TWI677392B - Marking device - Google Patents
Marking device Download PDFInfo
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- TWI677392B TWI677392B TW105130653A TW105130653A TWI677392B TW I677392 B TWI677392 B TW I677392B TW 105130653 A TW105130653 A TW 105130653A TW 105130653 A TW105130653 A TW 105130653A TW I677392 B TWI677392 B TW I677392B
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- drawing pattern
- marking
- pattern
- laser
- spot diameter
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
Abstract
本發明提供一種可以簡單構成實現高速且精細地描繪之標記裝置。 具體而言，標記裝置1包含：雷射加工部3，其以第1點徑303及點徑小於第1點徑303之第2點徑304對薄膜100進行標記；致動器71，其變更雷射加工部3之點徑；及作為部分描繪圖案登錄部之裝置PC7，其登錄構成整體描繪圖案113之一部分、且以上述第1點徑303描繪之第1描繪圖案115，及構成整體描繪圖案113之一部分、且以第2點徑304描繪之第2描繪圖案117。The present invention provides a marking device which can be simply constructed to achieve high-speed and fine drawing. Specifically, the marking device 1 includes a laser processing unit 3 that marks the film 100 with a first point diameter 303 and a second point diameter 304 that is smaller than the first point diameter 303, and an actuator 71 that changes The spot diameter of the laser processing section 3; and the device PC7, which is a partial drawing pattern registration section, registers a first drawing pattern 115 constituting a part of the overall drawing pattern 113 and drawing with the above-mentioned first point diameter 303, and constituting the overall drawing A second drawing pattern 117 which is a part of the pattern 113 and is drawn with the second dot diameter 304.
Description
本發明係關於一種標記裝置。The invention relates to a marking device.
標記裝置係對半導體器件或液晶顯示器用基板、電子零件等被加工物印上(標記)文字、記號、圖形、配線圖案等之特定形狀之裝置。 作為具體之標記裝置，已提出一種使雷射光聚焦為特定之點徑一面照射於被加工物之表面一面於2維方向掃描，而於被加工物之表面標記文字或圖形之雷射標記裝置(例如、專利文獻1)。 又，作為雷射標記裝置之構成，亦已知有將自1台雷射單元所照射之1束脈衝雷射光分為複數條光路而進行加工之構成(例如、專利文獻2)。 進而，作為雷射標記裝置之構成，已提出一種於在3維之加工面上雷射印字時，根據自聚焦透鏡至加工面之距離而調整雷射之點徑之構成(例如、專利文獻3)。 另一方面，專利文獻1～3所示之技術有加工精度與作業時間之縮短難以併存之問題。 具體而言，如專利文獻1、3所示之技術，雖然於標記使用之雷射之點徑愈大，作業時間愈縮短，但由於無法進行精細之圖案描繪，故有加工精度劣化之問題。另一方面，由於標記使用之點徑愈小，愈可進行精細之圖案描繪，故可提高加工精度，但加工時間變長，而有難以縮短作業時間之問題。 又，如專利文獻2所示，將來自1個雷射光源之複數之雷射光分為複數條光路而標記之技術，與僅使用1條光路進行標記之情形相比雖可縮短作業時間，但有無法提高加工精度之問題，又有於加工精度與作業時間之縮短成為取捨關係之方面不變之問題。 因此，提出一種組合以各不同之點徑進行描繪之複數個雷射單元，高速且精細地進行標記之裝置(專利文獻4)。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2005-66611號公報 [專利文獻2]日本專利特開2005-74479號公報 [專利文獻3]日本專利特開2009-285693號公報 [專利文獻4]日本專利特開2015-160235號公報A marking device is a device that prints (marks) characters, symbols, graphics, wiring patterns, and other specific shapes on a workpiece such as a semiconductor device, a substrate for a liquid crystal display, or an electronic component. As a specific marking device, a laser marking device has been proposed that focuses laser light to a specific point diameter while scanning the surface of a workpiece while scanning in a two-dimensional direction, and marks characters or graphics on the surface of the workpiece ( For example, Patent Document 1). In addition, as a configuration of a laser marking device, a configuration in which one pulse laser light irradiated from one laser unit is divided into a plurality of optical paths and processed is known (for example, Patent Document 2). Furthermore, as a configuration of a laser marking device, a configuration has been proposed in which the laser spot diameter is adjusted according to the distance from the self-focusing lens to the processing surface when laser printing is performed on a three-dimensional processing surface (for example, Patent Document 3) ). On the other hand, the technologies shown in Patent Documents 1 to 3 have a problem that it is difficult to coexist with a reduction in processing accuracy and a reduction in working time. Specifically, as shown in Patent Documents 1 and 3, although the larger the spot diameter of the laser used for marking, the shorter the working time, but the fine pattern drawing cannot be performed, and therefore there is a problem that the processing accuracy deteriorates. On the other hand, the smaller the diameter of the point used by the marker, the finer the pattern can be drawn, so that the processing accuracy can be improved, but the processing time becomes longer and it is difficult to shorten the working time. Moreover, as shown in Patent Document 2, the technology of dividing a plurality of laser light from one laser light source into a plurality of optical paths and marking them can reduce the working time as compared with the case of marking using only one optical path, but There is a problem that the processing accuracy cannot be improved, and there is a problem that the shortening of the processing accuracy and the operation time becomes the same as the trade-off relationship. Therefore, a device is proposed that combines a plurality of laser units that draw at different point diameters to perform high-speed and fine marking (Patent Document 4). [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2005-66611 [Patent Literature 2] Japanese Patent Laid-Open No. 2005-74479 [Patent Literature 3] Japanese Patent Laid-Open No. 2009-285693 Gazette [Patent Document 4] Japanese Patent Laid-Open No. 2015-160235
[發明欲解決之問題] 於專利文獻4所記載之裝置於可同時實現加工精度之提高與作業時間之縮短方面有用。 另一方面，專利文獻4所記載之裝置，若不始終將複數個雷射單元之描繪位置精度設為固定，則有於以各雷射單元描繪之圖案中產生描繪遺漏(空隙)之虞。因此，有必須於各雷射單元間進行複雜之精度校正作業之問題。 進而，專利文獻4所記載之裝置，需要複數個雷射單元，於因描繪之圖案較小等之理由而僅需使用點徑較小之雷射單元之情形時，由於不使用點徑較大之雷射單元，故成為無用之構成。因此，有對於所描繪之圖案之裝置構成變得複雜、昂貴之情形之問題。 本發明係鑒於上述課題而完成者，其目的在於提供一種可以簡單構成實現高速且精細地描繪之標記裝置。 [解決問題之技術手段] 為了解決上述之課題，本發明之1態樣係一種標記裝置，其係於設定於被加工物之標記區域描繪特定之描繪圖案者，且包含：標記部，其以第1點徑及點徑小於上述第1點徑之第2點徑對上述被加工物進行標記；可變部，其變更上述標記部之點徑；及部分描繪圖案登錄部，其登錄構成上述描繪圖案之一部分、且以上述第1點徑描繪之第1描繪圖案，及構成上述描繪圖案之一部分且、以上述第2點徑描繪之第2描繪圖案。 [發明之效果] 根據本發明，可提供一種可以簡單構成實現高速且精細地描繪之標記裝置。[Problems to be Solved by the Invention] The device described in Patent Document 4 is useful in that both an improvement in processing accuracy and a reduction in working time can be achieved. On the other hand, in the device described in Patent Document 4, if the drawing position accuracy of a plurality of laser units is not always fixed, there is a possibility that a drawing omission (void) may occur in a pattern drawn by each laser unit. Therefore, there is a problem that a complicated accuracy correction operation must be performed between the laser units. Furthermore, the device described in Patent Document 4 requires a plurality of laser units, and when only a laser unit with a small spot diameter is used due to reasons such as a small drawing pattern, a large spot diameter is not used. The laser unit has become useless. Therefore, there is a problem that the device configuration of the drawn pattern becomes complicated and expensive. The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a marking device that can be simply configured to achieve high-speed and fine drawing. [Technical Means for Solving the Problem] In order to solve the above-mentioned problem, one aspect of the present invention is a marking device for drawing a specific drawing pattern in a marking area set on a workpiece, and including: a marking section, A first point diameter and a second point diameter smaller than the first point diameter mark the workpiece; a variable section that changes the point diameter of the marking section; and a partial drawing pattern registration section whose registration constitutes the above A first drawing pattern in which a part of the drawing pattern is drawn and drawn in the first dot diameter, and a second drawing pattern in which a part of the drawing pattern is drawn and is drawn in the second dot diameter. [Effects of the Invention] According to the present invention, it is possible to provide a marking device that can be simply configured to achieve high-speed and fine drawing.
