 202211382557A CN 116082976 A CN116082976 A CN 116082976A
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metal
porous metal
layer
adhesive
particles
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李韦志
王影
高建兴
林志铭
李建辉
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Yasen Electronic Materials Technology Dongtai Co ltd
Kunshan Aplus Tec Corp
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Yasen Electronic Materials Technology Dongtai Co ltd
Kunshan Aplus Tec Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a porous metal type conductive adhesive film, which comprises an upper adhesive layer, an ultrathin porous metal layer and a lower adhesive layer, wherein the ultrathin porous metal layer is formed between the upper adhesive layer and the lower adhesive layer; the total thickness of the conductive adhesive film is 40-80 mu m, wherein the thickness of the upper adhesive layer is 20-40 mu m, the thickness of the lower adhesive layer is 20-40 mu m, and the thickness of the ultrathin porous metal layer is 2-15 mu m. The invention has the characteristics of good electrical property, good bonding strength, good soldering tin property, good reliability, good flame resistance and the like, has better conducting effect and bonding strength compared with the common conductive adhesive, is easy to realize production and has wide market application prospect.

Description

Porous metal type conductive adhesive film and preparation method thereof
Technical Field
The invention belongs to the technical field of conductive adhesive for printed circuit boards, and particularly relates to a porous metal type conductive adhesive film which is applied to a reinforcing component formed by being attached to a steel sheet, a PI reinforcing plate or the like in an FPC (flexible printed circuit), can effectively prevent deformation of an installation part caused by bending and the like, can ensure good pore filling performance of a product, and can play roles of direct grounding and shielding external signal interference.
Background
The trend of electronic and communication products requires that circuit substrate components are light, thin, short and highly integrated, and the frequency band of transmission signals is wider and wider, so that electromagnetic interference is more and more serious; meanwhile, considering the use safety of the electronic circuit assembly, new requirements are put forward on the grounding reliability of the circuit assembly and the design freedom of the circuit board in the electronic product, and the defects of board explosion and the like caused by the fact that the grounding aperture is excessively filled with conductive adhesive to affect the design and the installation of other assemblies or the connection part has gaps when reflow soldering is caused by insufficient filling of the conductive adhesive in the current market.
In addition, the conductive adhesive products circulated in the market at present are mostly prepared by directly dispersing conductive particles in an adhesive, and if the adhesive layer is generally thicker, the adhesive layer is not cured sufficiently and the lamination condition is uneven, the uneven distribution of powder can occur when the product is attached to a printed circuit board, and the conductive performance and the like are further affected.
At present, some new technologies and patents mention that a thin metal layer is buried in a conductive adhesive layer to improve conductivity of a conductive adhesive product, reduce powder content to reduce cost, and are completely theoretically established, but in the actual production process, because flexibility of metal is poor, pore filling performance of the product after lamination cannot achieve an expected effect, and the metal layer is possibly worse, and meanwhile, because of poor air permeability of the metal layer, the SMT can generate a board explosion hidden trouble in the FPC manufacturing process.
Disclosure of Invention
The invention mainly solves the technical problems of providing an isotropic high-conductivity porous metal type conductive adhesive film comprising porous metal layers, which is composed of various metal powder, has the characteristics of good electrical property, good bonding strength, good soldering tin property, good reliability, good flame resistance and the like, has better conducting effect and bonding strength compared with the common conductive adhesive, is easy to realize in production and has wide market application prospect. The porous metal type conductive adhesive film can be combined with the PI type reinforcing plate to realize the functions of reinforcement, grounding and shielding, and the defect that the traditional conductive adhesive can only be combined with a steel sheet is avoided.
In order to solve the technical problems, the invention adopts a technical scheme that: a porous metal type conductive adhesive film, comprising an upper adhesive layer, an ultrathin porous metal layer and a lower adhesive layer, wherein the ultrathin porous metal layer is formed between the upper adhesive layer and the lower adhesive layer;
the total thickness of the conductive adhesive film is 40-80 mu m, wherein the thickness of the upper adhesive layer is 20-40 mu m, the thickness of the lower adhesive layer is 20-40 mu m, and the thickness of the ultrathin porous metal layer is 2-15 mu m;
the ultrathin porous metal layer is porous metal silver-plated copper foil or porous metal gold-plated copper foil;
the ultra-thin porous metal layer has a through hole density of 10000-15000/cm 2 The aperture of the through hole is 1-100 μm.
