TWI636522B - 晶圓狀物件之表面處理用裝置 - Google Patents
晶圓狀物件之表面處理用裝置 Download PDFInfo
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Abstract
一種晶圓狀物件之處理用裝置包含封閉處理腔室。該封閉處理腔室包含:提供氣密包圍區域的外殼;位於封閉處理腔室內且用以固持其上之晶圓狀物件的旋轉夾盤;及設置於該封閉處理腔室內的內部蓋件。該內部蓋件可於其中旋轉夾盤與封閉處理腔室之外壁相連的第一位置、與其中內部蓋件對鄰近旋轉夾盤的封閉處理腔室之內表面加以密封來定義氣密之內處理腔室的第二位置之間移動。
Description
本發明大致關於例如半導體晶圓的晶圓狀物件之表面處理用裝置,其中自封閉處理腔室內獲得一或更多處理流體。
半導體晶圓受到各種表面處理製程,例如蝕刻、清洗、拋光及材料沉積。為了容納這些製程,單一晶圓可由與可旋轉載具有關之夾盤相關於一或更多處理流體加以支撐,例如於美國專利第4,903,717及5,513,668號中所述者。
或者,可將用以支撐晶圓的呈環狀轉子形式之夾盤定位於封閉處理腔室內,並在不具物理性接觸的情況下經由主動磁性軸承(active magnetic bearing)加以驅動,例如於國際發表編號第WO 2007/101764號及美國專利第6,485,531號中所述者。因離心作用而自旋轉中晶圓之邊緣朝外驅動的處理流體被送至處置用之共同排放管線。
儘管習知之封閉處理腔室在腔室關閉時適當地容納用於晶圓處理之危險物質,但其必須開啟以供裝載及卸載晶圓。此導致處理氣體、化學煙霧、例如汽化異丙醇之熱蒸氣、臭氧及類似者可能釋放至工具環境的明顯風險,而可能導致明顯的安全風險及對於周圍構件及工具的損害。
本發明人已發展出一種改善的用以處理晶圓狀物件之封閉處理腔室,其中在外腔室內設有內腔室,而內腔室及外腔室之各者係配置成提供氣密包圍區域。
因此在一實施態樣中,本發明有關於一種晶圓狀物件之處理用裝置,包含封閉處理腔室。該封閉處理腔室包含:提供氣密包圍區域的外殼;位於該封閉處理腔室內且用以固持其上之晶圓狀物件的旋轉夾盤;及設置於該封閉處理腔室內的內部蓋件。該內
部蓋件可於其中旋轉夾盤與封閉處理腔室之外壁相連的第一位置、與其中內部蓋件對鄰近旋轉夾盤的封閉處理腔室之內表面加以密封來定義氣密之內處理腔室的第二位置之間移動。較佳地,介於第一位置與第二位置之間的該移動為沿旋轉夾盤之旋轉軸的軸向移動。
在依據本發明之裝置的較佳實施例中,當位於第二位置時,內部蓋件形成內處理腔室之一下部。
在依據本發明之裝置的較佳實施例中,內部蓋件包含基座及至少一直立壁,該基座係連接至經由密封件穿過封閉處理腔室之一軸,該密封件容許該軸與封閉處理腔室之間的相對移動、同時維持外處理腔室之氣密性。較佳地,該相對移動為沿旋轉夾盤之旋轉軸的軸向移動。
在依據本發明之裝置的較佳實施例中,至少一處理流體收集器形成於內部蓋件之下部中,該處理流體收集器與排出管連通,該排出管係自內部蓋件懸出、經由密封件穿過封閉處理腔室,該密封件容許排出管與封閉處理腔室之間的相對移動、同時維持外處理腔室之氣密性。
在依據本發明之裝置的較佳實施例中,封閉處理腔室包含獨立受到控制的排放埠,當內部蓋件位於第二位置時,第一排放埠通至封閉處理腔室、內腔室內之一區域中,且當內部蓋件位於第二位置時,第二排放埠通至封閉處理腔室、內腔室外之一區域中。
在依據本發明之裝置的較佳實施例中,內部蓋件包含可相對於內部蓋件獨立地軸向位移的複數防濺板,當內部蓋件位於第二位置時,該等防濺板及內部蓋件係用以在內腔室內定義複數分離處理區域。
在依據本發明之裝置的較佳實施例中,分離處理區域之每一者包含與其流體連通之個別液體排放管。
