TWI647989B - Roll-to-roll processed flexible circuit board and quick method for forming the same - Google Patents
Roll-to-roll processed flexible circuit board and quick method for forming the same Download PDFInfo
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Abstract
本發明公開一種卷對卷柔性線路板及其快速加工方法，該快速加工方法首先提供一基板層，接著形成一佈線層於基板層上，然後對佈線層進行表面金屬處理，經表面金屬處理的所述第一佈線層通過焊接以提供一第一介金屬化合物層，最後利用塗佈方式形成一增層絕緣層於經表面金屬處理的佈線層上，以使增層絕緣層填滿經表面金屬處理的佈線層的鏤空處。藉此，能突破現有製程上的限制。 The invention discloses a roll-to-roll flexible circuit board and a rapid processing method thereof. The rapid processing method first provides a substrate layer, then forms a wiring layer on the substrate layer, and then performs surface metal treatment on the wiring layer, and is subjected to surface metal treatment. The first wiring layer is soldered to provide a first intermetallic compound layer, and finally a build-up insulating layer is formed on the surface metal-treated wiring layer by coating, so that the build-up insulating layer fills the surface metal The hollowed out portion of the treated wiring layer. In this way, it is possible to break through the limitations of the existing process.
Description
本發明涉及一種柔性線路板及其製造方法，特別是涉及一種卷對卷柔性線路板及其快速加工方法。 The invention relates to a flexible circuit board and a manufacturing method thereof, in particular to a roll-to-roll flexible circuit board and a rapid processing method thereof.
近年來，隨著各種電子產品的設計趨向輕薄短小，此等電子產品內部所使用的印刷電路板(printed circuit board，PCB)與電子零件相對也要小型化和輕量化。為了增加印刷電路板內部的線路佈設空間，已有許多製程技術是將複數佈線層堆疊而構成多層式線路結構，並在其中設置導電結構來導通各層的線路，此即所謂的增層法(build-up method)。 In recent years, as the design of various electronic products tends to be light and thin, printed circuit boards (PCBs) and electronic components used in such electronic products have to be smaller and lighter. In order to increase the wiring space inside the printed circuit board, many process technologies have been to stack a plurality of wiring layers to form a multi-layer circuit structure, and a conductive structure is provided therein to conduct the lines of the layers. This is called a build-up method. -up method).
更進一步來說，現有的增層法多以半固化膠片(prepreg)來形成上、下層線路之間的絕緣介質，也就是先將半固化膠片壓合於一佈線層上，並使其固化形成絕緣介質層，再於絕緣介質層上製作另一佈線層。然而，由於每一次的線路增層所使用的半固化膠片通常是從整卷膠片上裁出預定的形狀和尺寸，故所形成的絕緣介質層的厚度都是固定不變的，以致於現有製程無法滿足不同層內線路的電氣性能的需要。除此之外，半固化膠片即便是在壓合時，其間隙填充能力仍然不佳，而不利於填滿線路之間的間隙，故所形成的絕緣介質層內會出現氣泡缺陷。 Furthermore, the existing build-up method mostly uses a prepreg to form an insulating medium between the upper and lower layers, that is, the prepreg is first pressed onto a wiring layer and cured. An insulating dielectric layer is formed on the insulating dielectric layer to form another wiring layer. However, since the prepreg used in each line buildup is usually cut out from the entire roll of film to a predetermined shape and size, the thickness of the formed insulating dielectric layer is fixed so that the existing process is completed. The electrical performance of the lines in different layers cannot be met. In addition, the semi-cured film has poor gap filling ability even when pressed, and is not favorable for filling the gap between the lines, so that bubble defects may occur in the formed insulating dielectric layer.
本發明所要解決的技術問題在於，針對現有技術的不足提供 一種提高製程能力的卷對卷柔性線路板及其快速加工方法。 The technical problem to be solved by the present invention is to provide for the deficiencies of the prior art. A roll-to-roll flexible circuit board with improved process capability and a rapid processing method thereof.
為了解決上述的技術問題，本發明所採用的其中一技術方案是：一種卷對卷柔性線路板之快速加工方法，其包括：提供一基板層；形成一第一佈線層於所述基板層上；對所述第一佈線層進行表面金屬處理，經表面金屬處理的所述第一佈線層通過焊接以提供一第一介金屬化合物層；以及利用塗佈方式形成一第一增層絕緣層於經表面金屬處理的所述第一佈線層上，以使所述第一增層絕緣層填滿經表面金屬處理的所述第一佈線層的一鏤空處。 In order to solve the above technical problem, one of the technical solutions adopted by the present invention is: a rapid processing method for a roll-to-roll flexible circuit board, comprising: providing a substrate layer; forming a first wiring layer on the substrate layer Performing a surface metal treatment on the first wiring layer, the first wiring layer subjected to surface metal treatment is soldered to provide a first intermetallic compound layer; and a first buildup insulating layer is formed by coating The first wiring layer is surface-metal treated such that the first build-up insulating layer fills a void of the surface metal-treated first wiring layer.
