TWI628407B - Copper alloy plate and coil for heat dissipation parts - Google Patents

Copper alloy plate and coil for heat dissipation parts Download PDF

Info

Publication number
TWI628407B
TWI628407B TW106108765A TW106108765A TWI628407B TW I628407 B TWI628407 B TW I628407B TW 106108765 A TW106108765 A TW 106108765A TW 106108765 A TW106108765 A TW 106108765A TW I628407 B TWI628407 B TW I628407B
Authority
TW
Taiwan
Prior art keywords
copper alloy
heat dissipating
bending
layer
thickness
Prior art date
Application number
TW106108765A
Other languages
Chinese (zh)
Other versions
TW201809581A (en
Inventor
西村昌泰
真砂靖
Original Assignee
神戶製鋼所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 神戶製鋼所股份有限公司 filed Critical 神戶製鋼所股份有限公司
Publication of TW201809581A publication Critical patent/TW201809581A/en
Application granted granted Critical
Publication of TWI628407B publication Critical patent/TWI628407B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/08—Alloys based on copper with lead as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Conductive Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本揭示之散熱零件用銅合金板，係含有Fe：0.01~1.0mass%、P：0.01~0.20mass%、Zn：0.01~1.0mass%、及Sn：0.01~0.15mass%，且剩餘部分由Cu及不可避免的雜質所構成。軋延平行方向上的拉伸強度為410MPa以上，耐力為390MPa以上，伸長率為5%以上；軋延直角方向上的拉伸強度為420MPa以上，耐力為400MPa以上，伸長率為3%以上；導電率為75%IACS以上；將彎折半徑R與板厚t之比R/t設為0.5，並將彎折線設為軋延直角方向以進行90度彎折時之彎折加工臨限寬度為70mm以上；將彎折線設為軋延直角方向以進行密著彎折時之彎折加工臨限寬度為20mm以上。 The copper alloy plate for heat dissipation parts disclosed in the present invention contains Fe: 0.01 to 1.0 mass%, P: 0.01 to 0.20 mass%, Zn: 0.01 to 1.0 mass%, and Sn: 0.01 to 0.15 mass%, and the remainder is Cu. And the inevitable impurities. The tensile strength in the parallel direction of rolling is 410 MPa or more, the endurance is 390 MPa or more, and the elongation is 5% or more; the tensile strength in the direction perpendicular to the rolling is 420 MPa or more, the endurance is 400 MPa or more, and the elongation is 3% or more; The ratio is 75% IACS or more; the ratio R/t of the bending radius R to the sheet thickness t is set to 0.5, and the bending line is set to the right angle direction of the rolling to bend at a 90-degree bending limit. 70 mm or more; the bending line is set to a right angle direction for bending, and the bending width of the bending process is 20 mm or more.

Description

散熱零件用銅合金板及捲料 Copper alloy plate and coil for heat dissipation parts

本發明係關於用以將個人電腦、平板終端、智慧型手機、行動電話、數位相機等的電子機器所裝載之CPU、液晶等的熱予以散熱之散熱零件所使用之銅合金板。 The present invention relates to a copper alloy plate used for a heat dissipating component for dissipating heat of a CPU, a liquid crystal, or the like mounted on an electronic device such as a personal computer, a tablet terminal, a smart phone, a mobile phone, or a digital camera.

於個人電腦、平板終端、智慧型手機、行動電話、數位相機、數位攝影機等的電子機器中，係使用將所裝載之CPU、液晶、攝像元件等的電子零件所產生之熱予以散熱之散熱零件。散熱零件，係用以防止電子零件之過度的溫度上升，防止電子零件的熱失控以使其正常地發揮功能者。散熱零件，係使用將熱傳導性高的純銅、強度與耐蝕性優異之不鏽鋼及鎳銀、輕量的鋁合金等之原材料進行加工而成者。此等散熱零件，不僅散熱功能，亦擔負起保護所裝載之電子零件免受施加於電子機器之外力的影響之構造構件的功用。 In an electronic device such as a personal computer, a tablet terminal, a smart phone, a mobile phone, a digital camera, a digital camera, or the like, a heat dissipating component that dissipates heat generated by an electronic component such as a CPU, a liquid crystal, or an image sensor mounted thereon is used. . The heat dissipating component is used to prevent excessive temperature rise of the electronic component and prevent thermal runaway of the electronic component so that it functions normally. The heat-dissipating parts are made of raw materials such as pure copper with high thermal conductivity, stainless steel with excellent strength and corrosion resistance, nickel silver, and lightweight aluminum alloy. These heat dissipating components not only function as a heat dissipating function, but also function as a structural member that protects the mounted electronic components from the forces applied to the electronic device.

對於裝載於電子機器之電子零件，係要求高速化、高功能化，而使電子零件的高密度化持續發展。因此，電子零件的發熱量急速地增大。此外，在電子機器的 小型化、薄型化、輕量化的要求下，對於散熱零件亦要求薄層化。然而，即使將散熱零件薄層化，亦要求可維持散熱性能及構造強度。 For electronic components mounted on electronic equipment, high speed and high functionality are required, and the density of electronic components continues to grow. Therefore, the amount of heat generated by the electronic component is rapidly increased. In addition, in electronic machines Under the requirements of miniaturization, thinning, and light weight, thin-layering is also required for heat-dissipating parts. However, even if the heat dissipating component is thinned, it is required to maintain heat dissipation performance and structural strength.

散熱零件之原材料的板材，係經由摺邊彎折(密著彎折)、90°彎折、拉製等之塑性加工而成形為散熱零件。彎折加工中，在引線架及端子中，彎折部的寬度(彎折線的長度)為數毫米程度以下，但在散熱零件中，彎折部的寬度為較大的20mm程度以上者。彎折寬度愈大，板材的彎折加工性急遽地降低者乃為人所知，對於散熱零件用板材，與端子及引線架用板材相比，係要求更嚴格的彎折加工性。 The sheet of the raw material of the heat dissipating component is formed into a heat dissipating component by plastic working such as hemming bending (close bending), 90° bending, drawing, and the like. In the bending process, the width of the bent portion (the length of the bending line) is not more than several millimeters in the lead frame and the terminal. However, in the heat dissipating component, the width of the bent portion is not less than 20 mm. The larger the bending width, the less severely the bending workability of the sheet material is known, and the sheet for heat dissipating parts is required to have more severe bending workability than the sheet for the terminal and the lead frame.

作為散熱零件的原材料，純銅雖然熱傳導性優異，但強度小，無法將散熱零件薄層化。不鏽鋼及鎳銀，其熱傳導率低(2~3%IACS)，並不適用作為散熱量大之電子零件用散熱零件。鋁合金，該強度與熱傳導性皆不足。另一方面，關於銅合金，於專利文獻1、2中揭示有一種散熱零件用Fe-P系銅合金，但關於彎折部的寬度大之彎折加工中的彎折加工性，並無任何揭示。 As a raw material of the heat dissipating component, pure copper has excellent thermal conductivity, but has low strength and cannot thin the heat dissipating component. Stainless steel and nickel silver have low thermal conductivity (2~3% IACS) and are not suitable for heat dissipation parts for electronic parts with large heat dissipation. In aluminum alloys, the strength and thermal conductivity are insufficient. On the other hand, in the case of the copper alloy, there is disclosed an Fe-P-based copper alloy for a heat dissipating component, but there is no bending workability in the bending process in which the width of the bent portion is large. reveal.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2003-277853號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-277853

[專利文獻2]日本特開2014-189816號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2014-189816

本發明之實施形態，該目的在於提供一種具有高強度，於彎折部的寬度大之彎折加工中之優異的彎折加工性，以及散熱性之散熱零件用銅合金板。 According to an embodiment of the present invention, it is an object of the invention to provide a copper alloy sheet for a heat dissipating component which has high strength and excellent bending workability in a bending process having a large width of a bent portion and heat dissipation.

本發明之實施形態之散熱零件用銅合金板，其特徵為：含有Fe：0.01~1.0mass%、P：0.01~0.20mass%、Zn：0.01~1.0mass%、及Sn：0.01~0.15mass%，且剩餘部分由Cu及不可避免的雜質所構成；軋延平行方向上的拉伸強度為410MPa以上，降伏強度(yield strength)為390MPa以上，伸長率為5%以上；軋延直角方向上的拉伸強度為420MPa以上，降伏強度為400MPa以上，伸長率為3%以上；導電率為75%IACS以上；將彎折半徑R與板厚t之比R/t設為0.5，並將彎折線設為軋延直角方向以進行90度彎折時之彎折加工臨限寬度為70mm以上；將彎折線設為軋延直角方向以進行密著彎折時之彎折加工臨限寬度為20mm以上。 A copper alloy sheet for a heat dissipating component according to an embodiment of the present invention is characterized in that it contains Fe: 0.01 to 1.0 mass%, P: 0.01 to 0.20 mass%, Zn: 0.01 to 1.0 mass%, and Sn: 0.01 to 0.15 mass%. And the remainder is composed of Cu and unavoidable impurities; the tensile strength in the parallel direction of rolling is 410 MPa or more, the yield strength is 390 MPa or more, and the elongation is 5% or more; The tensile strength is 420 MPa or more, the relief strength is 400 MPa or more, the elongation is 3% or more; the electrical conductivity is 75% IACS or more; the ratio of the bending radius R to the thickness t is R/t is set to 0.5, and the bending line is set. The bending width of the bending process is 70 mm or more when the bending is performed at a right angle of 90 degrees, and the bending width is 20 mm or more when the bending line is set to a right angle direction for bending.

上述銅合金，能夠以合計為0.3mass%以下更含有Co、Al、Cr、Mg、Mn、Ca、Pb、Ni、Ti、Zr、Si及Ag的1種或2種以上(Ni含量未達0.1mass%)。 The copper alloy may have one or more of Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, and Ag in a total amount of 0.3 mass% or less (Ni content is less than 0.1). Mass%).

於上述銅合金板的表面，可視需要藉由電鍍等來形成表面被覆層，如此可提升耐蝕性。表面被覆層，可考量到 由Sn層、Cu-Sn合金層、Ni、Co、Fe、Ni-Co合金及Ni-Fe合金中的任一種所構成之電鍍層。 On the surface of the above copper alloy sheet, a surface coating layer may be formed by plating or the like as needed, thereby improving corrosion resistance. Surface coating, can be considered A plating layer composed of any one of a Sn layer, a Cu-Sn alloy layer, Ni, Co, Fe, a Ni-Co alloy, and a Ni-Fe alloy.

根據本發明之實施形態，可提供一種具有作為構造構件的強度，尤其可承受變形及落下衝擊性之強度，可承受加工為複雜形狀之彎折加工性，以及相對於來自半導體元件等的熱之高散熱性之散熱零件用銅合金板。此外，將前述表面被覆層形成於此銅合金板時，可提升耐蝕性，即使在嚴苛環境下，亦可防止作為散熱零件之性能的降低。 According to the embodiment of the present invention, it is possible to provide a strength as a structural member, particularly capable of withstanding deformation and drop impact strength, withstand bending workability for processing into a complicated shape, and with respect to heat from a semiconductor element or the like. Copper alloy plate for heat dissipation parts with high heat dissipation. Further, when the surface coating layer is formed on the copper alloy sheet, the corrosion resistance can be improved, and the performance as a heat dissipating member can be prevented from being lowered even in a severe environment.

1‧‧‧V字模塊 1‧‧‧V word module

2‧‧‧按壓模具 2‧‧‧ Pressing the mold

3‧‧‧試驗片 3‧‧‧Test strips

第1圖係說明實施例之90度彎折試驗的試驗方法之圖。 Fig. 1 is a view showing the test method of the 90 degree bending test of the examples.

