TWI705146B - 合金粉末組成物、成型體及其製造方法和電感器 - Google Patents
合金粉末組成物、成型體及其製造方法和電感器 Download PDFInfo
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- TWI705146B TWI705146B TW108114085A TW108114085A TWI705146B TW I705146 B TWI705146 B TW I705146B TW 108114085 A TW108114085 A TW 108114085A TW 108114085 A TW108114085 A TW 108114085A TW I705146 B TWI705146 B TW I705146B
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- 239000000843 powder Substances 0.000 title claims abstract description 105
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 82
- 239000000956 alloy Substances 0.000 title claims abstract description 82
- 239000000203 mixture Substances 0.000 title claims abstract description 38
- 238000000465 moulding Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 229910052742 iron Inorganic materials 0.000 claims abstract description 101
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 18
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 17
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 17
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 197
- 239000011230 binding agent Substances 0.000 claims description 22
- 239000012778 molding material Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 229920000178 Acrylic resin Polymers 0.000 claims description 7
- 229910008458 Si—Cr Inorganic materials 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 229910017061 Fe Co Inorganic materials 0.000 claims description 2
- 229910017082 Fe-Si Inorganic materials 0.000 claims description 2
- 229910017133 Fe—Si Inorganic materials 0.000 claims description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- 229910002796 Si–Al Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 239000007767 bonding agent Substances 0.000 claims 1
- 230000035699 permeability Effects 0.000 description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 239000011162 core material Substances 0.000 description 9
- 239000000696 magnetic material Substances 0.000 description 8
- 239000006247 magnetic powder Substances 0.000 description 5
