TWI692677B - Substrate processing device - Google Patents

Substrate processing device Download PDF

Info

Publication number
TWI692677B
TWI692677B TW107139691A TW107139691A TWI692677B TW I692677 B TWI692677 B TW I692677B TW 107139691 A TW107139691 A TW 107139691A TW 107139691 A TW107139691 A TW 107139691A TW I692677 B TWI692677 B TW I692677B
Authority
TW
Taiwan
Prior art keywords
substrate
temperature
pattern
processing device
projection
Prior art date
Application number
TW107139691A
Other languages
Chinese (zh)
Other versions
TW201908876A (en
Inventor
鈴木智也
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW201908876A publication Critical patent/TW201908876A/en
Application granted granted Critical
Publication of TWI692677B publication Critical patent/TWI692677B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本發明之基板處理裝置，具備：具有從既定軸以一定半徑彎曲之曲面、基板之一部分被捲繞於曲面以支承基板的基板支承構件，由軸看配置在基板支承構件周圍、對位於周方向中特定位置之曲面之基板施以處理的處理部，以及用以調整供應至基板支承構件前之基板之溫度的溫度調節裝置。 The substrate processing apparatus of the present invention includes a substrate support member having a curved surface that is bent at a constant radius from a predetermined axis, and a portion of the substrate is wound around the curved surface to support the substrate. A processing section for processing a curved substrate at a specific position in the middle, and a temperature adjusting device for adjusting the temperature of the substrate before being supplied to the substrate supporting member.

Description

基板處理裝置 Substrate processing device

本發明係關於對位在基板支承構件之曲面之基板施以處理的基板處理裝置及元件製造方法。 The invention relates to a substrate processing device and a device manufacturing method for processing a substrate positioned on a curved surface of a substrate supporting member.

微影製程所使用之曝光裝置中，有一種如下述專利文獻所揭示之、使圓筒狀或圓柱狀光罩旋轉，以使基板曝光之曝光裝置(例如，參照專利文獻1)。 Among the exposure devices used in the lithography process, there is an exposure device that exposes a substrate by rotating a cylindrical or cylindrical mask as disclosed in the following patent documents (for example, refer to Patent Document 1).

不僅僅是在使用板狀光罩之場合，即使是在使用圓筒狀或圓柱狀光罩來使基板曝光之情形時，為了將光罩圖案之像良好的投影曝光至基板，必須正確的取得光罩圖案之位置資訊。因此，期待有一種能正確的取得圓筒狀或圓柱狀光罩之位置資訊，以能正確的調整該光罩與基板間之位置關係之技術。 Not only in the case of using a plate mask, but also in the case of using a cylindrical or cylindrical mask to expose the substrate, in order to expose a good projection of the mask pattern image to the substrate, it must be obtained correctly Position information of the mask pattern. Therefore, it is expected that there is a technology that can accurately obtain the position information of the cylindrical or cylindrical mask to accurately adjust the positional relationship between the mask and the substrate.

於是，專利文獻1所揭示之曝光裝置中，揭露了一種於光罩之圖案形成面之既定區域，相對圖案以既定位置關係形成位置資訊取得用之標記(刻度、格子等)，並藉由以編碼器系統檢測標記，以取得圖案在圖案形成面之周方向之位置資訊、或光罩之旋轉軸方向之位置資訊的構成。 Therefore, the exposure device disclosed in Patent Document 1 discloses a predetermined area on a pattern forming surface of a photomask, and forms a mark (scale, grid, etc.) for obtaining position information with a predetermined positional relationship with respect to the pattern, and by using The encoder system detects the mark to obtain the position information of the pattern in the circumferential direction of the pattern forming surface or the position information of the rotation axis direction of the mask.

又，近年來，亦提出一種為了將大型顯示面板(液晶、有機EL等)等之電子元件形成於可撓性樹脂薄膜、塑膠片材、極薄玻璃片材等，而拉出捲繞成輥狀之可撓性長條狀薄膜或片材(以下，稱可撓性基板)，於該 可撓性基板表面塗布光感應層，於該光感應層曝光出電子電路用之各種圖案的裝置(例如，專利文獻2)。 In addition, in recent years, there has also been proposed a method of forming an electronic component such as a large display panel (liquid crystal, organic EL, etc.) on a flexible resin film, a plastic sheet, an extremely thin glass sheet, etc. A flexible long strip-shaped film or sheet (hereinafter, referred to as a flexible substrate), a device on which a photosensitive layer is coated on the surface of the flexible substrate, and various patterns for electronic circuits are exposed on the photosensitive layer ( For example, Patent Document 2).

先行技術文獻Advanced technical literature

[專利文獻1]日本特開2008-076650號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2008-076650

[專利文獻2]日本特開2010-217877號公報 [Patent Document 2] Japanese Patent Application Publication No. 2010-217877

上述專利文獻2所揭露之對可撓性基板施以處理之基板處理裝置，被要求可抑制基板之伸縮、及可提升處理之精度。 The substrate processing apparatus for processing flexible substrates disclosed in the above-mentioned Patent Document 2 is required to suppress expansion and contraction of the substrate and improve processing accuracy.

本發明之態樣即係在上述情事下完成，其目的在提供一種可抑制基板伸縮、提升處理精度之基板處理裝置及元件製造方法。 The aspect of the present invention is completed under the above circumstances, and its object is to provide a substrate processing apparatus and a device manufacturing method that can suppress substrate expansion and contraction and improve processing accuracy.

本發明第1態樣，提供一種基板處理裝置，具備：基板支承構件，具有從既定軸以一定半徑彎曲之曲面，基板之一部分被捲繞於該曲面以支承該基板；處理部，由該軸看配置在該基板支承構件周圍，對位於周方向中特定位置之該曲面的該基板施以處理；以及溫度調節裝置，用以調整供應至該基板支承構件前之該基板之溫度。 According to a first aspect of the present invention, there is provided a substrate processing apparatus including: a substrate support member having a curved surface curved at a constant radius from a predetermined axis, and a portion of the substrate is wound around the curved surface to support the substrate; Seeing that it is arranged around the substrate support member, the substrate on the curved surface at a specific position in the circumferential direction is treated; and a temperature adjustment device for adjusting the temperature of the substrate before being supplied to the substrate support member.

本發明第2態樣，提供一種使用本發明第1態樣之基板處理裝置於基板形成圖案之元件製造方法。 According to a second aspect of the present invention, there is provided a device manufacturing method for forming a pattern on a substrate using the substrate processing apparatus of the first aspect of the present invention.

本發明第3態樣，提供一種元件製造方法，係於可撓性長條狀基板上製造電子元件，包含：一邊將該基板之長條方向之一部分沿基板支承構件之該長條方向彎曲之支承面加以支承、一邊將該基板於該長條方 向以既定速度加以搬送的動作；於該基板支承構件之支承面中之該長條方向之特定位置，將構成該電子元件之圖案轉印至被支承於該支承面之該基板的動作；以及以相對該基板支承構件之支承面之該基板在搬送方向上游側之溫度、與該基板在該支承面之溫度為既定差之方式進行溫度控制的動作。 A third aspect of the present invention provides a device manufacturing method for manufacturing an electronic component on a flexible elongated substrate, including: bending a portion of the substrate in the elongated direction along the elongated direction of the substrate support member The supporting surface is supported while the substrate is transported at a predetermined speed in the longitudinal direction; at a specific position in the longitudinal direction in the supporting surface of the substrate supporting member, the pattern constituting the electronic component is transferred to The operation of the substrate supported on the support surface; and temperature control so that the temperature of the substrate upstream of the support surface relative to the support surface of the substrate support member in the conveying direction and the temperature of the substrate on the support surface are a predetermined difference Actions.

根據本發明之態樣，上述基板處理裝置及元件製造方法可抑制基板伸縮、提升處理精度。 According to the aspect of the present invention, the above substrate processing apparatus and component manufacturing method can suppress substrate expansion and contraction and improve processing accuracy.

1‧‧‧元件製造系統 1‧‧‧Component manufacturing system

2‧‧‧基板供應裝置 2‧‧‧Substrate supply device

3‧‧‧基板回收裝置 3‧‧‧Substrate recycling device

5‧‧‧上位控制裝置 5‧‧‧Higher control device

9‧‧‧搬送裝置 9‧‧‧Conveying device

12‧‧‧光罩保持裝置 12‧‧‧ Mask Holder

13‧‧‧光源裝置 13‧‧‧Light source device

14‧‧‧控制裝置 14‧‧‧Control device

21‧‧‧第1滾筒構件 21‧‧‧The first roller component

22‧‧‧第2滾筒構件 22‧‧‧The second roller component

23‧‧‧導輥 23‧‧‧Guide roller

24‧‧‧驅動輥 24‧‧‧Drive roller

25‧‧‧第1檢測器 25‧‧‧The first detector

26‧‧‧第1驅動部 26‧‧‧First drive unit

31‧‧‧第1導件 31‧‧‧First guide

32‧‧‧第2導件 32‧‧‧The second guide

33‧‧‧第3導件 33‧‧‧The third guide

35‧‧‧第2檢測器 35‧‧‧Second detector

36‧‧‧第2驅動部 36‧‧‧ 2nd drive unit

44‧‧‧焦點修正光學構件 44‧‧‧ Focus correction optical component

45‧‧‧像位移修正光學構件 45‧‧‧ Image displacement correction optical component

46‧‧‧旋轉修正機構 46‧‧‧ Rotation correction mechanism

47‧‧‧倍率修正用光學構件 47‧‧‧Optical components for magnification correction

60、60A‧‧‧溫度調節裝置 60、60A‧‧‧Temperature adjustment device

61、32A‧‧‧導件 61、32A‧‧‧Guide

61S‧‧‧曲面 61S‧‧‧Curved

62、62A‧‧‧媒體送風構件 62、62A‧‧‧Media air supply component

63‧‧‧送風壓力均勻化構件 63‧‧‧Supply air pressure equalization component

64、65‧‧‧限制構件 64, 65

66‧‧‧音圈馬達 66‧‧‧Voice coil motor

67‧‧‧空間 67‧‧‧Space

71‧‧‧媒體調節裝置 71‧‧‧Media adjustment device

72H、72C、74H、74C‧‧‧流量調整閥 72H, 72C, 74H, 74C‧‧‧Flow regulating valve

73‧‧‧基板支承構件溫度調節裝置 73‧‧‧Substrate supporting member temperature regulating device

AD‧‧‧媒體供應管線 AD‧‧‧media supply pipeline

AM1、AM2‧‧‧觀察方向 AM1, AM2‧‧‧ Observation direction

AMG1、AMG2、PMG1‧‧‧對準顯微鏡 AMG1, AMG2, PMG1 ‧‧‧ alignment microscope

AP‧‧‧媒體供應管線 AP‧‧‧Media supply pipeline

AX1、AX2‧‧‧旋轉中心線 AX1, AX2‧‧‧Rotation centerline

CC‧‧‧媒體供應管線 CC‧‧‧Media supply pipeline

CU‧‧‧冷卻單元 CU‧‧‧cooling unit

DM‧‧‧圓筒光罩 DM‧‧‧Cylinder Mask

DR1~DR8‧‧‧驅動輥 DR1~DR8‧‧‧Drive roller

HH‧‧‧媒體供應管線 HH‧‧‧Media supply pipeline

EL1‧‧‧照明光束 EL1‧‧‧Illumination beam

EL2‧‧‧成像光束 EL2‧‧‧Imaging beam

EN1、EN2、EN3、EN4、EN5‧‧‧編碼器讀頭 EN1, EN2, EN3, EN4, EN5 ‧‧‧ Encoder read head

EX、EX2、EX3、EX4‧‧‧曝光裝置(基板處理裝置) EX, EX2, EX3, EX4‧‧‧ Exposure device (substrate processing device)

HH‧‧‧媒體供應管線 HH‧‧‧Media supply pipeline

HU‧‧‧加熱單元 HU‧‧‧Heating unit

IA‧‧‧搬送方向進入位置 IA‧‧‧Transport direction into position

IL‧‧‧照明模組 IL‧‧‧Lighting Module

IR‧‧‧照明區域 IR‧‧‧Illuminated area

IU‧‧‧照明機構 IU‧‧‧Lighting agency

OA‧‧‧搬送方向脫離位置 OA‧‧‧Transport direction is out of position

P‧‧‧基板 P‧‧‧Substrate

P1‧‧‧第1面 P1‧‧‧The first side

P2‧‧‧第2面 P2‧‧‧The second side

P2‧‧‧中心面 P2‧‧‧Center

PA(PA1~PA6)‧‧‧投影區域 PA(PA1~PA6)‧‧‧Projection area

PL(PL1~PL6)‧‧‧投影光學系 PL(PL1~PL6)‧‧‧Projection optics

PM1‧‧‧檢測方向 PM1‧‧‧Detection direction

PO1、PO2‧‧‧多邊形掃描單元 PO1, PO2‧‧‧ polygon scanning unit

PX‧‧‧特定位置 PX‧‧‧ specific location

PX1、PX2‧‧‧第1、第2特定位置 PX1, PX2‧‧‧First and second specific positions

T1、T2‧‧‧溫度測量裝置 T1, T2‧‧‧Temperature measuring device

圖1係顯示第1實施形態之元件製造系統之構成的圖。 FIG. 1 is a diagram showing the configuration of the component manufacturing system of the first embodiment.

圖2係顯示第1實施形態之處理裝置(曝光裝置)之全體構成的示意圖。 FIG. 2 is a schematic diagram showing the overall configuration of the processing apparatus (exposure apparatus) of the first embodiment.

圖3係顯示圖2中之照明區域及投影區域之配置的示意圖。 FIG. 3 is a schematic diagram showing the arrangement of the illumination area and the projection area in FIG. 2.

圖4係顯示適用於圖2之處理裝置(曝光裝置)之投影光學系之構成的示意圖。 FIG. 4 is a schematic diagram showing the configuration of a projection optical system suitable for the processing device (exposure device) of FIG. 2.

圖5係適用於圖2之處理裝置(曝光裝置)之旋轉筒的立體圖。 FIG. 5 is a perspective view of a rotating drum suitable for the processing device (exposure device) of FIG. 2.

圖6係用以說明適用於圖2之處理裝置(曝光裝置)之檢測探針與讀取裝置間之關係的立體圖。 FIG. 6 is a perspective view for explaining the relationship between the detection probe and the reading device applied to the processing device (exposure device) of FIG. 2.

圖7係從旋轉中心線方向觀察第1實施形態之標尺圓盤，用以說明讀取裝置之位置的說明圖。 7 is an explanatory view for explaining the position of the reading device when the scale disk of the first embodiment is viewed from the direction of the rotation center line.

圖8係說明第1實施形態之溫度調節裝置的說明圖。 FIG. 8 is an explanatory diagram illustrating the temperature adjusting device of the first embodiment.

圖9係說明對準標記之一例的說明圖。 9 is an explanatory diagram illustrating an example of an alignment mark.

圖10係以示意方式說明因基板伸縮造成之對準標記之一變化例的說明圖。 FIG. 10 is an explanatory diagram schematically illustrating a variation of alignment marks due to substrate expansion and contraction.

圖11係顯示修正第1實施形態之處理裝置(曝光裝置)之處理之一程序例的流程圖。 FIG. 11 is a flowchart showing an example of a procedure of processing for correcting the processing device (exposure device) of the first embodiment.

圖12係顯示第2實施形態之處理裝置(曝光裝置)之全體構成的示意圖。 FIG. 12 is a schematic diagram showing the overall configuration of the processing device (exposure device) according to the second embodiment.

圖13係顯示第3實施形態之處理裝置(曝光裝置)之全體構成的示意圖。 13 is a schematic diagram showing the overall configuration of a processing device (exposure device) according to a third embodiment.

圖14係顯示第4實施形態之處理裝置(曝光裝置)之全體構成的示意圖。 14 is a schematic diagram showing the overall configuration of a processing device (exposure device) according to a fourth embodiment.

圖15係顯示第5實施形態之處理裝置(曝光裝置)之全體構成的示意圖。 15 is a schematic diagram showing the overall configuration of a processing device (exposure device) according to a fifth embodiment.

圖16係顯示第6實施形態之處理裝置(曝光裝置)之全體構成的示意圖。 16 is a schematic diagram showing the overall configuration of a processing device (exposure device) according to a sixth embodiment.

圖17係顯示使用第1實施形態之處理裝置(曝光裝置)之元件製造方法的流程圖。 FIG. 17 is a flowchart showing a device manufacturing method using the processing device (exposure device) of the first embodiment.

針對用以實施本發明之形態(實施形態)，一邊參照圖面一邊加以詳細說明如下。本發明並不受以下實施形態記載內容之限定。又，以下記載之構成要素中，當然包含本領域之業者易於想到之、實質上相同之物。再者，以下記載之構成要素可適當的加以組合。此外，在不脫離本發明之要旨範圍內可進行構成要素之各種省略、置換或變更。例如，以下之實施形態中，作為元件雖係以製造可撓性顯示器之場合為例加以說明，但不限於此。作為元件，亦可以是製造配線基板、半導體基板等。 The form (embodiment) for implementing the present invention will be described in detail below with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below, of course, include those that are easy to think of by those skilled in the art and are substantially the same. In addition, the constituent elements described below can be combined as appropriate. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the gist of the present invention. For example, in the following embodiments, the device is described as an example of a case where a flexible display is manufactured, but it is not limited to this. As an element, a wiring board, a semiconductor substrate, etc. may be manufactured.

(第1實施形態) (First embodiment)

第1實施形態中，對基板施以曝光處理之基板處理裝置係曝光裝置。又，曝光裝置係組裝在對曝光後之基板施以各種處理以製造元件之元件製 造系統中。首先，說明元件製造系統。 In the first embodiment, the substrate processing apparatus that performs exposure processing on the substrate is an exposure apparatus. In addition, the exposure apparatus is incorporated in a device manufacturing system that performs various processes on the exposed substrate to manufacture devices. First, the component manufacturing system will be described.

<元件製造系統> <Component Manufacturing System>

圖1係顯示第1實施形態之元件製造系統之構成的圖。圖1所示之元件製造系統1，係製造作為元件之可撓性顯示器的生產線(可撓性顯示器製造線)。作為可撓性顯示器，例如有有機EL顯示器等。此元件製造系統1，係從將可撓性基板P捲繞成捲筒狀之供應用捲筒FR1送出該基板P，並對送出之基板P連續的施以各種處理後，將處理後之基板P作為可撓性元件捲繞於回收用捲筒FR2、所謂之捲對捲(Roll to Roll)方式。第1實施形態之元件製造系統1，係顯示將成薄膜狀片材之基板P從供應用捲筒FR1送出，從供應用捲筒FR1送出之基板P，依序經n台之處理裝置U1、U2、U3、U4、U5、…Un，捲繞至回收用捲筒FR2為止之例。首先，針對作為元件製造系統1之處理對象的基板P加以說明。 FIG. 1 is a diagram showing the configuration of the component manufacturing system of the first embodiment. The component manufacturing system 1 shown in FIG. 1 is a production line (flexible display manufacturing line) for manufacturing flexible displays as components. As the flexible display, for example, there is an organic EL display. This component manufacturing system 1 sends out the substrate P from the supply reel FR1 that winds the flexible substrate P into a roll shape, and after successively applying various treatments to the sent substrate P, the processed substrate P is wound as a flexible element around the reel for recycling FR2, a so-called roll-to-roll method. The element manufacturing system 1 of the first embodiment shows that the substrate P formed into a film-like sheet is sent out from the supply reel FR1, and the substrate P sent out from the supply reel FR1 passes sequentially through n processing devices U1 U2, U3, U4, U5, ...Un, an example of winding up to the reel for recycling FR2. First, the substrate P to be processed by the component manufacturing system 1 will be described.

基板P，例如係使用由樹脂薄膜、不鏽鋼等之金屬或合金構成之箔(foil)等。作為樹脂薄膜之材質，例如包含聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯共聚物樹脂、聚氯乙烯樹脂、纖維素樹酯、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、乙酸乙烯酯樹脂中之1或2種以上。 For the substrate P, for example, a foil made of a metal or alloy of resin film, stainless steel, or the like is used. The material of the resin film includes, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene-vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin , Polystyrene resin, vinyl acetate resin 1 or 2 or more.

基板P，以選擇例如熱膨脹係數顯著較大、而能在對基板P實施之各種處理中因受熱而產生之變形量可實質忽視者較佳。熱膨脹係數，例如，可藉由將無機填充物混入樹脂薄膜中，據以設定為較對應製程溫度等之閾值小。無機填充物，可以是例如，氧化鈦、氧化鋅、氧化鋁、氧化矽等。又，基板P可以是以浮製法等製造之厚度100μm程度之極薄玻 璃之單層體、或於此極薄玻璃貼合上述樹脂薄膜、箔等之積層體。 For the substrate P, for example, it is preferable to select, for example, a coefficient of thermal expansion that is remarkably large, and the amount of deformation that can be generated due to heat in various processes performed on the substrate P can be substantially ignored. The coefficient of thermal expansion, for example, can be set to be smaller than the threshold value corresponding to the process temperature or the like by mixing the inorganic filler into the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, silicon oxide, or the like. In addition, the substrate P may be a single layer body of extremely thin glass having a thickness of about 100 m manufactured by a float method or the like, or a laminate in which the above-mentioned resin film, foil, etc. are bonded to the extremely thin glass.

以此方式構成之基板P，被捲繞成捲筒狀而成為供應用捲筒FR1，此供應用捲筒FR1被裝著於元件製造系統1。裝有供應用捲筒FR1之元件製造系統1，對從供應用捲筒FR1送出之基板P反覆實施用以製造1個元件之各種處理。因此，處理後之基板P成為複數個元件連結之狀態。也就是說，從供應用捲筒FR1送出之基板P，為多面用之基板。此外，基板P亦可以是藉由預先之既定前處理，將其表面予以改質而活性化者、或於表面形成用以精密圖案化之微細間隔壁構造(凹凸構造)者。 The substrate P configured in this way is wound into a roll shape to become a supply roll FR1, and this supply roll FR1 is mounted on the component manufacturing system 1. The component manufacturing system 1 equipped with the supply reel FR1 repeatedly performs various processes for manufacturing one component on the substrate P sent out from the supply reel FR1. Therefore, the processed substrate P is in a state where a plurality of elements are connected. In other words, the substrate P sent from the supply reel FR1 is a substrate for multiple surfaces. In addition, the substrate P may be one whose surface is modified and activated by a predetermined pre-treatment in advance, or a fine partition wall structure (concave-convex structure) for precise patterning is formed on the surface.