在依據本發明之裝置的較佳實施例中,可軸向位移的防濺板之每一者係選擇性地自封閉處理腔室外受驅動至一預先定義垂直位置。
在依據本發明之裝置的較佳實施例中,可軸向位移的防濺板之每一者可選擇性地加以定位,以捕獲從由旋轉夾盤所承載的旋轉中之晶圓散出的預先選定之處理流體。
在依據本發明之裝置的較佳實施例中,旋轉夾盤係用以在無物理接觸的情況下經由磁性軸承加以驅動,且旋轉夾盤及內部蓋件可相對彼此垂直地移動。
在依據本發明之裝置的較佳實施例中,磁性軸承包含位於封閉處理腔室外的一定子。
在依據本發明之裝置的較佳實施例中,磁性軸承可選擇性地加以定位,使得從由旋轉夾盤所承載的旋轉中之晶圓散出的預先選定之處理流體被導引至一預先選定之流體收集器。
在依據本發明之裝置的較佳實施例中,磁性軸承為主動磁性軸承。
在依據本發明之裝置的較佳實施例中,封閉處理腔室為半導體晶圓之單一晶圓濕式處理站中的一模組。
在依據本發明之裝置的較佳實施例中,封閉處理腔室係由以過氟烷氧基(perfluoroalkoxy)樹脂塗覆之鋁所製成。
現參照圖1,依據本發明之第一實施例的晶圓狀物件之表面處理用裝置包含外處理腔室1,其較佳地由以PFA(過氟烷氧基,perfluoroalkoxy)樹脂塗覆之鋁所製成。此實施例中的腔室具有主圓柱壁10、下部12及上部15。由蓋件36關閉的較窄之圓柱壁34自上部15延伸。
旋轉夾盤30係設置於腔室1之上部,且由圓柱壁34所圍繞。旋轉夾盤30在裝置使用期間可轉動地支撐晶圓W。旋轉夾盤30結合了包含環形齒輪38的旋轉驅動器,該旋轉驅動器接合並驅動用以選擇性地接觸及釋放晶圓W之周圍邊緣的可偏心移動之複數夾持構件。
在此實施例中,旋轉夾盤30為鄰近圓柱壁34之內表面而設
置的環形轉子。定子32係相對於環形轉子、鄰近圓柱壁34之外表面而設置。轉子30及定子32作為可藉以經由主動磁性軸承使環形轉子30(及從而受支撐之晶圓W)轉動的馬達。例如,定子32可包含複數電磁線圈或繞線,其可受到主動控制以經由設置於轉子上的對應之永久磁鐵而可轉動地驅動旋轉夾盤30。旋轉夾盤30之軸向及徑向軸承亦可藉由定子之主動控制或藉由永久磁鐵來實現。因此,可使旋轉夾盤30懸浮並在無機械性接觸的情況下可轉動地驅動。或者,轉子可由被動軸承支托,其中轉子之磁鐵係由圍繞地排列於腔室外之外轉子上的相對應之高溫超導磁鐵(HTS-magnets)所支托。在此選擇性之實施例的情況下,環形轉子之每一磁鐵被牽制於其對應的外轉子之高溫超導磁鐵。因此在不物理性地連接的情況下,內轉子做出與外轉子相同的移動。
蓋件36具有裝設於其外部上的歧管42,該歧管42供應穿過蓋體36並通至晶圓W上方之腔室中的介質入口44。值得注意的是,此實施例中之晶圓W自旋轉夾盤朝下懸吊、由夾持構件40所支撐,使得經由入口44供應之流體將衝擊於晶圓W之朝上表面上。
在晶圓W為例如300mm或450mm直徑之半導體晶圓的情形中,晶圓W之朝上側將為裝置側或晶圓W之正面側,其係藉由晶圓如何置於旋轉夾盤30上來判定,而因此由腔室1內執行之特定製程所支配。
圖1之裝置更包含可相關於處理腔室1移動的內部蓋件2。內部蓋件2在圖1中係顯示為位於其第一(或開啟)位置,其中旋轉夾盤30係與腔室1之外圓柱壁10連通。此實施例中之蓋件2大致上為杯狀、包含由圓柱壁21圍繞的基座20。蓋件2進一步包含中空軸22,其支撐基座20、且穿過腔室1之底壁14。
中空軸22由形成於主要腔室1中之軸套12所圍繞,且該等元件係經由動態密封件而連接,該動態密封件容許中空軸22相關於軸套12位移、同時對腔室1維持氣密。
在圓柱壁21之頂部附接有環狀折向器構件24,該折向器構
件24於其朝上之表面上載有墊片26。蓋件2較佳地包含穿過基座20之流體介質入口28,使處理流體及沖洗液體可被引入腔室至晶圓W的朝下表面上。