在本發明的一實施例中，所述卷對卷柔性線路板之快速加工方法還包括：形成一第二佈線層於所述第一增層絕緣層上；對所述第二佈線層進行表面金屬處理，經表面金屬處理的所述第二佈線層通過焊接以提供一第二介金屬化合物層；以及利用塗佈方式形成一第二增層絕緣層於經表面金屬處理的所述第二佈線層上，以使所述第二增層絕緣層填滿經表面金屬處理的所述第二佈線層的一鏤空處。 In an embodiment of the present invention, the method for rapidly processing a roll-to-roll flexible circuit board further includes: forming a second wiring layer on the first build-up insulating layer; and performing surface on the second wiring layer Metal treatment, the surface metal treated second wiring layer is soldered to provide a second intermetallic compound layer; and a second build-up insulating layer is formed by coating to the surface metal treated second wiring a layer such that the second build-up insulating layer fills a void of the surface metal-treated second wiring layer.
在本發明的一實施例中，在對所述第一佈線層進行表面金屬處理的步驟中，所述第一佈線層的表面上形成有一第一表面金屬層。在對所述第二佈線層進行表面金屬處理的步驟中，所述第二佈線層的表面上形成有一第二表面金屬層。所述第一表面金屬層與所述第二表面金屬層的材質為鎳或錫。 In an embodiment of the invention, in the step of performing surface metal treatment on the first wiring layer, a surface of the first wiring layer is formed with a first surface metal layer. In the step of performing surface metal treatment on the second wiring layer, a second surface metal layer is formed on the surface of the second wiring layer. The material of the first surface metal layer and the second surface metal layer is nickel or tin.
在本發明的一實施例中，所述第一表面金屬層與所述第二表面金屬層的厚度介於2微米至10微米之間。 In an embodiment of the invention, the first surface metal layer and the second surface metal layer have a thickness of between 2 micrometers and 10 micrometers.
在本發明的一實施例中，所述第一表面金屬層覆蓋所述第一佈線層的一部分。所述第二表面金屬層覆蓋所述第二佈線層的一部分。 In an embodiment of the invention, the first surface metal layer covers a portion of the first wiring layer. The second surface metal layer covers a portion of the second wiring layer.
在本發明的一實施例中，所述第一佈線層具有一第一焊接部，且所述第一表面金屬層覆蓋所述第一焊接部。所述第二佈線層具有一第二焊接部，且所述第二表面金屬層覆蓋所述第二焊接 部。 In an embodiment of the invention, the first wiring layer has a first soldering portion, and the first surface metal layer covers the first soldering portion. The second wiring layer has a second soldering portion, and the second surface metal layer covers the second soldering unit.
在本發明的一實施例中，在形成所述第二增層絕緣層的步驟中，通過塗佈以使所述第二增層絕緣層的厚度不同於所述第一增層絕緣層的厚度。 In an embodiment of the present invention, in the step of forming the second build-up insulating layer, coating is performed such that a thickness of the second build-up insulating layer is different from a thickness of the first build-up insulating layer .
在本發明的一實施例中，所述第一增層絕緣層與所述第二增層絕緣層的材質為聚醯亞胺或液晶聚合物。 In an embodiment of the invention, the first build-up insulating layer and the second build-up insulating layer are made of a polyimide or a liquid crystal polymer.
為了解決上述的技術問題，本發明所採用的另外一技術方案是：一種卷對卷柔性線路板，其包括一基板層、一第一佈線層、一第一表面金屬層以及一第一增層絕緣層。所述第一佈線層形成於所述基板層上；所述第一表面金屬層形成於所述第一佈線層上，其中所述第一表面金屬層的表面通過焊接而形成一第一介金屬化合物層；所述第一增層絕緣層形成於所述第一表面金屬層上，且填滿所述第一佈線層的一鏤空處。 In order to solve the above technical problem, another technical solution adopted by the present invention is: a roll-to-roll flexible circuit board comprising a substrate layer, a first wiring layer, a first surface metal layer, and a first build-up layer Insulation. The first wiring layer is formed on the substrate layer; the first surface metal layer is formed on the first wiring layer, wherein a surface of the first surface metal layer is formed by soldering to form a first metal a compound layer; the first build-up insulating layer is formed on the first surface metal layer and fills a hollow of the first wiring layer.
在本發明的一實施例中，所述卷對卷柔性線路板還包括一第二佈線層、一第二表面金屬層以及一第二增層絕緣層。所述第二佈線層形成於所述第一增層絕緣層上；所述第二表面金屬層形成於所述第二佈線層上，其中所述第二表面金屬層的表面通過焊接而形成一第二介金屬化合物層；所述第二增層絕緣層形成於所述第二表面金屬層上，且填滿所述第二佈線層的一鏤空處。 In an embodiment of the invention, the roll-to-roll flexible circuit board further includes a second wiring layer, a second surface metal layer, and a second build-up insulating layer. The second wiring layer is formed on the first build-up insulating layer; the second surface metal layer is formed on the second wiring layer, wherein a surface of the second surface metal layer is formed by soldering a second intermetallic compound layer; the second build-up insulating layer is formed on the second surface metal layer and fills a hollow of the second wiring layer.