Further, the upper adhesive layer and the lower adhesive layer are both thermosetting adhesive layers containing metal conductive particles and adhesive resin;
the weight ratio of the metal conductive particles to the adhesive resin is 1:4-4:1;
the weight mixing proportion of the metal conductive particles is 20-80%.
Further, the metal conductive particles are at least two of dendritic metal powder, needle-like metal powder, flake-like metal powder and spherical metal powder;
the metal conductive particles are at least one of single metal conductive particles and alloy conductive particles.
Still further, the single metal conductive particles may be at least one of gold particles, silver particles, copper particles, nickel particles, and graphite;
the alloy conductive particles may be at least one of silver-plated copper particles, silver-plated nickel particles, gold-plated copper particles, gold-plated nickel particles, and graphene-copper alloy.
Further, the adhesive resin is selected from one or more of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin, phenol resin, melamine resin and polyimide resin.
Further, the metal conductive particles are prepared by mixing three kinds of dendritic metal powder, needle-shaped metal powder and lamellar metal powder, wherein the weight ratio of the dendritic metal powder to the needle-shaped metal powder is 1:5-5:1, and the weight ratio of the needle-shaped metal powder to the lamellar metal powder is 1:4-4:1.
Further, a release film layer or a carrier film layer is formed above the upper adhesive layer and below the lower adhesive layer, respectively.
Further, the thickness of the release film layer is 25-100 μm, and the release film of the release film layer is at least one selected from PET fluoroplastic release film, PET silicone oil release film, PET matte release film or PE release film.
The preparation method of the porous metal type conductive adhesive film comprises the following steps:
step one: screening, screening and uniformly mixing metal conductive particles with various shapes;
step two: adding metal conductive particles and adhesive resin according to the sequence and proportion, and fully and uniformly mixing;
step three: coating the mixture prepared in the second step, namely an adhesive layer, on a release film (paper) appointed release surface;
step four: attaching and curing the coating product in the third step on one surface of the ultrathin porous metal foil;
step five: the coated product (adhesive layer and release film (paper)) obtained in the third step is attached to the other surface of the ultrathin porous metal foil again;
step six: solidifying, rolling and splitting to obtain the finished product.
The preparation method of the porous metal type conductive adhesive film further comprises the following steps:
step one: screening, screening and uniformly mixing metal conductive particles with various shapes;
step two: adding metal conductive particles and adhesive resin according to the sequence and proportion, and fully and uniformly mixing;
step three: coating the mixture prepared in the second step, namely an adhesive layer, on a release film (paper) appointed release surface;
step four: attaching and curing the coating product in the third step on one surface of the ultrathin porous metal foil;
step five: coating an adhesive layer on the other side of the ultrathin porous metal foil;
step six: solidifying, rolling and splitting to obtain the finished product.
