TWI636112B - Double adhesive tape for temporary fixing and temporary fixing method of workpiece using the tape - Google Patents
Double adhesive tape for temporary fixing and temporary fixing method of workpiece using the tape Download PDFInfo
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- TWI636112B TWI636112B TW103112086A TW103112086A TWI636112B TW I636112 B TWI636112 B TW I636112B TW 103112086 A TW103112086 A TW 103112086A TW 103112086 A TW103112086 A TW 103112086A TW I636112 B TWI636112 B TW I636112B
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- side chain
- adhesive tape
- crystalline polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
Abstract
本發明的假固定用兩面黏著膠帶係具備基材、貼附於台座之第1黏著劑層、及黏貼於被加工物之第2黏著劑層。前述第1黏著劑層係含有第1感壓性接著劑、第1側鏈結晶性聚合物及發泡劑。前述第2黏著劑層係含有第2感壓性接著劑及第2側鏈結晶性聚合物。本發明的被加工物的假固定方法係具有：將前述假固定用兩面黏著膠帶加熱至特定溫度，並將前述被加工物與前述假固定用兩面黏著膠帶一起從前述台座剝離之步驟；以及將前述假固定用兩面黏著膠帶加熱至特定溫度，並將前述被加工物從前述假固定用兩面黏著膠帶剝離之步驟。 The double-sided adhesive tape for false fixing of the present invention comprises a base material, a first adhesive layer attached to the pedestal, and a second adhesive layer adhered to the workpiece. The first adhesive layer contains a first pressure-sensitive adhesive, a first side chain crystalline polymer, and a foaming agent. The second adhesive layer contains a second pressure-sensitive adhesive and a second side chain crystalline polymer. The method for falsely fixing a workpiece according to the present invention includes: heating the double-sided adhesive tape for false fixing to a specific temperature, and separating the workpiece from the pedestal with the double-sided adhesive tape for false fixing; and The pseudo-fixing is heated to a specific temperature by a double-sided adhesive tape, and the workpiece is peeled off from the double-sided adhesive tape for the dummy fixing.
Description
本發明係關於將被加工物假固定在台座上之假固定用兩面黏著膠帶，以及使用該膠帶之被加工物的假固定方法。 The present invention relates to a double-sided adhesive tape for false fixing for fixing a workpiece to a pedestal, and a false fixing method for a workpiece to be processed using the tape.
將被加工物假固定在台座上之假固定手段，已知有蠟(例如參照專利文獻1)。 A wax is known as a dummy fixing means for fixing a workpiece to a pedestal (see, for example, Patent Document 1).
然而，若透過蠟將被加工物假固定在台座上，則將被加工物從台座剝離時蠟會分別殘留於被加工物及台座，故需使用有機溶劑等之洗淨步驟。 However, if the workpiece is falsely fixed to the pedestal by the wax, the wax remains in the workpiece and the pedestal when the workpiece is peeled off from the pedestal, so a washing step using an organic solvent or the like is required.
另一方面，其他假固定手段已知有兩面黏著膠帶。兩面黏著膠帶已知有一種兩面黏著膠帶(A)，其係一面的黏著劑層為一般之丙烯酸系黏著劑層，另一面的黏著劑層為在一般之丙烯酸系黏著劑層添加發泡劑之發泡黏著劑層。 On the other hand, other false fixing means are known as two-sided adhesive tape. The double-sided adhesive tape is known to have a double-sided adhesive tape (A), the adhesive layer on one side is a general acrylic adhesive layer, and the adhesive layer on the other side is a foaming agent added to a general acrylic adhesive layer. Foaming adhesive layer.
兩面黏著膠帶(A)係分別將丙烯酸系黏著劑 層貼附於台座、將發泡黏著劑層貼附於被加工物，而將被加工物假固定在台座上。兩面黏著膠帶(A)之剝離係依下述順序進行。首先，在將被加工物研磨加工等之後，將兩面黏著膠帶(A)加熱至發泡劑膨脹或發泡的溫度，使發泡黏著劑層之黏著力降低。接著，將被加工物從兩面黏著膠帶(A)剝離之後，將兩面黏著膠帶(A)從台座剝離。 Adhesive tape on both sides (A) The layer is attached to the pedestal, and the foamed adhesive layer is attached to the workpiece, and the workpiece is fixed on the pedestal. The peeling of the double-sided adhesive tape (A) was carried out in the following order. First, after the workpiece is polished or the like, the double-sided adhesive tape (A) is heated to a temperature at which the foaming agent expands or foams, so that the adhesion of the foamed adhesive layer is lowered. Next, after the workpiece is peeled off from the double-sided adhesive tape (A), the double-sided adhesive tape (A) is peeled off from the pedestal.
但若使用此種兩面黏著膠帶(A)，在研磨加工等時，源自發泡劑之凹凸會轉印至被加工物，而有產率降低之問題。 However, when such a double-sided adhesive tape (A) is used, when the polishing process or the like is performed, the unevenness derived from the foaming agent is transferred to the workpiece, and the yield is lowered.
又，其他兩面黏著膠帶已知有一種兩面黏著膠帶(B)，其係一面之黏著劑層為一般之丙烯酸系黏著劑層，另一面的黏著劑層包含感溫性黏著劑層。感溫性黏著劑層係含有感壓性接著劑及側鏈結晶性聚合物，且在側鏈結晶性聚合物之熔點以上的溫度其黏著力會降低之黏著劑層。 Further, the other two-sided adhesive tape is known to have a double-sided adhesive tape (B) in which one adhesive layer is a general acrylic adhesive layer and the other adhesive layer contains a temperature sensitive adhesive layer. The temperature sensitive adhesive layer contains a pressure-sensitive adhesive and a side chain crystalline polymer, and the adhesive layer whose adhesive strength is lowered at a temperature higher than the melting point of the side chain crystalline polymer.
兩面黏著膠帶(B)係分別將丙烯酸系黏著劑層貼附在台座、將感溫性黏著劑層貼附在被加工物，並將被加工物假固定於台座上者。兩面黏著膠帶(B)之剝離係依下述順序進行。首先，在將被加工物研磨加工等之後，將被加工物與兩面黏著膠帶(B)一起從台座剝離。接著，將兩面黏著膠帶(B)加熱至側鏈結晶性聚合物之熔點以上的溫度，使感溫性黏著劑層之黏著力降低，並將被加工物從兩面黏著膠帶(B)剝離。 The double-sided adhesive tape (B) is obtained by attaching an acrylic pressure-sensitive adhesive layer to a pedestal, attaching a temperature-sensitive adhesive layer to a workpiece, and fixing the workpiece to the pedestal. The peeling of the double-sided adhesive tape (B) was carried out in the following order. First, after the workpiece is polished or the like, the workpiece is peeled off from the pedestal together with the double-sided adhesive tape (B). Next, the double-sided adhesive tape (B) is heated to a temperature equal to or higher than the melting point of the side chain crystalline polymer to lower the adhesive force of the temperature sensitive adhesive layer, and the workpiece is peeled off from the double-sided adhesive tape (B).
然而，若使用種此兩面黏著膠帶(B)，則將被加工物與兩面黏著膠帶(B)一起從台座剝離時的剝離性 不佳，故例如需將刮刀(spatula)等***丙烯酸系黏著劑層與台座之界面以形成剝離起點。而且，因形成剝離起點時所施加的外力而會造成加工物破損，而有產率降低之問題。 However, if the double-sided adhesive tape (B) is used, the peeling property when the workpiece is peeled off from the pedestal together with the double-sided adhesive tape (B) It is not preferable, for example, a spatula or the like is inserted into the interface between the acrylic adhesive layer and the pedestal to form a peeling starting point. Further, the external force applied when the peeling starting point is formed may cause the workpiece to be broken, and there is a problem that the yield is lowered.
專利文獻1：日本特開平6-69324號公報 Patent Document 1: Japanese Patent Laid-Open No. Hei 6-69324
本發明之課題為提供可將被加工物以良好產率且簡單地剝離之假固定用兩面黏著膠帶，及使用該膠帶之被加工物的假固定方法。 An object of the present invention is to provide a double-sided adhesive tape for false fixing which can be easily peeled off in a good yield, and a method of fixing a workpiece using the tape.