以下詳細說明本發明之實施形態之散熱零件用銅合金板。 Hereinafter, the copper alloy sheet for heat dissipation parts according to the embodiment of the present invention will be described in detail.

〈銅合金板的組成〉 <Composition of Copper Alloy Sheet>

銅合金的組成，係含有Fe：0.01~1.0mass%、P：0.01~0.20mass%、Zn：0.01~1.0mass%、及Sn：0.01~ 0.15mass%，且剩餘部分由Cu及不可避免的雜質所構成。此銅合金，可視需要，以合計為0.3mass%以下(不含0mass%)含有Co、Al、Cr、Mg、Mn、Ca、Pb、Ni、Ti、Zr、Si及Ag的1種或2種以上作為副成分(惟含有Ni時，Ni含量未達0.1mass%(不含0mass%))。 The composition of the copper alloy contains Fe: 0.01 to 1.0 mass%, P: 0.01 to 0.20 mass%, Zn: 0.01 to 1.0 mass%, and Sn: 0.01 to 0.15 mass%, and the remainder consists of Cu and unavoidable impurities. The copper alloy may contain one or two kinds of Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, and Ag in a total amount of 0.3 mass% or less (excluding 0 mass%) as needed. The above is an accessory component (when Ni is contained, the Ni content is less than 0.1 mass% (excluding 0 mass%)).

Fe，藉由析出與後述P之金屬間化合物，可使銅合金達到高強度化。Fe含量未達0.01mass%時，Fe-P化合物的析出量少，無法得到期望的強度，另一方面，Fe含量超過1.0mass%時，無法得到期望的導電率。因此，Fe含量設為0.01~1.0mass%。Fe含量的下限較佳為0.03mass%，尤佳為0.05mass%，Fe含量的上限較佳為0.8mass%，尤佳為0.6mass%。 Fe can increase the strength of the copper alloy by depositing an intermetallic compound with P described later. When the Fe content is less than 0.01 mass%, the amount of precipitation of the Fe-P compound is small, and the desired strength cannot be obtained. On the other hand, when the Fe content exceeds 1.0 mass%, the desired conductivity cannot be obtained. Therefore, the Fe content is set to 0.01 to 1.0 mass%. The lower limit of the Fe content is preferably 0.03 mass%, more preferably 0.05 mass%, and the upper limit of the Fe content is preferably 0.8 mass%, and particularly preferably 0.6 mass%.

P，形成與Fe之金屬間化合物並析出於Cu的母相，而提升強度。P含量未達0.01mass%時，Fe-P化合物的析出不足，無法得到期望的強度。另一方面，P含量超過0.20mass%時，無法得到期望的導電率。因此，P含量設為0.01~0.20mass%。P含量的下限較佳為0.03mass%，尤佳為0.05mass%，P含量的上限較佳為0.17mass%，尤佳為0.15mass%。 P, forming an intermetallic compound with Fe and decomposing the parent phase of Cu, thereby increasing the strength. When the P content is less than 0.01 mass%, the precipitation of the Fe-P compound is insufficient, and the desired strength cannot be obtained. On the other hand, when the P content exceeds 0.20 mass%, the desired conductivity cannot be obtained. Therefore, the P content is set to 0.01 to 0.20 mass%. The lower limit of the P content is preferably 0.03 mass%, more preferably 0.05 mass%, and the upper limit of the P content is preferably 0.17 mass%, and particularly preferably 0.15 mass%.

Zn，具有提升焊錫的耐熱剝離性之作用，且具有維持零件組裝時及隨時間經過後之焊錫接合可靠度之功用。然而，Zn的含量未達0.01mass%時，無法充分滿足焊錫的耐熱剝離性，超過1.0mass%時，會使銅合金的導電率及熱傳導率劣化。Zn含量的下限較佳為0.03mass%，尤佳 為0.05mass%，Zn含量的上限較佳為0.8mass%，尤佳為0.6mass%。 Zn has the function of improving the heat-resistant peeling property of the solder, and has the function of maintaining the solder joint reliability at the time of component assembly and over time. However, when the content of Zn is less than 0.01 mass%, the heat-resistant peeling property of the solder cannot be sufficiently satisfied, and when it exceeds 1.0 mass%, the electrical conductivity and thermal conductivity of the copper alloy are deteriorated. The lower limit of the Zn content is preferably 0.03 mass%, particularly preferably The upper limit of the Zn content is preferably 0.05 mass%, and particularly preferably 0.6 mass%.

Sn，有益於提升銅合金的強度，Sn的含量未達0.01mass%時，無法得到充分的強度。此外，Sn的含量超過0.15mass%時，會使銅合金的導電率及熱傳導率劣化。因此，Sn的含量設為0.01~0.15mass%。Sn含量的下限較佳為0.03mass%，尤佳為0.05mass%，Sn含量的上限較佳為0.12mass%，尤佳為0.10mass%。 Sn is beneficial for increasing the strength of the copper alloy, and when the content of Sn is less than 0.01 mass%, sufficient strength cannot be obtained. Further, when the content of Sn exceeds 0.15 mass%, the electrical conductivity and thermal conductivity of the copper alloy are deteriorated. Therefore, the content of Sn is set to be 0.01 to 0.15 mass%. The lower limit of the Sn content is preferably 0.03 mass%, more preferably 0.05 mass%, and the upper limit of the Sn content is preferably 0.12 mass%, and particularly preferably 0.10 mass%.

此外，視需要作為副成分所添加之Co、Al、Cr、Mg、Mn、Ca、Pb、Ni、Ti、Zr、Si及Ag，具有提升銅合金的強度，並提升製造時的熱軋延性之作用。然而，當上述副成分之1種或2種以上的合計含量超過0.3mass%時，雖可提升銅合金的強度，但會使導電率及熱傳導性降低。因此，上述副成分的合計含量設為0.3mass%以下(不含0mass%)。惟含有Ni時，Ni含量設為未達0.1mass%(不含0mass%)。 In addition, Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, and Ag added as auxiliary components have the strength of the copper alloy and the hot rolling ductility at the time of manufacture. effect. However, when the total content of one or two or more of the above-mentioned subcomponents exceeds 0.3 mass%, the strength of the copper alloy can be increased, but the electrical conductivity and thermal conductivity are lowered. Therefore, the total content of the above-mentioned subcomponents is set to 0.3 mass% or less (excluding 0 mass%). However, when Ni is contained, the Ni content is set to be less than 0.1 mass% (excluding 0 mass%).

〈銅合金板的特性〉 <Characteristics of Copper Alloy Sheets>

散熱零件，必須具有作為構造構件的強度，尤其是可承受變形及落下衝擊之強度。若銅合金板之軋延平行方向上的拉伸強度為410MPa以上，降伏強度為390MPa以上，且軋延直角方向上的拉伸強度為420MPa以上，降伏強度為400MPa以上，則即使將散熱零件薄層化，亦可確保作為構造構件的強度。此外，若銅合金板之軋延平行方向上 的伸長率為5%以上，且軋延直角方向上的伸長率為3%以上，則在藉由彎折加工或拉製加工從銅合金板使散熱零件成形時，成形加工性不會特別產生問題。降伏強度，為於拉伸試驗中產生0.2%的永久伸長率時之拉伸強度。 The heat dissipating component must have strength as a structural member, especially the strength that can withstand deformation and drop impact. If the tensile strength of the copper alloy sheet in the parallel direction is 410 MPa or more, the relief strength is 390 MPa or more, and the tensile strength in the right angle direction is 420 MPa or more, and the relief strength is 400 MPa or more, even if the heat dissipation part is thin. It also ensures the strength as a structural member. In addition, if the copper alloy sheet is rolled in parallel direction When the elongation is 5% or more and the elongation in the right-angle direction is 3% or more, the molding processability is not particularly caused when the heat-dissipating component is molded from the copper alloy sheet by bending or drawing. problem. The drop strength is the tensile strength at which a permanent elongation of 0.2% is produced in the tensile test.

當以銅合金板作為原材料使散熱零件成形時，一般而言，銅合金板必須具有優異的彎折加工性。若將彎折半徑R與板厚t之比R/t設為0.5並將彎折線設為軋延直角方向以進行銅合金板的90度彎折時之彎折加工臨限寬度為70mm以上，且將彎折線設為軋延直角方向以進行密著彎折時之彎折加工臨限寬度為20mm以上，則散熱零件的製造不會產生阻礙。當銅合金板的彎折加工臨限寬度未達到上述值時，在製造散熱零件的程序上，於彎折加工部會產生龜裂或破裂，難以成形為複雜形狀。 When a heat-dissipating part is formed using a copper alloy plate as a raw material, in general, a copper alloy plate must have excellent bending workability. When the ratio R/t of the bending radius R to the thickness t is set to 0.5 and the bending line is set to the right angle of the rolling to perform the 90 degree bending of the copper alloy sheet, the bending width of the bending processing is 70 mm or more. Further, when the bending line is set to the right angle direction for bending and the bending width of the bending process is 20 mm or more, the production of the heat dissipating member is not hindered. When the bending width limit of the copper alloy sheet does not reach the above value, cracks or cracks may occur in the bent portion in the procedure for manufacturing the heat dissipating member, and it is difficult to form a complicated shape.

吸收從半導體元件等所產生之熱並釋放至外部時，散熱零件用銅合金板的導電率較佳係超過75%IACS，熱傳導率超過300W/m‧K。熱傳導率，可依循Wiedemann-Franz法則，從導電率換算出，若導電率為75%IACS以上，則熱傳導率為300W/m‧K以上。 When the heat generated from the semiconductor element or the like is absorbed and released to the outside, the conductivity of the copper alloy sheet for the heat dissipating component is preferably more than 75% IACS, and the thermal conductivity exceeds 300 W/m‧K. The thermal conductivity can be converted from the conductivity according to the Wiedemann-Franz rule. If the conductivity is 75% IACS or more, the thermal conductivity is 300 W/m‧K or more.

〈銅合金板的製造方法〉 <Method of Manufacturing Copper Alloy Sheet>

本發明之實施形態之銅合金板，可藉由熔解鑄造、均質化處理、熱軋延、冷軋延、再結晶回火、冷軋延、時效回火、冷軋延之製程而製造。 The copper alloy sheet according to the embodiment of the present invention can be produced by a process of melt casting, homogenization treatment, hot rolling, cold rolling, recrystallization tempering, cold rolling, aging tempering, and cold rolling.

適當的熔解鑄造及熱軋延條件如下所述，藉此可防止粗大之Fe、Fe-P、Fe-P-O等的析出。 The appropriate melt casting and hot rolling conditions are as follows, whereby precipitation of coarse Fe, Fe-P, Fe-P-O, or the like can be prevented.

熔解鑄造，係將Fe添加於1200℃以上的銅合金熔湯並熔解，之後亦將熔湯溫度保持在1200℃以上而鑄造。鑄塊的冷卻，於凝固時(固液共存時)及凝固後，皆以1℃/秒以上的冷卻速度來進行。因此，於連續鑄造或半連續鑄造時，必須充分地有效進行鑄模內的一次冷卻、鑄模正下方的二次冷卻。 In the melt casting, Fe is added to a copper alloy melt of 1200 ° C or higher and melted, and then the melt temperature is maintained at 1200 ° C or higher and cast. The cooling of the ingot is carried out at a cooling rate of 1 ° C /sec or more at the time of solidification (when solid-liquid coexisting) and after solidification. Therefore, in continuous casting or semi-continuous casting, it is necessary to sufficiently perform primary cooling in the mold and secondary cooling directly under the mold.