以下，參照圖式詳細地說明於本發明較佳之實施形態。 首先，參照圖1及圖2對本實施形態之標記裝置1之構成進行說明。 此處作為標記裝置1，係例示對作為被加工物之薄膜100之表面使用雷射進行標記之雷射標記裝置。 具體而言，圖1所示之標記裝置1具備作為標記部之雷射加工部3。進而，圖2所示之裝置PC7係作為PLC(Programmable Logic Controller:可程式化邏輯控制器)37，且作為控制標記之控制裝置而動作。 雷射加工部3可藉由第1點徑303及點徑小於第1點徑303之第2點徑304，對薄膜100進行標記(參照圖5)。 其中，裝置PC7具有控制部6與記憶部7a，記憶部7a具有：儲存區域12，其儲存所標記之整體之圖案形狀之資訊即整體描繪圖案113(參照圖6)；第1部分儲存區域14，其儲存雷射加工部3以第1點徑303描繪之第1圖案115(參照圖8)；及第2部分儲存區域16，其儲存雷射加工部3以第2點徑304描繪之第2圖案117(參照圖9)。如此，於記憶部7a，登錄自整體描繪圖案113產生之第1描繪圖案115及第2描繪圖案117。因此，裝置PC7係作為事先登錄第1描繪圖案115及第2描繪圖案117之部分描繪圖案登錄部而動作。 進而，裝置PC7亦作為設定第2描繪圖案117之輪廓圖案120(參照圖9)之行數的輪廓行數設定部而動作。 又，裝置PC7亦作為設定第1描繪圖案115與第2描繪圖案117之重疊量Vx、Vy(參照圖11)的重疊量設定部而動作，亦作為設定第1描繪圖案115之緣部相對於整體描繪圖案113之緣部313之偏移量Gx、Gy(參照圖11)的偏移量設定部而動作。 如此，於本實施形態中由於由裝置PC7進行整體描繪圖案113之登錄、及自整體描繪圖案113產生第1描繪圖案115及第2描繪圖案117之處理，故裝置PC7具有作為整體描繪圖案登錄部及部分描繪圖案產生部之功能。 參照圖1～5，對標記裝置1之構成進而詳細地說明。 如圖1及圖2所示般，標記裝置1具有：捲出器11，其捲出薄膜100；及捲取器13，其捲取自捲出器11捲出之薄膜100。 薄膜100於此處如圖3所示般，係於高分子薄膜等之基材101上形成有金屬層103者，藉由自雷射加工部3對金屬層103上選擇性照射雷射，去除受到照射之部分而形成特定之配線圖案70(參照圖6)。 另一方面，於標記裝置1中，於捲出器11與捲取器13之間，且於薄膜100之下方，設置有吸附保持薄膜100之標記區域203(參照圖4)之作為相對移動部之加工台21。藉由驅動部23，可將加工台21朝與薄膜100之搬送方向平行之方向，即與圖1之+x、-x之方向、及薄膜100之面之法線方向平行之方向即+z、-z之方向移動。 另一方面，加工台21之朝+x、-x之方向之可移動距離係限制於圖1之距離H，於移動界限之兩端設置有暫時吸附、保持薄膜100之保持台25。藉由未圖示之致動器可將保持台25朝圖1之朝+z、-z之方向移動。 加工台21係於標記時吸附薄膜100，且於薄膜100之搬送時追隨於薄膜100而移動，藉此防止薄膜100之位置偏離。 又，於加工台21因薄膜100之搬送而到達移動界限之情形時，暫時由保持台25吸附薄膜100，使加工台21與薄膜100分離且將加工台21返回至上游側(捲出器11側)。 又，於標記裝置1中，雷射加工部3可為固定，亦可為設置用以位置修正之XYθ載台或UVW載台等而使雷射加工部3能夠於以水平(XY)方向及Z方向為旋轉軸之旋轉(θ)方向對薄膜100相對移動之構成。 進而，標記裝置1具有測定雷射輸出之雷射功率計33及轉換器35。 裝置PC7係驅動控制標記裝置1之各構成要素之電腦，於裝置PC7設有用以操作該裝置PC7之監視器8、鍵盤10作為輸入輸出裝置。該等輸入輸出裝置亦可為平板電腦型之輸入輸出裝置。 又，裝置PC7亦具有作為移動標記控制部之功能，該控制部係控制加工台21、捲出器11及捲取器13，以使雷射加工部3對薄膜100一面相對移動、一面進行標記之方式對加工台21、捲出器11、捲取器13(經由PLC37)下達指令。 進而，於本實施形態中，裝置PC7與PLC37係作為控制標記之控制裝置而動作。更具體而言，裝置PC7除了主要進行雷射加工部3之雷射加工條件(雷射輸出、雷射振盪頻率、檢流掃描速度、加工台21之搬送速度、加工台21之搬送距離、雷射功率計33之條件、雷射加工之佈局)之設定、關於雷射加工部3之加工指示控制等以外，亦擔任將意指加工完成之資訊(加工完成觸發)發送至PLC37之角色。 又，PLC37除了進行加工台21之動作之控制、保持台25之動作之控制、加工台21及保持台25之真空吸附及吸附之解除之控制、未圖示之集塵器、雷射用冷卻器、台夾等之動作控制、雷射之機械快門之開閉動作之控制等之除了雷射加工部3以外之構成之動作之控制以外，亦擔任將顯示動作之控制完成之資訊(觸發)發送至裝置PC7之角色。 裝置PC7經由PLC(可程式化邏輯控制器)37與雷射加工部3、捲出器11、捲取器13、加工台21、保持台25、雷射功率計33(轉換器35)連接。 進而，標記裝置1具有作為變更自雷射加工部3照射之雷射之點徑的可變部之致動器71。 另，於薄膜100中於一次進行標記之區域成為例如圖4所示之標記區域203。 又，於圖1中雷射加工部3之數量為1個，但亦可將2個以上之雷射加工部3相對於薄膜100之搬送方向排列於並列之方向(+y、-y之方向)而進行標記。 此處，參照圖5對雷射加工部3及致動器71之構成及動作之概略進行說明。 如圖5所示般，雷射加工部3具有：光源51，其照射YAG(Yttrium Aluminum Garnet:釔鋁石榴石)雷射等之雷射；擴束器53，其調整設置於自光源51照射之雷射之光路上之雷射之點徑；轉角鏡55、57，其等用以改變透過擴束器53之雷射之方向；Z掃描器59及物鏡61，其等進行自轉角鏡57入射之雷射之Z軸方向之焦點之調整；XY檢流掃描器63，其調整透過物鏡61之光之X軸及Y軸方向座標；及雷射加工單元PC39，其控制該等構成要件之動作。 又，擴束器53具有複數個透鏡53a、53b，於透鏡53b設置有致動器71，該致動器71係使透鏡53b相對於透鏡53a於光路方向(圖5之-y、+y之方向)相對移動。 致動器71藉由使透鏡53b相對於透鏡53a朝光路方向相對移動，而調節透鏡53a與透鏡53b之距離L。藉此，將自光源51照射之雷射之點徑設定為第1點徑303或第2點徑304之任一者。 於標記時，於雷射加工部3中，自光源51以特定之輸出照射之雷射由擴束器53調整為特定之點徑，調整以Z掃描器59、物鏡61、及XY檢流掃描器63照射之位置座標及於其位置之焦點，以第1點徑303照射至薄膜100之期望位置。 另，致動器71亦可不設置於透鏡53b而設置於透鏡53a。 又，於雷射加工部3中，亦可取代Z掃描器59與物鏡61而使用fθ透鏡。於該情形時，將fθ透鏡配置於XY檢流掃描器63與薄膜100之間，進行Z軸方向之焦點之調整。 以上為雷射加工部3及致動器71之構成及動作之概略。 接著，對使用標記裝置1之標記順序，參照圖6～圖18進行說明。 首先，於以下之說明中參照圖6～圖13說明於薄膜100上形成之整體描繪圖案113之例。 如圖6所示般，於矩形之標記區域203內之整體描繪圖案113設置有16個配線圖案70。 又，於本實施形態中，自整體描繪圖案113產生構成整體描繪圖案113之一部分之第1描繪圖案115及第2描繪圖案117。因此，就自整體描繪圖案113產生第1描繪圖案115及第2描繪圖案117之方法，參照圖7～圖14詳細地說明。 首先，考慮如圖7所示之有整體描繪圖案113，第1點徑303之直徑為D之情形。於該情形時，於雷射之點徑為第1點徑303之情形時，無法描繪較D更小(寬度更窄)之區域305、306、307、309，故設定為由第2點徑304描繪之第2描繪圖案117。 其次，由於描繪時，第1點徑點徑303之雷射點徑大於描繪第2點徑304之雷射點徑，而可以高速描繪較大面積，故原本就期望將以第1點徑303可描繪之區域(區域310)設定為第1描繪圖案115。 另一方面，於本實施形態中將第2描繪圖案117設定為具有如埋填第1描繪圖案115之緣部116之輪廓圖案120之圖案。反言之，成為第1描繪圖案115之緣部116相對於整體描繪圖案113之緣部313向內側偏移之形狀。另一方面，第2描繪圖案117之外側之緣部114(包含輪廓圖案120)與整體描繪圖案113之緣部313一致。 若按照以上之基準自圖7之整體描繪圖案113產生第1描繪圖案115及第2描繪圖案117，則第1描繪圖案115成為圖8所示之圖案，第2描繪圖案117成為圖9所示之圖案。 又，若第1描繪圖案115與第2描繪圖案117重疊，則如圖10及圖11所示般產生重疊區域118。即，第1描繪圖案115與第2描繪圖案117係藉由相互重疊描繪而對薄膜100形成整體描繪圖案113者。 另，如圖11所示般，將第1描繪圖案115與第2描繪圖案117之X方向之重疊量稱為Vx，將Y方向之重疊量稱為Vy。又，將自第1描繪圖案115之緣部相對於整體描繪圖案113之緣部313於X方向之偏移量稱為Gx，將Y方向之偏移量稱為Gy。 此處，將第1描繪圖案115之緣部設定為第2描繪圖案117之輪廓圖案120係根據以下之2個理由。 首先，雷射加工部3雖基於第1描繪圖案115及第2描繪圖案117進行標記，但雷射之點形狀係平面形狀為圓形。因此，如圖12所示，若假設為僅使用雷射加工部3對大於D之區域310整體進行標記而作為第1描繪圖案115，則於第1描繪圖案115之緣部與實際描繪之圖案之間產生一定之空隙315。 此種空隙315雖於使用第2點徑304作為點徑對區域310進行描繪之情形亦會產生，但因第1點徑303之點徑大於第2點徑304，故於以第1點徑303描繪之情形時空隙315更大。 因此，藉由將第2描繪圖案117設定為包含如埋填第1描繪圖案115之緣部之輪廓圖案120之圖案，與將區域310整體設為第1描繪圖案115之情形相比可縮小空隙315，可提高整體描繪圖案113之精度。此為第1理由。 其次，於標記裝置1中，因雷射加工部3之對位精度、標記時之歷時變化等，而有實際描繪之圖案之位置自第1描繪圖案115及第2描繪圖案117產生偏離之情形。 於該情形時，第1描繪圖案115較第2描繪圖案117偏離量更大。其原因在於，第1點徑303之點徑較第2點徑304更大。因此，第1描繪圖案115之偏離尤其成為問題。 因此，藉由將第1描繪圖案115之緣部設定為第2描繪圖案117，而即使於應以第1描繪圖案115描繪之區域實際上產生偏離，產生偏離之部分亦描繪於第2描繪圖案117之區域內。 更正確而言，於如圖11所示般自第1描繪圖案115之外周相對於整體描繪圖案113之緣部313之偏移量Gx、Gy為重疊量Vx、Vy以下之情形時，只要第1描繪圖案115之偏離量為Gx、Gy以下，則產生偏離之部分將描繪於第2描繪圖案117之區域內或重疊區域118之區域內。 另一方面，於偏移量Gx、Gy大於重疊量Vx、Vy之情形時，只要第1描繪圖案115之偏離量為Vx、Vy以下，則產生偏離之部分將描繪於第2描繪圖案117之區域內或重疊區域118之區域內。 因此，產生偏離之部分可由偏移量Gx、Gy或重疊量Vx、Vy之範圍吸收，而實際描繪之圖案本身不論偏離之有無均可形成與整體描繪圖案113相同之形狀。此為第2理由。 以上係自整體描繪圖案113產生第1描繪圖案115及第2描繪圖案117之方法。 如此，藉由將雷射加工部3之點徑設為可變而使用不同之複數個點徑，將需要大面積加工之部分以較大之點徑高速描繪，且將需要精細加工之部分以較小之點徑精密地描繪，而使標記裝置1可以簡單構成實現高速且精細地描繪。 尤其，於標記裝置1中，由1個雷射加工部3進行不同點徑之標記，故與依每個不同點徑設置複數個雷射加工部而進行標記之情形相比，裝置構成較簡單，於雷射加工部間亦無需複雜之精度校正作業。 進而，於標記裝置1中，藉由將第1描繪圖案115之緣部設定為第2描繪圖案117之輪廓圖案120，即使於應以第1描繪圖案115描繪之區域實際上產生偏離，產生偏離之部分亦會被描繪於第2描繪圖案117之區域內。 因此，標記裝置1可進一步提高加工精度。 另，於圖11中，第2描繪圖案117中，埋填第1描繪圖案115之緣部之圖案之寬度(於圖11中將X方向之寬度記為Sx，將Y方向之寬度記為Sy)與第2點徑304之直徑相同。即第2描繪圖案117係以一行點形成。 另一方面，第2描繪圖案117並非必須以一行點形成，亦可以如圖13所示之複數行形成。 藉由如此設為複數行，與一行之情形相比可增大重疊量Vx、Vy及偏移量Gx、Gy。 因此，可進一步增大第1描繪圖案115(及第2描繪圖案117)所容許之偏離量。 惟隨著行數或重疊量Vx、Vy增大，第2描繪圖案117之面積變大，從而描繪所需之時間變長。 因此，重疊量Vx、Vy與行數較佳為比較預測之偏離量與作業時間而選擇適當之範圍。 例如，若將因標記時之歷時變化等所致之標記位置之假定之第1描繪圖案115及第2描繪圖案117之位置偏離各自設為α、β，則重疊量Vx、Vy最低亦必須為α+β。進而，於第1描繪圖案115與第2描繪圖案117相互於相反方向偏離最大量之情形時，因有可能產生因點徑為圓所致之空隙(參照圖12之空隙315)，故若將埋填該空隙之量設為γ，則實際之重疊量Vx、Vy成為α+β+γ。 又，如上所述，第2描繪圖案117之行數係根據重疊量Vx、Vy之大小及偏移量Gx、Gy之大小而增減。即較佳隨著重疊量Vx、Vy及偏移量Gx、Gy增大而增加行數，且較佳隨著重疊量Vx、Vy及偏移量Gx、Gy減小而減少行數。 以上係形成於薄膜100上之整體描繪圖案113之例之說明。 其次，參照圖14對標記之程序進行說明。另，於以下之說明中假設第1點徑303為直徑0.1 mm，第2點徑304為直徑為0.05 mm。即，假定第2點徑304之直徑為第1點徑303之直徑之1/2。 首先，標記裝置1之裝置PC7(之控制部6)判斷於記憶部7a中是否登錄有整體描繪圖案113及對應於整體描繪圖案113之第1描繪圖案115、第2描繪圖案117(圖14之S1)，於已登錄之情形時按照所登錄之圖案進行標記(圖案之描繪)(圖14之S2)。 於未登錄第1描繪圖案115及第2描繪圖案117之情形時，裝置PC7之控制部6按照以下順序產生第1描繪圖案115及第2描繪圖案117(部分描繪圖案)並登錄。另，此處雖使用裝置PC7作為產生部分描繪圖案之部分描繪圖案產生部，但部分描繪圖案之產生亦可不使用裝置PC7，而使用其他電腦。 首先，裝置PC7之控制部6讀取對應於整體描繪圖案113之CAD (Computer Aided Design：電腦輔助設計)資料等之圖案形狀之資料(圖14之S3)。 其次，裝置PC7之控制部6設定第1描繪圖案115與第2描繪圖案117之重疊量Vx、Vy、第1描繪圖案115相對於整體描繪圖案113之緣部313之偏移量Gx、Gy、及第2描繪圖案117之行數(圖14之S4)。具體而言，由作業者輸入重疊量Vx、Vy、偏移量Gx、Gy、及第2描繪圖案117之行數，或自其他PC或記憶媒體讀取該等資料。 其次，裝置PC7之控制部6將讀取之CAD資料轉換為Gerber資料(圖14之S5)。 其次，裝置PC7之控制部6自整體描繪圖案113產生第1描繪圖案115及第2描繪圖案117，且登錄(圖14之S6)。具體之產生方法如參照圖6～圖13所說明，於以下簡單進行說明。 即，分割描繪圖案產生部基於整體描繪圖案113之形狀、於S4設定之第1描繪圖案115與第2描繪圖案117之重疊量Vx、Vy、第1描繪圖案115相對於整體描繪圖案113之緣部313之偏移量Gx、Gy、及第2描繪圖案117之行數而產生第2描繪圖案117。 其次，裝置PC7之控制部6進行描繪第1描繪圖案115時之光源51之描繪能量(雷射輸出或振盪頻率)之設定，將設定之描繪能量登錄於記憶部7a之第1部分儲存區域14等(圖14之S7)。此處，假定為將以第1點徑303描繪之情形之光源51之雷射輸出設定為1000 mW、頻率設定為10 kHz者。 其次，裝置PC7之控制部6進行描繪第2描繪圖案117時之光源51之描繪能量(雷射輸出或振盪頻率)之計算(圖14之S8)。此處，以描繪第2描繪圖案117時之每單位面積之描繪能量與描繪第1描繪圖案115時之每單位面積之描繪能量實質相等之方式進行計算。其原因在於，第1描繪圖案115及第2描繪圖案117點徑不同，故若單純使光源51以相同之雷射輸出或振盪頻率進行第1描繪圖案115及第2描繪圖案117之描繪，則於描繪時每單位面積之描繪能量不同，於第1描繪圖案115與第2描繪圖案117產生描繪之不均(加工深度之不同等)。 於該例中第2點徑304之直徑為第1點徑303之直徑之1/2，故第2點徑304之面積為第1點徑303之面積之1/4。