在本發明的一實施例中，所述第一表面金屬層與所述第二表面金屬層的材質為鎳或錫。 In an embodiment of the invention, the first surface metal layer and the second surface metal layer are made of nickel or tin.
在本發明的一實施例中，所述第一表面金屬層與所述第二表面金屬層的厚度介於2微米至10微米之間。 In an embodiment of the invention, the first surface metal layer and the second surface metal layer have a thickness of between 2 micrometers and 10 micrometers.
在本發明的一實施例中，所述第一表面金屬層覆蓋所述第一佈線層的一部分。所述第二表面金屬層覆蓋所述第二佈線層的一部分。 In an embodiment of the invention, the first surface metal layer covers a portion of the first wiring layer. The second surface metal layer covers a portion of the second wiring layer.
在本發明的一實施例中，所述第一佈線層具有一第一焊接部，且所述第一表面金屬層覆蓋所述第一焊接部。所述第二佈線 層具有一第二焊接部，且所述第二表面金屬層覆蓋所述第二焊接部。 In an embodiment of the invention, the first wiring layer has a first soldering portion, and the first surface metal layer covers the first soldering portion. The second wiring The layer has a second weld and the second surface metal layer covers the second weld.
在本發明的一實施例中，所述第二增層絕緣層的厚度不同於所述第一增層絕緣層的厚度。 In an embodiment of the invention, the thickness of the second build-up insulating layer is different from the thickness of the first build-up insulating layer.
在本發明的一實施例中，所述第一增層絕緣層與所述第二增層絕緣層的材質為聚醯亞胺或液晶聚合物。 In an embodiment of the invention, the first build-up insulating layer and the second build-up insulating layer are made of a polyimide or a liquid crystal polymer.
本發明的其中一有益效果在於，本發明所提供的卷對卷柔性線路板之快速加工方法，其能通過“對佈線層進行表面金屬處理，使其能於焊接時在表面上形成良性的IMC層”以及“利用塗佈方式形成增層絕緣層，以使其填滿佈線層的鏤空處”的技術方案，以提高柔性線路板的信賴性，並使柔性線路板更具實用性。 One of the beneficial effects of the present invention is that the rapid processing method of the roll-to-roll flexible circuit board provided by the present invention can achieve a benign IMC on the surface by "surface metal treatment of the wiring layer" during soldering. The layer "and the coating method to form the build-up insulating layer to fill the void of the wiring layer" to improve the reliability of the flexible circuit board and make the flexible circuit board more practical.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the detailed description and drawings of the invention.
Z1、Z2、Z3‧‧‧柔性線路板 Z1, Z2, Z3‧‧‧ flexible circuit board
1‧‧‧基板層 1‧‧‧ substrate layer
11‧‧‧核心層 11‧‧‧ core layer
12‧‧‧導電層 12‧‧‧ Conductive layer
2‧‧‧第一佈線層 2‧‧‧First wiring layer
21‧‧‧焊接部 21‧‧‧Weld Department
3‧‧‧第一表面金屬層 3‧‧‧First surface metal layer
4‧‧‧第一增層絕緣層 4‧‧‧First buildup insulation
5‧‧‧第二佈線層 5‧‧‧Second wiring layer
6‧‧‧第二表面金屬層 6‧‧‧Second surface metal layer
7‧‧‧第二增層絕緣層 7‧‧‧Second build-up insulation
A‧‧‧介金屬化合物層 A‧‧‧Metal compound layer
S‧‧‧焊料 S‧‧‧ solder
D1、D2‧‧‧厚度 D1, D2‧‧‧ thickness
圖1為本發明的卷對卷柔性線路板之快速加工方法的步驟流程圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart showing the steps of a rapid processing method for a roll-to-roll flexible circuit board of the present invention.
圖2為第一次執行本發明的卷對卷柔性線路板之快速加工方法的步驟S102的製程示意圖。 2 is a schematic view showing the process of step S102 of the rapid processing method of the roll-to-roll flexible wiring board of the present invention.
圖3為第一次執行本發明的卷對卷柔性線路板之快速加工方法的步驟S104的製程示意圖。 Fig. 3 is a schematic view showing the process of the step S104 of the rapid processing method of the roll-to-roll flexible wiring board of the present invention.
圖4為第一次執行本發明的卷對卷柔性線路板之快速加工方法的步驟S106的製程示意圖。 Fig. 4 is a schematic view showing the process of the step S106 of the rapid processing method of the roll-to-roll flexible wiring board of the present invention.