處理後之基板P，被捲繞成捲筒狀作為回收用捲筒FR2加以回收。回收用捲筒FR2，被安裝於為圖示之切割裝置。裝有回收用捲筒FR2之切割裝置，將處理後之基板P分割(切割)成各個元件，據以成複數個元件。基板P之尺寸，例如，寬度方向(短邊之方向)之尺寸為10cm~2m程度、而長度方向(長條之方向)尺寸則為10m以上。當然，基板P之尺寸不限於上述尺寸。 The processed substrate P is wound into a roll shape and collected as a collection roll FR2. The reel for recycling FR2 is installed in the cutting device shown in the figure. A cutting device equipped with a reel for recycling FR2 divides (cuts) the processed substrate P into individual components, thereby forming a plurality of components. The size of the substrate P is, for example, the size in the width direction (the direction of the short side) is about 10 cm to 2 m, and the size in the length direction (the direction of the long direction) is more than 10 m. Of course, the size of the substrate P is not limited to the above-mentioned size.

其次，參照圖1，說明元件製造系統1。圖1中，X方向、Y方向及Z方向成一正交之正交座標系。X方向係在水平面內，連結供應用捲筒FR1及回收用捲筒FR2之方向，為圖1中之左右方向。Y方向係在水平面內與X方向正交之方向，為圖1中之前後方向。Y方向係供應用捲筒FR1及回收用捲筒FR2之軸方向。Z方向係鉛直方向，為圖1中之上下方向。 Next, referring to FIG. 1, the component manufacturing system 1 will be described. In FIG. 1, the X direction, the Y direction, and the Z direction form an orthogonal coordinate system that is orthogonal. The X direction is in the horizontal plane, and the direction connecting the supply reel FR1 and the recovery reel FR2 is the left-right direction in FIG. 1. The Y direction is the direction orthogonal to the X direction in the horizontal plane, which is the front-rear direction in FIG. 1. The Y direction is the axial direction of the supply reel FR1 and the recovery reel FR2. The Z direction is the vertical direction, which is the up and down direction in FIG. 1.

元件製造系統1，具備供應基板P之基板供應裝置2、對由基板供應裝置2供應之基板P施以各種處理之處理裝置U1~Un、回收經處理裝置U1~Un施以處理之基板P之基板回收裝置3、以及控制元件製造系 統1之各裝置之上位控制裝置5。 The component manufacturing system 1 includes a substrate supply device 2 that supplies substrates P, processing devices U1 to Un that perform various processes on the substrate P supplied by the substrate supply device 2, and recovery of substrates P that are processed by the processing devices U1 to Un The substrate recovery device 3 and the upper control device 5 of each device of the control element manufacturing system 1.

於基板供應裝置2，以可旋轉之方式安裝供應用捲筒FR1。基板供應裝置2，具有從所安裝之供應用捲筒FR1送出基板P的驅動輥DR1、與調整基板P在寬度方向(Y方向)之位置的邊緣位置控制器EPC1。驅動輥DR1，一邊夾持基板P之表背兩面一邊旋轉，將基板P從供應用捲筒FR1往朝向回收用捲筒FR2之搬送方向送出，據以將基板P供應至處理裝置U1~Un。此時，邊緣位置控制器EPC1係以基板P在寬度方向端部(邊緣)之位置，相對目標位置在±十數μm程度範圍至±數十μm程度之範圍內之方式，使基板P移動於寬度方向，以修正基板P在寬度方向之位置。 The substrate supply device 2 is provided with a supply reel FR1 in a rotatable manner. The substrate supply device 2 includes a driving roller DR1 that feeds the substrate P from the mounted supply reel FR1, and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller DR1 rotates while pinching the front and back surfaces of the substrate P, and sends the substrate P from the supply reel FR1 toward the conveyance direction of the collection reel FR2, thereby supplying the substrate P to the processing devices U1 to Un. At this time, the edge position controller EPC1 moves the substrate P in such a manner that the position of the end (edge) of the substrate P in the width direction relative to the target position is within the range of ± tens of μm to ± tens of μm In the width direction, the position of the substrate P in the width direction is corrected.

於基板回收裝置3，以可旋轉之方式裝有回收用捲筒FR2。基板回收裝置3，具有將處理後之基板P拉向回收用捲筒FR2側的驅動輥DR2、與調整基板P在寬度方向(Y方向)之位置的邊緣位置控制器EPC2。基板回收裝置3，一邊以驅動輥DR2夾持基板P之表背兩面一邊旋轉，將基板P拉向搬送方向，並藉由使回收用捲筒FR2旋轉，據以捲繞基板P。此時，邊緣位置控制器EPC2與邊緣位置控制器EPC1同樣構成，修正基板P在寬度方向之位置，以避免基板P之寬度方向端部(邊緣)在寬度方向產生不均。 The substrate recovery device 3 is provided with a recovery reel FR2 in a rotatable manner. The substrate recovery device 3 includes a driving roller DR2 that pulls the processed substrate P toward the recovery reel FR2 side, and an edge position controller EPC2 that adjusts the position of the substrate P in the width direction (Y direction). The substrate recovery device 3 rotates while sandwiching the front and back surfaces of the substrate P with the drive roller DR2, pulls the substrate P in the transport direction, and rotates the recovery reel FR2 to wind the substrate P accordingly. At this time, the edge position controller EPC2 has the same configuration as the edge position controller EPC1, and corrects the position of the substrate P in the width direction to avoid unevenness in the width direction end (edge) of the substrate P.

處理裝置U1，係在從基板供應裝置2供應之基板P表面塗布感光性機能液之塗布裝置。作為感光性機能液，例如係使用光阻劑、感光性矽烷耦合劑、UV硬化樹脂液等。處理裝置U1，從基板P之搬送方向上游側起，依序設有塗布機構Gp1與乾燥機構Gp2。塗布機構Gp1，具有捲繞基板P之壓輥R1、與和壓輥R1對向之塗布輥R2。塗布機構Gp1在將所 供應之基板P捲繞於壓輥R1之狀態下，以壓輥R1及塗布輥R2夾持基板P。接著，塗布機構Gp1藉由使壓輥R1及塗布輥R2旋轉，一邊使基板P移動於搬送方向、一邊以塗布輥R2塗布感光性機能液。乾燥機構Gp2吹出熱風或乾燥空氣等之乾燥用空氣以除去感光性機能液中所含之溶質(溶劑或水)，使塗有感光性機能液之基板P乾燥，以在基板P上形成感光性機能層。 The processing device U1 is a coating device that coats a photosensitive functional liquid on the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist, a photosensitive silane coupling agent, a UV curing resin liquid, or the like is used. The processing device U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in order from the upstream side in the conveyance direction of the substrate P. The coating mechanism Gp1 has a pressure roller R1 wound around the substrate P, and a coating roller R2 opposed to the pressure roller R1. The coating mechanism Gp1 holds the substrate P between the pressing roller R1 and the coating roller R2 in a state where the supplied substrate P is wound around the pressing roller R1. Next, the coating mechanism Gp1 applies the photosensitive functional liquid by the coating roller R2 while moving the substrate P in the conveying direction by rotating the pressure roller R1 and the coating roller R2. The drying mechanism Gp2 blows out drying air such as hot air or dry air to remove the solute (solvent or water) contained in the photosensitive functional liquid to dry the substrate P coated with the photosensitive functional liquid to form the photosensitivity on the substrate P Function layer.

處理裝置U2，係為了使形成在基板P表面之感光性機能層安定，而將從處理裝置U1搬送之基板P加熱至既定溫度(例如，數10~120℃程度)之加熱裝置。處理裝置U2，從基板P之搬送方向上游側起依序設有加熱室HA1與冷卻室HA2。加熱室HA1，於其內部設有複數個輥及複數個空氣翻轉桿(air turn bar)，複數個輥及複數個空氣翻轉桿構成基板P之搬送路徑。複數個輥以接觸基板P背面之方式設置，複數個空氣翻轉桿以非接觸狀態設於基板P之表面側。複數個輥及複數個空氣翻轉桿為加長基板P之搬送路徑，而呈蛇行狀之搬送路徑。通過加熱室HA1內之基板P，一邊沿蛇行狀之搬送路徑被搬送、一邊被加熱至既定溫度。冷卻室HA2，為使在加熱室HA1加熱之基板P之溫度與後製程(處理裝置U3)之環境溫度一致，而將基板P冷卻至環境溫度。冷卻室HA2，其內部設有複數個輥，複數個輥，與加熱室HA1同樣的，為加長基板P之搬送路徑而呈蛇行狀搬送路徑之配置。通過冷卻室HA2內之基板P，一邊沿蛇行狀之搬送路徑被搬送一邊被冷卻。於冷卻室HA2之搬送方向下游側，設有驅動輥DR3，驅動輥DR3一邊夾持通過冷卻室HA2之基板P一邊旋轉，據以將基板P供應向處理裝置U3。 The processing device U2 is a heating device that heats the substrate P transferred from the processing device U1 to a predetermined temperature (for example, about 10 to 120°C) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. The processing device U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in this order from the upstream side in the conveyance direction of the substrate P. In the heating chamber HA1, a plurality of rollers and a plurality of air turn bars are provided inside the plurality of rollers and a plurality of air turn bars. The plurality of rollers and the plurality of air turn bars constitute a conveyance path of the substrate P. A plurality of rollers are provided so as to contact the back surface of the substrate P, and a plurality of air turning bars are provided on the surface side of the substrate P in a non-contact state. The plurality of rollers and the plurality of air reversing rods extend the conveying path of the substrate P, and form a meandering conveying path. The substrate P in the heating chamber HA1 is heated to a predetermined temperature while being transported along the meandering transport path. The cooling chamber HA2 cools the substrate P to the ambient temperature so that the temperature of the substrate P heated in the heating chamber HA1 matches the ambient temperature of the post-process (processing device U3). The cooling chamber HA2 is provided with a plurality of rollers inside, and the plurality of rollers, like the heating chamber HA1, are arranged in a serpentine transport path to lengthen the transport path of the substrate P. The substrate P in the cooling chamber HA2 is cooled while being transported along the meandering transport path. A driving roller DR3 is provided on the downstream side of the cooling chamber HA2 in the conveying direction. The driving roller DR3 rotates while sandwiching the substrate P passing through the cooling chamber HA2, thereby supplying the substrate P to the processing device U3.

處理裝置(基板處理裝置)U3，係對從處理裝置U2供應、表 面形成有感光性機能層之基板(感光基板)P，投影曝光(轉印)顯示器用電路或配線等圖案之曝光裝置。詳細將留待後敘，處理裝置U3以照明光束照明穿透型或反射型之圓筒光罩(光罩)DM，將藉由照明光束穿透圓筒光罩(光罩)DM、或被其反射所得之投影光束投影曝光於基板P。處理裝置U3，具有將從處理裝置U2供應之基板P送往搬送方向下游側的驅動輥DR4、與調整基板P在寬度方向(Y方向)之位置的邊緣位置控制器EPC。驅動輥DR4藉由在夾持基板P之表背兩面之同時進行旋轉，將基板P送向搬送方向下游側，據以朝曝光位置供應基板P。邊緣位置控制器EPC與邊緣位置控制器EPC1同樣構成，修正基板P在寬度方向之位置，以使在曝光位置之基板P之寬度方向成為目標位置。處理裝置U3，在以溫度調節裝置60調整邊緣位置控制器EPC供應之基板P之溫度後，以驅動輥DR5搬送基板P。 The processing device (substrate processing device) U3 is an exposure device that supplies a pattern (photosensitive substrate) P with a photosensitive functional layer formed on the surface supplied from the processing device U2, and projection exposure (transfer) a circuit or wiring for display. The details will be described later. The processing device U3 illuminates the transparent or reflective cylindrical reticle (reticle) DM with an illumination beam, which will penetrate the cylindrical reticle (reticle) DM or be The reflected projection beam is projected and exposed to the substrate P. The processing device U3 includes a driving roller DR4 that sends the substrate P supplied from the processing device U2 to the downstream side in the conveyance direction, and an edge position controller EPC that adjusts the position of the substrate P in the width direction (Y direction). The driving roller DR4 rotates while gripping both the front and back surfaces of the substrate P to feed the substrate P to the downstream side in the conveying direction, thereby supplying the substrate P toward the exposure position. The edge position controller EPC has the same configuration as the edge position controller EPC1, and corrects the position of the substrate P in the width direction so that the width direction of the substrate P at the exposure position becomes the target position. The processing device U3 adjusts the temperature of the substrate P supplied by the edge position controller EPC with the temperature adjusting device 60, and then conveys the substrate P with the driving roller DR5.

又，處理裝置U3，具備緩衝部DL，此緩衝部DL具有在對曝光後之基板P賦予鬆弛之狀態下，將基板P送往搬送方向下游側之2組驅動輥DR6、DR7。2組驅動輥DR6、DR7於基板P之搬送方向相隔既定間隔配置。驅動輥DR6夾持搬送之基板P之上游側並旋轉，驅動輥DR7則夾持搬送之基板P之下游側並旋轉，據以將基板P供應向處理裝置U4。此時，基板P由於被賦予鬆弛，因此能吸收在較驅動輥DR7靠搬送方向下游側所產生之搬送速度之變動，而能消除搬送速度之變動對基板P之曝光處理之影響。又，於處理裝置U3內，為進行圓筒光罩(光罩)DM之光罩圖案之一部分之像與基板P之相對位置對準(對準，alignment)，而設有檢測預先形成在基板P之對準標記等的對準顯微鏡AMG1、AMG2。 In addition, the processing device U3 includes a buffer section DL having two sets of drive rollers DR6 and DR7 that transport the substrate P to the downstream side in the conveying direction while slackening the exposed substrate P. The two sets of drives The rollers DR6 and DR7 are arranged at a predetermined interval in the conveyance direction of the substrate P. The driving roller DR6 clamps and rotates the upstream side of the transported substrate P, and the driving roller DR7 clamps and rotates the downstream side of the transported substrate P, thereby supplying the substrate P to the processing device U4. At this time, since the substrate P is given slack, it is possible to absorb the variation in the conveying speed that is generated downstream of the driving roller DR7 in the conveying direction, and the influence of the variation in the conveying speed on the exposure processing of the substrate P can be eliminated. In addition, in the processing device U3, in order to perform relative alignment (alignment) of a part of the image of the mask pattern of the cylindrical mask (mask) DM and the substrate P, a detection is formed in advance on the substrate The alignment marks such as P are aligned with the microscopes AMG1 and AMG2.

處理裝置U4，係對從處理裝置U3搬送而來之曝光後之基 板P，進行濕式之顯影處理、無電電鍍處理等之濕式處理裝置。處理裝置U4，於其內部具有於鉛直方向(Z方向)階段化之3個處理槽BT1、BT2、BT3、與搬送基板P之複數個輥。複數個輥係以基板P依序通過3個處理槽BT1、BT2、BT3內部之搬送路徑的方式配置。於處理槽BT3之搬送方向下游側設有驅動輥DR8，驅動輥DR8藉由一邊夾持通過處理槽BT3後之基板P一邊旋轉，據以將基板P供應向處理裝置U5。 The processing device U4 is a wet processing device that performs wet development processing, electroless plating processing, etc. on the exposed substrate P that has been transferred from the processing device U3. The processing device U4 has three processing tanks BT1, BT2, BT3 staged in the vertical direction (Z direction) and a plurality of rollers for transporting the substrate P inside. The plural rollers are arranged in such a manner that the substrate P sequentially passes through the transport paths inside the three processing tanks BT1, BT2, and BT3. A driving roller DR8 is provided on the downstream side of the processing tank BT3 in the conveying direction. The driving roller DR8 rotates while holding the substrate P passing through the processing tank BT3, thereby supplying the substrate P to the processing device U5.

雖省略圖示，但處理裝置U5係使從處理裝置U4搬送而來之基板P乾燥的乾燥裝置。處理裝置U5，將在處理裝置U4將濕式處理而附著於基板P之水分含有量，調整為既定水分含有量。由處理裝置U5加以乾燥之基板P，經由若干個處理裝置後被搬送至處理裝置Un。在以處理裝置Un加以處理後，基板P即被捲繞於基板回收裝置3之回收用捲筒FR2。 Although not shown, the processing device U5 is a drying device that dries the substrate P transferred from the processing device U4. The processing device U5 adjusts the moisture content of the processing device U4 to be wet-processed and attached to the substrate P to a predetermined moisture content. The substrate P dried by the processing device U5 is transported to the processing device Un after passing through several processing devices. After being processed by the processing device Un, the substrate P is wound around the collection reel FR2 of the substrate collection device 3.

上位控制裝置5，統籌控制基板供應裝置2、基板回收裝置3及複數個處理裝置U1~Un。上位控制裝置5控制基板供應裝置2及基板回收裝置3，將基板P從基板供應裝置2搬送向基板回收裝置3。又，上位控制裝置5，與基板P之搬送同步，控制複數個處理裝置U1~Un，以實施對基板P之各種處理。 The higher-level control device 5 controls the substrate supply device 2, the substrate recovery device 3, and the plurality of processing devices U1 to Un as a whole. The higher-level control device 5 controls the substrate supply device 2 and the substrate recovery device 3 to transport the substrate P from the substrate supply device 2 to the substrate recovery device 3. In addition, the higher-level control device 5 synchronizes the conveyance of the substrate P, and controls a plurality of processing devices U1 to Un to perform various processings on the substrate P.

<曝光裝置(基板處理裝置)> <Exposure device (substrate processing device)>

其次，針對作為第1實施形態之處理裝置U3之曝光裝置(基板處理裝置)之構成，參照圖2至圖4加以說明。圖2係顯示第1實施形態之曝光裝置(基板處理裝置)之全體構成的圖。圖3係顯示圖2所示曝光裝置之照明區域及投影區域之配置的圖。圖4係顯示圖2所示曝光裝置之投影光學系之構成的圖。 Next, the configuration of the exposure device (substrate processing device) as the processing device U3 of the first embodiment will be described with reference to FIGS. 2 to 4. 2 is a diagram showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment. FIG. 3 is a diagram showing the arrangement of the illumination area and the projection area of the exposure apparatus shown in FIG. 2. 4 is a diagram showing the configuration of the projection optical system of the exposure apparatus shown in FIG. 2.

如圖2所示，處理裝置U3包含曝光裝置(處理機構)EX、搬送裝置9、以及溫度調節裝置60。曝光裝置EX，係以搬送裝置9供應基板P(片材、薄膜等)。曝光裝置EX係所謂的掃描曝光裝置，一邊同步驅動圓筒光罩DM之旋轉與可撓性基板P之搬送、一邊將形成在圓筒光罩DM之圖案之像透過投影倍率為等倍(×1)之投影光學系PL(PL1~PL6)，投影至基板P。又，圖2所示之曝光裝置EX，係將XYZ正交座標系之Y軸設為與第1滾筒(drum)構件21之旋轉中心線AX1平行。同樣的，曝光裝置EX，係將XYZ正交座標系之Y軸設定為與為旋轉筒之第2滾筒構件22之旋轉中心線AX2平行。 As shown in FIG. 2, the processing device U3 includes an exposure device (processing mechanism) EX, a transport device 9, and a temperature adjustment device 60. The exposure apparatus EX supplies the substrate P (sheet, film, etc.) with the conveying apparatus 9. The exposure device EX is a so-called scanning exposure device that simultaneously drives the rotation of the cylindrical mask DM and the conveyance of the flexible substrate P while transmitting the image of the pattern formed on the cylindrical mask DM through the projection magnification (× 1) The projection optics PL (PL1~PL6) project onto the substrate P. In addition, the exposure apparatus EX shown in FIG. 2 sets the Y axis of the XYZ orthogonal coordinate system parallel to the rotation center line AX1 of the first drum member 21. Similarly, the exposure device EX sets the Y axis of the XYZ orthogonal coordinate system to be parallel to the rotation center line AX2 of the second roller member 22 which is a rotating cylinder.

如圖2所示，曝光裝置EX，具備光罩保持裝置12、照明機構IU、投影光學系PL及控制裝置14。曝光裝置EX，使被保持於光罩保持裝置12之圓筒光罩DM旋轉移動，並以搬送裝置9搬送基板P。照明機構IU，將被保持於光罩保持裝置12之圓筒光罩DM之一部分(照明區域IR)，由照明光束EL1以均勻之亮度加以照明。投影光學系PL，將在圓筒光罩DM上之照明區域IR之圖案之像，投影至以搬送裝置9搬送之基板P之一部分(投影區域PA)。隨著圓筒光罩DM之移動，配置在照明區域IR之圓筒光罩DM上之部位變化，另隨著基板P之移動，配置在投影區域PA之基板P上之部位變化。據此，圓筒光罩DM上之既定圖案(光罩圖案)之像即被投影至基板P。控制裝置14控制曝光裝置EX之各部，使各部實施處理。又，本實施形態中，控制裝置14控制搬送裝置9。 As shown in FIG. 2, the exposure device EX includes a mask holding device 12, an illumination mechanism IU, a projection optical system PL, and a control device 14. The exposure device EX rotates and moves the cylindrical mask DM held by the mask holding device 12 and transfers the substrate P by the transfer device 9. The illumination mechanism IU will be held by a part of the cylindrical mask DM (illumination area IR) of the mask holding device 12 and illuminated by the illumination beam EL1 with uniform brightness. The projection optical system PL projects the image of the pattern of the illumination area IR on the cylindrical mask DM onto a part of the substrate P (projection area PA) transported by the transport device 9. As the cylindrical mask DM moves, the portion disposed on the cylindrical mask DM of the illumination area IR changes, and as the substrate P moves, the portion disposed on the substrate P of the projection area PA changes. Accordingly, the image of the predetermined pattern (mask pattern) on the cylindrical mask DM is projected onto the substrate P. The control device 14 controls each part of the exposure device EX and causes each part to perform processing. In this embodiment, the control device 14 controls the transport device 9.