因此，將以第2點徑304描繪之情形之光源51之雷射輸出設定為以第1點徑303描繪之情形之雷射輸出之1/4即250 mW。 又，於加工速度相等之情形時，以第2點徑304描繪之情形時照射一次雷射之每XY方向之移動量為第1點徑303之1/2，故將振盪頻率設定為以第1點徑303描繪之情形之振盪頻率之2倍即20 kHz。 其次，裝置PC7之控制部6將於S8中計算之描繪能量登錄於記憶部7a之第2部分儲存區域16等(圖14之S9)。 其次，參照圖15～圖18對整體描繪圖案113之描繪方法(圖14之S2)更詳細地說明。 首先，標記裝置1(之裝置PC7之PLC37)以未圖示之馬達等驅動捲出器11及捲取器13，而以將薄膜100之標記區域203配置於雷射加工部3可描繪之位置之方式將薄膜100朝+x之方向搬送(圖15之S11、圖16(a))。此時，加工台21受到PLC37之控制而一面吸附保持標記區域203之下表面一面移動。若加工台21之移動完成，則PLC37將意指移動完成之資訊(移動完成觸發)及加工台21之位置資訊發送至裝置PC7。 其次，接收到移動完成觸發及加工台21之位置資訊之裝置PC7對雷射加工部3(之雷射加工單元PC39)指示先將雷射之點徑設定為第1點徑303(圖15之S12)。另，於此時裝置PC7對雷射加工部指示將描繪能量(雷射輸出及頻率)亦設為與第1點徑303對應之值。 其次，裝置PC7對雷射加工部3(之雷射加工單元PC39)指示第1描繪圖案115之加工。接收指示之雷射加工部3基於第1描繪圖案115，對標記區域203照射雷射，而進行圖案化(圖15之S13、圖16(b))。 其次，裝置PC7對雷射加工部3(之雷射加工單元PC39)指示為將雷射之點徑設定為第2點徑304(圖15之S14、圖16(b))。此時裝置PC7亦對雷射加工部3指示將描繪能量(雷射輸出及頻率)亦設為與第2點徑304對應之值。 其次，裝置PC7對雷射加工部3(之雷射加工單元PC39)指示第2描繪圖案117之加工。收到指示之雷射加工部3基於第2描繪圖案117，對標記區域203照射雷射，而進行圖案化(圖15之S15)。 若加工完成，則裝置PC7將意指加工完成之資訊(加工完成觸發)發送至PLC37。 其次，以接收加工完成觸發之狀態，標記裝置1之PLC37判斷加工台21之位置是否位於下游側(捲取器13側)之移動界限(圖15之S16)，且於不位於下游側之移動界限之情形時返回至S11，於位於移動界限之情形時進行至S17。 於加工台21之位置位於下游側之移動界限之情形時，標記裝置1必須將加工台21返回上游側(捲出器11側)，故按照以下順序使加工台21移動。 首先，標記裝置1之PLC37使用未圖示之致動器等使保持台25向+z方向移動，並吸附保持薄膜100(圖15之S17、圖16(c))。 其次，標記裝置1之PLC37解除利用加工台21之薄膜100之吸附，並使用驅動部23使加工台21向-z方向移動而自薄膜100拉離(圖15之S18、圖17(a))。 其次，標記裝置1之PLC37使用驅動部23使加工台21向-x方向移動而移動至上游側(圖15之S19、圖17(b))。 其次，標記裝置1之PLC37使用驅動部23使加工台21向+z方向移動而使其再次與薄膜100接觸，並吸附薄膜100(圖15之S20、圖17(c))。 其次，標記裝置1之PLC37解除保持台25對薄膜100之吸附，並使保持台25向-z方向移動而自薄膜100拉離(圖15之S21、圖17(d))。 以後，重複進行S11～S21直至將標記區域203全部加工為止。 如此，藉由加工台21始終自下方吸附保持標記區域203，可將標記時之薄膜100之位置偏離抑制為最小限度。 以上係使用標記裝置1之標記順序。 如此，根據本實施形態，標記裝置1包含：雷射加工部3，其以第1點徑303及點徑小於第1點徑303之第2點徑304對薄膜100進行標記；致動器71，其變更雷射加工部3之點徑；及作為部分描繪圖案登錄部之裝置PC7，其登錄構成整體描繪圖案113之一部分之圖案、由第1點徑303描繪之第1描繪圖案115及構成整體描繪圖案113之一部分之圖案、由第2點徑304描繪之第2描繪圖案117。 因此，標記裝置1可以簡單構成實現高速且精細地描繪。 [產業上之可利用性] 以上，雖基於實施形態對本發明進行說明，但本發明並非限定於上述之實施形態。 例如，於上述之實施形態中，作為標記裝置1，雖例示使用雷射進行標記之裝置，但本發明絕不受此限定，只要為可對被加工物進行標記之裝置，則亦可為例如使用噴墨機或塗佈機等塗佈裝置進行標記之裝置。 又，於上述之實施形態中，雷射加工部3以第1點徑303與第2點徑304之兩個點徑進行描繪，但點徑亦可為3個以上。於該情形時，部分描繪圖案不僅為第1描繪圖案115與第2描繪圖案117之2個，而成為3個以上。 又，於本實施形態中針對整體描繪圖案113，係先進行第1描繪圖案115之描繪後，進行第2描繪圖案117之描繪，但描繪之順序亦可為相反。即，亦可先進行第2描繪圖案117之描繪後，進行第1描繪圖案115之描繪。 同樣地，於本實施形態中先設定描繪第1描繪圖案115時之光源51之描繪能量，其次設定描繪第2圖案117時之光源51之描繪能量，但該順序亦可相反。 進而，於上述之實施形態中第1描繪圖案115與第2描繪圖案117成為分割整體描繪圖案113之圖案，但第1描繪圖案115與第2描繪圖案117並非必須為分割之圖案，亦可例如圖10般以於整體描繪圖案113上覆蓋第1描繪圖案115與第2描繪圖案117之區域之形狀產生1個圖案。 又，作為本發明可應用之標記對象(被加工物)，並非限定於上述薄膜100等之長條片材，可例示玻璃板或印刷基板等之矩形基板、或半導體晶圓或玻璃晶圓等之圓形基板等。Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. First, the configuration of a marking device 1 according to this embodiment will be described with reference to FIGS. 1 and 2. The marking device 1 here is an example of a laser marking device that uses laser to mark the surface of the film 100 as a workpiece. Specifically, the marking device 1 shown in FIG. 1 includes a laser processing section 3 as a marking section. Furthermore, the device PC7 shown in FIG. 2 operates as a PLC (Programmable Logic Controller) 37 and operates as a control device for a control mark. The laser processing section 3 can mark the film 100 with the first spot diameter 303 and the second spot diameter 304 smaller than the first spot diameter 303 (see FIG. 5). Among them, the device PC7 has a control section 6 and a memory section 7a. The memory section 7a has a storage area 12 that stores information of the overall pattern shape marked, that is, the overall drawing pattern 113 (refer to FIG. 6); the first part of the storage area 14 , Which stores the first pattern 115 (see FIG. 8) drawn by the laser processing section 3 with the first point diameter 303; and the second part storage area 16 which stores the first pattern 115 drawn by the laser processing section 3 with the second point diameter 304 2 pattern 117 (see FIG. 9). In this way, the first drawing pattern 115 and the second drawing pattern 117 generated from the overall drawing pattern 113 are registered in the memory section 7a. Therefore, the device PC7 operates as a partial drawing pattern registration unit that registers the first drawing pattern 115 and the second drawing pattern 117 in advance. Furthermore, the device PC7 also operates as a contour line number setting unit that sets the number of lines of the contour pattern 120 (see FIG. 9) of the second drawing pattern 117. The device PC7 also operates as an overlap amount setting unit that sets the overlap amount Vx, Vy (see FIG. 11) of the first drawing pattern 115 and the second drawing pattern 117, and also acts as an edge portion for setting the first drawing pattern 115 with respect to The offset amount setting unit of the offset amounts Gx and Gy (see FIG. 11) of the edge portion 313 of the overall drawing pattern 113 operates. As described above, in the present embodiment, the device PC7 performs registration of the overall drawing pattern 113 and the process of generating the first drawing pattern 115 and the second drawing pattern 117 from the overall drawing pattern 113. Therefore, the device PC7 includes the overall drawing pattern registration unit. And part of the function of drawing the pattern generating part. The configuration of the marking device 1 will be described in more detail with reference to FIGS. 1 to 5. As shown in FIGS. 1 and 2, the marking device 1 includes a unwinder 11 that rolls out the film 100, and a reel 13 that winds off the film 100 that is rolled out from the unwinder 11. Here, as shown in FIG. 3, the thin film 100 is formed on a base material 101 such as a polymer thin film, and the metal layer 103 is selectively irradiated on the metal layer 103 by the laser processing unit 3 to remove the metal layer 103. The irradiated portion forms a specific wiring pattern 70 (see FIG. 6). On the other hand, in the marking device 1, between the unwinder 11 and the reel 13 and below the film 100, a labeling region 203 (see FIG. 4) that adsorbs and holds the film 100 is provided as a relative moving portion Of processing table 21. By the driving section 23, the processing table 21 can be oriented in a direction parallel to the conveying direction of the film 100, that is, a direction parallel to the + x, -x directions in FIG. 1 and the normal direction of the surface of the film 100, which is + z. Move in the direction of -z. On the other hand, the movable distance in the directions of + x and -x of the processing table 21 is limited to the distance H in FIG. 1, and holding tables 25 for temporarily adsorbing and holding the film 100 are provided at both ends of the moving limit. The holding table 25 can be moved in the + z and -z directions in FIG. 1 by an actuator (not shown). The processing table 21 absorbs the film 100 during marking, and moves following the film 100 during the transportation of the film 100, thereby preventing the position of the film 100 from deviating. In addition, when the processing table 21 reaches the moving limit due to the conveyance of the film 100, the holding table 25 temporarily adsorbs the film 100, separates the processing table 21 from the film 100, and returns the processing table 21 to the upstream side (roller 11). side). Further, in the marking device 