圖5顯示根據步驟S104形成的佈線層，其於焊接時在表面上形成介金屬化合物。 Fig. 5 shows a wiring layer formed in accordance with step S104, which forms a metal intermetallic compound on the surface at the time of soldering.
圖6為第二次執行本發明的卷對卷柔性線路板之快速加工方法的步驟S102的製程示意圖。 Fig. 6 is a schematic view showing the process of the step S102 of the second method for performing the rapid processing of the roll-to-roll flexible wiring board of the present invention.
圖7為第二次執行本發明的卷對卷柔性線路板之快速加工方 法的步驟S104的製程示意圖。 Figure 7 is a second time for the rapid processing of the roll-to-roll flexible circuit board of the present invention. Schematic diagram of the process of step S104 of the method.
圖8為第二次執行本發明的卷對卷柔性線路板之快速加工方法的步驟S106的製程示意圖。 Fig. 8 is a schematic view showing the process of step S106 of the second method for rapidly processing the roll-to-roll flexible wiring board of the present invention.
圖9為根據本發明的卷對卷柔性線路板之快速加工方法所得到的一種卷對卷柔性線路板的結構示意圖。 Figure 9 is a structural schematic view of a roll-to-roll flexible circuit board obtained by the rapid processing method of the roll-to-roll flexible circuit board according to the present invention.
圖10為根據本發明的卷對卷柔性線路板之快速加工方法所得到的另一種卷對卷柔性線路板的結構示意圖。 Fig. 10 is a structural schematic view showing another roll-to-roll flexible circuit board obtained by the rapid processing method of the roll-to-roll flexible circuit board according to the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“卷對卷柔性線路板及其快速加工方法”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。 The following is a specific embodiment to illustrate the implementation of the "roll-to-roll flexible circuit board and its rapid processing method" disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in the present specification. . The invention can be implemented or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not intended to be stated in the actual size. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of the present invention.
應理解，雖然本文中可能使用術語第一、第二、第三等來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, these elements or signals are not limited by these terms. These terms are primarily used to distinguish one element from another, or one signal and another. In addition, the term "or" as used herein may include a combination of any one or more of the associated listed items, depending on the actual situation.
請參閱圖1至圖8，圖1為本發明一實施例的卷對卷柔性線路板之快速加工方法的步驟流程圖，圖2至圖8為本發明一實施例的卷對卷柔性線路板之快速加工方法的製程示意圖。關於本實施例的卷對卷柔性線路板之快速加工方法(或稱“多層線路板之製造方法”)，其至少包括下列幾個步驟：步驟S100，提供一基板層；步驟S102，形成一佈線層於基板層上；步驟S104，對佈線層進行 表面金屬處理；以及步驟S106，利用塗佈方式形成一增層絕緣層於經表面金屬處理的佈線層上。 Please refer to FIG. 1 to FIG. 8. FIG. 1 is a flow chart showing the steps of a method for rapidly processing a roll-to-roll flexible circuit board according to an embodiment of the present invention, and FIG. 2 to FIG. 8 are a roll-to-roll flexible circuit board according to an embodiment of the present invention. Schematic diagram of the process of the rapid processing method. The method for rapidly processing a roll-to-roll flexible circuit board of the present embodiment (or "manufacturing method of a multilayer circuit board") includes at least the following steps: step S100, providing a substrate layer; and step S102, forming a wiring Layered on the substrate layer; in step S104, the wiring layer is performed Surface metal treatment; and step S106, forming a build-up insulating layer on the surface metal-treated wiring layer by coating.
在步驟S100中，如圖2所示，基板層1可為單層結構，基板層1的材質可為聚醯亞胺(polyimide，PI)、聚碳酸酯(polycarbonate，PC)、聚對苯二甲酸乙二酯(polyethylene terephthalate，PET)、液晶高分子(liquid crystal polyester，LCP)或聚四氟乙烯(polytetrafluoroethylene，PTFE)等，但並不限定於此。 In step S100, as shown in FIG. 2, the substrate layer 1 may have a single layer structure, and the material of the substrate layer 1 may be polyimide (PI), polycarbonate (PC), poly(p-phenylene terephthalate). Ethylene terephthalate (PET), liquid crystal polyester (LCP), or polytetrafluoroethylene (PTFE), etc., but is not limited thereto.
在步驟S104中，如圖2所示，可利用半加成法(semi-additive process，SAP)於基板層1的一面上形成一第一佈線層2，用以構成內層線路與導電結構(如：導電接觸墊)，但並不限定於此。更進一步來說，形成第一佈線層2的方法可包括：先利用電鍍(electroplating)製程形成一金屬鍍層(圖中未顯示)，其中金屬鍍層全面覆蓋基板層1，然後再依照設定的線路圖案，利用微影(lithography)及蝕刻(etch)製程將金屬鍍層圖案化，但並不限定於此。 In step S104, as shown in FIG. 2, a first wiring layer 2 may be formed on one surface of the substrate layer 1 by using a semi-additive process (SAP) to form an inner layer wiring and a conductive structure ( Such as: conductive contact pad), but is not limited to this. Further, the method of forming the first wiring layer 2 may include: first forming a metal plating layer (not shown) by an electroplating process, wherein the metal plating layer completely covers the substrate layer 1 and then according to the set circuit pattern. The metal plating layer is patterned by a lithography and an etch process, but is not limited thereto.
