TWI658328B - Positive photosensitive resin composition and titanium black dispersion - Google Patents

Positive photosensitive resin composition and titanium black dispersion Download PDF

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Publication number
TWI658328B
TWI658328B TW106134327A TW106134327A TWI658328B TW I658328 B TWI658328 B TW I658328B TW 106134327 A TW106134327 A TW 106134327A TW 106134327 A TW106134327 A TW 106134327A TW I658328 B TWI658328 B TW I658328B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
positive
mass
titanium black
Prior art date
Application number
TW106134327A
Other languages
English (en)
Chinese (zh)
Other versions
TW201830137A (zh
Inventor
三浦賢治
古江健太郎
豆田介
Original Assignee
日商昭和電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工股份有限公司 filed Critical 日商昭和電工股份有限公司
Publication of TW201830137A publication Critical patent/TW201830137A/zh
Application granted granted Critical
Publication of TWI658328B publication Critical patent/TWI658328B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
TW106134327A 2016-11-09 2017-10-05 Positive photosensitive resin composition and titanium black dispersion TWI658328B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016219082 2016-11-09
JP2016-219082 2016-11-09

Publications (2)

Publication Number Publication Date
TW201830137A TW201830137A (zh) 2018-08-16
TWI658328B true TWI658328B (zh) 2019-05-01

Family

ID=62109745

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106134327A TWI658328B (zh) 2016-11-09 2017-10-05 Positive photosensitive resin composition and titanium black dispersion

Country Status (4)

Country Link
JP (1) JP7283903B2 (ja)
KR (1) KR102181114B1 (ja)
TW (1) TWI658328B (ja)
WO (1) WO2018088052A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6689434B1 (ja) * 2019-02-06 2020-04-28 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子
JP6827572B2 (ja) * 2020-01-20 2021-02-10 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子
WO2021240879A1 (ja) * 2020-05-28 2021-12-02 昭和電工株式会社 熱硬化性樹脂組成物
TWI810578B (zh) * 2020-06-03 2023-08-01 日商昭和電工股份有限公司 正型感光性樹脂組成物，及有機ｅｌ元件隔膜

Citations (2)

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TW201232178A (en) * 2010-12-20 2012-08-01 Asahi Glass Co Ltd Photosensitive resin composition, partition wall, color filter, and organic el element
TW201339755A (zh) * 2012-03-30 2013-10-01 Fujifilm Corp 著色感光性組成物及其製造方法、彩色濾光片及其製造方法以及顯示裝置

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JPH10265338A (ja) * 1997-03-21 1998-10-06 Mitsubishi Pencil Co Ltd アイメイクアップ化粧料
JP2001281440A (ja) 2000-04-03 2001-10-10 Nippon Zeon Co Ltd 遮光膜、その製造方法及びその用途
JP4438080B2 (ja) * 2000-09-29 2010-03-24 日本ゼオン株式会社 絶縁膜形成用感放射線性樹脂組成物及び有機エレクトロルミネッセンス素子用絶縁膜
JP2002116536A (ja) 2000-10-06 2002-04-19 Jsr Corp 感放射線性樹脂組成物、その硬化物および素子。
JP2008039961A (ja) * 2006-08-03 2008-02-21 Toray Ind Inc ポジ型感光性樹脂組成物およびそれを用いた有機エレクトロルミネッセンス素子
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EP2221665A3 (en) * 2009-02-19 2011-03-16 Fujifilm Corporation Dispersion composition, photosensitive resin composition for light- shielding color filter, light-shielding color filter, method of producing the same, and solid-state image sensor having the color filter
JP5934463B2 (ja) 2009-07-07 2016-06-15 富士フイルム株式会社 遮光膜用着色組成物、遮光膜及び遮光パターンの形成方法、並びに固体撮像素子及びその製造方法
JP5501175B2 (ja) * 2009-09-28 2014-05-21 富士フイルム株式会社 分散組成物及びその製造方法、遮光性カラーフィルタ用感光性樹脂組成物及びその製造方法、遮光性カラーフィルタ及びその製造方法、並びに固体撮像素子
KR20110109944A (ko) * 2010-03-29 2011-10-06 가부시키가이샤 닛폰 쇼쿠바이 컬러 필터용 감광성 수지 조성물
KR101954114B1 (ko) * 2011-09-26 2019-03-05 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및 액정 표시 장치
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201232178A (en) * 2010-12-20 2012-08-01 Asahi Glass Co Ltd Photosensitive resin composition, partition wall, color filter, and organic el element
TW201339755A (zh) * 2012-03-30 2013-10-01 Fujifilm Corp 著色感光性組成物及其製造方法、彩色濾光片及其製造方法以及顯示裝置

Also Published As

Publication number Publication date
KR20190034262A (ko) 2019-04-01
JP7283903B2 (ja) 2023-05-30
JPWO2018088052A1 (ja) 2019-09-26
TW201830137A (zh) 2018-08-16
KR102181114B1 (ko) 2020-11-20
WO2018088052A1 (ja) 2018-05-17

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