TWI664321B - Eletroplating auxiliary plate and electroplating system provided with same - Google Patents
Eletroplating auxiliary plate and electroplating system provided with same Download PDFInfo
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Abstract
本發明之電鍍輔助板係應用於電鍍系統，其主要具有一不導電之板體，設置於該陽極與該待鍍面之間，該電鍍輔助板係將該陽極部分遮蔽而形成遮蔽區域，而該電鍍輔助板設有至少一朝向於該陽極之遮蔽件，該遮蔽件可阻斷遮蔽區域處的電鍍液與電鍍槽其他區域的電鍍液間的流動，即可以更為積極、可靠之手段阻止金屬鍍層沉積於相對該遮蔽區域之待鍍面上，具有調整電鍍時之電場分佈的能力。The plating auxiliary plate of the present invention is applied to a plating system, which mainly has a non-conductive plate body disposed between the anode and the surface to be plated. The plating auxiliary plate shields the anode part to form a shielding area, and The plating auxiliary board is provided with at least one shielding member facing the anode. The shielding member can block the flow between the plating solution in the shielded area and the plating solution in other areas of the plating tank, that is, it can be prevented by more positive and reliable means. The metal plating layer is deposited on the surface to be plated opposite to the shielded area, and has the ability to adjust the electric field distribution during plating.
Description
本發明係有關一種電鍍輔助板及應用其之電鍍系統，特別是一種以更為積極、可靠之手段來調整電鍍時之電場分佈以及金屬離子擴散路徑的電鍍輔助板。 The invention relates to an electroplating auxiliary plate and an electroplating system using the same, in particular to an electroplating auxiliary plate that adjusts the electric field distribution and the metal ion diffusion path during electroplating by more positive and reliable means.
電鍍係為一種電解反應，利用電解反應把一種金屬鍍在另一種金屬的表面上，以形成一層金屬外殼薄膜，我們將這樣的過程稱為電鍍。而電鍍技術廣泛的應用在各種不同用途與不同領域上。從早期以美觀為主的裝飾用途，如於容器表面上形成一具有光澤的薄膜，漸漸發展到現今應用於高科技產業，如半導體的製程中，是現今科技產業中不可或缺的一項技術。 Electroplating is an electrolytic reaction. Electrolytic reaction is used to plate a metal on the surface of another metal to form a metal shell film. We call this process electroplating. The electroplating technology is widely used in various applications and different fields. From the early decorative purposes that are mainly aesthetic, such as forming a glossy film on the surface of the container, it has gradually developed into the current high-tech industry, such as the manufacturing process of semiconductors, which is an indispensable technology in the current technology industry. .
一般而言，電鍍技術的流程包括提供一電鍍槽、一電鍍液、一陰極、一陽極、一待鍍物以及一電鍍金屬。其中電鍍液、陰極、陽極、待鍍物以及電鍍金屬皆位於電鍍槽內，而待鍍物與陰極耦接，電鍍金屬則與陽極耦接。如此配置，當施予陰極與陽極間一外加電壓V時，電鍍金屬會析出電鍍金屬離子M+，而待鍍物表面則會聚集電子e-。此帶正電荷的電鍍金屬離子M+會被電子e-所帶的負電荷所吸引，以電鍍液做為介質(medium)而流向待鍍物表面。當電鍍金屬離子M+抵達待鍍物表面時，便會與電子e-結合而形成金屬原子，並沉積於待鍍物表面，形成電鍍金屬層。當電鍍金屬完全析出或是停止施加外加電壓V時，電鍍反應便停止。 Generally speaking, the process of electroplating technology includes providing a plating bath, a plating solution, a cathode, an anode, an object to be plated, and a plated metal. The plating solution, the cathode, the anode, the object to be plated, and the plated metal are all located in the plating tank, the object to be plated is coupled to the cathode, and the plated metal is coupled to the anode. In this configuration, when an external voltage V is applied between the cathode and the anode, the electroplated metal will precipitate electroplated metal ions M +, and the surface of the object to be plated will collect electrons e-. The positively-charged electroplated metal ion M + is attracted by the negative charge carried by the electron e-, and the plating solution is used as a medium to flow to the surface of the object to be plated. When the electroplated metal ions M + reach the surface of the object to be plated, they will combine with the electrons e- to form metal atoms, which are deposited on the surface of the object to be plated to form an electroplated metal layer. When the plating metal is completely precipitated or the application of the applied voltage V is stopped, the plating reaction is stopped.