The invention has the beneficial effects that:
1. the porous metal type conductive adhesive film used in the invention is applied to the FPC, and forms a reinforcing part after being attached to a steel sheet or a PI reinforcing plate and the like, so that deformation of an installation part caused by bending and the like can be effectively prevented, good pore-filling performance of a product can be ensured, the effects of direct grounding and shielding of external signal interference can be achieved, and the shielding performance is good;
2. the ultrathin porous metal layer in the porous metal type conductive adhesive film is beneficial to the connection of the upper and lower conductive adhesive layers through holes in the upper and lower conductive metal particles added in the upper and lower adhesive layers due to the porous structure of the ultrathin porous metal layer, and meanwhile, the explosion plate phenomenon can not occur in the FPC downstream manufacturing process through SMT due to the good air permeability of the ultrathin porous metal layer, so that the explosion plate problem of the conductive adhesive circulated in the market and the buried metal layer conductive adhesive at present can be effectively solved;
3. the ultrathin porous metal layer disclosed by the invention takes various metals as a base material, and the metal base material can comprise, but is not limited to, an electroplated metal coating, such as a porous metal silver-plated copper foil, a porous metal gold-plated copper foil and the like, and has good stability and weather resistance, so that the FPC is not deformed due to overlarge hardness when being subjected to hot pressing, the material performance is poor, and meanwhile, the upper and lower adhesives and conductive particles in the upper and lower adhesives are deformed and flow due to the hot pressing of an adhesive resin material to realize isotropic conduction, so that the defect of poor conduction effect of the traditional conductive adhesive and the conductive adhesive added with a nonporous thin metal layer can be effectively avoided;
4. the porous metal layer in the porous metal type conductive adhesive film can also be subjected to electroplating metal plating treatment, for example, cu is more active than Au and Ag, so that the porous metal foil can be selected from porous silver-plated copper foil, porous gold-plated copper foil and the like, the defect that Cu is easy to oxidize at high temperature can be effectively overcome, the adhesive strength of a product is greatly improved on the basis that the conductive performance of the product is not influenced, and meanwhile, the material cost is reduced.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
reference numerals illustrate:
conductive adhesive film 100
An upper adhesive layer 101, an ultra-thin porous metal layer 102, a lower adhesive layer 103, and a release film layer or carrier film layer 104.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
Examples: a porous metal type conductive adhesive film 100 comprising an upper adhesive layer 101, an ultra-thin porous metal layer 102 and a lower adhesive layer 103, the ultra-thin porous metal layer being formed between the upper adhesive layer and the lower adhesive layer;
the total thickness of the conductive adhesive film is 40-80 mu m, wherein the thickness of the upper adhesive layer is 20-40 mu m, the thickness of the lower adhesive layer is 20-40 mu m, and the thickness of the ultrathin porous metal layer is 2-15 mu m; because the ultrathin porous metal foil layer has a hole-shaped structure, after the upper and lower adhesive layers are coated, the adhesive can permeate into the holes of the ultrathin porous metal foil, the actual total thickness of the product can be smaller than the sum of the thicknesses of the ultrathin porous metal foil and the upper and lower adhesive layers, the adhesive layer is too thin, the shielding effect is poor, the adhesive layer is too thick, the requirement on thinning is not met, the coating processability is higher, and the production cost is indirectly increased.
The ultra-thin porous metal layer has a through hole density of 10000-15000/cm 2 The aperture of the through hole is 1-100 μm. Too thick ultrathin porous metal layers can cause the failure of contact of metal particles in the upper and lower adhesive layers and poor contact of the upper and lower adhesive layers; too thin is unfavorable for production, increases production cost, and the porous metal layer has excellent stability and weather resistance, and can improve product reliability and shielding performance;
when the conductive adhesive film is used, the ultrathin porous metal layer is thinner, the specific surface area is large, and the conductive adhesive is subjected to a downstream lamination process, wherein the holes in the ultrathin porous metal layer are filled with metal particles, the form and the conduction effect of the ultrathin porous metal foil are not influenced, the overall conduction effect of the material is greatly enhanced, and compared with the existing conductive adhesive, the conductive adhesive film can effectively reduce the content of conductive particles in the upper conductive adhesive and the lower conductive adhesive to achieve the same conduction effect.
The upper adhesive layer and the lower adhesive layer are thermosetting adhesive layers containing metal conductive particles and adhesive resin;
the weight ratio of the metal conductive particles to the adhesive resin is 1:4-4:1; when the ratio is lower than 1:4, the conductivity is poor, and more adhesive can cause problems such as sticking plates in downstream operation; when the ratio is more than 4:1, the powder proportion is higher, the requirement on the powder dispersing process is higher, and the compactness and the adhesive strength are influenced.