均質化處理中，將鑄塊於900~1000℃加熱0.5~5小時，並於該溫度開始進行熱軋延。熱軋延結束溫度設為650℃以上，較佳設為700℃以上，熱軋延結束後，立即以20℃/秒以上的冷卻速度進行急冷(較佳為水冷)。 In the homogenization treatment, the ingot is heated at 900 to 1000 ° C for 0.5 to 5 hours, and hot rolling is started at this temperature. The hot rolling end temperature is 650 ° C or higher, preferably 700 ° C or higher, and immediately after the hot rolling is completed, it is rapidly cooled (preferably water-cooled) at a cooling rate of 20 ° C /sec or more.

熱軋延之每1道次的加工率，不僅是熱軋延材料，亦會影響最終製品的韌性、組織的均質化、緊密化。製造本發明之實施形態之散熱零件用銅合金板時，較佳係將熱軋延之每1道次的加工率之平均值設為20%以上，將最大加工率設為25%以上。 The processing rate per hot pass of the hot rolling is not only the hot rolling material, but also affects the toughness of the final product, homogenization and compaction of the structure. When the copper alloy sheet for a heat dissipating component according to the embodiment of the present invention is produced, the average value of the processing ratio per one pass of the hot rolling is preferably 20% or more, and the maximum processing ratio is 25% or more.

該理由如以下所記載。 The reason is as follows.

當施加依據軋延輥所進行的軋壓時，為人所知者，壓縮應力於軋延方向上，作用於從軋延出口側鑄塊的表面至一定深度hc之區域，並且拉伸應力於軋延方向上，作用於從深度hc至鑄塊厚度的中央部之區域。於壓縮應力所作用之區域中，距離表面之深度愈淺，壓縮應力愈大，於拉伸應力所作用之區域中，距離鑄塊厚度的中心愈 近，拉伸應力愈大。 When the rolling according to the rolling roll is applied, it is known that the compressive stress acts on the rolling direction from the surface of the ingot to the depth hc, and the tensile stress is in the rolling direction. In the rolling direction, it acts on the region from the depth hc to the central portion of the thickness of the ingot. In the region where the compressive stress acts, the shallower the depth from the surface, the greater the compressive stress. In the region where the tensile stress acts, the center of the thickness of the ingot is more Recently, the tensile stress is larger.

從壓縮應力改變為拉伸應力之深度hc，可藉由軋延輥徑、軋壓量(軋延輥入口側的厚度-軋延輥出口側的板厚)等之計算來求取(O.G.Muzalevskii：Stal in English,June(1970),p.455)。根據此計算式，當軋延輥徑為一定時，軋壓率愈大，hc愈大。亦即，鑄塊內部之拉伸應力的作用區域變小。 The change from the compressive stress to the depth hc of the tensile stress can be obtained by calculation of the rolling roll diameter and the rolling amount (thickness on the inlet side of the rolling roll - the thickness of the exit side of the rolling roll) (OGMuzalevskii) :Stal in English, June (1970), p. 455). According to this calculation formula, when the rolling roll diameter is constant, the larger the rolling reduction rate, the larger the hc. That is, the action area of the tensile stress inside the ingot becomes small.

於鑄塊中，存在有因縮孔或氣體所造成之微模腔、合金元素的微偏析及中介物等缺陷，此等缺陷，愈接近於鑄塊厚度的中央部愈多。將此等缺陷完全消除者，工業上極難達成。 In the ingot, there are defects such as micro-cavities, alloying elements, micro-segregation and intermediaries caused by shrinkage cavities or gases, and the defects are closer to the central portion of the ingot thickness. The complete elimination of these defects is extremely difficult to achieve in industry.

當為了進行均質化處理而加熱鑄塊時，雖然藉由合金元素的擴散而消除微偏析，但鑄塊內部的微模腔未被消除。反而會藉由均質化處理而形成柯肯特爾孔洞(Kirkendall Void)，使固溶於鑄塊之氣體成分往中介物-母材界面或晶界析出，因此，鑄塊內部的微模腔有增加之傾向。 When the ingot is heated for the homogenization treatment, although the microsegregation is eliminated by the diffusion of the alloying elements, the microcavity inside the ingot is not eliminated. Instead, the Kirkendall Void is formed by homogenization treatment, so that the gas component dissolved in the ingot is precipitated at the interfacial-base metal interface or grain boundary, and therefore, the microcavity cavity inside the ingot is increased. The tendency.

如此，由於在鑄塊內部存在有微模腔及中介物，故為了提高熱軋延材料的內部品質，較佳係提高熱軋延之每1道次的加工率。因此，熱軋延之每1道次的加工率，較佳係平均設為20%以上，最大加工率設為25%以上。尤佳者，熱軋延之每1道次的加工率之平均值為25%以上，最大加工率為30%以上。此外，實際操作上，熱軋延之每1道次的加工率，平均為35%以下，最大加工率為 45%以下。 As described above, since the microcavity and the interposer are present inside the ingot, it is preferable to increase the processing rate per one pass of the hot rolling in order to improve the internal quality of the hot rolled material. Therefore, the processing ratio per pass of the hot rolling is preferably 20% or more on average, and the maximum processing ratio is 25% or more. In addition, the average processing rate per one pass of the hot rolling is 25% or more, and the maximum processing rate is 30% or more. In addition, in practice, the processing rate per hot pass of the hot rolling is 35% or less, and the maximum processing rate is 45% or less.

此外，藉由增大熱軋延之每1道次的加工率，可減少熱軋延道次次數，能夠以更高溫來結束熱軋延。因此，可從更高溫來進行急冷(退火)，而增加熱軋延材料中之合金元素的固溶量。其結果可改善所接續進行之冷軋延及熱處理後之銅合金板(製品)之組織的均一性，而能夠得到良好的彎折加工性、拉製加工性及伸展加工性。 Further, by increasing the processing rate per one pass of the hot rolling, the number of hot rolling delays can be reduced, and the hot rolling can be terminated at a higher temperature. Therefore, quenching (annealing) can be performed from a higher temperature, and the amount of solid solution of the alloying elements in the hot rolled material can be increased. As a result, the uniformity of the structure of the copper alloy sheet (product) after the cold rolling and the heat treatment which are successively performed can be improved, and good bending workability, drawing workability, and stretch workability can be obtained.

另一方面，於熱軋延的初期，對鑄塊施加較大的軋壓時，有時會於鑄塊之端面附近的軋延面產生破裂。因此，實際操作上，從熱軋延的第1道次至第3道次為止，一般是進行輕加工率的軋延。 On the other hand, when a large rolling pressure is applied to the ingot at the initial stage of the hot rolling, cracking may occur in the rolling surface near the end surface of the ingot. Therefore, in actual operation, from the first pass to the third pass of the hot rolling, the rolling rate of the light working rate is generally performed.

然而，於熱軋延的初期持續進行輕加工率的軋延道次時，於每一軋延道次，拉伸應力作用於從前述深度hc至鑄塊中央為止之區域，使鑄塊內部的微模腔或中介物-母材界面的間隙增大，而產生細微的破裂。然後，即使增大每1道次的加工率，已產生之破裂的壓著延遲，導致熱軋延材料的內部品質降低。對如此的熱軋延材料進行冷軋延及熱處理所製造之銅合金板，難以進行彎折R較小之寬幅彎折、摺邊彎折、拉製加工及伸展加工等之嚴苛的加工。 However, when the rolling rate of the light working rate is continued in the initial stage of the hot rolling, the tensile stress acts on the region from the depth hc to the center of the ingot at each rolling pass, so that the inside of the ingot is The gap between the microcavity cavity or the intermediate-base material interface is increased to cause a fine crack. Then, even if the processing rate per pass is increased, the crushing delay of the generated crack is delayed, resulting in a decrease in the internal quality of the hot rolled material. For the copper alloy sheet produced by cold rolling and heat treatment of such a hot rolled material, it is difficult to perform severe processing such as wide bending, hemming bending, drawing processing, and stretching processing with a small bending R. .

因此，製造本發明之實施形態之散熱零件用銅合金板時，較佳係將熱軋延的初期，具體而言為第1道次至第3道次為止之平均的加工率設為10%以上35%以下。第1道次至第3道次為止之平均的加工率，尤佳設為12%以上30%以下，更佳設為15%以上25%以下。 Therefore, in the case of producing the copper alloy sheet for a heat dissipating component according to the embodiment of the present invention, it is preferable to set the average processing ratio of the first pass to the third pass to 10% in the initial stage of the hot rolling. Above 35%. The average processing ratio from the first pass to the third pass is preferably 12% or more and 30% or less, more preferably 15% or more and 25% or less.

當增大熱軋延初期的加工率時，容易產生鑄塊的熱軋延破裂，為了避免此情形，於第1道次開始前，較佳係藉由磨邊器將鑄塊端面進行軋延。藉由活用磨邊器，可增大軋延初期的加工率，並防止或減少軋延初期之內部破裂的產生。 When the processing rate at the initial stage of hot rolling is increased, hot rolling cracking of the ingot is likely to occur. In order to avoid this, it is preferred to roll the end face of the ingot by an edger before the start of the first pass. . By utilizing the edging device, the processing rate at the initial stage of rolling can be increased, and the occurrence of internal cracking at the initial stage of rolling can be prevented or reduced.

於熱軋延後，削除雙面並以適當的軋延率進行冷軋延。 After the hot rolling is delayed, both sides are removed and cold rolling is performed at an appropriate rolling rate.

再結晶回火，係在連續回火爐中於600℃~850℃的溫度範圍加熱5~30秒，以使再結晶回火後的平均結晶粒徑未達20μm。此再結晶回火，係用以改善銅合金板(製品)的伸長率及彎折加工性而進行。當再結晶回火的溫度未達600℃或保持時間未達5秒時，再結晶不足，使銅合金板(製品)的彎折加工性劣化。另一方面，當再結晶回火的溫度超過850℃或保持時間超過30秒時，再結晶粒粗大化(平均結晶粒徑粗大化至20μm以上)，銅合金板(製品)無法得到充分的強度。再者，於寬幅的彎折中，彎折加工性劣化。 The recrystallization tempering is carried out in a continuous tempering furnace at a temperature ranging from 600 ° C to 850 ° C for 5 to 30 seconds so that the average crystal grain size after recrystallization and tempering is less than 20 μm. This recrystallization tempering is carried out to improve the elongation and bending workability of the copper alloy sheet (product). When the temperature of recrystallization tempering is less than 600 ° C or the holding time is less than 5 seconds, recrystallization is insufficient to deteriorate the bending workability of the copper alloy sheet (product). On the other hand, when the temperature of the recrystallization tempering exceeds 850 ° C or the holding time exceeds 30 seconds, the recrystallized grains are coarsened (the average crystal grain size is coarsened to 20 μm or more), and the copper alloy sheet (product) cannot obtain sufficient strength. . Further, in the wide bending, the bending workability is deteriorated.

於再結晶回火後，可視需要進行冷軋延。進行此冷軋延時，該加工率，以在後述精製冷軋延中得到既定的加工率及製品板後之方式，可在0~40%的範圍內適當地設定。 After recrystallization and tempering, cold rolling can be carried out as needed. This cold rolling delay is performed, and the processing rate can be appropriately set within a range of 0 to 40% in such a manner that a predetermined processing ratio and a product sheet are obtained in the finish cooling and rolling described later.