本發明之假固定用兩面黏著膠帶係具備：膜狀之基材、積層於前述基材的一面並貼附於台座之第1黏著劑層、以及積層於前述基材的另一面並貼附於被加工物之第2黏著劑層，其中，前述第1黏著劑層係含有第1感壓性接著劑、第1側鏈結晶性聚合物及發泡劑，且在前述第1側鏈結晶性聚合物之熔點以上的溫度黏著力會降低，前述第2黏著劑層係含有第2感壓性接著劑及第2側鏈結晶性聚合物，且在前述第2側鏈結晶性聚合物之熔點以上的溫度黏著力會降低。 The double-sided adhesive tape for false-fixing of the present invention comprises: a film-form substrate; a first adhesive layer laminated on one surface of the substrate and attached to the pedestal; and a layer laminated on the other surface of the substrate and attached to The second adhesive layer of the workpiece, wherein the first adhesive layer contains a first pressure-sensitive adhesive, a first side chain crystalline polymer, and a foaming agent, and the first side chain crystallinity The temperature adhesive force of the polymer is lower than the melting point of the polymer, and the second adhesive layer contains the second pressure-sensitive adhesive and the second side chain crystalline polymer, and the melting point of the second side chain crystalline polymer The above temperature adhesion will decrease.
本發明之被加工物的假固定方法係具有以下步驟：透過上述本發明的假固定用兩面黏著膠帶將被加 工物假固定於台座上，在該狀態下，將前述假固定用兩面黏著膠帶加熱至前述第1側鏈結晶性聚合物之熔點以上、且使前述發泡劑膨脹或發泡之溫度，將前述被加工物與前述假固定用兩面黏著膠帶一起從前述台座剝離的步驟；將前述假固定用兩面黏著膠帶加熱至前述第2側鏈結晶性聚合物之熔點以上的溫度，並將前述被加工物從前述假固定用兩面黏著膠帶剝離之步驟。 The pseudo-fixing method of the workpiece of the present invention has the following steps: the double-sided adhesive tape for the false fixing of the present invention is added The workpiece is fixed to the pedestal, and in this state, the temperature of the false-fixed double-sided adhesive tape is increased to a temperature equal to or higher than the melting point of the first side chain crystalline polymer, and the foaming agent is expanded or foamed. a step of peeling the workpiece from the pedestal together with the double-sided adhesive tape for false fixing; heating the double-sided adhesive tape for false fixing to a temperature equal to or higher than a melting point of the second side chain crystalline polymer, and processing the above The step of peeling off the material from the above-mentioned pseudo-fixing double-sided adhesive tape.
根據本發明，可達所謂將被加工物以良好產率且簡單地剝離之效果。 According to the present invention, the effect of soaking the workpiece in a good yield and simply peeling off can be achieved.
1‧‧‧膠帶 1‧‧‧ Tape
2‧‧‧基材 2‧‧‧Substrate
3‧‧‧第1黏著劑層 3‧‧‧1st adhesive layer
4‧‧‧第2黏著劑層 4‧‧‧2nd adhesive layer
5‧‧‧第1分隔膜 5‧‧‧1st separator film
6‧‧‧第2分隔膜 6‧‧‧Second separation membrane
21‧‧‧基材2的一面 21‧‧‧One side of substrate 2
22‧‧‧基材2的另一面 22‧‧‧The other side of the substrate 2
31‧‧‧第1黏著劑層3的表面 31‧‧‧ Surface of the first adhesive layer 3
41‧‧‧第2黏著劑層4的表面 41‧‧‧ Surface of the second adhesive layer 4
100‧‧‧台座 100‧‧‧ pedestal
200‧‧‧被加工物 200‧‧‧Processed objects
第1圖係表示本發明之一種實施形態之假固定用兩面黏著膠帶的概略說明圖。 Fig. 1 is a schematic explanatory view showing a double-sided adhesive tape for false fixing according to an embodiment of the present invention.
第2圖(a)至(c)係表示本發明之一種實施形態之被加工物的假固定方法的步驟圖。 Fig. 2 (a) to (c) are process diagrams showing a method of falsifying a workpiece according to an embodiment of the present invention.
<假固定用兩面黏著膠帶> <Fake fixing with double-sided adhesive tape>
以下參照第1圖而詳細說明本發明之一種實施形態之假固定用兩面黏著膠帶(以下也稱為「膠帶」)。 Hereinafter, a double-sided adhesive tape for false fixing (hereinafter also referred to as "tape") according to an embodiment of the present invention will be described in detail with reference to Fig. 1.
如第1圖所示，本實施形態的膠帶1係具備：基材2、在基材2的一面21積層之第1黏著劑層3、在基材2的另一面22積層之第2黏著劑層4。 As shown in Fig. 1, the tape 1 of the present embodiment includes a base material 2, a first adhesive layer 3 laminated on one surface 21 of the base material 2, and a second adhesive layer laminated on the other surface 22 of the base material 2. Layer 4.
(基材) (substrate)
本實施形態的基材2為膜(film)狀。所謂膜狀，並不侷限於膜狀，在不損及本實施形態效果之範圍內，為包括膜狀或片(sheet)狀之概念。 The substrate 2 of the present embodiment is in the form of a film. The film shape is not limited to a film shape, and is a concept including a film shape or a sheet shape within a range that does not impair the effects of the present embodiment.
基材2的構成材料例如可舉出聚乙烯、聚對苯二甲酸乙二酯、聚丙烯、聚酯、聚醯胺、聚醯亞胺、聚碳酸酯、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-聚丙烯共聚物、聚氯乙烯等合成樹脂，所例示的合成樹脂中，較佳為聚對苯二甲酸乙二酯。 Examples of the constituent material of the substrate 2 include polyethylene, polyethylene terephthalate, polypropylene, polyester, polyamine, polyimine, polycarbonate, ethylene-vinyl acetate copolymer, and ethylene. A synthetic resin such as an ethyl acrylate copolymer, an ethylene-polypropylene copolymer or a polyvinyl chloride. Among the synthetic resins exemplified, polyethylene terephthalate is preferred.
本實施形態的基材2可為單層體或多層體之任一者，其厚度較佳為5至250μm，更佳為12至188μm，又更佳為25至100μm。為了提昇對第1黏著劑層3及第2黏著劑層4之密著性，可在基材2的一面21及另一面22實施例如電暈放電處理、電漿處理、噴砂處理、化學蝕刻處理、底漆處理等表面處理。 The substrate 2 of the present embodiment may be either a single layer body or a multilayer body, and has a thickness of preferably 5 to 250 μm, more preferably 12 to 188 μm, still more preferably 25 to 100 μm. In order to improve the adhesion to the first adhesive layer 3 and the second adhesive layer 4, for example, corona discharge treatment, plasma treatment, sand blast treatment, or chemical etching treatment may be performed on one surface 21 and the other surface 22 of the substrate 2. Surface treatment such as primer treatment.
(第1黏著劑層) (first adhesive layer)
積層於基材2的一面21之第1黏著劑層3，其黏著體為台座，並含有第1感壓性接著劑、第1側鏈結晶性聚合物及發泡劑。 The first adhesive layer 3 laminated on one surface 21 of the substrate 2 has a pedestal and contains a first pressure-sensitive adhesive, a first side chain crystalline polymer, and a foaming agent.
第1感壓性接著劑係具有黏著性之聚合物，其具體例可舉出天然橡膠接著劑、合成橡膠接著劑、苯乙烯/丁二烯乳膠基底接著劑、丙烯酸系接著劑等，所例示之改等接著劑中，較佳為丙烯酸系接著劑。 The first pressure-sensitive adhesive is a polymer having adhesiveness, and specific examples thereof include a natural rubber adhesive, a synthetic rubber adhesive, a styrene/butadiene latex base adhesive, an acrylic adhesive, and the like, and are exemplified. Among the above-mentioned adhesives, an acrylic adhesive is preferred.
構成丙烯酸系接著劑之單體，例如可舉出(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸甲酯、(甲基)丙烯 酸乙酯、(甲基)丙烯酸丁酯等具有碳數1至12的烷基之(甲基)丙烯酸酯；(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基己酯等具有羥基烷基之(甲基)丙烯酸酯等，該等可使用1種或混合2種以上使用。(甲基)丙烯酸酯係表示丙烯酸酯或甲基丙烯酸酯。 Examples of the monomer constituting the acrylic adhesive include 2-ethylhexyl (meth)acrylate, methyl (meth)acrylate, and (meth)acryl. (meth) acrylate having an alkyl group having 1 to 12 carbon atoms such as ethyl acrylate or butyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate or 2-hydroxypropyl (meth) acrylate (meth) acrylate having a hydroxyalkyl group, such as 2-hydroxyhexyl (meth)acrylate, may be used alone or in combination of two or more. The (meth) acrylate means an acrylate or a methacrylate.