1, the laser processing section 3 may be fixed, or an XYθ stage or UVW stage for position correction may be provided, so that the laser processing section 3 can be positioned in the horizontal (XY) direction and The Z direction is a configuration in which the film 100 is relatively moved by the rotation (θ) direction of the rotation axis. Furthermore, the marking device 1 includes a laser power meter 33 and a converter 35 for measuring laser output. The device PC7 is a computer that drives the constituent elements of the marking device 1. The device PC7 is provided with a monitor 8 and a keyboard 10 for operating the device PC7 as input and output devices. These input-output devices can also be tablet-type input-output devices. In addition, the device PC7 also has a function as a moving mark control unit that controls the processing table 21, the unwinder 11, and the reel 13 so that the laser processing unit 3 marks the film 100 while it is relatively moved. In this way, instructions are given to the processing table 21, the unwinder 11, and the reel 13 (via the PLC 37). Furthermore, in the present embodiment, the devices PC7 and PLC37 operate as control devices for control marks. More specifically, the device PC7 mainly performs laser processing conditions (laser output, laser oscillation frequency, galvano-scanning speed) of the laser processing section 3, the transport speed of the processing table 21, the transport distance of the processing table 21, and the laser. In addition to the conditions of the radiometer 33, the layout of laser processing), the processing instruction control of the laser processing section 3, etc., it also plays the role of sending information (processing completion trigger) that means processing completion to the PLC 37. In addition, the PLC 37 controls the operation of the processing table 21, the operation of the holding table 25, the control of vacuum adsorption and release of the processing table 21 and the holding table 25, a dust collector (not shown), and cooling for lasers. In addition to the control of the operation of the device, the clamp, etc., the control of the opening and closing of the laser mechanical shutter, and other operations other than the laser processing unit 3, it also acts as the information (trigger) to send the completion of the display operation control. To the role of device PC7. The device PC7 is connected to the laser processing unit 3, the unwinder 11, the winder 13, the processing table 21, the holding table 25, and the laser power meter 33 (converter 35) via a PLC (programmable logic controller) 37. Furthermore, the marking device 1 includes an actuator 71 as a variable portion that changes the spot diameter of the laser beam irradiated from the laser processing portion 3. In addition, the area where the marking is performed once in the film 100 becomes, for example, the marking area 203 shown in FIG. 4. In FIG. 1, the number of the laser processing sections 3 is one, but two or more laser processing sections 3 may be arranged in parallel with respect to the transport direction of the film 100 (directions of + y and −y). ). Here, the outline of the configuration and operation of the laser processing section 3 and the actuator 71 will be described with reference to FIG. 5. As shown in FIG. 5, the laser processing unit 3 includes a light source 51 that irradiates a laser such as a YAG (Yttrium Aluminum Garnet) laser, and a beam expander 53 that is adjusted to be irradiated from the light source 51. The diameter of the laser beam on the path of the laser beam; corner mirrors 55, 57 which change the direction of the laser beam passing through the beam expander 53; Z scanner 59 and objective lens 61, which perform the rotation angle mirror 57 Adjustment of the focal point in the Z-axis direction of the incident laser; XY galvanometer scanner 63, which adjusts the X-axis and Y-axis coordinates of the light transmitted through the objective lens 61; and a laser processing unit PC39, which controls these constituent elements action. The beam expander 53 includes a plurality of lenses 53a and 53b, and an actuator 71 is provided on the lens 53b. The actuator 71 makes the lens 53b in the optical path direction with respect to the lens 53a (directions -y and + y in Fig. 5). ) Relative movement. The actuator 71 adjusts the distance L between the lens 53a and the lens 53b by moving the lens 53b relative to the lens 53a in the optical path direction. Thereby, the spot diameter of the laser beam irradiated from the light source 51 is set to either the first spot diameter 303 or the second spot diameter 304. At the time of marking, in the laser processing section 3, the laser irradiated with a specific output from the light source 51 is adjusted by the beam expander 53 to a specific point diameter, and adjusted by scanning with the Z scanner 59, the objective lens 61, and the XY galvanometer. The coordinates of the position irradiated by the device 63 and the focus at the position are irradiated to the desired position of the film 100 with the first point diameter 303. The actuator 71 may be provided on the lens 53a instead of the lens 53b. In the laser processing unit 3, an fθ lens may be used instead of the Z scanner 59 and the objective lens 61. In this case, the fθ lens is arranged between the XY galvanometer scanner 63 and the film 100, and the focus in the Z-axis direction is adjusted. The above is the outline of the configuration and operation of the laser processing section 3 and the actuator 71. Next, a marking procedure using the marking device 1 will be described with reference to FIGS. 6 to 18. First, an example of the entire drawing pattern 113 formed on the film 100 will be described in the following description with reference to FIGS. 6 to 13. As shown in FIG. 6, the entire drawing pattern 113 in the rectangular mark area 203 is provided with 16 wiring patterns 70. Further, in the present embodiment, the first drawing pattern 115 and the second drawing pattern 117 constituting a part of the entire drawing pattern 113 are generated from the entire drawing pattern 113. Therefore, a method of generating the first drawing pattern 115 and the second drawing pattern 117 from the entire drawing pattern 113 will be described in detail with reference to FIGS. 7 to 14. First, consider a case where the overall drawing pattern 113 is shown in FIG. 7 and the diameter of the first dot diameter 303 is D. In this case, when the spot diameter of the laser is the first spot diameter 303, the areas 305, 306, 307, and 309 smaller than D (narrower width) cannot be drawn, so the second spot diameter is set. The second drawing pattern 117 drawn by 304. Secondly, since the laser spot diameter of the first spot diameter 303 is larger than the laser spot diameter of the second spot diameter 304 when drawing, and a large area can be drawn at high speed, it is originally expected that the first spot diameter 303 will be used. The drawable area (area 310) is set as the first drawing pattern 115. On the other hand, in the