The weight mixing proportion of the metal conductive particles is 20-80%, preferably 35-55%, and too much metal conductive particles can cause excessive powder, uneven dispersion and poor conducting effect due to too little fear. The adhesive resin has too low viscosity, is unfavorable for on-line production, and the produced product has stronger viscosity, and the relative content of the metal powder is reduced, so that the conductivity is poor.
The ultrathin porous metal layer in the porous metal type conductive adhesive film takes various metals as a base material, and the metal base material can comprise but is not limited to an electroplated metal coating, such as porous metal silver-plated copper foil, porous metal gold-plated copper foil and the like, and has good stability and weather resistance, so that the material performance is not good due to deformation caused by overlarge hardness when the porous metal type conductive adhesive film is subjected to hot pressing in the FPC manufacturing process, meanwhile, multidimensional pore channels are provided for upper and lower adhesives and conductive particles in the upper and lower adhesives so as to reduce the diffusion distance of ions and electrons, and isotropic conductive adhesive is formed through three conductive adhesive conduction mechanisms, namely a conductive channel, a tunnel effect and field emission, so that the defect of poor conduction effect of the traditional conductive adhesive and the conductive adhesive added with the nonporous thin metal layer can be effectively avoided, and the reliability and shielding performance of products can be improved.
The metal conductive particles are at least two of dendritic metal powder, needle-shaped metal powder, flake-shaped metal powder and spherical metal powder;
the metal conductive particles are at least one of single metal conductive particles and alloy conductive particles.
The single metal conductive particles can be at least one of gold particles, silver particles, copper particles, nickel particles and graphite;
the alloy conductive particles may be at least one of silver-plated copper particles, silver-plated nickel particles, gold-plated copper particles, gold-plated nickel particles, and graphene-copper alloy.
The porous thin metal layer is preferably copper foil or/and silver-plated copper foil.
The adhesive resin is selected from one or more of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin, phenol resin, melamine resin and polyimide resin, wherein acrylic resin is preferable. The addition proportion of the adhesive resin is 20-80% (calculated by solid content), too little viscosity is too low, on-line production is not facilitated, too much produced products are strong in viscosity, and poor conductivity is caused by reduced relative content of metal powder.
Preferably, the metal conductive particles are three kinds of mixed dendritic metal powder, needle-shaped metal powder and lamellar metal powder, wherein the ratio of the dendritic metal powder to the needle-shaped metal powder is 1:5-5:1, and the ratio of the needle-shaped metal powder to the lamellar metal powder is 1:4-4:1. Too high or too low a ratio may reduce the conductivity of the conductive paste. In the adhesive layer with the metal conductive particles, various conductive particles deform and flow due to the fact that adhesive resin materials are subjected to hot pressing, and then a conducting circuit is formed with the grounding aperture on the flexible board, the resin can be completely crosslinked and solidified through high-temperature curing for a period of time to maintain good electrical property and mechanical property, so that the grounding resistance value of the flexible board is reduced, and meanwhile, the purpose of effectively shielding external electromagnetic wave interference can be achieved due to good grounding stability when the adhesive layer with the metal conductive particles and metal components such as steel sheets or PI reinforcing plates are formed and reinforced when the adhesive layer with the metal conductive particles is adhered to the printed circuit board. In addition, the added metal particles have excellent oxidation resistance and conductivity, so that the product is convenient to store and transport, the physical properties of the product are not affected, and the stability and reliability of the product are higher.
A release film layer or carrier film layer 104 is formed above the upper adhesive layer and below the lower adhesive layer, respectively.
The thickness of the release film layer is 25-100 mu m, and the release film of the release film layer is at least one selected from PET fluoroplastic release film, PET silicone oil release film, PET matte release film or PE release film.
The release film layer can be released from both sides or one side, and is preferably released from both sides;
the color of the release film layer is pure white, milky white or transparent, and preferably pure white or milky white is selected. When the numerical control automatic equipment engraves a line, the problems of infrared induction and white no reflected light exist, the numerical control automatic equipment can be rapidly and accurately positioned, the numerical control automatic equipment can be used for processing, and when the numerical control automatic equipment is used for manual operation, white color has a recognition effect, and artificial leakage and tearing are prevented. Among them, a white double-sided PET release film is preferable.