丙烯酸系接著劑的具體組成，可舉出藉由使丙烯酸2-乙基己酯、丙烯酸甲酯及丙烯酸2-羥基乙酯聚合所得之共聚物等。又，較佳為上述各單體係以丙烯酸2-乙基己酯為42至62重量份、丙烯酸甲酯為30至50重量份及丙烯酸2-羥基乙酯為3至13重量份之比例聚合。 The specific composition of the acrylic adhesive is a copolymer obtained by polymerizing 2-ethylhexyl acrylate, methyl acrylate, and 2-hydroxyethyl acrylate. Further, it is preferred that each of the above single systems is polymerized in a ratio of 42 to 62 parts by weight of 2-ethylhexyl acrylate, 30 to 50 parts by weight of methyl acrylate, and 3 to 13 parts by weight of 2-hydroxyethyl acrylate. .
聚合方法並無特別限定，例如可採用溶液聚合法、塊狀聚合法、懸浮聚合法、乳化聚合法等。採用溶液聚合法時，只要將上述單體混合於溶劑，並在40至90℃左右攪拌2至10小時左右即可。 The polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method, or the like can be employed. In the case of the solution polymerization method, the above monomer may be mixed in a solvent and stirred at about 40 to 90 ° C for about 2 to 10 hours.
聚合上述單體所得之聚合物，亦即第1感壓性接著劑的重量平均分子量，較佳為15萬至50萬，更佳為20萬至35萬。藉此，可抑制將膠帶1從台座剝離時第1黏著劑層3殘留在台座上，亦即，可抑制殘膠之產生。又，可抑制因第1黏著劑層3的凝集力提高而造成第1黏著劑層3的黏著力降低之情形。重量平均分子量係將聚合物以膠體滲透層析(GPC)測定，並將所得之測定值以聚苯乙烯換算的值。 The weight average molecular weight of the polymer obtained by polymerizing the above monomer, that is, the first pressure-sensitive adhesive is preferably from 150,000 to 500,000, more preferably from 200,000 to 350,000. Thereby, it is possible to suppress the first adhesive layer 3 from remaining on the pedestal when the tape 1 is peeled off from the pedestal, that is, the occurrence of residual glue can be suppressed. Further, it is possible to suppress a decrease in the adhesion of the first adhesive layer 3 due to an increase in the cohesive force of the first adhesive layer 3. The weight average molecular weight is determined by colloidal permeation chromatography (GPC) of the polymer, and the obtained measured value is a value in terms of polystyrene.
另一方面，第1側鏈結晶性聚合物係具有熔點之聚合物。所謂熔點，是意指藉由某種平衡程序，使最 初為有秩序地排列整合之聚合物的特定部分成為無秩序狀態的溫度，係以示差掃描熱析儀(DSC)在10℃/分之測定條件測定所得的值。 On the other hand, the first side chain crystalline polymer is a polymer having a melting point. The so-called melting point means that by some kind of balancing procedure, the most The temperature at which a specific portion of the polymer which is integrated and arranged in an orderly state is disordered is measured by a differential scanning calorimeter (DSC) at a measurement condition of 10 ° C /min.
第1側鏈結晶性聚合物係在未達上述熔點的溫度結晶化，且在熔點以上的溫度相轉移並顯示流動性。亦即，第1側鏈結晶性聚合物係具有對應溫度變化而可逆地呈結晶狀態與流動狀態之感溫性。藉此，在未達熔點的溫度中，第1側鏈結晶性聚合物為結晶狀態，故第1黏著劑層3可確保黏著力。又，在熔點以上的溫度中，第1側鏈結晶性聚合物顯示流動性，因此會阻礙上述第1感壓性接著劑的黏著性，結果為可降低第1黏著劑層3的黏著力。 The first side chain crystalline polymer is crystallized at a temperature not exceeding the above melting point, and is phase-shifted at a temperature equal to or higher than the melting point to exhibit fluidity. That is, the first side chain crystalline polymer has a temperature sensitivity which is reversibly in a crystalline state and a flow state in response to a change in temperature. Thereby, the first side chain crystalline polymer is in a crystalline state at a temperature at which the melting point is not reached, so that the first adhesive layer 3 can secure the adhesion. In addition, since the first side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point, the adhesion of the first pressure-sensitive adhesive is inhibited, and as a result, the adhesion of the first adhesive layer 3 can be lowered.
第1側鏈結晶性聚合物的熔點較佳為45℃以上且未達55℃。藉此，在室溫(23℃)中第1側鏈結晶性聚合物為結晶狀態，故可確保第1黏著劑層3在室溫之黏著力，結果為可提昇作業性。 The melting point of the first side chain crystalline polymer is preferably 45 ° C or more and less than 55 ° C. Thereby, since the first side chain crystalline polymer is in a crystalline state at room temperature (23 ° C), the adhesion of the first adhesive layer 3 at room temperature can be ensured, and as a result, workability can be improved.
上述熔點可藉由改變第1側鏈結晶性聚合物的組成等而調整。構成第1側鏈結晶性聚合物之單體例，如可舉出具有碳數16以上的直鏈狀烷基之(甲基)丙烯酸酯、具有碳數1至6的烷基之(甲基)丙烯酸酯、極性單體等。 The above melting point can be adjusted by changing the composition of the first side chain crystalline polymer or the like. Examples of the monomer constituting the first side chain crystalline polymer include a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms and an alkyl group having a carbon number of 1 to 6 (methyl group). ) acrylate, polar monomer, and the like.
具有碳數16以上的直鏈狀烷基之(甲基)丙烯酸酯，例如可舉出：(甲基)丙烯酸十六酯、(甲基)丙烯酸十八酯、(甲基)丙烯酸二十酯、(甲基)丙烯酸二十二酯等具 有碳數16至22的線狀烷基之(甲基)丙烯酸酯；具有碳數1至6的烷基之(甲基)丙烯酸酯，例如可舉出(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸己酯等；極性單體，例如可舉出丙烯酸、甲基丙烯酸、巴豆酸、伊康酸、馬來酸、福馬酸等具有羧基之乙烯不飽和單體；(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基己酯等具有羥基之乙烯不飽和單體等；該等可使用1種或混合2種以上使用。 Examples of the (meth) acrylate having a linear alkyl group having 16 or more carbon atoms include hexadecyl (meth) acrylate, octadecyl (meth) acrylate, and stearyl (meth) acrylate. , (tetra) (meth) acrylate, etc. a (meth) acrylate having a linear alkyl group having 16 to 22 carbon atoms; a (meth) acrylate having an alkyl group having 1 to 6 carbon atoms, and examples thereof include methyl (meth)acrylate, (A) Ethyl acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, etc.; polar monomers, for example, acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid Ethylene-unsaturated monomer having a carboxyl group; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxyhexyl (meth)acrylate, etc. The body may be used alone or in combination of two or more.
第1側鏈結晶性聚合物可為藉由使上述各單體中至少具有碳數16以上、較佳為具有碳數18以上的直鏈狀烷基之(甲基)丙烯酸酯聚合而得之聚合物。上述各單體較佳為例如使具有碳數16以上的直鏈狀烷基之(甲基)丙烯酸酯以30至100重量份、具有碳數1至6的烷基之(甲基)丙烯酸酯以0至70重量份、極性單體以0至10重量份比例聚合。 The first side chain crystalline polymer may be obtained by polymerizing a (meth) acrylate having at least a carbon number of 16 or more, preferably a linear alkyl group having a carbon number of 18 or more, in each of the above monomers. polymer. Each of the above monomers is preferably a (meth) acrylate having, for example, a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms and having an alkyl group having 1 to 6 carbon atoms in an amount of 30 to 100 parts by weight. The polar monomer is polymerized in a proportion of from 0 to 10 parts by weight, based on 0 to 70 parts by weight.
第1側鏈結晶性聚合物的具體組成，可舉出藉由聚合丙烯酸二十二酯、丙烯酸十八酯、丙烯酸甲酯及丙烯酸而得之共聚物等。又，上述各單體較佳為使丙烯酸二十二酯以35至45重量份、丙烯酸十八酯以30至40重量份、丙烯酸甲酯以15至25重量份及丙烯酸、1至10重量份之比例聚合。 The specific composition of the first side chain crystalline polymer may, for example, be a copolymer obtained by polymerizing behenyl acrylate, octadecyl acrylate, methyl acrylate or acrylic acid. Further, each of the above monomers is preferably 35 to 45 parts by weight of icosyl acrylate, 30 to 40 parts by weight of octadecyl acrylate, 15 to 25 parts by weight of methyl acrylate, and 1 to 10 parts by weight of acrylic acid. Proportional polymerization.