接著進行時效回火。時效回火的條件，較佳係於400~575℃進行1~10小時之範圍內。當時效處理的溫度未達400℃或保持時間未達1小時時，析出不足，無法提升銅合 金板(製品)的導電率。另一方面，當時效處理的溫度超過575℃或保持時間超過10小時時，析出物粗大化，銅合金板(製品)無法得到充分的強度。 Then aging and tempering. The aging and tempering conditions are preferably in the range of 1 to 10 hours at 400 to 575 °C. When the temperature of the aging treatment is less than 400 ° C or the holding time is less than 1 hour, the precipitation is insufficient and the copper bonding cannot be improved. The conductivity of the gold plate (product). On the other hand, when the temperature of the aging treatment exceeds 575 ° C or the holding time exceeds 10 hours, the precipitates are coarsened, and the copper alloy sheet (product) cannot obtain sufficient strength.

時效回火後，進行精製的冷軋延至目標板厚為止。軋延率，可因應目標之製品強度，設定在30~85%。 After aging and tempering, the cold rolling for refining is extended until the target thickness is reached. The rolling rate can be set at 30~85% depending on the product strength of the target.

精製冷軋延後，可視需要進行短時間回火。此短時間回火的條件，設為於250~450℃進行3~40秒。藉由在此條件下進行短時間回火，以消除精製冷軋延中所導入之應變。此外，於此條件下，材料不會軟化，強度的降低少。 After the fine cooling and rolling, short-time tempering can be performed as needed. The conditions for this short-term tempering are set at 250 to 450 ° C for 3 to 40 seconds. By performing short-term tempering under these conditions, the strain introduced in the fine cooling rolling is eliminated. In addition, under these conditions, the material does not soften and the strength is reduced less.

〈銅合金板的表面被覆層〉 <Surface coating of copper alloy sheet>

藉由電鍍等將表面被覆層形成於銅合金板，藉此可提升散熱零件的耐蝕性，即使於嚴苛環境下，亦可防止作為散熱零件之性能的降低。 By forming a surface coating layer on a copper alloy plate by plating or the like, the corrosion resistance of the heat dissipating component can be improved, and the performance as a heat dissipating component can be prevented from being lowered even in a severe environment.

形成於銅合金板的表面之表面被覆層，較佳為Sn層。Sn層的厚度未達0.2μm時，耐蝕性的改善不足，超過5μm時，生產性降低而導致成本上升。因此，Sn層的厚度設為0.2~5μm。Sn層，包含Sn金屬及Sn合金。 The surface coating layer formed on the surface of the copper alloy sheet is preferably a Sn layer. When the thickness of the Sn layer is less than 0.2 μm, the improvement in corrosion resistance is insufficient, and when it exceeds 5 μm, the productivity is lowered to cause an increase in cost. Therefore, the thickness of the Sn layer is set to 0.2 to 5 μm. The Sn layer contains a Sn metal and a Sn alloy.

表面被覆層，亦可於Sn層的下方形成Cu-Sn合金層。當Cu-Sn合金層的厚度超過3μm時，彎折加工性等會降低，所以將Cu-Sn合金層的厚度設為3μm以下。此外，較佳係將Cu-Sn合金層的厚度設為0.1μm以上。此時，Sn層的厚度設為0~5μm(包含無Sn層之情形)，並將Cu-Sn 合金層與Sn層的合計厚度設為0.2μm以上。該合計厚度的上限設為8μm。 The surface coating layer may also form a Cu-Sn alloy layer under the Sn layer. When the thickness of the Cu—Sn alloy layer exceeds 3 μm, the bending workability and the like are lowered. Therefore, the thickness of the Cu—Sn alloy layer is set to 3 μm or less. Further, it is preferable to set the thickness of the Cu-Sn alloy layer to 0.1 μm or more. At this time, the thickness of the Sn layer is set to 0 to 5 μm (including the case where there is no Sn layer), and Cu-Sn is The total thickness of the alloy layer and the Sn layer is set to 0.2 μm or more. The upper limit of the total thickness is set to 8 μm.

本說明書中，「Cu-Sn合金層的厚度」，為使用螢光X射線膜厚計，測定Cu-Sn合金層中的Sn量所得到之Sn換算厚度。 In the present specification, the "thickness of the Cu-Sn alloy layer" is a thickness in terms of Sn obtained by measuring the amount of Sn in the Cu-Sn alloy layer using a fluorescent X-ray film thickness meter.

前述Cu-Sn合金層，可暴露於表面(參考日本特開2006-183068號公報、日本特開2013-185193號公報等)。Cu-Sn合金層，由於為較硬的Hv：200~400，所以具有因處理所帶來的抑制損傷效果。Cu-Sn合金層的表面暴露率(Cu-Sn合金層於材料表面的每單位面積所暴露之表面積乘上100後之值)，可為100%或0%，較佳為50%以下。於Cu-Sn合金層上無Sn層時(Sn層的厚度為零)，Cu-Sn合金層的表面暴露率為100%。Cu-Sn合金層未暴露時，Cu-Sn合金層的表面暴露率為0%。 The Cu-Sn alloy layer can be exposed to the surface (refer to JP-A-2006-183068, JP-A-2013-185193, etc.). Since the Cu-Sn alloy layer is a hard Hv: 200 to 400, it has a damage suppression effect by the treatment. The surface exposure of the Cu-Sn alloy layer (the value obtained by multiplying the surface area per unit area exposed by the Cu-Sn alloy layer on the surface of the material by 100) may be 100% or 0%, preferably 50% or less. When there is no Sn layer on the Cu-Sn alloy layer (the thickness of the Sn layer is zero), the surface exposure rate of the Cu-Sn alloy layer is 100%. When the Cu-Sn alloy layer was not exposed, the surface exposure rate of the Cu-Sn alloy layer was 0%.

於Cu-Sn合金層的下方，更可形成由Ni、Co、Fe、Ni-Co合金及Ni-Fe合金中的任一種所構成之電鍍層來作為底層。當此電鍍層的厚度超過3μm時，彎折加工性等會降低，所以該厚度設為3μm以下。此電鍍層的厚度較佳為0.1μm以上。 Below the Cu-Sn alloy layer, a plating layer composed of any one of Ni, Co, Fe, Ni-Co alloy, and Ni-Fe alloy may be formed as the underlayer. When the thickness of the plating layer exceeds 3 μm, the bending workability and the like are lowered, so the thickness is set to 3 μm or less. The thickness of this plating layer is preferably 0.1 μm or more.

可形成僅由Ni、Co、Fe、Ni-Co合金及Ni-Fe合金中的任一種所構成之電鍍層(不含Cu-Sn合金層及/或Sn層)，作為表面被覆層。此電鍍層的厚度，從防止彎折加工性等的劣化之觀點來看，皆設為3μm以下。此電鍍層的厚度較佳為0.1μm以上。 A plating layer (excluding a Cu-Sn alloy layer and/or a Sn layer) composed of only Ni, Co, Fe, a Ni-Co alloy, and a Ni-Fe alloy can be formed as a surface coating layer. The thickness of the plating layer is set to 3 μm or less from the viewpoint of preventing deterioration of bending workability and the like. The thickness of this plating layer is preferably 0.1 μm or more.

上述各表面被覆層，可藉由電解電鍍、回焊電鍍、無電解電鍍、濺鍍等來形成。Cu-Sn合金層，可對母材的銅合金板施以Sn電鍍，或是對銅合金母材施以Cu電鍍及Sn電鍍後，進行回焊處理等，使Cu與Sn反應而形成。回焊處理的加熱條件，設為230~600℃×5~30秒。 Each of the surface coating layers described above can be formed by electrolytic plating, reflow plating, electroless plating, sputtering, or the like. The Cu-Sn alloy layer can be formed by applying Sn plating to the copper alloy plate of the base material, or performing Cu plating and Sn plating on the copper alloy base material, performing reflow processing or the like, and reacting Cu with Sn. The heating conditions for the reflow treatment are set to 230 to 600 ° C for 5 to 30 seconds.

[實施例1] [Example 1]

於小型電爐中，在大氣中熔解表1的No.1~23所示之組成的銅合金，並熔製為厚度50mm、長度80mm、寬度200mm的鑄塊。然後於950℃加熱此鑄塊1小時後，軋延至厚度12mm為止，立即浸漬於水中以進行急冷。熱軋延結束溫度為750℃。熱軋延輥，使用輥徑：450mmΦ者。熱軋延的道次規劃，係設為5道次精製，為50mm→42mm(16.0%)→34mm(19.0%)→26mm(23.5%)→18mm(30.8%)→12mm(33.3%)。括弧內表示加工率。No.1~23之銅合金的氫含量為0.5~1.0質量ppm，氧含量為4~18質量ppm。 In a small electric furnace, a copper alloy having the composition shown in Nos. 1 to 23 of Table 1 was melted in the atmosphere and melted into an ingot having a thickness of 50 mm, a length of 80 mm, and a width of 200 mm. Then, the ingot was heated at 950 ° C for 1 hour, rolled to a thickness of 12 mm, and immediately immersed in water to be quenched. The hot rolling end temperature was 750 °C. Hot rolling roll, using roller diameter: 450mm Φ. The pass plan of the hot rolling is set to 5 times of refining, which is 50 mm → 42 mm (16.0%) → 34 mm (19.0%) → 26 mm (23.5%) → 18 mm (30.8%) → 12 mm (33.3%). The machining rate is indicated in brackets. The copper alloy of No. 1 to 23 has a hydrogen content of 0.5 to 1.0 mass ppm and an oxygen content of 4 to 18 mass ppm.

[表1] [Table 1]

接著將熱軋延材料的雙面分別削除約1mm以去除氧化膜，並進行冷軋延。 Next, both sides of the hot rolled material were respectively removed by about 1 mm to remove the oxide film, and cold rolling was performed.

然後進行720℃×20秒的再結晶回火。再結晶回火後的板材進行水冷。於再結晶回火後，於板表面上所測定之平 均結晶粒徑(藉由JISH0501所規定之切斷法於軋延平行方向上進行測定)，皆未達20μm。 Then, recrystallization tempering was performed at 720 ° C for 20 seconds. The plate after recrystallization and tempering is water-cooled. After recrystallization and tempering, the flatness measured on the surface of the board The average crystal grain size (measured by the cutting method defined by JISH0501 in the rolling parallel direction) was less than 20 μm.

接著在進行加工率35%的冷軋延後，於500℃×2小時的條件下進行時效回火。接著以稀硫酸液去除表面氧化物後，進行加工率50%的精製冷軋延，而製作出厚度0.2mm的銅合金條。精製冷軋延後，於350℃進行30秒的短時間回火。 Next, after performing a cold rolling elongation of 35% of the working rate, aging tempering was carried out under conditions of 500 ° C × 2 hours. Subsequently, the surface oxide was removed with a dilute sulfuric acid solution, and then a cold rolling was performed at a processing rate of 50% to prepare a copper alloy strip having a thickness of 0.2 mm. After the fine cooling and rolling, a short time tempering was performed at 350 ° C for 30 seconds.

然後對與No.1為相同組成之銅合金(No.24)，以不同的道次規劃來實施熱軋延。 Then, for the copper alloy (No. 24) having the same composition as No. 1, the hot rolling was performed in a different pass plan.