在其他實施例中，形成第一佈線層2的方法可包括：先利用無電鍍(electroless plating)或濺鍍(sputtering)製程形成一介面層(或稱種子層或觸媒層，圖中未顯示)，其中介面層全面覆蓋基板層1，並使金屬鍍層以介面層為媒介而形成於基板層1上，然後再利用微影(lithography)及蝕刻(etch)製程將金屬鍍層圖案化。或者，可依照設定的線路圖案，利用噴塗(spraying)或印刷(printing)製程形成一圖案化的介面層，並使金屬材料直接沉積於圖案化的介面層上而完成線路的製作。介面層的材質可為鈀-鎳(Pd-Ni)或鈀-聚合物(Pd-polymer)，但並不限定於此。 In other embodiments, the method of forming the first wiring layer 2 may include first forming an interface layer (or a seed layer or a catalyst layer) by an electroless plating or sputtering process, which is not shown in the figure. The interposer layer completely covers the substrate layer 1, and the metal plating layer is formed on the substrate layer 1 by using an interface layer, and then the metal plating layer is patterned by a lithography and an etch process. Alternatively, a patterned interface layer may be formed by a spraying or printing process according to a set circuit pattern, and the metal material may be directly deposited on the patterned interface layer to complete the fabrication of the wiring. The material of the interface layer may be palladium-nickel (Pd-Ni) or palladium-polymer (Pd-polymer), but is not limited thereto.
在步驟S104中，如圖3所示，第一佈線層2的表面上形成有一第一表面金屬層3。第一表面金屬層3可利用電鍍或無電鍍製程而形成，第一表面金屬層3的材質可為鎳或錫，且厚度介於2微米至10微米之間。在步驟S106中，如圖4所示，第一增層絕緣 層4形成於第一表面金屬層3上，且填滿第一佈線層2的鏤空處。第一增層絕緣層4可由熱固化絕緣材料所形成，而考慮到材料的物化特性(如：耐熱性、機械特性、電氣特性等)，本實施例採用聚醯亞胺或液晶高分子來形成第一增層絕緣層4，但並不限定於此。 In step S104, as shown in FIG. 3, a first surface metal layer 3 is formed on the surface of the first wiring layer 2. The first surface metal layer 3 may be formed by an electroplating or electroless plating process, and the first surface metal layer 3 may be made of nickel or tin and have a thickness of between 2 micrometers and 10 micrometers. In step S106, as shown in FIG. 4, the first build-up insulation The layer 4 is formed on the first surface metal layer 3 and fills the hollow of the first wiring layer 2. The first build-up insulating layer 4 may be formed of a heat-curable insulating material, and in view of the physicochemical properties of the material (eg, heat resistance, mechanical properties, electrical properties, etc.), the present embodiment is formed by using a polyimide or a liquid crystal polymer. The first buildup insulating layer 4 is not limited thereto.
值得說明的是，由於第一增層絕緣層4是先將其原料(如：絕緣材料組成物)塗佈於第一表面金屬層3上以形成濕膜，且於塗佈過程中濕膜能將第一佈線層2的鏤空處填充並充實，然後再對濕膜進行熱處理以使其形成乾膜。因此，第一增層絕緣層4內不會有氣泡產生，且第一增層絕緣層4的厚度可通過控制濕膜的厚度與乾膜的厚度損耗來達到精準的控制，以及第一增層絕緣層4可根據實際需要而具有不同的厚度。 It is worth noting that since the first build-up insulating layer 4 is first coated with a raw material (such as an insulating material composition) on the first surface metal layer 3 to form a wet film, and the wet film can be applied during the coating process. The hollow portion of the first wiring layer 2 is filled and filled, and then the wet film is heat-treated to form a dry film. Therefore, no bubbles are generated in the first build-up insulating layer 4, and the thickness of the first build-up insulating layer 4 can be precisely controlled by controlling the thickness of the wet film and the thickness loss of the dry film, and the first build-up layer. The insulating layer 4 can have different thicknesses according to actual needs.