蓋件2進一步包含通至排出管25的處理液體排出開口23。鑑於排出管25係牢固地裝設於蓋件2的基座20,其經由動態密封件17通過腔室1之底壁14,使得該管可相關於底壁14軸向地滑動、同時維持氣密。
排出口16穿過腔室1之圓柱壁10,而分離之排出口46穿過靠近旋轉夾盤30之內表面的蓋件36。各排出口係連接至適合的排出導管(未顯示),該等排出導管較佳地經由個別之閥及排放裝置而獨立地受到控制。
圖1中所繪之位置對應至晶圓W的裝載或卸載。尤其,可經由蓋件36、或更佳地經由腔室壁10中之側門(未顯示)而將晶圓W裝載於旋轉夾盤上。然而,當蓋件36在適當位置時、且當任何側門已被關閉時,腔室1為氣密且能維持所定義之內部壓力。
在圖2中,內部蓋件2已被移動至其對應至晶圓W之處理的第二(或關閉)位置。亦即,在將晶圓W裝載至旋轉夾盤30上後,蓋件2便藉由作用於中空軸22上之適合的馬達(未顯示)而相關於腔室1朝上移動。內部蓋件2之朝上移動持續直到折向器構件24與腔室1之上部15的內表面相接觸。尤其,由折向器24所承載的墊片26抵住上部15之下側而密封,而由上部15所承載之墊片18則抵住折向器24之上表面而密封。
當內部蓋件2到達如圖2所繪之其第二位置時,便因此在關閉之處理腔室1內產生第二腔室48。並且,內部腔室48係以氣密形式密封於腔室1之其餘部份之外。再者,腔室48較佳地與腔室1之其餘部份分離排放,其係於此實施例中藉由通至腔室48中之排出口46的供應來達成,該供應係獨立於大致上供應腔室1及圖2之配置中的腔室1之其餘部份的排出口16。
在晶圓處理期間,可將處理流體導引通過介質入口44及/或28至旋轉中之晶圓W,以執行各種處理,例如蝕刻、清潔、沖洗、
及受處理晶圓的任何其他期望之表面處理。
整體處理腔室1內的內部腔室48之供應因此藉由允許用於晶圓處理之氣體及流體更佳地隔離於處理腔室之外部環境,而增進環境上封閉腔室的安全性,並減少處理氣體、化學煙霧、例如汽化異丙醇之熱蒸氣、臭氧及類似者被釋放至工具環境的風險。
圖3-6顯示依據本發明之第二實施例,其中內部蓋件2設有一組分隔器,以便在內腔室48內定義分離的處理區域。
具體而言,在內腔室48內設有一或更多可垂直移動之防濺板37、39。在圖3-6中顯示兩圓形防濺板37及39,然而吾人將察知可設置任何期望數量之防濺板,且藉由此揭露內容所思及的為,防濺板之真實數量在某種程度上係取決於欲分離地加以收集的不同處理流體之數量。
外防濺板37係同心地定位於內防濺板39的周圍。因此,內防濺板39在其內部中定義內處理流體收集器31。中處理流體收集器33係藉由形成於內防濺板39之外表面與外防濺板37之內表面之間的環狀區域而定義。外處理流體收集器35係藉由形成於外防濺板37之外表面與圓柱壁21之內表面之間的環狀區域而定義。
用以將自各流體收集器所收集之處理介質輸送至封閉處理腔室之外的排放管線係與每一此流體收集器連結而設置。如圖3所示,排放管線31、33及35各延伸通過內部蓋件之基座20,且亦通過主要腔室1之底壁14。排放管線31、33及35之組合係經由如上述之動態密封件與底壁14連結,以允許排放管線與外腔室1在內部蓋件2移動時的相對移動,同時維持氣密。
此實施例中之折向器27略為延長以容納防濺板37及39的上部,但其他部份則如以上關於第一實施例所述。
防濺板37及39係藉由適合的致動器(例如氣壓缸、氣壓缸及液壓缸之組合、線性馬達、鮑登線(Bowden wire)或其類似者)而相對於內部蓋件2上下移動。儘管並未顯示於隨附圖式,但供防濺板37及39用之致動器係經由動態密封件而相似地穿過底壁14加以裝設。
各防濺板可在垂直方向上獨立移動。因此,各防濺板可選擇性地相對旋轉夾盤30、相對任何其他防濺板、及相對內部蓋件2被升高及/或降低,使得自旋轉夾盤30之軌跡邊緣散出的過量處理流體被導向選定之流體收集器。