No.24的道次規劃，係設為10道次精製，以50mm→46mm(8.0%)→41mm(10.9%)→36mm(12.2%)→31mm(13.9%)→26mm(16.1%)→22mm(15.4%)→19mm(13.6%)→16mm(15.8%)→14mm(12.5%)→12mm(14.3%)來實施。括弧內表示加工率，每1道次的加工率之平均值為13.3%。5道次結束後，再次***於950℃的爐而升溫，於10道次結束後，浸漬於水中以進行急冷。10道次結束不久後之熱軋延材料的溫度為810℃。No.24中，熱軋延以外之製程的條件與No.1~23相同。No.24中，於再結晶回火後，於板表面上所測定之平均結晶粒徑未達20μm(測定方法與先前所說明之方法相同)。 No.24's pass plan is set to 10 times of refining, from 50mm → 46mm (8.0%) → 41mm (10.9%) → 36mm (12.2%) → 31mm (13.9%) → 26mm (16.1%) → 22mm (15.4%)→19mm (13.6%)→16mm (15.8%)→14mm (12.5%)→12mm (14.3%) were implemented. The processing ratio is indicated in parentheses, and the average processing rate per pass is 13.3%. After the completion of the 5 passes, the furnace was again inserted into a furnace at 950 ° C to raise the temperature, and after 10 passes, it was immersed in water to be quenched. The temperature of the hot rolled material shortly after the end of 10 passes was 810 °C. In No. 24, the conditions of the process other than the hot rolling were the same as those of Nos. 1 to 23. In No. 24, after recrystallization tempering, the average crystal grain size measured on the surface of the plate was less than 20 μm (the measurement method was the same as that described previously).

以經由以上製程所得到之銅合金條(製品板)作為試驗材料，並藉由下述要領來測定機械特性、導電率、彎折臨限寬度、及焊接性並進行評估。此外，依循Wiedemann-Franz法則，從導電率換算出熱傳導率。 The copper alloy strip (product sheet) obtained through the above process was used as a test material, and mechanical properties, electrical conductivity, bending margin width, and weldability were measured and evaluated by the following methods. In addition, according to the Wiedemann-Franz rule, the thermal conductivity is converted from the conductivity.

此等結果如表2所示。 These results are shown in Table 2.

〈機械特性〉 <Mechanical characteristics>

從各試驗材料中，以使長邊方向平行及垂直於軋延方向之方式採集JIS5號試驗片，並根據JISZ2241的規定來進行拉伸試驗，測定平行於軋延方向之方向(∥)及垂直於軋延方向之方向(⊥)上的拉伸強度、降伏強度及伸長率。 JIS No. 5 test piece was collected from each of the test materials so that the longitudinal direction was parallel and perpendicular to the rolling direction, and the tensile test was performed in accordance with the regulation of JIS Z 2241, and the direction parallel to the rolling direction (∥) and the vertical direction were measured. Tensile strength, lodging strength and elongation in the direction of rolling direction (⊥).

〈導電率〉 <Conductivity>

導電率，係根據JISH0505的規定來測定。電阻的測定，係以使用雙橋接之四端子法來進行。 The conductivity was measured in accordance with the regulations of JISH0505. The measurement of the resistance was carried out using a four-terminal method using double bridge.

〈90度彎折的彎折臨限寬度〉 <90 degree bend bending margin width>

從試驗材料中，製作出長30mm、寬10~100mm(寬10、15、20、25…每隔5mm至100mm為止)之寬度不同的4角形試驗片(各寬度分別為3個)。試驗片之長度30mm的邊之方向，設為平行於試驗材料的軋延方向。使用此試驗片，將第1圖所示之V字模塊1及按壓模具2設置在油壓模壓機，將彎折半徑R與板厚t之比R/t設為0.5，並將彎折線(第1圖中垂直於紙面之方向)的方向設為試驗片3的寬度方向(Good Way彎折)，以進行90度彎折。V字模塊1及按壓模具2的寬度(第1圖中垂直於紙面之方向上的厚度)設為120mm。此外，油壓模壓機的荷重，設為試驗片的寬度每10mm為1000kgf(9800N)。 From the test materials, four-corner test pieces each having a width of 30 mm and a width of 10 to 100 mm (widths of 10, 15, 20, 25 ... every 5 mm to 100 mm) were produced (three for each width). The direction of the side of the test piece having a length of 30 mm was set to be parallel to the rolling direction of the test material. Using this test piece, the V-shaped module 1 and the pressing die 2 shown in Fig. 1 were placed in a hydraulic press, and the ratio R/t of the bending radius R to the thickness t was set to 0.5, and the bending line was set. The direction (the direction perpendicular to the paper surface in Fig. 1) is set to the width direction (Good Way bend) of the test piece 3 to perform the 90-degree bending. The width of the V-shaped module 1 and the pressing mold 2 (the thickness in the direction perpendicular to the paper surface in Fig. 1) was set to 120 mm. Further, the load of the hydraulic press was set to 1000 kgf (9800 N) per 10 mm of the width of the test piece.

彎折試驗後，以100倍的光學顯微鏡來觀察試驗片的彎折部外側全長，以3個試驗片全部皆未觀察到1處的破裂者為合格，除此之外為不合格。將合格之試驗片的最大寬度設為該試驗材料的彎折臨限寬度。 After the bending test, the entire outer side of the bent portion of the test piece was observed with a 100-fold optical microscope, and the crack of one of the three test pieces was not observed as one pass, and the other was unacceptable. The maximum width of the qualified test piece was set to the bending margin width of the test material.

〈密著彎折的彎折臨限寬度〉 <Bending and bending width of dense bending>

以與90度彎折為相同之方法，從試驗材料中，製作出長30mm、寬5~50mm(寬5、10、15、20…每隔5mm至50mm為止)之寬度不同的4角形試驗片(各寬度分別為3個)。試驗片之長度30mm的邊之方向，設為平行於軋延方向。使用此試驗片，將彎折半徑R與板厚t之比R/t設為2.0，並將彎折線的方向設為試驗片的寬度方向(Good Way)，依循JISZ2248的規定，大致彎折至170度為止後，進行密著彎折。 A 4-sided test piece having a width of 30 mm and a width of 5 to 50 mm (widths of 5, 10, 15, 20, ..., every 5 mm to 50 mm) is produced from the test material in the same manner as the 90-degree bending. (each width is 3). The direction of the side of the test piece having a length of 30 mm was set to be parallel to the rolling direction. Using this test piece, the ratio R/t of the bending radius R to the thickness t was set to 2.0, and the direction of the bending line was set to the width direction of the test piece (Good Way), and was roughly bent according to the regulation of JIS Z2248. After 170 degrees, a close bend is made.

彎折試驗後，以100倍的光學顯微鏡來觀察彎折部之破裂的有無，以3個試驗片全部皆未觀察到1處的破裂者為合格，除此之外為不合格。將合格之試驗片的最大寬度設為該試驗材料的彎折臨限寬度。 After the bending test, the presence or absence of cracking of the bent portion was observed with a 100-fold optical microscope, and it was found that none of the three test pieces failed to be observed at one place, and otherwise it was unacceptable. The maximum width of the qualified test piece was set to the bending margin width of the test material.

〈焊接性評估〉 <welding evaluation>

使用Sn-3Ag-0.5Cu焊錫來實施依據弧面狀沾錫試驗法之焊錫浸潤試驗。將活性助焊劑浸漬塗佈在加工為10mm×30mm的大小之試驗片後，浸漬在浴溫設為265℃之焊錫浴中(浸漬速度：25mm/sec、浸漬深度：12mm、浸漬 時間：5.0sec)，並測定零交叉時間(焊錫浸潤時間)。焊錫浸潤時間未達1.5秒者評估為合格(○)，1.5秒以上者評估為不合格(×)。 The solder infiltration test according to the arc-shaped soldering test method was carried out using Sn-3Ag-0.5Cu solder. The active flux was dip-coated on a test piece of a size of 10 mm × 30 mm, and then immersed in a solder bath having a bath temperature of 265 ° C (immersion speed: 25 mm/sec, immersion depth: 12 mm, dipping) Time: 5.0 sec), and the zero crossing time (solder infiltration time) was measured. Those whose solder infiltration time is less than 1.5 seconds are evaluated as qualified (○), and those who are 1.5 seconds or longer are evaluated as unacceptable (×).

如表1、表2所示，具有本發明之實施形態所規定的合金組成，且熱軋延的道次規畫位於較佳範圍內(每1道次的加工率之平均值為20%以上，最大加工率為25%以上)之No.1~14，其拉伸強度、降伏強度、伸長率、導電率、90度彎折及密著彎折的彎折臨限寬度，滿足本發明之實施形態的規定。 As shown in Tables 1 and 2, the alloy composition specified in the embodiment of the present invention has a hot rolling schedule in a preferred range (the average processing rate per pass is 20% or more). No. 1 to 14 having a maximum processing ratio of 25% or more, the tensile strength, the elongation strength, the elongation, the electrical conductivity, the 90-degree bending, and the bending margin width of the dense bending satisfy the present invention. The provisions of the embodiment.

另一方面，不具有本發明之實施形態所規定的合金組成之No.15~23，以及熱軋延的道次規畫脫離較佳範圍之No.24，其拉伸強度、降伏強度、伸長率、導電率、90度彎折及密著彎折的彎折臨限寬度、以及焊接性中的任1項以上，未滿足本發明之實施形態的規定。 On the other hand, No. 15 to 23, which does not have the alloy composition specified in the embodiment of the present invention, and No. 24, which has a hot rolling pass, which is out of the preferred range, has tensile strength, lodging strength, and elongation. Any one or more of the rate, the electrical conductivity, the 90-degree bending, the bending-limited width of the adhesive bending, and the weldability do not satisfy the specifications of the embodiment of the present invention.

No.15，Fe含量過剩，導電率及熱傳導率低。 No. 15, the Fe content is excessive, and the electrical conductivity and thermal conductivity are low.

No.16，Fe含量不足，拉伸強度及降伏強度低，且導電率及熱傳導率低。 No. 16, the content of Fe is insufficient, the tensile strength and the drop strength are low, and the electrical conductivity and thermal conductivity are low.

No.17，P含量過剩，導電率及熱傳導率低。 No. 17, P content is excessive, and electrical conductivity and thermal conductivity are low.

No.18，P含量不足，拉伸強度及降伏強度低。 No. 18, P content is insufficient, and tensile strength and lodging strength are low.

No.19，Zn含量過剩，導電率及熱傳導率低。 No. 19, the Zn content is excessive, and the electrical conductivity and thermal conductivity are low.

No.20，Zn含量不足，焊接性差。 No. 20, the Zn content was insufficient, and the weldability was poor.

No.21，Sn含量過剩，導電率及熱傳導率低，且90度彎折及密著彎折的彎折臨限寬度亦差。 No. 21, excess Sn content, low electrical conductivity and thermal conductivity, and the bending width of the 90-degree bend and the tight bend are also poor.

No.22，Sn含量不足，拉伸強度及降伏強度低。 No. 22, the Sn content was insufficient, and the tensile strength and the fall strength were low.

No.23，副成分的合計含量過剩，導電率及熱傳導率低。 No. 23, the total content of the subcomponents was excessive, and the electrical conductivity and thermal conductivity were low.

No.24，由於熱軋延的道次規畫脫離較佳範圍，所以 90度彎折及密著彎折的彎折臨限寬度小。 No.24, since the hot rolling schedule is out of the better range, The 90 degree bend and the tight bend have a small width.