聚合方法並無特別限定，例如可採用溶液聚合法、塊狀聚合法、懸浮懸浮聚合法、乳化聚合法等。當採用溶液聚合法時，只要將上述單體混合於溶劑，並在 40至90℃左右攪拌2至10小時左右即可。 The polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension suspension polymerization method, an emulsion polymerization method, or the like can be employed. When the solution polymerization method is employed, it is only necessary to mix the above monomers in a solvent and Stir about 40 to 90 °C for about 2 to 10 hours.
第1側鏈結晶性聚合物的重量平均分子量較佳為3,000至30,000，更佳為5,000至20,000，又更佳為6,000至11,000。藉此，可抑制膠帶1從台座剝離時產生殘膠。又，第1側鏈結晶性聚合物在熔點以上溫度顯示流動性時，可充分地降低第1黏著劑層3的黏著力。重量平均分子量，係以GPC測定第1側鏈結晶性聚合物，並將所得測定值以聚苯乙烯換算的值。 The weight average molecular weight of the first side chain crystalline polymer is preferably from 3,000 to 30,000, more preferably from 5,000 to 20,000, still more preferably from 6,000 to 11,000. Thereby, it is possible to suppress generation of residual glue when the tape 1 is peeled off from the pedestal. Further, when the first side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point, the adhesion of the first adhesive layer 3 can be sufficiently reduced. The weight average molecular weight is a value obtained by measuring the first side chain crystalline polymer by GPC and measuring the obtained value in terms of polystyrene.
第1側鏈結晶性聚合物，較佳為以固形分換算相對於第1感壓性接著劑100重量份為0.5至10重量份的比例摻配，更佳為以0.5至5重量份的比例摻配。藉此，第1側鏈結晶性聚合物在熔點以上溫度顯示流動性時，可充分地降低第1黏著劑層3的黏著力。 The first side chain crystalline polymer is preferably blended in a ratio of 0.5 to 10 parts by weight, based on 100 parts by weight of the first pressure-sensitive adhesive, in terms of solid content, more preferably 0.5 to 5 parts by weight. Blending. Thereby, when the first side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point, the adhesion of the first adhesive layer 3 can be sufficiently reduced.
另一方面，發泡劑可採用一般化學發泡劑及物理發泡劑中之任一者。化學發泡劑係包括熱分解型及反應型的有機系發泡劑以及無機系發泡劑。 On the other hand, the foaming agent may be any of a general chemical foaming agent and a physical foaming agent. The chemical foaming agent includes a thermally decomposable and reactive organic foaming agent and an inorganic foaming agent.
熱分解型的有機系發泡劑，例如可舉出：各種的偶氮化合物(偶氮二甲醯胺等)、亞硝基化合物(N,N’-二亞硝基五亞甲基四胺等)、肼衍生物[4,4’-氧基雙(苯磺醯基肼)等]、半卡肼(semicarbazide)化合物(伸肼二甲醯胺(hydrazodicarbamide)等)、疊氮化合物、四唑化合物等，反應型的有機系發泡劑例如可舉出異氰酸酯化合物等。 Examples of the thermally decomposable organic foaming agent include various azo compounds (azomethoxamine, etc.) and nitroso compounds (N, N'-dinitrosopentamethylenetetramine). Et.), anthracene derivative [4,4'-oxybis(phenylsulfonylhydrazine), etc., semicarbazide compound (hydrazodicarbamide, etc.), azide compound, four Examples of the azole compound and the reaction type organic foaming agent include an isocyanate compound and the like.
熱分解型的無機系發泡劑例如可舉出：重碳酸鹽/碳酸鹽(碳酸氫鈉等)、亞硝酸鹽/氫化物等，反應型 的無機系發泡劑例如可舉出：重碳酸鈉與酸之組合、過氧化氫與酵母菌之組合、鋅粉末與酸之組合等。 Examples of the thermally decomposable inorganic foaming agent include a bicarbonate/carbonate (such as sodium hydrogencarbonate), a nitrite/hydride, and the like. Examples of the inorganic foaming agent include a combination of sodium bicarbonate and an acid, a combination of hydrogen peroxide and yeast, a combination of a zinc powder and an acid, and the like.
物理發泡劑例如可舉出：丁烷、庚烷、己烷等脂肪族烴類；二氯乙烷、二氯甲烷等氯化碳氫類；氟氯化碳等氟化氯烴類等有機系物理發泡劑；空氣、碳酸氣體、氮氣等無機系物理發泡劑等。 Examples of the physical foaming agent include aliphatic hydrocarbons such as butane, heptane, and hexane; chlorinated hydrocarbons such as dichloroethane and dichloromethane; and fluorinated chlorocarbons such as chlorofluorocarbon. It is a physical foaming agent; an inorganic physical foaming agent such as air, carbonic acid gas or nitrogen.
又，其他發泡劑可採用微膠囊化之熱膨脹性微粒子，亦即微球(microballoon)發泡劑。微球發泡劑，係在熱塑化性或熱硬化性樹脂所構成之聚合物殼的內部封入包括固體、液體或氣體之加熱膨脹性物質者。換言之，微球發泡劑係具備：平均粒徑為微米量級(micro-order)之中空狀聚合物殼、及封入於聚合物殼內部之加熱膨脹性物質。微球發泡劑能藉由加熱使體積膨脹40倍以上，而得到獨立氣泡形式的發泡體。因此，與通常的發泡劑相比，微球發泡劑具有發泡倍率相當大之特性。此種微球發泡劑可使用市售品，例如EXPANCEL公司製的「461DU20」等。 Further, other foaming agents may be microencapsulated heat-expandable fine particles, that is, microballoon foaming agents. The microsphere foaming agent is one in which a heat-expandable substance including a solid, a liquid or a gas is enclosed in a polymer shell composed of a thermoplastic or thermosetting resin. In other words, the microsphere foaming agent has a hollow polymer shell having an average particle diameter of micrometers and a heat expandable material sealed inside the polymer shell. The microsphere blowing agent can expand the volume by 40 times or more by heating to obtain a foam in the form of a closed cell. Therefore, the microsphere foaming agent has a characteristic that the expansion ratio is considerably larger than that of the usual foaming agent. A commercially available product such as "461DU20" manufactured by EXPANCEL Co., Ltd., or the like can be used as the microsphere foaming agent.
發泡劑較佳為以固形分換算相對於第1感壓性接著劑100重量份係5至30重量份的比例摻配，更佳為以10至30重量份的比例摻配。藉此，發泡劑在膨脹或發泡時，可充分地降低第1黏著劑層3的黏著力。 The foaming agent is preferably blended in a ratio of 5 to 30 parts by weight based on 100 parts by weight of the first pressure-sensitive adhesive in terms of solid content, more preferably 10 to 30 parts by weight. Thereby, when the foaming agent expands or foams, the adhesion of the first adhesive layer 3 can be sufficiently lowered.
發泡劑膨脹或發泡之溫度，通常為比第1側鏈結晶性聚合物的熔點高之溫度。又，發泡劑膨脹或發泡之溫度通常為180℃以下，較佳為在90℃開始膨脹或發泡並在120℃實質地完全發泡。 The temperature at which the blowing agent expands or foams is usually a temperature higher than the melting point of the first side chain crystalline polymer. Further, the temperature at which the foaming agent expands or foams is usually 180 ° C or lower, preferably starts to swell or foam at 90 ° C and is substantially completely foamed at 120 ° C.
發泡劑的平均粒徑並無特別限定，通常較佳為5至50μm，更佳為5至20μm，又更佳為5至10μm。平均粒徑係以粒度分布測定裝置測定所得的值。 The average particle diameter of the foaming agent is not particularly limited, but is usually preferably from 5 to 50 μm, more preferably from 5 to 20 μm, still more preferably from 5 to 10 μm. The average particle diameter is a value measured by a particle size distribution measuring apparatus.