- 229910000859 α-Fe Inorganic materials 0.000 description 5
- 238000000889 atomisation Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WJZHMLNIAZSFDO-UHFFFAOYSA-N manganese zinc Chemical compound [Mn].[Zn] WJZHMLNIAZSFDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Abstract
本發明關於一種合金粉末組成物、由該合金粉末組成物製造成型體之方法、由該方法所製得之成型體、以及包含該成型體之電感器。合金粉末組成物包括鐵基非晶質合金之粉末及鐵基結晶質合金之粉末;其中鐵基非晶質合金之粉末在受到20kN的力時,其體積電阻率為1×106Ω.cm以下,鐵基結晶質合金之粉末在受到20kN的力時,其體積電阻率為1×106Ω.cm以上;且其中鐵基非晶質合金包含Fe、Co、Cr、C、P、及Si。
Description
本發明關於一種合金粉末組成物、由該合金粉末組成物製造成型體之方法、由該方法所製得之成型體、以及包含該成型體之電感器。
電感器包含磁芯材料以及導體,其中磁芯材料可以使用鐵氧體磁芯或粉末鐵芯。鐵氧體是含有鎳、鋅或錳的化合物,其具有較高的相對磁導率,而且鐵氧體化合物的高頻鐵損小,因此被廣泛應用於高頻電感器中。然而,鐵氧體之缺點在於飽和磁通量密度差,且鎳-鋅或錳-鋅鐵氧體製作流程繁雜,例如:煆燒、研磨、造粒、成型、燒結。粉末鐵芯則具有高飽和磁通量密度,且粉末鐵芯可被壓成任意形狀;因此電感器的體積可以縮小,以實現小型化、輕量化。
專利文獻1(TW200419600A)揭示了一種複合磁性材料,其係將60wt%-90wt%的含鐵晶體合金磁粉和40wt%-10wt%的含鐵非晶質合金磁粉混合而構成,因而得到複合磁粉,另將重量為混合磁粉的1wt%-10wt%之絶緣連結劑混入混合磁粉。然而,實際上,如專利文獻1中圖4至圖6所示,其轉換效率、磁導率以及鐵損仍有很大的改善空間。
專利文獻2(TW201712699A)則揭示一種壓粉磁芯材料,其係含有羰基鐵粉及非晶質磁性材料之粉末者,且上述羰基鐵粉之含量相對於上述羰基鐵粉之含量與上述非晶質磁性材料之粉末之含量之總和之質量比率,即第一混
合比率,為75質量%以上且95質量%以下,藉由使壓粉磁芯不僅含有結晶質磁性材料之粉末,亦含有特定量之非晶質磁性材料之粉末,而鐵損Pcv容易降低。然而,這樣的磁芯材料所得到的磁芯磁導率(專利文獻2圖10)表現不足,且鐵損的降低亦存在改善空間,此外,由此得到的電感器之電感轉換效率不佳。
因此,本發明的目的在於提供一種具有穩定的高磁導率、低鐵損(Core loss)之合金粉末組成物,由該合金粉末組成物製造成型體之方法和由該方法所製得之成型體,以及具有高電感轉換效率之電感器。
本發明上下文中所指的磁導率為相對磁導率(relative permeability)之實部值(real part)。相對磁導率為實際磁導率除以真空磁導率之值。相對磁導率的實部值(μr’)和感值成正比。此外,由於Lμr’×N2,在同一感值下,若使用導磁率較大的材料,除了可減少繞線圈數外,亦可使用較粗線徑,以降低直流電阻值(DC Resistance)。電磁轉換效率可分為輕載效率(light-load efficiency)與重載效率(heavy-load efficiency)兩類。輕載部分,主要是依賴磁性材料的鐵損,鐵損越低,可提高輕載效率。重載效率則是為依賴導體的電阻值,低電阻的導體,可改善重載部分的電磁轉換效率。因此,高μr’且低鐵損的的磁性材料可同時提升輕載到重載之間的電磁轉換效率。
為了達成本發明目的,發明人發現,藉由使用本發明之合金粉末組成物,可以實現高磁導率、低鐵損以及高轉換效率。特別是,本發明之合金粉末組成物即使在高頻下也可以展現優異的軟磁性特性。
因此,本發明的一個態樣為合金粉末組成物,其包括鐵基非晶質合金之粉末及鐵基結晶質合金之粉末,其中鐵基非晶質合金之粉末在受到20kN的力時,其體積電阻率為1×106Ω.cm以下,鐵基結晶質合金之粉末在受到20kN的力時,其體積電阻率為1×106Ω.cm以上;且其中鐵基非晶質合金包含Fe、Co、Cr、C、P、和Si以及視情況可另外包含Ni、B、Al中之一或多者。
本發明另一態樣為用於製備成型體之方法,其包含根據使本發明之合金粉末組成物與黏結劑混合以形成成型材料,以及加壓成型(pressure molding)該成型材料,以形成成型體。
本發明另一態樣係成型體,其係藉由根據本發明之用於製備成型體之方法得到,其中成型體具有1×104Ω.cm以上的體積電阻率以及70%至95%之相對成型密度。
本發明另一態樣為電感器,其包含根據本發明之成型體。
根據本發明之成型體相較於先前技術具有穩定的高磁導率、顯著降低的鐵損,且包含本發明之成型體之電感器具有高電感轉換效率。