又，控制裝置14可以是統籌控制上述元件製造系統1之複數個處理裝置之上位控制裝置5的一部分或全部。此外，控制裝置14亦可 以是受上位控制裝置5控制、與上位控制裝置5為不同之另一裝置。控制裝置14，例如包含電腦系統。電腦系統，例如包含CPU及各種記憶體即OS、周邊機器等之硬體。處理裝置U3之各部之動作過程，可以是以程式形式儲存在電腦可讀取之記錄媒體之記憶部，藉由電腦系統讀出並實施此程式，據以進行各種處理。電腦系統，在可連接於網際網路或內部網路系統之情形時，亦包含首頁提供環境(或顯示環境)。又，電腦可讀取之記錄媒體，包含軟碟、光磁碟、ROM、CD-ROM等之可搬媒體、內建於電腦系統之硬碟等之記憶裝置。電腦可讀取之記錄媒體，亦包含在透過網際網路等網路及電話線路等通訊線路送出程式之情形時之通訊線般，能短時間、動態方式保持程式者，以及如此時之伺服器及客戶端之電腦系統內部之揮發性記憶體般，可一定時間保持程式者。再者，程式可以是用以實現處理裝置U3之部分功能者，亦可以是與已儲存在電腦系統中之程式組合來實現處理裝置U3之功能者。上位控制裝置5，與控制裝置14同樣的，可利用電腦系統來加以實現。 In addition, the control device 14 may be a part or all of the upper control device 5 that collectively controls the plurality of processing devices of the component manufacturing system 1 described above. In addition, the control device 14 may be another device controlled by the upper control device 5 and different from the upper control device 5. The control device 14 includes, for example, a computer system. The computer system includes, for example, hardware such as a CPU and various memories, that is, an OS and peripheral devices. The operation process of each part of the processing device U3 may be stored in the memory part of the computer-readable recording medium in the form of a program, and the program is read out and implemented by the computer system to perform various processes accordingly. The computer system, when it can be connected to the Internet or intranet system, also includes the homepage providing environment (or display environment). In addition, computer-readable recording media include removable media such as floppy disks, optical disks, ROMs, CD-ROMs, and memory devices such as hard disks built into computer systems. The computer-readable recording media also includes the communication line when the program is sent out through the Internet and other networks and telephone lines and other communication lines. It can maintain the program in a short time and dynamically, and the server at this time. And the internal volatile memory of the client computer system, which can keep the program for a certain time. Furthermore, the program may be used to realize part of the functions of the processing device U3, or may be combined with a program already stored in the computer system to realize the functions of the processing device U3. The higher-level control device 5 is the same as the control device 14 and can be realized by a computer system.

如圖2所示，光罩保持裝置12，具備保持圓筒光罩DM之第1滾筒構件21、支承第1滾筒構件21之導輥23、根據控制裝置14之控制指令由第1驅動部26驅動第1滾筒構件21之驅動輥24、以及檢測第1滾筒構件21之位置之第1檢測器25。 As shown in FIG. 2, the mask holding device 12 includes a first roller member 21 that holds the cylindrical mask DM, a guide roller 23 that supports the first roller member 21, and a first drive unit 26 based on a control command from the control device 14 The driving roller 24 that drives the first roller member 21 and the first detector 25 that detects the position of the first roller member 21.

第1滾筒構件21，係具有從作為既定軸之旋轉中心線AX1(以下，亦稱第1中心軸AX1)以一定半徑彎曲之曲面的圓筒構件，繞既定軸旋轉。第1滾筒構件21，形成圓筒光罩DM上之照明區域IR配置之第1面P1。本實施形態中，第1面P1，包含將線分(母線)繞與此線分平行之軸 (第1中心軸AX1)旋轉之面(以下，稱圓筒面)。圓筒面，例如係圓筒之外周面、圓柱之外周面等。第1滾筒構件21係以例如玻璃或石英等構成，為具又一定厚度之圓筒狀，其外周面(圓筒面)形成為第1面P1。亦即，本實施形態中，圓筒光罩DM上之照明區域IR係彎曲成從從旋轉中心線AX1具一定半徑r1之圓筒面狀。如此，第1滾筒構件21具有從既定軸旋轉中心線AX1以一定半徑彎曲之曲面。第1滾筒構件21可被驅動輥24驅動，而繞既定軸旋轉中心線AX1旋轉。 The first roller member 21 is a cylindrical member having a curved surface curved at a constant radius from a rotation center line AX1 (hereinafter also referred to as a first center axis AX1) as a predetermined axis, and rotates around the predetermined axis. The first roller member 21 forms a first surface P1 where the illumination region IR is arranged on the cylindrical mask DM. In the present embodiment, the first surface P1 includes a surface (hereinafter, referred to as a cylindrical surface) that rotates a line segment (generator line) about an axis parallel to the line segment (first center axis AX1). The cylindrical surface is, for example, a cylindrical outer peripheral surface, a cylindrical outer peripheral surface, or the like. The first roller member 21 is made of, for example, glass or quartz, has a cylindrical shape with a constant thickness, and its outer peripheral surface (cylindrical surface) is formed as a first surface P1. That is, in this embodiment, the illumination region IR on the cylindrical mask DM is curved into a cylindrical surface shape having a constant radius r1 from the rotation center line AX1. In this way, the first roller member 21 has a curved surface curved at a constant radius from the predetermined axis rotation center line AX1. The first roller member 21 can be driven by the driving roller 24 to rotate around a predetermined axis rotation center line AX1.

圓筒光罩DM，係被作成例如於平坦性佳之短條狀極薄玻璃板(例如厚度100μm~500μm)之一面以鉻等遮光層形成有圖案之穿透型的平面狀片型光罩。光罩保持裝置12，使圓筒光罩DM依第1滾筒構件21外周面之曲面彎曲，在捲繞(貼於)於此曲面之狀態下使用。圓筒光罩DM，具有未形成圖案之圖案非形成區域，於圖案非形成區域被安裝於第1滾筒構件21。圓筒光罩DM可相對第1滾筒構件21被釋放。 The cylindrical mask DM is, for example, a transparent sheet-like mask formed by patterning a light-shielding layer such as chromium on one surface of a short strip-shaped extremely thin glass plate with a good flatness (for example, a thickness of 100 μm to 500 μm). The mask holding device 12 bends the cylindrical mask DM according to the curved surface of the outer peripheral surface of the first roller member 21, and is used in a state of being wound (attached) to this curved surface. The cylindrical mask DM has a non-patterned non-patterned region, and is attached to the first roller member 21 in the non-patterned region. The cylindrical mask DM can be released from the first roller member 21.

又，亦可取代以極薄玻璃板構成圓筒光罩DM，將該圓筒光罩DM捲繞於由透明圓筒母材構成之第1滾筒構件21，而在透明圓筒母材構成之第1滾筒構件21之外周面直接描繪形成以鉻等之遮光層形成之光罩圖案，來加以一體化。此場合，第1滾筒構件21即作為圓筒光罩DM之圖案之支承構件。 Moreover, instead of forming the cylindrical mask DM with an extremely thin glass plate, the cylindrical mask DM may be wound around the first roller member 21 made of a transparent cylindrical base material, and the transparent mask The outer surface of the first roller member 21 is directly formed by forming a photomask pattern formed with a light-shielding layer such as chromium and integrated. In this case, the first roller member 21 serves as a support member for the pattern of the cylindrical mask DM.

第1檢測器25係以光學方式檢測第1滾筒構件21之旋轉位置之物，例如以旋轉編碼器等構成。第1檢測器25，將所檢測之顯示第1滾筒構件21之旋轉位置的資訊，例如，將後述來自編碼器讀頭之2相訊號等輸出至控制裝置14。包含電動馬達等致動器之第1驅動部26，依據從控 制裝置14輸入之控制訊號，調整用以使驅動輥24旋轉之扭矩及旋轉速度。控制裝置14根據第1檢測器25之檢測結果控制第1驅動部26，據以控制第1滾筒構件21之旋轉位置。控制裝置14，控制第1滾筒構件21所保持之圓筒光罩DM之旋轉位置與旋轉速度之一方或双方。 The first detector 25 optically detects the rotation position of the first roller member 21, and is composed of, for example, a rotary encoder. The first detector 25 outputs the detected information indicating the rotation position of the first roller member 21, for example, outputs a two-phase signal from the encoder read head to be described later to the control device 14. The first drive unit 26, which includes an actuator such as an electric motor, adjusts the torque and rotation speed for rotating the drive roller 24 based on the control signal input from the control device 14. The control device 14 controls the first drive unit 26 based on the detection result of the first detector 25 and accordingly controls the rotational position of the first roller member 21. The control device 14 controls one or both of the rotation position and the rotation speed of the cylindrical mask DM held by the first roller member 21.

第2滾筒構件22，係具有從作為既定軸之旋轉中心線AX2(以下，亦稱第2中心軸AX2)以一定半徑彎曲之曲面(第1曲面)的圓筒構件，為繞既定軸旋轉之旋轉筒。第2滾筒構件22，形成將包含來自投影光學系PL之成像光束投射之基板P上之投影區域PA的一部分支承為圓弧狀(圓筒狀)之第2面(支承面)P2。又，第2滾筒構件22，係藉由從包含電動馬達等致動器之第2驅動部36供應之扭矩而旋轉之驅動輥DR5。 The second roller member 22 is a cylindrical member having a curved surface (first curved surface) curved at a constant radius from a rotation center line AX2 (hereinafter also referred to as a second central axis AX2) as a predetermined axis, and is a member rotating around a predetermined axis Rotate the cylinder. The second roller member 22 forms a second surface (support surface) P2 that supports a part of the projection area PA on the substrate P on which the imaging beam from the projection optical system PL is projected into an arc shape (cylindrical shape). In addition, the second roller member 22 is a driving roller DR5 that is rotated by the torque supplied from the second driving unit 36 including an actuator such as an electric motor.

如前所述，第2滾筒構件22係驅動輥DR5，並兼作為支承曝光(處理)對象基板P之基板支承構件(基板載台)。亦即，第2滾筒構件22可以是曝光裝置EX之一部分。第2滾筒構件22，並能繞第2滾筒構件22之旋轉中心線AX2(第2中心軸AX2)旋轉，基板P順著第2滾筒構件22上之外周面(圓筒面)彎曲成圓筒面狀，於彎曲部分之一部分配置投影區域PA。 As described above, the second roller member 22 is the driving roller DR5 and also serves as a substrate support member (substrate stage) that supports the substrate P to be exposed (processed). That is, the second roller member 22 may be a part of the exposure device EX. The second roller member 22 is rotatable around the rotation center line AX2 (second center axis AX2) of the second roller member 22, and the substrate P is bent into a cylinder along the outer peripheral surface (cylindrical surface) of the second roller member 22 Planar, the projection area PA is arranged in a part of the curved portion.

本實施形態中，到達投影區域PA之成像光束EL2中、通過投影區域PA之各中心點的主光線，如圖2所示，從第2滾筒構件22之第2中心軸AX2看，到達夾著中心面P3分別配置在於周方向角度θ之位置的第1特定位置PX1、第2特定位置PX2。而從旋轉中心線AX2看，位在第1特定位置PX1與第2特定位置PX2之間之特定位置PX，則為在第2滾筒構件22之曲面之基板P被平均曝光之區域的中心。 In the present embodiment, the chief ray passing through each center point of the projection area PA in the imaging light beam EL2 that reaches the projection area PA, as shown in FIG. 2, is seen from the second central axis AX2 of the second roller member 22 and reaches the pinch The center plane P3 is arranged at the first specific position PX1 and the second specific position PX2 at the position of the circumferential angle θ, respectively. As seen from the rotation center line AX2, the specific position PX between the first specific position PX1 and the second specific position PX2 is the center of the area where the substrate P on the curved surface of the second roller member 22 is averagely exposed.

搬送裝置9，具備驅動輥DR4、第2滾筒構件22(驅動輥 DR5)、及驅動輥DR6。搬送裝置9，以基板P通過第1特定位置PX1、特定位置PX及第2特定位置PX2之方式，於搬送基板P之搬送方向移動基板P。第2驅動部36依據從控制裝置14輸出之控制訊號，調整使第2滾筒構件22旋轉之扭矩。 The conveying device 9 includes a driving roller DR4, a second roller member 22 (driving roller DR5), and a driving roller DR6. The transport device 9 moves the substrate P in the transport direction of the transport substrate P so that the substrate P passes through the first specific position PX1, the specific position PX, and the second specific position PX2. The second driving unit 36 adjusts the torque for rotating the second roller member 22 according to the control signal output from the control device 14.

本實施形態中，從搬送路徑之上游往驅動輥DR4搬送之基板P，經由驅動輥DR4搬送往溫度調節裝置60。溫度調節裝置60依據從控制裝置14輸出之控制訊號，調節往第2滾筒構件22供應前之基板P之溫度。經由溫度調節裝置60、溫度被調節之基板P，被引導至第1導件31、第2導件32，往第2滾筒構件22搬送。基板P被第2滾筒構件22之表面支承，被搬送往第3導件33。經由第3導件33之基板P，被搬送往搬送路徑之下游。又，第2滾筒構件22(驅動輥DR5)之旋轉中心線AX2與驅動輥DR4、DR6之各旋轉中心線，皆設定為與Y軸平行。 In the present embodiment, the substrate P transferred from the upstream of the transfer path to the driving roller DR4 is transferred to the temperature adjusting device 60 via the driving roller DR4. The temperature adjusting device 60 adjusts the temperature of the substrate P before supplying the second roller member 22 according to the control signal output from the control device 14. The substrate P whose temperature is adjusted via the temperature adjustment device 60 is guided to the first guide 31 and the second guide 32 and is transported to the second roller member 22. The substrate P is supported by the surface of the second roller member 22 and is transported to the third guide 33. The substrate P passing through the third guide 33 is transported downstream of the transport path. In addition, the rotation center line AX2 of the second roller member 22 (driving roller DR5) and each rotation center line of the driving rollers DR4 and DR6 are set parallel to the Y axis.

於第2滾筒構件22之周圍配置有限制搬送基板P之搬送方向、且引導基板P之第1導件31、第2導件32及第3導件33。第2滾筒構件22，捲繞基板P之一部分，支承從基板P開始接觸第2面P2之曲面之搬送方向進入位置IA起至基板P開始脫離第2面P2之曲面之搬送方向離脫位置OA為止的基板P。第2導件32及第3導件33，例如，藉由往基板P之搬送方向移動，以調整於搬送路徑中作用於基板P之張力等。又，第2導件32及第3導件33，例如，可藉由移動於基板P之搬送方向，以調整捲繞於第2滾筒構件22外周之上述進入位置IA及離脫位置OA等。此外，搬送裝置9、第1導件31、第2導件32及第3導件33，只要能沿投影光學系PL之投影區域PA搬送基板P即可，搬送裝置9、第1導件31、第2導件 32及第3導件33之構成可適當的加以變更。 Around the second roller member 22, a first guide 31, a second guide 32, and a third guide 33 that restrict the transport direction of the transport substrate P and guide the substrate P are arranged. The second roller member 22 winds a portion of the substrate P, and supports the transfer direction detachment position OA from the transfer direction of the curved surface of the substrate P contacting the curved surface of the second surface P2 into the position IA to the transfer direction of the curved surface of the curved surface of the second surface P2 Up to the substrate P. For example, the second guide 32 and the third guide 33 are moved in the conveyance direction of the substrate P to adjust the tension acting on the substrate P in the conveyance path. In addition, the second guide 32 and the third guide 33 can be adjusted, for example, by moving in the conveyance direction of the substrate P to adjust the aforementioned entry position IA and detachment position OA wound around the outer periphery of the second roller member 22. In addition, the transport device 9, the first guide 31, the second guide 32, and the third guide 33 need only be able to transport the substrate P along the projection area PA of the projection optical system PL. The transport device 9, the first guide 31 The structure of the second guide 32 and the third guide 33 can be changed as appropriate.

第2檢測器35，例如係以旋轉編碼器等構成，以光學方式檢測第2滾筒構件22之旋轉位置。第2檢測器35，將所檢測之顯示第2滾筒構件22之旋轉位置的資訊(例如，後述來自編碼器讀頭EN1、EN2、EN3、EN4、EN5之2相訊號等)輸出至控制裝置14。控制裝置14根據第2檢測器35之檢測結果控制第2驅動部36，以控制第2滾筒構件22之旋轉位置，來使第1滾筒構件21(圓筒光罩DM)與第2滾筒構件22同步移動(同步旋轉)。又，關於第2檢測器35之詳細構成，留待後敘。 The second detector 35 is configured by, for example, a rotary encoder or the like, and optically detects the rotational position of the second roller member 22. The second detector 35 outputs the detected information indicating the rotation position of the second roller member 22 (for example, a 2-phase signal from the encoder read heads EN1, EN2, EN3, EN4, EN5, etc., described later) to the control device 14 . The control device 14 controls the second driving unit 36 based on the detection result of the second detector 35 to control the rotational position of the second roller member 22 to make the first roller member 21 (cylindrical mask DM) and the second roller member 22 Synchronous movement (synchronous rotation). The detailed configuration of the second detector 35 will be described later.

本實施形態之曝光裝置EX，係設定為所謂之搭載多透鏡方式之投影光學系PL的曝光裝置。投影光學系PL具備投影圓筒光罩DM之圖案中之部分像的複數個投影模組。例如，圖2中，於中心面P3左側於Y方向以一定間隔配置有3個投影模組(投影光學系)PL1、PL3、PL5，於中心面P3右側亦於Y方向以一定間隔配置有3個投影模組(投影光學系)PL2、PL4、PL6。 The exposure apparatus EX of the present embodiment is set as a so-called exposure apparatus equipped with a multi-lens projection optical system PL. The projection optical system PL includes a plurality of projection modules that project partial images in the pattern of the cylindrical mask DM. For example, in FIG. 2, three projection modules (projection optical systems) PL1, PL3, and PL5 are arranged at a certain interval in the Y direction on the left side of the center plane P3, and 3 are arranged at a certain interval in the Y direction on the right side of the center plane P3. A projection module (projection optics) PL2, PL4, PL6.

此種多透鏡方式之曝光裝置EX，係將以複數個投影模組PL1~PL6曝光之區域(投影區域PA1~PA6)之Y方向端部藉掃描加以彼此重疊，據以投影所欲圖案之全體像。此種曝光裝置EX，即使是在圓筒光罩DM上圖案之Y方向尺寸大、而必然係處理Y方向寬度大的基板P之情形時，僅需於Y方向増設投影模組PL、與對應投影模組PL之照明機構IU側模組即可，因此具有可輕易因應面板尺寸(基板P寬度)大型化的優點。 This multi-lens exposure device EX is to overlap the Y-direction ends of the areas (projection areas PA1 to PA6) exposed by a plurality of projection modules PL1 to PL6 by scanning to overlap each other, thereby projecting the entire desired pattern Like. In such an exposure apparatus EX, even if the pattern on the cylindrical mask DM has a large dimension in the Y direction and it is necessary to process the substrate P with a large width in the Y direction, it is only necessary to provide the projection module PL in the Y direction and the corresponding The IU side module of the illumination mechanism of the projection module PL may be sufficient. Therefore, it has the advantage of easily adapting to the enlargement of the panel size (substrate P width).

又，曝光裝置EX可以不是多透鏡方式的。例如，在基板P之寬度方向尺寸某種程度較小之情形等時，曝光裝置EX可以是以1個投影 模組將圖案全寬之像投影至基板P。又，複數個投影模組PL1~PL6，可分別是投影對應1個元件之圖案。亦即，曝光裝置EX可將複數個元件用之圖案，以複數個投影模組同時進行投影。 In addition, the exposure device EX may not be a multi-lens system. For example, in the case where the width direction dimension of the substrate P is somewhat small, the exposure device EX may project a full-width image of the pattern onto the substrate P with one projection module. Moreover, the plurality of projection modules PL1~PL6 can respectively project the pattern corresponding to one element. That is, the exposure device EX can simultaneously project a pattern for a plurality of elements with a plurality of projection modules.

本實施形態之照明機構IU，具備光源裝置13及照明光學系。照明光學系，具備對應複數個投影模組PL1~PL6之各個而於Y軸方向排列之複數個(例如6個)照明模組IL。光源裝置13，包含例如水銀燈等之燈光源、或雷射二極體、發光二極體(LED)等之固態光源。光源裝置13射出之照明光，例如係從燈光源射出之輝線(g線、h線、i線)、KrF準分子雷射光(波長248nm)等之遠紫外光(DUV光)、ArF準分子雷射光(波長193nm)等。從光源裝置13射出之照明光，其照度分布被均勻化後，透過例如光纖等之導光構件，被分至複數個照明模組IL。 The lighting mechanism IU of this embodiment includes a light source device 13 and an illumination optical system. The illumination optical system includes a plurality of (for example, 6) illumination modules IL arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1 to PL6. The light source device 13 includes a lamp light source such as a mercury lamp or a solid-state light source such as a laser diode and a light-emitting diode (LED). The illumination light emitted by the light source device 13 is, for example, far-ultraviolet light (DUV light) such as glow lines (g-line, h-line, i-line), KrF excimer laser light (wavelength 248 nm) emitted from the lamp light source, and ArF excimer laser Beam (wavelength 193nm) and so on. The illumination light emitted from the light source device 13 is uniformized in illuminance distribution, and then is divided into a plurality of illumination modules IL through a light guide member such as an optical fiber.