If the release paper is selected, the release paper is required to be well attached to the product adhesive layer and is easy to peel off, and the release paper can not fall off in the transportation and carrying process.
The preparation method of the porous metal type conductive adhesive film comprises the following steps:
step one: screening, screening and uniformly mixing metal conductive particles with various shapes;
step two: adding metal conductive particles and adhesive resin according to the sequence and proportion, and fully and uniformly mixing;
step three: coating the mixture prepared in the second step, namely an adhesive layer, on a release film (paper) appointed release surface;
step four: attaching and curing the coating product in the third step on one surface of the ultrathin porous metal foil;
step five: the coated product (adhesive layer and release film (paper)) obtained in the third step is attached to the other surface of the ultrathin porous metal foil again;
step six: solidifying, rolling and splitting to obtain the finished product.
The preparation method of the porous metal type conductive adhesive film further comprises the following steps:
step one: screening, screening and uniformly mixing metal conductive particles with various shapes;
step two: adding metal conductive particles and adhesive resin according to the sequence and proportion, and fully and uniformly mixing;
step three: coating the mixture prepared in the second step, namely an adhesive layer, on a release film (paper) appointed release surface;
step four: attaching and curing the coating product in the third step on one surface of the ultrathin porous metal foil;
step five: coating an adhesive layer on the other side of the ultrathin porous metal foil;
step six: solidifying, rolling and splitting to obtain the finished product.
The metal conductive particles with various shapes are uniformly mixed for use after being screened by a screening machine, wherein the median of the metal particle size distribution is 2-22um, and the median of the metal particle size distribution is 8-20 um. Too small particle size can lead to poor effect of filling the conducting aperture in the printed circuit substrate, and too large particle size can increase the difficulty of coating production, and is unfavorable for smooth production.
Conducting analysis and test are carried out on the novel porous metal type conductive adhesive film after the upper and lower release films are peeled off: the conductivity analysis test was performed by using a high-bridge tester, after the nickel-plated steel sheet and the FPC were respectively pseudo-attached to the upper and lower surfaces of the adhesive layer, the conductivity resistance data before and after the test sample sheet was subjected to reflow soldering was press-cured, the test performed on the present invention was used as an example, the conductivity of a general product was tested by the same method as a comparative example, and the measured conductivity results were recorded in table 1.
Also, the novel conductive adhesive film after peeling the upper and lower release films was subjected to peel force analysis test: the Peel force analysis test was performed by using a universal tensile machine, after the nickel-plated steel sheet and the single-sided CCL were respectively pseudo-pasted on the upper and lower sides of the adhesive layer, the test Peel value was taken out by press-bonding and curing, the test performed by the present invention was used as an example, the Peel force of a general product was tested by the same method as a comparative example, and the measured Peel value, solder heat resistance and conductivity results were recorded in Table 1.
Peel strength test method: IPC-TM-650 2.4.9;
the solder heat resistance testing method comprises the following steps: IPC-TM-650 2.4.13.
In the embodiment, the resin of the upper and lower adhesive layers is acrylic resin.
Figure BDA0003929074960000081
Figure BDA0003929074960000091
As can be seen from the above table, the novel porous metal type conductive adhesive film of the present invention has good conductive effect, solder heat resistance and good adhesive strength compared with the conventional products.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the present invention and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A porous metal type conductive adhesive film is characterized in that: the ultra-thin porous metal layer is formed between the upper adhesive layer and the lower adhesive layer;
the total thickness of the conductive adhesive film is 40-80 mu m, wherein the thickness of the upper adhesive layer is 20-40 mu m, the thickness of the lower adhesive layer is 20-40 mu m, and the thickness of the ultrathin porous metal layer is 2-15 mu m;
the ultrathin porous metal layer is porous metal silver-plated copper foil or porous metal gold-plated copper foil;
the density of the through holes of the ultrathin porous metal layer is 10000-15000/cm 2 The aperture of the through hole is 1-100 μm.