再者，如圖5所示，第一表面金屬層3能於焊接時，在焊接所需的熱處理溫度(如：100℃至260℃)下與焊料產生交互作用，而形成一良性的介金屬化合物(inter metallic compound,IMC)層A，以增加第一佈線層2與焊料S(如：錫球)之間的接合力。較佳地，第一表面金屬層3的厚度介於2微米至10微米之間，介金屬化合物層A的材質可為銅-錫合金、鎳-錫合金或銅-鎳-錫合金，但並不限定於此。附帶說明一點，於焊接時須在第一增層絕緣層4上形成一開口(圖中未標號)，以使第一佈線層2的一部分裸露。 Furthermore, as shown in FIG. 5, the first surface metal layer 3 can interact with the solder at the heat treatment temperature (for example, 100 ° C to 260 ° C) required for soldering to form a benign dielectric metal. An intermetallic compound (IMC) layer A is used to increase the bonding force between the first wiring layer 2 and the solder S (eg, solder balls). Preferably, the thickness of the first surface metal layer 3 is between 2 micrometers and 10 micrometers, and the material of the metal-organic compound layer A may be a copper-tin alloy, a nickel-tin alloy or a copper-nickel-tin alloy, but It is not limited to this. Incidentally, an opening (not shown) must be formed on the first build-up insulating layer 4 during soldering to expose a portion of the first wiring layer 2.
值得說明的是，若第一表面金屬層3的厚度低於2微米，則容易形成不良的IMC層，而不良的IMC層會損及焊料的機械強度、與抗疲勞性(fatigue strength)，若第一表面金屬層3的厚度高於10微米，則會造成焊料對第一佈線層2的附著力降低。 It should be noted that if the thickness of the first surface metal layer 3 is less than 2 μm, a defective IMC layer is easily formed, and a poor IMC layer may damage the mechanical strength and fatigue strength of the solder. When the thickness of the first surface metal layer 3 is higher than 10 μm, the adhesion of the solder to the first wiring layer 2 is lowered.
本實施例中，如圖4所示，第一表面金屬層3是覆蓋第一佈線層2的全表面，但並不限定於此。在其他實施例中，第一表面金屬層3可以只覆蓋第一佈線層2的部分表面，例如，如圖5所示，第一佈線層2具有一用於進行焊接的焊接部21，且第一表面金屬層3只覆蓋焊接部21。 In the present embodiment, as shown in FIG. 4, the first surface metal layer 3 covers the entire surface of the first wiring layer 2, but is not limited thereto. In other embodiments, the first surface metal layer 3 may cover only a portion of the surface of the first wiring layer 2, for example, as shown in FIG. 5, the first wiring layer 2 has a soldering portion 21 for soldering, and A surface metal layer 3 covers only the welded portion 21.
在步驟S106結束之後，即完成第一次的線路增層。其中，第一佈線層2形成於基板層1上；第一表面金屬層3形成於第一佈線層2上，其中第一佈線層2能於焊接時，通過第一表面金屬層3以在其表面上形成一介金屬化合物層A；第一增層絕緣層4形成於第一表面金屬層3上，且填滿第一佈線層2的鏤空處。 After the end of step S106, the first line build-up is completed. Wherein the first wiring layer 2 is formed on the substrate layer 1; the first surface metal layer 3 is formed on the first wiring layer 2, wherein the first wiring layer 2 can pass through the first surface metal layer 3 during soldering A metal compound layer A is formed on the surface; the first build-up insulating layer 4 is formed on the first surface metal layer 3 and fills the void of the first wiring layer 2.
請參閱圖6至圖8，本實施例的卷對卷柔性線路板之快速加工方法在完成上述步驟之後，可再依照所需層數重複步驟S102至步驟S106數次，以製成柔性線路板Z1(即多層線路板)。例如，一般手機用電路板層數約為8至14層。更進一步來說，先形成一第二佈線層5於第一增層絕緣層4上，再對第二佈線層5進行表面金屬處理，以在第二佈線層5的表面上形成一第二表面金屬層6，然後利用塗佈方式形成一第二增層絕緣層7於第二表面金屬層6上並填滿第二佈線層5的鏤空處，如此即完成另一次的線路增層，依此類推。關於第二佈線層5、第二表面金屬層6與第二增層絕緣層7的具體實施方式與技術細節，和第一佈線層2、第一表面金屬層3與第一增層絕緣層4大致相同，故於此不再贅述。 Referring to FIG. 6 to FIG. 8 , after the above steps are completed, the method for quickly processing the roll-to-roll flexible circuit board of the embodiment may repeat steps S102 to S106 several times according to the required number of layers to form a flexible circuit board. Z1 (ie multilayer board). For example, the average number of circuit boards used in mobile phones is about 8 to 14 layers. Further, a second wiring layer 5 is formed on the first build-up insulating layer 4, and then the second wiring layer 5 is subjected to surface metal treatment to form a second surface on the surface of the second wiring layer 5. The metal layer 6 is then formed by coating to form a second build-up insulating layer 7 on the second surface metal layer 6 and fill the void of the second wiring layer 5, thus completing another line buildup. analogy. Specific embodiments and technical details regarding the second wiring layer 5, the second surface metal layer 6, and the second build-up insulating layer 7, and the first wiring layer 2, the first surface metal layer 3, and the first build-up insulating layer 4 It is roughly the same, so it will not be repeated here.
