TWI677141B - 電子信號處理裝置 - Google Patents
電子信號處理裝置 Download PDFInfo
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- G06F13/38—Information transfer, e.g. on bus
- G06F13/382—Information transfer, e.g. on bus using universal interface adapter
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- H—ELECTRICITY
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H01R12/716—Coupling device provided on the PCB
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
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- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
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- H—ELECTRICITY
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H—ELECTRICITY
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
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Abstract
一種電子信號處理裝置包含有一印刷電路板、一信號處理晶片、複數個導電線路、複數個銅墊以及一固定裝置。信號處理晶片安裝於印刷電路板之上,複數個導電線路形成於印刷電路板之上並連接信號處理晶片。銅墊則分別形成在導電線路的末端。固定裝置設置於印刷電路板之上,並露出上述之銅墊,以用來連接一線材組件,進而提升信號完整度。
Description
本發明係有關於一種電子信號處理裝置。特別是有關於一種高頻電子信號處理裝置。
隨著各類電子產品的技術的持續進步與不斷創新,新的電子產品相對地需要更多的頻寬。因此,現今世界也越來越依賴於資訊快速與可靠的傳遞。
當半導體在技術上持續的突破,已經在PC匯流排架構、網路基礎設施、數位無線通訊得到廣泛的應用。在個人電腦,特別是在伺服器處理器的速度已經升級到GHz的範圍內,同時記憶體的傳輸量和內部匯流排速度也隨之上升。高速的資料傳輸技術支援更為強大的電腦應用,如3D遊戲和電腦輔助設計程式。先進的三維圖像需要大量的資料在CPU、記憶體、顯示卡中進行傳輸。
然而,電腦技術只是頻寬資訊時代的一個部分。數位通訊設備設計工程師也正逐步採用更高頻的資料傳輸技術。與此同時,在數位高畫質視訊技術領域,正在設計下一代傳輸高畫質、互動視訊的設備。眾多技術不斷驅使資料傳輸率進步。新興的串列匯流排正在打破平行匯流排構架
的瓶頸。
逐漸增長的頻寬,為數位系統設計帶來的挑戰,曾經在毫秒時間內發生的資料互動,現在要以奈秒來衡量。為了能更精確地傳送所需的信號,如何能提高信號傳輸的正確性與速率,為業者與使用者所企盼。
發明內容旨在提供本揭示內容的簡化摘要,以使閱讀者對本揭示內容具備基本的理解。此發明內容並非本揭示內容的完整概述,且其用意並非在指出本發明實施例的重要/關鍵元件或界定本發明的範圍。
本發明內容之一目的是在提供一種電子信號處理裝置,可以有效地提升高頻信號完整度,進而增加高頻信號傳輸的品質與速率。
為達上述目的,本發明內容之一技術態樣係關於一種電子信號處理裝置,包含有一印刷電路板、一信號處理晶片、複數個導電線路、複數個銅墊以及一固定裝置。
信號處理晶片安裝於印刷電路板之上,複數個導電線路形成於印刷電路板之上並連接信號處理晶片。銅墊,例如是金手指,則分別形成在導電線路的末端。固定裝置設置於印刷電路板之上,並露出上述之銅墊,以用來連接一線材組件。
在一些實施例中,固定裝置包含有一U型保護殼,固定於印刷電路板之上。
在一些實施例中,固定裝置更包含有一保護
蓋,連接於U型保護殼。
在一些實施例中,保護蓋包含有一樞軸,樞接於U型保護殼。
在一些實施例中,保護蓋包含有一固定凸起,U型保護殼包含有一固定凹槽,以將保護蓋固定在U型保護殼。
在一些實施例中,U型保護殼包含有一定位凹槽,以用來定位線材組件的一定位凸緣。此外,保護蓋更包含一壓制凸緣,以將線材組件的定位凸緣固定於定位凹槽之中。