複數個照明模組IL之各個，包含透鏡等之複數個光學構件。本實施形中，將從光源裝置13射出而通過複數個照明模組IL中任一者之光稱為照明光束EL1。複數個照明模組IL之各個，包含例如積分光學系、棒狀透鏡、複眼透鏡等，以均勻照度分布之照明光束EL1照明照明區域IR。本實施形態中，複數個照明模組IL配置在圓筒光罩DM之內側。複數個照明模組IL之各個，從圓筒光罩DM之內側照明形成在圓筒光罩DM外周面之光罩圖案之各照明區域IR。 Each of the plurality of illumination modules IL includes a plurality of optical components such as lenses. In this embodiment, the light emitted from the light source device 13 and passing through any one of the plurality of illumination modules IL is referred to as an illumination light beam EL1. Each of the plurality of illumination modules IL includes, for example, an integrating optical system, a rod lens, a compound eye lens, etc., and illuminates the illumination area IR with an illumination light beam EL1 having a uniform illuminance distribution. In this embodiment, a plurality of illumination modules IL are arranged inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates each illumination region IR of the mask pattern formed on the outer peripheral surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

圖3係顯示本實施形態之照明區域IR及投影區域PA之配置的圖。又，圖3中，顯示了-Z側所視之配置在第1滾筒構件21之圓筒光罩DM上之照明區域IR的俯視圖(圖3中左側之圖)、與從+Z側所視之配置在第2滾筒構件22之基板P上之投影區域PA的俯視圖(圖3中右側之 圖)。圖3中之符號Xs，係顯示第1滾筒構件21或第2滾筒構件22之旋轉方向(移動方向)。 FIG. 3 is a diagram showing the arrangement of the illumination area IR and the projection area PA in this embodiment. In addition, FIG. 3 shows a plan view of the illumination region IR arranged on the cylindrical mask DM of the first roller member 21 viewed from the -Z side (the figure on the left in FIG. 3 ), and the view from the +Z side A plan view of the projection area PA disposed on the substrate P of the second roller member 22 (the figure on the right in FIG. 3). The symbol Xs in FIG. 3 indicates the rotation direction (moving direction) of the first roller member 21 or the second roller member 22.

複數個照明模組IL，分別照明圓筒光罩DM上之第1至第6照明區域IR1~IR6。例如，第1照明模組IL係照明第1照明區域IR1、第2照明模組IL則照明第2照明區域IR2。 A plurality of illumination modules IL respectively illuminate the first to sixth illumination regions IR1 to IR6 on the cylindrical mask DM. For example, the first lighting module IL illuminates the first lighting area IR1 and the second lighting module IL illuminates the second lighting area IR2.

第1照明區域IR1雖係於Y方向細長之梯形區域加以說明，但如投影光學系(投影模組)PL般係形成中間像面之構成之投影光學系時，由於可在該中間像之位置配置具有梯形開口之視野光闌板，因此亦可以是包含該梯形開口之長方形區域。第3照明區域IR3及第5照明區域IR5分別是與第1照明區域IR1相同形狀之區域，於Y軸方向相隔一定間隔配置。又，第2照明區域IR2係就中心面P3與第1照明區域IR1為對稱之梯形(或長方形)區域。第4照明區域IR4及第6照明區域IR6分別係與第2照明區域IR2相同形狀之區域，於Y軸方向相隔一定間隔配置。 Although the first illumination area IR1 is described as a slender trapezoidal area in the Y direction, when a projection optical system that forms an intermediate image plane like a projection optical system (projection module) PL, it can be located at the position of the intermediate image The field stop plate having a trapezoidal opening is arranged, so it may also be a rectangular area containing the trapezoidal opening. The third illumination region IR3 and the fifth illumination region IR5 are respectively regions of the same shape as the first illumination region IR1, and are arranged at regular intervals in the Y-axis direction. The second illumination region IR2 is a symmetrical trapezoidal (or rectangular) region with respect to the center plane P3 and the first illumination region IR1. The fourth illumination region IR4 and the sixth illumination region IR6 are respectively regions of the same shape as the second illumination region IR2, and are arranged at regular intervals in the Y-axis direction.

如圖3所示，第1至第6照明區域IR1~IR6之各個，在沿第1面P1之周方向看時，係配置成相鄰梯形照明區域之斜邊部之三角部重疊(overlap)。因此，例如，藉第1滾筒構件21之旋轉而通過第1照明區域IR1之圓筒光罩DM上的第1區域A1，與藉第1滾筒構件21之旋轉而通過第2照明區域IR2之圓筒光罩DM上的第2區域A2部分重疊。 As shown in FIG. 3, when the first to sixth illumination regions IR1 to IR6 are viewed along the circumferential direction of the first surface P1, the triangles of the oblique sides of the adjacent trapezoidal illumination regions overlap. . Therefore, for example, the first area A1 on the cylindrical mask DM passing through the first illumination area IR1 by the rotation of the first roller member 21 and the circle passing the second illumination area IR2 by the rotation of the first roller member 21 The second area A2 on the cylindrical mask DM partially overlaps.

本實施形態中，圓筒光罩DM包含形成有圖案之圖案形成區域A3、與沒有形成圖案之圖案非形成區域A4。該圖案非形成區域A4係配置成以框狀圍繞圖案形成區域A3，具有遮蔽照明光束EL1之特性。圓筒光罩DM之圖案形成區域A3隨著第1滾筒構件21之旋轉而移動於移動方向 Xs，圖案形成區域A3中之Y軸方向之各部分區域，通過第1至第6照明區域IR1~IR6中之一個。換言之，第1至第6照明區域IR1~IR6係配置成能覆蓋圖案形成區域A3之Y軸方向全寬。 In the present embodiment, the cylindrical mask DM includes a pattern-formed area A3 in which a pattern is formed, and a pattern non-formation area A4 in which a pattern is not formed. The pattern non-formation area A4 is configured to surround the pattern formation area A3 in a frame shape, and has a characteristic of blocking the illumination light beam EL1. The pattern forming area A3 of the cylindrical mask DM moves in the moving direction Xs with the rotation of the first roller member 21, and each partial area in the Y axis direction in the pattern forming area A3 passes through the first to sixth illumination areas IR1~ One of IR6. In other words, the first to sixth illumination regions IR1 to IR6 are arranged so as to cover the entire width in the Y-axis direction of the pattern formation region A3.

如圖2所示，排列於Y軸方向之複數個投影模組PL1~PL6之各個，與第1至第6照明模組IL之各個1對1對應，將被對應之照明模組照明之照明區域IR內出現之圓筒光罩DM之部分圖案之像，投影至基板P上之各投影區域PA。 As shown in FIG. 2, each of the plurality of projection modules PL1 to PL6 arranged in the Y-axis direction corresponds one-to-one to each of the first to sixth illumination modules IL, and the illumination to be illuminated by the corresponding illumination module The image of the partial pattern of the cylindrical mask DM appearing in the region IR is projected onto each projection area PA on the substrate P.

例如，第1投影模組PL1與第1照明模組IL對應，將被第1照明模組IL照明之第1照明區域IR1(參照圖3)中之圓筒光罩DM之圖案之像，投影至基板P上之第1投影區域PA1。第3投影模組PL3、第5投影模組PL5，分別與第3、第5照明模組IL對應。第3投影模組PL3及第5投影模組PL5，從Y軸方向看，配置在與第1投影模組PL1重疊之位置。 For example, the first projection module PL1 corresponds to the first illumination module IL, and the image of the pattern of the cylindrical mask DM in the first illumination region IR1 (refer to FIG. 3) illuminated by the first illumination module IL is projected To the first projection area PA1 on the substrate P. The third projection module PL3 and the fifth projection module PL5 correspond to the third and fifth lighting modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are arranged at positions overlapping with the first projection module PL1 as viewed from the Y-axis direction.

又，第2投影模組PL2與第2照明模組IL對應，將被第2照明模組IL照明之第2照明區域IR2(參照圖3)中之圓筒光罩DM之圖案之像，投影至基板P上之第2投影區域PA2。第2投影模組PL2，從Y軸方向看，配置在相對第1投影模組PL1夾著中心面P3對稱之位置。 Moreover, the second projection module PL2 corresponds to the second illumination module IL, and projects the image of the pattern of the cylindrical mask DM in the second illumination region IR2 (refer to FIG. 3) illuminated by the second illumination module IL, To the second projection area PA2 on the substrate P. The second projection module PL2 is arranged at a position symmetrical with respect to the first projection module PL1 across the center plane P3 as viewed from the Y-axis direction.

第4投影模組PL4、第6投影模組PL6，分別與第4、第6照明模組IL對應配置，第4投影模組PL4及第6投影模組PL6，從Y軸方向看，配置在與第2投影模組PL2重疊之位置。 The fourth projection module PL4 and the sixth projection module PL6 are respectively arranged corresponding to the fourth and sixth illumination modules IL, and the fourth projection module PL4 and the sixth projection module PL6, viewed from the Y-axis direction, are arranged at The position overlapping with the second projection module PL2.

又，本實施形態中，係設從照明機構IU之各照明模組IL到達圓筒光罩DM上之照明區域IR1~IR6之光為照明光束EL1。又，將受到對應各照明區域IR1~IR6中出現之圓筒光罩DM之部分圖案之強度分布調 變後射入各投影模組PL1~PL6而到達各投影區域PA1~PA6之光，設為成像光束EL2。而到達各投影區域PA1~PA6之成像光束EL2中、通過投影區域PA1~PA6之各中心點之主光線，如圖2所示，從第2滾筒構件22之第2中心軸AX2看，分別配置在夾著中心面P3於周方角度θ之位置(特定位置)。 Moreover, in this embodiment, the light that reaches the illumination regions IR1 to IR6 on the cylindrical mask DM from the illumination modules IL of the illumination mechanism IU is the illumination light beam EL1. In addition, the intensity distribution of a part of the pattern corresponding to the cylindrical mask DM appearing in each illumination area IR1~IR6 is modulated and then enters each projection module PL1~PL6 to reach each projection area PA1~PA6. Imaging beam EL2. The chief rays passing through the center points of the projection areas PA1 to PA6 in the imaging light beam EL2 reaching the projection areas PA1 to PA6 are respectively arranged from the second center axis AX2 of the second roller member 22 as shown in FIG. 2 At a position (specific position) sandwiching the center plane P3 at a circumferential angle θ.

如圖3所示，在第1照明區域IR1之圖案之像被投影於第1投影區域PA1、在第3照明區域IR3之圖案之像被投影於第3投影區域PA3、在第5照明區域IR5之圖案之像被投影於第5投影區域PA5。本實施形態中，第1投影區域PA1、第3投影區域PA3及第5投影區域PA5係於Y軸方向排列配置成一行。 As shown in FIG. 3, the image of the pattern in the first illumination area IR1 is projected in the first projection area PA1, the image of the pattern in the third illumination area IR3 is projected in the third projection area PA3, and in the fifth illumination area IR5 The image of the pattern is projected on the fifth projection area PA5. In this embodiment, the first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged in a line in the Y-axis direction.

又，在第2照明區域IR2之圖案之像被投影於第2投影區域PA2。本實施形態中，第2投影區域PA2，從Y軸方向看，就中心面P3與第1投影區域PA1對稱配置。又，在第4照明區域IR4之圖案之像被投影於第4投影區域PA4、在第6照明區域IR6之圖案之像被投影於第6投影區域PA6。本實施形態中、第2投影區域PA2、第4投影區域PA4及第6投影區域PA6係於Y軸方向排列配置成一行。 In addition, the image of the pattern in the second illumination area IR2 is projected on the second projection area PA2. In the present embodiment, the second projection area PA2 is arranged symmetrically with the first projection area PA1 with respect to the center plane P3 as viewed from the Y-axis direction. The image of the pattern in the fourth illumination area IR4 is projected on the fourth projection area PA4, and the image of the pattern in the sixth illumination area IR6 is projected on the sixth projection area PA6. In this embodiment, the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged in a row in the Y-axis direction.

第1至第6投影區域PA1~PA6之各個，在沿第2面P2之周方向觀察時，係配置成在與第2中心軸AX2平行之方向相鄰投影區域(奇數個與偶數個)彼此之端部(梯形之三角部分)重疊。因此，例如，藉第2滾筒構件22之旋轉而通過第1投影區域PA1之基板P上之第3區域A5，與藉第2滾筒構件22之旋轉而通過第2投影區域PA2之基板P上之第4區域A6部分重疊。第1投影區域PA1與第2投影區域PA2，其各個之形狀等被 設定成在第3區域A5與第4區域A6重疊之區域之曝光量，與在不重疊區域之曝光量實質相同。而第1~第6投影區域PA1~PA6，被配置成可覆蓋曝光至基板P上之曝光區域A7之Y方向全寬。 The first to sixth projection areas PA1 to PA6 are arranged so that the projection areas (odd and even) adjacent to each other in the direction parallel to the second central axis AX2 when viewed in the circumferential direction of the second surface P2 The ends (triangular part of the trapezoid) overlap. Therefore, for example, the third area A5 on the substrate P passing through the first projection area PA1 by the rotation of the second roller member 22 and the substrate P passing through the second projection area PA2 by the rotation of the second roller member 22 The fourth area A6 partially overlaps. The shapes of the first projection area PA1 and the second projection area PA2 are set so that the exposure amount in the area where the third area A5 and the fourth area A6 overlap is substantially the same as the exposure amount in the non-overlap area. The first to sixth projection areas PA1 to PA6 are arranged so as to cover the full width in the Y direction of the exposure area A7 exposed to the substrate P.

其次，參照圖4說明本實施形態之投影光學系PL之詳細構成。又，本實施形態中，第2投影模組PL2~第5投影模組PL5之各個，與第1投影模組PL1同樣構成。因此，以第1投影模組PL1代表投影光學系PL說明其構成，第2投影模組PL2~第5投影模組PL5各個之說明則省略。 Next, the detailed configuration of the projection optical system PL of this embodiment will be described with reference to FIG. 4. In this embodiment, each of the second projection module PL2 to the fifth projection module PL5 is configured in the same manner as the first projection module PL1. Therefore, the configuration of the first projection module PL1 representing the projection optical system PL will be described, and the description of each of the second projection module PL2 to the fifth projection module PL5 will be omitted.

圖4所示之第1投影模組PL1，具備將配置在第1照明區域IR1之圓筒光罩DM之圖案之像成像於中間像面P7的第1光學系41、將第1光學系41所形成之中間像之至少一部分再成像於基板P之第1投影區域PA1的第2光學系42、以及配置在形成中間像之中間像面P7的第1視野光闌43。 The first projection module PL1 shown in FIG. 4 includes a first optical system 41 for imaging the image of the pattern of the cylindrical mask DM disposed in the first illumination region IR1 on the intermediate image plane P7, and a first optical system 41 At least a part of the formed intermediate image is re-imaged on the second optical system 42 of the first projection area PA1 of the substrate P and the first field stop 43 disposed on the intermediate image plane P7 where the intermediate image is formed.

又，第1投影模組PL1，具備焦點修正光學構件44、像位移(shift)修正光學構件45、旋轉(rotation)修正機構46及倍率修正用光學構件47。焦點修正光學構件44，係對基板P上形成之光罩之圖案像(以下，稱投影像)之焦點狀態進行微調的焦點調整裝置。又，像位移修正光學構件45係使投影像在像面內微幅横位移的位移調整裝置。倍率修正用光學構件47係微修正投影像之倍率的倍率調整裝置。旋轉修正機構46則係使投影像在像面內微幅旋轉的位移調整裝置。 In addition, the first projection module PL1 includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47. The focus correction optical member 44 is a focus adjustment device that finely adjusts the focus state of the pattern image of the photomask formed on the substrate P (hereinafter, referred to as a projected image). In addition, the image displacement correction optical member 45 is a displacement adjustment device that slightly shifts the projected image laterally in the image plane. The magnification correction optical member 47 is a magnification adjustment device that finely corrects the magnification of the projected image. The rotation correction mechanism 46 is a displacement adjustment device that slightly rotates the projected image in the image plane.

來自圓筒光罩DM之圖案之成像光束EL2，從第1照明區域IR1往法線方向(D1)射出，通過焦點修正光學構件44射入像位移修正光學構件45。穿透像位移修正光學構件45之成像光束EL2於作為第1光學系41 之要件的第1偏向構件50之第1反射面(平面鏡)p4反射，通過第1透鏡群51被第1凹面鏡52反射，再次通過第1透鏡群51於第1偏向構件50之第2反射面(平面鏡)p5反射後，射入第1視野光闌43。通過第1視野光闌43之成像光束EL2，於作為第2光學系42之要件的第2偏向構件57之第3反射面(平面鏡)p8反射，通過第2透鏡群58被第2凹面鏡59反射，再次通過第2透鏡群58於第2偏向構件57之第4反射面(平面鏡)p9反射後，射入倍率修正用光學構件47。從倍率修正用光學構件47射出之成像光束EL2，射入基板P上之第1投影區域PA1，出現在第1照明區域IR1內之圖案之像被以等倍(×1)投影至第1投影區域PA1。 The imaging light beam EL2 of the pattern from the cylindrical mask DM is emitted from the first illumination region IR1 in the normal direction (D1), and enters the image displacement correction optical member 45 through the focus correction optical member 44. The imaging light beam EL2 passing through the image displacement correction optical member 45 is reflected on the first reflection surface (plane mirror) p4 of the first deflection member 50 which is a requirement of the first optical system 41, and is reflected by the first concave mirror 52 through the first lens group 51 After being reflected by the first lens group 51 again on the second reflection surface (planar mirror) p5 of the first deflection member 50, it enters the first field stop 43. The imaging light beam EL2 passing through the first field stop 43 is reflected on the third reflecting surface (plane mirror) p8 of the second deflection member 57 which is a requirement of the second optical system 42, and is reflected by the second concave mirror 59 through the second lens group 58 After being reflected by the second lens group 58 on the fourth reflection surface (plane mirror) p9 of the second deflection member 57, it enters the magnification correction optical member 47. The imaging light beam EL2 emitted from the magnification correction optical member 47 enters the first projection area PA1 on the substrate P, and the image of the pattern appearing in the first illumination area IR1 is projected to the first projection at an equal magnification (×1) Area PA1.

設圖2所示之圓筒光罩DM之半徑為半徑r1、捲繞在第2滾筒構件22之基板P之圓筒狀表面之半徑為半徑r2，當使半徑r1與半徑r2相等之情形時在各投影模組PL1~PL6之光罩側之成像光束EL2之主光線，雖被傾斜而通過圓筒光罩DM之旋轉中心線AX1，其傾角與在基板P側之成像光束EL2之主光線之傾角θ(相對中心面P3為±θ)相同

Figure 107139691-A0101-12-0022-18
。 Let the radius of the cylindrical mask DM shown in FIG. 2 be radius r1, the radius of the cylindrical surface of the substrate P wound around the second roller member 22 be radius r2, when the radius r1 and the radius r2 are equal The chief ray of the imaging beam EL2 on the reticle side of each projection module PL1~PL6, although tilted, passes through the rotation center line AX1 of the cylindrical mask DM. The inclination angle θ (±θ relative to the center plane P3) is the same
Figure 107139691-A0101-12-0022-18
.

第2偏向構件57之第3反射面p8與第2光軸AX4所夾之角度θ 3、與第1偏向構件50之第2反射面p5與第1光軸AX3所夾角度θ 2實質相同。又，第2偏向構件57之第4反射面p9與第2光軸AX4所夾角度θ 4、與第1偏向構件50之第1反射面p4與第1光軸AX3所夾角度θ 1實質相同。為賦予上述傾角θ，使圖4所示之第1偏向構件50之第1反射面p4相對第1光軸AX3之角度θ 1較45°小△θ 1，並使第2偏向構件57之第4反射面p9相對第2光軸AX4之角度θ 4較45°小△θ 4。△θ 1與△θ 4，相對圖2中所示之角度θ，係設定成△θ 1=△θ 4=θ/2之關係。 The angle θ3 between the third reflection surface p8 of the second deflection member 57 and the second optical axis AX4 is substantially the same as the angle θ2 between the second reflection surface p5 of the first deflection member 50 and the first optical axis AX3. The angle θ 4 between the fourth reflective surface p9 of the second deflection member 57 and the second optical axis AX4 and the angle θ 1 between the first reflective surface p4 of the first deflection member 50 and the first optical axis AX3 are substantially the same . In order to give the above inclination angle θ, the angle θ 1 of the first reflecting surface p4 of the first deflection member 50 shown in FIG. 4 with respect to the first optical axis AX3 is smaller than 45° by Δθ 1 and the second deflection member 57 4 The angle θ 4 of the reflecting surface p9 with respect to the second optical axis AX4 is smaller than 45° by Δθ 4. Δθ 1 and Δθ 4, relative to the angle θ shown in FIG. 2, are set to a relationship of Δθ 1=Δθ 4=θ/2.

圖5係適用於圖2之處理裝置(曝光裝置)之旋轉筒的立體圖。圖6係用以說明適用於圖2之處理裝置(曝光裝置)之檢測探針與讀取裝置間之關係的立體圖。圖7係從旋轉中心線AX2方向觀察第1實施形態之標尺圓盤SD，用以說明讀取裝置之位置的說明圖。又，圖5中，為方便起見，僅顯示第2至第4投影區域PA2~PA4之圖示，而省略了第1、第5、第6投影區域PA1、PA5、PA6之圖示。 FIG. 5 is a perspective view of a rotating drum suitable for the processing device (exposure device) of FIG. 2. FIG. 6 is a perspective view for explaining the relationship between the detection probe and the reading device applied to the processing device (exposure device) of FIG. 2. FIG. 7 is an explanatory diagram for explaining the position of the reading device when the scale disk SD of the first embodiment is viewed from the direction of the rotation center line AX2. In FIG. 5, for convenience, only the illustrations of the second to fourth projection areas PA2 to PA4 are displayed, and the illustrations of the first, fifth, and sixth projection areas PA1, PA5, and PA6 are omitted.

圖2所示之第2檢測器35係以光學方式檢測第2滾筒構件22之旋轉位置之物，包含高真圓度之標尺圓盤(標尺構件)SD與讀取裝置編碼器讀頭EN1、EN2、EN3、EN4、EN5。 The second detector 35 shown in FIG. 2 optically detects the rotation position of the second roller member 22, and includes a high-roundness scale disk (scale member) SD and a reading device encoder reading head EN1 EN2, EN3, EN4, EN5.

標尺圓盤SD固定在與第2滾筒構件22之旋轉軸ST正交之第2滾筒構件22之端部。因此，標尺圓盤SD繞旋轉中心線AX2與旋轉軸ST一體旋轉。於標尺圓盤SD之外周面刻有作為標尺部GP之例如刻度(格子)。標尺部GP係沿第2滾筒構件22旋轉之周方向排列成環狀，且與第2滾筒構件22一起於旋轉軸ST(第2中心軸AX2)周圍旋轉。編碼器讀頭EN1、EN2、EN3、EN4、EN5，從旋轉軸ST(第2中心軸AX2)看，配置在標尺部GP之周圍。編碼器讀頭EN1、EN2、EN3、EN4、EN5與標尺部GP對向配置，可以非接觸方式讀取標尺部GP。又，編碼器讀頭EN1、EN2、EN3、EN4、EN5係配置在第2滾筒構件22之周方向之不同位置。 The scale disc SD is fixed to the end of the second roller member 22 orthogonal to the rotation axis ST of the second roller member 22. Therefore, the scale disc SD rotates integrally with the rotation axis ST around the rotation center line AX2. A scale (grid) as a scale part GP is engraved on the outer peripheral surface of the scale disc SD. The scale part GP is arranged in a ring shape along the circumferential direction in which the second roller member 22 rotates, and rotates together with the second roller member 22 around the rotation axis ST (second center axis AX2). The encoder read heads EN1, EN2, EN3, EN4, and EN5 are arranged around the scale part GP as viewed from the rotation axis ST (second center axis AX2). The encoder read heads EN1, EN2, EN3, EN4, and EN5 are arranged opposite to the scale part GP, and the scale part GP can be read in a non-contact manner. In addition, the encoder heads EN1, EN2, EN3, EN4, and EN5 are arranged at different positions in the circumferential direction of the second roller member 22.

編碼器讀頭EN1、EN2、EN3、EN4、EN5係對標尺部GP之切線方向(XZ面內)變位之變動具有測量感度(檢測感度)的讀取裝置。如圖5所示，將編碼器讀頭EN1、EN2、EN3、EN4、EN5之設置方位(在以旋轉中心線AX2為中心之XZ面內的角度方向)以設置方位線Le1、Le2、Le3、Le4、 Le5表示時，如圖7所示，係以設置方位線Le1、Le2相對中心面P3成角度±θ°之方式，配置編碼器讀頭EN1、EN2。又，本實施形態中，例如角度θ係15°。 The encoder read heads EN1, EN2, EN3, EN4, and EN5 are reading devices that have measurement sensitivity (detection sensitivity) to the variation of the displacement of the scale part GP in the tangential direction (in the XZ plane). As shown in Figure 5, set the orientation of the encoder read heads EN1, EN2, EN3, EN4, EN5 (angle direction in the XZ plane centered on the rotation center line AX2) to set the orientation lines Le1, Le2, Le3, When Le4 and Le5 are represented, as shown in FIG. 7, the encoder read heads EN1 and EN2 are arranged in such a manner that the azimuth lines Le1 and Le2 are set at an angle of ±θ° with respect to the central plane P3. In this embodiment, for example, the angle θ is 15°.

圖4所示之投影模組PL1~PL6，係以基板P為被處理物體，對基板P施以照射光之照射處理之曝光裝置EX的處理部。曝光裝置EX對基板P，將2條成像光束EL2之主光線射入基板P。投影模組PL1、PL3、PL5為第1處理部，投影模組PL2、PL4、PL6為第2處理部，對基板P將2條成像光束EL2之主光線分別射入基板P之位置，為對基板P施以照射光之照射處理的特定位置。特定位置係從第2滾筒構件22之第2中心軸AX2看，在第2滾筒構件22上之曲面之基板P中、夾著中心面P3於周方向之角度±θ的位置。編碼器讀頭EN1之設置方位線Le1，與通過奇數個投影模組PL1、PL3、PL5之各投影區域(投影視野)PA1、PA3、PA5之中心點之主光線相對中心面P3之傾角θ一致，編碼器讀頭EN2之設置方位線Le2則與通過偶數個投影模組PL2、PL4、PL6之各投影區域(投影視野)PA2、PA4、PA6之中心點之主光線相對中心面P3之傾角θ一致。因此，編碼器讀頭EN1係讀取位在連結第1特定位置PX1與第2中心軸AX2之方向之標尺部GP的讀取裝置。而編碼器讀頭EN2則係讀取位在連結第2特定位置PX2與第2中心軸AX2之方向之標尺部GP的讀取裝置。 The projection modules PL1 to PL6 shown in FIG. 4 are processing sections of an exposure apparatus EX that uses the substrate P as a processing object and applies an irradiation process of irradiating light to the substrate P. The exposure device EX directs the principal rays of the two imaging light beams EL2 into the substrate P toward the substrate P. The projection modules PL1, PL3, and PL5 are the first processing sections, and the projection modules PL2, PL4, and PL6 are the second processing sections. The principal rays of the two imaging light beams EL2 are incident on the substrate P to the substrate P respectively. The substrate P is irradiated with light at a specific position. The specific position is a position of the angle ±θ in the circumferential direction sandwiching the center plane P3 among the curved substrates P on the second roll member 22 as viewed from the second center axis AX2 of the second roll member 22. The azimuth line Le1 of the encoder read head EN1 is consistent with the inclination angle θ of the chief ray passing through the center of the projection point (projection field of view) PA1, PA3, and PA5 of the odd number of projection modules PL1, PL3, and PL5 with respect to the center plane P3 , The azimuth line Le2 of the encoder read head EN2 and the inclination angle θ of the principal ray of the central point of the projection point (projection field of view) PA2, PA4, PA6 passing through the projection areas (projection field of view) of the even number of projection modules PL2, PL4, PL6 relative to the central plane Consistent. Therefore, the encoder read head EN1 is a reading device that reads the scale part GP located in the direction connecting the first specific position PX1 and the second central axis AX2. The encoder read head EN2 is a reading device that reads the scale part GP located in the direction connecting the second specific position PX2 and the second central axis AX2.

編碼器讀頭EN4配置在基板P之搬送方向之後方側、也就是配置在曝光位置(投影區域)之前方，被設定在朝基板P之搬送方向後方側將編碼器讀頭EN1之設置方位線Le1繞旋轉中心線AX2之軸旋轉的設置方位線Le4上。又，編碼器讀頭EN5則係設定在朝基板P之搬送方向後方側 將編碼器讀頭EN1之設置方位線Le1繞旋轉中心線AX2之軸旋轉的設置方位線Le5上。 The encoder read head EN4 is arranged behind the transport direction of the substrate P, that is, before the exposure position (projection area), and is set to the rear side toward the transport direction of the substrate P to set the azimuth line of the encoder read head EN1 Le1 rotates on the setting azimuth line Le4 about the axis of rotation center line AX2. In addition, the encoder head EN5 is set on the installation direction line Le5 that rotates the installation direction line Le1 of the encoder head EN1 about the axis of the rotation center line AX2 toward the rear side of the conveyance direction of the substrate P.

又，編碼器讀頭EN3係相對編碼器讀頭EN1、EN2配置在夾著旋轉中心線AX2之相反側，其設置方位線Le3被設定在中心面P3上。 In addition, the encoder head EN3 is disposed on the opposite side of the encoder heads EN1 and EN2 with respect to the rotation center line AX2, and the installation orientation line Le3 is set on the center plane P3.

標尺構件標尺圓盤SD係以低熱膨脹之金屬、玻璃、陶瓷等為母材，為提高測量解析力，盡可能做成具有大直徑(例如直徑20cm以上)。圖5中，標尺圓盤SD之直徑雖相對第2滾筒構件22之直徑圖示的較小，但可藉由使第2滾筒構件22之外周面中、捲繞有基板P之外周面之直徑與標尺圓盤SD之標尺部GP之直徑一致(使大致一致)，可進一步縮小所謂的測量阿貝誤差。 Scale member The scale disc SD is made of low thermal expansion metal, glass, ceramics, etc. as the base material. In order to improve the measurement resolution, it should be made with a large diameter (for example, 20 cm or more in diameter) as much as possible. In FIG. 5, although the diameter of the scale disc SD is smaller than the diameter of the second roller member 22 as shown, the diameter of the outer periphery of the second roller member 22 around which the substrate P is wound The diameter of the scale part GP of the scale disc SD is the same (to make it roughly the same), and the so-called measurement Abbe error can be further reduced.

刻設於標尺部GP周方向之刻度(格子)之最小間距，受限於加工標尺圓盤SD之刻度刻線裝置等之性能。因此，若將標尺圓盤SD之直徑做大的話，相應於此，對應最小間距之角度測量解析能力亦能提高。 The minimum pitch of the scale (grid) engraved in the circumferential direction of the scale part GP is limited by the performance of the scale marking device for processing the scale disc SD. Therefore, if the diameter of the scale disc SD is made larger, corresponding to this, the angle measurement resolution capability corresponding to the minimum pitch can also be improved.

將配置讀取標尺部GP之編碼器讀頭EN1、EN2的設置方位線Le1、Le2之方向，從旋轉中心線AX2看時，藉由使相對基板P成像光束EL2之主光線射入基板P之方向相同，例如，即使因支承旋轉軸ST之軸承(bearing)將故障而有些微間隙(2μm~3μm程度)而使第2滾筒構件22於X方向產生位移時，亦能以編碼器讀頭EN1、EN2高精度測量可能因此位移而在投影區域PA1~PA6內發生之在基板P之搬送方向(Xs)的位置誤差。 When the direction of the azimuth lines Le1 and Le2 of the encoder heads EN1 and EN2 of the reading scale part GP are viewed from the rotation center line AX2, the principal ray of the imaging beam EL2 of the opposite substrate P is incident on the substrate P The direction is the same, for example, even if there is a slight gap (about 2μm~3μm) due to the failure of the bearing supporting the rotating shaft ST and the second roller member 22 is displaced in the X direction, the encoder read head EN1 can be used 1. EN2 high-precision measurement may cause a position error in the transport direction (Xs) of the substrate P that occurs in the projection areas PA1 to PA6 due to the displacement.

如圖6所示，為了在被第2滾筒構件22之曲面支承之基板P之一部分，將以圖2所示之投影光學系PL投影之光罩圖案之一部分之像與基板P相對的對準，設有檢測預先形成在基板P之對準標記等的對準顯 微鏡AMG1、AMG2。對準顯微鏡AMG1、AMG2，係具有用以檢測基板P上離散或連續形成之特定圖案的檢測探針，以此檢測探針之檢測區域設定在較上述特定位置靠基板P之搬送方向後方側之方式，配置在第2滾筒構件22周圍的圖案檢測裝置。 As shown in FIG. 6, in order to align a portion of the mask pattern projected by the projection optical system PL shown in FIG. 2 with a portion of the substrate P supported by the curved surface of the second roller member 22, the image of the portion of the reticle pattern is aligned with the substrate P Alignment microscopes AMG1 and AMG2 that detect alignment marks and the like formed on the substrate P in advance are provided. The alignment microscopes AMG1 and AMG2 are provided with detection probes for detecting a specific pattern discretely or continuously formed on the substrate P, so that the detection area of the detection probe is set to the rear side of the substrate P in the transport direction of the specific position The pattern detection device is arranged around the second roller member 22.

如圖6所示，對準顯微鏡AMG1、AMG2具有於Y軸方向(基板P之寬度方向)排列成一行之複數個(例如4個)檢測探針。對準顯微鏡AMG1、AMG2可以第2滾筒構件22之Y軸方向兩側端之檢測探針，隨時觀察或檢測形成在基板P兩端附近之對準標記。且對準顯微鏡AMG1、AMG2可以第2滾筒構件22之Y軸方向(基板P之寬度方向)兩側端以外之檢測探針，觀察或檢測例如形成在基板P上沿長邊方向形成之複數個顯示面板之圖案形成區域間之留白部等的對準標記。 As shown in FIG. 6, the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detection probes arranged in a row in the Y-axis direction (the width direction of the substrate P). The alignment microscopes AMG1 and AMG2 can observe or detect the alignment marks formed near both ends of the substrate P at any time with the detection probes on both ends of the second roller member 22 in the Y-axis direction. Moreover, the alignment microscopes AMG1 and AMG2 can detect or detect a plurality of detection probes formed on the substrate P along the long side direction, for example, on both ends of the second roller member 22 in the Y-axis direction (the width direction of the substrate P). The pattern of the display panel forms an alignment mark such as a blank portion between regions.

如圖6及圖7所示，係以從XZ面內且旋轉中心線AX2看時，與對準顯微鏡AMG1之基板P之觀察方向AM1(朝第2中心軸AX2)之檢測中心同一方向之方式，在設定於標尺部GP之直徑方向之設置方位線Le4上，配置編碼器讀頭EN4。又，係以從XZ面內且旋轉中心線AX2看時，與對準顯微鏡AMG2之基板P之觀察方向AM2(朝旋轉中心線AX2)之檢測中心同一方向之方式，在設定於標尺部GP之直徑方向之設置方位線Le5上，配置編碼器讀頭EN5。如前所述，對準顯微鏡AMG1、AMG2之檢測探針從第2中心軸AX2看時配置在第2滾筒構件22之周圍，以連結編碼器讀頭EN4、EN5之配置位置與第2中心軸AX2之方向(設置方位線Le4、Le5)與連結第2中心軸AX2與對準顯微鏡AMG1、AMG2之檢測區域之方向一致之方式配置。又，配置對準顯微鏡AMG1、AMG2及編碼器讀頭EN4、EN5 之旋轉中心線AX2周方向之位置，係設定在基板P開始接觸第2滾筒構件22之進入位置IA與基板P脫離第2滾筒構件22之離脫位置OA之間。 As shown in FIGS. 6 and 7, it is in the same direction as the detection center of the observation direction AM1 (toward the second central axis AX2) of the substrate P of the microscope AMG1 when viewed from the XZ plane and the rotation center line AX2 The encoder read head EN4 is arranged on the setting azimuth line Le4 set in the diameter direction of the scale part GP. In addition, when viewed from the XZ plane and the rotation center line AX2, it is set in the scale part GP in the same direction as the detection center of the observation direction AM2 (toward the rotation center line AX2) of the substrate P of the microscope AMG2. Encoder reading head EN5 is arranged on the azimuth line Le5 in the diameter direction. As described above, the detection probes of the alignment microscopes AMG1 and AMG2 are arranged around the second roller member 22 when viewed from the second central axis AX2, to connect the arrangement positions of the encoder read heads EN4 and EN5 and the second central axis The direction of AX2 (the azimuth lines Le4 and Le5 are provided) and the direction connecting the second central axis AX2 and the detection areas of the alignment microscopes AMG1 and AMG2 are arranged so as to match. Further, the positions of the alignment microscopes AMG1, AMG2 and the encoder reading heads EN4, EN5 in the circumferential direction of the rotation center line AX2 are set at the entry position IA where the substrate P starts to contact the second roller member 22 and the substrate P is separated from the second roller Between the disengagement position OA of the member 22.

上述對準顯微鏡AMG2之觀察方向AM2係配置在基板P之搬送方向前方側、亦即曝光位置(投影區域)之後方，將形成在基板P之Y方向端部附近之對準標記(形成在數十μm~數百μm對角線內之區域)，在基板P被以既定速度搬送之狀態下，以攝影元件等高速的進行影像檢測，於顯微鏡視野(拍攝範圍)高速的進行標記像之取樣(sampling)。於進行該取樣之瞬間，儲存以編碼器讀頭EN5逐次測量之標尺圓盤SD之旋轉角度位置，據以求出基板P上之對準標記之標記位置與第2滾筒構件22之旋轉角度位置間之對應關係。 The observation direction AM2 of the alignment microscope AMG2 is arranged on the front side of the substrate P in the conveying direction, that is, behind the exposure position (projection area), and the alignment mark (formed in the number) formed near the end of the substrate P in the Y direction (Diagonal area between ten μm and hundreds of μm), under the condition that the substrate P is transported at a predetermined speed, image detection is performed at a high speed with a photographic element, etc., and the mark image is sampled at a high speed in the microscope field of view (shooting range) (sampling). At the moment when the sampling is performed, the rotation angle position of the scale disc SD measured successively by the encoder read head EN5 is stored, and the mark position of the alignment mark on the substrate P and the rotation angle position of the second roller member 22 are obtained based thereon The corresponding relationship between.

另一方面，上述對準顯微鏡AMG1之觀察方向AM1係配置在基板P之搬送方向後方側、亦即曝光位置(投影區域)之前方，將形成在基板P之Y方向端部附近之對準標記(形成在數十μm~數百μm對角線內之區域)之像，與對準顯微鏡AMG2同樣的，以攝影元件等高速的進行取樣，於該取樣之瞬間，儲存以編碼器讀頭EN4逐次測量之標尺圓盤SD之旋轉角度位置，據以求出基板P上之對準標記之標記位置與第2滾筒構件22之旋轉角度位置間之對應關係。 On the other hand, the observation direction AM1 of the alignment microscope AMG1 is arranged on the rear side of the transport direction of the substrate P, that is, in front of the exposure position (projection area), and an alignment mark formed near the end of the substrate P in the Y direction (The area formed within the diagonal of tens of μm to hundreds of μm), as with the alignment microscope AMG2, samples are taken at high speed with imaging elements, etc., and at the moment of sampling, the encoder read head EN4 is stored The rotation angle position of the scale disk SD measured successively is used to obtain the correspondence between the mark position of the alignment mark on the substrate P and the rotation angle position of the second roller member 22.

以對準顯微鏡AMG1檢測過之標記，再以對準顯微鏡AMG2檢測時，將以編碼器讀頭EN4測量並儲存之角度位置與以編碼器讀頭EN5測量並儲存之角度位置的差，與預先經精密校正之2個對準顯微鏡AMG1、AMG2之設置方位線Le4、Le5之開角加以比較。於前述開角度具有誤差之情形時，在進入位置IA與離脫位置OA之間，基板P極有可能在第2滾筒 構件22上些微滑動、或於搬送方向(周方向)或與第2中心軸AX2平行之方向(Y軸方向)產生伸縮。 The difference between the angular position measured and stored by the encoder read head EN4 and the angular position measured and stored by the encoder read head EN5 is different from the mark detected by the alignment microscope AMG1 and then by the alignment microscope AMG2. Compare the opening angles of the azimuth lines Le4 and Le5 of the two calibrated microscopes AMG1 and AMG2 with precise correction. When there is an error in the aforementioned opening angle, between the entry position IA and the release position OA, the substrate P is highly likely to slide slightly on the second roller member 22, or in the conveyance direction (circumferential direction) or the second center The axis AX2 is parallel to the direction (Y-axis direction).

一般而言，圖案化時之位置誤差，雖係視形成在基板P上之元件圖案之微細度及重疊精度來決定，但例如為了對底圖案層正確的重疊曝光10μm寬之線條圖案，僅能容許數分之一以下之誤差，亦即，換算成基板P上之尺寸時，僅能容許±2μm程度之位置誤差。 In general, the positional error during patterning is determined by the fineness and overlapping accuracy of the element patterns formed on the substrate P, but for example, in order to accurately overlay and expose the line pattern with a width of 10 μm to the bottom pattern layer, only An error of less than a fraction of the allowable value, that is, when converted to the size on the substrate P, only a position error of about ±2 μm can be tolerated.

為實現此種高精度之測量，必須使各對準顯微鏡AMG1、AMG2之標記影像測量方向(在XZ面內之第2滾筒構件22之外周切線方向)與各編碼器讀頭EN4、EN5之測量方向(在XZ面內之標尺部GP之外周切線方向)，在容許角度誤差內一致。 In order to achieve such high-precision measurement, it is necessary to align the marking image measurement direction of each of the microscopes AMG1 and AMG2 (the tangential direction of the outer circumference of the second roller member 22 in the XZ plane) with the measurement of each encoder reading head EN4 and EN5 The direction (the tangent direction of the outer circumference of the scale part GP in the XZ plane) is consistent within the allowable angle error.

如以上所述，係以和對準顯微鏡AMG1、AMG2之基板P上之對準標記之測量方向(第2滾筒構件22之圓周面之切線方向)一致之方式，配置編碼器讀頭EN4、EN5。因此，在進行對準顯微鏡AMG1、AMG2之基板P(標記)之位置檢測時(影像取樣時)，即使第2滾筒構件22(標尺圓盤SD)在XZ面內往與設置方位線Le4或Le5正交之周方向(切線方向)位移時，亦能進行考慮了第2滾筒構件22之位移的高精度位置測量。 As described above, the encoder read heads EN4 and EN5 are arranged in such a way as to match the measurement direction of the alignment marks on the substrate P of the alignment microscopes AMG1 and AMG2 (the tangential direction of the circumferential surface of the second roller member 22) . Therefore, when detecting the position of the substrate P (mark) of the alignment microscopes AMG1, AMG2 (when image sampling), even if the second roller member 22 (scale disk SD) is positioned in the XZ plane to the azimuth line Le4 or Le5 Even when the displacement is in the orthogonal circumferential direction (tangential direction), high-precision position measurement in consideration of the displacement of the second roller member 22 can also be performed.

由於從第2中心軸AX2看，在標尺圓盤SD之標尺部GP周圍5處配置了編碼器讀頭EN1~EN5，因此藉由組合其中之適當的2個或3個編碼器讀頭之測量值輸出進行運算處理，亦能求出標尺圓盤SD之標尺部GP之真圓度(形狀畸變)、偏心誤差等。 As seen from the second central axis AX2, encoder read heads EN1 to EN5 are arranged around the scale part GP of the scale disc SD, so by combining the appropriate 2 or 3 encoder read heads for measurement The value output is calculated, and the roundness (shape distortion) and eccentricity error of the scale part GP of the scale disc SD can also be obtained.

<溫度調節裝置> <Temperature adjustment device>

如前所述，基板P有可能因處理裝置U3內部之溫度環境而 在搬送方向(周方向)或與第2中心軸AX2平行之方向(Y軸方向)視基板P之溫度而產生伸縮。伸縮係由基板P之材料物性決定，有會隨著基板P之溫度増加而產生延伸之材料、與隨著基板P之溫度増加而產生縮小之材料。圖8係說明第1實施形態之溫度調節裝置的說明圖。溫度調節裝置60，如圖2所示，係對通過第1特定位置PX1、特定位置PX及第2特定位置PX2之基板P之搬送方向上游側進行溫度調節的裝置。處理裝置U3，其從第1導件31、第2導件32引導之基板P之溫度調節裝置60之溫度調整結束至往第2滾筒構件22之進入位置IA之搬送為止之長度，以盡可能短者較佳，但亦可視以溫度調節裝置60設定之溫度與第2滾筒構件22之溫度間之差來決定。例如，由於第2滾筒構件22一般而言熱容量大，欲改變設定溫度需花時間，因此為了使第2滾筒構件22保持某一固定溫度，係以圖2中之基板支承構件溫度調節裝置73隨時持續地進行調溫。並根據從溫度調節裝置60至進入位置IA之搬送距離、其間之搬送空間之溫度、及基板P之速度，來決定以溫度調節裝置60設定之溫度。例如，第2滾筒構件22之表面溫度為25℃時，以溫度調節裝置60設定之溫度，即係在基板P移動搬送距離分之時間(秒數)後，剛好降至25℃。然而，由於一般而言基板P較薄，會快速的成為環境溫度，因此最好是盡可能的縮短從溫度調節裝置60至進入位置IA之搬送距離，且如上述般預測並控制變化溫度。 As described above, the substrate P may expand or contract depending on the temperature of the substrate P in the transport direction (peripheral direction) or in a direction parallel to the second central axis AX2 (Y-axis direction) due to the temperature environment inside the processing device U3. The expansion and contraction is determined by the material properties of the substrate P, and there are materials that extend as the temperature of the substrate P increases and materials that shrink as the temperature of the substrate P increases. FIG. 8 is an explanatory diagram illustrating the temperature adjusting device of the first embodiment. As shown in FIG. 2, the temperature adjustment device 60 is a device that performs temperature adjustment on the upstream side in the transport direction of the substrate P passing through the first specific position PX1, the specific position PX, and the second specific position PX2. The processing device U3 has a length from the end of the temperature adjustment of the temperature adjustment device 60 of the substrate P guided by the first guide 31 and the second guide 32 to the transfer to the entry position IA of the second roller member 22, as far as possible The shorter is better, but it can also be determined by the difference between the temperature set by the temperature adjusting device 60 and the temperature of the second roller member 22. For example, since the second roller member 22 generally has a large heat capacity and it takes time to change the set temperature, in order to maintain the second roller member 22 at a certain fixed temperature, the substrate supporting member temperature adjustment device 73 in FIG. 2 is used at any time. Continuously adjust the temperature. The temperature set by the temperature adjustment device 60 is determined according to the transfer distance from the temperature adjustment device 60 to the entry position IA, the temperature of the transfer space in between, and the speed of the substrate P. For example, when the surface temperature of the second roller member 22 is 25°C, the temperature set by the temperature adjusting device 60, that is, the time (seconds) after the substrate P has moved by the transport distance, drops to 25°C just after. However, since the substrate P is generally thin and will quickly become the ambient temperature, it is best to shorten the transfer distance from the temperature adjustment device 60 to the entry position IA as much as possible, and predict and control the changing temperature as described above.

溫度調節裝置60具備導件61、媒體送風構件62、送風壓力均勻化構件63、媒體調節裝置71、加熱單元HU、以及冷卻單元CU。媒體送風構件62透過以多孔質材料形成之媒體之送風壓力均勻化構件63，將媒體送至基板P。搬送裝置9使基板P通過導件61與媒體送風構件62之間之 空間67。媒體送風構件62將從媒體調節裝置71透過媒體供應管線AP供應之媒體送至導件61側。加熱單元HU係透過媒體供應管線HH將高溫之媒體供應至媒體調節裝置71的第1媒體供應部。冷卻單元CU係透過媒體供應管線CC將溫度較加熱單元HU之高溫媒體低之低溫媒體供應至媒體調節裝置71的第2媒體供應部。媒體調節裝置71，具備調整從媒體供應管線HH供應至媒體供應管線AP之高溫媒體之流量的流量調整閥72H、與調整從媒體供應管線CC供應至媒體供應管線AP之低溫媒體之流量的流量調整閥72C。流量調整閥72H及流量調整閥72C，係以例如電磁閥構成。媒體調節裝置71，可藉由根據控制裝置14之控制訊號之輸出調整通過流量調整閥72H之高溫媒體之量及通過流量調整閥72C之低溫媒體之量，來使供應至媒體送風構件62之高溫媒體與低溫媒體之比。因此，媒體調節裝置71可混合高溫媒體與低溫媒體作為供應至媒體送風構件62之媒體，使之流通。溫度調節裝置60可使任意溫度之媒體流通至導件61周圍、以調節基板P之溫度。又，亦可將與圖8中之送風壓力均勻化構件63同等之構件設置在基板P之相反側，透過與媒體供應管線AP同等之構件將經溫度調整之媒體亦吹送至基板P之相反側。 The temperature adjusting device 60 includes a guide 61, a medium blowing member 62, a blowing pressure equalizing member 63, a medium adjusting device 71, a heating unit HU, and a cooling unit CU. The medium blowing member 62 transmits the medium to the substrate P through the medium blowing pressure uniformizing member 63 formed of the porous material. The conveying device 9 passes the substrate P through the space 67 between the guide 61 and the medium blowing member 62. The media blowing member 62 sends the media supplied from the media adjustment device 71 through the media supply line AP to the guide 61 side. The heating unit HU supplies high-temperature media to the first media supply unit of the media adjustment device 71 through the media supply line HH. The cooling unit CU supplies low-temperature media with a temperature lower than the high-temperature media of the heating unit HU to the second media supply unit of the media adjustment device 71 through the media supply line CC. The media adjustment device 71 includes a flow adjustment valve 72H that adjusts the flow of high-temperature media supplied from the media supply line HH to the media supply line AP, and a flow adjustment that adjusts the flow of low-temperature media supplied from the media supply line CC to the media supply line AP Valve 72C. The flow rate adjustment valve 72H and the flow rate adjustment valve 72C are constituted by, for example, solenoid valves. The media regulating device 71 can adjust the amount of high-temperature media passing through the flow regulating valve 72H and the amount of low-temperature media passing through the flow regulating valve 72C according to the output of the control signal of the control device 14 to make the high temperature supplied to the media blowing member 62 The ratio of media to cryogenic media. Therefore, the media adjusting device 71 can mix the high-temperature media and the low-temperature media as the media supplied to the media blowing member 62 and circulate it. The temperature adjusting device 60 can circulate a medium of any temperature around the guide 61 to adjust the temperature of the substrate P. In addition, it is also possible to provide a member equivalent to the blowing pressure equalizing member 63 in FIG. 8 on the opposite side of the substrate P, and to blow the temperature-adjusted medium to the opposite side of the substrate P through the member equivalent to the media supply line AP .

基板支承構件溫度調節裝置73係調節為基板支承構件之第2滾筒構件22之溫度的裝置。基板支承構件溫度調節裝置73，具備調整從媒體供應管線HH供應至媒體供應管線AD之高溫媒體之流量的流量調整閥74H、與調整從媒體供應管線CC供應至媒體供應管線AD之低溫媒體之流量的流量調整閥74C。流量調整閥74H及流量調整閥74C係以例如電磁閥構成。基板支承構件溫度調節裝置73，可根據控制裝置14之控制訊號之輸 出調整通過流量調整閥74H之高溫媒體之量及通過流量調整閥74C之低溫媒體之量，據以改變供應至第2滾筒構件22之高溫媒體與低溫媒體之比。因此，基板支承構件溫度調節裝置73可混合高溫媒體與低溫媒體來作為供應至第2滾筒構件22內部之媒體，透過媒體供應管線AD使其流通至第2滾筒構件22之內部。基板支承構件溫度調節裝置73，最好是被控制裝置14控制成可將第2滾筒構件22之溫度維持於一定。如此，傳至與第2滾筒構件22之曲面接觸之基板P之熱容量即能大致維持一定，能使在第2滾筒構件22之曲面產生之基板P之伸縮狀態安定。 The substrate supporting member temperature adjusting device 73 is a device that adjusts the temperature of the second roller member 22 of the substrate supporting member. The substrate supporting member temperature adjusting device 73 includes a flow adjustment valve 74H that adjusts the flow rate of the high-temperature medium supplied from the media supply line HH to the media supply line AD, and adjusts the flow rate of the low-temperature medium supplied from the media supply line CC to the media supply line AD The flow control valve 74C. The flow rate adjustment valve 74H and the flow rate adjustment valve 74C are constituted by, for example, solenoid valves. The substrate support member temperature adjustment device 73 can adjust the amount of high-temperature medium passing through the flow adjustment valve 74H and the amount of low-temperature medium passing through the flow adjustment valve 74C according to the output of the control signal of the control device 14, thereby changing the supply to the second roller member 22 is the ratio of high temperature media to low temperature media. Therefore, the substrate supporting member temperature adjusting device 73 can mix the high-temperature medium and the low-temperature medium as the medium supplied to the inside of the second roller member 22, and circulate to the inside of the second roller member 22 through the medium supply line AD. The substrate supporting member temperature adjusting device 73 is preferably controlled by the control device 14 so as to maintain the temperature of the second roller member 22 constant. In this way, the heat capacity transferred to the substrate P in contact with the curved surface of the second roller member 22 can be maintained substantially constant, and the expansion and contraction state of the substrate P generated on the curved surface of the second roller member 22 can be stabilized.

溫度調節裝置60及基板支承構件溫度調節裝置73雖係將溫度經調整之媒體供應至基板P或第2滾筒構件22之裝置，但媒體可以是使液體於管線中循環，而以放射熱來調節基板P或第2滾筒構件22之溫度。媒體調節裝置71及基板支承構件溫度調節裝置73，例如可將加熱器與散熱片加以組合構成。 Although the temperature adjusting device 60 and the substrate supporting member temperature adjusting device 73 are devices that supply the temperature-adjusted medium to the substrate P or the second roller member 22, the medium may be circulated in the pipeline and regulated by radiant heat The temperature of the substrate P or the second roller member 22. The media adjustment device 71 and the substrate support member temperature adjustment device 73 can be configured by combining a heater and a heat sink, for example.

檢測被導件61搬送前之基板P之溫度的溫度測量裝置T1，可將檢測結果輸出至控制裝置14。控制裝置14可根據溫度測量裝置T1之檢測結果，對溫度調節裝置60進行前饋控制。又，檢測通過溫度調節裝置60(導件61)後之基板P之溫度的溫度測量裝置T2，可將檢測結果輸出至控制裝置14。可根據溫度測量裝置T2之檢測結果，對溫度調節裝置60進行反饋控制。控制裝置14，可藉由對溫度調節裝置60進行前饋控制及反饋控制中之至少1種，控制從媒體送風構件62送出之媒體之溫度，以提高加至基板P之溫度之精度。例如，溫度測量裝置T1、T2可使用測量基板P放射出之紅外線能量之非接觸式紅外線溫度計等。 The temperature measuring device T1 that detects the temperature of the substrate P before being transported by the guide 61 can output the detection result to the control device 14. The control device 14 may perform feedforward control on the temperature adjustment device 60 according to the detection result of the temperature measurement device T1. In addition, the temperature measuring device T2 that detects the temperature of the substrate P after passing through the temperature adjusting device 60 (lead 61) can output the detection result to the control device 14. The temperature adjustment device 60 can be feedback controlled according to the detection result of the temperature measurement device T2. The control device 14 can control the temperature of the medium sent from the medium blowing member 62 by performing at least one of feedforward control and feedback control on the temperature adjustment device 60 to improve the accuracy of the temperature applied to the substrate P. For example, the temperature measuring devices T1 and T2 may use a non-contact infrared thermometer that measures the infrared energy emitted from the substrate P.

如圖8所示，使基板P通過導件61與媒體送風構件62間之空間67之情形時，於導件61，最好是能具備基板P之支承機構。媒體送風構件62將來自媒體供應管線AP之媒體透過開設在位於送風壓力均勻化構件63之貫通孔AH，送至送風壓力均勻化構件63。送風壓力均勻化構件63，由於例如係多孔質材料，因此可於基板P側之對向面63S，以每單位面積之媒體壓力均等之方式噴出媒體。於導件61具備按壓基板P之Y方向(寬度方向)端部的限制構件64與限制構件65，限制構件64與限制構件65於基板P之搬送時夾在基板P之寬度方向。限制構件65透過軸承BE固定在導件61之內側面。限制構件64透過彈簧SS連接於音圈馬達66之磁石VCMm。依據流於音圈馬達66之線圈VCMc之電流，磁石VCMm之Y方向位置變化，音圈馬達66可使基板P之Y方向位置變化。 As shown in FIG. 8, when the substrate P is passed through the space 67 between the guide 61 and the medium blowing member 62, it is preferable that the guide 61 can be provided with a support mechanism for the substrate P. The media blowing member 62 sends the media from the media supply line AP to the blowing pressure equalizing member 63 through the through hole AH formed in the blowing pressure uniformizing member 63. Since the blowing air pressure equalizing member 63 is, for example, a porous material, the medium can be ejected on the opposite surface 63S on the substrate P side with an equal medium pressure per unit area. The guide 61 includes a restricting member 64 and a restricting member 65 that press the end in the Y direction (width direction) of the substrate P. The restricting member 64 and the restricting member 65 are sandwiched in the width direction of the substrate P when the substrate P is transported. The restricting member 65 is fixed to the inner side of the guide 61 through the bearing BE. The restricting member 64 is connected to the magnet VCMm of the voice coil motor 66 through the spring SS. According to the current flowing in the coil VCMc of the voice coil motor 66, the position of the magnet VCMm in the Y direction changes, and the voice coil motor 66 can change the position of the substrate P in the Y direction.

如圖2所示，於溫度調節裝置60之內部或搬送方向之出口側，設有檢測預先形成在基板P之對準標記等的對準顯微鏡PMG1。具有於對準顯微鏡PMG1之Y方向(基板P之寬度方向)排列成一行之複數個(例如4個)檢測探針。圖9係說明對準標記之一例的說明圖。圖2所示之對準顯微鏡PMG1，可以導件61之Y方向兩側端之檢測探針，隨時觀察或檢測沿搬送方向α形成在圖9所示之基板P之兩端附近的對準標記ma。 As shown in FIG. 2, an alignment microscope PMG1 that detects alignment marks and the like formed on the substrate P in advance is provided inside the temperature adjustment device 60 or the exit side in the conveying direction. A plurality of (for example, 4) detection probes arranged in a row in the Y direction of the alignment microscope PMG1 (the width direction of the substrate P). 9 is an explanatory diagram illustrating an example of an alignment mark. The alignment microscope PMG1 shown in FIG. 2 can detect or detect the alignment marks formed near both ends of the substrate P shown in FIG. 9 along the conveying direction α at any time by the detection probes on both ends of the guide 61 in the Y direction. ma.

圖10係以示意方式說明因基板伸縮造成之對準標記之一變化例的說明圖。圖11係顯示修正第1實施形態之處理裝置(曝光裝置)之處理之一程序例的流程圖。如圖10所示，對準顯微鏡AMG1，作為第1檢測探針，在位於觀察方向(檢測方向)AM1之顯微鏡視野(攝影範圍)mam之範圍內檢測對準標記ma。同樣的，對準顯微鏡PMG1，作為第2檢測探針，在 位於檢測方向PM1之顯微鏡視野(攝影範圍)map之範圍內檢測對準標記ma。以此方式，對準顯微鏡AMG1及對準顯微鏡PMG1檢測圖10所示之基板P上之特定圖案對準標記ma(步驟S11)。對準顯微鏡AMG1將對準標記ma之影像輸出至控制裝置14，控制裝置14及對準顯微鏡AMG1，作為第1圖案檢測裝置，將對準標記ma作為影像資料儲存至控制裝置14之記憶部。對準顯微鏡PMG1將對準標記ma之影像輸出至控制裝置14，控制裝置14及對準顯微鏡PMG1，作為第2圖案檢測裝置，將對準標記ma作為影像資料儲存至控制裝置14之記憶部。 FIG. 10 is an explanatory diagram schematically illustrating a variation of alignment marks due to substrate expansion and contraction. FIG. 11 is a flowchart showing an example of a procedure of processing for correcting the processing device (exposure device) of the first embodiment. As shown in FIG. 10, the alignment microscope AMG1 is used as the first detection probe to detect the alignment mark ma in the range of the microscope field of view (imaging range) mam located in the observation direction (detection direction) AM1. Similarly, the alignment microscope PMG1 is used as the second detection probe to detect the alignment mark ma within the scope of the microscope field of view (photographing range) map in the detection direction PM1. In this way, the alignment microscope AMG1 and the alignment microscope PMG1 detect the specific pattern alignment mark ma on the substrate P shown in FIG. 10 (step S11). The alignment microscope AMG1 outputs the image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG1 serve as the first pattern detection device, and store the alignment mark ma as image data in the memory portion of the control device 14. The alignment microscope PMG1 outputs the image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope PMG1 serve as the second pattern detection device, and store the alignment mark ma as image data in the memory portion of the control device 14.

其次，藉比較記憶部中儲存之顯微鏡視野(攝影範圍)map之對準標記ma之影像資料與顯微鏡視野(攝影範圍)mam之對準標記ma之影像資料，在沒有因基板P之伸縮造成對準標記ma之影像資料之變化時(步驟S12，No)，控制裝置14即實施步驟S11之處理。如圖10所示，藉比較記憶部中儲存之顯微鏡視野(攝影範圍)map之對準標記ma之影像資料與顯微鏡視野(攝影範圍)mam之對準標記ma之影像資料，發現有因基板P之伸縮造成對準標記ma之影像資料之變化時(步驟S12，Yes)，控制裝置14即進至步驟S13之處理。例如，所謂有因基板P之伸縮造成對準標記ma之影像資料之變化之情形，如圖10所示，係指對準標記ma之影像資料之變化△m超過為位移調整裝置之像位移修正光學構件45容許之、投影像可在像面內微幅横位移之量的情形。此外，所謂有因基板P之伸縮造成對準標記ma之影像資料之變化之情形，係指對準標記ma之影像資料之變化△m超過為倍率調整裝置之倍率修正用光學構件47所容許之、可微修正投影像倍率之倍率的情形等。 Secondly, by comparing the image data of the alignment mark ma of the microscope field of view (photographic range) map stored in the memory section with the image data of the alignment mark ma of the microscope field of view (photographic range) mam, there is no problem caused by the expansion and contraction of the substrate P When the image data of the quasi-mark ma changes (step S12, No), the control device 14 executes the process of step S11. As shown in FIG. 10, by comparing the image data of the alignment mark ma of the microscope field of view (photographic range) map stored in the memory section with the image data of the alignment mark ma of the microscope field of view (photographic range) mam, it is found that there is a substrate P When the expansion and contraction causes the image data of the alignment mark ma to change (step S12, Yes), the control device 14 proceeds to the process of step S13. For example, the so-called change in the image data of the alignment mark ma due to the expansion and contraction of the substrate P, as shown in FIG. 10, means that the change in the image data of the alignment mark ma Δm exceeds the image displacement correction of the displacement adjustment device The optical member 45 allows a situation where the projected image can be slightly laterally displaced within the image plane. In addition, the so-called change in the image data of the alignment mark ma due to the expansion and contraction of the substrate P means that the change in the image data of the alignment mark ma Δm exceeds what is allowed by the magnification correction optical member 47 of the magnification adjustment device , Can slightly correct the magnification of the projected image magnification, etc.

其次，控制裝置14視基板P之材料，控制溫度調節裝置60之媒體調節裝置71，以使基板P在寬度方向之目標寬度成為如圖10所示之目標寬度PP，來進行基板P之溫度調整(步驟S13)。控制裝置14根據溫度測量裝置T1、T2之檢測結果，在未達特定之基板溫度時(步驟S14，No)，持續進行基板P之溫度調整(步驟S13)。控制裝置14根據溫度測量裝置T1、T2之檢測結果，在達到特定之基板溫度時(步驟S14，Yes)，進至步驟S15之處理。 Next, the control device 14 controls the media adjustment device 71 of the temperature adjustment device 60 according to the material of the substrate P so that the target width of the substrate P in the width direction becomes the target width PP as shown in FIG. 10 to adjust the temperature of the substrate P (Step S13). Based on the detection results of the temperature measuring devices T1 and T2, the control device 14 continues to adjust the temperature of the substrate P when the specified substrate temperature is not reached (step S14, No) (step S13). The control device 14 proceeds to the process of step S15 when the specific substrate temperature is reached based on the detection results of the temperature measuring devices T1 and T2 (step S14, Yes).

其次，曝光裝置EX，由上述像位移調整裝置重新根據從上述第1圖案檢測裝置及前述第2圖案檢測裝置之輸出求出之對準標記ma(特定圖案)之變化△m，進行使投影像位移的投影像修正(步驟S15)。又，曝光裝置EX，亦可由上述倍率調整裝置重新根據從上述第1圖案檢測裝置及前述第2圖案檢測裝置之輸出求出之對準標記ma(特定圖案)之變化△m，進行修正投影像倍率的投影像修正。或者，曝光裝置EX，亦可由上述倍率調整裝置及像位移調整裝置重新根據從上述第1圖案檢測裝置及前述第2圖案檢測裝置之輸出求出之對準標記ma(特定圖案)之變化△m，進行修正投影像之位移及倍率的投影像修正。 Next, the exposure device EX performs the projection of the projection image by the image displacement adjustment device based on the change Δm in the alignment mark ma (specific pattern) obtained from the outputs of the first pattern detection device and the second pattern detection device. Correction of the shifted projection image (step S15). In addition, the exposure device EX may correct the projection image based on the change Δm of the alignment mark ma (specific pattern) obtained from the outputs of the first pattern detection device and the second pattern detection device by the magnification adjustment device. Magnification correction of the projected image. Alternatively, the exposure device EX may be changed again by the magnification adjustment device and the image displacement adjustment device based on the change Δm in the alignment mark ma (specific pattern) obtained from the output of the first pattern detection device and the second pattern detection device To correct the projection image to correct the displacement and magnification of the projection image.

如以上之說明，處理裝置U3，可藉由溫度調節裝置60調整捲繞於第2滾筒構件22前之基板P之一部分之溫度，使在上述第1特定位置PX1、特定位置PX或第2特定位置PX2之基板P之伸縮狀態安定。因此，曝光裝置EX可在第1特定位置PX1、特定位置PX或第2特定位置PX2，精密地進行照射曝光用光之處理。 As described above, the processing device U3 can adjust the temperature of a part of the substrate P wound around the second roller member 22 by the temperature adjustment device 60 so that the first specific position PX1, the specific position PX, or the second specific The expansion and contraction state of the substrate P at the position PX2 is stable. Therefore, the exposure device EX can precisely perform the process of irradiating exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.

藉由溫度調節裝置60調整捲繞於第2滾筒構件22前之基板 P之一部分之溫度，可將基板P之伸縮抑制在倍率調整裝置及像位移調整裝置可修正投影像之範圍。因此，曝光裝置EX可在第1特定位置PX1、特定位置PX或第2特定位置PX2，精密地進行照射曝光用光之處理。 By adjusting the temperature of a part of the substrate P wound around the second roller member 22 by the temperature adjustment device 60, the expansion and contraction of the substrate P can be suppressed within the range where the magnification adjustment device and the image displacement adjustment device can correct the projected image. Therefore, the exposure device EX can precisely perform the process of irradiating exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.

進一步的，本實施形態，可藉由控制第2滾筒構件22之外周面(支承面)之溫度之基板支承構件溫度調節裝置73、與設在第2滾筒構件22之上游側之溫度調節裝置60的設置，進行於基板P之搬送方向，在對準位置或曝光位置之特定位置與其上游側之位置之間，使基板P具有一定溫度差之溫度控制。如此，亦能調整在基板P被支承於第2滾筒構件22之時間點之基板P之伸縮量。此場合，設以溫度調節裝置60設定之基板P之溫度為Tu、以基板支承構件溫度調節裝置73透過第2滾筒構件22設定之基板P之溫度為Td的話，設定為Tu>Td、或Tu<Td，以其差大致一定之方式進行溫度控制。 Further, in this embodiment, the substrate supporting member temperature adjusting device 73 for controlling the temperature of the outer peripheral surface (supporting surface) of the second roller member 22 and the temperature adjusting device 60 provided on the upstream side of the second roller member 22 The installation is performed in the conveying direction of the substrate P, between the specific position of the alignment position or the exposure position and the position on the upstream side thereof, so that the substrate P has a temperature control with a certain temperature difference. In this manner, the amount of expansion and contraction of the substrate P at the time when the substrate P is supported by the second roller member 22 can also be adjusted. In this case, if the temperature of the substrate P set by the temperature adjusting device 60 is Tu and the temperature of the substrate P set by the substrate supporting member temperature adjusting device 73 through the second roller member 22 is Td, then set to Tu>Td or Tu <Td, temperature control is performed so that the difference is approximately constant.

(第2實施形態) (Second embodiment)

其次，參照圖12說明本發明之處理裝置之第2實施形態，。圖12係顯示第2實施形態之處理裝置(曝光裝置)之整體構成的示意圖。此圖中，針對與第1實施形態之構成要素相同之要素，係賦予相同符號並省略其說明。 Next, a second embodiment of the processing apparatus of the present invention will be described with reference to FIG. FIG. 12 is a schematic diagram showing the overall configuration of the processing apparatus (exposure apparatus) of the second embodiment. In this figure, the same elements as those of the first embodiment are given the same symbols and their description is omitted.

如圖12所示，溫度調節裝置60A，具有從與第2中心軸AX2平行之平行基準軸BX1以一定半徑r3彎曲之曲面(第2曲面)61S，具備基板P之一部分接觸曲面61S之導件32A、以及使經溫度調節之媒體流通於導件32A周圍之空間67之媒體調節裝置71。搬送裝置9使基板P通過導件32A與媒體送風構件62A間之空間67。媒體送風構件62A將從媒體調節裝置71透過媒體供應管線AP供應之媒體送至導件32A側。導件32A，由於從平行 基準軸BX1看沿曲面61S彎曲，因此可抑制空間67之亂氣流。 As shown in FIG. 12, the temperature adjustment device 60A has a curved surface (second curved surface) 61S bent at a constant radius r3 from a parallel reference axis BX1 parallel to the second central axis AX2, and includes a guide member that partially contacts the curved surface 61S of the substrate P 32A, and a media regulating device 71 that circulates the temperature-regulated media in the space 67 around the guide 32A. The conveying device 9 passes the substrate P through the space 67 between the guide 32A and the medium blowing member 62A. The media blowing member 62A sends the media supplied from the media adjustment device 71 through the media supply line AP to the guide 32A side. The guide 32A is curved along the curved surface 61S as viewed from the parallel reference axis BX1, so that the turbulent airflow in the space 67 can be suppressed.

溫度調節裝置60A，藉由使溫度經調節之媒體流通於導件32A周圍之空間67，據以將媒體之溫度傳遞至基板P。導件32A，由於係做成基板P之一部分接觸曲面61S，而能從導件32A直接將基板P供應往第2滾筒構件22，縮短從導件32A至第2滾筒構件22之距離。因此，處理裝置U3可抑制經由溫度調節裝置60A之溫度調整所調整之基板P之伸縮狀態，在從溫度調節裝置60A至第2滾筒構件22之期間產生變化。 The temperature adjusting device 60A transmits the temperature of the medium to the substrate P by circulating the temperature-adjusted medium in the space 67 around the guide 32A. The guide 32A is made such that a part of the substrate P contacts the curved surface 61S, so that the substrate P can be directly supplied to the second roller member 22 from the guide 32A, and the distance from the guide 32A to the second roller member 22 is shortened. Therefore, the processing device U3 can suppress the expansion and contraction state of the substrate P adjusted by the temperature adjustment of the temperature adjustment device 60A, and the change from the temperature adjustment device 60A to the second roller member 22 occurs.

上述導件32A之曲面61S之半徑r3，最好是與第2滾筒構件22之半徑r2相同。藉由此構造，可使作用於捲繞在第2滾筒構件22之基板P之張力、與作用於捲繞在導件32A之基板P之張力相同。其結果，可從對準標記之變化抑制張力差造成之誤差，檢測因溫度造成之對準標記之變化。 The radius r3 of the curved surface 61S of the guide 32A is preferably the same as the radius r2 of the second roller member 22. With this structure, the tension acting on the substrate P wound around the second roller member 22 can be made the same as the tension acting on the substrate P wound around the guide 32A. As a result, the error caused by the difference in tension can be suppressed from the change in the alignment mark, and the change in the alignment mark due to temperature can be detected.

(第3實施形態) (Third Embodiment)

其次，參照圖13說明本發明之處理裝置之第3實施形態，。圖13係顯示第3實施形態之處理裝置(曝光裝置)之整體構成的示意圖。此圖中，針對與第1實施形態及第2實施形態之構成要素相同之要素，係賦予相同符號並省略其說明。 Next, a third embodiment of the processing apparatus of the present invention will be described with reference to FIG. 13 is a schematic diagram showing the overall configuration of a processing device (exposure device) according to a third embodiment. In this figure, the same elements as those of the first embodiment and the second embodiment are given the same symbols and their descriptions are omitted.

如圖13所示，第3實施形態之處理裝置U3，係將媒體調節裝置71作為調節導件32A之導件溫度調節裝置。媒體調節裝置71，可混合高溫媒體與低溫媒體以作為供應至導件32A內部之媒體並使之流通。媒體調節裝置71受控制裝置14控制而調整導件32A之溫度，將導件32A之溫度傳遞至與導件32A接觸之基板P。如此，傳遞至與導件32A之曲面61S 接觸之基板P之熱容量，即被大致維持於一定。 As shown in FIG. 13, the processing device U3 of the third embodiment is a guide temperature adjustment device that uses the media adjustment device 71 as an adjustment guide 32A. The media adjusting device 71 can mix high-temperature media and low-temperature media as the media supplied to the guide 32A and circulate it. The media adjustment device 71 is controlled by the control device 14 to adjust the temperature of the guide 32A, and transfer the temperature of the guide 32A to the substrate P in contact with the guide 32A. In this way, the heat capacity transferred to the substrate P in contact with the curved surface 61S of the guide 32A is maintained substantially constant.

上述導件32A之曲面61S之半徑r3，最好是能與第2滾筒構件22之半徑r2相同。藉由此構造，可使作用於捲繞在第2滾筒構件22之基板P之張力，與作用於捲繞在導件32A之基板P之張力相同。例如，藉由使媒體調節裝置71所施加之傳遞至與導件32A之曲面61S接觸之基板P之熱容量、與傳遞至與第2滾筒構件22之曲面接觸之基板P之熱容量一致，即能提高從對準顯微鏡PMG1檢測之對準標記在對準顯微鏡AMG1之對準標記之變化的預測精度。 The radius r3 of the curved surface 61S of the guide 32A is preferably the same as the radius r2 of the second roller member 22. With this structure, the tension acting on the substrate P wound around the second roller member 22 can be made the same as the tension acting on the substrate P wound around the guide 32A. For example, by making the heat capacity transferred to the substrate P in contact with the curved surface 61S of the guide 32A and the heat capacity transferred to the substrate P in contact with the curved surface of the second roller member 22 applied by the media adjustment device 71, it can be increased The prediction accuracy of the change of the alignment mark detected from the alignment microscope PMG1 in the alignment mark of the alignment microscope AMG1.

(第4實施形態) (Fourth embodiment)

其次，參照圖14說明本發明之處理裝置之第4實施形態，。圖14係顯示第4實施形態之處理裝置(曝光裝置)之整體構成的示意圖。此圖中，針對與第1實施形態至第3實施形態之構成要素相同之要素，係賦予相同符號並省略其說明。曝光裝置EX2，從光源射出照明圓筒光罩DM之照明光束EL1。 Next, a fourth embodiment of the processing apparatus of the present invention will be described with reference to FIG. 14. 14 is a schematic diagram showing the overall configuration of a processing device (exposure device) according to a fourth embodiment. In this figure, the same elements as those of the first to third embodiments are given the same symbols and their description is omitted. The exposure device EX2 emits the illumination light beam EL1 that illuminates the cylindrical mask DM from the light source.

將從光源射出之照明光束EL1導至照明模組IL，設有複數個照明光學系之情形時，將來自光源之照明光束EL1分離成複數條，將複數條照明光束EL1導至複數個照明模組IL。 When the illumination light beam EL1 emitted from the light source is directed to the illumination module IL and a plurality of illumination optical systems are provided, the illumination light beam EL1 from the light source is separated into a plurality of pieces, and the plurality of illumination light beams EL1 are guided to a plurality of illumination modules Group IL.

此處，從光源射出之照明光束EL1射入偏光分束器SP1、SP2。於偏光分束器SP1、SP2，為抑制因照明光束EL1之分離造成能量損失，以做成可將射入之照明光束EL1完全反射之光束較佳。此處，偏光分束器SP1、SP2係使為S偏光之直線偏光的光束反射、使為P偏光之直線偏光的光束透射。因此，光源係使射入偏光分束器SP1、SP2之照明光束EL1 成為直線偏光(S偏光)之光束的照明光束EL1射出至第1滾筒構件21。如此，光源即射出波長及相位一致之照明光束EL1。 Here, the illumination light beam EL1 emitted from the light source enters the polarizing beam splitters SP1 and SP2. In the polarizing beam splitters SP1 and SP2, in order to suppress the energy loss caused by the separation of the illumination beam EL1, it is preferable to make a beam that can completely reflect the incident illumination beam EL1. Here, the polarizing beam splitters SP1 and SP2 reflect linearly polarized light beams that are S-polarized light and transmit linearly polarized light beams that are P-polarized light. Therefore, the light source emits the illumination light beam EL1 that enters the polarization beam splitters SP1 and SP2 into a linearly polarized (S-polarized) light beam to the first roller member 21. In this way, the light source emits the illumination light beam EL1 having the same wavelength and phase.

偏光分束器SP1、SP2，在使來自光源之照明光束EL1反射之同時，使被圓筒光罩DM反射之成像光束(投影光束)EL2透射。換言之，來自照明光學模組之照明光束EL1作為反射光束射入偏光分束器SP1、SP2，來自圓筒光罩DM之成像光束EL2則作為透射光束射入偏光分束器SP1、SP2。 The polarizing beam splitters SP1 and SP2 transmit the imaging beam (projection beam) EL2 reflected by the cylindrical mask DM while reflecting the illumination beam EL1 from the light source. In other words, the illumination beam EL1 from the illumination optical module enters the polarizing beam splitters SP1 and SP2 as a reflected beam, and the imaging beam EL2 from the cylindrical mask DM enters the polarizing beam splitters SP1 and SP2 as a transmitted beam.

如前所述，為處理部之照明模組IL，進行使照明光束EL1反射至作為被處理物體之圓筒光罩DM上之既定圖案(光罩圖案)的處理。據此，投影光學系PL即能將在圓筒光罩DM上之照明區域IR中之圖案之像，投影至以搬送裝置9搬送之基板P之一部分(投影區域PA)。曝光裝置EX2，可藉由於圓筒光罩DM反射之投影光束，進行對在第1特定位置PX1、第2特定位置PX2之基板P照射曝光用光的處理。 As described above, the illumination module IL of the processing section performs a process of reflecting the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM as the object to be processed. According to this, the projection optical system PL can project the image of the pattern in the illumination area IR on the cylindrical mask DM onto a part of the substrate P (projection area PA) transferred by the transfer device 9. The exposure device EX2 can perform a process of irradiating exposure light to the substrate P at the first specific position PX1 and the second specific position PX2 by the projection beam reflected by the cylindrical mask DM.

(第5實施形態) (Fifth Embodiment)

其次，參照圖15說明本發明之處理裝置之第5實施形態，。圖15係顯示第5實施形態之處理裝置(曝光裝置)之整體構成的示意圖。此圖中，針對與第1實施形態至第4實施形態之構成要素相同之要素，係賦予相同符號並省略其說明。曝光裝置EX3具備複數個多邊形掃描單元PO1、PO2，各多邊形掃描單元PO一邊將來自紫外線雷射光源之光束點以高速掃描於基板P上與軸旋轉中心AX2平行之方向、一邊以未圖示之AOM(Acousto-Optic Modulator：聲光調變元件)等依據圖案描繪資料(CAD資料)進行光束之調變(On/Off)，據以將圖案描繪於基板P上。 Next, a fifth embodiment of the processing apparatus of the present invention will be described with reference to FIG. 15. 15 is a schematic diagram showing the overall configuration of a processing device (exposure device) according to a fifth embodiment. In this figure, the same elements as those of the first to fourth embodiments are given the same symbols and their description is omitted. The exposure device EX3 includes a plurality of polygonal scanning units PO1, PO2. Each polygonal scanning unit PO scans the beam spot from the ultraviolet laser light source at a high speed in a direction parallel to the axis rotation center AX2 on the substrate P. AOM (Acousto-Optic Modulator: Acousto-optic Modulator), etc., performs beam modulation (On/Off) based on pattern drawing data (CAD data), so as to draw the pattern on the substrate P.

曝光裝置EX3，係沒有圓筒光罩DM亦能對在第1特定位置PX1、第2特定位置PX2之基板P照射曝光用光(雷射點)以形成既定圖案之無光罩曝光裝置，除點掃描以外，亦可以是使用DMD(Digital Micro mirror Device)或SLM(Spatial light modulator：空間光調變器)描繪圖案之方式。 The exposure device EX3 is a maskless exposure device that can irradiate the substrate P at the first specific position PX1 and the second specific position PX2 with exposure light (laser point) to form a predetermined pattern without the cylindrical mask DM, except In addition to spot scanning, a pattern can be drawn using DMD (Digital Micro Mirror Device) or SLM (Spatial light modulator: spatial light modulator).

(第6實施形態) (Sixth embodiment)

其次，參照圖16說明本發明之處理裝置之第6實施形態。圖16係顯示第6實施形態之處理裝置(曝光裝置)之整體構成的示意圖。此圖中，針對與第1實施形態之構成要素相同之要素係賦予相同符號並省略其說明。 Next, a sixth embodiment of the processing apparatus of the present invention will be described with reference to FIG. 16. Fig. 16 is a schematic diagram showing the overall configuration of a processing device (exposure device) according to a sixth embodiment. In this figure, the same elements as those of the first embodiment are given the same symbols and their descriptions are omitted.

曝光裝置EX4，係所謂之對基板P施以近接曝光之處理裝置。曝光裝置EX4，將圓筒光罩DM與第2滾筒構件22之間設定為極微小之間隙，照明機構IU直接對基板P照射照明光束EL以進行非接觸曝光。本實施形態中，第2滾筒構件22係藉由包含電動馬達等致動器之第2驅動部36所供應之扭矩而旋轉。以和第2驅動部36之旋轉方向相反之方式，由例如以磁齒輪連結之驅動輥MGG驅動第1滾筒構件21。第2驅動部36旋轉第2滾筒構件22，並將驅動輥MGG與第1滾筒構件21加以連結，使第1滾筒構件21(圓筒光罩DM)與第2滾筒構件22同步移動(同步旋轉)。 The exposure device EX4 is a so-called processing device that applies close exposure to the substrate P. The exposure device EX4 sets a very small gap between the cylindrical mask DM and the second roller member 22, and the illumination mechanism IU directly irradiates the substrate P with the illumination light beam EL to perform non-contact exposure. In the present embodiment, the second roller member 22 is rotated by the torque supplied by the second driving unit 36 including an actuator such as an electric motor. The first roller member 21 is driven by, for example, a driving roller MGG connected with a magnetic gear so as to be opposite to the rotation direction of the second driving part 36. The second driving unit 36 rotates the second roller member 22, connects the driving roller MGG and the first roller member 21, and moves the first roller member 21 (cylindrical mask DM) in synchronization with the second roller member 22 (synchronous rotation ).

又，曝光裝置EX4，具備檢測相對基板P照明光束(成像光束)EL之主光線射入基板P之特定位置之標尺部GP之位置PX6的編碼器讀頭EN6。此處，由於有使第2滾筒構件22之外周面中捲繞基板P之外周面之直徑與標尺圓盤SD之標尺部GP之直徑一致，因此，從第2中心軸AX2看，位置PX6與上述特定位置一致。此外，編碼器讀頭EN7係設定在朝向基板P搬送方向之後方側將編碼器讀頭EN6之設置方位線Le6繞旋轉中心 線AX2旋轉大致90°之設置方位線Le7上。 In addition, the exposure device EX4 includes an encoder read head EN6 that detects the position PX6 of the scale portion GP of the specific position of the substrate P where the chief ray of the illumination beam (imaging beam) EL of the substrate P enters the substrate P. Here, since the diameter of the outer peripheral surface of the wound substrate P on the outer peripheral surface of the second roller member 22 matches the diameter of the scale portion GP of the scale disc SD, the position PX6 is the same as that seen from the second central axis AX2 The above specific positions are consistent. In addition, the encoder head EN7 is set on the setting direction line Le7 that rotates the setting azimuth line Le6 of the encoder head EN6 approximately 90° around the rotation center line AX2 toward the rear side of the substrate P transport direction.

本實施形態之曝光裝置EX4，以編碼器讀頭EN7為第1讀取裝置、以編碼器讀頭EN6為第2讀取裝置，而將從標尺部GP之讀取輸出求出之第2滾筒構件22之軸之位置與特定位置加以連結、且對與軸正交之方向之變位成分，施以以第1讀取裝置之讀取輸出加以修正之處理。 The exposure device EX4 of this embodiment uses the encoder head EN7 as the first reading device and the encoder head EN6 as the second reading device, and the second roller obtained from the reading output of the scale section GP The position of the shaft of the member 22 is connected to a specific position, and the displacement component in the direction orthogonal to the shaft is subjected to a process of correcting the reading output of the first reading device.

以上之第1至第6實施形態中，作為處理裝置係以曝光裝置為例做了說明。但作為處理裝置並不限於曝光裝置，但亦可以是處理部為以噴墨之墨滴下裝置將圖案印刷至被處理物體基板P之裝置。此外，處理部亦可以是檢査裝置。 In the above first to sixth embodiments, the exposure device has been described as an example of the processing device. However, the processing device is not limited to the exposure device, but the processing unit may be a device that prints a pattern on the substrate P to be processed with an inkjet ink dropping device. In addition, the processing unit may be an inspection device.

<元件製造方法> <Component manufacturing method>

其次，參照圖17說明元件製造方法。圖17係顯示使用第1實施形態之處理裝置(曝光裝置)之元件製造方法的流程圖。 Next, the element manufacturing method will be described with reference to FIG. 17. FIG. 17 is a flowchart showing a device manufacturing method using the processing device (exposure device) of the first embodiment.

圖17所示之元件製造方法，首先，係進行例如使用有機EL等自發光元件之顯示面板之功能、性能設計，以CAD等設計所需之電路圖案及配線圖案(步驟S201)。接著，根據以CAD等設計之各種的每一層圖案，製作所需層量之圓筒光罩DM(步驟S202)。並準備捲繞有作為顯示面板之基材之可撓性基板P(樹脂薄膜、金屬箔膜、塑膠等)的供應用捲筒FR1(步驟S203)。又，於此步驟S203中準備之捲筒狀基板P，可以是視需要將其表面改質者、或事前已形成底層(例如透過印記(imprint)方式之微小凹凸)者、或預先積層有光感應性之功能膜或透明膜(絶緣材料)者。 The device manufacturing method shown in FIG. 17 first performs function and performance design of a display panel using self-luminous elements such as organic EL, and designs circuit patterns and wiring patterns required by CAD or the like (step S201). Next, a cylindrical mask DM of a desired layer amount is manufactured according to various patterns of each layer designed by CAD or the like (step S202). And a roll FR1 for supplying the flexible substrate P (resin film, metal foil film, plastic, etc.) serving as the base material of the display panel is prepared (step S203). In addition, the roll substrate P prepared in this step S203 may be the one whose surface has been modified as necessary, or the bottom layer (for example, micro unevenness by imprint) has been formed in advance, or the light is previously deposited Inductive functional film or transparent film (insulating material).