在圖3及4中,防濺板37及39二者均顯示為呈抬升狀態,使得在圖4之所繪的工作位置中,自旋轉夾盤30之軌跡邊緣散出的過量處理流體被導向對著內防濺板39之內表面並進入內流體收集器31,因此,來自受處理中之晶圓表面的過量流體可透過內流體收集器31而選擇性地獲得,並選擇性地加以回收或再利用。
在圖5中,防濺板37及39二者均位於其相對於內部蓋件2之下方位置,而內部蓋件2係位於其第二或關閉位置。在此配置中,自旋轉夾盤30之軌跡邊緣散出的過量處理流體被導向對著圓柱壁21之內表面並進入外流體收集器35。因此,來自受處理中之晶圓表面的過量流體可透過外流體收集器35而選擇性地獲得,並選擇性地加以回收或再利用。
在圖6中,相對於內部蓋件2,防濺板39係位於其下方位置,且防濺板37係位於其上方位置,而內部蓋件係位於其第二或關閉位置。在此配置中,自旋轉夾盤30之軌跡邊緣散出的過量處理流體被導向對著外防濺板37之內表面並進入中流體收集器33。因此,來自受處理中之晶圓表面的過量流體可透過中流體收集器33而選擇性地獲得,並選擇性地加以回收或再利用。
圖7及8顯示本發明之第三實施例,其中將第一實施例之腔室設計改成用於一旋轉夾盤,其中晶圓W係裝設於經由中心軸上之馬達的動作而旋轉的夾盤之上側。
尤其,晶圓W係於內部蓋件2位於圖7所繪之裝載/卸載位置時裝載至旋轉夾盤50上,且晶圓W係藉由夾持構件40相對於夾盤50朝一預定方向固定。然後將內部蓋件2移動至如以上相關於第一實施例所述之其第二位置,以定義內腔室48。
在此實施例中,將見到旋轉夾盤50係亦可相對於內部蓋件2垂直地移動,使得可將其抬升至腔室48內的最佳處理位置。然後
藉由作用於軸55上之馬達(未顯示)使旋轉夾盤50轉動。
圖9及10顯示本發明之第四實施例,其中先前實施例之旋轉夾盤50相對於內部蓋件2轉動,但不相對於內部蓋件2軸向地移動。
因此,晶圓W係於內部蓋件2位於圖9所繪之裝載/卸載位置的情況下裝載至旋轉夾盤50上,且晶圓W係藉由夾持構件40相對於夾盤50朝一預定方向固定。然後將內部蓋件2移動至如圖10所繪且於以上相關於第一實施例所述之其第二位置,以定義內腔室48。
由於此實施例之旋轉夾盤50無法相對於內部蓋件2垂直移動,因此內部蓋件2之移動同時用於將晶圓W定位於腔室48內之其最終處理位置。然後藉由作用於軸55上之馬達(未顯示)使旋轉夾盤50轉動。
1‧‧‧腔室
2‧‧‧蓋件
10‧‧‧圓柱壁
12‧‧‧下部(軸套)
14‧‧‧底壁
15‧‧‧上部
16‧‧‧排出口
17‧‧‧動態密封件
18‧‧‧墊片
20‧‧‧基座
21‧‧‧圓柱壁
22‧‧‧中空軸
23‧‧‧處理液體排出開口
24‧‧‧折向器
25‧‧‧排出管
26‧‧‧墊片
28‧‧‧介質入口
30‧‧‧旋轉夾盤
31‧‧‧流體收集器
32‧‧‧定子
33‧‧‧流體收集器
34‧‧‧圓柱壁
35‧‧‧流體收集器
36‧‧‧蓋件
37‧‧‧防濺板
38‧‧‧環形齒輪
39‧‧‧防濺板
40‧‧‧夾持構件
42‧‧‧歧管
44‧‧‧介質入口
46‧‧‧排出口
48‧‧‧腔室
50‧‧‧旋轉夾盤
55‧‧‧軸
W‧‧‧晶圓
在參照隨附圖式的情況下,於閱讀以上的本發明之較佳實施例詳細說明後,本發明之其他目的、特徵及優點將變得更為顯而易見,其中:圖1為依據本發明之第一實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第一位置;圖2為依據本發明之第一實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第二位置;圖3為依據本發明之第二實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第一位置;圖4為依據本發明之第二實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第二位置、且防濺板呈第一配置;圖5為依據本發明之第二實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第二位置、且防濺板呈第二配置;圖6為依據本發明之第二實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第二位置、且防濺板呈第三配置;