present embodiment, the second drawing pattern 117 is set to a pattern having an outline pattern 120 in which the edge portion 116 of the first drawing pattern 115 is embedded. In other words, the edge portion 116 of the first drawing pattern 115 is shifted inward from the edge portion 313 of the entire drawing pattern 113. On the other hand, the edge portion 114 (including the outline pattern 120) on the outer side of the second drawing pattern 117 coincides with the edge portion 313 of the entire drawing pattern 113. When the first drawing pattern 115 and the second drawing pattern 117 are generated from the overall drawing pattern 113 in FIG. 7 according to the above reference, the first drawing pattern 115 becomes the pattern shown in FIG. 8 and the second drawing pattern 117 becomes the one shown in FIG. Of the pattern. When the first drawing pattern 115 and the second drawing pattern 117 overlap, an overlapping area 118 is generated as shown in FIGS. 10 and 11. That is, the first drawing pattern 115 and the second drawing pattern 117 are formed by overlapping drawing to form the entire drawing pattern 113 on the film 100. As shown in FIG. 11, the amount of overlap in the X direction of the first drawing pattern 115 and the second drawing pattern 117 is called Vx, and the amount of overlap in the Y direction is called Vy. In addition, the amount of deviation in the X direction from the edge portion of the first drawing pattern 115 relative to the edge portion 313 of the entire drawing pattern 113 is referred to as Gx, and the amount of offset in the Y direction is referred to as Gy. Here, setting the edge portion of the first drawing pattern 115 as the outline pattern 120 of the second drawing pattern 117 is based on the following two reasons. First, although the laser processing unit 3 marks on the basis of the first drawing pattern 115 and the second drawing pattern 117, the shape of the laser dot is a circular plane. Therefore, as shown in FIG. 12, if it is assumed that the entire area 310 larger than D is marked as the first drawing pattern 115 using only the laser processing section 3, the edge portion of the first drawing pattern 115 and the actually drawn pattern are marked. A certain gap 315 is created. Such a gap 315 may also occur when the area 310 is drawn using the second point diameter 304 as the point diameter, but because the point diameter of the first point diameter 303 is larger than the second point diameter 304, the first point diameter The gap 315 is larger in the situation depicted by 303. Therefore, by setting the second drawing pattern 117 as a pattern including the outline pattern 120 in which the edge portion of the first drawing pattern 115 is buried, the gap can be reduced compared to the case where the entire area 310 is set as the first drawing pattern 115. 315, can improve the accuracy of the overall drawing pattern 113. This is the first reason. Next, in the marking device 1, the position of the pattern actually drawn may deviate from the first drawing pattern 115 and the second drawing pattern 117 due to the alignment accuracy of the laser processing section 3, the diachronic change during marking, and the like. . In this case, the first drawing pattern 115 has a larger deviation amount than the second drawing pattern 117. The reason is that the spot diameter of the first spot diameter 303 is larger than the spot diameter of the second spot diameter 304. Therefore, the deviation of the first drawing pattern 115 is particularly a problem. Therefore, by setting the edge portion of the first drawing pattern 115 as the second drawing pattern 117, even if a deviation actually occurs in the area to be drawn with the first drawing pattern 115, the portion where the deviation occurs is also drawn in the second drawing pattern. Within 117. More specifically, when the offset amounts Gx and Gy from the outer periphery of the first drawing pattern 115 to the edge portion 313 of the overall drawing pattern 113 are equal to or less than the overlapping amounts Vx and Vy as shown in FIG. The amount of deviation of the 1 drawing pattern 115 is equal to or smaller than Gx and Gy, and the portion where the deviation occurs is drawn in the region of the second drawing pattern 117 or the region of the overlapping region 118. On the other hand, when the offset amounts Gx and Gy are larger than the overlap amounts Vx and Vy, as long as the deviation amount of the first drawing pattern 115 is less than Vx, Vy, the portion where the deviation occurs will be drawn on the second drawing pattern 117. Within the area or within the area of the overlapping area 118. Therefore, the part where the deviation occurs can be absorbed by the range of the offset amount Gx, Gy or the overlap amount Vx, Vy, and the pattern actually drawn can form the same shape as the overall drawing pattern 113 regardless of the presence or absence of the deviation. This is the second reason. The above is a method of generating the first drawing pattern 115 and the second drawing pattern 117 from the overall drawing pattern 113. In this way, by making the point diameter of the laser processing section 3 variable and using a plurality of different point diameters, a part requiring a large area of processing is drawn at a high speed with a larger point diameter, and a part requiring fine processing is drawn at a high speed. The small dot diameter is accurately drawn, so that the marking device 1 can be simply constructed to realize high-speed and fine drawing. In particular, in the marking device 1, a laser processing section 3 is used to mark different point diameters. Therefore, compared with a case where a plurality of laser processing sections are provided for each different point diameter for marking, the device configuration is simpler. There is also no need for complicated precision calibration operations between laser processing sections. Further, in the marking device 1, by setting the edge portion of the first drawing pattern 115 as the contour pattern 120 of the second drawing pattern 117, even if the area actually to be drawn with the first drawing pattern 115 is deviated, deviation occurs. Part of it will also be drawn in the area of the second drawing pattern 117. Therefore, the marking device 1 can further improve the processing accuracy. In FIG. 11, in the second drawing pattern 117, the width of the pattern at the edge of the first drawing pattern 115 is embedded (the width in the X direction is denoted as Sx, and the width in the Y direction is denoted as Sy ) Is the same as the diameter of the second spot diameter 304. That is, the second drawing pattern 117 is formed by one line of dots. On the other hand, the second drawing pattern 117 does not have to be formed in one line of dots, and may be formed in plural lines as shown in FIG. 13. By setting plural lines in this way, it is possible to increase the amount of overlap Vx, Vy and the amounts of offset Gx, Gy compared to the case of one line. Therefore, the amount of deviation allowed by the first drawing