[實施例2] [Embodiment 2]

熔解表3所示之組成(2種)的銅合金，並熔製為厚度200mm、寬度500mm、長度5000mm的鑄塊。然後於950℃加熱此鑄塊1小時後，軋延至厚度12mm為止，立即浸漬於水中以進行急冷。熱軋延結束溫度為750℃。每經過熱軋延的一道次，板厚逐漸變薄，熱軋延的溫度降低逐漸增大。熱軋延結束時之熱軋延材料的長度成為超過80m之長度，熱軋延結束溫度於兩端上雖為不同，惟前述熱軋延結束溫度為當中較低者之端部上所測定的溫度。本實施例中，兩端部上之熱軋延結束溫度的差約20℃。熱軋延的道次規劃，係設為9道次精製，以200mm→177mm(11.5%)→156mm(11.9%)→123mm(21.2%)→98mm(20.3%)→72mm(26.5%)→46mm(36.1%)→27mm(41.3%)→18mm(33.3%)→12mm(33.3%)來實施。括弧內表示加工率，每1道次的加工率之平均值為26.2%。 The copper alloy of the composition (two kinds) shown in Table 3 was melted and melted into an ingot having a thickness of 200 mm, a width of 500 mm, and a length of 5000 mm. Then, the ingot was heated at 950 ° C for 1 hour, rolled to a thickness of 12 mm, and immediately immersed in water to be quenched. The hot rolling end temperature was 750 °C. Each time the hot rolling is performed, the thickness of the sheet is gradually thinned, and the temperature of the hot rolling is gradually decreased. The length of the hot rolled material at the end of the hot rolling is more than 80 m, and the hot rolling end temperature is different at both ends, but the hot rolling end temperature is determined at the lower end. temperature. In this embodiment, the difference in the hot rolling end temperature at both end portions is about 20 °C. The hot rolling schedule is set to 9 passes, 200mm → 177mm (11.5%) → 156mm (11.9%) → 123mm (21.2%) → 98mm (20.3%) → 72mm (26.5%) → 46mm (36.1%) → 27 mm (41.3%) → 18 mm (33.3%) → 12 mm (33.3%) was carried out. The processing ratio is indicated in parentheses, and the average processing rate per pass is 26.2%.

接著將熱軋延材料的雙面分別削除約1mm以去除氧化膜，並進行冷軋延。 Next, both sides of the hot rolled material were respectively removed by about 1 mm to remove the oxide film, and cold rolling was performed.

將2種冷軋延材料分別分為3個(No.25~27、28~30)，No.25、28係進行720℃×20秒的再結晶回火及水冷，No.26、29不進行再結晶回火及水冷，No.27、30進行920℃×30秒的再結晶回火及水冷。於此階段中，測定No.25~30之板表面的平均結晶粒徑(藉由JISH0501所規定 之切斷法於軋延平行方向上進行測定)。於適當的條件下進行再結晶回火之No.25、27的平均結晶粒徑為10μm，未進行再結晶回火之No.26、29，由於維持纖維組織，所以無法測定平均結晶粒徑。此外，再結晶回火的溫度過高之No.27、30的平均結晶粒徑為30μm，較適當水準(未達20μm)大。 The two kinds of cold rolled materials are divided into three (No. 25~27, 28~30), and No.25 and 28 are recrystallized and tempered at 720 °C for 20 seconds, and water cooling. No.26,29 Recrystallization tempering and water cooling were carried out, and No. 27 and 30 were subjected to recrystallization tempering and water cooling at 920 ° C for 30 seconds. In this stage, the average crystal grain size of the surface of No. 25-30 was determined (as specified by JISH0501). The cutting method is performed in the parallel direction of rolling. No. 25 and 27 which were recrystallized and tempered under appropriate conditions had an average crystal grain size of 10 μm, and No. 26 and 29 which were not subjected to recrystallization and tempering. Since the fiber structure was maintained, the average crystal grain size could not be measured. Further, the average crystal grain size of No. 27 and 30 in which the temperature of recrystallization tempering was too high was 30 μm, which was larger than an appropriate level (less than 20 μm).

接著對No.25~30的板材，以與[實施例1]相同之製程及條件來進行冷軋延、時效回火、酸洗、精製冷軋延及短時間回火。 Next, the sheets of Nos. 25 to 30 were subjected to cold rolling, aging tempering, pickling, fine cooling and rolling, and short-time tempering in the same processes and conditions as in [Example 1].

以No.25~30的銅合金條(製品板)作為試驗材料，並藉由與實施例1相同之要領來測定機械特性、導電率、彎折臨限寬度、及焊接性並進行評估。此外，依循Wiedemann-Franz法則，從導電率換算出熱傳導率。此等結果如表4所示。 A copper alloy strip (product sheet) of No. 25 to 30 was used as a test material, and mechanical properties, electrical conductivity, bending margin width, and weldability were measured and evaluated by the same method as in Example 1. In addition, according to the Wiedemann-Franz rule, the thermal conductivity is converted from the conductivity. These results are shown in Table 4.

[表4] [Table 4]

No.25~30，皆具有本發明之實施形態所規定的合金組成。如表4所示，於適當的條件下進行再結晶回火之No.25、28，其拉伸強度、降伏強度、伸長率、導電率、90度彎折及密著彎折的彎折臨限寬度，滿足本發明之實施形態的規定。另一方面，未進行再結晶回火之No.25、28，及再結晶回火的條件不適當之No.26、29，其90度彎折及密著彎折的彎折臨限寬度，未滿足本發明之實施形態的規定。 No. 25 to 30 have the alloy composition defined in the embodiment of the present invention. As shown in Table 4, No. 25 and 28, which were subjected to recrystallization and tempering under appropriate conditions, were subjected to tensile strength, lodging strength, elongation, electrical conductivity, 90-degree bending, and bending of a dense bend. The width is limited to satisfy the requirements of the embodiments of the present invention. On the other hand, No. 25 and 28 which are not subjected to recrystallization and tempering, and No. 26 and 29 which are not suitable for recrystallization and tempering, the 90-degree bending and the bending margin limit of the dense bending, The provisions of the embodiments of the present invention are not satisfied.

[實施例3] [Example 3]

接著以表1所示之No.7的銅合金條(製品板)作為試驗材料，分別以既定厚度對表面施以Ni電鍍、Cu電鍍、Sn電鍍、及Ni-Co合金電鍍的1種或2種以上。此等皆為電解電鍍，各電鍍的電鍍浴組成及電鍍條件如表5所示，各電鍍層的厚度如表6所示。 Next, a copper alloy strip (product sheet) of No. 7 shown in Table 1 was used as a test material, and one or two of Ni plating, Cu plating, Sn plating, and Ni-Co alloy plating were applied to the surface at a predetermined thickness. More than one species. These are all electrolytic plating, the plating bath composition and plating conditions of each plating are shown in Table 5, and the thickness of each plating layer is shown in Table 6.

表6的No.31~33、36、37、39~42，係在進行Ni電鍍或Ni-Co電鍍後(或不進行)，進行Cu電鍍及Sn電鍍，接著施以回焊處理。各電鍍層的厚度為施以回焊處理後的厚度。回焊處理，以450℃×15秒來實施，接續於回焊處理之冷卻係構成為水冷。此係由於回焊處理為一般條件者。No.31~33、36、37、39~42的Cu-Sn層，是藉由回焊處理使Cu電鍍的Cu與Sn電鍍的Sn反應所形成者。Cu電鍍藉由回焊處理而被消滅。 No. 31 to 33, 36, 37, and 39 to 42 of Table 6 were subjected to Ni plating or Ni-Co plating (or not), and Cu plating and Sn plating were performed, followed by reflow processing. The thickness of each plating layer is the thickness after the reflow treatment. The reflow process is carried out at 450 ° C for 15 seconds, and the cooling system following the reflow process is configured to be water-cooled. This is because the reflow process is a general condition. The Cu-Sn layers of No. 31 to 33, 36, 37, and 39 to 42 are formed by reacting Cu electroplated Cu with Sn-plated Sn by a reflow process. Cu plating is destroyed by reflow processing.

表6的No.38，係進行Ni電鍍、Cu電鍍及Sn電鍍者，隨 著時間的經過，Cu電鍍的Cu與Sn電鍍的Sn反應而形成Cu-Sn合金層，使Cu電鍍被消滅。Sn電鍍層的厚度為Cu電鍍被消滅後的厚度。 No. 38 in Table 6 is for Ni plating, Cu plating, and Sn plating. After the passage of time, Cu electroplated Cu reacts with Sn-plated Sn to form a Cu-Sn alloy layer, and Cu plating is eliminated. The thickness of the Sn plating layer is the thickness after the Cu plating is extinguished.

各電鍍層的厚度測定以下述方法來進行。 The thickness of each plating layer was measured by the following method.

〈Sn層〉 <Sn layer>

首先使用螢光X射線膜厚計(Seiko Instruments股份有限公司；型式SFT3200)，測定Sn層合計厚度(包含Cu-Sn合金層之Sn層合計厚度)。然後浸漬在以對硝基酚及氫氧化鈉為主成分之剝離液10分鐘，剝離Sn層後，使用螢光X射線膜厚計，來測定Cu-Sn合金層中的Sn量。從如此求取之Sn層合計厚度中減去Cu-Sn合金層中的Sn量，藉此算出Sn層厚度。 First, a total thickness of the Sn layer (including the total thickness of the Sn layer of the Cu-Sn alloy layer) was measured using a fluorescent X-ray film thickness meter (Seiko Instruments Co., Ltd.; type SFT3200). Then, the mixture was immersed in a stripping solution containing p-nitrophenol and sodium hydroxide as a main component for 10 minutes, and the Sn layer was peeled off, and then the amount of Sn in the Cu-Sn alloy layer was measured using a fluorescent X-ray film thickness meter. The thickness of the Sn layer was calculated by subtracting the amount of Sn in the Cu-Sn alloy layer from the total thickness of the Sn layer thus obtained.

〈Cu-Sn合金層〉 <Cu-Sn alloy layer>

浸漬在以對硝基酚及氫氧化鈉為主成分之剝離液10分鐘，剝離Sn層後，使用螢光X射線膜厚計，來測定Cu-Sn合金層中的Sn量。Cu-Sn合金層的厚度為Sn換算厚度。 After immersing in a peeling liquid containing p-nitrophenol and sodium hydroxide as a main component for 10 minutes, the Sn layer was peeled off, and the amount of Sn in the Cu-Sn alloy layer was measured using a fluorescent X-ray film thickness meter. The thickness of the Cu-Sn alloy layer is a thickness in terms of Sn.

〈Ni層及Ni-Co層〉 <Ni layer and Ni-Co layer>

Ni層、Ni-Co合金層的厚度，使用螢光X射線膜厚計來測定。 The thickness of the Ni layer and the Ni-Co alloy layer was measured using a fluorescent X-ray film thickness meter.

〈Cu-Sn合金層暴露率〉 <Cu-Sn alloy layer exposure rate>

以SEM(掃描型電子顯微鏡)來觀察電鍍後之各試驗材料(形成有Cu-Sn合金層者)的表面，並對在任意的3個視野所得到表面組成像(×200)進行二值化處理。然後藉由圖像 解析，測定前述3個視野中之Cu-Sn合金被覆層的材料表面暴露率之平均值)。 The surface of each test material (the one in which the Cu-Sn alloy layer was formed) after plating was observed by SEM (scanning electron microscope), and the surface composition image (×200) obtained in any three fields of view was binarized. deal with. Then by image Analytically, the average value of the surface exposure of the material of the Cu-Sn alloy coating layer in the above three fields of view was measured.

從No.31~43的各試驗材料中製作出試驗片，並藉由下述要領來測定耐蝕性及彎折加工性。 A test piece was produced from each of the test materials of Nos. 31 to 43, and the corrosion resistance and the bending workability were measured by the following methods.