圖7為依據本發明之第三實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第一位置;圖8為依據本發明之第三實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第二位置;圖9為依據本發明之第四實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第一位置;及圖10為依據本發明之第四實施例的處理腔室之說明性剖面側視圖,而內蓋顯示為位於其第二位置。
Claims (20)
- 一種晶圓狀物件之處理用裝置,包含一外處理腔室,該外處理腔室包含:一外殼,提供氣密包圍區域;一旋轉夾盤,位於該外處理腔室內,該旋轉夾盤係用以固持其上之一晶圓狀物件;一內部蓋件,設置於該外處理腔室內,該內部蓋件可相對該外處理腔室於一第一位置與一第二位置之間移動,在該第一位置中,該內部蓋件並未對鄰近該旋轉夾盤的該外處理腔室之一內表面加以密封,在該第二位置中,該內部蓋件對鄰近該旋轉夾盤的該外處理腔室之該內表面加以密封,以定義氣密之一內處理腔室;及至少一處理流體收集器,形成於該內部蓋件之下部,該處理流體收集器與自該內部蓋件懸出的一排出管連通。
- 如申請專利範圍第1項之晶圓狀物件之處理用裝置,其中當位於該第二位置時,該內部蓋件形成該內處理腔室之一下部。
- 如申請專利範圍第2項之晶圓狀物件之處理用裝置,其中該內部蓋件包含一基座及至少一直立壁,該基座係連接至經由一密封件穿過該外處理腔室之一軸,該密封件容許該軸與該外處理腔室之間的相對移動、同時維持該外處理腔室之氣密性。
- 如申請專利範圍第1項之晶圓狀物件之處理用裝置,其中自該內部蓋件懸出的該排出管經由一密封件穿過該外處理腔室,該密封件容許該排出管與該外處理腔室之間的相對移動、同時維持該外處理腔室之氣密性。
- 如申請專利範圍第1項之晶圓狀物件之處理用裝置,其中該外處理腔室包含獨立受到控制的排放埠,當該內部蓋件位於該第二 位置時,一第一排放埠通至該外處理腔室、該內處理腔室內之一區域中,且當該內部蓋件位於該第二位置時,一第二排放埠通至該外處理腔室、該內處理腔室外之一區域中。
- 如申請專利範圍第1項之晶圓狀物件之處理用裝置,其中該內部蓋件包含可相對於該內部蓋件獨立地軸向位移的複數防濺板,當該內部蓋件位於該第二位置時,該等防濺板及該內部蓋件係用以在該內處理腔室內定義複數分離處理區域。
- 如申請專利範圍第6項之晶圓狀物件之處理用裝置,其中該等分離處理區域之每一者包含與其流體連通之一個別液體排放管。
- 如申請專利範圍第6項之晶圓狀物件之處理用裝置,其中可軸向位移的該等防濺板之每一者係選擇性地自該外處理腔室外受驅動至一預先定義垂直位置。
- 如申請專利範圍第6項之晶圓狀物件之處理用裝置,其中可軸向位移的該等防濺板之每一者可選擇性地加以定位,以捕獲從由該旋轉夾盤所承載的旋轉中之晶圓散出的預先選定之處理流體。
- 如申請專利範圍第1項之晶圓狀物件之處理用裝置,其中該旋轉夾盤係用以在無物理接觸的情況下經由一磁性軸承加以驅動,且其中該旋轉夾盤及該內部蓋件可相對彼此垂直地移動。
- 如申請專利範圍第10項之晶圓狀物件之處理用裝置,其中該磁性軸承包含位於該外處理腔室外的一定子。
- 如申請專利範圍第10項之晶圓狀物件之處理用裝置,其中該磁性軸承可選擇性地加以定位,使得從由該旋轉夾盤所承載的旋轉中之晶圓散出的預先選定之處理流體被導引至一預先選定之流 體收集器。