就將此種發泡劑與含有上述第1感壓性接著劑及第1側鏈結晶性聚合物之第1黏著劑層3一起積層於基材2的一面21而言，例如只要是將於溶劑加有第1感壓性接著劑、第1側鏈結晶性聚合物及發泡劑之塗佈液藉由塗佈器等塗佈在基材2的一面21並乾燥即可。塗佈器例如可舉出：刀式塗佈器、輥式塗佈器、壓延塗佈器、缺角輪塗佈器、凹版塗佈器、棒式塗佈器等。 When the foaming agent is laminated on the one surface 21 of the substrate 2 together with the first pressure-sensitive adhesive layer 3 containing the first pressure-sensitive adhesive and the first side chain crystalline polymer, for example, The coating liquid to which the first pressure-sensitive adhesive, the first side chain crystalline polymer, and the foaming agent are added in a solvent is applied onto one surface 21 of the substrate 2 by an applicator or the like and dried. Examples of the applicator include a knife coater, a roll coater, a calender applicator, a slant wheel coater, a gravure coater, a bar coater, and the like.
第1黏著劑層3的厚度，較佳為10至50μm，更佳為10至30μm，又更佳為15至25μm。 The thickness of the first adhesive layer 3 is preferably from 10 to 50 μm, more preferably from 10 to 30 μm, still more preferably from 15 to 25 μm.
另外，在第1黏著劑層3中，可添加例如交聯劑、增黏劑、塑化劑、抗老化劑、紫外線吸收劑等各種添加劑，例示之添加劑中，較佳為添加交聯劑。交聯劑例如可舉出異氰酸酯化合物等。較佳為固形分換算相對於第1感壓性接著劑100重量份，以0.1至10重量份的比例添加交聯劑，更佳為以0.1至5重量份的比例添加交聯劑，又更佳為以0.1至2重量份的比例添加交聯劑。 Further, various additives such as a crosslinking agent, a thickener, a plasticizer, an anti-aging agent, and an ultraviolet absorber may be added to the first adhesive layer 3, and among the additives exemplified, a crosslinking agent is preferably added. The crosslinking agent may, for example, be an isocyanate compound or the like. It is preferable to add a crosslinking agent in a ratio of 0.1 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the first pressure-sensitive adhesive, and more preferably a crosslinking agent in a ratio of 0.1 to 5 parts by weight. Preferably, the crosslinking agent is added in a ratio of 0.1 to 2 parts by weight.
上述第1黏著劑層3中，尤佳之第1感壓性接著劑、第1側鏈結晶性聚合物、發泡劑及交聯劑的摻配比率，係該等以重量比為第1感壓性接著劑：第1側鏈結晶性聚合物：發泡劑：交聯劑=100：1至3：10至15：0.5至1。 In the first adhesive layer 3, the blending ratio of the first pressure-sensitive adhesive, the first side chain crystalline polymer, the foaming agent, and the crosslinking agent is preferably the first ratio by weight ratio. Pressure-sensitive adhesive: first side chain crystalline polymer: blowing agent: crosslinking agent = 100:1 to 3:10 to 15:0.5 to 1.
(第2黏著劑層) (2nd adhesive layer)
在上述基材2的另一面22積層之第2黏著劑層4，其係黏著體為被加工物，並含有第2感壓性接著劑及第2側鏈結晶性聚合物，在第2側鏈結晶性聚合物之熔點以上的溫度黏著力會降低之感溫性黏著劑層。 The second adhesive layer 4 laminated on the other surface 22 of the substrate 2 is an object to be processed, and contains a second pressure-sensitive adhesive and a second side chain crystalline polymer on the second side. The temperature-sensitive adhesive layer having a lower temperature adhesive force than the melting point of the chain crystalline polymer is lowered.
第2感壓性接著劑，其重量平均分子量較佳為大於上述第1感壓性接著劑的重量平均分子量。藉此，使第2黏著劑層4的凝集力較第1黏著劑層3的凝集力更為提昇，以提昇保持被加工物之保持力，結果為在將被加工物與膠帶1一起從台座剝離時，可抑制被加工物從膠帶1脫落。 The second pressure-sensitive adhesive preferably has a weight average molecular weight larger than a weight average molecular weight of the first pressure-sensitive adhesive. Thereby, the cohesive force of the second adhesive layer 4 is increased more than the cohesive force of the first adhesive layer 3, so as to increase the holding force of the workpiece, and as a result, the workpiece is brought together with the tape 1 from the pedestal. At the time of peeling, the workpiece can be prevented from falling off from the tape 1.
第2感壓性接著劑的重量平均分子量較佳為30萬至70萬，更佳為40萬至60萬，在該數值範圍內，較佳為使第2感壓性接著劑的重量平均分子量大於第1感壓性接著劑的重量平均分子量。藉此，可抑制被加工物從膠帶1剝離時產生殘膠，並可得到上述效果。 The weight average molecular weight of the second pressure-sensitive adhesive is preferably from 300,000 to 700,000, more preferably from 400,000 to 600,000, and in this numerical range, the weight average molecular weight of the second pressure-sensitive adhesive is preferably used. It is larger than the weight average molecular weight of the first pressure-sensitive adhesive. Thereby, it is possible to suppress the occurrence of residual glue when the workpiece is peeled off from the tape 1, and the above effects can be obtained.
第2感壓性接著劑的組成等可與上述第1感壓性接著劑相同或相異。 The composition or the like of the second pressure-sensitive adhesive may be the same as or different from the first pressure-sensitive adhesive.
第2感壓性接著劑的其他構成係與上述第1感壓性接著劑相同，故省略說明。 The other structure of the second pressure-sensitive adhesive is the same as that of the first pressure-sensitive adhesive, and thus the description thereof is omitted.
另一方面，與上述第1側鏈結晶性聚合物相同地，第2側鏈結晶性聚合物之熔點較佳為45℃以上且未達55℃。又，第2側鏈結晶性聚合物的重量平均分子量較佳為3,000至30,000，更佳為5,000至20,000，又更佳為6,000 至11,000。第2側鏈結晶性聚合物較佳為以固形分換算相對於第2感壓性接著劑100重量份為0.5至10重量份的比例摻配，更佳為以0.5至5重量份的比例摻配。 On the other hand, similarly to the first side chain crystalline polymer, the melting point of the second side chain crystalline polymer is preferably 45 ° C or more and less than 55 ° C. Further, the weight average molecular weight of the second side chain crystalline polymer is preferably from 3,000 to 30,000, more preferably from 5,000 to 20,000, still more preferably 6,000. To 11,000. The second side chain crystalline polymer is preferably blended in a ratio of 0.5 to 10 parts by weight based on 100 parts by weight of the second pressure-sensitive adhesive in terms of solid content, more preferably 0.5 to 5 parts by weight. Match.
第2側鏈結晶性聚合物的熔點、組成、重量平均分子量、摻配量等，係可與上述第1側鏈結晶性聚合物相同或相異。 The melting point, composition, weight average molecular weight, blending amount, and the like of the second side chain crystalline polymer may be the same as or different from those of the first side chain crystalline polymer.
第2側鏈結晶性聚合物的其他構成係與上述第1側鏈結晶性聚合物相同，故省略說明。 The other structure of the second side chain crystalline polymer is the same as that of the first side chain crystalline polymer, and thus the description thereof will be omitted.
上述含有第2感壓性接著劑及第2側鏈結晶性聚合物之第2黏著劑層4，其厚度較佳為小於上述第1黏著劑層3的厚度。換言之，第1黏著劑層3的厚度較佳為大於第2黏著劑層4的厚度。本實施形態，係第1黏著劑層3的厚度大於第2黏著劑層4的厚度之構成。根據如此構成，在透過膠帶1將被加工物壓附於台座時，貼附於台座之厚層的第1黏著劑層3會沿著台座表面形狀擴散並增大接觸面積，故可安定被加工物的假固定狀態。又，因貼附於被加工物之薄層的第2黏著劑層4不容易從膠帶1的外周部滲出，故可抑制因多餘之第2黏著劑層4滲出而污染被加工物。 The thickness of the second adhesive layer 4 containing the second pressure-sensitive adhesive and the second side chain crystalline polymer is preferably smaller than the thickness of the first adhesive layer 3. In other words, the thickness of the first adhesive layer 3 is preferably larger than the thickness of the second adhesive layer 4. In the present embodiment, the thickness of the first adhesive layer 3 is larger than the thickness of the second adhesive layer 4. According to this configuration, when the workpiece is pressed against the pedestal by the tape 1, the first adhesive layer 3 adhered to the thick layer of the pedestal spreads along the surface shape of the pedestal and increases the contact area, so that it can be processed stably. The fake fixed state of the object. Further, since the second adhesive layer 4 attached to the thin layer of the workpiece does not easily ooze out from the outer peripheral portion of the tape 1, it is possible to suppress the contamination of the workpiece due to the bleeding of the excess second adhesive layer 4.
