TWI707022B - 黏著片及顯示體 - Google Patents
黏著片及顯示體 Download PDFInfo
- Publication number
- TWI707022B TWI707022B TW105120453A TW105120453A TWI707022B TW I707022 B TWI707022 B TW I707022B TW 105120453 A TW105120453 A TW 105120453A TW 105120453 A TW105120453 A TW 105120453A TW I707022 B TWI707022 B TW I707022B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- meth
- adhesive layer
- display body
- layer
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-158447 | 2015-08-10 | ||
JP2015158447A JP6400537B2 (ja) | 2015-08-10 | 2015-08-10 | 粘着シートおよび表示体 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201710432A TW201710432A (zh) | 2017-03-16 |
TWI707022B true TWI707022B (zh) | 2020-10-11 |
Family
ID=58047625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105120453A TWI707022B (zh) | 2015-08-10 | 2016-06-29 | 黏著片及顯示體 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6400537B2 (ko) |
KR (1) | KR102541098B1 (ko) |
CN (1) | CN106433498B (ko) |
TW (1) | TWI707022B (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7051382B2 (ja) * | 2017-11-16 | 2022-04-11 | リンテック株式会社 | 繰り返し屈曲デバイス |
TWI786193B (zh) * | 2017-12-19 | 2022-12-11 | 日商琳得科股份有限公司 | 重複彎曲裝置用黏著劑、黏著片、重複彎曲積層構件及重複彎曲裝置 |
TWI813590B (zh) * | 2017-12-19 | 2023-09-01 | 日商琳得科股份有限公司 | 重複彎曲裝置用黏著劑、黏著片、重複彎曲積層構件及重複彎曲裝置 |
TWI786201B (zh) * | 2017-12-19 | 2022-12-11 | 日商琳得科股份有限公司 | 重複彎曲裝置用黏著劑、黏著片、重複彎曲積層構件及重複彎曲裝置 |
JP7004564B2 (ja) * | 2017-12-19 | 2022-01-21 | リンテック株式会社 | 粘着シート、繰り返し屈曲積層部材および繰り返し屈曲デバイス |
JP7017442B2 (ja) * | 2018-03-12 | 2022-02-08 | リンテック株式会社 | 感温性粘着シートおよび積層体 |
JP7017464B2 (ja) * | 2018-04-27 | 2022-02-08 | リンテック株式会社 | 感温性粘着シートおよび積層体 |
JP6770569B2 (ja) * | 2018-12-27 | 2020-10-14 | リンテック株式会社 | バックライト貼付用粘着シートおよびバックライトユニット |
JP7273501B2 (ja) * | 2018-12-27 | 2023-05-15 | リンテック株式会社 | 粘着シート、構成体および構成体の製造方法 |
JP7402066B2 (ja) * | 2020-01-27 | 2023-12-20 | リンテック株式会社 | 粘着シート、繰り返し屈曲積層部材および繰り返し屈曲デバイス |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201439254A (zh) * | 2013-02-25 | 2014-10-16 | Lintec Corp | 黏接性組合物、黏接劑以及黏接片 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5114811B2 (ja) * | 2007-03-07 | 2013-01-09 | 綜研化学株式会社 | 光学フィルム用粘着剤および粘着加工光学フィルム |
CN102131880B (zh) * | 2008-09-01 | 2014-08-06 | 日本电石工业株式会社 | 粘合剂组合物、粘合剂以及光学膜 |
JP2010097070A (ja) | 2008-10-17 | 2010-04-30 | Nitto Denko Corp | フラットパネルディスプレイ用透明粘着シート及びフラットパネルディスプレイ |
JP5174204B2 (ja) * | 2010-04-13 | 2013-04-03 | 三菱樹脂株式会社 | 透明両面粘着シート |
JP5571995B2 (ja) * | 2010-03-31 | 2014-08-13 | リンテック株式会社 | 両面粘着シートおよびタッチパネル付き表示装置 |
JP5613109B2 (ja) * | 2011-06-28 | 2014-10-22 | リンテック株式会社 | 粘着剤および粘着シート |
JP2013067737A (ja) * | 2011-09-22 | 2013-04-18 | Daicel Corp | 透明粘着シート |
JP5844201B2 (ja) * | 2012-03-30 | 2016-01-13 | リンテック株式会社 | 粘着性組成物、粘着剤および粘着シート |
CN105378020A (zh) * | 2013-05-24 | 2016-03-02 | Dic株式会社 | 紫外线固化型粘合剂组合物、粘合剂及粘合膜 |
-
2015
- 2015-08-10 JP JP2015158447A patent/JP6400537B2/ja active Active
-
2016
- 2016-06-29 TW TW105120453A patent/TWI707022B/zh active
- 2016-07-07 KR KR1020160086245A patent/KR102541098B1/ko active IP Right Grant
- 2016-08-09 CN CN201610648114.6A patent/CN106433498B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201439254A (zh) * | 2013-02-25 | 2014-10-16 | Lintec Corp | 黏接性組合物、黏接劑以及黏接片 |
Also Published As
Publication number | Publication date |
---|---|
JP6400537B2 (ja) | 2018-10-03 |
KR20170018769A (ko) | 2017-02-20 |
KR102541098B1 (ko) | 2023-06-07 |
JP2017036395A (ja) | 2017-02-16 |
TW201710432A (zh) | 2017-03-16 |
CN106433498B (zh) | 2021-09-10 |
CN106433498A (zh) | 2017-02-22 |
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