- 如申請專利範圍第10項之晶圓狀物件之處理用裝置,其中該磁性軸承為一主動磁性軸承。
- 如申請專利範圍第3項之晶圓狀物件之處理用裝置,更包含通過該內部蓋件之該基座的一流體介質入口,使處理流體得以被引導至該內處理腔室中、一晶圓之一向下表面上。
- 如申請專利範圍第1項之晶圓狀物件之處理用裝置,其中該外處理腔室係由以過氟烷氧基(perfluoroalkoxy)樹脂塗覆之鋁所製成。
- 一種晶圓狀物件之處理用裝置,包含一外處理腔室,該外處理腔室包含:一外殼,提供氣密包圍區域;一旋轉夾盤,位於該外處理腔室內,該旋轉夾盤係用以固持其上之一晶圓狀物件;及一內部蓋件,設置於該外處理腔室內,該內部蓋件可相對該外處理腔室於一第一位置與一第二位置之間移動,在該第一位置中,該內部蓋件並未對鄰近該旋轉夾盤的該外處理腔室之一內表面加以密封,在該第二位置中,該內部蓋件對鄰近該旋轉夾盤的該外處理腔室之該內表面加以密封,以定義氣密之一內處理腔室,其中該旋轉夾盤係用以在無物理接觸的情況下經由一磁性軸承加以驅動,且其中該旋轉夾盤及該內部蓋件可相對彼此垂直地移動。
- 如申請專利範圍第16項之晶圓狀物件之處理用裝置,其中當位於該第二位置時,該內部蓋件形成該內處理腔室之一下部。
- 如申請專利範圍第17項之晶圓狀物件之處理用裝置,其中該內部蓋件包含一基座及至少一直立壁,該基座係連接至經由一密封件穿過該外處理腔室之一軸,該密封件容許該軸與該外處理腔室之間的相對移動、同時維持該外處理腔室之氣密性。
- 如申請專利範圍第16項之晶圓狀物件之處理用裝置,更包含形成於該內部蓋件之下部的至少一處理流體收集器,該處理流體收集器與一排出管連通,該排出管係自該內部蓋件懸出、經由一密封件穿過該外處理腔室,該密封件容許該排出管與該外處理腔室之間的相對移動、同時維持該外處理腔室之氣密性。
- 如申請專利範圍第16項之晶圓狀物件之處理用裝置,其中該外處理腔室包含獨立受到控制的排放埠,當該內部蓋件位於該第二位置時,一第一排放埠通至該外處理腔室、該內處理腔室內之一區域中,且當該內部蓋件位於該第二位置時,一第二排放埠通至該外處理腔室、該內處理腔室外之一區域中。
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Also Published As
Publication number | Publication date |
---|---|
US10056287B2 (en) | 2018-08-21 |
KR20140078658A (ko) | 2014-06-25 |
JP6121424B2 (ja) | 2017-04-26 |
TW201316446A (zh) | 2013-04-16 |
US20130062839A1 (en) | 2013-03-14 |
SG11201400404PA (en) | 2014-04-28 |
WO2013035019A3 (en) | 2014-10-30 |
KR101986395B1 (ko) | 2019-06-05 |
JP2015506087A (ja) | 2015-02-26 |
US10269615B2 (en) | 2019-04-23 |
US20160027680A1 (en) | 2016-01-28 |
SG10201602736RA (en) | 2016-05-30 |
WO2013035019A2 (en) | 2013-03-14 |
CN104160496A (zh) | 2014-11-19 |
CN104160496B (zh) | 2017-07-28 |
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