目前已知的電鍍系統，則可依電鍍金屬提供方式區分為溶解性陽極電鍍系統及不溶解陽極電鍍系統。在不溶解性陽極電鍍系統中，當電流從陽極頂部流至陽極底部時，其電流量會因電阻而遞減，換言之，在陽極頂部處，由於通過此處的電流較大，因此較多的金屬離子被分解釋放，而通過下方部位所通過的電流較通過上方部位的電流少，因此較少的金屬離子被分解釋放出來，進而在電鍍槽中產生電力線分佈並不均勻(即電流的密度分佈不均勻)的現象。此現象將造成產品位在電力線密度較高即電流密度大的區域處鍍層相對較厚，反之產品位在電力線密度較低即電流密度小的區域則鍍層相對較薄，因此使得產品表面鍍層的膜厚均勻度不佳，厚度不均勻之鍍層極可能影響後續製程或產品效能，進而降低整體製程良率。 The currently known electroplating systems can be divided into a soluble anodizing system and an insoluble anodizing system according to the method of providing metal plating. In an insoluble anodizing system, when the current flows from the top of the anode to the bottom of the anode, the amount of current will decrease due to the resistance. In other words, at the top of the anode, due to the larger current passing through it, there will be more metal. The ions are decomposed and released, and the current passing through the lower part is less than the current passing through the upper part, so less metal ions are decomposed and released, and the power line distribution in the plating bath is uneven (that is, the current density distribution is not uniform). Uniform). This phenomenon will cause the product to be relatively thick in the area where the power line density is high, that is, the current density is high. Conversely, the product is relatively thin in the area where the power line density is low, that is, the current density is low, so the film on the product surface is coated. The thickness uniformity is not good, and the coating with uneven thickness is likely to affect subsequent processes or product performance, thereby reducing the overall process yield.
故市面上出現一種以多個陽極分別供電並分別產生所需的電流密度，來達到均勻電鍍之作用，如台灣專利公告號第I530593號，其主要提供一種多陽極控制裝置，搭配一陰極連接件使用，所述陰極連接件電性連接於基板的一邊，該多陽極控制裝置包括：一陽極模組，包含彼此並排且之間相隔一間距的多數陽極網；以及一供電控制模組，分別電性連接於各該陽極網，該供電控制模組對各該陽極網分別供電，以在各該陽極網分別產生所需的電流密度，能使各陽極網所分別獲得的電流密度，與基板不同位置所分別獲得的陰極電彼此互補，從而對基板進行均勻電鍍。 Therefore, a variety of anodes are available on the market to supply power and generate the current density required to achieve uniform plating. For example, Taiwan Patent Publication No. I530593, which mainly provides a multi-anode control device with a cathode connection For use, the cathode connector is electrically connected to one side of the substrate. The multi-anode control device includes: an anode module including a plurality of anode grids side by side and separated by a distance; and a power supply control module, respectively Is connected to each of the anode grids, and the power supply control module supplies power to each of the anode grids separately to generate the required current density in each of the anode grids, which can make the current density obtained by each anode grid different from the substrate The cathodes obtained at the positions are complementary to each other, thereby uniformly plating the substrate.
上述習有多陽極技術雖然可以達到均勻電鍍之功效，及控制電場分佈；然，整體多陽極控制裝置結構組成較為複雜，成本也相對較高；再者，由於陽極網的邊際效應，使得陽極網邊際的電流密度反而會增加，所以實際上仍需視情況利用供電控制模組分別調整提供給各陽極網的電流，如此造成了使用上之不便利性。 Although the above-mentioned multi-anode technology can achieve the effect of uniform plating and control the electric field distribution; however, the overall structure of the multi-anode control device is relatively complicated and the cost is relatively high. Furthermore, due to the marginal effect of the anode network, the anode network The marginal current density will increase, so in fact, it is still necessary to use the power supply control module to adjust the current provided to each anode network separately according to the situation, which causes inconvenience in use.
