TWI667119B - Resin sealing method and resin sealing device - Google Patents
Resin sealing method and resin sealing device Download PDFInfo
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- TWI667119B TWI667119B TW104144363A TW104144363A TWI667119B TW I667119 B TWI667119 B TW I667119B TW 104144363 A TW104144363 A TW 104144363A TW 104144363 A TW104144363 A TW 104144363A TW I667119 B TWI667119 B TW I667119B
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- resin
- substrate
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- lower mold
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- 239000011347 resin Substances 0.000 title claims abstract description 417
- 229920005989 resin Polymers 0.000 title claims abstract description 417
- 238000007789 sealing Methods 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims abstract description 172
- 238000000465 moulding Methods 0.000 claims abstract description 23
- 239000012530 fluid Substances 0.000 claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
消除因供給到樹脂密封模的各基板的厚度T的偏差而引起的、進行樹脂密封成形時的不良情況。 The problem of performing resin sealing molding due to the variation in the thickness T of each substrate supplied to the resin sealing mold is eliminated.
準備一片基板19，該基板19具有能覆蓋下模18的樹脂供給部23、兩個樹脂通道部28、兩個樹脂成形部29和下模18在樹脂成形部29外方周圍中的模面的大小(寬度)。使安裝在基板19上的兩組被密封部件19a朝下，將基板19安置在上模13的基板安置部13a。在上下兩模13、18合模時，使基板19上的兩組被密封部件19a分別收容在設置於下模18的兩個樹脂成形部29內。維持合模後的狀態並使流動性樹脂在各樹脂成形部29內固化，由此將各樹脂成形部29中的基板19上的被密封部件19a密封在由固化樹脂構成的樹脂封裝部內。 A substrate 19 having a resin supply portion 23 capable of covering the lower mold 18, two resin passage portions 28, two resin molded portions 29, and a die surface of the lower mold 18 in the periphery of the resin molded portion 29 is prepared. Size (width). The two sets of sealed members 19a mounted on the substrate 19 are faced downward, and the substrate 19 is placed on the substrate seating portion 13a of the upper mold 13. When the upper and lower molds 13 and 18 are clamped, the two sets of sealed members 19a on the substrate 19 are housed in the two resin molded portions 29 provided in the lower mold 18, respectively. The state after the mold clamping is maintained and the fluid resin is cured in each of the resin molded portions 29, whereby the sealed member 19a on the substrate 19 in each of the resin molded portions 29 is sealed in a resin package portion made of a cured resin.
Description
本發明涉及一種用於對安裝在基板上的電子零件等被密封部件進行樹脂密封的樹脂密封方法及樹脂密封裝置。更詳細而言，涉及一種改進成有效地防止因供給到樹脂密封模中的各基板的厚度不同而產生成形不良等不良情況的樹脂密封方法及樹脂密封裝置。 The present invention relates to a resin sealing method and a resin sealing device for resin-sealing a sealed member such as an electronic component mounted on a substrate. More specifically, the present invention relates to a resin sealing method and a resin sealing device which are improved to prevent defects such as molding failure due to the difference in thickness of each substrate supplied to the resin sealing mold.
眾所周知，藉由向樹脂密封模供給兩片基板，並且對該各基板上的被密封部件同時進行樹脂密封，來追求高效率生產的樹脂密封方法及樹脂密封裝置。 It is known that a resin sealing method and a resin sealing device for high-efficiency production are pursued by supplying two substrates to a resin sealing mold and simultaneously sealing the sealed members on the respective substrates.
例如，如圖5中示意性地圖示，裝設在樹脂密封裝置的樹脂密封模1由上下相對設置的上模1a和下模1b構成。 For example, as schematically illustrated in Fig. 5, the resin sealing mold 1 mounted on the resin sealing device is composed of an upper mold 1a and a lower mold 1b which are disposed to face each other.
而且，在上模1a的中央位置設置有形成有主流道2a的主流道塊2，並且與該主流道塊2相鄰在其兩側位置配設有基板安置塊4，其中，在該基板安置塊4設置有用於安置基板3的基板安置部4a。 Further, a main flow path block 2 on which the main flow path 2a is formed is disposed at a central position of the upper mold 1a, and a substrate seating block 4 is disposed adjacent to the main flow path block 2 at a position on both sides thereof, wherein the substrate is disposed on the substrate The block 4 is provided with a substrate seating portion 4a for arranging the substrate 3.
另外，在與上模的主流道塊2對應的下模1b的位置設置有料筒塊5，並且在與上模的基板安置塊4對應的下模1b的位置配設有空腔塊6，其中，在該空腔塊6設置有空腔6a(樹脂成形部)。 Further, a cartridge block 5 is disposed at a position of the lower mold 1b corresponding to the main flow path block 2 of the upper mold, and a cavity block 6 is disposed at a position of the lower mold 1b corresponding to the substrate seating block 4 of the upper mold, wherein A cavity 6a (resin forming portion) is provided in the cavity block 6.
另外，在下模的料筒塊5中設置有用於供給樹脂材料7的料筒5a(樹脂供給部)，並且在該料筒5a嵌裝有用於對在該料筒5a內被加熱熔化的樹 脂材料7進行加壓的柱塞8(樹脂加壓構件)。 Further, a cartridge 5a (resin supply portion) for supplying the resin material 7 is provided in the cartridge block 5 of the lower mold, and a tree for heating and melting in the cartridge 5a is fitted in the cartridge 5a. The grease material 7 is a plunger 8 (resin pressurizing member) that is pressurized.
另外，如圖5的(2)所示，在料筒塊5和空腔塊6中設置有澆口5b、6b(樹脂通道部)，該澆口5b、6b用於在上模1a和下模1b合模時，將在料筒5a內加熱熔化的熔融樹脂7a移送到空腔6a內。 Further, as shown in (2) of Fig. 5, gates 5b, 6b (resin passage portions) are provided in the cylinder block 5 and the cavity block 6, and the gates 5b, 6b are used for the upper mold 1a and the lower portion. When the mold 1b is closed, the molten resin 7a heated and melted in the cylinder 5a is transferred into the cavity 6a.
為了使用樹脂密封模1對兩片基板3上的被密封部件3a同時進行樹脂密封，首先，在圖5的(1)所示的上模1a和下模1b開模時，在下模1b的模面上張緊設置脫模膜9，並且隔著該脫模膜9，將樹脂材料7供給到下模1b的料筒5a內，而且，將兩片基板3分別供給並安置到上模的基板安置塊4中的基板安置部4a。 In order to simultaneously perform resin sealing on the sealed member 3a on the two substrates 3 using the resin sealing mold 1, first, in the mold of the lower mold 1b when the upper mold 1a and the lower mold 1b shown in (1) of Fig. 5 are opened. The release film 9 is stretched on the surface, and the resin material 7 is supplied into the cylinder 5a of the lower mold 1b via the release film 9, and the two substrates 3 are separately supplied and placed on the substrate of the upper mold. The substrate seating portion 4a in the block 4 is placed.
此外，此時基板3上的被密封部件3a以朝下的姿勢安置。 Further, at this time, the sealed member 3a on the substrate 3 is placed in a downward posture.
接著，如圖5的(2)所示，對上模1a和下模1b進行合模，以使基板3上的被密封部件3a隔著脫模膜9分別嵌裝在下模1b的空腔6a內。 Next, as shown in (2) of FIG. 5, the upper mold 1a and the lower mold 1b are clamped so that the sealed member 3a on the substrate 3 is fitted into the cavity 6a of the lower mold 1b via the release film 9 respectively. Inside.