圖1呈現本發明實施例1-2與比較例之磁導率與頻率之關係。
圖2呈現本發明實施例1-2與比較例於Bm=10mT下鐵損與頻率之關係。
圖3呈現本發明實施例1-2與比較例於Bm=50mT下鐵損與頻率之關係。
圖4呈現本發明實施例1-2與比較例於Bm=100mT下鐵損與頻率之關係。
圖5呈現本發明實施例1-2與比較例之電感轉換效率。
本發明之合金粉末組成物包括鐵基非晶質合金之粉末及鐵基結晶質合金之粉末,其中鐵基非晶質合金之粉末在受到20kN的力時,其體積電阻率為1×106Ω.cm以下,鐵基結晶質合金之粉末在受到20kN的力時,其體積電阻率為1×106Ω.cm以上;且其中鐵基非晶質合金之粉末包含Fe、Co、Cr、C、P、和Si以及視情況可另外包含Ni、B、Al中之一或多者。根據本發明之合金粉末組
成物,其中鐵基非晶質合金之粉末及鐵基結晶質合金之粉末之體積電阻率是根據JIS K6911結合例如粉體阻抗測定系統MCP-PD51來測定,並且是受到20kN的力時的值。
本發明之鐵基非晶質合金包含Fe、Co、Cr、C、P、和Si。
在本發明一個具體實例中,鐵基非晶質合金可另外包含Ni、B及Al中之一或多者。
在本發明一個具體實例中,鐵基非晶質合金包含Fe、Co、Cr、C、P及Si或由Fe、Co、Cr、C、P及Si所組成。
在本發明一個具體實例中,鐵基非晶質合金包含Fe、Co、Cr、C、P、B及Si或由Fe、Co、Cr、C、P、B及Si所組成。
在本發明一個具體實例中,鐵基非晶質合金包含Fe、Co、Cr、C、P、Al及Si或由Fe、Co、Cr、C、P、Al及Si所組成。
在本發明一個具體實例中,鐵基非晶質合金包含Fe、Co、Ni、P、Cr、C及Si或由Fe、Co、Ni、P、Cr、C及Si所組成。
在本發明一個具體實例中,鐵基非晶質合金包含Fe、Co、Ni、P、Cr、C、B及Si或由Fe、Co、Ni、P、Cr、C、B及Si所組成。
在本發明一個具體實例中,鐵基非晶質合金包含Fe、Co、Ni、P、Cr、C、Al及Si或由Fe、Co、Ni、P、Cr、C、Al及Si所組成。
在本發明一個具體實例中,鐵基非晶質合金可以包含以下原子比例:70at%<Fe<83at%;0at%<Co<1at%;1at%<Cr<4at%;7at%<C<11at%;9at%<P<12at%;0at%<Si<1at%;
Ni不存在或為5at%<Ni<7at%;0at%≦B<3at%;且0at%≦Al<1at%。
在本發明一個具體實例中,鐵基非晶質合金中的Fe量例如在>70at%至<83at%的範圍內,或>70at%至<81at%的範圍內,或>70at%至<79at%的範圍內,或>70at%至<78at%的範圍內。
在本發明一個具體實例中,鐵基非晶質合金之含氧量等於或小於2500ppm、或等於或小於2300ppm、或等於或小於2000ppm。
在本發明一個具體實例中,鐵基非晶質合金之粉末的中值粒徑(median diameter)D50為4μm至14μm、或7μm至14μm,其係藉由雷射繞射法量測。
本發明之鐵基結晶質合金之實例包含Fe-Ni系合金、Fe-Co系合金、Fe-V系合金、Fe-Si-Cr系合金、Fe-Al系合金、Fe-Si系合金及Fe-Si-Al系合金,這些合金可以單獨使用或以混合物使用。本發明較佳使用Fe-Si-Cr系合金。
在本發明一個具體實例中,鐵基結晶質合金之粉末具有1μm至15μm、2μm至10μm、或2.5μm至6μm之中值粒徑,其係藉由雷射繞射法量測。
在本發明一個具體實例中,鐵基結晶質合金為Fe-Si-Cr系合金。
在本發明一個較佳的具體實例中,鐵基結晶質合金為Fe-Si-Cr系合金,且其中Cr濃度為等於或大於4wt%。
在本發明一個具體實例中,鐵基非晶質合金之粉末具有≧3.5g/cm3之敲緊密度(tap density),鐵基結晶質合金之粉末具有≧2g/cm3之敲緊密度,敲緊密度係例如根據ISO 3953,使粉末在量筒內經過一定次數的振動,體積不再變化時的堆積密度;鐵基非晶質合金之粉末具有0.15m2/g至0.30m2/g之BET比表面積,鐵基結晶質合金之粉末具有0.5m2/g至2.5m2/g之BET比表面積,其中BET比表面積係根據例如ISO 9277測定。
根據本發明之合金粉末組成物,鐵基非晶質合金之粉末和鐵基結晶質合金之粉末之混合比例以重量計係介於20:80至95:5、30:70至95:5、40:60至95:5、50:50至95:5、60:40至95:5、70:30至95:5、80:20至95:5、90:10至95:5。在本發明之較佳具體實例中,鐵基非晶質合金之粉末和鐵基結晶質合金之粉末之混合比例以重量計為90:10。
本發明之鐵基非晶質合金之粉末可以例如藉由霧化法製造。霧化法係以快速運動的流體(霧化介質)衝擊或其他方式將合金液體破碎為細小液滴,然後使液滴冷卻為固體粉末。