雖然在本實施例的柔性線路板Z1中，如圖7及圖8所示，第二表面金屬層6是覆蓋第二佈線層5的全表面，但是在其他實施例中，第二表面金屬層6可以只覆蓋第二佈線層5的部分表面，例如，第二佈線層5具有一用於進行焊接的焊接部(圖中未顯示)，且第二表面金屬層6只覆蓋焊接部。如此一來，第二表面金屬層6也能於焊接時，在焊接所需的熱處理溫度下與焊料產生交互作用，而形成一良性的介金屬化合物層(圖中未顯示)，以增加第二佈線層5與焊料(如：錫球)之間的接合力，從而提高柔性線路板Z1的信賴性。 Although in the flexible wiring board Z1 of the present embodiment, as shown in FIGS. 7 and 8, the second surface metal layer 6 covers the entire surface of the second wiring layer 5, in other embodiments, the second surface metal layer 6 may cover only a part of the surface of the second wiring layer 5, for example, the second wiring layer 5 has a soldering portion (not shown) for performing soldering, and the second surface metal layer 6 covers only the soldering portion. In this way, the second surface metal layer 6 can also interact with the solder at the heat treatment temperature required for soldering during soldering to form a benign metal-organic compound layer (not shown) to increase the second. The bonding force between the wiring layer 5 and the solder (e.g., solder balls), thereby improving the reliability of the flexible wiring board Z1.
依上所述，即完成第二次的線路增層。其中，第二佈線層5形成於第一增層絕緣層4上；第二表面金屬層6形成於第二佈線層5上，其中第二佈線層5能於焊接時，通過第二表面金屬層6 以在其表面上形成一介金屬化合物層；第二增層絕緣層7形成於第二表面金屬層6上，且填滿第二佈線層5的鏤空處。 According to the above, the second line buildup is completed. Wherein, the second wiring layer 5 is formed on the first build-up insulating layer 4; the second surface metal layer 6 is formed on the second wiring layer 5, wherein the second wiring layer 5 can pass through the second surface metal layer during soldering 6 A layer of a metal compound is formed on the surface thereof; a second build-up insulating layer 7 is formed on the second surface metal layer 6 and fills the void of the second wiring layer 5.
再者，如圖8所示，由於第二增層絕緣層7是利用塗佈而形成，因此其能將第二佈線層5的鏤空處填充並充實，且通過控制濕膜的厚度與乾膜的厚度損耗來達到精準的控制，能克服現有製程“使用固定厚度的膠片來進行增層”的限制，使第二增層絕緣層7的厚度D1與第一增層絕緣層4的厚度D1不同，以滿足電路不同的電氣性能的要求。 Furthermore, as shown in FIG. 8, since the second build-up insulating layer 7 is formed by coating, it can fill and enrich the void of the second wiring layer 5, and by controlling the thickness of the wet film and the dry film The thickness loss is used to achieve precise control, which overcomes the limitation of the prior art process of "adding layers using a fixed thickness of film", so that the thickness D1 of the second build-up insulating layer 7 is different from the thickness D1 of the first build-up insulating layer 4. To meet the different electrical performance requirements of the circuit.
請參閱圖9，在其他實施例中柔性線路板Z2所包括的基板層1也可為多層結構，例如，基板層1可由一核心層11與一導電層12堆疊而成，其中導電層12形成於核心層11的上表面或下表面上。以軟性銅箔基板(flexible copper clad laminate，FCCL)作為基板層1而言，核心層11為一聚醯亞胺層，且導電層12為一銅箔層，但並不限定於此。 Referring to FIG. 9 , in other embodiments, the substrate layer 1 included in the flexible circuit board Z2 may also be a multi-layer structure. For example, the substrate layer 1 may be formed by stacking a core layer 11 and a conductive layer 12 , wherein the conductive layer 12 is formed. On the upper or lower surface of the core layer 11. In the case of the substrate layer 1 of the flexible copper clad laminate (FCCL), the core layer 11 is a polyimide layer, and the conductive layer 12 is a copper foil layer, but is not limited thereto.