接著，對各基板3施加由上模1a和下模1b引起的合模壓力，並且在該狀態下，藉由柱塞8對在料筒5a加熱熔化的熔融樹脂7a進行加壓，將該熔融樹脂通過澆口5b、6b注入到各空腔6a內。 Next, the mold clamping pressure by the upper mold 1a and the lower mold 1b is applied to each of the substrates 3, and in this state, the molten resin 7a heated and melted in the cylinder 5a is pressurized by the plunger 8, and the melting is performed. The resin is injected into each of the cavities 6a through the gates 5b, 6b.
此外，該熔融樹脂7a受到由上模1a和下模1b引起的加熱作用和由柱塞8引起的既定的樹脂壓力而固化，形成固化樹脂(未圖示)。而且，安置在各空腔6a內的被密封部件3a被密封在由與空腔6a的形狀對應成形的固化樹脂構成的樹脂封裝部內，並且在構成於料筒5a與各空腔6a之間的樹脂通道部即由主流道2a和澆口5b、6b構成的空間部形成作為產品不需要的固化樹脂。 Further, the molten resin 7a is cured by a heating action by the upper mold 1a and the lower mold 1b and a predetermined resin pressure by the plunger 8, thereby forming a cured resin (not shown). Further, the sealed member 3a disposed in each of the cavities 6a is sealed in a resin encapsulation portion composed of a cured resin formed corresponding to the shape of the cavity 6a, and is formed between the cartridge 5a and each of the cavities 6a. The resin passage portion, that is, the space portion composed of the main flow path 2a and the gates 5b, 6b forms a cured resin which is not required as a product.
然而，有時供給到上模1a和下模1b之間的兩片基板3的厚度T1、T2互不相同。如果在這種狀態下對該上模1a和下模1b進行合模，則在較厚的一側(厚度T1)的基板施加較高的合模壓力，相反，在較薄的一側(厚度T2)的基板施加較低的合模壓力。 However, the thicknesses T1 and T2 of the two substrates 3 supplied between the upper mold 1a and the lower mold 1b are sometimes different from each other. If the upper mold 1a and the lower mold 1b are clamped in this state, a higher mold clamping pressure is applied to the substrate on the thicker side (thickness T1), and conversely, on the thinner side (thickness The substrate of T2) applies a lower clamping pressure.
因此，在對各基板3的合模壓力產生偏差，所謂每個模的平衡變差。而且，如果在對各基板3的合模壓力存在這種偏差的狀態下，將料筒5a內的熔融樹脂7a通過澆口5b、6b加壓注入到各空腔6a內，則會有例如從合模壓力不足的上下兩模面的部位漏出熔融樹脂7a的一部分而形成樹脂毛刺，或者受到過大的合模壓力的基板的一部分破損而產生成形不良品等的弊害。 Therefore, variations in the mold clamping pressure of the respective substrates 3 are caused, and the balance of each mold is deteriorated. Further, if there is such a deviation in the mold clamping pressure of each of the substrates 3, the molten resin 7a in the cylinder 5a is pressure-injected into the respective cavities 6a through the gates 5b, 6b, for example, from A portion of the upper and lower mold faces where the mold clamping pressure is insufficient leaks a part of the molten resin 7a to form a resin burr, or a part of the substrate subjected to an excessive mold clamping pressure is broken to cause a defect such as a molded product.
另外，藉由設定為使基板3上的被密封部件3a隔著脫模膜9嵌裝到下模1b的空腔6a內，並且使該被密封部件的表面(在圖中為底面)隔著脫模膜9壓接在該空腔6a的底面的狀態，可成形為使被密封部件3a的表面從與該空腔6a的形狀對應成形的樹脂封裝部露出到外部。 Further, the sealing member 3a on the substrate 3 is fitted into the cavity 6a of the lower mold 1b via the release film 9, and the surface of the member to be sealed (the bottom surface in the drawing) is interposed. The release film 9 is pressed against the bottom surface of the cavity 6a, and can be formed such that the surface of the member to be sealed 3a is exposed to the outside from the resin package portion formed in accordance with the shape of the cavity 6a.
但是，由於無法設定為基板3的厚度較薄(厚度T2)的基板上的被密封部件3a隔著脫模膜9壓接在空腔6a的底面的狀態(參照圖5的(2))，因此存在無法成形為使該被密封部件3a的表面露出到樹脂封裝部的外部的狀態的問題。 However, the state in which the sealed member 3a on the substrate having a small thickness (thickness T2) of the substrate 3 cannot be pressed against the bottom surface of the cavity 6a via the release film 9 (see (2) of FIG. 5), Therefore, there is a problem that the surface of the member to be sealed 3a cannot be exposed to the outside of the resin package portion.
另外，如果在將兩片基板3分別供給並安置到上模的各基板安置塊4中的基板安置部4a的情況下，將料筒5a內的熔融樹脂7a通過澆口5b、6b加壓注入到各空腔6a內，並且對該熔融樹脂7a施加既定的樹脂壓力，則熔融樹脂7a的一部分浸入到各基板3中的主流道塊2側的端面3b 而形成樹脂毛刺，因此存在降低作為成形品的樹脂密封後基板的品質的問題。 Further, in the case where the two substrates 3 are separately supplied and placed to the substrate seating portion 4a in each of the substrate seating blocks 4 of the upper mold, the molten resin 7a in the cylinder 5a is pressurized and injected through the gates 5b, 6b. When a predetermined resin pressure is applied to the molten resin 7a, a part of the molten resin 7a is immersed in the end face 3b on the side of the main channel block 2 in each of the substrates 3. Since the resin burr is formed, there is a problem that the quality of the substrate after resin sealing as a molded article is lowered.
另外，提出了將兩片基板以使該基板的端面接合的狀態供給並安置到上模的技術方案(參照專利文獻1)。 Further, a proposal has been made to supply and mount two substrates in a state in which the end faces of the substrates are joined to each other (see Patent Document 1).
在這種情況下，與上述相同，能夠對兩片基板上的被密封部件大致同時進行密封成形。 In this case, as in the above, the sealed members on the two substrates can be substantially simultaneously sealed and formed.
但是，在專利文獻1中記載的技術方案中，供給並安置到上模上的兩片基板的厚度必須相同。 However, in the technical solution described in Patent Document 1, the thickness of the two substrates supplied and placed on the upper mold must be the same.
因此，當兩片基板的厚度互不相同時，存在無法期待有效的樹脂密封的問題。 Therefore, when the thicknesses of the two substrates are different from each other, there is a problem that an effective resin sealing cannot be expected.
進而，在兩片基板的厚度互不相同的情況下，不得不採用用於分別吸收各基板3的厚度偏差的合模壓力調整手段(浮動模結構等)，因此存在樹脂密封模的模結構複雜化和大型化，並且樹脂密封模和樹脂密封裝置的整體製造成本昂貴的問題。 Further, in the case where the thicknesses of the two substrates are different from each other, it is necessary to employ a mold clamping pressure adjusting means (a floating mold structure or the like) for absorbing the thickness variations of the respective substrates 3, so that the mold structure of the resin sealing mold is complicated. The problem of enlargement and enlargement, and the overall manufacturing cost of the resin sealing mold and the resin sealing device are expensive.
專利文獻1：日本特開2007-307766號公報(參照說明書第[0013]段、第[0026]段、第[0046]段及圖3、圖5和圖6等) Patent Document 1: Japanese Laid-Open Patent Publication No. 2007-307766 (refer to paragraph [0013], paragraph [0026], paragraph [0046], and FIG. 3, FIG. 5, and FIG.
本發明的目的在於提供一種樹脂密封方法及用於實施該方法的樹脂密封裝置，該樹脂密封方法能解決因供給到樹脂密封模的各基板的厚度偏差而引起的樹脂密封成形方面的不良情況，並且可不需要與各基板的厚度偏差對應附設的現有的合模壓力調整手段。 An object of the present invention is to provide a resin sealing method and a resin sealing device for carrying out the method, which can solve the problem of resin sealing formation caused by variations in thickness of each substrate supplied to a resin sealing mold, Further, the conventional mold clamping pressure adjusting means attached to the thickness deviation of each substrate is not required.
為了解決上述問題，本發明所涉及的樹脂密封方法為， 至少將上模和下模相對設置而成的樹脂密封模具有樹脂供給部，將位於該樹脂供給部的流動性樹脂通過樹脂通道部注入到樹脂成形部內，使該樹脂成形部內的該流動性樹脂固化而形成固化樹脂，來成形由該固化樹脂構成的樹脂封裝部，將供給到該樹脂成形部中的一片基板上的被密封部件密封在該樹脂封裝部內，其特徵在於，包含：準備該下模的步驟，在該下模的中央位置配設該樹脂供給部，並且在與該樹脂供給部相鄰的位置分別經由使與該樹脂供給部連通連接的至少兩個該樹脂通道部配設至少兩個該樹脂成形部；準備該上模的步驟，將以該一片基板上的該被密封部件朝下的姿勢安置該一片基板的基板安置部配設在該上模，並且安置在該基板安置部的該一片基板上的該被密封部件具有和與該至少兩個樹脂成形部的配設位置對應的位置一致的形狀；準備該一片基板的步驟，該一片基板具有能覆蓋該樹脂供給部、該至少兩個樹脂通道部、該至少兩個樹脂成形部和位於該樹脂成形部外方周圍的該下模的模面的大小；基板搬入步驟，將該一片基板搬入到該上模與該下模之間；基板安置步驟，將該一片基板以該被密封部件朝下的姿勢安置在該上模的該基板安置部；樹脂供給步驟，向該樹脂供給部內供給樹脂材料；合模步驟，在該基板安置步驟和該樹脂供給步驟之後，閉合該上模的模面與該下模的模面來對該上模和該下模進行合模，使該被密封部件收容 在該各樹脂成形部內；以及合模維持步驟，維持將該上模和該下模合模後的狀態，在該合模維持步驟中，將在該樹脂供給部由該樹脂材料生成的該流動性樹脂通過該樹脂通道部注入到該樹脂成形部內，並且使該樹脂成形部內的該流動性樹脂固化而將該被密封部件密封在該樹脂封裝部內。 In order to solve the above problems, the resin sealing method according to the present invention is The resin sealing mold in which the upper mold and the lower mold are opposed to each other has a resin supply portion, and the fluid resin located in the resin supply portion is injected into the resin molded portion through the resin passage portion, and the fluid resin in the resin molded portion is made. Forming a cured resin to form a resin encapsulating portion made of the cured resin, and sealing the sealed member on one of the substrates formed in the resin molded portion in the resin encapsulating portion, comprising: preparing the lower portion a step of disposing the resin supply portion at a central position of the lower mold, and disposing at least two of the resin passage portions that are in communication with the resin supply portion at a position adjacent to the resin supply portion Two resin forming portions; a step of preparing the upper mold, disposing a substrate seating portion on which the one substrate is placed in a downward facing posture on the one substrate, and placing the substrate on the upper mold, and placing the substrate on the substrate The sealed member on the one piece of the substrate has a shape that coincides with a position corresponding to the arrangement position of the at least two resin molded portions; a step of the one substrate having a size capable of covering the resin supply portion, the at least two resin passage portions, the at least two resin molded portions, and the die face of the lower mold located outside the resin molded portion a substrate loading step of loading the one substrate between the upper mold and the lower mold; a substrate placing step of positioning the one substrate in the substrate placement portion of the upper mold with the sealed member facing downward; resin a supply step of supplying a resin material into the resin supply portion; a mold clamping step of closing the die face of the upper die and the die face of the lower die after the substrate placement step and the resin supply step to the upper die and the lower The mold is clamped to accommodate the sealed component In the respective resin molding portions and the mold clamping maintaining step, the state in which the upper mold and the lower mold are closed is maintained, and in the mold clamping maintaining step, the flow is generated in the resin supply portion from the resin material. The resin resin is injected into the resin molded portion through the resin passage portion, and the fluid resin in the resin molded portion is cured to seal the sealed member in the resin package portion.
本發明所涉及的樹脂密封方法具有如下的實施方式： 在該樹脂供給步驟之前，包含在該下模的該模面上張緊設置脫模膜的脫模膜張緊設置步驟。 The resin sealing method according to the present invention has the following embodiments: Before the resin supply step, a release film tensioning step of tensioning the release film is provided on the mold surface of the lower mold.
另外，本發明所涉及的樹脂密封方法具有如下的實施方式：在該樹脂供給步驟之前，包含在該下模的該模面上張緊設置脫模膜的脫模膜張緊設置步驟，在該合模步驟中，對分別收容在該樹脂成形部的該被密封部件和張緊設置在該各樹脂成形部內的該脫模膜進行壓接。 Further, the resin sealing method according to the present invention has an embodiment in which a release film tensioning step of tensioning a release film is provided on the die surface of the lower mold before the resin supply step, In the mold clamping step, the sealed member housed in the resin molded portion and the release film that is stretched in the respective resin molded portions are pressure-bonded.
為了解決上述問題，本發明所涉及的樹脂密封裝置為：具備：樹脂密封模，至少將上模和下模相對設置而成；樹脂供給部，設置於該下模；樹脂成形部，設置於該下模；以及樹脂通道部，供位於該樹脂供給部的流動性樹脂流動，該流動性樹脂從該樹脂供給部通過該樹脂通道部注入到該樹脂成形部內，在該樹脂成形部內使該流動性樹脂固化而成形由固化樹脂構成的樹脂封裝部，用來將安置在該樹脂成形部的一片基板上的被密封部件密封在該樹脂封裝部內，其特徵在於，具備：該樹脂供給部，被配設在該下模的中央位置； 至少兩個該樹脂通道部，被配設在與該樹脂供給部相鄰的位置且與該樹脂供給部分別連通；至少兩個該樹脂成形部，分別經由該至少兩個樹脂通道部而配設；以及基板安置部，設置於該上模，當將該一片基板以該被密封部件朝下的姿勢安置在該基板安置部時，該被密封部件和與該下模中的該至少兩個樹脂成形部的配設位置對應的位置一致，並且將該樹脂供給部、該至少兩個樹脂通道部、該至少兩個樹脂成形部和位於該樹脂成形部外方周圍的該下模的模面設定為該一片基板能覆蓋該樹脂供給部、該至少兩個樹脂通道部、該至少兩個樹脂成形部和位於該樹脂成形部外方周圍的該下模的模面，在該上模和該下模合模的狀態下，該一片基板上的各個該被密封部件被分別收容在該各樹脂成形部內，該樹脂供給部中的該流動性樹脂通過該樹脂通道部注入到該樹脂成形部內，該流動性樹脂在該樹脂成形部內固化，安置在該樹脂成形部的該一片基板上的該被密封部件被密封在成形於該樹脂成形部的該樹脂封裝部內。 In order to solve the above problems, the resin sealing device according to the present invention includes: a resin sealing mold in which at least an upper mold and a lower mold are opposed to each other; a resin supply portion provided in the lower mold; and a resin molded portion provided in the resin sealing portion a lower mold; and a resin passage portion through which the fluid resin located in the resin supply portion flows, the fluid resin is injected into the resin molded portion from the resin supply portion through the resin passage portion, and the fluidity is made in the resin molded portion The resin is cured to form a resin encapsulating portion made of a cured resin, and the member to be sealed placed on one of the resin molding portions is sealed in the resin encapsulating portion, and the resin supply portion is provided Located at the center of the lower mold; At least two of the resin passage portions are disposed adjacent to the resin supply portion and communicate with the resin supply portion, and at least two of the resin molded portions are disposed via the at least two resin passage portions And a substrate seating portion disposed on the upper mold, the sealed member and the at least two resins in the lower mold when the one substrate is placed in the substrate seating portion with the sealed member facing downward Positions corresponding to the arrangement positions of the molding portions are the same, and the resin supply portion, the at least two resin passage portions, the at least two resin molded portions, and the die face of the lower mold located around the outside of the resin molded portion are set. The mold supply portion, the at least two resin passage portions, the at least two resin molded portions, and the die face of the lower mold located around the outside of the resin molded portion, the upper mold and the lower portion In the state of the mold clamping, each of the sealed members on the one substrate is housed in each of the resin molding portions, and the fluid resin in the resin supply portion is injected into the tree through the resin passage portion. The forming section, the fluidity of the resin in the cured resin molded portion, which is disposed on a molded resin portion of the substrate which is formed in the sealing member is sealed inside the resin package portion of the resin molded portion.
本發明所涉及的樹脂密封裝置具有如下的實施方式：具備脫模膜張緊設置機構，用於在該下模的該模面張緊設置脫模膜。 The resin sealing device according to the present invention has an embodiment in which a release film tensioning mechanism is provided for tensioning a release film on the mold surface of the lower mold.
另外，本發明所涉及的樹脂密封裝置具有如下的實施方式：具備脫模膜張緊設置機構，用於在該下模的該模面張緊設置脫模膜，在該上模和該下模合模的狀態下，藉由該脫模膜張緊設置機構張緊設置的該脫模膜和該被密封部件被壓接。 Further, the resin sealing device according to the present invention has an embodiment in which a release film tensioning mechanism is provided for tensioning a release film on the mold surface of the lower mold, and the upper mold and the lower mold In the state of the mold clamping, the release film which is tensioned by the release film tensioning mechanism and the member to be sealed are pressure-bonded.
根據本發明，能夠在上模和下模的合模時將一片基板配置為覆蓋配設有至少兩個樹脂成形部的下模(下模主體)中的模面的整個區域。當以這種方式配置基板時，基板厚度不會產生偏差。因此，由於能夠對一片基板均等地施加由樹脂密封模引起的合模壓力，故每個模的平衡良好。因此，能有效且確實地防止因每個模的平衡的不良情況而引起的成形不良。 According to the present invention, it is possible to arrange one of the substrates to cover the entire area of the die face in the lower mold (lower mold main body) in which at least two resin molded portions are disposed at the time of mold clamping of the upper mold and the lower mold. When the substrate is configured in this manner, the substrate thickness does not vary. Therefore, since the mold clamping pressure caused by the resin sealing mold can be uniformly applied to one of the substrates, the balance of each mold is good. Therefore, it is possible to effectively and surely prevent the molding failure caused by the balance of each mold.
另外，根據本發明，不需要與供給到上模和下模之間的兩片基板的厚度偏差對應附設的現有的合模壓力調整手段。因此，能夠將樹脂密封模的模構造簡易省略化，能夠追求樹脂密封模和樹脂密封裝置的整體製造成本的降低。 Further, according to the present invention, it is not necessary to provide a conventional mold clamping pressure adjusting means corresponding to the thickness deviation of the two substrates supplied between the upper mold and the lower mold. Therefore, the mold structure of the resin sealing mold can be easily omitted, and the overall manufacturing cost of the resin sealing mold and the resin sealing device can be reduced.
10‧‧‧樹脂密封裝置 10‧‧‧Resin sealing device
11‧‧‧上模座 11‧‧‧Upper mold base
12‧‧‧固定盤 12‧‧‧ Fixed disk
13‧‧‧上模 13‧‧‧上模
13a‧‧‧基板安置部 13a‧‧‧Substrate Placement Department
14‧‧‧底座 14‧‧‧Base
15‧‧‧上下驅動機構 15‧‧‧Up and down drive mechanism
16‧‧‧可動盤 16‧‧‧ movable plate
17‧‧‧下模座 17‧‧‧ lower mold base
18‧‧‧下模 18‧‧‧Down
19‧‧‧基板 19‧‧‧Substrate
19a‧‧‧被密封部件 19a‧‧‧Sealed parts
19b‧‧‧樹脂密封部位 19b‧‧‧ resin sealing parts
19c‧‧‧露出面 19c‧‧‧ exposed face
20‧‧‧基板卡止機構 20‧‧‧Substrate locking mechanism
20a‧‧‧吸氣孔 20a‧‧‧ suction holes
21‧‧‧密封構件 21‧‧‧ Sealing members
22‧‧‧下模主體 22‧‧‧Subject main body
23‧‧‧樹脂供給部 23‧‧‧Resin Supply Department
24‧‧‧樹脂加壓構件 24‧‧‧Resin pressure member
25‧‧‧上下驅動機構 25‧‧‧Up and down drive mechanism
26‧‧‧脫模膜 26‧‧‧ release film
27‧‧‧減壓機構 27‧‧‧Relief mechanism
28‧‧‧樹脂通道部 28‧‧‧Resin Channel Department
29‧‧‧樹脂成形部 29‧‧‧Resin Forming Department
30‧‧‧密封構件 30‧‧‧ Sealing members
31‧‧‧搬入機構 31‧‧‧ Moving into the institution
R‧‧‧樹脂材料 R‧‧‧Resin materials
R1‧‧‧熔融樹脂(流動性樹脂) R1‧‧‧ molten resin (liquid resin)
R2‧‧‧樹脂封裝部 R2‧‧‧Resin Packaging Department
R3‧‧‧不需要樹脂 R3‧‧‧ does not require resin
T‧‧‧基板厚度 T‧‧‧ substrate thickness
圖1示意性地顯示本發明所涉及的樹脂密封裝置的主要部分，是顯示將基板和樹脂材料及脫模膜運送至樹脂密封模部的狀態的局部剖面前視圖。 Fig. 1 is a partial cross-sectional front view showing a state in which a substrate, a resin material, and a release film are transported to a resin sealing mold portion, which is a main part of the resin sealing device according to the present invention.
圖2顯示與圖1對應的樹脂密封裝置的主要部分，圖2的(1)是該樹脂密封模部開模時的局部剖面前視圖，圖2的(2)是其下模部分的俯視圖。 Fig. 2 shows a main portion of the resin sealing device corresponding to Fig. 1, and Fig. 2 (1) is a partial cross-sectional front view of the resin sealing mold portion when the mold is opened, and (2) of Fig. 2 is a plan view of the lower mold portion.
圖3顯示與圖2對應的樹脂密封模部，圖3的(1)是其合模時的局部剖面前視圖，圖3的(2)是顯示成形品的局部剖面前視圖，圖3的(2)是成形品的俯視圖，圖3的(4)是成形品的仰視圖。 Fig. 3 shows a resin sealing mold portion corresponding to Fig. 2, (1) of Fig. 3 is a partial cross-sectional front view at the time of mold clamping, and (2) of Fig. 3 is a partial cross-sectional front view showing the molded article, Fig. 3 ( 2) is a plan view of the molded article, and (4) of Fig. 3 is a bottom view of the molded article.
圖4的(1)至圖4的(6)是本發明方法的步驟說明圖。 (1) to (4) of Fig. 4 are explanatory diagrams of steps of the method of the present invention.
圖5是現有技術的問題點的說明圖，圖5的(1)是樹脂密封模部開模時的局部剖面前視圖，圖5的(2)是其合模時的局部剖面前視圖。 Fig. 5 is an explanatory view of a problem of the prior art, wherein (1) of Fig. 5 is a partial cross-sectional front view at the time of mold opening of the resin sealing mold portion, and (2) of Fig. 5 is a partial cross-sectional front view at the time of mold clamping.
以下，根據圖1至圖4所示的實施例圖說明本發明。 Hereinafter, the present invention will be described based on the embodiment shown in Figs. 1 to 4 .
首先，根據圖1，說明本發明所涉及的樹脂密封裝置10的概要。 First, an outline of a resin sealing device 10 according to the present invention will be described with reference to Fig. 1 .
於該樹脂密封裝置10具備：上模13，透過上模座11固定在固定盤12的下面；以及下模18，透過下模座17裝設在可動盤16的上面，該可動盤16被設置為可藉由配置在該樹脂密封裝置10的底座14上的上下驅動機構15上下移動。 The resin sealing device 10 includes an upper die 13 that is fixed to the lower surface of the fixed disk 12 through the upper die holder 11, and a lower die 18 that is mounted on the upper surface of the movable disk 16 through the lower die holder 17, and the movable disk 16 is disposed. The upper and lower drive mechanisms 15 disposed on the base 14 of the resin sealing device 10 are vertically movable.
另外，上模13的模面(下面)和下模18的模面(上面)被上下相對配置地設置，該上模13和下模18構成樹脂密封模。 Further, the die face (lower face) of the upper die 13 and the die face (upper face) of the lower die 18 are disposed to face up and down, and the upper die 13 and the lower die 18 constitute a resin seal die.
此外，上下驅動機構15被設置為，藉由使可動盤16、下模座17和下模18上下移動而能進行打開上模13和下模18的模面之間的開模(參照圖1)，並且能進行用於閉合上模13和下模18的模面的合模(參照圖3的(1))。因此，該上下驅動機構15構成模開閉機構。 Further, the upper and lower drive mechanism 15 is provided to open the mold between the die faces of the upper die 13 and the lower die 18 by moving the movable disk 16, the lower die holder 17, and the lower die 18 up and down (refer to FIG. 1). And the mold clamping for closing the die faces of the upper die 13 and the lower die 18 can be performed (refer to (1) of FIG. 3). Therefore, the vertical drive mechanism 15 constitutes a mold opening and closing mechanism.
另外，上模13的模面中的基板安置部13a設置有基板卡止機構20，該基板卡止機構20用於使安裝有複數個被密封部件19a的基板19以其被密封部件19a朝下的姿勢卡止。在作為基板卡止機構20外周圍的上模13的模面位置配置有用於使上模13和下模18的既定範圍密封的密封構件21。 Further, the substrate seating portion 13a in the die face of the upper mold 13 is provided with a substrate locking mechanism 20 for causing the substrate 19 on which the plurality of sealed members 19a are mounted to face down by the sealing member 19a The posture is stuck. A sealing member 21 for sealing the predetermined range of the upper mold 13 and the lower mold 18 is disposed at a position of the die surface of the upper mold 13 around the outer periphery of the substrate locking mechanism 20.
此外，圖中的符號20a表示與用於將基板19吸附到上模13的模面的基板吸附機構(未圖示)連通連接而設置的吸氣孔。 In addition, reference numeral 20a in the drawing denotes an intake hole provided in communication with a substrate suction mechanism (not shown) for adsorbing the substrate 19 to the die surface of the upper mold 13.
此外，基板19被形成為如將兩片當前使用的大小的基板(例 如，100mm×300mm程度的大小的矩形狀基板)合併成一組而形成的一片大型基板。 Further, the substrate 19 is formed as a substrate of two pieces of the currently used size (for example) For example, a rectangular substrate having a size of about 100 mm × 300 mm) is a large-sized substrate formed by combining one set.
另外，在下模18設置有：下模主體22，設置於下模座17上；樹脂供給部(料筒)23，被配置在該下模主體22的中央部且供給樹脂材料R；樹脂加壓構件(柱塞)24，以能夠滑動的狀態嵌裝到該樹脂供給部23；以及上下驅動機構25，設為能夠將該樹脂加壓構件24上下移動。 Further, the lower mold 18 is provided with a lower mold main body 22 which is provided on the lower mold base 17, and a resin supply portion (cartridge) 23 which is disposed at the central portion of the lower mold main body 22 and which is supplied with the resin material R; The member (plunger) 24 is fitted to the resin supply portion 23 in a slidable state, and the vertical drive mechanism 25 is configured to vertically move the resin pressing member 24.
另外，設置有減壓機構27(參照圖1)，該減壓機構27藉由從樹脂供給部23與樹脂加壓構件24的間隙吸引樹脂供給部23內的空氣而將脫模膜26吸附並張緊設置在下模18的模面(下模主體22的上面)。 In addition, a pressure reducing mechanism 27 (see FIG. 1) that sucks the air in the resin supply unit 23 from the gap between the resin supply unit 23 and the resin pressing unit 24 to adsorb the release film 26 is provided. The tension is placed on the die face of the lower die 18 (the upper surface of the lower die body 22).
此外，在上模13和下模18合模時，透過上下驅動機構25使樹脂加壓構件24向上移動，由此能對在樹脂供給部23被加熱熔化的樹脂材料(圖3所示的熔融樹脂R1)進行加壓。因此，該上下驅動機構25構成樹脂加壓機構。 Further, when the upper mold 13 and the lower mold 18 are clamped, the resin pressing member 24 is moved upward by the upper and lower drive mechanisms 25, whereby the resin material heated and melted in the resin supply portion 23 can be melted (the melting shown in Fig. 3). The resin R1) is pressurized. Therefore, the vertical drive mechanism 25 constitutes a resin pressurizing mechanism.
另外，脫模膜26藉由脫模膜張緊設置機構(未圖示)被搬入至下模18(下模主體22)的模面位置，並且包覆該下模18的模面。 Further, the release film 26 is carried into the mold surface position of the lower mold 18 (lower mold main body 22) by a release film tensioning mechanism (not shown), and covers the mold surface of the lower mold 18.
另外，在下模主體22中的作為樹脂供給部23的兩側的對象位置，設置有經由樹脂通道部28(在圖例中為澆口)分別連通的複數個(在圖例中為兩個)樹脂成形部(空腔)29。複數個被密封部件19a被分為與兩個樹脂成形部29相等的個數(在圖例中為兩個)的組。樹脂通道部28也可以具有被延長的流路(橫澆道)。 Further, in the lower mold main body 22, the target positions on both sides of the resin supply portion 23 are provided with a plurality of (in the illustrated example, two) resin forming which are respectively communicated via the resin passage portion 28 (gate in the illustrated example). Part (cavity) 29. The plurality of sealed members 19a are divided into groups equal to the number of the two resin molded portions 29 (two in the illustrated example). The resin passage portion 28 may have an extended flow path (traverse runner).
進而，被設置為，當上模13和下模18合模時(參照圖3的(1))，能在該各樹脂成形部29嵌合安置透過基板卡止機構20卡止在上模13的基板 安置部13a的基板19的兩側位置的各個樹脂密封部位19b(參照圖2)。 Further, when the upper mold 13 and the lower mold 18 are clamped (see (1) of FIG. 3), the resin molding portion 29 can be fitted and placed in the upper mold 13 by the transmission substrate locking mechanism 20. Substrate Each of the resin sealing portions 19b at the both sides of the substrate 19 of the seating portion 13a (see Fig. 2).
此外，如圖2的(2)所示，在俯視觀察時，該樹脂供給部23被設置為矩形狀。而且，在俯視觀察時，配設在作為該樹脂供給部23的兩側的對象位置的各樹脂成形部29的形狀也被設置為矩形狀。 Further, as shown in (2) of FIG. 2, the resin supply portion 23 is provided in a rectangular shape in plan view. In addition, the shape of each of the resin molded portions 29 disposed at the target positions on both sides of the resin supply portion 23 is also formed in a rectangular shape in a plan view.
另外，如圖1所示，在與配設於上模13的密封構件21相對的下模座17上的位置配設有密封構件30，該密封構件30用於在上模13和下模18合模時與該密封構件21一起作用密封該上模13和下模18的外方周圍。 Further, as shown in FIG. 1, a sealing member 30 is provided at a position on the lower die holder 17 disposed opposite to the sealing member 21 of the upper mold 13, and the sealing member 30 is used for the upper die 13 and the lower die 18 When the mold is closed, the sealing member 21 acts to seal the outer periphery of the upper mold 13 and the lower mold 18.
此外，減壓機構27被設置為可使被兩個密封構件21、30密封的範圍(密封範圍)內的空氣向該密封範圍外積極地排出。 Further, the pressure reducing mechanism 27 is provided such that the air in the range (sealing range) sealed by the two sealing members 21, 30 can be actively discharged outside the sealing range.
另外，被設置為，在圖1所示的上模13和下模18開模時，基板19和樹脂材料R的搬入機構31能移動至該上模13和下模18之間的既定位置，並且能使該搬入機構31上的基板19透過基板卡止機構20和基板吸附機構(吸氣孔20a)卡止在上模13的基板安置部13a。 Further, when the upper mold 13 and the lower mold 18 shown in FIG. 1 are opened, the loading mechanism 31 of the substrate 19 and the resin material R can be moved to a predetermined position between the upper mold 13 and the lower mold 18, Further, the substrate 19 on the loading mechanism 31 can be locked to the substrate seating portion 13a of the upper mold 13 through the substrate locking mechanism 20 and the substrate suction mechanism (suction hole 20a).
另外，搬入機構31被設置為能將該搬入機構31上的樹脂材料R供給到下模18的樹脂供給部23內。 Further, the loading mechanism 31 is provided so that the resin material R on the loading mechanism 31 can be supplied into the resin supply portion 23 of the lower mold 18.
此外，舉例說明了供給到下模18的樹脂供給部23的樹脂材料R為與該樹脂供給部23相比稍小型的錠狀樹脂或片狀樹脂等固體形狀樹脂的情況。可代替這種固體形狀樹脂使用任意樹脂。例如，可採用顆粒狀樹脂、微粒狀樹脂、粉末狀樹脂等固體形狀樹脂、膠狀樹脂、凝膠狀樹脂和液狀樹脂(在常溫下為液狀的樹脂)。也可以根據需要使用經預熱的錠狀樹脂等。 In addition, the resin material R supplied to the resin supply part 23 of the lower mold 18 is a case of a solid resin such as an ingot resin or a sheet resin which is slightly smaller than the resin supply unit 23 . Any resin may be used instead of such a solid shape resin. For example, a solid resin such as a particulate resin, a particulate resin or a powdery resin, a gel resin, a gel resin, and a liquid resin (a resin which is liquid at normal temperature) can be used. It is also possible to use a preheated ingot resin or the like as needed.
下面，針對使用該樹脂密封裝置10將基板19上的被密封部件19a一併樹脂密封的情況進行說明。 Next, a case where the sealed member 19a on the substrate 19 is collectively sealed by the resin sealing device 10 will be described.
首先，進行構成樹脂密封裝置10中的樹脂密封模的上模13的準備步驟和下模18的準備步驟，並且進行基板19的準備步驟。 First, the preparation step of the upper mold 13 constituting the resin sealing mold in the resin sealing device 10 and the preparation step of the lower mold 18 are performed, and the preparation step of the substrate 19 is performed.
此外，在下模18的中央位置配設有樹脂供給部23。在與該樹脂供給部23相鄰的位置經由與樹脂供給部23連通連接的樹脂通道部28配設有至少兩個樹脂成形部29。 Further, a resin supply portion 23 is disposed at a central position of the lower mold 18. At least two resin molded portions 29 are disposed at a position adjacent to the resin supply portion 23 via the resin passage portion 28 that is in communication with the resin supply portion 23.
另外，在上模13配設有用於以基板19上的被密封部件19a朝下的姿勢安置的基板安置部13a。供給並安置到該基板安置部13a的基板19上的被密封部件19a被設定為和與下模18中的至少兩個樹脂成形部29的配設位置對應的位置一致。 Further, the upper mold 13 is provided with a substrate seating portion 13a for arranging the sealed member 19a on the substrate 19 in a downward posture. The sealed member 19a that is supplied and placed on the substrate 19 of the substrate seating portion 13a is set to coincide with a position corresponding to the arrangement position of at least two resin molded portions 29 of the lower mold 18.
另外，基板19的大小(寬度)被設定為能夠覆蓋下模18的樹脂供給部23、樹脂通道部28、至少兩個樹脂成形部29及作為樹脂成形部29外方周圍的下模18(下模主體22)的模面。換言之，在樹脂密封裝置10中，以樹脂供給部23、樹脂通道部28、樹脂成形部29和位於樹脂成形部29外方周圍的下模18的模面被基板19覆蓋的方式，設定各個構件23、28、29、18的形狀。基板19是基板19的厚度T均等，並且被成形為一片基板。在本申請文件中“基板19的厚度T均等”這一內容是指，在以該一片基板19為對象進行樹脂密封的情況下，該一片基板19的厚度T的偏差小至在後述的樹脂密封後基板中不會有樹脂毛刺的形成和基板19的破損等弊害的程度。 In addition, the size (width) of the substrate 19 is set so as to cover the resin supply portion 23 of the lower mold 18, the resin passage portion 28, at least two resin molded portions 29, and the lower mold 18 around the outside of the resin molded portion 29. The die face of the mold body 22). In other words, in the resin sealing device 10, the respective members are set such that the resin supply portion 23, the resin passage portion 28, the resin molded portion 29, and the die surface of the lower mold 18 located around the outside of the resin molded portion 29 are covered by the substrate 19. The shape of 23, 28, 29, 18. The substrate 19 is equal in thickness T of the substrate 19, and is formed into a single substrate. In the present application, the term "the thickness T of the substrate 19 is equal" means that when the resin is sealed by the substrate 19, the variation in the thickness T of the one substrate 19 is as small as the resin seal described later. The back substrate does not have the disadvantage of the formation of resin burrs and the damage of the substrate 19.
接著，進行基板搬入步驟和樹脂搬入步驟(參照圖1和圖4 的(1))，透過搬入機構31，將準備好的基板19和樹脂材料R搬入到上模13和下模18之間。 Next, a substrate carrying step and a resin carrying step are performed (refer to FIGS. 1 and 4). (1)), the prepared substrate 19 and the resin material R are carried into between the upper mold 13 and the lower mold 18 through the loading mechanism 31.