2. The porous metal-type conductive adhesive film according to claim 1, wherein: the upper adhesive layer and the lower adhesive layer are thermosetting adhesive layers containing metal conductive particles and adhesive resin;
the weight ratio of the metal conductive particles to the adhesive resin is 1:4-4:1;
the weight mixing proportion of the metal conductive particles is 20-80%.
3. The method for preparing the porous metal type conductive adhesive film according to claim 2, wherein: the metal conductive particles are at least two of dendritic metal powder, needle-shaped metal powder, flake-shaped metal powder and spherical metal powder;
the metal conductive particles are at least one of single metal conductive particles and alloy conductive particles.
4. The method for preparing a porous metal type conductive adhesive film according to claim 3, wherein: the single metal conductive particles can be at least one of gold particles, silver particles, copper particles, nickel particles and graphite;
the alloy conductive particles may be at least one of silver-plated copper particles, silver-plated nickel particles, gold-plated copper particles, gold-plated nickel particles, and graphene-copper alloy.
5. The method for preparing the porous metal type conductive adhesive film according to claim 2, wherein: the adhesive resin is selected from one or more of epoxy resin, acrylic resin, carbamate resin, silicone rubber resin, parylene resin, bismaleimide resin, phenol resin, melamine resin and polyimide resin.
6. A porous metal conductive adhesive film according to claim 3, wherein: the metal conductive particles are formed by mixing three kinds of dendritic metal powder, needle-shaped metal powder and lamellar metal powder, wherein the weight ratio of the dendritic metal powder to the needle-shaped metal powder is 1:5-5:1, and the weight ratio of the needle-shaped metal powder to the lamellar metal powder is 1:4-4:1.
7. The porous metal-type conductive adhesive film according to claim 1, wherein: and a release film layer or a carrier film layer is respectively formed above the upper adhesive layer and below the lower adhesive layer.
8. The porous metal-type conductive adhesive film according to claim 7, wherein: the thickness of the release film layer is 25-100 mu m, and the release film of the release film layer is at least one selected from PET fluoroplastic release film, PET silicone oil release film, PET matte release film or PE release film.
9. The method for preparing the porous metal type conductive adhesive film according to claim 1, wherein: the method comprises the following steps:
step one: screening, screening and uniformly mixing metal conductive particles with various shapes;
step two: adding metal conductive particles and adhesive resin according to the sequence and proportion, and fully and uniformly mixing;
step three: coating the mixture prepared in the second step, namely an adhesive layer, on a release film appointed release surface;
step four: attaching and curing the coating product in the third step on one surface of the ultrathin porous metal foil;
step five: attaching the coating product in the third step to the other surface of the ultrathin porous metal foil again;
step six: solidifying, rolling and splitting to obtain the finished product.
10. The method for preparing the porous metal type conductive adhesive film according to claim 1, wherein: the method also comprises the following steps:
step one: screening, screening and uniformly mixing metal conductive particles with various shapes;
step two: adding metal conductive particles and adhesive resin according to the sequence and proportion, and fully and uniformly mixing;
step three: coating the mixture prepared in the second step, namely an adhesive layer, on a release film appointed release surface;
step four: attaching and curing the coating product in the third step on one surface of the ultrathin porous metal foil;
step five: coating an adhesive layer on the other side of the ultrathin porous metal foil;
step six: solidifying, rolling and splitting to obtain the finished product.
CN202211382557.7A 2022-11-07 2022-11-07 Porous metal type conductive adhesive film and preparation method thereof Pending CN116082976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211382557.7A CN116082976A (en) 2022-11-07 2022-11-07 Porous metal type conductive adhesive film and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211382557.7A CN116082976A (en) 2022-11-07 2022-11-07 Porous metal type conductive adhesive film and preparation method thereof

Publications (1)

Publication Number Publication Date
CN116082976A true CN116082976A (en) 2023-05-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211382557.7A Pending CN116082976A (en) 2022-11-07 2022-11-07 Porous metal type conductive adhesive film and preparation method thereof

Country Status (1)

Country Link
CN (1) CN116082976A (en)

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