在一些實施例中,線材組件包含有複數個電接觸件,電接觸件則包含有複數個變化寬度電接觸件,例如是具有變化寬度的信號傳輸電接觸件。
綜上所述,電子信號處理裝置不僅可以方便地與線材組件耦合,且線材組件的電接觸件可以直接接觸電路板上的銅墊,減少訊號處理晶片與線材之間所需的連接元件,有效地提升信號完整度,進而增加信號傳輸的品質與速率。此外,藉由電接觸件的尺寸變化,在進行高頻信號傳輸時,高頻信號完整度可以更有效地被提升,更進一步地增加高頻信號傳輸的品質與速率。
100‧‧‧線材組件
110‧‧‧線材
120‧‧‧電接觸件
121‧‧‧變化寬度電接觸件
130‧‧‧保護殼
138‧‧‧定位凸緣
140‧‧‧固定器
302‧‧‧接觸段
304‧‧‧外露段
306‧‧‧固定段
308‧‧‧線材連接段
310‧‧‧第一寬度
320‧‧‧第二寬度
330‧‧‧第三寬度
340‧‧‧第四寬度
350‧‧‧第五寬度
600‧‧‧電子信號處理裝置
610‧‧‧印刷電路板
620‧‧‧信號處理晶片
630‧‧‧固定裝置
632‧‧‧U型保護殼
633‧‧‧固定凹槽
634‧‧‧保護蓋
635‧‧‧樞軸
636‧‧‧容置空間
637‧‧‧固定凸起
638‧‧‧定位凹槽
639‧‧‧壓制凸緣
640‧‧‧導電線路
650‧‧‧銅墊
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1圖是依照本發明之一實施例所繪示的一種電子信號處理裝置之示意圖。
第2圖是依照本發明之一實施例所繪示的一種電子信號處理裝置之後視示意圖。
第3圖是依照本發明之一實施例所繪示的一種電子信號處理裝置之線材組件之電接觸件的正視示意圖。
下文係舉實施例配合所附圖式進行詳細說明,但所提供之實施例並非用以限制本揭露所涵蓋的範圍,而結構運作之描述非用以限制其執行之順序,任何由元件重新組合之結構,所產生具有均等功效的裝置,皆為本揭露所涵蓋的範圍。另外,圖式僅以說明為目的,並未依照原尺寸作圖。為使便於理解,下述說明中相同元件或相似元件將以相同之符號標示來說明。
另外,在全篇說明書與申請專利範圍所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。某些用以描述本揭露之用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本揭露之描述上額外的引導。
於實施方式與申請專利範圍中,除非內文中對於冠詞有所特別限定,否則『一』與『該』可泛指單一個或複數個。而步驟中所使用之編號僅係用來標示步驟以便於說明,而非用來限制前後順序及實施方式。
其次,在本文中所使用的用詞『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意
指包含但不限於。
參閱第1圖至第3圖,第1圖根據本發明之一實施例所繪示的一種電子信號處理裝置之示意圖,第2圖是其後視示意圖,而第3圖則是電子信號處理裝置之線材組件之電接觸件的正視示意圖。
如圖所示,電子信號處理裝置600包含有一印刷電路板610、一信號處理晶片620、複數個導電線路640、複數個銅墊(pad)650以及一固定裝置630。
信號處理晶片620安裝於印刷電路板610之上,而導電線路640形成於印刷電路板610之上,並用以電性連接信號處理晶片620,複數個銅墊650則分別形成在導電線路640的末端。固定裝置630亦設置於印刷電路板610之上,並露出前述之銅墊650,以用來連接一線材組件100。其中,銅墊650可直接與線材組件100的電接觸件120相互接觸,且印刷電路板610上無需另外安裝電連接器,線材組件100的電接觸件120直接連接印刷電路板610上的銅墊650,例如是金手指,故可以有效地降低信號的衰減或變異,進而提升信號完整度,更增加信號傳輸的品質與速率。
在一些實施例中,固定裝置630包含有一U型保護殼632以及一保護蓋634,U型保護殼632固定於印刷電路板610之上,以形成一容置空間636,並使銅墊650外露於容置空間636,而保護蓋634利用一樞軸635樞接於U型保護殼632,並可蓋在U型保護殼632之上。
在一些實施例中,保護蓋634包含有一固定凸起637,例如是一彈性鋼珠或一凸塊,當保護蓋634蓋在U型保
護殼632之上時,保護蓋634的固定凸起637耦合U型保護殼632的一固定凹槽633,以將保護蓋634固定在U型保護殼632,然本發明並不限定於此,其可以利用其他的固定裝置,或將固定凸起637與固定凹槽633的位置互換,其均不脫離本發明之精神與範圍。
在一些實施例中,U型保護殼632包含有一定位凹槽638,以用來定位線材組件100的一定位凸緣138。且當保護蓋634蓋在U型保護殼632之上時,利用保護蓋634上的壓制凸緣639,以將線材組件100的定位凸緣138固定於定位凹槽638之中,進而有效地確保印刷電路板610上的銅墊650與線材組件100的電接觸件120相互接觸,以穩定的傳輸信號。