本發明另一態樣為用於製備成型體之方法,其包含使根據本發明之合金粉末組成物與黏結劑混合以形成成型材料,以及加壓成型該成型材料,以得到成型體。成型壓力並不設限,依據田島伸等人刊登於日本粉體與粉末冶金協會誌第50卷第7號之「採用模具潤滑溫壓成形法所製備的高密度壓粉磁芯(HDMC)的特性」,隨著成型壓力的增加,體積電阻率會下降。熟習此項技藝者可以依照所添加的鐵基非晶質合金之粉末的比例並考量所得到的成型體之機械強度視情況調整以得到具有1×104Ω.cm以上之體積電阻率的成型體。於加壓成型過程中,可視情況加熱。本發明所使用的黏結劑的實例為環氧樹脂、聚矽氧樹脂、丙烯酸樹脂、酚醛樹脂或聚乙烯醇。本發明方法所使用之黏結劑之量,基於合金粉末組成物與黏結劑之總重量計為1wt%至4wt%,或者1wt%至3wt%,又或者1wt%至2wt%。
本發明之另一態樣為成型體,其包含根據本發明之合金粉末組成物,其中成型體具有1×104Ω.cm以上的體積電阻率以及70%至95%之相對成型密度。
本發明之成型體的形狀並沒有限制,可以是例如E字型、T字型或工字鼓形。
本發明之另一態樣為電感器,電感器包含根據本發明之成型體以及導體,例如附絕緣層的導線或匯流排(bus bar)。本發明的電感器可以是例如繞線式電感器(wire wound inductor)或一體成型電感器(molded inductor)。
在本發明一個具體實例中,電感器為繞線式電感器,電感器之附絕緣層的導線是纏繞於成型體上。本發明之繞線式電感器係藉由將附絕緣層的導線纏繞於本發明之成型體上,由外側覆蓋磁封膠加以密封。
在本發明一個具體實例中,電感器為一體成型電感器,電感器之導體是埋設於成型體內部。一體成型電感器之製造方法已揭示於美國專利第US6204744B1、US 6198375B1號中。本發明之電感器是例如藉由以下方法製造:將導體的一端焊接至引線框架;捲繞導體;將導體的另一端焊接至引線框架;將導體置放於模穴中;混合本發明之合金粉末組成物與黏結劑之混合物以形成成型材料;將成型材料倒入模穴中;加壓成型;加熱以固化黏結劑。本發明所使用的黏結劑的實例為環氧樹脂、聚矽氧樹脂、丙烯酸樹脂、酚醛樹脂或聚乙烯醇。成型材料可視情況添加填料及/或潤滑劑。在加壓成型步驟中,對成型材料施加適當的壓力,以壓縮導體周圍之成型材料。
使用具有如表1所示性質之鐵基非晶質合金之粉末與鐵基結晶質合金之粉末。混合90wt%的Fe77.27Co0.1P10.8C9.31Cr2Si0.52粉末以及10wt%的Fe88.6Cr6.7Si4.7粉末後,添加丙烯酸樹脂作為黏結劑以形成成型材料,隨後在成型壓力為20t/cm2下經過加壓成型得到具有大於104Ω.cm的體積電阻率以及相對成型密度為82%之成型體;其中Fe77.27Co0.1P10.8C9.31Cr2Si0.52粉末之含氧量為
1300~1400ppm,Fe88.6Cr6.7Si4.7粉末之Cr濃度為4.5wt%,且丙烯酸樹脂黏結劑之使用量基於合金粉末組成物和黏結劑之總重量計為2wt%。
使用具有如表2所示性質之鐵基非晶質合金之粉末與鐵基結晶質合金之粉末。混合90wt%的Fe70.97Co0.1Ni5.96Cr1.99P10.74C7.75B1.99Si0.5粉末以及10wt%的Fe88.6Cr6.7Si4.7粉末後,添加丙烯酸樹脂作為黏結劑以形成成型材料,隨後在成型壓力為20t/cm2下經過加壓成型得到具有大於104Ω.cm的體積電阻率以及相對成型密度為82%之成型體;其中Fe70.97Co0.1Ni5.96Cr1.99P10.74C7.75B1.99Si0.5粉末之含氧量為1300~1400ppm,Fe88.6Cr6.7Si4.7粉末之Cr濃度為4.5wt%,且丙烯酸樹脂黏結劑之使用量基於合金粉末組成物和黏結劑之總重量計為2wt%。
使用具有如表3所示性質之鐵基非晶質合金之粉末與鐵基結晶質合金之粉末。混合30wt%的Fe73Si11B10.8Cr2.3C2.9粉末以及70wt%的羰基鐵粉(CIP)後,添加環氧樹脂作為黏結劑以形成成型材料,隨後在成型壓力為20t/cm2下經過加壓成型得到具有大於104Ω.cm的體積電阻率以及相對成型密度為87%之成型體,其中環氧樹脂黏結劑之使用量基於合金粉末組成物和黏結劑之總重量計為4.5wt%。需留意者,比較例中為了得到具有大於104Ω.cm的體積電阻率之成型體,需要添加較多的黏結劑,因此造成軟磁性質不佳。
對於根據實施例1-2及比較例之成型體測定磁導率μr’以及鐵損PCV,結果顯示在圖1及圖2-4中。
圖1顯示了磁導率與頻率之關係,圖1所示之磁導率μr’為相對磁導率之實部值,其係使用依據實施例1-2及比較例之成型材料製作成尺寸為外徑13.5mm、內徑7.6mm、高5mm之磁環量測時之相對磁導率的實部值。從圖1可以發現,實施例1及2之成型體之磁導率遠高於比較例,且在高頻區也具有穩定的磁導率;圖2-4則揭示了在不同的最大磁通密度(Bm=10、50、100mT)下鐵損與頻率的關係,實施例1及2之成型體皆具有顯著較低的鐵損。
