TWI645966B - 聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法 - Google Patents

聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法 Download PDF

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Publication number
TWI645966B
TWI645966B TW103142930A TW103142930A TWI645966B TW I645966 B TWI645966 B TW I645966B TW 103142930 A TW103142930 A TW 103142930A TW 103142930 A TW103142930 A TW 103142930A TW I645966 B TWI645966 B TW I645966B
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TW
Taiwan
Prior art keywords
layer
polyimide
release film
resin
adhesive layer
Prior art date
Application number
TW103142930A
Other languages
English (en)
Chinese (zh)
Other versions
TW201532822A (zh
Inventor
山田薰平
藤本大輔
岩倉哲郎
金子陽一
村井曜
Original Assignee
日商日立化成股份有限公司
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Publication of TW201532822A publication Critical patent/TW201532822A/zh
Application granted granted Critical
Publication of TWI645966B publication Critical patent/TWI645966B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C09J2461/005—Presence of condensation polymers of aldehydes or ketones in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW103142930A 2013-12-09 2014-12-09 聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法 TWI645966B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-254088 2013-12-09
JP2013254088 2013-12-09

Publications (2)

Publication Number Publication Date
TW201532822A TW201532822A (zh) 2015-09-01
TWI645966B true TWI645966B (zh) 2019-01-01

Family

ID=53371186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103142930A TWI645966B (zh) 2013-12-09 2014-12-09 聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法

Country Status (5)

Country Link
JP (1) JP6561841B2 (ja)
KR (1) KR102344267B1 (ja)
CN (1) CN106232355A (ja)
TW (1) TWI645966B (ja)
WO (1) WO2015087884A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6679902B2 (ja) * 2015-12-04 2020-04-15 日立化成株式会社 めっきプロセス用樹脂組成物、めっきプロセス用樹脂付キャリアフィルム及びその製造方法、配線板用積層体並びに配線板の製造方法
JP6756162B2 (ja) * 2016-06-08 2020-09-16 日立化成株式会社 コンフォーマルマスク用絶縁層付き離型金属箔、積層板、多層配線板及び多層配線板の製造方法
CN106840101B (zh) * 2017-04-11 2019-01-22 重庆三峡学院 一种新型光学水准器
JP6879158B2 (ja) * 2017-10-03 2021-06-02 信越化学工業株式会社 半導体装置及びその製造方法、並びに積層体
JP6997976B2 (ja) * 2017-10-13 2022-01-18 東レフィルム加工株式会社 エポキシ樹脂含有層転写フィルム用離型フィルムおよびエポキシ樹脂含有層転写フィルム
JP6967432B2 (ja) * 2017-11-21 2021-11-17 リンテック株式会社 セラミックグリーンシート製造工程用剥離フィルムおよびその製造方法
JP6934141B2 (ja) * 2017-11-28 2021-09-15 東レフィルム加工株式会社 転写フィルム用離型フィルムおよび転写フィルム
JP7358729B2 (ja) * 2018-01-29 2023-10-11 東レ株式会社 離型フィルム
JP7070128B2 (ja) * 2018-06-15 2022-05-18 大日本印刷株式会社 積層体、ポリイミドフィルム、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置並びにポリイミドフィルムの製造方法、積層体の製造方法及びディスプレイ用表面材の製造方法
JP7223672B2 (ja) * 2019-11-08 2023-02-16 日本特殊陶業株式会社 多層配線基板
CN113498270B (zh) * 2021-07-08 2023-06-02 江西晶弘新材料科技有限责任公司 一种用于氮化铝陶瓷基板中固化油墨的退洗方法

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JPH11300894A (ja) * 1998-04-16 1999-11-02 Shin Etsu Chem Co Ltd 工程用離型フィルム
US20050261438A1 (en) * 2004-05-24 2005-11-24 Lintec Corporation Release agent cpmposition and release liner
US20070166523A1 (en) * 2006-01-17 2007-07-19 Lintec Corporation Release film and process for producing the film
US20090084487A1 (en) * 2007-09-28 2009-04-02 Tdk Corporation Manufacturing method of laminated film and multilayer ceramic electronic device thereof
US20110085437A1 (en) * 2008-06-17 2011-04-14 Lintec Corporation Sheet for multilayer optical recording medium and multilayer optical recording medium using the same
WO2012153776A1 (ja) * 2011-05-11 2012-11-15 日本曹達株式会社 離型剤組成物及びそれを用いた転写箔

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JP2000301665A (ja) * 1999-04-22 2000-10-31 Toyobo Co Ltd 転写シート用離型フィルム及び転写シート
JP2003251739A (ja) 2002-03-01 2003-09-09 Mitsubishi Gas Chem Co Inc アディティブ用基材入り金属箔付きｂステージ樹脂組成物シート。
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KR101240916B1 (ko) * 2011-02-01 2013-03-11 도레이첨단소재 주식회사 반사시트용 점착필름 및 그를 이용한 반사시트

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH11300894A (ja) * 1998-04-16 1999-11-02 Shin Etsu Chem Co Ltd 工程用離型フィルム
US20050261438A1 (en) * 2004-05-24 2005-11-24 Lintec Corporation Release agent cpmposition and release liner
US20070166523A1 (en) * 2006-01-17 2007-07-19 Lintec Corporation Release film and process for producing the film
US20090084487A1 (en) * 2007-09-28 2009-04-02 Tdk Corporation Manufacturing method of laminated film and multilayer ceramic electronic device thereof
US20110085437A1 (en) * 2008-06-17 2011-04-14 Lintec Corporation Sheet for multilayer optical recording medium and multilayer optical recording medium using the same
WO2012153776A1 (ja) * 2011-05-11 2012-11-15 日本曹達株式会社 離型剤組成物及びそれを用いた転写箔

Also Published As

Publication number Publication date
JP6561841B2 (ja) 2019-08-21
CN106232355A (zh) 2016-12-14
KR102344267B1 (ko) 2021-12-27
TW201532822A (zh) 2015-09-01
JPWO2015087884A1 (ja) 2017-03-16
WO2015087884A1 (ja) 2015-06-18
KR20160094972A (ko) 2016-08-10

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