在一些實施例中,線材組件100的電接觸件120至少包含複數個變化寬度電接觸件121。且變化寬度電接觸件121可以有效地傳輸高頻信號,例如是信號傳輸電接觸件。
同時參閱第1圖至第3圖,線材組件100包含有複數個線材110、複數個電接觸件120、一保護殼130以及一固定器140。
線材110分別固定於電接觸件120,並利用固定器140,固定電接觸件120,然後,將固定器140、線材110以及電接觸件120安裝於保護殼130。
電接觸件120則依序形成有接觸段302、外露段304、固定段306以及線材連接段308。電接觸件120的接觸段302用以電性連接一電路板,例如是主機板等電子裝置的印刷電路板等,上裸露的金手指等。
電接觸件120的線材連接段308則用來連接線材110,以使兩者電性連接,其可以是利用焊接等方式,將兩者加以連接。
電接觸件120至少包含一個以上的變化寬度電接觸件121,用來進行信號傳輸,藉由變化寬度,有效地提升信號完整度(signal integrity;SI),進而增加信號傳輸的品質與速率,特別是高頻的信號完整度,例如是使用在5吉赫(gigahertz;GHz)以上的信號傳輸時,有效地提升信號完整度,以增加信號傳輸的品質與速率。
變化寬度電接觸件121可以包含有第一寬度310、第二寬度320、第三寬度330、第四寬度340以及第五寬度350。
在一些實施例中,第一寬度310與第二寬度320設置於外露段304,其中,第一寬度310鄰近接觸段302,而第二寬度320位於第一寬度310與固定段306之間。第一寬度310不同於第二寬度320,以改變變化寬度電接觸件121的信號傳輸的寬度,有效地提升信號完整度,進而增加信號傳輸的品質與速率,特別是高頻的信號完整度。
在一些實施例中,第一寬度310大於第二寬度320。在另一些實施例中,第一寬度310小於第二寬度320。
此外,第三寬度330形成在固定段306之中。在一些實施例中,第一寬度310大於第三寬度330。在另一些實施例中,第一寬度310小於第三寬度330。
第四寬度340以及第五寬度350則形成在線材連接段308之中。在一些實施例中,第一寬度310大於第四寬
度340。在另一些實施例中,第一寬度310小於第四寬度340。
在一些實施例中,第一寬度310等於第五寬度350。在另一些實施例中,第一寬度310不等於第五寬度350。
經由實驗可知,當使用變化寬度電接觸件121進行高頻信號傳輸時,藉由變化寬度,可以有效地提升信號完整度,進而增加信號傳輸的品質與速率。
綜上所述,電子信號處理裝置不僅可以方便地與線材組件耦合,且線材組件的電接觸件可以直接接觸電路板上的銅墊,減少訊號處理晶片與線材之間所需的連接元件,有效地提升信號完整度,進而增加信號傳輸的品質與速率。此外,藉由電接觸件的尺寸變化,在進行高頻信號傳輸時,高頻信號完整度可以更有效地被提升,更進一步地增加高頻信號傳輸的品質與速率。
雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何本領域具通常知識者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。
Claims (8)
- 一種電子信號處理裝置,包含:一印刷電路板;一信號處理晶片,安裝於該印刷電路板之上;複數個導電線路,形成於該印刷電路板之上,並連接該信號處理晶片;複數個銅墊,分別形成在該些導電線路的末端;以及一固定裝置,設置於該印刷電路板之上,並露出該些銅墊,以用來連接一線材組件,其中該固定裝置包含一U型保護殼,固定於該印刷電路板之上,且該U型保護殼包含一定位凹槽,以用來定位該線材組件的一定位凸緣。
- 如請求項1所述之電子信號處理裝置,其中該固定裝置更包含一保護蓋,連接於該U型保護殼。
- 如請求項2所述之電子信號處理裝置,其中該保護蓋包含一樞軸,樞接於該U型保護殼。
- 如請求項2所述之電子信號處理裝置,其中該保護蓋包含一固定凸起,而該U型保護殼包含一固定凹槽,以固定該保護蓋在該U型保護殼。
- 如請求項4所述之電子信號處理裝置,其中該保護蓋更包含一壓制凸緣,以將該線材組件的該定位凸緣固定於該定位凹槽之中。
- 如請求項1所述之電子信號處理裝置,其中該線材組件包含複數個電接觸件。
- 如請求項6所述之電子信號處理裝置,其中該些電接觸件包含複數個變化寬度電接觸件。
- 如請求項7所述之電子信號處理裝置,其中該些變化寬度電接觸件係為信號傳輸電接觸件。
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