〈耐蝕性〉 <Corrosion resistance>

電鍍後之試驗材料的耐蝕性，係以鹽水噴霧試驗來評估。使用含有5質量%的NaCl之99.0%脫離子水(和光純藥工業股份有限公司製)，試驗條件，設為試驗溫度：35℃±1℃、噴霧液pH：6.5~7.2、噴霧壓力：0.098±0.01MPa，於72小時的噴霧後，進行水洗及乾燥。接著以實體顯微鏡來觀察試驗片的表面，並觀察腐蝕(母材腐蝕與電鍍表面的點狀腐蝕)的有無。 The corrosion resistance of the test material after electroplating was evaluated by a salt spray test. 99.0% deionized water (manufactured by Wako Pure Chemical Industries, Ltd.) containing 5% by mass of NaCl was used, and the test conditions were as follows: test temperature: 35 ° C ± 1 ° C, spray liquid pH: 6.5 to 7.2, spray pressure: 0.098 ±0.01 MPa, after 72 hours of spraying, it was washed with water and dried. Next, the surface of the test piece was observed with a stereoscopic microscope, and the presence or absence of corrosion (base metal corrosion and pitting corrosion of the plated surface) was observed.

〈電鍍材料的彎折加工性評估〉 <Evaluation of Bending Processability of Electroplating Materials>

從電鍍後的各試驗材料中，製作出長30mm、寬20mm的4角形試驗片(各試驗材料分別為3個)。試驗片之長度30mm的邊之方向，設為平行於試驗材料(母材)的軋延方向。使用此試驗片，將第1圖所示之V字模塊1及按壓模具2設置在油壓模壓機，將彎折半徑R與板厚t之比R/t設為2.0，並將彎折線的方向設為朝向垂直於母材的軋延方向之方向，以進行90度彎折。油壓模壓機的荷重，設為試驗片的寬度每10mm為1000kgf(9800N)。 A tetragonal test piece having a length of 30 mm and a width of 20 mm was produced from each of the test materials after plating (three test materials were used). The direction of the side of the test piece having a length of 30 mm was set to be parallel to the rolling direction of the test material (base metal). Using this test piece, the V-shaped module 1 and the pressing die 2 shown in Fig. 1 were placed in a hydraulic press, and the ratio R/t of the bending radius R to the thickness t was set to 2.0, and the bending line was set. The direction is set to be perpendicular to the direction of the rolling direction of the base material to perform a 90 degree bend. The load of the hydraulic molding machine was set to 1000 kgf (9800 N) per 10 mm of the width of the test piece.

彎折試驗後，以100倍的光學顯微鏡來觀察試驗片的 彎折部外側全長，將3個試驗片全部皆未觀察到1處的破裂者判定為無破裂，將即使觀察到1處的破裂者，亦判定為有破裂。 After the bending test, the test piece was observed with a 100-fold optical microscope. The entire outer side of the bent portion was determined to have no crack at all of the three test pieces, and it was judged that there was crack even if one of the cracks was observed.

如第6圖所示，具有本發明之實施形態所規定的電鍍構成及各電鍍層厚度之No.31~40，於鹽水噴霧試驗中未觀察到母材腐蝕，於彎折加工性試驗中未觀察到破裂。未形成由Ni層或Ni-Co合金層所構成之底層之No.33，以及未殘留Sn層而使Cu-Sn合金層暴露於表面之No.37，雖未觀察到母材腐蝕，但觀察到點狀腐蝕(被覆層表面呈點狀地腐蝕之現象)。 As shown in Fig. 6, in the plating composition and the thickness of each plating layer specified in the embodiment of the present invention, No. 31 to 40 were observed, and no corrosion of the base material was observed in the salt spray test, and it was not observed in the bending workability test. A rupture was observed. No. 33 of the underlayer composed of the Ni layer or the Ni-Co alloy layer was not formed, and No. 37 in which the Cu-Sn alloy layer was not exposed to the surface without leaving the Sn layer, although no corrosion of the base material was observed, but observation was observed. To pitting corrosion (the phenomenon that the surface of the coating layer is corroded in a punctiform manner).

另一方面，電鍍層厚度脫離本發明之實施形態的規定之No.41~43，於鹽水噴霧試驗中觀察到母材腐蝕，或是於彎折加工性試驗中於電鍍中產生破裂。 On the other hand, the thickness of the plating layer was deviated from No. 41 to 43 of the embodiment of the present invention, and the base material was observed to be corroded in the salt spray test or cracked in the plating in the bending workability test.

No.41，其Cu-Sn合金層與Sn層的合計厚度不足，產生母材腐蝕。 In No. 41, the total thickness of the Cu-Sn alloy layer and the Sn layer was insufficient, and the base material was corroded.

No.42、43，其Cu-Sn合金層或Ni層的厚度較厚，於彎折加工性試驗中，於電鍍中產生破裂。 No. 42 and 43, the thickness of the Cu-Sn alloy layer or the Ni layer was thick, and cracking occurred in the plating in the bending workability test.

本發明係關於以下樣態。 The present invention relates to the following aspects.

樣態1： Pattern 1:

一種散熱零件用銅合金板，其特徵為：含有Fe：0.01~1.0mass%、P：0.01~0.20mass%、Zn：0.01~1.0mass%、及Sn：0.01~0.15mass%，且剩餘部分由Cu及不可避免的雜質所構成； 軋延平行方向上的拉伸強度為410MPa以上，降伏強度為390MPa以上，伸長率為5%以上；軋延直角方向上的拉伸強度為420MPa以上，降伏強度為400MPa以上，伸長率為3%以上；導電率為75%IACS以上；將彎折半徑R與板厚t之比R/t設為0.5，並將彎折線設為軋延直角方向以進行90度彎折時之彎折加工臨限寬度為70mm以上；將彎折線設為軋延直角方向以進行密著彎折時之彎折加工臨限寬度為20mm以上。 A copper alloy plate for heat dissipating parts, characterized by containing Fe: 0.01~1.0 mass%, P: 0.01~0.20 mass%, Zn: 0.01~1.0 mass%, and Sn: 0.01~0.15 mass%, and the remaining part is Cu and inevitable impurities; The tensile strength in the parallel direction of rolling is 410 MPa or more, the undulation strength is 390 MPa or more, and the elongation is 5% or more; the tensile strength in the direction perpendicular to the rolling is 420 MPa or more, the lodging strength is 400 MPa or more, and the elongation is 3% or more. The conductivity is 75% IACS or more; the ratio R/t of the bending radius R to the thickness t is set to 0.5, and the bending line is set to the right angle of the rolling to bend the processing when the bending is 90 degrees. The width is 70 mm or more; the bending line is set to a right angle direction for bending, and the bending width of the bending process is 20 mm or more.

樣態2： Pattern 2:

如樣態1所述之散熱零件用銅合金板，其中以合計為0.3mass%以下更含有Co、Al、Cr、Mg、Mn、Ca、Pb、Ti、Zr、Si及Ag的1種或2種以上。 The copper alloy sheet for a heat dissipating component according to the aspect 1, wherein the total amount is 0.3 mass% or less, and one or two of Co, Al, Cr, Mg, Mn, Ca, Pb, Ti, Zr, Si, and Ag are further contained. More than one species.

樣態3： Figure 3:

如樣態1所述之散熱零件用銅合金板，其中以合計為0.3mass%以下更含有Co、Al、Cr、Mg、Mn、Ca、Pb、Ti、Zr、Si及Ag的1種或2種以上與未達0.1mass%的Ni。 The copper alloy sheet for a heat dissipating component according to the aspect 1, wherein the total amount is 0.3 mass% or less, and one or two of Co, Al, Cr, Mg, Mn, Ca, Pb, Ti, Zr, Si, and Ag are further contained. Above and below 0.1% of Ni.

樣態4： Figure 4:

如樣態1~3中的任一項所述之散熱零件用銅合金板，其中於表面形成有厚度0.2~5μm的Sn層。 The copper alloy plate for a heat dissipating component according to any one of the above aspects, wherein a Sn layer having a thickness of 0.2 to 5 μm is formed on the surface.

樣態5： Figure 5:

如樣態1~3中的任一項所述之散熱零件用銅合金板，其中於表面依序形成有厚度3μm以下的Cu-Sn合金層與厚度0~5μm的Sn層，Cu-Sn合金層與Sn層的合計厚度為0.2μm以上。 The copper alloy plate for heat dissipating parts according to any one of the above aspects, wherein a Cu-Sn alloy layer having a thickness of 3 μm or less and a Sn layer having a thickness of 0 to 5 μm are sequentially formed on the surface, Cu-Sn alloy. The total thickness of the layer and the Sn layer is 0.2 μm or more.

樣態6： Figure 6:

如樣態1~3中的任一項所述之散熱零件用銅合金板，其中於表面依序形成有厚度3μm以下之由Ni、Co、Fe、Ni-Co合金及Ni-Fe合金中的任一種所構成之電鍍層、及厚度3μm以下的Cu-Sn合金層、以及厚度0~5μm的Sn層，Cu-Sn合金層與Sn層的合計厚度為0.2μm以上。 The copper alloy plate for heat dissipating parts according to any one of the above aspects, wherein the surface is formed with Ni, Co, Fe, Ni-Co alloy and Ni-Fe alloy in a thickness of 3 μm or less. Any one of the plating layer and the Cu-Sn alloy layer having a thickness of 3 μm or less and the Sn layer having a thickness of 0 to 5 μm, and the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 μm or more.

樣態7： Aspect 7:

如樣態1~3中的任一項所述之散熱零件用銅合金板，其中於表面形成有厚度3μm以下之由Ni、Co、Fe、Ni-Co合金及Ni-Fe合金中的任一種所構成之電鍍層。 The copper alloy plate for heat dissipating parts according to any one of the above aspects, wherein the surface is formed of any one of Ni, Co, Fe, Ni-Co alloy and Ni-Fe alloy having a thickness of 3 μm or less. The plating layer formed.

樣態8： Figure 8:

如樣態5或6所述之散熱零件用銅合金板，其中Cu-Sn合金層暴露於最表面，該暴露面積率為50%以下。 A copper alloy plate for a heat dissipating component according to the aspect 5 or 6, wherein the Cu-Sn alloy layer is exposed to the outermost surface, and the exposed area ratio is 50% or less.

樣態9： Figure 9:

一種散熱零件，其係由如樣態1~8中的任一項所述之散熱零件用銅合金板所構成。 A heat dissipating component comprising the copper alloy plate for a heat dissipating component according to any one of the above aspects 1 to 8.

樣態10： Aspect 10:

一種捲料，其係由如樣態1~8中的任一項所述之散熱零件用銅合金板所構成。 A coil material comprising the copper alloy sheet for a heat dissipating component according to any one of the above aspects 1 to 8.

本申請案，係以申請日為2016年3月17日之日本國專利申請案的日本特願第2016-034204號為基礎提出申請並主張優先權。日本特願第2016-034204號，係藉由參考而納入於本說明書中。 The present application is filed on the basis of Japanese Patent Application No. 2016-034204, the entire disclosure of which is hereby incorporated by reference. Japanese Patent Application No. 2016-034204 is incorporated herein by reference.