有鑑於此，本發明提供一種電鍍輔助板及應用其之電鍍系 統，特別是一種以更為積極、可靠之手段來調整電鍍時之電場分佈以及金屬離子擴散路徑的電鍍輔助板，為其主要目的者。 In view of this, the present invention provides a plating auxiliary board and a plating system using the same System, especially a plating auxiliary board that adjusts the electric field distribution and metal ion diffusion path during electroplating by a more positive and reliable method.
本發明中電鍍輔助板係應用於電鍍系統，為不導電之板體，且該板體具有至少一側面，該至少一側面處係設有一遮蔽件，該遮蔽件係突出於該板體表面一預定高度。 In the present invention, the plating auxiliary board is applied to a plating system and is a non-conductive plate body. The plate body has at least one side surface, and a shielding member is provided at the at least one side surface. The shielding member protrudes from the surface of the plate body. Predetermined height.
在一優選具體實施方案中，進一步設有一驅動模組，係與該電鍍輔助板連結，可帶動該電鍍輔助板位移。 In a preferred embodiment, a driving module is further provided, which is connected with the plating auxiliary plate and can drive the plating auxiliary plate to be displaced.
在一優選具體實施方案中，所述遮蔽件利用一固定件固定於該板體。 In a preferred embodiment, the shielding member is fixed to the plate body by a fixing member.
根據本發明的第二方面，其提供一種電鍍系統，適於對一待鍍物進行電鍍，該電鍍系統係至少包含：一電鍍槽，係供裝設電鍍液；一陰極，設置於該電鍍槽並耦接該待鍍物；至少一陽極，設置於該電鍍槽並耦接一電鍍金屬，該陽極面對該待鍍物的一待鍍面；以及至少一上述之電鍍輔助板，位於該陽極與該待鍍面之間，該電鍍輔助板之該遮蔽件係朝向於該陽極，該遮蔽件係充填於該電鍍輔助板與該陽極間之間隙。 According to a second aspect of the present invention, it provides an electroplating system suitable for electroplating an object to be plated. The electroplating system includes at least: an electroplating tank for installing a plating solution; and a cathode disposed in the electroplating tank. And is coupled to the object to be plated; at least one anode is disposed in the plating tank and is coupled to a plated metal, the anode faces a surface to be plated of the object to be plated; and at least one above-mentioned plating auxiliary plate is located at the anode Between the plate and the surface to be plated, the shielding member of the plating auxiliary plate faces the anode, and the shielding member fills a gap between the plating auxiliary plate and the anode.
在一優選具體實施方案中，所述電鍍槽之內側面設有至少一導槽，以供插設該電鍍輔助板。 In a preferred embodiment, at least one guide groove is provided on an inner side surface of the plating tank for inserting the plating auxiliary board.
在另一優選具體實施方案中，所述電鍍輔助板具有可供深入於該導槽之導引邊部，以及由該導引邊部延伸至該電鍍槽內部之遮蔽部，而該遮蔽件則位於該遮蔽部之至少一側。 In another preferred embodiment, the plating auxiliary plate has a guide edge portion that can be penetrated deep into the guide groove, and a shielding portion extending from the guide edge portion to the inside of the plating groove, and the shielding member is It is located on at least one side of the shielding portion.
在更優選具體實施方案中，所述遮蔽部進一步設有至少一開口，該開口可供該陽極部分外露。 In a more preferred embodiment, the shielding portion is further provided with at least one opening, and the opening can be exposed by the anode portion.
10‧‧‧電鍍輔助板 10‧‧‧Plating Auxiliary Board
11‧‧‧板體 11‧‧‧ plate
111‧‧‧側面 111‧‧‧ side
112‧‧‧導引邊部 112‧‧‧Guide Edge
113‧‧‧遮蔽部 113‧‧‧ shelter
114‧‧‧開口 114‧‧‧ opening
12‧‧‧遮蔽件 12‧‧‧ shelter
13‧‧‧固定件 13‧‧‧Fixed parts
21‧‧‧電鍍槽 21‧‧‧plating tank
211‧‧‧導槽 211‧‧‧Guide
22‧‧‧電鍍液 22‧‧‧plating solution
23‧‧‧陰極 23‧‧‧ cathode
24‧‧‧陽極 24‧‧‧Anode
24a‧‧‧遮蔽區域 24a‧‧‧ sheltered area
24b‧‧‧非遮蔽區域 24b‧‧‧Uncovered area
25‧‧‧電鍍金屬 25‧‧‧plated metal
30‧‧‧待鍍物 30‧‧‧ to be plated
31‧‧‧待鍍面 31‧‧‧ surface to be plated
40‧‧‧金屬鍍層 40‧‧‧metal plating
第1圖所示為本發明中電鍍輔助板第一實施例之結構立體圖；第2圖所示為本發明中電鍍輔助板第二實施例之立體分解圖；第3圖所示為本發明中電鍍系統之結構示意圖；以及第4圖所示為本發明中電鍍輔助板第二實施例之結構立體圖。 Fig. 1 is a perspective view showing the structure of the first embodiment of the plating auxiliary plate in the present invention; Fig. 2 is an exploded view showing the second embodiment of the plating auxiliary plate in the present invention; Schematic diagram of the structure of the plating system; and FIG. 4 is a perspective view showing the structure of the second embodiment of the plating auxiliary board in the present invention.
