TWI628407B - Copper alloy plate and coil for heat dissipation parts - Google Patents

Copper alloy plate and coil for heat dissipation parts Download PDF

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Publication number
TWI628407B
TWI628407B TW106108765A TW106108765A TWI628407B TW I628407 B TWI628407 B TW I628407B TW 106108765 A TW106108765 A TW 106108765A TW 106108765 A TW106108765 A TW 106108765A TW I628407 B TWI628407 B TW I628407B
Authority
TW
Taiwan
Prior art keywords
copper alloy
heat dissipating
bending
layer
thickness
Prior art date
Application number
TW106108765A
Other languages
English (en)
Chinese (zh)
Other versions
TW201809581A (zh
Inventor
西村昌泰
真砂靖
Original Assignee
神戶製鋼所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 神戶製鋼所股份有限公司 filed Critical 神戶製鋼所股份有限公司
Publication of TW201809581A publication Critical patent/TW201809581A/zh
Application granted granted Critical
Publication of TWI628407B publication Critical patent/TWI628407B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/08—Alloys based on copper with lead as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW106108765A 2016-03-17 2017-03-16 Copper alloy plate and coil for heat dissipation parts TWI628407B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-054204 2016-03-17
JP2016054204A JP6283046B2 (ja) 2016-03-17 2016-03-17 放熱部品用銅合金板

Publications (2)

Publication Number Publication Date
TW201809581A TW201809581A (zh) 2018-03-16
TWI628407B true TWI628407B (zh) 2018-07-01

Family

ID=59850758

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106108765A TWI628407B (zh) 2016-03-17 2017-03-16 Copper alloy plate and coil for heat dissipation parts

Country Status (3)

Country Link
JP (1) JP6283046B2 (ja)
TW (1) TWI628407B (ja)
WO (1) WO2017159749A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6315868B1 (ja) * 2017-11-28 2018-04-25 日酸Ｔａｎａｋａ株式会社 ガス切断火口
CN111809079B (zh) * 2020-07-23 2021-12-17 郑州恒天铜业有限公司 一种高强高导铜合金导线材料及其制备方法
WO2022126726A1 (zh) * 2020-12-16 2022-06-23 苏州森诺扬机械有限公司 一种用于五金制品加工的折角装置
WO2022126723A1 (zh) * 2020-12-16 2022-06-23 苏州森诺扬机械有限公司 一种可调节五金制品加工的冲压设备
CN113122755A (zh) * 2021-04-16 2021-07-16 江西富鸿金属有限公司 一种医疗数据传输用镀锡合金线及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11343527A (ja) * 1998-06-01 1999-12-14 Kobe Steel Ltd プレス打ち抜き加工時の熱処理性に優れる高強度、高導電性銅合金
JP2008088469A (ja) * 2006-09-29 2008-04-17 Hitachi Cable Ltd 銅合金製バッキング・プレートおよびバッキング・プレート用銅合金の製造方法
JP5851000B1 (ja) * 2014-08-22 2016-02-03 株式会社神戸製鋼所 Ｌｅｄのリードフレーム用銅合金板条

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4168077B2 (ja) * 2006-07-21 2008-10-22 株式会社神戸製鋼所 酸化膜密着性に優れた電気電子部品用銅合金板
JP6328380B2 (ja) * 2013-05-31 2018-05-23 Ｊｘ金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6081513B2 (ja) * 2015-03-30 2017-02-15 株式会社神戸製鋼所 放熱部品用銅合金板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11343527A (ja) * 1998-06-01 1999-12-14 Kobe Steel Ltd プレス打ち抜き加工時の熱処理性に優れる高強度、高導電性銅合金
JP2008088469A (ja) * 2006-09-29 2008-04-17 Hitachi Cable Ltd 銅合金製バッキング・プレートおよびバッキング・プレート用銅合金の製造方法
JP5851000B1 (ja) * 2014-08-22 2016-02-03 株式会社神戸製鋼所 Ｌｅｄのリードフレーム用銅合金板条

Also Published As

Publication number Publication date
JP6283046B2 (ja) 2018-02-21
JP2017166044A (ja) 2017-09-21
WO2017159749A1 (ja) 2017-09-21
TW201809581A (zh) 2018-03-16

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