第2黏著劑層4的厚度較佳為5至40μm，更佳為5至20μm，又更佳為5至15μm，在該數值範圍內，較佳為第1黏著劑層3的厚度大於第2黏著劑層4的厚度。 The thickness of the second adhesive layer 4 is preferably 5 to 40 μm, more preferably 5 to 20 μm, still more preferably 5 to 15 μm, and in this numerical range, it is preferable that the thickness of the first adhesive layer 3 is larger than that of the second adhesive layer 3. The thickness of the adhesive layer 4.
另外，與第1黏著劑層3相同地，第2黏著 劑層4中較佳為添加交聯劑。較佳為添加以固形分換算相對於第2感壓性接著劑100重量份為0.1至10重量份的比例之交聯劑，更佳為添加0.1至5重量份的比例之交聯劑，又更佳為添加0.1至1重量份的比例之交聯劑。 Further, similarly to the first adhesive layer 3, the second adhesive Preferably, a crosslinking agent is added to the agent layer 4. It is preferable to add a crosslinking agent in a ratio of 0.1 to 10 parts by weight based on 100 parts by weight of the second pressure-sensitive adhesive in terms of a solid content, and more preferably a crosslinking agent in a ratio of 0.1 to 5 parts by weight. More preferably, a crosslinking agent in a ratio of 0.1 to 1 part by weight is added.
上述第2黏著劑層4中，特佳的第2感壓性接著劑、第2側鏈結晶性聚合物及交聯劑之摻配，可舉出：該等之重量比為第2感壓性接著劑：第2側鏈結晶性聚合物：交聯劑=100：1至5：0.4至0.6之比率。 In the second adhesive layer 4, a particularly preferable second pressure-sensitive adhesive, a second side chain crystalline polymer, and a crosslinking agent are blended, and the weight ratio is the second pressure-sensitive ratio. Binder: 2nd side chain crystalline polymer: crosslinker = 100:1 to 5:0.4 to 0.6 ratio.
第2黏著劑層4的其他構成係與上述第1黏著劑層3相同，故省略說明。 The other structure of the second adhesive layer 4 is the same as that of the first adhesive layer 3, and thus the description thereof is omitted.
上述本實施形態的膠帶1，係進一步具備：積層於第1黏著劑層3的表面31之第1分隔膜5，及積層於第2黏著劑層4的表面41之第2分隔膜6。藉此，可分別保護第1黏著劑層3的表面31及第2黏著劑層4的表面41。 The tape 1 of the present embodiment further includes a first separator film 5 laminated on the surface 31 of the first adhesive layer 3, and a second separator film 6 laminated on the surface 41 of the second adhesive layer 4. Thereby, the surface 31 of the first adhesive layer 3 and the surface 41 of the second adhesive layer 4 can be respectively protected.
就第1分隔膜5及第2分隔膜6而言，例如可舉出：在含聚乙烯、聚對苯二甲酸乙二酯等之膜的表面塗佈有聚矽氧、氟等脫模劑者。又，就第1分隔膜5及第2分隔膜6個別的厚度而言，較佳為10至110μm。 The first separator 5 and the second separator 6 are, for example, coated with a release agent such as polyfluorene or fluorine on the surface of a film containing polyethylene or polyethylene terephthalate. By. Moreover, the thickness of each of the first separator film 5 and the second separator film 6 is preferably 10 to 110 μm.
第1分隔膜5及第2分隔膜6，彼此的組成、厚度等可相同或不同。本實施形態中，第1分隔膜5係在聚乙烯膜表面塗佈有聚矽氧者，第2分隔膜6係在聚對苯二甲酸乙二酯膜表面塗佈有聚矽氧者。又，本實施形態中，第1分隔膜5的厚度係大於第2分隔膜6的厚度。 The composition, thickness, and the like of the first separator film 5 and the second separator film 6 may be the same or different. In the present embodiment, the first separator film 5 is coated with polyfluorene on the surface of the polyethylene film, and the second separator film 6 is coated with polyoxymethylene on the surface of the polyethylene terephthalate film. Further, in the present embodiment, the thickness of the first separator film 5 is larger than the thickness of the second separator film 6.
本實施形態的膠帶1，較佳為第1黏著劑層3在23℃之180°剝離強度為2至16N/25mm，更佳為6至12N/25mm。藉此，可得到對台座之固定力。第1黏著劑層3的180°剝離強度，係根據JISZ0237在23℃的環境溫度測定聚對苯二甲酸乙二酯膜之180°剝離強度所得之值。 In the tape 1 of the present embodiment, it is preferable that the first adhesive layer 3 has a peel strength of 180° at 23° C. of 2 to 16 N/25 mm, more preferably 6 to 12 N/25 mm. Thereby, the fixing force to the pedestal can be obtained. The 180° peel strength of the first adhesive layer 3 is a value obtained by measuring the 180° peel strength of the polyethylene terephthalate film according to JIS Z0237 at an ambient temperature of 23 ° C.
又，本實施形態的膠帶1較佳為第2黏著劑層4在23℃之180°剝離強度為0.5至10N/25mm，更佳為1至3.5N/25mm。藉此，可得到對藍寶石玻璃等被加工物之固定力。第2黏著劑層4的180°剝離強度係根據JISZ0237，在23℃的環境溫度測定對藍寶石玻璃之180°剝離強度所得之值。 Further, in the tape 1 of the present embodiment, it is preferable that the second adhesive layer 4 has a 180° peel strength at 23 ° C of 0.5 to 10 N/25 mm, more preferably 1 to 3.5 N/25 mm. Thereby, the fixing force to the workpiece such as sapphire glass can be obtained. The 180° peel strength of the second adhesive layer 4 is a value obtained by measuring the 180° peel strength against sapphire glass at an ambient temperature of 23° C. according to JIS Z0237.
<被加工物的假固定方法> <Fake fixing method of workpiece>
接著，以使用上述膠帶1之情形為例，參照第2圖而詳細說明本發明一實施形態之被加工物的假固定方法。 Next, a case where the above-described tape 1 is used will be described as an example, and a method of fixing a workpiece according to an embodiment of the present invention will be described in detail with reference to FIG.
本實施形態，首先係如第2圖(a)所示，透過膠帶1將被加工物200假固定於台座100上，從該狀態如第2圖(b)所示，將被加工物200與膠帶1一起從台座100剝離。 In the first embodiment, as shown in Fig. 2(a), the workpiece 200 is fixed to the pedestal 100 by the tape 1, and the workpiece 200 is placed as shown in Fig. 2(b). The tape 1 is peeled off together from the pedestal 100.
具體來說，被加工物200可採用欲使用者而無特別限定，但以LED基板素材之藍寶石玻璃等較合適。本實施形態的被加工物200為藍寶石玻璃。又，台座100例如可舉出陶瓷製者。 Specifically, the workpiece 200 is not particularly limited as long as it is intended for the user, but sapphire glass or the like which is an LED substrate material is suitable. The workpiece 200 of the present embodiment is sapphire glass. Further, the pedestal 100 is exemplified by a ceramic manufacturer.
如第2圖(a)所示，被加工物200係在分別將第1黏著劑層3貼附於台座100，將第2黏著劑層4貼 附被加工物200之狀態下，透過膠帶1而假固定於台座100上。藉此，即使將被加工物200進行研磨加工等，也可抑制源自發泡劑之凹凸轉印至被加工物200因而降低產率。 As shown in Fig. 2(a), the workpiece 200 is attached to the pedestal 100 by the first adhesive layer 3, and the second adhesive layer 4 is attached. In the state in which the workpiece 200 is attached, it is affixed to the pedestal 100 by the tape 1 . Thereby, even if the workpiece 200 is subjected to polishing processing or the like, transfer of the unevenness derived from the foaming agent to the workpiece 200 can be suppressed, thereby reducing the yield.
接著，將膠帶1加熱至上述第1側鏈結晶性聚合物之熔點以上且使發泡劑膨脹或發泡的溫度。藉此，第1側鏈結晶性聚合物在熔點以上的溫度會顯示流動性，而且發泡劑會膨脹或發泡，因此可充分地降低第1黏著劑層3的黏著力。其結果係如第2圖(b)所示，可將被加工物200與膠帶1一起從台座100往箭頭A方向平順地剝離，因此可抑制因剝離時施加外力造成被加工物200破損而降低產率。加熱膠帶1之加熱手段例如可舉出加熱器等。 Next, the tape 1 is heated to a temperature equal to or higher than the melting point of the first side chain crystalline polymer and the foaming agent is expanded or foamed. Thereby, the first side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point, and the foaming agent expands or foams, so that the adhesion of the first adhesive layer 3 can be sufficiently reduced. As a result, as shown in FIG. 2(b), the workpiece 200 can be smoothly peeled off from the pedestal 100 in the direction of the arrow A together with the tape 1, so that the workpiece 200 can be prevented from being damaged by the external force applied during peeling. Yield. The heating means for heating the tape 1 is, for example, a heater or the like.