除非另外說明，否則本申請說明書和申請專利範圍中所使用的下列用語具有下文給予的定義。請注意，本申請說明書和申請專利範圍中所使用的單數形用語「一」意欲涵蓋在一個以及一個以上的所載事項，例如至少一個、至少二個或至少三個，而非意味著僅僅具有單一個所載事項。此外，申請專利範圍中使用的「包含」、「具有」等開放式連接詞是表示請求項中所記載的元件或成分的組合中，不排除請求項未載明的其他組件或成分。亦應注意到用語「或」在意義上一般也包括「及/或」，除非內容另有清楚表明。本申請說明書和申請專利範圍中所使用的用語「約(about)」，是用以修飾任何可些微變化的誤差，但這種些微變化並不會改變其本質。 Unless otherwise stated, the following terms used in the specification and scope of the patent application have the definitions given below. Please note that the use of the singular word "a" in the specification and scope of the patent application is intended to cover one or more of the stated matters, such as at least one, at least two, or at least three, and is not meant to mean merely having A single item. In addition, the use of open-ended conjunctions such as "including" and "having" in the scope of a patent application indicates a combination of elements or components described in a claim, and does not exclude other components or components not specified in the claim. It should also be noted that the term "or" generally includes "and / or" in the sense, unless the content clearly indicates otherwise. The term "about" used in the description of this application and the scope of the patent application is used to modify any slightly variable error, but such slight change will not change its essence.
請參閱第1圖所示，本發明之電鍍輔助板10係為不導電之板體11，本發明之電鍍輔助板係應用於電鍍系統中，板體11需由可以抵抗電鍍液之侵蝕及不產生電鍍反應的材料所製成。這些材料具有介電特性或是為包含有介電性塗覆的複合材料，以防止電鍍槽中誘發的電位變化造成金屬電鍍在電鍍輔助板上，或是與電鍍輔助板產生化學反應而污染電鍍液。電鍍輔助板的材料包含但不限於是塑膠，例如聚丙烯、聚乙烯、聚氯乙烯、氟聚物、聚四氟乙烯(polytetrafluoroethylene，PTFE)或是聚偏二氟乙烯(polyvinylidene fluoride)。該材料可以阻擋電力線通過。所述電力線 為電鍍液中正負離子在外電場作用下作定向移動的軌道稱為電力線。 Please refer to FIG. 1. The plating auxiliary board 10 of the present invention is a non-conductive board body 11. The plating auxiliary board of the present invention is used in a plating system. The board body 11 must be resistant to the corrosion and corrosion of the plating solution. Made of materials that cause plating reactions. These materials have dielectric properties or are composite materials containing a dielectric coating to prevent potential changes induced in the plating bath from causing metal plating on the plating auxiliary board or chemical reaction with the plating auxiliary board to pollute the plating liquid. The material of the plating auxiliary board includes, but is not limited to, plastic, such as polypropylene, polyethylene, polyvinyl chloride, fluoropolymer, polytetrafluoroethylene (PTFE), or polyvinylidene fluoride. This material can block the passage of power lines. The power line The orbit that moves the positive and negative ions in the plating solution under the action of an external electric field is called a power line.
而該板體11具有至少一側面111，如圖所示之實施例中，板體11係為矩形而具有四個側面111，雖然本說明書說明且圖式繪示板體11的形狀為矩形，但該板體可具有所屬技術領域中具有通常知識者已知的各種其他形狀。該至少一側面111處係設有一遮蔽件12，該遮蔽件12係突出於該板體11表面底部之一預定高度。在一個優選具體實施方案中，該遮蔽件12可以與該板體11一體製成。 The plate body 11 has at least one side surface 111. In the embodiment shown in the figure, the plate body 11 is rectangular and has four side surfaces 111. Although the shape of the plate body 11 is described in this specification and illustrated in the drawings, The plate can have various other shapes known to those skilled in the art. A shielding member 12 is provided on the at least one side 111, and the shielding member 12 protrudes from a predetermined height of the bottom of the surface of the plate 11. In a preferred embodiment, the shielding member 12 can be made integrally with the plate body 11.
另一個優選具體實施方案中，如第2圖所示，該遮蔽件12利用一固定件13固定於該板體11。雖然本說明書說明且圖式繪示固定件13係構形為螺絲的結構，但該固定件13可具有所屬技術領域中具有通常知識者已知的各種其他固定結構。而該遮蔽件12與板體11同樣為不導電材質，且可如上述板體具體實施方案中所提及之材料所製成。 In another preferred embodiment, as shown in FIG. 2, the shielding member 12 is fixed to the plate body 11 by a fixing member 13. Although the present specification describes and illustrates the structure in which the fixing member 13 is configured as a screw, the fixing member 13 may have various other fixing structures known to those skilled in the art. The shielding member 12 is the same as the plate body 11 and is made of a non-conductive material, and can be made of the materials mentioned in the above specific embodiments of the plate body.
本發明之電鍍輔助板適於設置在電鍍系統中，用以調整電鍍時之電場分佈，以更為積極、可靠之手段阻止特定區域的金屬鍍層沉積。所述電鍍系統的具體實施方案中，如第3圖所示，該電鍍系統係至少包含：一電鍍槽21係供裝設電鍍液22；一陰極23設置於該電鍍槽21並耦接該待鍍物30；至少一陽極24設置於該電鍍槽21並耦接一電鍍金屬25，該陽極24面對該待鍍物30的一待鍍面31；陰極23與至少一陽極24設置於電鍍槽21中，並至少局部浸泡於電鍍液22中。另有電源(圖未示)分別供應至少一陽極24與陰極23正電與負電，以形成通過電鍍液22的電力線。陽極24可包含溶解性陽極及不溶解性陽極，在一個優選具體實施方案中，陽極24為不溶解性陽極，其用來傳導電流，而電鍍液22中之金屬離子則是以金屬鹽來補充。不溶解性陽極通常為良好的導電體，且不會與電鍍液22產生化學作用而污染溶液也不會受到侵蝕。 The plating auxiliary board of the present invention is suitable for being set in a plating system to adjust the electric field distribution during plating, and to prevent the metal plating layer deposition in a specific area by more positive and reliable means. In a specific embodiment of the electroplating system, as shown in FIG. 3, the electroplating system includes at least: a plating tank 21 for installing a plating solution 22; a cathode 23 is disposed in the plating tank 21 and is coupled to the Plating 30; at least one anode 24 is disposed in the plating tank 21 and is coupled to a plating metal 25, the anode 24 faces a to-be-plated surface 31 of the to-be-plated 30; the cathode 23 and at least one anode 24 are disposed in the plating tank 21 and at least partially immersed in the plating solution 22. Another power source (not shown) supplies at least one anode 24 and cathode 23 with positive and negative electricity respectively to form a power line passing through the plating solution 22. The anode 24 may include a soluble anode and an insoluble anode. In a preferred embodiment, the anode 24 is an insoluble anode that is used to conduct current, and the metal ions in the plating solution 22 are supplemented with metal salts. . The insoluble anode is generally a good conductor, and does not cause chemical interaction with the plating solution 22 and does not corrode the solution.
在一個優選具體實施方案中，係可將成對的陽極24分別置 於電鍍槽21內部相對於陰極23之兩側，且於陰極23吊掛欲進行電鍍的待鍍物30，使分別在陽極24與陰極23輸入電流之狀態下，令電鍍槽21內之電鍍液22因電解反應而析出沈積於陰極端的金屬離子，待金屬離子於陰極23還原後，形成沉積鍍著於待鍍物30表面的金屬鍍層40。 In a preferred embodiment, the pair of anodes 24 can be placed separately The two sides of the plating tank 21 opposite to the cathode 23 are hung on the cathode 23 to be plated, so that the plating solution in the plating tank 21 is made in the state where the anode 24 and the cathode 23 are inputting current, respectively. 22 The metal ions deposited on the cathode end are precipitated due to the electrolytic reaction. After the metal ions are reduced on the cathode 23, a metal plating layer 40 is deposited and deposited on the surface of the object 30 to be plated.
電鍍輔助板10係設置於電鍍槽21中，位於該陽極24與該待鍍面31之間，該電鍍輔助板10係將陽極24部分遮蔽而形成遮蔽區域24a以及非遮蔽區域24b，該電鍍輔助板10之板體11係略平行於該待鍍面31，且該電鍍輔助板10之遮蔽件12係朝向於該陽極24，該遮蔽件12係充填於該電鍍輔助板10與該陽極24間之間隙。在一個優選具體實施方案中，該遮蔽件12之高度可以等於略小於該電鍍輔助板10與該陽極24間之間隙大小，且遮蔽件12之長度可等於略小於該電鍍槽21之寬度。 The plating auxiliary plate 10 is disposed in the plating tank 21 between the anode 24 and the surface to be plated 31. The plating auxiliary plate 10 partially shields the anode 24 to form a shielded area 24a and a non-shielded area 24b. The plate body 11 of the plate 10 is slightly parallel to the surface to be plated 31, and the shielding member 12 of the plating auxiliary plate 10 faces the anode 24, and the shielding member 12 is filled between the plating auxiliary plate 10 and the anode 24. The gap. In a preferred embodiment, the height of the shielding member 12 may be slightly smaller than the gap between the plating auxiliary plate 10 and the anode 24, and the length of the shielding member 12 may be slightly smaller than the width of the plating tank 21.
其中，電鍍輔助板10之板體11可阻擋部分電力線的形成，改變了原有電場分佈，加了電鍍輔助板10之後電鍍槽21內電場分佈之變化，特別是待鍍物30部分之電力線已改善不再較其他部位為密，如此使得非遮蔽區域24b上電流分佈均勻，電鍍所得之電鍍金屬層厚度也可均勻一致；反之，遮蔽區域24a處不形成電力線，且遮蔽件12係充填於該電鍍輔助板10與該陽極24間之間隙，可阻斷遮蔽區域24a處的電鍍液與電鍍槽其他區域的電鍍液間的流動，讓遮蔽區域24a處造成電鍍液的停滯，且遮蔽區域24a處的電解反應難度大為提升，使相對該遮蔽區域24a之待鍍面31無法有金屬鍍層沉積，讓被鍍物之待鍍面31可局部沉積有金屬鍍層40，使用者更可依其所需改變電鍍輔助板的形狀或相對於待鍍面之位置，而得到具有特定位置或特定形狀之金屬鍍層。而上述之電鍍輔助板10除了可達到調整電鍍時之電場分佈的能力外，亦可調整電鍍液中金屬離子的擴散路徑，讓被鍍物表面金屬鍍層的膜厚均勻度提升，達到均勻電鍍之目的。 Among them, the plate body 11 of the plating auxiliary board 10 can block the formation of some power lines and change the original electric field distribution. After the plating auxiliary board 10 is added, the electric field distribution in the plating tank 21 changes, especially the power lines of the 30 parts to be plated. The improvement is no longer denser than other parts, so that the current distribution on the non-shielded area 24b is uniform, and the thickness of the electroplated metal layer obtained by electroplating can be uniform; on the other hand, no power line is formed at the shielded area 24a, and the shield 12 is filled in the The gap between the plating auxiliary plate 10 and the anode 24 can block the flow of the plating solution in the shielded area 24a and the plating solution in other areas of the plating tank, and cause the stagnation of the plating solution in the shielded area 24a, and the shielded area 24a. The difficulty of the electrolytic reaction is greatly increased, so that the metal plating layer can not be deposited on the to-be-plated surface 31 of the shielded area 24a, so that the metal-plated layer 40 can be locally deposited on the to-be-plated surface 31 of the object to be plated. The shape of the plating auxiliary plate or the position relative to the surface to be plated is changed to obtain a metal plating layer having a specific position or a specific shape. In addition to the above-mentioned plating auxiliary plate 10, in addition to the ability to adjust the electric field distribution during plating, the diffusion path of metal ions in the plating solution can also be adjusted to increase the uniformity of the thickness of the metal plating layer on the surface of the object to be plated. purpose.
在一個優選具體實施方案中，該電鍍槽21之內側面設有至 少一導槽211，如第4圖所示，以供插設該電鍍輔助板10，該電鍍輔助板10之板體11二相對之邊側具有可供深入於該導槽211之導引邊部112，以及由該導引邊部112延伸至該電鍍槽內部之遮蔽部113，而該遮蔽件12則位於該遮蔽部113之至少一側，該遮蔽部113進一步設有至少一開口114，該開口114可供該陽極24之非遮蔽區域24b外露，該開口114的位置及形狀則相對於待鍍面進行電鍍後所形成金屬鍍層的位置及形狀。在上述優選具體實施方案中，板體11二相對邊側之導引邊部112係插置於導槽211內，而板體11之遮蔽部113底側則接觸電鍍槽21之底面，故僅需於板體11之遮蔽部113頂側設置一遮蔽件12，即可阻隔遮蔽部113相對之遮蔽區域24a處的電鍍液與電鍍槽其他區域的電鍍液間的流動。在另一個優選具體實施方案中，本發明板體11之遮蔽部113若移動至其他位置，例如往上移動時，此時遮蔽部113底側並無接觸電鍍槽21之底面，而讓遮蔽區域24a於該處的電鍍液與電鍍槽其他區域的電鍍液間構成相通狀態，則可進一步於遮蔽部113底側設置有遮蔽件12，藉以達到完全阻隔之作用。 In a preferred embodiment, the inner surface of the plating tank 21 is provided to One guide groove 211 is missing, as shown in FIG. 4, for inserting the electroplating auxiliary board 10, and the plate 11 of the electroplating auxiliary board 10 has opposite sides on the opposite sides, which can be guided into the guide groove 211. The shielding portion 113 extends from the guiding edge portion 112 to the inside of the plating tank, and the shielding member 12 is located on at least one side of the shielding portion 113. The shielding portion 113 is further provided with at least one opening 114. The opening 114 can expose the non-shielded area 24b of the anode 24, and the position and shape of the opening 114 are relative to the position and shape of the metal plating layer formed after the surface to be plated is plated. In the above-mentioned preferred embodiment, the guide edge portions 112 on the opposite sides of the plate body 11 are inserted into the guide groove 211, and the bottom side of the shielding portion 113 of the plate body 11 contacts the bottom surface of the plating tank 21, so only A shielding member 12 needs to be provided on the top side of the shielding portion 113 of the plate body 11 to block the flow between the plating solution at the shielding area 24a opposite to the shielding portion 113 and the plating solution in other areas of the plating tank. In another preferred embodiment, if the shielding portion 113 of the plate body 11 of the present invention is moved to another position, for example, when moving upward, the bottom side of the shielding portion 113 does not contact the bottom surface of the plating tank 21 at this time, so that the shielding area is allowed. A conductive state between the plating solution at 24a and the plating solution in other areas of the plating tank is formed, and a shielding member 12 may be further provided on the bottom side of the shielding portion 113 so as to achieve a complete blocking effect.
在另一個優選具體實施方案中，本發明進一步設有一驅動模組(圖未示)，係與該電鍍輔助板連結，可帶動該電鍍輔助板位移，藉以自動化的方式來改變電鍍輔助板相對於待鍍面之位置。 In another preferred embodiment, the present invention further includes a driving module (not shown), which is connected to the plating auxiliary plate, which can drive the displacement of the plating auxiliary plate, thereby changing the plating auxiliary plate relative to the plating auxiliary plate in an automated manner. Position of the surface to be plated.
以上諸實施例僅供說明本發明之用，而並非對本發明的限制，相關領域的技術人員，在不脫離本發明的技術範圍做出的各種變換或變化也應屬於本發明的保護範疇。 The above embodiments are only for the purpose of illustrating the present invention, rather than limiting the present invention. Various alterations or changes made by those skilled in the related art without departing from the technical scope of the present invention should also belong to the protection scope of the present invention.
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