pattern 115 (and the second drawing pattern 117) can be further increased. However, as the number of lines or the amount of overlap Vx, Vy increases, the area of the second drawing pattern 117 becomes larger, and the time required for drawing becomes longer. Therefore, the overlap amount Vx, Vy, and the number of rows are preferably selected in a suitable range in comparison with the predicted deviation amount and the operation time. For example, if the positions of the assumed first drawing pattern 115 and the second drawing pattern 117 due to the diachronic change in the marking position are respectively set to α and β, the minimum overlap amount Vx and Vy must also be α + β. Furthermore, when the first drawing pattern 115 and the second drawing pattern 117 deviate from each other by the maximum amount in the opposite direction, a void due to a circle diameter may occur (see void 315 in FIG. 12). The amount of filling the void is γ, and the actual overlap amounts Vx and Vy become α + β + γ. As described above, the number of lines of the second drawing pattern 117 increases or decreases according to the magnitudes of the overlap amounts Vx and Vy and the magnitudes of the offset amounts Gx and Gy. That is, it is preferable to increase the number of lines as the overlap amount Vx, Vy and the offsets Gx, Gy increase, and it is preferable to decrease the number of lines as the overlap amount Vx, Vy and offsets Gx, Gy decrease. The above is an example of the overall drawing pattern 113 formed on the thin film 100. Next, the procedure for marking will be described with reference to FIG. 14. In the following description, it is assumed that the first point diameter 303 is 0.1 mm in diameter, and the second point diameter 304 is 0.05 mm in diameter. That is, it is assumed that the diameter of the second point diameter 304 is 1/2 of the diameter of the first point diameter 303. First, the device PC7 (the control unit 6) of the marking device 1 determines whether or not the overall drawing pattern 113 and the first drawing pattern 115 and the second drawing pattern 117 (FIG. 14 of FIG. 14) corresponding to the overall drawing pattern 113 are registered in the memory part 7a. S1), when registered, mark (pattern drawing) according to the registered pattern (S2 in FIG. 14). When the first drawing pattern 115 and the second drawing pattern 117 are not registered, the control unit 6 of the device PC 7 generates and registers the first drawing pattern 115 and the second drawing pattern 117 (partial drawing pattern) in the following order. In addition, although the device PC7 is used here as a partial drawing pattern generation unit that generates a partial drawing pattern, the partial drawing pattern may be generated without using the device PC7 and using another computer. First, the control unit 6 of the device PC7 reads the pattern shape data (S3 in FIG. 14) corresponding to CAD (Computer Aided Design) data of the overall drawing pattern 113. Next, the control unit 6 of the device PC7 sets the amount of overlap Vx, Vy of the first drawing pattern 115 and the second drawing pattern 117, and the offset amounts Gx, Gy, And the number of lines of the second drawing pattern 117 (S4 in FIG. 14). Specifically, the operator inputs the overlap amount Vx, Vy, the offset amounts Gx, Gy, and the number of lines of the second drawing pattern 117, or reads such data from another PC or a storage medium. Next, the control section 6 of the device PC7 converts the read CAD data into Gerber data (S5 in FIG. 14). Next, the control unit 6 of the device PC7 generates the first drawing pattern 115 and the second drawing pattern 117 from the overall drawing pattern 113 and registers them (S6 in FIG. 14). The specific generation method is as described with reference to FIGS. 6 to 13, and is briefly described below. That is, based on the shape of the overall drawing pattern 113, the division drawing pattern generation unit overlaps the first drawing pattern 115 and the second drawing pattern 117 in S4 with the amount Vx, Vy, and the edge of the first drawing pattern 115 with respect to the overall drawing pattern 113 The offset Gx and Gy of the portion 313 and the number of lines of the second drawing pattern 117 generate the second drawing pattern 117. Next, the control unit 6 of the device PC7 sets the drawing energy (laser output or oscillation frequency) of the light source 51 when drawing the first drawing pattern 115, and registers the set drawing energy in the first part storage area 14 of the memory portion 7a And so on (S7 in Fig. 14). Here, it is assumed that the laser output of the light source 51 in the case of the first point diameter 303 is set to 1000 mW and the frequency is set to 10 kHz. Next, the control unit 6 of the device PC7 calculates the drawing energy (laser output or oscillation frequency) of the light source 51 when drawing the second drawing pattern 117 (S8 in FIG. 14). Here, calculation is performed such that the drawing energy per unit area when the second drawing pattern 117 is drawn is substantially equal to the drawing energy per unit area when the first drawing pattern 115 is drawn. The reason is that the first drawing pattern 115 and the second drawing pattern 117 have different point diameters. Therefore, if the light source 51 is simply used to draw the first drawing pattern 115 and the second drawing pattern 117 with the same laser output or oscillation frequency, then When drawing, the drawing energy per unit area is different, and the drawing unevenness (the difference in processing depth, etc.) occurs between the first drawing pattern 115 and the second drawing pattern 117. In this example, the diameter of the second point diameter 304 is 1/2 of the diameter of the first point diameter 303, so the area of the second point diameter 304 is 1/4 of the area of the first point diameter 303. Therefore, the laser output of the light source 51 in the case of the second point diameter 304 is set to 1/4 of the laser output of the case in the first point diameter 303, that is, 250 mW. In the case of equal processing speed, the movement amount per XY direction of the laser beam irradiated once with the second point diameter 304 is 1/2 of the first point diameter 303, so the oscillation frequency is set to In the case depicted by the 1-point diameter 303, twice the oscillation frequency is 20 kHz. Next, the control section 6 of the device PC7 registers the drawing energy calculated in S8 in the second part storage area 16 and the like of the memory section 7a (S9 in FIG. 14). Next, a drawing method (S2 in FIG. 14) of the overall drawing pattern 113 will be described in more detail with reference to FIGS. 15 to 18. First, the marking device 1 (PLC37 of the device PC7) drives the unwinder 11 and the reel 13 with a motor or the like not shown, and the marking area 203 of the film 100 is arranged at a position that can be drawn by the laser processing section 3. In this way, the film 100 is transported in the + x direction (S11 in FIG. 15 and FIG. 16 (a)). At this time, the