另外，伴隨著第1黏著劑層3的黏著力降低，第2黏著劑層4通常會變成所含有之第2側鏈結晶性聚合物之熔點以上的溫度，而使黏著力降低，但因其黏著力並未完全消失，故只要不施加大的外力，即可藉由第2黏著劑層4繼續固定被加工物200。 In addition, as the adhesion of the first adhesive layer 3 is lowered, the second adhesive layer 4 usually has a temperature equal to or higher than the melting point of the second side chain crystalline polymer contained, and the adhesive force is lowered. Since the adhesive force does not completely disappear, the workpiece 200 can be continuously fixed by the second adhesive layer 4 as long as no large external force is applied.
將被加工物200與膠帶1一起從台座100剝離後，將膠帶1加熱至第2側鏈結晶性聚合物之熔點以上的溫度，使第2黏著劑層4的黏著力降低，如第2圖(c)所示，將被加工物200從膠帶1往箭頭B的方向剝離。此時，膠帶1不容易在被加工物200產生殘膠，故可將洗淨步驟簡化或省略。 After the workpiece 200 is peeled off from the pedestal 100 together with the tape 1, the tape 1 is heated to a temperature equal to or higher than the melting point of the second side chain crystalline polymer, and the adhesion of the second adhesive layer 4 is lowered, as shown in FIG. As shown in (c), the workpiece 200 is peeled off from the tape 1 in the direction of the arrow B. At this time, the tape 1 does not easily generate residual glue in the workpiece 200, so the washing step can be simplified or omitted.
以下舉出合成例及實施例以詳細說明本發 明，但本發明並不僅限於以下合成例及實施例。另外，以下說明中「份」係意指重量份。 The following synthesis examples and examples are given to explain in detail the present invention. However, the present invention is not limited to the following synthesis examples and examples. In the following description, "parts" means parts by weight.
(合成例1：第1感壓性接著劑) (Synthesis Example 1: First pressure-sensitive adhesive)
以丙烯酸2-乙基己酯52份、丙烯酸甲酯40份、丙烯酸2-羥基乙酯8份及聚合起始劑之PERBUTYL ND(日油公司製)0.3份之比例，分別加入於甲苯200份，在60℃攪拌5小時，並使該等單體聚合。所得共聚物的重量平均分子量為25萬。 52 parts of 2-ethylhexyl acrylate, 40 parts of methyl acrylate, 8 parts of 2-hydroxyethyl acrylate, and PERBUTYL ND (manufactured by Nippon Oil Co., Ltd.) of a polymerization initiator were added to 200 parts of toluene. Stir at 60 ° C for 5 hours and polymerize the monomers. The obtained copolymer had a weight average molecular weight of 250,000.
(合成例2：第2感壓性接著劑) (Synthesis Example 2: second pressure-sensitive adhesive)
除了攪拌時的溫度以55℃取代60℃、PERBUTYL ND(日油公司製)以0.2份取代0.3份，溶劑以乙酸乙酯：庚烷=7：3(重量比)取代甲苯以外，以與合成例1相同方式聚合丙烯酸2-乙基己酯、丙烯酸甲酯及丙烯酸2-羥基乙酯。所得共聚物的重量平均分子量為45萬。 In addition to the temperature at the time of stirring, the temperature was 55 ° C instead of 60 ° C, PERBUTYL ND (manufactured by Nippon Oil Co., Ltd.) was replaced with 0.3 parts of 0.3 parts, and the solvent was replaced with ethyl acetate: heptane = 7:3 (by weight) to prepare for synthesis. In the same manner as in Example 1, 2-ethylhexyl acrylate, methyl acrylate and 2-hydroxyethyl acrylate were polymerized. The obtained copolymer had a weight average molecular weight of 450,000.
(合成例3：第1、第2側鏈結晶性聚合物) (Synthesis Example 3: first and second side chain crystalline polymers)
以丙烯酸二十二酯40份、丙烯酸十八酯35份、丙烯酸甲酯20份、丙烯酸5份、鏈轉移劑之十二基硫醇6份及聚合起始劑之PERHEXYL PV(日油公司製)1.0份的比例分別加入於甲苯100份，在80℃攪拌5小時，並使該等單體聚合。所得共聚物的重量平均分子量為8,000，熔點為50℃。 40 parts of behenyl acrylate, 35 parts of octadecyl acrylate, 20 parts of methyl acrylate, 5 parts of acrylic acid, 6 parts of dodecyl thiol of a chain transfer agent, and PERHEXYL PV of a polymerization initiator (manufactured by NOF Corporation The ratio of 1.0 parts was separately added to 100 parts of toluene, stirred at 80 ° C for 5 hours, and the monomers were polymerized. The obtained copolymer had a weight average molecular weight of 8,000 and a melting point of 50 °C.
合成例1至3之各共聚物係示於表1。另外，重量平均分子量係藉由GPC測定共聚物，並將所得測定值以聚苯乙烯換算而得。熔點係藉由將共聚物以DSC在10℃/分鐘之測定條件測定而得。 The copolymers of Synthesis Examples 1 to 3 are shown in Table 1. Further, the weight average molecular weight was measured by GPC, and the obtained measurement value was obtained in terms of polystyrene. The melting point was determined by measuring the copolymer under DSC conditions of 10 ° C / min.
<兩面黏著膠帶的製作> <Production of double-sided adhesive tape>
首先，將合成例1至3所得之各共聚物、發泡劑及交聯劑以表2所示組合混合，而得混合物。表2中，比率係表示固形分換算之重量比。 First, each of the copolymers obtained in Synthesis Examples 1 to 3, a foaming agent, and a crosslinking agent were mixed in the combination shown in Table 2 to obtain a mixture. In Table 2, the ratio indicates the weight ratio of the solid fraction conversion.
合成例1至3中所得之各共聚物、與表2中的第1、第2感壓性接著劑及第1、第2側鏈結晶性聚合物的關係如下。 The relationship between each of the copolymers obtained in Synthesis Examples 1 to 3 and the first and second pressure-sensitive adhesives in Table 2 and the first and second side chain crystalline polymers was as follows.
第1感壓性接著劑：合成例1 First pressure-sensitive adhesive: Synthesis Example 1
第2感壓性接著劑：合成例2 Second pressure-sensitive adhesive: Synthesis Example 2
第1側鏈結晶性聚合物：合成例3 First side chain crystalline polymer: Synthesis Example 3
第2側鏈結晶性聚合物：合成例3 Second side chain crystalline polymer: Synthesis Example 3
所使用之發泡劑及交聯劑如下。 The blowing agent and crosslinking agent used are as follows.
發泡劑：平均粒徑為6至9μm，且發泡起始溫度為90℃以上之EXPANCEL公司製的微球發泡劑「461DU20」 A foaming agent: a microsphere foaming agent "461DU20" manufactured by EXPANCEL Co., Ltd. having an average particle diameter of 6 to 9 μm and a foaming initiation temperature of 90 ° C or higher.
交聯劑：日本聚胺酯工業公司製之異氰酸酯化合物「CORONATE L-45E」 Crosslinking agent: Isocyanate compound "CORONATE L-45E" manufactured by Japan Polyurethane Industry Co., Ltd.
接著，將所得混合物用乙酸乙酯調整成固形分為30重量%，得到塗佈液。接著，將所得之塗佈液塗佈於含聚對苯二甲酸乙二酯之厚度100μm的膜狀基材並乾燥，得到兩面黏著膠帶。乾燥係使用加熱器，並分別對第1、第2黏著劑層進行。乾燥條件如下。 Next, the obtained mixture was adjusted to a solid content of 30% by weight with ethyl acetate to obtain a coating liquid. Next, the obtained coating liquid was applied to a film-form substrate having a thickness of 100 μm containing polyethylene terephthalate and dried to obtain a double-sided adhesive tape. The drying system uses a heater and performs the first and second adhesive layers, respectively. The drying conditions are as follows.
第1黏著劑層：80℃×10分鐘 1st adhesive layer: 80 ° C × 10 minutes
第2黏著劑層：100℃×10分鐘 2nd adhesive layer: 100 ° C × 10 minutes
所得兩面黏著膠帶中，第1、第2黏著劑層分別的厚度如下。 In the obtained double-sided adhesive tape, the thicknesses of the first and second adhesive layers are as follows.