電感轉換效率進一步被分析,結果顯示於圖5。從圖5可以發現,從實施例1及2之成型體得到的電感的轉換效率明顯優於比較例。
以上雖已參照圖式來詳細說明本發明較佳實施形態,但本發明不限於上述實施形態。本發明所述技術領域中具通常知識者應當可在申請專利範
圍所記載之範圍內做各種變化,亦可任意組合說明書中所揭示的各種具體實例,並且可明瞭該等當然亦屬於本發明之技術範圍。
Claims (17)
- 一種合金粉末組成物,其包括鐵基非晶質合金之粉末及鐵基結晶質合金之粉末,其中該鐵基非晶質合金之粉末在受到20kN的力時,其體積電阻率為1×106Ω.cm以下,該鐵基結晶質合金之粉末在受到20kN的力時,其體積電阻率為1×106Ω.cm以上;其中該鐵基非晶質合金包含Fe、Co、Cr、C、P及Si以及視情況地另外包含Ni、B及Al中之一或多者;其中該鐵基非晶質合金包含70at%<Fe<83at%之原子比例;且其中該鐵基結晶質合金之粉末係選自由Fe-Ni系合金、Fe-Co系合金、Fe-V系合金、Fe-Si-Cr系合金、Fe-Al系合金、Fe-Si系合金及Fe-Si-Al系合金所組成之群中之一或多者。
- 如請求項1之合金粉末組成物,其中該鐵基非晶質合金包含以下之原子比例:0at%<Co<1at%;1at%<Cr<4at%;7at%<C<11at%;9at%<P<12at%;0at%<Si<1at%;Ni不存在或為5at%<Ni<7at%;0at%≦B<3at%;且0at%≦Al<1at%。
- 如請求項1或2之合金粉末組成物,其中該鐵基非晶質合金之原子比例為:70at%<Fe<78at%。
- 如請求項1或2之合金粉末組成物,其中該鐵基非晶質合金之含氧量等於或小於2500ppm。
- 如請求項1或2之合金粉末組成物,其中該鐵基結晶質合金之粉末具有2.5μm至6μm之中值粒徑(median diameter)D50。
- 如請求項5之合金粉末組成物,其中該鐵基結晶質合金為Fe-Si-Cr系合金。
- 如請求項6之合金粉末組成物,其中該Fe-Si-Cr系合金之Cr含量為等於或大於4wt%。
- 如請求項1或2之合金粉末組成物,其中該鐵基非晶質合金之粉末具有≧3.5g/cm3之敲緊密度(tap density),且該鐵基結晶質合金之粉末具有≧2g/cm3之敲緊密度。
- 如請求項1或2之合金粉末組成物,其中該鐵基非晶質合金之粉末具有0.15m2/g至0.30m2/g之BET比表面積,且該鐵基結晶質合金之粉末具有0.5m2/g至2.5m2/g之BET比表面積。
- 如請求項1或2之合金粉末組成物,其中該鐵基非晶質合金之粉末具有4μm至14μm之中值粒徑D50。
- 如請求項1或2之合金粉末組成物,其中該鐵基非晶質合金之粉末和該鐵基結晶質合金之粉末之混合比例以重量計係介於20:80至95:5。
- 一種用於製備成型體之方法,其包含混合如請求項1至11中任一項之合金粉末組成物與黏結劑以形成成型材料,以及加壓成型(pressure molding)該成型材料。
- 如請求項12之方法,其中黏結劑為環氧樹脂、聚矽氧樹脂、丙烯酸樹脂、酚醛樹脂或聚乙烯醇。
- 如請求項12或13之方法,其中黏結劑之使用量基於該合金粉末組成物和黏結劑之總重量計為1wt%至4wt%。
- 一種成型體,其係藉由如請求項12至14中任一項之方法得到,其中該成型體具有1×104Ω.cm以上的體積電阻率以及70%至95%之相對成型密度。
- 一種電感器,其包含如請求項15之成型體。
- 如請求項16之電感器,其包含導體,其中該導體係埋設於該成型體內部或纏繞於該成型體外部。
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US16/450,529 US20200343029A1 (en) | 2019-04-23 | 2019-06-24 | Alloy powder composition, molding and the manufacturing method thereof, and inductors |
JP2019120963A JP7041099B2 (ja) | 2019-04-23 | 2019-06-28 | 合金粉末組成物、成形体及びその製造方法、並びにインダクタ |
CN201910582862.2A CN111834075B (zh) | 2019-04-23 | 2019-06-28 | 合金粉末组合物、成型体及其制造方法和电感器 |
KR1020200046910A KR20200124609A (ko) | 2019-04-23 | 2020-04-17 | 합금 분말 조성물, 몰딩들과 몰딩들의 제조 방법, 및 인덕터들 |
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