TWI632595B - 壓印裝置、壓印方法及物品製造方法 - Google Patents

壓印裝置、壓印方法及物品製造方法 Download PDF

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Publication number
TWI632595B
TWI632595B TW106104125A TW106104125A TWI632595B TW I632595 B TWI632595 B TW I632595B TW 106104125 A TW106104125 A TW 106104125A TW 106104125 A TW106104125 A TW 106104125A TW I632595 B TWI632595 B TW I632595B
Authority
TW
Taiwan
Prior art keywords
substrate
mold
voltage
peripheral structure
imprint
Prior art date
Application number
TW106104125A
Other languages
English (en)
Chinese (zh)
Other versions
TW201732881A (zh
Inventor
米川雅見
Original Assignee
佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW201732881A publication Critical patent/TW201732881A/zh
Application granted granted Critical
Publication of TWI632595B publication Critical patent/TWI632595B/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106104125A 2016-02-29 2017-02-08 壓印裝置、壓印方法及物品製造方法 TWI632595B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016037999 2016-02-29
JP2016-037999 2016-02-29
JP2016-223348 2016-11-16
JP2016223348A JP6789772B2 (ja) 2016-02-29 2016-11-16 インプリント装置、インプリント方法および物品製造方法

Publications (2)

Publication Number Publication Date
TW201732881A TW201732881A (zh) 2017-09-16
TWI632595B true TWI632595B (zh) 2018-08-11

Family

ID=59810121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104125A TWI632595B (zh) 2016-02-29 2017-02-08 壓印裝置、壓印方法及物品製造方法

Country Status (3)

Country Link
JP (1) JP6789772B2 (ko)
KR (1) KR102134212B1 (ko)
TW (1) TWI632595B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6802691B2 (ja) * 2016-11-18 2020-12-16 キヤノン株式会社 インプリント装置および物品製造方法
JP7495814B2 (ja) * 2020-05-13 2024-06-05 キヤノン株式会社 インプリント装置、および物品の製造方法
KR102542639B1 (ko) * 2021-02-10 2023-06-12 성균관대학교산학협력단 미세 패턴 형성 장치 및 방법
KR102528880B1 (ko) * 2021-02-16 2023-05-03 성균관대학교산학협력단 전기수력학 불안정성을 이용한 패턴제작기술의 미세 구조체 사이의 2차 간섭효과에 의한 초미세구조체 제작 및 초소수성표면 형성방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI224149B (en) * 2000-08-29 2004-11-21 Canon Kk Thin-film formation system and thin-film formation process
TW200905727A (en) * 2007-04-06 2009-02-01 Canon Kk Exposure apparatus and original
TW201604934A (zh) * 2014-07-15 2016-02-01 佳能股份有限公司 壓印設備及製造物品的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4758406B2 (ja) * 2007-10-02 2011-08-31 日本電信電話株式会社 インプリント方法
JP2011040464A (ja) * 2009-08-07 2011-02-24 Canon Inc 異物除去装置、露光装置及びデバイス製造方法
JP6171412B2 (ja) * 2013-03-06 2017-08-02 大日本印刷株式会社 インプリント方法、インプリント用のモールドおよびインプリント装置
JP6139434B2 (ja) * 2013-12-13 2017-05-31 株式会社東芝 インプリント方法
JP6313591B2 (ja) * 2013-12-20 2018-04-18 キヤノン株式会社 インプリント装置、異物除去方法及び物品の製造方法
JP2015149390A (ja) * 2014-02-06 2015-08-20 キヤノン株式会社 インプリント装置、型、および物品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI224149B (en) * 2000-08-29 2004-11-21 Canon Kk Thin-film formation system and thin-film formation process
TW200905727A (en) * 2007-04-06 2009-02-01 Canon Kk Exposure apparatus and original
TW201604934A (zh) * 2014-07-15 2016-02-01 佳能股份有限公司 壓印設備及製造物品的方法

Also Published As

Publication number Publication date
JP2017157821A (ja) 2017-09-07
KR102134212B1 (ko) 2020-07-15
TW201732881A (zh) 2017-09-16
KR20180118684A (ko) 2018-10-31
JP6789772B2 (ja) 2020-11-25

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