第1黏著劑層的厚度：20μm Thickness of the first adhesive layer: 20 μm
第2黏著劑層的厚度：10μm Thickness of the second adhesive layer: 10 μm
<評估> <evaluation>
評估所得兩面黏著膠帶之剝離強度、發泡剝離性、殘膠性及研磨性。各評估方法係如下所示，並將其結果示於表2。 The peel strength, foam peelability, residual adhesiveness, and abrasiveness of the obtained double-sided adhesive tape were evaluated. The evaluation methods are as follows, and the results are shown in Table 2.
(剝離強度) (peel strength)
評估第1、第2黏著劑層在23℃的環境溫度之180°剝離強度。首先，在23℃的環境溫度中，使第1黏著劑層為上側，並將第2黏著劑層透過市售兩面膠帶固定於不鏽鋼板。接著，在第1黏著劑層貼附厚度25μm的聚對苯二甲 酸乙二酯膜。接著，使用測力器(load cell)以300mm/分鐘的速度將聚對苯二甲酸乙二酯膜從第1黏著劑層180°剝離。根據JISZ0237測定此時的180°剝離強度，評估第1黏著劑層於23℃環境溫度之180°剝離強度。第2黏著劑層之23℃之180°剝離強度，除了係透過第2黏著劑層將兩面黏著膠帶貼附於藍寶石玻璃，並將兩面黏著膠帶從藍寶石玻璃180°剝離之外，係以與第1黏著劑層相同方式評估。各評估結果分別表示於表2中「剝離強度」一欄。 The 180° peel strength of the first and second adhesive layers at an ambient temperature of 23 ° C was evaluated. First, the first adhesive layer was placed on the upper side at an ambient temperature of 23 ° C, and the second adhesive layer was fixed to the stainless steel plate by a commercially available double-sided tape. Next, a polyethylene terpene having a thickness of 25 μm is attached to the first adhesive layer. Ethylene glycol film. Next, the polyethylene terephthalate film was peeled off from the first adhesive layer at 180° using a load cell at a speed of 300 mm/min. The 180° peel strength at this time was measured in accordance with JIS Z0237, and the 180° peel strength of the first adhesive layer at an ambient temperature of 23 ° C was evaluated. The 180° peel strength of the second adhesive layer at 23° C., except that the double-sided adhesive tape is attached to the sapphire glass through the second adhesive layer, and the double-sided adhesive tape is peeled off from the sapphire glass by 180°, 1 Adhesive layer is evaluated in the same way. The results of each evaluation are shown in the column "Peel Strength" in Table 2.
(發泡剝離性) (foaming peelability)
首先，在23℃環境溫度中，透過第1黏著劑層將兩面黏著膠帶貼附於陶瓷板。接著，將環境溫度昇溫至第1側鏈結晶性聚合物之熔點以上、且使發泡劑膨脹或發泡之溫度之130℃。此時，以目視觀察兩面黏著膠帶是否僅因膠帶本身重量而從陶瓷板剝離。另外，評估基準係設定如下。 First, the double-sided adhesive tape was attached to the ceramic plate through the first adhesive layer at an ambient temperature of 23 °C. Next, the ambient temperature was raised to 130 ° C above the melting point of the first side chain crystalline polymer and the temperature at which the blowing agent was expanded or foamed. At this time, it was visually observed whether the double-sided adhesive tape was peeled off from the ceramic plate only by the weight of the tape itself. In addition, the evaluation criteria are set as follows.
○：在120秒以內剝離。 ○: Peeled within 120 seconds.
△：超過120秒且在300秒以內剝離。 △: Exceeded for more than 120 seconds and peeled off within 300 seconds.
×：未在300秒以內剝離。 ×: Not peeled off within 300 seconds.
(殘膠性) (residuality)
首先，在23℃環境溫度中，將兩面黏著膠帶的各面貼附於藍寶石玻璃。接著，對於第1黏著劑層在環境溫度130℃將兩面黏著膠帶發泡剝離，對於第2黏著劑層在環境溫度60℃將兩面黏著膠帶剝離。接著，以目視觀察剝離後的藍寶石玻璃表面，藉此評估殘膠性(殘渣)。另外，評估基準係設定如下。 First, each side of the double-sided adhesive tape was attached to the sapphire glass at an ambient temperature of 23 °C. Next, the double-sided adhesive tape was foamed and peeled off at an ambient temperature of 130 ° C for the first adhesive layer, and the double-sided adhesive tape was peeled off at an ambient temperature of 60 ° C for the second adhesive layer. Next, the surface of the sapphire glass after peeling was visually observed, and the residual property (residue) was evaluated. In addition, the evaluation criteria are set as follows.
○：在藍寶石玻璃觀察到些許殘膠(殘渣)，但在實用上不會造成問題的範圍。 ○: A small amount of residual glue (residue) was observed in sapphire glass, but it did not cause a problem in practical use.
△：在藍寶石玻璃觀察到殘膠(殘渣)。 △: Residue (residue) was observed in sapphire glass.
×：在藍寶石玻璃觀察到大量殘膠(殘渣)。 ×: A large amount of residual glue (residue) was observed in sapphire glass.
(研磨性) (abrasiveness)
首先，在23℃環境溫度中，透過第1黏著劑層將兩面黏著膠帶貼附於研磨機的平台。接著，透過第2黏著劑層，將厚度635μm的藍寶石玻璃所構成之板狀被加工物黏貼於兩面黏著膠帶。接著，研磨條件設定如下。 First, the double-sided adhesive tape was attached to the platform of the grinder through the first adhesive layer at an ambient temperature of 23 °C. Next, a plate-shaped workpiece composed of sapphire glass having a thickness of 635 μm was adhered to the double-sided adhesive tape through the second adhesive layer. Next, the polishing conditions were set as follows.
研磨機：平台尺寸36吋 Grinder: platform size 36吋
研磨壓力：170kgf/軸 Grinding pressure: 170kgf / shaft
平台旋轉數：45rpm Platform rotation number: 45rpm
漿液：膠態氧化矽 Slurry: colloidal cerium oxide
研磨布：不織布型 Abrasive cloth: non-woven type
環境溫度：23℃ Ambient temperature: 23 ° C
研磨時發熱溫度範圍：23至45℃ Heating temperature range during grinding: 23 to 45 ° C
以上述研磨條件，將被加工物研磨至厚度620μm為止。此時，以目視觀察第1、第2黏著劑層是否產生滑動，藉此評估研磨性。另外，目視觀察係在研磨中至研磨後進行。又，評估基準係設定如下。 The workpiece was polished to a thickness of 620 μm under the above polishing conditions. At this time, the polishing property was evaluated by visually observing whether or not the first and second adhesive layers were slipped. In addition, visual observation was carried out during the grinding to the time of grinding. Also, the evaluation criteria are set as follows.
○：第1、第2黏著劑層兩者皆未產生滑動。 ○: Both the first and second adhesive layers did not slip.
×：第1、第2黏著劑層之至少一者產生滑動。 ×: At least one of the first and second adhesive layers is slid.
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| JP6390366B2 (en) * | 2014-11-13 | 2018-09-19 | 東洋インキＳｃホールディングス株式会社 | Adhesive composition, method for producing the same, adhesive tape |
| JP2016199725A (en) * | 2015-04-14 | 2016-12-01 | ニッタ株式会社 | Temperature-sensitive adhesive sheet for producing ceramic electronic component and method for producing ceramic electronic component |
| WO2017187800A1 (en) * | 2016-04-26 | 2017-11-02 | 日東電工株式会社 | Shaping-stage adhesive sheet and lamination shaping device |
| JP6967908B2 (en) * | 2016-09-09 | 2021-11-17 | ニッタ株式会社 | A temperature-sensitive adhesive sheet and a method for manufacturing a wafer using the same. |
| US9909035B1 (en) * | 2017-09-29 | 2018-03-06 | Mayapple Baby Llc | Mountable articles, dual-adhesive-adhesive tape and mounting methods using them |
| CN108559425B (en) * | 2018-05-11 | 2020-01-17 | 华南协同创新研究院 | Solvent-free adhesive for preventing warping of FDM printing device, printing platform and manufacturing method of solvent-free adhesive |
| KR20210061717A (en) | 2019-11-20 | 2021-05-28 | 엘지디스플레이 주식회사 | Display device |
| KR102381023B1 (en) * | 2020-05-28 | 2022-03-31 | 주식회사 휴먼텍 | Adhesive film comprising foamed layer |
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