接著，於基板P上形成由構成顯示面板之電極及配線、絶緣膜、TFT(薄膜半導體)等構成之底板(backplane)層，並以積層於該底板層之方 式形成由有機EL等自發光元件構成之發光層(顯示像素部)(步驟S204)。於此步驟S204中，亦包使用先前之各實施形態中說明之曝光裝置EX、EX2、EX3、EX4來使光阻層曝光之習知微影製程，但亦包含取代光阻而將塗有感光性矽烷耦合劑之基板P予以圖案曝光來於表面形成親撥水性之圖案的曝光製程、使光感應性之觸媒層圖案曝光後以無電電鍍法形成金屬膜之圖案(配線、電極等)的濕式製程、或以含有銀奈米粒子之導電性墨水等描繪圖案的印刷製程、等之處理。 Next, a backplane layer composed of electrodes and wiring constituting the display panel, an insulating film, a TFT (thin film semiconductor), and the like is formed on the substrate P, and a self-luminous element such as an organic EL is formed by layering on the backplane layer The configured light-emitting layer (display pixel portion) (step S204). In this step S204, the conventional photolithography process for exposing the photoresist layer using the exposure devices EX, EX2, EX3, and EX4 described in the previous embodiments is also included, but it also includes replacing the photoresist and applying the photosensitive The substrate P of the reactive silane coupling agent is subjected to pattern exposure to form a water-repellent pattern on the surface. After exposing the photosensitive catalyst layer pattern, the pattern of the metal film (wiring, electrodes, etc.) is formed by electroless plating. Wet process, or printing process of drawing patterns with conductive ink containing silver nanoparticles, etc.

其次，就以捲筒方式於長條狀基板P上連續製造之每一顯示面板元件切割基板P、或於各顯示面板元件之表面貼合保護薄膜(對環境障壁層)及彩色濾光片等，以組裝元件(步驟S205)。接著，進行顯示面板元件是否可正常運作、或是否滿足所欲性能及特性等的檢査步驟(步驟S206)。採上述方式，即能製造顯示面板(可撓性顯示器)。 Secondly, each display panel element continuously manufactured on the elongated substrate P in the form of a roll cuts the substrate P, or a protective film (barrier to the environment) and color filters are attached to the surface of each display panel element To assemble components (step S205). Next, an inspection step is performed to determine whether the display panel element can operate normally or whether it satisfies the desired performance and characteristics (step S206). With the above method, a display panel (flexible display) can be manufactured.

9‧‧‧搬送裝置 9‧‧‧Conveying device

12‧‧‧光罩保持裝置 12‧‧‧ Mask Holder

13‧‧‧光源裝置 13‧‧‧Light source device

14‧‧‧控制裝置 14‧‧‧Control device

21‧‧‧第1滾筒構件 21‧‧‧The first roller component

22‧‧‧第2滾筒構件 22‧‧‧The second roller component

23‧‧‧導輥 23‧‧‧Guide roller

24‧‧‧驅動輥 24‧‧‧Drive roller

25‧‧‧第1檢測器 25‧‧‧The first detector

26‧‧‧第1驅動部 26‧‧‧First drive unit

31‧‧‧第1導件 31‧‧‧First guide

32‧‧‧第2導件 32‧‧‧The second guide

33‧‧‧第3導件 33‧‧‧The third guide

35‧‧‧第2檢測器 35‧‧‧Second detector

36‧‧‧第2驅動部 36‧‧‧ 2nd drive unit

60‧‧‧溫度調節裝置 60‧‧‧Temperature adjustment device

61‧‧‧導件 61‧‧‧Guide

62‧‧‧媒體送風構件 62‧‧‧Media supply components

63‧‧‧送風壓力均勻化構件 63‧‧‧Supply air pressure equalization component

67‧‧‧空間 67‧‧‧Space

71‧‧‧媒體調節裝置 71‧‧‧Media adjustment device

72H、72C、74H、74C‧‧‧流量調整閥 72H, 72C, 74H, 74C‧‧‧Flow regulating valve

73‧‧‧基板支承構件溫度調節裝置 73‧‧‧Substrate supporting member temperature regulating device

AD‧‧‧媒體供應管線 AD‧‧‧media supply pipeline

AM1、AM2‧‧‧觀察方向 AM1, AM2‧‧‧ Observation direction

AMG1、AMG2、PMG1‧‧‧對準顯微鏡 AMG1, AMG2, PMG1 ‧‧‧ alignment microscope

AP‧‧‧媒體供應管線 AP‧‧‧Media supply pipeline

AX1、AX2‧‧‧旋轉中心線 AX1, AX2‧‧‧Rotation centerline

CC‧‧‧媒體供應管線 CC‧‧‧Media supply pipeline

CU‧‧‧冷卻單元 CU‧‧‧cooling unit

DM‧‧‧圓筒光罩 DM‧‧‧Cylinder Mask

DR6、DR4‧‧‧驅動輥 DR6, DR4‧‧‧ drive roller

EL1‧‧‧照明光束 EL1‧‧‧Illumination beam

EL2‧‧‧成像光束 EL2‧‧‧Imaging beam

EX‧‧‧曝光裝置(基板處理裝置) EX‧‧‧Exposure device (substrate processing device)

HH‧‧‧媒體供應管線 HH‧‧‧Media supply pipeline

HU‧‧‧加熱單元 HU‧‧‧Heating unit

IA‧‧‧搬送方向進入位置 IA‧‧‧Transport direction into position

IL‧‧‧照明模組 IL‧‧‧Lighting Module

IR‧‧‧照明區域 IR‧‧‧Illuminated area

IU‧‧‧照明機構 IU‧‧‧Lighting agency

OA‧‧‧搬送方向脫離位置 OA‧‧‧Transport direction is out of position

P‧‧‧基板 P‧‧‧Substrate

P1‧‧‧第1面 P1‧‧‧The first side

P2‧‧‧第2面 P2‧‧‧The second side

P2‧‧‧中心面 P2‧‧‧Center

PA(PA1~PA6)‧‧‧投影區域 PA(PA1~PA6)‧‧‧Projection area

PL(PL1~PL6)‧‧‧投影光學系 PL(PL1~PL6)‧‧‧Projection optics

PM1‧‧‧檢測方向 PM1‧‧‧Detection direction

PX‧‧‧特定位置 PX‧‧‧ specific location

PX1、PX2‧‧‧第1、第2特定位置 PX1, PX2‧‧‧First and second specific positions

T1、T2‧‧‧溫度測量裝置 T1, T2‧‧‧Temperature measuring device

Claims (9)

一種基板處理裝置，係於可撓性長條狀之基板上形成用以構成電子元件之圖案，具備：基板支承構件，具有支承該基板之長條方向之一部分之彎曲的支承面，將該基板於該長條方向沿該彎曲的支承面以既定速度連續搬送；處理裝置，在被該基板支承構件之該彎曲的支承面支承之該基板形成該圖案；第1溫度調節裝置，將該基板支承構件之該彎曲的支承面調整為第1溫度；以及第2溫度調節裝置，於該基板之搬送方向設於該基板支承構件之上游側，將在該上游側之該基板之溫度調整為與該第1溫度不同之第2溫度，該第2溫度與該第1溫度之溫度差，係視藉由該處理裝置形成該圖案時所需要之該基板之伸縮量而設定之溫度差。 A substrate processing device is formed on a flexible elongated substrate to form a pattern for forming an electronic component, comprising: a substrate support member having a curved support surface that supports a portion of the substrate in the longitudinal direction, and the substrate Continuous transport at a predetermined speed along the curved support surface in the longitudinal direction; the processing device forms the pattern on the substrate supported by the curved support surface of the substrate support member; the first temperature adjustment device supports the substrate The curved support surface of the member is adjusted to the first temperature; and a second temperature adjustment device is provided on the upstream side of the substrate support member in the transport direction of the substrate, and the temperature of the substrate on the upstream side is adjusted to the temperature The second temperature, which is different from the first temperature, and the temperature difference between the second temperature and the first temperature depends on the amount of expansion and contraction of the substrate required for forming the pattern by the processing device. 如申請專利範圍第1項之基板處理裝置，其中，該基板支承構件係旋轉滾筒，該旋轉滾筒具有從中心軸以一定半徑彎曲成圓筒面狀之外周面以作為該彎曲的支承面，一邊將該基板之長條方向之一部分沿該外周面支承為圓筒面狀、一邊繞該中心軸旋轉將該基板搬送於長條方向。 A substrate processing apparatus as claimed in item 1 of the patent application, wherein the substrate support member is a rotating drum having an outer peripheral surface bent into a cylindrical shape with a certain radius from a central axis as the curved supporting surface, one side A part of the substrate in the longitudinal direction is supported in a cylindrical shape along the outer peripheral surface, and the substrate is transported in the longitudinal direction while rotating around the central axis. 如申請專利範圍第2項之基板處理裝置，其中，具備：第1圖案檢測裝置，在該基板與該旋轉滾筒之外周面開始接觸之進入位置與從該外周面開始脫離之脫離位置之周方向之範圍內，檢測沿該長條方向於該基板上離散或連續形成之特定圖案；以及第2圖案檢測裝置，配置在該旋轉滾筒之該進入位置之上游側，檢測 形成於被該第2溫度調節裝置溫度調整後之該基板之該特定圖案；以及控制裝置，根據該第1圖案檢測裝置及該第2圖案檢測裝置之檢測結果，控制該第2溫度調節裝置。 A substrate processing device as claimed in item 2 of the patent application, which includes: a first pattern detection device in the circumferential direction of the entry position where the substrate comes into contact with the outer peripheral surface of the rotating drum and the detachment position starting from the outer peripheral surface Within the range, detecting specific patterns discretely or continuously formed on the substrate along the longitudinal direction; and a second pattern detecting device, which is arranged on the upstream side of the entrance position of the rotating drum, to detect The specific pattern formed on the substrate after temperature adjustment by the second temperature adjustment device; and the control device controls the second temperature adjustment device based on the detection results of the first pattern detection device and the second pattern detection device. 如申請專利範圍第3項之基板處理裝置，其中，該控制裝置，係以將該旋轉滾筒之溫度保持一定之方式控制該第1溫度調節裝置。 For example, in the substrate processing device of claim 3, the control device controls the first temperature adjustment device in such a manner that the temperature of the rotary drum is kept constant. 如申請專利範圍第4項之基板處理裝置，其中，該控制裝置，係以獲得藉由該處理裝置將該圖案形成於該基板上時所需要之該基板之伸縮量之方式，將被該第1溫度調節裝置調整之該旋轉滾筒之溫度與被該第2溫度調節裝置調整之該基板之溫度之溫度差控制成一定。 The substrate processing device as claimed in item 4 of the patent scope, wherein the control device is used to obtain the amount of expansion and contraction of the substrate that is required when the pattern is formed on the substrate by the processing device. 1 The temperature difference between the temperature of the rotating drum adjusted by the temperature adjusting device and the temperature of the substrate adjusted by the second temperature adjusting device is controlled to be constant. 如申請專利範圍第5項之基板處理裝置，其中，該處理裝置，具有將形成於該基板之該圖案之倍率微幅修正之倍率修正功能、或將該圖案之位置微幅位移之位移修正功能；該控制裝置，以藉由該處理裝置之該圖案形成時所需要之該基板之伸縮量成為以該倍率修正功能或該位移修正功能所能修正之容許範圍之方式，控制該第1溫度調節裝置而調整該旋轉滾筒之溫度。 A substrate processing device as claimed in item 5 of the patent application, wherein the processing device has a magnification correction function for finely correcting the magnification of the pattern formed on the substrate, or a displacement correction function for slightly displacing the position of the pattern The control device controls the first temperature adjustment in such a manner that the amount of expansion and contraction of the substrate required by the patterning of the processing device becomes an allowable range that can be corrected by the magnification correction function or the displacement correction function Device to adjust the temperature of the rotating drum. 如申請專利範圍第6項之基板處理裝置，其中，該處理裝置，係將形成於光罩後之該圖案透過包含倍率修正機構與像位移機構之投影光學系統轉印至該基板之投影曝光裝置。 A substrate processing device as claimed in item 6 of the patent scope, wherein the processing device is a projection exposure device that transfers the pattern formed behind the photomask to the substrate through a projection optical system including a magnification correction mechanism and an image displacement mechanism . 如申請專利範圍第1至5項中任一項之基板處理裝置，其中，該處理裝置，係將形成於光罩後之該圖案轉印至該基板之曝光裝置、或根據該圖案之CAD資料將該圖案描繪於該基板之無光罩曝光裝置。 The substrate processing apparatus as described in any one of the patent application items 1 to 5, wherein the processing apparatus is an exposure apparatus that transfers the pattern formed after the photomask to the substrate, or CAD data based on the pattern The pattern is drawn on the maskless exposure device of the substrate. 如申請專利範圍第1至5項中任一項之基板處理裝置，其中，該處 理裝置，係以噴墨之墨滴下將圖案印刷至該基板之裝置。 The substrate processing apparatus as claimed in any one of items 1 to 5 of the patent application scope, where A processing device is a device that prints a pattern onto the substrate by dropping inkjet ink.
TW107139691A 2012-09-14 2013-09-09 Substrate processing device TWI692677B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012203578 2012-09-14
JPJP2012-203578 2012-09-14

Publications (2)

Publication Number Publication Date
TW201908876A TW201908876A (en) 2019-03-01
TWI692677B true TWI692677B (en) 2020-05-01

Family

ID=50278066

Family Applications (4)

Application Number Title Priority Date Filing Date
TW102132344A TWI606306B (en) 2012-09-14 2013-09-09 Substrate processing apparatus and device manufacturing method
TW109111014A TWI724850B (en) 2012-09-14 2013-09-09 Substrate processing device and component manufacturing method
TW107139691A TWI692677B (en) 2012-09-14 2013-09-09 Substrate processing device
TW106129763A TWI645262B (en) 2012-09-14 2013-09-09 Substrate processing device and component manufacturing method

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW102132344A TWI606306B (en) 2012-09-14 2013-09-09 Substrate processing apparatus and device manufacturing method
TW109111014A TWI724850B (en) 2012-09-14 2013-09-09 Substrate processing device and component manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106129763A TWI645262B (en) 2012-09-14 2013-09-09 Substrate processing device and component manufacturing method

Country Status (6)

Country Link
JP (4) JP6256338B2 (en)
KR (5) KR101890099B1 (en)
CN (2) CN104620178B (en)
HK (1) HK1207162A1 (en)
TW (4) TWI606306B (en)
WO (1) WO2014041941A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK3120107T3 (en) * 2014-03-21 2019-03-18 Carpe Diem Tech Inc System and method for producing miniature structures on a flexible substrate
TWI639064B (en) * 2014-04-01 2018-10-21 日商尼康股份有限公司 Substrate processing device and element manufacturing method
JP6311450B2 (en) * 2014-05-23 2018-04-18 株式会社ニコン Transport device
WO2016013417A1 (en) * 2014-07-23 2016-01-28 株式会社ニコン Cylindrical-member-position detection device, substrate processing device, device manufacturing method, and sheet substrate conveying device
TWI736147B (en) * 2015-06-17 2021-08-11 日商尼康股份有限公司 Pattern drawing device
JP6942555B2 (en) * 2017-08-03 2021-09-29 東京エレクトロン株式会社 Board processing method, computer storage medium and board processing system
JP6516030B2 (en) * 2018-03-05 2019-05-22 株式会社ニコン Pattern formation method
JP6680376B2 (en) * 2019-03-06 2020-04-15 株式会社ニコン Pattern forming equipment
CN109884861A (en) * 2019-03-26 2019-06-14 中山新诺科技股份有限公司 A kind of flexible board double-sided laser direct write digitized exposure machine
JP7370019B2 (en) * 2019-06-07 2023-10-27 パナソニックＩｐマネジメント株式会社 Input devices and input systems
JP7004016B2 (en) * 2020-02-28 2022-01-21 株式会社ニコン Pattern forming device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002072492A (en) * 2000-08-31 2002-03-12 Asahi Kogyosha Co Ltd Temperature control method for planar work and device for the same
JP2004258665A (en) * 2003-02-27 2004-09-16 Heidelberger Druckmas Ag Apparatus for controlling temperature of exposure drum in printing plate exposer
JP2011248381A (en) * 2011-08-29 2011-12-08 Asahikogyosha Co Ltd Nozzle structure for glass substrate temperature adjustment
TW201234509A (en) * 2010-12-15 2012-08-16 Nikon Corp Substrate processing system and display element manufacturing method

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651319A (en) * 1979-10-01 1981-05-08 Unitika Ltd Manufacture of nylon embossed film
JPS5922932A (en) * 1982-07-30 1984-02-06 Teijin Ltd Preparation of thin film
JPS60158626A (en) * 1984-01-30 1985-08-20 Canon Inc Semiconductor exposure device
JP2938799B2 (en) * 1996-03-11 1999-08-25 信越ポリマー株式会社 Plastic sheet for remote control face
JP2001308003A (en) * 2000-02-15 2001-11-02 Nikon Corp Exposure method and system, and method of device manufacturing
JP4308458B2 (en) * 2001-09-25 2009-08-05 富士フイルム株式会社 Image recording device
JP4052558B2 (en) * 2002-05-13 2008-02-27 富士フイルム株式会社 Method and apparatus for manufacturing optical compensation sheet
JP2004296773A (en) * 2003-03-27 2004-10-21 Dainippon Printing Co Ltd Method and device for controlling temperature of substrate
JP4376128B2 (en) * 2003-05-23 2009-12-02 大日本印刷株式会社 Optical sheet and manufacturing method thereof
DE10353029B3 (en) * 2003-11-13 2004-08-19 Heidelberger Druckmaschinen Ag Displacement spindle length variation measuring method, for printing plate exposure device, uses measurement of stepping motor clock pulses for displacement of exposure head carrier along reference path
JP4669760B2 (en) * 2004-09-14 2011-04-13 芝浦メカトロニクス株式会社 Substrate processing apparatus and processing method
JP2006098727A (en) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd Long flexible recording medium provided with detecting means for contraction/expansion state, and method and apparatus capable of drawing image by correcting contraction/expanding state of the flexible recording medium
JP2006098719A (en) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd Exposure apparatus
US7375795B2 (en) * 2004-12-22 2008-05-20 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7100510B2 (en) * 2005-02-09 2006-09-05 Eastman Kodak Company Method for registering patterns on a web
CN100541719C (en) * 2005-04-25 2009-09-16 株式会社尼康 Exposure method and exposure device and device making method
JP5181451B2 (en) 2006-09-20 2013-04-10 株式会社ニコン Mask, exposure apparatus, exposure method, and device manufacturing method
US20080229941A1 (en) * 2007-03-19 2008-09-25 Babak Heidari Nano-imprinting apparatus and method
KR20090120136A (en) * 2008-05-19 2009-11-24 삼성전기주식회사 Device for imprinting
JP2010118557A (en) * 2008-11-13 2010-05-27 Canon Inc Exposure apparatus, substrate processing apparatus, lithography system, and device manufacturing method
JP2010155439A (en) * 2009-01-05 2010-07-15 Asahi Kasei Corp Method for manufacturing polymer sheet having irregular pattern
JP5282895B2 (en) * 2009-03-06 2013-09-04 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US8264666B2 (en) 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device
JP2011221536A (en) * 2010-04-13 2011-11-04 Nikon Corp Mask moving device, exposure device, substrate processor and device manufacturing method
JP2012099638A (en) * 2010-11-02 2012-05-24 Fujifilm Corp Curable composition for imprint
JP5424271B2 (en) 2010-11-08 2014-02-26 株式会社ブイ・テクノロジー Exposure equipment
JP2012203151A (en) * 2011-03-24 2012-10-22 Hitachi High-Technologies Corp Film substrate exposure device and film substrate exposure method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002072492A (en) * 2000-08-31 2002-03-12 Asahi Kogyosha Co Ltd Temperature control method for planar work and device for the same
JP2004258665A (en) * 2003-02-27 2004-09-16 Heidelberger Druckmas Ag Apparatus for controlling temperature of exposure drum in printing plate exposer
TW201234509A (en) * 2010-12-15 2012-08-16 Nikon Corp Substrate processing system and display element manufacturing method
JP2011248381A (en) * 2011-08-29 2011-12-08 Asahikogyosha Co Ltd Nozzle structure for glass substrate temperature adjustment

Also Published As

Publication number Publication date
CN106933065B (en) 2019-03-05
TW201809906A (en) 2018-03-16
KR20180127548A (en) 2018-11-28
KR101908269B1 (en) 2018-10-15
JP6540774B2 (en) 2019-07-10
KR20150056547A (en) 2015-05-26
HK1207162A1 (en) 2016-01-22
KR101861904B1 (en) 2018-05-28
JPWO2014041941A1 (en) 2016-08-18
KR101890099B1 (en) 2018-08-20
TW201411298A (en) 2014-03-16
KR101973349B1 (en) 2019-04-26
JP2019061279A (en) 2019-04-18
JP6780742B2 (en) 2020-11-04
TWI645262B (en) 2018-12-21
KR101923360B1 (en) 2018-11-28
TWI606306B (en) 2017-11-21
KR20180033595A (en) 2018-04-03
JP6690697B2 (en) 2020-04-28
KR20180079476A (en) 2018-07-10
JP6256338B2 (en) 2018-01-10
TW201908876A (en) 2019-03-01
TW202026775A (en) 2020-07-16
CN106933065A (en) 2017-07-07
TWI724850B (en) 2021-04-11
CN104620178B (en) 2016-10-26
JP2018045248A (en) 2018-03-22
CN104620178A (en) 2015-05-13
JP2019152885A (en) 2019-09-12
WO2014041941A1 (en) 2014-03-20
KR20180112881A (en) 2018-10-12

Similar Documents

Publication Publication Date Title
TWI692677B (en) Substrate processing device
US20190025713A1 (en) Substrate processing apparatus, processing apparatus, and method for manufacturing device
JP6074898B2 (en) Substrate processing equipment
JP6816814B2 (en) Scanning exposure method
JP6337486B2 (en) Substrate processing equipment
JP6500968B2 (en) Substrate processing equipment
JP6531622B2 (en) Cylindrical mask, exposure system
JP6658938B2 (en) Substrate processing equipment