Claims (20)

一種散熱零件用銅合金板，其特徵為：含有Fe：0.01~1.0mass%、P：0.01~0.20mass%、Zn：0.01~1.0mass%、及Sn：0.01~0.15mass%，且剩餘部分由Cu及不可避免的雜質所構成；軋延平行方向上的拉伸強度為410MPa以上，耐力為390MPa以上，伸長率為5%以上；軋延直角方向上的拉伸強度為420MPa以上，耐力為400MPa以上，伸長率為3%以上；導電率為75%IACS以上；將彎折半徑R與板厚t之比R/t設為0.5，並將彎折線設為軋延直角方向以進行90度彎折時之彎折加工臨限寬度為70mm以上；將彎折線設為軋延直角方向以進行密著彎折時之彎折加工臨限寬度為20mm以上。 A copper alloy plate for heat dissipating parts, characterized by containing Fe: 0.01~1.0 mass%, P: 0.01~0.20 mass%, Zn: 0.01~1.0 mass%, and Sn: 0.01~0.15 mass%, and the remaining part is Cu and unavoidable impurities; tensile strength in the parallel direction of rolling is 410 MPa or more, endurance is 390 MPa or more, elongation is 5% or more; tensile strength in the right angle direction is 420 MPa or more, and endurance is 400 MPa or more. , the elongation is 3% or more; the electrical conductivity is 75% IACS or more; the ratio R/t of the bending radius R to the thickness t is set to 0.5, and the bending line is set to the right angle direction for bending at 90 degrees. In the case of the bending process, the width of the bending process is 70 mm or more; and the bending line is set to the direction of the right angle of the rolling to make the bending width of the bending process to be 20 mm or more. 如請求項1所述之散熱零件用銅合金板，其中在導電率為75%IACS以上的範圍，以合計為0.3mass%以下更含有Co、Al、Cr、Mg、Mn、Ca、Pb、Ti、Zr、Si及Ag的1種或2種以上。 The copper alloy sheet for a heat dissipating component according to claim 1, wherein the conductivity is 75% IACS or more, and the total is 0.3 mass% or less, and further contains Co, Al, Cr, Mg, Mn, Ca, Pb, Ti. One or two or more kinds of Zr, Si, and Ag. 如請求項1所述之散熱零件用銅合金板，其中在導電率為75%IACS以上的範圍，以合計為0.3mass%以下更含有 Co、Al、Cr、Mg、Mn、Ca、Pb、Ti、Zr、Si及Ag的1種或2種以上與未達0.1mass%的Ni。 The copper alloy sheet for heat-dissipating parts according to claim 1, wherein the conductivity is 75% IACS or more, and the total is 0.3 mass% or less. One or two or more kinds of Co, Al, Cr, Mg, Mn, Ca, Pb, Ti, Zr, Si, and Ag, and less than 0.1 mass% of Ni. 如請求項1~3中的任一項所述之散熱零件用銅合金板，其中於表面形成有厚度0.2~5μm的Sn層。 The copper alloy plate for heat dissipating parts according to any one of claims 1 to 3, wherein a Sn layer having a thickness of 0.2 to 5 μm is formed on the surface. 如請求項1~3中的任一項所述之散熱零件用銅合金板，其中於表面依序形成有厚度3μm以下的Cu-Sn合金層與厚度0~5μm的Sn層，Cu-Sn合金層與Sn層的合計厚度為0.2μm以上。 The copper alloy plate for heat dissipating parts according to any one of claims 1 to 3, wherein a Cu-Sn alloy layer having a thickness of 3 μm or less and a Sn layer having a thickness of 0 to 5 μm are sequentially formed on the surface, Cu-Sn alloy The total thickness of the layer and the Sn layer is 0.2 μm or more. 如請求項1~3中的任一項所述之散熱零件用銅合金板，其中於表面依序形成有厚度3μm以下之由Ni、Co、Fe、Ni-Co合金及Ni-Fe合金中的任一種所構成之電鍍層、及厚度3μm以下的Cu-Sn合金層、以及厚度0~5μm的Sn層，Cu-Sn合金層與Sn層的合計厚度為0.2μm以上。 The copper alloy sheet for heat dissipating parts according to any one of claims 1 to 3, wherein the surface is formed with Ni, Co, Fe, Ni-Co alloy and Ni-Fe alloy in a thickness of 3 μm or less. Any one of the plating layer and the Cu-Sn alloy layer having a thickness of 3 μm or less and the Sn layer having a thickness of 0 to 5 μm, and the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 μm or more. 如請求項1~3中的任一項所述之散熱零件用銅合金板，其中於表面形成有厚度3μm以下之由Ni、Co、Fe、Ni-Co合金及Ni-Fe合金中的任一種所構成之電鍍層。 The copper alloy plate for heat dissipating parts according to any one of claims 1 to 3, wherein any one of Ni, Co, Fe, Ni-Co alloy, and Ni-Fe alloy having a thickness of 3 μm or less is formed on the surface. The plating layer formed. 如請求項5所述之散熱零件用銅合金板，其中Cu-Sn合金層暴露於最表面，該暴露面積率為50%以下。 A copper alloy plate for a heat dissipating component according to claim 5, wherein the Cu-Sn alloy layer is exposed to the outermost surface, and the exposed area ratio is 50% or less. 如請求項6所述之散熱零件用銅合金板，其中Cu-Sn合金層暴露於最表面，該暴露面積率為50%以下。 A copper alloy plate for a heat dissipating component according to claim 6, wherein the Cu-Sn alloy layer is exposed to the outermost surface, and the exposed area ratio is 50% or less. 一種散熱零件，其係由如請求項1~3中的任一項所述之散熱零件用銅合金板所構成。 A heat dissipating component comprising the copper alloy plate for a heat dissipating component according to any one of claims 1 to 3. 一種散熱零件，其係由如請求項4所述之散熱零件用銅合金板所構成。 A heat dissipating component comprising a copper alloy plate for a heat dissipating component according to claim 4. 一種散熱零件，其係由如請求項5所述之散熱零件用銅合金板所構成。 A heat dissipating component comprising a copper alloy plate for a heat dissipating component according to claim 5. 一種散熱零件，其係由如請求項6所述之散熱零件用銅合金板所構成。 A heat dissipating component comprising a copper alloy plate for a heat dissipating component according to claim 6. 一種散熱零件，其係由如請求項7所述之散熱零件用銅合金板所構成。 A heat dissipating component comprising a copper alloy plate for a heat dissipating component according to claim 7. 一種散熱零件，其係由如請求項8所述之散熱零件用銅合金板所構成。 A heat dissipating component comprising a copper alloy plate for a heat dissipating component according to claim 8. 一種散熱零件，其係由如請求項9所述之散熱零件用銅合金板所構成。 A heat dissipating component comprising a copper alloy plate for a heat dissipating component according to claim 9. 一種捲料，其係由如請求項1~3中的任一項所述之散熱零件用銅合金板所構成。 A coil material comprising the copper alloy sheet for heat dissipation parts according to any one of claims 1 to 3. 一種捲料，其係由如請求項4所述之散熱零件用銅合金板所構成。 A coil material comprising the copper alloy sheet for heat dissipating parts according to claim 4. 一種捲料，其係由如請求項5所述之散熱零件用銅合金板所構成。 A coil material comprising the copper alloy sheet for a heat dissipating component according to claim 5. 一種捲料，其係由如請求項6所述之散熱零件用銅合金板所構成。 A coil material comprising the copper alloy sheet for heat dissipating parts according to claim 6.
TW106108765A 2016-03-17 2017-03-16 Copper alloy plate and coil for heat dissipation parts TWI628407B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016054204A JP6283046B2 (en) 2016-03-17 2016-03-17 Copper alloy plate for heat dissipation parts
JP2016-054204 2016-03-17

Publications (2)

Publication Number Publication Date
TW201809581A TW201809581A (en) 2018-03-16
TWI628407B true TWI628407B (en) 2018-07-01

Family

ID=59850758

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106108765A TWI628407B (en) 2016-03-17 2017-03-16 Copper alloy plate and coil for heat dissipation parts

Country Status (3)

Country Link
JP (1) JP6283046B2 (en)
TW (1) TWI628407B (en)
WO (1) WO2017159749A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6315868B1 (en) * 2017-11-28 2018-04-25 日酸Ｔａｎａｋａ株式会社 Gas cutting crater
CN111809079B (en) * 2020-07-23 2021-12-17 郑州恒天铜业有限公司 High-strength high-conductivity copper alloy wire material and preparation method thereof
WO2022126726A1 (en) * 2020-12-16 2022-06-23 苏州森诺扬机械有限公司 Corner folding device for machining hardware product
WO2022126723A1 (en) * 2020-12-16 2022-06-23 苏州森诺扬机械有限公司 Adjustable stamping apparatus for machining of hardware products
CN113122755A (en) * 2021-04-16 2021-07-16 江西富鸿金属有限公司 Tinned alloy wire for medical data transmission and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11343527A (en) * 1998-06-01 1999-12-14 Kobe Steel Ltd High strength and high conductivity copper alloy excellent in heat treatability at the time of press punching
JP2008088469A (en) * 2006-09-29 2008-04-17 Hitachi Cable Ltd Copper alloy-made backing plate, and method for manufacturing copper alloy for backing plate
JP5851000B1 (en) * 2014-08-22 2016-02-03 株式会社神戸製鋼所 Copper alloy strip for LED lead frame

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4168077B2 (en) * 2006-07-21 2008-10-22 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent oxide film adhesion
JP6328380B2 (en) * 2013-05-31 2018-05-23 Ｊｘ金属株式会社 Copper alloy sheet with excellent conductivity and bending deflection coefficient
JP6081513B2 (en) * 2015-03-30 2017-02-15 株式会社神戸製鋼所 Copper alloy plate for heat dissipation parts

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11343527A (en) * 1998-06-01 1999-12-14 Kobe Steel Ltd High strength and high conductivity copper alloy excellent in heat treatability at the time of press punching
JP2008088469A (en) * 2006-09-29 2008-04-17 Hitachi Cable Ltd Copper alloy-made backing plate, and method for manufacturing copper alloy for backing plate
JP5851000B1 (en) * 2014-08-22 2016-02-03 株式会社神戸製鋼所 Copper alloy strip for LED lead frame

Also Published As

Publication number Publication date
JP6283046B2 (en) 2018-02-21
JP2017166044A (en) 2017-09-21
WO2017159749A1 (en) 2017-09-21
TW201809581A (en) 2018-03-16

Similar Documents

Publication Publication Date Title
TWI628407B (en) Copper alloy plate and coil for heat dissipation parts
KR101979533B1 (en) Copper alloy plate and heat dissipation parts for heat dissipation parts
TWI621722B (en) Copper alloy plate for heat dissipating parts
WO2008041584A1 (en) Copper alloy plate for electrical and electronic components
WO2008038593A1 (en) Cu-Ni-Si ALLOY
JP4168077B2 (en) Copper alloy sheet for electrical and electronic parts with excellent oxide film adhesion
JP2010007174A (en) Cu-Ni-Si-BASED ALLOY PLATE OR BAR FOR ELECTRONIC MATERIAL
TWI605139B (en) A copper alloy sheet for a heat radiating component and a heat radiating component
JP4567906B2 (en) Copper alloy plate or strip for electronic and electrical parts and method for producing the same
JP2009007625A (en) Method for producing high strength copper alloy for electric/electronic component
TW201827613A (en) Copper alloy sheet for heat radiation component
TWI537401B (en) Strength and heat resistance and flexographic workability of the Fe-P copper alloy plate
KR101688300B1 (en) Fe-P BASED COPPER ALLOY SHEET EXCELLENT IN STRENGTH, HEAT RESISTANCE AND BENDING WORKABILITY
JP6811136B2 (en) Cu-Ni-Si based copper alloy strip and its manufacturing method
TWI697652B (en) Copper alloy plate for heat dissipation parts, heat dissipation parts, and method for manufacturing heat dissipation parts
JP3049137B2 (en) High strength copper alloy excellent in bending workability and method for producing the same
JP5755892B2 (en) Method for producing copper alloy sheet
JP6762333B2 (en) Cu-Ni-Si based copper alloy strip
JP2020015986A (en) Cu-Ni-Si-BASED COPPER ALLOY STRIP AND MANUFACTURING METHOD THEREFOR
JP2018070919A (en) Copper alloy sheet for heat radiation part
JPS63105992A (en) Surface treated steel sheet for lead frame having superior corrosion resistance, solderability and adhesion

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees