TWI665053B - 晶圓之兩面研磨裝置及兩面研磨方法 - Google Patents

晶圓之兩面研磨裝置及兩面研磨方法 Download PDF

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Publication number
TWI665053B
TWI665053B TW107102186A TW107102186A TWI665053B TW I665053 B TWI665053 B TW I665053B TW 107102186 A TW107102186 A TW 107102186A TW 107102186 A TW107102186 A TW 107102186A TW I665053 B TWI665053 B TW I665053B
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TW
Taiwan
Prior art keywords
wafer
flow rate
gbir
polishing
shape
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TW107102186A
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English (en)
Chinese (zh)
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TW201836765A (zh
Inventor
村上裕一朗
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日商Ｓｕｍｃｏ股份有限公司
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107102186A 2017-03-31 2018-01-22 晶圓之兩面研磨裝置及兩面研磨方法 TWI665053B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-072755 2017-03-31
JP2017072755A JP6743746B2 (ja) 2017-03-31 2017-03-31 ウェーハの両面研磨装置および両面研磨方法

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TW201836765A TW201836765A (zh) 2018-10-16
TWI665053B true TWI665053B (zh) 2019-07-11

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TW (1) TWI665053B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7081544B2 (ja) * 2019-03-22 2022-06-07 株式会社Sumco ワークの両面研磨方法及びワークの両面研磨装置
CN113894635B (zh) * 2021-11-03 2022-06-21 安徽格楠机械有限公司 基于自学习的智能硅基晶圆超精密研磨抛光机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201334051A (zh) * 2011-11-07 2013-08-16 Shinetsu Handotai Kk 雙面研磨方法
TW201529227A (zh) * 2013-11-18 2015-08-01 Sumco Corp 工件之兩面硏磨裝置及兩面硏磨方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111255A (ja) * 1993-10-12 1995-04-25 Nippon Steel Corp ウェーハ研磨装置
JP3935757B2 (ja) * 2002-03-28 2007-06-27 信越半導体株式会社 ウエーハの両面研磨装置及び両面研磨方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201334051A (zh) * 2011-11-07 2013-08-16 Shinetsu Handotai Kk 雙面研磨方法
TW201529227A (zh) * 2013-11-18 2015-08-01 Sumco Corp 工件之兩面硏磨裝置及兩面硏磨方法

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JP6743746B2 (ja) 2020-08-19
JP2018171695A (ja) 2018-11-08
TW201836765A (zh) 2018-10-16

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