接著，進行基板安置步驟，將在基板搬入步驟中搬入的基板19以被密封部件19a朝下的姿勢供給並安置到上模13的基板安置部13a。 Then, the substrate placement step is performed, and the substrate 19 carried in the substrate carrying-in step is supplied to the substrate seating portion 13a of the upper mold 13 in a downward posture by the sealing member 19a.
此外，在該基板安置步驟中，可透過基板卡止機構20使基板19以既定的姿勢卡止。此外，可藉由透過基板吸附機構(未圖示)從吸氣孔20a吸引基板19，使上模13的基板安置部13a更確實地吸附支撐該基板19(參照圖4的(2))。 Further, in the substrate placing step, the substrate 19 can be locked in a predetermined posture by the substrate locking mechanism 20. In addition, the substrate 19 is sucked from the air intake hole 20a by the substrate suction mechanism (not shown), and the substrate placement portion 13a of the upper mold 13 is more reliably adsorbed and supported by the substrate 19 (see (2) of FIG. 4).
另外，進行樹脂供給步驟，將在樹脂搬入步驟中搬入的樹脂材料R供給到下模18的樹脂供給部23內。 In addition, the resin supply step is performed, and the resin material R carried in the resin carrying step is supplied into the resin supply portion 23 of the lower mold 18.
在將樹脂材料R投入到樹脂供給部23內後，該樹脂材料以載置在樹脂加壓構件24的上面的方式被供給。 After the resin material R is placed in the resin supply portion 23, the resin material is supplied so as to be placed on the upper surface of the resin pressing member 24.
此外，在進行樹脂供給步驟之前，可藉由進行在下模18(下模主體22)的模面張緊設置脫模膜26的脫模膜張緊設置步驟，將樹脂材料R隔著該脫模膜26供給到樹脂供給部23內(參照圖2的(1)和圖4的(2))。 Further, before the resin supply step, the release film of the release film 26 can be stretched by the mold surface of the lower mold 18 (the lower mold main body 22), and the resin material R can be separated by the mold release. The film 26 is supplied into the resin supply unit 23 (see (1) of FIG. 2 and (2) of FIG. 4).
在基板安置步驟及樹脂供給步驟之後，進行閉合上模13和下模18的模面而對上模13和下模18進行合模的合模步驟。 After the substrate placement step and the resin supply step, a mold clamping step of closing the mold faces of the upper mold 13 and the lower mold 18 to mold the upper mold 13 and the lower mold 18 is performed.
在基板安置步驟中，以在該合模步驟時基板19上的各被密封部件19a被分別收容在下模18中的各個樹脂成形部29內的方式安置基板19(參照圖4的(3))。 In the substrate arranging step, the substrate 19 is placed in such a manner that the respective sealed members 19a on the substrate 19 are housed in the respective resin molded portions 29 in the lower mold 18 at the time of the mold clamping step (refer to (3) of FIG. 4). .
接著，維持合模狀態(合模維持步驟)的同時，如圖3的(1)和圖4的(4)所示，進行樹脂密封步驟。首先，將供給到樹脂供給部23 內的樹脂材料R加熱熔化生成熔融樹脂(流動性樹脂)R1。接著，利用樹脂加壓構件24對熔融樹脂R1進行加壓。由此，進行樹脂密封步驟，將熔融樹脂R1通過樹脂通道部28注入到各樹脂成形部29內且以既定的樹脂壓力對各樹脂成形部29內的熔融樹脂R1進行加壓。 Next, while maintaining the mold clamping state (clamping maintaining step), as shown in (1) of FIG. 3 and (4) of FIG. 4, a resin sealing step is performed. First, it is supplied to the resin supply unit 23 The resin material R inside is heated and melted to form a molten resin (flowable resin) R1. Next, the molten resin R1 is pressurized by the resin pressing member 24. Thus, the resin sealing step is performed, and the molten resin R1 is injected into each of the resin molded portions 29 through the resin passage portion 28, and the molten resin R1 in each of the resin molded portions 29 is pressurized at a predetermined resin pressure.
此外，注入到各樹脂成形部29內的熔融樹脂R1受到既定的樹脂壓力的同時被加熱而固化，在基板19中的兩樹脂密封部位19b成形由固化樹脂構成的樹脂封裝部R2。然後，通過供給並安置到各樹脂成形部29內的基板19上的被密封部件19a被分別密封在該樹脂封裝部R2內，形成作為成形品的樹脂密封後基板191(參照圖3的(2))。 In addition, the molten resin R1 injected into each of the resin molding portions 29 is heated and solidified while being subjected to a predetermined resin pressure, and the resin sealing portion R2 made of a cured resin is molded into the two resin sealing portions 19b of the substrate 19. Then, the sealed member 19a that has been supplied and placed on the substrate 19 in each of the resin molding portions 29 is sealed in the resin sealing portion R2 to form a resin-sealed substrate 191 as a molded article (refer to FIG. 3 (2). )).
接著，在經過所需時間之後，進行使上模13和下模18之間移動至原來的位置的該上模和下模的開模步驟(參照圖1)。 Next, after the elapse of the required time, a mold opening step of the upper and lower molds for moving the upper mold 13 and the lower mold 18 to the original position is performed (see Fig. 1).
此外，在實施例圖中，由於在下模18的模面張緊設置有脫模膜26，因此樹脂密封後基板191容易從下模18(下模主體22)的模面脫模。在樹脂密封後基板191卡止於上模13的基板安置部13a的狀態下進行開模(參照圖4的(5))。 Further, in the embodiment, since the release film 26 is stretched on the mold surface of the lower mold 18, the substrate 191 after the resin sealing is easily released from the mold surface of the lower mold 18 (the lower mold main body 22). The mold is opened in a state where the substrate 191 is locked by the substrate seating portion 13a of the upper mold 13 after the resin sealing (see (5) of FIG. 4).
接著，可解除由基板卡止機構20和基板吸附機構引起的對樹脂密封後基板191的卡止狀態並將該樹脂密封後基板191取出至上模13和下模18之間，並且透過搬出機構(未圖示)向外部搬出。 Then, the locked state of the resin-sealed substrate 191 by the substrate locking mechanism 20 and the substrate suction mechanism can be released, and the resin-sealed substrate 191 can be taken out between the upper mold 13 and the lower mold 18, and the through-out mechanism ( It is not shown) and is carried out to the outside.
此外，在樹脂供給步驟之前，進行在下模18(下模主體22)的模面張緊設置脫模膜26的步驟。然後，可設定為，在合模步驟中，分別收容在下模18的各樹脂成形部29內的被密封部件19a的露出面19c(例如為作為散熱面的部位且在圖3的(2)和圖4的(6)中為下面)和張緊設置 在各樹脂成形部29內的脫模膜26被壓接。 Further, a step of tensioning the release film 26 on the die face of the lower mold 18 (the lower mold main body 22) is performed before the resin supply step. Then, in the mold clamping step, the exposed surface 19c of the member to be sealed 19a in each of the resin molded portions 29 of the lower mold 18 can be set (for example, a portion serving as a heat radiating surface and in (2) of FIG. 3 and Figure (6) is the following) and tension settings The release film 26 in each of the resin molded portions 29 is pressure-bonded.
因此，藉由在該狀態下進行樹脂密封步驟，能夠防止樹脂向被密封部件的露出面19c的附著。 Therefore, by performing the resin sealing step in this state, adhesion of the resin to the exposed surface 19c of the member to be sealed can be prevented.