processing table 21 is controlled by the PLC 37 and moves while sucking and holding the lower surface of the mark area 203. If the movement of the processing table 21 is completed, the PLC 37 sends information (movement completion trigger) that indicates the movement completion and the position information of the processing table 21 to the device PC7. Secondly, the device PC7 that received the movement completion trigger and the position information of the processing table 21 instructs the laser processing section 3 (the laser processing unit PC39) to set the laser spot diameter to the first spot diameter 303 (FIG. 15). S12). At this time, the device PC7 instructs the laser processing unit to set the drawing energy (laser output and frequency) to a value corresponding to the first point diameter 303. Next, the device PC7 instructs the laser processing unit 3 (the laser processing unit PC39) to process the first drawing pattern 115. The laser processing unit 3 receiving the instruction performs patterning by irradiating a laser on the marked area 203 based on the first drawing pattern 115 (S13 in FIG. 15 and FIG. 16 (b)). Next, the device PC7 instructs the laser processing unit 3 (the laser processing unit PC39) to set the spot diameter of the laser to the second spot diameter 304 (S14 in FIG. 15 and FIG. 16 (b)). At this time, the device PC7 also instructs the laser processing unit 3 to set the drawing energy (laser output and frequency) to a value corresponding to the second point diameter 304. Next, the device PC7 instructs the laser processing unit 3 (the laser processing unit PC39) to process the second drawing pattern 117. Upon receiving the instruction, the laser processing section 3 irradiates a laser beam to the marked area 203 based on the second drawing pattern 117 to perform patterning (S15 in FIG. 15). If the processing is completed, the device PC7 sends information (processing completion trigger) that means the processing is completed to the PLC 37. Secondly, in the state of receiving the processing completion trigger, the PLC 37 of the marking device 1 judges whether the position of the processing table 21 is located on the downstream side (winder 13 side) of the movement limit (S16 in FIG. 15), and moves in a position that is not on the downstream side In the case of a limit, the process returns to S11, and in the case of a moving limit, the process proceeds to S17. In the case where the position of the processing table 21 is located on the downstream side, the marking device 1 must return the processing table 21 to the upstream side (roller 11 side), so the processing table 21 is moved in the following order. First, the PLC 37 of the marking device 1 uses an actuator (not shown) or the like to move the holding table 25 in the + z direction, and sucks and holds the holding film 100 (S17 in FIG. 15 and FIG. 16 (c)). Next, the PLC 37 of the marking device 1 releases the adsorption of the film 100 using the processing table 21, and uses the driving unit 23 to move the processing table 21 in the -z direction and pull it away from the film 100 (S18 in Fig. 15 and Fig. 17 (a)) . Next, the PLC 37 of the marking device 1 uses the drive unit 23 to move the processing table 21 in the -x direction to move to the upstream side (S19 in Fig. 15 and Fig. 17 (b)). Next, the PLC 37 of the marking device 1 uses the driving unit 23 to move the processing table 21 in the + z direction to bring it into contact with the film 100 again, and adsorbs the film 100 (S20 in FIG. 15 and FIG. 17 (c)). Next, the PLC 37 of the marking device 1 releases the film 100 from the holding stage 25 and moves the holding stage 25 in the -z direction to pull it away from the film 100 (S21 in Fig. 15 and Fig. 17 (d)). After that, S11 to S21 are repeated until all the marked areas 203 are processed. As described above, the processing table 21 always sucks and holds the marking area 203 from below, so that the positional deviation of the film 100 at the time of marking can be minimized. The above is the marking sequence using the marking device 1. Thus, according to this embodiment, the marking device 1 includes a laser processing section 3 that marks the film 100 with the first point diameter 303 and the second point diameter 304 smaller than the first point diameter 303; the actuator 71 , Which changes the spot diameter of the laser processing unit 3; and the device PC7, which is a partial drawing pattern registration unit, which registers a part of the overall drawing pattern 113, the first drawing pattern 115 drawn by the first point diameter 303, and the structure A part of the overall drawing pattern 113 is a second drawing pattern 117 drawn by the second dot diameter 304. Therefore, the marking device 1 can be configured in a simple manner to achieve high-speed and fine drawing. [Industrial Applicability] Although the present invention has been described based on the embodiments, the present invention is not limited to the above-mentioned embodiments. For example, in the embodiment described above, although the marking device 1 is exemplified by a device for marking using a laser, the present invention is by no means limited to this. As long as it is a device capable of marking a workpiece, for example, it may be A device for marking using a coating device such as an inkjet or a coater. In the above-mentioned embodiment, the laser processing section 3 is drawn with two spot diameters of the first spot diameter 303 and the second spot diameter 304, but the spot diameter may be three or more. In this case, the partial drawing pattern is not only two of the first drawing pattern 115 and the second drawing pattern 117 but also three or more. In the present embodiment, the first drawing pattern 115 is drawn first and then the second drawing pattern 117 is drawn for the overall drawing pattern 113. However, the order of drawing may be reversed. That is, the second drawing pattern 117 may be drawn first, and then the first drawing pattern 115 may be drawn. Similarly, in this embodiment, the drawing energy of the light source 51 when the first drawing pattern 115 is drawn is set first, and the drawing energy of the light source 51 when the second pattern 117 is drawn is set next, but the order may be reversed. Furthermore, in the above-mentioned embodiment, the first drawing pattern 115 and the second drawing pattern 117 are patterns that divide the overall drawing pattern 113. However, the first drawing pattern 115 and the second drawing pattern 117 are not necessarily divided patterns. For example, As shown in FIG. 10, one pattern is generated in the shape of a region covering the first drawing pattern 115 and the second drawing pattern 117 on the entire drawing pattern 113. Moreover, as a marking object (processed object) to which the present invention is applicable, it is not limited to the long sheet of the film 100 and the like, and a rectangular substrate such as a glass plate or a printed substrate, or a semiconductor wafer or a glass wafer can be exemplified. Round substrates, etc.
1‧‧‧標記裝置1‧‧‧ marking device
3‧‧‧雷射加工部3‧‧‧Laser Processing Department
6‧‧‧控制部6‧‧‧Control Department
7‧‧‧裝置PC7‧‧‧ Device PC
7a‧‧‧記憶部7a‧‧‧Memory Department
8‧‧‧監視器8‧‧‧ monitor
10‧‧‧鍵盤10‧‧‧ keyboard
11‧‧‧捲出器11‧‧‧ Unwinder
12‧‧‧儲存區域12‧‧‧Storage area
13‧‧‧捲取器13‧‧‧ coiler
14‧‧‧第1部分儲存區域14‧‧‧ Part 1 Storage Area
16‧‧‧第2部分儲存區域16‧‧‧ Part 2 storage area
21‧‧‧加工台21‧‧‧Processing table
23‧‧‧驅動部23‧‧‧Driver
25‧‧‧保持台25‧‧‧holding table
33‧‧‧雷射功率計33‧‧‧Laser Power Meter
35‧‧‧轉換器35‧‧‧ converter
37‧‧‧PLC37‧‧‧PLC
39‧‧‧雷射加工單元PC39‧‧‧laser processing unit PC
51‧‧‧光源51‧‧‧light source
53‧‧‧擴束器53‧‧‧Beam Expander
53a‧‧‧透鏡53a‧‧‧lens
53b‧‧‧透鏡53b‧‧‧lens
55‧‧‧轉角鏡55‧‧‧ corner mirror
57‧‧‧轉角鏡57‧‧‧ corner mirror
59‧‧‧Z掃描器59‧‧‧Z Scanner
61‧‧‧物鏡61‧‧‧ Objective
63‧‧‧XY檢流掃描器63‧‧‧XY Galvanic Scanner
70‧‧‧配線圖案70‧‧‧wiring pattern
71‧‧‧致動器71‧‧‧Actuator
100‧‧‧薄膜100‧‧‧ film
101‧‧‧基材101‧‧‧ substrate
103‧‧‧金屬層103‧‧‧metal layer
113‧‧‧整體描繪圖案113‧‧‧Overall drawing pattern
114‧‧‧緣部114‧‧‧Edge
115‧‧‧第1描繪圖案115‧‧‧The first drawing pattern
116‧‧‧緣部116‧‧‧Edge
117‧‧‧第2描繪圖案117‧‧‧The second drawing pattern
118‧‧‧重疊區域118‧‧‧ overlapping area
120‧‧‧輪廓圖案120‧‧‧ contour pattern
203‧‧‧標記區域203‧‧‧Marked area
303‧‧‧第1點徑303‧‧‧point 1 trail
304‧‧‧第2點徑304‧‧‧point 2 trail
305‧‧‧區域305‧‧‧area
306‧‧‧區域306‧‧‧area
307‧‧‧區域307‧‧‧area
309‧‧‧區域309‧‧‧area
310‧‧‧區域310‧‧‧area
313‧‧‧緣部313‧‧‧Edge
315‧‧‧空隙315‧‧‧Gap
A‧‧‧區域A‧‧‧Area
Gx‧‧‧偏移量Gx‧‧‧offset
Gy‧‧‧偏移量Gy‧‧‧offset
H‧‧‧距離H‧‧‧distance
S1～S9‧‧‧步驟S1 ～ S9‧‧‧‧ steps
S11～S21‧‧‧步驟Steps S11 ～ S21‧‧‧‧
Sx‧‧‧寬度Sx‧‧‧Width
Sy‧‧‧寬度Sy‧‧‧Width
Vx‧‧‧重疊量Vx‧‧‧ Overlap
Vy‧‧‧重疊量Vy‧‧‧ overlap
x‧‧‧方向x‧‧‧ direction
y‧‧‧方向y‧‧‧direction
z‧‧‧方向z‧‧‧ direction
θ‧‧‧旋轉方向θ‧‧‧ Direction of rotation
圖1係顯示本發明之一實施形態之標記裝置1之概略構成之立體圖。 圖2係本發明之一實施形態之標記裝置1之方塊圖，粗線表示藉由專用線進行之連接，波形線表示藉由通訊進行之連接，細線表示藉由I/O(輸入輸出)埠進行之連接，虛線表示藉由類比線路進行之連接。 圖3係本發明之一實施形態之薄膜100之剖視圖。 圖4係顯示本發明之一實施形態之薄膜100上之標記區域203之俯視圖。 圖5係顯示雷射加工部3及致動器71之概略構成之立體圖。 圖6係顯示於薄膜100上形成之整體描繪圖案113之例之俯視圖。 圖7係顯示於薄膜100上形成之整體描繪圖案113之例之俯視圖，且為放大圖6之配線圖案70附近之圖。 圖8係顯示第1描繪圖案115之例之俯視圖，且為與圖7對應之圖。 圖9係顯示第2描繪圖案117之例之俯視圖，且為與圖7對應之圖。 圖10係顯示整體描繪圖案113之例之俯視圖，以斜線描繪之部分顯示第1描繪圖案115，以點描繪之部分顯示第2描繪圖案117，以網格描繪之部分顯示第1描繪圖案115與第2描繪圖案117之重疊區域118。 圖11係圖10之區域A之放大圖，亦記載第1點徑303及第2點徑304。 圖12係顯示設想將區域310整體作為第1描繪圖案115，僅將點徑作為第1點徑303描繪之情形之描繪圖案之圖。 圖13係顯示以包含複數行之圖案形成第2描繪圖案117之例之圖。 圖14係顯示使用標記裝置1之標記順序之流程圖。 圖15係圖14之S2之詳細之流程圖。 圖16(a)～(c)係本發明之一實施形態之標記裝置1之加工台21周圍之側視圖，且為與圖15之各流程對應之圖。 圖17(a)～(d)係本發明之一實施形態之標記裝置1之加工台21周圍之側視圖，且為與圖15之各流程對應之圖。FIG. 1 is a perspective view showing a schematic configuration of a marking device 1 according to an embodiment of the present invention. FIG. 2 is a block diagram of a marking device 1 according to an embodiment of the present invention. A thick line indicates a connection through a dedicated line, a waveform line indicates a connection through communication, and a thin line indicates a connection through an I / O (input / output) port. Connections are made. The dotted lines indicate connections made by analog lines. FIG. 3 is a cross-sectional view of a film 100 according to an embodiment of the present invention. FIG. 4 is a plan view showing a marking region 203 on a film 100 according to an embodiment of the present invention. FIG. 5 is a perspective view showing a schematic configuration of the laser processing section 3 and the actuator 71. FIG. 6 is a plan view showing an example of the entire drawing pattern 113 formed on the thin film 100. FIG. 7 is a plan view showing an example of the entire drawing pattern 113 formed on the thin film 100, and is an enlarged view of the vicinity of the wiring pattern 70 of FIG. 6. FIG. 8 is a plan view showing an example of the first drawing pattern 115 and is a view corresponding to FIG. 7. FIG. 9 is a plan view showing an example of the second drawing pattern 117, and is a view corresponding to FIG. 7. FIG. 10 is a plan view showing an example of the overall drawing pattern 113. The first drawing pattern 115 is displayed in a portion drawn with oblique lines, the second drawing pattern 117 is displayed in a portion drawn with dots, and the first drawing pattern 115 and the portion shown in a grid are displayed. The overlapping area 118 of the second drawing pattern 117. FIG. 11 is an enlarged view of the area A in FIG. 10, and the first point diameter 303 and the second point diameter 304 are also described. FIG. 12 is a drawing showing a drawing pattern in a case where the entire area 310 is drawn as the first drawing pattern 115 and only the dot diameter is drawn as the first dot diameter 303. FIG. 13 is a diagram showing an example in which the second drawing pattern 117 is formed in a pattern including a plurality of lines. FIG. 14 is a flowchart showing a marking sequence using the marking device 1. FIG. FIG. 15 is a detailed flowchart of S2 in FIG. 14. 16 (a) to 16 (c) are side views around the processing table 21 of the marking device 1 according to an embodiment of the present invention, and are views corresponding to the processes in FIG. Figs. 17 (a) to (d) are side views around the processing table 21 of the marking device 1 according to an embodiment of the present invention, and are views corresponding to the respective processes in Fig. 15.
Claims (9)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015200742A JP6608236B2 (en) | 2015-10-09 | 2015-10-09 | Marking device |
| JP2015-200742 | 2015-10-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201722599A TW201722599A (en) | 2017-07-01 |
| TWI677392B true TWI677392B (en) | 2019-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105130653A TWI677392B (en) | 2015-10-09 | 2016-09-22 | Marking device |
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| Country | Link |
|---|---|
| JP (1) | JP6608236B2 (en) |
| KR (1) | KR20180063103A (en) |
| CN (1) | CN108025392B (en) |
| TW (1) | TWI677392B (en) |
| WO (1) | WO2017061222A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7119421B2 (en) * | 2018-02-27 | 2022-08-17 | Ａｇｃ株式会社 | Glass plate with identification mark and method for forming identification mark on glass plate |
| JP2020007591A (en) * | 2018-07-04 | 2020-01-16 | Ｄｇｓｈａｐｅ株式会社 | Processing method, processing system, and processing program |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07116869A (en) * | 1993-10-21 | 1995-05-09 | Nippon Steel Corp | Marking method by laser beam |
| WO2015129316A1 (en) * | 2014-02-27 | 2015-09-03 | 東レエンジニアリング株式会社 | Marking device and pattern generation device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2577638B2 (en) * | 1989-07-14 | 1997-02-05 | 三井東圧化学株式会社 | Laser marking method and apparatus |
| JPH04356380A (en) * | 1991-05-24 | 1992-12-10 | Fuji Electric Co Ltd | Laser marking method |
| JP4461740B2 (en) | 2003-08-21 | 2010-05-12 | オムロン株式会社 | Laser marking device |
| JP3872462B2 (en) | 2003-09-01 | 2007-01-24 | 住友重機械工業株式会社 | Laser processing apparatus and laser processing method |
| JP2007025394A (en) * | 2005-07-19 | 2007-02-01 | Fujifilm Holdings Corp | Pattern forming method |
| JP5248205B2 (en) | 2008-05-29 | 2013-07-31 | パナソニック デバイスＳｕｎｘ株式会社 | Laser marking device |
| JP5896459B2 (en) * | 2012-03-06 | 2016-03-30 | 東レエンジニアリング株式会社 | Marking apparatus and method |
-
2015
- 2015-10-09 JP JP2015200742A patent/JP6608236B2/en active Active
-
2016
- 2016-09-07 KR KR1020187009237A patent/KR20180063103A/en not_active Application Discontinuation
- 2016-09-07 WO PCT/JP2016/076250 patent/WO2017061222A1/en active Application Filing
- 2016-09-07 CN CN201680052982.6A patent/CN108025392B/en active Active
- 2016-09-22 TW TW105130653A patent/TWI677392B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07116869A (en) * | 1993-10-21 | 1995-05-09 | Nippon Steel Corp | Marking method by laser beam |
| WO2015129316A1 (en) * | 2014-02-27 | 2015-09-03 | 東レエンジニアリング株式会社 | Marking device and pattern generation device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108025392B (en) | 2020-03-03 |
| TW201722599A (en) | 2017-07-01 |
| JP2017070989A (en) | 2017-04-13 |
| KR20180063103A (en) | 2018-06-11 |
| JP6608236B2 (en) | 2019-11-20 |
| WO2017061222A1 (en) | 2017-04-13 |
| CN108025392A (en) | 2018-05-11 |
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