請參閱圖10，本實施例的柔性線路板之快速加工方法還能用於製作雙面的柔性線路板Z3，也就是說，其能分別或同時於基板層1的上、下表面進行線路增層。例如，在步驟S102中，可以在基板層1的上、下表面上分別形成一第一佈線層2；或者，在兩個第一增層絕緣層4上分別形成一第二佈線層5。在步驟S104中，可以對兩個第一佈線層2進行表面金屬處理，以在兩個第一佈線層2的表面上分別形成一第一表面金屬層3；或者，可以對兩個第二佈線層5進行表面金屬處理，以在兩個第二佈線層5的表面上分別形成一第二表面金屬層6。在步驟S106中，可以在兩個第一表面金屬層3上分別形成一第一增層絕緣層4，並使其填滿第一佈線層2的鏤空處；或者，可以在兩個第二表面金屬層6上分別形成一第二增層絕緣層7，並使其填滿第二佈線層5的鏤空處。 Referring to FIG. 10, the rapid processing method of the flexible circuit board of the present embodiment can also be used to fabricate the double-sided flexible circuit board Z3, that is, it can perform line increase on the upper and lower surfaces of the substrate layer 1 separately or simultaneously. Floor. For example, in step S102, a first wiring layer 2 may be formed on the upper and lower surfaces of the substrate layer 1, or a second wiring layer 5 may be formed on each of the two first enhancement insulating layers 4. In step S104, the two first wiring layers 2 may be subjected to surface metal treatment to respectively form a first surface metal layer 3 on the surfaces of the two first wiring layers 2; or, two second wirings may be The layer 5 is subjected to surface metal treatment to form a second surface metal layer 6 on the surfaces of the two second wiring layers 5, respectively. In step S106, a first build-up insulating layer 4 may be respectively formed on the two first surface metal layers 3 and filled to the hollow of the first wiring layer 2; or, may be on the two second surfaces. A second build-up insulating layer 7 is formed on the metal layer 6, and is filled with the hollow portion of the second wiring layer 5.
[實施例的有益效果] [Advantageous Effects of Embodiments]
本發明的其中一有益效果在於，本發明所提供的卷對卷柔性線路板之快速加工方法，其能通過“對佈線層進行表面金屬處理，使其能於焊接時在表面上形成良性的IMC層”以及“利用塗佈方式形成增層絕緣層，以使其填滿佈線層的鏤空處”的技術特徵，以提高柔性線路板的信賴性，並使柔性線路板更具實用性。 One of the beneficial effects of the present invention is that the rapid processing method of the roll-to-roll flexible circuit board provided by the present invention can achieve a benign IMC on the surface by "surface metal treatment of the wiring layer" during soldering. The layer "and the technical feature of forming a build-up insulating layer by coating to fill the void of the wiring layer" to improve the reliability of the flexible wiring board and make the flexible wiring board more practical.
更進一步來說，由於增層絕緣層是利用塗佈而形成，因此增層絕緣層能將佈線層的鏤空處填充並充實，以避免氣泡產生。再者，增層絕緣層的厚度可通過控制濕膜的厚度與乾膜的厚度損耗來達到精準的控制，且上、下層的增層絕緣層可具有不同的厚度，以滿足不同層內線路的電氣性能的需要。並且，塗佈後的增層絕緣層可藉由CCD和IR來檢控外觀及厚度。 Furthermore, since the build-up insulating layer is formed by coating, the build-up insulating layer can fill and enrich the void of the wiring layer to avoid bubble generation. Furthermore, the thickness of the build-up insulating layer can be precisely controlled by controlling the thickness of the wet film and the thickness loss of the dry film, and the build-up insulating layers of the upper and lower layers can have different thicknesses to meet the lines of different layers. The need for electrical performance. Moreover, the coated insulating layer can be used to check the appearance and thickness by CCD and IR.
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。 The above disclosure is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the drawings are included in the application of the present invention. Within the scope of the patent.
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| US4349609A (en) * | 1979-06-21 | 1982-09-14 | Fujitsu Limited | Electronic device having multilayer wiring structure |
| TWI248183B (en) * | 2002-09-26 | 2006-01-21 | Sanyo Electric Co | Method of manufacturing circuit device |
| TWI449482B (en) * | 2008-02-13 | 2014-08-11 | Nippon Steel & Sumikin Chem Co | Manufacturing method for circuit wiring board |
| US20140318698A1 (en) * | 2010-03-04 | 2014-10-30 | Rogers Corporation | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
| TWI525833B (en) * | 2009-09-30 | 2016-03-11 | 大日本印刷股份有限公司 | Substrate for flexible device,thin-film transistor substrate for flexible device,flexible device,substrate for thin film device,thin film device,thin film transistor,manufacturing method of substrate for thin film device,manufacturing method of thin film |
-
2018
- 2018-01-31 TW TW107103448A patent/TWI647989B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4349609A (en) * | 1979-06-21 | 1982-09-14 | Fujitsu Limited | Electronic device having multilayer wiring structure |
| TWI248183B (en) * | 2002-09-26 | 2006-01-21 | Sanyo Electric Co | Method of manufacturing circuit device |
| TWI449482B (en) * | 2008-02-13 | 2014-08-11 | Nippon Steel & Sumikin Chem Co | Manufacturing method for circuit wiring board |
| TWI525833B (en) * | 2009-09-30 | 2016-03-11 | 大日本印刷股份有限公司 | Substrate for flexible device,thin-film transistor substrate for flexible device,flexible device,substrate for thin film device,thin film device,thin film transistor,manufacturing method of substrate for thin film device,manufacturing method of thin film |
| US20140318698A1 (en) * | 2010-03-04 | 2014-10-30 | Rogers Corporation | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
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| Publication number | Publication date |
|---|---|
| TW201936030A (en) | 2019-09-01 |
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