另外，如圖4的(6)所示，在樹脂密封後基板191上粘接並一體化有：各樹脂封裝部R2，被成形為與各樹脂成形部29的形狀對應，並且將除露出面19c以外的被密封部件19a的整體密封；和不需要樹脂R3，在該各樹脂封裝部R2之間被成形為與樹脂通道部28的形狀對應。 Further, as shown in (6) of FIG. 4, the resin-sealed substrate 191 is bonded and integrated with each resin encapsulation portion R2, and is formed to correspond to the shape of each resin molding portion 29, and the exposed surface is removed. The entire sealing member 19a other than 19c is sealed; and the resin R3 is not required, and the resin sealing portion R2 is formed to correspond to the shape of the resin channel portion 28.
根據該實施例，能夠將相當於兩片基板的大小的一片基板19例如將兩片當前使用的100mm×300mm程度的大小的矩形狀基板形成為一組而成的大小(寬度)的基板配置為在上模13和下模18合模時該覆蓋配設有至少兩個樹脂成形部29的下模18(下模主體22)的模面整個區域。 According to this embodiment, it is possible to arrange, for example, a substrate having a size (width) in which a plurality of rectangular substrates having a size of about 100 mm × 300 mm which are currently used are formed in a single substrate 19 having a size corresponding to two substrates. When the upper mold 13 and the lower mold 18 are clamped, the entire area of the mold surface of the lower mold 18 (lower mold main body 22) of at least two resin molded portions 29 is covered.
由於這種一片基板19的基板厚度T未產生偏差，因此能夠均等且同時施加由樹脂密封模引起的合模壓力，因此每個模的平衡良好。 Since the substrate thickness T of such a single substrate 19 is not deviated, the mold clamping pressure caused by the resin sealing mold can be uniformly and simultaneously applied, so that the balance of each mold is good.
因此，能有效且確實地防止因每個模的平衡的不良情況而引起的成形不良，並能追求高效率生產。 Therefore, it is possible to effectively and surely prevent the molding failure due to the balance of the failure of each mold, and to pursue high-efficiency production.
另外，由於不需要與供給到上模和下模之間的兩片基板的厚度偏差對應地附設的現有的合模壓力調整手段，因此能使樹脂密封模的模結構簡易省略化，能追求樹脂密封模和樹脂密封裝置的整體製造成本的降低。 In addition, since the conventional mold clamping pressure adjusting means provided corresponding to the thickness deviation of the two substrates supplied between the upper mold and the lower mold is not required, the mold structure of the resin sealing mold can be easily omitted, and the resin can be pursued. The overall manufacturing cost of the sealing mold and the resin sealing device is lowered.
此外，在實施例中，舉例說明了在樹脂密封後基板191中的被密封部件19a設置樹脂未附著的露出面19c的情況。在無需設置露出面19c的情況下，例如在以固化樹脂覆蓋被密封部件19a的整體的方式進行樹脂密封的情況下，設定為在被密封部件19a的表面(底面)與張緊設置在樹 脂成形部29內的脫模膜26之間設置有所需的間隙即可。 Further, in the embodiment, the case where the exposed surface 19c to which the resin is not adhered is provided in the sealed member 19a in the substrate 191 after the resin sealing is exemplified. When it is not necessary to provide the exposed surface 19c, for example, when resin sealing is performed so that the entire sealing member 19a is covered with a cured resin, the surface (bottom surface) of the member to be sealed 19a and the tension are set in the tree. A desired gap may be provided between the release films 26 in the grease forming portion 29.
另外，在實施例中，舉例說明了樹脂通道部28和樹脂成形部29分別設置兩個的情況。樹脂通道部28和樹脂成形部29也可以分別設置N個(N為N3的整數)。在這種情況下，複數個被密封部件19a被分為N個組。 Further, in the embodiment, the case where two of the resin passage portion 28 and the resin molded portion 29 are provided separately is exemplified. N of the resin passage portion 28 and the resin molded portion 29 may be separately provided (N is N An integer of 3). In this case, the plurality of sealed members 19a are divided into N groups.
另外，在實施例中，舉例說明了使用脫模膜26的情況，但當使用具備優異的脫膜功能的樹脂材料和模結構或模原材料等時即使不使用該脫模膜亦可。 Further, in the examples, the case where the release film 26 is used has been exemplified, but the release film may not be used when a resin material having an excellent release function, a mold structure, a mold material, or the like is used.
另外，作為基板19的材質，可使用任意材質。例如，可採用金屬製的引線框、將塑膠、陶瓷、玻璃、金屬或具有其它材質作為基材的印刷電路基板等。 Further, as the material of the substrate 19, any material can be used. For example, a lead frame made of metal, a printed circuit board made of plastic, ceramic, glass, metal or other material as a substrate can be used.
另外，作為安裝在基板19的被密封部件19a，例如可使用包含IC(Integrated Circuit：積體電路)晶片、LED(Light Emitting Diode：發光二極體)晶片等的半導體晶片等電子元件和其它電氣電子部件等。 In addition, as the member to be sealed 19a to be mounted on the substrate 19, for example, an electronic component such as a semiconductor wafer including an IC (Integrated Circuit) wafer, an LED (Light Emitting Diode) wafer, or the like can be used, and other electrical components can be used. Electronic components, etc.
另外，作為樹脂材料R，可使用任意材料。以操作容易性等為基準，可適當採用錠狀樹脂、顆粒狀樹脂、微粒狀樹脂、粉末狀樹脂、片狀樹脂、膠狀樹脂、凝膠狀樹脂和液狀樹脂等。在使用液狀樹脂的情況下，液狀樹脂自身相當於流動性樹脂。另外，也可以根據需要使用經預熱的錠狀樹脂。 Further, as the resin material R, any material can be used. The ingot resin, the particulate resin, the particulate resin, the powdery resin, the sheet resin, the gel resin, the gel resin, the liquid resin, or the like can be suitably used, based on the ease of handling and the like. When a liquid resin is used, the liquid resin itself corresponds to a fluid resin. Further, a preheated ingot resin may be used as needed.
本發明並不限定於上述的實施例，在不脫離本發明的主旨的範圍內，可按照需要，任意並且適當變更，或選擇性地採用。 The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately changed or selectively employed as needed within the scope of the gist of the invention.
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| JP6296195B1 (en) * | 2017-07-21 | 2018-03-20 | 第一精工株式会社 | Resin sealing mold adjustment method and resin sealing mold |
| JP6482616B2 (en) * | 2017-08-21 | 2019-03-13 | Ｔｏｗａ株式会社 | Resin molding apparatus and resin molded product manufacturing method |
| CN108198764B (en) * | 2017-12-18 | 2019-07-02 | 重庆市长寿区普爱网络科技有限公司 | Electronic component manufacturing method |
| JP7160770B2 (en) * | 2019-07-22 | 2022-10-25 | アピックヤマダ株式会社 | Resin molding equipment |
| JP6837530B1 (en) * | 2019-10-17 | 2021-03-03 | Ｔｏｗａ株式会社 | Resin molding method and resin molding equipment |
| CN112976666B (en) * | 2019-12-12 | 2022-07-26 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
| JP7341115B2 (en) * | 2020-11-24 | 2023-09-08 | Ｔｏｗａ株式会社 | Resin powder collection member, plunger unit, resin molding device, and method for manufacturing resin molded products |
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| US20010008775A1 (en) * | 2000-01-19 | 2001-07-19 | Saburo Yamamoto | Resin sealing method and resin sealing apparatus |
| JP2007109831A (en) * | 2005-10-13 | 2007-04-26 | Towa Corp | Resin sealing molding method for electronic component |
| JP2007307766A (en) * | 2006-05-17 | 2007-11-29 | Towa Corp | Resin seal-molding method of electronic part |
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